Manufacturing method for coil components

By aligning conductor ends with the flange surface through thermal processing, the method addresses strength and alignment issues in miniaturized coil components, resulting in stable and compact coil components.

JP7835557B2Active Publication Date: 2026-03-25TAIYO YUDEN KK
View PDF 6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-28
Publication Date
2026-03-25

AI Technical Summary

Technical Problem

Existing methods for miniaturizing coil components face challenges such as conductor strength reduction and difficulty in aligning conductor ends with the base surface, leading to larger components and unstable connections.

Method used

A method involving bending and heating the conductor ends to align them with the flange surface using thermal energy, specifically through laser irradiation or heated metal contact, to form a stable connection with external electrodes.

Benefits of technology

This approach enables the production of smaller coil components with stable conductor alignments and connections, reducing mechanical stress and maintaining insulation integrity.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007835557000001
    Figure 0007835557000001
  • Figure 0007835557000002
    Figure 0007835557000002
  • Figure 0007835557000003
    Figure 0007835557000003
Patent Text Reader

Abstract

To obtain a small-sized coil component.SOLUTION: Provided is a manufacturing method of a coil component 100 that comprises: a second surface 20 of a flange part 14 which becomes a reference; and a conductive wire 40 containing copper or silver. In the manufacturing method of a coil component 100, the conductive wire 40 positioned at an upper part of a second surface 20 of the flange part 14 is used as a processed part 44a, a temperature that is a softening temperature or more for softening the conductive wire 40 is applied to the processed part 44a to obtain a processing part 46a along the second surface 20 of the flange part 14. Thus, a spring back of the conductive wire 40 is suppressed, and a small-sized coil component can be obtained.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] This invention relates to a method for manufacturing coil components. [Background technology]

[0002] With the increasing sophistication of electronic devices, the number of coil components used in electronic devices is also increasing. Therefore, there is a need for further miniaturization of coil components. For example, in a coil component in which a conductor is drawn out into a groove formed in the flange to form an external electrode, it is known that miniaturization can be achieved by making the conductor portion located in the groove thinner than the conductor portion wound around the shaft (for example, Patent Document 1). Also, in a coil component in which an external electrode made of a metal piece attached to the flange and a conductor are connected by a weld ball produced by laser welding, it is known that miniaturization can be achieved by forming the weld ball within the thickness range of the flange (for example, Patent Document 2). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2010-109211 [Patent Document 2] Japanese Patent Publication No. 2016-134590 [Overview of the project] [Problems that the invention aims to solve]

[0004] However, in the method described in Patent Document 1, the conductor is thinned and then bent before being pulled into the groove, which reduces its strength and can cause it to break. In particular, the reduction in strength is more likely to occur when the conductor is thin, making it difficult to use in small coil components. Also, in the method described in Patent Document 2, the metal piece is plate-shaped and has a predetermined thickness, making it difficult to use in small coil components.

[0005] In a coil component where the end of a conductor is brought out onto one surface of a base, when the end of the conductor is brought out onto one surface of the base, the end of the conductor may not be formed along the surface of the base, but rather the tip of the conductor may be formed further away from the surface of the base. In this case, the coil component becomes larger.

[0006] This invention has been made in view of the above problems, and aims to provide a small coil component. [Means for solving the problem]

[0007] The present invention A shaft portion, and a flange portion provided at one end of the shaft portion, In a method for manufacturing a coil component comprising a conductor containing copper or silver, The process involves bending the wire wound around the shaft and pulling out the end of the wire to the side of the flange opposite to the shaft, and after the pulling out process, the wire Apply a temperature above the softening temperature at which the aforementioned wire softens. The end of the conductor is on the opposite side In accordance with A process to make it, and This is a method for manufacturing coil components.

[0008] In the above configuration, The process of making it conform to the above It is 0.3 J / mm 2 More than 2.0J / mm 2 The temperature due to the following thermal energy Add the wire so that the end of the wire is aligned with the opposite surface. It can be configured as follows.

[0009] In the above configuration, The process of making it conform to the above The temperature is reduced by laser irradiation. Add the wire so that the end of the wire is aligned with the opposite surface. It can be configured as follows.

