Organic light-emitting display device

Abstract

The organic light-emitting display device may include a first three-dimensional structure on a substrate, a second three-dimensional structure spaced apart from the first three-dimensional structure with a separation region therebetween along a first direction on the substrate, a first sub-pixel on one side surface of the first three-dimensional structure, a second sub-pixel on one side surface of the second three-dimensional structure, a third sub-pixel on the separation region, a first anode separation structure below the first three-dimensional structure between the first organic light-emitting element and the third organic light-emitting element, and a second anode separation structure below the second three-dimensional structure between the second organic light-emitting element and the third organic light-emitting element. The first sub-pixel may include the first organic light-emitting element, the second sub-pixel may include the second organic light-emitting element, and the third sub-pixel may include the third organic light-emitting element.

Description

Technical Field

[0001] The embodiments relate to an organic light emitting display device.

Background Art

[0002] In recent years, society has entered a full-scale information age, and there has been an increasing interest in information displays that process and display large amounts of information. Along with this, there has been an increasing demand to use portable information media, and the display field has been rapidly developing. In response, various lightweight and thin flat panel display devices have attracted attention.

[0003] Among such flat panel display devices, organic light emitting display devices (OLEDs: Organic Light Emitting Display Devices, hereinafter referred to as OLEDs) have attracted attention. OLEDs are actively being developed for use as display devices for head mounted displays (HMDs) worn close to the human eye. HMDs are worn in the form of helmets or glasses, and virtual reality (VR) or augmented reality (AR) is realized.

[0004] High-resolution small OLEDs are provided in HMDs. In a high-resolution small OLED, organic light emitting elements are arranged on a driving circuit formed using a wafer-based semiconductor process. On the other hand, for glasses-type HMDs, a brighter and clearer screen is required at a very small screen size. For this, it is necessary to maximize the light amount from the organic light emitting elements and the light extraction efficiency thereof. In addition, it is necessary to suppress light leakage between pixels and improve image quality. A technology for improving light extraction efficiency applicable to ultra-high resolution is expected to be widely applied to large screen display industries such as mobile devices and IT devices.

[0005] On the other hand, conventionally, in order to form an organic light emitting layer constituting an organic light emitting element by vapor deposition for each subpixel, a fine metal mask (FMM) is used as a vapor deposition pattern mask.

[0006] However, forming organic light-emitting layers separately for each subpixel using FMMs is considerably difficult in the manufacturing of high-resolution (e.g., 500 PPI or higher) and large-area (e.g., 8th generation or higher) display devices. Furthermore, there are limitations to further increasing resolution when using FMMs. Additionally, using FMMs results in reduced yield and increased manufacturing costs. Moreover, optimizing the deposition process is difficult when using FMMs, leading to a reduced product lifespan.

[0007] On the other hand, as display resolutions have increased recently, pixel resolution (ppi) has also increased, and the spacing between pixels (or subpixels) has gradually narrowed. In addition, the efficiency of light-emitting materials for organic light-emitting elements has improved, allowing for high brightness with low current and voltage, resulting in the advantage of lower power consumption. However, because the efficiency of light-emitting materials for organic light-emitting elements has improved, enabling light emission with small amounts of current, even a small amount of current leaking from one pixel (or subpixel) to another adjacent pixel (or subpixel) can cause it to emit light. As a result, the phenomenon occurs where adjacent pixels (or subpixels) that should not emit light also emit light. This type of current leakage is called lateral current leakage.

[0008] When leakage light occurs due to lateral current leakage, problems such as color mixing and color coordinate shifts can arise. Furthermore, if leakage light occurs in low-luminance areas, it can increase black luminance.

[0009] To suppress luminescence leakage, methods such as reducing the efficiency of the light-emitting material or lowering the resolution of the display element are available. However, given the recent increase in demand for low-power, high-resolution products, solving the problem of luminescence leakage due to lateral current leakage by reducing the efficiency of the light-emitting material or lowering the resolution of the display element is undesirable. Therefore, a technology is needed that can suppress luminescence leakage due to lateral current leakage without lowering the resolution in display devices using highly efficient light-emitting materials. [Overview of the project] [Problems that the invention aims to solve]

[0010] The embodiments aim to solve the aforementioned problems and other problems.

[0011] Another objective of the embodiment is to provide a high-definition and high-resolution organic light-emitting display device.

[0012] Another objective of the embodiment is to provide an organic light-emitting device that does not use FMMs.

[0013] Another objective of the embodiment is to provide an organic light-emitting display device that can prevent lateral current leakage between pixels (or subpixels).

[0014] The technical problems of the embodiments are not limited to those described in this section, but also include those that can be understood from the description of the invention. [Means for solving the problem]

[0015] To achieve the aforementioned or other objectives, according to one aspect of the embodiment, the organic light-emitting device includes: a first three-dimensional structure on a substrate; a second three-dimensional structure separated from the first three-dimensional structure by a separation region on the substrate along a first direction; a first subpixel on one side of the first three-dimensional structure; a second subpixel on one side of the second three-dimensional structure; a third subpixel on the separation region; a first anode separation structure below the first three-dimensional structure between the first organic light-emitting element and the third organic light-emitting element; and a second anode separation structure below the second three-dimensional structure between the second organic light-emitting element and the third organic light-emitting element, wherein the first subpixel includes a first organic light-emitting element, the second subpixel includes a second organic light-emitting element, and the third subpixel may include a third organic light-emitting element.

[0016] The organic light-emitting display device may further include a protective layer comprising a plurality of insulating films on the substrate, a first auxiliary electrode between the protective layer and the first three-dimensional structure, a second auxiliary electrode between the protective layer and the second three-dimensional structure, and a third auxiliary electrode between the protective layer and the third organic light-emitting element.

[0017] The first anode isolation structure includes a first undercut structure formed such that the ends of at least one protective film among the plurality of insulating films are located inward from the side surface of the first three-dimensional structure, and the second anode isolation structure may include a second undercut structure formed such that the ends of at least one protective film among the plurality of insulating films are located inward from the side surface of the second three-dimensional structure.

[0018] The first anode separation structure further includes a first discontinuation structure that separates the first subpixel and the third subpixel by the first undercut structure, and the second anode separation structure may further include a second discontinuation structure that separates the second subpixel and the third subpixel by the second undercut structure.

[0019] The first disconnection structure includes a first-1 disconnection structure that disconnects the first anode electrode of the first organic light-emitting element and the third anode electrode of the third organic light-emitting element between the first subpixel and the third subpixel, and the second disconnection structure may include a second-1 disconnection structure that disconnects the second anode electrode of the second organic light-emitting element and the third anode electrode of the third organic light-emitting element between the second subpixel and the third subpixel.

[0020] The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element each include a plurality of stacks between an anode electrode and a cathode electrode, and a plurality of charge generation layers between the plurality of stacks, wherein the plurality of stacks of the third organic light-emitting element each include a blue light-emitting layer, and the blue light-emitting layer and the charge generation layer may be formed in common with the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element.

[0021] The first disconnection structure includes a first-2 disconnection structure that disconnects the blue light-emitting layer between the first sub-pixel and the third sub-pixel, and the second disconnection structure can include a second-2 disconnection structure that disconnects the blue light-emitting layer between the second sub-pixel and the third sub-pixel.

[0022] The first disconnection structure includes a first-3 disconnection structure that disconnects the charge generation layer between the first sub-pixel and the third sub-pixel, and the second disconnection structure can include a second-3 disconnection structure that disconnects the charge generation layer between the second sub-pixel and the third sub-pixel.

[0023] The first auxiliary electrode and the second auxiliary electrode each include a plurality of metal films. At least one metal film of the plurality of metal films of the first auxiliary electrode includes a first protruding region that protrudes outward from the side surface of the first three-dimensional structure and contacts the first anode electrode. At least one metal film of the plurality of metal films of the second auxiliary electrode can include a second protruding region that protrudes outward from the side surface of the second three-dimensional structure and contacts the second anode electrode.

[0024] The organic light-emitting display device further includes a first insulating layer on the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element, a second insulating layer on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure, and a third insulating layer on the second insulating layer. The third insulating layer can contact the upper surfaces of the first three-dimensional structure and the second three-dimensional structure.

Advantages of the Invention

[0025] Regarding the effects of the organic light-emitting display device according to the embodiment, it is as follows.

[0026] According to at least one of the embodiments, subpixels are arranged on a three-dimensional structure. This maintains or expands the light-emitting area of ​​each subpixel while reducing the occupied area, resulting in a high-definition and high-resolution display.

[0027] According to at least one of the embodiments, the blue organic light-emitting layer in the blue common structure is formed either not on the sides of the three-dimensional structure or at a very thin thickness, by increasing the inclination angle of the sides of the three-dimensional structure or by having vertical surfaces. As a result, the blue organic light-emitting layer does not affect the light emission of each subpixel, preventing defects such as reduced color purity and uneven coloring.

[0028] According to at least one of the embodiments, the anode isolation structure naturally disconnects (or separates) the anode electrodes of each subpixel. This eliminates the need for a patterning process to separate the anode electrodes for each subpixel, preventing defects caused by the patterning process, simplifying the process, and reducing costs.

[0029] According to at least one of the embodiments, the anode isolation structure isolates (or separates) the charge generation layer on a subpixel-by-subpixel basis. This prevents lateral current leakage between each subpixel.

[0030] The additional scope of applicability of the examples will become clear from the detailed description below. It should be understood that the detailed description and specific examples, such as preferred embodiments, are merely illustrative, as various changes and modifications within the concept and scope of the examples should be clearly understood by those skilled in the art. [Brief explanation of the drawing]

[0031] [Figure 1] Figure 1 is a schematic plan view illustrating an organic light-emitting display device according to an embodiment. [Figure 2] Figure 2 is a schematic perspective view illustrating an organic light-emitting display device according to an embodiment as a first example. [Figure 3]Figure 3 is a schematic perspective view illustrating an organic light-emitting display device according to an embodiment as a second example. [Figure 4] Figure 4 is a schematic perspective view illustrating an organic light-emitting display device according to an embodiment as a third example. [Figure 5] Figure 5 is a cross-sectional view illustrating an organic light-emitting device according to the first embodiment. [Figure 6] Figure 6 is a cross-sectional view illustrating an organic light-emitting display device according to the second embodiment. [Figure 7] Figure 7 is a cross-sectional view illustrating an organic light-emitting device according to the third embodiment. [Figure 8] Figure 8 is a cross-sectional view illustrating an organic light-emitting device according to the fourth embodiment. [Figure 9a] Figure 9a is a cross-sectional view illustrating the stacked structure of different organic light-emitting elements according to the first embodiment. [Figure 9b] Figure 9b is a cross-sectional view illustrating the stacked structure of different organic light-emitting elements according to the second embodiment. [Figure 10a] Figure 10a illustrates the vapor deposition system according to the embodiment. [Figure 10b] Figure 10b illustrates the deposition process of a blue organic light-emitting layer, a red organic light-emitting layer, and a green organic light-emitting layer onto a substrate. [Figure 10c] Figure 10c is a diagram illustrating the self-aligned deposition (SAD) method of the example. [Figure 11] Figure 11 is a flowchart showing the method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12a] Figure 12a is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12b] Figure 12b is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12c] Figure 12c is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12d] Figure 12d is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12e] Figure 12e is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12f] Figure 12f is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12g] Figure 12g is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12h] Figure 12h is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12i] Figure 12i is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12j] Figure 12j is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12k] Figure 12k is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12l] Figure 12l is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12m] Figure 12m is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 12n] Figure 12n is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the first embodiment. [Figure 13] Figure 13 is a flowchart showing the method for manufacturing an organic light-emitting display device according to the second embodiment. [Figure 14a] Figure 14a is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the second embodiment. [Figure 14b] Figure 14b is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the second embodiment. [Figure 14c] Figure 14c is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the second embodiment. [Figure 14d] Figure 14d is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the second embodiment. [Figure 15] Figure 15 is a detailed cross-sectional view of region X in Figure 7. [Figure 16] Figure 16 is a flowchart showing the method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 17a] Figure 17a is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 17b] Figure 17b is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 17c] Figure 17c is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 17d] Figure 17d is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 17e] Figure 17e is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 17f] Figure 17f is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 17g] Figure 17g is a cross-sectional view showing a method for manufacturing an organic light-emitting display device according to the third embodiment. [Figure 18] Figure 18 illustrates the height and depth of the undercut structure in the anode separation structure according to the embodiment. [Figure 19] Figure 19 is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment. [Figure 20] Figure 20 is a cross-sectional view illustrating an organic light-emitting device according to the sixth embodiment. [Figure 21a] Figure 21a is a cross-sectional view of a schematic panel designed for an AR product. [Figure 21b] Figure 21b is the design data sheet for the panel design shown in Figure 21a. [Figure 22] Figure 22 is a plan view of a schematic panel design for an AR product.

[0032] The size, shape, and numerical values ​​of the components shown in the drawings do not necessarily correspond to reality. Furthermore, even if the same component is shown with different sizes, shapes, and numerical values ​​in different drawings, this is merely one example on the drawing, and the same component can have the same size, shape, and numerical values ​​in different drawings. [Modes for carrying out the invention]

[0033] The embodiments disclosed herein will be described in detail below with reference to the accompanying drawings, but identical or similar components will be given the same reference numeral regardless of the drawing reference numerals, and redundant descriptions will be omitted. The suffixes “module” and “part” used for components in the following description are given or used interchangeably for the sake of facilitating the writing of the specification and do not have any distinguishing meaning or role in themselves. The accompanying drawings are provided to facilitate understanding of the embodiments disclosed herein and do not limit the technical ideas disclosed herein. Furthermore, when an element such as a layer, region, or substrate is referred to as being “on” another component, this includes elements that are directly on other elements or where other intermediate elements may exist between them.

[0034] Figure 1 is a schematic plan view illustrating an organic light-emitting display device according to an embodiment.

[0035] The organic light-emitting display device 100 according to this embodiment may be an upper-emitting type or a lower-emitting type. An upper-emitting type organic light-emitting display device can emit light upwards to display an image. A lower-emitting type organic light-emitting display device can emit light downwards to display an image.

[0036] Referring to Figure 1, the organic light-emitting display device 100 according to the embodiment may include a plurality of pixels P arranged on a substrate 101.

[0037] The substrate 101 can be divided into a display area and a non-display area. Multiple pixels P are arranged on the display area. Driving devices such as gate drivers and data drivers may be arranged on the non-display area, but are not limited to this. Multiple pixels P are arranged in a matrix. Multiple pixels P are arranged along a first direction X. Multiple pixels P are arranged along a second direction Y.

[0038] Each pixel P may contain multiple subpixels SPg, SPr, and SPb. Each of these subpixels may contain at least three subpixels of different colors.

