Valve body device and semiconductor manufacturing equipment

Abstract

To provide a gate valve device and a semiconductor manufacturing device that reduce the volume of a driving part for driving a valve element.SOLUTION: A gate valve device comprises a case comprising an opening part, a valve element for opening / closing the opening part, and a driving part for driving the valve element. The driving part comprises: a first crankshaft comprising a first input shaft rotatably supported by a side wall of the case, and a first output shaft rotatably supported by the valve element; a second crankshaft comprising a second input shaft rotatably supported by the side wall of the case, and a second output shaft rotatably supported by the valve element; a rotation transmission part for transmitting the rotation of the first input shaft to the second input shaft; and an actuator for rotating the first input shaft.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to Valve body device and semiconductor manufacturing apparatuses.

Background Art

[0002] Patent Document 1 discloses a gate valve device disposed in a plasma processing apparatus that has an opening for loading and unloading a substrate to be processed into and out of a processing chamber, and that performs plasma processing on the substrate to be processed by plasma generated in the processing chamber. A drive unit for driving a valve body is provided below a housing in which an opening for substrate transfer is formed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] On one side, the present disclosure provides a gate valve device and a semiconductor manufacturing apparatus that reduce the volume of a drive unit for driving a valve body.

Means for Solving the Problems

[0005] To solve the above problems, according to one aspect, there is provided a gate valve device including a housing having an opening, a valve body for opening and closing the opening, and a drive unit for driving the valve body, the drive unit including a first crankshaft having a first input shaft rotatably supported by a side wall of the housing and a first output shaft rotatably supported by the valve body, a second crankshaft having a second input shaft rotatably supported by the side wall of the housing and a second output shaft rotatably supported by the valve body, a rotation transmission unit for transmitting rotation of the first input shaft to the second input shaft, and an actuator for rotating the first input shaft. [Effects of the Invention]

[0006] In one aspect, it is possible to provide a gate valve device and semiconductor manufacturing apparatus that reduce the volume of the drive unit that drives the valve body. [Brief explanation of the drawing]

[0007] [Figure 1] A diagram showing an example of the overall configuration of a semiconductor manufacturing apparatus according to the first embodiment. [Figure 2] An example of a front view of a gate valve according to this embodiment. [Figure 3] An example of a front view of a gate valve according to this embodiment. [Figure 4] An example of a cross-sectional view of a gate valve according to this embodiment. [Figure 5] An example of a cross-sectional view of a gate valve according to this embodiment. [Figure 6] An example of a cross-sectional view AA of a gate valve according to this embodiment. [Figure 7] An example of a view from above of a semiconductor manufacturing apparatus according to the first embodiment, which has a gate valve according to this embodiment. [Figure 8] An example of a side view of a semiconductor manufacturing apparatus according to the first embodiment, which has a gate valve according to this embodiment. [Figure 9] A diagram showing an example of the overall configuration of a semiconductor manufacturing apparatus according to the second embodiment. [Figure 10] An example of a side view of a semiconductor manufacturing apparatus according to the second embodiment, which has a gate valve according to this embodiment. [Figure 11] An example of a side view of a semiconductor manufacturing apparatus having a gate valve, as shown in the reference example. [Modes for carrying out the invention]

[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0009] [Overall configuration of the semiconductor manufacturing apparatus according to the first embodiment] An example of the configuration of the semiconductor manufacturing apparatus 1 according to the first embodiment will be described with reference to Figure 1. The semiconductor manufacturing apparatus 1 shown in Figure 1 is a cluster structure (multi-chamber type) apparatus, and the transport chamber VTM and substrate processing chamber PM are examples of vacuum equipment.

[0010] The semiconductor manufacturing apparatus 1 shown in Figure 1 includes substrate processing chambers PM (Process Module) 1 to PM6, a transport chamber VTM (Vacuum Transfer Module), load lock chambers LLM (Load Lock Module) 1 and LLM2, a loader module LM (Loader Module), and load ports LP (Load Port) 1 to LP3.

[0011] The semiconductor manufacturing apparatus 1 is controlled by the control unit 2 and performs a predetermined process on a semiconductor wafer W (hereinafter also referred to as "wafer W"), which is an example of a substrate.

