LED lamp plate

Abstract

The present invention is applied to the field of LED technology, and provides an LED lamp plate, which includes a substrate provided with a circuit layer. The circuit layer has pads for connecting a plurality of LED chips. A first light reflection layer is provided on the circuit layer, and a plurality of window opening structures are provided on the first light reflection layer. Each window opening structure is arranged, and at least a pair of pads for connecting with the LED chips are distributed in each window opening structure. The LED lamp plate further includes a second light reflection layer filled between the first light reflection layer and the LED chips, and the reflectivity of the second light reflection layer is greater than that of the first light reflection layer. The LED lamp plate according to the present invention is easy to die bond, has high luminous efficiency of the LED lamp plate, improves the process yield, and has low manufacturing cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED packages, and particularly relates to an LED lamp plate.

Background Art

[0002] In recent years, LED backlight lamp plates can achieve local dimming and the display image quality has been greatly improved. Therefore, they are favored in the market, and their popularization in the market is vigorously promoted. Mini-LED backlight display modules and direct display products have become the mainstream of the future display market. In the prior art, for an LED backlight lamp plate using a glass substrate, a layer of white ink is applied to the glass substrate, and a window opening process needs to be performed at the location where the LED chip is placed to expose the pads. Therefore, the window opening process of the white ink, which is convenient for welding the LED chip and the pads (i.e., die bonding), has a great impact on the luminous efficiency of the backlight lamp plate. If the window opening is too large (exposing the glass substrate), the light emitted by the LED will be transmitted through the glass and lost. If the window opening is too small, the ink will cover the pads and cause die bonding defects. At the same time, the reflectivity of the white ink is generally not high, and the luminous efficiency of the LED backlight lamp plate is always limited by the reflectivity of the white ink. Therefore, the luminous efficiency of the LED backlight lamp plate is relatively low, which is disadvantageous for improving the backlight brightness.

[0003] On the other hand, the flip-chip process structure used in the lamp plates of conventional mini-LED backlight display modules is suitable for the needs of densely packed ultra-small spaces and is compatible with various types of package substrates. The substrate material for the package of mini-LED backlight display modules is generally a PCB (Printed Circuit Board) substrate or a glass substrate, and the package adhesive layer on the surface of the mini-LED backlight display module is generally made of silicone resin or epoxy resin. The thermal expansion coefficient of PCB substrates or glass substrates is (1-15) × 10⁻⁶ / °C, and the thermal expansion coefficient of silicone resin or epoxy resin is approximately (50-220) × 10⁻⁶ / °C. Because there is a large thermal expansion mismatch between the substrate and the package adhesive layer, there is a risk of substrate warping, layering, deformation, poor airtightness, and chip delamination. The difference in thermal expansion coefficients between the substrate and the package adhesive is large (the thermal expansion coefficient of the package adhesive is much larger than that of the substrate). This difference causes the deformation to separate unsynchronized when cooled or heated (for example, when performing a thermal shock test). Conventional techniques reduce deformation by reducing the difference in thermal expansion coefficients between the substrate and the adjacent package adhesive. However, this does not remove the stress present in the substrate, making the substrate prone to deformation. Reducing the difference in thermal expansion coefficients between the substrate and the adjacent package adhesive is difficult and results in high production costs.

[0004] Furthermore, LED products come in a wide variety of shapes, and even products of the same type can have vastly different applications in terminals. For example, display products require high contrast, white light products require high brightness, and monochromatic light requires color purity. Thus, client requirements for lamp beads are also diverse. BT (Bismaleimide Triazine) plates, commonly used in LED packages, only come in black and white. Simultaneously, the circuit design inside the PCB must meet the recipe requirements of the packaging process, and a metallic functional area must be left for bonding during the LED packaging process.The primary colors of the metal functional area and BT plate, after packaging, both affect the base color of the LED chip. For example, display products use black paste packaging to improve contrast, but this significantly reduces the brightness of the product and prevents complete coverage of the bottom functional area. Some white light products require relatively high brightness, but the selection of larger chip sizes is limited by the bead size. In this case, brightness improvement must rely on improvements in the luminous efficiency of the LED chip by the chip manufacturer, but the improvement is extremely small and limited, resulting in high costs. The conventional packaging process for backlight lamp plates involves die-bonding LED flip chips onto the circuit layer of a substrate, and then protecting the LED chips and circuit layer by covering them with a layer of transparent protective gel. LED chips generally exhibit Lambertian emission, meaning that the light emission is strong in the center of the LED chip and weaker on both sides. In order to obtain a larger emission angle and more uniform emission, conventional techniques typically involve covering the LED chip directly with a light-reflecting layer to reflect the light emitted from the surface of the LED chip to both sides. While this configuration allows for a large emission angle, the light-reflecting layer does not transmit light, causing the light from the LED chip to reflect multiple times between the light-reflecting layer and the substrate. Since the reflectivity of the substrate does not reach 100%, the substrate absorbs some of the light during these multiple reflections, resulting in significant light loss and a substantial decrease in the luminous efficiency and brightness of the backlight lamp plate. Simultaneously, the low brightness directly above the LED chip results in poor uniformity of the backlight lamp plate.

[0005] The developers need to make improvements based on the technical issues in the LED lamp plate and manufacturing process described above. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] The present invention aims to provide an LED lamp plate that is easy to die bond, has high luminous efficiency, improves process yield, and has low manufacturing costs, in order to overcome at least the drawbacks of the prior art described above. [Means for solving the problem]

[0007] The present invention relates to an LED lamp plate comprising a substrate and an LED chip, wherein the substrate is provided with a circuit composite layer having pads for connecting to the LED chip.

[0008] As a further improvement of the present invention, the circuit composite layer is provided with a first light-reflecting layer, the first light-reflecting layer is provided with a plurality of window-opening structures, each of the window-opening structures has at least one pair of pads in a region corresponding to it, the LED chip is provided within the window-opening structure and connected to the pad in the corresponding window-opening structure, a housing region is formed between the outer circumference of the LED chip and the inner circumference of the window-opening structure, and the LED lamp plate further includes a second light-reflecting layer that fills the housing region.

[0009] As a further improvement of the present invention, the circuit composite layer comprises a circuit layer and a window-opening structure provided on the circuit layer. Light reflection The LED lamp plate comprises a layer and has at least one pair of pads within a region corresponding to each of the windowed structures, the LED chip being provided within the windowed structure and connected to the pad in the corresponding windowed structure, the LED lamp plate further comprises a first package adhesive layer, the first package adhesive layer being provided on one side of the substrate and covering the LED chip and the circuit composite layer, the first package adhesive layer allowing the transmission of light emitted by the LED chip, and the LED lamp plate further comprises a second package adhesive layer being provided on the other side of the substrate to partially or completely offset the stress on the substrate by the first package adhesive layer.

[0010] As a further improvement of the present invention, the circuit composite layer comprises a circuit layer and a window-opening structure provided on the circuit layer. Light reflection The LED lamp plate includes a layer and has at least one pair of pads in the region corresponding to each of the windowed structures, the LED chip is provided in the windowed structure and connected to the pad in the corresponding windowed structure, the LED chip is located in the windowed structure and connected to the circuit layer, and the LED lamp plate is Second light reflection Further including the layer, Second light reflection The layer is filled into the windowed structure, Second light reflection Each layer is the LED chip, the Light reflection Connected to the layer, Second light reflection The color of the layer and the above Light reflection The color of the layers is the same.

[0011] As a further improvement of the present invention, the second light-reflecting layer is made of resin, and light-reflecting particles are dispersed in the second light-reflecting layer.

[0012] As a further improvement of the present invention, the second light-reflecting layer is formed by being dispensed within the window-opening structure.

[0013] As a further improvement of the present invention, the LED chip is a flip chip and has a gap between the surface of the LED chip facing the substrate and the substrate, and the second light-reflecting layer includes a side light-reflecting portion in contact with the outer peripheral side of the LED chip and a bottom light-reflecting portion filled in the gap.

[0014] As a further improvement of the present invention, a solder paste layer for connecting to the LED chip is provided on the surface of the pad, and the second light-reflecting layer is covered around the connection point between the LED chip and the solder paste layer.

[0015] As a further improvement of the present invention, the top surface of the first light-reflecting layer is located between the bottom surface and the top surface of the LED chip, and the top surface of the second light-reflecting layer is not higher than the top surface of the first light-reflecting layer.

[0016] As a further improvement of the present invention, the reflectivity of the second light reflection layer is greater than that of the first light reflection layer.

[0017] As a further improvement of the present invention, the first light reflection layer is made of white ink.

[0018] As a further improvement of the present invention, the thickness of range of the first light reflection layer is 20 μm to 80 μm.

[0019] As a further improvement of the present invention, the size of the window opening structure satisfies the relationship of Bx < Px and By < Py, where Bx represents the maximum size in the lateral direction of the window opening structure, By represents the maximum size in the longitudinal direction of the window opening structure, Px represents the lateral pitch between two adjacent LED chips, and Py represents the longitudinal pitch between two adjacent LED chips.

[0020] As a further improvement of the present invention, the window opening structure is a rectangular through hole, and the longitudinal size of the rectangular through hole is 2 mm or more.

[0021] As a further improvement of the present invention, a plurality of LED chips are provided, the LED lamp plate further includes a plurality of reflection patterns, the second light reflection layer is coated above the substrate and the LED chips, the reflection patterns are provided on the upper surface of the second light reflection layer, the reflection patterns include a plurality of reflection means provided at intervals, an air gap is formed between the reflection means, the reflection means includes a resin and reflection particles dispersed in the resin, and the reflection particle density in the central region of the reflection pattern collection is greater than the reflection particle density in the outer peripheral region of the reflection pattern collection and the first light reflection layer is provided on the surface of the circuit composite layer to which the LED chips are connected, and one surface of the second light reflection layer is coated with the first light reflection layer and the LED chips.

[0022] As a further improvement of the present invention, in one of the reflection patterns, the area of the air gap occupies 20% to 80% of the area of the contour of the reflection pattern, and / or the thickness of the reflection pattern is 10 μm to 60 μm.

