Sealant for dimming elements, use of curable resin composition as a sealant for dimming elements, dimming elements, and laminated glass

Abstract

The present invention aims to provide a sealant for dimming elements that has excellent sealing performance for dimming elements having dimming materials even in high-temperature environments. The present invention also aims to provide a method for using a curable resin composition as a sealant for dimming elements, and a dimming element and laminated glass containing a cured product of the sealant for dimming elements. The present invention relates to a sealant for a dimming element used to seal a dimming element having a dimming material, comprising a curable resin and a radical polymerization initiator, wherein the curable resin comprises a (meth)acrylic compound, the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the sealant for the dimming element at 25°C is 2.0 GPa or more.

Description

Technical Field

[0001] The present invention relates to a sealant for a dimming element. The present invention also relates to a method of using a curable resin composition as the sealant for the dimming element, and to a dimming element and a laminated glass including a cured product of the sealant for the dimming element.

Background Art

[0002] Dimming elements that change the light transmittance by applying a voltage are used in a wide range of applications. For example, in buildings, automobiles, etc., laminated glass including a dimming element is used. In such laminated glass, a dimming element in which a dimming material is sandwiched between films with transparent electrodes is sandwiched between an intermediate film and a pair of glasses. In addition, in a dimming element, a sealant is usually used to protect the dimming material from moisture, contaminants, etc. For example, Patent Document 1 discloses that a seal portion using a curable resin is provided by coating formation at the peripheral edge of a dimming film in order to protect a liquid crystal layer from moisture, acid, ultraviolet rays, etc. Patent Document 2 also discloses a method of sealing an element by melt-bonding a barrier material made of PET or the like to at least some of the layers of a laminate of functional elements.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In laminated glass and the like, when a dimming element is sandwiched between interlayers, the dimming function at the ends of the dimming element sometimes deteriorates. Therefore, laminated glass with dimming elements is designed to include a sealant-filled area between the dimming element and the interlayer. On the other hand, in recent years, devices using dimming elements have increasingly been required to be reliable in high-temperature environments, but conventional sealants have had difficulty providing sufficient sealing performance in high-temperature environments. Furthermore, in sealing methods such as those disclosed in Patent Document 2, there was a risk that the upper and lower substrates would melt during heating. The present invention aims to provide a sealant for dimming elements that has excellent sealing performance for dimming elements having dimming materials even in high-temperature environments. The present invention also relates to a method of using a curable resin composition as a sealant for dimming elements, and to a dimming element and laminated glass containing a cured product of the sealant for dimming elements. [Means for solving the problem]

[0005] Disclosure 1 is a sealant for a dimming element used to seal a dimming element having a dimming material, comprising a curable resin and a radical polymerization initiator, wherein the curable resin comprises a (meth)acrylic compound, the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the sealant for the dimming element at 25°C is 2.0 GPa or more. Disclosure 2 is the sealant for a dimming element of Disclosure 1, wherein the storage modulus of the cured product of the sealant for a dimming element is 3.3 GPa or less at 25°C. Disclosure 3 relates to a sealant for a dimming element used to seal a dimming element having a dimming material, comprising a curable resin and a radical polymerization initiator, wherein the curable resin comprises a (meth)acrylic compound, the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the sealant for the dimming element at 110°C is 0.04 GPa or more. Disclosure 4 is the sealant for a dimming element of Disclosure 3, wherein the storage modulus of the cured product of the sealant for the dimming element is 1.40 GPa or less at 110°C. Disclosure 5 relates to a sealant for a dimming element used to seal a dimming element having a dimming material, comprising a curable resin and a radical polymerization initiator, wherein the curable resin comprises a (meth)acrylic compound, the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the glass transition temperature of the cured product of the sealant for the dimming element is 65°C or more. Disclosure 6 is the sealant for dimming elements of Disclosure 5, wherein the glass transition temperature of the cured product of the sealant for dimming elements is 80°C or higher. Disclosure 7 is the sealant for dimming elements of Disclosure 6, wherein the glass transition temperature of the cured product of the sealant for dimming elements is 110°C or higher. Disclosure 8 is a sealant for a dimming element according to Disclosure 5, 6, or 7, wherein the glass transition temperature of the cured product of the sealant for the dimming element is 120°C or lower. Disclosure 9 is a sealant for a dimming element according to Disclosure 1, 2, 3, 4, 5, 6, 7, or 8, wherein the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 8.0 degrees or more. Disclosure 10 is a sealant for dimming elements of Disclosure 1, 2, 3, 4, 5, 6, 7, 8, or 9, wherein the (meth)acrylic compound is a compound having two or more (meth)acryloyl groups in one molecule. Disclosure 11 is a sealant for dimming elements of Disclosure 10, in which the compound having two or more (meth)acryloyl groups in one molecule comprises epoxy (meth)acrylate. Disclosure 12 is a sealant for dimming elements according to Disclosure 10 or 11, comprising a compound having two or more (meth)acryloyl groups in one molecule, and a (meth)acrylic compound having one or more aromatic rings in one molecule. Disclosure 13 states that the dimming material is a solid dimming material, which is a sealant for a dimming element according to Disclosures 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12. Disclosure 14 is a sealant for a dimming element of Disclosure 13, wherein the solid dimming material is a PDLC. Disclosure 15 is a sealant for dimming elements of Disclosure 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 or 14, which is used to seal dimming elements that are arranged around a resin composition containing a plasticizer. Disclosure 16 relates to a curable resin composition comprising a curable resin and a radical polymerization initiator, wherein the curable resin comprises a (meth)acrylic compound, the contact angle between the cured product of the curable resin composition and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the curable resin composition at 25°C is 2.0 GPa or more, and the curable resin composition is to be used as a sealant for a dimming element. Disclosure 17 relates to a curable resin composition comprising a curable resin and a radical polymerization initiator, wherein the curable resin comprises a (meth)acrylic compound, the contact angle between the cured product of the curable resin composition and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the curable resin composition at 110°C is 0.04 GPa or more, and the curable resin composition is to be used as a sealant for a dimming element. Disclosure 18 relates to a curable resin composition comprising a curable resin and a radical polymerization initiator, wherein the curable resin comprises a (meth)acrylic compound, the contact angle between the cured product of the curable resin composition and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the glass transition temperature of the cured product of the curable resin composition is 65°C or more, and the curable resin composition is to be used as a sealant for a dimming element. Disclosure 19 relates to a dimming element comprising a dimming material and a cured product of a sealant for a dimming element that seals the dimming material, wherein the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the sealant for the dimming element at 25°C is 2.0 GPa or more. Disclosure 20 relates to a dimming element comprising a dimming material and a cured product of a sealant for a dimming element that encapsulates the dimming material, wherein the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the sealant for the dimming element at 110°C is 0.04 GPa or more. Disclosure 21 relates to a dimming element comprising a dimming material and a cured product of a sealant for a dimming element that seals the dimming material, wherein the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the glass transition temperature of the cured product of the sealant for the dimming element is 65°C or more. Disclosure 22 is a laminated glass having a dimming element according to Disclosure 19, 20, or 21, an interlayer film sandwiching the dimming element, and a pair of glass panes sandwiching the interlayer film. The present invention will be described in detail below. Furthermore, the sealant for dimming elements described in Disclosure 1 will also be referred to as "the sealant for dimming elements of the present invention 1," the sealant for dimming elements described in Disclosure 3 will also be referred to as "the sealant for dimming elements of the present invention 2," and the sealant for dimming elements described in Disclosure 5 will also be referred to as "the sealant for dimming elements of the present invention 3." In addition, matters common to the sealant for dimming elements of Disclosure 1, the sealant for dimming elements of Disclosure 2, and the sealant for dimming elements of Disclosure 3 will not be specifically specified, or will be described as "the sealant for dimming elements of the present invention."