[0012] The substrate processing chambers PM1 to PM6 are located adjacent to the transport chamber VTM. The substrate processing chambers PM1 to PM6 are collectively referred to as the substrate processing chamber PM. The substrate processing chambers PM1 to PM6 and the transport chamber VTM are connected by opening and closing the gate valve GV. The substrate processing chambers PM1 to PM6 have a support section 10 that supports the wafer W, and are reduced to a predetermined vacuum atmosphere, where the wafer W is subjected to processes such as etching, film deposition, cleaning, and ashing.

[0013] Inside the transfer chamber VTM, a transfer device VA for transferring the wafer W is arranged. The transfer device VA has two robot arms AC and AD that can flex and rotate. At the tip of each of the robot arms AC and AD, picks C and D are respectively attached. The transfer device VA can hold the wafer W at each of the picks C and D, and carries in and out the wafer W between the substrate processing chambers PM1 to PM6 and the transfer chamber VTM according to the opening and closing of the gate valve GV. Further, the transfer device VA carries in and out the wafer W between the transfer chamber VTM and the load lock chambers LLM1 and LLM2 according to the opening and closing of the gate valve GV.

[0014] The load lock chambers LLM1 and LLM2 are provided between the transfer chamber VTM and the loader module LM. The load lock chambers LLM1 and LLM2 switch between the atmospheric atmosphere and the vacuum atmosphere to transfer the wafer W from the loader module LM on the atmospheric side to the transfer chamber VTM on the vacuum side or from the transfer chamber VTM on the vacuum side to the loader module LM on the atmospheric side. In the semiconductor manufacturing apparatus 1 according to the first embodiment shown in FIG. 1, the load lock chambers LLM1 and LLM2 are arranged side by side in the horizontal direction (lateral direction) on one side wall of the transfer chamber VTM.

[0015] The loader module LM is provided with load ports LP1 to LP3. On the load ports LP1 to LP3, for example, a FOUP (Front Opening Unified Pod) containing 25 wafers W or an empty FOUP is placed. The loader module LM carries the wafer W unloaded from the FOUP in the load ports LP1 to LP3 into one of the load lock chambers LLM1 and LLM2, and carries the wafer W unloaded from one of the load lock chambers LLM1 and LLM2 into the FOUP.

[0016] The control unit 2 includes a CPU (Central Processing Unit) 21, a ROM (Read Only Memory) 22, a RAM (Random Access Memory) 23, and a HDD (Hard Disk Drive) 24. The control unit 2 may have other storage areas such as an SSD (Solid State Drive) instead of being limited to the HDD 24. In the storage areas such as the HDD 24 and the RAM 23, there are stored recipes in which the procedure of the process, the conditions of the process, the transfer conditions, etc. are set.

[0017] The CPU 21 controls the processing of the wafer W in the substrate processing chamber PM according to the recipe and controls the transfer of the wafer W. Also, the CPU 21 controls process processing such as gas introduction and exhaust control according to this embodiment, and measurement of particles, etc. Programs for executing, for example, substrate transfer processing, cleaning processing, exhaust control processing, etc. may be stored in the HDD 24 or the RAM 23. These programs may be stored in a storage medium and provided, or may be provided from an external device through a network.

[0018] Note that the numbers of the substrate processing chamber PM, the load lock chamber LLM, and the load port LP are not limited to the numbers shown in this embodiment, and it is sufficient that one or more are provided.

[0019] With such a configuration, the semiconductor manufacturing apparatus 1 can attach a FOUP containing the wafer W or an empty FOUP to the load ports LP1 to LP3. Also, the semiconductor manufacturing apparatus 1 can take out the wafer W before processing accommodated in the FOUP, and transfer it to each substrate processing chamber PM1 to PM6 via the loader module LM, the load lock chambers LLM1, LLM2, and the transfer chamber VTM. Also, the semiconductor manufacturing apparatus 1 can perform desired processing on the wafer W in each substrate processing chamber PM1 to PM6. Also, the semiconductor manufacturing apparatus 1 can take out the processed wafer W from each substrate processing chamber PM1 to PM6 and accommodate it in the FOUP via the transfer chamber VTM, the load lock chambers LLM1, LLM2, and the loader module LM.

