IC chip placement method, program

Abstract

To provide an IC chip loading device and method that, when loading an IC chip on an antenna in an inlay manufacturing process, improve the accuracy of the loading position of the IC chip.SOLUTION: An IC chip loading device conveys an antenna AN for an inlay, and loads an IC chip at a predetermined reference position of the antenna. A rotary mounter 3 comprises: nozzles that each adsorb the IC chip C when located at a first position PA, and arrange the IC chip at the reference position of the antenna when located at a second position PK; nozzle attachment parts (rotary heads 30) to each of which the nozzle is attached; an image acquisition unit (imaging apparatus CA3) that acquires images of the IC chips adsorbed on the nozzles; and a correction amount determination unit that determines, on the basis of the acquired images, as a correction amount of the IC chips adsorbed on the nozzles, a first correction amount that is a correction amount of an angle around an axis of the nozzle, a second correction amount that is a correction amount of the position in a conveyance direction D1 of the antenna, and a third correction amount that is a correction amount of the position in a width direction of the antenna.SELECTED DRAWING: Figure 7

Description

Technical Field

[0003] , , , , , , , , , , , ,

[0004]

[0001] The present invention relates to an IC chip mounting device and an IC chip mounting method.

Background Art

[0002] With the spread of RFID tags, the production of sheet-like inlays having an antenna and an IC chip electrically connected to the antenna has been expanding. To manufacture an inlay, in the antenna formed on a base substrate, a step of arranging a supplied IC chip with respect to a predetermined reference position on the antenna serving as a reference for mounting the IC chip is provided. At this time, in order to accurately mount the IC chip with respect to the reference position of the antenna, it is known to correct the position of the IC chip (for example, Patent Document 1). and. In the antenna formed on the base substrate, a step of arranging the supplied IC chip with respect to a predetermined reference position on the antenna serving as a reference for mounting the IC chip is provided. At this time, in order to accurately mount the IC chip with respect to the reference position of the antenna, it is known to correct the position of the IC chip (for example, Patent Document 1). At this time, in order to accurately mount the IC chip with respect to the reference position of the antenna, the position of the IC chip is known to be corrected (for example, Patent Document 1). Patent Document 1 describes a mounting device provided with a stage that moves a synchronous roller that adsorbs and holds an IC chip back and forth and left and right with respect to a film substrate. and.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the mounting device described in Patent Document 1 only moves the synchronous roller back and forth and left and right (that is, in the X - axis and Y - axis) with respect to the film substrate, and there is a limit to accurately positioning with respect to the antenna. and. Therefore, an aspect of the present invention is to mount an IC chip on an antenna in the manufacturing process of an inlay ​ The purpose is to improve the accuracy of the mounting position of the IC chip when it is installed. [Means for solving the problem]

[0005] One aspect of the present invention is An IC chip placement method for placing an IC chip on an antenna, wherein a nozzle attracts the IC chip at a first position, and while moving the IC chip from the first position to a second position where the IC chip is placed on the antenna, an image of the IC chip attracted to the nozzle is acquired, and based on the acquired image, a correction value for the nozzle for placing the IC chip at a reference position on the antenna is determined. That is the case. [Effects of the Invention]

[0006] According to one aspect of the present invention, an IC chip is mounted on the antenna during the manufacturing process of the inlay. This allows for improved accuracy in the placement of IC chips. [Brief explanation of the drawing]

[0007] [Figure 1] This is a plan view of the antenna of the embodiment and a partially enlarged view of it before and after the mounting of the IC chip. [Figure 2] This figure shows an antenna sheet and a roll of the antenna sheet wound around it. [Figure 3] This diagram shows the portion of the IC chip mounting device according to the embodiment that corresponds to the IC chip placement process. [Figure 4] This figure shows a chip-containing tape and its enlarged cross-section. [Figure 5] This is a side view of the rotary mounter in the IC chip mounting device of the embodiment. [Figure 6] These are plan and side views of the nozzle unit mounted on the rotary mounter. [Figure 7] This diagram provides a schematic explanation of the relationship between the rotary mounter and the antenna sheet. [Figure 8] This is a perspective view showing the chip-containing tape being separated by the separation roller. [Figure 9] This diagram illustrates the operation of supplying IC chips from the chip-containing tape to the nozzle unit. [Figure 10] This is a front view showing the movement mechanism in the width direction of the rotary mounter. [Figure 11]It is a functional block diagram of a control unit that controls a rotary mounter. [Figure 12] It is a diagram showing an example of an image captured by an imaging device. [Figure 13] It is a diagram illustrating an IC chip adsorbed on a nozzle before and after the rotation of the nozzle. [Figure 14] It is a diagram showing a part corresponding to a curing process in the IC chip mounting apparatus of the embodiment. [Figure 15] It is a diagram showing a part of a pressing unit and an ultraviolet irradiator as viewed from the arrow J in FIG. 14. [Figure 16] It is a diagram showing a method of transporting an antenna sheet according to an embodiment. [Figure 17] It is a diagram for explaining an IC chip placement process according to an embodiment. [Figure 18] It is a diagram for explaining a curing process according to an embodiment. [Figure 19] It is a diagram showing a configuration example of an ultraviolet curing unit in FIG. 18. [Figure 20] It is a diagram for explaining a curing process according to an embodiment.

