Transparent ultrasonic probe module and optical apparatus equipped therewith

Abstract

To provide an optical device capable of improving SNR by using a transparent ultrasonic sensor that makes coaxialization with an ultrasonic route and an optical path and of downsizing a machine.SOLUTION: A transparent ultrasonic wave probe module provided inside a housing of an optical device includes: a lens which is provided on one side inside the housing, made of a transparent material, and is arranged so that one surface is exposed outside the housing; a first matching layer which is provided on the other surface of the lens and is made of a transparent material; a piezoelectric element layer which is provided on the first matching layer and includes a plurality of transparent piezoelectric elements mutually converting an electric signal and a machine signal; a first electrode layer and a second electrode layer which are made of transparent materials, are provided on one surface and the other surface of the piezoelectric element layer, respectively, and transmit electric signals; a circuit board which is coupled to the first electrode layer and the second electrode layer, is made of a bendable material, and transmits / receives the electric signal to / from the piezoelectric element; and a block layer provided on the second electrode layer, is mde of a transparent material and removes ultrasonic noise.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a transparent ultrasonic probe module and an optical device including the same.

Background Art

[0002] An ultrasonic sensor (Ultrasonic Sensor or Ultrasonic Transducer) is a sensor that can measure the physical distance to an object and obtain an image of the object based on the principle of converting electrical energy into acoustic energy using the characteristics of a piezoelectric material, transmitting this energy to an object as the target, and then converting the reflected acoustic energy back into an electrical signal.

[0003] Imaging techniques based on optics and ultrasound are being steadily used in medical diagnosis due to their advantages of being safer, easier to access compared to MRI, X-ray, and CT, and allowing real-time image confirmation.

[0004] Therefore, conventionally, research has been conducted on combining an ultrasonic imaging system and an optical imaging system, combining an ultrasonic imaging system and an optical coherence tomography imaging system, combining an ultrasonic imaging system and a fluorescence imaging system, and so on.

[0005] FIG. 1 is a diagram showing a state of scanning a target through a conventional opaque ultrasonic sensor and an optical device. The conventional ultrasonic sensor 20 was used in an opaque state. However, when the ultrasonic sensor 20 and the optical device 30 are used together, as shown in FIG. 1, since the optical device 30 cannot transmit through the opaque ultrasonic sensor 20, it is arranged off-axis (un-axis insertion) of the ultrasonic sensor.

[0006] Such off-axis placement presents several disadvantages when capturing video for various reasons. For example, it can lead to poor system alignment, increased complexity, larger system size, a lower signal-to-noise ratio (SNR), and a limited field of view.

[0007] Furthermore, the optical scan data and ultrasound scan data did not match, making accurate diagnosis difficult.

[0008] For example, referring to Figure 1, of the first substance 501, second substance 502, third substance 503, and fourth substance 504 present inside the sample 500, the ultrasonic beam 21 detects a portion of the first substance 501 and the fourth substance 504. However, depending on the optical beam 31, there is a problem in that the first substance 501, which is located vertically below the ultrasonic sensor 20, is not detected.

[0009] In conventional optical devices that scan objects using opaque ultrasonic sensors and optical instruments, the light source cannot pass through the ultrasonic sensor. Therefore, auxiliary elements such as prisms and silicon oil had to be placed to separate the optical path from the ultrasonic signal path. This also resulted in the problem of the system becoming very large.

[0010] On the other hand, in order to solve the problems of opaque ultrasonic sensors, Patent Document 1 describes a method in which a part of the cross-section of the opaque ultrasonic sensor is perforated to form an optical path, so that the optical path and the ultrasonic path are located on the same axis. However, even in this case, light can only be transmitted through a part of the cross-section of the ultrasonic sensor, so the problems caused by the opacity of the ultrasonic sensor could not be fully solved.

[0011] Meanwhile, in recent years, the development of transparent ultrasonic sensors has been underway to address the problems associated with image capture using opaque ultrasonic sensors. However, some transparent ultrasonic sensors still have limitations in obtaining high SNR and high-resolution photoacoustic images due to low transparency, low sensitivity, or wide focusing.

[0012] The inventors have previously presented a single-crystal transparent ultrasonic sensor structure and a method for manufacturing the same based on lithium niobate (LNO) in Patent Document 2 ("Transparent Ultrasonic Sensor and Method for Manufacturing the Same"). Building upon this, they have also presented an optical composite imaging system relating to a single-element transparent ultrasonic sensor in Patent Document 3 ("Ultrasonic Optical Composite Imaging System for Transparent Ultrasonic Sensor Substrate").

[0013] However, since the aforementioned ultrasonic sensor structure consists of a single element, there was a limit to the amount of data that could be processed per unit of time by a single element. As a result, there is a growing need for an optical device that employs a multi-element transparent ultrasonic sensor to increase the amount of data, improve image quality, and provide a wider field of view, while maintaining the advantages of a transparent ultrasonic sensor that can process data in real time. [Prior art documents] [Patent Documents]

[0014] [Patent Document 1] U.S. Patent No. 8784321 [Patent Document 2] Korean Published Patent Publication No. 10-2021-0034466 [Patent Document 3] Korean Published Patent No. 10-2022-0029003 [Overview of the Initiative] [Problems that the invention aims to solve]

[0015] The present invention aims to provide an optical device that can improve the signal-to-noise ratio (SNR) and reduce the size of the device by using a transparent ultrasonic sensor that enables coaxial alignment of the ultrasonic path and the optical path.

[0016] Another object of the present invention is to provide an optical device equipped with an ultrasonic sensor having high transparency and sensitivity.

[0017] Another object of the present invention is to provide an optical device that employs multiple piezoelectric elements to improve image quality and provide a wide field of view.