[0020] Next, the gate valve GV according to this embodiment will be described using Figures 2 to 6. Figures 2 and 3 are examples of front views of the gate valve GV according to this embodiment. Figures 4 and 5 are examples of cross-sectional views of the gate valve GV according to this embodiment. Figure 6 is an example of cross-sectional view AA of the gate valve GV according to this embodiment. Figures 2 and 4 show the state with the opening 101a open, and Figures 3 and 5 show the state with the opening 101a closed. In addition, in Figure 6, the position of the valve body 110 when the opening 101a is closed is shown by a solid line, and the position of the valve body 110 when the opening 101a is open is shown by a dashed line.

[0021] The gate valve GV is a rectangular gate valve. The gate valve GV is installed between the transport chamber VTM and the chambers adjacent to the transport chamber VTM (substrate processing chambers PM1 to PM6, load lock chambers LLM1 and LLM2). The gate valve GV according to this embodiment may also be applied as a door valve (not shown) installed between the loader module LM and the load lock chambers LLM1 and LLM2. The gate valve GV has a housing 100, a valve body 110, and a drive unit 120. The drive unit 120 is provided on the left and right sides of the valve body 110.

[0022] The housing 100 houses the valve body 110. The housing 100 has a shielding wall 101 with an opening 101a formed therein. The shielding wall 101 is positioned to shield one chamber (e.g., transport chamber VTM) from the other chamber (e.g., substrate processing chambers PM1-PM6, load lock chambers LLM1,2). The opening 101a is formed in a rectangular shape, with the horizontal direction as the longitudinal direction and the vertical direction as the short direction, when viewed from the front side (see Figures 2 and 3), so that picks C and D holding wafers W can be transported.

[0023] The housing 100 has side walls 102 on the left and right sides in the horizontal direction when viewed from the front (see Figures 2 and 3). Outside the side walls 102, there is a drive unit housing 121 that houses the orthogonal transmission 150 and actuator 160 of the drive unit 120.

[0024] The valve body 110 is installed inside the housing 100 and opens and closes the opening 101a. Specifically, the valve body 110 is provided to move between a shielding position that closes the opening 101a (see the valve body 110 shown by the solid line in Figures 3, 5, and 6) and an open position that opens the opening 101a (see the valve body 110 shown by the dashed line in Figures 2, 4, and 6). In addition, a sealing member (not shown) is provided on the surface of the valve body 110 that contacts the shielding wall 101. As a result, the opening 101a can be airtightly closed by closing the opening 101a with the valve body 110 and pressing the valve body 110 against the shielding wall 101.

[0025] As shown in Figures 4 and 5, the drive unit 120 drives the valve body 110. The drive unit 120 includes crankshafts 131 and 132, a rotational transmission unit 140, a right-angle transmission 150, and an actuator 160.

[0026] The first crankshaft 131 has a first output shaft 131a and a first input shaft 131b. The central axes of the first output shaft 131a and the central axis of the first input shaft 131b are parallel, and there is a distance between the central axes of the first output shaft 131a and the central axis of the first input shaft 131b. The first output shaft 131a is rotatably supported on the upper side surface of the valve body 110. The first output shaft 131a is supported by a bearing (not shown) provided on the valve body 110. The first input shaft 131b penetrates the side wall 102 of the housing 100 and is rotatably supported by a bearing 170 provided on the side wall 102. Furthermore, a sealing member 180 is provided between the side wall 102 and the first input shaft 131b, so that the inside of the housing 100 is airtight.

[0027] The second crankshaft 132 has a second output shaft 132a and a second input shaft 132b. The central axes of the second output shaft 132a and the central axis of the second input shaft 132b are parallel, and there is a distance between the central axes of the second output shaft 132a and the central axis of the second input shaft 132b. The second output shaft 132a is rotatably supported on the lower side surface of the valve body 110. The second output shaft 132a is supported by a bearing (not shown) provided on the valve body 110. The second input shaft 132b penetrates the side wall 102 of the housing 100 and is rotatably supported by a bearing 170 provided on the side wall 102. Furthermore, a sealing member 180 is provided between the side wall 102 and the second input shaft 132b, and the inside of the housing 100 is airtight.

