Evaporation device

Abstract

To provide a vapor deposition device that can solve a problem of wafer breakage caused by the high elastic modulus of an elastic components in the prior art.SOLUTION: A vapor deposition device 1000 includes a base, a plurality of mounting bodies 2, a plurality of fixing members 3, and a plurality of clamping mechanisms 4, and the mounting bodies are detachably arranged on the base. The fixing members are arranged corresponding to the center positions of the mounting bodies, and penetrate the base to fix the mounting bodies. The clamping mechanisms are arranged on the mounting bodies, and when a wafer is held by each mounting body and clamped by each clamping mechanism, the wafer is clamped and fixed between a part of each mounting body and the clamping mechanism.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a vapor deposition apparatus, and more particularly to a vapor deposition apparatus in which a placement body for holding a wafer is fixed by a fixing member and the placement body has a recessed space.

Background Art

[0002] The vapor deposition process is a semiconductor process technology for depositing a thin film material on the surface of a wafer. In the vapor deposition process, a vapor deposition apparatus such as a vapor deposition pot is mainly used. The function of the vapor deposition pot is to contain a solid metal or other vapor deposition material for vapor deposition. The vapor deposition process is usually performed in a vacuum environment. The vapor deposition pot is heated to evaporate the vapor deposition material therein. In chemical vapor deposition (CVD) or physical vapor deposition (PVD), vapor is generated when the vapor deposition material evaporates. The thin film material is deposited on the surface of the wafer or other substrate as atoms or molecules to form a desired thin film layer. By the way, at present when the demand for silicon wafers is increasing in many industries, how to improve the stability and product yield of wafers is one of the most important research topics.

[0003] In a general vapor deposition apparatus, usually, a dedicated placement body and a rotating base are used. A plurality of placement bodies are provided on the rotating base. These placement bodies are mainly used to hold wafers and are arranged in the vapor deposition apparatus. However, such a conventional vapor deposition apparatus has unavoidable drawbacks. First, in the conventional vapor deposition process, the elastic component of the vapor deposition apparatus needs to simultaneously hold the wafer and the placement body, so it has a large elastic coefficient. As a result, a force from the elastic component is applied to the thin wafer, and cracks are likely to occur on the surface of the wafer. In addition, in the vapor deposition process, when the rotating base vibrates, the wafer and the placement body rub against each other, which may damage the wafer surface and have an adverse effect on the appearance yield of the product.

[0004] In view of the above circumstances, the present invention proposes a vapor deposition apparatus that can solve the problem of wafer breakage caused by the high elastic coefficient of the elastic component in the prior art.

Summary of the Invention

[0005] The object of the present invention is to provide a vapor deposition apparatus that can reduce the possibility of wafer damage during the vapor deposition process and reduce contact between the wafer and the mounting body. In this invention, the mounting body that holds the wafer is fixed to the base by a fixing member. Since the mounting body is fixed by the fixing member, the elastic component does not need a high modulus of elasticity to hold the wafer. With this structure, wafers, especially thin wafers, are less likely to crack due to external forces. On the other hand, a recessed space is provided in the center of the mounting body, and multiple protrusions are provided on the outer circumference of the mounting body. With the above design, the contact area between the wafer and the mounting body can be greatly reduced, friction between the wafer and the mounting body during the vapor deposition process can be reduced, the possibility of scratches on the wafer surface can be reduced, and the appearance yield of the wafer can be improved.

[0006] To achieve the above objective, the present invention discloses a vapor deposition apparatus comprising a base, a plurality of mounting bodies, a plurality of fixing members, and a plurality of clamping mechanisms. The mounting bodies are detachably disposed on the base. Each of the fixing members is positioned corresponding to the center position of each of the mounting bodies. The fixing members penetrate the base and fix the mounting bodies. The clamping mechanisms are disposed on the mounting bodies. When a wafer is held on each of the mounting bodies and clamped by each of the clamping mechanisms, the wafer is clamped and fixed between a portion of each mounting body and the clamping mechanism.