[0010] In the above configuration, the irradiation position of the laser is, The end of the aforementioned wire It can be configured to be located at a distance from the main point.

[0011] In the above configuration, The process of making it conform to the above The temperature is between 600°C and 800°C. Add the wire so that the end of the wire is aligned with the opposite surface. It can be configured as follows.

[0012] In the above configuration, The process of making it conform to the above The temperature is affected by contact with the heated metal body. Add the wire so that the end of the wire is aligned with the opposite surface. It can be configured as follows.

[0013] In the above configuration, The process of making it conform to the above in addition to the temperature, The end of the aforementioned wire a load is applied to Add the following so that the end of the conductor is aligned with the opposite surface. and it can be configured.

[0014] In the above configuration, The process of making it conform to the surface involves applying the heat to the wire, thereby deforming the end of the wire by its own weight, so that the end of the wire conforms to the opposite surface. it can be configured.

Advantages of the Invention

[0015] According to the present invention, a small coil component can be obtained.

Brief Description of the Drawings

[0016] [Figure 1] Figs. 1(a) to 1(d) are side views showing a method for manufacturing a coil component according to an embodiment. [Figure 2] Figs. 2(a) to 2(d) are plan views showing a method for manufacturing a coil component according to an embodiment. [Figure 3] Figs. 3(a) to 3(c) are side views showing another method for machining a machined portion to a machining portion along the second surface of the flange portion.

Modes for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described with appropriate reference to the drawings. However, the present invention is not limited to the illustrated embodiments. Also, the same reference numerals are assigned to common components in a plurality of drawings. Note that each drawing is not necessarily drawn to an exact scale for convenience of explanation.

[0018] [Embodiment] Figures 1(a) to 1(d) are side views showing a method for manufacturing the coil component 100 according to the embodiment. Figures 2(a) to 2(d) are plan views showing a method for manufacturing the coil component 100 according to the embodiment. Figures 1(a) to 1(d) are side views viewed from the +X side, and Figures 2(a) to 2(d) are plan views viewed from the +Z side. The X, Y, and Z axes are orthogonal to each other. In this embodiment, a drum core is shown as an example of the base body 10, but other cases are also possible, such as a T-core having a flange on only one side. In Figures 1(a) to 1(d), hatching is applied to the components for clarity (the same applies to similar figures below). In Figures 2(a) to 2(d), hatching is also applied to some of the components for clarity. Furthermore, Figures 1(d) and 2(d) also show the ends 41a and 41b of the conductor 40 that are incorporated into parts of the external electrodes 60a and 60b. The coil component may be a power inductor incorporated into a power line, an inductor used in a signal line, or something else.

[0019] As shown in Figures 1(a) and 2(a), a drum core base 10 is prepared, which has a shaft portion 12 extending in the Z-axis direction, one flange portion 14 provided at the +Z end of the shaft portion 12, and the other flange portion 16 provided at the -Z end of the shaft portion 12. In the following description, the focus will be on the flange portion 14 on the side closer to the substrate when mounted on a substrate. The outer shape of the flange portion 14 is, for example, approximately the same size as the outer shape of the other flange portion 16, but it may be larger or smaller than the outer shape of the other flange portion 16. The thickness of the flange portion 14 may be the same as the thickness of the other flange portion 16, or it may be a different thickness. The flange portion 14 has a first surface 18 on the side of the shaft portion 12 and a second surface 20 on the opposite side of the shaft portion 12.

[0020] The substrate 10 is formed by, for example, filling a mold cavity with a paste made by mixing magnetic powder and resin and press molding it to form a molded body, and then performing a heat treatment on this molded body at, for example, 200°C to solidify the resin. The magnetic powder can be, for example, ferrite magnetic powder or metallic magnetic powder. Examples of ferrite magnetic powder include ferrite materials such as Ni-Zn or Mn-Zn. Examples of metallic magnetic powder include soft magnetic alloy materials such as Fe-Si-Cr, Fe-Si-Al, or Fe-Si-Cr-Al, magnetic metal materials such as Fe or Ni, amorphous magnetic metal materials, or nanocrystalline magnetic metal materials. The resin can be, for example, a resin with excellent insulating properties such as polyvinyl butyral (PVB) resin or epoxy resin.