[0028] The central axis of the first input shaft 131b of the first crankshaft 131 extends horizontally to the left and right when viewed from the front (see Figures 2 and 3). In other words, the central axis of the first input shaft 131b is positioned parallel to the longitudinal direction of the opening 101a. Similarly, the central axis of the second input shaft 132b of the second crankshaft 132 extends horizontally to the left and right when viewed from the front (see Figures 2 and 3). In other words, the central axis of the second input shaft 132b is positioned parallel to the longitudinal direction of the opening 101a.

[0029] Furthermore, the first input shaft 131b of the first crankshaft 131 and the second input shaft 132b of the second crankshaft 132 are positioned vertically separated from each other.

[0030] The rotation transmission unit 140 transmits the rotation of the first input shaft 131b of the first crankshaft 131 to the second input shaft 132b of the second crankshaft 132. The rotation transmission unit 140 includes a timing pulley 141 provided on the first input shaft 131b, a timing pulley 142 provided on the second input shaft 132b, and a timing belt 143 provided between the timing pulleys 141 and 142. As a result, rotating the first input shaft 131b causes the second input shaft 132b to rotate synchronously.

[0031] The orthogonal transmission 150 receives rotational motion with the vertical axis of rotation as input and outputs rotational motion with the horizontal axis of rotation as output. The orthogonal transmission 150 may also be a speed reducer. The input side of the orthogonal transmission 150 is connected to the rotation axis of the actuator 160, and the output side is connected to the first input shaft 131b of the first crankshaft 131.

[0032] The actuator 160 rotates the first input shaft 131b via the orthogonal transmission 150. The actuator 160 is a rotary actuator, such as a motor. The rotation axis of the actuator 160 extends vertically when viewed from the front (see Figures 2 and 3). That is, the actuator 160 is positioned so that its rotation axis and the first input shaft 131b of the first crankshaft 131 are orthogonal to each other.

[0033] In Figures 4 and 5, the drive unit 120 located on the left side when viewing the gate valve GV from the front (see Figures 2 and 3) has been described. The same applies to the drive unit 120 located on the right side, so redundant explanations will be omitted.

[0034] Furthermore, the orthogonal transmission 150 and the actuator 160 may be provided in only one of the drive units 120, which are located on the left and right sides.

[0035] Here, the actuator 160 is rotated in one direction, causing the first input shaft 131b of the first crankshaft 131 to rotate in one direction (clockwise when viewed from the direction in Figure 6). As a result, the second input shaft 132b of the second crankshaft 132 also rotates in one direction (clockwise when viewed from the direction in Figure 6) via the rotation transmission unit 140.

[0036] Therefore, the first output shaft 131a of the first crankshaft 131 rotates clockwise around the first input shaft 131b as the axis of rotation, and the second output shaft 132a of the second crankshaft 132 rotates clockwise around the second input shaft 132b as the axis of rotation. As a result, as shown by the arrow in Figure 6, the valve body 110 moves along the arc, and the valve body 110 can be moved from the shielded position to the open position. That is, the opening 101a can be opened.

[0037] Furthermore, the actuator 160 is rotated in the opposite direction to the first direction, causing the first input shaft 131b of the first crankshaft 131 to rotate in the opposite direction (counterclockwise when viewed from the direction in Figure 6). As a result, the second input shaft 132b of the second crankshaft 132 also rotates in the opposite direction (counterclockwise when viewed from the direction in Figure 6) via the rotation transmission unit 140.

[0038] Therefore, the first output shaft 131a of the first crankshaft 131 rotates counterclockwise around the first input shaft 131b as the axis of rotation, and the second output shaft 132a of the second crankshaft 132 rotates counterclockwise around the second input shaft 132b as the axis of rotation. As a result, the valve body 110 moves along the arc in the opposite direction to the arrow shown in Figure 6, and the valve body 110 can be moved from the open position to the shielded position. That is, the opening 101a can be shielded by the valve body 110.

[0039] Then, by rotating the actuator 160 in the opposite direction, the valve body 110 can be pressed against the shielding wall 101 in which the opening 101a is formed. This allows the opening 101a to be airtightly closed.

[0040] Thus, according to the gate valve GV of this embodiment, a single actuator 160 can perform both the opening and closing operation of the valve body 110 and the operation of pressing the valve body 110 toward the shielding wall 101 in which the opening 101a is formed.