Best Mode for Carrying Out the Invention

[0008] Hereinafter, an IC chip mounting apparatus and an IC chip mounting method according to an embodiment will be described with reference to the drawings. Refer to and explain. The IC chip mounting apparatus 1 according to the embodiment is an apparatus for mounting an IC chip on a thin-film antenna when manufacturing a non-contact communication inlay such as an RFID inlay. FIG. 1 shows an exemplary antenna AN having a predetermined antenna pattern, but it is not intended to be limited to this antenna pattern.FIG. 1 also shows an enlarged view of part E of the antenna AN before and after the IC chip C is mounted. In this example, the IC chip C is mounted at a predetermined reference position Pref that is determined in advance based on the antenna pattern. In FIG. 1, an exemplary antenna AN having a predetermined antenna pattern is shown, but it is not intended to be limited to this antenna pattern. FIG. 1 also shows an enlarged view of part E of the antenna AN before and after the IC chip C is mounted. In this example, the IC chip C is mounted at a predetermined reference position Pref that is determined in advance based on the antenna pattern. antenna pattern, but it is not intended to be limited to this antenna pattern. FIG. 1 also shows an enlarged view of part E of the antenna AN before and after the IC chip C is mounted. In this example, the IC chip C is mounted at a predetermined reference position Pref that is determined in advance based on the antenna pattern. antenna pattern, but it is not intended to be limited to this antenna pattern. FIG. 1 also shows an enlarged view of part E of the antenna AN before and after the IC chip C is mounted. In this example, the IC chip C is mounted at a predetermined reference position Pref that is determined in advance based on the antenna pattern. ーンを基準として予め決定されている所定の基準位置PrefにICチップCが搭載され The IC chip C is extremely small, for example, with dimensions of several hundred micrometers in length and width. It is required that the IC chip C of IZ be precisely mounted at the reference position Pref.

[0009] To mount IC chip C on antenna AN, point it towards the reference position Pref of antenna AN. The IC chip placement step involves applying an adhesive and placing the IC chip C on the adhesive, and bonding A curing process is required to harden the agent and strengthen the connection between antenna AN and IC chip C. .

[0010] In the IC chip placement process described later, as shown in Figure 2, multiple antennas AN are set to a constant pitch. A strip-shaped antenna sheet AS (an example of an antenna continuum) formed on a substrate BM is wound using a tool. The rotating rolled PR is installed. The antenna sheet AS is continuously pulled from the rolled PR. They are then released and fed into the IC chip placement line. The material of the base material BM is not particularly limited, but for example, high-quality paper, coated paper, etc. Paper-based substrates such as paper, PET (polyethylene terephthalate), PE (polyethylene), Synthetic resin films made from PP (polypropylene) and PS (polystyrene), and the aforementioned Sheets made by combining multiple types of synthetic resins, and composite sheets made by combining synthetic resin film and paper. It can also be used. Antenna AN is, for example, made by attaching a metal foil to a substrate BM, or by attaching a conductive material to the substrate BM. It is formed by screen printing or vapor deposition in a predetermined pattern.

[0011] In the following explanation, we define the XYZ coordinate system as shown in Figure 2. When referring to diagrams showing the arrangement of each process, the view from the YZ plane is called the front view. A view from the XY plane is called a plan view, and a view from the XZ plane is called a side view. In the X direction, the antenna sheet AS drawn out from the roll PR is processed as described below. This is the direction in which the transport takes place, and is also referred to as the transport direction D1 as appropriate. The Y direction is the direction of transport. This is the width direction of the antenna sheet AS, and is also referred to as the width direction D2 as appropriate. The Z direction is the antenna sheet. This direction is perpendicular to AS.

[0012] (1) IC chip placement process The IC chip placement process will be explained below with reference to Figures 3 to 10. Figure 3 shows the implementation. This diagram shows the portion of the IC chip mounting device 1 corresponding to the IC chip placement process. Figure 4 shows a plan view of the chip-embedded tape CT and an enlarged view of its AA cross-section. In the IC chip placement process, the IC chip mounting device 1 places each chip on the antenna sheet AS. With respect to the reference position Pref of the container AN (see Figure 1), an extremely small IC chip is precisely positioned. It is possible to arrange them in a specific way.

[0013] As shown in Figure 3, in the IC chip placement process, the IC chip mounting device 1 is on the conveyor 8 1, dispenser 2, rotary mounter 3, ultraviolet irradiator 41, and imaging device CA 1-CA3, tape feeder 71, tape body take-up reel 72, film winding It includes a reel 73 and a separation roller 74.

[0014] The conveyor 81 (an example of a transport section) pulls out the ante from the roll body PR (see Figure 2). The Nasheet AS is transported downstream of the process at a predetermined transport speed. The upper surface of the conveyor 81 is This corresponds to the conveying surface. Dispenser 2 dispenses a quantitative amount of anisotropic fluid towards the reference position Pref of each antenna AN being transported. Anisotropic conductive paste (ACP); hereinafter simply referred to as "conductive paste" It dispenses ) this conductive paste is an example of an ultraviolet-curing adhesive. Dispenser 2 precisely positions the discharge position relative to the reference position Pref of each antenna AN. To achieve this, the discharge position is configured to be adjustable in the width direction.

[0015] The imaging device CA1 is located upstream of the dispenser 2 and is positioned to apply the conductive paste. To determine the position, images are taken of the area near the reference position Pref of each antenna AN. The imaging device CA2 is located downstream of the dispenser 2 and provides guidance to each antenna AN. The inspection checks whether the conductive paste has been applied and whether the conductive paste is accurately positioned at the reference position Pref. To check whether or not it has been applied to the area, the reference position Pref of each antenna AN is near Capture an image of the surrounding area.

[0016] The rotary mounter 3 places the IC chip on the conductive paste applied to each antenna AN. This is the chip mounter that places the chips, and it rotates counterclockwise as shown in Figure 3. Rotary mounter 3 It is attached to and suspended by the suspension plate 86. The suspension plate 86 moves in the Y direction on the support base 85. It is possible to support it. Thereafter, the rotary mounter 3 is suspended from above on the support base 85. Furthermore, it has a structure that allows it to move in the Y direction. As will be described later, the rotary mounter 3 picks up the IC chip from the chip-containing tape. The adsorbed IC chip is directed towards the reference position Pref of each antenna AN on the antenna sheet AS. The chip is released and positioned (mounted). At this time, the IC chip is precisely positioned relative to the reference position of antenna AN. To place the IC chip in the pre-positioning tray, a process is performed to correct the position and orientation of the attached IC chip. The imaging device CA3, when mounting the IC chip on antenna AN, determines the position of the IC chip. And for the correction process to correct the orientation, the IC chip, which is held in place by the nozzle (described later), Image the top.

