A device for cooling data center computer servers using phase change materials.

Abstract

The present invention relates to an apparatus (1) for cooling at least a server of a data center computer, the apparatus (1) comprising a phase change material (5) configured for exchanging heat with at least one component of the server and at least one heat exchanger (7) connected to a heat transfer fluid circuit (3). The apparatus (1) is configured, on the one hand, to cool the at least one component of the server by storing heat generated by the component in the phase change material (5), and, on the other hand, to release the heat stored in the phase change material (5) via the heat exchanger (7).

Description

Technical Field

[0001] The present invention relates to the field of servers in data centers, and particularly to the thermal management of the servers, especially cooling the servers by using phase change materials.

Background Art

[0002] A data center is typically a building or a space within a building designed to house computer systems and related components such as communication systems and storage systems.

[0003] Due to the operation of computer systems being technically, scientifically, and / or commercially important, data centers typically have redundant or backup components and infrastructure for power, data communication connections, environmental control (e.g., air conditioning, fire suppression, etc.), and various security devices.

[0004] Furthermore, data centers need to operate 24 hours a day, 365 days a year. Therefore, the operation of data centers involves a huge amount of electrical energy and / or thermal energy consumption. "Thermal energy consumption" means that, for example, energy needs to be used to adjust the temperature of computer servers and / or data centers, such as cooling the air flowing into the computer servers by an air conditioning system powered by electricity. This temperature adjustment is essential to ensure the functionality of data centers and their components regardless of the country, air temperature, or tropical region.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Therefore, air conditioning systems are typically configured to cool the surrounding air and circulate it within the server (generally from the front to the back of the server) to cool the components inside the server. Furthermore, to facilitate air circulation within the server, ventilation means are usually located at the rear of the server. However, these ventilation means incur significant power consumption and maintenance costs (malfunctions, filter replacement, etc.).

[0006] Furthermore, it is known that intermittent renewable power sources, such as solar panels and wind turbines, are typically used in combination with battery power storage. However, such battery-based power storage solutions are costly and can pose electrical and fire hazards to high-power equipment.

[0007] Therefore, given the ever-increasing number of data centers in use, finding solutions to reduce power consumption, carbon emissions, and / or operating costs while keeping the servers in these data centers running at their best possible level has become a pressing issue.

[0008] Therefore, the present invention proposes to solve at least one of the above-mentioned problems by a cooling solution using a phase change material (PCM) that is advantageously associated with a renewable power source. [Means for solving the problem]

[0009] Therefore, the present invention relates to at least a device for cooling a server of a data center computer, the device comprising the following: The device is A phase change material configured to exchange heat with at least one component of the server, A heat exchanger connected to a heat transfer fluid circuit, Equipped with, The device is On the one hand, by storing the heat generated by the components in a phase-change material, at least one component of the server is cooled. On the other hand, heat stored in the phase change material is released through a heat exchanger. It is structured in this way.

[0010] Therefore, the cooling device allows for easy and rapid management of heat within the server components by storing the thermal energy generated by the server components in a phase-change material, and enables, for example, management of the delay of the thermal energy stored in the phase-change material during a period when thermal management is more environmentally friendly and / or less expensive.

[0011] Advantageously, the phase change material is configured to directly exchange heat with at least one component of the computer server, meaning that heat transfer from the server component to the phase change material for cooling occurs primarily by conduction. The phase change material can be in direct contact with at least one component, or it can be in contact via one or more intermediate thermally conductive items (e.g., heat exchangers, thermal pastes, flanges, etc.).

[0012] It should also be noted that the phase change material can indirectly exchange heat with at least one component of the server. "Indirect heat exchange" means that the heat exchange between the component and the phase change material takes place via a fluid such as a gas (e.g., air) or a liquid (e.g., water).

[0013] The cooling device is advantageous if it is configured to cool a computer server rack. Note that each rack typically contains storage components (or hard disks) and at least one hub and / or network switch. Associating each rack with a cooling device according to the present invention makes it possible to optimize and customize the thermal management of the rack components, thereby extending the lifespan of the components and minimizing the power consumption for cooling the computer server rack and its components.

[0014] According to possible features, the apparatus comprises at least one renewable electrical energy source, such as a solar panel or a wind turbine, configured to supply power to components of the apparatus, such as a heat transfer fluid circuit and its sub-components.