[0041] Furthermore, as shown in Figure 6, the processing containers 300 of the substrate processing chambers PM1 to PM6 or the load lock chambers LLM1 and LLM2 have a container opening 301a for loading and unloading wafers W into and out of the processing container 300. The processing containers 300 are formed of a metal material such as aluminum, for example, which has been anodized on the inside, and are electrically grounded. The housing 100 of the gate valve GV has a valve seat plate 103 as a valve body receiving member. The valve seat plate 103 is arranged around the container opening 301a on the outside of the side wall of the processing container 300. The valve seat plate 103 is frame-shaped and has an opening 101a that is approximately the same size as the container opening 301a. Preferably, the size of the opening 101a is the same as or larger than the container opening 301a. The valve seat plate 103 is arranged so that the opening 101a and the container opening 301a are in communication. The valve seat plate 103 is made of a conductive material such as metal. The valve seat plate 103 is interposed between the valve body 110 and the processing container 300, with the valve body 110 closing the opening 101a and the container opening 301a.

[0042] An O-ring 211, serving as a first airtight sealing member, is attached to the valve seat plate 103. The O-ring 211 is fitted into a groove (not shown) formed in the valve seat plate 103. The O-ring 211 is positioned to surround the entire circumference of the opening 101a of the valve seat plate 103. The O-ring 211 is sandwiched between the valve body 110 and the valve seat plate 103 when the opening 101a and the container opening 301a are closed by the valve body 110. In this way, the O-ring 211 interposes between the valve body 110 and the valve seat plate 103, airtightly sealing the space between them when the opening 101a and the container opening 301a are closed by the valve body 110. The O-ring 211 can also be positioned on the valve body 110 side.

[0043] A shield ring 212, which serves as a first conductive member, is attached to the valve seat plate 103. The shield ring 212 is fitted into a groove (not shown) formed in the valve seat plate 103. The shield ring 212 is made of a conductive material such as metal and is provided so as to surround the opening 101a of the valve seat plate 103 around its entire circumference. The shield ring 212 is sandwiched between the valve body 110 and the valve seat plate 103 when the opening 101a and the container opening 301a are closed by the valve body 110. In this way, the shield ring 212 interposes between the valve body 110 and the valve seat plate 103, electrically connecting them when the opening 101a and the container opening 301a are closed by the valve body 110. Here, electrically connecting means that charge moves between the connected members and their potentials become equal. The shield ring 212 can also be positioned on the valve body 110 side.

[0044] The O-ring 211 is provided so as to surround the entire circumference of the opening 101a of the valve seat plate 103, and the shield ring 212 is further arranged so as to surround the outside of the O-ring 211. Note that the arrangement of the O-ring 211 and the shield ring 212 may be reversed. That is, the shield ring 212 can be provided so as to surround the entire circumference of the opening 101a of the valve seat plate 103, and the O-ring 211 can be provided so as to surround the outside of the shield ring 212.

[0045] An O-ring 221, serving as a second airtight sealing member, is attached to the valve seat plate 103. The O-ring 221 is fitted into a groove (not shown) formed in the valve seat plate 103. The O-ring 221 is positioned to surround the entire circumference of the container opening 301a. The O-ring 221 is sandwiched between the valve seat plate 103 and the surrounding surface of the container opening 301a on the side wall of the processing container 300. In this way, the O-ring 221 interposes between the valve seat plate 103 and the processing container 300, providing an airtight seal between them. The O-ring 221 can also be positioned on the side wall side of the processing container 300.

[0046] A shield ring 222, which serves as a second conductive member, is attached to the valve seat plate 103. The shield ring 222 is fitted into a groove (not shown) formed in the valve seat plate 103. The shield ring 222 is made of a conductive material such as metal and is provided to surround the entire circumference of the container opening 301a. The shield ring 222 is sandwiched between the valve seat plate 103 and the surface of the side wall of the processing container 300 surrounding the container opening 301a. In this way, the shield ring 222 interposes between the valve seat plate 103 and the processing container 300, electrically connecting them. The shield ring 222 can also be positioned on the side wall side of the processing container 300.

[0047] The O-ring 221 is provided so as to surround the entire circumference of the opening 101a of the valve seat plate 103 and the container opening 301a, and furthermore, the shield ring 222 is arranged so as to surround the outside of the O-ring 221. Note that the arrangement of the O-ring 221 and the shield ring 222 may be reversed. That is, the shield ring 222 can be provided so as to surround the entire circumference of the opening 101a of the valve seat plate 103 and the container opening 301a, and the O-ring 221 can be provided so as to surround the outside of the shield ring 222.

