Curable composition for inkjet printing and partition formation, light-emitting device, and method for manufacturing a light-emitting device.

Abstract

Provided is a curable composition which is for an inkjet and for partition wall formation, and from which a partition wall having a large aspect ratio and a high infrared light shielding property can be formed.　A curable composition for an inkjet and for partition wall formation according to the present invention comprises: a photocurable compound having (meth)acryloyl groups and vinyl groups in a total number of at least two, while not having a cyclic ether group; a thermosetting compound having a cyclic ether group; a photopolymerization initiator; a thermosetting agent; and an infrared shielding agent.

Description

Technical Field

[0001] The present invention relates to a curable composition for inkjet and for forming partitions, which is applied and used by an inkjet apparatus. Further, the present invention relates to a light-emitting device using the above curable composition and a method for manufacturing the light-emitting device.

Background Art

[0002] In recent years, light-emitting devices capable of irradiating infrared light have been widely used. Examples of the above light-emitting devices include smartphones equipped with face recognition systems. Conventional light-emitting devices include a first member such as a substrate, a second member such as a glass member, a light-emitting member capable of irradiating infrared light disposed on the surface of the first member, and a plastic housing connecting the first member and the second member. The plastic housing is usually arranged so as to surround the light-emitting member and is formed of a material through which infrared light hardly leaks (for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, miniaturization of light-emitting devices has been progressing. However, in conventional light-emitting devices using a plastic housing, it is difficult to sufficiently reduce the distance between the light-emitting member and the plastic housing. Therefore, there is a limit to the miniaturization of the light-emitting device.

[0005] To achieve miniaturization of light-emitting devices, it is conceivable to manufacture them by using an inkjet device to apply a curable composition in a frame-like manner around a light-emitting component, and then curing the applied curable composition to form a partition wall. In this case, the curable composition must have the performance to form a partition wall with a large aspect ratio (height / width) and high infrared light shielding properties.

[0006] However, conventional inkjet curable compositions make it difficult to form partitions with a large aspect ratio. Furthermore, conventional inkjet curable compositions make it difficult to improve the infrared light shielding properties of the partitions.

[0007] The object of the present invention is to provide an inkjet and partition-forming curable composition that can form partitions with a large aspect ratio and high infrared light shielding properties. The object of the present invention is also to provide a light-emitting device using the above curable composition and a method for manufacturing the light-emitting device. [Means for solving the problem]

[0008] In a broader sense, the present invention provides a curable composition for inkjet printing and partition formation (hereinafter sometimes abbreviated as "curable composition") comprising a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and no cyclic ether groups, a thermosetting compound having cyclic ether groups, a photopolymerization initiator, a thermosetting agent, and an infrared light shielding agent.

[0009] In certain aspects of the curable composition according to the present invention, the infrared light shielding agent comprises carbon black, a metal complex having a phthalocyanine skeleton, or a metal complex having a naphthalocyanine skeleton.

[0010] In a particular aspect of the curable composition according to the present invention, the metal complex in the metal complex having a phthalocyanine skeleton is a vanadium complex or a copper complex, and the metal complex in the metal complex having a naphthalocyanine skeleton is a vanadium complex or a copper complex.

[0011] In a specific aspect of the curable composition according to the present invention, the average primary particle size of the carbon black is 20 nm or more and 100 nm or less.

[0012] In a particular aspect of the curable composition according to the present invention, the thermosetting compound includes a thermosetting compound having two or more cyclic ether groups.

[0013] In a particular aspect of the curable composition according to the present invention, the photocurable compound includes a photocurable compound having a dicyclopentadiene skeleton.

[0014] In certain aspects of the curable composition according to the present invention, the thermosetting compound includes a photo- and thermosetting compound having a (meth)acryloyl group.

[0015] In a particular aspect of the curable composition according to the present invention, the photocurable compound includes a photocurable compound having a total of three or more (meth)acryloyl groups and vinyl groups.

[0016] In a specific aspect of the curable composition according to the present invention, the content of the photocurable compound is 10% by weight or more and 75% by weight or less.

[0017] In a particular aspect of the curable composition according to the present invention, the thermosetting agent comprises an aromatic amine compound.

[0018] In certain aspects of the curable composition according to the present invention, the aromatic amine compound comprises 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone.

[0019] In certain aspects of the curable composition according to the present invention, the curable composition further comprises a dispersant.

[0020] In a specific aspect of the curable composition according to the present invention, the acid value of the dispersant is 10 mgKOH / g or more and 100 mgKOH / g or less, and the amine value of the dispersant is 10 mgKOH / g or more and 100 mgKOH / g or less.

[0021] According to a broad aspect of the present invention, there is provided a light-emitting device including a first member, a light-emitting member disposed on a first surface of the first member, and a partition wall disposed on the first surface of the first member, wherein the partition wall is a cured product of the above-described curable composition for inkjet and partition wall formation.

[0022] In a specific aspect of the light-emitting device according to the present invention, the light-emitting device includes a second member, the light-emitting member is a light-emitting member capable of irradiating infrared light, the partition wall is disposed on the first surface of the first member so as to surround the light-emitting member, and the partition wall adheres the first member and the second member.

[0023] According to a broad aspect of the present invention, there is provided a method for manufacturing a light-emitting device including a coating step of applying the above-described curable composition for inkjet and partition wall formation using an inkjet device on a first surface of a first member on which a light-emitting member is disposed to form a curable composition layer, and a photocuring step of advancing the curing of the curable composition layer by irradiation with light to form a B-staged product layer.

[0024] In a specific aspect of the method for manufacturing a light-emitting device according to the present invention, the method for manufacturing the light-emitting device includes an arrangement step of disposing a second member on a surface of the B-staged product layer opposite to the first member side, and a thermosetting step of thermally curing the B-staged product layer by heating, and in the arrangement step, the second member is disposed on the surface of the B-staged product layer disposed so as to surround the light-emitting member. [[Effect of the Invention]]

[0025] The inkjet and partition-forming curable composition according to the present invention comprises a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and no cyclic ether groups, a thermosetting compound having cyclic ether groups, a photopolymerization initiator, a thermosetting agent, and an infrared light shielding agent. Because the inkjet and partition-forming curable composition according to the present invention has the above configuration, it is possible to form partitions with a large aspect ratio and high infrared light shielding properties. [Brief explanation of the drawing]

[0026] [Figure 1] Figure 1(a) is a schematic plan view showing a light-emitting device obtained using an inkjet and partition-forming curable composition according to the first embodiment of the present invention, and Figure 1(b) is a schematic cross-sectional view showing the light-emitting device. [Figure 2] Figures 2(a) to 2(c) are cross-sectional views illustrating each step in the manufacturing process of the light-emitting device shown in Figure 1. [Figure 3] Figures 3(d) to 3(f) are cross-sectional views illustrating each step in the manufacturing process of the light-emitting device shown in Figure 1. [Modes for carrying out the invention]

[0027] The present invention will be described in detail below.

[0028] (Curable composition for inkjet printing and partition formation) The curable composition for inkjet printing and partition formation according to the present invention (hereinafter sometimes abbreviated as "curable composition") is used by being applied using an inkjet device (application of the curable composition using an inkjet device and use for forming partitions). The curable composition according to the present invention differs from curable compositions applied by screen printing and differs from curable compositions applied by dispensers.

[0029] The curable composition according to the present invention comprises a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and no cyclic ether groups, a thermosetting compound having cyclic ether groups, a photopolymerization initiator, a thermosetting agent, and an infrared light shielding agent.

[0030] In this specification, the above-mentioned "photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and not having a cyclic ether group" may be referred to as "(A) photocurable compound".

[0031] In this specification, the above-mentioned "thermosetting compound having a cyclic ether group" may be referred to as "(B) thermosetting compound".

[0032] Therefore, the curable composition according to the present invention comprises (A) a photocurable compound, (B) a thermosetting compound, a photopolymerization initiator, a thermosetting agent, and an infrared light shielding agent.

[0033] The curable composition according to the present invention has the above configuration, so it is possible to form a partition with a large aspect ratio and high infrared light shielding ability. The curable composition according to the present invention can form a partition having the aspect ratio (height / width) required for a light-emitting device. Furthermore, in a light-emitting device, if infrared light irradiated from the light-emitting member leaks to an unintended area, the performance of the light-emitting device deteriorates. The curable composition according to the present invention can form a partition with high infrared light shielding ability, so infrared light irradiated from the light-emitting member is less likely to leak to unintended locations.