[0018] The problems addressed by the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those with ordinary skill in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0019] According to one aspect of the present invention, a transparent ultrasonic probe module is provided for use inside the housing of an optical device, comprising: a lens provided on one side inside the housing, formed of a transparent material and positioned such that one surface is exposed to the outside of the housing; a first matching layer provided on the other surface of the lens and formed of a transparent material; a piezoelectric element layer provided on the first matching layer and including a plurality of transparent piezoelectric elements capable of mutually converting electrical signals and mechanical signals; a first electrode layer and a second electrode layer, both made of a transparent material and provided on one and the other surface of the piezoelectric element layer, respectively, for transmitting electrical signals; a circuit board connected to the first electrode layer and the second electrode layer and made of a bendable material, capable of sending and receiving electrical signals with the piezoelectric elements; and a block layer provided on the second electrode layer and made of a transparent material for removing ultrasonic noise.

[0020] In this case, a second matching layer made of a transparent material may be further provided between the first matching layer and the lens.

[0021] In this case, the circuit board may be made of a transparent material.

[0022] In this case, the circuit board may consist of a ground board (ground fpcb) and a signal board (signal fpcb).

[0023] At this time, the grounding substrate may be connected to the first electrode layer between the first electrode layer and the first alignment layer, and the signal substrate may be connected to the second electrode layer between the second electrode layer and the block layer.

[0024] At this time, the circuit board may be composed of a gold foil board responsible for the grounding function and a signal substrate (signal fpcb).

[0025] At this time, the gold foil board may be connected to the first electrode layer between the first electrode layer and the first alignment, and the signal substrate may be connected to the second electrode layer between the second electrode layer and the block layer.

[0026] At this time, the block layer is formed so as to have a surface wider than the piezoelectric element layer and the second electrode layer, and the signal substrate is disposed on a part of the upper surface of the block layer that protrudes from the piezoelectric element layer and the second electrode layer, and may be connected to the second electrode layer via a conductive material.

[0027] At this time, the plurality of piezoelectric elements constituting the piezoelectric element layer may be arranged in a row.

[0028] At this time, the plurality of piezoelectric elements are arranged in a row, but may be arranged in an arch shape that protrudes upward in a convex shape.

[0029] At this time, the plurality of piezoelectric elements are arranged in a row, but may be arranged in a U-shaped concave shape that is concave upward.

[0030] At this time, the plurality of piezoelectric elements constituting the piezoelectric element layer may be arranged in a horizontal and vertical grid shape.

[0031] At this time, the plurality of piezoelectric elements constituting the piezoelectric element layer may be arranged in a circular shape.

[0032] At this time, the plurality of piezoelectric elements may be formed in ring shapes with different diameters and arranged in a concentric circle shape.

[0033] In this case, the plurality of piezoelectric elements may be arranged in a hemispherical shape having a certain curvature.

[0034] In this case, the matching layer and the block layer may be formed from one or more materials selected from plastic, silicon, glass, and epoxy, or from a composite of these materials mixed with powders having a diameter of several nanometers to several hundred micrometers.

[0035] In this case, the lens may have one of the following shapes: a concave lens, a convex lens, or a planar lens.

[0036] According to another aspect of the present invention, an optical ultrasonic device is provided, comprising: a housing; the aforementioned transparent ultrasonic probe module provided on one side inside the housing; and an optical instrument provided on the other side inside the housing, positioned at the other end of the transparent ultrasonic probe module, and positioned coaxially with the transparent ultrasonic probe module along the longitudinal direction of the housing.

[0037] In this case, the photo-ultrasonic optical apparatus may further include an optical lens provided inside the housing and positioned between the optical instrument and the transparent ultrasonic probe module.

[0038] In this case, the optical device may be a camera.

[0039] In this case, the optical instrument may be a light source. [Effects of the Invention]

[0040] With the above configuration, an optical device according to one aspect of the present invention can improve the signal-to-noise ratio (SNR) and miniaturize the device by adopting a configuration in which a transparent ultrasonic probe module is arranged coaxially with the optical instrument.

[0041] Furthermore, another aspect of the present invention provides an ultrasonic probe module with high transparency by using a transparent material such as lithium niobate.

[0042] Furthermore, optical devices according to other embodiments of the present invention can improve image quality and provide a wide viewing angle by applying multiple piezoelectric elements.

[0043] Furthermore, optical devices according to yet another aspect of the present invention can provide optical devices tailored to specific purposes by diversifying the arrangement of multiple piezoelectric elements.

[0044] The effects of the present invention are not limited to those described above, but should be understood to include all effects that can be inferred from the detailed description of the invention or the configuration of the invention as described in the claims. [Brief explanation of the drawing]

[0045] [Figure 1] This diagram schematically illustrates the process of scanning a specimen using a conventional opaque ultrasound probe and optical instrument. [Figure 2] This figure shows the photoacoustic and ultrasonic tomography images that can be obtained when the ultrasonic probe and optical equipment are arranged coaxially and when they are arranged non-coaxially. [Figure 3] This is a perspective view showing an optical device according to one embodiment of the present invention. [Figure 4] This is a cross-sectional view showing a cross-section of an optical device according to one embodiment of the present invention. [Figure 5] This diagram schematically illustrates the state in which an optical device according to one embodiment of the present invention scans an object. [Figure 6] This figure shows an ultrasonic probe module provided in an optical device according to the first embodiment of the present invention. [Figure 7] Figure 6 shows a cross-section of the ultrasonic probe module as viewed from the I-I' direction, and a magnified view of a portion of that cross-section. [Figure 8]Figure 6 shows a cross-section of the ultrasonic probe module viewed from the II-II' direction, and a magnified view of a portion of that cross-section. [Figure 9] This figure shows an ultrasonic probe module of an optical device according to a second embodiment of the present invention. [Figure 10] Figure 9 shows a cross-sectional view of the second embodiment of the ultrasonic probe module as seen from the III-III' direction, and an enlarged view of a portion of that cross-section. [Figure 11] Figure 9 shows a cross-section of the second embodiment of the ultrasonic probe module as viewed from the IV-IV' direction, and an enlarged view of a portion of that cross-section. [Figure 12] This figure shows a cross-section of an ultrasonic probe module of an optical device according to the third embodiment of the present invention, viewed from the same direction as in Figure 10, and an enlarged view of a part of that cross-section. [Figure 13] This figure shows an ultrasonic probe module for an optical device according to a first modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. [Figure 14] This figure shows an ultrasonic probe module for an optical device according to a second modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. [Figure 15] This figure shows an ultrasonic probe module for an optical device according to a third modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. [Figure 16] This figure shows an ultrasonic probe module for an optical device according to a fourth modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. [Figure 17] This figure shows an ultrasonic probe module for an optical device according to a fifth modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. [Modes for carrying out the invention]