[0007] In embodiments of the present invention, each of the aforementioned components comprises a main body and a plurality of protrusions formed on the outer circumference of the main body that contact the wafer.

[0008] In an embodiment of the present invention, the main body has a first surface and a second surface, a first height difference exists between the protrusion and the first surface, and a second height difference exists between the first surface and the second surface.

[0009] In an embodiment of the present invention, the first surface and the second surface define a recessed space.

[0010] In an embodiment of the present invention, the clamping mechanism is elastic and is positioned perpendicularly to the protrusion on the main body.

[0011] In an embodiment of the present invention, the clamping mechanism includes at least one first elastic member fixedly disposed on the main body and at least one second elastic member detachably disposed on the main body.

[0012] In the embodiment of the present invention, the number of the first elastic member and the second elastic member in the clamping mechanism is at least two each.

[0013] In an embodiment of the present invention, the base has a plurality of holes and a plurality of support pieces, the holes are formed on both sides of each support piece, and the support pieces and the aforementioned mounting body are connected by the fixing member.

[0014] In an embodiment of the present invention, when the wafer is held and fixed between a part of each of the aforementioned mounting bodies and the clamping mechanism, the wafer is in contact with the protrusion and the clamping mechanism simultaneously, but not with the first surface and the second surface.

[0015] In embodiments of the present invention, the base is rotatable.

[0016] Those skilled in the art will be able to understand other objects of the present invention, as well as the technical means and embodiments of the present invention, by referring to the drawings and the embodiments described later. [Brief explanation of the drawing]

[0017] [Figure 1] Front view showing the mounting body of the vapor deposition apparatus according to the present invention [Figure 2] Rear view showing the mounting body of the vapor deposition apparatus according to the present invention [Figure 3] Partial cross-sectional view of the vapor deposition apparatus according to the present invention [Figure 4] Front view showing a vapor deposition apparatus according to an embodiment of the present invention. [Figure 5]Rear view showing a vapor deposition apparatus according to an embodiment of the present invention. [Figure 6] Front view showing a vapor deposition apparatus according to another embodiment of the present invention. [Figure 7] Rear view showing a vapor deposition apparatus according to another embodiment of the present invention. [Modes for carrying out the invention]

[0018] The present invention will be described below through examples. These examples illustrate the embodiments of the present invention and are not intended to limit the invention to any particular environment, application, or specific configuration described therein. Therefore, while the examples illustrate the present invention, they do not limit it. Components not directly related to the present invention are omitted and not shown in the embodiments and drawings. The dimensional relationships of the components in the drawings are for ease of understanding and do not limit the actual dimensions.

[0019] The explanation will be given with reference to Figures 1 to 3. Figures 1 and 2 are a front view and a rear view, respectively, of the mounting body 2 of the deposition apparatus 1000 according to the present invention. Figure 3 is a partial cross-sectional view of the deposition apparatus 1000 according to the present invention. The deposition apparatus 1000 is an apparatus that holds a plurality of wafers 2000 and performs a deposition process on the wafers 2000. As shown in Figure 6, in an embodiment of the present invention, the deposition apparatus 1000 comprises a base 1, a plurality of mounting bodies 2, a plurality of fixing members 3, and a plurality of clamping mechanisms 4. The mounting bodies 2 are detachably arranged on the base 1. The mounting bodies 2 hold the wafers 2000. The fixing members 3 and the clamping mechanisms 4 are arranged corresponding to each mounting body 2.

