converter

Abstract

The converter includes a housing including an internal space, a printed circuit board disposed within the internal space, a first electronic component disposed on an upper surface of the printed circuit board, a second electronic component disposed on a lower surface of the printed circuit board, and a heat dissipation space disposed within the housing, wherein the first electronic component is disposed so as to overlap with the heat dissipation space in a first direction, and the second electronic component is disposed so as to overlap with the heat dissipation space in a second direction perpendicular to the first direction.

Description

Technical Field

[0001] This embodiment relates to a converter.

Background Art

[0002] As automotive electrical devices, engine electrical devices (starter, ignition, charging) and lighting devices are common. However, in recent years, as vehicles become more electronically controlled, most systems including chassis electrical devices tend to be electrified.

[0003] Various electrical components such as lamps, audio systems, heaters, and air conditioners installed in automobiles receive power supply from the battery when the vehicle stops and from the generator when the vehicle is running. At this time, the power generation capacity of the 14V power supply system with the normal power supply voltage is used.

[0004] In recent years, with the development of the information technology industry, various new technologies (such as motorized power steering, Internet, etc.) aimed at increasing the convenience of automobiles have been incorporated into vehicles, and it is expected that the development of new technologies that can make the most of the current automotive system will continue in the future.

[0005] Regardless of the software or hardware type, a hybrid electric vehicle (HEV) is equipped with a DC-DC converter (Low Voltage DC-DC Converter) for supplying the electrical load (12V). Also, the DC-DC converter that serves as the generator (alternator) of a general gasoline vehicle reduces the high voltage of the main battery (usually a high voltage battery of 144V or more) and supplies the voltage of 12V for the electrical load.

[0006] A DC-DC converter refers to an electronic circuit device that converts a DC power supply of one voltage to a DC power supply of another voltage and is used in various fields such as television receivers and automotive electrical components.

[0007] The converter's external shape is formed by a housing. Inside the housing are one or more electronic components for operation. An example of such electronic components is a printed circuit board on which numerous elements are mounted. The elements on the printed circuit board generate heat through operation. This generated heat can cause overload on each electronic component, leading to malfunctions in the setting function and ultimately failure. Therefore, a structure or means for heat dissipation from the components within the converter is required. [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] This invention was proposed to improve the aforementioned problems and aims to provide a converter that can improve heat dissipation efficiency by improving its structure. [Means for solving the problem]

[0009] The converter according to this embodiment includes a housing with an internal space, a printed circuit board disposed within the internal space, a first electronic component disposed on the upper surface of the printed circuit board, a second electronic component disposed on the lower surface of the printed circuit board, and a heat dissipation space disposed within the housing, wherein the first electronic component is arranged to overlap with the heat dissipation space in a first direction, and the second electronic component is arranged to overlap with the heat dissipation space in a second direction perpendicular to the first direction.

[0010] The first direction may be the vertical direction, and the second direction may be parallel to the printed circuit board.

[0011] A first heat conductive layer may be placed between the upper surface of the heat dissipation space and the lower surface of the printed circuit board.

[0012] A groove for housing the second electronic component may be provided at the bottom of the internal space, which is recessed compared to other areas.

[0013] A second heat conduction layer may be placed between the inner surface of the groove and the outer surface of the second electronic component.

[0014] The second heat conductive layer may include a side portion disposed between the side surface of the second electronic component and the inner surface of the groove, and a bottom portion disposed between the bottom surface of the second electronic component and the bottom surface of the groove.

[0015] The heat dissipation space may include refrigerant pipes through which a refrigerant flows.

[0016] The refrigerant pipe may include a first straight section with a refrigerant inlet at one end, a second straight section parallel to the first straight section with a refrigerant outlet at one end, and a connecting section that connects the first and second straight sections and is perpendicular to the first and second straight sections.

[0017] The second electronic component may be provided in multiple quantities, some of which may be arranged along a first row parallel to the first straight section, and the remaining portion may be arranged along a second row parallel to the second straight section.