[0017] The tape feeder 71 is mounted with the chip-containing tape containing the IC chip wound around it. The chips are filled and sequentially mounted in the direction of the arrows in Figure 3 at a speed synchronized with the rotary mounter 3. It is designed to pull out the loop. Here, with reference to Figure 4, an example of a chip-containing tape will be described. As shown in Figure 4, the chip-containing tape CT has a constant recess Td that contains the IC chip C. A tape body T is formed at intervals, and a recess Td is attached to the tape body T so as to cover it. The tape body T includes a covering film CF. The recess Td is, for example, embossed on the tape body T. It is formed by applying the following. The IC chip C is formed along the stretching direction of the chip-containing tape CT. Each recess Td is contained within it. In the stretching direction of the chip-containing tape CT, it is taken at regular intervals. Mounting holes H are formed. These mounting holes H determine the precise position of the separation roller 74 relative to its circumferential surface. It is provided for the purpose of separating the chip-containing tape CT when it is transported to the separation roller 74. Then, it is inserted into the projection 74p (described later) provided on the separation roller 74.

[0018] As shown in Figure 4, the bottom surface of the recess Td and the back surface of the tape body T (where the covering film CF is attached) Adsorption pores Ts are formed between the surface being treated and the surface opposite to it. To prevent the IC chip C from falling out of the recess Td when the covering film CF is peeled off, a separation rod It is provided by -ra 74 to attract IC chip C.

[0019] Referring again to Figure 3, the separation roller 74 receives one or more tapes from the tape feeder 71. The coating film CF is peeled off from the chip-containing tape CT supplied via the auxiliary roller. The tape body T and the covering film CF are separated. The covering film CF is peeled off and exposed. The IC chip C is sequentially attracted to each nozzle provided on the rotary mounter 3. The separation roller 74 separates the chip-containing tape CT into the tape body T and the covering film CF. After being separated, the tape body T passes through one or more auxiliary rollers to the tape body take-up reel 7 The film CF is wound onto the 2nd and then passed through one or more auxiliary rollers to the film winding roller. It gets wound up on the 73.

[0020] Next, the rotary mounter 3 will be described with reference to Figures 5 to 7. Figure 5 is a side view of the rotary mounter 3 in the IC chip mounting device 1 of the embodiment. Figure 6A is a plan view of the nozzle unit mounted on the rotary mounter 3. Figure B is a side view of the nozzle unit 30. Figure 7 shows the rotary mounter 3 and antenna. This diagram provides a general overview of the relationship with AS.

[0021] As shown in Figure 5, the rotary mounter 3 has a rotary head 3H (nozzle mounting part) (Example) Multiple nozzle units 30-1 to 30-1 radiate outwards from one nozzle unit (12 in the illustrated example) Unit 2 is installed. The following description applies to nozzle units 30-1 to 30-12 in common. When referring to these items, they will be collectively referred to as the nozzle unit 30. Although details of the rotary head 3H are not shown in the diagram, the nozzle unit rotates counterclockwise as shown in Figure 5. Rotary drive motor (rotary drive motor M31, described later) that rotates parts 30-1 to 30-12. And, a vacuum pump for adsorbing the IC chip to the nozzle unit 30, and the nozzle unit It is connected to a blower for ejecting IC chips from point 30.

[0022] Referring to Figure 6, the nozzle 32, sleeve 33, solenoid valve 35, and cylinder drive motor It is equipped with a 30. The nozzle 32 is located at the tip of the nozzle unit 30, It is connected to the cylinder drive motor M30 within the 33. Cylinder drive motor M30 ( An example of the first rotating part is a motor (for example, a stepping motor) that rotates the nozzle 32 around its axis. It is a motor. The nozzle 32 has a passage that can communicate with the intake pipe 36 and the exhaust pipe 37. It has been done. The sleeve 33 is connected to an intake pipe 36 and an exhaust pipe 37. The intake pipe 36 is under vacuum. The exhaust pipe 37 is connected to a pump (not shown) and a blower (not shown). The solenoid valve 35 is, for example, a 3-port solenoid valve, and depending on the energized state of the solenoid valve 35, The passage between the passage 34 of the sul 32 and the intake pipe 36 is left open, and the exhaust pipe 37 is closed, or This is done by opening the passage 34 of the nozzle 32 and the exhaust pipe 37, and closing the intake pipe 36. It is configured as follows. The solenoid valve 35 is a suction valve that draws air through the intake pipe 36 using the nozzle 32. Either perform a function, or perform a discharge operation in which air is discharged from the nozzle 32 through the exhaust pipe 37. It is structured in this way.

[0023] Referring to Figure 7, the rotary head 3H is rotated counterclockwise by a rotary drive motor (not shown). It is rotated around, thereby on the circumference of the rotary head 3H of each nozzle unit 30 The position in the rotary head is switched sequentially. In other words, a specific nozzle unit 30 is in the rotary head As the 3H rotates, it moves along an annular trajectory on a plane perpendicular to the transport surface, from position PA. The 12 positions PA to PL on the circumference of the rotary head 3H in a counterclockwise direction They will be positioned in that order.

