Coil components

Abstract

To disclose a coil component.SOLUTION: A coil component according to one aspect of the present invention may include: a body having one surface and one end surface and the other end surface which are respectively connected to the one surface and oppose each other; a coil portion including first and second lead-out portions spaced apart from each other and disposed in the body; first and second slit portions formed respectively at corners where the one end surface and the other end surface of the body are in contact with the one surface of the body, and exposing the first and second lead-out portions; first and second external electrodes disposed to be spaced apart from each other on the one surface of the body, and extending onto the first and second slit portions, respectively, to be connected to the first and second lead-out portions; a slit insulating layer covering at least portions of the first and second external electrodes in the first and second slit portions; and a surface insulating layer disposed on the slit insulating layer and extending to cover at least portions of the first or second external electrodes in an area disposed on the one surface of the body.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] This invention relates to a coil component. [Background technology]

[0002] An inductor, a type of coil component, is a typical passive electronic component used in electronic devices, along with resistors and capacitors.

[0003] As electronic devices become more high-performance and smaller, the number and size of electronic components used in them are increasing.

[0004] The external electrodes of a coil component are usually formed by applying and curing conductive paste to both ends facing each other in the longitudinal direction of the component body. However, in this case, the overall length of the component may increase. Furthermore, when a component with the aforementioned external electrodes is mounted on a substrate, bonding members such as solder are formed on the mounting surface of the substrate, extending from the component in the width direction and length direction, respectively, thereby increasing the effective mounting area of ​​the component. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2018-107346 (Published July 5, 2018) [Overview of the project] [Problems that the invention aims to solve]

[0006] One of the objectives of the embodiments of the present invention is to improve chipping defects at the bottom corner portion during the dicing process of coil components.

[0007] Another objective according to embodiments of the present invention is to provide a coil component that can be made lighter, thinner, and shorter, and to facilitate mounting. [Means for solving the problem]

[0008] According to one aspect of the present invention, a coil component is provided that includes a body having one face and one end face and the other end face facing each other; a coil portion disposed within the body and including a first and second pull-out portion that are spaced apart from each other; a first slit portion and a second slit portion formed at the corners of the body in areas where the one end face and the other end face of the body are adjacent to each other and exposing the first and second pull-out portions; a first external electrode and a second external electrode disposed spaced apart from each other on the body and extending to the first and second slit portions, respectively, and connected to the first and second pull-out portions; a slit insulating layer covering at least a portion of the first and second external electrodes in the first and second slit portions; and a surface insulating layer disposed on the slit insulating layer and extending to cover at least a portion of the area of ​​the first and second external electrodes that is disposed on the body.

[0009] According to another aspect of the present invention, a coil component is provided comprising: a body having one surface, one end surface and the other end surface connected to the one surface and facing each other; a coil portion including a first lead portion and a second lead portion spaced apart from each other and exposed on the one end surface and the other end surface of the body, respectively; a first external electrode and a second external electrode disposed spaced apart from each other on the one surface of the body and extending to the one end surface and the other end surface of the body and connected to the first lead portion and the second lead portion, respectively; a lower insulating layer covering at least a portion of the area of ​​the one surface of the body excluding the first external electrode and the second external electrode; and a surface insulating layer covering at least a portion of the first external electrode and the second external electrode on the one end surface and the other end surface of the body, respectively, and disposed on the lower insulating layer on the one surface of the body, wherein the surface insulating layer covers at least a portion of the area of ​​the first external electrode and the second external electrode disposed on the one surface of the body, and extends to cover at least a portion of the first external electrode and the second external electrode at the boundary between each of the first external electrode and the second external electrode and the lower insulating layer. [Effects of the Invention]

[0010] According to an embodiment of the present invention, the effective volume of the magnetic material can be improved, plating penetration and short - circuit of the electrode portion can be prevented, and the mounting area can be reduced.

Brief Description of the Drawings

[0011] [Figure 1] It is a perspective view schematically showing a coil component according to an embodiment of the present invention. [Figure 2] It is a view showing the coil component of FIG. 1 as seen from the lower side. [Figure 3] It is a view showing a cross - section taken along the line I - I' of FIG. 1. [Figure 4] It is an enlarged view showing the A region of FIG. 3. [Figure 5] It is an enlarged view showing the B region of FIG. 3. [Figure 6] It is a view showing a cross - section taken along the line II - II' of FIG. 1. [Figure 7] It is a view schematically showing the connection relationship of the coil portion. [Figure 8] It is a view showing a modification corresponding to FIG. 3. [Figure 9] It is a perspective view schematically showing a coil component according to another embodiment of the present invention. [Figure 10] It is a view showing the coil component of FIG. 9 as seen from the lower side. [Figure 11] It is a view showing a cross - section taken along the line III - III' of FIG. 9. [Figure 12] It is an enlarged view showing the C region of FIG. 1l. [Figure 13] It is a perspective view schematically showing a coil component according to still another embodiment of the present invention.

Modes for Carrying Out the Invention

[0012] The terms used in this application are used solely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless they are clearly different in context. In this application, terms such as “includes” or “having” should be understood as specifying the presence of features, figures, stages, actions, components, parts, or combinations thereof described in the specification, and not as preemptively excluding the presence or possibility of adding one or more other features, figures, stages, actions, components, parts, or combinations thereof. Also, throughout the specification, “above” means located above or below the part in question, and does not necessarily mean located on the upper side with respect to the direction of gravity.

[0013] Furthermore, the term "connection" is used to encompass not only cases where each component is in direct physical contact with another component, but also cases where other components are interposed between the components, and each component is in contact with the other components.

[0014] The dimensions and thicknesses of each component shown in the drawings are arbitrary and provided for illustrative purposes only; therefore, the present invention is not necessarily limited to those shown.

[0015] In drawings, the L direction can be defined as the first direction or length direction, the W direction as the second direction or width direction, and the T direction as the third direction or thickness direction.

[0016] Hereinafter, coil components according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components will be given the same drawing number, and redundant explanations will be omitted.

[0017] Various electronic components are used in electronic devices, and various coil components can be appropriately used between these electronic components for purposes such as noise reduction.

[0018] In other words, coil components in electronic devices can be used in power inductors, high-frequency inductors (HF inductors), general beads, high-frequency beads (GHz beads), common mode filters, and so on.

[0019] (First embodiment and modified example) Figure 1 is a schematic perspective view of a coil component according to one embodiment of the present invention. Figure 2 is a view of the coil component of Figure 1 from below. Figure 3 is a cross-section along line I-I' in Figure 1. Figure 4 is an enlarged view of area A in Figure 3. Figure 5 is an enlarged view of area B in Figure 3. Figure 6 is a cross-section along line II-II' in Figure 1. Figure 7 is a schematic diagram showing the connection relationship of the coil section. Figure 8 is a modified example shown corresponding to Figure 3.

