Hardening components

Abstract

The present application relates to a curable composition and its use. The curable composition of the present application can be applied to a product that generates heat during operation or maintenance, and can provide a curable composition that can be used as a material capable of processing the heat. The curable composition of the present application can be applied to a product in which a plurality of heat-generating elements are integrated, and can efficiently process the heat generated from the elements while maintaining the temperature of the product uniform. In addition, the curable composition of the present application can be applied to such a product, and even if abnormal heat generation, explosion, or fire occurs in any one of the plurality of elements, the effect of such heat generation, explosion, or fire on other adjacent elements can be prevented or minimized. The curable composition of the present application can also stably perform the above-mentioned functions for a long period of time.

Description

[Technical Field]

[0001] Mutual citation with related applications This application claims priority rights under Korean Patent Application No. 10-2021-0134138 dated October 8, 2021, and Korean Patent Application No. 10-2022-0128215 dated October 6, 2022, and all content disclosed in the documents of said Korean Patent Applications is incorporated herein by reference.

[0002] a Technical field This application relates to a curable composition and its uses. [Background technology]

[0003] The importance of technologies for managing the heat generated by products is increasing. One common method of heat management is to use materials with excellent thermal conductivity to dissipate the heat generated from the product to the outside, or to use cooling media to eliminate the generated heat.

[0004] However, managing heat in a product composed of multiple heat-generating elements (elements that generate heat) is a difficult problem.

[0005] For example, battery modules and battery packs contain multiple battery cells or multiple battery modules, which are located relatively close to each other. Therefore, heat generated from one battery cell or battery module can affect other adjacent components, potentially triggering problems such as chain ignition or chain explosion.

[0006] In such products, it is necessary to ensure that heat, explosions, or fires generated from any one element do not affect other adjacent elements.

[0007] Depending on the product, it may be necessary to maintain a uniform temperature throughout the entire system during operation and maintenance. Therefore, in products composed of multiple heat-generating elements as described above, there is a need for technology that can maintain a uniform temperature throughout the entire product during operation or maintenance, and that can handle abnormal heat generation, explosions, or fires originating from any one heat-generating element without propagating them to other elements as much as possible. [Overview of the project] [Problems that the invention aims to solve]

[0008] This application relates to a curable composition and its uses. The curable composition of this application can be applied to products that generate heat during the driving or maintenance process and can be used as a material capable of handling such heat. The curable composition of this application can be applied to products in which multiple heat-generating elements are integrated and can efficiently handle the heat generated from the elements while maintaining a uniform temperature of the product. Furthermore, the curable composition of this application can be applied to such products and can prevent or minimize the impact of abnormal heat generation, explosion, or ignition on other adjacent elements even if abnormal heat generation, explosion, or ignition occurs in one of the multiple elements. The curable composition of this application can also perform the above functions stably over a long period of time. The application can also provide a cured body formed by such a curable composition or uses for the curable composition or the cured body. [Means for solving the problem]

[0009] In this specification, any physical properties that are affected by temperature are those measured at room temperature unless otherwise specified.

[0010] In this specification, the term "room temperature" refers to the natural temperature without heating or cooling, meaning any single temperature within the range of approximately 10°C to 30°C, for example, approximately 15°C, 18°C, 20°C, 23°C, or 25°C. Unless otherwise specified in this specification, the unit of temperature is °C.

[0011] In this specification, if pressure affects the results of any physical property mentioned, unless otherwise specified, the physical property is the one measured at normal pressure. Normal pressure is the natural pressure without pressurization or depressurization, and is usually defined as approximately 1 atmosphere (approximately 700-800 mmHg).

[0012] In this specification, if humidity affects the results of any physical property mentioned herein, unless otherwise specified, the physical property is the one measured at normal temperature and pressure with unadjusted humidity.

[0013] This application relates to curable compositions. A curable composition is a composition that can be cured. Curing is the phenomenon in which a composition solidifies through physical and / or chemical reactions.

[0014] The curable composition may be energy ray curable, moisture curable, thermosetting, or room temperature curable, or it may be a hybrid curable type to which two or more of the curing methods are applied.

[0015] In the case of energy ray curing, the curable composition can be cured by irradiating the composition with energy rays such as ultraviolet light; in the case of moisture curing, by maintaining the composition under appropriate humidity; in the case of thermosetting, by applying appropriate heat to the composition; or in the case of room temperature curing, by maintaining the curable composition at room temperature. In the case of hybrid curing, two or more of the methods described above can be applied simultaneously or in stages to cure the curable composition. In one example, the curable composition of this application may be at least of the room temperature curing type. For example, the curable composition of this application can be cured while maintained at room temperature without the application of additional energy rays or heat.

[0016] The curable composition of this application may be a one-component curable composition or a two-component curable composition. A one-component curable composition is a composition that is stored with the components necessary for curing already mixed, while a two-component curable composition is a composition that is stored with the components necessary for curing physically separated. A two-component curable composition usually contains a so-called main component and a curing agent component, and the main component and curing agent component are mixed for curing. When the curable composition of this application is a two-component curable composition, the curable composition may be the main component component or the curing agent component of the two-component curable composition, or a mixture of the main component and the curing agent component.

[0017] The curable composition can form a cured body that exhibits latent heat within a predetermined temperature range. Latent heat is generally defined as the amount of heat required for any substance to undergo a phase transition without a change in temperature. However, when the cured body of this application exhibits latent heat, it is not necessarily the case that the entire body must undergo a phase transition. The latent heat of the cured body of this application may be generated during the phase transition process of at least a part of the cured body or of the components contained in the cured body.

[0018] In this application, the statement that the cured body exhibits latent heat within a predetermined temperature range means that the cured body exhibits an endothermic peak within a predetermined temperature range in a DSC (Differential Scanning Calorimeter) analysis performed in the manner described in the examples below. The process by which the cured body exhibits the latent heat in this application is an isothermal process. Therefore, the cured body can be applied to heat-generating products, controlling the heat while maintaining a uniform temperature of the product, and minimizing or preventing the impact of abnormal heat generation, explosion, and / or ignition from one product on other adjacent products.

[0019] The lower limit of the latent heat exhibited by the cured body may be approximately 20 J / g, 25 J / g, 30 J / g, 35 J / g, 40 J / g, 45 J / g, 50 J / g, 55 J / g, 60 J / g, 65 J / g, 70 J / g, 75 J / g, 80 J / g, 85 J / g, or 90 J / g, and the upper limit may be approximately 200 J / g, 195 J / g, 190 J / g, 185 J / g, 180 J / g, 175 J / g, 170 J / g, or 165 J / g. g, 160 J / g, 155 J / g, 150 J / g, 145 J / g, 140 J / g, 135 J / g, 130 J / g, 125 J / g, 120 J / g, 115 J / g, 110 J / g, 105 J / g, 100 J / g, 95 J / g, 90 J / g, 85 J / g, 80 J / g, 75 J / g, 70 J / g, 65 J / g, 60 J / g, 55 J / g, 50 J / g, 45 J / g, or around 40 J / g may also be acceptable. The latent heat exhibited by the cured material may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. A cured material exhibiting such latent heat can provide excellent thermal control in various applications, and can particularly provide stable thermal control in battery modules and battery packs.

[0020] The cured body can control the temperature range in which it exhibits the latent heat.

[0021] In this specification, the latent heat interval is the temperature interval exhibiting the latent heat, and is the endothermic interval in which the endothermic peak is confirmed in the DSC (Differential Scanning Calorimeter) analysis of the examples described later, ranging from the temperature at the left on-set inflection point of the endothermic peak to the temperature at the right on-set inflection point of the endothermic peak. In this specification, the temperature at the left on-set inflection point of the endothermic peak is also called the on-set temperature, and the temperature at the right on-set inflection point of the endothermic peak is also called the offset temperature.

[0022] In the endothermic section of DSC analysis, one or more endothermic peaks can be observed. Even when multiple endothermic peaks are observed, the latent heat section is defined as the range from the temperature at the inflection point of the first endothermic peak (latent heat section start temperature or onset temperature) to the temperature at the inflection point of the last endothermic peak (latent heat section end temperature or offset).

[0023] The concepts of latent heat, latent heat interval, onset temperature, and offset temperature described above also apply equally to phase transition materials.

[0024] The lower limit of the temperature in the latent heat interval may be around 0°C, 5°C, 10°C, 15°C, 20°C, 25°C, 27°C, or 30°C, and the upper limit may be around 80°C, 78°C, 76°C, 74°C, 72°C, 70°C, 68°C, 66°C, 64°C, 62°C, 60°C, 58°C, 56°C, 54°C, 52°C, 50°C, 48°C, 46°C, 44°C, 42°C, or 40°C. The latent heat interval may be within a range that is above or below any one of the lower limits described above, and below or below any one of the upper limits described above.