[0046] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that they can be easily implemented by a person with ordinary skill in the art to which the present invention pertains. The present invention can be implemented in a variety of different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention in the drawings, parts that are not relevant to the description have been omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

[0047] Words and terms used herein and in the claims shall not be limited to their ordinary or dictionary meanings, but shall be interpreted as meanings and concepts consistent with the technical idea of ​​the present invention, in accordance with the principle that inventors may define terms and concepts in order to best describe their invention.

[0048] In this specification, terms such as “includes” or “have” are intended to describe the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, and should not be understood to preemptively exclude the possibility of the presence or addition of one or more other features, figures, steps, actions, components, parts, or combinations thereof.

[0049] The position of one component "in front of," "behind," "above," or "below" another component includes, unless otherwise specified, not only cases where it is directly adjacent to another component in front of, behind, above, or below, but also cases where another component is positioned in between. Furthermore, the position of one component "connected" to another component includes, unless otherwise specified, cases where it is directly connected to one another, as well as cases where it is indirectly connected to one another.

[0050] An optical device according to one embodiment of the present invention is an optical device for scanning a target for diagnosis, in which a transparent ultrasonic probe module and an optical instrument are coaxially arranged.

[0051] Figure 1 is a schematic diagram illustrating the scanning of a specimen using a conventional opaque ultrasound probe and optical instrument. Figure 2 shows the photoacoustic scan data and ultrasound scan data that can be obtained when the ultrasound probe and optical instrument are arranged coaxially and non-coaxially. Figure 3 is a perspective view showing an optical device according to one embodiment of the present invention. Figure 4 is a cross-sectional view showing a cross-section of the optical device according to one embodiment of the present invention. Figure 5 is a schematic diagram illustrating the state in which the optical device according to one embodiment of the present invention scans a specimen. The specimen 500 here can be any object that can be examined with a photoacoustic probe. For example, the specimen 500 could be human body tissue or biological tissue of another living organism.

[0052] Hereinafter, an optical device 100 according to one embodiment of the present invention will be described, followed by a description of the structure of the ultrasonic probe module 200 and optical instrument 300 that constitute the optical device 100.

[0053] Figure 5 shows a transparent ultrasonic probe module, optical instrument, and specimen 500 according to one embodiment of the present invention. In Figure 5, the specimen 500 is shown such that the deep part of the specimen 500 faces the negative z-axis direction when viewed from Figure 5, and the outer surface of the specimen faces the positive z-axis direction when viewed from Figure 5.

[0054] Referring to Figures 3 to 5, in one embodiment of the present invention, the optical device 100 may have an ultrasonic probe module 200 and an optical device 300 coaxially coupled inside the housing 400.

[0055] The housing 400 may be formed in a curved shape with a bend along the height direction on its sides so that it can be easily gripped by the user during use.

[0056] Furthermore, an opening may be formed on one side of the housing 400 to allow the beams emitted from the internally positioned ultrasonic probe module 200 and optical device 300 to escape to the outside.

[0057] The optical device 100 according to one embodiment of the present invention can be provided as a wireless device as shown in Figure 3, but is not limited to this, and can also be provided as a wired device.

[0058] If the optical device 100 is provided as a wireless device, the other side of the housing 400 may be formed to be sealed; however, if the optical device 100 is provided as a wired device, an opening for connecting a cable and a separate support may be formed to stably support the cable.

[0059] Furthermore, referring to Figure 4, the housing 400 may be equipped with a coupling holder 420 that allows the optical instrument 300 to be stably fixed inside the housing while coupled with the ultrasonic profile module 200.

[0060] The coupling holder 420 is configured as part of the housing body 410 and may be formed to enclose the optical device 300, with one side protruding beyond the optical device 300 to support the other side of the ultrasonic probe module 200.

[0061] The ultrasonic probe module 200 is located on one side inside the housing 400, and one side of the ultrasonic probe module 200 can be exposed to the outside through an opening provided on one side of the housing 400.

[0062] A lens 210 may be located on one side of the ultrasonic probe module 200, which is exposed to the outside.

[0063] As shown in Figure 3, one surface of the lens 210 of the ultrasonic probe module 200 may be exposed to the outside through an opening in the housing 400, while the lens 210 and the rest of the ultrasonic probe module 200 may be positioned inside the housing 400.

[0064] Referring to Figure 4, an optical instrument 300 may be positioned on the other side of the ultrasonic probe module 200. In this case, in order to coaxially couple the ultrasonic probe module 200 and the optical instrument 300, the ultrasonic probe module 200 may be made of a transparent material that does not obstruct the optical path.

[0065] In this case, the optical instrument 300 may be provided as a camera for capturing light entering the housing 400 from the outside, or as a light source for emitting light from the inside of the housing 400 to the outside.

[0066] However, the optical device 300 is not limited to this and may be provided as a device that has both a camera function and a light source function, and may be formed in a form in which multiple devices are combined.

[0067] Although not shown in the diagram, it is also possible to place an optical system between the ultrasonic probe module 200 and the optical instrument 300 to set the optical path to suit the purpose.

