Method of treating the substrate

Abstract

To provide an adherend treatment method and an adherend treatment device capable of preventing prescribed treatment from reaching an untreated region of an adherend as much as possible.SOLUTION: An adherend treatment device EA that performs a predetermined process on an adherend WK, includes sheet pasting means 10 that sets a predetermined region on the adherend WK as an untreated region WK1 and pastes an adhesive sheet AS on the untreated region WK1 so as not to be subjected to a predetermined treatment, and treatment means 30 that performs predetermined treatment on the adherend WK. The adhesive sheet AS is capable of being cured by a predetermined energy UV, and the adhesive sheet AS is capable of being cured by the predetermined energy UV. The adhesive sheet AS is further provided with energy applying means 20 that applies the predetermined energy UV to the adhesive sheet AS to cure the adhesive sheet AS.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for treating an adherend. to

Background Art

[0002] There is known a method for treating an adherend in which a predetermined region of the adherend is set as an untreated region, an adhesive sheet is attached so that a predetermined treatment does not reach the untreated region, and a predetermined treatment is performed on the adherend (see, for example, Patent Document 1). direction The patent document is JP 2016-115868 A.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the method for manufacturing a semiconductor device (adherend treatment method) described in Patent Document 1, when the outer peripheral portion of the semiconductor substrate 1010 (adherend) is set as an untreated region and the film 1100 (adhesive sheet) is attached to the untreated region so that the plating treatment (predetermined treatment) does not reach it, if the adhesive sheet is forcibly deformed and attached in accordance with the planar shape, uneven shape, etc. of the untreated region, the outer edge portion of the adhesive sheet will lift due to its own residual stress, and this lifting will cause a problem that the predetermined treatment reaches the untreated region.

[0005] An object of the present invention is to provide a method for treating an adherend that can prevent a predetermined treatment from reaching the untreated region of the adherend as much as possible. of

Means for Solving the Problems

[0006] The present invention employs the configuration described in the claims.

Effects of the Invention

[0007] According to the present invention, an adhesive sheet that can be cured by a predetermined energy is used, and the adhesive sheet is cured, thereby suppressing the formation of lifted portions on the outer edge of the adhesive sheet and ensuring that the predetermined treatment does not extend to untreated areas of the adherend as much as possible. [Brief explanation of the drawing]

[0008] [Figure 1] An explanatory diagram of an adhesive processing apparatus according to one embodiment of the present invention and an explanatory diagram of the operation of the apparatus. [Figure 2] Operational diagram of the adherend processing device. [Modes for carrying out the invention]

[0009] One embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the X, Y, and Z axes are orthogonal to each other. The X and Y axes are axes within a predetermined plane, and the Z axis is an axis perpendicular to the predetermined plane. Furthermore, in this embodiment, when viewing from the direction of arrow DR parallel to the Y axis, and directions are indicated without specifying a figure, "up" is the direction of the Z axis arrow and "down" is the opposite direction, "left" is the direction of the X axis arrow and "right" is the opposite direction, and "front" is the direction towards the viewer in Figure 1 parallel to the Y axis and "back" is the opposite direction.

[0010] The present invention relates to an apparatus for performing a plating treatment on an adherend WK, comprising: a sheet application means 10 that performs a sheet application process in which an adhesive sheet AS is applied to an untreated area WK1, which is defined as a predetermined area of ​​the adherend WK, so as not to be treated; an energy application means 20 that performs an energy application process in which ultraviolet UV (see Figure 2(C)) as a predetermined energy is applied to the adhesive sheet AS applied to the adherend WK to cure the adhesive sheet AS; and a plating treatment The system includes a processing means 30 that performs a processing step to apply a treatment, a dividing means 40 that performs a dividing step to form a cut CU (see Figure 2(A)) as a separation line in the plated workpiece WK and divide the workpiece WK into a first workpiece portion WKA (see Figure 2(B)) including an untreated area WK1 and a second workpiece portion WKB other than the first workpiece portion WKA, and an untreated area removal means 50 that performs an untreated area removal step to remove the first workpiece portion WKA from the workpiece WK, and is located near a transport means 60 that performs a transport step to transport the workpiece WK. Furthermore, the adhesive sheet AS is prepared in a way that allows it to be cured by ultraviolet UV energy as a predetermined energy source during the adhesive sheet preparation process, and is also deformable by heat (hot air HA) as a predetermined second energy source. Furthermore, as shown in the figure labeled AA in Figure 1(A), the adherend WK of this embodiment comprises one surface WK2 and the other surface WK3, and has a circular shape centered on a reference position WKR. The other surface WK3 is provided with an annular protrusion CV, and the outer edge where the annular protrusion CV is provided is designated as the untreated area WK1. Furthermore, in this embodiment, the adherend WK has a cover sheet CS attached to the other side WK3, which includes the annular protrusion CV.