[0020] Referring to Figures 1 to 7, a coil component 1000 according to one embodiment of the present invention includes a main body 100, a substrate 200, a coil portion 300, slit portions S1 and S2, external electrodes 410 and 420, and insulating layers 510, 520 and 530, and may further include an insulating film IF.

[0021] The main body 100 forms the external appearance of the coil component 1000 according to this embodiment, and has a circuit board 200 and a coil section 300 embedded inside.

[0022] The main body 100 can have an overall hexahedral shape.

[0023] The main body 100 includes a first surface 101 and a second surface 102 facing each other in the length direction (L), a third surface 103 and a fourth surface 104 facing each other in the width direction (W), and a fifth surface 105 and a sixth surface 106 facing each other in the thickness direction (T), based on the directions shown in Figures 1 to 6. The first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the main body 100 correspond to the wall surfaces of the main body 100 that connect the fifth surface 105 and the sixth surface 106, respectively. Hereinafter, both end faces (one end face and the other end face) of the main body 100 can mean the first surface 101 and the second surface 102 of the main body 100, and both sides (one side face and the other side face) of the main body 100 can mean the third surface 103 and the fourth surface 104 of the main body 100. Furthermore, one face and the bottom face of the main body 100 may mean the sixth face 106 of the main body 100, and the other face and the top face of the main body 100 may mean the fifth face 105 of the main body 100.

[0024] The main body 100 can, for example, be formed such that the coil component 1000 according to this embodiment, which has the external electrodes 410, 420 and insulating layers 510, 520, 530 described later, has a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.5 mm, or it can be formed to have a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but it is not limited to these. On the other hand, the above values ​​are merely design values ​​that do not reflect process errors, etc., so the range that is considered to be a process error should be considered to be within the scope of the present invention.

[0025] The length of the coil component 1000 described above may refer to the maximum length among multiple line segments parallel to the length direction (L) when the outermost boundary lines of the coil component 1000 shown in the cross-sectional photograph taken with an optical microscope or SEM (Scanning Electron Microscope) is connected, based on the cross-sectional photograph taken with an optical microscope or SEM (Scanning Electron Microscope) of the cross-sectional section in the length direction (L)-thickness direction (T) at the center of the width direction (W) of the coil component 1000. Alternatively, it may refer to the arithmetic mean of the lengths of at least three or more line segments parallel to the length direction (L) when the outermost boundary lines of the coil component 1000 shown in the cross-sectional photograph are connected.

[0026] The thickness of the coil component 1000 described above may refer to the maximum length among multiple line segments parallel to the thickness direction (T) when the outermost boundary lines of the coil component 1000 shown in the cross-sectional photograph taken with an optical microscope or SEM (Scanning Electron Microscope) is connected, based on the cross-sectional photograph taken with an optical microscope or SEM (Scanning Electron Microscope) of the cross-sectional section in the length direction (L)-thickness direction (T) at the center of the width direction (W) of the coil component 1000. Alternatively, it may refer to the arithmetic mean of the lengths of at least three or more line segments parallel to the thickness direction (T) when the outermost boundary lines of the coil component 1000 shown in the cross-sectional photograph are connected.

[0027] The width of the coil component 1000 described above may refer to the maximum length among multiple line segments parallel to the width direction (W), obtained by connecting the outermost boundary lines of the coil component 1000 shown in the optical microscope or SEM (Scanning Electron Microscope) photograph of the cross-section (width direction (W)-thickness direction (T)) at the center of the coil component 1000 in the length direction (T). Alternatively, it may refer to the arithmetic mean of the lengths of at least three or more line segments parallel to the width direction (W), obtained by connecting the outermost boundary lines of the coil component 1000 shown in the cross-section photograph.

[0028] Alternatively, the length, width, and thickness of the coil component 1000 may be measured by micrometer measurement. Micrometer measurement involves setting a zero point on a Gage R&R (Repeatability and Reproducibility) micrometer, inserting the coil component 1000 according to this embodiment between the tips of the micrometer, and rotating the micrometer's measuring lever to perform the measurement. On the other hand, when measuring the length of the coil component 1000 by micrometer measurement, the length of the coil component 1000 may refer to a single measurement or the arithmetic mean of multiple measurements. This is similarly applicable to the width and thickness of the coil component 1000.

[0029] The main body 100 may include a magnetic material and a resin. Specifically, the main body 100 can be formed by laminating one or more magnetic composite sheets in which the magnetic material is dispersed in a resin. However, the main body 100 may have structures other than those in which the magnetic material is dispersed in a resin. For example, the main body 100 may be made of a magnetic material such as ferrite.

[0030] The magnetic material can be ferrite or metallic magnetic powder.

[0031] The ferrite can be at least one of the following: spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn; hexagonal ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co; garnet-type ferrites such as Y-type; and Li-based ferrites.

[0032] The metallic magnetic powder may contain one or more elements selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), boron (B), zirconium (Zr), hafnium (Hf), phosphorus (P), and nickel (Ni). For example, the metallic magnetic powder may be at least one of the following: pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, or Fe-Cr-Al alloy powder.

[0033] Metallic magnetic powders can be amorphous and / or crystalline. For example, a metallic magnetic powder can be, but is not necessarily limited to, an Fe-Si-B-Cr amorphous alloy powder.

[0034] Each of the metal magnetic powders can have an average diameter of approximately 0.1 μm to 30 μm, but is not limited to this.

[0035] The main body 100 may include two or more types of magnetic materials dispersed in the resin. Here, different types of magnetic materials mean that the magnetic materials dispersed in the resin are distinguished from each other by any one of the following: average diameter, composition, crystallinity, and shape.

[0036] The resin may contain, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., either alone or in combination.

[0037] The main body 100 includes a core 110 that penetrates the coil portion 300, which will be described later. The core 110 can be formed by filling a through hole on the inside of the coil portion 300 with a magnetic composite sheet, but is not limited to this.

[0038] The circuit board 200 is placed inside the main body 100. The circuit board 200 is configured to support the coil section 300, which will be described later.

[0039] The substrate 200 can be formed from an insulating material including a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or from an insulating material in which such an insulating resin is impregnated with a reinforcing material such as glass fiber or inorganic filler. For example, the substrate 200 can be formed from insulating materials such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, PID (Photo Imagable Dielectric), or copper-clad laminate (CCL), but is not limited thereto.