[0039] As a first example, multiple subpixels SPg, SPr, and SPb are separated into pixel P units or row line units along the second direction Y. For example, the green subpixel SPg is separated into pixel P units or row line units along the second direction Y, the red subpixel SPr is separated into pixel P units or row line units along the second direction Y, and the blue subpixel SPr is separated into pixel P units or row line units along the second direction Y.

[0040] As a second example, multiple subpixels SPg, SPr, and SPb may be arranged in a stripe pattern along the second direction Y. In the stripe pattern structure, the multiple subpixels SPg, SPr, and SPb may not be separated but continuously arranged along the second direction Y. For example, the green subpixels SPg may be continuously arranged along the second direction Y, the red subpixels SPr may be continuously arranged along the second direction Y, and the blue subpixels SPr may be continuously arranged along the second direction Y.

[0041] On the other hand, in the first and second examples, the green subpixel SPg, red subpixel SPr, and blue subpixel SPb are arranged alternately in column line units along the first direction X. That is, in the examples, the green subpixel SPg, red subpixel SPr, and blue subpixel SPb, which have different colors from each other, are arranged in a side-by-side structure along the first direction X. In a side-by-side structure, it is extremely important to achieve high definition and high resolution without reducing the light-emitting area of ​​each of the multiple subpixels SPg, SPr, and SPb.

[0042] The green subpixel SPg may be referred to as the first subpixel, the red subpixel SPr as the second subpixel, and the blue subpixel SPb as the third subpixel.

[0043] Figures 2 to 4 illustrate organic light-emitting devices on various three-dimensional structures 130-1 and 130-2. Specifically, Figure 2 is a schematic perspective view illustrating an organic light-emitting device according to an embodiment as a first example, Figure 3 is a schematic perspective view illustrating an organic light-emitting device according to an embodiment as a second example, and Figure 4 is a schematic perspective view illustrating an organic light-emitting device according to an embodiment as a third example. Figures 2 to 4 are cross-sectional views taken along the AA' line in Figure 1.

[0044] For the sake of explanation, two three-dimensional structures 130-1 and 130-2 are shown, but multiple three-dimensional structures can be arranged on the substrate 100.

[0045] As shown in Figures 1 to 4, the organic light-emitting display device 100 according to the embodiment may include three-dimensional structures 130-1 and 130-2. The three-dimensional structures 130-1 and 130-2 have at least two sides 130-1a, 130-1b, 130-2a, and 130-2b, and at least two subpixels SPg and SPr are arranged on at least two sides 130-1a, 130-1b, 130-2a, and 130-2b. Such a structure makes it possible to realize high definition and high resolution without reducing the light-emitting area of ​​each subpixel SPg and SPr.

[0046] In the drawings, sides 130-1a, 130-1b, 130-2a, and 130-2b have straight surfaces, but they can also have curved or uneven surfaces. Sides 130-1a, 130-1b, 130-2a, and 130-2b can be referred to as walls. Sides 130-1a, 130-1b, 130-2a, and 130-2b and walls may be used interchangeably.

[0047] The three-dimensional structures 130-1 and 130-2 may have a dot structure. The three-dimensional structures 130-1 and 130-2 are arranged in a matrix along the first direction X and the second direction Y. The three-dimensional structures 130-1 and 130-2 are separated into pixel units P or column-line units along the first direction X. As shown in Figures 2 and 4, the three-dimensional structures 130-1 and 130-2 are separated into pixel units P or row-line units along the second direction Y. As shown in Figure 3, the three-dimensional structures 130-1 and 130-2 are separated into two or more pixel units P or row-line units along the second direction Y.

[0048] Although not shown in the diagram, the three-dimensional structures 130-1 and 130-2 are arranged in a continuous stripe pattern along the second direction Y. That is, the three-dimensional structures 130-1 and 130-2 are not separated but are arranged as a single, long unit along the second direction Y.

[0049] The sides 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 may have inclined surfaces (Figures 2 and 3) or vertical surfaces (Figure 4). Although not shown, the sides 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 may also have vertical surfaces, separated into two or more pixel P units or row line units along the second direction Y.

[0050] The scan signal drives multiple subpixels SPg, SPr, and SPb sequentially or interleavingly for at least one row line. For example, they are driven alternately in the order of the first row line, third row line, second row line, and fourth row line. This alternating drive reduces leakage current in the second direction Y.

[0051] The separation of the three-dimensional structures 130-1 and 130-2 into one pixel P unit or two or more pixel P units along the second direction Y facilitates the anode electrode patterning process and reduces leakage current between pixels P or subpixels SPg, SPr, and SPb along the second direction Y.

[0052] The height and width of the three-dimensional structures 130-1 and 130-2 are determined according to the resolution of the organic light-emitting display device 100, and the manufacturing method for the three-dimensional structures 130-1 and 130-2 is also determined.

[0053] A first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 are provided on a substrate 101. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be separated by a separation region 105 between them. The second three-dimensional structure 130-2 can be separated from the first three-dimensional structure 130-1 by a separation region 105 along a first direction X.

[0054] In such a case, one pixel P is defined using the first side surface 130-1a of the first three-dimensional structure 130-1, the first side surface 130-2a of the second three-dimensional structure 130-2, and the separation region 105. The first side surface 130-1a of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2 can be positioned opposite each other with the separation region 105 in between. The first side surface 130-1a of the first three-dimensional structure 130-1 can be in contact with one side of the separation region 105, and the first side surface 130-2a of the second three-dimensional structure 130-2 can be in contact with the other side of the separation region 105.

[0055] For example, a green subpixel SPg is defined on the first side surface 130-1a of the first three-dimensional structure 130-1, a red subpixel SPr is defined on the first side surface 130-2a of the second three-dimensional structure 30-2, and a blue subpixel SPb is defined on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green subpixel SPg, red subpixel SPr, and blue subpixel SPb constitute one pixel P. Thus, multiple pixels are defined by providing multiple three-dimensional structures on the substrate 101.

[0056] A green organic light-emitting element 140g is placed in the green subpixel SPg, a red organic light-emitting element 140r is placed in the red subpixel 140r, and a blue organic light-emitting element 140b is placed in the blue subpixel SPb. The green organic light-emitting element 140g may be referred to as the first organic light-emitting element, the red organic light-emitting element 140r as the second organic light-emitting element, and the blue organic light-emitting element 140b as the third organic light-emitting element.

[0057] Furthermore, another red organic light-emitting element 140'r is placed in the red subpixel SPr on the second side surface 130-1b of the first three-dimensional structure 130-1, and yet another green organic light-emitting element 140'g is placed in the green subpixel SPg on the second side surface 130-2b of the second three-dimensional structure 130-2.

[0058] Therefore, along the first direction X, the red subpixel SPr, green subpixel SPg, blue subpixel SPb, red subpixel SPr, and green subpixel SPg are arranged in that order. Along the first direction X, yet another red organic light-emitting element 140'r, green organic light-emitting element 140g, blue organic light-emitting element 140b, red organic light-emitting element 140r, and yet another green organic light-emitting element 140'g are arranged in that order.

[0059] The average wall angles θa1 and θa2 can be obtained from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2. For example, the average wall angles θa1 and θa2 may be the angles at which the upper and lower ends of the anode electrode are extended and touch the surface of the separation region 105 of the substrate 101 at the upper surface 130T of the three-dimensional structures 130-1 and 130-2. If the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2 have rounded surfaces, the average wall angles θa1 and θa2 can be obtained using the linear extrapolation method.

[0060] For example, depending on the size of the average wall angles θa1 and θa2, the three-dimensional structures 130-1 and 130-2 can have a rhombic column (Figures 2 and 3) or a rectangular column (Figure 4) when viewed from the side. That is, the inner diameter and area of ​​the three-dimensional structures 130-1 and 130-2 decrease as they go upwards. In the three-dimensional structures 130-1 and 130-2 that have a rhombic column (Figures 2 and 3) or a rectangular column (Figure 4), the average wall angles θa1 and θa2 may be 60 degrees or more and less than 90 degrees.

[0061] As another example, the average wall angles θa1 and θa2 may be perpendicular to the substrate 101. That is, the average wall angles θa1 and θa2 may be 90 degrees to the substrate 101.

[0062] As yet another example, the three-dimensional structures 130-1 and 130-2 may have an inverse tapered shape in which the inner diameter and area increase towards the top. In such cases, the average wall angles θa1 and θa2 can be 90 degrees or more with respect to the substrate 101.

[0063] On the other hand, the closer the average wall angle θa is to vertical, i.e., 90 degrees, the more advantageous it is for high resolution. The average wall angle θa may also be an angle with respect to the ground or substrate 101. In a blue common structure, the blue organic light-emitting layer 142B may be commonly arranged for the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb. The closer the average wall angle θa is to vertical, i.e., 90 degrees, the thinner the blue organic light-emitting layer 142B commonly arranged for the green subpixel SPg and the red subpixel SPr is, thus minimizing defects due to reduced color purity and uneven coloring.

[0064] On the other hand, as shown in Figure 3, the three-dimensional structures 130-1 and 130-2 are separated into units of two or more pixels P or rows / lines along the second direction Y. In this case, two or more green organic light-emitting elements 140g are provided on the first side surface 130-1a of the first three-dimensional structure 130-1 along the second direction Y. Two or more red organic light-emitting elements 140r are provided on the first side surface 130-2a of the second three-dimensional structure 130-2 along the second direction Y. Two or more blue organic light-emitting elements 140b are provided on the separation region 105 along the second direction Y.

[0065] Various organic light-emitting devices will be described below with reference to Figures 5 to 8. Figures 5 to 8 are cross-sectional views taken along the BB' line in Figure 1.

[0066] Figure 5 is a cross-sectional view illustrating an organic light-emitting device according to the first embodiment.

[0067] The organic light-emitting display device 100A shown in Figure 5 is the same as the organic light-emitting display device shown in Figure 2 or Figure 3, and the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 can be tilted with respect to the substrate 101.

[0068] Referring to Figure 5, the organic light-emitting device 100A according to the first embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, and the like.

[0069] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are placed on the substrate 101. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can have a rectangular prism or a rhombic prism (Figures 2 to 4). The sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 can be inclined with respect to the substrate 101. In such a case, the average wall angle θa may be 60 degrees or more and less than 90 degrees.

[0070] On the other hand, the three-dimensional structures 130-1 and 130-2 may have a flat or rounded top surface 130T. For example, a flat surface is advantageous for thickness control when a photoprocessing step is involved, while it does not necessarily have to be flat when a printing step is involved. Although not shown, the three-dimensional structures 130-1 and 130-2 may also have vertices instead of a top surface 130T.

[0071] On the other hand, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can each be separated into one pixel P unit or two or more pixel P units along the second direction Y, or they can have a stripe shape.

[0072] The green subpixel SPg is positioned on the first side surface 130-1a of the first three-dimensional structure 130-1, the red subpixel SPr is positioned on the first side surface 130-2a of the second three-dimensional structure 130-2, and the blue subpixel SPb is positioned on the separation region 105. The separation region 105 may be a region on the substrate 101 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0073] The first side surface 130-1a of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2 can be in contact with both sides of the separation region 105.

[0074] The area of ​​the separation region 105 changes depending on the isolation distance between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Therefore, the area of ​​the blue subpixel SPb placed on the separation region 105 is determined by the area of ​​the separation region 105. Increasing the isolation distance increases the area of ​​the separation region 105, which in turn increases the area of ​​the blue subpixel SPb. While increasing the area of ​​the blue subpixel SPb increases brightness, it does not increase resolution. Therefore, the isolation distance between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 is determined by considering resolution.

[0075] The green organic light-emitting element 140g is placed in the green subpixel SPg, the red organic light-emitting element 140r is placed in the red subpixel SPr, and the blue organic light-emitting element 140b is placed in the blue subpixel SPb.

[0076] The green organic light-emitting element 140g may include a first anode electrode 141g, a green organic light-emitting layer 142G, and a cathode electrode 143. The red organic light-emitting element 140r may include a second anode electrode 141r, a red organic light-emitting layer 142R, and a cathode electrode 143. The blue organic light-emitting element 140b may include a third anode electrode 141b, a blue organic light-emitting layer 142B, and a cathode electrode 143. The green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may contain more layers than those listed above.

[0077] The green organic light-emitting layer 142G may be referred to as the first organic light-emitting layer, the red organic light-emitting layer 142R as the second organic light-emitting layer, and the blue organic light-emitting layer 142B as the third organic light-emitting layer.

[0078] The first anode electrode 141g and the green organic light-emitting layer 142G of the green organic light-emitting element 140g are located in the green subpixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1. The second anode electrode 141r and the red organic light-emitting layer 142R of the red organic light-emitting element 140r are located in the red subpixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2. The third anode electrode 141b and the blue organic light-emitting layer 142B of the blue organic light-emitting element 140b are located in the blue subpixel SPb on the separation region 105.

[0079] The cathode electrode 143 may be commonly arranged for the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb. The cathode electrode 143 is commonly arranged for the entire area of ​​the substrate 101, for example, for all pixels P and all subpixels SPg, SPr, and SPb.

[0080] In this embodiment, the blue organic light-emitting layer 142B is placed not only on the blue subpixel SPb but also on the green subpixel SPg and the red subpixel SPr. That is, the blue organic light-emitting layer 142B is placed in common across the entire area of ​​the substrate 101, for example, on all pixels P and all subpixels SPg, SPr, and SPb. Such a structure can be called a blue common structure. In such a blue common structure, the blue organic light-emitting layer 142B is placed on the sides 130-1a and 130-1b of the first three-dimensional structure 130-1, the sides 130-2a and 130-2b of the second three-dimensional structure 130-2, and on the separation region 105. In the green subpixel SPg, the blue organic light-emitting layer 142B is placed between the first anode electrode 141g and the green organic light-emitting layer 142G. In the red subpixel SPr, the blue organic light-emitting layer 142B is placed between the second anode electrode 141r and the red organic light-emitting layer 142R.

[0081] According to the example, without using FMM, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B are formed on the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb, respectively. That is, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B are formed using the self-aligned deposition (SAD) method and the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The SAD method will be described later.

[0082] On the other hand, the organic light-emitting display device 100A according to the first embodiment may include a substrate 101, a plurality of drive circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc.

[0083] Multiple drive circuits 103 are arranged on the substrate 101, a protective layer 110 is arranged on the multiple drive circuits 103, and multiple auxiliary electrodes 120g, 120r, and 120b are arranged on the protective layer 110. The auxiliary electrodes can be referred to as pixel electrodes.

[0084] The substrate 101 can be made of a silicon wafer, glass, plastic, ceramic, or the like. The substrate 101 can be made of a transparent or opaque material. The drive circuit 103 can include a plurality of transistors and at least one or more capacitors. One of the plurality of transistors may be a drive transistor.