[0034] Furthermore, with the curable composition according to the present invention, the curable composition can be applied with high precision in close proximity to the light-emitting member using an inkjet device, thereby enabling miniaturization of the light-emitting device.

[0035] Furthermore, since the curable composition according to the present invention has the above-described configuration, the adhesive strength between the member to be bonded and the partition can be increased.

[0036] The above curable composition contains (A) a photocurable compound and (B) a thermosetting compound, and is therefore a photo- and thermosetting composition. The above curable composition is preferably used after curing by irradiation with light and then curing by heating.

[0037] The details of each component contained in the above curable composition are described below. In this specification, "(meth)acryloyl" means either or both "acryloyl" and "methacryloyl," and "(meth)acrylate" means either or both "acrylate" and "methacrylate." In this specification, the CH2=C(H or CH3) group of the (meth)acryloyl group is not included in the vinyl group.

[0038] <(A) Photocurable compound> The above curable composition contains (A) a photocurable compound. (A) The photocurable compound is a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and not having a cyclic ether group. (A) The photocurable compound may have a (meth)acryloyl group, may have a vinyl group, or may have both a (meth)acryloyl group and a vinyl group. (A) The photocurable compound has a (meth)acryloyl group or a vinyl group. In this case, (A) the photocurable compound has at least one of the (meth)acryloyl group and the vinyl group. (A) The photocurable compound may have a (meth)acryloyl group and a vinyl group. (A) The photocurable compound may have a (meth)acryloyl group and may have a vinyl group. The (meth)acryloyl group and the vinyl group are photocurable functional groups. (A) The photocurable compound does not have, for example, an epoxy group (cyclic ether group). (A) The photocurable compound may be used alone or in combination of two or more.

[0039] (A) The photocurable compound has a total of two or more (meth)acryloyl groups and vinyl groups. When a curable composition contains an infrared light shielding agent, the photoreactivity (photocurability) of the curable composition tends to decrease. However, in the present invention, a photocurable compound (A) with a large number of photocurable functional groups is used, so the number of reaction sites to light irradiation increases. As a result, in the present invention, the curing of the curable composition can be advanced well by light irradiation. Furthermore, in the present invention, by using a photocurable compound (A) with a large number of photocurable functional groups, the curing of the curable composition can be advanced well by light irradiation, and the proportion of three-dimensional structures formed in the crosslinked state after photocuring can be increased. As a result, in the present invention, even when the curable composition contains an infrared light shielding agent, partitions with a large aspect ratio can be formed.

[0040] (A) The photocurable compound preferably contains a photocurable compound having a total of 3 or more (meth)acryloyl groups and vinyl groups, and more preferably contains a photocurable compound having a total of 4 or more (meth)acryloyl groups and vinyl groups. (A) The photocurable compound preferably contains a photocurable compound having a total of 5 or more (meth)acryloyl groups and vinyl groups, and particularly preferably contains a photocurable compound having a total of 6 or more (meth)acryloyl groups and vinyl groups. In this case, the photocurability can be further enhanced, and a septum with an even larger aspect ratio can be formed. (A) The total number of (meth)acryloyl groups and vinyl groups in the photocurable compound may be 100 or less, 50 or less, or 10 or less.

[0041] (A) The photocurable compound preferably comprises a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of three or more (meth)acryloyl groups and vinyl groups. (A) The photocurable compound more preferably comprises a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of four or more (meth)acryloyl groups and vinyl groups. (A) The photocurable compound even more preferably comprises a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of five or more (meth)acryloyl groups and vinyl groups. (A) The photocurable compound particularly preferably comprises a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of six or more (meth)acryloyl groups and vinyl groups. In this case, the photocurability can be further enhanced, and a septum with an even larger aspect ratio can be formed.

[0042] From the viewpoint of forming a curable composition layer with high precision and further improving photocurability to form a partition with an even larger aspect ratio, (A) the photocurable compound preferably has a (meth)acryloyl group, and more preferably has two or more (meth)acryloyl groups. (A) The photocurable compound preferably is a (meth)acrylate compound, and more preferably is a polyfunctional (meth)acrylate compound.

[0043] (A) The photocurable compound may contain a difunctional (meth)acrylate compound, a trifunctional (meth)acrylate compound, a tetrafunctional (meth)acrylate compound, a pentafunctional (meth)acrylate compound, or a hexafunctional (meth)acrylate compound. (A) The photocurable compound may contain heptafunctional or more (meth)acrylate compounds. For example, "difunctional" in a difunctional (meth)acrylate compound indicates that it has two (meth)acryloyl groups.

[0044] (A) The photocurable compound preferably contains a bifunctional (meth)acrylate compound, more preferably a trifunctional or more functional (meth)acrylate compound, and even more preferably a tetrafunctional or more functional (meth)acrylate compound. (A) The photocurable compound is even more preferably a quinfunctional or more functional (meth)acrylate compound, and particularly preferably a hexafunctional or more functional (meth)acrylate compound. In this case, the photocurability can be further enhanced, and a septum with an even larger aspect ratio can be formed. In addition, the curable composition layer can be formed with even greater precision.

[0045] Examples of the above-mentioned difunctional (meth)acrylate compounds include ethoxylated bisphenol A di(meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, and butyl ethoxymethyl glycol di(meth)acrylate. Examples include lupropanediol di(meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0046] Examples of the above trifunctional (meth)acrylate compounds include glycerin propoxy tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolpropane alkylene oxide-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, isocyanuric acid alkylene oxide-modified tri(meth)acrylate, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl) isocyanurate, and sorbitol tri(meth)acrylate.

[0047] Examples of the above-mentioned tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol tetra(meth)acrylate propionate.

[0048] Examples of the five-functional (meth)acrylate compounds mentioned above include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0049] Examples of the hexafunctional (meth)acrylate compounds mentioned above include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0050] Examples of photocurable compounds (A) having a vinyl group include vinyl ethers, ethylene derivatives, and dicyclopentadiene.

[0051] (A) The photocurable compound preferably includes a photocurable compound having a polyol skeleton, and more preferably includes a (meth)acrylate compound having a polyol skeleton. In this case, the adhesive strength between the members to be bonded (the first member and the second member) and the partition can be further increased.

[0052] The number of (meth)acryloyl groups (functionality) in the (meth)acrylate compound having the polyol skeleton described above may be 2, 2 or more, 3 or more, 4 or more, 5 or more, or 6 or more. The number of (meth)acryloyl groups in the (meth)acrylate compound having the polyol skeleton described above may be 100 or less, 50 or less, or 10 or less.

[0053] (A) The photocurable compound preferably includes a photocurable compound having a dicyclopentadiene skeleton, and more preferably includes a (meth)acrylate compound having a dicyclopentadiene skeleton. In this case, the curing shrinkage of the curable composition is reduced because the dicyclopentadiene skeleton is a rigid skeleton, so the adhesive strength between the members to be bonded (the first member and the second member) and the partition can be further increased.

[0054] The number of (meth)acryloyl groups (functionality) in the (meth)acrylate compound having the dicyclopentadiene skeleton described above may be 2, 2 or more, 3 or more, 4 or more, 5 or more, or 6 or more. The number of (meth)acryloyl groups in the (meth)acrylate compound having the dicyclopentadiene skeleton described above may be 100 or less, 50 or less, or 10 or less.

[0055] In 100% by weight of the above curable composition, the content of (A) the photocurable compound is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of (A) the photocurable compound is above the lower limit and below the upper limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed. Furthermore, when the content of (A) the photocurable compound is below the upper limit, the adhesive strength between the members to be bonded (the first member and the second member) and the partition can be further enhanced.

[0056] In 100% by weight of the above curable composition, the content of the photocurable compound having the polyol skeleton is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of the photocurable compound having the polyol skeleton is above the lower limit and below the upper limit, the photocurability can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. Furthermore, when the content of the photocurable compound having the polyol skeleton is above the lower limit and below the upper limit, the adhesive strength between the members to be bonded (the first member and the second member) and the partition wall can be further enhanced.