[0040] As inorganic fillers, at least one selected from the group consisting of silica (silicon dioxide, SiO2), alumina (aluminum oxide, Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0041] When the substrate 200 is formed from an insulating material containing reinforcing material, the substrate 200 can provide superior rigidity. When the substrate 200 is formed from an insulating material that does not contain glass fibers, the substrate 200 is advantageous in reducing the overall thickness of the coil portion 300. When the substrate 200 is formed from an insulating material containing a photosensitive insulating resin, the number of steps required to form the coil portion 300 is reduced, which is advantageous in reducing production costs, and fine vias can be formed.

[0042] The thickness of the substrate 200 can be, for example, 10 μm or more and 50 μm or less, but is not limited thereto.

[0043] The slits S1 and S2 are formed at the corners of the sixth surface 106 of the main body 100. Specifically, the slits S1 and S2 are formed along the corners between the first surface 101 and the second surface 102 of the main body 100 and the sixth surface 106 of the main body 100. That is, the first slit S1 is formed along the corner between the first surface 101 and the sixth surface 106 of the main body 100, and the second slit S2 is formed along the corner between the second surface 102 and the sixth surface 106 of the main body 100. The slits S1 and S2 have a form that extends from the third surface 103 to the fourth surface 104 of the main body 100. On the other hand, the slits S1 and S2 do not extend to the fifth surface 105 of the main body 100. That is, the slits S1 and S2 do not penetrate the main body 100 in the thickness direction (T) of the main body 100.

[0044] The slit portions S1 and S2 can be formed by pre-dicing one surface of the coil bar at the level of the coil bar before each coil component is individualized, along a virtual boundary line that coincides with the width direction of each coil component, among the virtual boundary lines that individualize each coil component. The depth of such pre-dicing is adjusted so that the pull-out portions 331 and 332, described later, are exposed on the inner surface of the slit portions S1 and S2. The inner surface of the slit portions S1 and S2 may have an inner wall substantially parallel to the first surface 101 and the second surface 102 of the main body 100, and a bottom surface connecting the inner wall to the first surface 101 and the second surface 102 of the main body 100. On the other hand, for the sake of explanation below, it will be described that the slit portions S1 and S2 have an inner wall and a bottom surface, but the scope of the present invention is not limited thereto. For example, the inner surface of the first slit portion S1 is formed to have a curved shape in the length direction (L) - thickness direction (T) cross-section that connects the first surface 101 and the sixth surface 106 of the main body 100, and the aforementioned inner wall and bottom surface may not be separated.

[0045] On the other hand, the inner surfaces of the slit portions S1 and S2 also correspond to the surface of the main body 100. However, in this specification, for the convenience of understanding and explaining the invention, the inner surfaces of the slit portions S1 and S2 are distinguished from the first surface 101, second surface 102, third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106, which are the surface of the main body 100.

[0046] The coil section 300 is embedded in the main body 100 and exhibits the characteristics of a coil component. For example, when the coil component 1000 according to this embodiment is used as a power inductor, the coil section 300 can stabilize the power supply of electronic equipment by storing the electric field as a magnetic field and maintaining the output voltage.

[0047] The coil section 300 includes coil patterns 311, 312, vias 321, 322, 323, lead-out sections 331, 332, and dummy lead-out sections 341, 342.

[0048] Referring to Figures 1, 3, 6, and 7, with reference to the orientation in Figures 3 and 6, the first coil pattern 311 and lead sections 331 and 332 are arranged on the lower surface of the substrate 200 facing the sixth surface 106 of the main body 100, and the second coil pattern 312 and dummy lead sections 341 and 342 are arranged on the upper surface of the substrate 200 facing the fifth surface 105 of the main body 100. On the lower surface of the substrate 200, the first coil pattern 311 is in contact with and connected to the second lead section 332, and the first coil pattern 311 and the second lead section 332 are each arranged at a distance from the first lead section 331. The second lead section 332 can be formed extending from the outermost turn of the first coil pattern 311.

[0049] The first pull-out portion 331 is exposed to the first surface 101 of the main body 100 and the inner surface of the first slit portion S1, respectively. The first pull-out portion 331 can be continuously exposed to the first surface 101 of the main body 100, the bottom surface of the first slit portion S1, and the inner wall of the first slit portion S1.

[0050] The second drawer portion 332 is exposed to the second surface 102 of the main body 100 and the inner surface of the second slit portion S2, respectively. The second drawer portion 332 can be continuously exposed to the second surface 102 of the main body 100, the bottom surface of the second slit portion S2, and the inner wall of the second slit portion S2.

[0051] Referring to Figures 3 and 7, on the upper surface of the substrate 200, the second coil pattern 312 is in contact with and connected to the first dummy lead portion 341, and the second coil pattern 312 and the first dummy lead portion 341 are each positioned away from the second dummy lead portion 342. The first dummy lead portion 341 can be formed extending from the outermost turn of the second coil pattern 312. The first dummy lead portion 341 is exposed on the first surface 101 of the main body 100. The second dummy lead portion 342 is exposed on the second surface 102 of the main body 100.

[0052] Referring to Figure 6, the first via 321 penetrates the substrate 200 and connects to the innermost turn of the first coil pattern 311 and the innermost turn of the second coil pattern 312, respectively.

[0053] Referring to Figure 3, the second via 322 penetrates the substrate 200 and connects the first lead portion 331 and the first dummy lead portion 341 to each other. The third via 323 penetrates the substrate 200 and connects the second lead portion 332 and the second dummy lead portion 342 to each other. In this way, the coil portion 300 can function as a single coil as a whole.

[0054] Referring now to Figure 8, which shows a modified example corresponding to Figure 3, the second dummy lead section 342 is not related to the electrical connection of the remaining components of the coil section 300. Therefore, in this modified example, the second dummy lead section 342 and the third via 323 may be omitted. In this case, the volume of magnetic material inside the main body 100 increases by the volume corresponding to the second dummy lead section 342, but the asymmetric structure may cause warpage of the substrate 200.

[0055] The first coil pattern 311 and the second coil pattern 312 can each be in a planar spiral shape, forming at least one turn around the core 110. For example, the first coil pattern 311 can form at least one turn around the core 110 on one surface of the substrate 200.

