Electronic component mounting board

Abstract

To provide an electronic component mounting substrate that can seal an electronic component, an electronic component mounting substrate on which a wiring member and a lead wire are mounted, can further seal a lead wire extraction portion, and has sufficient splash-proof performance.SOLUTION: In an electronic component mounting substrate 1 on which an electronic component 2, a wiring member 3 that connects the electronic components 2, and an external connection portion 4 for connecting a lead wire 6 for supplying electricity to the wiring member 3 and the electronic component 2 are mounted, an inner connecting portion 41 that is connected to the wiring member 3, an outer connecting portion 42 that is connected to the inner connecting portion 41 and connected to a lead wire 6, and a frame portion 43 having a through hole 44 larger than the area of the inner connecting portion 41 and the outer connecting portion 42 are attached to the external connection portion 4, the surface of the electronic component mounting substrate 1 except for the through hole 44 of the frame portion 43 is sealed with a film 5, and the inside of the through hole 44 of the frame portion 43 is filled with at least a resin 70 or a cap 71 is attached.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component mounting substrate on which an external connection portion for connecting an electronic component or a wiring member and a lead wire for supplying electricity to the electronic component or for inputting / outputting a signal between the electronic components is mounted, and which is sealed for various purposes such as insulation measures, heat dissipation measures, anti-contact measures, waterproof and moisture-proof measures, etc.

Background Art

[0002] In a circuit board (IC board) or the like on which components such as elements and coils are mounted, it is often necessary to seal the components on the circuit board for insulation measures, heat dissipation measures, anti-vibration measures, waterproof and moisture-proof measures, etc. For example, Patent Document 1 discloses the following technique (method).

[0003] FIG. 7 is a plan view of the substrate after the decorative molding process, and FIG. 8 is a plan view of the substrate after the wiring exposure process. A plurality of elements 200 are fixed on a substrate 100, and a coating film having thermoplasticity and covering the entire substrate 100 is overlaid and formed on the upper surface side of the substrate 100 where a wiring 300 is connected to a connection portion 400 of one of the elements 200. The overlay molding is performed by expanding and setting the coating film 500 above the substrate 100, surrounding the upper and lower portions of the set coating film 500 respectively, and forming upper and lower continuous sealed spaces partitioned by the coating film 500, and by decorative molding (three-dimensional decorative molding) that causes a pressure difference between these upper and lower sealed spaces. The coating film 500 after the decorative molding has an overhanging portion 600 that extends continuously to the four sides of the periphery of the circuit board at the end, and the overhanging base of the overhanging portion 600 is adhered to the peripheral side surface of the substrate 100 over the entire circumference of the substrate 100 (FIG. 7).

[0004] In Figure 7, since excess protective film 500 spreads around the perimeter of this circuit board, the protective film 500 is cut along the dashed line shown in Figure 7 during the cutting process. Figure 8 shows the state after the cutting process. In this cutting process, the protective film 500 at the ends of the wiring is also removed, and an exposure process is performed to expose a portion of the wiring ends of the wiring 300 so that they can be connected. As a result, all the wiring ends of the multiple wirings 300 that extend parallel to each other from the connection section 400 are exposed. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2015-228421 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, the cutting process also involves cutting the covering film 500 at the wiring ends of the wiring 300 to expose a portion of the wiring ends of the wiring 300 so that they can be connected. As a result, all of the wiring ends of the wiring 300 that extend parallel from the connection section 400 are exposed, creating a gap between the wiring 300 and the covering film 500, making it difficult to say that sufficient splash-proof performance can be obtained. [Means for solving the problem]

[0007] The present invention aims to provide an electronic component mounting board that has sufficient splash-proof performance, which can be sealed even at the lead wire outlet, and has external connection parts mounted on it for connecting electronic components, wiring members that connect electronic components, and lead wires for supplying electricity to electronic components or for inputting and outputting signals between electronic components.