[0021] The base body 10 may be formed by processing a large block of molded material to create a molded body having a shaft portion 12 and flange portions 14 and 16, and then heat-treating this molded body. The heat treatment may be performed before processing the molded body having the shaft portion 12 and flange portions 14 and 16. Furthermore, the base body 10 is not limited to being formed by solidifying magnetic powder with resin, but may also be formed by bonding magnetic powders together with inorganic material. In this case, the base body 10 is formed by heat-treating a molded body formed by press-molding magnetic powder at, for example, 600°C to 1100°C. Also, the base body 10 is not limited to being a magnetic material, but may be a non-magnetic material formed from aluminum oxide (alumina) or silicon oxide (glass), etc.

[0022] The shaft portion 12 has, for example, a roughly rectangular cross-sectional shape parallel to the XY plane with rounded corners. The flange portions 14 and 16 have, for example, a roughly rectangular cross-sectional shape parallel to the XY plane and are plate-like with thickness in the Z-axis direction. The shaft portion 12 may have a circular, elliptical, roughly rectangular, polygonal shape with pentagons or more, or a combination thereof in cross-sectional shape. The shaft portion 12 is smaller than the outer shape of the flange portions 14 and 16 when viewed in the Z-axis direction and is located near the center of the flange portions 14 and 16. The length dimensions of the base body 10 in the X-axis direction, the Y-axis direction, and the Z-axis direction are set appropriately as needed.

[0023] After preparing the base body 10, metal films 30a and 30b are formed on the second surface 20 of the flange portion 14. If grooves (not shown) are formed on the second surface 20 of the flange portion 14, the metal films 30a and 30b are formed on the inner surfaces of each of the two grooves. The two grooves extend substantially parallel to each other and open to two opposing outer surfaces 22 and 24 of the flange portion 14. The metal films 30a and 30b are formed, for example, by forming a base layer of copper (Cu) or silver (Ag) by sputtering or applying a conductive paste, and then forming a plating layer of nickel (Ni) and tin (Sn) on the base layer using a plating method. Note that the metal films 30a and 30b are not limited to multiple layers with a plating layer formed on the base layer, but may also consist of a single layer of only the base layer. Furthermore, the metal films 30a and 30b may have an adhesion layer of titanium (Ti) or chromium (Cr) or the like for adhesion to the flange portion 14. The thickness of the metal films 30a and 30b is, for example, about 1 μm to 50 μm.

[0024] After forming the metal films 30a and 30b, the conductor 40 is wound around the shaft portion 12 of the base body 10 to form a coil portion 42 made of the conductor 40. After pulling the conductor 40 outwards from each of the pair of ends of the coil portion 42 beyond the outer peripheral surface 22 of the flange portion 14, the conductor 40 is bent so that the ends 41a and 41b of the conductor 40 are positioned on the metal films 30a and 30b and brought out onto the second surface 20 of the flange portion 14. Here, the portions of the conductor 40 that are bent in order to bring the ends 41a and 41b of the conductor 40 onto the second surface 20 of the flange portion 14 are called bent portions 48a and 48b. The bent portions 48a and 48b are located near the outer peripheral surface 22 of the flange portion 14. Furthermore, the portion of the conductor 40 located on the second surface 20 of the flange portion 14, that is, the end portions 41a and 41b of the conductor 40, are designated as the workpiece portions 44a and 44b.

[0025] Even when the conductor 40 pulled out from the coil portion 42 is bent so that its ends 41a and 41b follow the second surface 20 of the flange portion 14, the conductor 40 will still be formed to move away from the second surface 20 of the flange portion 14 as it moves from the bent portions 48a and 48b towards the tips 43a and 43b due to springback.

[0026] The coil portion 42 only needs to have the conductor 40 wound around the shaft portion 12 at least once, and may be wound in only one layer around the shaft portion 12, or in part or all of the coil portion to be wound in multiple layers. The coil portion 42 may also be formed by a so-called alpha winding, in which the central part of the conductor 40 is wound first, and then the winding continues toward both ends of the conductor 40.