[0025] The cured body can adjust the width of the temperature interval in which it exhibits latent heat, i.e., the width of the latent heat interval. The width of the latent heat interval is the value obtained by subtracting the latent heat interval start temperature (the onset temperature) from the latent heat interval end temperature (the offset temperature). The lower limit of the width of the latent heat interval may be around 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, or 35°C, and the upper limit may be around 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, 40°C, 35°C, 30°C, or 25°C. The width of the latent heat interval of the latent heat exhibited by the cured body may be greater than or exceeding any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or exceeding any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0026] In one example, the onset temperature of the latent heat interval in which the cured body exhibits the latent heat can be adjusted. In this case, the definition of the onset temperature is as described above. The lower limit of the interval range in which the onset temperature exists may be around 10°C, 12°C, 14°C, 16°C, 18°C, 20°C, 22°C, 24°C, 26°C, or 28°C, and the upper limit may be around 60°C, 58°C, 56°C, 54°C, 52°C, 50°C, 48°C, 46°C, 44°C, 42°C, 40°C, 38°C, 36°C, 34°C, 32°C, 30°C, 28°C, or 26°C. The onset temperature may be within a range that is greater than or equal to any one of the lower limits described above, and less than or equal to any one of the upper limits described above.

[0027] In one example, the offset temperature of the latent heat interval in which the cured body exhibits the latent heat can be adjusted. In this case, the definition of the offset temperature is as described above. The lower limit of the interval range in which the offset temperature exists may be around 30°C, 32°C, 34°C, 36°C, 38°C, 40°C, 42°C, 44°C, 46°C, 48°C, or 50°C, and the upper limit may be around 80°C, 78°C, 56°C, 74°C, 72°C, 70°C, 68°C, 66°C, 64°C, 62°C, 60°C, 58°C, 56°C, 54°C, 52°C, or 50°C. The offset temperature may be within a range that is greater than or equal to any one of the lower limits described above, and less than or equal to any one of the upper limits described above.

[0028] A cured body having the latent heat in the aforementioned temperature range and interval can be applied to various heat-generating products (especially battery modules or battery packs) to enable the product to operate stably and uniformly within a temperature range. Furthermore, the cured body can be applied to products containing multiple heat-generating elements arranged relatively adjacent to each other, maintaining a uniform temperature throughout the product and minimizing or preventing the impact of abnormal heat generation, ignition, and / or explosion in one element on other elements. In particular, a cured body exhibiting the latent heat characteristics can be applied to products that must maintain an operating temperature within a range of approximately 15°C to 60°C (e.g., secondary battery cells or battery modules / battery packs containing multiple such cells), enabling efficient heat control.

[0029] The cured body of this application can stably maintain the latent heat properties described above for a long period of time. In one example, the curable composition may contain a so-called phase change material (PCM) in order for the cured body to exhibit the latent heat properties. As the phase change material, a substance that absorbs heat by undergoing a phase transition from solid to liquid can be used. Such a substance can disappear from the cured body because it transitions to the liquid phase while exhibiting latent heat. Therefore, in such cases, the latent heat properties can disappear over time. In this application, through the selection of the curable resin components that form the cured body, the adjustment of the degree of crosslinking, the adjustment of the type and proportion of the phase change material, and / or the method of manufacturing the curable composition, the phase change material in the cured body does not disappear from the cured body even after transitioning to the liquid phase, and therefore, the latent heat properties described above can be stably maintained for a long period of time.

[0030] For example, the cured body of this application can control ΔW in the following formula 1 within a predetermined range.

[0031] [Formula 1] △W = 100 × (W f -W i ) / W i

[0032] In Equation 1, △W is the weight change rate of the hardened body (in %), and W f This is the weight of the hardened body measured after maintaining the hardened body at 80°C for 24 hours, W i This is the weight of the cured body before maintaining it at 80°C for 24 hours. The specific method for measuring ΔW in Equation 1 is described in the Examples section. Also, the weight (W) in Equation 1 above. f and W i The units of ) are not restricted as long as the same units apply to each other.

[0033] The upper limit of the weight change rate △W may be approximately 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1.5%, 1%, or 0.5%. The weight change rate may be less than or equal to any one of the upper limits described above. Since a smaller value of the weight change rate △W means that the phase transition material is stably maintained within the cured body, there is no particular limit to its lower limit. The lower limit of the weight change rate △W may be, for example, approximately 0% or 0.5%. The weight change rate △W may be within a range that is greater than or equal to any one of the lower limits described above, and less than or equal to any one of the upper limits described above.

[0034] In this application, the latent heat properties and weight change properties described above can be achieved without using so-called composite materials as phase transition materials. Phase transition materials exhibit endothermic properties that allow for heat control, but they usually have poor thermal conductivity. Therefore, it is not easy to transfer the heat to be processed to the phase transition material. For this reason, composite materials are known that combine a phase transition material with a material with high thermal conductivity, such as graphite or carbon fiber. Such materials can solve to some extent the problem of low thermal conductivity, which is a disadvantage of phase transition materials, but they increase the density and specific gravity of the material, which is disadvantageous from the viewpoint of weight reduction. However, in this application, the problem of reduced thermal control efficiency due to low thermal conductivity, which is a disadvantage of phase transition materials, can be solved without using the composite phase transition material by selecting the curable resin component that forms the cured body, adjusting the degree of crosslinking, adjusting the type and ratio of the phase transition material and / or adjusting the manufacturing method of the curable composition, thereby enabling the provision of a lightweight material.

[0035] In the present application, it is possible to achieve the above latent heat characteristics and weight change characteristics while using a so-called non-encapsulated phase change material, that is, a non-encapsulated phase change material as the phase change material. That is, the phase change material often transfers to a liquid during the phase change process, and the phase change material transferred to the liquid can easily leak out from the cured body. Therefore, usually, in order to prevent the leakage of the phase change material, a phase change material encapsulated with a material that does not become a liquid phase is used. However, in such a case, since the phase change material is encapsulated with a material that is not a phase change material, it is not easy to stably ensure the performance of the phase change material. In the present application, as will be described later, even when using a non-encapsulated phase change material as the phase change material through the control of the matrix of the cured body, the above weight change characteristics can be exhibited.

[0036] In one exemplification, the curable composition may contain a non-encapsulated phase change material as the phase change material, and the lower limit of the content of the non-encapsulated phase change material based on the weight of the total phase change material present in the curable composition or the cured body may be about 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt% or 95 wt%, and the upper limit thereof may be about 100 wt%, 99 wt%, 98 wt%, 97 wt%, 96 wt% or 95 wt%. The content of the non-encapsulated phase change material may exceed any one of the lower limits described above or more, or exceed any one of the lower limits described above or more and be within the range less than or equal to any one of the upper limits described above.

[0037] In one exemplification, the cured body may have a density within a predetermined range. The density as described above can be controlled in consideration of the possibility of providing a lightweight material. For example, the lower limit of the density is 0.5 g / cm 3 , 0.55 g / cm 3 , 0.6 g / cm 3 , 0.65 g / cm 3 , 0.7 g / cm 30.75 g / cm³ 3 , 0.8 g / cm³ 3 , 0.85 g / cm³ 3 , 0.9 g / cm³ 3 0.95 g / cm³ 3 , 1 g / cm³ 3 1.05 g / cm³ 3 1.1 g / cm³ 3 Or 1.15 g / cm³ 3 It may be as low as 2 g / cm³, with an upper limit of 2 g / cm³. 3 1.8 g / cm³ 3 1.6 g / cm³ 3 1.5 g / cm³ 3 1.45 g / cm³ 3 1.4 g / cm³ 3 1.35 g / cm³ 3 3. 1.3 g / cm³ 3 1.25 g / cm³ 3 , 1.2 g / cm³ 3 , 1.15 g / cm³ 3 , 1.1 g / cm³ 3 1.05 g / cm³ 3 , 1 g / cm³ 3 Or 0.95 g / cm³ 3 It may be to a certain extent. The density of the hardened body may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0038] The hardness of the cured body described in this application can be adjusted. The hardness of the cured body is affected by the degree of crosslinking. Generally, when the degree of crosslinking is dense, the hardness increases, and conversely, when the degree of crosslinking is low, the hardness is measured as low. In this application, the degree of crosslinking of the cured body can be adjusted to show an appropriate hardness, taking into account the maintenance efficiency of the phase transition material maintained within the cured body. If the degree of crosslinking is too low and the hardness is too low, the phase transition material may not be properly maintained inside the cured body, and conversely, if the degree of crosslinking is too high and the hardness is too high, the performance of the phase transition material may not be properly expressed.

[0039] For example, the lower limit of the hardness of the hardened body may be approximately 20, 25, 30, 35, 40, 45, 50, 55, 60, 70, or 80 on the Shore OO hardness scale, or approximately 10, 15, 20, 25, 30, 35, 40, or 50 on the Shore A hardness scale, and the upper limit may be approximately 90, 85, 80, 75, 70, 65, or 60 on the Shore OO hardness scale, or approximately 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25, or 20 on the Shore A hardness scale. The hardness of the hardened body may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0040] As mentioned above, the hardness of the cured body can be adjusted mainly by controlling the degree of crosslinking, and such methods are known. In this application, the molecular weight of the curable resin component forming the cured body and the degree of crosslinking of the resin component are controlled so that the hardness is within the aforementioned range, thereby providing a network that can stably maintain the phase transition material. Furthermore, the hardness within the aforementioned range allows the cured body to stably fill spaces with complex shapes, and also improves vibration resistance and impact resistance.