[0057] (A) The content of the photocurable compound having the polyol skeleton in 100% by weight of the photocurable compound is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 90% by weight or less, and more preferably 80% by weight or less. When the content of the photocurable compound having the polyol skeleton is above the lower limit and below the upper limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed. Furthermore, when the content of the photocurable compound having the polyol skeleton is above the lower limit, the adhesive strength between the members to be bonded (the first member and the second member) and the partition can be further enhanced.

[0058] In 100% by weight of the above curable composition, the content of photocurable compounds (A) other than the photocurable compound having the polyol skeleton is preferably 10% by weight or more, more preferably 20% by weight or more, even more preferably 30% by weight or more, preferably 65% ​​by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. If the content of photocurable compounds (A) other than the photocurable compound having the polyol skeleton is above the lower limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed. Furthermore, if the content of photocurable compounds (A) other than the photocurable compound having the polyol skeleton is below the upper limit, the adhesive strength between the members to be bonded (the first member and the second member) and the partition can be further enhanced.

[0059] In 100% by weight of the above curable composition, the content of the photocurable compound having the dicyclopentadiene skeleton is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, preferably 65% ​​by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. If the content of the photocurable compound having the dicyclopentadiene skeleton is above the lower limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed. Furthermore, if the content of the photocurable compound having the dicyclopentadiene skeleton is below the upper limit, the adhesive strength between the members to be bonded (the first member and the second member) and the partition can be further enhanced.

[0060] (A) The content of the photocurable compound having the dicyclopentadiene skeleton in 100% by weight of the photocurable compound is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 90% by weight or less, and more preferably 80% by weight or less. If the content of the photocurable compound having the dicyclopentadiene skeleton is above the lower limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed. Furthermore, if the content of the photocurable compound having the dicyclopentadiene skeleton is above the lower limit and below the upper limit, the adhesive strength between the bonded members (first member and second member) and the partition can be further enhanced.

[0061] <(B) Thermosetting compound> The above curable composition contains (B) a thermosetting compound. (B) is a thermosetting compound having a cyclic ether group. The cyclic ether group is a thermosetting functional group. (B) may be used alone or in combination of two or more.

[0062] (B) Examples of the cyclic ether group possessed by the thermosetting compound include epoxy groups. (B) The thermosetting compound may have only one type of cyclic ether group, or it may have two or more types.

[0063] (B) The cyclic ether group in the thermosetting compound is preferably an epoxy group. (B) The thermosetting compound is preferably an epoxy group. (B) The thermosetting compound is preferably an epoxy compound. In this case, the curable composition layer can be formed with high precision. Furthermore, the thermosetting properties can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. Furthermore, the adhesive strength between the bonded members (first member and second member) and the partition wall can be further enhanced.

[0064] (B) The thermosetting compound may contain a thermosetting compound having one cyclic ether group, a thermosetting compound having two cyclic ether groups, a thermosetting compound having two or more cyclic ether groups, or a thermosetting compound having three or more cyclic ether groups. (B) The thermosetting compound may contain an epoxy compound having one epoxy group, an epoxy compound having two epoxy groups, an epoxy compound having two or more epoxy groups, or an epoxy compound having three or more epoxy groups. (B) The number of cyclic ether groups or epoxy groups in the thermosetting compound may be 100 or less, 50 or less, or 10 or less.

[0065] From the viewpoint of exhibiting the effects of the present invention more effectively, (B) the thermosetting compound preferably includes a thermosetting compound having two or more cyclic ether groups, and more preferably includes an epoxy compound having two or more epoxy groups. In this case, the curable composition layer can be formed with high precision. Furthermore, the thermosetting properties can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. In addition, the adhesive strength between the bonded members (first member and second member) and the partition wall can be further enhanced.

[0066] Examples of the epoxy compounds mentioned above include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine core as their skeleton.

[0067] (B) The thermosetting compound may have a (meth)acryloyl group, or it may not have a (meth)acryloyl group. (B) The thermosetting compound may contain a thermosetting compound having a (meth)acryloyl group, or it may not contain a thermosetting compound having a (meth)acryloyl group.

[0068] (B) Thermosetting compounds having a (meth)acryloyl group are photo- and thermosetting compounds.

[0069] In this specification, the above-mentioned "(B) thermosetting compound having a (meth)acryloyl group" may be referred to as "(B1) photo- and thermosetting compound".

[0070] (B1) The photo- and thermosetting compound is a photo- and thermosetting compound having a (meth)acryloyl group and a cyclic ether group. (B1) The photo- and thermosetting compound may be used alone or in combination of two or more.

[0071] (B) The thermosetting compound preferably contains (B1) light and the thermosetting compound. In this case, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed while maintaining good adhesive strength between the bonded members (first member and second member) and the partition.

[0072] (B1) The photo- and thermosetting compound may have one (meth)acryloyl group or two or more.

[0073] (B1) Examples of photo- and thermosetting compounds include glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0074] (B1) The photocurable and thermosetting compound preferably contains glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, and more preferably contains 4-hydroxybutyl (meth)acrylate glycidyl ether. In this case, the photocurability can be further enhanced, and a septum with an even larger aspect ratio can be formed.

[0075] In 100% by weight of the above curable composition, the content of (B) thermosetting compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, still more preferably 20% by weight or more, and particularly preferably 30% by weight or more. In 100% by weight of the above curable composition, the content of (B) thermosetting compound is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 60% by weight or less, still more preferably 40% by weight or less, even more preferably 35% by weight or less, and particularly preferably 30% by weight or less. When the content of (B) thermosetting compound is above the lower limit and below the upper limit, the curable composition layer can be formed with high precision. Furthermore, the thermosetting properties can be further enhanced, and partitions with an even larger aspect ratio can be formed. Furthermore, the adhesive strength between the members to be bonded (first member and second member) and the partition can be further enhanced.

[0076] In 100% by weight of the above curable composition, the content of (B1) photo- and thermosetting compounds is preferably 10% by weight or more, more preferably 20% by weight or more, and even more preferably 30% by weight or more. In 100% by weight of the above curable composition, the content of (B1) photo- and thermosetting compounds is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 60% by weight or less, even more preferably 40% by weight or less, even more preferably 35% by weight or less, and particularly preferably 30% by weight or less. When the content of (B1) photo- and thermosetting compounds is above the lower limit and below the upper limit, the photo-curability and thermosetting properties can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. Also, when the content of (B1) photo- and thermosetting compounds is above the lower limit, the adhesive strength between the members to be bonded (the first member and the second member) and the partition wall can be further enhanced.

[0077] (B) The content of (B1) the photo-curing compound in 100% by weight of the thermosetting compound is preferably 10% by weight or more, more preferably 20% by weight or more, even more preferably 30% by weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, and even more preferably 70% by weight or less. If the content of (B1) the photo-curing compound is above the lower limit, the photocurability can be further enhanced, and a partition with an even larger aspect ratio can be formed. Also, if the content of (B1) the photo-curing compound is below the upper limit, the adhesive strength between the bonded members (first member and second member) and the partition can be further enhanced.

[0078] In 100% by weight of the above curable composition, the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 55% by weight or more, more preferably 60% by weight or more, and even more preferably 65% ​​by weight or more. When the total content is above the lower limit, the curable composition layer can be formed with high precision. Furthermore, when the total content is above the lower limit, the photocurability and thermosetting properties can be further enhanced, and a partition wall with an even larger aspect ratio can be formed. In addition, the adhesive strength between the bonded members (first member and second member) and the partition wall can be further enhanced. In 100% by weight of the above curable composition, there is no particular upper limit to the total content of (A) the photocurable compound and (B) the thermosetting compound. In 100% by weight of the above curable composition, the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 95% by weight or less, more preferably 90% by weight or more, and even more preferably 85% by weight or less.

[0079] <Photopolymerization initiator> The above curable composition contains a photopolymerization initiator. The photopolymerization initiator may be used alone or in combination of two or more types.

[0080] Examples of the above-mentioned photopolymerization initiators include photoradical polymerization initiators and photocationic polymerization initiators. The above-mentioned photopolymerization initiator is preferably a photoradical polymerization initiator.

[0081] The above-mentioned photoradical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.Examples of the above photoradical polymerization initiators include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1 -one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, N,N-dimethylaminoacetophenone and other aminoacetophenone compounds; anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone; 2,4-dimeth Thioxanthones such as ruthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethano Examples include oxime ester compounds such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(o-acetyloxime); and titanocene compounds such as bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-dichloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrole-1-yl)phenyl)titanium.The above-mentioned photoradical polymerization initiator may be used alone or in combination of two or more types.