[0008] To solve the above problems, the present invention of claim 1 is an electronic component mounting board on which electronic components, wiring members connecting electronic components, and external connection parts for connecting lead wires for supplying electricity to electronic components or for inputting and outputting signals between electronic components are mounted, wherein the external connection part is formed by attaching an internal connection part that connects to the wiring member, an external connection part that connects to the internal connection part and connects lead wires, and a frame part having a through hole larger than the area of ​​the internal connection part and the outer connection part to the electronic component mounting board, the surface of the electronic component mounting board excluding the through hole of the frame part of the external connection part is sealed with a film, and the through hole of the frame part of the external connection part is filled with at least resin or rubber or fitted with a cap.

[0009] The present invention as of claim 1 is an electronic component mounting board on which electronic components, wiring members connecting electronic components, and an external connection portion for connecting lead wires for supplying electricity to the electronic components or for inputting and outputting signals between the electronic components are mounted, wherein the external connection portion is formed by attaching an inner connection portion that connects to the wiring member, an outer connection portion that connects to the inner connection portion and connects lead wires, and a frame portion having a through hole larger than the area of ​​the inner connection portion and the outer connection portion to the electronic component mounting board, and the surface of the front component mounting board of the external connection portion, excluding the through hole of the frame portion, is sealed with a film, so that the electronic components, the wiring members connecting electronic components, and the area between the wiring members and the external connection portion have high splash-proof performance.

[0010] Furthermore, in the external connection section, at least resin or rubber is filled into the through-hole of the frame of the external connection section, or a cap is attached, so that the lead wires that are connected to the film and pulled out to the outside can be sealed. As a result, high splash resistance can be achieved even in the external connection section. Therefore, high splash resistance can be achieved throughout the entire electronic component mounting board.

[0011] Here, "lead wire" is a general term for wire components used to electrically connect power sources, electronic components, etc., in electrical circuits. Examples include vinyl-coated wire, tinned wire, and enameled wire. Lead wire plays the role of transmitting electrical signals and electrical energy between electronic components.

[0012] Claim 2 of the present invention is the invention of Claim 1, wherein the electronic component includes an LED module in which at least a light-emitting diode (LED) is covered with a lens, the film is a transparent resin film, and the height of the frame portion of the external connection portion is greater than the height of the wiring member and less than the height of the LED module, and is an electronic component mounting substrate.

[0013] In the present invention of claim 2, the electronic component includes an LED module in which at least the light-emitting diode (LED) is covered with a lens, and the film is a transparent resin film. Firstly, the LED module and the wiring members connecting the LED modules are sealed with the transparent resin film. This prevents the LED module and the lens of the LED module from falling off, and prevents the wiring members from floating between the LED modules, which can occur if they are not sealed, thus preventing the lateral emission of light from the LED module from being blocked. As a result, the emission of light from the LED module can be utilized efficiently.

[0014] Secondly, since the height of the frame of the external connection part is higher than the height of the wiring component but lower than the height of the LED module, the external connection part does not obstruct the lateral light emitted from the LED. As a result, the light emitted from the LED can be efficiently utilized even at the external connection part.

[0015] Claim 3 of the present invention is the invention of Claim 2, wherein the wiring member is a lead wire, and the lead wire is an electronic component mounting board attached to a crimp terminal arranged on an LED module.

[0016] In the present invention of claim 3, the wiring member is a lead wire, and the lead wire is attached to a crimp terminal provided on the LED module. Therefore, compared to the case where the lead wire is soldered to the LED module, it can be connected more easily and has superior workability. Furthermore, it is possible to prevent connection failures that occur when soldering, and there is no need to worry about thermal load on the LED during soldering. [Effects of the Invention]

[0017] An electronic component mounting board is mounted with electronic components, wiring members connecting the electronic components, and an external connection part for connecting lead wires to supply electricity to the electronic components or to input / output signals between the electronic components and the wiring members. The external connection part is formed by attaching an inner connection part that connects to the wiring member, an outer connection part that connects to the inner connection part and connects the lead wires, and a frame part having a through hole larger than the area of ​​the inner connection part and the outer connection part to the electronic component mounting board. The surface of the front component mounting board of the external connection part, excluding the through hole of the frame part, is sealed with a film, so that the electronic components, the wiring members connecting the electronic components, and the area between the wiring members and the external connection part have high splash-proof performance.

