Wiring board and method for manufacturing a wiring board

The wiring board with a transparent substrate and optimized mesh wiring layer addresses the challenge of limited antenna design in miniaturized devices by enhancing transparency and reducing transmission loss, ensuring effective radio wave sensitivity.

JP7875516B2Active Publication Date: 2026-06-18DAI NIPPON PRINTING CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DAI NIPPON PRINTING CO LTD
Filing Date
2025-04-10
Publication Date
2026-06-18

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Abstract

To provide a wiring board and a method for manufacturing the wiring board that suppresses the difficulty of current flow in a mesh wiring layer.SOLUTION: A wiring board (10) has a substrate (11) and a mesh wiring layer (20) that is disposed on the substrate (11) and includes a plurality of wires (21, 22). The substrate (11) has a transmittance of 85% or more for light rays of wavelengths from 400 nm to 700 nm. The wiring (21, 22) includes a surface roughness Ra, and the surface roughness Ra is equal to or less than 100 nm.SELECTED DRAWING: Figure 2
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