[0068] In this case, the optical system may include not only convex and concave lenses that can change the path of light, but also cylindrical lenses, ball-shaped lenses, beam shapers, beam diffusers, and the like.

[0069] With the configuration described above, according to one embodiment of the present invention, the ultrasonic probe module 200 and the optical device 300 are arranged coaxially within the housing 400, so that the ultrasonic beam 201 irradiated onto the sample 500 for scanning by the ultrasonic probe module 200 and the optical beam 301 irradiated onto the sample 500 for scanning by the optical device 300 travel in a straight line in the direction they are aligned, unlike in Figure 1.

[0070] As a result, unlike in Figure 1 where the images formed by the ultrasonic beam 21 and optical beam 31 irradiated from the conventional ultrasonic sensor 20 and optical instrument 30 reach different positions on the outer surface of the specimen 500, when using the optical device 100 according to one embodiment of the present invention, the image formed by the ultrasonic beam 201 and the image formed by the optical beam 301 can reach the same position on the outer surface of the specimen 500.

[0071] As a result, unlike when using a conventional optical device 100, the optical beam 31 could not reach the region where the ultrasonic beam 21 reached, within a certain depth L1 from the outer surface of the specimen 500. As shown in Figure 5, when using the optical device according to one embodiment of the present invention, both ultrasonic image information and optical image information can be obtained along the entire depth region L3 of the specimen 500.

[0072] Furthermore, this device can solve the problem of having a low signal-to-noise ratio that occurs when the paths of the ultrasonic beam 21 and the optical beam 31 diverge in conventional equipment.

[0073] Such effects can also be confirmed in the photoacoustic scan data (Figure 2(a)) and ultrasonic scan data (Figure 2(b)) obtained when the ultrasonic probe and optical instrument are arranged coaxially, as in the optical device according to one embodiment of the present invention.

[0074] Figure 2(a) shows photoacoustic scan data acquired with the ultrasonic probe and optical instrument arranged coaxially, and Figure 2(b) shows ultrasonic scan data acquired with the ultrasonic probe and optical instrument arranged coaxially. Figure 2(c) shows photoacoustic scan data acquired with the ultrasonic probe and optical instrument arranged non-coaxially, and Figure 2(d) shows ultrasonic scan data acquired with the ultrasonic probe and optical instrument arranged non-coaxially.

[0075] Comparing Figures 2(a) and 2(c), it can be seen that in Figure 2(c), which is scan data acquired with the ultrasonic probe and optical instrument positioned non-coaxially, data in the shallower depth areas is missing.

[0076] Furthermore, the scan data shown in Figure 2(c) confirms that a significant amount of noise occurred in the deeper parts of the image.

[0077] As described above, when the ultrasonic probe and optical instrument are coaxially coupled, the photoacoustic scan data (Figure 2(a)) and the ultrasonic scan data (Figure 2(b)) match. However, when the ultrasonic probe and optical instrument are not coaxially coupled, the photoacoustic scan data (Figure 2(c)) and the ultrasonic scan data (Figure 2(d)) do not match.

[0078] The structure of the ultrasonic probe module 200 provided in the optical device 100 according to the present invention will be described below with reference to different drawings.

[0079] Figure 6 shows an ultrasonic probe module provided in an optical device according to the first embodiment of the present invention. Figure 7 shows a cross-section of the ultrasonic probe module shown in Figure 6 viewed from the I-I' direction and an enlarged view of a part of the said cross-section. Figure 8 shows a cross-section of the ultrasonic probe module shown in Figure 6 viewed from the II-II' direction and an enlarged view of a part of the said cross-section.

[0080] Referring to Figures 3 and 6, an ultrasonic probe module 200 that can be installed in an optical device according to one embodiment of the present invention is located on one side of the housing 400 where an opening is formed, and a lens 210 is provided on one side of the ultrasonic probe module 200, with one surface of the lens 210 exposed to the outside through the opening of the housing 400.

[0081] In this case, the lens 210 may be formed to have one of the shapes of a concave lens, a convex lens, or a planar lens, depending on the purpose.

[0082] The lens 210 of the ultrasonic probe module 200 according to one embodiment of the present invention may be formed of a silicone material, or it may be formed of a water-based gel, plastic, or epoxy resin.

[0083] In one embodiment of the present invention, a matching layer 220 can be arranged on the other side of the lens of the ultrasonic probe module 200, and a piezoelectric element layer 230 formed of one or more piezoelectric elements can be arranged on the other side of the matching layer 220.

[0084] The matching layer 220 is intended to reduce the difference in acoustic impedance between the ultrasonic signal generated from the piezoelectric elements constituting the piezoelectric element layer 230 and the medium to which it is to be irradiated, i.e., the specimen 500.

[0085] In other words, when ultrasonic signals are generated for the operation of a piezoelectric element, in order to efficiently transmit ultrasonic signals in water, biological tissue, or other media other than air, the loss of ultrasonic energy can be minimized only by maximizing the adjustment of the acoustic impedance of the medium.

[0086] The matching layer 220 in this example may be a focusing type equipped with an acoustic lens capable of focusing light and ultrasonic signals.

[0087] In such cases, the focusing function of the matching layer 220 allows the ultrasonic signal reflected from the sample 500 and incident on the transparent ultrasonic probe module 200 to be precisely coupled to the desired position of the piezoelectric element.

[0088] Therefore, the focusing function of the matching layer 220 allows for focusing of the ultrasonic image acquired by the ultrasonic signal output from the piezoelectric element layer 230, thereby enabling the acquisition of a clear ultrasonic image.

[0089] This improves the clarity of the image obtained by the operation of the transparent ultrasound probe module 200, making it possible to obtain a clear image of the desired area of ​​the specimen 500 to which the ultrasound signal is irradiated.