[0085] The protective layer 110 may be a single layer consisting of an inorganic film or an organic film. The protective layer 110 may be a multilayer of inorganic films, or a combination of a multilayer of inorganic films and an organic film. The protective layer 110 may be formed of a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer of these.

[0086] For example, the protective layer 110 is composed of a multilayer structure of an organic film and an inorganic film. In such a case, the organic film may include acrylic resin, epoxy resin, phenolicresin, polyamide resin, polyimide resin, etc. The inorganic film may include silicon oxide (SiOx), silicon nitride (SiNx), etc.

[0087] Multiple auxiliary electrodes 120g, 120r, and 120b are provided corresponding to multiple subpixels SPg, SPr, and SPb. For example, the first auxiliary electrode 120g is connected to the green subpixel SPg, the second auxiliary electrode 120r is connected to the red subpixel SPr, and the third auxiliary electrode 120b is connected to the blue subpixel SPb. For example, the first auxiliary electrode 120g is connected to the green organic light-emitting element 140g, the second auxiliary electrode 120r is connected to the red organic light-emitting element 140r, and the third auxiliary electrode 120b is connected to the blue organic light-emitting element 140b.

[0088] On the other hand, the first auxiliary electrode 120g, the second auxiliary electrode 120r, and the third auxiliary electrode 120b can each connect the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b to the corresponding drive circuit 103 via through-holes 114 in the protective layer 110. Multiple auxiliary electrodes 120g, 120r, and 120b are used to apply power and signals to multiple subpixels SPg, SPr, and SPb, or as pads or terminals for inspection.

[0089] As mentioned above, the auxiliary electrodes 120g, 120b, and 120r can electrically connect the drive circuit 103 to the anode electrodes 141g, 141r, and 141b of the organic light-emitting elements 140g, 140r, and 140b. For example, the auxiliary electrodes 120g, 120b, and 120r are formed as a single layer of Ti, Mo, etc. to improve contact resistance characteristics. For example, the auxiliary electrodes 120g, 120b, and 120r have an oxide film such as ITO or IZO formed on a single layer of Ti, Mo, etc. for processability and reliability. For example, the auxiliary electrodes 120g, 120b, and 120r may have a double structure of ITO / (Ti or Mo). For example, the auxiliary electrodes 120g, 120b, and 120r may have a triple structure of (Ti or Mo) / ITO / (Ti or Mo).

[0090] On the other hand, in the blue subpixel SPb, the third auxiliary electrode 120b can replace the third anode electrode 141b. In such cases, the third anode electrode 141b may be omitted in the blue subpixel SPb. That is, the third auxiliary electrode 120b is required to have low connection resistance with the drain electrode of the drive transistor of the drive circuit 103, or to have excellent reflective performance, or to match the Work Function value (>4.8eV) of the third anode electrode 141b. In such cases, only the first anode electrode 141g of the green organic light-emitting element 140g and the second anode electrode 141r of the red organic light-emitting element 140r are formed. For example, after the first anode electrode 141g of the green organic light-emitting element 140g, the second anode electrode 141r of the red organic light-emitting element 140r, and the third anode electrode 141b of the blue organic light-emitting element 140b are formed, the third anode electrode 141b may be removed.

[0091] The first three-dimensional structure 130-1 is placed on the first auxiliary electrode 120g, and the second three-dimensional structure 130-2 is placed on the second auxiliary electrode 120r. A portion of the end of the first auxiliary electrode 120g is electrically connected to the first anode electrode 141g located on the green subpixel SPg on the first side surface 130-1a of the first three-dimensional structure 130-1. A portion of the end of the second auxiliary electrode 120r is electrically connected to the second anode electrode 141r located on the red subpixel SPr on the first side surface 130-2a of the second three-dimensional structure 130-2.

[0092] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may consist of an inorganic film or an organic resin. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may also consist of a double structure of an organic resin on an inorganic film. The organic resin may be a black resin, but is not limited to this. When a black resin is used as the organic resin, external or internal light is absorbed by the black resin, which can improve image quality, such as contrast characteristics and color unevenness due to light leakage.

[0093] The selection of such materials can be based on the height of the first three-dimensional structure 130-1 and / or the second three-dimensional structure 130-2, and the width of the underside of the first three-dimensional structure 130-1 and / or the second three-dimensional structure 130-2, with respect to the resolution, allowing for the selection of materials that are easy to process.

[0094] On the other hand, the organic light-emitting display device 100A according to the first embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc. The first insulating layer 150 may be made of an inorganic material, the second insulating layer 160 may be made of an organic material, and the third insulating layer 170 may be made of an inorganic material, but the invention is not limited to these materials.

[0095] The first insulating layer 150 is placed on the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. Specifically, the first insulating layer 150 is placed on the side surfaces 130-1a, 130-1b and the top surface 130T of the first three-dimensional structure 130-1, the side surfaces 130-2a, 130-2b and the top surface 130T of the second three-dimensional structure 130-2, and on the separation region 105. Since the first insulating layer 150 has a relatively thin thickness, it is formed to bend according to the respective shapes of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0096] The second insulating layer 160 is placed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The second insulating layer 160 is placed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. That is, the second insulating layer 160 can cover the first insulating layer 150 placed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. Since the second insulating layer 160 is required to be thick, it is formed from an organic material that is easy to form to a thick thickness during the manufacturing process. The second insulating layer 160 may also be a flattening layer that makes the upper surface 130T flat so as to facilitate the formation of the third insulating layer 170.

[0097] The third insulating layer 170 is placed on the second insulating layer 160.

[0098] The first insulating layer 150, the second insulating layer 160, and the third insulating layer 170 can prevent the penetration of oxygen, moisture, etc., and mitigate impact. Since the first insulating layer 150 and the third insulating layer 170 are made of inorganic material, the penetration of oxygen or moisture is completely blocked.

[0099] At least one additional layer may be added on the third insulating layer 170. For example, a planarizing layer, an anti-reflective layer, a PSA layer, a cover film, etc., may be placed on the third insulating layer 170.

[0100] The substrate 101 described above may be a silicon substrate on which multiple drive circuits 103 are formed using a semiconductor process. Alternatively, a glass substrate or a plastic substrate may be used. In addition to these, organic light-emitting display devices can be manufactured using a variety of other materials, structures, methods, and processes.

[0101] According to the embodiment, the green subpixel SPg, red subpixel SPr, and blue subpixel SPb are arranged on the sides 130-1a and 130-1b of the first three-dimensional structure 130-1, the sides 130-2a and 130-2b of the second three-dimensional structure 130-2, and the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. This maintains or expands the light-emitting area of ​​the green subpixel SPg and red subpixel SPr, while reducing their occupied area, thereby realizing a high-definition and high-resolution display.

[0102] Figure 6 is a cross-sectional view illustrating an organic light-emitting display device according to the second embodiment.

[0103] The second embodiment is identical to the first embodiment (Figure 5), except that the third insulating layer 170 is in contact with the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. In the second embodiment, the same reference numerals are used for components having the same structure, shape, and / or function as in the first embodiment, and detailed descriptions are omitted.

[0104] The organic light-emitting display device shown in Figure 6 is similar to the organic light-emitting display devices shown in Figures 2 and 3, in that the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 can be tilted with respect to the substrate 101.

[0105] Referring to Figure 6, the organic light-emitting device 100B according to the second embodiment may include a substrate 101, a plurality of drive circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting device 100B according to the second embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting device 100B according to the second embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0106] The green organic light-emitting element 140g is placed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light-emitting element 140r is placed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light-emitting element 140b is placed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light-emitting element 140g is placed in the green subpixel SPg, the red organic light-emitting element 140r is placed in the red subpixel SPr, and the blue organic light-emitting element 140b is placed in the blue subpixel SPb. The green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb constitute one pixel P.

[0107] The sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 can be inclined with respect to the substrate 101. For example, the average wall angle θa may be 60 degrees or more and less than 90 degrees.

[0108] The third insulating layer 170 can come into contact with the upper surface 130T of the first three-dimensional structure 130-1. The third insulating layer 170 can come into contact with the upper surface 130T of the second three-dimensional structure 130-2.

[0109] The second embodiment can also be described as a modified embodiment of the first embodiment (Figure 5). That is, in the first embodiment (Figure 5), a green organic light-emitting layer 142G, a red organic light-emitting layer 142R, a blue organic light-emitting layer 142B, a cathode electrode 143, a first insulating layer 150, and a second insulating layer 160 are formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. Subsequently, the second insulating layer 160, the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are removed, and the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are exposed. Thereafter, the third insulating layer 170 is formed on the upper surface 130T of the first three-dimensional structure 130-1, the upper surface 130T of the first three-dimensional structure 130-1, and on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. As a result, as in the second embodiment, the third insulating layer 170 can come into contact with the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2.

[0110] Although not shown in the diagram, a charge generation layer CGL common to the green subpixel SPg, red subpixel SPr, and blue subpixel SPb is formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. In this case, the charge generation layer CGL is removed from the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, thereby disconnecting the charge generation layer CGL of the green subpixel SPg and the charge generation layer CGL of the red subpixel SPr, and thus preventing lateral current leakage between each subpixel.

[0111] Figure 7 is a cross-sectional view illustrating an organic light-emitting device according to the third embodiment.

[0112] The third embodiment is identical to the first embodiment (Figure 5) or the second embodiment (Figure 6), except that the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101. In the third embodiment, the same reference numerals are used for components having the same structure, shape, and / or function as in the first embodiment (Figure 5) or the second embodiment (Figure 6), and detailed descriptions are omitted.

[0113] The organic light-emitting display device shown in Figure 7 may be the same as the organic light-emitting display device shown in Figure 4, where the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101.

[0114] Referring to Figure 7, the organic light-emitting device 100C according to the third embodiment may include a substrate 101, a plurality of drive circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting device 100C according to the third embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting device 100C according to the third embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0115] The green organic light-emitting element 140g is placed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light-emitting element 140r is placed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light-emitting element 140b is placed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light-emitting element 140g is placed in the green subpixel SPg, the red organic light-emitting element 140r is placed in the red subpixel SPr, and the blue organic light-emitting element 140b is placed in the blue subpixel SPb. The green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb constitute one pixel P.

[0116] The sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 may be perpendicular to the substrate 101. For example, the average wall angle θa may be 90 degrees. A green organic light-emitting element 140g is placed on the first side 130-1a of the first three-dimensional structure 130-1, and a red organic light-emitting element 140r is placed on the first side 130-2a of the second three-dimensional structure 130-2. Since the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101, when viewed from the front, the occupied area of ​​the green organic light-emitting element 140g and the occupied area of ​​the red organic light-emitting element 140r are minimized, resulting in an ultra-high-resolution display.

[0117] Since the average wall angle θa is 90 degrees, in the blue common structure, the blue organic light-emitting layer 142B is not formed on the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 or on the sides 130-2a and 130-2b of the second three-dimensional structure 130-2, or is formed at a very thin thickness. As a result, the blue organic light-emitting layer 142B, which should not affect the light emission of the green subpixel SPg and the red subpixel SPr, is not formed or is formed at a minimum thickness, thereby preventing defects due to reduced color purity and uneven coloring.

[0118] Figure 8 is a cross-sectional view illustrating an organic light-emitting device according to the fourth embodiment.

[0119] The fourth embodiment is identical to the first embodiment (Figure 5) or the second embodiment (Figure 6), except that the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101. Furthermore, the fourth embodiment is identical to the third embodiment (Figure 7), except that the third insulating layer 170 is in contact with the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. In the fourth embodiment, the same reference numerals are used for components having the same structure, shape, and / or function as in the first to third embodiments (Figures 5 to 7), and detailed descriptions are omitted.

[0120] The organic light-emitting display device shown in Figure 8 may be the same as the organic light-emitting display device shown in Figure 4, where the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101.

[0121] Referring to Figure 8, the organic light-emitting device 100D according to the fourth embodiment may include a substrate 101, a plurality of drive circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting device 100D according to the fourth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting device 100D according to the fourth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0122] The green organic light-emitting element 140g is placed on the first side surface 130-1a of the first three-dimensional structure 130-1, and the red organic light-emitting element 140r is placed on the first side surface 130-2a of the second three-dimensional structure 130-2. The blue organic light-emitting element 140b is placed on the separation region 105 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The green organic light-emitting element 140g is placed in the green subpixel SPg, the red organic light-emitting element 140r is placed in the red subpixel SPr, and the blue organic light-emitting element 140b is placed in the blue subpixel SPb. The green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb constitute one pixel P.

[0123] The third insulating layer 170 can come into contact with the upper surface 130T of the first three-dimensional structure 130-1. The third insulating layer 170 can come into contact with the upper surface 130T of the second three-dimensional structure 130-2.

[0124] The fourth embodiment can also be described as a modified embodiment of the third embodiment (Figure 7). In the third embodiment (Figure 7), a green organic light-emitting layer 142G, a red organic light-emitting layer 142R, a blue organic light-emitting layer 142B, a cathode electrode 143, a first insulating layer 150, and a second insulating layer 160 are formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. Subsequently, the second insulating layer 160, the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are removed, and the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are exposed. Thereafter, the third insulating layer 170 is formed on the upper surface 130T of the first three-dimensional structure 130-1, the upper surface 130T of the first three-dimensional structure 130-1, and on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. As a result, as in the second embodiment, the third insulating layer 170 can come into contact with the upper surface 130T of the first three-dimensional structure 130-1 and the upper surface 130T of the second three-dimensional structure 130-2.

[0125] Although not shown in the diagram, a charge generation layer CGL common to the green subpixel SPg, red subpixel SPr, and blue subpixel SPb is formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. In this case, the charge generation layer CGL is removed from the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, thereby disconnecting the charge generation layer CGL of the green subpixel SPg and the charge generation layer CGL of the red subpixel SPr, and thus preventing lateral current leakage between each subpixel.

[0126] On the other hand, the organic light-emitting display devices according to the first to fourth embodiments (Figures 5 to 8) may include a first anode separation structure 180-1 and a second anode separation structure 180-2. That is, one pixel P is provided with two anode separation structures 180-1 and 180-2.

[0127] The first anode separation structure 180-1 is provided along the periphery of the first three-dimensional structure 130-1. The first anode separation structure 180-1 can be located between the green subpixel SPg and the blue subpixel SPb. The first anode separation structure 180-1 can be located below the first three-dimensional structure 130-1 between the green subpixel SPg and the red subpixel SPr. The second anode separation structure 180-2 is provided along the periphery of the second three-dimensional structure 130-2. The second anode separation structure 180-2 can be located between the red subpixel SPr and the blue subpixel SPb. The second anode separation structure 180-2 can be located below the second three-dimensional structure 130-2 between the red subpixel SPr and the blue subpixel SPb.