[0011] The sheet application means 10 includes a base plate 11 that directly or indirectly supports the components constituting the sheet application means 10, a support roller 12 that supports the raw material RS on which the adhesive sheet AS is temporarily attached to a strip-shaped release sheet RL, a guide roller 13 that guides the raw material RS, a release plate 14 as a release means that folds the release sheet RL at the release edge 14A and peels the adhesive sheet AS from the release sheet RL, a pressing roller 15 as a pressing means that presses and applies the adhesive sheet AS to the adherend WK, and a pinch roller 16B supported on the output shaft (not shown) of a rotating motor 16A as a drive device. The device includes a drive roller 16 that grips the release sheet RL between itself and the pinch roller 16B, a recovery roller 17 supported by the output shaft of a drive device (not shown) that constantly applies a predetermined tension to the release sheet RL between itself and the pinch roller 16B while the adherend processing device EA is in automatic operation, and recovers the release sheet RL, a deformation means 18 that deforms the adhesive sheet AS attached to the adherend WK and attaches the adhesive sheet AS to the unprocessed area WK1, and a pair of upper and lower re-pressing rollers 19 that re-press the adhesive sheet AS against one surface WK2 and the other surface WK3 of the adherend WK. The deformation means 18 includes a linear motor 18A as a drive device, a heating device 18C such as a coil heater or the heating side of a heat pipe supported on its output shaft 18B which heats a gas such as air or gas to generate hot air HA as a second energy source, and a blower 18D which blows the hot air HA generated by the heating device 18C from an exhaust port 18E, and is configured to attach an adhesive sheet AS to the untreated area WK1 including the protrusion CV.

[0012] The energy supply means 20 includes a pair of upper and lower energy supply devices 21 having energy generating devices 21A such as light-emitting diodes or mercury lamps that can emit ultraviolet UV light.

[0013] The processing means 30 comprises a so-called articulated robot 31 as a drive device, which is a displacement means that is composed of multiple arms and can displace what is supported by the tip arm 31A, which is the work part, to any position and angle within its working range; a transport arm 32 to which the tip arm 31A can be connected is provided with a first support member 32A; a contact member 33 made of an elastic material such as rubber or resin is supported by the transport arm 32; a rotary motor 34 (holding means) as a drive device supported by the transport arm 32; a chuck jaw 35 supported on its output shaft 34A; a storage member 37 supported by the slider 36A of a linear motor 36 as a drive device and capable of accommodating the object to be deposited WK; and a plating tank 38 for storing an aqueous plating solution 38A. The linear motor 36 is configured to lower the storage member 37, which is initially positioned above the aqueous plating solution 38A stored in the plating tank 38, and immerse what is contained in the storage member 37 in the aqueous plating solution 38A.

[0014] The sorting means 40 includes a multi-joint robot 31 as a drive device which is a displacement means shared with the processing means 30, a cutting arm 41 to which a second support member 41A to which an end arm 31A can be connected is provided, a cutting blade 42 as a cutting means supported by the cutting arm 41 and capable of forming a cut CU in the workpiece WK, a base 43 with a relief groove 43B for a chuck jaw 35 formed on its upper surface 43A, and a circular mounting base 44 having a holding surface 44A formed on its upper surface 43A that can be held by suction using a depressurizing means (holding means) not shown, such as a depressurizing pump or a vacuum ejector, and an annular groove 44B formed on the holding surface 44A. In this embodiment, the dividing means 40 is configured to form a cut CU such that a portion of the adhesive sheet AS is attached to the second adherend portion WKB.

[0015] The unprocessed area removal means 50 includes a multi-joint robot 31 as a drive device which is a displacement means shared with the processing means 30 and the sorting means 40, a transport arm 32 shared with the processing means 30, a contact member 33, a rotating motor 34, and a chuck jaw 35.

[0016] The transport means 60 comprises a linear motor 61 as a drive device, a rotary motor 62 as a drive device supported by its slider 61A, and a support table 63 supported by its output shaft 62A, which has a holding surface 63A capable of being held by a pressure reducing means (holding means) not shown, such as a pressure reducing pump or a vacuum ejector. The support table 63 is configured to rotate by the rotary motor 62 around the rotation center 62R of the rotary motor 62.