[0090] Furthermore, when the matching layer 220 uses an acoustic lens, the surface curvature is constant and the surface transparency is improved, which can reduce the amount of ultrasonic signal loss during transmission and reception of ultrasonic signals irradiated onto or reflected from the sample 500.

[0091] Furthermore, if necessary, additional permeable or blocking films can be formed on the matching layer 220 to transmit or block only signals in the desired wavelength band.

[0092] In the case of the harmonized layer 220 according to one embodiment of the present invention, it may be formed of two layers, a first harmonized layer 222 and a second harmonized layer 224, in order to achieve the above-mentioned objectives.

[0093] The acoustic lens provided in the matching layer 220 may be formed from a material that takes acoustic impedance into consideration so that ultrasonic waves are transmitted efficiently, that is, so that reflections do not occur between layers.

[0094] For example, the matching layer 220 may be formed from transparent plastic, silicon, glass, or epoxy resin, or it may be formed from a composite in which a powder having a diameter of several nanometers to several hundred micrometers is partially mixed with the said material.

[0095] The piezoelectric element layer 230 provided on the other side of the matching layer 220 may be formed of one or more piezoelectric elements.

[0096] Piezoelectric elements can exhibit the piezoelectric effect, where polarization occurs and electricity is generated when a mechanical force is applied to the element, and the inverse piezoelectric effect, where mechanical contraction and relaxation occur when a voltage is applied to the element.

[0097] An ultrasonic probe module 200 according to one embodiment of the present invention can transmit ultrasonic waves to the sample 500 using the piezoelectric effect and the inverse piezoelectric effect, and receive ultrasonic waves reflected from the sample 500 to generate an electrical signal.

[0098] The number of piezoelectric elements constituting the piezoelectric element layer 230 may vary depending on the size of the ultrasonic probe module 200. For example, the piezoelectric element layer 230 may consist of 64 piezoelectric elements or 1024 piezoelectric elements.

[0099] In this case, multiple piezoelectric elements may be manufactured by mechanically cutting relatively large piezoelectric elements using processes such as dicing saws or laser cutting.

[0100] In this case, the piezoelectric element may be formed from lithium niobate (LNO), and may contain not only LNO but also transparent piezoelectric materials exhibiting piezoelectric properties such as PMN-PT, PVDF, and PVDF-TrFE.

[0101] Referring to Figures 7 and 8, electrode layers 260 for transmitting electrical signals can be formed on one and the other surface of the piezoelectric element layer 230.

[0102] The electrode layer 260 may consist of a first electrode layer 261 disposed between one surface of the piezoelectric element layer 230 and the other surface of the first matching layer 222, and a second electrode layer 262 disposed between the other surface of the piezoelectric element layer 230 and the block layer 240.

[0103] The first electrode layer 261 and the second electrode layer 262 may be formed by depositing them onto the upper and lower surfaces of the respective piezoelectric elements constituting the piezoelectric element layer 230. Furthermore, the first electrode layer 261 and the second electrode layer 262 may be insulated to prevent electrical short circuits between them.

[0104] The first electrode layer 261 and the second electrode layer 262 may be formed of a transparent material, similar to the other components of the ultrasonic probe module 200 according to one embodiment of the present invention.

[0105] More specifically, the first electrode layer 261 and the second electrode layer 262 may be formed from transparent, conductive materials such as silver nanowire (AgNW), copper nanowire (CuNW), gold nanowire (AuNW), indium-tin-oxide (ITO), carbon nanotubes, and graphene.

[0106] Furthermore, the first electrode layer 261 and the second electrode layer 262 may be formed to a thickness of, for example, less than 100 nm.

[0107] On the other hand, referring to Figures 6 to 8, a block layer 240 may be arranged on the other side of the second electrode layer 262 of the ultrasonic probe module 200 according to one embodiment of the present invention.

[0108] The block layer 240 can serve as a damping layer to remove ultrasonic noise generated in the ultrasonic probe module 200 according to one embodiment of the present invention.

[0109] The ultrasonic beam 201 generated by the piezoelectric element layer 230 travels forward of the optical device 100 where the sample 500 is located, but also travels backward in the opposite direction.

[0110] In this case, unlike the forward-moving ultrasonic beam 201, the backward-moving ultrasonic beam can act as noise when the ultrasonic probe module 200 scans the sample 500.

[0111] Furthermore, if the ultrasonic beam 201 that has advanced forward from the optical device 100 is reflected by the sample 500 and returns to the ultrasonic probe module 200, it may pass through the matching layer 220 and the piezoelectric element layer 230 and be reflected again. This can cause unwanted signal interference.

[0112] The blocking layer 240 can prevent such unwanted signal interference and attenuate ultrasonic signals directed toward the other side of the piezoelectric element layer 230, i.e., toward the rear of the optical device 100.

[0113] In this case, since the optical beam must be able to pass through the other side of the block layer 240, the block layer 240 can also be formed from a transparent material.

[0114] More specifically, the block layer 240 may be formed from plastic, silicon, glass, or epoxy resin, and to enhance damping performance, it may also be formed from a composite in which a powder having a diameter of several nanometers to several hundred micrometers is partially mixed with the said material.

[0115] Referring to Figures 6 to 8, circuit boards 251 and 252 can be connected to the first electrode layer 261 and the second electrode layer 262 of the ultrasonic probe module 200 according to one embodiment of the present invention, respectively.

[0116] Since the circuit board must fit into the narrow space within the housing 400 of the optical device 100, it can generally be formed from a thin and flexible flexible printed circuit board.

[0117] In the case of the ultrasonic probe module 200 according to one embodiment of the present invention, the circuit board may consist of a ground board (Ground fpcb) 251 that is responsible for grounding and a signal board (signal fpcb) 252 that is responsible for signal transmission.