[0006] The inventors considered that the decrease in dimming function at the ends of a dimming element was due to contact between the plasticizer contained in the resin composition constituting the interlayer and the dimming material. Therefore, the inventors investigated sealing the ends of the dimming element with a sealant that satisfies at least one of the following conditions: the storage modulus at 25°C after curing is above a specific value; the storage modulus at 110°C after curing is above a specific value; and the glass transition temperature after curing is above a specific temperature; and that has low compatibility with the plasticizer. As a result, they found that the sealant can exhibit excellent sealing performance even in high-temperature environments, and thus completed the present invention.

[0007] The sealant for dimming elements of the present invention has a lower limit of 7.5 degrees at the contact angle between the cured product of the sealant for dimming elements and triethylene glycol di(2-ethylhexanoate). By having a contact angle of 7.5 degrees or more between the cured product of the sealant for dimming elements and triethylene glycol di(2-ethylhexanoate), the sealant for dimming elements of the present invention can suppress the deterioration of the dimming function of the dimming element caused by contact between the plasticizer and the dimming material. The preferred lower limit of the contact angle between the cured product of the sealant for dimming elements and triethylene glycol di(2-ethylhexanoate) is 8.0 degrees, and the more preferred lower limit is 9.0 degrees. Furthermore, there is no particular preferred upper limit for the contact angle between the cured product of the above-mentioned dimming element sealant and triethylene glycol di(2-ethylhexanoate), but the practical upper limit is 80 degrees. The contact angle between the cured product of the above-mentioned dimming element sealant and triethylene glycol di(2-ethylhexanoate) may be 7.5 to 80 degrees, 8.0 to 80 degrees, or 9.0 to 80 degrees. The contact angle between the cured product of the above-mentioned dimming element sealant and triethylene glycol di(2-ethylhexanoate) can be measured by the following method. Specifically, first, triethylene glycol di(2-ethylhexanoate) is brought into contact with a cured sealant for a dimming element, measuring 10 cm in length, 10 cm in width, and 0.3 mm in thickness, using a syringe attached to a contact angle meter at 25°C and 50% RH, to form a droplet (2.0 μL) of triethylene glycol di(2-ethylhexanoate) on the cured material. Next, an image of the droplet is taken 3 seconds after its formation on the cured material, and the contact angle is calculated using the θ / 2 method by analyzing this image. The average of 10 measurements is taken as the contact angle between the cured sealant for the dimming element and triethylene glycol di(2-ethylhexanoate). For example, a Drop Master (manufactured by Kyowa Interface Science Co., Ltd.) can be used as the contact angle meter. Furthermore, the cured product of the sealant for the dimming element, which is used to measure the contact angle, storage modulus, and glass transition temperature described later, can be obtained by applying the sealant for the dimming element to an easily peelable PET film, then layering another easily peelable PET film on top of the resulting laminate, curing the sealant for the dimming element by irradiating it with light or heating it, and then peeling off one or both of the easily peelable PET films. Specifically, for photocurable sealants for dimming elements, the curing method involves a wavelength of 340 nm and an illuminance of 100 mW / cm². 2 Methods such as irradiating with light for 30 seconds are used, and in the case of thermosetting sealants for dimming elements, methods such as heating at 120°C for 60 minutes are used, and in the case of photothermosetting sealants for dimming elements, both of these methods are used in combination. The wavelength of light irradiated when photocuring the above-mentioned sealant for dimming elements is appropriately selected according to the absorption wavelength of the photoradical polymerization initiator described later.

[0008] Methods for adjusting the contact angle between the cured product of the above-mentioned dimming element sealant and triethylene glycol di(2-ethylhexanoate) include, for example, increasing the content of the acrylic compound in the (meth)acrylic compound described later, using a compound having a hydroxyl group as the (meth)acrylic compound described later, or not using a compound with a long hydrocarbon chain as the (meth)acrylic compound, or reducing its content. These methods are carried out while adjusting the balance with the glass transition temperature described later. In this specification, "(meth)acrylic" means acrylic or methacrylic, "(meth)acrylic compound" means a compound having a (meth)acryloyl group, and "(meth)acryloyl" means acryloyl or methacryloyl.