[0023] As a further improvement of the present invention, the reflection means includes a reflection ring located in the central region of the reflection pattern.

[0024] As a further improvement of the present invention, the reflection means includes a plurality of the reflection rings provided at the same center, and there is a gap between adjacent reflection rings.

[0025] As a further improvement of the present invention, reflection points are provided on the outer periphery of the reflection ring, and the distribution density of each reflection point decreases as it moves away from the center of the reflection pattern. collection As it moves away from the center of the reflection pattern.

[0026] As a further improvement of the present invention, the reflection means includes a plurality of reflection points surrounding the center of the reflection pattern, and the area of the reflection points decreases as it moves away from the center of the reflection pattern.

[0027] As a further improvement of the present invention, the reflectivity of the reflection means in the central region of the reflection pattern is greater than the reflectivity of the reflection means in the outer peripheral region of the reflection pattern.

[0028] As a further improvement of the present invention, the reflection means in the central region of the reflection pattern includes titanium dioxide particles, and the reflection means in the outer peripheral region of the reflection pattern includes silica particles.

[0029] As a further improvement of the present invention, the reflection pattern is formed by screen printing, and a release slope is provided on the side wall of the reflection means.

[0030] As a further improvement of the present invention, the invention further includes an optical film provided above the second light-reflecting layer, wherein a diffusion pattern is printed on the surface of the optical film, and the diffusion pattern and the reflection pattern of the optical film are arranged alternately.

[0031] As a further improvement of the present invention, the thickness of the first package adhesive layer is greater than the thickness of the second package adhesive layer, the first package adhesive layer has a first coefficient of thermal expansion, and the second package adhesive layer has a second coefficient of thermal expansion that is greater than the first coefficient of thermal expansion.

[0032] As a further improvement of the present invention, the materials of the first package adhesive layer and the second package adhesive layer are the same, and both are epoxy resin or silicone resin.

[0033] As a further improvement of the present invention, inorganic light-transmitting particles are dispersed in the first package adhesive layer to adjust its coefficient of thermal expansion.

[0034] As a further improvement of the present invention, the inorganic light-transmitting particles settle in the first package adhesive layer, causing the content of the inorganic light-transmitting particles to gradually decrease along the direction away from the substrate.

[0035] As a further improvement to the present invention, the particle size range of the inorganic light-transmitting particles is 50 nm to 5 μm.

[0036] As a further improvement of the present invention, the inorganic light-transmitting particles are at least one of silica powder or alumina powder.

[0037] As a further improvement of the present invention, the thickness of the first package adhesive layer of The range is 150 μm to 400 μm, and / or the thickness of the second package adhesive layer. of The range is 20 μm to 200 μm.

[0038] As a further improvement of the present invention, the first package adhesive layer is in direct contact with the substrate through the windowed structure.

[0039] As a further improvement of the present invention, Second light reflection The upper end of the layer and the above Light reflection The upper edges of the layers are all lower than the upper edges of the LED chips.

[0040] As a further improvement of the present invention, Light reflection Thickness of the layer of The range is 20 μm to 50 μm.

[0041] As a further improvement of the present invention, the LED lamp plate is the Light reflection The top of the layer and the above Second light reflection The package adhesive layer is provided at the top of the layer and covers the LED chip.

[0042] As a further improvement of the present invention, Second light reflection The material of the layer and the material of the package adhesive layer are the same, and both are epoxy resin or silica gel.

[0043] As a further improvement of the present invention, Second light reflection The layer and the above Light reflection The layer is either white or black.

[0044] As a further improvement of the present invention, Second light reflection The layers are created using colored inks or colored colloids with a viscosity of less than 2000 mPa·s.

[0045] As a further improvement of the present invention, the window opening structure or the inner wall of the circuit layer has a rounded or chamfered structure.

[0046] As a further improvement of the present invention, the window opening structure is plurality, and one or more of the LED chips are face-up or flip-chip and are fixed within each of the window opening structures.

[0047] The LED lamp plate according to the present invention includes a substrate on which a circuit layer is provided, and the circuit layer has pads for connecting a plurality of LED chips. is. The circuit layer is provided with a first light reflection layer, and the first light reflection layer is provided with a plurality of window opening structures, each of which is a window opening structure In an array The arrangement includes at least one pair of pads distributed within each windowed structure for connecting to the LED chip. is. The LED lamp plate further includes a second light-reflecting layer filled between the first light-reflecting layer and the LED chip, wherein the reflectance of the second light-reflecting layer is greater than the reflectance of the first light-reflecting layer. The LED lamp plate according to the present invention is easy to die bond, has high luminous efficiency, improves process yield, and has low manufacturing costs. First The adhesive layer of package 1 is base Provided on one side of the board 、L ED chip and rotation Covered by road layers second The adhesive layer of package 1 is 、L Allows light emitted by the ED chip to pass through. third The two packaging adhesive layers are base Provided on the other side of the board fourth 1. The adhesive layer of the package rotation By being used to partially or completely cancel out the stress on the plate, the warping deformation of the substrate due to stress is reduced. reduce This reduces problems such as layering, deformation, and poor airtightness after the lamp freight is sealed. modify Good, it avoids the risk of defects such as LED chip peeling, and production costs are low. L The ED chip is exposed from the substrate. First light reflection The same color as the layer Second light reflection Each layer reL ED chip, First light reflection Connected to the layer, [[ID=四十一]]Second light reflection The layer can completely cover the rest of the substrate, that is, Second light reflectionThe layer is filled into the windowed structure and can also cover the outer peripheral area of ​​the LED chip, effectively improving the color consistency of the substrate surface after sealing. Different colored colloids can be applied depending on the case to improve luminous brightness or contrast, for example. 、L When an ED package structure is used in white light LED products, using a white adhesive layer can enhance the light reflection effect of the outer peripheral region of the LED chip, effectively improving the brightness of the white light. 、L When the ED package structure is used in RGB-LED direct display products, using a black adhesive layer can reduce light reflection in the peripheral area of ​​the RGB-LED chip, thereby reducing light reflection and effectively improving contrast. When used in monochromatic LED products, the corresponding color system Second light reflection By using layers, the light emitted by the LED chip can be prevented from mixing with other colorless light, thereby ensuring light emission purity.

[0048] In order to more clearly explain the configuration in the embodiments of the present invention, the drawings that need to be used in describing the embodiments will be briefly described below. The drawings in the following description are only a few embodiments of the present invention, and it will be obvious to those skilled in the art that other drawings can be obtained based on these drawings without any creative work. [Brief explanation of the drawing]

[0049]

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[0050] The present invention will be described in more detail below with reference to the drawings and examples in order to further clarify its purpose, structure, and advantages. The specific examples described herein are for interpretation purposes only and do not limit the present invention.

[0051] Furthermore, the terms "installation" and "connection" should be understood in a broad sense; for example, installation and connection may be direct, or indirect installation and connection may be via intermediate parts or structures.

[0052] Furthermore, in the embodiments of the present invention, terms such as "vertical direction," "horizontal direction," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "perpendicular," "horizontal," "top," "bottom," "inside," and "outside" are based on the directions and positional relationships shown in the drawings, as well as the normal arrangement and usage conditions. They are merely for the convenience and simplification of the explanation of the present invention and do not indicate or imply that the shown structure, features, device, or element has a specific direction or positional relationship, nor do they need to be configured and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention. Unless otherwise specified in this specification, "multiple" means two or more.

[0053] Each specific configuration and each embodiment described in the embodiments for carrying out this invention can be combined in any suitable manner, as long as they do not contradict each other. For example, different specific configurations / embodiments may be combined to form different embodiments. To avoid redundancy, various possible combinations of each specific configuration / embodiment in this invention will not be described separately.

[0054] An LED lamp plate according to an embodiment of the present invention includes a substrate and an LED chip, wherein a circuit composite layer is provided on the substrate, the circuit composite layer has pads for connecting to the LED chip, a first light-reflecting layer is provided on the circuit composite layer, a plurality of window-opening structures are provided on the first light-reflecting layer, each of the window-opening structures has at least one pair of pads in a corresponding area, the LED chip is provided within the window-opening structure and connected to the pad in the corresponding window-opening structure, a housing area is formed between the outer periphery of the LED chip and the inner periphery of the window-opening structure, and the LED lamp plate further includes a second light-reflecting layer filled in the housing area, or The circuit composite layer comprises a circuit layer and a window-opening structure provided on the circuit layer. Light reflectionThe LED lamp plate includes a layer and has at least one pair of pads within a region corresponding to each of the windowed structures, the LED chip is provided within the windowed structure and connected to the pad in the corresponding windowed structure, the LED lamp plate further includes a first package adhesive layer, the first package adhesive layer is provided on one side of the substrate and covers the LED chip and the circuit composite layer, the first package adhesive layer allows light emitted by the LED chip to be transmitted, and the LED lamp plate further includes a second package adhesive layer provided on the other side of the substrate to partially or completely offset the stress on the substrate by the first package adhesive layer. Or, The circuit composite layer comprises a circuit layer and a window-opening structure provided on the circuit layer. Light reflection The LED lamp plate includes a layer and has at least one pair of pads in the region corresponding to each of the windowed structures, the LED chip is provided in the windowed structure and connected to the corresponding pad in the windowed structure, the LED chip is located in the windowed structure and connected to the circuit layer, the LED lamp plate further includes a colored adhesive layer, the colored adhesive layer is filled in the windowed structure, and the colored adhesive layer is each the LED chip, the Light reflection Connected to the layer, the color of the colored adhesive layer and the Light reflection The layer color is the same, it is easy to die bond, the luminescence efficiency is high, the manufacturing efficiency is high, and the manufacturing cost is low. The present invention will be further explained below with reference to specific examples.