[0118] The signal board 252 may be provided with lines and pads corresponding to each piezoelectric element for signal exchange with each piezoelectric element, and each line and pad may be configured to correspond one-to-one with each piezoelectric element.

[0119] In this configuration, the grounding substrate 251 is connected to one side of the first electrode layer 261, and the connecting portion can be positioned between the first electrode layer 261 and the first matching layer 222. The signal substrate 252 is connected to the other side of the second electrode layer 262, and the connecting portion can be positioned between the second electrode layer 262 and the block layer 240.

[0120] The grounding substrate 251 and the signal substrate 252 can also be formed from an opaque material.

[0121] If the grounding substrate 251 and the signal substrate 252 are made of an opaque material, the portion of the piezoelectric element layer 230 corresponding to the central part through which the ultrasonic beam 201 or optical beam 301 passes may be formed with the grounding substrate 251 and the signal substrate 252 open, and the grounding substrate 251 and the signal substrate 252 attached to the edges of the piezoelectric element layer 230.

[0122] If the grounding substrate 251 and the signal substrate 252 are made of transparent material, they can be formed without leaving an opening in the portion corresponding to the center of the piezoelectric element layer 230.

[0123] Referring to Figures 7 and 8, the portion where the ground substrate 251 and the first electrode layer 261 are connected, and the portion where the signal substrate 252 and the second electrode layer 262 are connected, can be formed with the gold foil 255 of the circuit board exposed.

[0124] The remaining portions of the grounding substrate 251 and signal substrate 252, excluding the portions where the grounding substrate 251 and the first electrode layer 261 are connected and where the signal substrate 252 and the second electrode layer 262 are connected, can be formed in isolation, except for the portions where they are connected to the connector portions of the optical device 100 which are connected to the respective circuit boards.

[0125] In this case, the grounding substrate 251 and the signal substrate 252 may be formed to a thickness of less than 50 μm, and the thickness of the gold foil 255 may be formed to less than 100 nm.

[0126] The stacked structure described above can be applied to each piezoelectric element constituting each piezoelectric element layer 230. Referring to Figures 6 and 8, when multiple piezoelectric elements are arranged in a line, the stacked structures with each piezoelectric element can be arranged at predetermined intervals, as shown in the figures.

[0127] Figure 9 shows an ultrasonic probe module of an optical device according to a second embodiment of the present invention. Figure 10 shows a cross-section of the second embodiment of the ultrasonic probe module shown in Figure 9, viewed from the III-III' direction, and an enlarged view of a part of the said cross-section. Figure 11 shows a cross-section of the second embodiment of the ultrasonic probe module shown in Figure 9, viewed from the IV-IV' direction, and an enlarged view of a part of the said cross-section. When describing other embodiments of the present invention below, detailed descriptions of configurations identical to those of the above-described embodiments will be omitted, and various embodiments of the present invention will be described focusing on configurations that are distinguishable from the above-described embodiments.

[0128] Referring to the ultrasonic probe module 200 according to the second embodiment of the present invention shown in Figures 9 to 11, the arrangement of the matching layer 220, piezoelectric element layer 230, and blocking layer 240 sequentially from the lens 210 to the other side is the same as that of the ultrasonic probe module 200 according to the first embodiment shown in Figures 6 to 8.

[0129] However, unlike the ultrasonic probe module 200 shown in Figures 6 to 8, in the modified version of the ultrasonic probe module 200 shown in Figures 9 to 11, the circuit board can be configured with only the signal board 252 without a grounding board.

[0130] Referring to Figure 10, in a modified example of the ultrasonic probe module 200 according to one embodiment of the present invention, a grounding gold foil 253 may be provided in place of the grounding substrate.

[0131] The grounding gold foil 253 can be connected at one end to the first electrode layer 261 and at the other end to the signal substrate 252.

[0132] Referring to Figure 10, an insulating member 254 may be provided in the space between the piezoelectric element layer 230, the second electrode layer 262, and the gold foil 255 of the signal substrate 252 and the ground gold foil 253 in order to prevent a short circuit between the ground gold foil 253 and other components.

[0133] An ultrasonic probe module 200 according to one embodiment of the present invention can bond a circuit board or gold foil to a piezoelectric element layer 230 by applying pressure after applying an adhesive material such as epoxy to the circuit board or gold foil.

[0134] In this case, the adhesive layer formed by the adhesive member used for bonding is formed to the same thickness as the circuit board or gold foil being bonded.

[0135] In this case, the adhesive material may affect the ultrasonic scan data detected from the ultrasonic probe module 200, so the thinner the adhesive layer is formed, the more noise- and distortion-free the ultrasonic scan data can be obtained.

[0136] Unlike circuit boards that can be formed to a thickness of 50 μm, gold foil can be formed to a thickness of less than 100 nm. Therefore, when adopting a modified configuration such as the ultrasonic probe module 200 shown in Figures 9 to 11, it is possible to form a thinner adhesive layer compared to the configuration of the ultrasonic probe module 200 shown in Figures 6 to 8.

[0137] Therefore, adopting the structure described in this modification has the advantage of allowing for the acquisition of more accurate ultrasonic scan data.

[0138] Figure 12 is a cross-sectional view of the ultrasonic probe module of the optical device according to the third embodiment of the present invention, viewed from the same direction as in Figure 10, and an enlarged view of a part of the said cross-section.

[0139] Referring to Figure 12, in the third embodiment, the block layer 240, which is located on the other side of the piezoelectric element layer 230, may be formed to have a wider width than the piezoelectric element layer 230, the matching layer 220, and the lens 210.

[0140] As a result, unlike the ultrasonic probe module 200 shown in Figures 6 to 11, the signal substrate 252 does not interfere with the piezoelectric element layer 230 and the block layer 240, and the piezoelectric element layer 230 and the signal substrate 252 can be connected on the side of the piezoelectric element layer 230.