[0015] According to possible features, the device includes an electronic monitoring unit configured to monitor the release of heat stored in the phase-change material, for example, the release being a function of the available power supply and / or energy price from a renewable electrical energy source.

[0016] It should be noted that, advantageously, the heat release monitored by the electronic monitoring unit is delayed. This means that the moment when the phase change material stores heat and the moment when this heat is released or stored are different and independent moments. For example, the release becomes a function of the power supply from a renewable electrical energy source and / or the energy price, which makes it possible to cool the server in a more environmentally friendly and / or cheaper way.

[0017] Therefore, the present invention makes it possible to delay the use of energy for cooling the phase change material to the most appropriate moment. This allows the phase change material to be cooled and the refrigerator to store energy when electricity rates are favorable, such as at night, and then the stored energy in the refrigerator to reduce, or at least reduce, electricity consumption during the day (when electricity rates are generally high).

[0018] According to another possible characteristic, the heat transfer fluid circuit is thermally coupled to a “heat pump” type circuit or cooling system. Advantageously, the heat transfer fluid circuit is configured to connect to a heat sink, which allows heat stored in the phase-change material to be released. A “heat pump” type circuit or cooling system is generally a system that requires electricity to operate.

[0019] According to a first possible embodiment of the present invention, the apparatus includes a ventilation unit configured to circulate an airflow through the server to the phase change material.

[0020] Advantageously, the ventilation unit is installed to draw air from the server. To draw air from the server, especially during maintenance operations, it is advantageous to keep the front of the server easily accessible for various operations, while leaving the rear of the server open for the ventilation unit to be installed. Furthermore, the ventilation unit is advantageously equipped with at least one fan motor assembly and a battery.

[0021] According to a possible feature of the first mode, the airflow from the ventilation unit is directed to at least one cooling unit comprising the heat exchanger and the phase change material. For example, these cooling units are substantially columnar. The airflow cooled as it flows through the column of the cooling unit is then discharged into the air surrounding the building and / or server room, or directed (directly) to the air inlets of the servers of at least one computer.

[0022] According to another possible feature of the first mode, the heat exchanger of the cooling unit comprises the following: The heat exchanger of the cooling unit is The first structure is designed in which the conduit is for the heat transfer fluid of the heat transfer fluid circuit, A second structure is located around the first structure and is configured to cool the airflow from the ventilation unit (by heat transfer to the phase change material), comprising The first and second structures are configured such that there is a gap between the structures that define the housing in which the phase change material is disposed.

[0023] According to another possible feature of the first mode, the air flow from the ventilation unit is directed downward through the cooling unit. The air flow heated by the server then passes through the cooling unit, for example, through the columns of the unit along its length, facilitating heat transfer from the air flow to the phase change material.

[0024] According to another possible feature of the first mode, the heat transfer fluid circuit is configured such that the heat transfer fluid flows upward through the heat exchanger. Advantageously, the phase change material is re-solidified first at the level of the material disposed at the bottom of the cooling unit.

[0025] According to another possible feature of the first mode, the ventilation rate of the ventilation unit is configured such that the temperature of the air of the server and / or the components of the server (measured by a sensor at an appropriate location) is substantially stabilized.

[0026] According to a second possible embodiment of the present invention, the apparatus comprises a heat conducting member that couples at least one of the components of the server to the phase change material. The heat conducting member is, for example, a structure that is in thermal contact with the component that needs to be cooled via a heat conducting paste. For example, the heat conducting member is made of a material with excellent thermal conductivity, such as a metal like copper or aluminum.

[0027] According to another possible feature of the second mode, the heat conducting member further comprises a Peltier thermoelectric module. The Peltier thermoelectric module can accelerate the temperature drop of the component, improve, and in some cases force, heat transfer to the phase change material.

[0028] According to another possible feature of the second mode, the phase change material is housed within the heat exchanger connected to the heat transfer fluid circuit.

[0029] According to another possible feature of the second mode, the heat exchanger comprises the following: A heat exchanger is The first structure is designed in which the conduit is for the heat transfer fluid of the heat transfer fluid circuit, A second structure is located around the first structure, in contact with at least one component of the server, and configured to cool at least one component of the server (by heat transfer to a phase change material), Equipped with, The first structure and the second structure are configured such that there is a gap between the structures that define the housing in which the phase change material is placed.