[0018] A converter according to another embodiment includes a printed circuit board, a first electronic component disposed on the upper surface of the printed circuit board, a second electronic component disposed on the lower surface of the printed circuit board, and a refrigerant pipe disposed at a distance from the lower surface of the printed circuit board, wherein the refrigerant pipe includes a first straight section, a second straight section parallel to the first straight section, and a connecting section connecting the first straight section and the second straight section, the first electronic component is arranged to overlap the first straight section, the second straight section, and the connecting section in a direction perpendicular to the printed circuit board, and the second electronic component is arranged between the first straight section and the second straight section. [Effects of the Invention]

[0019] This embodiment has the advantage of improving heat dissipation efficiency because the first and second electronic components, which are arranged on both sides of the printed circuit board, form an optimal heat dissipation structure with the refrigerant pipe.

[0020] Particularly, in the case of the second electronic component, heat dissipation is performed not only on the bottom surface but also on the side surfaces, so that there is an advantage in increasing the heat dissipation area of the electronic component.

Brief Description of the Drawings

[0021] [Figure 1] Perspective view showing the appearance of the converter according to an embodiment of the present invention. [Figure 2] Plan view showing the bottom surface of the converter according to an embodiment of the present invention. [Figure 3] Plan view showing the top surface of the converter according to an embodiment of the present invention. [Figure 4] Exploded perspective view of the converter according to an embodiment of the present invention. [Figure 5] Plan view showing the top surface of the converter from which the cover and the printed circuit board according to an embodiment of the present invention are excluded. [Figure 6] Plan view showing the top surface of the converter from which the cover according to an embodiment of the present invention is excluded. [Figure 7] Plan view showing the bottom surface of the printed circuit board according to an embodiment of the present invention. [Figure 8] Cross-sectional view of the heat dissipation structure inside the converter according to an embodiment of the present invention. [Figure 9] Cross-sectional view showing A-A' of FIG. 3.

Modes for Carrying Out the Invention

[0022] [[ID=*]] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to some of the described embodiments, and can be realized in various different forms. Within the scope of the technical idea of the present invention, one or more of the components can be selectively combined or replaced between the embodiments and used.

[0023] Furthermore, unless otherwise clearly defined, terms used in the embodiments of the present invention (including technical and scientific terms) can be interpreted as having a meaning generally understood by a person skilled in the art to which the present invention pertains. Terms that are commonly used, such as predefined terms, can be interpreted in consideration of their meaning in the context of the relevant art.

[0024] Furthermore, the terminology used in the embodiments of this invention is for illustrative purposes only and is not intended to limit the invention.

[0025] In this specification, singular forms may also include plural forms unless otherwise specified in the text, and when it says "A and / or at least one of B and C," it may include one or more of all possible combinations of A, B, and C.

[0026] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., can be used.

[0027] These terms are used to distinguish one component from another, and are not limited by the nature, order, or sequence of the component in question.

[0028] Furthermore, when it is stated that one component is “linked,” “joined,” or “connected” to another component, this includes not only cases where the component is directly “linked,” “joined,” or “connected” to that other component, but also cases where it is “linked,” “joined,” or “connected” by yet another component between that component and the other component.

[0029] Furthermore, when a component is described as being formed or positioned "above" or "below" another component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more additional components are formed or positioned between the two components. Also, when expressed as "above" or "below," it can include not only an upward direction but also a downward direction relative to one component.

[0030] Figure 1 is a perspective view illustrating the external appearance of a converter according to an embodiment of the present invention; Figure 2 is a plan view illustrating the bottom surface of a converter according to an embodiment of the present invention; Figure 3 is a plan view illustrating the top surface of a converter according to an embodiment of the present invention; Figure 4 is an exploded perspective view of a converter according to an embodiment of the present invention; Figure 5 is a plan view illustrating the top surface of a converter according to an embodiment of the present invention with the cover and printed circuit board removed; Figure 6 is a plan view illustrating the top surface of a converter according to an embodiment of the present invention with the cover removed; Figure 7 is a plan view illustrating the bottom surface of a printed circuit board according to an embodiment of the present invention; Figure 8 is a cross-sectional view of the heat dissipation structure inside the converter according to an embodiment of the present invention; and Figure 9 is a cross-sectional view illustrating the line A-A' in Figure 3.