[0009] The sealant for dimming elements of the present invention 1 has a storage modulus at 25°C of 2.0 GPa at the lower limit of the cured product of the sealant for dimming elements. Because the storage modulus at 25°C of the cured product is 2.0 GPa or higher, the sealant for dimming elements of the present invention 1 has excellent sealing performance even in high-temperature environments. From the viewpoint of sealing performance in high-temperature environments, a preferred lower limit for the storage modulus at 25°C of the cured product is 2.1 GPa, a more preferred lower limit is 2.2 GPa, an even more preferred lower limit is 2.5 GPa, and a particularly preferred lower limit is 2.6 GPa. Furthermore, from the viewpoint of shape conformability to the film, the preferred upper limit of the storage modulus of the cured product at 25°C is 3.3 GPa, a more preferred upper limit is 3.2 GPa, an even more preferred upper limit is 2.9 GPa, an even more preferred upper limit is 2.8 GPa, and a particularly preferred upper limit is 2.7 GPa. The storage modulus of the above-mentioned cured product at 25°C may be 2.0 GPa to 3.3 GPa, 2.1 GPa to 3.2 GPa, 2.2 GPa to 2.9 GPa, 2.5 GPa to 2.8 GPa, or 2.6 GPa to 2.7 GPa. The storage modulus of the cured sealant for the dimming element at 25°C and the storage modulus of the cured sealant for the dimming element at 110°C, as described later, can be obtained by measuring the dynamic viscoelasticity using a dynamic viscoelasticity measuring device under the following conditions: tensile mode, test piece width 5 mm, thickness 300 μm, grip width 25 mm, heating rate 10°C / min, temperature range -80°C to 200°C, and frequency 10 Hz. For example, the DVA-200 (manufactured by IT Measurement Control Co., Ltd.) can be used as the dynamic viscoelasticity measuring device.

[0010] The sealant for the dimming element of the present invention 2 has a lower limit of the storage elastic modulus at 110 °C of the cured product of the sealant for the dimming element of 0.04 GPa. Since the storage elastic modulus of the above cured product at 110 °C is 0.04 GPa or more, the sealant for the dimming element of the present invention 2 has excellent sealing performance even in a high-temperature environment. From the viewpoint of the sealing property in a high-temperature environment, the preferable lower limit of the storage elastic modulus of the above cured product at 110 °C is 0.05 GPa, the more preferable lower limit is 0.10 GPa, the further preferable lower limit is 0.50 GPa, and the particularly preferable lower limit is 0.60 GPa. Also, from the viewpoint of shape followability to the film, etc., the preferable upper limit of the storage elastic modulus of the above cured product at 110 °C is 1.40 GPa, the more preferable upper limit is 1.38 GPa, the further preferable upper limit is 1.35 GPa, the even more preferable upper limit is 1.28 GPa, and the particularly preferable upper limit is 1.25 GPa. The storage elastic modulus of the above cured product at 110 °C may be 0.04 GPa to 1.40 GPa, may be 0.05 GPa to 1.38 GPa, may be 0.10 GPa to 1.35 GPa, may be 0.50 GPa to 1.28 GPa, or may be 0.60 GPa to 1.25 GPa.

[0011] The sealant for the dimming element of the present invention 3 has a lower limit of the glass transition temperature of the cured product of the sealant for the dimming element of 65 °C. Since the glass transition temperature of the above cured product is 65 °C or more, the sealant for the dimming element of the present invention 3 has excellent sealing performance even in a high-temperature environment. From the viewpoint of the sealing property in a high-temperature environment, the preferable lower limit of the glass transition temperature of the above cured product is 80 °C, the more preferable lower limit is 110 °C, and the further preferable lower limit is 120 °C. Also, from the viewpoint of shape followability to the film, etc., the preferable upper limit of the glass transition temperature of the above cured product is 180 °C, the more preferable upper limit is 160 °C, and the further preferable upper limit is 145 °C. Furthermore, from the viewpoint of preventing film peeling, the glass transition temperature of the above cured product is preferably 120 °C or less, and more preferably 110 °C or less. The glass transition temperature of the above-mentioned cured product may be 65°C to 180°C, or 65°C to 160°C, or 65°C to 145°C, or 65°C to 120°C, or 65°C to 110°C, or 80°C to 180°C, or 80°C to 160°C, or 80°C to 145°C, or 80°C to 120°C, or 80°C to 110°C, or 110°C to 180°C, or 110°C to 160°C, or 110°C to 145°C, or 110°C to 120°C, or 120°C to 180°C, or 120°C to 160°C, or 120°C to 145°C. In addition, the glass transition temperature of the cured product of the light control element sealing agent can be obtained as the temperature of the maximum value of the loss tangent (tanδ) when measuring the dynamic viscoelasticity under the conditions of a tensile mode, a test piece width of 5 mm, a thickness of 300 μm, a gripping width of 25 mm, a heating rate of 10°C / min, a temperature range of -80°C to 200°C, and a frequency of 10 Hz using a dynamic viscoelasticity measuring device. As the above-mentioned dynamic viscoelasticity measuring device, for example, DVA-200 (manufactured by IT Measurement and Control Co., Ltd.) can be used.

[0012] As a method for adjusting the storage elastic modulus at 25°C and 110°C of the cured product of the light control element sealing agent and the glass transition temperature, for example, increasing the content ratio of the methacrylic compound in the (meth)acrylic compound described later, using a compound having a rigid skeleton such as a bridged ring structure as the (meth)acrylic compound described later, increasing the crosslinking density of the cured product, etc. can be mentioned. These are carried out while adjusting the balance with the contact angle described above.