[0024] Here, position PA (an example of the first position) is where the nozzle unit 30 is located on the chip-containing tape CT. This is the position where the IC chip C is newly adsorbed. Position PE is the nozzle of the nozzle unit 30. The image of the IC chip C, while it is attached to the rod, is captured by the imaging device CA3 at this position. ru. Position PK (an example of a second position) is applied to antenna AN on the antenna sheet AS being transported. This is the position where the adsorbed IC chip C is released from the conductive paste that is being applied. Position PK Therefore, the direction of movement of the nozzle tip coincides with the transport direction D1 of the antenna sheet AS. Position PK Next, air is discharged from the nozzle of the nozzle unit 30 in order to eject the IC chip C. At position PL, since the IC chip C has already been ejected at position PK, the nozzle unit 30 IC chip C is not being adsorbed. Note that position PL removes any debris that may adhere to the nozzle. To do this, air may be released from the nozzle. Figure 7 shows the collection of dust that may be released from the nozzle. An example is shown where a waste collection tray TR is placed at position PL for collection.

[0025] For example, in Figure 7, the nozzle unit 30-1 located at position PA is where the IC chip C It newly attracts the IC chip C, and while holding it in place, rotates counterclockwise until it reaches position PK. The IC chip C is then released, and upon returning to position PA, it is repeatedly attracted to a new IC chip C. The process is repeated. In this IC chip mounting method, the transport of the antenna sheet AS is not stopped. IC chips can be continuously placed on each antenna AN, resulting in high productivity.

[0026] The nozzle unit 30, which reaches position PK in order, is transported from upstream to antenna sheet A. The rotor emits IC chip C toward the reference position Pref of each antenna AN of S. The angular velocity of the lead head 3H and the transport speed of the antenna sheet AS are set or controlled. For reliable placement of the IC chip C, the speed of the tip of the nozzle unit 30 near position PK It is preferable to provide a section where the transport speed of the antenna sheet AS and the transport speed are constant.

[0027] In this embodiment, 12 nozzle units 30 are arranged on the rotary head 3H. Examples are shown, but this is not always the case. Nozzles are installed on the rotary head 3H. The number of units 30 can be set arbitrarily.

[0028] Next, referring to Figures 8 and 9, the IC chip C is attracted by the nozzle unit 30. Let's explain the action of being able to do something. Figure 8 is a perspective view showing the chip-containing tape CT being separated by the separation roller 74. Figure 9 is a side view of the vicinity of the separation roller 74, showing the chip-containing tape CT from the nozzle. This diagram illustrates the operation in which the IC chip C is supplied to the unit 30. Figure 9 shows the chip To show the condition of the embedded tape CT, only the chip-embedded tape CT is shown in cross-section.

[0029] As shown in Figure 8, mounting holes for the chip-containing tape CT supplied from the tape feeder 71 When the projection 74p of the separation roller 74 is inserted into H, the width direction of the chip-containing tape CT The chip-containing tape CT is transported while in a positioned state. At this time, the branching member 75 The coating film CF of the chip-containing tape CT is peeled off and the film is taken up by the film reel 7 Proceed to 3. On the other hand, the tape body T of the chip-containing tape CT is connected to the tape body take-up reel 7. Proceed to 2.

[0030] As shown in Figure 9, the IC chip C, which has been exposed after the coating film CF has been peeled off, is immediately no longer available. It is attracted by the suction unit 30. At this time, the IC chip C is exposed before the nozzle unit To prevent the IC chip C from falling out during the short time it takes for it to be attracted by the knit 30, The separation roller 74 is designed to attract the IC chip C toward the rotation center of the separation roller 74. A suction channel (not shown) is provided. This suction channel and the suction holes T provided in the tape body T are connected. The IC chip C is attracted through s (see Figure 4).

[0031] Next, referring to Figure 10, the moving mechanism 8 moves the rotary head 3H in the width direction D2. This will be explained. Figure 10 is a front view of the moving mechanism 8. The movement mechanism 8 corrects the position of the IC chip C in the width direction D2 that the nozzle unit 30 has attracted. It is provided to make this possible. As shown in Figure 10, the moving mechanism 8 has a bearing 76, and a shaft Foot 77, suspension plate 86, guide plate 87, slider 88, and width direction drive motor M32 It holds. The bearing 76, shaft 77, and width-direction drive motor M32 are mounted on the support base 85. The shaft 77 is a rod-shaped member having a threaded portion, and the width direction drive motor M It is rotationally driven by 32. The shaft 77 is fixed to the upper surface of the support base 85 by bearing 76 It is rotatably supported by (2 points). The rotary head 3H is attached to the suspension plate 86. The upper end of the suspension plate 86 is threaded. A cut hole (not shown) is formed, and this hole is the thread of the shaft 77. It fits into the cut section. Therefore, in accordance with the rotation of the shaft 77, the suspension plate 86 and the suspension The rotary head 3H attached to the plate 86 is movable in the width direction D2. The upper part of the support base 85 and the guide plate 87 have a range of motion in the width direction D2 of the suspension plate 86. An empty space is provided. The slider 88 is attached to the suspension plate 86, and the width of the suspension plate 86 As the widthwise movement in direction D2 occurs, the upper surface of the guide plate 87 slides. With the above configuration, the moving mechanism 8 moves in accordance with the rotational drive of the width-direction drive motor M32. The toy head 3H is made displaceable in the width direction D2.

[0032] In this embodiment, the rotary head 3H is moved in the width direction D2 by the moving mechanism 8. This allows the nozzle unit 30 attached to the rotary head 3H to be moved in the width direction D2. An example of movement is shown, but this is not the only case. For example, the rotary head can be moved in the width direction D2 Without moving them, each nozzle unit 30 inside the rotary head moves individually in the width direction The rotary head may be configured to be displaceable to D2.

