System and method for monitoring spatial light modulator (SLM) flares

Abstract

The problem of the presence of excessive flare in maskless photolithography systems is addressed by a system and method that utilizes an aerial imaging system to monitor flare associated with the maskless photolithography system.

Description

Technical Field

[0001] Cross-reference This application claims priority to U.S. Provisional Patent Application No. 63 / 337,682, filed May 3, 2022, entitled "SYSTEM AND METHODS FOR MONITORING SPATIAL LIGHT MODULATOR (SLM) FLARE," which is hereby incorporated by reference in its entirety for all purposes.

Background Art

[0002] Certain maskless photolithography systems and methods utilize one or more light sources, a spatial light modulator (SLM), and projection optics to project spatially patterned light onto a photoresist on a wafer. The spatial pattern imparted by the SLM determines the locations where the photoresist is exposed. To expose all of the photoresist on the wafer, the wafer is moved relative to the SLM and the projection optics (e.g., using an actuator system that moves the stage on which the wafer is located). As the wafer is moved, the spatial pattern imparted by the SLM is updated to expose the photoresist at desired locations on the wafer. However, the use of an SLM in maskless photolithography can introduce extra flare into the maskless photolithography system optics. Accordingly, systems and methods for monitoring flare (e.g., SLM flare) in a maskless photolithography system are presented herein.

[0003] Various embodiments of the present invention are disclosed in the following detailed description and the accompanying drawings.

Brief Description of the Drawings

[0004] [Figure 1A] A schematic diagram showing an exemplary system for monitoring SLM flare in a maskless photolithography system when the system is operating at a first position. [Figure 1B]A schematic diagram shows an exemplary system for monitoring SLM flare in a maskless photolithography system when the system is operating in a second position. [Figure 2A] A flowchart illustrating a first exemplary method for monitoring SLM flare in a maskless photolithography system is shown. [Figure 2B] A flowchart illustrating a second exemplary method for monitoring SLM flare in a maskless photolithography system is shown. [Figure 3] This is a block diagram of a computer system used in some embodiments to perform part of the method for monitoring SLM flare in the maskless photolithography system described herein. [Figure 4A] An example of a checkerboard SLM pattern or reference modulation pattern described herein is shown. [Figure 4B] Figure 4A shows an example of a simulated illuminance profile obtained after passing light through the checkerboard pattern. [Figure 4C] Figure 4B shows an example of the simulated central intensity of the illuminance profile. [Figure 4D] Figure 4C shows an example of the simulated contrast of the illuminance profile. [Modes for carrying out the invention]

[0005] The present invention can be realized in many ways, including processes, apparatus, systems, compositions of materials, computer program products embodied on computer-readable storage media, and / or processors, such as processors configured to execute instructions stored in memory coupled to a processor and / or instructions provided by memory. These implementations, or any other forms the present invention may take, may be referred to as "technologies." Generally, the order of the steps of the disclosed process can be modified within the scope of the invention. Unless otherwise specified, components such as processors or memory described as configured to perform a task may be implemented as general components temporarily configured to perform a task at a given time, or as specific components manufactured to perform a task. As used herein, the term "processor" refers to one or more devices, circuits, and / or processing cores configured to process data, such as computer program instructions.

[0006] A detailed description of one or more embodiments of the present invention is provided below, along with accompanying drawings illustrating the principles of the present invention. While the present invention is described in relation to such embodiments, it is not limited to any embodiment. The scope of the present invention is limited solely by the claims, and the present invention encompasses numerous alternative forms, modifications, and equivalents. Numerous specific details are described below to provide a complete understanding of the present invention. These details are provided for illustrative purposes only, and the present invention can be carried out in accordance with the claims without some or all of these specific details. For clarity, technical materials known in the art relating to the present invention are not described in detail so as not to unnecessarily obscure the present invention.

[0007] As used herein, the term "or" shall convey both a disjunctive and a conjunctive meaning. For example, the phrase "A or B" should be interpreted as including element A alone, element B alone, and a combination of elements A and B.

[0008] As used herein, the term “flare” refers to unwanted reflected or scattered light reaching a wafer during a photolithography process. Flare can be caused by light traveling in a direction different from that predicted by ray tracing. Flare can generally degrade exposure quality in photolithography by providing exposure to nominally dark areas on the wafer, thereby reducing contrast. Flare can be quantified as the percentage of total light energy reaching the wafer resulting from undesirable reflection or scattering within the photolithography system or its components.

[0009] Certain maskless photolithography systems and methods utilize one or more light sources, spatial light modulators (SLMs), and projection optics to project spatially patterned light onto a photoresist on a wafer. The spatial pattern imparted by the SLM determines the location where the photoresist is exposed. To expose all the photoresist on the wafer, the wafer is moved relative to the SLM and projection optics (e.g., using an actuator system that moves the stage on which the wafer is positioned). As the wafer is moved, the spatial pattern imparted by the SLM is updated to expose the photoresist at the desired location on the wafer. However, the use of SLMs in maskless photolithography can introduce extra flare into the maskless photolithography system optics. For example, an SLM can operate in piston mode by raising or lowering micromirrors. This raising and lowering process may impart a 0-degree or 180-degree phase to each pixel of the SLM. However, small errors in the raising and lowering process can result in phase errors that manifest as flare. Small gaps between micromirrors, holes in the center of the micromirrors, and defects in the micromirror coatings can also contribute to flare. Furthermore, flares associated with SLM can change over time as their components change over time.

[0010] Therefore, the problem of excessive flare in maskless photolithography systems is addressed by systems and methods that utilize an aerial imaging system to monitor flare associated with maskless photolithography systems. The systems and methods generally utilize a stage configured to support a SLM and a reference plate featuring a reference modulation pattern. The stage is movable between two positions, allowing either the SLM or the reference plate to receive light from a light source. When the stage is positioned so that the SLM can receive light, the SLM imparts an SLM modulation pattern to the light, projecting the spatially modulated light onto a projection lens. The projection lens projects a first image corresponding to the spatially modulated light. The first image is received by an aerial imaging system. When the stage is positioned so that the reference plate can receive light, the reference plate imparts a reference modulation pattern to the light, projecting the reference modulated light onto the projection lens. The projection lens projects a second image corresponding to the reference modulated light. The second image is received by an aerial imaging system. The spatially modulated light includes a first flare pattern, which includes a contribution from the SLM, and the reference modulated light includes a second flare pattern, which includes a contribution from the reference plate. Assuming the reference plate is substantially free of defects, the flare associated with the SLM can be determined by subtracting the second flare pattern from the first flare pattern. The resulting flare can be used to modify one or more parameters associated with the SLM, such as the exposure time or exposure intensity of the spatially modulated light on the photoresist.