[0055] Example 1 An LED lamp plate according to an embodiment of the present invention is shown in Figure 7 As shown, the substrate and the LED chip 1 are included, and in this embodiment, the substrate is a glass substrate 6. and A circuit composite layer 3 is provided on the substrate. gas Surface of Lath substrate 6 installed in kicked is. Multiple LED chips 1 are provided, Electrically connected to the circuit composite layer 3, in one embodiment The circuit layer 3 is few no and A pair of pads is, A plurality of LED chips are each connected to a pad. Circuit layer or pad A first light-reflecting layer 4 is provided in layer 3. and The light-reflecting layer 4 is Covered by circuit layer 3 multiple Number window structure 41 has. These Window opening structure 41 is first The hole is located at the position where it penetrates the light-reflecting layer 4. and expose the underlying pads ru. L ED chip 1 is, these Provided within the window opening structure 41 these Window opening structure 41 corresponding to Connected to the pad is. Other in Each of the aforementioned window opening structures 41 is In an array Arranged, each The window opening area of ​​the window opening structure 41 is larger than the projected area of ​​the LED chip 1 onto the glass substrate 6. by doing so On the surface of the glass substrate 6 L This exposes the area where the ED chip 1 needs to be welded, and also makes it easier to place the LED chip 1 inside the window-type structure 41. is. This Window opening structure 41 By this design, the pads can be exposed This avoids being covered by the first light-reflecting layer 4 and facilitates welding the LED chip 1 located within the window-opening structure 41 to the corresponding pad. is. If the gap between the window opening structure 41 and the LED chip 1 is too small, it will be difficult to install. Conversely If the gap is too large, light will leak in. bring about , affects luminous efficiency further This affects the process yield. there is a risk of . Referring to FIG. 7, in this embodiment, the LED lamp plate includes a second light reflection layer 5. The size of the window opening structure 41 is larger than the outer dimensions of the LED chip 1, and a accommodating area 410 is formed between the outer periphery of the LED chip 1 and the inner periphery of the window opening structure 41. This embodiment teeth, filled in the accommodation space It includes a second light-reflecting layer 5, that is The second light-reflecting layer 5 is inside the window opening structure 41 Filled and Located above the circuit layer 3 and on the outer periphery side of the LED chip 1 while doing so, the front Outer edge of LED chip 1 to Closely pressed together and Inner circumference side of window opening structure 41 to Closelyis. The size of the window opening structure 41 is larger than the size of the LED chip 1 so that the LED chip 1 can be easily placed inside the window opening structure 41, resulting in high manufacturing efficiency, low manufacturing costs, and easier assurance of a good die bonding yield. Furthermore, the second light-reflecting layer 5 formed by filling can well fill the housing area 410 in order to avoid light leakage gaps. The LED lamp plate according to the embodiment of the present invention is easy to die bond, has high luminous efficiency, high manufacturing efficiency, and low manufacturing cost.

[0056] Furthermore, the reflectance of the second light-reflecting layer 5 is greater than that of the first light-reflecting layer 4, and the reflectance of the second light-reflecting layer 5 is higher than that of the first light-reflecting layer 4. As a result, more effective light rays are reflected by the second light-reflecting layer 5, which has a higher reflectance, and the luminous efficiency is higher.

[0057] moreover, The height of the light emitting surface of the LED chip 1 is not less than the height of the first light reflection layer 4, but the height of the top surface of the second light reflection layer 5 is Top surface of the first light-reflecting layer 4 less than the height of. The front Thickness of the first light-reflecting layer 4 of The range may be 20 μm to 80 μm. In a specific application, the second light-reflecting layer 5 is filled into the housing region 410 between the LED chip 1 and the first light-reflecting layer 4, that is, filled into the window-opening structure 41, and the top surface of the second light-reflecting layer 5 may be lower than the top surface of the first light-reflecting layer 4, or it may be held flush with the top surface of the first light-reflecting layer 4. is. In this embodiment, the second light-reflecting layer 5 is formed by solidification with colloid, which has a certain degree of fluidity and a good filling effect, thus avoiding defects such as adhesive defects and light-leakage gaps. As shown in FIG. 7 The thickness of the first light-reflecting layer 4 is a. and The thickness of the second light-reflecting layer 5 is c. and To prevent the colloid from overflowing onto the upper surface of the first light-reflecting layer 4, the thickness c of the second light-reflecting layer 5 is set to be less than or equal to the thickness a of the first light-reflecting layer 4. belowTo achieve this, it is necessary to control the amount of adhesive used to form the second light-reflecting layer 5, thereby preventing the colloid of the second light-reflecting layer 5 from overflowing onto the first light-reflecting layer 4 and ensuring consistency in the luminous efficiency of the LED lamp plate. is suitable The possible range for a is 20 μm to 80 μm, preferably 25 μm to 60 μm, and more preferably 50 μm to 60 μm.

[0058] Referring to FIG. 8 Bx indicates the maximum lateral size of the window opening structure, By indicates the maximum vertical size of the window opening structure, Px indicates the lateral pitch between two adjacent LED chips 1, and Py indicates the vertical pitch between two adjacent LED chips 1. and the size of the window opening structure 41 satisfies the relationship of Bx <Px, By <Py. That is, the lateral distance Px between two adjacent LED chips 1 is larger than the lateral width Bx of the window opening structure 41, but the vertical distance Py between two adjacent LED chips 1 is larger than the vertical width By of the window opening structure 41. In one embodiment The aforementioned window opening structure 41 is rectangular is a groove Its maximum size is the length of the rectangle, as shown in Figure 9. adjacent The pitch value between the centers of the two touching LED chips 1 is p. and The lateral center pitch of two adjacent LED chips 1 is Px, the vertical center pitch is Py, the maximum lateral size of the window opening structure 41 is Bx, and the maximum vertical size is By. the size of the window opening structure 41 is Bx <Px、By<Py satisfies the relationship of. Rectangle The length size of the shape is Bx≧2mm, preferably Bx≧3mm. In another embodiment, the window structure 41 may be circular, as shown in Figure 8, in which case its maximum size is its diameter, and the diameter is smaller than both Px and Py. It is possible to ensure that the window area of ​​the window structure 41 is larger than the projected area of ​​the LED chip 1 onto the glass substrate 6, which is advantageous for exposing the area on the surface of the glass substrate 6 where the LED chip 1 needs to be welded, and the LED chip 1 may be located in the center of the window structure 41, and there is no communication between adjacent window structures 41, which is advantageous for production and cost reduction.

[0059] Furthermore, the LED chip 1 is As shown in FIG. 7It may be a flip chip, and there is a gap between the surface of the LED chip 1 facing the glass substrate 6 and the glass substrate 6, and the second light-reflecting layer 5 includes a side light-reflecting portion 51 and a bottom light-reflecting portion 52. aims at The side light reflecting portion 51 is front The bottom light reflecting portion 52 is connected to the outer circumference of the LED chip 1, fills the gap, and is connected to the bottom surface of the LED chip 1.

[0060] front A solder paste layer 7 is provided on the surface of the pad, and the metal solder paste of the solder paste layer 7 is gray in color and absorbs blue light. The LED chip 1 is connected via the solder paste layer 7. Circuit layer or pad 3 It is connected to and forms a gap filled by the bottom light reflecting portion 52 described above. The aforementioned solder paste layer 7 is connected to the LED chip 1, specifically is Then, print the solder paste onto the pad and weld the LED chip 1 to the pad to complete the die bonding. does. The height of the light emitting surface of the LED chip 1 is not less than the height of the first light reflection layer 4. In this embodiment, the height of the first light reflection layer 4 is higher than the top surface of the LED chip 1 and cannot shield the light source, and is lower than the bottom surface of the LED chip 1 and cannot expose the solder paste layer 7 to the outside either. In this embodiment, the LED chip 1 is connected via a solder paste layer 7 (metal solder paste) Circuit layer or pad 3 The metal solder paste is connected and exhibits a gray color, and the bottom light reflecting portion 52 located at the bottom of the LED chip 1 is covered with the metal solder paste layer 7, thereby preventing blue light from being absorbed by the solder paste layer 7.

[0061] front The first light-reflecting layer 4 may be made of white ink. is The second light-reflecting layer 5 is made of silica gel or silicone resin. inside it Light-reflecting particles are dispersed and provided therein may also be In specific applications first The light-reflecting layer 5 of 2 is To further improve the reflectivity of the second light-reflecting layer 5, TiO2 light reflective particles, BaSO4 light reflective particles or a combination of both Includes, In other words Adhesive appropriate A quantity of light-reflecting particles Blend them together.LED lamp plate In the first The light-reflecting layer is made of white ink and white adhesive. from But it's fine, Here, Both white adhesive and white ink can be used as reflective materials. While white ink is low-cost, it has low reflectivity and poor fluidity, making it unsuitable for large-area printing. In this embodiment, the first light-reflecting layer 4 is made of white ink. White adhesive is expensive. ruga , high reflectivity, fluidity often, Local cap dispenser to Used Therefore In this embodiment , the The light-reflecting layer 5 of 2 is created with white adhesive. It is. In this embodiment, The reflectance of the first light-reflecting layer 4 is 、9 3% or less ruga The reflectivity of the second light-reflecting layer 5 is 98% or higher, which solves the problems of difficulty in die bonding, low luminous efficiency, and high cost all at once. do. The LED lamp plate according to the present invention is easy to die bond, simultaneously improves luminous efficiency, is highly efficient, and is low-cost. Therefore, it is easy to die bond, ensures high luminous efficiency, balances cost, offers high operability in actual production, and has high market applicability value.

[0062] Referring to Figures 1 to 9, the embodiment of the present invention further provides a method for manufacturing an LED lamp plate, which includes the following steps for manufacturing the above-mentioned LED lamp plate.

[0063] Step 1: As shown in Figure 1, a substrate is manufactured, and in this embodiment, a glass substrate 6 is used which has good stability and low cost. Selected .

[0064] Step 2: As shown in Figure 2, a circuit layer 3 having pads is provided on the substrate, specifically is, The path layer 3 is printed onto the substrate. It also connects to multiple LED chips 1. .

[0065] Step 3:As shown in Figure 3, the circuit layer 3 is provided with a first light-reflecting layer 4 made of a first light-reflecting material. It is. In this embodiment, the first light-reflecting layer 4 is formed by printing white ink onto the circuit layer 3.