[0018] Furthermore, in the external connection section, at least resin or rubber is filled into the through-hole of the frame of the external connection section, or a cap is attached, so that the lead wires that are connected to the film and pulled out to the outside can be sealed. As a result, high splash resistance can be achieved even in the external connection section. Therefore, high splash resistance can be achieved throughout the entire electronic component mounting board. [Brief explanation of the drawing]

[0019] [Figure 1] This is a plan view of an electronic component mounting substrate used in an embodiment of the present invention. [Figure 2] This is a magnified view of the area within the dashed line in Figure 1, showing the state before resin filling or cap attachment. [Figure 3] This is a plan view of an LED module (electronic component) used in an embodiment of the present invention. [Figure 4] It is a perspective view of an external connection portion of an electronic component mounting substrate used in the first embodiment of the present invention, showing a state before resin filling. [Figure 5] It is a perspective view of an external connection portion of an electronic component mounting substrate used in the second embodiment of the present invention before cap attachment. [Figure 6] (a) is a cross-sectional view from the A direction at the center of the external connection portion after cap attachment in FIG. 5, and (b) is a cross-sectional view from the B direction at the center of the external connection portion after cap attachment. [Figure 7] It is a plan view of a substrate after a decorative molding process of a conventional electronic component mounting substrate (Patent Document 1). [Figure 8] It is a plan view of a substrate after a wiring portion exposure process of a conventional electronic component mounting substrate (Patent Document 1).

Embodiments for Carrying Out the Invention

[0020] The electronic component mounting substrate 1 used in the embodiment of the present invention is used for light-emitting diode (LED) lighting used in advertising billboards, road signs, etc. Further, the electronic component mounted on the electronic component mounting substrate used in the embodiment of the present invention is an LED module 20 in which an LED 21 shown in FIG. 3 is covered with a lens 22.

[0021] In the embodiment of the present invention, the electronic component mounting substrate common to the first embodiment and the second embodiment will be described based on FIGS. 1 to 4. Note that the dimensions of the electronic component mounting substrate 1 and the LED module 20, the number of LED modules 20, the arrangement of the LED module 20 and the external connection portion 4, the path of the wiring member 3, the shape of the external connection portion 4, etc. described below are examples, and are appropriately changed according to the specifications of the applicable object, etc.

[0022] The LED 21 of the LED module 20 is made of, for example, a GaN (gallium nitride) compound semiconductor and emits blue light. A fluorescent resin (not shown), for example, a silicon resin or epoxy resin, is mixed with a substance that emits yellow light when excited by the blue light emitted from the LED 21, and this mixture is filled into the space surrounded by the reflector, thereby producing white light as a mixture of blue and yellow light.

[0023] In addition to the above, for white light, a combination of one or more phosphors with an LED having a peak emission wavelength in the blue, violet, or ultraviolet region may also be used.

[0024] Furthermore, the LED 21 is covered by a lens 22. The lens 22 is dome-shaped, but has a bullet-shaped space between it and the LED 21, and a recess 23 is formed on the axis of the LED 21. This shape of the lens 22 efficiently guides the light emitted from the LED 21 laterally, suppresses the luminous intensity on the axis of the LED 21, and achieves a uniform light emission state over a wide area.

[0025] The LED module 20 is rectangular, approximately 27 mm in height and 43 mm in width, with positive and negative terminals formed at the upper end in Figure 3. In this embodiment, crimp terminals 8 were used. The crimp terminals 8 consist of two parallel plates with grooves formed therein, and the lead wires can be fixed in place without stripping the insulation of the wires by physically pressing them into the grooves. Since no wire termination is required, work time can be reduced and the process is less dependent on the worker's skill. In addition, it prevents connection failures that can occur with soldering and eliminates concerns about thermal load on the LEDs during soldering.

[0026] As shown in Figure 1, the electronic component mounting board 1 consists of a rectangular aluminum plate with a white insulating film attached to it. The dimensions of the electronic component mounting board 1 are 300 mm square. The insulating film is white because the light emitted from the LED module 20 is white.

[0027] As shown in Figure 1, a total of five LED modules 20 are attached to the electronic component mounting board 1 at the four corners and in the center using double-sided tape. In addition, vinyl wire is used as the wiring member 3, and after cutting the vinyl wire to a predetermined length, both ends of the vinyl wire are used to crimp the crimp terminals 8 of each LED module 20 using a crimping tool to electrically connect the LED modules 20 and the wiring member 3.