[0011] Provided herein is a system for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, the system comprising a stage configured to support an SLM and a reference plate, the stage being movable between a first position where the SLM receives light from a light source, imparts an SLM pattern to the light source, and projects spatially modulated light based on the SLM pattern, the spatially modulated light comprising a first flare pattern associated with the SLM, and a second position where the reference plate receives light from a light source, imparts a reference modulation pattern to the light source, and projects referencely modulated light based on the reference modulation pattern, the referencely modulated light comprising a second flare pattern associated with the reference plate, and when the stage is in the first position, the spatially modulated light receives, spatially modulated light The system comprises: a projection lens configured to project a first image corresponding to dimming, and when the stage is in a second position, to receive a reference modulated light and project a second image corresponding to the reference modulated light; an aerial imaging system configured to receive a first image and output a corresponding first signal when the stage is in a first position, and when the stage is in a second position, to receive a second image and output a corresponding second signal; and a controller operably coupled to the stage and the aerial imaging system, configured to (a) move the stage to a first position, (b) receive a first signal, (c) move the stage to a second position, (d) receive a second signal, and (e) determine a third flare pattern related to the SLM error based on the difference between the first signal and the second signal. In some embodiments, the system further comprises a light source configured to project light source light. In some embodiments, the controller is further operably coupled to the SLM, and the controller is further configured to modify one or more parameters related to the SLM in accordance with the third flare pattern. In some embodiments, one or more parameters include one or more elements selected from the group consisting of exposure time of spatially modulated light on the photoresist, exposure intensity of spatially modulated light on the photoresist, and phase of one or more pixels related to SLM.In some embodiments, the reference modulation pattern includes a static modulation pattern. In some embodiments, the aerial imaging system includes at least one deep ultraviolet (DUV) camera. In some embodiments, the SLM pattern or reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark. In some embodiments, the light source includes OBKK light or BBSK light. In some embodiments, the controller includes a processor and a memory coupled to the processor, the memory being configured to provide the processor with instructions that, when executed, cause the processor to perform (a) to (e). In some embodiments, the controller includes a processor configured to perform (a) to (e) and a memory coupled to the processor and configured to provide the processor with instructions that perform (a) to (e).

[0012] Further provided herein is a method for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, the method comprising: (a) projecting light source onto an SLM to impart an SLM pattern to the light source; and projecting spatially modulated light based on the SLM pattern, wherein the spatially modulated light includes a first flare pattern associated with the SLM; (b) receiving the spatially modulated light and using a projection lens to project a first image corresponding to the spatially modulated light; and (c) receiving the first image and using an aerial imaging system to output a first signal corresponding thereto. The method includes the steps of: (d) projecting light from a light source onto a reference plate to impart a reference modulation pattern to the light source, and projecting a reference modulated light based on the reference modulation pattern, wherein the reference modulated light includes a second flare pattern related to the reference plate; (f) receiving the reference modulated light and using a projection lens to project a second image corresponding to the reference modulated light; (g) receiving the second image and using an aerial imaging system to output a second signal corresponding thereto; and (g) determining a third flare pattern related to the SLM error based on the difference between the first signal and the second signal. In some embodiments, the method further includes the step of using a light source to project light from a light source. In some embodiments, the method further includes the step of changing one or more parameters related to the SLM in accordance with the third flare pattern. In some embodiments, the one or more parameters include one or more elements selected from the group consisting of exposure time of spatially modulated light on a photoresist, exposure intensity of spatially modulated light on a photoresist, and phase of one or more pixels related to the SLM. In some embodiments, the reference modulated pattern includes a static modulation pattern. In some embodiments, the aerial imaging system includes at least one deep ultraviolet (DUV) camera. In some embodiments, the SLM pattern or reference modulation pattern is selected from the group consisting of checkerboard patterns, flat line patterns, parallelogram patterns, diamond patterns, and patterns including at least one alignment mark.

[0013] Further provided herein is an exposure apparatus comprising: an illumination optical system configured to illuminate a spatial light modulator (SLM) having a plurality of spatial light modulator (SLM) elements whose reflective surfaces are arranged on a surface; a projection optical system configured to project light from the SLM onto a workpiece; a reference member having a reference modulation pattern; a position changing device configured to change the positional relationship between the SLM, the reference member and the projection optical system to either a first positional relationship in which light from the illumination optical system is incident on the projection optical system via the SLM, or a second positional relationship in which light from the illumination optical system is incident on the projection optical system via the reference member; and a detection device configured to detect light from the SLM or the reference member via the projection optical system.

[0014] In some embodiments, the exposure apparatus includes a computing device configured to calculate the state of the SLM based on a first output from a detection device in a first positional relationship and a second output from a detection device in a second positional relationship. In some embodiments, the state of the SLM includes flare from the SLM. In some embodiments, the detection device is configured to detect an aerial image of the SLM and a reference pattern of a reference member formed by a projection optical system. In some embodiments, the detection device is configured to detect an aerial image of the SLM in a first positional relationship and an aerial image of the reference modulation pattern in a second positional relationship. In some embodiments, the exposure apparatus further includes a controller configured to control pattern and positional change devices for a plurality of SLM elements. In some embodiments, the controller is configured to set the pattern of the plurality of SLM elements to the same pattern as the reference modulation pattern. In some embodiments, the reference modulation pattern includes at least one of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0015] Further provided herein is an exposure method comprising: illuminating a spatial light modulator (SLM) having a plurality of spatial light modulators (SLMs) whose reflective surfaces are arranged on a surface; using a projection optical system to project light from the SLM onto a workpiece; setting the positional relationship between the SLM and the projection optical system to a first positional relationship in which light from the SLM is incident on the projection optical system; outputting a first output by detecting light from the SLM through the projection optical system in the first positional relationship; setting the positional relationship between a reference member having a reference modulation pattern and the projection optical system to a second positional relationship in which light from the reference member is incident on the projection optical system; and outputting a second output by detecting light from the SLM through the projection optical system in the second positional relationship. In some embodiments, the exposure method further includes the step of obtaining the state of the SLM based on the first and second outputs.

[0016] Further provided herein are methods for manufacturing a device, each comprising the steps of forming a resist on the surface of a substrate and exposing an exposure pattern using an exposure method.