[0017] The operation of the adherend processing device EA described above will now be explained. First, the user of the adherend processing device EA (hereinafter simply referred to as "user") sets the raw material RS as shown in the figure, with each component positioned in the initial position shown by the solid line in Figure 1(A). Then, a signal to start automatic operation is input via an operating means (not shown), such as an operation panel or a personal computer. The sheet application means 10 then drives the rotary motor 16A to feed out the raw material RS, and when the leading end of the adhesive sheet AS in the feeding direction is peeled off by a predetermined length from the peeling edge 14A of the release plate 14, as shown by the solid line in Figure 1(A), the driving of the rotary motor 16A is stopped. Next, the user or a transport means (not shown), such as an articulated robot or a belt conveyor, places the adherend WK on the holding surface 63A so that the reference position WKR coincides with the rotation center 62R of the rotary motor 62, as shown in Figure 1(A). The transport means 60 then drives a depressurization means (not shown) to start suction holding on the holding surface 63A.

[0018] Thereafter, the conveying means 60 drives the linear motor 61 to move the support table 62 to the left. When the adherent WK reaches the position marked with reference numeral CC in Fig. 1(A), the driving of the linear motor 61 is stopped. At this time, the rear outer edge of the adherent WK abuts against the outer edge of the pressing roller 15, and the front outer edge portion is sandwiched by a pair of re-pressing rollers 19 as shown in Fig. 1(B). Further, as shown in Fig. 2(C), the outer edge portion is disposed between a pair of energy applying devices 21. Next, the sheet attaching means 10 drives the direct-acting motor 18A. As shown by the two-dot chain line in Fig. 1(A), after approaching the blower device 18D to the outer edge of the adherent WK, the heating device 18C and the blower device 18D are driven to start blowing hot air HA from the exhaust port 18E. At the same time, the energy applying means 20 drives the energy generating device 21A to emit ultraviolet rays UV.

[0019] Then, the conveying means 60 drives the rotating motor 62 to rotate the support table 62 in the counterclockwise rotation direction RD, and the sheet attaching means 10 drives the rotating motor 16A to feed out the base material RS in accordance with the rotation speed of the outer edge of the adherent WK. As a result, the adhesive sheet AS is peeled off from the release sheet RL, and the adhesive sheet AS peeled off from the release sheet RL is pressed against the outer edge of the adherent WK by the pressing roller 15 as shown by the two-dot chain line in Fig. 1(A), and is attached to the outer edge of the adherent WK in a state where an overhanging region ASH is formed as shown in Fig. 1(B). Next, when the adhesive sheet AS attached to the outer edge of the adherent WK passes in front of the exhaust port 18E, the adhesive sheet AS is heated by the hot air HA, and as shown by the two-dot chain line in Fig. 1(B), the overhanging region ASH is deformed and adheres to the non-treatment region WK1. Thereafter, when the overhanging region ASH adhered to the non-treatment region WK1 passes between the re-pressing rollers 19, the overhanging region ASH is pressed by the re-pressing rollers 19 and is pressure-bonded to the non-treatment region WK1.

[0020] Next, when the adhesive sheet AS pressed against the adherent WK by the re-pressing roller 19 passes between the energy applying devices 21, as shown in Fig. 2(C), the adhesive sheet AS is irradiated with ultraviolet rays UV, and the adhesive sheet AS irradiated with ultraviolet rays UV is cured. As a result, even if the outer edge portion of the adhesive sheet AS tries to lift due to its own residual stress, it cannot lift due to curing. Then, after the rotation of the adherent WK in the counterclockwise rotation direction RD exceeds one rotation and the trailing end portion in the feeding direction of the leading adhesive sheet AS is adhered so as to overlap the leading end portion in the feeding direction of the same adhesive sheet AS, when the leading end portion in the feeding direction of the next adhesive sheet AS following the leading adhesive sheet AS is peeled off by a predetermined length at the peeling edge 14A of the peeling plate 14, the sheet attaching means 10 stops driving the rotation motor 16A. Next, when the trailing end portion in the feeding direction of the adhesive sheet AS passes in front of the exhaust port 18E and the trailing end portion in the feeding direction adheres to the leading end portion in the feeding direction of the same adhesive sheet AS to form an integral object UP, the sheet attaching means 10 stops driving the heating device 18C and the blower device 18D, and then drives the linear motion motor 18A to return the blower device 18D to the initial position. Thereafter, when the trailing end portion in the feeding direction of the adhesive sheet AS passes between the re-pressing rollers 19 and between the energy applying devices 21, the conveying means 60 stops driving the rotation motor 62.