[0028] As shown in Figure 1, an external connection section 4 for connecting lead wires 6 to supply power to the LED module 20 from an external source is formed approximately in the lower center of the electronic component mounting board 1.

[0029] As shown in Figure 2, the external connection portion 4 has two internal connection portions 41 (positive and negative sides) that electrically connect to the wiring member 3, and an external connection portion 42 for connecting the power supply source and the electronic component mounting board 1 with lead wires 6. The positive sides of the internal connection portions 41 and the external connection portions 42 are also connected to each other, and the negative sides are also connected to each other. In this embodiment, a plate-shaped member 48 on which the internal connection portions 41 and the external connection portions 42 are formed is attached to the electronic component mounting board 1 with double-sided tape. The internal connection portions 41 and the external connection portions 42 may also be formed on the electronic component mounting board 1.

[0030] In the external connection section 4, a resin frame section 43 having a through hole 44 larger than the area of ​​the inner connecting section 41 and the outer connecting section 42 is attached to the electronic component mounting substrate 1 with double-sided tape. The through hole 44 is sized to accommodate the plate-shaped member 48. Therefore, when the frame section 43 is attached, the inner connecting section 41 and the outer connecting section 42 are exposed within the through hole 44.

[0031] As shown in Figures 2 and 4, the frame portion 43 is cylindrical and has a two-stage structure with a wider cylindrical width on the side facing the electronic component mounting substrate 1. Furthermore, the side opposite to the electronic component mounting substrate 1 (the surface side) is formed to have a wider inner diameter.

[0032] Furthermore, a communication portion 45 having approximately the same thickness (height) as the wiring member 3 is formed on the electronic component mounting substrate 1 side of the frame portion 43, and a surface groove portion 47 is formed on the surface side of the frame portion 43 at a position approximately 180° from the communication portion 45.

[0033] The communication portion 45 is formed to connect the wiring member 3 and the inner connecting portion 41. The surface groove portion 47 is formed to reduce the height of the lead wire 6 from the electronic component mounting substrate 1 when the outer connecting portion 42 and the lead wire 6 are connected, thereby preventing the lateral light (parallel to the surface of the electronic component mounting substrate 1) from the LED module 20 from being blocked.

[0034] Next, the sealing of the electronic component mounting board 1 and the connection of the lead wires 6 will be described. After fixing the LED module 20 and the plate-shaped member 48 of the external connection part 4 to the electronic component mounting board 1 using double-sided tape, vinyl wire is used as the wiring member 3. After cutting the vinyl wire to a predetermined length, both ends of the vinyl wire are connected to the crimp terminals 8 of each LED module 20 by using a crimping tool. At this stage, the external connection part 4 and the LED module 20 are not connected.

[0035] A wiring member 3 of a predetermined length is prepared for use in connecting the external connection part 4 and the LED module 20. After exposing the copper wire at one end of the wiring member 3, the copper wire is connected to the inner connecting part 41 of the external connection part 4 by soldering.

[0036] The wiring member 3 connected to the inner connecting part 41 is inserted into the communication part 45 of the external connecting part 4, and the frame part 43 of the external connecting part 4 is fixed to the electronic component mounting board 1 in a predetermined position using double-sided tape.

[0037] The end of the wiring member 3, which is connected to the inner connecting portion 41 of the external connection portion 4, is attached to the crimp terminal 8 of the LED module 20. This electrically connects the inner connecting portion 41 of the external connection portion 4 to all of the LED modules 20.

[0038] The film 5 and the electronic component mounting substrate 1 are adhered as follows: A transparent film 5 is placed on the surface of the electronic component mounting substrate 1 where the LED module 20, wiring member 3, and external connection part 4 are located, and the film 5 is heated to soften it. A vacuum is created between the electronic component mounting substrate 1 and the film 5 to create a pressure difference on both sides of the film 5. The electronic component mounting substrate 1 is pushed upward, and at the same time, pressure is applied to the side of the film 5 opposite to the electronic component mounting substrate 1 to adhere the film 5 to the electronic component mounting substrate 1. After that, the film 5 on the side of the electronic component mounting substrate 1 opposite to the surface where the LED module 20, wiring member 3, and external connection part 4 are located is trimmed, completing the adhesion of the film 5 to the electronic component mounting substrate 1.