[0027] The conductor 40 is made of metal, such as copper (Cu) or silver (Ag). The conductor 40 has a cross-sectional diameter of 0.02 to 0.6 mm. This cross-section can be circular, square, rectangular, or hexagonal. The conductor 40 has a metal wire core covered with an insulating coating made of urethane. The insulating coating may be made of an insulating material other than urethane, such as polyimide, polyamide-imide, or a resin material such as polyester. The cross-sectional shape of the metal wire is, for example, circular, but it may also be rectangular.

[0028] Although not shown in the diagram, an outer casing covering the coil portion 42 may be formed. The outer casing is formed by applying a resin material, for example, by brushing, roller transfer, or dispensing, and then curing the resin material. The resin component of the resin material is preferably a thermosetting resin with excellent insulating properties, such as epoxy resin or polyimide resin. The resin material may also contain magnetic material fillers, such as magnetic particles with an average particle size of 10 μm or less. For example, the resin material may be formed by mixing a magnetic material and a resin; for example, ferrite may be used as the magnetic material and epoxy resin as the resin component. Furthermore, the resin material may contain non-magnetic material fillers such as silica particles, or it may contain a combination or mixture of magnetic and non-magnetic materials.

[0029] After the workpieces 44a and 44b are placed on the second surface 20 of the flange portion 14, a process is performed to apply a temperature above the softening temperature at which the conductor 40 softens to at least a portion of the workpieces 44a and 44b. This process will be explained using Figures 1(b) and 2(b), but this is just one example of a process to apply a temperature above the softening temperature, and a temperature above the softening temperature may be applied by other methods. As shown in Figures 1(b) and 2(b), the conductor 40 is irradiated with a laser 50 so that a temperature above the softening temperature at which the conductor 40 softens is applied to at least a portion of the workpieces 44a and 44b. For example, the laser 50 is irradiated so as to span a portion of the bent portions 48a and 48b of the workpieces 44a and 44b and the bent portions 48a and 48b. The areas of the conductor 40 irradiated with the laser 50 are shown as areas 32a and 32b. As a result, the temperature of at least the portion of the workpiece 44a and 44b irradiated with the laser 50 is above the softening temperature at which the wire 40 softens. As the laser device that outputs the laser 50, for example, a YAG laser device that emits a laser 50 with a wavelength of 1064 nm is used. For example, if the diameter of the wire 40 containing copper or silver is 0.6 mm or less, the thermal energy per unit area received by regions 32a and 32b from the laser 50 is 0.3 J / mm². 2 More than 2.0J / mm 2 The laser 50 is irradiated as follows. In this case, for example, the output of the laser 50 may be set to 0.1 kW or more and 0.3 kW or less, and the irradiation time may be set to 1 msec or more and 10 msec or less.

[0030] As shown in Figures 1(c) and 2(c), when the workpieces 44a and 44b are subjected to a temperature above the softening temperature of the wire 40, the workpieces 44a and 44b are deformed by their own weight into a shape that conforms to the second surface 20 of the flange 14. Here, the portion of the wire 40 that has been processed to conform to the second surface 20 of the flange 14, i.e., the ends 41a and 41b of the wire 40, are defined as the processed parts 46a and 46b. In the processed parts 46a and 46b, compared to the workpieces 44a and 44b, the tips 43a and 43b of the wire 40 come closer to the second surface 20 of the flange 14, for example, and come into contact with the metal films 30a and 30b. Alternatively, most of the processed parts 46a and 46b may be in contact with the metal films 30a and 30b. By obtaining processed portions 46a and 46b that follow the second surface 20 of the flange portion 14, the coil component can be made smaller compared to the case where the processed portions 44a and 44b have a shape that moves away from the second surface 20 of the flange portion 14 as they move from the bent portions 48a and 48b towards the tips 43a and 43b, as shown in Figure 1(a).