[0021] Next, the transport means 60 drives the linear motor 61 to move the support table 62 to the left, and when the integrated object UP reaches the position indicated by the numeral DD in Figure 1(A), the drive of the linear motor 61 is stopped, followed by the drive of the depressurization means (not shown), and the suction holding on the holding surface 63A is released. Then, the processing means 30 drives the articulated robot 31, connects the tip arm 31A to the first support member 32A to support the transport arm 32, and after bringing the contact member 33 into contact with the upper surface of the integrated object UP, the rotation motor 34 is driven to grip the integrated object UP with the chuck jaws 35 and the contact member 33 (see Figure 2(B)). Next, the processing means 30 drives the articulated robot 31 and, as shown by the dashed line in Figure 1(A), houses the integrated object UP inside the housing member 37. Then, the rotating motor 34 is driven to release the grip of the integrated object UP between the chuck jaws 35 and the contact member 33, and the articulated robot 31 is driven to retract the transport arm 32 from the housing member 37. After that, the processing means 30 drives the linear motor 36 to lower the housing member 37 and immerse the integrated object UP in the plating aqueous solution 38A, thereby plating the integrated object UP.

[0022] Once the plating of the integrated object UP is complete, the processing means 30 drives the linear motor 36 to return the housing member 37 to its initial position, and then the processing means 30 grips the integrated object UP with the chuck jaws 35 and the contact member 33 in the same operation as described above. Next, the processing means 30 drives the articulated robot 31 and places the integrated object UP on the holding surface 44A so that the reference position WKR coincides with the center 44R of the mounting table 44 (see Figure 2(B)), and the dividing means 40 drives a depressurization means (not shown) to start suction holding on the holding surface 44A. Then, the processing means 30 drives the rotary motor 34 to release the grip of the integrated object UP between the chuck jaws 35 and the contact member 33, and then drives the articulated robot 31 to return the transport arm 32 to its initial position.

[0023] Next, the sorting means 40 drives the articulated robot 31, connecting the tip arm 31A to the second support member 41A to support the cutting arm 41, and as shown in Figure 2(A), inserting the cutting blade 42 into the integral object UP through the adhesive sheet AS, and inserting its tip into the groove 44B. After that, the sorting means 40 drives the articulated robot 31, rotating the cutting blade 42 one or more times around the center 44R of the mounting table 44 to form an annular cut CU, and after dividing the integral object into a first adherend portion WKA including the unprocessed area WK1 to which the adhesive sheet AS is attached, and a second adherend portion WKB to which a part of the adhesive sheet AS is attached to the outer edge, the cutting arm 41 is returned to its initial position. Furthermore, by creating a second adherend portion WKB with a portion of the adhesive sheet AS attached to its outer edge in this manner, even if the adherend WK is made of a brittle material, it is possible to prevent damage to the outer edge of the second adherend portion WKB or the inner edge of the first adherend portion WKA when the cut CU is formed. Moreover, even if the outer edge of the second adherend portion WKB or the inner edge of the first adherend portion WKA is damaged when the cut CU is formed, it is possible to prevent the fragments formed by the damage from scattering into the surrounding area.

[0024] Next, the non-processing area removal means 50 drives the articulated robot 31, connecting the tip arm 31A to the first support member 32A to support the transport arm 32, and as shown in Figure 2(B), after bringing the contact member 33 into contact with the upper surface of the first adherend portion WKA, it drives the rotation motor 34 to grip the first adherend portion WKA with the chuck jaws 35 and the contact member 33. Then, the non-processing area removal means 50 drives the articulated robot 31 to transport the first adherend portion WKA to a recovery area (not shown), and then returns the arms of the transport arm 32 and the articulated robot 31 to their initial positions. Subsequently, the sorting means 40 stops driving the depressurization means (not shown) and releases the suction holding on the holding surface 44A, at which point the user or a transport means (not shown) transports the second adherend portion WKB to the next process, and the same operation as above is repeated thereafter.

[0025] According to the embodiments described above, since an adhesive sheet AS that can be cured by ultraviolet UV is used and the adhesive sheet AS is cured, the formation of lifted portions on the outer edge of the adhesive sheet AS is suppressed, and the plating treatment can be kept to a minimum from extending to the untreated area WK1 of the adherend WK.