[0013] The light control element sealing agent of the present invention contains a curable resin. The above-mentioned curable resin contains a (meth)acrylic compound. By containing the above-mentioned (meth)acrylic compound as the curable resin, the light control element sealing agent of the present invention is less likely to cause contamination to the light control material (excellent in low contamination property).

[0014] The above (meth)acrylic compound preferably contains a compound having two or more (meth)acryloyl groups in one molecule (hereinafter also referred to as "bifunctional or more (meth)acrylic compound"). By containing the above bifunctional or more (meth)acrylic compound as the above (meth)acrylic compound, the sealant for dimming elements of the present invention exhibits excellent curability and adhesion.

[0015] Examples of the above-mentioned bifunctional or more (meth)acrylic compounds include epoxy (meth)acrylate, (meth)acrylic acid ester compounds, urethane (meth)acrylate, etc., which have two or more (meth)acryloyl groups in one molecule. Among these, the above-mentioned bifunctional or more (meth)acrylic compounds preferably include epoxy (meth)acrylate from the viewpoint of low staining (especially low liquid crystal staining). In this specification, "epoxy (meth)acrylate" refers to a compound obtained by reacting all epoxy groups in an epoxy compound with (meth)acrylic acid.

[0016] Examples of the epoxy (meth)acrylate mentioned above include those obtained by reacting an epoxy compound having two or more epoxy groups in one molecule with (meth)acrylic acid in the presence of a basic catalyst according to a conventional method.

[0017] Examples of the epoxy compounds used as raw materials for the epoxy (meth)acrylates mentioned above include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol E type epoxy compounds, bisphenol S type epoxy compounds, 2,2'-diallylbisphenol A type epoxy compounds, hydrogenated bisphenol type epoxy compounds, propylene oxide-added bisphenol A type epoxy compounds, resorcinol type epoxy compounds, biphenyl type epoxy compounds, sulfide type epoxy compounds, diphenyl ether type epoxy compounds, dicyclopentadiene type epoxy compounds, naphthalene type epoxy compounds, phenol novolac type epoxy compounds, orthocresol novolac type epoxy compounds, dicyclopentadiene novolac type epoxy compounds, biphenyl novolac type epoxy compounds, naphthalene phenol novolac type epoxy compounds, glycidylamine type epoxy compounds, alkyl polyol type epoxy compounds, rubber-modified epoxy compounds, glycidyl ester compounds, and the like.

[0018] Examples of the difunctional (meth)acrylic acid ester compounds listed above include 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, 2-n-butyl-2-ethyl-1,3-propanediol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, and polypropylene glycol di Examples include (meth)acrylate, neopentyl glycol di(meth)acrylate, ethylene oxide-added bisphenol A di(meth)acrylate, propylene oxide-added bisphenol A di(meth)acrylate, ethylene oxide-added bisphenol F di(meth)acrylate, dimethylol dicyclopentadienyl di(meth)acrylate, ethylene oxide-modified isocyanurate di(meth)acrylate, 2-hydroxy-3-(meth)acryloyloxypropyl(meth)acrylate, carbonate diol di(meth)acrylate, polyether diol di(meth)acrylate, polyester diol di(meth)acrylate, polycaprolactone diol di(meth)acrylate, polybutadiene diol di(meth)acrylate, and the like.

[0019] Examples of the above (meth)acrylic acid ester compounds that have three or more functionalities include ethylene oxide-added isocyanuric acid tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethylene oxide-added trimethylolpropane tri(meth)acrylate, propylene oxide-added trimethylolpropane tri(meth)acrylate, caprolactone-modified trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate, propylene oxide-added glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0020] The above-mentioned urethane (meth)acrylate can be obtained, for example, by reacting an isocyanate compound with a (meth)acrylic acid derivative having a hydroxyl group in the presence of a catalytic amount of a tin-based compound.

[0021] Examples of isocyanate compounds that serve as raw materials for the above-mentioned urethane (meth)acrylate include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tollidine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris(isocyanatephenyl)thiophosphate, tetramethylxylylene diisocyanate, and 1,6,11-undecane triisocyanate.

[0022] Furthermore, as the isocyanate compound used as a raw material for the above-mentioned urethane (meth)acrylate, a chain-extended isocyanate compound obtained by the reaction of a polyol with an excess isocyanate compound can also be used. Examples of the polyols mentioned above include ethylene glycol, propylene glycol, glycerin, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, and polycaprolactone diol.

[0023] Examples of (meth)acrylic acid derivatives having the hydroxyl group mentioned above include hydroxyalkyl (meth)acrylates, mono(meth)acrylates of dihydric alcohols, mono(meth)acrylates or di(meth)acrylates of trihydric alcohols, epoxy (meth)acrylates, and the like. Examples of the hydroxyalkyl (meth)acrylates mentioned above include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Examples of the dihydric alcohols mentioned above include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, polyethylene glycol, and the like. Examples of the above-mentioned trivalent alcohols include trimethylolethane, trimethylolpropane, and glycerin. Examples of the epoxy (meth)acrylates mentioned above include bisphenol A type epoxy (meth)acrylate.

[0024] Furthermore, from the viewpoint of providing superior effectiveness in suppressing the deterioration of the dimming function of the dimming element due to contact between the plasticizer and the dimming material, the above-mentioned bifunctional or more (meth)acrylic compounds preferably contain one or more aromatic rings in one molecule, preferably contain two or more aromatic rings in one molecule, and even more preferably contain a (meth)acrylic compound having a bisphenol skeleton. The bisphenol skeletons mentioned above are preferably bisphenol A, bisphenol F, and bisphenol E, more preferably bisphenol A and bisphenol F, and even more preferably bisphenol A.

[0025] The above (meth)acrylic compound may include a monofunctional (meth)acrylic compound having one (meth)acryloyl group in one molecule.