[0033] Referring again to Figure 3, the nozzle unit 30 of the rotary mounter 3 is connected to antenna A. A UV irradiator 41 is installed near the location where the IC chip is emitted to N (location PK in Figure 7). It gets kicked. The ultraviolet irradiator 41 irradiates ultraviolet light onto the conductive paste on the transported antenna AN. It is configured to perform the following: The irradiation of ultraviolet light by the ultraviolet irradiator 41 is performed during the IC chip placement process. Unlike the ultraviolet irradiation (described later) performed in the subsequent curing process, Antenna A The objective is to adjust the viscosity of the conductive paste on N. From this perspective, the ultraviolet irradiator 41 The cumulative amount of ultraviolet light applied to the conductive paste is used in the subsequent curing process. It is preferable to make it less than the cumulative amount of ultraviolet light that is given. The cumulative amount of ultraviolet light is the amount of light rays Since it is expressed as the product of intensity and irradiation time, the integrated light amount can be adjusted by adjusting the light intensity and irradiation time. You only need to adjust one of them.

[0034] In the IC chip mounting device 1 of this embodiment, the dispenser 2 supplies the antenna AN to Apply a thermosetting adhesive such as epoxy resin, and replace the ultraviolet irradiator 41 with a thermosetting device. It may be established.

[0035] In Figure 3, the ultraviolet irradiator 41 is configured to irradiate ultraviolet light after the IC chip has been placed. It is placed, but not always. The ultraviolet irradiator 41 is placed before the IC chip is placed. The IC chip may be positioned to irradiate ultraviolet light at the same time as the ultraviolet light is irradiated. They may be positioned to project a line of light. When ultraviolet light is irradiated after the IC chip has been placed, the viscosity of the conductive paste decreases. As a result, the IC chip may shift or tilt after being placed on the conductive paste. This makes it less likely for such things to occur. Before the IC chip is placed, or when the IC chip is placed When UV light is irradiated at the same time, the conductive paste, which has reduced viscosity, will be subjected to IC Since the chip will be placed on the conductive paste, the IC chip will be placed on the conductive paste after it has been placed on the paste. Because it becomes more difficult to move, the IC chip is less likely to shift or tilt. In either case, by irradiating ultraviolet light at a location near where the IC chip is placed, The fluidity of the conductive paste causes the IC chip to be unstable on the conductive paste. This can be avoided. In other words, by irradiating with the ultraviolet irradiator 41, the IC chip This has the advantage of improving the mounting accuracy.

[0036] Next, referring to Figures 11 to 13, the control unit 100 that controls the rotary mounter 3... This section will explain the control performed by this process. Figure 11 is a functional block diagram of the control unit 100. Figure 12 shows an example of an image captured by the imaging device CA1. Figure 13 shows the nozzle 32. This figure illustrates the adsorbed IC chip C before and after rotation of the nozzle 32. The state before rotation shows an example of an image captured by the imaging device CA3. Figure 13 The state after the rotation of the nozzle shows the XYZ axes when the nozzle is at position PK (see Figure 7). They are doing it.

[0037] The control unit 100 is mounted on a circuit board (not shown) and is connected to imaging devices CA1 to CA3, and Dispenser 2, cylinder drive motor M30, rotary drive motor M31, width direction drive motor M 32, solenoid valve 35, and ultraviolet irradiator 41 are electrically connected. Rotary drive motor The M31 (an example of the second rotating part) is a nozzle unit 30- in the rotary head 3H. This is a driving mechanism that rotates 1 to 30-12. The control unit 100 includes a microcomputer, memory (RAM (Random Access Memory)), Includes ROM (Read Only Memory), storage, and drive circuits. Microcomputer The program stored in memory is read and executed by the ejection position adjustment means 101, The functions of the IC chip correction means 102, valve control means 103, and hardening execution means 104 It will be realized.

[0038] The discharge position adjustment means 101 adjusts the conductive plate based on the image captured by the imaging device CA1. Determine the discharge position of the paste, the discharge timing of the conductive paste, and the width of dispenser 2. It has a function to adjust the position of direction D2. The method for determining the discharge position of the conductive paste is shown in Figure 12. For reference, see below. The image captured by the imaging device CA1 is as illustrated in Figure 12, and the antenna AN This is an image of the area near the reference position Pref. The ejection position adjustment means 101 adjusts the reference position Pref from the characteristic shape portion included in the image. Identify the following. Specifically, the discharge position adjustment means 101 is the antenna A in the image of Figure 12. Analyzing the shape of N, we determine that reference lines L1 and L2 are parallel to each other in the X direction, and that in the Y direction... Identify parallel reference lines L3 and L4, and compare the midpoint of reference lines L1 and L2 with reference lines L3 and L4 The intersection of the central lines is identified as the reference position Pref.

[0039] Point Pj1 in the image in Figure 12 is the target position of the reference position Pref on the image, and the imaging device Calibration between the image from CA1 and the dispensing position of the conductive paste from dispenser 2. This is a predetermined position based on the results of the operation. In other words, it is a reference position identified on the image. The dispensing timing and width direction of dispenser 2 are adjusted so that position Pref coincides with the target position Pj1. By adjusting the position of D2, the conductive paste is applied to the actual reference position of antenna AN. It is possible. In the example in Figure 12, the reference position Pref identified on the image coincides with the target position Pj1. To achieve this, the position needs to be adjusted by x1 in the X direction and y1 in the Y direction. Specifically, x1 Based on the transport speed of antenna AN, the dispensing timing from dispenser 2 is Based on the determined y1, the widthwise displacement D2 of the dispenser 2 is performed. In other words, the dispensing The position adjustment means 101 adjusts the dispensing timing and width direction D2 relative to the dispenser 2. A control signal is sent to indicate the position, and based on this control signal, dispenser 2 moves To carry out a project.

[0040] The image captured by the imaging device CA2 is, except for the fact that conductive paste is applied, This image is similar to Figure 12.