[0066] Step 4: As shown in Figure 4, the first light reflection layer 4 above Multiple window-opening structures 41 are provided, and each window-opening structure 41 has at least one pair of pads within its area. do. specifically teeth In this embodiment, the window structure 41 is formed by an exposure etching process. in array form An array of window-opening structures 41 is provided, and in this embodiment, the window-opening structure 41 is a rectangular groove (Figure 9 In other embodiments (as shown in Figure 8), the window opening structure 4 may also be circular (as shown in Figure 8).

[0067] Step 5: As shown in Figure 5, the LED chip 1 is installed inside the window opening structure 41 and connected to the pad. do. specifically teeth The pads corresponding to the same LED chip 1 are also located within the window-opening structure 41, that is, the LED chips 1 located within the window-opening structure 41 are connected to the corresponding pads, and two or more LED chips 1 may be provided within each window-opening structure 41.

[0068] Step 6: As shown in Figure 6, the second light-reflecting material 5 0 Filled within the aforementioned window opening structure 41 along As shown in Figure 7, the second light-reflecting material 50 is located between the first light-reflecting layer 4 and the LED chip 1, forming the second light-reflecting layer 5. In this embodiment, the reflectance of the second light-reflecting material 50 is greater than the reflectance of the first light-reflecting material. specifically teeth In this embodiment, the second light-reflecting material 50 is a white adhesive.

[0069] An embodiment of the present invention provides an LED lamp plate and a method for manufacturing the same, in which a first light-reflecting layer 4 is provided on the circuit layer 3, a plurality of window-opening structures 41 are provided on the first light-reflecting layer 4, the LED chip 1 is provided in the window-opening structure 41 and connected to a corresponding pad in the window-opening structure 41, a housing region 410 is formed between the outer circumference of the LED chip 1 and the inner circumference of the window-opening structure 41, and a second light-reflecting layer 5 with high reflectivity is filled into the housing region 410, making die bonding easier, manufacturing costs lower, and the reflectivity of the second light-reflecting layer 5 being greater than the reflectivity of the first light-reflecting layer 4 to increase luminous efficiency. The LED lamp plate and method for manufacturing the same according to the present invention not only makes die bonding easier, but also increases luminous efficiency, improves the yield of the manufacturing process, and reduces manufacturing costs.

[0070] Example 2 An LED lamp plate according to an embodiment of the present invention is It further includes multiple reflection patterns. An LED lamp plate according to an embodiment of the present invention is As shown in Figure 10 , base board 6 , circuit layer 3 and multiple LED chips 1 Includes, The circuit layer 3 is provided on the substrate 6, and the LED chip 1 is provided on the circuit layer 3 and is electrically connected to the circuit layer 3. The aforementioned LED The lamp plate further includes a package adhesive layer 130 and multiple reflective patterns 300. nothing. The package adhesive layer 130 is the substrate 6 and the above Multiple LED chips 1 Covered above However The reflective pattern 300 is provided on the upper surface of the package adhesive layer 130, Multiple LED chips 1 The light-emitting surface is directed toward the reflection pattern 300. Buy this. Reflection pattern 300 is at intervals array It includes multiple reflective means 320, each Between the reflective means 320 air Gap 31 0 formed ru. The reflective means 320 is made of resin It consists of, and within Dispersed reflected particles It contains inside. In this embodiment , reflection of the central region of the reflection pattern 300 density of means teeth, So Reflection in the outer region Concentration of means More than degrees High, LED chip 1 Even if some of the light rays emitted from the light-emitting surface are reflected, stomach. As shown in Example 1, in this application, LED The lamp plate is the first light-reflecting layer 4 This further includes, in this embodiment , the 1. Light-reflecting layer 4 is , it is a white adhesive layer, Furthermore, the first light-reflecting layer 4 is distributed in a dispersed manner. light reflective particles Includes That's fine. This first light-reflecting layer 4 teeth ,times road layer 3 LED chips 1 It is provided on one side to which it is connected, and the package adhesive layer 13 0 is the first light-reflecting layer 4 and Multiple LED chips 1 It is covered on top.

[0071] In this embodiment, the reflection pattern 300 includes a reflection means 320 and an air gap 310. The reflective means 320 is , anti The firing range is 320, Used to reflect light rays, Air gap 310 is , Tooru This is the area of ​​oak carving. It is used to provide light rays that can pass through. Referring to Figure 10, LED chip 1 The light rays emitted by it are, Ray 901 reflective means 320 Towards Uga , other parts Ray 902 is in the air gap 310 It was fired directly from there. In response to the characteristic that the LED chip 1 emits strong light in the center and weak light on the outer edge, the reflective means 320 Rays of light 901 is reflection means 320 It is reflected and forms reflected rays, and a portion of the reflected rays is reflected by the light-reflecting layer, LED chip 1 Emitted from the openwork area on the outer perimeter and from the sides. It is. In this example, reflection Means 320 and air gap 310 By adjusting the proportion and distribution of the area, The density of reflective means in the central region of the reflection pattern 300 is greater than the density of reflective means in the outer region, and the LED chip 1 A portion of the light emitted is allowed to pass directly through the openwork area and exit from the surface, while a portion is reflected by the reflective area. Light-emitting surface of LED chip 1 It can effectively adjust the brightness and ensure the luminous efficiency and brightness of the backlight lamp plate. ru. At the same time, the localized reflection effect of reflection pattern 300 causes some of the light rays to be reflected. LED chip 1 Reflect it to the side area, LED chip 1 This increases the light emission angle after passing through the package adhesive layer 130. LED chip 1 The luminous brightness on the outer edge increases, the uniformity of light emission from the lamp plate improves, and the application effect may be better.

[0072] In one embodiment, the LED chip 1 of this application This is a flip mini LED chip, Solder paste layer 7 Circuit layer 3 It may be welded to it. specifically teeth, First light reflection layer 4 teeth, LED chip 1 In the corresponding section Window opening structure 410 A package adhesive layer 130 may be provided, The first light-reflecting layer 4 and the LED chip 1 are located inside the window-opening structure 410. The gap between them may be filled. In one embodiment, The reflective pattern 300 is the package adhesive layer 130 The opposing surfaces that come into contact between the upper package adhesive layer 130 and the LED chip 1. Provided In other examples, The reflective pattern 300 is embedded inside the package adhesive layer 130, that is, the reflective pattern 300 is embedded inside the package adhesive layer 130 of Inside Department sandwiched Include They can be mixed together to form a sandwich structure. stomach. The reflective pattern 300 may be covered by the package adhesive layer 130 to prevent unexpected damage. one In this example, the reflective pattern 300 is screen printed on the package adhesive layer 130. surface It may be formed in a simple and reliable process, allowing for high-precision control of the size and proportion of the openwork, resulting in good product consistency, high production efficiency, and low costs.

[0073] specifically teeth In one of the reflection patterns 300, the area of ​​the air gap 310 (perforated area) accounts for 20% to 80% of the area of ​​the contour of the reflection pattern 300, which is advantageous for ensuring luminous efficiency and uniform light emission. In specific applications, the area of ​​the air gap 310 accounts for 30% to 60% of the area of ​​the contour of the reflection pattern 300, thereby improving the luminous efficiency and brightness of the backlight lamp plate and ensuring uniformity of light emission from the backlight lamp plate.

[0074] In specific applications, the thickness of the reflection pattern 300 may be 10 μm to 60 μm, providing good reflection and low application costs.

[0075] In specific applications, the reflective pattern 300 may consist of a white adhesive, that is, the white adhesive may be screen printed onto the reflective pattern 300 having a perforated area, and the white adhesive may be a white silicone resin.

[0076] Alternatively, the reflective pattern 300 is made of white adhesive. also White silicon tree Fat and The white adhesive may also include light-reflecting particles embedded in it, and the light-reflecting particles may be titanium dioxide light-reflecting particles and / or silica light-reflecting particles in order to improve the light ray reflection efficiency. In this embodiment, the reflection area of ​​the reflection pattern 300 of reflectance teeth, 88% That's all. That is the case.

[0077] In one embodiment, The reflective means 320 is As shown in Figure 10, dot structure Construction, It may include reflective regions exhibiting block-like structures, linear structures, grid structures, or annular structures. Other examples In this case, the reflective means 320 is As shown in Figure 13, Dot-shaped, ring-shaped Condition, The shape may be polygonal, polygonal ring (hollow polygon), linear, wavy, or bent, and the reflective region may be rectangular or rhombic.

[0078] L ED chip 1 Dense reflection region near the center collection The degree is as shown in Figure 10, LED chip 1 The density of the reflection region away from the center collection Larger than degrees, i.e., the reflective region. of center Arrangement of reflective means in the section It is relatively dense ruga outer perimeter region It is relatively sparse. 。

[0079] This allows for effective adjustment of the brightness above the LED chip 1 and reinforcement of the brightness on the outer edge of the LED chip 1, thereby improving the uniformity of the luminous efficiency. .

[0080] L ED chip 1 The density of the openwork area near the center collection The degree is as shown in Figure 11, LED chip 1 The density of the openwork area away from the center collection Smaller than a degree, that is, the air gap is at the center ( LED chip 1 The arrangement may be such that the center (referring to the center of the arrangement) is relatively dense and the outer periphery is relatively sparse. LED chip 1 Effectively adjust the brightness at the top, LED chip 1 This can reinforce the brightness on the outer edge and improve the uniformity of the luminous efficiency.

[0081] Of course, in some embodiments, the air gaps may be provided randomly or uniformly.

[0082] specifically teeth ,before Note L ED chip 1 There are one or at least two, and the reflection region includes a central reflection region and an outer reflection region, each of the LED chip 1 One central reflection region is provided directly above the central reflection region, and the outer reflection region is provided on the outer periphery of the central reflection region, and the reflection region of the central reflection region is dense collection The degree of the reflection area density of the outer peripheral reflection region collection Greater than degrees, LED chip 1 It is advantageous for adjusting the brightness of the upper part, LED chip 1 This can reinforce the brightness on the outer edge and improve the uniformity of the luminous efficiency.