[0031] Referring to Figures 1-9, the converter 10 according to an embodiment of the present invention has its outer shape formed by a housing 100. An internal space 101 is formed inside the housing 100 so as to be used to arrange components for driving the converter 10. A cover 190 is fitted to the upper surface of the housing 100 to cover the upper surface of the internal space 101. Screw holes are formed in the housing 100 and the cover 190 so as to be passed through corresponding areas of each other, and the housing 100 and the cover 190 can be screw-connected. A sealing member for sealing the internal space 101 may be placed between the housing 100 and the cover 190.

[0032] A connector module 200 may be arranged on the side of the housing 100. The connector module 200 is arranged on the side of the housing 100 and can be exposed to the outside. At least a portion of the connector module 200 is arranged inside the housing 100 and can be electrically connected to a printed circuit board 120, which will be described later.

[0033] The connector module 200 electrically connects the converter 10 to a battery (not shown) and to a load, so that power supplied from the battery can be converted by the converter 10. The converted power can then be applied to the load. For example, a high-voltage power supplied from the battery is converted by the converter 10, and a low-voltage power is applied to the load. Therefore, the connector module 200 can be used to connect configurations for supplying power to the converter 10 or for supplying power from the converter 10.

[0034] However, this is illustrative, and the connector module 200 can be defined as including any configuration that is arranged on the outer surface of the housing 10 for the external terminals related to the driving of the converter 10 to be electrically and physically connected.

[0035] The connector module 200 may include a bracket, pins 210 housed within the bracket, and a busbar 220 that electrically connects the pins 210 to the printed circuit board 120.

[0036] The converter 10 may include a refrigerant pipe 300. The refrigerant pipe 300 may be coupled to the housing 100. A heat dissipation space 110 may be formed within the housing 100 to accommodate the refrigerant pipe 300. At least a portion of the refrigerant pipe 300 may be located within the heat dissipation space 110, while another portion may protrude outside the heat dissipation space 110 and be exposed to the outside. The area of ​​the lower surface of the housing 100 in which the heat dissipation space 110 is located may protrude downward from other areas. The area of ​​the space within the housing 100 in which the heat dissipation space 110 is located may be partitioned from other areas. For example, the heat dissipation space 110 within the housing 100 may be in the shape of a partition wall enclosing the refrigerant pipe 300.

[0037] The refrigerant pipe 300 has a flow path 301 formed inside for the flow of refrigerant, a refrigerant inlet 310 at one end for introducing refrigerant into the flow path 301, and a refrigerant outlet 320 at the other end for discharging the refrigerant that has circulated through the flow path 301. The refrigerant pipe 300 may be formed in the shape of a metal pipe. Heat exchange occurs as the refrigerant circulates along the flow path 301, allowing the converter 10 to dissipate heat.

[0038] The refrigerant pipe 300 and the housing 100 may be formed integrally by gravity casting.

[0039] The refrigerant pipe 300 may include a first straight section 302 and a second straight section 306 arranged parallel to each other, and a connecting section 304 connecting the first straight section 302 and the second straight section 306. The connecting section 304 may be arranged perpendicular to the first straight section 302 and the second straight section 304. The connecting region between the connecting section 304 and the first straight section 302, and the connecting region between the connecting section 304 and the second straight section 306 may be bent in shape. A refrigerant inlet 310 may be located at one end of the first straight section 302, and a refrigerant outlet 320 may be located at one end of the second straight section 306.

[0040] The partition wall of the heat dissipation space 110 is formed to enclose the first linear section 302, the second linear section 306, and the connecting section 304, which are located within the housing 100, and the connecting region between the first linear section 302 and the connecting section 304, and the connecting region between the second linear section 306 and the connecting section 304 can be exposed to the space within the housing 100.