[0031] As shown in Figures 1(d) and 2(d), solder films 62a and 62b are applied to the surfaces of the metal films 30a and 30b, for example by dispensing or transferring. The solder films 62a and 62b are, for example, tin-silver solder or tin-silver-copper solder and contain flux components. Subsequently, the solder films 62a and 62b are heated to a temperature above their melting point, for example, 220°C to 230°C or higher, to melt them. The flux components contained in the solder films 62a and 62b peel off the insulating coating at the ends 41a and 41b of the conductor 40, exposing the metal wires at the ends 41a and 41b of the conductor 40. As a result, the end 41a of the conductor 40, the metal film 30a, and the solder film 62a are joined together, forming an external electrode 60a that is electrically connected to the coil portion 42. Similarly, the end 41b of the conductor 40, the metal film 30b, and the solder film 62b are joined together to form an external electrode 60b that is electrically connected to the coil portion 42. Thus, the coil component 100 according to the embodiment is formed.

[0032] As described above, according to the present embodiment, as shown in FIGS. 1(b), 1(c), 2(b), and 2(c), a temperature equal to or higher than the softening temperature at which the conductor 40 softens is applied to the processed portions 44a and 44b, which are the end portions 41a and 41b of the conductor 40 located on the second surface 20 of the flange portion 14, to obtain processed portions 46a and 46b along the second surface 20 of the flange portion 14. For example, when bending the conductor 40 by applying a load, springback is likely to occur. However, by processing the conductor 40 by applying heat, springback can be suppressed, and a small coil component 100 can be obtained. Further, by processing the conductor 40 by applying heat, the mechanical load on the conductor 40 and the substrate 10 is reduced compared to the case of processing the conductor 40 by applying a load, so it can be applied to the manufacture of small coil components. Also, when the conductor 40 is formed so as to move away from the second surface 20 of the flange portion 14 from the bent portions 48a and 48b toward the tips 43a and 43b due to springback, the positions of the tips 43a and 43b are unstable, which causes effects on dimensions and connection to the external electrodes 60a and 60b. However, such a situation is also suppressed in the present embodiment.

[0033] Also, in the present embodiment, the processed portions 46a and 46b are formed by applying a temperature equal to or higher than the softening temperature of the conductor 40 by thermal energy of 0.3 J / mm 2 or more and 2.0 J / mm 2 or less to the processed portions 44a and 44b. Thereby, for a small coil component using a conductor 40 having a diameter of 0.6 mm or less and containing copper or silver, processed portions 46a and 46b along the second surface 20 of the flange portion 14 can be obtained. The thermal energy is preferably 0.4 J / mm 2 or more and 1.8 J / mm 2 or less, more preferably 0.5 J / mm 2 or more and 1.6 J / mm 2 or less. Setting the thermal energy within such a range can suppress the influence of heat on portions other than the processed portions 44a and 44b. For example, the insulation of the coil portion 42 connected to the processed portions 44a and 44b can be maintained.

[0034] Furthermore, in this embodiment, as shown in Figures 1(b), 1(c), and 2(b), 2(c), the processed parts 46a and 46b are formed by applying a temperature above the softening temperature of the conductor 40 to the processed parts 44a and 44b by irradiation with the laser 50. This makes it possible to obtain processed parts 46a and 46b that follow the second surface 20 of the flange 14 in a short working time, and also suppresses the influence of heat on parts other than the processed parts 44a and 44b. Even if the conductor 40 is thick, heat conduction can be reduced, and for example, even if a conductor 40 with a thickness of 0.6 mm, which conducts heat easily, is used, the temperature of the base body 10 can be kept below 300°C. In addition, since there is no direct contact of the energy source with the processed parts 44a and 44b, damage to the conductor 40 in the processed parts 44a and 44b can be suppressed, and it is possible to use thin conductors 40.

[0035] In the above embodiment, the example shown was one in which the laser 50 is irradiated so as to span both a part of the bent portions 48a and 48b of the workpiece 44a and 44b and the bent portions 48a and 48b themselves. However, the laser 50 may also be irradiated only on the workpiece 44a and 44b and not on the bent portions 48a and 48b.

[0036] In the above embodiment, the insulating coating may be removed from the ends 41a, 41b and bent portions 48a, 48b of the conductor 40 before irradiating the conductor 40 with the laser 50. This suppresses the scattering of the insulating coating even when the conductor 40 is irradiated with the laser 50. Conversely, the conductor 40 may be irradiated with the laser 50 while it still has the insulating coating. In this case, it is possible to obtain processed portions 46a, 46b that follow the second surface 20 of the flange portion 14 and remove the insulating coating at the same time.