[0026] The means and processes in this invention are not limited in any way as long as they can perform the operations, functions, or processes described for those means and processes, and are certainly not limited at all to the components or processes of a single embodiment shown above. For example, the processing means can be anything that can apply a predetermined treatment to the adherend, and is not limited in any way as long as it is within the scope of the common technical knowledge at the time of filing (the same applies to other means and processes).

[0027] The sheet application means 10 may either use a strip-shaped adhesive sheet base material in which a closed loop shape or a cut along the entire width direction is formed, thereby dispensing a roll RS in which a predetermined area partitioned by the cut is designated as an adhesive sheet AS, and peeling the adhesive sheet AS from the release sheet RL to apply it, or use a strip-shaped adhesive sheet base material in which a strip-shaped adhesive sheet base material is temporarily attached to a strip-shaped release sheet RL, and while dispensing the roll of adhesive sheet base material, a closed loop shape or a cut along the entire width direction is formed in the adhesive sheet base material with a cutting blade as a cutting means, and the area partitioned by the cut is The raw material RS, in which a predetermined area is made of adhesive sheet AS, may be fed out, and the adhesive sheet AS may be peeled off from the release sheet RL and attached; or the raw material RS, in which a strip-shaped adhesive sheet AS is temporarily attached to a strip-shaped release sheet RL, may be fed out, and the strip-shaped adhesive sheet AS may be peeled off from the release sheet RL and attached; or the raw material RS may be fed out without being wound, for example, in a fanfold fold; or a collection means may be employed to collect the release sheet RL without being wound, for example, by fanfold folding, shredding, or haphazardly accumulating it. Alternatively, a recovery means may not be employed, or an adhesive sheet AS that is not temporarily attached to the release sheet RL may be unfurled and the adhesive sheet AS may be attached to the adherend WK, or instead of the pressing roller 15, the adhesive sheet AS may be held by a holding member that is supported on the output shaft of a linear motor which is a drive device and a pressing means, and can be held by suction using a depressurizing means (holding means) not shown, such as a depressurizing pump or a vacuum ejector, and the adhesive sheet AS held by the holding member may be pressed and attached to the adherend WK, or the untreated area WK1 may be only on one side WK2, or only on the other side WK3 If this is done, the adhesive sheet AS may be attached to the adherend WK such that the overhanging region ASH extends only to one side WK2 or only to the other side WK3, or multiple adhesive sheets AS may be attached to the adherend WK, or a depressurization means that forms a reduced pressure atmosphere including a vacuum may be provided and the adhesive sheet AS may be attached to the untreated region WK1 in the reduced pressure atmosphere, or a repressing means that presses the adhesive sheet AS only to one side WK2 or a repressing means that presses it only to the other side WK3 may be employed, or a repressing means may or may not be provided. In the above embodiment, a sheet application means 10 was illustrated in which the adhesive sheet AS is deformed to match the shape of the untreated area WK1 (the shape of the outer edge of the adherend WK), and the adhesive sheet AS is applied to the untreated area WK1. However, the sheet application means 10 may also apply an adhesive sheet AS that has been pre-shaped to match the shape of the untreated area (for example, the shape of the outer edge of one side WK2 of the adherend WK, or the shape of the central part of the other side WK3 of the adherend WK, etc.) to the untreated area. The deformation means 18 may apply electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays, or gamma rays, or heat such as hot water or cold air, as a predetermined second energy to the adhesive sheet AS. Considering the characteristics, features, properties, material, composition, and structure of the adhesive sheet AS, any second energy that can deform the adhesive sheet AS is acceptable. The same energy may be used as the predetermined second energy and applied in one or more instances. Different energies may be used as the predetermined second energy and applied in one or more instances. The deformation means 18 does not need to move away from the adherend WK, may be positioned inside the support table 63, and may apply the predetermined second energy to the adhesive sheet AS from above, below, or obliquely. The adhesive sheet AS may be moved by itself without moving the adhesive sheet AS or while moving the adhesive sheet AS, or the adhesive sheet AS attached to the adherend WK may be given a predetermined second energy all at once, or the adhesive sheet AS may be provided with guiding means such as a guide shaft or roller that guides the overhang region ASH to deform in the direction of the unprocessed region WK1, or it may or may not be provided in the adherend processing apparatus EA of the present invention, or the adhesive sheet AS may be deformed until the overhang region ASH contacts the unprocessed region WK1, or the adhesive sheet AS may not be deformed until the overhang region ASH contacts the unprocessed region WK1, and if the overhang region ASH does not contact the unprocessed region WK1, the overhang region ASH may be brought into contact with the unprocessed region WK1 by the re-pressing means 18 or the pressing means of the other device. The sheet application means 10 may involve preparing an elastically deformable adhesive sheet AS in the adhesive sheet preparation process, applying tension to the adhesive sheet AS located between the pressing roller 15 and the release plate 14, and applying the adhesive sheet AS to the adherend WK, so that the excess region ASH bends and adheres to the untreated region WK1 due to the elastic restoring force inherent in the adhesive sheet AS.