[0041] The IC chip correction means 102 has a function to correct the IC chip that has been attracted to the nozzle 32. The method for correcting the IC chip is as follows, referring to Figures 12 and 13. . As shown in Figure 13, before rotation, the image was captured by the imaging device CA3 (an example of an image acquisition unit). The captured image shows the nozzle end 32e of the nozzle 32 and the IC chip adsorbed to the nozzle end 32e. The diagram includes chip C. Point Pc1 is the center position of IC chip C before nozzle rotation. Point Pj2 in image 13 is the target position of the center of IC chip C in the image, as shown in Figure 12. It is set to coincide with the target position Pj1. In other words, the center position of the IC chip C is set By aligning it with the target position Pj1, the IC is positioned at the reference position of the actual antenna AN being transported. It is now possible to place a C-cup.

[0042] The rotation center Prc around the axis of nozzle 32 is the mounting point of nozzle unit 30-1 to 30-12. Due to variations in attachment, etc., this does not represent the theoretical axis center of each nozzle. The rotation center Prc is for each nozzle It varies depending on the cheating unit, and is identified, for example, based on previously obtained measured data. First, around the rotation center Prc of the nozzle 32, within the IC chip C shown in the image When the heart Pc1 is rotated, the reference line of IC chip C (for example, IC chip C in Figure 13) The amount of rotation required until the reference side (Sc) becomes parallel to the Y direction is determined. In the example of the rotated state in Figure 13, the IC chip in the captured image rotates around the rotation center Prc. Rotate chip C so that the reference side Sc of IC chip C is parallel to the Y direction. The rotation angle at that time is identified as the correction amount for the rotation direction of the IC chip C (an example of a first correction amount). Here, if we define the center position of the IC chip C after movement as point Pc2, then point Pc2 is the target position. To match Pj2, the correction amount in the X direction (an example of the second correction amount) is x2, and the correction amount in the Y direction is (An example of the third correction quantity) is identified as y2.

[0043] The IC chip correction means 102 controls the amount of correction in the rotational direction around the axis of the nozzle 32. A signal is sent to the cylinder drive motor M30, thereby positioning PE (imaging device CA3) Between the position where the image is taken and the position PK where the IC chip is ejected, the nozzle 32 rotates axially. It rotates. The IC chip correction means 102 controls a control signal corresponding to the correction amount x2 in the X direction, and the rotation drive motor The signal is sent to the drive circuit that drives the M31, thereby increasing the angular velocity of the rotary head 3H. The adjustment is made. The IC chip correction means 102 provides a control signal corresponding to the correction amount y2 in the Y direction. The signal is sent to the drive circuit that drives the width-direction drive motor M32, thereby driving the rotary head 3 The position of H in the width direction D2 is adjusted. The position of rotary head 3H in the width direction D2 is adjusted. This also adjusts the position of the nozzle 32 in the width direction D2.

[0044] In the IC chip mounting device 1 of this embodiment, the IC chip correction means 102 corrects the IC chip The position of the IC chip in the X and Y directions, and in a plane perpendicular to the nozzle axis. Because orientation correction is performed, the mounting accuracy of the IC chip's antenna relative to its reference position is very high. It has the advantage of being expensive.

[0045] The valve control means 103 controls the 12 nozzle units 30- included in the rotary mounter 3. For each of 1 to 30-12, each nozzle unit according to the position of each nozzle unit 30 Each electromagnetic unit performs either an action of drawing air in or expelling air from unit 30. The valve 35 is controlled. Specifically, the valve control means 103 controls the nozzle unit 30 when it is in position PA~ When positioned in PJ (see Figure 7), the solenoid valve 35 draws air from the nozzle unit 30. Controlling the nozzle unit 30 when it is in position PK or PL, the nozzle unit 30 The solenoid valve 35 is controlled to expel air.

[0046] The curing execution means 104 performs a predetermined procedure for each of the transported antennas AN. A predetermined drive signal is sent so that ultraviolet light is emitted from the ultraviolet irradiator 41 based on the accumulated light intensity. It is sent to the launcher 41.

[0047] (2) Curing process Next, the curing process will be explained with reference to Figures 14 and 15. In the curing process, the conductive coating applied to each antenna after the IC chip placement process described above is removed. The superst hardens to strengthen the physical connection between the antenna and the IC chip, and also the antenna Ensure electrical conductivity between the antenna and the IC chip.

[0048] Figure 14 shows the portion corresponding to the curing process in the IC chip mounting apparatus 1 of the embodiment. Figure 15 shows a part of the pressing unit 6 and the ultraviolet irradiator 42 as seen from arrow J in Figure 14. This is the diagram shown.

[0049] As shown in Figure 14, in the curing process, the IC chip mounting device 1 has a conveyor 82 and a hardening It includes a photocatalyst 4 and an imaging device CA4. The conveyor 82 transports the antenna sheet AS, which is being transported from the upstream IC chip placement process, downwards. It is transported in the direction of the flow at a predetermined transport speed. The imaging device CA4 is located at the very upstream end of the curing process (i.e., the most upstream end of the IC chip placement process). On the downstream side, it is positioned above the antenna sheet AS, and is used in the IC chip placement process. Images of each antenna AN being transported are captured. The imaging device CA4 is used in the IC chip placement process. In order to check whether the IC chip is positioned in the correct location, ru.

[0050] As shown in Figure 14, the curing apparatus 4 consists of one or more pressing units 6 and an ultraviolet irradiator 42 It holds. The pressing unit 6 moves up and down in a direction perpendicular to the transport surface, and the conductive paste of antenna AN is applied. The IC chip positioned on top is pressed while ultraviolet light is being irradiated onto each antenna AN. The number of pressure units 6 is not fixed, but can be set to any number from the standpoint of productivity and cost. . The ultraviolet irradiator 42 is positioned along the transport direction D1. Therefore, antenna sheet A It is also possible to simultaneously irradiate multiple antennas AN on S with ultraviolet light.

