electronic machinery

Abstract

The present invention achieves both effective heat dissipation in a series resonator of a ladder-type filter and space saving in an elastic wave device. This elastic wave device comprises a third wiring portion that is connected to a first wiring portion and a non-ground terminal.

Description

Technical Field

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[0001] The present disclosure relates to an elastic wave device and an electronic device.

Background Art

[0002] Conventionally, referring to Patent Document 1, an elastic surface wave device provided with a ladder-type filter is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] An elastic wave device according to an aspect of the present disclosure includes a ladder-type filter including a series resonator, a first wiring portion and a second wiring portion connected to the series resonator, a ground terminal, and a non-ground terminal electrically independent of the ground terminal, and a third wiring portion connected to the first wiring portion and the non-ground terminal.

Brief Description of the Drawings

[0005] <​​​​​​​​​​​​​​​​​ [Figure 7] This is a plan view showing a schematic configuration of an elastic wave apparatus according to a second modified example of Embodiment 3 of the present disclosure. [Figure 8] This is a plan view showing the schematic configuration of an elastic wave apparatus according to Embodiment 4 of this disclosure. [Figure 9] This is a cross-sectional view showing the schematic configuration of an electronic device according to the first example of Embodiment 5 of this disclosure. [Figure 10] This is a cross-sectional view showing the schematic configuration of an electronic device according to a second example of Embodiment 5 of this disclosure. [Modes for carrying out the invention]

[0006] The following describes the forms for implementing this disclosure. For the sake of convenience, components having the same function as those described earlier will be denoted by the same reference numerals, and their descriptions may not be repeated.

[0007] In conventional technology, it has been difficult to achieve both effective heat dissipation of the series resonators of a ladder-type filter and space-saving design for the elastic wave apparatus. According to one aspect of this disclosure, it is possible to achieve both effective heat dissipation of the series resonators of a ladder-type filter and space-saving design for the elastic wave apparatus.

[0008] [Embodiment 1] Figure 1 is a plan view showing the schematic configuration of the elastic wave device 101 according to this embodiment. The elastic wave device 101 comprises a series resonator 1, a first wiring section 2, a second wiring section 3, a ground terminal 4, a non-ground terminal 5, and a third wiring section 6.

[0009] Figure 2 is a circuit diagram of the ladder filter 51. The elastic wave device 101 is equipped with the ladder filter 51. The ladder filter 51 includes a series resonator 7 and a parallel resonator 8. The series resonator 1 corresponds to the series resonator 7.

[0010] The first wiring section 2 and the second wiring section 3 are connected to the series resonator 1. The first wiring section 2 and the second wiring section 3 are signal wiring sections that transmit signals supplied to the series resonator 1 and signals supplied by the series resonator 1. The first wiring section 2 may transmit the signals supplied to the series resonator 1, and the second wiring section 3 may transmit the signals supplied by the series resonator 1. Alternatively, the second wiring section 3 may transmit the signals supplied to the series resonator 1, and the first wiring section 2 may transmit the signals supplied by the series resonator 1.

[0011] The ground terminal 4 is the ground terminal of the elastic wave device 101. The non-ground terminal 5 is a terminal that is electrically independent from the ground terminal 4. In other words, the ground terminal 4 and the non-ground terminal 5 are not conductive to each other. The potential of the non-ground terminal 5 may be different from the potential of the ground terminal 4, or it may end up being the same as the potential of the ground terminal 4.

[0012] The non-ground terminal 5 may be formed of a material with excellent heat dissipation properties. A bump with excellent heat dissipation properties may be formed on the non-ground terminal 5.

[0013] The third wiring section 6 is connected to the first wiring section 2 and the non-ground terminal 5. The third wiring section 6 may be provided for the purpose of dissipating heat from the series resonator 1. The third wiring section 6 may contain a material with excellent heat dissipation properties. Examples of materials for the third wiring section 6 include aluminum, copper, gold, and tungsten. The third wiring section 6 does not have to transmit signals, and it is not necessary for the third wiring section 6 to be conductive.

[0014] According to the elastic wave device 101, there is no need to provide a member that contributes to the heat dissipation of the series resonator 1 between the series resonator 1 and another series resonator adjacent to it, so the series resonator 1 and the other series resonator can be placed in close proximity. Therefore, the elastic wave device 101 can achieve both effective heat dissipation of the series resonator 1 and space saving for the elastic wave device. The series resonator 1 corresponds to the series resonator 7 of the ladder-type filter 51.

