Method for securing power supply and semiconductor elements

Abstract

To provide a power source device with an increased assembly, and a method for pressing semiconductor elements.SOLUTION: In the power source device, a reinforcement member 50 includes: a heat discharge member 20 having a first supporting wall 21 and a second supporting wall 22 for supporting a plurality of semiconductor elements 11, 12, and 13; and a pressing member 40 for pressing the plurality of semiconductor elements 11, 12, and 13 toward the first supporting wall 21 and the second supporting wall 22. The pressing member 40 includes: a first contact part 41 and a second contact part 43 in contact with the first supporting wall 21 and the second supporting wall 22; and a first pressing part 42 and a second pressing part 44 extending from the contact parts for pressing the semiconductor elements to the supporting walls.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a power supply device and a method for pressing a semiconductor element.

Background Art

[0002] Patent Document 1 discloses a semiconductor mounting structure including a fixing member screwed to a heat radiation fin fixed to a printed circuit board and a semiconductor mounting member for pressing a semiconductor attached to the printed circuit board against the heat radiation fin.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Devices such as power supply devices have a plurality of semiconductor elements mounted thereon. In the mounting structure disclosed in Patent Document 1, many mounting members such as screws are required to bring individual semiconductor elements into contact with the heat radiation fin, increasing the assembly man - hours.

[0005] An object of the present invention is to provide a power supply device and a method for pressing a semiconductor element that can improve the assemblability.

Means for Solving the Problems

[0006] A power supply device according to an aspect of the present invention includes a heat radiating member having a support wall for supporting a plurality of semiconductor elements, and a pressing member for pressing the plurality of semiconductor elements toward the support wall. The pressing member includes a contact portion that contacts the support wall, and a plurality of pressing portions that extend from the contact portion and press each of the plurality of semiconductor elements toward the support wall.

Effects of the Invention

[0007] According to the above embodiment, the ease of assembly of the power supply unit can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] This figure shows an example of the appearance of a mechanism for fixing a semiconductor element to a heat dissipation member before assembly. [Figure 2] This figure shows an example of a fixing method using fixing members. [Figure 3] This is a front view of a mechanism for fixing a semiconductor element to a heat dissipation member. [Figure 4] This is a rear view of the mechanism for fixing a semiconductor element to a heat dissipation member. [Figure 5] This is a side view of a mechanism for fixing a semiconductor element to a heat dissipation member. [Figure 6] This figure shows a first comparative example of a mechanism for holding a semiconductor element to a heat dissipation member. [Figure 7] This figure shows a second comparative example of a mechanism for holding a semiconductor element to a heat dissipation member. [Modes for carrying out the invention]

[0009] The power supply unit comprises a heat dissipation member having a support wall for supporting a plurality of semiconductor elements, and a pressing member for pressing the plurality of semiconductor elements toward the support wall, wherein the pressing member comprises a contact portion that abuts against the support wall, and a plurality of pressing portions extending from the contact portion for pressing each of the plurality of semiconductor elements toward the support wall.

[0010] The method for securing semiconductor elements involves arranging multiple semiconductor elements on the support wall of a heat dissipation member, bringing the contact portion of a securing member into contact with the support wall, and using multiple securing portions extending from the contact portion to secure each of the multiple semiconductor elements toward the support wall.

[0011] The heat dissipation member has a support wall that supports multiple semiconductor elements. The surface of the support wall that supports the semiconductor elements is preferably flat, but is not limited to that, and may have, for example, fine irregularities. The surface of the support wall opposite to the surface that supports the semiconductor elements preferably has heat dissipation fins. The pressing member comprises a contact portion that abuts the support wall, and a plurality of pressing portions that extend from the contact portion and press each of the plurality of semiconductor elements toward the support wall. The contact portion is preferably in direct contact with the support wall, but is not limited to that, and may indirectly abut the support wall via an intervening material. The plurality of pressing portions extending from the contact portion press each semiconductor element toward the support wall (heat dissipation member). The plurality of pressing portions allow the plurality of semiconductor elements to be brought into contact with the heat dissipation member together.

[0012] According to the above configuration, mounting members such as screws for bringing individual semiconductor elements into contact with the heat dissipation fins can be eliminated or reduced, thereby reducing assembly man-hours and improving ease of assembly.