[0082] Along with the above-mentioned photoradical polymerization initiator, a photopolymerization initiator aid may also be used. Examples of such photopolymerization initiator aids include ethyl N,N-dimethylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Other photopolymerization initiator aids may also be used. The above-mentioned photopolymerization initiator aids may be used individually or in combination of two or more.

[0083] Additionally, titaniumene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals), which have absorption in the visible light region, may be used to promote the photoreaction.

[0084] Examples of the above-mentioned photocationic polymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzointosylates. One of these photocationic polymerization initiators may be used, or two or more may be used in combination.

[0085] In 100% by weight of the above curable composition, the content of the above photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, even more preferably 1% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less.

[0086] <Thermosetting agent> The above-mentioned curable composition contains a thermosetting agent. The thermosetting agent may be used alone, or two or more may be used in combination.

[0087] Examples of the above-mentioned thermosetting agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. Modified polyamine compounds such as amine-epoxy adducts may also be used as the above-mentioned thermosetting agent. Other thermosetting agents may also be used.

[0088] The above-mentioned amine compound refers to a compound having one or more amino groups. The above-mentioned amine compound may be a primary amine, a secondary amine, or a tertiary amine. Examples of the above-mentioned amine compound include aliphatic amine compounds, alicyclic amine compounds, aromatic amine compounds, hydrazides, and guazinine derivatives. The above-mentioned aliphatic amine compound may be an aliphatic polyamine. The above-mentioned alicyclic amine compound may be an alicyclic polyamine. The above-mentioned aromatic amine compound may be an aromatic polyamine. Furthermore, adduct forms such as epoxy compound-added polyamines (reaction products of epoxy compounds and polyamines), Michael-added polyamines (reaction products of α,β-unsaturated ketones and polyamines), Mannich-added polyamines (condensates of polyamines, formalin, and phenol), thiourea-added polyamines (reaction products of thiourea and polyamines), and ketone-blocked polyamines (reaction products of ketone compounds and polyamines [ketimines]) may be used as the above-mentioned amine compound.

[0089] Examples of the above-mentioned aliphatic polyamines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0090] Examples of the above-mentioned alicyclic polyamines include mensendiamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0091] Examples of the above aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xylenediamine, m-xylenediamine, p-xylenediamine, 4,4-diaminodiphenylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0092] Examples of the above-mentioned hydrazides include carbodihydrazide, adipic acid dihydrazide, sebacate acid dihydrazide, dodecanediic acid dihydrazide, and isophthalic acid dihydrazide.

[0093] Examples of the above guanidine derivatives include dicyandiamide, 1-o-tolyl diguanide, α-2,5-dimethylguanide, α,ω-diphenyl diguanidide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyl diguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)] diguanide, phenyl diguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0094] Examples of the above-mentioned phenol compounds include polyhydric phenol compounds. Examples of the above-mentioned polyhydric phenol compounds include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabrombisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, xylylene skeleton-containing phenol novolac resin, dicyclopentadiene skeleton-containing phenol novolac resin, and fluorene skeleton-containing phenol novolac resin.

[0095] Examples of the above-mentioned acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecyl succinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0096] The above-mentioned thermosetting agent preferably contains an amine compound, and more preferably is an amine compound. The above-mentioned amine compound is preferably an aromatic amine compound. From the viewpoint of improving the inkjet ejectability of the curable composition and forming a partition with an even larger aspect ratio, the above-mentioned aromatic amine compound preferably contains 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone. In this case, the above-mentioned aromatic amine compound contains at least one of 1,3-bis(3-aminophenoxy)benzene and bis[4-(3-aminophenoxy)phenyl]sulfone. The above-mentioned aromatic amine compound may contain 1,3-bis(3-aminophenoxy)benzene and bis[4-(3-aminophenoxy)phenyl]sulfone. The above-mentioned aromatic amine compound may contain 1,3-bis(3-aminophenoxy)benzene and may contain bis[4-(3-aminophenoxy)phenyl]sulfone. When the above-mentioned thermosetting agent contains these preferred compounds, the adhesive strength between the members to be bonded (the first member and the second member) and the partition can be further increased.

[0097] In 100% by weight of the above curable composition, the content of the above thermosetting agent is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 40% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less.

[0098] <Infrared light shielding agent> The above curable composition contains an infrared light shielding agent. By including an infrared light shielding agent in the above curable composition, the infrared light shielding properties of the partition formed by the above curable composition can be enhanced. The above infrared light shielding agent may be used alone or in combination of two or more types.

[0099] The above-mentioned infrared light shielding agent is not particularly limited, as long as it is a particle or compound that has the ability to shield infrared light.

[0100] Examples of the above-mentioned infrared light shielding agents include carbon black, carbon nanotubes, graphene, lanthanum hexaboride compounds, tungsten cesium oxide compounds, dithiol compounds, naphthoquinone compounds, aminium compounds, immonium compounds, azo compounds, phthalocyanine compounds, naphthalocyanine compounds, anthracianine compounds, quinacridone compounds, pentaphene compounds, dioxazine compounds, perylene compounds, and indole compounds.

[0101] From the viewpoint of further enhancing infrared light shielding performance, the above infrared light shielding agent preferably contains carbon black, a phthalocyanine compound, or a naphthalocyanine compound, and more preferably contains carbon black, a metal complex having a phthalocyanine skeleton, or a metal complex having a naphthalocyanine skeleton. In this case, the above infrared light shielding agent contains at least one of carbon black, a phthalocyanine compound, and a naphthalocyanine compound. The above infrared light shielding agent may contain at least two of carbon black, a phthalocyanine compound, and a naphthalocyanine compound, and may contain carbon black, a phthalocyanine compound, and a naphthalocyanine compound. The above infrared light shielding agent may contain carbon black, a phthalocyanine compound, or a naphthalocyanine compound. From the viewpoint of exhibiting excellent light absorption in a wide range from near-infrared to infrared light and further enhancing infrared light shielding performance, the above infrared light shielding agent is even more preferably made of carbon black. From the viewpoint of having excellent light absorption in a localized area of ​​near-infrared light, forming a septum with an even larger aspect ratio without inhibiting the photocuring reaction of the photocurable compound (A), and further enhancing infrared light shielding, the above infrared light shielding agent is even more preferably a metal complex having a phthalocyanine skeleton.

[0102] When the above curable composition contains an infrared light shielding agent, the average primary particle size of the carbon black is preferably 15 nm or more, more preferably 20 nm or more, even more preferably 30 nm or more, preferably 100 nm or less, and more preferably 90 nm or less. When the average primary particle size of the carbon black is above the above lower limit, the dispersibility of the carbon black in the curable composition can be further improved when the curable composition is heated and circulated and applied using an inkjet device, thereby improving the inkjet ejectability of the curable composition and enabling the formation of partitions with an even larger aspect ratio.

[0103] The average primary particle size of the carbon black mentioned above can be measured using a transmission electron microscope (TEM). Examples of transmission electron microscopes include the JEOL JEM-ARM200F. The major and minor axes of the particle image obtained using the transmission electron microscope are measured, and the geometric mean (major axis × minor axis) of the measured values ​​is calculated. 1 / 2 This is defined as the primary particle diameter of the carbon black. It is preferable to measure the primary particle diameter of 100 carbon black particles and take the arithmetic mean to obtain the average primary particle diameter of the carbon black.

[0104] The metal complex having the phthalocyanine skeleton described above is a phthalocyanine compound. From the viewpoint of further enhancing infrared light shielding, the metal complex in the metal complex having the phthalocyanine skeleton described above is preferably a vanadium complex or a copper complex. The phthalocyanine compound described above is preferably a phthalocyanine containing a vanadium atom or a copper atom.

[0105] The metal complex having the naphthalocyanine skeleton described above is a naphthalocyanine compound. From the viewpoint of further enhancing infrared light shielding, the metal complex in the metal complex having the naphthalocyanine skeleton described above is preferably a vanadium complex or a copper complex. The naphthalocyanine compound described above is preferably a naphthalocyanine containing a vanadium atom or a copper atom.