[0015] The non-ground terminal 5 may be arranged at a position that does not interfere with the planar shape of the first wiring portion 2. The position that does not interfere with the planar shape of the first wiring portion 2 is a position where, in the plan view of the first wiring portion 2, the routing change of the first wiring portion 2 is not forced. As an example of such an arrangement of the non-ground terminal 5, an arrangement that does not narrow or bypass the first wiring portion 2, an arrangement that does not omit the substantially strip-shaped first wiring portion 2, and an arrangement where the non-ground terminal 5 and the first wiring portion 2 do not appear to overlap each other can be cited.

[0016] There may be one non-ground terminal 5 connected to the third wiring portion 6.

[0017] 〔Embodiment 2〕 FIG. 3 is a plan view showing a schematic configuration of the surface acoustic wave device 102 according to the present embodiment. The surface acoustic wave device 102 includes a series resonator 1, a first wiring portion 2, a second wiring portion 3, a ground terminal 4, a non-ground terminal 5, a third wiring portion 6, and a fourth wiring portion 9.

[0018] The fourth wiring portion 9 is connected to the second wiring portion 3. The fourth wiring portion 9 is not connected to the non-ground terminal 5 and is arranged close to the non-ground terminal 5. In other words, the third wiring portion 6 and the fourth wiring portion 9 are provided so as not to short-circuit the first wiring portion 2 and the second wiring portion 3 with the non-ground terminal 5 interposed therebetween. The separation distance 10 between the fourth wiring portion 9 and the non-ground terminal 5 may be a distance that can effectively transfer the heat of the fourth wiring portion 9 to the non-ground terminal 5, for example, 2 μm or more and 30 μm or less.

[0019] Similar to the third wiring portion 6, the fourth wiring portion 9 may be provided for the purpose of radiating heat from the series resonator 1. The options for the material of the fourth wiring portion 9 may be the same as the options for the material of the third wiring portion 6. Similar to the third wiring portion 6, the fourth wiring portion 9 does not have to transmit signals and does not necessarily have conductivity.

[0020] According to the elastic wave device 102, by adding the fourth wiring section 9 to the elastic wave device 101, more effective heat dissipation of the series resonator 1 can be achieved.

[0021] [Embodiment 3] Figure 4 is a plan view showing the schematic configuration of the elastic wave device 103 according to this embodiment. The elastic wave device 103 comprises a series resonator 1, a first wiring section 2, a second wiring section 3, a ground terminal 4, a non-ground terminal 5, a third wiring section 6, a fourth wiring section 9, and a capacitive comb electrode 11. The capacitive comb electrode 11 has a pair of first comb electrodes, and the pair of first comb electrodes is arranged facing each other. In other words, the pair of first comb electrodes are the first comb electrodes 12 and 13. The capacitive comb electrode 11 may be provided for the purpose of heat dissipation of the series resonator 1.

[0022] The series resonator 1 may be a SAW (Surface Acoustic Wave) filter. Figure 5 is a plan view showing the schematic configuration of the series resonator 1, which is a SAW filter. The series resonator 1 has a pair of second comb electrodes, and these two pairs of second comb electrodes are arranged facing each other. In other words, these two pairs of second comb electrodes are second comb electrodes 14 and 15.

[0023] The third wiring section 6 is electrically connected to the first wiring section 2 and the first comb electrode 12. The first comb electrode 12 corresponds to one of a pair of first comb electrodes. The fourth wiring section 9 is electrically connected to the second wiring section 3 and the first comb electrode 13. The first comb electrode 13 corresponds to the other of a pair of first comb electrodes. The first comb electrode 12 is electrically connected to the first wiring section 2 and the third wiring section 6, and the first comb electrode 13 is electrically connected to the second wiring section 3.

[0024] Figure 6 is a plan view showing the schematic configuration of the elastic wave apparatus 104 according to the first modified example of this embodiment. Figure 7 is a plan view showing the schematic configuration of the elastic wave apparatus 105 according to the second modified example of this embodiment.

[0025] The elastic wave device 104 differs from the elastic wave device 103 in that the first comb-tooth electrode 13 is in contact with the second wiring section 3, and consequently, the fourth wiring section 9 is absent. The elastic wave device 105 differs from the elastic wave device 103 in that the arrangement of the non-ground terminal 5 is shifted in the width direction of the third wiring section 6 compared to the elastic wave device 103.

[0026] According to the elastic wave device 104, it is not necessary for the first comb-tooth electrode 13 to be electrically connected to the fourth wiring section 9.

[0027] With elastic wave devices 103, 104, and 105, respectively, by adding capacitive comb-tooth electrodes 11 to elastic wave devices 101 and 102, respectively, more effective heat dissipation of the series resonator 1 can be achieved.