[0041] The curable composition of this application may contain a curable resin component. The term "curable resin component" includes not only components that are themselves so-called resin components, but also components that can form resin components after the curing reaction. Therefore, the curable resin component may be a monomolecule, oligomeric, or polymeric compound.

[0042] In this application, the curable resin component can be a component whose weight-average molecular weight (Mw) is within a predetermined range. The weight-average molecular weight of the curable resin component, along with the crosslinking structure, affects the maintenance of the phase transition material. That is, even under the same or similar degree of crosslinking, if the weight-average molecular weight of the curable resin component linking the crosslinking structure is too low, leakage of the phase transition material may occur, so it is necessary to ensure an appropriate level of weight-average molecular weight. For example, the lower limit of the weight-average molecular weight of the curable resin component may be around 9,000 g / mol, 10,000 g / mol, 15,000 g / mol, 20,000 g / mol, or 25,000 g / mol, and the upper limit may be 1,000,000 g / mol, 900,000 g / mol, 800,000 g / mol, 700,000 g / mol, or 600,000 g The molecular weight may be approximately 500,000 g / mol, 400,000 g / mol, 300,000 g / mol, 200,000 g / mol, 100,000 g / mol, 90,000 g / mol, 80,000 g / mol, 70,000 g / mol, 60,000 g / mol, 50,000 g / mol, 40,000 g / mol, or 30,000 g / mol. Curable resin components having such molecular weight characteristics can form a network of cured bodies in which phase transition materials can be stably maintained internally. In particular, silicone resin components can be effectively applied as resin components having the aforementioned molecular weight characteristics. The weight-average molecular weight may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0043] There are no particular restrictions on the type of curable resin component. In one example, the curable resin component may include a polyurethane component, a silicone resin component, an acrylic resin component, or an epoxy resin component. The polyurethane component, silicone resin component, acrylic resin component, or epoxy resin component may be polyurethane, silicone resin, acrylic resin, or epoxy resin, or a component that forms the polyurethane, silicone resin, acrylic resin, or epoxy resin after a curing reaction. There are no particular restrictions on the specific types of applicable curable resin components, and known polyurethane components, silicone resin components, acrylic resin components, or epoxy resin components that exhibit the molecular weight characteristics and / or hardness characteristics described above can be selected and used. By controlling the degree of crosslinking of such resin components, the hardness of the final cured product can also be controlled.

[0044] For example, if the curable resin component is a silicone resin component, the component may include, as an addition-curable silicone resin component, (1) a polyorganosiloxane containing two or more alkenyl groups in the molecule and (2) a polyorganosiloxane containing two or more silicon-bonded hydrogen atoms in the molecule. The compound can form a cured product by an addition reaction in the presence of a catalyst, such as a platinum catalyst.

[0045] The (1) polyorganosiloxane contains at least two alkenyl groups. Specific examples of alkenyl groups include vinyl, allyl, butenyl, pentenyl, hexenyl, or heptenyl groups, among which vinyl groups are commonly used, but the application is not limited to vinyl. In the (1) polyorganosiloxane, the bonding positions of the aforementioned alkenyl groups are not particularly limited. For example, the alkenyl groups may be bonded to the ends of the molecular chain and / or to the side chains of the molecular chain. Furthermore, in the polyorganosiloxane (1) mentioned above, the types of substituents that may be included in addition to the alkenyls mentioned above include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, or heptyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl or phenethyl groups; and halogen-substituted alkyl groups such as chloromethyl, 3-chloropropyl, or 3,3,3-trifluoropropyl groups. Of these, methyl or phenyl groups are usually used, but the invention is not limited to these.

[0046] The molecular structure of the polyorganosiloxane described in (1) above is not particularly limited and can be any shape, such as linear, branched, cyclic, networked, or linear with a partial branching structure. Typically, among the above molecular structures, those having a linear molecular structure are applied, but the invention is not limited to this.

[0047] More specific examples of the polyorganosiloxanes in (1) above include: dimethylsiloxane-methylvinylsiloxane copolymer with trimethylsiloxane groups sealed at both ends of the molecular chain, methylvinylpolysiloxane with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylpolysiloxane with dimethylvinylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane copolymer with dimethylvinylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer with dimethylvinylsiloxane groups sealed at both ends of the molecular chain, R 1 2SiO 2 / 2 Siloxane units and R 1 2R 2 SiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 2R 2 SiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 R 2 SiO 2 / 2 Siloxane units and R 1 SiO 3 / 2 Siloxane units or R represented by 2 SiO 3 / 2 Examples include, but are not limited to, polyorganosiloxane copolymers containing siloxane units represented by and mixtures of two or more of the above. 1R is a hydrocarbon group other than an alkenyl group, and specifically may be an alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group or heptyl group; an aryl group such as a phenyl group, tolyl group, xylyl group or naphthyl group; an aralkyl group such as a benzyl group or phenethyl group; or a halogen-substituted alkyl group such as a chloromethyl group, 3-chloropropyl group or 3,3,3-trifluoropropyl group. Also, as above, R 2 This is an alkenyl group, and specifically may be a vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group, or heptenyl group.

[0048] In the addition-curable silicone composition, (2) polyorganosiloxane can play a role in crosslinking the (1) polyorganosiloxane. In the (2) polyorganosiloxane, the bonding position of the hydrogen atoms is not particularly limited and may be, for example, bonded to the ends and / or side chains of the molecular chain. Furthermore, in the (2) polyorganosiloxane, the types of substituents that may be included in addition to the silicon-bonded hydrogen atoms are not particularly limited and include, for example, alkyl groups, aryl groups, aralkyl groups, or halogen-substituted alkyl groups, as mentioned in (1) polyorganosiloxane, of which methyl groups or phenyl groups are usually applied, but are not limited thereto.

[0049] The molecular structure of the polyorganosiloxane described in (2) above is not particularly limited and can be any shape, such as linear, branched, cyclic, networked, or linear with a portion of branching. Among the above molecular structures, those having a linear molecular structure are usually applied, but the invention is not limited thereto.

[0050] More specific examples of the polyorganosiloxanes in (2) above include methylhydrogenpolysiloxane with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylhydrogen copolymer with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylhydrogensiloxane-methylphenylsiloxane copolymer with trimethylsiloxane groups sealed at both ends of the molecular chain, dimethylpolysiloxane with dimethylhydrogensiloxane groups sealed at both ends of the molecular chain, dimethylsiloxane-methylphenylsiloxane copolymer with dimethylhydrogensiloxane groups sealed at both ends of the molecular chain, methylphenylpolysiloxane with dimethylhydrogensiloxane groups sealed at both ends of the molecular chain, R 1 3SiO 1 / 2 Siloxane units and R 1 2HSiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 2HSiO 1 / 2 Siloxane units and SiO 4 / 2 Polyorganosiloxane copolymer containing siloxane units represented by R 1 HSiO 2 / 2 Siloxane units and R 1 SiO 3 / 2 Siloxane units or HSiO represented by 3 / 2 Examples include, but are not limited to, polyorganosiloxane copolymers containing siloxane units represented by and mixtures of two or more of the above. 1 This group is a hydrocarbon group other than an alkenyl group, and specifically may be an alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group or heptyl group; an aryl group such as a phenyl group, tolyl group, xylyl group or naphthyl group; an aralkyl group such as a benzyl group or phenethyl group; or a halogen-substituted alkyl group such as a chloromethyl group, 3-chloropropyl group or 3,3,3-trifluoropropyl group.

[0051] The content of the polyorganosiloxane described in (2) above is not particularly limited, as long as it is included in an amount that allows for proper curing. For example, the polyorganosiloxane described in (2) above may be included in an amount such that there are 0.5 to 10 silicon-bonded hydrogen atoms for each alkenyl group contained in the polyorganosiloxane described in (1) above. Within this range, sufficient curing can be carried out and heat resistance can be ensured.

[0052] The aforementioned addition-curable silicone resin component may further contain platinum or a platinum compound as a catalyst for curing. There are no specific limitations on the type of platinum or platinum compound used. The proportion of the catalyst should also be adjusted to a level that allows for proper curing.

[0053] In other examples, the silicone resin component may include, for example, (a) an alkoxy group-containing siloxane polymer and (b) a hydroxyl group-containing siloxane polymer as a condensation-curable silicone resin component.

[0054] The siloxane polymer in (a) may be, for example, a compound represented by the following chemical formula 1.

[0055] [Chemical formula 1] R 1 a R 2 b SiO c (OR 3 ) d

[0056] In chemical formula 1, R 1 and R 2 Each independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, R 3 R represents an alkyl group. 1 , R 2 and R 3If there are multiple instances of each, they may be the same or different from each other. a and b each independently represent numbers greater than or equal to 0 and less than 1. a+b represents a number greater than 0 and less than 2. c represents a number greater than 0 and less than 2. d represents a number greater than 0 and less than 4. a+b+c×2+d is 4.