[0017] Figure 1A shows a schematic diagram illustrating an exemplary system 100 for monitoring SLM flare in a maskless photolithography system when system 100 is operating in a first position. In some embodiments, system 100 is referred to herein as an exposure apparatus. In the illustrated example, system 100 comprises an illumination optical system 110. In some embodiments, the illumination optical system 110 comprises a light source. In some embodiments, the illumination optical system 110 is configured to project light from the light source 112. In some embodiments, the illumination optical system 110 comprises at least one light-emitting diode (LED). In some embodiments, the illumination optical system 110 comprises at least one laser source. In some embodiments, the laser source comprises at least one continuous-wave laser source. In some embodiments, the laser source comprises at least one pulsed laser. In some embodiments, the laser source comprises at least one gas laser (typically an argon fluoride (ArF) excimer laser or a krypton fluoride (KrF) excimer laser). In some embodiments, the laser source comprises at least one metal vapor laser. In some embodiments, the laser source comprises at least one solid-state laser. In some embodiments, the laser source comprises at least one semiconductor laser or diode laser. Although Figure 1A shows the system 100 with an illumination optical system 110, in some embodiments the system 100 does not have an illumination optical system 110.

[0018] In the illustrated example, system 100 includes a repositioning device 120. In some embodiments, the repositioning device 120 includes a stage. In some embodiments, the repositioning device 120 is configured to support an SLM 130 and a reference member 140. In some embodiments, when the repositioning device 120 is in a first position, the SLM 130 receives light from a light source 112, imparts an SLM pattern 132 to it, and projects spatially modulated light 134 based on the SLM pattern 132. In some embodiments, the SLM pattern 132 includes a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, or a pattern including at least one alignment mark. In some embodiments, the spatially modulated light 134 includes a first flare pattern associated with the SLM 130. In the illustrated example, the SLM 130 includes a reflective SLM. However, in some embodiments, the SLM 130 includes a transmissive SLM. In some embodiments, the SLM includes a plurality of SLM elements having reflective surfaces arranged on a placement plane. In some embodiments, the illumination optical system 110 is configured to illuminate the SLM.

[0019] In the illustrated example, the SLM 130 is provided with an SLM pattern 132 having an 8x6 display resolution for simplification. However, the SLM pattern 132 may have any display resolution. In some embodiments, the SLM 130 has a pixel pitch of at least about 0.1 micrometers (μm) or more. In some embodiments, the SLM 130 has a pixel pitch of up to about 10 μm. In some embodiments, the SLM 130 has a pixel pitch of about 0.1 μm to about 10 μm. Furthermore, the inset shows the SLM pattern 132 rotated 90 degrees for illustrative purposes.

[0020] In the illustrated example, system 100 includes a projection optical system 150. In some embodiments, the projection optical system 150 includes a projection lens. In some embodiments, when the position changing device 120 is in the first position, the projection optical system 150 is configured to receive the spatially modulated light 134 and project a first image 152 corresponding to the spatially modulated light 134. In some embodiments, the projection optical system is configured to project light from the SLM onto the workpiece (not shown in FIG. 1A).

[0021] In the illustrated example, system 100 includes a detection device 160. In some embodiments, the detection device 160 includes an aerial imaging system. In some embodiments, when the position changing device 120 is in the first position, the detection device 160 is configured to receive the first image 152 and output a first signal 162 corresponding to the first image 152. In some embodiments, the first image 152 includes an aerial image of the SLM 130. In some embodiments, the detection device 160 includes at least one ultraviolet (UV) camera or at least one deep ultraviolet (DUV) camera. In some embodiments, the detection device 160 is substantially similar or identical to any of the systems disclosed in U.S. Patent Nos. 8,809,616, 7,573,052, and 7,791,718, each of which is incorporated by reference in its entirety for all purposes.

[0022] In the illustrated example, system 100 includes a controller 170. In some embodiments, the controller 170 is operably coupled to the position changing device 120 and the detection device 160. In some embodiments, when the position changing device 120 is in the first position, the controller 170 is configured to receive the first signal 162.

[0023] Thus, the detection device 160 is configured to detect light from the SLM 130 through the projection optical system 150 when in the first position.

[0024] Figure 1B shows a schematic diagram illustrating an exemplary system 100 for monitoring SLM flare in a maskless photolithography system when system 100 is operating in a second position.

[0025] As shown in Figure 1A, the system 100 generally comprises an illumination optical system 110 configured to project light from a light source 112, a repositioning device 120 configured to support the SLM 130 and the reference member 140, a projection optical system 150, a detection device 160, and a controller 170.

[0026] In the illustrated example, when the repositioning device 120 is in a second position, the reference member 140 receives light from a light source 112, assigns a reference modulation pattern 142, and projects reference modulated light 144 based on the reference modulation pattern 142. In some embodiments, the reference member 140 comprises a reference plate. In some embodiments, the reference modulation pattern 142 includes a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, or a pattern including at least one alignment mark. In some embodiments, the reference modulated light 144 includes a second flare pattern associated with the reference member 140. In some embodiments, the reference modulation pattern 142 includes a static modulation pattern. In some embodiments, the reference member 140 includes a series of transmission regions and a series of absorption regions. In some embodiments, the transmission and absorption regions emulate the behavior of an ideal SLM.

[0027] In the illustrated example, the reference member 140 is provided with a reference modulation pattern 142 having an 8x6 display resolution for simplification. However, the reference modulation pattern 142 may have any display resolution. For example, in some embodiments, the reference modulation pattern 142 has the same display resolution as the SLM pattern 132. For example, in some embodiments, the display resolution of the reference modulation pattern is greater than or less than the display resolution of the SLM pattern 132. Furthermore, the inset shows a reference modulation pattern 154 rotated 90 degrees for illustrative purposes.

[0028] In the illustrated example, when the repositioning device 120 is in the first position, the projection optical system 150 is configured to receive the reference modulated light 144 and project a second image 154 corresponding to the reference modulated light 144.

[0029] In the illustrated example, when the position changing device 120 is in the second position, the detection device 160 is configured to receive the second image 154 and output a second signal 164 corresponding to the second image 154. In some embodiments, the first image 152 includes an aerial image of the reference member 140.

[0030] As shown in Figure 1A, the system 100 includes a controller 170. In some embodiments, the controller 170 is operably coupled to the position change device 120 and the detection device 160. In some embodiments, in the illustrated example, the controller 170 is configured to receive a second signal 164 when the position change device 120 is in a second position.