[0028] The capacitive comb-tooth electrode 11 and the SAW filter can be manufactured in the same process. Therefore, if the series resonator 1 is a SAW filter, the capacitive comb-tooth electrode 11 can be easily manufactured.

[0029] The width 17 of the electrode fingers 16 provided on the first comb electrode 12 may be greater than the width 19 of the electrode fingers 18 provided on the second comb electrode 14. This allows the total area of ​​the first comb electrode 12 to be increased, thereby enabling more effective heat dissipation of the series resonator 1. In this explanation, the same can be said if the first comb electrode 12 is replaced with the first comb electrode 13, and the same can be said if the second comb electrode 14 is replaced with the second comb electrode 15.

[0030] The width 21 of the capacitive comb electrode 11 along the arrangement direction 20 of the multiple electrode fingers 16 provided on the first comb electrode 12 may be greater than at least one of the minimum widths of the first wiring section 2, the second wiring section 3, and the third wiring section 6. An example of at least one of the minimum widths of the first wiring section 2, the second wiring section 3, and the third wiring section 6 is the minimum width 22 of the third wiring section 6, excluding the connection point with the non-ground terminal 5. The width 21 may be greater than the minimum width of the fourth wiring section 9. As a result, the larger size of the capacitive comb electrode 11 enables more effective heat dissipation of the series resonator 1. The same can be said if the first comb electrode 12 is replaced with the first comb electrode 13 in this description.

[0031] [Embodiment 4] Figure 8 is a plan view showing the schematic configuration of the elastic wave device 106 according to this embodiment. The elastic wave device 106 comprises a tip 23 and each component that constitutes one of the elastic wave devices 101 to 105. For the sake of simplicity, in Figure 8, all components except the ground terminal 4 and the non-ground terminal 5 are omitted from the illustration.

[0032] The chip 23 has an outer periphery 24. A non-ground terminal 5 may be located on the outer periphery 24. A ground terminal 4 may be located on the outer periphery 24. A signal terminal 25 that is electrically connected to the first wiring section 2 and the second wiring section 3 may be located on the outer periphery 24.

[0033] According to the elastic wave device 106, the degree of freedom in the layout of each component is high, which makes it possible to miniaturize the elastic wave device.

[0034] In the elastic wave device 106, the non-ground terminal 5 may be electrically independent from the signal terminal 25 which is electrically connected to the first wiring section 2 and the second wiring section 3.

[0035] [Embodiment 5] Figure 9 is a cross-sectional view showing the schematic configuration of an electronic device 201 according to a first example of this embodiment. The electronic device 201 comprises an elastic wave device 106 in which the non-ground terminal 5 is electrically independent from the signal terminal 25, a mounting substrate 26, an electronic device substrate 27, and a sealing member 28.

[0036] The mounting substrate 26 is a substrate on which the elastic wave device 106 is mounted. The mounting substrate 26 has a first wiring pattern 29, a second wiring pattern 30, and a third wiring pattern 31. The first wiring pattern 29 is formed on the surface of the mounting substrate 26. The second wiring pattern 30 and the third wiring pattern 31 are formed on the surface and inside the mounting substrate 26, respectively.

[0037] The substrate 27 is a substrate on which the mounting substrate 26, on which the elastic wave device 106 is mounted, is mounted. The substrate 27 has a fourth wiring pattern 32 and a fifth wiring pattern 33. The sealing member 28 seals the elastic wave device 106 and may be made of, for example, a resin material.

[0038] The first wiring pattern 29 and the non-ground terminal 5 are connected. A bump 34 may be used to connect the first wiring pattern 29 and the non-ground terminal 5. The non-ground terminal 5 may be connected to the first wiring pattern 29 via the bump 34.

[0039] The fourth wiring pattern 32 belongs to the input and output signal paths of the electronic device 201. The fourth wiring pattern 32 is connected to the second wiring pattern 30 and the signal terminal 25. A bump 35 may be used to connect the second wiring pattern 30 and the signal terminal 25. The second wiring pattern 30 is electrically connected to the first wiring section 2 and the second wiring section 3.

[0040] The fifth wiring pattern 33 is grounded. The fifth wiring pattern 33, the third wiring pattern 31, and the ground terminal 4 are connected. A bump 36 may be used to connect the third wiring pattern 31 and the ground terminal 4.

[0041] Figure 10 is a cross-sectional view showing the schematic configuration of an electronic device 202 according to a second example of this embodiment. The electronic device 202 differs from the electronic device 201 in that the mounting substrate 26 has a heat dissipation member 37.