[0057] In the definition of Chemical Formula 1, the monovalent hydrocarbon group may be, for example, an alkyl group having 1 to 8 carbon atoms, a phenyl group, a benzyl group, or a tolyl group. In this case, the alkyl group having 1 to 8 carbon atoms may be a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, or an octyl group. Furthermore, in the definition of Chemical Formula 1, the monovalent hydrocarbon group may be substituted with known substituents such as a halogen, an amino group, a mercapto group, an isocyanate group, a glycidyl group, a glycidoxy group, or a ureido group.

[0058] In the definition of chemical formula 1, R 3 Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, or butyl groups. While methyl or ethyl groups are commonly used among alkyl groups, the application is not limited to these.

[0059] In the polymer of chemical formula 1, branched or tertiarily crosslinked siloxane polymers can be used. Furthermore, this (a) siloxane polymer may contain residual hydroxyl groups to the extent that it does not impair the purpose, specifically, to the extent that it does not inhibit the de-alcoholization reaction.

[0060] The (a) siloxane polymer can be produced, for example, by hydrolysis and condensation of a polyfunctional alkoxysilane or polyfunctional chlorosilane. An average technician in this field can easily select a suitable polyfunctional alkoxysilane or chlorosilane for the desired (a) siloxane polymer, and can also easily control the conditions of the hydrolysis and condensation reaction using it. In addition, when producing the (a) siloxane polymer, a suitable monofunctional alkoxysilane can also be used in combination, depending on the purpose.

[0061] As the siloxane polymer (a) mentioned above, commercially available organosiloxane polymers such as Shin-Etsu Silicone's X40-9220 or X40-9225, or GE Toray Silicone's XR31-B1410, XR31-B0270 or XR31-B2733 can be used.

[0062] As the (b) hydroxyl group-containing siloxane polymer contained in the condensation-curable silicone composition, for example, a compound represented by the following chemical formula 2 can be used.

[0063] [ka]

[0064] In chemical formula 2, R4 and R5 each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group. If there are multiple R4 and R5 groups, they may be the same or different from each other, and n represents an integer between 5 and 2,000.

[0065] In the definition of chemical formula 2, specific types of monovalent hydrocarbon groups include, for example, the same hydrocarbon groups as in the case of chemical formula 1.

[0066] The (b) siloxane polymer can be produced, for example, by hydrolysis and condensation of dialkoxysilane and / or dichlorosilane. An average technician in this field can easily select a suitable dialkoxysilane or dichlorosilane for the (b) siloxane polymer of interest, and can also easily control the conditions of the hydrolysis and condensation reaction using it. As the (b) siloxane polymer described above, commercially available bifunctional organosiloxane polymers such as GE Toray Silicone's XC96-723, YF-3800, and YF-3804 can be used.

[0067] The addition-curing or condensation-curing silicone compositions described above are just one example of the silicone resin components applicable in this application.

[0068] In other examples, if the curable resin component is a polyurethane component, the component may include at least a polyol and a polyisocyanate. The polyol is a compound containing at least two hydroxyl groups, and the polyisocyanate is a compound containing at least two isocyanate groups. Such compounds may each be monomolecular, oligomeric, or polymeric compounds.

[0069] There are no major restrictions on the types of polyols that can be applied; for example, known polyether polyols or polyester polyols can be used. As mentioned above, known polyether polyols include polyalkylene glycols such as polypropylene glycol or polyethylene glycol, where the alkylene glycol portion has 1-20, 1-16, 1-12, 1-8, or 1-4 carbon atoms, as well as ethylene oxide / propylene oxide copolymer polyols, PTME (poly(tetramethylene glycol)), PHMG (poly(hexamethylene ether glycol)), and others. As for polyester polyols, these are polyols synthesized from a dibasic acid and a glycol, and include polyester polyols containing the dibasic acid unit and the glycol unit, or polycaprolactone polyols (obtained from ring-opening polymerization of cyclic lactones). In addition to the polyols mentioned above, carbonate polyols, vegetable polyols such as castor oil, and hydrocarbon polyols such as HTPB (Hydroxyl-terminated polybutadiene) and HTPIB (Hydroxyl-terminated polyisobutylene) are also known.

[0070] In this application, an appropriate type can be selected and used from among the known polyols described above.

[0071] Furthermore, as the polyisocyanate, an appropriate type can be selected and used from among known aromatic or aliphatic polyisocyanate compounds.

[0072] The lower limit of the content of the curable resin component in the curable composition may be approximately 30% by weight, 35% by weight, 40% by weight, 45% by weight, 50% by weight, 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, or 80% by weight, based on the total weight of the curable composition, and the upper limit may be approximately 95% by weight, 90% by weight, 85% by weight, 80% by weight, 75% by weight, 70% by weight, 65% by weight, 60% by weight, or 55% by weight, but less than 100% by weight. The content may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above. The above-mentioned content is based on the total weight of the curable composition, except when the curable composition contains a filler and / or a solvent, in which case it is a percentage based on the total weight of the curable composition excluding the filler and / or solvent.

[0073] The curable composition may contain a so-called phase-change material (PCM) to ensure the latent heat properties described above. A phase-change material is, as is generally known, a substance that endothermic or exothermic during a phase transition process. The phase transition process is an isothermal process.

[0074] The phase transition of the aforementioned phase transition material, whether endothermic or exothermic, may be a phase transition from solid to solid, solid to liquid, solid to gas, or liquid to gas. The phase transition reactions described above (solid → solid, solid → liquid, solid → gas, liquid → gas) may also be endothermic reactions. From the viewpoint of efficiency, a substance that undergoes a phase transition from solid to liquid is advantageous, but such a substance becomes a liquid phase after the phase transition and is difficult to maintain within the cured body. However, the cured body of this application exhibits the weight change rate described above, and therefore, a substance that undergoes a phase transition from solid to liquid can be applied. Thus, the phase transition material applied in this application may be a substance in which a phase transition occurs between a solid phase and a liquid phase, and the phase transition reaction from the solid phase to the liquid phase may be an endothermic reaction.

[0075] The phase transition material to which this application applies may have a melting point within a predetermined range. For example, the lower limit of the melting point may be around 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, or 50°C, and the upper limit may be around 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, or 40°C. The melting point may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0076] To ensure appropriate temperature control characteristics, the lower limit of the content of the phase transition material having the melting point described above among the overall phase transition material contained in the curable composition of this application may be approximately 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, 90% by weight, or 95% by weight, and the upper limit may be approximately 100% by weight, 99% by weight, 98% by weight, 97% by weight, 96% by weight, or 95% by weight. The content may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0077] In other examples, the curable composition may also include only phase transition materials having a melting point within the specified range as the phase transition material.

[0078] As the phase transition material, one that exhibits a predetermined range of latent heat within a predetermined temperature range can be used.

[0079] For example, the lower limit of the latent heat exhibited by the phase transition material may be around 100 J / g, 110 J / g, 120 J / g, 130 J / g, 140 J / g, 150 J / g, 160 J / g, 170 J / g, or 180 J / g, and the upper limit may be around 400 J / g, 380 J / g, 360 J / g, 340 J / g, 320 J / g, 300 J / g, 280 J / g, 260 J / g, 240 J / g, 220 J / g, 200 J / g, 180 J / g, or 160 J / g. The latent heat may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0080] The lower limit of the temperature range (temperature interval) in which the phase transition material exhibits the latent heat may be approximately 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, or 50°C, and the upper limit may be approximately 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, 70°C, 65°C, 60°C, 55°C, 50°C, 45°C, or 40°C. The temperature range in which the latent heat exhibits may be above or below any one of the lower limits described above, below or below any one of the upper limits described above, or above or below any one of the lower limits described above and below or below any one of the upper limits described above.

[0081] To ensure appropriate temperature control characteristics, the lower limit of the content of the phase transition material having the latent heat characteristics described above among the overall phase transition material contained in the curable composition of this application may be approximately 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, 90% by weight, or 95% by weight, and the upper limit may be approximately 100% by weight, 99% by weight, 98% by weight, 97% by weight, 96% by weight, or 95% by weight. The content may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0082] In other examples, the curable composition may also include only the phase transition material having the latent heat properties described above as the phase transition material.

[0083] The desired hardened body can be formed by applying the phase transition material described above.

[0084] As the phase transition material, any known substance exhibiting the aforementioned properties can be used. Known phase transition materials include inorganic substances, organic substances, and eutectic substances. Among such substances, organic phase transition materials can be used as substances possessing the aforementioned latent heat properties.

[0085] Known organic phase transition materials include fatty acids and paraffins, and in this application, one or more of these materials can be used.

[0086] Examples of the aforementioned fatty acids include formic acid, n-octanoic acid, lauric acid, myristic acid, palmitic acid, or stearic acid.