[0106] In 100% by weight of the above curable composition, the content of the above infrared light shielding agent is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 10% by weight or less, and more preferably 5% by weight or less. When the content of the above infrared light shielding agent is above the lower limit and below the upper limit, the infrared light shielding performance can be further enhanced, and a partition with an even larger aspect ratio can be formed.

[0107] <(C) Photocurable compound> The above curable composition may contain a photocurable compound having a total of one (meth)acryloyl group and one vinyl group, and no cyclic ether group. In this case, the storage stability of the curable composition can be further enhanced.

[0108] In this specification, the above-mentioned "photocurable compound having a total of one (meth)acryloyl group and one vinyl group and not having a cyclic ether group" may be referred to as "(C) photocurable compound".

[0109] (C) The photocurable compound may have a (meth)acryloyl group or a vinyl group. (C) The photocurable compound may have only one of a (meth)acryloyl group or a vinyl group. (C) The photocurable compound may have a (meth)acryloyl group or a vinyl group. The (meth)acryloyl group and the vinyl group are photocurable functional groups. (C) The photocurable compound does not have, for example, an epoxy group (cyclic ether group). (C) Only one type of photocurable compound may be used, or two or more types may be used in combination.

[0110] (C) photocurable compounds (monofunctional (meth)acrylate compounds) having a (meth)acryloyl group include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, and 2-phenoxyethyl (meth)acrylate. Examples include methoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, isodecyl (meth)acrylate, isononyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentadienyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono (meth)acrylate, 2-ethylhexyl (meth)acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, and stearyl (meth)acrylate.

[0111] Examples of (C) photocurable compounds having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, α-methylstyrene, maleic anhydride, N-vinylpyrrolidone, and N-vinylformamide.

[0112] In 100% by weight of the above curable composition, the content of (C) photocurable compound is preferably 30% by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less. When the content of (C) photocurable compound is below the above upper limit, the content of (A) photocurable compound that can be included in the curable composition can be increased, and as a result, the photocurability can be further enhanced, and a septum with an even larger aspect ratio can be formed. In 100% by weight of the above curable composition, there is no particular lower limit to the content of (C) photocurable compound. In 100% by weight of the above curable composition, the content of (C) photocurable compound may be 0% by weight or more, may exceed 0% by weight, may be 1% by weight or more, or may be 5% by weight or more. The above curable composition may not contain (C) photocurable compound.

[0113] In 100% by weight of the above curable composition, the total content of (A) photocurable compound, (B) thermosetting compound, and (C) photocurable compound is preferably 55% by weight or more, more preferably 60% by weight or more, and even more preferably 65% ​​by weight or more. When the total content is above the lower limit, the curable composition layer can be formed with high precision. Furthermore, a partition wall with an even larger aspect ratio can be formed. In addition, the adhesive strength between the bonded members (first member and second member) and the partition wall can be further increased. There is no particular upper limit to the total content of (A) photocurable compound, (B) thermosetting compound, and (C) photocurable compound. The total content of (A) photocurable compound, (B) thermosetting compound, and (C) photocurable compound is preferably 95% by weight or less, more preferably 90% by weight or less, and even more preferably 85% by weight or less.

[0114] <Curing accelerator> The above-mentioned curable composition may or may not contain a curing accelerator. The curing accelerator may be used alone or in combination of two or more types.

[0115] Examples of the curing accelerators mentioned above include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.

[0116] In 100% by weight of the above curable composition, the content of the above curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably 10% by weight or less, and more preferably 5% by weight or less.

[0117] <Solvent> The above curable composition may or may not contain a solvent. The above solvent may be used alone or in combination of two or more types.

[0118] Examples of the solvents mentioned above include water and organic solvents.

[0119] From the viewpoint of further improving the ability to remove residues, the above solvent is preferably an organic solvent.

[0120] Examples of the above-mentioned organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.

[0121] From the viewpoint of further improving the thickness accuracy of the curable composition layer, it is preferable to have a lower solvent content in the curable composition.

[0122] When the curable composition contains the solvent, the content of the solvent in 100% by weight of the curable composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. It is most preferable that the curable composition does not contain the solvent.

[0123] <Dispersant> The above curable composition may or may not contain a dispersant. Preferably, the above curable composition contains a dispersant. When the above curable composition contains a dispersant, when the above curable composition is heated and circulated for application using an inkjet device, the dispersibility of the carbon black in the curable composition is further enhanced, thereby improving the inkjet ejection performance of the curable composition and allowing the formation of partitions with an even larger aspect ratio.

[0124] The above-mentioned dispersant has a structure in which a hydrophilic backbone and a lipophilic backbone are covalently bonded within a single molecule. Examples of the above-mentioned dispersant include surfactants such as cationic dispersants, anionic dispersants, nonionic dispersants, amphoteric dispersants, silicone dispersants, fluorine dispersants, and polymeric dispersants. The above-mentioned dispersant may be used alone or in combination of two or more types.

[0125] Examples of the cationic dispersant mentioned above include resins and compounds having amino groups. The cationic dispersant is preferably one having amino groups. The cationic dispersant may have one, two, three, or four amino groups. The number of amino groups in the cationic dispersant may be 100 or less, 50 or less, or 10 or less. The cationic dispersant does not have to be a thermosetting agent.

[0126] Examples of the above-mentioned anionic dispersants include resins and compounds having carboxyl groups, sulfonic acid groups, sulfate ester groups, or phosphate ester groups. Preferably, the above-mentioned anionic dispersant has carboxyl groups, sulfonic acid groups, sulfate ester groups, or phosphate ester groups.

[0127] Examples of the above nonionic dispersants include nonionic dispersants having a polyoxyethylene group and nonionic dispersants having an amide group. Examples of the above nonionic dispersants having a polyoxyethylene group include polyoxyethylene alkyl ethers, polyoxyethylene alkylaryl ethers, acetylene glycol, and polyoxyethylene glycol ester copolymers. Examples of the above nonionic dispersants having an amide group include polyoxyethylene fatty acid amides.

[0128] Examples of the polymer-based dispersants mentioned above include BYK-9076 (manufactured by BYK), DISPERBYK-145 (manufactured by BYK), Floren GW-1500 (manufactured by Kyoeisha Chemical Co., Ltd.), EfkaPX4701 (manufactured by BASF), and Hinotect T-6000 (manufactured by Kawaken Fine Chemical Co., Ltd.).

[0129] From the viewpoint of improving the inkjet ejectability of the curable composition and forming partitions with an even larger aspect ratio, the molecular weight of the dispersant is preferably 500 or more, more preferably 1000 or more, even more preferably 2000 or more, preferably 50000 or less, more preferably 25000 or less, and even more preferably 10000 or less.

[0130] The acid value of the above dispersant is preferably 0 mgKOH / g or higher, more preferably 10 mgKOH / g or higher, even more preferably 20 mgKOH / g or higher, preferably 100 mgKOH / g or less, and more preferably 90 mgKOH / g or less. When the acid value of the above dispersant is above the lower limit and below the upper limit, the inkjet ejection performance of the curable composition can be improved, partitions with an even larger aspect ratio can be formed, and the pot life can be improved. The amine value of the above dispersant is preferably 0 mgKOH / g or higher, more preferably 10 mgKOH / g or higher, even more preferably 20 mgKOH / g or higher, preferably 100 mgKOH / g or less, and more preferably 90 mgKOH / g or less. When the amine value of the above dispersant is above the lower limit and below the upper limit, the inkjet ejection performance of the curable composition can be improved, partitions with an even larger aspect ratio can be formed, and the pot life can be improved. From the viewpoint of improving the inkjet ejection properties of the curable composition, forming partitions with an even larger aspect ratio, and improving the pot life, it is preferable that the acid value of the dispersant is 10 mg KOH / g or more and 100 mg KOH / g or less, and the amine value of the dispersant is 10 mg KOH / g or more and 100 mg KOH / g or less.

[0131] <Other ingredients> The above-mentioned curable composition may contain other components besides those described above. These other components are not particularly limited, but may include adhesive aids such as coupling agents, fillers, leveling agents, defoamers, and polymerization inhibitors.