[0026] A preferred lower limit for the content of the bifunctional or more (meth)acrylic compound in 100 parts by mass of the above (meth)acrylic compound is 50 parts by mass. When the content of the bifunctional or more (meth)acrylic compound in 100 parts by mass of the above (meth)acrylic compound is 50 parts by mass or more, the resulting sealant for dimming elements exhibits superior curability, adhesion, and low-stain properties. A more preferred lower limit for the content of the bifunctional or more (meth)acrylic compound in 100 parts by mass of the above (meth)acrylic compound is 66 parts by mass. It is particularly preferable that the content of the bifunctional or more (meth)acrylic compound in 100 parts by mass of the above (meth)acrylic compound is 100 parts by mass, i.e., the above (meth)acrylic compound is composed solely of the bifunctional or more (meth)acrylic compound. The content of the above bifunctional or more (meth)acrylic compound in 100 parts by mass of the above (meth)acrylic compound may be 50 to 100 parts by mass, or 66 to 100 parts by mass.

[0027] It is preferable that the above-mentioned curable resin does not contain any compounds whose homopolymer glass transition temperature is less than 30°C, does not contain any compounds whose homopolymer glass transition temperature is 30°C or more and less than 65°C, or contains 40% by mass or less of compounds whose homopolymer glass transition temperature is 30°C or more and less than 65°C, and contains 30% by mass or more and 70% by mass or less of compounds whose homopolymer glass transition temperature is 120°C or more.

[0028] The preferred lower limit for the content of the (meth)acrylic compound in 100 parts by mass of the curable resin is 50 parts by mass. A content of 50 parts by mass or more of the (meth)acrylic compound results in a sealant for dimming elements that exhibits superior low-stain properties. A more preferred lower limit for the content of the (meth)acrylic compound is 66 parts by mass. It is particularly preferable that the content of the (meth)acrylic compound in 100 parts by mass of the curable resin is 100 parts by mass, i.e., that the curable resin is composed solely of the (meth)acrylic compound. The content of the (meth)acrylic compound in 100 parts by mass of the curable resin may be 50 to 100 parts by mass, or 66 to 100 parts by mass.

[0029] The preferred lower limit of the total content of the curable resin in 100 parts by mass of the sealant for dimming elements of the present invention is 66 parts by mass, and the preferred upper limit is 99 parts by mass. Having the total content of the curable resin within this range results in a sealant for dimming elements with superior curability and adhesion.

[0030] The sealing agent for dimming elements of the present invention contains a radical polymerization initiator. As the radical polymerization initiators mentioned above, photoradical polymerization initiators that generate radicals upon light irradiation and thermal radical polymerization initiators that generate radicals upon heating can be used. Among these, photoradical polymerization initiators are preferably used.

[0031] Examples of the above-mentioned photoradical polymerization initiators include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, and thioxanthone compounds. Examples of the above-mentioned photoradical polymerization initiators include, specifically, 1-hydroxycyclohexylphenyl ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-((4-methylphenyl)methyl)-1-(4-(4-morpholinyl)phenyl)-1-butanone, 2,2-dimethoxy-1,2-diphenylethane-1-one, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and 2-methyl-1-(4-methylthiophenyl). Examples include -2-morpholinopropan-1-one, 1-(4-(2-hydroxyethoxy)-phenyl)-2-hydroxy-2-methyl-1-propan-1-one, 1-(4-(phenylthio)phenyl)-1,2-octanedione 2-(O-benzoyloxime), 2-(acetoxyimino)-1-(4-(4-(2-hydroxyethoxy)phenylthio)phenyl)propan-1-one, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and 2,4-dimethylthioxanthene-9-one.

[0032] Examples of the above-mentioned thermal radical polymerization initiators include those composed of azo compounds and organic peroxides. Among these, initiators composed of azo compounds (hereinafter also referred to as "azo initiators") are preferred from the viewpoint of suppressing contamination of light-adjusting materials. The above-mentioned thermal radical polymerization initiators may be used alone or in combination of two or more types.

[0033] Examples of the above-mentioned azo compounds include those having a structure in which multiple units such as polyalkylene oxides and polydimethylsiloxanes are bonded via an azo group, polycondensates of 2,2'-azobis(2,4-dimethylvaleronitrile), 4,4'-azobis(4-cyanovaleric acid), 4,4'-azobis(4-cyanopentanoic acid) and polyalkylene glycols, and polycondensates of 4,4'-azobis(4-cyanopentanoic acid) and polydimethylsiloxanes having terminal amino groups. Examples of the above-mentioned azo initiators include VPE-0201, VPE-0401, VPE-0601, VPS-0501, VPS-1001, V-65, and V-501 (all manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.).

[0034] Examples of the above-mentioned organic peroxides include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, peroxyesters, diacyl peroxides, and peroxydicarbonates.

[0035] The preferred lower limit of the radical polymerization initiator content is 0.01 parts by mass and the preferred upper limit is 10 parts by mass per 100 parts by mass of the curable resin. This range of radical polymerization initiator content results in a sealant for dimming elements with superior storage stability and curability. A more preferred lower limit for the radical polymerization initiator content is 0.1 parts by mass and a more preferred upper limit is 7 parts by mass. The amount of the radical polymerization initiator per 100 parts by mass of the curable resin may be 0.01 to 10 parts by mass, or 0.1 to 7 parts by mass.

[0036] The sealant for dimming elements of the present invention may further contain, if necessary, additives such as a thermosetting agent, a curing accelerator, a light-shielding agent, a filler, a silane coupling agent, a stress-relieving agent, a reactive diluent, a thixotrope, a spacer, an antifoaming agent, a leveling agent, or a polymerization inhibitor.

[0037] One method for producing the sealant for dimming elements of the present invention is to mix a curable resin, a radical polymerization initiator, and additives as needed using a mixer. Examples of the above-mentioned mixing machines include homodispers, homomixers, multi-purpose mixers, planetary mixers, kneaders, and three-roll mixers.