[0128] For example, during the deposition process to form the anode electrode, the first anode electrode 141g of the green organic light-emitting element 140g and the third anode electrode 141b of the blue organic light-emitting element 140b are separated by the first anode separation structure 180-1. For example, during the deposition process, the second anode electrode 141r of the red organic light-emitting element 140r and the third anode electrode 141b of the blue organic light-emitting element 140b are separated by the second anode separation structure 180-2. Therefore, a separate patterning process is not required to separate the first anode electrode 141g and the third anode electrode 141b, or to separate the second anode electrode 141r and the third anode electrode 141b, preventing defects caused by the patterning process, simplifying the process, and reducing costs.

[0129] For example, a green subpixel SPg, a blue subpixel SPb, and a red subpixel SPr are arranged in that order along a first direction X, and a charge generation layer CGL is formed in common for the green subpixel SPg, blue subpixel SPb, and red subpixel SPr. In such a case, lateral current leakage (LCL) may occur between the green organic light-emitting element 140g on the green subpixel SPg, the red organic light-emitting element 140r on the red subpixel SPr, and the blue organic light-emitting element 140b on the blue subpixel SPb via the charge generation layer CGL. However, according to the embodiment, the charge generation layer CGL formed in common for the green subpixel SPg, red subpixel SPr, and blue subpixel SPb is isolated by the first anode isolation structure 180-1 and the second anode isolation structure 180-2, respectively. That is, the charge generation layer CGL located between the green subpixel SPg and the blue subpixel SPb is isolated by the first anode isolation structure 180-1. The charge generation layer CGL located between the red subpixel SPr and the blue subpixel SPb is disconnected by the second anode isolation structure 180-2. Therefore, the charge generation layer CGL, which is commonly formed in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, prevents lateral current leakage flowing between the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b.

[0130] Later, the first anode separation structure 180-1 and the second anode separation structure 180-2 will be described in detail with reference to Figures 15-18.

[0131] On the other hand, in the examples, the anode electrodes 141g, 141r, and 141b can consist of a transparent conductive film or a reflective film. The transparent conductive film can be formed using a sputtering method with a thickness of 50 nm or less using a transparent conductive material (TCO) such as ITO or IZO that can transmit light. A metal film may also be formed on the transparent conductive film using electroplating.

[0132] According to the examples, the transparent conductive film on the anode electrodes 141g, 141r, and 141b is thinly deposited to a thickness of 50 nm or less, or the anode electrodes 141g, 141r, and 141b are connected to the auxiliary electrodes 120g, 120b, and 120r and the sides 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2, thereby forming a structure without any steps from the source. Alternatively, anode separation structures 180-1 and 180-2 are provided. This prevents point defects due to short circuits between the anode electrodes 141g, 141r, and 141b and the cathode electrode 143, as well as leakage current between pixels P (or subpixels), even without the formation of banks such as PDL (Pixel Define Layer).

[0133] Figure 9a is a cross-sectional view illustrating the stacked structure of different organic light-emitting elements according to the first embodiment. Figure 9b is a cross-sectional view illustrating the stacked structure of different organic light-emitting elements according to the second embodiment.

[0134] The green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may be configured in a single stack (Figure 9a), or in a tandem structure including two stacks ST1 and ST2 (Figure 9b). Although not shown, they may also be configured in three or more stacks.

[0135] As shown in Figure 9a, the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may each consist of a stack containing one green organic light-emitting layer G-EML, one red organic light-emitting layer R-EML, and one blue organic light-emitting layer B-EML.

[0136] The green organic light-emitting element 140g may include a green organic light-emitting layer G-EML between the first anode electrode 141g and the cathode electrode. The red organic light-emitting element 140r may include a red organic light-emitting layer R-EML between the second anode electrode 141r and the cathode electrode. The blue organic light-emitting element 140b may include a blue organic light-emitting layer B-EML between the third anode electrode 141b and the cathode electrode.

[0137] The green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may each include a hole injection layer (HIL), a hole transport layer (HTL), an organic light-emitting layer (EML), an electron transport layer (ETL), an electron injection layer, etc. Furthermore, the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may each include at least one electron shielding monolayer (EBL). A capping layer (CPL) is formed on the cathode electrode of each of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. The hole injection layer (HIL), hole transport layer (HTL), electron transport layer (ETL), electron injection layer, cathode electrode, and capping layer (CPL) are common to all three elements.

[0138] The cathode electrode may be formed of a transparent conductive film, a semipermeable film, a reflective film, etc. The semipermeable film can be formed by depositing a magnesium (Mg) and silver (Ag) alloy (Mg:Ag) with a thickness of 20 nm or less. The semipermeable film may be composed of a double layer. That is, the semipermeable film may include a first layer containing the Mg:Ag alloy and a second layer containing a transparent conductive material (TCO) such as ITO or IZO on top of the first layer. If the cathode electrode consists only of a transparent film, the transparent film may be formed only of a transparent conductive film containing a transparent conductive material (TCO).

[0139] When a voltage is applied to the first anode electrode 141g and cathode electrode of the green organic light-emitting element 140g, holes and electrons move through the hole transport layer HTL and electron transport layer ETL to the green organic light-emitting layer G-EML, where the holes and electrons combine and emit light. Similarly, the red organic light-emitting element 140r and the blue organic light-emitting element 140b can also emit light through the combination of holes and electrons.

[0140] In the blue common structure, the blue organic light-emitting layer B-EML is included not only in the blue organic light-emitting element 140b but also in the green organic light-emitting element 140g and the red organic light-emitting element 140r.

[0141] As shown in Figure 9b, the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may each be composed of two stacks ST1 and ST2, each containing two organic light-emitting layers. The green organic light-emitting element 140g may be composed of two stacks ST1 and ST2, each containing two green organic light-emitting layers G-EML1 and G-EML2 between the first anode electrode 141g and the cathode electrode. The red organic light-emitting element 140r may be composed of two stacks ST1 and ST2, each containing two red organic light-emitting layers R-EML1 and R-EML2 between the second anode electrode 141r and the cathode electrode. The blue organic light-emitting element 140b may be composed of two stacks ST1 and ST2, each containing two blue organic light-emitting layers B-EML1 and B-EML2 between the third anode electrode 141b and the cathode electrode.

[0142] The green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b may each include a hole injection layer (HIL), two hole transport layers (HTL1, HTL2), two electron transport layers (ETL1, ETL2), two electron shielding monolayers (EBL1, EBL2), etc. A capping layer (CPL) is formed on the cathode electrode of each of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. The hole injection layer (HIL), hole transport layers (HTL1, HTL2), electron transport layers (ETL1, ETL2), electron shielding monolayers (EBL1, EBL2), and capping layer (CPL) are also included in common to the green organic light-emitting element 140g and the red organic light-emitting element 140r.

[0143] In particular, in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, a charge generation layer is formed between the first stack ST1 and the second stack ST2. For example, the charge generation layer may include a first charge generation layer formed adjacent to the first stack ST1, i.e., an n-type charge generation layer n-CGL, and a second charge generation layer formed between the first charge generation layer and the second stack ST2, i.e., a p-type charge generation layer p-CGL. The n-type charge generation layer n-CGL can inject electrons into the first stack ST1, and the p-type charge generation layer p-CGL can inject holes into the second stack ST2. The n-type charge generation layer n-CGL may consist of an organic layer doped with an alkali metal such as Li, Yb, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra. The p-type charge generation layer p-CGL may be constructed by doping a hole transport layer HTL2 with a dopant.

[0144] As mentioned above, the charge generation layer is made of a low-resistance material and is formed in common in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. Therefore, lateral current leakage may occur between the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb. As will be explained later, lateral current leakage between each subpixel is prevented by disconnecting the charge generation layer located between the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb.

[0145] On the other hand, in the blue common structure, two blue organic light-emitting layers B-EML1 and B-EML2 are also included in common with the green organic light-emitting element 140g and the red organic light-emitting element 140r. The first blue organic light-emitting layer B-EML1 is located below the first stack ST1, and the second blue organic light-emitting layer B-EML2 can be located between the first stack ST1 and the second stack ST2.

[0146] Figure 10a illustrates the deposition system according to the embodiment. Figure 10b illustrates the deposition of a blue organic light-emitting layer, a red organic light-emitting layer, and a green organic light-emitting layer on a substrate.

[0147] In Figure 10b, the top of the three-dimensional structure is shown as the vertex, but it can also have a top surface as shown in Figures 5 to 8. The drawing shows seven chambers CH1 to CH7, but more chambers may be provided.

[0148] As shown in Figures 5-8, 9a, 10a, and 10b, the deposition system according to the embodiment can be operated in line. That is, the substrate 101 passes through the first chamber CH1 to the seventh chamber CH7 in one direction, thereby forming the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b on the substrate 101. In other words, as the substrate 101 is transported, the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b are deposited onto the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb on the substrate 101.

[0149] The first chamber CH1 can deposit a hole injection layer (HIL) and / or a hole transport layer (HTL) onto the substrate 101. The hole injection layer (HIL) and the hole transport layer (HTL) may be deposited in separate chambers. The second chamber CH2 can deposit a blue organic light-emitting layer (B-EML) onto the substrate 101. The third chamber CH3 can deposit a red organic light-emitting layer (R-EML) onto the substrate 101. The fourth chamber CH4 can deposit a green organic light-emitting layer (G-EML) onto the substrate 101. The fifth chamber CH5 can deposit an electron transport layer (ETL) onto the substrate 101. The sixth chamber CH6 can deposit an electron injection layer (EIL) and / or a cathode electrode onto the substrate 101. The electron injection layer (EIL) and the cathode electrode may be deposited in separate chambers. The seventh chamber CH7 can deposit a capping layer (CPL) onto the substrate 101.

[0150] As shown in Figure 9b, when the green organic light-emitting element 140g, red organic light-emitting element 140r, and blue organic light-emitting element 140b are each composed of two stacks ST1 and ST2, a separate chamber, the second chamber CH2 to the fourth chamber CH4, is added between the fourth chamber CH4 and the fifth chamber CH5. In this case, the substrate 101 passes through the second chamber CH2 to the fourth chamber CH4, forming the first stack ST1 on the substrate 101, which includes the first blue organic light-emitting layer B-EML1, the first red organic light-emitting layer R-RML1, and the first green organic light-emitting layer G-EML1, respectively. Subsequently, the substrate 101 passes through the additionally added chamber, the second chamber CH2 to the fourth chamber CH4, forming the charge generation layer CGL and the second stack ST2 on the first stack. The second stack ST2 may include the second blue organic light-emitting layer B-EML1, the second red organic light-emitting layer R-RML2, and the second green organic light-emitting layer G-EML2, respectively. Therefore, each of the green organic light-emitting element 140g, red organic light-emitting element 140r, and blue organic light-emitting element 140b can have a tandem structure including a first stack ST1 and a second stack ST2. The first blue organic light-emitting layer B-EML1 and the second blue organic light-emitting layer B-EML1 are deposited in common on the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, respectively.

[0151] As shown in Figures 10a and 10b, the substrate 101 is transferred from left to right on the first evaporation source 251, the second evaporation source 252, and the third evaporation source 253. The first evaporation source 251 is provided in the second chamber CH2, the second evaporation source 252 is provided in the third chamber CH3, and the third evaporation source 253 is provided in the fourth chamber CH4. The first evaporation source 251 can discharge blue organic light-emitting material, the second evaporation source 252 can discharge red organic light-emitting material, and the third evaporation source 253 can discharge green organic light-emitting material. The first evaporation source 251 can discharge the blue organic light-emitting material perpendicularly toward the substrate 101. The second evaporation source 252 can discharge the red organic light-emitting material toward the substrate 101 in the first diagonal direction. The third evaporation source 253 can discharge the green organic light-emitting material toward the substrate 101 in the second diagonal direction. The first diagonal direction and the second diagonal direction can be symmetrical with respect to the normal direction.

[0152] On the other hand, a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 are provided on the substrate 101. As described above, a separation region 105 is defined on the substrate 101 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0153] After the substrate 101 is inverted so that the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 face the first evaporation source 251, the second evaporation source 252, and the third evaporation source 253, the substrate 101 is transferred to the first chamber CH1, the second chamber CH2, and the third chamber CH3, respectively.

[0154] When the substrate 101 passes through the first chamber CH1, the blue organic light-emitting material ejected vertically from the first evaporation source 251 is deposited over the entire surface of the substrate 101. Specifically, it is deposited on the sides 130-1a and 130-1b of the first three-dimensional structure 130-1, the sides 130-2a and 130-2b of the second three-dimensional structure 130-2, and the separation region 105. The blue organic light-emitting material deposited on the separation region 105 forms a blue organic light-emitting layer B-EML.

[0155] When the substrate 101 passes through the second chamber CH2, the red organic light-emitting material ejected from the second evaporation source 252 in the first diagonal direction is deposited on the exposed region of the substrate 101. That is, the red organic light-emitting material is deposited only on the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. The red organic light-emitting layer R-EML is formed by the red organic light-emitting material deposited on the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. Since the red organic light-emitting material traveling in the first diagonal direction is blocked by the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the red organic light-emitting material is not deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 and the separated region 105.

[0156] When the substrate 101 passes through the third chamber CH3, the green organic light-emitting material ejected from the third evaporation source 253 in the second diagonal direction is deposited on the exposed region of the substrate 101. That is, the green organic light-emitting material is deposited only on the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. The green organic light-emitting layer G-EML is formed by the green organic light-emitting material deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. Since the green organic light-emitting material advancing in the second diagonal direction is blocked by the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the green organic light-emitting material is not deposited on the first side surface 130-2a of the second three-dimensional structure 130-2 and on the separated region 105.

[0157] Therefore, as the substrate 101 passes through the second chamber CH2 and the third chamber CH3, the blue organic light-emitting material is deposited over the entire area of ​​the substrate 101, including the separation region 105; the red organic light-emitting material is deposited only on the first side surface 130-2a of the second three-dimensional structure 130-2; and the green organic light-emitting material is deposited only on the first side surface 130-1a of the first three-dimensional structure 130-1.

[0158] According to the examples, an in-line deposition system can form a blue organic light-emitting layer (EML), a red organic light-emitting layer (R-EML), and a green organic light-emitting layer (G-EML) without using a separate deposition pattern mask such as an FMM. Therefore, since a separate deposition pattern mask such as an FMM is not used, high-definition (e.g., 500 PPI or higher) displays and large-area (e.g., 8th generation or higher) displays can be realized. Since a separate deposition pattern mask such as an FMM is not used, manufacturing costs are significantly reduced. Since a separate deposition pattern mask such as an FMM is not used, yield is improved and product life is extended through deposition optimization.