[0083] reflection Pattern 300 A preferred invention is that the reflective means 320 is located at the same center as shown in Figure 13. array It includes a plurality of reflective rings 321, with space between adjacent reflective rings 321 ,workman A gap 310 is formed. Reflective ring 321 Shape This may be a ring-shaped or polygonal ring. The spacing between adjacent reflective rings 321 may be the same. , anti Distance close to the center of the group of firing rings But it's small. , distance from the center It may be better to design it to be larger. Reflective ring 321 The external shape Ring-shaped Therefore, LED chip 1 The light emission from the center is strong. Iga The edges don't glow very brightly. Suitable for the characteristics As such, the radius is large To that extent, Adjacent reflective ring 321 between interval And along with that Grow After being reflected by reflection pattern 300, the distribution of light rays becomes more uniform, and LED chip 1 Adjust the brightness of the top And , reinforcing the brightness on the outer edge and ensuring uniformity of luminous efficiency The price will increase .

[0084] specifically teeth The dashed box indicates 、L ED chip 1 and each of the above LED chip 1 The direction of light emission Upward along Before Reflective ring group 321,322 The reflective ring group is provided and 321,322 The center is the aforementioned LED chip 1 It corresponds to the center, LED chip 1 Brightness to check It can be arranged.

[0085] In one embodiment, A dispersed reflection structure may be provided on the outer circumference of the aforementioned reflection ring. The The structure can be point-like, band-like, or ring-like. It may take on the form of In other words, the dispersed reflection structure may be a reflection point. In specific applications, each of the dispersed reflection structures described herein is uniformly distributed. It is also possible to enhance the brightness on the outer edge of LED chip 1 and further improve the uniformity of luminous efficiency by adjusting the density. As you move away from the center of reflection pattern 300 It is acceptable to gradually reduce it. . In specific applications, the dispersed reflection structure may also have reflection point 322. , Zhou They may be distributed as dots spaced apart in the direction. . anti The firing point 322 is circular or polygonal, etc. the law of nature , one or at least two concentric circles (concentric with the reflection ring 321) ) Distributed at equal intervals along the line You can line up if you like. The radius of the concentric circles is large. As it gets The spacing of the reflection points 322 in the circumferential direction becomes larger. ,same The number of 322 reflex points on the central circle decreases. ru. Reflection pattern 300 effectively adjusts the brightness above the chip. LED Uniformity of light emission from the lamp plate of improvement It is possible .

[0086] In one preferred invention, the air gap may include a group of openwork rings provided at the same center, with spacing between adjacent openwork rings, and the openwork rings may be circular rings or polygonal rings. The spacing between adjacent openwork rings may be equal, or the spacing closer to the center of the group of openwork rings may be larger than the spacing further away from the center of the group of openwork rings. 、L ED chip 1 Adjust the brightness at the top, LED chip 1 This can enhance the brightness on the outer edge and improve the uniformity of the luminous efficiency.

[0087] In another preferred invention, the reflective region includes a band-shaped reflective strip and a reflective point, the reflective point being on the outer circumference of the reflective strip, i.e. 、L Located in the region near the center of ED chip 1, the reflective bands adopt a continuous band-like distribution in the circumferential direction. LED chip 1 In the outer region, the reflection points may be distributed as points spaced apart in the circumferential direction. Each of the above LED chip 1 In this configuration, the reflective strips are provided in correspondence along the direct line immediately in front of the direction of light emission, multiple reflective strips are provided, and each reflective strip is provided at intervals and / or intersecting, and the reflection points exhibit a circular or polygonal shape, LED chip 1 Adjust the brightness at the top, LED chip 1 This can enhance the brightness on the surrounding side and improve the uniformity of the luminous efficiency.

[0088] In specific applications, the reflection points are uniformly distributed, or the area of ​​the reflection points decreases as it moves away from the center of the reflection pattern. LED chip 1 This is advantageous for reinforcing the brightness on the outer edge and can improve the uniformity of luminous efficiency.

[0089] In a specific application, the reflective means 320 includes a plurality of reflection points surrounding the center of the reflection pattern 300.

[0090] In specific applications, the package adhesive layer 130 may be a transparent adhesive layer to avoid loss of light rays.

[0091] specifically teeth The thickness of the package adhesive layer 130 may be 200 μm to 400 μm, and the light rays have a certain reflection distance and space, which is advantageous for improving luminescence efficiency.

[0092] In specific applications, a release slope 131 may be selectively provided on the side wall of the reflective means 320, as shown in Figure 12, in order to facilitate the release of the screen and to improve the product yield.

[0093] In specific applications, the reflection Means 320 may be a plurality of block-shaped reflective blocks. The reflective blocks are the LED chip 1 The area decreases along the direction away from the center, and each of the reflective blocks LED chip 1 The closer it is, the larger its individual surface area is relatively. In other words, the reflective block is As shown in Figure 14, LED chip 1 It includes a central block 327 that is close to the center and an outer perimeter block 328 located on the outer perimeter of the central block 327, The brightness of the upper part of LED chip 1 is effectively adjusted, LED chip 1 The size of the central block 327 is larger than the size of the central block 327 in order to reinforce the brightness of the outer periphery and improve the uniformity of the luminous efficiency. In a specific application, a preferred invention is that the reflective block includes a central block 327 close to the LED chip 1 and an outer peripheral block 328 located on the outer periphery of the central block 327, wherein the reflectivity of the central block 327 is greater than that of the outer peripheral block 328, and titanium dioxide particles may be provided in the central block 327 and silica particles in the outer peripheral block 328. The size of the central block 327 may be greater than or equal to the size of the outer peripheral block 328 in order to effectively adjust the brightness above the LED chip 1, reinforce the brightness on the outer periphery of the LED chip 1, and improve the uniformity of the luminous efficiency.

[0094] In a specific application, the reflectivity of the reflective means 320 in the central region of the reflection pattern 300 is greater than the reflectivity of the reflective means 320 in the outer peripheral region of the reflection pattern 300, as shown in Figures 10, 11, and 14. The reflective means 320 in the central region of the reflection pattern 300 includes titanium dioxide particles, and the reflective means 320 in the outer peripheral region of the reflection pattern 300 includes silica particles. The reflective region LED chip 1 Titanium dioxide particles may be provided in the portion close to the reflection region. LED chip 1 Silica particles may be provided in the portion that is separated from the surface.

[0095] In other embodiments, the LED lamp plate according to the present application may further include a second reflective layer. As shown in Figures 15 and 16, the LED lamp plate according to the present application includes a substrate 6, a circuit layer 3, and a plurality of LED chips 1, wherein the circuit layer 3 is provided on the substrate 6, and the LED chips 1 are provided on the circuit layer 3 and are electrically connected to the circuit layer 3. The LED lamp plate further includes a first reflective layer 131, which further includes a first package adhesive layer 130 and a first reflective pattern 300 provided on the upper surface of the first package adhesive layer 130. The first package adhesive layer 130 covers the substrate 6 and the plurality of LED chips 1. The first reflective pattern 300 includes a plurality of first reflective means 320 arranged at intervals, with air gaps 310 formed between each first reflective means 320. The LED lamp plate further includes a second reflective layer 140 provided on the first reflective layer 131. The second reflective layer 140 includes a transparent second package adhesive layer 142 and a second reflective means 141 for allowing some light rays to pass through, with one side of the second package adhesive layer 142 covering the first reflective layer 131, and the second reflective means 141 provided on the upper surface of the second package adhesive layer 142. ru.

[0096] Between the second reflecting means 141 air gap 143 and reflection means 320 air gap With 310 substrate 6 The projection to overlaps at least partially. ru. Due to two or more layers of reflection LED chip 1 The light beam can be adjusted, which is advantageous for improving the uniformity of light emission. The opposite firing range and First The material and thickness of the reflective pattern 300 may be the same. 。

[0097] figure 15. As shown in Figure 16, A second reflective layer 140 is provided on the first package adhesive layer 130 and the first reflective means 320. It's fine if it's done that way. A reflection pattern is provided on the surface of the second reflection layer 140, in which a plurality of second reflection means 141 are arranged, and the second reflection means 141 of the second reflection layer 140 and the first reflection means 320 are They may be arranged alternately, and some rays may be arranged alternately. Second reflecting means and first reflecting means The light travels back and forth between the 320 and the 320 before being reflected and then emitted, which is advantageous for uniformity of emitted light. Second reflection pattern The composition of 141 is, First Reflection pattern 3 0 Similar to the case described above, it may also include a resin and reflective particles dispersed in the resin.

[0098] In the above examples, the reflection pattern is a single, independent On the adhesive layer of the package It is provided and may be attached to the package adhesive layer, thus providing different reflective patterns. Reflective layer or Optical films can be manufactured in advance and have specific reflection patterns depending on the application effect. Reflective layer or Select an optical film and attach it to the package adhesive layer, and Reflective layer orThe optical film can be replaced, making it flexible and convenient to use, and giving it a wide range of applications. Reflective layer or On the front and back surfaces of the optical film A first reflecting means and a second reflecting means Each of these may be screen printed (i.e., A first reflecting means and a second reflecting means This eliminates the need for two optical films, as one optical film is shared as a carrier. A first reflecting means and a second reflecting means They may be arranged alternately, and the optical film can be directly attached to the package adhesive during use, making it flexible and convenient to use, with a wide range of applications and low cost. cheap .