[0013] The heat dissipation member may have a first support wall and a second support wall provided opposite to the first support wall. The pressing member may include a first contact portion that abuts against the first support wall, a plurality of first pressing portions extending from the first contact portion that press the plurality of semiconductor elements toward the first support wall, a second contact portion that abuts against the second support wall, and a plurality of second pressing portions extending from the second contact portion that press the plurality of semiconductor elements toward the second support wall.

[0014] With the above configuration, many semiconductor elements can be held together towards both the first and second support walls of the heat dissipation member. By using both opposing support walls of a single heat dissipation member for cooling semiconductor elements, it is possible to improve assembly efficiency, as well as save space and increase mounting density.

[0015] The pressing portion may have protrusions at positions corresponding to recesses provided in the semiconductor element.

[0016] According to the above configuration, all or part of the protrusions can be fitted into the recesses, concentrating the pressing force for holding the semiconductor element, and the holding portion can surely hold the semiconductor element toward the support wall (heat radiating member).

[0017] The power supply device may include a reinforcing member having a top plate disposed on the upper part of the holding member and a support plate extending from the top plate and supporting the holding member from the opposite side of the support wall.

[0018] According to the above configuration, while the top plate of the reinforcing member presses the holding member from above, the support plate of the reinforcing member supports the holding member (contact portion and / or holding portion), suppressing the holding member from separating from the heat radiating member. Even when there are variations in the dimensions of the holding member and / or the semiconductor element or mounting errors, etc., the support plate supports the holding member, ensuring the pressing force of the holding portion of the holding member against the semiconductor element.

[0019] The holding member may have a convex portion on the surface facing the support plate, and the support plate may contact the convex portion. The convex portion may be at the contact portion of the holding member or at the holding portion.

[0020] According to the above configuration, when the convex portion of the holding member contacts the support plate, the first holding portion and / or the second holding portion of the holding member is suppressed from separating from the support wall of the heat radiating member (hereinafter, also referred to as "expansion" in this specification).

[0021] The support plate has a first support plate and a second support plate disposed to face each other with the holding member interposed therebetween. The first support plate is fixed to the first support wall together with the first contact portion by a fixing member, and the second support plate may be fixed to the second support wall together with the second contact portion by the fixing member. The fixing member may be divided into a member for fixing the first support plate, the first contact portion, and the first support wall and a member for fixing the second support plate, the second contact portion, and the second support wall, but it is preferable from the viewpoint of improving the assembly property to fix the first support plate, the first contact portion, and the first support wall and also fix the second support plate, the second contact portion, and the second support wall with the same fixing member.

[0022] According to the above configuration, the reinforcing member having the first support plate and the second support plate more reliably suppresses the expansion of the first and second pressing portions. Since the fixing member fixes the reinforcing member to the contact portion of the pressing member, the pressing portion of the pressing member can maintain pressing the semiconductor element with an appropriate pressing force.

[0023] The fixing member may include a head that presses the first support plate toward the first support wall, and a shaft that penetrates the first support plate, the first contact portion, the first support wall, the second support wall, the second contact portion, and the second support plate.

[0024] With the above configuration, by inserting the fixing member from the first support plate towards the second support plate, multiple semiconductor elements can be fixed from one side of the heat dissipation member (the first support wall side), allowing taller components to be mounted on the opposite side of the heat dissipation member (the second support wall side).

[0025] The shaft portion may be screwed into the second support plate.

[0026] According to the above configuration, by rotating the head of the fixing member, the second support plate moves toward (is pulled towards) the first support plate, narrowing the gap between the second support plate and the first support plate, thereby suppressing the expansion of the first and second pressing portions.

[0027] The aforementioned retaining member may be made of synthetic resin (insulating material).

[0028] With the above configuration, the retaining member has insulating properties, so it can hold down the semiconductor element regardless of whether the semiconductor element package has insulating properties or not.

[0029] The reinforcing member may be made of metal.

[0030] With the above configuration, the rigidity of the reinforcing member can be increased relative to the pressing member (relative to expansion).

[0031] The following describes embodiments of the power supply unit and the method for securing semiconductor elements, with reference to the drawings.