[0056] The first and second drawer portions 331 and 332 are exposed to the bottom and inner walls of the slit portions S1 and S2. That is, the depth of the slit portions S1 and S2 is adjusted so that they extend to at least a portion of the first and second drawer portions 331 and 332. One surface of the first and second drawer portions 331 and 332 exposed to the inner walls and bottom surfaces of the slit portions S1 and S2 can have a higher surface roughness than the other surfaces of the first and second drawer portions 331 and 332. For example, if the first and second drawer portions 331 and 332 are formed by electroplating, and then the slit portions S1 and S2 are formed on the first and second drawer portions 331 and 332 and the main body 100, a portion of the first and second drawer portions 331 and 332 is removed in a pre-dicing process for forming the slit portions S1 and S2. As a result, one surface of the first and second extraction portions 331 and 332 exposed on the inner walls and bottom surfaces of the slit portions S1 and S2 is formed to have a higher surface roughness compared to the rest of the first and second extraction portions 331 and 332 due to polishing of the pre-dicing tip. External electrodes 410 and 420, described later, are formed on the first and second extraction portions 331 and 332 exposed on the bottom surfaces and inner walls of the slit portions S1 and S2, and the coil portion 300 and the external electrodes 410 and 420 are connected. Since the external electrodes 410 and 420 are formed as thin films, the bonding force with the first and second extraction portions 331 and 332 is weak. However, by bringing the external electrodes 410 and 420 into contact and connecting with one surface of the first and second extraction portions 331 and 332 which have relatively higher surface roughness, the bonding force between the external electrodes 410 and 420 and the first and second extraction portions 331 and 332 can be improved. This improves the coupling reliability between the coil section 300 and the external electrodes 410 and 420.

[0057] At least one of the coil patterns 311, 312, vias 321, 322, 323, lead-out portions 331, 332, and dummy lead-out portions 341, 342 may include one or more conductive layers. For example, when the first coil pattern 311, lead-out portions 331, 332, and vias 321, 322, 323 are formed on the lower surface side of the substrate 200 by plating, the first coil pattern 311, lead-out portions 331, 332, and vias 321, 322, 323 may each include a first conductive layer formed by electroless plating or the like, and a second conductive layer disposed on the first conductive layer.

[0058] The first conductive layer may be a seed layer for forming the second conductive layer on the substrate 200 by plating. The second conductive layer may be an electroplated layer. Here, the electroplated layer may be a single layer or a multilayer structure. The multilayer electroplated layer may be formed in a conformal film structure in which one electroplated layer covers another electroplated layer, or it may be formed in a shape in which one electroplated layer is laminated on only one surface of one electroplated layer. The seed layer of the first coil pattern 311 and the seed layer of the second lead-out portion 332 may be formed integrally without a boundary being formed between them, but are not limited to this. The electroplated layer of the first coil pattern 311 and the electroplated layer of the second lead-out portion 332 may be formed integrally without a boundary being formed between them, but are not limited to this.

[0059] The coil patterns 311, 312, the lead-out sections 331, 332, and the dummy lead-out sections 341, 342 can be formed protruding from the lower and upper surfaces of the substrate 200, respectively, as shown in Figures 3 and 6. In another example, the first coil pattern 311 and the lead-out sections 331, 332 can be formed protruding from the lower surface of the substrate 200, while the second coil pattern 312 and the dummy lead-out sections 341, 342 can be embedded in the upper surface of the substrate 200, with their upper surfaces exposed. In this case, a recess is formed in at least one of the upper surfaces of the second coil pattern 312 and the dummy lead-out sections 341, 342, and the upper surface of the substrate 200 and the upper surface of the second coil pattern 312 and / or the upper surface of the dummy lead-out sections 341, 342 are not located on the same plane.

[0060] The coil patterns 311, 312, vias 321, 322, 323, lead sections 331, 332, and dummy lead sections 341, 342 can be formed from conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited thereto.

[0061] The insulating film IF insulates the coil patterns 311, 312, the lead-out portions 331, 332, and the dummy lead-out portions 341, 342 from the main body 100. The insulating film IF may, for example, contain parylene, but is not limited thereto. The insulating film IF can be formed by methods such as vapor deposition, but is not limited thereto, and may also be formed by laminating insulating films on both sides of the substrate 200. On the other hand, the insulating film IF may, but is not limited thereto, contain a portion of the plating resist used when forming the coil portion 300 by electroplating.

[0062] The external electrodes 410 and 420 are arranged on one surface 106 of the main body 100, spaced apart from each other, and extend to the first slit portion S1 and the second slit portion S2, respectively, and are connected to the first pull-out portion 331 and the second pull-out portion 332.

[0063] Specifically, the first external electrode 410 includes a first connecting portion 411 positioned on the bottom surface and inner wall of the first slit portion S1 and connected in contact with the first pull-out portion 331 exposed on the bottom surface and inner wall of the first slit portion S1, and a first pad portion 412 extending from the first connecting portion 411 to the sixth surface 106 of the main body 100.

[0064] The second external electrode 420 includes a second connecting portion 421 positioned on the bottom surface and inner wall of the second slit portion S2 and connected in contact with the second pull-out portion 332 exposed on the bottom surface and inner wall of the second slit portion S2, and a second pad portion 422 extending from the second connecting portion 421 to the sixth surface 106 of the main body 100.

[0065] The first pad portion 412 and the second pad portion 422 are arranged on the sixth surface 106 of the main body 100, spaced apart from each other.

[0066] The connecting portions 411 and 421 can be positioned in the center of the width direction (W) of the inner surfaces of the slit portions S1 and S2. The pad portions 412 and 422 can be positioned in the center of the width direction (W) of the sixth surface of the main body 100. In other words, the connecting portions 411 and 421 and the pad portions 412 and 422 do not have to extend to the third and fourth surfaces 103 and 104 of the main body 100, respectively.

[0067] On the other hand, in Figures 1 and 2, the lengths of the connecting portions 411 and 421 along the width direction (W) and the lengths of the pad portions 412 and 422 along the width direction (W) are shown to be the same, but this is merely illustrative, and the scope of the present invention is not limited to what is shown in Figures 1 and 2. For example, the lengths of the pad portions 412 and 422 along the width direction (W) can be longer than the lengths of the connecting portions 411 and 421 along the width direction (W).

[0068] The external electrodes 410 and 420 are formed along the inner surfaces of the slit portions S1 and S2 and the sixth surface 106 of the main body 100, respectively. That is, the external electrodes 410 and 420 are formed in the form of a conformal film on the inner surfaces of the slit portions S1 and S2 and the sixth surface 106 of the main body 100. The external electrodes 410 and 420 can be formed integrally on the inner surfaces of the slit portions S1 and S2 and the sixth surface 106 of the main body 100, respectively. In this case, the external electrodes 410 and 420 can be formed by a thin-film process such as a sputtering process or a plating process.

[0069] The external electrodes 410 and 420 may be formed from conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but are not limited to these.

[0070] The external electrodes 410 and 420 can be formed with a multi-layer structure. For example, each of the external electrodes 410 and 420 may include a first layer containing copper (Cu) and a second layer 413 formed on the first layer. The first layer may consist of connecting portions 411 and 421 and pad portions 412 and 422. The second layers 413 and 423 can be placed on the pad portions 412 and 422 and can be formed with a single-layer or multi-layer structure. If the second layers 413 and 423 have a multi-layer structure, they may include a first conductive layer containing nickel (Ni) and a second conductive layer containing tin (Sn).