[0030] According to another possible feature, the device comprises a heat transfer fluid circuit including at least a pump and a heat exchanger associated with a refrigerant fluid circuit, and is configured to operate, for example, in a "heat pump" mode.

[0031] According to another possible feature, the apparatus comprises at least two temperature sensors from the following list, namely, a temperature sensor for airflow at the server outlet, a temperature sensor for airflow at the cooling unit inlet, a temperature sensor for airflow at the cooling unit outlet, a temperature sensor for the phase change material, and a measuring device for the latent heat load rate (solidification) of the phase change material, such as a temperature sensor and / or pressure sensor.

[0032] According to another possible feature, the electronic monitoring unit is configured to monitor a "heat pump" type circuit, a heat transfer fluid circuit, a ventilation unit, and / or a cooling device. In particular, the electronic monitoring unit is configured to monitor the flow rate of the heat transfer fluid through the circuit, the flow rate of the fluid through the "heat pump" type circuit, any item of the cooling device, and / or the flow rate of air through the ventilation unit, etc.

[0033] Advantageously, the electronic monitoring unit is configured to adjust the flow rate parameters of at least one fluid (such as air or a heat transfer fluid) in response to real-time power consumption in the server or one of the server's racks in order to stabilize the temperature of the server or one of the server's components.

[0034] According to a second possible embodiment of the present invention, all heat-generating components of the rack are directly attached to a cooling unit and / or conduit for a heat transfer fluid, all of which contain some phase-change material. This configuration is effective for designing new autonomous racks that include an integrated cooling system. The phase-change material allows heat to be directly stored and then released within the rack without requiring strong ventilation. Other weaker heat-generating components can be cooled by convection or minimal ventilation at low power.

[0035] The present invention also relates to the use of a heat sink to optimize the "refilling" (generally solidification by cooling) of a phase change material in response to the presence of collected intermittent energy. If such intermittent energy is not present for an extended period, the cooling unit is powered directly from the mains power supply.

[0036] Of particular note is the advantage that it allows for the cooling and solidification of PCM at approximately 15°C (unrestricted) without being limited by other climatic conditions (from deserts to polar regions), while simultaneously condensing and removing excess moisture from the cooling airflow.

[0037] When directly cooling the heat-generating components, it is advantageous, though not limited to, to use phase-change materials that solidify at ambient temperatures of approximately 20°C to 24°C in order to prevent condensation within the column and rack.

[0038] It should be noted that any refrigerant fluid can be used to cool the phase change material, including a cooling water network from a heat pump (or other gases or liquids), or other cooling means, including those utilizing the Peltier effect. [Brief explanation of the drawing]

[0039] The present invention will be better understood and other purposes, details, features, and advantages will be more clearly defined by the following description of specific embodiments of the invention, which are described non-limitingly for informational purposes only, with reference to the attached figures. [Figure 1] This is a schematic and partial diagram, referred to as Figure 1, showing an example of a cooling device according to the present invention, designed for temperature control of at least one server. [Figure 2] This is a schematic diagram, referred to as Figure 2, showing an example of a cooling device according to one embodiment of the present invention. [Figure 3] This is a schematic and partial diagram, referred to as Figure 3, showing an example of a cooling unit in a cooling device according to one embodiment of the present invention. [Figure 4] This is a schematic diagram, referred to as Figure 4, showing an example of a cooling device according to another embodiment of the present invention. [Figure 5] This is a schematic perspective view, referred to as Figure 5, showing an example of a heat exchanger in the cooling unit shown in Figure 4. [Figure 6] This is a schematic cross-sectional view, referred to as Figure 6, showing an example of a heat exchanger in the cooling unit shown in Figure 4. [Modes for carrying out the invention]

[0040] Furthermore, please note that, in principle, the same reference numeral should be assigned to identical components in various diagrams.

[0041] Figure 1 is a schematic and partial diagram showing an example of a cooling device 1 according to a first embodiment, designed to cool at least one server S in a data center or a group of computer servers (a server may consist of one or more "racks").