[0051] Referring to Figure 15, each antenna AN is irradiated with ultraviolet light by the ultraviolet irradiator 42. The state in which this occurs is shown. As shown in Figure 15, the pressing unit 6 is at the tip of the shaft 63 The structure is such that a pressing portion 61 is attached. The side of the pressing portion 61 of the pressing unit 6 (that is, The side on which the ultraviolet irradiator 42 is placed is open. The glass plate 61p is made of glass that transmits ultraviolet light. The ultraviolet irradiator 42 has a light source 42e such as an LED (Light Emitting Device). The light source 42e emits ultraviolet light from a direction oblique to the transport surface, directed towards antenna AN. It is configured to irradiate with light. While pressing the IC chip on the conductive paste applied to each antenna AN, UV light is shone on it. By performing radiation, the conductive paste applied to each antenna AN hardens, and the antenna This strengthens the physical connection between the antenna and the IC chip, as well as the electrical connection between the antenna and the IC chip. The electrical connection will be more reliable.

[0052] As explained above, multiple antennas are formed on the substrate at a constant pitch in a strip-like shape. The antenna sheet is fed into the line, and after the IC chip placement process and curing process, each antenna An IC chip is mounted on top. The IC chip mounting device of this embodiment is an IC chip placement process In this process, adhesive is applied towards the reference position of the antenna, and an IC chip is placed on the adhesive. The pin is positioned, and the adhesive is cured during the curing process to firmly connect the antenna and IC chip. In particular, in this embodiment, in the IC chip placement process, the X direction and Y direction of the IC chip The position of the IC chip, and the IC chip in a plane perpendicular to the axis of the nozzle that attracts the IC chip. The orientation is corrected. Therefore, when mounting an IC chip on the antenna, the IC chip This can improve the precision of the mounting position.

[0053] The embodiments of the IC chip mounting device and IC chip mounting method have been described above, but this The invention is not limited to the embodiments described above. Furthermore, the embodiments described above do not depart from the spirit of the present invention. Within a certain range, various improvements and modifications are possible.

[0054] For example, in the embodiment shown in Figure 3, in the IC chip placement process, antenna sheet A The example shown assumes that S is transported in one direction on the conveyor belt 81, but this is not always the case. In one embodiment, as shown in Figure 16, in the IC chip placement process, the suction drum 92 ,94 and multiple conveyor rollers (for example, in Figure 17, conveyor rollers 91, 93, 95) The antenna sheet AS may be transported. In Figure 16, at the highest position of the suction drum 92, The conductive paste is dispensed by the dispenser 2 at the reference position of antenna AN on the antenna sheet AS. It is then ejected. Also, at the highest position of the suction drum 94, the IC chip is placed on the conductive paste. In this case, at least the suction drums 92 and 94 will absorb the back surface of the antenna sheet AS. It is preferable that the suction roller is attached to the surface. This prevents misalignment of the antenna sheet AS. (Especially in the longitudinal direction) this can prevent the discharge of conductive paste and the placement of IC chips. It can be done with high precision.

[0055] In one embodiment, a guide is applied to the antenna AN, which is in the shape of an antenna sheet AS that is being transported. Instead of releasing the IC chip onto the conductive paste, the IC chip is pressed into the conductive paste. They may be arranged by moving them. Figure 17 shows the rotor when the IC chip is placed by pressing it into conductive paste. The operation of the re-mounter 3 is shown in chronological order. In one embodiment, the rotary mounter 3 Each nozzle unit 30 can be individually moved in the radial direction by a built-in drive device. It is structured like a Noh play. State ST1 is the state in which the nozzle unit 30 has attracted the IC chip C. When positioning the C chip C, the nozzle unit 30 is directed to emit light as shown in state ST2. It extends radially towards the reference position (that is, downwards, i.e., the Z direction in Figure 2). Move it to and press the IC chip C onto the conductive paste applied to antenna AN. This places the IC chip C onto the conductive paste. After placing the IC chip C, adsorption The nozzle unit 30 is released and returned to the position of state ST1. When knit 30 reaches position PK (see Figure 7), the actions of states ST1 to ST3 are performed. As a result, the IC chip C is placed on the conductive paste applied to the antenna AN.

[0056] Figure 18 shows the curing process of one embodiment. Figure 18 shows the curing process of one embodiment. A curing device 4A is shown. The curing device 4A has multiple ultraviolet curing units 43 mounted on a plate 4 It is detachably attached to 4. Antenna AN adjacent to antenna sheet AS Multiple mounting plates 44 with different mounting positions are prepared according to the interval, By replacing the mounting plate 44, it can be made compatible with various antenna sheets AS. . The support shaft 45 supports the mounting plate 44 and is configured to allow the mounting plate 44 to move up and down. The antenna sheet AS, transported from the top placement process, is carried via the transport rollers 96-98. It is sent to the curing process. The transport roller 97 is configured to be able to move up and down by a drive device (not shown). It is being done.

[0057] An example of the configuration of the ultraviolet curing unit 43 is shown in Figure 19. As shown in Figure 19, The knit 43 contains a light source 432 (e.g., an LED light source) for irradiating ultraviolet light into the housing 431. It has a built-in light source 432, which is supplied from outside the ultraviolet curing unit 43 via cable 43. Power is supplied by 6 (not shown in Figure 18). Inside the housing 431, light is provided by the light source 432. A focusing lens may be provided to concentrate the incoming ultraviolet light. The retaining plate 434 is connected to the housing 431. They are connected and hold the glass plate 435. Ultraviolet light irradiated from the light source 432 is directed at each element. The conductive paste applied to Tena AN is irradiated, causing the conductive paste to harden.