[0099] This embodiment is, substrate 6 The steps for manufacturing, The aforementioned substrate 6 circuit layer 3 Steps in which this is provided, The circuit layer 3 to multiple LED chip 1 The circuit layer is connected to the circuit layer 3 to First The steps include providing a light-reflecting layer 120, 1 The package adhesive layer 130 is Multiple LED chips 1 and First light-reflecting layer 120 A step of being covered, For allowing some light rays to pass through and reflecting some light rays First The reflection pattern 300 is the above First By being provided in the package adhesive layer 130, First The reflective surface of the reflection pattern 300 is LED chip 1 The present invention further provides a method for manufacturing an LED lamp plate, which includes a step of moving toward the light-emitting surface of the backlight lamp plate. LED chip 1 The light rays emitted by the device are partially directed towards the reflection region, but another portion is emitted directly from the air gap, and the light rays directed towards the reflection region are reflected by the reflection region to form reflected light rays, and a portion of the reflected light rays First Light reflective layer 12 0 Therefore, after reflection, LED chip 1It is emitted from the air gaps and sides on the outer periphery, and after a portion of the reflected light is reflected, LED chip 1 It is fired from the side, LED chip 1 In contrast to the characteristic that the light emission is strong in the center and weak on the outer edge, in this embodiment, First By creating a perforated structure in the reflective pattern 300 and forming air gaps, the proportion and occupancy rate of the air gap area can be adjusted. LED chip 1 It weakens the light intensity in the central region of the surface, LED chip 1 The light intensity in the lateral region may be increased. LED chip 1 Some of the light emitted by passes directly through the air gap and is emitted from the surface, while some is reflected by the reflective region. LED chip 1 of Idemitsu surface This effectively adjusts the brightness, ensuring the luminous efficiency and brightness of the backlight lamp plate, First Reflection pattern 300 and First reflective layer 12 0 Due to its effect, LED chip 1 By increasing the light emission angle, LED chip 1 It improves the luminous brightness on the outer edge, enhances the uniformity of light emission from the light plate, and provides a good application effect.

[0100] specifically teeth , the above First The reflective pattern 300 is created by screen printing. First The cutout may be formed on the surface of the package adhesive layer 130, and the process is simple and reliable, allowing for high-precision control of the cutout size, cutout ratio, etc., resulting in good product consistency, high production efficiency, and low cost.

[0101] An LED lamp plate according to an embodiment of the present invention is a backlight lamp plate, First By providing the reflection pattern 300, LED chip 1 A portion of the light rays emitted by LED chip 1 Through the air gap in front First Light is emitted from the surface of the reflection pattern 300, and a portion of it is reflected in the reflection region to form a reflected ray, and a portion of the reflected ray First Light reflective layer 12 0 Therefore, after reflection, LED chip 1 It is emitted from the air gaps and sides on the outer periphery, and after a portion of the reflected light is reflected... LED chip 1 It is fired from the side, LED chip 1 In response to the characteristic that the light emission is strong in the center and weak on the outer periphery, in this embodiment, a perforated structure is created in the reflection pattern 300 to form air gaps, thereby adjusting the ratio and occupancy rate of the air gap area. LED chip 1 It weakens the light intensity in the central region of the surface, LED chip 1 The light intensity in the lateral region may be increased. LED chip 1 Some of the light emitted by passes directly through the air gap and is emitted from the surface, while some is reflected by the reflective region. LED chip 1 of Secondment This effectively adjusts the brightness, ensuring the luminous efficiency and brightness of the backlight lamp plate, First Reflection pattern 300 and First reflective layer 12 0 Due to its effect, LED chip 1 By increasing the light emission angle, LED chip 1 It improves the luminous brightness on the outer edge, enhances the uniformity of light emission from the light plate, and provides a good application effect.

[0102] Example 3 This invention other As shown in Figures 17 and 18, and referring to Figures 1 to 3, the LED lamp plate according to the embodiment is used in a mini LED backlight display module and a direct display product, and the lamp plate consists of a substrate 6 and a first package adhesive layer. 130 , comprising a circuit composite layer and an LED chip 1, wherein the circuit composite layer comprises a circuit layer 3 and First light reflection layer 4 Includes, First light reflection layer 4 It is provided on the circuit layer 3 and has a window opening structure, First light reflection layer 4 The circuit layer 3 and the first package adhesive layer 130 Provided between and the above First light reflection layer 4 Multiple window-opening structures are provided, the circuit layer 3 is provided on one side of the substrate 6, the circuit layer 3 has pads, the LED chip 1 is connected to the pads, in this embodiment the LED chip 1 is a flip chip, specifically teeth, a flip blue light LED chip or a group of flip RGB LED chips, the substrate 6 is an FR4 wiring board or a glass substrate, the lamp plate further includes a second package adhesive layer 7, and the first package adhesive layer 130 It is provided on one side of the substrate 6 and covers the LED chip 1 and the circuit layer 3, and is the first package adhesive layer 130 The second package adhesive layer 7 is provided on the other side of the substrate 6, and the first package adhesive layer 130 Used to partially or completely offset the stress on the substrate 6 caused by the above. ru. In addition , The first package adhesive layer is applied by a dispenser or direct press. 130 If this is formed, the first package adhesive layer 130 This has stress acting on the substrate 6. Easy As a result, the substrate 6 is easily deformed, and typically, the ends of the substrate 6 warp and the middle section becomes concave, making it easy for the LED chip 1 to peel off. It is. In this embodiment, the first package adhesive layer 130 The first package adhesive layer and the second package adhesive layer 7 are provided on both sides of the substrate 6, respectively. 130 The first package adhesive layer and the second package adhesive layer 7 form a "sandwich" structure with the substrate 6, where the first package adhesive layer 130 The first package adhesive layer has a tensile stress acting on the substrate 6 toward one side of the substrate 6, and the second package adhesive layer 7 has a tensile stress acting on the substrate 6 toward the other side of the substrate 6. As a result, the tensile stress acting on both sides of the substrate 6 are largely canceled out, effectively reducing warping deformation due to stress from the package adhesive layer in the substrate 6 (especially the substrate 6), effectively improving problems such as layering, deformation, and poor airtightness after the lamp freight is sealed, and avoiding the risk of defects such as peeling of the LED chip. 130 Furthermore, the second package adhesive layer 7 and the substrate 6 form a "sandwich" structure, eliminating the need for multiple package adhesive layers, resulting in a simpler manufacturing process and lower costs.

[0103] In a specific application, the first package adhesive layer 130 The projected area of ​​the first package adhesive layer onto the substrate 6 is such that it can cover the substrate 6, i.e., the first package adhesive layer 130 This can completely cover one side of the substrate 6 surface, or the first package adhesive layer 130 The first segment adhesive layer consists of non-contacting segments, and the first package adhesive may be formed on one side of the substrate 6 (specifically, one side of the circuit layer 3 and the top of the LED chip 1) using a dispenser to form a first segment adhesive layer of multiple segments that do not contact each other. In other embodiments, the second package adhesive layer 7 consists of a second segment adhesive layer that does not contact each other, and the second package adhesive may be formed on the other side of the substrate 6 using a dispenser to form a second segment adhesive layer of multiple segments that do not contact each other, thereby canceling out the stress between the substrates 6 located on both sides of the segment adhesive layer and preventing deformation of the substrate 6. As a preferred embodiment, the first package adhesive layer 130 The first layer completely covers one side of the substrate 6, and the second package adhesive layer 7 partially covers the other side of the substrate 6. In this way, other elements may be pre-attached to the back surface of the substrate 6, leaving a space between them.

[0104] In a specific application, the first package adhesive layer 130 The thickness of the second package adhesive layer 7 is greater than the thickness of the second package adhesive layer 7. Thin No. Specifically teeth , the first package adhesive layer located on one side of the substrate 6 130 The first package adhesive layer serves to cover the LED chip 1 and requires a certain thickness. The second package adhesive layer 7, located on the other side of the substrate 6, is an additional thickness, increasing the overall thickness of the product and not meeting the market demand for a thinner LED module. 130 More than the thickness Thin By controlling the process in this way, the entire lamp plate can be made thinner, allowing for miniaturization of the device, which is advantageous in meeting market demands.

[0105] In a specific application, the first package adhesive layer 130 The thickness of the first package adhesive layer is greater than the thickness of the second package adhesive layer 7. 130 The first thermal expansion coefficient is present, and the second package adhesive layer 7 has a second thermal expansion coefficient that is greater than the first thermal expansion coefficient. First package adhesive layer 130 The product of the thickness of the first thermal expansion coefficient is A, and the product of the thickness of the second package adhesive layer 7 and the second thermal expansion coefficient is B, and A is equal to or approximately equal to B. Furthermore, the first package adhesive layer 130 If the thickness of the first package adhesive layer is large and the first coefficient of thermal expansion is small, while the thickness of the second package adhesive layer 7 is small and the first coefficient of thermal expansion is large, the stresses acting on both sides of the substrate 6 can be balanced and canceled out, and the first package adhesive layer 130 The second package adhesive layer 7 has a certain thickness and serves to cover the LED chip, and the thickness of the second package adhesive layer 7 is relatively small, making the lamp plate thinner. Suitable In another embodiment, the first package adhesive layer 130 The thickness of the first package adhesive layer is equal to the thickness of the second package adhesive layer 7. 130 The first thermal expansion coefficient is present, and the second package adhesive layer 7 has the same second thermal expansion coefficient as the first thermal expansion coefficient. In specific applications, the most important parameters for the magnitude of the stress that the package adhesive layer exerts on the substrate 6 are the thickness of the package adhesive layer and its coefficient of thermal expansion. In specific applications, a package adhesive material with a different coefficient of thermal expansion can be selected depending on the thickness of the package adhesive layer, allowing for flexible control and tending to cancel out the stress acting on both sides of the substrate 6, thus making the overall product thinner.