[0020] The base 1 will be described with reference to Figures 4 and 5. Figure 4 is a front view showing a vapor deposition apparatus 1000 according to an embodiment of the present invention. Figure 5 is a rear view showing a vapor deposition apparatus 1000 according to an embodiment of the present invention. The base 1 has a plurality of holes 11 and a plurality of support pieces 12. The holes 11 are formed on both sides of each support piece 12. Each support piece 12 is provided with a locking hole. Each fixing member 3 fixes each mounting body 2 to each support piece 12 via the locking hole. In this embodiment, when a wafer 2000 is held on the mounting body 2, the user installs the clamping mechanism 4 on the mounting body 2 using the space of the holes 11. As a result, the wafer 2000 is clamped and fixed to the mounting body 2. On the other hand, the user can loosen a part of the clamping mechanism 4 from the holes 11 and remove the wafer 2000 held on the mounting body 2. Since the base 1 of the vapor deposition apparatus 1000 of the present invention is rotatable, the user can easily install and remove the wafer 2000.

[0021] The following explanation will be given with reference to Figures 1 and 2. The mounting body 2 has a main body 21 and four protrusions 22. The protrusions 22 are formed on the outer circumference of the main body 21 and come into contact with the wafer 2000. More specifically, the main body 21 has a first surface 211 and a second surface 212. As shown in Figure 3, the protrusions 22 are located on the first surface 211. A first height difference H1 exists between the protrusions 22 and the first surface 211. On the other hand, a second height difference H2 exists between the first surface 211 and the second surface 212. The first surface 211 and the second surface 212 define a recess space S. As shown in Figure 3, when the wafer 2000 is held by each mounting body 2 and clamped by each clamping mechanism 4, the wafer 2000 is clamped and fixed between a part of each mounting body 2 and the clamping mechanism 4. Furthermore, the wafer 2000 is held and fixed between the convex portion 22 and the clamping mechanism 4 by the convex portion 22 and the recessed space S. In other words, the wafer 2000 is in contact with both the convex portion 22 and the clamping mechanism 4 simultaneously. The wafer 2000 does not come into contact with the first surface 211 and the second surface 212. Unlike conventional vapor deposition apparatuses, the present invention reduces the contact area between the wafer 2000 and the mounting body 2, thereby avoiding scratches that may occur during the vapor deposition process. Figures 4 and 5 show a vapor deposition apparatus 1000 according to an embodiment of the present invention, and Figures 6 and 7 show a vapor deposition apparatus 1000 according to another embodiment of the present invention. The only difference between the two is the number of mounting bodies 2 arranged on the base 1. The arrangement position and number of mounting bodies 2 can be adjusted according to the actual size of the wafer to be held, and are not limited thereto.

[0022] Next, the fixing members 3 and the clamping mechanism 4 will be described in detail. As shown in Figures 3 and 6, each fixing member 3 is positioned corresponding to the center position of each mounting body 2. The fixing members 3 penetrate the base 1 and fix the mounting body 2. In this embodiment, the case in which the fixing member 3 is a combination of a screw and a nut is illustrated. The user can replace it with other types of fixing members according to their actual needs and is not limited thereto. The mounting body 2 is fixed to the base 1 by the fixing members 3. This fixing method makes it possible to reduce the elastic modulus of the clamping mechanism 4 that clamps the wafer 2000, and makes it possible to avoid cracking of the thin wafer 2000 during clamping.

[0023] Further, the clamping mechanism 4 has elasticity and is vertically arranged at a position corresponding to the convex portion 22 on the main body 21. Specifically, the clamping mechanism 4 has at least one first elastic member 41 and at least one second elastic member 42. The first elastic member 41 is fixedly arranged on the main body 21. The second elastic member 42 is detachably arranged on the main body 21. In this embodiment, the number of the first elastic member 41 and the second elastic member 42 in each clamping mechanism 4 is at least two respectively. Preferably, the number of the first elastic member 41 and the second elastic member 42 is two respectively. In this way, the wafer 2000 can be fixed to the convex portion 22 of the mounting body 2 by positioning at the four corners. Specifically, in this embodiment, the first elastic member 41 and the second elastic member 42 are the same spring member. As shown in FIG. 6, the first elastic member 41 is fixedly arranged at a position facing the outer periphery of the base 1 on the mounting body 2. The second elastic member 42 is detachably arranged at a position facing the inner periphery of the base 1 on the mounting body 2. Further, the procedure of clamping the wafer 2000 by using the clamping mechanism 4 includes the following procedures. First, the first elastic member 41 is fixedly installed. Next, a part of the wafer 2000 is clamped by the first elastic member 41 and a part of the convex portion 22. Finally, the wafer 2000 is clamped by the detachable second elastic member 42 and the other convex portion 22 of the mounting body 2. On the other hand, when the wafer 2000 is to be taken out, the wafer 2000 is taken out after removing the second elastic member 42.