[0028] The energy-applying means 20 may apply electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays, or gamma rays, or heat such as hot water or cold air, as predetermined energy to be applied to the adhesive sheet AS. Considering the characteristics, features, properties, material, composition, and structure of the adhesive sheet AS, any energy capable of curing the adhesive sheet AS is acceptable. The same energy may be designated as the predetermined energy and applied in one or more quantities. Different energies may be designated as the predetermined energy and applied in one or more quantities. The means may be configured to move in and out of the adherend WK. The means may be placed inside the support table 63. The means may apply the energy to the adhesive sheet AS from above, below, or obliquely. The system may provide S with a predetermined energy, or it may move itself without moving the adhesive sheet AS attached to the adherend WK, or while moving the adhesive sheet AS attached to the adherend WK, and provide a predetermined energy to the adhesive sheet AS attached to the adherend WK all at once, or it may be configured to include a depressurization means that forms a reduced pressure atmosphere including a vacuum, and provide a predetermined energy to the adhesive sheet AS attached to the adherend WK in the reduced pressure atmosphere to cure the adhesive sheet AS, or it may be configured to include a gas removal means that forms an inhibiting gas removal atmosphere from which gases that inhibit the curing of the adhesive sheet AS have been removed, and provide a predetermined energy to the adhesive sheet AS attached to the adherend WK in the gas removal atmosphere to cure the adhesive sheet AS.

[0029] The processing means 30 may be any processing equipment, such as those that perform electrolytic plating or electroless plating on the workpiece WK, or those that perform sandblasting, painting, etching, engraving, cutting, drilling, parts mounting, heating, cooling, etc. on the workpiece WK. Furthermore, the displacement means may be a separate component capable of performing the same operation as described above, without sharing it with at least one of the division means 40 and the non-processing area removal means 50. Similarly, the transport arm 32, contact member 33, rotating motor 34 and chuck jaws 35 may be a separate component capable of performing the same operation as described above, without sharing it with the non-processing area removal means 50. A storage member 37 capable of accommodating one or more integrated objects UP may be used, or a plating tank 38 (processing equipment) capable of plating (processing) one or more integrated objects UP simultaneously may be used.

[0030] The sorting means 40 may employ a displacement means capable of performing the same operation as described above with other members without sharing the displacement means with at least one of the processing means 30 and the unprocessed area removal means 50; the adherend WK may be moved without moving the cutting means or while moving it to form a notch CU in the adherend WK; the notch CU may be formed so that a part of the adhesive sheet AS is attached only to one side WK2 of the second adherend portion WKB; the notch CU may be formed so that a part of the adhesive sheet AS is attached only to the other side WK3 of the second adherend portion WKB; the notch CU may be formed so that a part of the adhesive sheet AS is not attached to the second adherend portion WKB; the notch CU may be formed along the outer edge of the adherend WK; the notch CU may be formed not along the outer edge of the adherend WK; and the adherend processing apparatus EA of the present invention may or may not be provided. In the present invention, a separation line includes not only a complete separation line in which a workpiece such as an adherend WK or an adhesive sheet AS is completely separated by a series of cuts that penetrate the workpiece, but also an incomplete separation line in which the workpiece is partially connected due to intermittent cuts that penetrate the workpiece, an incomplete separation line in which cuts that do not penetrate the workpiece are continuous or intermittent, an incomplete separation line in which weakened parts are continuously or intermittently formed by applying a laser, electromagnetic wave, heat, chemicals, chemical substances, etc., to the workpiece to alter its characteristics, properties, material, composition, structure, dimensions, etc., and the workpiece to be weakened, and an incomplete separation line in which at least two of the workpiece—cuts that penetrate the workpiece, cuts that do not penetrate the workpiece, and weakened parts—continue regularly or irregularly. Furthermore, since the incomplete separation lines described above can be transformed into complete separation lines by applying vibration, tension, light, heat, chemicals, etc., the substrate processing method and substrate processing apparatus EA of the present invention can employ a complete separation process and a complete separation apparatus that apply vibration, tension, light, heat, chemicals, etc. to transform the incomplete separation lines described above into complete separation lines.