[0042] The heat dissipation member 37 is formed inside the mounting substrate 26 and is electrically independent of the second wiring pattern 30. The non-ground terminal 5 is connected to the heat dissipation member 37 via the first wiring pattern 29. The heat dissipation member 37 may be provided for the purpose of dissipating heat from the series resonator 1. The heat dissipation member 37 may contain a material with excellent heat dissipation properties. The heat dissipation member 37 may also be a so-called via mounted on an electronic circuit.

[0043] According to electronic device 202, by adding the heat dissipation member 37 to electronic device 201, more effective heat dissipation of the series resonator 1 can be achieved.

[0044] The inventions described in this disclosure have been explained above based on the drawings and embodiments. However, the inventions described in this disclosure are not limited to the embodiments described above. That is, the inventions described in this disclosure can be modified in various ways within the scope shown in this disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the inventions described in this disclosure. In other words, it should be noted that it is easy for those skilled in the art to make various modifications or alterations based on this disclosure. Furthermore, it should be noted that these modifications or alterations are included in the scope of this disclosure. [Explanation of Symbols]

[0045] 1. 7 Series Resonator 2 1st wiring section 3 2nd wiring section 4. Ground terminal 5 Non-Ground Terminal 6 Third wiring section 8 parallel resonators 9 4th wiring section 10 Distance between the fourth wiring section and the non-ground terminal 11 Capacitive comb electrode 12, 13 First comb electrode 14, 15 Second comb electrode 16 Electrode fingers provided on the first comb electrode 17 Width of the electrode fingers provided on the first comb-tooth electrode 18 Electrode fingers provided on the second comb electrode 19. Width of the electrode fingers provided on the second comb electrode. 20. Arrangement direction of multiple electrode fingers provided on the first comb-shaped electrode. 21 Width of capacitive comb-tooth electrodes 22 Minimum width of the third wiring section 23 chips 24 Outer periphery 25 signal terminals 26 Implemented circuit board 27 Circuit boards for electronic equipment 28 Sealing member 29. First wiring pattern 30. Second wiring pattern 31 Third Wiring Pattern 32. Fourth wiring pattern 33 Fifth Wiring Pattern 34-36 Bump 37 Heat dissipation components 51 Ladder-type filters 101-106 Elastic wave apparatus 201, 202 Electronic equipment

Claims

1. An elastic wave device comprising: a ladder-type filter including a series resonator; a first wiring section connected to a first terminal of the series resonator; a second wiring section connected to a second terminal of the series resonator different from the first terminal; a third wiring section connected to the first wiring section; a fourth wiring section connected to the second wiring section; a ground terminal; a non-ground terminal electrically independent of the ground terminal; and a capacitive comb electrode having a pair of first comb electrodes arranged facing each other; A mounting substrate on which the elastic wave device is mounted and on which a first wiring pattern connected to the non-ground terminal is formed on the surface, It has, The first wiring section and one of the pair of first comb-tooth electrodes are connected to the third wiring section via the non-ground terminal. The second wiring section and the other of the pair of first comb-tooth electrodes are connected to the fourth wiring section. electronic equipment.

2. The electronic device according to claim 1, wherein the fourth wiring section is not connected to the non-ground terminal.

3. The electronic device according to claim 1, wherein the series resonator is a SAW filter.

4. The aforementioned series resonator has a second comb-shaped electrode, The electronic device according to claim 3, wherein the width of the electrode fingers provided on the first comb-tooth electrode is greater than the width of the electrode fingers provided on the second comb-tooth electrode.

5. The electronic device according to claim 3, wherein the width of the capacitive comb electrode along the direction of arrangement of the plurality of electrode fingers provided on the first comb electrode is greater than at least one of the minimum width of the first wiring portion, the minimum width of the second wiring portion, and the minimum width of the third wiring portion.

6. The electronic device according to claim 1, comprising a chip having an outer periphery on which the non-ground terminal is located.

7. The electronic device according to claim 1, wherein there is one non-ground terminal connected to the third wiring section.

8. The electronic device according to claim 1, wherein the non-ground terminal is positioned so as not to interfere with the planar shape of the first wiring section.

9. The electronic device according to claim 1, wherein the non-ground terminal and the first wiring pattern are connected via a bump.

10. The aforementioned mounting board is A second wiring pattern formed on the aforementioned mounting substrate and having electrical contact with the first wiring portion and the second wiring portion, A heat dissipation member formed on the aforementioned mounting substrate and electrically independent of the second wiring pattern, It has, The electronic device according to claim 9, wherein the non-ground terminal is connected to the heat dissipation member via the first wiring pattern.

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