[0032] Figure 1 shows an example of the appearance of a mechanism for fixing semiconductor elements to a heat dissipation member before assembly. Mechanisms for fixing semiconductor elements to a heat dissipation member are used in power supply devices such as uninterruptible power supplies (UPS), DC power supplies, and power conditioners. This mechanism is suitable for use in small UPSs (general-purpose UPSs) where internal space (component placement space) is limited. In Figure 1, reference numeral 10 denotes a circuit board. Multiple types of semiconductor elements are mounted on the circuit board 10. In the example in Figure 1, three types of semiconductor elements 11, 12, and 13 are mounted. The number and types of each semiconductor element are not limited to the example in Figure 1. In this specification, semiconductor elements 11, 12, and 13 are collectively referred to as multiple semiconductor elements.

[0033] A heat dissipation member 20 is fixed to the circuit board 10. The heat dissipation member 20 has a rectangular parallelepiped shape and includes a first support wall 21 that supports a plurality of semiconductor elements, and a second support wall 22 provided opposite the first support wall 21. As illustrated in Figure 1, the heat dissipation member 20 may have the first support wall 21 and the second support wall 22 each supporting a plurality of semiconductor elements, or, although not shown, either the first support wall 21 or the second support wall 22 may support a plurality of semiconductor elements. In this embodiment, a heat dissipation fin is provided between the first support wall 21 and the second support wall 22 to connect them.

[0034] Insulating heat dissipation sheets 31a and 31b are fixed or attached to the first support wall 21 with screws or the like, according to the shape and form of the multiple semiconductor elements. This prevents the conductive parts of the semiconductor elements from directly contacting the heat dissipation member 20, and also allows the heat generated by the semiconductor elements to be efficiently conducted to the heat dissipation member 20. Although not shown in the figure, insulating heat dissipation sheets 31a and 31b are also provided on the second support wall 22, according to the shape and form of the multiple semiconductor elements.

[0035] The first support wall 21 and the second support wall 22 have holes 23 through which the shafts of the fixing screws described later are inserted. In the example in Figure 1, six holes 23 are formed. The first support wall 21 and the second support wall 22 are collectively referred to as the support wall.

[0036] The pressing member 40 is made of synthetic resin and is a member that presses a plurality of semiconductor elements toward the support wall. The pressing member 40 has an upper contact portion 48 that abuts against the upper surface of the heat dissipation member 20, a first contact portion 41 that hangs down from one end of the upper contact portion 48 and abuts against the outer circumferential surface of the first support wall 21, and a plurality of first pressing portions 42 that extend from the first contact portion 41 and press each of the plurality of semiconductor elements toward the first support wall 21. The pressing member 40 also has a second contact portion 43 that hangs down from the other end of the upper contact portion 48 and abuts against the outer circumferential surface of the second support wall 22, and a plurality of second pressing portions 44 that extend from the second contact portion 43 and press each of the plurality of semiconductor elements toward the second support wall 22. The first contact portion 41 and the second contact portion 43 are collectively referred to as the contact portion.

[0037] The lower end of the first pressing portion 42 has rectangular notches of varying lengths formed to match the shape of the semiconductor element, and multiple rectangular protrusions of substantially different lengths (10 in the example in Figure 1) are formed to press down on the package portion of each semiconductor element. Similarly to the first pressing portion 42, the lower end of the second pressing portion 44 also has rectangular notches of varying lengths formed to match the shape of the semiconductor element, and multiple rectangular protrusions of substantially different lengths are formed to press down on the package portion of each semiconductor element. The first pressing portion 42 and the second pressing portion 44 are collectively referred to as the pressing portion. The heights of the multiple pressing portions from the upper contact portion 48 may be different.

[0038] By changing the shape of the lower ends of the first pressing portion 42 and the second pressing portion 44 to match the shape of the semiconductor elements fixed to the heat dissipation member 20 on the circuit board 10, it becomes possible to hold down multiple semiconductor elements of different types and shapes together with a single pressing member 40. The pressing member 40 can be manufactured with high precision and a high degree of freedom in shape by resin molding.

[0039] The method for securing semiconductor elements involves arranging multiple semiconductor elements on the support walls of the heat dissipation member 20 (in this embodiment, the first support wall 21 and the second support wall 22), bringing the contact portions (first contact portion 41 and second contact portion 43) of the securing member 40 into contact with the support walls, and using multiple securing portions (first securing portion 42 and second securing member 44) extending from the contact portions to secure each of the multiple semiconductor elements toward the support walls.