[0041] The internal space 101 may contain at least one electronic component for driving the converter 10. The electronic component may include a printed circuit board 120, a first electronic component 122, and a second electronic component 130. The printed circuit board 120 may be formed in a plate shape and placed within the internal space 101. The upper surface of the printed circuit board 120 may be positioned facing the cover 190, and the lower surface of the printed circuit board 120 may be positioned facing the bottom surface of the internal space 101. Numerous electronic components may be placed on both sides of the printed circuit board 120. The first electronic component 122 may be placed on the upper surface of the printed circuit board 120, and the second electronic component 130 may be placed on the lower surface of the printed circuit board 120.

[0042] The first electronic component 122 may be placed on the upper surface of the printed circuit board 120. The first electronic component 122 may include an FET element. Multiple first electronic components 122 may be provided and mounted on the printed circuit board 120. The multiple first electronic components 122 may be arranged in groups of four, with each group consisting of four components. The four first electronic components 122 within a single group may each be placed in a corner area. Each group may be arranged so as to be spaced apart from one another.

[0043] The first electronic component 122 may be arranged to overlap the refrigerant pipe 300 in the vertical direction (first direction). The first electronic component 122 may be arranged to overlap the first linear section 302 and the second linear section 306 in the vertical direction. For example, the first electronic component 122 may include six groups, three of which are arranged to overlap the first linear section 302 in the vertical direction, and the remaining three groups may be arranged to overlap the second linear section 306 in the vertical direction.

[0044] The lower surface of the printed circuit board 120 can contact the outer surface of the heat dissipation space 110. A first thermal conductive layer 129 may be placed between the lower surface of the printed circuit board 120 and the upper surface of the heat dissipation space 110. With the first thermal conductive layer 129 interposed, the lower surface of the printed circuit board 120 and the upper surface of the heat dissipation space 110 can contact each other. The first thermal conductive layer 129 is made of a material with excellent thermal conductivity and can transfer the driving heat of the first electronic component 122 to the heat dissipation space 110. The upper surface of the heat dissipation space 110 on which the first thermal conductive layer 129 is placed may be a flat surface.

[0045] The second electronic component 130 may be placed on the underside of the printed circuit board 120. The second electronic component 130 may include an inductor for obtaining inductance. Multiple second electronic components 130 may be provided and mounted on the underside of the printed circuit board 120. The second electronic components 130 may form a row of three, and six can be placed in the internal space 101. The six second electronic components 130 may include the 2-1 electronic component 131, 2-2 electronic component 132, and 2-3 electronic component 133 forming the first row, and the 2-4 electronic component 134, 2-5 electronic component 135, and 2-6 electronic component 136 forming the second row. Each of the second electronic components 130 may be placed spaced apart from one another.

[0046] A groove 102 may be formed in the bottom surface of the internal space 101 to which the second electronic component 130 is coupled. The groove 102 may be formed to correspond to the cross-sectional shape of the second electronic component 130, and a portion of the bottom surface of the internal space 101 may be recessed downwards compared to other areas. A portion of the second electronic component 130 may be housed in the groove 102, while another portion may be arranged to protrude outside the groove 102. The upper region of the second electronic component 130 protruding outside the groove 102 can be coupled to the printed circuit board 120. A protrusion 107 may be arranged in the area of ​​the lower surface of the housing 100 corresponding to the groove 102 forming area, protruding downwards compared to other areas. The protrusion 107 may be arranged to horizontally overlap with the area of ​​the heat dissipation space 110 protruding from the lower surface of the housing 100.

[0047] The second electronic component 130 may include a core and a coil disposed within the core. The core is disposed within the groove 102, and the coil is exposed above the core and can be electrically connected to the printed circuit board 120.

[0048] The second electronic component 130 is arranged such that at least a portion of it horizontally overlaps with the refrigerant pipe 300. The horizontal direction (second direction) can be understood as the direction perpendicular to the vertical direction and the direction parallel to the printed circuit board 120. The second-first electronic component 131, the second-second electronic component 132, and the second-third electronic component 133 may be arranged so as to horizontally overlap the first linear section 302. The second-fourth electronic component 134, the second-fifth electronic component 135, and the second-sixth electronic component 136 may be arranged so as to horizontally overlap the second linear section 306. This allows the heat generated by the operation of the second electronic component 130 to be easily transferred to the refrigerant pipe 300.