[0031] In some embodiments, the controller 170 is configured to sequentially control the repositioning device 120 and the detection device 160. Thus, in some embodiments, the controller 170 is configured to perform the following series of operations: (a) moving the repositioning device 120 to a first position, (b) receiving a first signal 162 from the detection device 160, (c) moving the repositioning device 120 to a second position, (d) receiving a second signal 164 from the detection device 160, and (e) determining a third flare pattern related to the SLM error based on the difference between the first signal 162 and the second signal 164. In some embodiments, the series of operations is repeated one or more times during the operation of the maskless photolithography system.

[0032] In some embodiments, the controller 170 is operably coupled to the SLM 130. In some embodiments, the controller 170 is configured to change one or more parameters associated with the SLM 130 in accordance with a third flare pattern. For example, in some embodiments, the controller 170 is configured to change the exposure time of the spatially modulated light 134 on a photoresist (not shown in Figure 1A or Figure 1B), the exposure intensity of the spatially modulated light 134 on the photoresist, or the phase of one or more pixels associated with the SLM 134. In some embodiments, the controller 170 is configured to control the patterns of the SLM 130 and multiple SLM elements of the repositioning device 120. In some embodiments, the controller 170 is configured to set the patterns of the multiple SLM elements to the same pattern as the reference modulation pattern 142. In some embodiments, the controller 170 comprises a computer system 300, or any component thereof, as described herein with respect to Figure 3.

[0033] Therefore, when the detection device 160 is in the second position, it is configured to detect light from the reference member 140 via the projection optical system 150.

[0034] When considered in combination, as shown in Figures 1A and 1B, in some embodiments, the position changing device 120 is configured to change the positional relationship between the SLM 130, the reference member 140, and the projection optical system 150 to either a first positional relationship in which light from the illumination optical system 110 is incident on the projection optical system 150 via the SLM 130, or a second positional relationship in which light from the illumination optical system 110 is incident on the projection optical system 150 via the reference member 140.

[0035] In some embodiments, the system 100 further comprises a computing device (not shown in Figure 1A or Figure 1B). In some embodiments, the computing device comprises a computer system 300, or any component thereof, as described herein with respect to Figure 3. In some embodiments, the computing device is configured to calculate the state of the SLM 130 based on a first output (e.g., a first signal 162) from a detection device 160 in a first positional relationship and a second output (e.g., a second signal 164) from a detection device 160 in a second positional relationship. In some embodiments, the computing device is configured to calculate the state of the SLM based on the difference between the first signal 162 and the second signal 164, as described herein. In some embodiments, the state of the SLM 130 includes flares from the SLM 130.

[0036] Figure 2A shows a flowchart illustrating a first exemplary method 200A for monitoring SLM flare in a maskless photolithography system. In the illustrated example, light source light is projected onto the SLM in 210A. In some embodiments, the light source light is given an SLM pattern by projecting it onto the SLM, and spatially modulated light is projected based on the SLM pattern. In some embodiments, the spatially modulated light includes a first flare pattern associated with the SLM. In some embodiments, the SLM includes any SLM described herein with respect to Figure 1A or Figure 1B. In some embodiments, the SLM pattern includes any SLM pattern described herein with respect to Figure 1A or Figure 1B. In some embodiments, the spatially modulated light includes any spatially modulated light described herein with respect to Figure 1A or Figure 1B. In some embodiments, the first flare pattern includes any first flare pattern described herein with respect to Figure 1A or Figure 1B.

[0037] In 220A, a projection lens is used to receive spatially modulated light. In some embodiments, the projection lens is used to project a first image corresponding to the spatially modulated light. In some embodiments, the projection lens comprises any projection lens described herein with respect to Figure 1A or Figure 1B. In some embodiments, the first image includes any first image described herein with respect to Figure 1A or Figure 1B.

[0038] In 230A, an aerial imaging system is used to receive a first image and output a first signal corresponding to the first image. In some embodiments, the aerial imaging system comprises any aerial imaging system described herein with respect to Figure 1A or Figure 1B. In some embodiments, the first signal includes any first signal described herein with respect to Figure 1A or Figure 1B.

[0039] In 240A, light from a light source is projected onto a reference plate. In some embodiments, a reference modulation pattern is imparted to the light source by projecting the light source onto the reference plate, and a reference modulated light is projected based on the reference modulation pattern. In some embodiments, the reference modulated light includes a second flare pattern associated with the reference plate. In some embodiments, the reference plate comprises any reference plate described herein with respect to Figure 1A or Figure 1B. In some embodiments, the reference modulation pattern includes any reference modulation pattern described herein with respect to Figure 1A or Figure 1B. In some embodiments, the reference modulated light includes any reference modulated light described herein with respect to Figure 1A or Figure 1B. In some embodiments, the second flare pattern includes any second flare pattern described herein with respect to Figure 1A or Figure 1B.

[0040] In 250A, a projection lens is used to receive a reference modulated light. In some embodiments, the projection lens is used to project a second image corresponding to the reference modulated light. In some embodiments, the second image includes any second image described herein with respect to Figure 1A or Figure 1B.

[0041] In 260A, an aerial imaging system is used to receive a second image and output a second signal corresponding to the second image. In some embodiments, the second signal includes any second signal described herein with respect to Figure 1A or Figure 1B.

[0042] In 270A, a third flare pattern related to the SLM error is determined based on the difference between the first signal and the second signal. In some embodiments, the third flare pattern includes any third flare pattern described herein with respect to Figure 1A or Figure 1B.

[0043] In some embodiments, method 200A further includes the step of changing one or more parameters related to the SLM in accordance with a third flare pattern. In some embodiments, one or more parameters include the exposure time of the spatially modulated light on the photoresist, the exposure intensity of the spatially modulated light on the photoresist, or the phase of one or more pixels related to the SLM.

[0044] In some embodiments, method 200A, or one or more of operations 210A, 220A, 230A, 240A, 250A, and 260A, and 270A, are performed using system 100 as described herein with respect to Figure 1A or Figure 1B, or computer system 300 as described herein with respect to Figure 3.

[0045] Figure 2B shows a flowchart illustrating a second exemplary method 200B for monitoring SLM flare in a maskless photolithography system. In the illustrated example, the SLM is illuminated at 210B. In some embodiments, the SLM includes any SLM described herein with respect to Figure 1A or Figure 1B.

[0046] In the 220B, a projection optical system is used to project light from the SLM onto the workpiece. In some embodiments, the projection optical system comprises any projection optical system described herein with respect to Figure 1A or Figure 1B.

[0047] In 230B, the positional relationship between the SLM and the projection optical system is set to a first positional relationship in which light from the SLM enters the projection optical system. In some embodiments, the positional relationship is set using a positional change device described herein with respect to Figure 1A or Figure 1B.