[0040] In other words, the surfaces of multiple semiconductor elements arranged with their backs to the support wall can be collectively pressed toward the support wall (heat dissipation member 20) by multiple pressing portions extending from the contact portion of the pressing member 40. This method offers good assembly efficiency.

[0041] In particular, in this embodiment, many semiconductor elements can be held together toward both the first support wall 21 and the second support wall 22 of the heat dissipation member 20. By using both opposing support walls of a single heat dissipation member 20, in addition to improving ease of assembly, space saving and increased mounting density can be achieved. In this embodiment, the pressing direction of the first pressing portion 42 and the pressing direction of the second pressing portion 44 are opposite. This can be achieved by the action of the fixing member 60, which will be described later.

[0042] Since the pressing member 40 is insulating, it can hold down the semiconductor element regardless of whether the semiconductor element package is insulating or not (without contacting the conductive part of the semiconductor element).

[0043] The retaining member 40 may be a single-piece molded resin part with a U-shaped cross-section. Alternatively, the retaining member 40 may be formed by dividing the upper contact portion 48 into two parts along the longitudinal direction, that is, by combining two molded parts with an L-shaped cross-section.

[0044] Each of the first pressing portion 42 and the second pressing portion 44 is provided with a projection 45 at a position corresponding to a recess provided in the semiconductor element. As shown in Figure 1, the semiconductor element 11 has a hole 111 formed at a predetermined location in the package, the semiconductor element 12 has a hole 121 formed at a predetermined location in the package, and the semiconductor element 13 has a hole 131 formed at a predetermined location in the package. These holes 111, 121, and 131 are collectively referred to as recesses. With the above configuration, all or part of the projection 45 fits into the recesses (holes 111, 121, and 131), allowing the pressing force applied to the semiconductor element by the first and second pressing portions 42 and 44 to be concentrated, and the semiconductor element can be reliably pressed toward the support wall (heat dissipation member 20).

[0045] The reinforcing member 50 is made of metal and has a top plate 51 positioned on top of the pressing member 40, and a support plate extending from the top plate 51 to suppress the expansion of the pressing member 40. The support plate has a first support plate 52 hanging down from one end of the top plate 51 and a second support plate 53 hanging down from the other end of the top plate 51. That is, the support plate of this embodiment has a first support plate 52 and a second support plate 53 that are positioned opposite each other with the pressing member 40 in between.

[0046] According to the above configuration, the top plate 51 of the reinforcing member 50 presses down on the retaining member 40 from above, while the support plate suppresses the expansion of the retaining member 40. Even if there are variations in the dimensions of the retaining member 40 and / or multiple semiconductor elements, or mounting errors, the support plate supports the retaining member 40, ensuring that the pressing force on the semiconductor elements by the first and second retaining portions 42 and 44 of the retaining member 40 is maintained.

[0047] The retaining member 40 has outward-facing protrusions 46 on the surface facing the support plates 52 and 53, and the support plates 52 and 53 abut against these protrusions 46. In this embodiment, outward-facing protrusions 46 are formed at the end of each of the multiple first retaining portions 42. Outward-facing protrusions 46 are also formed at the end of each of the multiple second retaining portions 44. The first support plate 52 and the second support plate 53 abut against the protrusions 46.

[0048] According to the above configuration, the expansion of the first and second pressing portions 42 and 44 is suppressed when the convex portion 46 of the pressing member 40 comes into contact with the support plate.

[0049] The reinforcing member 50 may be a single molded product with a U-shaped cross-section. Alternatively, the reinforcing member 50 may be formed by combining two molded products with an L-shaped cross-section, which is the shape obtained by dividing the top plate 51 in two along its longitudinal direction.

[0050] Figure 2 shows an example of a fixing method using a fixing member 60. The fixing member 60 is, for example, a fixing screw and has a head 61 and a shaft 62. The first support plate 52 is fixed to the first support wall 21 together with the first contact portion 41 by the fixing member 60, and the second support plate 53 is fixed to the second support wall 22 together with the second contact portion 43 by the fixing member 60. The shaft 62 of the fixing member 60 is inserted through the hole 54 formed in the first support plate 52, the hole 47 formed in the first contact portion 41, the hole 23 formed in the first support wall 21, the hole 23 formed in the second support wall, the hole 47 formed in the second contact portion 43, and the hole 55 formed in the second support plate 53. As a result, the head 61 presses the first support plate 52 toward the first support wall 21. Since the shaft portion 62 is designed to screw into the hole 55 of the second support plate 53, the head portion 61 can be rotated using a tool to tighten multiple components sandwiched between the head portion 61 and the second support plate 53.