[0141] In this case, a gold foil 255 protruding from the signal substrate 252 may be placed between the piezoelectric element layer 230 and the block layer 240 for electrical connection between the piezoelectric element layer 230 and the signal substrate 252.

[0142] In this case, unlike the signal substrate which can be formed to a thickness of 50 μm, the thickness of the gold foil can be formed to less than 100 nm. Therefore, this modified version minimizes the influence of the signal substrate 252 on the transmission and reception of ultrasonic waves by minimizing interference between the piezoelectric element layer 230 and the block layer 240.

[0143] Furthermore, in this modified example, a configuration is adopted in which the grounding substrate is replaced with a grounding gold foil 253, similar to the ultrasonic probe module 200 shown in Figures 9 to 11. Therefore, it is possible to form an even thinner adhesive layer compared to the configuration of the ultrasonic probe module 200 shown in Figures 6 to 8.

[0144] The stacked structure of the ultrasonic probe module 200 described above can also be applied identically to additional variations in which the arrangement of piezoelectric elements constituting the piezoelectric element layer 230 is changed.

[0145] Figure 13 shows an ultrasonic probe module for an optical device according to a first modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. Figure 14 shows an ultrasonic probe module for an optical device according to a second modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. Figure 15 shows an ultrasonic probe module for an optical device according to a third modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. Figure 16 shows an ultrasonic probe module for an optical device according to a fourth modified example of the arrangement of piezoelectric elements in an optical device according to the present invention. Figure 17 shows an ultrasonic probe module for an optical device according to a fifth modified example of the arrangement of piezoelectric elements in an optical device according to the present invention.

[0146] Referring to Figure 13, the piezoelectric elements constituting the piezoelectric element layer 230 can be arranged in a convex shape.

[0147] If the piezoelectric element layer 230 is formed in a convex shape, the lens 210, matching layer 220, and block layer 240 may also be formed in a convex shape.

[0148] In this case, the ultrasound probe module 200 has the advantage of being able to irradiate a wider area.

[0149] Thus, even when the piezoelectric element layer 230, lens 210, matching layer 220, and block layer 240 of the ultrasonic probe module 200 are formed in a convex shape, the stacking order and transparency of the ultrasonic probe module 200, as well as the positional relationship with the optical instrument 300 within the housing 400, can be formed in the same way as when the arrangement of the piezoelectric element layer 230 is not deformed.

[0150] Therefore, as shown in Figure 13, even in the first modified example of the piezoelectric element layer 230 of the ultrasonic probe module 200 according to one embodiment of the present invention, light can pass through the ultrasonic probe module 200 from the optical instrument 300 within the housing and proceed to the outside of the housing.

[0151] Referring to Figure 14, the piezoelectric elements constituting the piezoelectric element layer 230 can be arranged in a concave shape.

[0152] If the piezoelectric element layer 230 is formed in a concave shape, the lens 210, matching layer 220, and block layer 240 may also be formed in a concave shape.

[0153] In this case, the ultrasound probe module 200 has the advantage of being able to concentrate the irradiation on a relatively narrow area.

[0154] Thus, even when the piezoelectric element layer 230, lens 210, matching layer 220, and block layer 240 of the ultrasonic probe module 200 are formed in a convex shape, the stacking order and transparency of the ultrasonic probe module 200, as well as the positional relationship with the optical device 300 within the housing 400, can be formed in the same way as in the case of Figure 13, as described above, when the arrangement of the piezoelectric element layer 230 is not deformed.

[0155] Therefore, as shown in Figure 14, even in the case of the second modified example of the piezoelectric element layer 230 of the ultrasonic probe module 200 according to one embodiment of the present invention, light can pass from the optical device 300 through the ultrasonic probe module 200 within the housing and proceed to the outside of the housing.

[0156] Thus, in the third to fifth modified examples, in which the arrangement of the piezoelectric element layer 230 shown in Figures 15 to 17 is modified, light can still travel from the optical device 300 through the ultrasonic probe module 200 within the housing and proceed to the outside of the housing.

[0157] Referring to Figure 15, the piezoelectric elements constituting the piezoelectric element layer 230 can be arranged in a shape that forms a two-dimensional plane (2D matrix) in the vertical and horizontal directions.

[0158] In this case, the stacked structure of the ultrasonic probe modules 200 arranged in one direction as described above can be arranged in two dimensions, vertically and horizontally.

[0159] In this case, the ultrasound probe module 200 has the advantage of being able to acquire 3D images more easily.

[0160] Referring to Figure 16, the piezoelectric elements constituting the piezoelectric element layer 230 may be formed in ring shapes with different radii and arranged in an annular shape.

[0161] In this case, the lens 210, matching layer 220, and blocking layer 240 may also be formed in a ring shape, depending on each piezoelectric element formed in a ring shape.

[0162] Referring to Figure 17, the piezoelectric elements constituting the piezoelectric element layer 230 can be arranged in a hemispherical shape.

[0163] In this case, the stacked structure of the ultrasonic probe modules 200 arranged in one direction as described above can have each piezoelectric element positioned along the arrangement.

[0164] In this case, the ultrasonic probe module 200 has the advantage of being able to irradiate a narrower area more strongly and with greater intensity compared to the modified example shown in Figure 14.

[0165] By adopting the structure described above, the optical device 100 according to one embodiment of the present invention can improve the signal-to-noise ratio and miniaturize the device, unlike conventional optical devices in which the ultrasonic probe and the optical device are coupled non-coaxially.

[0166] Furthermore, the optical device 100 according to one embodiment of the present invention can obtain mutually consistent ultrasonic image information and optical image information along the entire depth region L3 of the sample 500.

[0167] This allows for the simultaneous acquisition of images containing diverse information, thereby improving the accuracy of lesion diagnosis.