[0159] On the other hand, as illustrated in Figures 5 to 8 and Figure 10b, the size of the average wall angle θa between the substrate 101 and the three-dimensional structures 130-1 and 130-2 is determined by the selection of materials for the three-dimensional structures 130-1 and 130-2, and the equipment and process conditions used to form the three-dimensional structures 130-1 and 130-2. In order to ensure uniform image quality and prevent color unevenness within the screen, the manufacturing method and process conditions for uniformly forming the shapes of the three-dimensional structures 130-1 and 130-2, as well as the sides 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2, must be optimized.

[0160] The angles of the sides 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structures 130-1 and 130-2, and the angles of the anode electrodes 141g, 141r, and 141b with respect to the substrate 101, affect the formation of organic light-emitting elements 142G, 142R, and 142B, and thus affect the final image quality. Therefore, the selection of these angles is a key success factor (KSF) in the process and product design stages.

[0161] On the other hand, as shown in Figure 10b, the deposition angle θe of the green organic light-emitting material discharged from the third evaporation source 253 can be expressed by Equation 1. The structure of the third evaporation source 253 changes depending on the design of the deposition angle θe.

[0162] (Equation 1)

number

[0163] The deposition angle θe may be an angle for depositing the green organic light-emitting material only in a specific region of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 on the substrate 101, utilizing the shadow effect of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2.

[0164] TS represents the distance between the substrate 101 and the third evaporation source 253, and Offset can represent the shortest distance over which the green organic light-emitting material ejected from the third evaporation source 253 is deposited onto the substrate 101.

[0165] Equation 1 can also be applied to the deposition angle of the red organic light-emitting material ejected from the second evaporation source 252.

[0166] On the other hand, as shown in Figure 10c, the deposition angle θe for containing the green organic light-emitting material ejected from the third evaporation source 253 in a specific region of the first three-dimensional structure 130-1 or the second three-dimensional structure 130-2 on the substrate 101 can be expressed by equation 2. The structure of the pixels P on the substrate 101 changes depending on the design of the deposition angle θe.

[0167] (Equation 2)

number

[0168] W1 represents the width of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, W2 represents the width of the separation area 105, and H can represent the height of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0169] From Equation 2, the greater the height H of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, the greater the maximum deposition angle θe can be. From Equation 2, the smaller the width W1 of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 and the width W2 of the separation region 105, the greater the maximum deposition angle θe can be.

[0170] Equation 2 can also be applied to the deposition angle of the red organic light-emitting material discharged from the second evaporation source 252.

[0171] On the other hand, as shown in Figure 10b, the blue organic light-emitting material ejected from the first evaporation source 251 is deposited over the entire area of ​​the substrate 101, forming a blue organic light-emitting layer B-EML.

[0172] The thickness of the blue organic light-emitting layer (B-EML) may differ in the blue subpixel (SPb), green subpixel (SPg), and red subpixel (SPr). That is, the thickness of the blue organic light-emitting layer (B-EML) may differ in the blue subpixel (SPb), green subpixel (SPg), and red subpixel (SPr) depending on the mean wall angle (θa).

[0173] Theoretically, if the average wall angle θa is 90 degrees, that is, if the green subpixel SPg and red subpixel SPr are perpendicular to the substrate 101, then the blue organic light-emitting layer B-EML may not be formed on the green subpixel SPg and red subpixel SPr. Also, if the blue organic light-emitting material ejected from the first evaporation source 251 travels in a straight line at the same angle, then the blue organic light-emitting layer B-EML may not be formed on the green subpixel SPg and red subpixel SPr that are perpendicular to the substrate 101.

[0174] However, since the blue organic light-emitting material ejected from the first evaporation source 251 travels in a straight line at different angles, a blue organic light-emitting layer B-EML is formed on the green subpixel SPg and red subpixel SPr even if they are perpendicular to the substrate 101. The thickness of the blue organic light-emitting layer B-EML can be expressed by equation 3.

[0175] (Equation 3) T WS =T BS cos(θa-θb)

[0176] T WSThis can represent the thickness of the blue organic emissive layer (B-EML) formed on the green subpixel SPg or red subpixel SPr. BS θa can represent the thickness of the blue organic emissive layer B-EML formed on the blue subpixel SPb. θa represents the average wall value, and θb can represent the correction angle considering the structure of the first evaporation source 251, particularly its evaporation characteristics.

[0177] The smaller the correction angle θb, the greater the thickness T of the blue organic emissive layer (B-EML) formed on the green subpixel SPg or red subpixel SPr. WS It can be made smaller. For example, when the correction angle θb is 0, the thickness T of the blue organic emissive layer B-EML formed on the green subpixel SPg or red subpixel SPr. WS This can be 0. In other words, this can mean that a blue organic emissive layer (B-EML) is not formed on the green subpixel SPg or the red subpixel SPr.

[0178] For example, if the green subpixel SPg and / or red subpixel SPr are perpendicular to the substrate 101 and the correction angle θb is approximately 10 degrees, the thickness of the blue organic light-emitting layer B-EML formed on the green subpixel SPg and / or red subpixel SPr may be 17.4% of the thickness of the blue organic light-emitting layer B-EML formed on the blue subpixel SPb. In such a case, if the thickness of the blue organic light-emitting layer B-EML formed on the blue subpixel SPb is 20 nm, the thickness of the blue organic light-emitting layer B-EML formed on the green subpixel SPg and / or red subpixel SPr can be considered 3.5 nm and ignored. That is, even if a 3.5 nm blue organic light-emitting layer B-EML is formed on the green subpixel SPg and / or red subpixel SPr, it will not affect the brightness of the green light emitted from the green subpixel SPg or the red light emitted from the red subpixel SPr.

[0179] According to the example, since the blue organic light-emitting layer (EML) is deposited over the entire area of ​​the substrate 101, there is no need to use a deposition pattern mask such as FMM to deposit the layer only in a specific area.

[0180] Furthermore, as mentioned above, by using the SAD method and the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, a deposition pattern mask like that used in FMM is not used, and only the green organic light-emitting layer G-EML is formed on the green subpixel SPg, and only the red organic light-emitting layer R-EML is formed on the red subpixel SPr.

[0181] Figure 11 is a flowchart illustrating a method for manufacturing an organic light-emitting display device according to the first embodiment. Figures 12a to 12n are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to the first embodiment. Using Figures 11 to 12n, a method for manufacturing an image display device (Figures 7 and 8) equipped with a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 having average wall angles θa1 and θa2 of 90 degrees will be described. However, the manufacturing method illustrated in Figures 11 and 12n can also be similarly applied to an image display device (Figures 5 and 6) equipped with a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 having average wall angles θa1 and θa2 of less than 90 degrees.

[0182] As shown in Figure 12a, multiple drive circuits 103 are formed on the substrate 101 (A1 stage).

[0183] Multiple drive circuits 103 are arranged spaced apart from each other. The drive circuits 103 may be formed separately for each subpixel, but are not limited to this. The drive circuit 103 may include multiple transistors formed using semiconductor processes and at least one capacitor. The transistors may be made of silicon-based or oxide-based semiconductor materials.

[0184] As shown in Figure 12b, after a protective layer 110 is formed on multiple drive circuits 103, through-holes 114 are formed in the protective layer 110 (stage A2).

[0185] The protective layer 110 can consist of a single or multiple film made of an inorganic material. The protective layer 110 may include a polymer resin layer. The through-hole 114 is formed through the protective layer 110 so that the drain electrode of the drive transistor of the drive circuit 103 is exposed.

[0186] For example, when a polymer resin layer is formed on multiple drive circuits 103, a first through-hole is formed in the polymer resin layer. Subsequently, after an inorganic film is formed on the polymer resin layer, a second through-hole having a larger diameter than the first through-hole is formed in the inorganic film. The second through-hole can communicate with the first through-hole. The first and second through-holes constitute a through-hole 114. In such a case, the protective layer 110 can consist of a polymer resin layer and an inorganic film.

[0187] As shown in Figure 12c, multiple auxiliary electrodes 120g, 120r, and 120b are formed on the protective layer 110 (stage A3).

[0188] Multiple auxiliary electrodes 120g, 120r, and 120b are formed by depositing and patterning them using a sputtering process. The multiple auxiliary electrodes 120g, 120r, and 120b are formed separately for each subpixel. The width of the third auxiliary electrode 120b may be larger than the width of the first auxiliary electrode 120g or the second auxiliary electrode 120r, but is not limited to this. The multiple auxiliary electrodes 120g, 120r, and 120b are arranged spaced apart from each other. Each of the multiple auxiliary electrodes 120g, 120r, and 120b can overlap perpendicularly with each of the multiple drive circuits 103. Each of the multiple auxiliary electrodes 120g, 120r, and 120b is electrically connected to the drain electrode of each drive transistor of the multiple drive circuits 103 via through-holes 114 in the protective layer 110.

[0189] As shown in Figure 12d, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are formed on the first auxiliary electrode 120g and the second auxiliary electrode 120r (stage A4).

[0190] For example, a first three-dimensional structure 130-1 is formed on the first auxiliary electrode 120g, and a second three-dimensional structure 130-2 is formed on the second auxiliary electrode 120r. No three-dimensional structure is formed on the third auxiliary electrode 120b. The third auxiliary electrode 120b can be defined as a separation region 105.

[0191] For example, a green subpixel SPg is defined on the first side surface 130-1a of the first three-dimensional structure 130-1, a red subpixel SPr is defined on the first side surface 130-2a of the second three-dimensional structure 130-2, and a blue subpixel SPb is defined in the separation region 105. As will be explained later, a green organic light-emitting element (140g in Figure 12k) is placed in the green subpixel SPg, a red organic light-emitting element 140r is placed in the red subpixel SPr, and a blue organic light-emitting element 140b is placed in the blue subpixel SPb.

[0192] The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be made of acrylic or polyimide resin. The first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 may be made of inorganic material for high-resolution products. If the resolution of the product is 300 ppi or less, an organic material is applied to the substrate using printing technology, precisely aligned and transferred onto the substrate, and patterned through ultraviolet or heat curing steps. This forms the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0193] As shown in Figure 12e, the three-dimensional structures 130-1 and 130-2 are used as masks to pattern multiple auxiliary electrodes 120g, 120r, and 120b (stage A5).

[0194] Depending on the type and structure of the auxiliary electrodes 120g, 120b, and 120r, or the design values ​​of the anode separation structure (180-1 and 180-2 in Figure 12f), patterning is performed using wet etching, dry etching, or a mixture thereof. An ashing step may also be added after patterning.

[0195] When auxiliary electrodes 120g, 120b, and 120r consist of multiple metal films and these multiple metal films are patterned, the ends of the multiple metal films can be positioned differently depending on the material and etching characteristics of each film. That is, the ends of some of the multiple metal films may protrude outward more than the ends of the other metal films. This will be explained in detail with reference to Figures 17a and 17b.

[0196] As shown in Figure 12f, multiple anode separation structures 180-1 and 180-2 are formed (stage A6).

[0197] For example, the first anode separation structure 180-1 is formed around the first three-dimensional structure 130-1, and the second anode separation structure 180-2 is formed around the second three-dimensional structure 130-2.

[0198] The term "anode isolation structure" can refer to any of the multiple isolation structures configured to self-align and electrically isolate the anode electrode and charge generation layer CGL by utilizing the undercut structure formed in the protective layer 110, but is not limited to this definition.

[0199] Therefore, since the anode electrode is formed separately for each subpixel SPg, SPr, and SPb without a separate patterning process, the manufacturing process is simplified and manufacturing costs are reduced. In addition, patterning defects of the anode electrode in high-definition and high-resolution images are prevented at the source. Furthermore, since the charge generation layer CGL, which is formed in common for multiple subpixels SPg, SPr, and SPb, is separated for each subpixel SPg, SPr, and SPb, lateral current leakage between each subpixel is prevented.

[0200] The method for forming the anode separation structure will be explained in detail later with reference to Figures 16-17g.

[0201] As shown in Figure 12g, anode electrodes 141g, 141r, and 141b are formed on a substrate 101 equipped with a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2. In this case, the anode electrodes 141g, 141r, and 141b are separated by multiple anode separation structures 180-1 and 180-2 for each subpixel SPg, SPr, and SPb (stage A7). That is, the anode electrodes 141g, 141r, and 141b are formed only on the corresponding subpixels SPg, SPr, and SPb, and not between the subpixels SPg, SPr, and SPb.

[0202] The anode electrodes 141g, 141r, and 141b may, but are not limited to, transparent conductive films. The anode electrodes 141g, 141r, and 141b may include single metal films such as Ni and Au, or multiple metal films such as Ni / Au. The third auxiliary electrode 120b on the blue subpixel SPb may consist of multiple films, such as ITO / Ag alloy / Ti, to ensure reflectivity.

[0203] On the other hand, a photoresist pattern may be formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 before the film deposition process, such that the anode electrodes 141g, 141r, and 141b are not formed on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively, but this is not the only option.

[0204] As shown in Figures 12h, 12i, and 12j, a blue organic light-emitting layer 142B, a red organic light-emitting layer 142R, and a green organic light-emitting layer 142G are sequentially deposited on the substrate 101 (A8 stage).

[0205] Specifically, as shown in Figure 12h, the blue organic light-emitting layer 142B is deposited over the entire surface of the substrate 101 using the first evaporation source (251 in Figure 10b) of the second chamber (CH2 in Figure 10a). That is, the blue organic light-emitting layer 142B is formed on the green subpixel SPg, red subpixel SPr, and blue subpixel SPb. The blue organic light-emitting layer 142B is formed on the anode electrodes 141g, 141r, and 141b using the green subpixel SPg, red subpixel SPr, and blue subpixel SPb. In addition, before the formation of the blue organic light-emitting layer 142B, the hole injection layer HIL and hole transport layer HTL are formed on the anode electrodes 141g, 141r, and 141b using the respective evaporation sources of the first chamber CH1.

[0206] Even if the hole injection layer HIL, hole transport layer HTL, and blue organic light-emitting layer 142B are deposited over the entire area of ​​the substrate 101, the hole injection layer HIL, hole transport layer HTL, and blue organic light-emitting layer 142B are separated by the first anode separation structure 180-1 and the second anode separation structure 180-2, which disconnect the green subpixel SPg, red subpixel SPr, and blue subpixel SPb.

[0207] To prevent defects such as color purity and color unevenness, controlling the thickness of the blue organic light-emitting layer 142B on the green subpixel SPg and red subpixel SPr is extremely important. The green subpixel SPg can emit green light, the red subpixel SPr can emit red light, and the blue subpixel SPb can emit blue light. In such cases, the blue organic light-emitting layer 142B on the green subpixel SPg and red subpixel SPr interferes with the emission of green and red light, so it is preferable to remove it.