[0051] With the above configuration, by rotating the head 61 of the fixing member 60, the second support plate 53 moves toward (is pulled towards) the first support plate 52, narrowing the gap between the second support plate 53 and the first support plate 52, thereby suppressing the expansion of the first and second pressing portions 42 and 44 of the pressing member 40.

[0052] Figure 3 is a front view of the mechanism for fixing the semiconductor element to the heat dissipation member, Figure 4 is a rear view of the mechanism for fixing the semiconductor element to the heat dissipation member, and Figure 5 is a side view of the mechanism for fixing the semiconductor element to the heat dissipation member. As shown in Figure 3, the head 61 of the fixing member 60 presses the first support plate 52 toward the first support wall 21. As shown in Figure 4, the shaft portion 62 of the fixing member 60 screws into the second support plate 53. As shown in Figure 5, the fixing member 60 (head 61 and shaft portion 62) inserts multiple components from the first support plate 52 toward the second support plate 53. The fixing member 60 allows the reinforcing member 50 (first and second support plates 52, 53) to be fixed to one side of the heat dissipation member 20 (the first support wall 21 side). On one side of the heat dissipation member 20, a low-profile component 101 needs to be mounted on the circuit board 10 for the operation of rotating the head 61, but on the opposite side of the heat dissipation member 20, a taller component 102 can be mounted on the circuit board 10 (because no space is required for mounting operations). This makes it possible to further reduce space and improve mounting density.

[0053] As shown in Figure 5, all or part of the projection 45 of the pressing member 40 fits into the recess (hole) of the semiconductor element, so that the pressing force for pressing the semiconductor element can be concentrated, and the first and second pressing parts 42 and 44 can reliably press the semiconductor element toward the first support wall 21 and the second support wall 22 (heat dissipation member 20).

[0054] As shown in Figure 5, the protrusion 46 of the retaining member 40 abuts against the first support plate 52 and the second support plate 53, thereby suppressing the expansion of the first and second retaining portions 42 and 44. Furthermore, since the reinforcing member 50 is made of metal, it can have greater rigidity (against expansion) compared to the retaining member 40 made of synthetic resin.

[0055] Several mechanisms can be considered for securing semiconductor elements to heat dissipation components (heat sinks). The following describes some examples of these securing mechanisms.

[0056] Figure 6 shows a first comparative example of a mechanism for holding semiconductor elements to a heat dissipation member. The semiconductor elements 110 are fixed to the heat sink 120 via a highly thermally conductive insulating sheet 130 (heat dissipation sheet). Resin (insulating) retaining parts 140 are placed on each semiconductor element 110 so as to cover a portion of the semiconductor elements 110, and fixing screws 142 are screwed into screw holes in fixing screw receiving sheets 141 provided on the retaining parts 140, thereby screwing the semiconductor elements 110 together with the retaining parts 140 to the heat sink 120.

[0057] In the structure of the first comparative example, the number of screw fastening operations is equivalent to the number of semiconductor elements. In addition, the same number of retaining parts 140 and fixing screws 142 as the number of semiconductor elements are required. Furthermore, depending on the type and shape of the semiconductor element, insulating bushings to ensure creepage distance and retaining parts 140 of different shapes may also be required, making it impossible to standardize the parts used to hold the semiconductor elements.

[0058] Figure 7 shows a second comparative example of a semiconductor element holding mechanism to a heat dissipation member. In the second comparative example in Figure 7, metal holding parts (holding brackets) 240 and 241 fixed to the heat sink 220 are used. The holding brackets 240 and 241 may hold multiple (for example, two) semiconductor elements 112 together. Depending on the shape of the semiconductor element, an insulating bushing 230 may be used. By holding two semiconductor elements with one holding bracket 240, the number of fixing screws 242 can be reduced compared to the first comparative example, but the number of fixing screws 242 will increase if the number of semiconductor elements increases.