[0071] The first layer can be formed by electroplating, vapor deposition such as sputtering, or by applying and curing a conductive paste containing conductive powder such as copper (Cu) and / or silver (Ag). The second layers 413 and 423 can be formed by electroplating.

[0072] In this embodiment, the insulating layer disposed on the outer surface of the coil component 1000 may include a lower insulating layer 510 disposed on the sixth surface 106 of the main body 100, a surface insulating layer 520 that covers the entire surface of the outermost external electrodes 410 and 420 excluding the pad portions 412 and 422, and a slit insulating layer 530 disposed between the surface insulating layer 520 and the connecting portions 411 and 421 of the external electrodes 410 and 420 in the slit portions S1 and S2. The lower insulating layer 510, the slit insulating layer 530, and the surface insulating layer 520 will be described in detail below in the order of the process sequence in which each insulating layer is formed.

[0073] Referring to Figures 2, 3, and 6, the lower insulating layer 510 is positioned on the sixth surface 106 of the main body 100. The lower insulating layer 510 can cover at least a portion of the sixth surface 106 of the main body 100, excluding the areas where the pad portions 412 and 422 of the external electrodes 410 and 420 are positioned.

[0074] The lower insulating layer 510 can have an average thickness close to 15 μm. Here, the average thickness of the lower insulating layer 510 can mean the arithmetic mean of the lengths of at least three equally spaced line segments from a plurality of line segments parallel to the thickness direction (T), connected by an optical microscope or SEM (Scanning Electron Microscope) photograph of the cross-section (L-T) in the length direction (L) at the center of the width direction (W) of the coil component 1000.

[0075] The lower insulating layer 510 may be a plating resist used when forming the external electrodes 410 and 420 by plating. The lower insulating layer 510 can be formed by forming an insulating material for forming the lower insulating layer over the entire sixth surface 106 of the main body 100, and then removing a portion corresponding to the area where the pad portions 412 and 422 of the external electrodes 410 and 420 are placed. Alternatively, the lower insulating layer 510 can be formed by selectively forming an insulating material for forming the lower insulating layer in the area of ​​the sixth surface 106 of the main body 100 excluding the area where the pad portions 412 and 422 are placed. The lower insulating layer 510 may contain an insulating resin such as epoxy.

[0076] The slit insulating layer 530 is positioned in the slit portions S1 and S2 so as to cover at least a portion of the connecting portions 411 and 421 of the first external electrode 410 and the second external electrode 420, respectively. By covering at least a portion of the connecting portions 411 and 421, the slit insulating layer 530 can prevent short circuits between the coil component 1000 and other electronic components according to this embodiment.

[0077] The average thickness of the slit insulating layer 530 can be 40 μm or more and 50 μm or less. Here, the average thickness of the slit insulating layer 530 can mean the arithmetic mean of the lengths of at least three or more equally spaced line segments among a plurality of line segments parallel to the length direction (L), based on an optical microscope or SEM (Scanning Electron Microscope) photograph of a cross-section (cross-section) in the length direction (L)-thickness direction (T) at the center of the width direction (W) of the coil component 1000. Alternatively, the inner boundary line corresponding to the inner surface of the slit insulating layer 530 in contact with the bottom surface of the slit S1 shown in the cross-sectional photograph above, and the outer boundary line corresponding to the outer surface of the slit insulating layer 530 are connected, and the result may represent the arithmetic mean of the lengths of at least three or more equally spaced line segments among a plurality of line segments parallel to the thickness direction (T).

[0078] The slit insulating layer 530 can be formed by forming an insulating material for forming the slit insulating layer 530 in the slit portions S1 and S2 where the connecting portions 411 and 421 are formed, by methods such as printing, vapor deposition, spray coating, and film lamination, but is not limited to these methods.

[0079] The slit insulating layer 530 is made of thermoplastic resins such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, and acrylic; thermosetting resins such as phenol, epoxy, urethane, melamine, and alkyd; photosensitive resins; parylene; SiO2 x , or SiN x It can include...

[0080] The surface insulating layer 520 is arranged on the first surface 101 and the second surface 102 of the main body 100, and on the slit portions S1 and S2, respectively. The surface insulating layer 520 can be arranged to cover at least a portion of the slit insulating layer 530 that covers the connecting portions 411 and 421 of the external electrodes 410 and 420 in the slit portions S1 and S2.

[0081] Referring to Figures 3 and 4, the surface insulating layer 520 can be positioned so as to extend in part from the slit portions S1 and S2 and cover at least a portion of the pad portions 412 and 422 of the external electrodes 410 and 420 which are arranged on the sixth surface 106 of the main body 100. That is, at least a portion of the surface insulating layer 520 can extend over the corners where the connecting portions 411 and 421 of the external electrodes 410 and 420 and the pad portions 412 and 422 come into perpendicular contact. In addition, the surface insulating layer 520 covers at least a portion of the areas of the pull-out portions 331 and 332 that are exposed on the first surface 101 and the second surface 102 of the main body 100.

[0082] Thus, the double insulating structure consisting of a surface insulating layer 520 and a slit insulating layer 530, and the structure in which at least a portion of the surface insulating layer 520 extends over the corners of the external electrodes 410 and 420, makes it possible to prevent plating bleeding on the surface of the coil component 1000 according to this embodiment, and to prevent short circuits between the coil component 1000 according to this embodiment and other electronic components mounted adjacent to it when mounted on a mounting board such as a printed circuit board.

[0083] Referring to Figure 4, the average thickness of the surface insulating layer 520 can be between 1 μm and 5 μm. The reason for forming the surface insulating layer 520 with the above thickness is to increase the effective volume of the main body 100 and the effective volume of the magnetic material compared to a component of the same size. Specifically, if the thickness of the surface insulating layer 520 is less than 1 μm, the insulation voltage will not reach the minimum value of the normal range, and if it exceeds 5 μm, problems such as decreased productivity, increased overall size of the component, and decreased effective volume of the magnetic material compared to a component of the same size may occur.

[0084] In other words, the dielectric strength improved by the surface insulating layer 520 increases in proportion to the thickness of the surface insulating layer 520. Conversely, as the thickness of the surface insulating layer 520, which does not affect the inductance characteristics of the coil component 1000, increases, the effective volume of the main body 100 may decrease compared to the same component size. Therefore, in terms of maintaining dielectric strength and effective volume, the optimal thickness of the surface insulating layer 520 to obtain a better result than conventional methods can be between 1 μm and 5 μm.

[0085] Conventionally, the surface insulating layer formed on the surface of the main body was formed by a thick-film process of printing insulating paste, which resulted in the problem of its relatively thick thickness. In the present invention, by forming the surface insulating layer 520 by a thin-film process, the effective volume of the main body 100 and the effective volume of the magnetic material can be increased compared to the same part size.