[0042] The apparatus 1 according to the present invention can be adapted to cool each server S, and / or to cool a set of servers together, without limiting the number of servers.

[0043] The apparatus 1 comprises at least one cooling unit 2 and a ventilation unit V configured to circulate an airflow F through at least one server S to the cooling unit 2.

[0044] For example, the ventilation unit V comprises at least one fan and / or fan motor assembly, which includes, for example, a fan located at the rear of at least one server S and positioned to draw air through at least one server S. The ventilation unit V may also comprise at least one battery to power at least one fan and / or fan motor assembly, in particular in case of a power outage and / or in case of using electricity previously generated and stored at low cost (or more environmentally friendly).

[0045] Therefore, the cooling device 1 is A phase change material 5 configured to exchange heat (here, by airflow F) with at least one component of the server, At least one heat exchanger 7 connected to the heat transfer fluid circuit 3, It is equipped with.

[0046] In particular, Figure 1 shows an embodiment of the present invention, in which the apparatus 1 comprises a cooling unit 2 that houses a heat exchanger 7 connected to a heat transfer fluid circuit 3 and a phase change material 5.

[0047] The apparatus 1 is configured, on the one hand, to cool at least one component of the server S by storing heat generated by one of the components of the server S in the phase change material 5, and on the other hand, to release the heat stored in the phase change material 5 via the heat exchanger 7 (and heat transfer fluid circuit 3).

[0048] Here, heat transfer is achieved by an airflow F passing through the server S, which is heated (thus warming the airflow F), and then the airflow F transfers heat to the phase change material 5 via the heat exchanger 7.

[0049] It should be noted that phase change materials (PCMs) are materials that can change their physical state within a limited temperature range (latent heat), and thus store and release heat.

[0050] The phase change material 5 is advantageously having a melting temperature of -10°C to 25°C (for energy storage), preferably -5°C to 20°C, and more preferably 12°C to 18°C ​​or 18°C ​​to 28°C in the case of direct cooling as described below.

[0051] Figure 2 is a schematic and partial diagram showing an example of a cooling device 1 according to one embodiment. The cooling unit 2 is substantially columnar and houses a heat exchanger 7 connected to a heat transfer fluid circuit 3 and a phase change material 5. Note that the device 1 may include one or more cooling units 2.

[0052] Therefore, the cooling unit 2 is configured such that the airflow F from the ventilation unit V passes through the cooling unit 2, the airflow is cooled as it flows through the columns of the cooling unit 2, and is then discharged into the air surrounding the building and / or server room, or directed (directly) to the air inlets of at least one computer server. It should be noted that the airflow from the ventilation unit V is preferably directed downward through the cooling unit 2.

[0053] The heat transfer fluid circuit 3 includes a pump 9 configured to circulate the heat transfer fluid preferably upward through the heat exchanger 7 of the cooling unit 2, and another heat exchanger 23 called a coupling exchanger which is thermally coupled to a heat sink (not shown).

[0054] Therefore, the heat transfer fluid circuit 3 is connected to a heat sink that allows some of the heat stored in the phase change material 5 to be released by the heat transfer fluid.

[0055] Figure 3 is a schematic cross-sectional view showing an example of a cooling unit 2 of the apparatus 1 shown in Figures 1 and 2, according to one embodiment of the present invention.

[0056] Therefore, the heat transfer fluid circuit 3 is A pump 9 that circulates the heat transfer fluid through the heat transfer fluid circuit 3, A shut-off valve 11 is configured to stop the flow of heat transfer fluid through the heat transfer fluid circuit 3, and when the circulation of the heat transfer fluid is stopped, the accumulation or release of heat between the heat transfer fluid and the phase change material 5 is restricted or stopped. At least one additional and optional airflow circulation means 13, configured to circulate the airflow F along the heat exchanger 7, It is equipped with.

[0057] The heat transfer fluid is preferably water, water glycol (meaning a mixture of water and glycol), glycol, etc., but it should be noted that a refrigerant fluid can also be used.

[0058] The additional circulation means 13 is, for example, a fan motor assembly or a fan (i.e., a centrifugal fan) that can draw in (or "push out") air through the cooling unit 2 and circulate the air along the heat exchanger 7, thereby cooling or heating the air (and by extension, the room into which the air flows).