[0087] In appropriate examples, paraffinic substances can be used as phase transition materials. Examples of paraffinic phase transition materials include n-heptadecane, n-octadecane, n-nonadecane, n-eicosane, n-henicosane, n-docosane, n-tricosane, n-pentacosane, and n-hexacosane. Paraffin C) n-heptacosane, n-octacosane, n-nonacosane, n-triacontane, n-hentriacontane, n-dotriacontane, n-triatriacontane, or other higher-order paraffins (Paraffin C) 16 ~C 18 , Paraffin C13 ~C 24 , RT 35 HC, Paraffin C 16 ~C 28 , Paraffin C 20 ~C 33 , Paraffin C 22 ~C 45 , Paraffin C 22 ~C 50 , Paraffin natural wax 811, Paraffin natural wax 106, etc.) are known.

[0088] In the present application, an appropriate type can be selected from the above-mentioned known paraffinic substances and used.

[0089] In order to achieve appropriate effects, in the present application, as the phase transition substance, paraffin having a melting point within the above-mentioned range and a carbon number within the range of 10 to 30 can be used. Such paraffin may be an alkane having the above carbon number.

[0090] In one example, as the paraffinic substance, one or more selected from the group consisting of n-nonadecane, n-docosane, n-eicosane, n-heneicosane, n-tricosane, n-tetracosane, n-pentacosane, n-hexacosane, n-heptacosane, lauric acid, and myristic acid can be used.

[0091] The proportion of the phase transition material in the curable composition, for example, the lower limit of the weight ratio with respect to 100 parts by weight of the curable resin component, may be around 20, 21, 22, 23, 24, or 25 parts by weight, and the upper limit may be around 75, 74, 73, 72, 71, 70, 69, 68, 67, 66, 65, 64, 63, 62, 61, or 60 parts by weight. The proportion may be greater than or equal to any one of the lower limits described above, less than or equal to any one of the upper limits described above, or greater than or equal to any one of the lower limits described above and less than or equal to any one of the upper limits described above.

[0092] Under these conditions, the desired temperature control performance can be ensured, and such performance can be stably maintained over the long term.

[0093] The curable composition may optionally include a filler, such as a thermally conductive filler, as an additional component. Such a filler can complement the low thermal conductivity of the phase transition material.

[0094] The applicable thermally conductive fillers are not particularly limited and include, but are not limited to, inorganic fillers such as aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium hydroxide (Ca(OH)2), boehmite (AlOOH), hydromagnesite, magnesia, alumina, aluminum nitride (AlN), boron nitride (BN), silicon nitride (Si3N4), silicon carbide (SiC), zinc oxide (ZnO), or beryllium oxide (BeO). One or more of the above fillers can be selected. When aiming to form a low-density cured body, fillers with a low specific gravity (e.g., aluminum hydroxide) can be selected from the above filler components.

[0095] As stated above, there are no special restrictions on the form of the filler; for example, spherical, needle-shaped, plate-shaped, or other amorphous fillers can be used.

[0096] In one example, the filler can be one with an average particle size in the range of 10 μm to 200 μm. The average particle size is the D50 particle size measured by the method described in the examples below. By applying a filler of such particle size, the desired effect can be secured more efficiently.

[0097] The particle size of the filler may be, in other examples, 15 μm or more, 20 μm or more, 25 μm or more, 30 μm or more, 35 μm or more, or 40 μm or more, or approximately 180 μm or less, 160 μm or less, 140 μm or less, 120 μm or less, 100 μm or less, 80 μm or less, 60 μm or less, or 50 μm or less.

[0098] The content of the thermally conductive filler in the curable composition is adjusted according to the purpose. For example, in the curable composition, the thermally conductive filler may be included in an amount of about 100 parts by weight or less per 100 parts by weight of the curable resin component. In other examples, the proportion may be 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, 45 parts by weight or less, or 40 parts by weight or less, or 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, or 40 parts by weight or more.

[0099] The curable composition may also optionally contain a hollow filler as a further component, from the viewpoint of reducing weight.

[0100] The application of the aforementioned hollow filler can contribute to weight reduction.

[0101] For example, the filler may have a D50 particle size (average particle size) in the range of 10 μm to 100 μm. In other examples, the D50 particle size may be 12 μm or more, 14 μm or more, 16 μm or more, 18 μm or more, 20 μm or more, 22 μm or more, 24 μm or more, 26 μm or more, 28 μm or more, 30 μm or more, 32 μm or more, 34 μm or more, 36 μm or more, 38 μm or more, 40 μm or more, 42 μm or more, 44 μm or more, 46 μm or more, 48 μm or more, 50 μm or more, 52 μm or more, 54 μm or more. It may be 56 μm or larger or 58 μm or larger, or 98 μm or smaller, 96 μm or smaller, 94 μm or smaller, 92 μm or smaller, 90 μm or smaller, 88 μm or smaller, 86 μm or smaller, 84 μm or smaller, 82 μm or smaller, 80 μm or smaller, 78 μm or smaller, 76 μm or smaller, 74 μm or smaller, 72 μm or smaller, 70 μm or smaller, 68 μm or smaller, 66 μm or smaller, 64 μm or smaller, 62 μm or smaller, or approximately 60 μm or smaller.

[0102] The hollow filler may have a density in the range of approximately 0.05 to 1 g / ml. In other examples, the density may be 0.01 g / ml or more, 0.15 g / ml or more, 0.2 g / ml or more, 0.25 g / ml or more, 0.3 g / ml or more, 0.35 g / ml or more, 0.4 g / ml or more, 0.45 g / ml or more, 0.5 g / ml or more, 0.55 g / ml or more, or 0.6 g / ml or more, or 0.95 g / ml or less, 0.9 g / ml or less, or 0.85 g / ml. / ml or less, 0.8g / ml or less, 0.75g / ml or less, 0.7g / ml or less, 0.65g / ml or less, 0.6g / ml or less, 0.55g / ml or less, 0.5g / ml or less, 0.4 It may be about 5 g / ml or less, 0.4 g / ml or less, 0.35 g / ml or less, 0.3 g / ml or less, 0.25 g / ml or less, 0.2 g / ml or less, or 0.15 g / ml or less.

[0103] As for the hollow filler, various types can be used without special limitations, as long as they have the aforementioned particle size and / or density and can be uniformly mixed with the curable polyorganosiloxane component.

[0104] For example, known organic fillers, inorganic fillers, or mixed inorganic fillers can be used as hollow fillers. Even when hollow fillers are applied, organic particles consisting of organic materials for the shell portion, inorganic particles consisting of inorganic materials, and / or mixed inorganic particles consisting of inorganic materials can be used. Examples of such particles include, but are not limited to, acrylic particles such as PMMA (poly(methyl methacrylate)), epoxy particles, nylon particles, styrene particles, and / or styrene / vinyl monomer copolymer particles, as well as inorganic particles such as silica particles, alumina particles, indium oxide particles, tin oxide particles, zirconium oxide particles, zinc oxide particles, and / or titania particles.

[0105] In one example, the hollow filler may be a particle whose shell portion is made of soda-lime material (soda-lime filler), a particle whose cell portion is made of soda-lime borosilicate material (soda-lime borosilicate filler), a cenosphere filler, or other silica particles.

[0106] When the aforementioned hollow filler is included, there are no special restrictions on its proportion, and it can be selected in an appropriate proportion within a range that allows for the desired weight reduction without impairing the physical properties of the cured body.

[0107] The curable composition may further contain other necessary components in addition to the above components. For example, the curable composition may further contain additional additives as needed, such as catalysts, pigments and dyes, dispersants, thixotropy-inducing agents, flame retardants, etc.

[0108] Such a curable composition may be a solvent-based composition, an aqueous composition, or a solvent-free composition, and preferably a solvent-free composition.

[0109] As described above, the curable composition may be a one-component composition or a two-component composition, and in some cases, it may be the main component or curing agent component of a two-component composition, or a mixture of the main component and the curing agent component.

[0110] Furthermore, when the curable composition is a two-component composition, there are no special restrictions on the proportion of other components in the main agent and curing agent parts besides the curable resin component. For example, the phase transition material and / or filler may be included entirely in the main agent or curing agent part, or they may be included separately in the main agent and curing agent parts.

[0111] The curable composition of this application is suitable for a variety of applications, and is particularly suitable for use in heat-generating products, where it can be used as a material to control the heat of such products.

[0112] In one example, a method for producing the curable composition can be selected to satisfy the aforementioned latent heat properties, weight change rate, density, and / or hardness properties.

[0113] For example, the curable composition can be manufactured by mixing the phase transition material with a curable resin component while the phase transition material is molten. Through such steps, the desired curable composition can be provided more effectively.

[0114] Therefore, the method for producing the curable composition may include a step of mixing the molten phase transition material with the curable resin component, or more specifically, a step of melting the phase transition material and a step of mixing the molten phase transition material with the curable resin component.

[0115] The method for melting the phase transition material described above is not particularly limited; for example, the phase transition material can be maintained and melted at a temperature above its melting point.