[0086] Table 1 shows experimental data derived from the thickness of the surface insulating layer 520 and the effective volume of the coil component 1000 for each configuration of the external electrodes 410 and 420. Referring to Table 1, it can be seen that when the thickness of the surface insulating layer 520 is 5 μm or less, the effective volume of the component is highest at 93.2%.

[0087] [Table 1]

[0088] On the other hand, the average thickness of the surface insulating layer 520 may mean the arithmetic mean of the lengths of at least three or more equally spaced line segments among a plurality of line segments parallel to the length direction (L), based on an optical microscope or SEM (Scanning Electron Microscope) photograph of a cross-section (cross-section) in the length direction (L)-thickness direction (T) at the center of the width direction (W) of the coil component 1000.

[0089] On the other hand, the surface insulating layer 520 can be arranged on the surface of the slit insulating layer 530 and extend to cover at least a portion of the pad portions 412 and 422 of the external electrodes 410 and 420. That is, at least a portion of the surface insulating layer 520 can be formed to extend over the corners where the connecting portions 411 and 421 and the pad portions 412 and 422 of the external electrodes 410 and 420 come into contact.

[0090] Referring to Figure 4, the length L1 of the region to which the surface insulating layer 520 extends can be between 1 μm and 50 μm. Here, the length L1 of the extending region can be defined as the shortest distance from a virtual plane substantially parallel to the first surface 101 and the second surface 102 of the main body 100 and including the surface insulating layer 520, to the end of the surface insulating layer 520 that extends over the corners where the connecting portions 411 and 421 and the pad portions 412 and 422 of the external electrodes 410 and 420 are in contact.

[0091] On the other hand, if the surface insulating layer 520 is directly placed on the connecting portions 411 and 421 without the slit insulating layer 530, the length L1 of the region to which the surface insulating layer 520 extends can be 1 μm or more and 30 μm or less.

[0092] The surface insulating layer 520 can be further disposed on the third surface 103, the fourth surface 104, and the fifth surface 105 of the main body 100, respectively. That is, for example, the surface insulating layer 520 can cover at least a portion of the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, the fifth surface 105, and the slit portions S1 and S2 of the main body 100. In this case, the surface insulating layer 520 can be integrally formed on the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, the fifth surface 105, and the slit portions S1 and S2 of the main body 100.

[0093] Referring to Figures 3 and 5, the surface insulating layer 520 can be formed with the lower insulating layer 510 formed on the sixth surface 106 of the main body 100. In this case, the surface insulating layer 520 can be formed in such a way that it covers at least a portion of each of the two sides of the lower insulating layer 510, which is on the same plane as the third surface 103 and the fourth surface 104 of the main body 100, but the scope of the present invention is not limited thereto.

[0094] Referring to Figure 5, at the interface between the lower insulating layer 510 and the pad portions 412 and 422 of the external electrodes 410 and 420, the lower insulating layer 510 is formed between the sixth surface 106 of the main body 100 and the pad portions 412 and 422 at the surface in contact with the pad portions 412 and 422, and can overlap with the pad portions 412 and 422 and a part of the second layers 413 and 423.

[0095] On the one hand, the surface insulating layer 520 is disposed on the surface of the lower insulating layer 510 and can extend to cover at least a part of the pad portions 412 and 422 of the external electrodes 410 and 420 at the boundary between each of the pad portions 412 and 422 and the lower insulating layer 510. That is, a double-insulating structure including the lower insulating layer 510 and the surface insulating layer 520 can be formed in the region of the sixth surface 106 of the main body 100 excluding the pad portions 412 and 422 of the external electrodes 410 and 420, and at least a part of the surface insulating layer 520 can be formed to extend over the pad portions 412 and 422 and the second layers 413 and 423.

[0096] Here, the length L2 of the region where the surface insulating layer 520 extends can be 1 μm or more and 30 μm or less. Here, the length L2 of the extending region can be defined as the average distance between a plane passing through the outermost side of the boundary surface between the lower insulating layer 510 and each of the pad portions 412 and 422 and a plane passing through the extended end of the surface insulating layer 520 among the virtual planes substantially perpendicular to the sixth surface 106 of the main body 100.

[0097] The surface insulating layer 520 can be formed by vapor deposition such as chemical vapor deposition (CVD), but is not limited thereto. The surface insulating layer 520 is, for example, Parylene-N (C 16 H 14 Cl2), EGDMA (Ethylene glycol dimethacrylate, C 10 H 14 O4), GMA (Glycidyl methacrylate, C7H 10 O3), V3D3 (2,4,6-trivinyl-2,4,6-trimethyl cyclotrisiloxane, C9H 18 O3Si3), V4D4 (2,4,6,8-tetramethyl-2,4,6,8-tetravinyl cyclotetrasiloxane, C 12 H 24O4Si4), PFDMA(3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl methacrylate, C 14 H9F 17 O2), 4VP (4-vinyl-pyridine, C7H7N), EGDA (Ethylene glycol diacrylate, C 10 H 14 O5), EA (Ethyl acrylate, C5H8O2), HEMA (2-hydroxyethylmethacrylate, C6H 10 O3), MAA (Methacrylic acid, C4H6O2), MAH (Methacrylic anhydride, C8H 10 O3), or DVB (Divinylbenzene, C 10 H 10 This does not limit the possibility of containing at least one of the following components.

[0098] With the above-described configuration, the coil component 1000 according to this embodiment can reduce the size of the coil component and easily realize the lower electrode structure. That is, unlike conventional designs, the external electrodes 410 and 420 are not formed to protrude from both end faces 101 and 102 or both sides 103 and 104 of the main body 100, so the overall length and width of the coil component 1000 are not increased. In addition, since the external electrodes 410 and 420 are formed by a thin-film process, they are formed relatively thinly, minimizing the increase in the thickness of the coil component 1000. Furthermore, in the coil component 1000 according to this embodiment, since the surface insulating layer 520 is formed relatively thinly by a thin-film process, the effective volume of the magnetic material can be maximized.

[0099] Furthermore, a double insulation structure, such as a slit insulating layer 530 and a surface insulating layer 520, or a lower insulating layer 510 and a surface insulating layer 520, can increase the insulation voltage compared to a single insulating structure. Table 2 shows the magnitude of the insulation voltage (V) depending on the thickness (μm) of the insulating layer when the lower insulating layer 510 is formed of acrylic resin by inkjet insulation. Table 3 shows the magnitude of the additional increase in insulation voltage (V) due to the thickness of the surface insulating layer 520 further formed on the lower insulating layer 510 when the lower insulating layer 510 formed of acrylic resin by inkjet insulation has a thickness of 15 μm. Table 4 shows, in order, the minimum value of the normal range according to the specifications of the coil component when forming the thin film insulating layer, the characteristics of the coil component according to the present invention, and the characteristics of the coil component by the conventional method.