[0048] In 240B, light is detected from the SLM via a projection optical system in a first positional relationship, and a first output is obtained. In some embodiments, the light is detected using a detection device described herein with respect to Figure 1A or Figure 1B.

[0049] In 250B, the positional relationship between the reference member and the projection optical system is set to a second positional relationship in which light from the reference member is incident on the projection optical system. In some embodiments, the reference member is any reference member described herein with respect to Figure 1A or Figure 1B. In some embodiments, the positional relationship is set using a position-changing device described herein with respect to Figure 1A or Figure 1B.

[0050] In 260B, light is detected from the reference member via a projection optical system in a second positional relationship, and a second output is obtained. In some embodiments, the light is detected using a detection device described herein with respect to Figure 1A or Figure 1B.

[0051] In some embodiments, method 200B further includes the step of obtaining the state of the SLM based on the first and second outputs.

[0052] In some embodiments, the method for manufacturing the device includes the steps of forming a resist (e.g., a photoresist) on the surface of a substrate and exposing an exposure pattern using method 200B.

[0053] In some embodiments, System 100, Method 200A, or Method 200B are used to measure SLM flare at different locations across all or part of the surface of the SLM to obtain flare measurements as a function of position on the SLM. In some embodiments, the aerial imaging system described herein measures SLM flare at different locations on the SLM using a scanning imaging protocol.

[0054] In some embodiments, System 100, Method 200A, or Method 200B is used to measure the uniformity of illumination provided by a light source, or by a light source and projection lens. In some embodiments, the uniformity of illumination can be measured by setting all pixels of the SLM to a uniform phase or height. In some embodiments, the measured uniformity of illumination may allow the SLM to compensate for non-uniformity of illumination.

[0055] In some embodiments, System 100, Method 200A, or Method 200B is used to provide a calibration profile for the SLM. In some embodiments, a white light interferometer (e.g., Mirau interferometer, Michelson interferometer, Linnik interferometer, etc.) is used to measure the pixel height or phase error of the SLM. In some embodiments, the measured height or phase error may allow the SLM to compensate for such non-idealism. In some embodiments, the white light interferometer comprises any interferometer disclosed in U.S. Patents 11,099,007, 10,267,625, and 10,302,419, each of which is incorporated herein by reference in whole for any purpose.

[0056] In some embodiments, System 100, Method 200A, or Method 200B is used to calibrate the relative position between the white light interferometer and the SLM defect detection system. In some embodiments, a reference modulation pattern or SLM modulation pattern including alignment marks is used to calibrate the relative position. In some embodiments, the SLM defect detection system comprises any inspection device disclosed in Japanese Patent No. 6969163, which is incorporated herein by reference in its entirety for any purpose.

[0057] In some embodiments, System 100, Method 200A, or Method 200B is used to calibrate the illumination uniformity of an SLM defect detection system. In some embodiments, illumination uniformity is calibrated using an SLM pattern 132 that displays a flat pattern (i.e., the pattern when all mirrors of the SLM 130 are in the same state).

[0058] In some embodiments, the system 100 can be used to calibrate the height measurements of the SLM defect detection system. In some embodiments, the height measurements are calibrated using an SLM pattern 132 that displays a checkerboard pattern.

[0059] In some embodiments, System 100, Method 200A, or Method 200B is used to provide blind position adjustment for a lighting pattern. In some embodiments, blind position adjustment uses a parallelogram lighting pattern and a test pattern including a parallelogram pattern. In some embodiments, blind position adjustment uses a test pattern including a checkerboard pattern.

[0060] In some embodiments, System 100, Method 200A, or Method 200B is used to provide a measurement of the optical power or optical intensity of the projected light described herein. In some embodiments, the measurement of optical power or optical intensity is measured using a test pattern including a solid pattern. In some embodiments, the measurement of optical power or optical intensity is used to monitor any changes in the SLM, such as a degradation of the SLM's intrinsic reflectance (e.g., due to a change in the SLM surface or coating). In some embodiments, changes in the SLM are detected by comparing a measurement of optical power or optical intensity through the SLM with a measurement through the test pattern.

[0061] Figure 3 is a block diagram of a computer system 300 used in some embodiments to perform part of a method for monitoring SLM flares in a maskless photolithography system described herein (for example, operation 270A of method 200A as described herein with respect to Figure 2A). In some embodiments, the computer system can be used as a component of a system for monitoring SLM flares in a maskless photolithography system described herein (for example, controller 170 of system 100 as described herein with respect to Figure 1A or Figure 1B). Figure 3 shows one embodiment of a general-purpose computer system. Other computer system architectures and configurations can be used to perform the processing of the present invention. The computer system 300, which consists of various subsystems described later, includes at least one microprocessor subsystem 301. In some embodiments, the microprocessor subsystem comprises at least one central processing unit (CPU) or graphics processing unit (GPU). The microprocessor subsystem can be implemented by a single-chip processor or multiple processors. In some embodiments, the microprocessor subsystem is a general-purpose digital processor that controls the operation of the computer system 300. Using instructions obtained from memory 304, the microprocessor subsystem controls the reception and manipulation of input data, as well as the output and display of data on the output device.

[0062] The microprocessor subsystem 301 is bidirectionally coupled to memory 304, which may include a first primary storage device, typically random access memory (RAM), and a second primary storage area, typically read-only memory (ROM). As is well known in the art, the primary storage device can be used as a general storage area and scratchpad memory, and can also be used to store input data and processing data. It can also store programming instructions and data in the form of data objects and text objects, in addition to other data and instructions for processes running on the microprocessor subsystem. Also as is well known in the art, the primary storage device typically contains basic operation instructions, program code, data, and objects used by the microprocessor subsystem to perform its functions. The primary storage device 304 may include any suitable computer-readable storage medium, as described later, depending, for example, whether data access needs to be bidirectional or unidirectional. The microprocessor subsystem 301 can also retrieve and store frequently needed data directly and very quickly in a cache memory (not shown).

[0063] The removable mass storage device 305 provides additional data storage capacity to the computer system 300 and is coupled to the microprocessor subsystem 301 in either a bidirectional (read / write) or unidirectional (read-only) manner. The storage device 305 may also include computer-readable media such as magnetic tape, flash memory, signals embodied on a carrier wave, PC-CARDS, portable mass storage devices, holographic storage devices, and other storage devices. The fixed mass storage device 309 can also provide additional data storage capacity. The most common example of a mass storage device 309 is a hard disk drive. Mass storage devices 305 and 309 generally store additional programming instructions, data, etc., that are not typically actively used by the processing subsystem. It will be understood that the information held within the mass storage devices 305 and 309 can, if necessary, be incorporated in a standard manner as part of the primary storage device 304 (e.g., RAM) as virtual memory.