[0048] The first conductive member, shield ring 212, and the second conductive member, shield ring 222, can both be any material having an electromagnetic wave sealing function. Preferably, the shield rings 212 and 222 are spiral spring gaskets formed by spirally shaping a thin metal sheet such as stainless steel.

[0049] As described above, with the valve body 110 closing the opening 101a and the container opening 301a, the two O-rings 211 and 221 provide an airtight seal between the processing container 300, the valve seat plate 103, and the valve body 110, maintaining the airtightness of the processing container 300. Furthermore, with the valve body 110 closing the opening 101a and the container opening 301a, the two shielding rings 212 and 222 ensure electrical conductivity between the processing container 300, the valve seat plate 103, and the valve body 110, thus electrically connecting them. As a result, with the valve body 110 closing the opening 101a and the container opening 301a, the valve body 110 is at the same ground potential as the processing container 300.

[0050] In this case, if the processing container 300 is a substrate processing chamber PM1 to PM6 where the wafer W is subjected to plasma processing, and the valve body 110 made of metal such as aluminum is electrically floating, there is a risk of abnormal discharge or localized plasma generation near the valve body 110 during plasma processing. In response to this, the gate valve GV ensures electrical conductivity between the valve body 110 and the processing container 300 by interposing the valve seat plate 103 and two shielding rings 212 and 222 while the valve body 110 closes the opening 101a and the container opening 301a, thereby preventing abnormal discharge and localized plasma generation.

[0051] Furthermore, the valve seat plate 103 and the two shield rings 212 and 222 are all made of the same type of metallic material. Here, "same type of metallic material" means a) that the main elements contained are the same, b) preferably that the main elements contained are the same, and c) more preferably that the main elements contained are the same and the content ratio is also the same. Also, in case a), "main elements" means, for example, elements contained in the metallic material at a concentration of 70% by mass or more, and the elements contained in trace amounts may be of different types. In case b), the content ratio of the elements may be different. The valve seat plate 103 and the two shield rings 212 and 222 are made of, for example, stainless steel. By using the same type of metallic material for the valve seat plate 103 and the two shield rings 212 and 222, the generation of metallic particles can be suppressed.

[0052] Figure 7 is an example of a view from above of the semiconductor manufacturing apparatus 1 according to the first embodiment, which has a gate valve GV according to this embodiment. Figure 8 is an example of a view from the side of the semiconductor manufacturing apparatus 1 according to the first embodiment, which has a gate valve GV according to this embodiment. Here, as an example of a gate valve GV, a gate valve GV provided between the transport chamber VTM and the load lock chambers LLM1 and LLM2 will be described.

[0053] In Figures 1, 7, and 8, the semiconductor manufacturing apparatus 1 according to the first embodiment has load lock chambers LLM1 and LLM2 provided in the horizontal direction (lateral direction).

[0054] As shown in Figures 4 and 5, the gate valve GV is equipped with a cross-speed transmission 150, which allows the axial direction of the actuator 160 to be vertical. This suppresses the width of the gate valve GV in the left-right direction. Therefore, as shown in Figure 7, in a configuration where the load lock chambers LLM1 and LLM2 are arranged horizontally, interference between the gate valve GV located between the load lock chamber LLM1 and the transport chamber VTM and the gate valve GV located between the load lock chamber LLM2 and the transport chamber VTM can be prevented.

[0055] Furthermore, as shown in Figure 8, since the drive unit housing 121 of the gate valve GV can be provided on the side of the housing 100, the height of the gate valve GV can be suppressed.

[0056] Furthermore, the gate valve GV of this embodiment can perform both the opening and closing operation of the valve body 110 and the operation of pressing it against the shielding wall 101 by the rotational motion of the crankshafts 131 and 132. This allows the valve body 110 to be driven without using a complex operating mechanism.

[0057] Furthermore, in this embodiment, the gate valve GV can control the force that presses the valve body 110 toward the shielding wall 101 using the actuator 160.