[0100] Referring to Tables 2 and 3, experiments on the insulation voltage characteristics depending on the thickness of the insulating layer showed that when the lower insulating layer 510 was inkjet insulated with a 15 μm thick acrylic resin (insulation voltage per film: 25 V / μm), it had an insulation voltage of 375 V. In contrast, when a 2 μm thick EGDMA (insulation voltage per film: 9.37 V / μm) surface insulating layer 520 was further placed on top of the lower insulating layer 510, the insulation voltage increased by an additional 18.74 V. As a result, this double insulating structure resulted in an insulation voltage of 393.74 V, which is an effect of increasing the insulation voltage by approximately 4.76% compared to a single insulating structure.

[0101] Referring to Table 4, the double insulation structure of the present invention has a lower insulating layer 510 thickness that falls within the range of 5 μm or more, which is the minimum thickness required to ensure the visibility of the insulating layer during inkjet insulation, and the surface insulating layer 520 can be formed with a thin film of 2 μm compared to conventional methods. With such a structure, it is possible to provide a coil component that has an insulation voltage of 393.74 V, which is the minimum value of the normal range of 80 V, and an effective volume ratio of 93%, which is improved compared to conventional methods.

[0102] [Table 2]

[0103] [Table 3]

[0104] [Table 4]

[0105] (Second Embodiment) Figure 9 is a schematic perspective view of a coil component 3000 according to another embodiment of the present invention. Figure 10 is a view of the coil component 3000 of Figure 9 from below. Figure 11 is a cross-section along the line III-III' in Figure 9. Figure 12 is an enlarged view of region C in Figure 11.

[0106] Referring to Figures 9 to 12, the coil component 3000 according to another embodiment of the present invention differs from the coil component 1000 according to one embodiment of the present invention in that the shape of the coil portion 300 and the external electrodes 410 and 420 are different, and the slit portions S1 and S2 are absent. Therefore, in describing this embodiment, only the coil portion 300 and the external electrodes 410 and 420 that differ from those of one embodiment of the present invention will be described. The other configurations of this embodiment can be described in the same way as those described in one embodiment of the present invention.

[0107] The coil section 300 applied to this embodiment includes coil patterns 311 and 312, a first via 321, and lead-out sections 331 and 332.

[0108] A first coil pattern 311 and a second lead portion 332 are arranged on the lower surface of the substrate 200 facing the sixth surface 106 of the main body 100, and a second coil pattern 312 and a first lead portion 331 are arranged on the upper surface of the substrate 200 facing the fifth surface 105 of the main body 100. On the lower surface of the substrate 200, the first coil pattern 311 is in contact with and connected to the second lead portion 332, and the first coil pattern 311 and the second lead portion 332 are each arranged at a distance from the first lead portion 331. The second lead portion 332 can be formed extending from the outermost turn of the first coil pattern 311. The first lead portion 331 and the second lead portion 332 can be exposed on the first surface 101 and the second surface 102 of the main body 100, respectively.

[0109] The first via 321 penetrates the substrate 200 and connects to the innermost turn of the first coil pattern 311 and the innermost turn of the second coil pattern 312, respectively. In this way, the coil section 300 can function as a single coil as a whole.

[0110] The external electrodes 410 and 420 used in this embodiment are arranged spaced apart from each other on one surface 106 of the main body 100, and extend to the first surface 101 and the second surface 102 of the main body 100, respectively, and are connected to the first and second lead-out sections 331 and 332.

[0111] Specifically, the first external electrode 410 includes a first connecting portion 411 positioned on the first surface 101 of the main body 100 and connected in contact with the first pull-out portion 331, and a first pad portion 412 extending from the first connecting portion 411 to the sixth surface 106 of the main body 100.

[0112] The second external electrode 420 includes a second connecting portion 421 positioned on the second surface 102 of the main body 100 and connected to the second lead-out portion 332 in contact with it, and a second pad portion 422 extending from the second connecting portion 421 to the sixth surface 106 of the main body 100.

[0113] The connecting portions 411 and 421 can have a configuration that covers the entire first surface 101 and second surface 102 of the main body 100. The first pad portion 412 and the second pad portion 422 are spaced apart from each other on the sixth surface 106 of the main body 100 and can have a length substantially the same as the width (W) of the main body 100. That is, the connecting portions 411 and 421 and the pad portions 412 and 422 can each extend in the width (W) to the third and fourth surfaces 103 and 104 of the main body 100.

[0114] Referring to Figures 10 and 11, the coil component 3000 applied to this embodiment does not include slit portions S1, S2 and slit insulating layer 530, and the surface insulating layer 520 can be directly placed on the connecting portions 411, 421 of the external electrodes 410, 420.

[0115] The surface insulating layer 520 can be positioned so as to extend in part from the connecting portions 411 and 421 of the external electrodes 410 and 420, and cover at least a portion of the pad portions 412 and 422 of the external electrodes 410 and 420 that are placed on the sixth surface 106 of the main body 100. That is, at least a portion of the surface insulating layer 520 can extend over the corners where the connecting portions 411 and 421 of the external electrodes 410 and 420 and the pad portions 412 and 422 are in perpendicular contact.

[0116] Thus, by having a structure in which the surface insulating layer 520 extends at least a portion over the corners of the external electrodes 410 and 420, it is possible to prevent plating bleeding on the surface of the coil component 3000 according to this embodiment, and when mounting it on a mounting board such as a printed circuit board, it is possible to prevent short circuits between the coil component 3000 according to this embodiment and other electronic components mounted adjacent to it.

[0117] (Third embodiment) Figure 13 is a schematic perspective view showing a coil component 4000 according to yet another embodiment of the present invention.

[0118] Referring to Figure 13, the coil component 4000 according to this embodiment may include a winding-type coil section 300. In this case, the coil component 4000 according to this embodiment does not include a substrate 200.

[0119] The coil section 300 can be a winding coil formed by winding a metal wire, such as a copper wire (Cu-wire), which includes a metal wire and a coating layer that covers the surface of the metal wire. Therefore, the entire surface of each of the multiple turns of the coil section 300 is covered with the coating layer.

[0120] On the other hand, the metal wire can be a flat wire, but is not limited to that. If the coil section 300 is formed from a flat wire, the cross-section of each turn of the coil section 300 can be a right rectangle.

[0121] The coating layer may, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., either alone or in combination.