[0024] As described above, the vapor deposition apparatus according to the present invention includes a base, a mounting body, a fixing member, and a clamping mechanism. Different from the conventional vapor deposition apparatus, in the present invention, since each mounting body is fixed to the base by the corresponding fixing member, it is not necessary to use an elastic component having a high elastic coefficient to clamp the mounting body and the wafer. Further, by providing a recessed space in the mounting body and contacting and supporting the wafer with the convex portion provided on the mounting body, the contact area between the wafer and the mounting body can be significantly reduced. Thereby, the possibility of scratches and cracks occurring on the wafer during the vapor deposition process can be reduced, and the appearance yield of the wafer can be improved.

[0025] The above-described embodiments illustrate embodiments of the present invention and describe the characteristic configuration of the present invention. The present invention is not limited to the above embodiments. Modifications or equivalent arrangements that can be easily made by those skilled in the art are also within the scope of the present invention. The scope of protection of the rights of the present invention shall be based on the claims. [Explanation of symbols]

[0026] 1000 vapor deposition equipment 2000 wafers 1 Base 11 Hole 12 Support piece 2 Mounting body 21 Main unit 211 1st surface 212 2nd surface 22 Convex part 3 Fixing member 4 Clamping mechanism 41 First elastic member 42 Second elastic member H1 1st height difference H2 2nd height difference S recessed space

Claims

1. A vapor deposition apparatus, Bass and, Multiple mounting bodies are detachably arranged on the base, A plurality of fixing members are arranged corresponding to the center position of each of the aforementioned fixtures, and penetrate the base to fix the aforementioned fixtures, The mounting body comprises a plurality of clamping mechanisms, When a wafer is held in each of the aforementioned mounting bodies and clamped in each of the clamping mechanisms, the wafer is clamped and fixed between a part of each of the aforementioned mounting bodies and the clamping mechanism. Each of the above-described components has a main body and a plurality of protrusions formed on the outer circumference of the main body that contact the wafer. The main body has a first surface and a second surface, a first height difference exists between the protrusion and the first surface, and a second height difference exists between the first surface and the second surface. A vapor deposition apparatus characterized in that, when the wafer is held and fixed between a part of each of the aforementioned mounting bodies and the clamping mechanism, the wafer simultaneously contacts the protrusion and the clamping mechanism, but does not contact the first surface and the second surface.

2. The vapor deposition apparatus according to claim 1, characterized in that the first surface and the second surface define a recessed space.

3. The vapor deposition apparatus according to claim 1, characterized in that the clamping mechanism is elastic and is arranged vertically to a position corresponding to the protrusion on the main body.

4. The vapor deposition apparatus according to claim 1, characterized in that the clamping mechanism comprises at least one first elastic member fixedly disposed on the main body and at least one second elastic member detachably disposed on the main body.

5. The vapor deposition apparatus according to claim 4, characterized in that the number of the first elastic member and the second elastic member in the clamping mechanism is at least two each.

6. The vapor deposition apparatus according to claim 1, characterized in that the base has a plurality of holes and a plurality of support pieces, the holes are formed on both sides of each of the support pieces, and the support pieces and the above-described mounting body are connected by the fixing member.

7. The vapor deposition apparatus according to claim 1, characterized in that the base is rotatable.

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