[0031] The unprocessed area removal means 50 may employ a displacement means that can perform the same operation as described above using other components without sharing the displacement means with at least one of the processing means 30 and the division means 40, or it may employ a transport arm 32, contact member 33, rotating motor 34 and chuck jaws 35 that can perform the same operation as described above using other components without sharing them with the processing means 30, or the first adherend portion WKA may be removed from the mounting table 44 after the second adherend portion WKB has been transported to the next process, or it may or may not be provided in the adherend processing apparatus EA of the present invention.

[0032] The conveying means 60 may move the sheet application means 10 without moving the support table 63 or while moving it, and apply the adhesive sheet AS to the adherend WK, or it may or may not be provided in the adherend processing apparatus EA of the present invention.

[0033] The substrate treatment method and substrate treatment apparatus EA of the present invention may be any treatment method and apparatus, including not only a plating treatment method and plating apparatus for applying electrolytic plating or electroless plating to a substrate WK, but also a sandblasting method and sandblasting apparatus, a painting method and painting apparatus, an etching method and etching apparatus, an engraving method and engraving apparatus, a cutting method and cutting apparatus, a drilling method and drilling apparatus, a component mounting method and component mounting apparatus, a heating method and heating apparatus, a cooling method and cooling apparatus, etc.

[0034] In the adhesive sheet preparation process, an adhesive sheet AS that can be cured by electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays or gamma rays, or by predetermined energy such as hot water or cold air may be prepared. Alternatively, only the substrate constituting the adhesive sheet AS may be cured by predetermined energy. Alternatively, only the adhesive layer constituting the adhesive sheet AS may be cured by predetermined energy. Alternatively, both the substrate and adhesive layer constituting the adhesive sheet AS may be cured by predetermined energy. Alternatively, an adhesive sheet AS may be prepared in which a material that can be cured by predetermined energy is laminated on a substrate laminated on an adhesive layer. Alternatively, an adhesive sheet AS that can be cured by predetermined energy may be prepared by unwinding a base material in which a substrate is laminated on an adhesive layer using a sheet application means 10, and laminating a material that can be cured by predetermined energy onto the base material during the unwinding process. Alternatively, an adhesive sheet AS that hardens with shrinkage, hardens with expansion, or hardens without shrinkage or expansion may be prepared by predetermined energy. In the adhesive sheet preparation process, when preparing an adhesive sheet AS that can be deformed by a predetermined second energy, an adhesive sheet AS that can be deformed by electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays or gamma rays, or by a predetermined second energy such as hot water or cold air may be prepared, or only the substrate constituting the adhesive sheet AS can be deformed by a predetermined second energy, or only the adhesive layer constituting the adhesive sheet AS can be deformed by a predetermined second energy, or both the substrate and adhesive layer constituting the adhesive sheet AS can be deformed by a predetermined second energy, or a substrate laminated on the adhesive layer may be prepared An adhesive sheet AS may be prepared by laminating a material that deforms with a second energy, or an adhesive sheet AS that can be deformed with a predetermined second energy may be prepared by unwinding a base material in which a substrate is laminated on an adhesive layer with a sheet bonding means 10, and laminating a material that deforms with a predetermined second energy on the substrate during the unwinding of the base material, or an adhesive sheet AS that deforms with contraction, deforms with expansion, or deforms without contraction or expansion with a predetermined second energy, or an adhesive sheet AS that undergoes different deformations with different predetermined second energies. In addition, during the adhesive sheet preparation process, an adhesive sheet AS may be prepared that can be cured by a predetermined energy and does not deform by a predetermined second energy. The adherend WK may not have an annular protrusion CV on its outer edge, or the cover sheet CS may be attached to the other surface WK3 that does not have an annular protrusion CV, or the cover sheet CS may be attached to at least one of the two surfaces WK2 and WK3, or the cover sheet CS may not be attached to both the two surfaces WK2 and WK3. The untreated area WK1 may be the outer edge or other area of ​​the adherend WK, or a part of the outer edge or other area of ​​the adherend WK. For example, it may be just the outer edge of one side WK2 of the adherend WK, or just the outer edge of the other side WK3 of the adherend WK, or just the central part of one side WK2 of the adherend WK, or just the central part of the other side WK3 of the adherend WK, or anywhere else. It may also be an area that includes a recess, or an area that does not include irregularities such as a convex portion CV or a recess, or any position that includes the outer edge or central part of one side WK2 or the other side WK3 of the adherend WK.