[0132] (Other details on the curable composition) The above curable composition is applied using an inkjet device and is generally liquid at 25°C. The viscosity of the above curable composition at 25°C and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 160 mPa·s or more, preferably 2000 mPa·s or less, more preferably 1600 mPa·s or less, and still more preferably 1500 mPa·s or less. From the viewpoint of further improving the thickness accuracy of the curable composition layer and further making it less likely for voids to occur in the curable composition layer, it is particularly preferable that the viscosity of the above curable composition at 25°C and 10 rpm is 160 mPa·s or more and 1600 mPa·s or less.

[0133] The above viscosity is measured at 25°C using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

[0134] The above curable composition can be used to bond a first member and a second member together and to form a partition wall. The above curable composition is preferably used by being applied to the first surface of the first member. The above curable composition is preferably used by being applied to the first surface of the first member so as to surround a light-emitting member placed on the first surface of the first member. The above curable composition is preferably used by being applied in a frame shape on the first surface of the first member. The above curable composition is preferably used to form a frame-shaped partition wall. It is preferable that a light-emitting member is located inside the frame-shaped partition wall. It is preferable that an internal space exists inside the partition wall. It is preferable that a void exists inside the partition wall.

[0135] Further details regarding the first component, the second component, and the light-emitting component will be described later.

[0136] (Light-emitting device and method for manufacturing a light-emitting device) The light-emitting device according to the present invention comprises a first member, a light-emitting member disposed on a first surface of the first member, and a partition wall disposed on the first surface of the first member, wherein the partition wall is a cured product of the inkjet and partition-forming curable composition described above.

[0137] The above-mentioned light-emitting device preferably comprises a second member. In the above-mentioned light-emitting device, it is preferable that the partition wall adheres the first member and the second member. In the above-mentioned light-emitting device, it is preferable that the partition wall is arranged on the first surface of the first member so as to surround the light-emitting member.

[0138] The manufacturing method for the above-mentioned light-emitting device preferably comprises the following steps (1) to (4): (1) A coating step in which the above-mentioned inkjet and partition-forming curable composition is applied to the first surface of the first member on which the light-emitting member is placed, using an inkjet device, to form a curable composition layer. (2) A photocuring step in which the curing of the curable composition layer is advanced by irradiation with light to form a B-stage material layer. (3) A placement step in which the second member is placed on the surface of the B-stage material layer opposite to the first member side. (4) A thermocuring step in which the B-stage material layer is heat-cured.

[0139] Specific embodiments of the present invention will be described below with reference to the drawings. Note that the size, thickness, and shape shown in the following drawings may differ from the actual size, thickness, and shape for illustrative purposes.

[0140] Figure 1(a) is a schematic plan view showing a light-emitting device obtained using an inkjet and partition-forming curable composition according to the first embodiment of the present invention, and Figure 1(b) is a schematic cross-sectional view showing the light-emitting device. Figure 1(b) is a cross-sectional view along line II in Figure 1(a).

[0141] The light-emitting device 10 shown in Figure 1 comprises a first member 1, a second member 2, a partition wall 3, and a light-emitting member 4. The partition wall 3 is a cured product of the curable composition described above. The partition wall 3 is a photocured and thermocured product of the curable composition described above. The partition wall 3 adheres to the first surface 1a of the first member 1 and the first surface 2a of the second member 2. The partition wall 3 is positioned on the first surface 1a of the first member 1 and the first surface 2a of the second member 2. The partition wall 3 is positioned on the first surface 1a of the first member 1 so as to surround the light-emitting member 4. The partition wall 3 is not positioned on the surface of the light-emitting member 4. The shape of the partition wall 3 is frame-like. A space is formed by the portion enclosed by the first member 1, the second member 2, and the partition wall 3.

[0142] Referring to Figures 2(a) to (c) and Figures 3(d) to (f), an example of a method for manufacturing the light-emitting device shown in Figure 1 will be described.

[0143] First, as shown in Figure 2(a), a curable composition is applied to the first surface 1a of the first member 1 on which the light-emitting member 4 is placed, using an inkjet device to form a curable composition layer 3A (coating step). The curable composition is applied to the upper surface of the first member 1 to form a curable composition layer 3A. The curable composition is ejected from the ejection section 51 of the inkjet device.

[0144] Next, as shown in Figure 2(b), light is irradiated onto the curable composition layer 3A from the light irradiation unit 52 of the inkjet device to advance the curing of the curable composition layer 3A and form the B-stage compound layer 3B (photocuring process). The B-stage compound layer 3B is a pre-cured layer of the curable composition.

[0145] In addition, in the above method for manufacturing the light-emitting device, after applying the curable composition to a specific area, the entire applied curable composition may be irradiated with light to form a B-stage compound layer. In the above method for manufacturing the light-emitting device, the applied curable composition may be irradiated with light each time multiple drops of the curable composition are applied to form a B-stage compound layer. In the above method for manufacturing the light-emitting device, the applied curable composition may be irradiated with light each time one drop of the curable composition is applied to form a B-stage compound layer.

[0146] After the above photocuring step, it is determined whether or not to repeat the above coating step and the above photocuring step. If the above coating step and the above photocuring step are repeated, the curable composition is applied to the surface side of the formed B-stage compound layer opposite to the first member side.

[0147] Figures 2(c) and 3(d) show the second coating process and the second photocuring process, respectively. As shown in Figure 2(c), a curable composition is applied to the surface of the B-stage material layer 3B opposite to the first member 1 side using an inkjet device, forming a curable composition layer 3A on the surface of the B-stage material layer 3B. Next, as shown in Figure 3(d), light is irradiated onto the applied curable composition layer 3A from the light irradiation unit 52 of the inkjet device to form the B-stage material layer 3B.

[0148] In Figures 2 and 3, the coating process and the photocuring process are performed twice in the thickness direction of the curable composition layer, as shown in Figures 2(a) and 2(b), and Figures 2(c) and 3(d). By performing the coating process and the photocuring process multiple times in the thickness direction of the curable composition layer, the thickness of the B-stage compound layer can be increased, and the aspect ratio (thickness / width) of the B-stage compound layer can be increased. The coating process and the photocuring process may be performed two or more times, or three or more times.

[0149] By repeating the above coating process and the above photocuring process, a B-stage material layer 3B is formed so as to surround the light-emitting member 4.

[0150] Next, as shown in Figure 3(e), the second member 2 is placed on the surface of the B-stage alloy layer 3B that surrounds the light-emitting member 4, on the side opposite to the first member 1 (placement step). The second member 2 is placed on the surface of the frame-shaped B-stage alloy layer 3B. Pressure may be applied when placing the second member.

[0151] Next, as shown in Figure 3(f), the B-stage phosphate layer 3B is heat-cured (thermo-curing step). The laminated structure obtained in Figure 3(e), comprising the first member 1, the second member 2, and the B-stage phosphate layer 3B, is heated to heat-cur the B-stage phosphate layer 3B. This forms the partition wall 3. The partition wall 3 is a photo-cured and thermo-cured layer of the curable composition.

[0152] In this way, the light-emitting device 10 shown in Figure 1 can be obtained.

[0153] In the above coating process, from the viewpoint of forming partitions with an even larger aspect ratio, it is preferable to coat (dispense) the curable composition while circulating it.

[0154] The above-mentioned inkjet apparatus is not particularly limited, and any inkjet apparatus capable of applying the curable composition according to the present invention can be used. Preferably, the above-mentioned inkjet apparatus has an ink tank in which the curable composition is stored, a discharge section connected to the ink tank and from which the curable composition is discharged, and a circulation channel section having one end connected to the discharge section and the other end connected to the ink tank, through which the curable composition flows. In this case, the inkjet discharge performance of the curable composition can be improved, and a partition wall with an even larger aspect ratio can be formed.

[0155] The above-described circulation channel section may or may not have a buffer tank and a pump within it. Preferably, the above-described circulation channel section has the buffer tank and preferably has the pump within it. In addition to the buffer tank and pump, the above-described circulation channel section may also have a flow meter, thermometer, filter, liquid level sensor, etc. within it.

[0156] From the viewpoint of improving the inkjet ejection performance of the curable composition and forming a partition with an even larger aspect ratio, it is preferable to circulate the curable composition while heating it. When circulating the curable composition while heating it, it is possible to adjust the temperature of the curable composition by introducing a heating heater into the ink tank or by using a heating heater in the circulation channel.