[0122] Although one embodiment of the present invention has been described above, a person with ordinary skill in the art can modify and change the present invention in various ways, such as by adding, changing, or deleting components, as long as it does not deviate from the spirit of the invention as described in the claims, and this can also be said to be within the scope of the rights of the present invention. [Explanation of Symbols]

[0123] 100 Main Unit 110 cores 200 circuit boards 300 coil section 311, 312 coil patterns 321, 322, 323 Beer 331, 332 Drawer section 341, 342 Dummy drawer section 410, 420 external electrode 411, 421 connection part 412, 422 Pad section 413, 423 2nd layer 510 Lower insulating layer 520 Surface insulating layer 530 Slit Insulating Layer IF insulating film S1, S2 Slit section 1000, 2000, 3000, 4000 coil parts

Claims

1. A body having one face and two opposing end faces, A coil section is disposed within the main body, including a first drawer section and a second drawer section that are spaced apart from each other, A first slit portion and a second slit portion are formed at the corner of the main body in the region where one end face and the other end face of the main body are adjacent to each other and expose the first and second pull-out portions, The first external electrode and the second external electrode are arranged on one surface of the main body at a distance from each other, and extend to the first slit portion and the second slit portion, respectively, and are connected to the first and second pull-out portions. A slit insulating layer that covers at least a portion of the first external electrode and the second external electrode with the first slit portion and the second slit portion, A coil component comprising a surface insulating layer disposed on the slit insulating layer and extending to cover at least a portion of the area of ​​the first external electrode and the second external electrode that is located on one surface of the main body.

2. The surface insulating layer is Parylene-N (C １６ H １４ Cl ２ ), EGDM A (Ethylene glycol dimethacrylate, C １０ H １４ O ４ ), GM A (Glycidyl methacrylate, C ７ H １０ O ３ ), V3D3 (2,4,6-trivinyl-2,4,6-trimethyl cyclotrisiloxane, C ９ H １８ O ３ Si ３ ), V4D4 (2,4,6,8-tetramethyl-2,4,6,8-tetravinyl cyclotetrasiloxane, C １２ H ２４ O ４ Si ４ ), PFDM A (3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl methacrylate, C １４ H ９ F １７ O ２ ), 4VP (4-vinyl-pyridine, C ７ H ７ N), EGDA (Ethylene glycol diacrylate, C １０ H １４ O ５ ), EA (Ethyl acrylate, C ５ H ８ O ２ ), HEMA (2-hydroxyethylmethacrylate, C ６ H １０ O ３ ), MAA (Methacrylic acid, C ４ H ６ O ２ ), MAH (Methacrylic anhydride, C ８ H １０ O ３ ), or DVB (Divinylbenzene, C １０ H １０ The coil component according to claim 1, comprising at least one of the following components.

3. The first external electrode and the second external electrode are, The first slit portion and the second slit portion are arranged in a connecting portion that contacts and connects to the first drawer portion and the second drawer portion, and the pad portion extends from the connecting portion to one surface of the main body, The coil component according to claim 1, wherein the slit insulating layer is disposed between the respective surfaces of the connecting portion, the first slit portion, and the second slit portion and the surface insulating layer.

4. The above-mentioned body further includes a lower insulating layer that covers at least a portion of the area of ​​one surface of the main body excluding the first external electrode and the second external electrode, The coil component according to claim 1, wherein the surface insulating layer is further disposed on the lower insulating layer.

5. The coil component according to claim 4, wherein the surface insulating layer extends to cover at least a portion of the first external electrode and the second external electrode at the boundary between each of the first external electrode and the lower insulating layer.

6. The main body has a surface facing one of the surfaces of the main body, and two other surfaces connected to the aforementioned surface and the other surface, respectively, and facing each other. The coil component according to claim 1, wherein the surface insulating layer is further disposed on the other side, one side, and the other side of the main body.

7. The main body further includes a circuit board, The first and second drawer sections are arranged at a distance from each other on the lower surface of the substrate facing one side of the main body, The aforementioned coil section is A coil component according to any one of claims 1 to 6, further comprising: a first coil pattern disposed on the lower surface of the substrate so as to be separated from the first pull-out portion and connected to the second pull-out portion; a second coil pattern disposed on the upper surface of the substrate facing the other surface of the main body; and a first dummy pull-out portion disposed on the upper surface of the substrate and connected to the second coil pattern.

8. The coil component according to claim 7, wherein the first and second extension portions are exposed on one end face and the other end face of the main body, respectively.

9. The aforementioned coil section is A first via penetrates the substrate and connects the first coil pattern and the second coil pattern to each other, The coil component according to claim 7, further comprising a second via that penetrates the substrate and connects the first lead portion and the first dummy lead portion to each other.

10. The aforementioned coil section is A second dummy pull-out section is arranged on the upper surface of the substrate, spaced apart from the second coil pattern and the first dummy pull-out section, The coil component according to claim 9, further comprising a third via that penetrates the substrate and connects the second lead portion and the second dummy lead portion to each other.

11. A body having one surface, one end surface and the other end surface connected to the aforementioned surface and facing each other, A coil section including a first pull-out section and a second pull-out section that are spaced apart from each other and exposed on one end face and the other end face of the main body, The first external electrode and the second external electrode are arranged on one surface of the main body at a distance from each other, and extend to one end surface and the other end surface of the main body, respectively, and are connected to the first and second extension portions. A lower insulating layer covering at least a portion of the area of ​​one surface of the main body excluding the first external electrode and the second external electrode, The main body includes a surface insulating layer that covers at least a portion of the first external electrode and the second external electrode on one end face and the other end face, respectively, and is disposed on the lower insulating layer on one end face of the main body, The aforementioned surface insulating layer is A coil component that covers at least a portion of the area of ​​the first external electrode and the second external electrode that is arranged on one surface of the main body, and extends to cover at least a portion of the first external electrode and the second external electrode at the boundary portion between each of the first external electrode and the lower insulating layer.

12. The coil component according to claim 11, further comprising a circuit board disposed within the main body.

13. The aforementioned coil section is A first coil pattern is positioned on the lower surface of the substrate facing one side of the main body and connected to the second pull-out section, A second coil pattern is arranged on the upper surface of the substrate facing the other side of the main body and connected to the first pull-out section, The present invention further includes a first via that penetrates the substrate and connects the first coil pattern and the second coil pattern to each other, The first external electrode and the second external electrode are, The coil component according to claim 12, comprising: a connecting portion arranged on one end face and the other end face of the main body and connected in contact with the first pull-out portion and the second pull-out portion; and a pad portion extending from the connecting portion to one face of the main body.

14. The aforementioned surface insulating layer is The coil component according to claim 13, wherein it covers at least a portion of the outer surface of the coil component excluding the pad portion, and a portion extends from the corner portion where the connecting portion and the pad portion meet onto the pad portion, further covering at least a portion of the pad portion.

15. The aforementioned coil section is A coil component according to any one of claims 11 to 14, which is a winding coil made by winding a metal wire whose surface is covered with a coating.

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