[0208] However, as shown in Equation 3, even if the sides 130-1a and 130-1b of the first three-dimensional structure 130-1 and the sides 130-2a and 130-2b of the second three-dimensional structure 130-2 are perpendicular to the substrate 101, the blue organic light-emitting material ejected from the first evaporation source 251 travels in a straight line at different angles, making it easy for the blue organic light-emitting layer 142B to form on the green subpixel SPg and red subpixel SPr. In this embodiment, the thickness of the blue organic light-emitting layer 142B formed on the green subpixel SPg and red subpixel SPr can be reduced by minimizing the correction angle θb, which takes into account the structure of the first evaporation source 251, particularly its evaporation characteristics. Even if the blue organic light-emitting layer 142B is formed on the green subpixel SPg and red subpixel SPr, the thickness of the blue organic light-emitting layer 142B is controlled so as not to affect the brightness of the color light emitted from the green subpixel SPg and red subpixel SPr.

[0209] To achieve this, the average wall angle θa is optimized within the range of 60 to 90 degrees, so that the thickness of the blue organic light-emitting layer 142B on the green subpixel SPg and red subpixel SPr is controlled to be 5% to 60% of the thickness of the blue organic light-emitting layer 142B formed on the blue subpixel SPb.

[0210] As shown in Figure 12i, a red organic light-emitting layer 142R is deposited on the substrate 101. The red organic light-emitting layer 142R is deposited on the first side surface 130-2a of the second three-dimensional structure 130-2 using the second evaporation source (252 in Figure 10b) of the third chamber (CH3 in Figure 10a). The red organic light-emitting layer 142R is deposited on the blue organic light-emitting layer 142B on the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2. At this time, due to the shadow effect in which the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 act as shielding films, the red organic light-emitting material is not formed on the first side surface 130-1a of the first three-dimensional structure 130-1, the second side surface 130-2b of the second three-dimensional structure 130-2, and the separation region 105.

[0211] Therefore, without using a deposition pattern mask like FMM, the red organic light-emitting layer 142R is selectively deposited on specific regions, namely the second side surface 130-1b of the first three-dimensional structure 130-1 and the first side surface 130-2a of the second three-dimensional structure 130-2, using the SAD method.

[0212] As shown in Figure 12j, a green organic light-emitting layer 142G is deposited on the substrate 101. The green organic light-emitting layer 142G is deposited on the first side surface 130-1a of the first three-dimensional structure 130-1 using the third evaporation source (253 in Figure 10b) of the fourth chamber (CH4 in Figure 10a). The green organic light-emitting layer 142G is deposited on the blue organic light-emitting layer 142B on the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2. At this time, the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 act as shielding films, creating a shadow effect, so the green organic light-emitting layer is not formed on the second side surface 130-1b of the first three-dimensional structure 130-1, the first side surface 130-2a of the second three-dimensional structure 130-2, and the separation region 105.

[0213] Therefore, without using a deposition pattern mask like FMM, the green organic light-emitting layer 142G is selectively deposited on specific regions, namely the first side surface 130-1a of the first three-dimensional structure 130-1 and the second side surface 130-2b of the second three-dimensional structure 130-2, using the SAD method.

[0214] Subsequently, the electron transport layer (ETL) and electron injection layer (EIL) are formed using the evaporation sources in the fifth chamber (CH5) and the sixth chamber (CH6).

[0215] As shown in Figure 12k, a cathode electrode 143 is formed on the organic light-emitting layer 142 (A9 step). The cathode electrode 143 is formed by sputtering transparent conductive films such as ITO and IZO using a sputtering process. The cathode electrode 143 is formed by depositing metal films such as magnesium (Mg) and silver (Ag) using a vacuum deposition method.

[0216] The cathode electrode 143 is connected in common to multiple subpixels SPg, SPr, and SPb. The cathode electrode 143 must not be interrupted by the anode separation structures 180-1 and 180-2. In the case of vacuum deposition, the step coverage for the cathode electrode 143 is not good, so the deposition angle of the evaporation source needs to be optimized so that the cathode electrode 143 is not interrupted by the anode separation structures 180-1 and 180-2. In addition, the interruption of the cathode electrode 143 is prevented by ensuring that the undercut structure included in the anode separation structures 180-1 and 180-2 does not exceed a predetermined height.

[0217] Meanwhile, a green organic light-emitting element 140g, a red organic light-emitting element 140r, and a blue organic light-emitting element 140b are formed on the green subpixel SPg, red subpixel SPr, and blue subpixel SPb, respectively, by the deposition process shown in Figures 12g to 12k. The green organic light-emitting element 140g includes a green organic light-emitting layer 142G, the red organic light-emitting element 140r includes a red organic light-emitting layer 142R, and the blue organic light-emitting element 140b may include a blue organic light-emitting layer 142B. The first anode electrode 141g, the second anode electrode 141r, and the third anode electrode 141b are independently included in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, respectively, while the cathode electrode 143 is commonly included in the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b.

[0218] As shown in Figure 12l, the first insulating layer 150 is formed on the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b (step A10).

[0219] The first insulating layer 150 is formed on the cathode electrodes 143 of the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. The first insulating layer 150 prevents oxygen or moisture from penetrating the blue organic light-emitting layer 142B, the green organic light-emitting layer 142G, and the blue organic light-emitting layer 142B.

[0220] The first insulating layer 150 can consist of an inorganic film. For example, the inorganic film can be a silicon oxide film or a silicon nitride film deposited by the PECVD method. The first insulating layer 150 can also include a film deposited by the ALD (Atomic Layer Deposition) method (e.g., a SiNx film, a SiOx film, or an Al2O3 film). The first insulating layer 150 can also include a double layer consisting of a film deposited by the ALD method and a film deposited by the PECVD method. The first insulating layer 150 can also include a double layer consisting of a film deposited by the ALD method and a film deposited by the PECVD method.

[0221] As shown in Figure 12m, the second insulating layer 160 is formed on the first insulating layer 150 (step A11).

[0222] The second insulating layer 160 is formed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The second insulating layer 160 may be made of an organic material that can easily be made thick, but is not limited thereto. The second insulating layer 160 may also be formed by an inkjet method, but is not limited thereto.

[0223] As shown in Figure 12n, the third insulating layer 170 is formed on the second insulating layer 160 (step A12).

[0224] The third insulating layer 170 may consist of an inorganic film. The third insulating layer 170 may be formed from the same material as the first insulating layer 150, but is not limited to this.

[0225] The organic light-emitting display device (third embodiment) shown in Figure 7 is manufactured by the manufacturing method shown in Figures 12a to 12n.

[0226] Figure 13 is a flowchart showing the method for manufacturing an organic light-emitting display device according to the second embodiment. Figures 14a to 14d are cross-sectional views showing the method for manufacturing an organic light-emitting display device according to the second embodiment.

[0227] A method for manufacturing an image display device (Figures 7 and 8) equipped with a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 having average wall angles θa1 and θa2 of 90 degrees will be explained using Figures 13 to 14d. However, the manufacturing method illustrated in Figures 13 to 14d can also be similarly applied to an image display device (Figures 5 and 6) equipped with a first three-dimensional structure 130-1 and a second three-dimensional structure 130-2 having average wall angles θa1 and θa2 of less than 90 degrees.

[0228] Since stages A1 to A10 in Figure 13 are identical to stages A1 to A10 shown in Figures 11 to 12, a detailed explanation is omitted.

[0229] As shown in Figure 14a, the first insulating layer 150 is formed on the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b (step A10).

[0230] As shown in Figure 14b, the second insulating layer 160 is formed on the first insulating layer 150 (step A11).

[0231] The second insulating layer 160 is formed on the first insulating layer 150 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0232] Unlike Figure 12m, the upper surface of the second insulating layer 160 shown in Figure 14b can be positioned lower than at least the upper surface 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. The upper surface of the second insulating layer 160 can be positioned higher than the upper end of the first anode electrode 141g on the first side surface 130-1a of the first three-dimensional structure 130-1. The upper surface of the second insulating layer 160 can be positioned higher than the upper end of the second anode electrode 141r on the first side surface 130-2a of the second three-dimensional structure 130-2.

[0233] For this reason, in the case of an inkjet process, the number of dots and the amount of shrinkage after vacuum drying are taken into consideration. In addition, a material is selected that takes into account the surface energy between the first insulating layer 150 and the second insulating layer 160.

[0234] As shown in Figure 14c, the first insulating layer 150, cathode electrode 143, green organic light-emitting layer 142G, red organic light-emitting layer 142R, and blue organic light-emitting layer 142B are removed from the upper surface 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively (A111 step).

[0235] In the dry etching process, the amount of ashing and the selection of gases appropriate for each material are important, and no damage to the first to blue organic light-emitting elements 140b should occur during the dry etching process.

[0236] When removing the first insulating layer 150, the cathode electrode 143, etc., the second insulating layer 160 is used as a stopper. That is, the first insulating layer 150, the cathode electrode 143, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B are each removed up to the top surface of the second insulating layer.

[0237] By removing the first insulating layer 150, cathode electrode 143, green organic light-emitting layer 142G, red organic light-emitting layer 142R, and blue organic light-emitting layer 142B, which are higher than the upper surface of the second insulating layer, the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be exposed. This prevents lateral current leakage between the green subpixel SPg on the first side surface 130-1a and the red subpixel SPr on the second side surface 130-1b of the first three-dimensional structure 130-1. It also prevents lateral current leakage between the red subpixel SPr on the first side surface 130-2a and the green subpixel SPg on the second side surface 130-2b of the second three-dimensional structure 130-2. In particular, in a two-stack tandem structure, the removal of the charge generation layer on the upper surface 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 prevents lateral current leakage between the green subpixel SPg and the red subpixel SPr via the charge generation layer.

[0238] At least one of the removed and remaining first insulating layer 150, cathode electrode 143, green organic light-emitting layer 142G, red organic light-emitting layer 142R, and blue organic light-emitting layer 142B can be positioned lower than the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively. Such a structure completely isolates the organic light-emitting layers 142G, 142R, and 142B on adjacent subpixels SPg and SPr, thereby more reliably preventing lateral current leakage.

[0239] As shown in Figure 14d, the third insulating layer 170 is formed on the substrate 101 (step A12).

[0240] A third insulating layer is formed on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. A third insulating layer 170 is formed on the upper surfaces 130T of the exposed first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively.

[0241] Not only is the organic light-emitting layer (EML) between adjacent subpixels SPg and SPr completely isolated on the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, but the third insulating layer 170 is also in contact with the upper surfaces 130T of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, thus completely preventing lateral current leakage.

[0242] The organic light-emitting display device (fourth embodiment) shown in Figure 8 is manufactured by the manufacturing method shown in Figures 14a to 14d.

[0243] On the other hand, as shown in Figure 14c, lateral current leakage can be prevented even without removing all the layers on the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, such as the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B.

[0244] Specifically, as shown in Figure 12m, the second insulating layer 160 is formed on the first insulating layer 150. Thereafter, the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B are locally removed from the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, respectively, and the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 are exposed. As a result, the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B can be separated from each other on the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. This eliminates the pathways through which leakage current flows between the green subpixel SPg and the red subpixel SPr on the upper surfaces of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, thereby preventing lateral current leakage.

[0245] According to the embodiment, the separation structures on the anode separation structures 180-1 and 180-2 and the three-dimensional structures 130-1 and 130-2 block the leakage current paths between all subpixels SPg, SPr, and SPb, thus completely preventing lateral current leakage.

[0246] Thereafter, a third insulating layer 170 is formed on the second insulating layer 160. In this case, the third insulating layer 170 can contact the etched cross-sections of the second insulating layer 160, the first insulating layer 150, the green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B, and can contact the upper surface of the first three-dimensional structure 130-1 and the upper surface of the second three-dimensional structure 130-2. The green organic light-emitting layer 142G, the red organic light-emitting layer 142R, and the blue organic light-emitting layer 142B can each have a structure in which they are separated by the third insulating layer 170.

[0247] Figure 15 is a detailed cross-sectional view of region X in Figure 7. The first anode separation structure 180-1 and the second anode separation structure 180-2 will be described in detail with reference to Figure 15.

[0248] As shown in Figure 15, a green subpixel SPg is defined on the first side surface 130-1a of the first three-dimensional structure 130-1, a red subpixel SPr is defined on the first side surface 130-2a of the second three-dimensional structure 130-2, and a blue subpixel SPb is defined on the separation region 105. The green subpixel SPg may include a green organic light-emitting element 140g, the red subpixel SPr may include a red organic light-emitting element 140r, and the blue subpixel SPb may include a blue organic light-emitting element 140b. A single pixel P is formed by the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb.

[0249] The first anode separation structure 180-1 is positioned along the periphery of the first three-dimensional structure 130-1. The first anode separation structure 180-1 is positioned below the first three-dimensional structure 130-1 between the green subpixel SPg and the blue subpixel SPb. The first anode separation structure 180-1 is positioned below the first three-dimensional structure 130-1 between the green organic light-emitting element 140g and the blue organic light-emitting element 140b.

[0250] The first anode separation structure 180-1 may include a first undercut structure 1810 and a first discontinuation structure 1820.

[0251] The first undercut structure 1810 is formed such that the end of at least one insulating film 112 among the plurality of insulating films 111 to 113 constituting the protective layer 110 is located inward from the first side surface 130-1a of the first three-dimensional structure 130-1.

[0252] The first discontinuation structure 1820 can isolate the green subpixel SPg and the blue subpixel SPb by the first undercut structure 1810. The first discontinuation structure 1820 may include a 1-1 discontinuation structure 1821, a 1-2 discontinuation structure 1822, a 1-3 discontinuation structure 1823, and so on.

[0253] The first-1 discontinuation structure 1821 can isolate the first anode electrode 141g of the green organic light-emitting element 140g and the third anode electrode 141b of the blue organic light-emitting element 140b between the green subpixel SPg and the blue subpixel SPb. During the anode electrode formation process, at least one metal film is formed on the substrate 101. In this case, at least one metal film is isolated between the green subpixel SPg and the blue subpixel SPb by the first undercut structure 1810. As a result, the first anode electrode 141g is formed on the green subpixel SPg and the third anode electrode 141b is formed on the blue subpixel SPb.

[0254] On the other hand, as shown in Figures 9a and 9b, a common layer is formed in common for the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b. For example, in Figure 9a, the common layer may include a hole injection layer HIL, a hole transport layer HTL, an electron shielding monolayer EBL, a blue organic light-emitting layer 142B, a charge generation layer CGL, an electron transport layer ETL, a cathode electrode 143, etc. For example, in Figure 9b, the common layer may include a hole injection layer HIL, hole transport layers HTL1 and HTL2, an electron shielding monolayer EBL1 and EBL2, a blue organic light-emitting layer 142B, a charge generation layer CGL, an electron transport layer ETL1 and ETL2, a cathode electrode 143, etc.