[0064] In addition to providing the processing subsystem 301 with access to the storage subsystem, the bus 306 can also be used to provide access to other subsystems and devices. In the embodiments described, these may include a display monitor 308, a network interface 307, a keyboard 302, and a pointing device 303, as well as an auxiliary input / output device interface, a sound card, speakers, and other subsystems as needed. The pointing device 303 may be a mouse, stylus, trackball, or tablet, which is useful for interacting with a graphical user interface.

[0065] The network interface 307 allows the processing subsystem 301 to be connected to another computer, computer network, or telecommunications network using a network connection as shown in the figure. Through the network interface 307, the processing subsystem 301 may receive information, such as data objects or program instructions, from another network, or output information to another network in the process of executing the method steps described above. Information, often represented as a series of instructions executed on the processing subsystem, can be received from and output to another network, for example, in the form of computer data signals embodied on a carrier wave. Using an interface card or similar device and appropriate software implemented by the processing subsystem 301, the computer system 300 can be connected to an external network and data can be transferred according to standard protocols. That is, the method embodiments of the present invention may be executed only on the processing subsystem 301, or they may be executed over a network such as the Internet, an intranet network, or a local area network, together with a remote processing subsystem that shares part of the processing. Additional mass storage devices (not shown) can also be connected to the processing subsystem 301 via the network interface 307.

[0066] An auxiliary I / O device interface (not shown) can be used with the computer system 300. The auxiliary I / O device interface may include general-purpose and customized interfaces that enable the processing subsystem 301 to send and more typically receive data to and from other devices such as microphones, touch-sensitive displays, transducer card readers, tape readers, voice or handwriting recognition devices, biometric readers, cameras, portable mass storage devices, and other computers.

[0067] Furthermore, embodiments of the present invention further relate to computer storage products having a computer-readable medium containing program code for performing various computer implementation operations. The computer-readable medium is any data storage device capable of storing data that can subsequently be read by a computer system. The medium and program code may be specifically designed and constructed for the purposes of the present invention, or may be of a type well known to those skilled in the art of computer software technology. Examples of computer-readable mediums include, but are not limited to, all of the above-mentioned mediums, namely magnetic media such as hard disks, floppy disks, and magnetic tapes; optical media such as CD-ROM disks; magneto-optical media such as floppy disks; and specially configured hardware devices such as application-specific integrated circuits (ASICs), programmable logic devices (PLDs), ROMs, and RAM devices. The computer-readable medium may also be distributed as data signals embodied in carrier waves on a network of coupled computer systems so that the computer-readable code is distributed, stored, and executed. Examples of program code include both machine code generated by a compiler, for example, or files containing higher-level code that can be executed using an interpreter. The computer system shown in Figure 3 is merely one example of a computer system suitable for use with the present invention. Other computer systems suitable for use in the present invention may include additional or fewer subsystems. Furthermore, bus 306 exemplifies any interconnection scheme that plays a role in linking subsystems. Other computer architectures with different subsystem configurations are also available. [Examples]

[0068] Example 1: Checkerboard pattern Figure 4A shows an example of a checkerboard SLM pattern or reference modulation pattern described herein. In the illustrated example, the checkerboard pattern utilized a series of dark squares and a series of light squares. Each of the dark and light squares constituted a 36 nanometer (nm) × 36 nm area, separated from the other squares by a 4 nm gap. The dark and light squares were arranged in a checkerboard pattern covering a 3 μm × 3 μm area. The test pattern was placed on a 6 μm × 6 μm substrate.

[0069] Figure 4B shows an example of a simulated illuminance profile obtained after passing light through the checkerboard pattern in Figure 4A. Figure 4C shows an example of the simulated central intensity of the illuminance profile in Figure 4B. Figure 4D shows an example of the simulated contrast of the illuminance profile in Figure 4C. As shown in Figures 4B to 4D, only the reference plate produces a sharp illuminance profile with minimal loss. The reference plate combined with an error-free SLM produces a less sharp illuminance profile with increased loss. The reference plate with an SLM having phase error due to the positional error of an 8 nm micromirror produces an even more blurred illuminance profile with even higher loss.

[0070] List of embodiments Embodiment 1. A system for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, The aforementioned system, A stage configured to support an SLM and a reference plate, A first position in which an SLM receives light from a light source, imparts an SLM pattern to the light source, and projects spatially modulated light based on the SLM pattern, wherein the spatially modulated light includes a first flare pattern associated with the SLM, A stage movable between a second position, where a reference plate receives light from a light source, imparts a reference modulation pattern to the light source, and projects reference modulated light based on the reference modulation pattern, wherein the reference modulated light includes a second flare pattern associated with the reference plate, and the stage movable between the second position and the second position, When the stage is in the first position, it receives spatially modulated light and projects a first image corresponding to the spatially modulated light. A projection lens configured to receive a reference modulated light and project a second image corresponding to the reference modulated light when the stage is in the second position, When the stage is in the first position, it receives the first image and outputs the corresponding first signal. An aerial imaging system configured to receive a second image and output a corresponding second signal when the stage is in a second position, A controller that is operablely coupled to a stage and an aerial imaging system, (a) Move the stage to the first position, (b) Receiving the first signal, (c) Move the stage to the second position, (d) Receiving the second signal, (e) A controller configured to determine a third flare pattern related to the SLM error based on the difference between the first signal and the second signal, A system that includes these features.

[0071] Embodiment 2. The system according to Embodiment 1, further comprising a light source configured to project light.

[0072] Embodiment 3. The system according to Embodiment 1 or 2, wherein the controller is further operably coupled to the SLM, and the controller is further configured to modify one or more parameters related to the SLM in accordance with a third flare pattern.

[0073] Embodiment 4. The system according to Embodiment 3, wherein one or more parameters include one or more elements selected from the group consisting of exposure time of spatially modulated light on a photoresist, exposure intensity of spatially modulated light on a photoresist, and phase of one or more pixels related to SLM.

[0074] Embodiment 5. The system according to any one of Embodiments 1 to 4, wherein the reference modulation pattern includes a static modulation pattern.

[0075] Embodiment 6. The aerial imaging system is the system according to any one of Embodiments 1 to 5, comprising at least one deep ultraviolet (DUV) camera.

