Wiring board and method for manufacturing a wiring board
The wiring board with a transparent substrate and optimized mesh wiring layer addresses the challenge of limited antenna design in miniaturized devices by enhancing transparency and reducing transmission loss, ensuring effective radio wave sensitivity.
JP7875516B2Active Publication Date: 2026-06-18DAI NIPPON PRINTING CO LTD
Patent Information
- Application Number
- JP2025065227
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-05-01
- Filing Date
- 2025-04-10
- Publication Date
- 2026-06-18
- Estimated Expiration
- 2041-04-28
Smart Images
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Abstract
To provide a wiring board and a method for manufacturing the wiring board that suppresses the difficulty of current flow in a mesh wiring layer.SOLUTION: A wiring board (10) has a substrate (11) and a mesh wiring layer (20) that is disposed on the substrate (11) and includes a plurality of wires (21, 22). The substrate (11) has a transmittance of 85% or more for light rays of wavelengths from 400 nm to 700 nm. The wiring (21, 22) includes a surface roughness Ra, and the surface roughness Ra is equal to or less than 100 nm.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
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