[0058] In Figures 7 and 8, the semiconductor manufacturing apparatus 1 is described using the example of a case where two chambers (load lock chambers LLM1 and LLM2) are arranged horizontally (laterally), but it is not limited to this. The semiconductor manufacturing apparatus 1 may have multiple chambers, and at least two of these chambers may be arranged horizontally (laterally).

[0059] [Overall configuration of the semiconductor manufacturing apparatus according to the second embodiment] Next, a semiconductor manufacturing apparatus 1A according to a second embodiment, which has a gate valve GV according to this embodiment, will be described. Figure 9 is a diagram showing an example of the overall configuration of the semiconductor manufacturing apparatus 1A according to the second embodiment.

[0060] The semiconductor manufacturing apparatus 1A according to the second embodiment includes substrate processing chambers PM1 to PM6, a transport chamber VTM, load lock chambers LLM1 and LLM2, a loader module LM, and load ports LP1 to LP3. In the semiconductor manufacturing apparatus 1A according to the second embodiment, the load lock chambers LLM1 and LLM2 are arranged vertically (vertically) along one side wall of the transport chamber VTM. The other configurations are the same as those of the semiconductor manufacturing apparatus 1 according to the second embodiment (see Figure 1), and redundant explanations are omitted.

[0061] Figure 10 is an example of a side view of a semiconductor manufacturing apparatus 1A according to a second embodiment having a gate valve GV according to this embodiment. Figure 11 is an example of a side view of a semiconductor manufacturing apparatus 1A according to a second embodiment having a gate valve GV according to a reference example. Here, as an example of a gate valve GV, a gate valve GV provided between the transport chamber VTM and the load lock chambers LLM1 and LLM2 will be described.

[0062] In Figures 9, 10, and 11, the semiconductor manufacturing apparatus 1A according to the second embodiment has load lock chambers LLM1 and LLM2 arranged vertically (vertically).

[0063] Here, the gate valve GV in the reference example has a linear actuator (not shown) that moves the valve body in the direction of opening and closing. For this reason, as shown in Figure 11, in the reference example, the gate valve GV provided in the lower load lock chamber LLM1 has the drive unit housing 121 located below the housing 100. Also, the gate valve GV provided in the upper load lock chamber LLM2 has the drive unit housing 121 located above the housing 100.

[0064] Therefore, as shown in Figure 11, the cover member 3 of the semiconductor manufacturing apparatus 1 in the reference example is positioned at a high position. Alternatively, it is necessary to provide an overhang (not shown) on the cover member 3. As a result, the overall volume of the semiconductor manufacturing apparatus 1A increases.

[0065] On the other hand, as shown in Figure 10, in this embodiment, the gate valve GV provided in the lower load lock chamber LLM1 has its drive unit housing 121 located on the side of the housing 100. Similarly, the gate valve GV provided in the upper load lock chamber LLM2 also has its drive unit housing 121 located on the side of the housing 100.

[0066] Therefore, as shown in Figure 10, the cover member 3 of the semiconductor manufacturing apparatus 1A in this embodiment can be positioned lower than in the reference example. Furthermore, the cover member 3 can be made flat without any protruding parts (not shown). This makes it possible to reduce the overall volume of the semiconductor manufacturing apparatus 1A.

[0067] In Figures 9 and 10, the semiconductor manufacturing apparatus 1 is described using the example of a case where two chambers (load lock chambers LLM1 and LLM2) are arranged vertically (vertically), but it is not limited to this. The semiconductor manufacturing apparatus 1 may have multiple chambers, and at least two of these chambers may be arranged vertically (vertically).

[0068] Furthermore, although the gate valve GV has been described using examples of its placement between substrate processing chambers PM1 to PM6 and transport chamber VTM, and between load lock chambers LLM1 and LLM2 and transport chamber VTM, it is not limited to these cases. In a configuration where the semiconductor manufacturing apparatus 1 includes other transport chambers different from transport chamber VTM, and transport chamber VTM and the other transport chambers are arranged adjacent to each other, the gate valve GV of this embodiment may be provided between transport chamber VTM and the other transport chambers.