[0116] In one example, the maintenance temperature of the phase transition material may be 10°C to 100°C or more higher than the melting point of the phase transition material. In other examples, the temperature may be 15°C or more, 20°C or more, 25°C or more or 30°C or more higher than the melting point of the phase transition material, and / or 95°C or less, 90°C or less, 85°C or less, 80°C or less, 75°C or less, 70°C or less, 65°C or less, 60°C or less, 55°C or less, 50°C or less, 45°C or less, 40°C or less, 35°C or less or 30°C or less lower than the melting point of the phase transition material.

[0117] By mixing a phase transition material melted within this temperature range with a curable resin component to produce a curable composition, a curable composition with the desired properties can be efficiently manufactured. The temperature at which the melted phase transition material and the curable resin component are mixed may be within the same temperature range as the temperature at which the phase transition material was melted, or it may be a lower temperature.

[0118] In one example, the mixing can be carried out at a temperature 10°C to 100°C or more above the melting point of the phase transition material. In other examples, the temperature may be 15°C or more, 20°C or more, 25°C or more or 30°C or more above the melting point of the phase transition material, or 95°C or less, 90°C or less, 85°C or less, 80°C or less, 75°C or less, 70°C or less, 65°C or less, 60°C or less, 55°C or less, 50°C or less, 45°C or less, 40°C or less, 35°C or less or 30°C or less below the melting point of the phase transition material.

[0119] This application also relates to a cured body of the curable composition described above. There are no limitations on the method of curing the curable composition to obtain a cured body, and an appropriate curing method may be applied depending on the type of curable composition. For example, in the case of an energy ray curing type, a method of irradiating the composition with energy rays such as ultraviolet light may be used; in the case of a moisture curing type, a method of maintaining the composition under appropriate humidity may be used; in the case of a thermosetting type, a method of applying appropriate heat to the composition may be used; in the case of a room temperature curing type, a method of maintaining the composition at room temperature may be used; and in the case of a hybrid curing type, a method of applying two or more curing methods may be used. As described above, in appropriate examples, the curable composition may be a room temperature curing type.

[0120] This application also relates to products comprising the composition or its cured form. The curable composition or its cured form can be usefully applied as a material for controlling the heat of heat-generating components, heating elements, or heat-generating products. Accordingly, the products may include heat-generating components, heating elements, or heat-generating products. The term heat-generating components, elements, or products means components, elements, or products that generate heat during use, and their type is not particularly limited. Typical heat-generating components, elements, or products include a variety of electrical / electronic products, such as battery cells, battery modules, or battery packs.

[0121] The product of this application may include, for example, the heat-generating component, element, or product, and the curable composition (or the two-component composition) or its cured form located adjacent to the heat-generating component, etc. In such a case, as described above, the heat-generating component, element, or product may be a component, element, or product whose appropriate operating temperature is in the range of approximately 15°C to 60°C. That is, the curable composition of this application is placed adjacent to the heat-generating component, element, or product and is useful for uniformly maintaining the operating temperature of the product within the aforementioned range.

[0122] The specific method of constructing the product of this application is not particularly limited, and the product can be constructed in various known ways when the curable composition or two-component composition or its cured form is applied to a heat dissipation material.

[0123] In one example, the curable composition can be used as a potting material when constructing a battery module or battery pack. The potting material may be a material that covers and is in contact with at least some or all of the unit battery cells within the battery module or battery pack. When applied to the potting material, the curable composition or its cured form can control the heat generated from the battery cells of the battery module or pack, prevent chain ignition or explosion, and maintain a uniform operating temperature of the module, pack, or battery cells. The present application also provides a curable composition that, before curing, has appropriately controlled viscosity and thixotropy, exhibits excellent potting efficiency, and forms a stable potting structure after curing without the generation of unwanted bubbles. The present application also provides a curable composition that exhibits low density after curing, enabling the provision of battery modules or packs that are lightweight relative to their volume but have high output. The present application also provides a curable composition that exhibits excellent required physical properties, including insulation.

[0124] In such cases, as a battery-related technology, the curable composition can be applied as a heat dissipation material for battery modules or battery packs, or as a heat dissipation material for vehicle OBCs (On-Board Chargers). Therefore, this application may also relate to a battery module, battery pack, or on-board charger (OBC) that includes the curable composition or its cured form as a heat dissipation material. The application location and method of the curable composition or cured form in the battery module, battery pack, or on-board charger are not particularly limited, and known methods can be applied. Furthermore, the curable composition of this application is not limited to the above-mentioned uses and can be effectively applied to various applications requiring excellent heat dissipation characteristics, storage stability, and adhesive strength.

[0125] In another example relating to this application, this application may relate to electronic equipment or apparatus having a cured body of the curable composition.

[0126] The types of electronic equipment or devices are not particularly limited and may include, for example, vehicle AVN (audio video navigation), OBC (On Board Charger) modules for electric vehicles, LED modules or IC chips and computers or mobile devices containing them.

[0127] The cured body of the curable composition can dissipate heat within the equipment or device, and can provide durability against impact, insulation, and the like.

[0128] The curable composition can be used, in one example, as a battery potting material.

[0129] This application also relates to a battery module to which the potting material is applied. Such a battery module is lighter than those of the same volume and can exhibit high output, and the heat generated from the battery cells and the like is properly controlled, so problems such as chain ignition do not occur.

[0130] In one example, the battery module may include a substrate, a plurality of battery cells arranged on the substrate, and the curable composition or its cured product covering at least a portion or all of the plurality of battery cells.

[0131] In the above structure, the curable composition or its cured product (potting material) may, in one example, cover the battery cells while in contact with the front surfaces of the plurality of battery cells (excluding the surfaces of the battery cells that are in contact with the substrate side) (structure in Figure 1), or it may be in contact only with the upper parts of the plurality of battery cells (structure in Figure 2).

[0132] Figures 1 and 2 are schematic diagrams of the structure of the battery module described above, and show a structure that includes a substrate 10, battery cells 20, and the potting material 30 (the curable composition or its cured product). The battery module may further include an adhesive material 40 for fixing the battery cells 20 to the substrate 10, and in one example, the adhesive material 40 may be configured to have thermal conductivity.

[0133] As long as the curable composition or its cured product is applied to the potting material, the specific components of the battery module, such as the battery cells, substrates, and / or adhesive materials, are not particularly limited, and known materials can be used.

[0134] For example, known pouch-type, rectangular, or cylindrical battery cells can be used as the battery cells, and known materials can also be used as the substrate and adhesive material.

[0135] The method for manufacturing the battery module is not particularly limited, and for example, it can be formed by pouring the curable composition onto a plurality of battery cells formed on a substrate and curing it as needed.

[0136] The curable composition of this application has appropriate viscosity and thixotropy, so it can efficiently fill the spaces between very closely spaced battery cells, and after forming the potting material, it can exhibit the desired thermal insulation and heat shielding properties.

[0137] For example, products such as the battery module or battery pack can be manufactured by a method that includes the steps of: maintaining the curable composition at an appropriate temperature and melting it; and applying the curable composition melted in the first step to a heat-generating component.

[0138] As described above, the temperature at the stage of melting the curable composition can be determined by the specific application. For example, when the heat-generating product is the aforementioned battery cell, battery module, or battery pack, the lower limit of the temperature at the melting stage may be around 40°C or 50°C, and the upper limit may be around 80°C or 70°C. The temperature may be above or below any one of the lower limits described above, below or below any one of the upper limits described above, or above or below any one of the lower limits described above and below or below any one of the upper limits described above. If the temperature is too low, the fluidity of the curable composition will be poor and the curing rate of the curable composition after melting will be too fast, making application difficult. If the temperature is too high, damage may occur to the heat-generating product, or a phase transition material with relatively low density may migrate to the surface within the curable composition, resulting in the formation of a non-uniform cured body.

[0139] There are no particular limitations on the method of applying the molten curable composition to the heat-generating component, and the curable composition can be applied through known potting processes or other processes.

[0140] Furthermore, if necessary, a step of curing the curable composition may be performed after the application, in which case an appropriate curing method can be selected depending on the type of curable composition. [Effects of the Invention]

[0141] This application can provide a curable composition and its applications. The curable composition of this application can be applied to products that generate heat during the driving or maintenance process and can be used as a material capable of handling said heat. The curable composition of this application can be applied to products in which multiple heat-generating elements are integrated and can efficiently handle the heat generated from the elements while maintaining a uniform temperature of the product. Furthermore, the curable composition of this application can be applied to such products and can prevent or minimize the impact of abnormal heat generation, explosion, or ignition on other adjacent elements even if abnormal heat generation, explosion, or ignition occurs in one of the multiple elements. The curable composition of this application can also perform the above functions stably over a long period of time. This application can also provide a cured body formed by the above curable composition or applications of the curable composition or the cured body. [Brief explanation of the drawing]

[0142] [Figure 1] Figure 1 is a schematic diagram of an exemplary battery module of this application. [Figure 2] Figure 2 is a schematic diagram of an exemplary battery module of this application. [Figure 3] Figure 3 shows the DSC analysis results for the cured products of Examples 1 to 3, respectively. [Modes for carrying out the invention]

[0143] The present application will be described in detail below based on the following examples, but the scope of this application is not limited by the following examples.