[0168] At the same time, the optical device 100 according to one embodiment of the present invention can utilize properties such as light absorption and light scattering to generate image information targeting specific tissues through fluorescent labeling, or to perform a wider range of tasks such as measuring oxygen saturation using the degree of light absorption.

[0169] Furthermore, the optical device 100 according to one aspect of the present invention can improve image quality and provide a wide viewing angle by applying multiple piezoelectric elements.

[0170] Furthermore, the optical device 100 according to another aspect of the present invention can provide an optical device tailored to a specific purpose by diversifying the arrangement of the multiple piezoelectric elements.

[0171] Although one embodiment of the present invention has been described above, the concept of the present invention is not limited to the embodiments presented herein. Those skilled in the art who understand the concept of the present invention can easily propose other embodiments within the same concept by adding, changing, deleting, or adding components, and this too is within the scope of the present invention. [Explanation of Symbols]

[0172] 20 Conventional ultrasonic sensors 21 Ultrasonic beam 30 Conventional Optical Instruments 31 Optical beams 100 Optical equipment 200 Transparent Ultrasound Probe Modules 201 Ultrasonic beam 210 Lens 220 Matching layer 222 1st matching layer 224 Second matching layer 230 Piezoelectric element layer 240 block layers 251 Ground board 252 Signal board 261 1st electrode layer 262 2nd electrode layer 300 Optical equipment 301 Optical beam 400 Housing 500 samples

Claims

1. A transparent ultrasonic probe module, which is installed inside the housing of an optical device, A lens is provided on one side inside the housing, is made of a transparent material, and is positioned so that one side is exposed to the outside of the housing, A first matching layer, formed of a transparent material, is provided on the other surface of the aforementioned lens, A piezoelectric element layer provided on the first matching layer, comprising a plurality of transparent piezoelectric elements capable of mutually converting electrical signals and mechanical signals, Formed from a transparent material, a first electrode layer and a second electrode layer are provided on one and the other surface of the piezoelectric element layer, respectively, for transmitting electrical signals. A circuit board is formed of a material that has an opening in the portion corresponding to the central part of the piezoelectric element layer, is attached to the edge of the piezoelectric element layer, is connected to the first electrode layer and the second electrode layer, and is bendable, and is capable of transmitting and receiving electrical signals with the piezoelectric element. The second electrode layer includes a blocking layer, which is provided on the aforementioned second electrode layer, is made of a transparent material, and is for removing ultrasonic noise, The circuit board comprises a grounding board and a signal board, and the portion corresponding to the central part of the piezoelectric element layer is formed with the grounding board and the signal board open, and the opening is formed by the open portion of the grounding board and the signal board, in a transparent ultrasonic probe module.

2. The transparent ultrasonic probe module according to claim 1, further comprising a second matching layer formed of a transparent material between the first matching layer and the lens.

3. The transparent ultrasonic probe module according to claim 1, wherein the circuit board is formed of a transparent material.

4. The grounding substrate is connected to the first electrode layer between the first electrode layer and the first matching layer, The transparent ultrasonic probe module according to claim 1, wherein the signal substrate is connected to the second electrode layer between the second electrode layer and the block layer.

5. The transparent ultrasonic probe module according to claim 1, wherein the circuit board comprises a gold foil plate that performs a grounding function and the signal board.

6. The gold foil plate is connected to the first electrode layer between the first electrode layer and the first matching layer, The transparent ultrasonic probe module according to claim 5, wherein the signal substrate is connected to the second electrode layer between the second electrode layer and the block layer.

7. The block layer is formed to have a larger surface area than the piezoelectric element layer and the second electrode layer. The transparent ultrasonic probe module according to claim 6, wherein the signal substrate is disposed on a portion of the upper surface of the block layer that protrudes from the piezoelectric element layer and the second electrode layer, and is connected to the second electrode layer via a conductive material.

8. The transparent ultrasonic probe module according to claim 1, wherein the plurality of piezoelectric elements constituting the piezoelectric element layer are arranged in a row.

9. The transparent ultrasonic probe module according to claim 8, wherein the plurality of piezoelectric elements are arranged in a line, but in an arch shape that rises convexly upwards.

10. The transparent ultrasonic probe module according to claim 8, wherein the plurality of piezoelectric elements are arranged in a line, but are arranged in a U-shape that is concave upwards.

11. The transparent ultrasonic probe module according to claim 1, wherein the plurality of piezoelectric elements constituting the piezoelectric element layer are arranged in a horizontal and vertical grid shape.

12. The transparent ultrasonic probe module according to claim 1, wherein the plurality of piezoelectric elements constituting the piezoelectric element layer are arranged in a circular shape.

13. The transparent ultrasonic probe module according to claim 12, wherein the plurality of piezoelectric elements are each formed in a ring shape with a different diameter and arranged in a concentric circle shape.

14. The transparent ultrasonic probe module according to claim 12, wherein the plurality of piezoelectric elements are arranged in a hemispherical shape having a constant curvature.

15. The transparent ultrasonic probe module according to claim 1, wherein the first matching layer and the block layer are formed of one or more materials selected from plastic, silicon, glass, and epoxy, or are formed of a composite obtained by mixing the materials with powder having a diameter of several nanometers to several hundred micrometers.

16. The transparent ultrasonic probe module according to claim 1, wherein the lens has the shape of one of a concave lens, a convex lens, or a planar lens.

17. Housing and A transparent ultrasonic probe module according to any one of claims 1 to 16 is provided on one side inside the housing, An optical device comprising an optical instrument provided on the other side inside the housing and arranged coaxially with the transparent ultrasonic probe module along the longitudinal direction of the housing.

18. The housing is provided inside the housing, The photo-ultrasonic optical apparatus according to claim 17, further comprising an optical lens disposed between the optical instrument and the transparent ultrasonic probe module.

19. The optical device is a camera, as described in claim 17.

20. The optical apparatus according to claim 17, wherein the optical instrument is a light source that emits light.

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