[0035] The material, type, shape, etc., of the adhesive sheet AS, cover sheet CS, and adherend WK in the present invention are not particularly limited. For example, the adhesive sheet AS, cover sheet CS, and adherend WK may be circular, elliptical, polygonal (such as triangle or square), or have other shapes. The adhesive sheet AS and cover sheet CS may also have adhesive properties such as pressure-sensitive or heat-sensitive adhesion. If a heat-sensitive adhesive sheet AS or cover sheet CS is used, it may be bonded by providing a suitable heating means, such as a suitable coil heater or the heating side of a heat pipe, to heat the adhesive sheet AS or cover sheet CS. Furthermore, such adhesive sheets AS and cover sheets CS can be any type, such as a single layer consisting only of an adhesive layer, a two-layer structure with a substrate and an adhesive layer laminated together, a three-layer or more-layer structure with one or more intermediate layers laminated between the substrate and the adhesive layer, a three-layer or more-layer structure with one or more cover layers laminated on the upper surface of the substrate, a structure in which the substrate, intermediate layer, or cover layer is peelably provided, a single-layer double-sided adhesive sheet consisting only of an adhesive layer, a double-sided adhesive sheet with adhesive layers laminated on both outermost surfaces of one or more intermediate layers, etc. Moreover, the adherend WK can be a single object such as food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disc, a glass plate, a steel plate, a ceramic, a wooden board, or a resin, or a composite object formed from two or more of these, and any form of component or article can also be targeted. Furthermore, adhesive sheet AS and cover sheet CS can be replaced with any sheet, film, tape, etc., such as information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc., based on their functional and practical applications.

[0036] The drive equipment in the above embodiment can be electric equipment such as rotary motors, linear motors, single-axis robots, articulated robots with two or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, or a combination of these directly or indirectly. In the above embodiment, if a rotating member such as a roller is used, a drive device for rotating the rotating member may be provided, the surface of the rotating member or the rotating member itself may be made of a deformable material such as rubber or resin, the surface of the rotating member or the rotating member itself may be made of a non-deformable material, other members such as rotating or non-rotating shafts or blades may be used instead of rollers, and if a means or member for pressing the object to be pressed, such as a pressing roller or pressing head, is used, in addition to the examples given above, a means of blowing gas such as air or gas may be used, in addition to rollers, round bars, blade materials, brush-like members, or a means of blowing gas may be used, and the pressing material may be made of a deformable material such as rubber, resin, or sponge, or it may be made of a non-deformable material such as metal or resin, and if a means or member for peeling the object to be peeled, such as a peeling plate or peeling roller, is used, in addition to the examples given above, In combination, plate-shaped members, round bars, rollers, and other members may be used, the material to be peeled off may be made of a deformable material such as rubber or resin, or a non-deformable material, and if a support (holding) means or support (holding) member or other means for supporting (holding) the supported member (held member) is used, a configuration in which the supported member is supported (held) by gripping means such as mechanical chucks or chuck cylinders, Coulomb force, adhesive (adhesive sheets, adhesive tapes), adhesive agents (adhesive sheets, adhesive tapes), magnetic force, Bernoulli adsorption, suction adsorption, drive equipment, etc. may be used, and if a cutting means or cutting member or other means for cutting the member to be cut or forming cuts or cutting lines in the member to be cut is used, instead of or in combination with the examples above, a cutter blade, laser cutter, ion beam, thermal power, heat, water pressure, electric heating wire, spraying of gas or liquid, etc. may be used, or the material to be cut may be moved by combining appropriate drive equipment to perform the cutting. [Explanation of Symbols]

[0037] EA... Adhesion Treatment Device 10…Method of attaching the sheet 20... Means of providing energy 30… Processing means 40...Dividing means AS...Adhesive sheet CU...cut (separation line) CV… Totsube UV... Ultraviolet light (specific energy level) WK...Adherent WK1... Unprocessed area WKA…first adherend part WKB…Second adherend part

Claims

[Claim 1] In a method for treating an adherend, in which a predetermined treatment is applied to the adherend, A sheet application step in which the outer edge of the adherend is designated as an untreated area, and an adhesive sheet is applied to the untreated area so as not to cover the central part of the adherend and so as not to extend the predetermined treatment to the untreated area, The process involves performing the predetermined treatment on the adherend, The adhesive sheet preparation step involves preparing an adhesive sheet that can be cured by a predetermined energy, A method for processing an adherend, characterized in that, prior to the processing step, an energy application step is further performed in which predetermined energy is applied to the adhesive sheet attached to the adherend to cure the adhesive sheet.

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