[0049] On the other hand, a second thermal conductive layer 150 may be disposed between the inner surface of the groove 102 and the outer surface of the second electronic component 130. The second thermal conductive layer 150 may include a side portion 152 disposed between the side surface of the second electronic component 130 and the inner surface of the groove 102, and a bottom portion 154 disposed between the bottom surface of the second electronic component 130 and the bottom surface of the groove 102. The side portion 152 and the bottom portion 154 may give the cross-section of the second thermal conductive layer 150 a "U" shape. The second thermal conductive layer 150 is made of a material with excellent thermal conductivity and can transfer the driving heat of the second electronic component 130 to the refrigerant pipe 300 and the heat dissipation space 110. The second thermal conductive layer 150 may have a pad shape.

[0050] According to the structure described above, the first and second electronic components, which are arranged on both sides of the printed circuit board, form an optimal heat dissipation structure with the refrigerant pipe, thus offering the advantage of improved heat dissipation efficiency.

[0051] In particular, with second-tier electronic components, heat dissipation occurs not only from the bottom but also from the sides, which has the advantage of increasing the heat dissipation area of ​​the electronic component.

[0052] Although all components constituting the embodiments of the present invention have been described as either acting as a single unit or in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the objectives of the present invention, all components can also act in a selective combination of one or more units. Furthermore, terms such as "includes," "constitutes," or "has," as described above, should be interpreted as meaning that the component in question may be inherent, and not as excluding other components, but rather as potentially including other components, unless otherwise stated. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted as corresponding to their meaning in the context of the relevant art, and should not be interpreted as ideal or overly formal unless explicitly defined in the present invention.

[0053] The above description is merely illustrative of the technical concept of the present invention, and any person with ordinary skill in the art to which the present invention pertains can make various modifications and changes without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention should be interpreted in accordance with the following claims, and all technical concepts within an equivalent scope should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. Housing including interior space, A printed circuit board, which is arranged in the internal space. The first electronic component, which is located on the upper surface of the printed circuit board, A second electronic component located on the lower surface of the printed circuit board, A heat dissipation space arranged within the housing, and The heat dissipation space includes a refrigerant pipe through which a refrigerant flows, The first electronic component is arranged so as to overlap with the heat dissipation space in a first direction. The second electronic component overlaps the heat dissipation space in a second direction perpendicular to the first direction, The refrigerant pipe includes a first straight section with a refrigerant inlet at one end, a second straight section parallel to the first straight section with a refrigerant outlet at one end, and a connecting section perpendicular to the first and second straight sections, connecting the first and second straight sections. The second electronic component is provided in multiple parts, some of which are arranged along a first row parallel to the first straight section, and the remaining parts are arranged along a second row parallel to the second straight section. The heat dissipation space has a partition wall shape so as to cover the refrigerant pipe, A converter characterized in that the first linear portion is the connecting region of the connecting portion, and the connecting region of the second linear portion and the connecting portion is exposed to the outside of the heat dissipation space.

2. The first direction is the up and down direction. The converter according to claim 1, characterized in that the second direction is parallel to the printed circuit board.

3. The converter according to claim 1 or 2, characterized in that a first heat conduction layer is disposed between the upper surface of the heat dissipation space and the lower surface of the printed circuit board.

4. The converter according to any one of claims 1 to 3, characterized in that a groove for housing the second electronic component is provided on the bottom surface of the internal space, which is recessed compared to other areas.

5. The converter according to claim 4, characterized in that a second heat conductive layer is disposed between the inner surface of the groove and the outer surface of the second electronic component.

6. The second thermal conductive layer is A side portion disposed between the side surface of the second electronic component and the inner surface of the groove, The converter according to claim 5, characterized in that it includes a lower surface portion disposed between the lower surface of the second electronic component and the bottom surface of the groove.

7. The converter according to any one of claims 1 to 6, characterized in that the area on the outer surface of the housing in which the heat dissipation space is located is shaped to protrude downward from other areas.

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