[0058] Referring again to Figure 18, the transport state is from the IC chip placement process to the antenna sheet AS This shows the state of transport. Antenna AN, to which the uncured conductive paste has been applied, is purple. When the antenna sheet AS is positioned directly below the external hardening unit 43, the transport of the antenna sheet AS stops. And, when the transport of the antenna sheet AS is stopped (stopped state), purple The external hardening unit 43 is moved downward and the antenna AN is pressed by the glass plate 435. While doing so, ultraviolet light is irradiated to harden the conductive paste.

[0059] Even when stopped, the antenna sheet AS is transported from the IC chip placement process. Therefore, while ultraviolet light is being irradiated, the transport roller 97 descends by its own weight, and the transported annealed The Tenasheet AS is absorbed between the conveyor rollers 96 and 98. The ultraviolet irradiation ends. Then, antennas AN, corresponding to the number of ultraviolet curing units 43, are rapidly transported downstream. Stop the unit so that the uncured antenna AN is positioned directly below the UV curing unit 43. Furthermore, in the curing process of one embodiment, the transport state and the stopped state of the antenna sheet AS (ultraviolet light) The state of firing is repeated. When rapidly transporting antenna AN, transport roller 97 It rises due to the tension applied to the antenna sheet AS.

[0060] The curing process in one embodiment may be carried out using a thermosetting device. That is, a dispenser In step 2, if a thermosetting adhesive such as epoxy resin is applied, the curing process involves heat The adhesive is hardened by a curing process. Figure 20, similar to Figure 18, shows the repeated cycles of transporting and stopping the antenna sheet AS. This is a curing device 4B configured to do so. Unlike curing device 4A, curing device 4B is configured to do so. It comprises multiple thermosetting units 46. Each thermosetting unit 46 is connected by a cable (not shown) A heat source that operates when power is supplied is positioned. The support shaft 45 is driven to descend, and each thermosetting unit 46 corresponds to antenna A The adhesive is heated and cured while pressing down on N. Once heating is complete, the support shaft 45 rises. The system is driven in this manner, and the antenna sheet AS is transported.

[0061] In Figure 18, when the conductive paste is cured by ultraviolet light, the light source is built into the device. Instead of the UV curing unit 43, a pressing unit presses the antenna AN through a glass plate. Using a tool, the conductive paste on the antenna AN, which is being pressed in a stationary state, is applied to the outer surface in the width direction. Alternatively, an ultraviolet irradiation device that irradiates ultraviolet light from diagonally above may be provided. In one embodiment, the antenna sheet AS is set to a stopped state when ultraviolet light is irradiated. To prevent this, multiple UV curing units 43 are linked to the progression speed of the antenna sheet AS. The antenna AN is moved in a circular motion, and while pressing it, ultraviolet light is irradiated by the built-in light source. That's good too. Similarly, in one embodiment, when a conductive paste is heat-cured, a plurality of heat-curing units 4 Move 6 in a circular motion in conjunction with the advance speed of the antenna sheet AS, and press against the antenna AN. It may be configured to heat while simultaneously heating. [Explanation of symbols]

[0062] 1...IC chip mounting device, 2...Dispenser, 3...Rotary mounter, 3H...Rotor Leehead, 4, 4A, 4B... hardening device, 6... pressing unit, 8... moving mechanism, 30... nozzle 32... Nozzle unit, 32e... Nozzle end, 33... Sleeve, 34... Passage, 35... Electrical unit Magnetic valve, 36... Intake pipe, 37... Exhaust pipe, 41, 42... Ultraviolet irradiator, 42e... Light source, 43... UV curing unit, 44…Mounting plate, 45…Support shaft, 46…Heat curing unit, 61…Pressing Part 61p...Glass plate, 63...Shaft, 71...Tape feeder, 72...Tape body winding mechanism Reel, 73...Film winding reel, 74...Separation roller, 74p...Protrusion, 75...Branch Components, 76...bearings, 77...shafts, 81, 82...conveyors, 85...support bases, 86...suspensions Board, 87... Guide plate, 88... Slider, 91, 93, 95~98... Conveyor roller, 92, 9 4... Suction drum, 100... Control unit, 101... Discharge position adjustment means, 102... IC chip correction Means, 103... Valve control means, 104... Hardening execution means, AN... Antenna, AS... Antenna , BM...substrate, C...IC chip, CA1~CA4...imaging device, CF...coating film, CT...Chip-containing tape, H...Mounting hole, M30...Cylinder drive motor, M31...Rotation drive Motor, M32...Width-direction drive motor, PR...Roll body, T...Tape body, TR...Garbage collection Tray, Td...recess, Ts...suction hole

Claims

1. A method for arranging IC chips on an antenna, At the first position, the nozzle attracts the IC chip. While moving the IC chip from the first position to the second position where the IC chip is placed on the antenna, an image of the IC chip held by the nozzle is acquired. Based on the acquired image, the amount of correction for the angle around the axis of the nozzle is determined as a correction value for the nozzle to position the IC chip at the reference position of the antenna. IC chip placement method.

2. After correcting the nozzle based on the correction value, the adsorption of the IC chip by the nozzle is released at the second position and the IC chip is placed at the reference position of the antenna. The IC chip arrangement method described in claim 1.

3. This is a program for placing an IC chip on an antenna. A procedure for adsorbing an IC chip onto a nozzle at a first position, A procedure for acquiring an image of the IC chip that is attracted to the nozzle while moving the IC chip from the first position to the second position where the IC chip is placed on the antenna, A procedure for determining the amount of correction for the angle around the axis of the nozzle as a correction value for the nozzle to position the IC chip at the reference position of the antenna, based on the acquired image, A program that causes a computer to execute something.

Images