[0038] The sealant for dimming elements of the present invention is used to seal a dimming element having a dimming material, and is preferably used when the dimming material is a solid dimming material. PDLC (polymer-dispersed liquid crystal) is preferably used as the solid dimming material. The seal portion formed by the sealant for dimming elements of the present invention is preferably provided around the dimming material. In this specification, "solid" means that it does not have fluidity at 25°C.

[0039] Furthermore, the sealant for dimming elements of the present invention is preferably used to seal dimming elements in which a resin composition containing a plasticizer is arranged around them, and more preferably used to seal dimming elements in which a polyvinyl butyral resin composition containing a plasticizer is arranged around them.

[0040] Figure 1 is a schematic cross-sectional view showing an example of a light-adjusting element in which a resin composition containing a plasticizer is arranged around it and sealed using the light-adjusting element sealant of the present invention. In Figure 1, a light-adjusting material 1 is sandwiched between transparent electrode-equipped films 2 to form a light-adjusting element. Since a seal portion 3 made of the light-adjusting element sealant is provided at the end of the light-adjusting element, the resin composition containing a plasticizer 4 (interlayer, etc.) is arranged around the light-adjusting element without coming into contact with the light-adjusting material 1. By using the light-adjusting element sealant of the present invention as the sealant for forming the seal portion 3, which has low compatibility with plasticizers and high storage modulus at 25°C after curing, storage modulus at 110°C, and glass transition temperature, excellent sealing performance can be achieved even in high-temperature environments.

[0041] Examples of the plasticizers mentioned above include organic acid esters, organic phosphate esters, and organic phosphite esters.

[0042] Examples of the above organic acid esters include triethylene glycol di(2-ethyl butyrate), triethylene glycol di(2-ethylhexanoate), triethylene glycol dicaprylate, triethylene glycol di(n-octanoate), triethylene glycol di(n-heptanoate), tetraethylene glycol di(n-heptanoate), tetraethylene glycol di(2-ethylhexanoate), dibutyl sebacate, dioctyl azelate, dibutyl carbitol adipate, ethylene glycol di(2-ethyl butyrate), 1,3-propylene glycol di(2-ethyl butyrate), 1,4-butylene glycol di(2-ethyl butyrate), Examples include diethylene glycol di(2-ethyl butyrate), diethylene glycol di(2-ethylhexanoate), dipropylene glycol di(2-ethyl butyrate), triethylene glycol di(2-ethylpentanoate), tetraethylene glycol di(2-ethyl butyrate), diethylene glycol dicapriate, dihexyl adipate, dioctyl adipate, hexylcyclohexyl adipate, diisononyl adipate, heptylnonyl adipate, oil-modified sebacate alkyd, mixtures of phosphate esters and adipate esters, and mixed adipate esters made from alkyl alcohols having 4 to 9 carbon atoms and cyclic alcohols having 4 to 9 carbon atoms.

[0043] Examples of the above-mentioned organic phosphate esters or organic phosphite esters include compounds obtained by the condensation reaction of phosphoric acid or phosphite with an alcohol. Among these, compounds obtained by the condensation reaction of an alcohol having 1 to 12 carbon atoms with phosphoric acid or phosphite are preferred. Examples of the above-mentioned C1-C12 alcohols include methanol, ethanol, butanol, hexanol, 2-ethylbutanol, heptanol, octanol, 2-ethylhexanol, decanol, dodecanol, butoxyethanol, butoxyethoxyethanol, and benzyl alcohol. Examples of the above-mentioned organic phosphate esters or organic phosphite esters include, specifically, trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, tri(2-ethylhexyl) phosphate, tri(butoxyethyl) phosphate, tri(2-ethylhexyl) phosphite, isodecylphenyl phosphate, triisopropyl phosphate, and the like.

[0044] In particular, the sealant for dimming elements of the present invention is suitably used to seal dimming elements in which a resin composition containing triethylene glycol di(2-ethylhexanoate) as a plasticizer is arranged around the element.

[0045] Furthermore, a curable resin composition containing a curable resin and a radical polymerization initiator, wherein the curable resin contains a (meth)acrylic compound, the contact angle between the cured product of the curable resin composition and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the curable resin composition at 25°C is 2.0 GPa or more, can be used as a sealant for dimming elements, and The use of a curable resin composition as a sealant for a dimming element, wherein the contact angle with (meth)acrylic compound is 7.5 degrees or more and the storage modulus of the cured product of the curable resin composition at 110°C is 0.04 GPa or more, and the use of a curable resin composition as a sealant for a dimming element, wherein the curable resin contains a (meth)acrylic compound, the contact angle between the cured product of the curable resin composition and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the glass transition temperature of the cured product of the curable resin composition is 65°C or more, is also one aspect of the present invention. Furthermore, a dimming element comprising a dimming material and a cured product of a sealant for a dimming element that seals the dimming material, wherein the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more, and the storage modulus of the cured product of the sealant for the dimming element at 25°C is 2.0 GPa or more; A dimming element having a contact angle of 7.5 degrees or more with xanoate and a storage modulus of 0.04 GPa or more at 110°C for the cured product of the dimming element sealant, and a dimming element having a dimming material and a cured product of the dimming element sealant that seals the dimming material, wherein the contact angle between the cured product of the dimming element sealant and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more and the glass transition temperature of the cured product of the dimming element sealant is 65°C or more are also one of the present inventions. In addition, a laminated glass having a dimming element of the present invention, an interlayer film sandwiching the dimming element, and a pair of glass panes sandwiching the interlayer film is also one of the present inventions. [Effects of the Invention]

[0046] According to the present invention, it is possible to provide a sealant for a dimming element that has excellent sealing performance for a dimming element having a dimming material even in a high-temperature environment. Furthermore, according to the present invention, it is possible to provide a method for using a curable resin composition as a sealant for a dimming element, as well as a dimming element and laminated glass containing a cured product of the sealant for the dimming element. [Brief explanation of the drawing]

[0047] [Figure 1] This is a schematic cross-sectional view showing an example of a configuration in which a light-adjusting element, surrounded by a resin composition containing a plasticizer, is sealed using the light-adjusting element sealant of the present invention. [Modes for carrying out the invention]

[0048] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0049] (Synthesis of resorcinol-type epoxy acrylate (curable resin A)) 1000 parts by mass of a resorcinol-type epoxy compound (Nagase ChemteX, "Denacol EX-201"), 2 parts by mass of p-methoxyphenol as a polymerization inhibitor, 2 parts by mass of triethylamine as a reaction catalyst, and 649 parts by mass of acrylic acid were reacted at 90°C for 5 hours under reflux stirring while introducing air. 100 parts by mass of the resulting reaction product was filtered through a column packed with 10 parts by mass of a natural compound of quartz and kaolin (Hoffmann Minerals, "Silitin V85") to adsorb ionic impurities in the reaction product, thereby obtaining a resorcinol-type epoxy acrylate (curable resin A).