[0106] Furthermore, the first package adhesive layer 130And the materials of the second package adhesive layer 7 are the same, both being epoxy resin or silicone resin, which is advantageous for cost reduction. In other embodiments, the first package adhesive layer 130 and the materials of the second package adhesive layer 7 may be different. The first package adhesive layer 130 is provided with inorganic light-transmitting particles 5 dispersed therein for adjusting its coefficient of thermal expansion. By adding inorganic light-transmitting particles to the package adhesive, the coefficient of thermal expansion of the package adhesive layer can be adjusted, which is convenient and has a low cost. Due to the sedimentation of the inorganic light-transmitting particles 5 in the first package adhesive layer 130 the content of the inorganic light-transmitting particles 5 gradually decreases along the direction away from the substrate. That is, the added inorganic light-transmitting particles 5 naturally sediment in the first package adhesive, and the coefficient of thermal expansion is smaller in the region closer to the substrate 6, effectively reducing the deformation of the substrate 6. The particle size range of the inorganic light-transmitting particles 5 is 50 nm to 5 μm. Since the inorganic light-transmitting particles 5 can transmit light, it is advantageous for ensuring the light emission of the LED chip. In this embodiment, the inorganic light-transmitting particles 5 are silica powder or alumina powder, or a mixture of silica powder and alumina powder is used, and the inorganic light-transmitting particles 5 are added to the first package adhesive layer 130 In this embodiment, preferably, the particle size range of the inorganic light-transmitting particles 5 is 100 nm to 1 μm, and silica is the main component of glass, alumina is the main component of sapphire. Both silica powder and alumina powder are light-transmitting particles. The proportion of silica powder or alumina powder in the first package adhesive layer 130 is from 20% to 60%. By controlling the standing time before the first package adhesive is cured, the silica powder or alumina powder naturally sediments in the first package adhesive, showing a step distribution, and the content is higher in the region closer to the substrate 6. That is, the coefficient of thermal expansion is smaller in the region closer to the substrate 6, further reducing the deformation of the substrate 6. ​Alternatively, the projected area of the package adhesive layer located on the other side of the substrate 6 onto the substrate 6 can be flexibly adjusted. Due to cost factors, it does not necessarily completely cover the other side of the substrate 6. Using light-transmissive particles does not affect the light emission of the LED chip 1, and the coefficient of thermal expansion is adjusted, with good adjustment effect and low cost.

[0107] As a preferred embodiment, the thickness 130 of the first package adhesive layer of ranges from 150 μm to 400 μm, and / or the thickness of of the second package adhesive layer 7 ranges from 20 μm to 200 μm. In a specific application, the thickness of the first package adhesive layer 130 is not less than the thickness of the second package adhesive layer 7, and the thickness 130 of the first package adhesive layer of preferably ranges from 250 μm to 300 μm. The first package adhesive layer 130 may be made of epoxy resin or silicone resin, and the second package adhesive layer 7 may also be made of either epoxy resin or silicone resin.

[0108] Furthermore, as shown in FIGS. 17 and 18, at least one pair of the pads are provided in the region corresponding to each of the window-opening structures, the LED chip 1 is provided in the window-opening structure and connected to the pads in the corresponding window-opening structure, and the first package adhesive layer 130 is in direct contact with the substrate through the window-opening structure. Specifically teeth the first package adhesive layer 130The package includes an external package adhesive layer located on the outer periphery of the LED chip 1 and a bottom package adhesive layer located in the windowed structure. The bottom package adhesive layer is formed by filling the windowed structure with the first package adhesive and is directly connected to the substrate 6. This not only facilitates die bonding but also improves luminous efficiency, is advantageous for improving backlight brightness, improves the yield of the manufacturing process, and lowers manufacturing costs.

[0109] Examples of the present invention include: A step of manufacturing a substrate 6 which may be an FR4 wiring board or a glass substrate, The substrate 6 is provided with a circuit layer 3 having pads, and in a specific application, further above the circuit layer 3 First light reflection layer 4 A pad is provided, and in other areas of the circuit layer other than the pad First light reflection layer 4 By providing this, it has an insulating oxidation prevention effect, First light reflection layer 4 This is generally done using ink, and when applied to backlit products, it is done using white ink, and when applied to direct display products, it is done using black ink. The present invention further provides a method for manufacturing an LED lamp plate, which includes the step of connecting an LED chip 1 to the pad, and in a specific application, a solder paste layer 2 may be provided on the pad to facilitate soldering.

[0110] As shown in Figure 17, a first package adhesive layer covers the LED chip 1 and the circuit layer 3 on one side of the substrate 6. 130 This is formed by the first package adhesive, specifically teeth Then, the first package adhesive is applied to one side of the substrate 6 by a dispenser or direct press method and cured and molded to form the first package adhesive layer 4.

[0111] As shown in Figure 18, a second package adhesive layer 7 is provided on the other side of the substrate 6 using a second package adhesive, specifically teethThe second package adhesive is applied to the other side of the substrate 6 by a dispenser or direct press method and cured, forming the second package adhesive layer 7, and the first package adhesive layer 130 By forming a "sandwich" structure with the substrate 6 using the second package adhesive layer 7, the tensile stress acting on both sides of the substrate 6 is largely canceled out, effectively reducing warping deformation due to stress from the package adhesive layer in the substrate 6 (especially the substrate 6), effectively improving problems such as layering, deformation, and poor airtightness after the lamp plate is sealed, and avoiding the risk of defects such as peeling of the LED chip.

[0112] An LED lamp plate and a method for manufacturing the same according to an embodiment of the present invention, the first package adhesive layer 130 The first package adhesive layer is provided on one side of the substrate 6 and covers the LED chip 1 and the circuit layer 3, and the second package adhesive layer 7 is provided on the other side of the substrate 6 and covers the first package adhesive layer 130 By forming a "sandwich" structure with the substrate 6 using the second package adhesive layer 7, the stresses acting on both sides of the substrate 6 are largely canceled out, effectively reducing problems such as warping deformation of the substrate 6 due to stress, effectively improving layering, deformation, and airtightness after the lamp plate is sealed, avoiding the risk of defects such as peeling of LED chips, and resulting in lower production costs.

[0113] Example 4 As shown in Figures 20 to 23, the LED lamp plate according to an embodiment of the present invention is made of a substrate 6 , circuit composite layer 3 LED chip 1 and Second light reflection Including layer 5, the circuit composite layer 3 The substrate 6 top It is set up in Circuit layer 2 and , with at least one window opening structure Includes a first light-reflecting layer 4 , the above First light reflection layer 4 It is provided in the circuit layer 2. It is. specifically teeth , the above First light reflection layer 4 It is located on the top and outer periphery of the circuit layer 2, and at least a portion of it covers the outer edge of the circuit layer 2. It is.The above LED chip 1 is located within the above window-opening structure and is connected to the circuit layer 2. In a specific application, the above LED chip 1 may be provided in plurality, and a plurality of window-opening structures may be provided corresponding to the above First light reflection layer 4 . One of the above LED chips is provided within each window-opening structure 1 . The above Second light reflection layer 5 is It is a colored adhesive layer, and the first light-reflecting layer 4 filled within the above window-opening structure, and the above Second light reflection layer 5, as shown in FIG. 20, is respectively connected to the above LED chip 1 , the above First light reflection layer 4 . Specifically teeth , the above Second light reflection layer 5 may be connected to the outer peripheral side of the above LED chip 1 . The side surface of the above Second light reflection layer 5 may be connected to the above First light reflection layer 4 as well stomach. Or, In another embodiment, the above Second light reflection layer 5, as shown in FIG. 21, has a part covering the top of the above First light reflection layer 4 . The color of the above Second light reflection layer 5 is the same as the color of the above First light reflection layer 4 . Specifically[[ID=4l]] teeth , in one embodiment, when the above LED lamp plate is used for a white light LED product, the above Second light reflection layer 5 is a white adhesive layer. By providing the white adhesive layer in the window-opening structure, the circuit layer 2 on the outer periphery of the LED chip 1 can be partially covered. When the LED chip 1 emits light, by providing a white adhesive layer on the outer periphery of the LED chip 1 , the reflectivity of the outer peripheral region of the above LED chip 1 is improved, and by enhancing the light reflection effect, the luminous brightness of the white light LED product is improved. There is no need to change the size of the lamp beads and the size of the LED chip 1 . There is also no need to improve the luminous efficiency of the chip. The brightness of the white LED can be effectively improved, the improvement effect is good, and the cost is low. In another embodiment of the present invention, the LED lamp plate is used in an RGB-LE direct display product, First light reflection The layers ,black It is a colored adhesive layer, and the blackness of the black adhesive layer can be adjusted, and the blackness is First light reflection Ensure that the black layer matches well with the RGB-LED chip. 1 The light reflection in the outer peripheral region is reduced, and the contrast is effectively improved. In other embodiments, the LED lamp plate is used in a monochromatic LED product. Second light reflection Layer 5 is, First light reflection The colored adhesive layer corresponds to the color of the layer, and for example, the LED lamp plate may be a red light LED product. Second light reflection layer This is a red adhesive layer, which is not mixed with other colors and ensures light emission purity. Of course, the LED lamp plate may also be other monochromatic LED products such as blue or green. Second light reflection layer These should be provided in accordance with the blue adhesive layer and the green adhesive layer. The LED lamp plate according to an embodiment of the present invention is an LED chip 1 The top part is the circuit board 6 Exposed from, the above First light reflection layer 4 Same color Second light reflection Layer 5 is the substrate 6 It can completely cover the remaining area, i.e. Second light reflection In addition to layer 5 being provided in a window-opening structure, LED chip 1 It can also cover the outer peripheral region, effectively improving the color consistency of the sealed substrate surface, and depending on the case, different colored colloids can be applied to improve luminous brightness or contrast. In specific applications, when used in white light LED products, using a white adhesive layer will improve the LED chip 1 When used in RGB-LED direct display products, the use of a black adhesive layer reduces light reflection in the outer region of the RGB-LED chip, thereby reducing light reflection and effectively improving contrast. When used in monocolor LED products, the corresponding color system Second light reflectionUsing layer 5, the LED chip 1 This prevents other colors from mixing with the light emitted, thereby ensuring the purity of the emitted light.

[0114] Furthermore, the aforementioned Second light reflection The upper end of layer 5 and the above First light reflection layer 4 The upper end of each is the LED chip 1 Lower than the upper edge of the LED chip 1 The top is exposed, and the outer edge has LED chips. 1 A sufficiently large light-emitting region is formed to reflect the light, Second light reflection Layer 5 is the aforementioned First light reflection layer 4 Higher than the height of the aforementioned Second light reflection The height of layer 5 is the height of the LED chip 1 Lower than the height of the above, that is, the above Second light reflection The top of layer 5 is the aforementioned First light reflection layer 4 The top surface and the LED chip 1 It may be located between the top surface and the vertex.

[0115] Furthermore, the aforementioned First light reflection layer 4 thickness of The range is 20 μm to 50 μm, and in this embodiment, First light reflection layer 4 The thickness is 30 μm, and in specific applications, First light reflection layer 4 The window structure may also be formed simultaneously (by the etching process). First light reflection layer 4 It is formed by curing with solder-resist ink.