[0255] The blue organic light-emitting layer 142B and the charge generation layer CGL cause lateral current leakage, so they must be isolated from the green subpixel SPg, red subpixel SPr, and blue subpixel SPb. In contrast, the cathode electrode 143 is electrically connected in common to the green organic light-emitting element 140g, the red organic light-emitting element 140r, and the blue organic light-emitting element 140b, so it must not be isolated from the green subpixel SPg, red subpixel SPr, and blue subpixel SPb.

[0256] According to the example, the blue organic light-emitting layer 142B, the charge generation layer CGL, etc., are isolated between the green subpixel SPg and the blue subpixel SPb by the first undercut structure 1810.

[0257] The first to second isolation structure 1822 can isolate the blue organic light-emitting layer 142B between the green sub-pixel SPg and the blue sub-pixel SPb by the first undercut structure 1810 and / or the separation interval between the first anode electrode 141g and the third anode electrode 141b. The first to third isolation structure 1823 can isolate the charge generation layer CGL between the green sub-pixel SPg and the blue sub-pixel SPb by the first undercut structure 1810, the separation interval between the first anode electrode 141g and the third anode electrode 141b, and / or the isolated blue organic light-emitting layer 142B.

[0258] Therefore, by isolating the blue organic light-emitting layer 142B and the charge generation layer CGL between the green sub-pixel SPg and the blue sub-pixel SPb by the first undercut structure 1810 or the like, the lateral current leakage between the sub-pixels is prevented.

[0259] The anode separation structure 180-2 is arranged along the periphery of the second three-dimensional structure 130-2. The second anode separation structure 180-2 is arranged below the second three-dimensional structure 130-2 between the red sub-pixel SPr and the blue sub-pixel SPb. The second anode separation structure 180-2 is arranged below the second three-dimensional structure 130-2 between the red organic light-emitting element 140r and the blue organic light-emitting element 140b.

[0260] The anode separation structure 180-2 can include a second undercut structure 1830 and a second isolation structure 1840.

[0261] The second undercut structure 1830 is formed such that the end of at least one of the insulating films 111 to 113 constituting the protective layer 110, i.e., the insulating film 112, is located inside from the first side surface 130-2a of the second three-dimensional structure 130-2.

[0262] The second discontinuation structure 1840 can isolate the red subpixel SPr and the blue subpixel SPb by the second undercut structure 1830. The second discontinuation structure 1840 may include a second-first discontinuation structure 1841, a second-second discontinuation structure 1842, a second-third discontinuation structure 1843, and so on.

[0263] The second-1 discontinuation structure 1841 can isolate the second anode electrode 141r of the red organic light-emitting element 140r and the third anode electrode 141b of the blue organic light-emitting element 140b between the red subpixel SPr and the blue subpixel SPb. During the anode electrode formation process, at least one metal film is formed on the substrate 101. In this case, at least one metal film is isolated between the red subpixel SPr and the blue subpixel SPb by the second undercut structure 1830. As a result, the second anode electrode 141r is formed on the green subpixel SPg and the third anode electrode 141b is formed on the blue subpixel SPb.

[0264] According to the example, the common layer, the blue organic light-emitting layer 142B, the charge generation layer CGL, etc., are disconnected between the red subpixel SPr and the blue subpixel SPb by the second undercut structure 1830.

[0265] The second-second discontinuation structure 1842 can interrupt the blue organic light-emitting layer 142B between the red subpixel SPr and the blue subpixel SPb by the second undercut structure 1830 and / or the separation distance between the second anode electrode 141r and the third anode electrode 141b. The second-third discontinuation structure 1843 can interrupt the charge generation layer CGL between the red subpixel SPr and the blue subpixel SPb by the second undercut structure 1830, the separation distance between the second anode electrode 141r and the third anode electrode 141b and / or the interrupted blue organic light-emitting layer 142B.

[0266] Therefore, the second undercut structure 1830, etc., disconnects the blue organic light-emitting layer 142B and the charge generation layer CGL between the red subpixel SPr and the blue subpixel SPb, thereby preventing lateral current leakage between each subpixel.

[0267] On the other hand, the first anode separation structure 180-1 may include only the first undercut structure 1810, and the second anode separation structure 180-2 may include only the second undercut structure 1830. That is, the first discontinuation structure 1820 may not be included in the first anode separation structure 180-1, and the second discontinuation structure 1840 may not be included in the second anode separation structure 180-2.

[0268] Although not shown, a third auxiliary electrode 120b is positioned below the third anode electrode 141b. The third anode electrode 141b can also be removed, and the third auxiliary electrode 120b can be in contact with the hole injection layer HIL in Figures 9a and 9b. In this case, the third auxiliary electrode 120b can perform the role of the third anode electrode 141b.

[0269] On the other hand, the first auxiliary electrode 120g, the second auxiliary electrode 120r, and the third auxiliary electrode 120b may each contain a plurality of metal films 121a, 121b, 122a, 122b, 123a, and 123b.

[0270] For example, the first metal films 121a and 121b can be made of a metal material that has excellent electrical contact characteristics with the drive circuit 103 and is easy to dry etch, such as Ti or Mo. For example, the second metal films 122a and 122b can be made of a metal material that has excellent reflective properties and is easy to wet etch, such as Ag, Ag alloy, or Al. For example, the third metal films 123a and 123b can be made of a transparent material that has low contact resistance with the anode electrodes 141g, 141r, and 141b and has excellent process reliability, such as ITO or IZO. For example, the third metal films 123a and 123b can also be made of Mo, MoTi alloy, or Ti.

[0271] The first auxiliary electrode 120g is placed beneath the first three-dimensional structure 130-1, and the second auxiliary electrode 120r is placed beneath the second three-dimensional structure 130-2.

[0272] At least one of the multiple metal films 121a, 122a, and 123a of the first auxiliary electrode 120g, namely metal film 121a, may include a first protruding region 1211 that protrudes outward from the first side surface 130-1a of the first three-dimensional structure 130-1 and is in contact with the first anode electrode 141g. The end of one metal film 121a of the first auxiliary electrode 120g may protrude outward more than the ends of the other metal films 122a and 123a.

[0273] At least one of the multiple metal films 121b, 122b, and 123b of the second auxiliary electrode 120r, specifically metal film 121b, may include a second protruding region 1212 that protrudes outward from the first side surface 130-2a of the second three-dimensional structure 130-2 and contacts the second anode electrode 141r. The second protruding region 1212 allows the end of one metal film 121b of the first auxiliary electrode 120g to protrude outward more than the ends of the other metal films 12b and 123b.

[0274] Figure 16 is a flowchart showing the method for manufacturing an organic light-emitting device according to the third embodiment. Figures 17a to 17g are cross-sectional views showing the method for manufacturing an organic light-emitting device according to the third embodiment. Figures 17a to 17g show the red subpixel SPr and blue subpixel SPb as shown in Figure 15, but the green subpixel SPg can be used in the same way.

[0275] Since stages A1 to A4 in Figure 16 are identical to stages A1 to A4 shown in Figure 11, a detailed explanation is omitted.

[0276] As shown in Figure 17a, the auxiliary electrode 120r is patterned using the three-dimensional structure 130-2 (stage A5).

[0277] Specifically, a protective layer 110 and an auxiliary electrode 120r are formed on a substrate 101, and a three-dimensional structure 130-2 is formed on the auxiliary electrode 120r. The protective layer 110 can include a plurality of insulating films 111 to 113. The auxiliary electrode can include a plurality of metal films 121b, 122b, and 123b.

[0278] Thereafter, the auxiliary electrode 120r is patterned using the three-dimensional structure 130-2 as a mask. In such a case, the ends of the plurality of metal films 121b, 122b, and 123b can be positioned differently from each other. The third metal film 123b, the second metal film 122b, and the first metal film 121b are etched into various cross-sectional shapes depending on the etching characteristics of the materials.

[0279] For example, the third metal film and the second metal film are etched, while the first metal film is not etched. As a result, the third metal film and the second metal film may be over-etched under the three-dimensional structure 130-2.

[0280] In FIG. 16, step A6 is a step of forming an anode separation structure, which will be described in detail with reference to FIGS. 17b to 17g.

[0281] As shown in FIG. 17b, the width and height of the three-dimensional structure 130-2 are reduced (step A61) by an ashing process or dry etching. As a result, the over-etched third metal film and second metal film can be exposed. The first metal film can include a protruding region 1212 that protrudes outward from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structure 130-2. The protruding region 1212 can protrude within approximately 2 μm from the side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structure 130-2.

[0282] The etched side surfaces 130-1a, 130-1b, 130-2a, and 130-2b of the third metal film and the second metal film of the auxiliary electrode 120r can be positioned on the same vertical line within an error range of about several hundred nm.

[0283] As shown in Figure 17c, multiple insulating films 111-113 of the protective layer 110 are patterned (A62 step). For example, dry etching is performed using the first metal film of the auxiliary electrode 120r as a mask, and the third insulating film 113 and the second insulating film 112 of the protective layer 110 are patterned.

[0284] The dry etching characteristics of the first insulating film 111, the second insulating film 112, and the third insulating film 113 are different. For example, while the dry etching characteristics of the second insulating film 112 and the third insulating film 113 are excellent, the first insulating film 111 may not be patterned by dry etching. For example, an HF-based etching solution can be used, but is not limited to this.

[0285] For example, the first insulating film 111 and the third insulating film 113 may be silicon nitride films, and the second insulating film 112 may be a silicon oxide film, but the invention is not limited to these. During the film formation stage of the first insulating film 111, the second insulating film 112, and the third insulating film 113, the ratio of silicon to nitrogen, the ratio of silicon to oxygen, the density of the films, etc., are optimized, and during the dry etching stage, the type and composition ratio of the dry etching gas, etc., are optimized.

[0286] As shown in Figure 17d, dry etching is performed continuously, and the second insulating film 112 is patterned (step A63). The first insulating film 111 and the third insulating film 113 are not patterned by the additional dry etching, while the second insulating film 112 is patterned. As a result, an undercut structure 1830 is formed in which the end of the second insulating film 112 is located inward from the sides 130-1a, 130-1b, 130-2a, and 130-2b of the three-dimensional structure 130-2.

[0287] On the other hand, the third insulating film 113 may be omitted, and the structure may be formed as a double layer of the second insulating film 112 and the first insulating film 111. In this case, the first insulating film 111 may include a resin film, and the second insulating film 112 may include an inorganic film such as a silicon nitride film or a silicon oxide film. This allows for the easy formation of the undercut structure 1830 by utilizing resin films and inorganic films with a high etching selectivity ratio. When the first insulating film 111 is a resin film, the etching selectivity ratio can be further increased by utilizing resin films that are difficult to etch in a wet etching solution, thereby facilitating structure formation.

[0288] As shown in Figure 17e, anode electrodes 141r and 141b are formed on the substrate 101 (step A7). The green anode electrode (142g in Figure 15) is also formed on the substrate 101.

[0289] At least one metal film is deposited on the substrate 101. In this case, the undercut structure 1830 forms a second-first discontinuation structure 1841. At least one metal film is discontinuous between the red subpixel SPr and the blue subpixel SPb by the second-first discontinuation structure 1841, separating it into a second anode electrode 141r and a third anode electrode 141b. The second anode electrode 141r is formed on the red subpixel SPr on the side surface 130-2a of the three-dimensional structure 130-2, and the third anode electrode 141b is formed on the blue subpixel SPb on the separation region 105.

[0290] Since the thickness of at least one metal film is very small, less than 50 nm, the height 182 of the undercut structure 1830 is not reduced by the anode electrodes 141r and 141b, preventing the anode electrodes 141r and 141b from being connected rather than separated.

[0291] According to the example, since the anode electrodes 141r and 141b are formed separately from each other by FMM or the like without any additional steps, the manufacturing process is simplified and manufacturing costs are reduced.

[0292] On the other hand, the second anode electrode 141r is electrically connected to the protruding region 1212 of the first metal film 121b of the auxiliary electrode 120r. That is, the second anode electrode 141r can contact the upper and side surfaces of the protruding region 1212, and can also contact the respective side surfaces of the second metal film 122b and the third metal film 123b. Therefore, the contact area between the second anode electrode 141r and the auxiliary electrode 120r is maximized, improving voltage and current supply characteristics and enhancing electrical / optical characteristics.

[0293] The anode electrode 141b can be removed, and an auxiliary electrode (not shown) located below the third anode electrode 141b can also perform the role of the third anode electrode 141b.

[0294] As shown in Figure 17f, the red organic light-emitting layer 142R and the blue organic light-emitting layer 142B are deposited on the anode electrodes 141r and 141b (step A8). Although not shown, the green organic light-emitting layer 142G is also deposited on the green anode electrode (141g in Figure 15).

[0295] The organic light-emitting layer 142R shown in Figure 17f may also be the two-stacked organic light-emitting layers R-EML1 and R-EML2 shown in Figure 9b.

[0296] As shown in Figure 9b, the red organic light-emitting layer 142R and the blue organic light-emitting layer 142B can each have a tandem structure including a first stack ST1, a charge generation layer CGL, and a second stack ST2.

[0297] For example, the first stack ST1 of the blue organic light-emitting layer 142B is deposited on the red subpixel SPr and the blue subpixel SPb, and the first stack ST1 of the red organic light-emitting layer 142R is deposited on the red subpixel SPr. Subsequently, the charge generation layer CGL is deposited on the red subpixel SPr and the blue subpixel SPb. Subsequently, the second stack ST2 of the blue organic light-emitting layer 142B is deposited on the red subpixel SPr and the blue subpixel SPb, and the second stack ST2 of the red organic light-emitting layer 142R is deposited on the red subpixel SPr.

[0298] In this case, the first stack ST1 of the blue organic light-emitting layer 142B is disconnected between the red subpixel SPr and the blue subpixel SPb by an undercut structure 1830, etc., forming a second-second disconnection structure 1842. The charge generation layer CGL is disconnected between the red subpixel SPr and the blue subpixel SPb by an undercut structure 1830, etc., forming a second-third disconnection structure 1843. The second disconnection structure 1840 is composed of the second-first disconnection structure 1841, the second-second disconnection structure 1842, and the second-third disconnection structure 1843.

[0299] The disconnection between the second anode electrode 141r and the third anode electrode 141b, the disconnection of the first stack ST1 of the blue organic light-emitting layer 142B, and the disconnection of the charge generation layer CGL all occur at the same location. That is, these disconnections occur either adjacent to the undercut structure 1830 or diagonally across the undercut structure 1830.