[0076] Embodiment 7. The system according to any one of Embodiments 1 to 6, wherein the SLM pattern or reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0077] Embodiment 8. The system according to any one of Embodiments 1 to 7, wherein the light source includes OBKK light or BBSK light.

[0078] Embodiment 9. The controller is Processor and Memory coupled to a processor, configured to provide the processor with instructions that, when executed, cause the processor to perform (a) to (e), and A system according to any one of embodiments 1 to 8, comprising:

[0079] Embodiment 10. The controller is A processor configured to perform (a) to (e), Memory coupled to the processor and configured to provide the processor with instructions to perform (a) to (e), A system according to any one of embodiments 1 to 8, comprising:

[0080] Embodiment 11. A method for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, The aforementioned method, (a) A step of projecting light from a light source onto an SLM, thereby imparting an SLM pattern to the light source, and projecting spatially modulated light based on the SLM pattern, wherein the spatially modulated light includes a first flare pattern associated with the SLM, (b) The steps of receiving spatially modulated light and using a projection lens to project a first image corresponding to the spatially modulated light, (c) The step of using an aerial imaging system to receive a first image and output a first signal corresponding thereto, (d) A step of projecting light from a light source onto a reference plate to impart a reference modulation pattern to the light source, and projecting a reference modulated light based on the reference modulation pattern, wherein the reference modulated light includes a second flare pattern associated with the reference plate, (e) The step of receiving a reference modulated light and using a projection lens to project a second image corresponding to the reference modulated light, (f) The step of using an aerial imaging system to receive a second image and output a corresponding second signal, (g) A step of determining a third flare pattern related to the SLM error based on the difference between the first signal and the second signal, Methods that include...

[0081] Embodiment 12. The method according to Embodiment 11, further comprising the step of using a light source to project light onto a light source.

[0082] Embodiment 13. The method according to Embodiment 11 or 12, further comprising the step of changing one or more parameters related to SLM in accordance with a third flare pattern.

[0083] Embodiment 14. The method according to Embodiment 13, wherein one or more parameters include one or more elements selected from the group consisting of exposure time of spatially modulated light on a photoresist, exposure intensity of spatially modulated light on a photoresist, and phase of one or more pixels related to SLM.

[0084] Embodiment 15. The method according to any one of Embodiments 11 to 14, wherein the reference modulation pattern includes a static modulation pattern.

[0085] Embodiment 16. The method according to any one of Embodiments 11 to 15, wherein the aerial imaging system comprises at least one deep ultraviolet (DUV) camera.

[0086] Embodiment 17. The method according to any one of Embodiments 11 to 16, wherein the SLM pattern or reference modulation pattern is selected from the group consisting of checkerboard patterns, flat line patterns, parallelogram patterns, diamond patterns, and patterns including at least one alignment mark.

[0087] Embodiment 18. An illumination optical system configured to illuminate a spatial light modulator (SLM) having a plurality of spatial light modulator (SLM) elements whose reflective surfaces are arranged on the arrangement surface, A projection optical system configured to project light from an SLM onto a workpiece, A reference member having a reference modulation pattern, A position-changing device configured to change the positional relationship between the SLM, the reference member, and the projection optical system to either a first positional relationship in which light from the illumination optical system enters the projection optical system via the SLM, or a second positional relationship in which light from the illumination optical system enters the projection optical system via the reference member. A detection device configured to detect light from an SLM or reference member via a projection optical system, An exposure apparatus equipped with the following features.

[0088] Embodiment 19. The exposure apparatus according to Embodiment 18, further comprising a computing device configured to calculate the state of the SLM based on a first output from a detection device in a first positional relationship and a second output from a detection device in a second positional relationship.

[0089] Embodiment 20. The exposure apparatus according to Embodiment 19, wherein the state of the SLM includes flare from the SLM.

[0090] Embodiment 21. An exposure apparatus according to any one of Embodiments 18 to 20, wherein the detection device is configured to detect an aerial image of the SLM and a reference modulation pattern of a reference member formed by a projection optical system.

[0091] Embodiment 22. The exposure apparatus according to Embodiment 21, wherein the detection device is configured to detect an aerial image of an SLM in a first positional relationship and to detect an aerial image of a reference modulation pattern in a second positional relationship.

[0092] Embodiment 23. An exposure apparatus according to any one of embodiments 18 to 22, further comprising a controller configured to control a pattern and position changing device for a plurality of SLM elements.

[0093] Embodiment 24. The exposure apparatus according to Embodiment 23, wherein the controller is configured to set the patterns of a plurality of SLM elements to the same pattern as the reference modulation pattern.

[0094] Embodiment 25. An exposure apparatus according to any one of Embodiments 18 to 24, wherein the reference modulation pattern includes at least one of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0095] Embodiment 26. A step of illuminating a spatial light modulator (SLM) having a plurality of spatial light modulators (SLMs) whose reflective surfaces are arranged on the arrangement surface, The steps include using a projection optical system to project light from the SLM onto the workpiece, The steps include setting the positional relationship between the SLM and the projection optical system to a first positional relationship in which light from the SLM enters the projection optical system, A step of outputting a first output by detecting light from the SLM through a projection optical system in a first positional relationship, The steps include setting the positional relationship between a reference member having a reference modulation pattern and a projection optical system to a second positional relationship in which light from the reference member is incident on the projection optical system, A step of outputting a second output by detecting light from the SLM through a projection optical system in a second positional relationship, An exposure method, including

[0096] Embodiment 27. The exposure method according to Embodiment 26, further comprising the step of obtaining the state of the SLM based on the first and second outputs.

[0097] Embodiment 28. Steps of forming a resist on the surface of a substrate, The steps include: exposing an exposure pattern using the exposure method described in Embodiment 26 or 27; A method for manufacturing a device, including

[0098] To the extent permitted by the national laws of the designated (or elected) state to which this international application applies, all publications (including international publication brochures) and U.S. patent disclosures relating to the exposure apparatus cited in each of the above embodiments and modifications are incorporated herein by reference.