[0157] From the viewpoint of improving the inkjet ejection properties of the curable composition and forming partitions with an even larger aspect ratio, the temperature of the circulating curable composition is preferably 30°C or higher, more preferably 40°C or higher, preferably 120°C or lower, and more preferably 100°C or lower.

[0158] In the above photocuring process, it is preferable to irradiate with ultraviolet light. The irradiance and irradiation time of the ultraviolet light in the above photocuring process can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition. For example, the irradiance of the ultraviolet light in the above photocuring process is 1000 mW / cm². 2 It may be greater than or equal to 5000 mW / cm². 2 It may be greater than or equal to 10,000 mW / cm². 2 It may also be less than 8000 mW / cm². 2 The following is also possible: The irradiation time of ultraviolet light in the above photocuring process may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.

[0159] In the above arrangement step, it is preferable to place the second member on the surface of the B-stage material layer that is arranged to surround the light-emitting member. In the above arrangement step, it is preferable to bond the second member to the surface of the frame-shaped B-stage material layer.

[0160] The above-mentioned heat curing step is preferably performed after the above-mentioned placement step.

[0161] The heating temperature and heating time in the above-mentioned thermosetting process can be appropriately changed depending on the composition of the curable composition and the thickness of the B-stage compound layer. The heating temperature in the above-mentioned thermosetting process may be, for example, 100°C or higher, 120°C or higher, 250°C or lower, or 200°C or lower. The heating time in the above-mentioned thermosetting process may be, for example, 5 minutes or more, 30 minutes or more, 600 minutes or lower, or 300 minutes or lower.

[0162] The width, height, and shape of the above-mentioned bulkhead can be changed as appropriate.

[0163] The width of the partition wall is preferably 5 μm or more, more preferably 10 μm or more, even more preferably 25 μm or more, preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less. If the width of the partition wall is greater than or equal to the lower limit, the strength of the partition wall can be increased. If the width of the partition wall is less than or equal to the upper limit, the light-emitting device can be made even smaller. If the width of the partition wall is greater than or equal to the lower limit, the infrared light shielding performance can be further increased.

[0164] The height of the partition wall is preferably 50 μm or more, more preferably 100 μm or more, even more preferably 200 μm or more, preferably 3000 μm or less, more preferably 2000 μm or less, and even more preferably 1000 μm or less. If the height of the partition wall is above the lower limit, a partition wall with an even larger aspect ratio can be formed. If the height of the partition wall is below the upper limit, the light-emitting device can be made even smaller. Also, if the height of the partition wall is below the upper limit, the occurrence of partition wall distortion can be effectively suppressed.

[0165] The aspect ratio (height / width ratio) of the partition wall is preferably 3 or more, more preferably 5 or more, even more preferably 10 or more, preferably 100 or less, more preferably 50 or less, and even more preferably 30 or less. If the aspect ratio (height / width) is above the lower limit, the light-emitting device can be made even smaller. If the aspect ratio (height / width) is below the upper limit, the strength of the partition wall can be increased.

[0166] Examples of the first component mentioned above include circuit boards, semiconductor elements, and silicon substrates.

[0167] Examples of the second member mentioned above include transparent members. Examples of the second member being a transparent member include transparent glass members such as diffusion glass and IR cut glass. It is preferable that the second member is a transparent glass member.

[0168] The above-mentioned light-emitting member is preferably a light-emitting member capable of emitting infrared light. Examples of the above-mentioned light-emitting member include a 3D sensor light source.

[0169] The present invention will be described in more detail below with reference to examples. The present invention is not limited to the following examples. Please note that the following examples 1-5, 10, 13-17, 32-38, and 40 are for reference only.

[0170] The following materials were prepared.

[0171] ((A) Photocurable compound) Hexafunctional (meth)acrylate compound: Dipentaerythritol hexaacrylate (Daicel Ornex "DPHA") Trifunctional (meth)acrylate compound: Trimethylolpropane triacrylate (Daicel Ornex "TMPTA") Bifunctional (meth)acrylate compound 1: Ethoxylated bisphenol A diacrylate (APG-700, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., a (meth)acrylate compound having a polyol skeleton) Bifunctional (meth)acrylate compound 2: Tricyclodecanedimethanol diacrylate ("IRR214K" manufactured by Daicel Ornex, a (meth)acrylate compound having a dicyclopentadiene skeleton) Difunctional (meth)acrylate compound 3:1,6-hexanediol diacrylate (HDDA, manufactured by Daicel Ornex)

[0172] ((B) Thermosetting compound) (B1) Photo- and thermosetting compounds: 4-hydroxybutyl (meth)acrylate glycidyl ether ("4HBAGE" manufactured by Mitsubishi Chemical Corporation) Difunctional epoxy compound: Bisphenol A type epoxy compound (DIC Corporation's "850CRP")

[0173] ((C) Photocurable compound) Monofunctional (meth)acrylate compound: 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd. as "2EHA")

[0174] (Photopolymerization initiator) 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (IGM "Irg379")

[0175] (Thermosetting agent) 1,3-Bis(3-aminophenoxy)benzene ("APB-N" manufactured by Mitsui Chemicals, Inc.) Bis[4-(3-aminophenoxy)phenyl]sulfone (Seika Corporation "BAPS-M") 4,4'-Diamino-3,3'-Diethyl-5,5'-Dimethyldiphenylmethane (Kumiai Chemical Industry Co., Ltd. "Cure Hard MED") Dicyandiamide (DICY7, manufactured by Mitsubishi Chemical Corporation)

[0176] (Silane coupling agent) 3-Glycidoxypropylmethyldimethoxysilane (Shin-Etsu Chemical Co., Ltd. "KBM-402") 3-Glycidoxypropylmethyldiethoxysilane (Shin-Etsu Chemical Co., Ltd. "KBE-402")

[0177] (Infrared light shielding agent) Phthalocyanine vanadium complex (HA-1, manufactured by Nippon Shokubai Co., Ltd.) Phthalocyanine copper complex (FDN-006, manufactured by Yamada Chemical Industries Co., Ltd.) Phthalocyanine metal complex (FDN-008, manufactured by Yamada Chemical Industries Co., Ltd.) Carbon Black 1 (Sanyo Pigment Co., Ltd. "SF Black BJ2296", average primary particle size 35nm) Carbon Black 2 (Mitsubishi Chemical Corporation "MA600", average primary particle size 20nm) Carbon Black 3 (PD-605 manufactured by Mikuni Pigment Co., Ltd., average primary particle size 65nm) Carbon Black 4 (Mitsubishi Chemical Corporation "#10", average primary particle size 75nm) Carbon Black 5 (Mitsubishi Chemical Corporation "#20", average primary particle size 50nm) Carbon Black 6 (Mitsubishi Chemical Corporation "#85", average primary particle size 40nm) Carbon Black 7 (Mitsubishi Chemical Corporation "MA220", average primary particle size 55nm) Carbon Black 8 (Mitsubishi Chemical Corporation's "MCF88", average primary particle size 18nm) Carbon Black 9 (Mitsubishi Chemical Corporation "#850", average primary particle size 17nm)

[0178] (Dispersant) Wetting and dispersing agent (BYK9076, manufactured by BYK, acid value 38 mg KOH / g, amine value 44 mg KOH / g) Wetting and dispersing agent (DISPERBYK-145, manufactured by BYK, acid value 76 mgKOH / g, amine value 71 mgKOH / g) Wetting and dispersing agent (Florence GW-1500, manufactured by Kyoeisha Chemical Co., Ltd., acid value 55 mg KOH / g, amine value 0 mg KOH / g) Wetting and dispersing agent (BASF "EfkaPX4701", acid value 0 mg KOH / g, amine value 40 mg KOH / g)

[0179] (Examples 1-40 and Comparative Examples 1, 2) The components shown in Tables 1 to 9 were blended in the amounts (pure amounts) shown in Tables 1 to 9 and uniformly mixed to obtain a curable composition for inkjet printing and partition formation.

[0180] (evaluation) (1) Formation of septa with a large aspect ratio (1) Formation of septa with a width of 300 μm and a height of 1 mm, 2) Formation of septa with a width of 200 μm and a height of 1 mm, and 3) Formation of septa with a width of 100 μm and a height of 1 mm) The obtained curable composition was applied to a first component using the inkjet head of a piezo-type inkjet printer equipped with an ultraviolet irradiation device (coating step). Next, the applied curable composition was irradiated with ultraviolet light to form a B-stage material layer (photocuring step). The above coating step and photocuring step were repeated in the thickness direction of the formed B-stage material layer. Next, the obtained B-stage material layer was heated and thermally cured to form a partition wall (photocured and thermocured material layer) (thermocuring step). The shape of the partition wall was observed using a laser microscope (Olympus "OLS4100").