[0037] [Examples of other processing methods for the workpiece] Figures 3(a) to 3(c) are side views showing another method for machining the workpiece 44a along the second surface 20 of the flange 14. Although Figures 3(a) to 3(c) illustrate and explain the workpiece 44a, the workpiece 44b is machined using the same method.

[0038] As shown in Figure 3(a), the laser 50 is irradiated from above the outer circumferential surface 22 of the flange portion 14 onto the bent portion 48a located on the outer circumferential surface 22, so that at least a portion of the workpiece 44a is heated to a temperature above the softening temperature at which the conductor 40 softens. In this way, by irradiating the workpiece 44a with the laser 50 at a position away from the workpiece 44a, damage to the workpiece 44a can be suppressed. For example, if the workpiece 44a is directly irradiated with the laser 50, the insulating coating of the conductor 40 in the workpiece 44a may carbonize or the surface of the metal wire may oxidize, but by irradiating the workpiece 44a with the laser 50 at a position away from the workpiece 44a, such carbonization of the insulating coating and oxidation of the metal wire surface can be suppressed. As a result, an electrically and mechanically stable external electrode 60a can be obtained. Furthermore, by irradiating the laser 50 at a position away from the workpiece 44a, the laser 50 is prevented from being directed toward the second surface 20 of the flange 14, thereby suppressing damage to the second surface 20 of the flange 14 and the metal film 30a caused by the laser 50.

[0039] As shown in Figure 3(b), a heated metal body 52, such as a soldering iron, is brought into contact with the vicinity of the portion of the workpiece 44a located on the bent portion 48a side, so that a temperature above the softening temperature at which the wire 40 softens is applied to at least a part of the workpiece 44a. By bringing the heated metal body 52 into contact, a temperature of 600°C to 800°C is applied to at least a part of the workpiece 44a. In this way, by applying a temperature of 600°C to 800°C to the workpiece 44a, a processed portion 46a that follows the second surface 20 of the flange portion 14 can be obtained when a wire 40 with a diameter of 0.6 mm or less and containing copper or silver is used. Furthermore, by applying a temperature above the softening temperature of the wire 40 to the workpiece 44a through contact with the heated metal body 52, the controllability of the temperature applied to the workpiece 44a is improved. Furthermore, as in the case of Figure 3(a), the heated metal body 52 may not directly contact the workpiece 44a, but may contact a location away from the workpiece 44a, for example, the bent portion 48a. In this case, the mechanical load on the workpiece 44a can be reduced.

[0040] As shown in Figure 3(c), in addition to irradiating the wire 40 with the laser 50 so that at least a portion of the workpiece 44a is heated to a temperature above the softening temperature of the wire 40, a load F is applied to the workpiece 44a from the +Z direction to the -Z direction. In this way, by applying a load F to the workpiece 44a in addition to applying a temperature above the softening temperature of the wire 40, a processed part 46a that follows the second surface 20 of the flange 14 can be stably obtained. Note that the load F may be applied diagonally from the +Z side to the -Z side. This allows the workpiece 44a to be moved in the direction to which the load F is applied. Furthermore, the load F is not limited to being applied while the laser 50 is being irradiated, but may also be applied after the laser 50 irradiation has finished, as long as the temperature of the workpiece 44a is maintained above the softening temperature of the wire 40. Furthermore, even when the heated metal body 52 is brought into contact with the wire 40, as shown in Figure 3(b), the load F may be applied to the workpiece 44a while the heated metal body 52 is in contact with the wire 40 or after contact.

[0041] In the above embodiment, a coil component in which a conductor 40 is wound around the surface of a base 10 to form a coil portion 42 was shown as an example. However, any coil component such as a coil component in which the coil portion 42 is built into the base 10, or a coil component made of winding, lamination, thin film, etc., may be used. [Examples]

[0042] A conductor 40 having a copper wire with a diameter of 0.6 mm was used, and processing was performed using the method described in Figures 1(a) to 1(d) and Figures 2(a) to 2(d). At this time, a YAG laser device was used for the laser 50, and the laser was irradiated at a power of 0.2 kW for 5 msec, spanning a portion of the bent portions 48a and 48b of the workpiece 44a and 44b, and the bent portions 48a and 48b themselves. The thermal energy per unit area received by the irradiated regions 32a and 32b from the laser 50 was 1.3 J / mm². 2 That was the case.