[0039] Film 5 can be made from hot-melt films such as EVA (ethylene vinyl acetate copolymer), PO (polyolefin), PES (polyester), ACR (polyacrylic), PUR (polyurethane), nylon, or polyvinyl chloride.

[0040] At this stage, the LED module 20, wiring member 3, and external connection part 4 are firmly fixed onto the electronic component mounting board 1 by the film 5. This prevents malfunctions such as disconnection or variations in brightness that may occur due to movement or detachment from the position on the electronic component mounting board 1 due to vibrations during work or after installation when used in advertising signs, road signs, etc., or due to changes in temperature and humidity.

[0041] Furthermore, since the LED module 20, wiring member 3, and external connection part 4 are in close contact with the electronic component mounting board 1 by the film 5, when fixing the wiring member 3 and external connection part 4 to the electronic component mounting board 1, it is sufficient to use a weak fixation that prevents them from moving or falling off from their positions on the electronic component mounting board 1 until the film 5 is attached.

[0042] Subsequently, the film 5 in the through hole 44 of the external connection part 4 is cut away with a utility knife or the like, exposing the inner connecting part 41 and the outer connecting part 42 inside the through hole 44 of the external connection part 4. At this time, the front end portion on the surface side of the cylindrical frame part 43 and the film 5 are sealed.

[0043] Prepare lead wires 6 for connecting to an electrical power source (not shown) or another electronic component mounting board. After exposing the copper wire at one end of the lead wires 6, connect the copper wire to the outer connecting portion 42 of the external connection portion 4 by soldering. Then, route the lead wires 6 along the surface groove portion 47. This creates an electronic component mounting board 1 on which the LED module 20, the wiring member 3 connecting the LED modules 20, the wiring member 3, and the external connection portion 4 for connecting the lead wires 6 for supplying power to the LED modules 20 are mounted.

[0044] Although the connection between the wiring component 3 and the inner connecting portion 41, and between the lead wire 6 and the outer connecting portion 42 were made by soldering, they may also be connected using crimp terminals, similar to the LED module 20.

[0045] (First embodiment) In the process described above, the inner connecting portion 41 and the outer connecting portion 42 within the through hole 44 of the external connecting portion 4 are exposed, and the surface end portion of the cylindrical frame portion 43 and the film 5 are sealed. However, because the adhesive area is small, there is a possibility that it may peel off due to vibrations during work or after installation, or due to changes in temperature and humidity.

[0046] In this first embodiment, resin 70 is filled into the through hole 44 of the external connection part 4, thereby covering the inner connecting part 41 and the outer connecting part 42 within the through hole 44, as well as the cut end of the film 5 (Figure 1). As a result, high splash-proof performance can be achieved throughout the entire electronic component mounting substrate 1, including the external connection part 4.

[0047] The resin 70 used for filling is not particularly limited as long as it has properties that prevent cracking in the environment of advertising signs and road signs; for example, silicone, urethane, epoxy resin, etc., can be used. The resin 70 used for filling may be transparent, but since the light emitted from the LED module 20 is white, it is desirable to mix in a white additive. Rubber may also be used for filling.

[0048] (Second embodiment) A second embodiment of the present invention will be described with reference to Figures 5 and 6. Figure 5 is a perspective view of the external connection portion 4 of the electronic component mounting substrate 1 used in the second embodiment of the present invention before the cap 71 is attached. Figure 6(a) is a cross-sectional view from direction A of the central part of the external connection portion 4 after the cap 71 is attached in Figure 5, and (b) is a cross-sectional view from direction B of the central part of the external connection portion 4 after the cap 71 is attached.

[0049] The difference from the first embodiment described above is that in this second embodiment, as shown in Figure 5, a cap 71 is used, and the surface side of the cylindrical frame portion 43 is covered by attaching the cap 71. In addition, in this second embodiment, the surface side of the cap 71 and the cylindrical frame portion 43 are also bonded together.