[0050] (Synthesis of resorcinol-type epoxy methacrylate (curable resin B)) Resorcinol-type epoxy methacrylate (curable resin B) was obtained in the same manner as described above in "(Synthesis of resorcinol-type epoxy acrylate (curable resin A))", except that 774 parts by mass of methacrylic acid were used instead of 649 parts by mass of acrylic acid.

[0051] (Examples 1-13, Comparative Examples 1-5) According to the mixing ratios listed in Tables 1-3, each material was stirred using a planetary agitator, and then uniformly mixed using a three-roll ceramic roller to obtain the dimming element sealants of Examples 1-13 and Comparative Examples 1-5. A "Awatori Rentaro" (manufactured by Shinky Co., Ltd.) was used as the planetary agitator. For the dimming element sealants obtained in Examples 1, 3-13 and Comparative Examples 1-5, the sealant for the dimming element was applied to an easily peelable PET film, and then another easily peelable PET film was placed on top of the resulting laminate. The laminate was then tested using MB1500T-3 (manufactured by Sun Energy Co., Ltd.) at a wavelength of 340 nm and an illuminance of 100 mW / cm². 2The sealant for the dimming element was cured by irradiating it with light for 30 seconds. Furthermore, for the sealant for the dimming element obtained in Example 2, after applying the sealant to an easily removable PET film, another easily removable PET film was placed on top of the resulting laminate. This laminate was then subjected to curing using MB1500T-3 (manufactured by Sun Energy Co., Ltd.) at a wavelength of 340 nm and an illuminance of 100 mW / cm². 2 The sealant for the dimming element was cured by irradiating it with light for 30 seconds and then heating it at 120°C for 60 minutes.

[0052] (Contact angle between cured product of dimming element sealant and triethylene glycol di(2-ethylhexanoate)) For a cured product of a light-adjusting element sealant, measuring 10 cm in length, 10 cm in width, and 0.3 mm in thickness (after removing the easily peelable PET film from the top), triethylene glycol di(2-ethylhexanoate) was brought into contact with the cured product at 25°C and 50% RH using a syringe attached to a contact angle meter, forming a 2.0 μL droplet of triethylene glycol di(2-ethylhexanoate) on the cured product. An image of the droplet was taken 3 seconds after its formation on the cured product. The contact angle was calculated using the θ / 2 method by analyzing this droplet image. The average of 10 measurements was taken as the contact angle between the cured light-adjusting element sealant and triethylene glycol di(2-ethylhexanoate). A Drop Master (manufactured by Kyowa Interface Science Co., Ltd.) was used as the contact angle meter. The results are shown in Tables 1-3.

[0053] (Storage modulus of cured sealant for dimming elements at 25°C and 110°C, and glass transition temperature) The cured sealant for the dimming element obtained (after peeling off both easy-peel PET films) was measured using a dynamic viscoelasticity analyzer in tensile mode under the following conditions: specimen width 5 mm, thickness 300 μm, grip width 25 mm, heating rate 10 °C / min, temperature range -80 °C to 200 °C, and frequency 10 Hz. The storage modulus at 25 °C and 110 °C, as well as the glass transition temperature, were determined. The dynamic viscoelasticity analyzer used was a DVA-200 (manufactured by IT Measurement Control Co., Ltd.). The results are shown in Tables 1 to 3.

[0054] <Rating> The following evaluations were performed on the obtained sealant for dimming elements. The results are shown in Tables 1-3.

[0055] (Sealing performance) (1) Film peeling prevention The obtained light-adjusting element sealant was coated onto a liquid crystal light-adjusting film (manufactured by Kyushu Nanotech Co., Ltd., "nanotec-film type 1") measuring 2 cm in width and 10 cm in length to a thickness of 300 μm. Then, for the light-adjusting element sealants obtained in Examples 1, 3-13, and Comparative Examples 1-5, an MB1500T-3 (manufactured by Sun Energy Co., Ltd.) was used to test them at a wavelength of 340 nm and an illuminance of 100 mW / cm². 2 The material was cured by irradiating it with light for 30 seconds to obtain a test specimen. Furthermore, for the dimming element sealant obtained in Example 2, MB1500T-3 (manufactured by Sun Energy Co., Ltd.) was used, with a wavelength of 340 nm and an illuminance of 100 mW / cm². 2 After irradiating the material with light for 30 seconds, the material was cured by heating it at 120°C for 60 minutes to obtain test specimens. The presence or absence of peeling of the liquid crystal dimming film on the obtained test specimens was visually checked, and the film peeling resistance was evaluated according to the following criteria. ○: If no peeling of the LCD dimming film is found. △: In cases where peeling of the LCD dimming film is observed in some areas. ×: If the LCD dimming film has completely peeled off.