[0059] As in the second comparative example, when using a clamping bracket that can hold multiple semiconductor elements together, the process of interposing insulating bushings 230 at various points, depending on the presence or absence of insulation and differences in size of the semiconductor elements, is still cumbersome. Because the clamping brackets 240 and 241 have high rigidity, they cannot tolerate the accumulation of dimensional errors and mounting misalignments, leading to an increase in the defect rate in the assembly process.

[0060] On the other hand, according to the embodiment shown in Figures 1 to 5, the insulating synthetic resin pressing member 40 is equipped with a plurality of first pressing portions 42 and second pressing portions 44 according to the type and shape of the semiconductor. Since the first and second pressing portions 42 and 44 extend from the contact portions 41 and 43 in a form that is divided into multiple parts by cuts, they have appropriate elasticity and can tolerate the accumulation of dimensional errors and mounting misalignment. Therefore, a single pressing member 40 can press multiple semiconductor elements to the heat dissipation member 20, that is, the components that press the semiconductor elements can be standardized.

[0061] According to this embodiment, the expansion of the pressing member 40 can be suppressed by using a highly rigid metal reinforcing member 50 to sandwich the multiple first pressing parts 42 and second pressing parts 44 from both sides. By using a plate-shaped reinforcing member 50 instead of individual fixing screws 142 and pressing parts 140 (see Figure 6), the number of fixing members 60 can be reduced compared to the number of semiconductor elements.

[0062] According to this embodiment, the retaining member 40 and the reinforcing member 50 can be fixed from one side of the heat dissipation member 20, resulting in good assembly. Furthermore, taller components can be placed on the opposite side of the heat dissipation member 20, thus enabling space saving and improved mounting density. [Explanation of Symbols]

[0063] 10 Circuit boards 11, 12, 13 Semiconductor devices 20 Heat dissipation components 21 1st support wall 22 Second support wall 40 Retaining member 41 1st contact part 42 First Pressing Section 43 Second contact part 44 Second Pressing Section 45 Protrusion 46 Convex part 50 Reinforcement members 51 Top plate 52 1st support plate 53 Second support plate 60 Fixing screws (fixing components)

Claims

1. A heat dissipation member having a support wall that supports multiple semiconductor elements, A pressing member that presses the plurality of semiconductor elements toward the support wall Equipped with, The aforementioned retaining member is A contact portion that abuts against the support wall, A plurality of pressing portions extending from the contact portion press each of the plurality of semiconductor elements toward the support wall. Equipped with, A top plate positioned above the aforementioned retaining member, A support plate extending from the top plate supports the pressing member from the opposite side of the support wall. Further comprising a reinforcing member having power supply.

2. The heat dissipation member is It has a first support wall and a second support wall provided opposite to the first support wall, The aforementioned retaining member is A first contact portion that contacts the first support wall, A plurality of first pressing portions extending from the first contact portion and pressing the plurality of semiconductor elements toward the first support wall, A second contact portion that contacts the second support wall, A plurality of second pressing portions extending from the second contact portion press the plurality of semiconductor elements toward the second support wall and Equipped with, The power supply device according to claim 1.

3. The aforementioned retaining member has a protrusion on the surface facing the support plate, The aforementioned support plate is The protrusion contacts, The power supply device according to claim 1.

4. The aforementioned support plate is The system includes a first support plate and a second support plate that are positioned opposite each other with the aforementioned retaining member in between, The first support plate is, The fixing member is fixed to the first support wall together with the first contact portion, The second support plate is, The fixing member is fixed to the second support wall together with the second contact portion. The power supply device according to claim 2.

5. The aforementioned fixing member is A head that presses the first support plate toward the first support wall, The first support plate, the first contact portion, the first support wall, the second support wall, the second contact portion, and the shaft portion that penetrates the second support plate Equipped with, The power supply device according to claim 4.

6. The shaft portion is screwed into the second support plate. The power supply device according to claim 5.

7. Multiple semiconductor elements are arranged on the support wall of the heat dissipation member. The contact portion of the retaining member is brought into contact with the support wall. Each of the multiple semiconductor elements is pressed toward the support wall by a plurality of pressing portions extending from the contact portion. The reinforcing member has a top plate positioned above the aforementioned pressing member and a support plate extending from the top plate to support the pressing member from the opposite side of the support wall, and the reinforcing member is supported from the opposite side of the support wall by the support plate of the reinforcing member, A method for securing semiconductor elements.

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