[0144] 1. Latent heat measurement The latent heat was evaluated using the following method: Approximately 3-5 mg of sample was loaded into a DSC (Differential Scanning Calorimeter) equipped with a Q200 model from TA Instrument Co., Ltd. The temperature range for latent heat evaluation of the equipment was set from -20°C to 200°C. The endothermic section was measured while the temperature was increased at a rate of approximately 10°C / min, and the latent heat (unit: J / g) was calculated by integrating the endothermic peak observed in the endothermic section. The temperature at the inflection point of the left onset of the endothermic peak was defined as the latent heat section start temperature (onset temperature), and the temperature at the inflection point of the right onset was defined as the latent heat section end temperature (offset temperature). The width of the latent heat section was the offset temperature minus the onset temperature. When measuring the latent heat of the phase transition material, the phase transition material was used as the sample. When measuring the latent heat of the cured body, the sample was prepared by curing a curable composition. Specifically, the main component and curing agent component of the curable composition were mixed in a 1:1 volume ratio to prepare a mixture. This mixture was left in an 80°C chamber for about one hour, then applied to an aluminum dish to a thickness of about 10 mm using an injector, and maintained at room temperature (about 25°C) for 24 hours to produce a cured body.

[0145] 2. Evaluation of melting point The melting point of the phase transition material was evaluated using the following method: Approximately 3 mg to 5 mg of the phase transition material was loaded into a Differential Scanning Calorimeter (DSC) equipped with a Q200 model from TA Instrument Co., Ltd. The temperature range of the equipment was set to -20°C to 200°C, and the temperature was increased at a rate of approximately 10°C / min while observing the endothermic peak. The temperature at the peak of the endothermic peak was designated as the melting point of the phase transition material.

[0146] 3. Weight change △W The main component part and the curing agent part of the curable composition were mixed at a volume ratio of 1:1 to produce a mixture. The mixture was maintained in a chamber at 80 °C for about 1 hour, and then applied with an injector to an aluminum dish to a thickness of about 10 mm. The applied mixture was cured by maintaining it at room temperature (about 25 °C) for 24 hours to produce a cured body. The cured body was cut into squares with a horizontal and vertical length of 1 cm each to produce test pieces (weight: W i , unit: g). The test pieces were placed on filter paper and maintained in a chamber at about 80 °C for about 24 hours, and then taken out. Furthermore, the weight of the test pieces (weight: W f , unit: g) was measured. The weight measured in the above process was substituted into the following formula A to measure the weight change rate △W. The weight change rates were measured for 4 test pieces formed of the same curable composition, and the average values are shown in Tables 1 and 2 below. [Formula A] △W = 100×(W f - W i ) / W i

[0147] 4. Temperature control performance test The main component part and the curing agent part of the curable composition were mixed at a volume ratio of 1:1 to produce a mixture. The mixture was maintained in a chamber at 80 °C for about 1 hour, and then applied with an injector to an aluminum dish to a thickness of about 10 mm. The applied mixture was cured while being maintained at room temperature (about 25 °C) for 24 hours to produce a cured body. Next, the cured body was cut into a square with a horizontal and vertical length of 3 cm each to produce test pieces. A K-type thermocouple was attached to a hot plate, and the test piece was closely adhered thereto and fixed with tape. Next, the temperature of the hot plate was raised from room temperature to about 35 °C at the same heating rate over about 2 minutes, maintained at 35 °C for about 10 minutes, and then the temperature was raised to 73 °C at the same heating rate over about 10 minutes. After maintaining the temperature of 73 °C for about 22 minutes, the temperature was measured with the K-type thermocouple.

[0148] 5. Measurement of hardness A mixture was prepared by mixing the main component and hardener component of a curable composition in a 1:1 volume ratio. The mixture was maintained in an 80°C chamber for about 1 hour and then applied to an aluminum dish to a thickness of about 10 mm using an injector. The applied mixture was allowed to cure at room temperature (about 25°C) for 24 hours to produce a cured body. The hardness of the cured body was measured according to the ASTM D2240 standard. An ASKER Durometer was used for hardness measurement. An initial hardness was measured by applying a load of about 1.5 kg to the surface of a flat sample, and the hardness was evaluated by confirming the stabilized measurement value after 15 seconds. Shore A or Shore 00 hardness was measured.

[0149] 6. Measurement of Density The density of the cured material was confirmed using a gas pyrometer (model name: BELPYCNO, manufacturer: MicrotracBEL) according to the ASTM D792 standard. The density can be measured at room temperature by injecting helium gas using the aforementioned equipment. The cured material was manufactured by mixing the main component and hardener parts produced in the example or comparative example in a 1:1 volume ratio and maintaining the mixture in an 80°C chamber for about 1 hour. Then, the mixture was applied to an aluminum dish to a thickness of about 10 mm using an injector, and cured at room temperature (about 25°C) for about 24 hours.

[0150] 7.GPC(Gel Permeation Chromatograph) The molecular weight characteristics were measured using GPC (Gel permeation chromatography). The material to be analyzed was placed in a 5 mL vial and diluted with toluene to a concentration of approximately 5 mg / mL. Then, both the calibration standard sample and the material to be analyzed were filtered through a syringe filter (pore size: 0.45 μm) and then measured. The analysis program used ChemStation from Agilent technologies, and the weight average molecular weight (Mw) or number average molecular weight (Mn) was determined by comparing the elution time of the sample with the calibration curve. The measurement conditions for GPC are as follows. <GPC measurement conditions> Equipment: 1200 series from Agilent technologies Columns: Two PLgel mixed B columns from Polymer laboratories were used Solvent: Toluene Column temperature: 40 °C Sample concentration: 5 mg / mL, 10 μL injection Standard sample: Polystyrene (Mp: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485)

[0151] 8. Particle size analysis of the filler The particle size of the filler was measured in accordance with ISO - 13320 using the MASTERSIZER 3000 equipment from Marven. Ethanol was used as the solvent during the measurement. As the particle size of the filler, the D50 particle size was measured and taken as the average particle size. The D50 particle size is the particle diameter (median diameter) at the 50% volume - based cumulative of the particle size distribution. The particle size distribution is determined based on volume, and it is the particle diameter at the point where the cumulative fraction becomes 50% on the cumulative curve with the total volume as 100%.

[0152] Example 1. Manufacturing of main component parts The main component of the curable composition was manufactured using a silicone resin component (SL3000, manufactured by KCC) as the curable resin component. The main component was manufactured by mixing the main component of the silicone resin component (SL3000A) with n-docosane (sigma Aldrich), which has a melting point of approximately 44°C, as the phase transition material. The weight-average molecular weight (Mw) of the main component (SL3000A) was approximately 28,000 g / mol. The phase transition material showed a latent heat of approximately 180 J / g in the temperature range of 20°C to 60°C as determined by DSC analysis. During the mixing process, approximately 25 parts by weight of the phase transition material were mixed with 100 parts by weight of the main component (SL3000A). During the manufacturing of the main component, the phase transition material was first uniformly stirred (300 rpm) at approximately 60°C for 1 hour to melt it. The other components of the main component were then mixed with the molten phase transition material and stirred further at 500 rpm for 2 hours. The mixing of the phase transition material and the other components of the main component was performed at a temperature of approximately 60°C. Subsequently, the main component was manufactured by degassing the mixture by stirring at 50 rpm for 20 minutes under a vacuum atmosphere.

[0153] Manufacturing of hardening agent parts A curing agent part was manufactured by mixing the curing agent (SL3000B) of the silicone resin component (SL3000, manufactured by KCC) of the main component part with a phase transition material. The same phase transition material used in the manufacture of the main component part was used. The weight-average molecular weight (Mw) of the curing agent (SL3000B) was approximately 28,000 g / mol. During the mixing process, approximately 25 parts by weight of the phase transition material were mixed with 100 parts by weight of the curing agent (SL3000B). In the manufacture of the curing agent part, the phase transition material was first melted by uniform stirring (300 rpm) at a temperature of approximately 60°C for 1 hour. The other components of the curing agent part were then mixed with the molten phase transition material and stirred further at 500 rpm for 2 hours. The mixing of the phase transition material and the other components of the curing agent part was performed at a temperature of approximately 60°C. Subsequently, the main component part was manufactured by degassing by stirring at 50 rpm for 20 minutes in a vacuum atmosphere.

[0154] curable composition The main component and curing agent parts were prepared in a volume ratio of 1:1 to produce a curable composition. The curable composition is a room-temperature curing type, and can be cured by maintaining it at room temperature for approximately 12 hours or more. Figure 3 shows the results of DSC analysis performed on the cured body.