[0056] (2) Low contamination in high-temperature environments The obtained light-adjusting element sealant was applied to the periphery of the light-adjusting film (manufactured by Gauzy) in a width of 500 μm, and then cured to obtain a light-adjusting layer with a sealed periphery. For the light-adjusting element sealants obtained in Examples 1, 3-13, and Comparative Examples 1-5, MB1500T-3 (manufactured by Sun Energy Co., Ltd.) was used at a wavelength of 340 nm and an illuminance of 100 mW / cm². 2 The material was cured by irradiating it with light for 30 seconds. Furthermore, for the dimming element sealant obtained in Example 2, MB1500T-3 (manufactured by Sun Energy Co., Ltd.) was used, with a wavelength of 340 nm and an illuminance of 100 mW / cm². 2The light-sensitive layer was cured by irradiating it with light for 30 seconds and then heating it at 120°C for 60 minutes. The resulting light-sensitive layer was sandwiched between an interlayer (Sekisui Chemical Co., Ltd.'s "Eslec™ Film") and glass, and laminated by applying pressure at a temperature of 90°C to obtain a test specimen. The obtained test specimens were left at 80°C for 100 hours, and the contamination distance from the edge of the light-adjusting layer was measured. The low contamination level at 80°C was then evaluated according to the following criteria. ◎: If the contamination distance is less than 3 mm ○: If the contamination distance was 3 mm or more but less than 10 mm ×: If the contamination distance is 10 mm or more Furthermore, the contamination distance from the edge of the light-adjusting layer was measured for the test specimens obtained in the same manner after being left at 110°C for 100 hours, and the low contamination performance at 110°C was evaluated according to the following criteria. ◎: If the contamination distance is less than 3 mm ○: If the contamination distance is 3 mm or more but less than 7 mm. △: If the contamination distance was 7 mm or more but less than 10 mm ×: If the contamination distance is 10 mm or more

[0057] [Table 1]

[0058] [Table 2]

[0059] [Table 3] [Industrial applicability]

[0060] According to the present invention, it is possible to provide a sealant for a dimming element that has excellent sealing performance for a dimming element having a dimming material even in a high-temperature environment. Furthermore, according to the present invention, it is possible to provide a method for using a curable resin composition as a sealant for a dimming element, as well as a dimming element and laminated glass containing a cured product of the sealant for the dimming element. [Explanation of Symbols]

[0061] 1. Dimmable materials 2 Transparent electrode film 3. Sealing part 4. Resin composition containing a plasticizer

Claims

1. A sealant for a dimming element used to seal a dimming element having a dimming material, It contains a curable resin and a radical polymerization initiator. The curable resin contains a (meth)acrylic compound, The contact angle between the cured product of the dimming element sealant and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more. The storage modulus of the cured product of the aforementioned light-adjusting element sealant is 2.0 GPa or higher at 25°C. A sealant for dimming elements characterized by the following features.

2. The sealant for a dimming element according to claim 1, wherein the storage modulus of the cured product of the sealant for the dimming element at 25°C is 3.3 GPa or less.

3. A sealant for a dimming element used to seal a dimming element having a dimming material, It contains a curable resin and a radical polymerization initiator. The curable resin contains a (meth)acrylic compound, The contact angle between the cured product of the dimming element sealant and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more. The storage modulus of the cured product of the aforementioned light-adjusting element sealant is 0.04 GPa or higher at 110°C. A sealant for dimming elements characterized by the following features.

4. The sealant for a dimming element according to claim 3, wherein the storage modulus of the cured product of the sealant for the dimming element is 1.40 GPa or less at 110°C.

5. The sealant for a dimming element according to claim 1, 2, 3, or 4, wherein the contact angle between the cured product of the sealant for the dimming element and triethylene glycol di(2-ethylhexanoate) is 8.0 degrees or more.

6. The sealant for a dimming element according to claim 1, 2, 3, or 4, wherein the (meth)acrylic compound comprises a compound having two or more (meth)acryloyl groups in one molecule.

7. The compound having two or more (meth)acryloyl groups in one molecule comprises epoxy (meth)acrylate, according to claim 6, as a sealant for a dimming element.

8. The sealant for a dimming element according to claim 6, wherein the compound having two or more (meth)acryloyl groups in one molecule comprises a (meth)acrylic compound having one or more aromatic rings in one molecule.

9. The light-modulating material is a solid light-modulating material, as described in claim 1, 2, 3, or 4, for use as a sealant for a light-modulating element.

10. The sealant for a dimming element according to claim 9, wherein the solid dimming material is a PDLC.

11. A sealant for a dimming element according to claim 1, 2, 3, or 4, wherein a resin composition containing a plasticizer is used to seal a dimming element disposed around it.

12. A curable resin composition containing a curable resin and a radical polymerization initiator, The curable resin contains a (meth)acrylic compound, The contact angle between the cured product of the curable resin composition and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more. The storage modulus of the cured product of the curable resin composition is 2.0 GPa or higher at 25°C. Use of a curable resin composition characterized by the above as a sealant for dimming elements.

13. A curable resin composition containing a curable resin and a radical polymerization initiator, The curable resin contains a (meth)acrylic compound, The contact angle between the cured product of the curable resin composition and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more. The storage modulus of the cured product of the curable resin composition is 0.04 GPa or higher at 110°C. Use of a curable resin composition characterized by the above as a sealant for dimming elements.

14. A dimming element comprising a dimming material and a cured product of a sealant for a dimming element that seals the dimming material, The contact angle between the cured product of the dimming element sealant and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more. The storage modulus of the cured product of the aforementioned light-adjusting element sealant is 2.0 GPa or higher at 25°C. A dimming element characterized by the following features.

15. A dimming element comprising a dimming material and a cured product of a sealant for a dimming element that seals the dimming material, The contact angle between the cured product of the dimming element sealant and triethylene glycol di(2-ethylhexanoate) is 7.5 degrees or more. The storage modulus of the cured product of the aforementioned light-adjusting element sealant is 0.04 GPa or higher at 110°C. A dimming element characterized by the following features.

16. A laminated glass comprising a dimming element according to claim 14 or 15, an interlayer film sandwiching the dimming element, and a pair of glass panes sandwiching the interlayer film.

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