[0043] By processing the workpieces 44a and 44b under these conditions, processed portions 46a and 46b were obtained that followed the second surface 20 of the flange portion 14. At this time, the distance between the ends 41a and 41b of the conductor 40 and the metal films 30a and 30b was 0.1 mm or less at its widest point. Similar results were obtained for other conductors 40 with diameters of 0.5 mm, 0.4 mm, 0.3 mm, 0.2 mm, and 0.1 mm, and the distance between the ends 41a and 41b of the conductor 40 and the metal films 30a and 30b could be kept within a range smaller than the thickness of the metal wire. Furthermore, similar results were obtained for conductors 40 with diameters of 0.05 mm and 0.02 mm, and the distance could be kept within a range that did not affect the thickness of the external electrodes 60a and 60b. In this way, the coil component has good positional accuracy at the ends 41a and 41b of the conductor 40, and even when connecting to the external electrodes 60a and 60b, the coil component could be manufactured without affecting the thickness of the external electrodes 60a and 60b.

[0044] Although embodiments of the present invention have been described in detail above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible within the scope of the gist of the present invention as described in the claims. [Explanation of symbols]

[0045] 10 Base 12 Shaft section 14, 16 Guard section 18 Page 1 20 Side 2 22, 24 Outer surface 30a, 30b metal film 32a, 32b area 40 Conductor 41a, 41b end 42 Coil section 43a, 43b tip 44a, 44b Processed part 46a, 46b Processing section 48a, 48b Folded section 50 lasers 52 Heated metal body 60a, 60b external electrode 62a, 62b Solder film 100 coil components

Claims

1. A method for manufacturing a coil component comprising a shaft portion, a flange portion provided at one end of the shaft portion, and a conductor containing copper or silver, The process of bending the wire wound around the shaft and bringing the end of the wire out to the side of the flange opposite to the shaft, A method for manufacturing a coil component, comprising the steps of: after the drawing-out step, applying a temperature to the conductor that is above the softening temperature at which the conductor softens, so that the end of the conductor lies along the opposite surface.

2. The step of making it conform to the surface is 0.3 J / mm 2 2.0J / mm or more 2 A method for manufacturing a coil component according to claim 1, wherein the temperature due to the following thermal energy is applied to the conductor so that the end of the conductor is aligned with the opposite surface.

3. The method for manufacturing a coil component according to claim 1 or 2, wherein the step of making it conform to the surface is to apply heat to the conductor by laser irradiation so that the end of the conductor conforms to the opposite surface.

4. The method for manufacturing a coil component according to claim 3, wherein the laser irradiation position is a position away from the end of the conductor.

5. The method for manufacturing a coil component according to Claim 1, wherein the step of making it conform to the surface is to apply the temperature of 600°C to 800°C to the conductor so that the end of the conductor conforms to the opposite surface.

6. The method for manufacturing a coil component according to claim 1 or 5, wherein the step of making it conform to the surface is to apply heat to the conductor by contact with a heated metal body so that the end of the conductor conforms to the opposite surface.

7. The method for manufacturing a coil component according to any one of claims 1 to 6, wherein the step of making it conform to the surface involves applying a load to the end of the conductor in addition to the temperature so that the end of the conductor conforms to the opposite surface.

8. The method for manufacturing a coil component according to any one of claims 1 to 6, wherein the step of making it conform to the surface is to apply the temperature to the conductor so that the end of the conductor is deformed by its own weight and the end of the conductor conforms to the opposite surface.

Citation Information

Patent Citations

  • Continuous forming method for plate like material

    JP1988188426A

  • Method and apparatus for forming lead of semiconductor device

    JP1994120388A

  • Electronic component and method of manufacturing the same

    JP2010109211A

  • Wound inductor and manufacturing method therefor

    JP2013045928A

  • Coil device

    JP2016134590A