[0050] As shown in Figures 5 and 6, the shape of the cap 71 on the external connection portion 4 side matches the surface shape of the frame portion 43 of the external connection portion 4. The cap 71 has a frame joint portion 72 for bonding with the frame portion 43 of the external connection portion 4, and a guide portion 73 that abuts against or is close to the through hole 44 of the frame portion 43. In addition, a cap groove portion 74 for the lead wire 6 is formed in the frame joint portion 72. The cap 71 can be manufactured by molding using, for example, a resin such as silicone, urethane, or epoxy resin, or rubber.

[0051] In this second embodiment, the outer connecting portion 42 of the external connection portion 4 and the copper wire are connected by soldering. Then, after aligning the lead wire 6 along the surface groove portion 47, the guide portion 73 of the cap 71 is inserted into the through hole 44 of the frame portion 43, thereby placing the cap 71 over the frame portion 43 of the external connection portion 4 and covering the frame portion 43 including the through hole 44. Adhesive is then filled between the frame portion 43 and the cap 71, and between the frame portion 43, the lead wire 6, and the cap 71. As a result, high splash resistance can be achieved throughout the entire electronic component mounting substrate 1, including the external connection portion 4.

[0052] In addition, the cap 71 may be attached after the resin filling in the first embodiment, so that the resin 70, the inner connecting portion 41 and the outer connecting portion 42 in the through hole 44, and the cut end of the film 5 are covered by the cap 71.

[0053] Incidentally, LED lighting used in advertising signs and road signs uses LED modules connected in a daisy-chain fashion with wires. However, to account for differences in specifications, general-purpose products are made with longer wire lengths. Therefore, after attaching the LED modules to the LED lighting base (aluminum composite panel, corresponding to the electronic component mounting substrate 1 of this invention) using silicone sealant, it is necessary to deal with the excess wires.

[0054] The excess wire is typically secured with a wiring fastener called a wire sticker, and if necessary, this section is also sealed with silicone sealant. As a result, the excess wire becomes wasted material (resource). Furthermore, the treated portion of the excess wire acts as a light barrier within the LED lighting, causing uneven lighting as the shielded wire portion is reflected on the LED light-emitting surface.

[0055] Therefore, the present invention makes it possible to prevent the generation of excess wires and to prevent the occurrence of uneven lighting caused by light shielding due to excess wires.

[0056] In carrying out the present invention, the invention is not limited to the embodiments described above, and various modifications are possible as long as they do not depart from the purpose of the invention.

[0057] Although the above embodiment describes the connection to a lead wire 6 connected to a power supply, it can also be applied to the connection to a number of lead wires for inputting and outputting signals to control the light emission of the LED module 20.

[0058] The above embodiment describes an electronic component mounting substrate 1 used for LED lighting in advertising signs and road signs, but it can also be applied to semiconductor circuit boards that are not light-emitting elements, for example. [Explanation of Symbols]

[0059] 1. Electronic component mounting board 2 Electronic components 3 Wiring components 4. External connection section 5 Film 6 Lead wires 8. Crimp terminals 20 LED modules 41 Inner connecting section 42 Outer connection part 43 Frame section 44 Through holes 48 Plate-shaped member 70 resin 71 Cap

Claims

1. An electronic component mounting board having electronic components, wiring members connecting the electronic components, and external connection parts for connecting lead wires for supplying electricity between the wiring members and the electronic components, or for inputting and outputting signals between the electronic components and the wiring members, The external connection portion comprises an inner connection portion that connects to the wiring member, and an outer connection portion that connects to the inner connection portion and connects to the lead wire. The inner connecting portion and the frame portion having a through hole larger than the area of ​​the outer connecting portion are attached to the electronic component mounting substrate to form the structure. The surface of the electronic component mounting substrate, excluding the through-holes in the frame portion of the external connection portion, is sealed with a film. An electronic component mounting substrate characterized in that the through-holes in the frame portion of the external connection portion are filled with at least resin or rubber, or fitted with caps.

2. The aforementioned electronic component includes an LED module in which at least a light-emitting diode (LED) is covered by a lens. The aforementioned film is a transparent resin film, The electronic component mounting board according to claim 1, wherein the height of the frame portion of the external connection portion is greater than the height of the wiring member and less than the height of the LED module.

3. The electronic component mounting board according to claim 2, wherein the wiring member is a lead wire, and the lead wire is attached to a crimp terminal provided on the LED module.

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