[0300] On the other hand, the organic vapor-deposited films constituting the red organic light-emitting layer 142R and the blue organic light-emitting layer 142B have poor step coverage characteristics. However, the embodiment can take advantage of the poor step coverage characteristics of the organic vapor-deposited film. That is, in the embodiment, because the step coverage characteristics of the organic vapor-deposited film are poor, even if the organic vapor-deposited film is deposited, the material of the organic vapor-deposited film does not penetrate into the undercut structure 1830. Therefore, the first stack ST1 and charge generation layer CGL of the blue organic light-emitting layer 142B are disconnected at the entrance of the undercut structure 1830, so the lateral current leakage minimizes the influence of adjacent subpixels SPr and SPb, resulting in sharper image quality and improved brightness.

[0301] As shown in Figure 17g, the cathode electrode 143 is formed (A9 stage).

[0302] Figure 18 illustrates the height and depth of the undercut structure in the anode separation structure according to the embodiment.

[0303] As illustrated in Figure 18, in order for the cathode electrode 143, which is common to all subpixels (SPg, SPr, SPb in Figure 15), to not be disconnected (or separated), for the second anode electrode 141r and the third anode electrode 141b to be disconnected (or separated) between red subpixels SPr, for the first blue organic light-emitting layer B-EML1 to be disconnected (or separated), and for the charge generation layer CGL to be disconnected (or separated), equation 4 must be satisfied.

[0304] (Math 4) Thickness of the third anode electrode 141b 184 + Thickness of the first stack ST1 185 + Thickness of the charge generation layer CGL 186 < Height of the undercut structure 1830 182 < Thickness of the third anode electrode 141b 184 + Total thickness of the blue organic light-emitting layer 142B 187

[0305] The height 182 of the undercut structure 1830 may be greater than the sum of the thickness 184 of the third anode electrode 141b (or second anode electrode 141r), the thickness 185 of the first stack ST1, and the thickness 186 of the charge generation layer CGL. The height 182 of the undercut structure 1830 may be less than the sum of the thickness 184 of the third anode electrode 141b (or second anode electrode 141r) and the total thickness 187 of the blue organic light-emitting layer 142B. The total thickness 187 of the blue organic light-emitting layer 142B may be the total thickness of all organic light-emitting layers included in the blue organic light-emitting layer 142B shown in Figure 9b.

[0306] On the other hand, the depth 183 of the undercut structure 1830 may be more than twice the height 182 of the undercut structure 1830, taking into account process deviations.

[0307] For example, in a structure having a tandem structure with two stacks, as shown in Figure 9b, the height 182 and depth 183 of the undercut structure 1830 can be calculated as follows.

[0308] -Thickness of the third anode electrode 141b: 184:50nm

[0309] - Thickness of the first stack ST1: 185:150nm

[0310] - Thickness of charge generation layer CGL: 186:20nm

[0311] -Total thickness of blue organic light-emitting layer 142B: 187:450nm

[0312] The height 182 of the undercut structure 1830 is calculated in the range of 220nm to 500nm, and the depth 183 of the undercut structure 1830 is calculated in the range of 440nm to 1,000nm.

[0313] On the other hand, in a structure with a tandem configuration of two stacks, the height 182 and depth 183 of the undercut structure 1830 calculated by Equation 4 are changed depending on the density of the stacks. Equation 4 can also be applied to a structure with a single stack (Figure 9a).

[0314] Figure 19 is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment.

[0315] The embodiment is identical to the third embodiment (Figure 7), except for the light scattering particle 190. In the fifth embodiment, the same reference numerals are used for components having the same structure, shape, and / or function as in the third embodiment (Figure 7), and detailed descriptions are omitted. The fifth embodiment can also be applied to the first, second, and fourth embodiments.

[0316] Referring to Figure 19, the organic light-emitting device 100E according to the fifth embodiment may include a substrate 101, a plurality of drive circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting device 100E according to the fifth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting device 100E according to the fifth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0317] The second insulating layer 160 contains light-scattering particles 190. In the drawing, only the second insulating layer 160 on the leftmost separation region 105 contains light-scattering particles 190, but the second insulating layer 160 on other separation regions 105 may also contain light-scattering particles 190.

[0318] Green light emitted from the green organic light-emitting element 140g, red light emitted from the red organic light-emitting element 140r, and blue light emitted from the blue organic light-emitting element 140b can travel to the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0319] For example, the first anode electrode 141g, the second anode electrode 141r, and the third anode electrode 141b may include a reflective film. For example, the cathode electrode 143 may include a semi-transparent film. Green light, red light, and blue light are reflected by the reflective film and semi-transparent film and emitted forward. Here, P1 to P4 can represent the optical path. Some of the light, for example, red light, is totally reflected upward within the red organic light-emitting element 140r and emitted forward (P2).

[0320] On the other hand, some of the light, specifically red light, is scattered by the light-scattering particles 190 and emitted forward (P3). Since more light is extracted to the outside by the light-scattering particles 190, the luminance can be increased.

[0321] Figure 20 is a cross-sectional view illustrating an organic light-emitting device according to the sixth embodiment.

[0322] The embodiment is identical to the fifth embodiment (Figure 19), except for the lens structure 193. In the sixth embodiment, the same reference numerals are used for components having the same structure, shape, and / or function as in the fifth embodiment (Figure 19), and detailed descriptions are omitted. The sixth embodiment can also be applied to the first to fourth embodiments.

[0323] Referring to Figure 20, the organic light-emitting device 100F according to the sixth embodiment may include a substrate 101, a plurality of drive circuits 103, a protective layer 110, a plurality of auxiliary electrodes 120g, 120r, 120b, etc. The organic light-emitting device 100F according to the sixth embodiment may include a first three-dimensional structure 130-1, a second three-dimensional structure 130-2, a green organic light-emitting element 140g, a red organic light-emitting element 140r, a blue organic light-emitting element 140b, etc. The organic light-emitting device 100F according to the sixth embodiment may include a first insulating layer 150, a second insulating layer 160, a third insulating layer 170, etc.

[0324] The lens structure 193 is placed on the third insulating layer 170. For example, the lens structure 193 is placed on the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2.

[0325] The structure of lens 193 is shown as convex, but it may also be concave. Light passes through the insulating film 170 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2, then enters lens 193, and is subsequently entered and emitted by another layer provided on top of lens 193. Through this process, the light is not totally internalized at the top and bottom surfaces of lens 193, is emitted forward to the maximum extent possible, and lens 193 is optimized to match the refractive index of each layer through which the light passes.

[0326] Although not shown in the diagram, the second insulating layer 160 can be patterned into a lens structure to prevent total internal reflection at the interface with the third insulating film 170, thereby maximizing the light extraction efficiency.

[0327] Green light emitted from the green organic light-emitting element 140g, red light emitted from the red organic light-emitting element 140r, and blue light emitted from the blue organic light-emitting element 140b are emitted forward through the second insulating layer 160 between the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2. In this case, the green light, red light, and blue light in the second insulating layer 160 are focused by the lens structure 193. Each lens structure 193 may be wider than or equal to the width of the second insulating layer 160.

[0328] If the second insulating layer 160 contains light scattering particles 190, the green, red, and blue light scattered by the light scattering particles 190 can be focused by the lens structure 193, thereby increasing the light intensity. The light scattering particles 190 may be omitted.

[0329] Although one lens structure 193 is shown in the drawing, the lens structure 193 may be placed on the upper surface of each of the second insulating layers 160 between multiple first three-dimensional structures 130-1 and multiple second three-dimensional structures 130-2.

[0330] Figure 21a is a cross-sectional view of a schematic panel designed for the AR product. Figure 21b is the design data sheet for the panel design in Figure 21a. Figure 22 is a plan view of a schematic panel designed for the AR product.

[0331] As mentioned above, the design is such that the larger the average wall angle θa, the smaller the pixel P (or subpixel), which is advantageous for high resolution. Figures 21 and 22 were designed as screens with the highest possible integration density physically possible.

[0332] Referring to Figures 21 and 22, the target product's screen has a diagonal size of 0.6 inches, a screen aspect ratio of 16:9, and a resolution of QHD (Quad HD).

[0333] In this case, the pixel density P of the panel is 4,900 ppi, and the size of each pixel P is 5.2 μm.

[0334] This design allowed for the calculation of the theoretical emission area ratio and the target deposition angle θe. The emission area ratio is the value obtained by dividing the total area of ​​each color emitted by the subpixels by the area of ​​pixel P. The target deposition angle θe is the angle at which the desired organic light-emitting material is deposited only on a specific region of the second three-dimensional structure 130-2, utilizing the shadow effect of the first three-dimensional structure 130-1, and not deposited on other regions, such as the separation region 105.

[0335] As shown in Figure 22, the height of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 can be designed to be 4 μm. The width of the lower surface of the first three-dimensional structure 130-1 and the second three-dimensional structure 130-2 in the first direction X can be designed to be 2.2 μm, and the width in the second direction Y can be designed to be 4.0 μm. The distance between the rows of three-dimensional structures 130-1 and 130-2 can be designed to be 1.2 μm. When the vertical margins of the red anode electrode and the green anode electrode are designed to be 0.6 μm on the top side and 1.0 μm on the bottom side, and the spacing between the rows is 1.0 μm, the total luminescent area (anode area) is 22.4 μm. 2 In such cases, the total light-emitting area is the pixel P area (27 μm²). 2 The luminous area ratio, calculated by dividing by ), is calculated to be 83%.

[0336] The target deposition angle θe is 51 degrees, and the deposition angle margin may be ±6 degrees.

[0337] Compared to the typical 20-25% luminous area ratio of 500ppi mobile phone products, the structure in this example allows for the manufacture of products with a luminous area ratio more than three times higher, even though the pixel P integration density is more than 10 times higher at 5,000ppi. Furthermore, the SAD structure in this example is a groundbreaking technology that can improve product brightness and lifespan by realizing a side-by-side structure in product areas with pixel P integration density where FMM cannot be used.

[0338] The above detailed description should not be interpreted restrictively in any way and should be considered illustrative. The scope of the examples should be determined by a reasonable analysis of the attached claims, and all modifications within the equivalent scope of the examples are included within the scope of the examples.

Claims

1. A protective layer comprising a plurality of insulating films on a substrate, A first three-dimensional structure is placed on the aforementioned protective layer, A second three-dimensional structure is separated from the first three-dimensional structure by placing a separation region along a first direction on the protective layer, Displaced on one side surface of the first three-dimensional structure, a first subpixel including a first organic light-emitting element, Displaced on one side surface of the second three-dimensional structure, a second subpixel including a second organic light-emitting element, Displaced on the aforementioned separation region, a third subpixel including a third organic light-emitting element, A first anode separation structure is provided below the first three-dimensional structure between the first organic light-emitting element and the third organic light-emitting element, The second anode separation structure is located below the second three-dimensional structure between the second organic light-emitting element and the third organic light-emitting element, The first anode separation structure described above is The first undercut structure is formed such that the end of at least one protective film among the plurality of insulating films is located inward from the side surface of the first three-dimensional structure. The above-mentioned second anode separation structure is, An organic light-emitting display device, comprising a second undercut structure formed such that the end of at least one protective film among the plurality of insulating films is located inward from the side surface of the second three-dimensional structure.

2. A first auxiliary electrode is placed between the protective layer and the first three-dimensional structure, A second auxiliary electrode is placed between the protective layer and the second three-dimensional structure, The organic light-emitting device according to claim 1, further comprising a third auxiliary electrode between the protective layer and the third organic light-emitting element.

3. The first anode separation structure described above is The first discontinuation structure further includes a first discontinuation structure that discontinues the first subpixel and the third subpixel by the first undercut structure, The organic light-emitting display device according to claim 2, wherein the second anode separation structure further includes a second disconnection structure that disconnects the second subpixel and the third subpixel by the second undercut structure.

4. The first discontinuity structure is, The first subpixel and the third subpixel include a first-first disconnection structure that disconnects the first anode electrode of the first organic light-emitting element and the third anode electrode of the third organic light-emitting element, The organic light-emitting device according to claim 3, wherein the second disconnection structure includes a second-first disconnection structure that disconnects the second anode electrode of the second organic light-emitting element and the third anode electrode of the third organic light-emitting element between the second subpixel and the third subpixel.

5. The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element are, respectively, Multiple stacks are placed between the anode electrode and the cathode electrode, The plurality of stacks include a plurality of charge generation layers, Each of the stacks of the third organic light-emitting element includes a blue light-emitting layer. The organic light-emitting device according to claim 3, wherein the blue light-emitting layer and the charge-generating layer are formed in common with the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element, respectively.

6. The first discontinuation structure includes a first-to-second discontinuation structure that discontinues the blue light-emitting layer between the first subpixel and the third subpixel. The organic light-emitting device according to claim 5, wherein the second discontinuation structure includes a second-2 discontinuation structure that discontinues the blue light-emitting layer between the second subpixel and the third subpixel.

7. The first discontinuation structure includes first-to-third discontinuation structures that discontinue the charge generation layer between the first subpixel and the third subpixel. The organic light-emitting device according to claim 6, wherein the second discontinuation structure includes a second-to-third discontinuation structure that discontinues the charge generation layer between the second subpixel and the third subpixel.

8. The first auxiliary electrode and the second auxiliary electrode each include a plurality of metal films, At least one of the plurality of metal films of the first auxiliary electrode includes a first protruding region that protrudes outward from the side surface of the first three-dimensional structure and contacts the first anode electrode. The organic light-emitting device according to claim 4, wherein at least one of the plurality of metal films of the second auxiliary electrode includes a second protruding region that protrudes outward from the side surface of the second three-dimensional structure and contacts the second anode electrode.

9. A first insulating layer is provided on the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element. A second insulating layer is placed on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure, The invention further includes a third insulating layer on the second insulating layer, The organic light-emitting display device according to claim 1, wherein the third insulating layer is in contact with the upper surface of the first three-dimensional structure and the upper surface of the second three-dimensional structure.

10. The second insulating layer, the first insulating layer, the first organic light-emitting layer of the first organic light-emitting element, the second organic light-emitting layer of the second organic light-emitting element, and the third organic light-emitting layer of the third organic light-emitting element are positioned lower than the upper surface of the first three-dimensional structure and the upper surface of the second three-dimensional structure. The third insulating layer is The organic light-emitting device according to claim 9, wherein it is in contact with the second insulating layer, the first insulating layer, the first organic light-emitting layer of the first organic light-emitting element, the second organic light-emitting layer of the second organic light-emitting element, and the third organic light-emitting layer of the third organic light-emitting element, and is in contact with the upper surface of the first three-dimensional structure and the upper surface of the second three-dimensional structure.

11. The organic light-emitting device according to claim 10, wherein the first organic light-emitting layer, the second organic light-emitting layer, and the third organic light-emitting layer are separated by contact between the third insulating layer and the upper surface of the first three-dimensional structure and the upper surface of the second three-dimensional structure, respectively.

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