[0116] Furthermore, the LED lamp plate is the First light reflection layer 4 The top and the aforementioned Second light reflection The LED chip is located at the top of layer 5. 1 The package adhesive layer 6 further comprises the LED chip, and more specifically, the package adhesive layer 6 comprises the LED chip 1 The LED chip is covered with 1 The package adhesive layer 6 is covered with a conductor (gold wire) for connecting to the circuit layer 2, and the package adhesive layer 6 may be a transparent adhesive layer, and the transparent adhesive layer is formed by packaging with a transparent adhesive. In embodiments of the present invention, the lamp beads of a display can improve the brightness of the product under conditions where a transparent adhesive is sealed, or the visual effect of the lamp beads can be made completely black under conditions where a transparent adhesive is sealed, thereby significantly improving contrast.

[0117] Furthermore, the aforementioned Second light reflection The material of layer 5 is the same as the material of the package adhesive layer 6, which avoids gaps or repulsion due to material differences in the contact area, and allows the connection to be tighter. Second light reflection Layer 5 and the package adhesive layer 6 may both be made of epoxy resin, or in another embodiment, they may both be made of silica gel, which is low cost and has good stability.

[0118] Furthermore, the aforementioned Second light reflection Layer 5 is made of a colored ink or colored colloid with a viscosity of less than 2000 mPa·S. Specifically teeth , the above Second light reflection Layer 5 is formed by solidification with a colored colloid, and the viscosity of the colored colloid is important as it affects its fluidity, and the LED chip 1 Toner (i.e., colored colloid) is sprayed onto the surrounding functional area (i.e., windowed structure), the viscosity range of the toner is 0 to 2000 mPa·s, the colored colloid spreads uniformly and evenly on the bottom surface of the lamp beads due to the liquid surface tension and capillary action of the colored colloid, and by controlling the amount of colored colloid used, after the colored colloid hardens, the substrate 6 LED chip at the bottom of the PCB substrate (in this embodiment) 1 The entire functional region, excluding the specified area, is covered with colored colloids, and the color of the functional region changes according to the color of the colored colloids.

[0119] Furthermore, the window opening structure or the inner wall of the circuit layer has a rounded or chamfered structure, as shown in Figures 23 and 24. Specifically, in this embodiment, the lower and upper ends of the inner wall of the window opening structure have a rounded structure 7, and the rounded structure 7 may be replaced with a chamfered structure. Second light reflectionThe combination of layer 5 and the inner wall of the windowed structure is improved, and the generation of air bubbles and cavities can be avoided. The inner wall of the circuit layer 3 may have a curved structure 8. Specifically, the inner wall of the windowed structure may have a curved surface, a slope, or a rough surface. The lower and upper ends of the inner wall of the windowed structure extend in opposite directions and are filled with colored colloid. Second light reflection Ensure that there is no gap at the joint surface between layer 5 and the inner wall of the window opening structure. The aforementioned window opening structure is multiple, and one or more of the LED chips 1 The LED lamp plate is either face-up or flip-chip and is fixed within each of the windowed structures, and the LED lamp plate may be applied to conventional lamp beads or to mini COB products.

[0120] Examples of the present invention include: PCB substrate 6 The steps for manufacturing, The aforementioned substrate 6 The step of providing circuit layer 2, The aforementioned substrate 6 It has a window opening structure First light reflection layer 4 A window opening structure may be formed by an etching process, and the above First light reflection layer 4 It is located on the outer periphery of the circuit layer 2 and covers at least partially the outer edge of the circuit layer 2, and in a specific application, First light reflection layer 4 The window opening structure may be formed synchronously, and more specifically, the First light reflection layer 4 thickness of The range is a step of 20 μm to 50 μm, LED chip 1 The LED chip is provided within the window opening structure. 1 The LED chip is connected to the circuit layer 2, and in a specific application, the LED chip is connected by a conductor (gold wire). 1 The step of realizing the connection with circuit layer 2 is also possible. The aforementioned First light reflection layer 4 Fill the windowed structure with a colored colloid or colored ink of the same color. Second light reflection Forming layer 5, Second light reflectionLayer 5 consists of the LED chips 1 , the above First light reflection layer 4 It is connected to the above, and in this embodiment, Second light reflection Layer 5 is the LED chip 1 It may be connected to the outer circumference, and in one embodiment, Second light reflection The side surface of layer 5 is as described above. First light reflection layer 4 Connected to, or in other embodiments, the Second light reflection Layer 5 is partially the same as above First light reflection layer 4 A step which may be covered on the top, Further, a manufacturing method for producing the above-mentioned LED lamp plate is provided.

[0121] The LED lamp plate and its manufacturing method according to embodiments of the present invention are LED chip 1 is the circuit board 6 Exposed from, the above First light reflection layer 4 Same color Second light reflection Each of the layers 5 is the LED chip 1 , the above First light reflection layer 4 In addition to being connected, Second light reflection Layer 5 is the substrate 6 It can completely cover the remaining area, i.e. Second light reflection Layer 5 can be filled into the windowed structure and can also cover the outer peripheral region of the LED chip 4, effectively improving the color consistency of the sealed substrate surface, and different colored colloids can be applied depending on the case to improve luminous brightness or contrast, and when the LED package structure is used in a white light LED product, using a white adhesive layer will improve the LED chip 1 The light reflection effect in the outer peripheral region can be enhanced, effectively improving the brightness of white light. When the LED package structure is used in an RGB-LED direct display product, using a black adhesive layer can reduce light reflection in the outer peripheral region of the RGB-LED chip, thereby reducing the light reflection effect and effectively improving contrast. When used in a monochromatic LED product, the color system corresponding to the color of the solder resist layer can be used. Second light reflection Using layer 5, the LED chip 1 The light emitted by this device prevents mixing with other colorless light, thereby ensuring light purity.

[0122] The foregoing are merely preferred embodiments of the present invention and do not limit it. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should all be included within the scope of the present invention.

Claims

1. circuit board and Multiple LED chips, An LED lamp plate comprising a circuit composite layer provided on the substrate, The circuit composite layer includes a circuit layer and a first light-reflecting layer having a plurality of window structures. The first light-reflecting layer is provided on the circuit layer, and each of the LED chips is provided within a plurality of window-opening structures and electrically connected to the circuit layer. An LED lamp plate characterized in that the second light-reflecting layer is filled within the window-opening structure, surrounds the outer periphery of the plurality of LED chips, covers the circuit composite layer, is connected to the first light-reflecting layer, and the height of the top surface of the second light-reflecting layer is not higher than the height of the top surface of the first light-reflecting layer.

2. The LED lamp plate according to claim 1, characterized in that the second light-reflecting layer includes light-reflecting particles.

3. The LED lamp plate according to claim 1, characterized in that the plurality of LED chips are flip chips.

4. The LED lamp plate according to claim 3, characterized in that a solder paste layer for connecting to the LED chip is provided on the surface of the circuit composite layer.

5. The LED lamp plate according to claim 1, further comprising the first light-reflecting layer, the second light-reflecting layer, and a package adhesive layer disposed on a plurality of LED chips.

6. The LED lamp plate according to claim 2, characterized in that the reflectance of the second light-reflecting layer is greater than the reflectance of the first light-reflecting layer.

7. The LED lamp plate according to claim 2, characterized in that the first light-reflecting layer is made of white ink.

8. The LED lamp plate according to claim 2, characterized in that the thickness range of the first light-reflecting layer is 20 μm to 80 μm.

9. The size of the aforementioned window opening structure is, Satisfying the relationships Bx < Px and By < Py, However, Bx indicates the maximum size of the window opening structure in the lateral direction. By indicates the maximum size of the window opening structure in the vertical direction. Px indicates the lateral pitch between two adjacent LED chips. The LED lamp plate according to claim 2, characterized in that P indicates the vertical pitch between two adjacent LED chips.

10. The LED lamp plate according to claim 3, characterized in that the window opening structure is a rectangular through hole, and the longitudinal size of the rectangular through hole is 2 mm or more.

11. An LED lamp plate comprising a substrate and a plurality of LED chips, The substrate and the plurality of LED chips are provided with a circuit composite layer including pads for connecting to the plurality of LED chips, The package adhesive layer covers the substrate and the LED chip, and has a plurality of reflective patterns on its upper surface, The aforementioned reflection pattern includes a plurality of reflective means provided at intervals, An LED lamp plate characterized in that the central region of the reflection pattern is provided such that the density of the reflection means is greater than the density of the reflection means in the outer peripheral region of the reflection pattern.

12. The reflection pattern includes the reflection means and the air gap between the reflection means, The area of ​​the air gap accounts for 20% to 80% of the area of ​​the reflection pattern, and The LED lamp plate according to claim 11, characterized in that the thickness of the reflection pattern is 10 μm to 60 μm.

13. The LED lamp plate according to claim 11, characterized in that the reflective means includes a reflective ring located in the central region of the reflective pattern.

14. The LED lamp plate according to claim 13, characterized in that the reflective means includes a plurality of reflective rings provided at the same center, with spacing between adjacent reflective rings.

15. The LED lamp plate according to claim 14, characterized in that reflection points are provided on the outer circumference of the reflection ring, and the density of the distribution of each reflection point decreases as it moves away from the center of the reflection pattern.

16. The LED lamp plate according to claim 11, characterized in that the reflective means includes a plurality of reflective points surrounding the center of the reflective pattern, and the area of ​​the reflective points decreases as they move away from the center of the reflective pattern.

17. The LED lamp plate according to claim 11, characterized in that the reflectance of the reflective means in the central region of the reflection pattern is greater than the reflectance of the reflective means in the outer peripheral region of the reflection pattern.

18. The LED lamp plate according to claim 11, characterized in that the reflective means in the central region of the reflection pattern includes titanium dioxide particles, and the reflective means in the outer peripheral region of the reflection pattern includes silica particles.

19. The LED lamp plate according to claim 11, characterized in that the reflective pattern is formed by screen printing and a release slope is provided on the side wall of the reflective means.

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