[0181] In accordance with the above, we confirmed whether it was possible to form partitions with the following dimensions: 1) a width of 300 μm and a height of 1 mm, 2) a width of 200 μm and a height of 1 mm, and 3) a width of 100 μm and a height of 1 mm. In the table, "A" means that partitions with the above shapes could be formed, and "B" means that partitions with the above shapes could not be formed.

[0182] (2) Infrared light shielding properties of the partition The obtained curable composition was applied to a first component using the inkjet head of a piezo-type inkjet printer equipped with an ultraviolet irradiation device (coating step). Next, the applied curable composition was irradiated with ultraviolet light to form a B-stage material layer (photocuring step). The above coating step and photocuring step were repeated in the thickness direction of the formed B-stage material layer. Next, the obtained B-stage material layer was heated and thermally cured (thermocuring step). The infrared transmittance of the obtained light and the thermocured layer at a wavelength of 950 nm (optical path length: 100 μm) was measured using a spectrophotometer (Hitachi High-Tech Corporation "U-4100").

[0183] <Criteria for determining the infrared light shielding performance of partitions> ○○: Infrared transmittance at a wavelength of 950nm is less than 0.1% ○: Infrared transmittance at a wavelength of 950nm is 0.1% or more and 10% or less. ×: Infrared transmittance at a wavelength of 950nm exceeds 10%.

[0184] (3) Adhesion between the member to be bonded and the partition wall A glass substrate (5 cm x 5 cm) was prepared as the material to be bonded. The curable composition obtained was applied to the glass substrate using the inkjet head of a piezo-type inkjet printer equipped with an ultraviolet irradiation device (coating step). Next, ultraviolet light was irradiated onto the applied curable composition to form a B-stage material layer (photocuring step). The above coating step and photocuring step were repeated in the thickness direction of the formed B-stage material layer. Next, the obtained B-stage material layer was heated and thermally cured to form a partition wall (photocured and thermocured layer) with a height of 150 μm (thermocuring step). Cuts were made in the obtained partition wall at 1 mm intervals in the vertical and horizontal directions to create 100 grids. Each grid of the partition wall was observed using a laser microscope (Olympus "OLS4100"), and the adhesion between the material to be bonded and the partition wall was determined according to the following criteria.

[0185] [Criteria for determining the adhesion between the component to be bonded and the partition wall] ○○: The number of squares where the partition has peeled off is 0 to 10. ○: Number of squares where the partition has peeled off is between 11 and 30. ×: The number of squares where the partition has peeled off is 31 or more.

[0186] (4) Inkjet ejection properties The curable composition obtained was subjected to ejection tests from the inkjet head of a piezo-type inkjet printer equipped with an ultraviolet irradiation device. The inkjet ejection performance was judged according to the following criteria.

[0187] [Criteria for determining inkjet ejection performance] A: Capable of continuously and evenly dispensing the curable composition for 100 hours or more. B: The curable composition can be dispensed without unevenness during 10 hours of continuous dispensing, but slight dispensing unevenness occurs during continuous dispensing for 10 hours or more but less than 100 hours. C: The curable composition can be dispensed continuously for 10 hours or more, but slight dispensing unevenness may occur during the 10 hours of continuous dispensing. D: The curable composition can be dispensed, but it cannot be dispensed continuously for more than 10 hours. E: The curable composition can be dispensed, but there is uneven dispensing in the initial stages. F: Unable to dispense the curable composition in the initial stages of dispensing.

[0188] The composition and results are shown in Tables 1-9 below.

[0189] [Table 1]

[0190] [Table 2]

[0191] [Table 3]

[0192] [Table 4]

[0193] [Table 5]

[0194] [Table 6]

[0195] [Table 7]

[0196] [Table 8]

[0197] [Table 9] [Explanation of Symbols]

[0198] 1...First component 1a...First surface 2…Second component 2a...First surface 3…Bulkhead 3A…Curable composition layer 3B...B Stage Monster Layer 4…Light-emitting component 10…Light-emitting devices 51...Discharge part 52…Light-irradiating section

Claims

1. A photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and no cyclic ether groups, Thermosetting compounds having cyclic ether groups, Photopolymerization initiator, Thermosetting agent and It contains an infrared light shielding agent, The aforementioned thermosetting agent comprises an aromatic amine compound, The infrared light shielding agent is a curable composition for inkjet printing and partition formation, comprising carbon black.

2. The inkjet and partition-forming curable composition according to claim 1, used to form partitions having an aspect ratio (ratio of height to width (height / width)) of 3 or more.

3. A light-emitting device comprising a first member, a light-emitting member disposed on a first surface of the first member, and a partition wall disposed on the first surface of the first member, wherein the inkjet and partition wall forming curable composition according to claim 1 is used to form the partition wall.

4. The curable composition for inkjet printing and partition formation according to claim 1, wherein the photocurable compound comprises a (meth)acrylate compound with six or more functionalities.

5. The curable composition for inkjet printing and partition formation according to any one of claims 1 to 4, wherein the average primary particle size of the carbon black is 20 nm or more and 100 nm or less.

6. The inkjet and partition-forming curable composition according to any one of claims 1 to 4, wherein the thermosetting compound comprises a thermosetting compound having two or more cyclic ether groups.

7. The curable composition for inkjet and partition formation according to any one of claims 1 to 4, wherein the photocurable compound comprises a photocurable compound having a dicyclopentadiene skeleton.

8. The inkjet and partition-forming curable composition according to any one of claims 1 to 4, wherein the thermosetting compound comprises a photo- and thermosetting compound having a (meth)acryloyl group.

9. The curable composition for inkjet and partition formation according to any one of claims 1 to 4, wherein the photocurable compound comprises a photocurable compound having a total of three or more (meth)acryloyl groups and vinyl groups.

10. The curable composition for inkjet printing and partition formation according to any one of claims 1 to 4, wherein the content of the photocurable compound is 10% by weight or more and 75% by weight or less.

11. The curable composition for inkjet printing and partition formation according to any one of claims 1 to 4, wherein the aromatic amine compound comprises 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone.

12. A curable composition for inkjet printing and partition formation according to any one of claims 1 to 4, further comprising a dispersant.

13. The acid value of the dispersant is 10 mg KOH / g or more and 100 mg KOH / g or less. The curable composition for inkjet printing and partition formation according to claim 12, wherein the amine value of the dispersant is 10 mg KOH / g or more and 100 mg KOH / g or less.

14. The curable composition for inkjet printing and partition formation according to any one of claims 1 to 4, wherein the content of the infrared light shielding agent is 0.5% by weight or more in 100% by weight of the curable composition.

15. A curable composition for inkjet printing and partition formation according to any one of claims 1 to 4, excluding a curable composition used to form a marking portion in an electronic component.

16. The first member and A light-emitting member disposed on the first surface of the first member, The first member comprises a partition wall disposed on the first surface of the first member, A light-emitting device in which the partition wall is a cured product of the inkjet and partition-forming curable composition described in any one of claims 1 to 4.

17. It comprises a second member, The light-emitting member is a light-emitting member capable of irradiating infrared light, The partition wall is arranged on the first surface of the first member so as to surround the light-emitting member. The light-emitting device according to claim 16, wherein the partition wall bonded the first member and the second member together.

18. A coating step of applying an inkjet-compatible and partition-forming curable composition according to any one of claims 1 to 4 onto a first surface of a first member on which a light-emitting member is arranged, using an inkjet device, to form a curable composition layer; A method for manufacturing a light-emitting device, comprising a photocuring step of curing the curable composition layer by irradiation with light to form a B-stage compound layer.

19. The arrangement step involves placing the second member on the surface of the B-stage material layer opposite to the first member side, The process includes a thermosetting step in which the B-stage compound layer is heat-cured, The method for manufacturing a light-emitting device according to claim 18, wherein in the arrangement step, the second member is placed on the surface of the B-stage material layer that is arranged to surround the light-emitting member.

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