Claims

1. A system for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, The aforementioned system, A stage configured to support an SLM and a reference spatial light modulator, A first position in which the SLM receives light from a light source, imparts an SLM pattern to the light source, and projects spatially modulated light based on the SLM pattern, wherein the spatially modulated light includes a first flare pattern associated with the SLM, A stage movable between a second position, where the reference spatial light modulator receives the light source, imparts a reference modulation pattern to the light source, and projects reference modulated light based on the reference modulation pattern, wherein the reference modulated light includes a second flare pattern associated with the reference spatial light modulator, and the stage movable between these two positions. When the stage is in the first position, it receives the spatially modulated light and projects a first image corresponding to the spatially modulated light. When the stage is in the second position, a projection lens is configured to receive the reference modulated light and project a second image corresponding to the reference modulated light, When the stage is in the first position, it receives the first image and outputs a first signal corresponding to it. An aerial imaging system configured to receive the second image and output a corresponding second signal when the stage is in the second position, A controller operably coupled to the stage and the aerial imaging system, (a) Move the stage to the first position, (b) Having received the first signal, (c) Move the stage to the second position, (d) Having received the second signal, (e) The controller is configured to determine a third flare pattern related to the SLM error based on the difference between the first signal and the second signal, system.

2. The system further comprises a light source configured to project the aforementioned light source light. The system according to claim 1.

3. The controller is further operably coupled to the SLM, and the controller is further configured to change one or more parameters related to the SLM in accordance with the third flare pattern. The system according to claim 1 or 2.

4. The one or more parameters include one or more elements selected from the group consisting of the exposure time of the spatially modulated light on the photoresist, the exposure intensity of the spatially modulated light on the photoresist, and the phase of one or more pixels related to the SLM. The system according to claim 3.

5. The aerial imaging system comprises at least one deep ultraviolet (DUV) camera. The system according to claim 1 or 2.

6. The SLM pattern or the reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark. The system according to claim 1 or 2.

7. The aforementioned controller, Processor and A memory coupled to the processor, wherein the memory is configured to provide the processor with instructions that, when executed, cause the processor to execute (a) to (e), and Equipped with, The system according to claim 1 or 2.

8. The aforementioned controller, A processor configured to perform (a) to (e), A memory coupled to the processor and configured to provide the processor with instructions to execute (a) to (e), Equipped with, The system according to claim 1 or 2.

9. A method for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, The aforementioned method, (a) A step of projecting light from a light source onto an SLM, thereby imparting an SLM pattern to the light source, and projecting spatially modulated light based on the SLM pattern, wherein the spatially modulated light includes a first flare pattern associated with the SLM, (b) The step of receiving the spatially modulated light and using a projection lens to project a first image corresponding to the spatially modulated light, (c) Using an aerial imaging system to receive the first image and output a first signal corresponding thereto, (d) A step of projecting the light source onto a reference spatial light modulator to impart a reference modulation pattern to the light source, and projecting a reference modulated light based on the reference modulation pattern, wherein the reference modulated light includes a second flare pattern associated with the reference spatial light modulator, (e) The step of receiving the reference modulated light and using the projection lens to project a second image corresponding to the reference modulated light, (f) Using the aerial imaging system to receive the second image and output a corresponding second signal, (g) A step of determining a third flare pattern related to the SLM error based on the difference between the first signal and the second signal, Methods that include...

10. The step further includes using a light source to project the aforementioned light source light, The method according to claim 9.

11. The further step includes changing one or more parameters related to the SLM in accordance with the third flare pattern, The method according to claim 9 or 10.

12. The one or more parameters include one or more elements selected from the group consisting of the exposure time of the spatially modulated light on the photoresist, the exposure intensity of the spatially modulated light on the photoresist, and the phase of one or more pixels related to the SLM. The method according to claim 11.

13. The aerial imaging system comprises at least one deep ultraviolet (DUV) camera. The method according to claim 9 or 10.

14. The SLM pattern or the reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark. The method according to claim 9 or 10.

15. An illumination optical system configured to illuminate a spatial light modulator (SLM) having multiple SLM elements whose reflective surfaces are arranged on the same surface, A projection optical system configured to project light from the SLM onto a workpiece, A reference spatial light modulator having a reference modulation pattern, A position-changing device configured to change the positional relationship between the SLM, the reference spatial light modulator, and the projection optical system to either a first positional relationship in which light from the illumination optical system is incident on the projection optical system via the SLM, or a second positional relationship in which light from the illumination optical system is incident on the projection optical system via the reference spatial light modulator, A detection device configured to detect light from the SLM or the reference spatial light modulator via the projection optical system, A computing device configured to determine a third flare pattern related to the error of the SLM based on the difference between a first output from the detection device in the first positional relationship and a second output from the detection device in the second positional relationship, Equipped with, Exposure apparatus.

16. The system further includes a computing device configured to calculate the flare from the SLM based on a first output from the detection device in the first positional relationship and a second output from the detection device in the second positional relationship. The exposure apparatus according to claim 15.

17. The detection device is configured to detect a first image corresponding to spatially modulated light to which the SLM pattern has been applied, and a second image corresponding to reference modulated light to which the reference modulation pattern of the reference spatial light modulator formed by the projection optical system has been applied. The exposure apparatus according to claim 15 or 16.

18. The detection device is configured to detect the first image corresponding to the spatially modulated light to which the pattern of the SLM is applied in the first positional relationship, and to detect the second image corresponding to the reference modulated light to which the reference modulation pattern of the reference spatial light modulator is applied in the second positional relationship. The exposure apparatus according to claim 17.

19. The system further comprises a controller configured to control the patterns of the plurality of SLM elements and the position-changing device. The exposure apparatus according to claim 15 or 16.

20. The controller is configured to set the patterns of the plurality of SLM elements to the same pattern as the reference modulation pattern. The exposure apparatus according to claim 19.

21. The aforementioned reference modulation pattern includes at least one of the following: a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark. The exposure apparatus according to claim 15 or 16.

22. The steps include illuminating a spatial light modulator (SLM) having multiple SLMs whose reflective surfaces are arranged on the surface, The steps include using a projection optical system to project light from the SLM onto a workpiece, The steps include setting the positional relationship between the SLM and the projection optical system to a first positional relationship in which light from the SLM is incident on the projection optical system, The steps include: outputting a first output by detecting light from the SLM through the projection optical system in the first positional relationship; The steps include setting the positional relationship between a reference spatial light modulator having a reference modulation pattern and the projection optical system to a second positional relationship in which light from the reference spatial light modulator is incident on the projection optical system, The steps include: detecting light from the SLM through the projection optical system in the second positional relationship and outputting a second output; A step of determining a third flare pattern related to the error of the SLM based on the difference between the first output and the second output, including, Exposure method.

23. The process further includes the step of obtaining flares from the SLM based on the first and second outputs, The exposure method according to claim 22.

24. The steps include forming a resist on the surface of the substrate, The steps of exposing an exposure pattern using the exposure method described in claim 22 or 23, including, A method for manufacturing a device.

Images