[0069] While embodiments of the gate valve have been described above, this disclosure is not limited to the above embodiments, and various modifications and improvements are possible within the scope of the gist of this disclosure as described in the claims. [Explanation of symbols]

[0070] GV Gate Valve (Gate Valve Device) 1. 1A Semiconductor manufacturing equipment 100 cabinets 101 Shielding wall 101a opening 102 Side wall 103 Valve seat plate 110 Valve body 120 Drive unit 121 Drive unit housing 131 First crank axle 132 Second crank axle 131a First output shaft 131b First input axis 132a Second output shaft 132b Second input axis 140 Rotational transmission section 141 Timing Pulley 142 Timing pulley 143 Timing belt 150 Right-angle transmission 160 Actuators 170 bearings 180 sealing member 211 O-ring (first hermetic sealing member) 212 Shielding ring (first conductive member) 221 O-ring (second hermetic sealing member) 222 Shielding ring (second conductive member) 300 processing containers 301a Container opening VTM transport room PM1~PM6 Substrate Processing Room LLM1, LLM2 Load Lock Room

Claims

1. A valve body device for opening and closing an opening in a housing having an opening, A valve body that opens and closes the aforementioned opening, The system includes a drive unit for driving the valve body, The aforementioned drive unit is A first crankshaft having a first input shaft rotatably supported on the side wall of the housing and a first output shaft rotatably supported on the valve body, A second crankshaft having a second input shaft rotatably supported on the side wall of the housing and a second output shaft rotatably supported on the valve body, It has an actuator that rotates the first input shaft and a rotation transmission unit that transmits the rotation of the first input shaft to the second input shaft, The first output shaft and the second output shaft are arranged vertically spaced apart on the side surface of the valve body. The first input shaft and the second input shaft are arranged vertically apart on the side wall of the housing. Valve body device.

2. A valve body device for opening and closing an opening in a housing having an opening, A valve body that opens and closes the aforementioned opening, The system includes a drive unit for driving the valve body, The aforementioned drive unit is A first crankshaft having a first input shaft rotatably supported on the side wall of the housing and a first output shaft rotatably supported on the valve body, A second crankshaft having a second input shaft rotatably supported on the side wall of the housing and a second output shaft rotatably supported on the valve body, It has an actuator that rotates the first input shaft and a rotation transmission unit that transmits the rotation of the first input shaft to the second input shaft, The longitudinal direction of the valve body is defined as the first direction, and the short direction of the valve body is defined as the second direction. The first input shaft, the first output shaft, the second input shaft, and the second output shaft are arranged parallel to the first direction. The first output shaft and the second output shaft are arranged on the side surface of the valve body, spaced apart in the second direction. The first input shaft and the second input shaft are arranged on the side wall of the housing, spaced apart in the second direction. Valve body device.

3. The rotation axis of the actuator and the first input axis are arranged orthogonally. The actuator's rotational shaft is connected to the first input shaft via an orthogonal transmission. The valve body device according to claim 1 or claim 2.

4. The conductive valve body receiving member having the opening which is opened and closed by the valve body is, With the opening closed by the valve body, a first airtight sealing member is interposed between the valve body and the valve body receiving member to airtightly seal the space between them, With the opening closed by the valve body, a first conductive member is interposed between the valve body and the valve body receiving member to electrically connect them, A valve body device according to any one of claims 1 to 3.

5. With the opening closed by the valve body, the first conductive member is provided so as to surround the first airtight sealing member. The valve body device according to claim 4.

6. The first airtight sealing member consists of an O-ring. The valve body device according to claim 4 or claim 5.

7. The transport room and A room located adjacent to the aforementioned transport room, A valve body device according to any one of claims 1 to 6, which opens and closes a communication section provided between the transport chamber and the chamber, Semiconductor manufacturing equipment.

8. The aforementioned chamber is a substrate processing chamber or a load lock chamber. The semiconductor manufacturing apparatus according to claim 7.

9. The aforementioned chamber is a different transport chamber from the aforementioned transport chamber. The semiconductor manufacturing apparatus according to claim 7.

10. The semiconductor manufacturing apparatus comprises a plurality of the aforementioned chambers, Of the multiple chambers, at least two of the chambers are arranged horizontally. A semiconductor manufacturing apparatus according to any one of claims 7 to 9.

11. The semiconductor manufacturing apparatus comprises a plurality of the aforementioned chambers, Of the multiple chambers, at least two of the chambers are arranged vertically. A semiconductor manufacturing apparatus according to any one of claims 7 to 9.

Images