[0155] Example 2. Manufacturing of main component parts A polyurethane component (Circalok 6410, manufactured by Lord) was used as the curable resin component. The main component of the polyurethane (Circalok 6410 A, manufactured by Lord) and a phase transition material were mixed to manufacture the main component part. As the phase transition material, n-docosane (Sigma Aldrich), which was used in Example 1, and n-pentacosane (C25, Sigma Aldrich), which has a melting point of approximately 53°C, were used. The paraffin (n-pentacosane (C25)) with a melting point of approximately 53°C showed a latent heat of approximately 175 J / g in the temperature range of 30°C to 70°C in DSC analysis. During the mixing, the mixing ratio of the main component and paraffin was 100:35:15 (Circalok 6410 A:n-docosane:n-pentacosane).

[0156] Manufacturing of hardening agent parts A curing agent (Circalok 6410 B) and a phase transition material were mixed to manufacture a curing agent part using a polyurethane component (Circalok 6410, manufactured by Lord). The same phase transition material used in the manufacture of the main component part was used. The mixing ratio was 100:35:15 (Circalok 6410 B:n-docosane:n-pentacosane).

[0157] curable composition The main component and curing agent parts were prepared in a volume ratio of 1:1 to produce a curable composition. The curable composition is a room-temperature curing type, and can be cured by maintaining it at room temperature for approximately 12 hours or more. Figure 3 shows the results of DSC analysis performed on the cured body.

[0158] Example 3. A curable composition was manufactured in the same manner as in Example 1, except that aluminum hydroxide (ATH) (D50 particle size: approximately 50 μm, manufactured by Sigma Aldrich) was further added during the manufacturing of the main component and the hardener component. During the manufacturing of the main component, the weight ratio of the main component (SL3000A), n-docosane (n-docosane, Sigma Aldrich), and the aluminum hydroxide was 100:60:40 (main component:n-docosane:ATH), and during the manufacturing of the hardener component, the weight ratio of the hardener, phase transition material, and the aluminum hydroxide was 100:60:40 (hardener:n-docosane:aluminum hydroxide). Figure 3 shows the results of DSC analysis performed on the cured product.

[0159] Comparative Example 1. Except for not incorporating a phase transition material, the main component, curing agent parts, and curable composition were manufactured in the same manner as in Example 1.

[0160] Comparative Example 2. Except for the fact that the weight ratio of the main component (SL3000A) and the phase transition material was set to 100:80 (main component: n-docosane) during the production of the main component part, and the weight ratio of the curing agent and the phase transition material was set to 100:80 (curing agent: n-docosane) during the production of the curing agent part, the main component and curing agent parts and the curable composition were manufactured in the same manner as in Example 1.

[0161] Comparative Example 3. Except for the fact that the weight ratio of the main component (SL3000A) to the phase transition material was set to 100:17 (main component: n-docosane) during the production of the main component part, and the weight ratio of the curing agent to the phase transition material was set to 100:17 (curing agent: n-docosane) during the production of the curing agent part, the main component and curing agent parts and the curable composition were manufactured in the same manner as in Example 1.

[0162] Comparative Example 4. Manufacturing of main component parts The main component of the curable composition was prepared by mixing a silicone resin component (VP100, manufactured by DAMI POLYCHEM), the same phase transition material (n-docosane) and catalyst (CP101, manufactured by DAMI POLYCHEM) used in Example 1. The weight-average molecular weight (Mw) of the resin component (VP100) was approximately 6,000 g / mol. The mixing ratio was 100:0.5:25 (VP100:CP101:n-docosane). The mixing method was the same as in Example 1.

[0163] Manufacturing of hardening agent parts A curing agent part was manufactured using a silicone resin component (VP100, manufactured by DAMI POLYCHEM), a curing agent (FD5020, manufactured by DAMI POLYCHEM), and the same phase transition material as in Example 1. The weight-average molecular weight (Mw) of the silicone resin component (VP100) was approximately 6,000 g / mol. The mixture was in a weight ratio of 100:3:25 (VP100:FD5020:n-docosane). The mixing method was the same as in Example 1.

[0164] curable composition The main component and curing agent parts were prepared in a volume ratio of 1:1 to produce a curable composition. The curable composition is a room-temperature curing type and can be cured by maintaining it at room temperature for about 24 hours or more.

[0165] Comparative Example 5. Manufacturing of main component parts The main component of the curable composition was prepared by mixing a silicone resin component (VP1000, manufactured by DAMI POLYCHEM), the same phase transition material (n-docosane) and catalyst (CP101, manufactured by DAMI POLYCHEM) used in Example 1. The weight-average molecular weight (Mw) of the resin component (VP1000) was approximately 28,000 g / mol. The mixing ratio was 100:0.5:25 (VP1000:CP101:n-docosane). The mixing method was the same as in Example 1.

[0166] Manufacturing of hardening agent parts A curing agent part was manufactured using a silicone resin component (VP1000, manufactured by DAMI POLYCHEM), a curing agent (FD5020, manufactured by DAMI POLYCHEM), and the same phase transition material as in Example 1. The weight-average molecular weight (Mw) of the silicone resin component (VP1000) was approximately 28,000 g / mol. The mixing ratio was 100:0.5:25 (VP100:FD5020:n-docosane). The mixing method was the same as in Example 1.

[0167] curable composition The main component and curing agent parts were prepared in a volume ratio of 1:1 to produce a curable composition. The curable composition is a room-temperature curing type and can be cured by maintaining it at room temperature for about 24 hours or more.

[0168] Comparative Example 6. The main component part, the hardener part, and the curable composition were manufactured in the same manner as in Example 1, except that docosan-1-ol (melting point approximately 72.5°C) was used as the phase transition material instead of n-docosane during the manufacturing of the main component part and the hardener part.

[0169] Comparative Example 7. The main component part, the hardener part, and the curable composition were manufactured in the same manner as in Example 1, except that hexadecane (melting point approximately 18°C) was used as the phase transition material instead of n-docosane during the manufacturing of the main component part and the hardener part. The evaluation results for the above examples and comparative examples are summarized in Tables 1 to 3 below. In the case of Comparative Example 7, the curing of the curable composition did not proceed efficiently, so no cured body was formed, and as a result, hardness, weight change, and temperature control performance could not be confirmed.

[0170] [Table 1]

[0171] Table 2

[0172] Table 3

Claims

1. It contains a curable resin component and a phase transition material, A cured body exhibiting a latent heat in the range of 20 J / g to 200 J / g is formed. The curable resin component is either a polyurethane resin component or a silicone resin component. The phase transition material includes an unencapsulated phase transition material. The phase transition material includes paraffins with a melting point in the range of 40°C to 55°C and a carbon number in the range of 10 to 30. When the curable resin component is a silicone resin component, the cured body has a Shore A hardness of 30 or higher, and when the curable resin component is a polyurethane resin component, the cured body has a Shore OO hardness of 40 or higher. The onset temperature of the latent heat is in the range of 10°C to 60°C. A curable composition in which the absolute value of ΔW in the following formula 1 is 10% or less: [Formula 1] △W=100×(W ｆ -W ｉ ) / W ｉ In formula 1, W ｆ W is the weight of the hardened body measured after maintaining the hardened body at 80°C for 24 hours. ｉ This is the weight of the hardened body before it is maintained at 80°C for 24 hours.

2. The curable composition according to claim 1, wherein the latent heat interval is in the range of 15°C to 40°C.

3. The hardened material has a density of 0.5 g / cm³. ３ ~2g / cm³ ３ A curable composition according to claim 1, which is within the range.

4. The curable composition according to claim 1, wherein the silicone resin component has a weight-average molecular weight of 9000 g / mol or more.

5. The curable composition according to claim 1, comprising only a phase transition material having a melting point in the range of 40°C to 55°C as the phase transition material.

6. The curable composition according to claim 1, comprising one or more selected from the group consisting of n-nonadecane, n-docosane, n-eicosane, n-heneicosane, n-tricosane, n-tetracosane, n-pentacosane, n-hexacosane, and n-heptacosane as a phase transition material.

7. The curable composition according to claim 1, comprising 20 to 75 parts by weight of a phase transition substance per 100 parts by weight of a curable resin component.

8. Aluminum hydroxide (Al(OH) ３ ), magnesium hydroxide (Mg(OH) ２ ), calcium hydroxide (Ca(OH) ２ ), boehmite (AlOOH), hydrotalcite, magnesia, alumina, aluminum nitride (AlN, aluminum nitride), boron nitride (BN, boron nitride), silicon nitride (Si ３ N ４ , silicon nitride), silicon carbide (SiC), zinc oxide (ZnO) and beryllium oxide (BeO), the curable composition according to claim 1, further comprising one or more selected from the group consisting of

9. A method for producing a curable composition according to any one of claims 1 to 8, comprising the step of mixing a molten phase transition material with a curable resin component.

10. A cured body of a curable composition according to any one of claims 1 to 8.

11. A product comprising a heat-generating component and a curable composition according to claim 1, which is adjacent to the heat-generating component.

12. A product comprising a heat-generating component and a cured body according to claim 10, which is adjacent to the heat-generating component.

13. A method for manufacturing a product equipped with a heat-generating component, comprising the steps of: maintaining and melting a curable composition according to any one of claims 1 to 8 at a temperature in the range of 40°C to 80°C; and applying the molten curable composition to a heat-generating component.

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