[0059] According to embodiments not shown, the heat exchanger 7 may have different shapes and / or include various components, thereby allowing air to flow through the center and / or edges of the heat exchanger 7.

[0060] The cooling unit 2 further comprises a case 32 in which, for example, a heat exchanger 7, a circulation means 13, part of a heat transfer fluid circuit 3, a shut-off valve 11, and the like are arranged.

[0061] The case 32 also includes an air inlet 32a and an air outlet 32b to enable air circulation by the additional circulation means 13 and / or ventilation unit V. Furthermore, it should be noted that the air inlet 32a can be configured to draw in external air (usually dry) and / or air already thermally conditioned by the cooling unit 2 (also known as recycled air).

[0062] Advantageously, a portion of the heat transfer fluid circuit 3 that is not within case 32 is thermally isolated from the outside by, for example, an insulating material 45. This insulating material limits heat loss before the heat transfer fluid reaches the phase change material 5 (this is more important than the loop being far outside the case).

[0063] Furthermore, the cooling unit 2 may also be provided with a sheath in the location where the heat exchanger 7 is preferably positioned, and it is advantageous that the sheath 21 be made of a thermal insulating material.

[0064] The cooling unit 2 also, In particular, an electronic monitoring unit 15 is configured to monitor the circulation of the heat transfer fluid through the heat transfer fluid circuit 3, and / or the circulation (flow rate, velocity, etc.) of the airflow through the cooling unit 2 and / or the at least one server S (i.e., to monitor the ventilation unit V and / or additional circulation means 13), A human-machine interface (or user interface) 17, which comprises all components that enable a user to interact with the unit, more specifically to monitor the unit, and / or exchange information with the unit, It is equipped with.

[0065] A human-machine interface includes one or more components such as buttons, keyboards, screens, touchscreens, knobs, and indicator lights.

[0066] Figure 4 is a schematic and partial diagram showing an example of a cooling device 1 of another embodiment according to the first embodiment of the present invention, where the heat sink (of device 1 in Figure 2) is a heat pump type circuit 4. Next, the cooling device 1 comprises a heat pump type circuit 4 which is thermally coupled to a heat transfer fluid circuit 3 via a heat exchanger 23 (for example, through which a refrigerant fluid flows).

[0067] The heat pump circuit 4 further comprises a compressor C, a pressure regulator D1, a heat exchanger H1 (for example, operating as an evaporator), and a heat exchanger H2 (for example, operating as a condenser). The heat pump circuit 4 also advantageously includes a bypass branch with a direct-acting valve for the coupling heat exchanger. The heat pump circuit 4 and its various components are configured to achieve a thermodynamic cycle in which heat is received from the heat exchanger 23 (i.e., from the heat transfer fluid) and heat is discharged in the heat exchanger H1 by transferring the heat, for example, to an airflow F passing through the heat exchanger H1.

[0068] In another embodiment not shown, the coupling heat exchanger is coupled, for example, to a refrigeration system through which a refrigerant fluid flows.

[0069] However, it should be noted that, regardless of the modification or embodiment, and without causing any technical problems, the cooling unit 2 may be equipped with at least two (not shown) temperature sensors from the following list, namely, a temperature sensor for the airflow at the outlet of the server, a temperature sensor for the airflow at the inlet of the cooling unit 2, a temperature sensor for the airflow at the outlet of the cooling unit 2, a temperature sensor for the phase change material, and a measuring device for the latent heat load rate (solidification) of the phase change material, such as a temperature sensor and / or pressure sensor.

[0070] Therefore, it is advantageous that the electronic monitoring unit 15 is configured to monitor the "heat pump" type circuit, the heat transfer fluid circuit, the ventilation unit, additional circulation means, and / or cooling device.

[0071] In particular, the electronic monitoring unit 15 can be configured to monitor, in principle, all components of the cooling device, including the flow rate of the heat transfer fluid through the heat transfer fluid circuit 3, the flow rate of the fluid (e.g., refrigerant fluid) through the heat pump type circuit 4, and / or the flow rate of the air through the ventilation unit V.

[0072] As more specifically shown in Figures 5 and 6, which are schematic perspective and schematic cross-sectional views of the heat exchanger 7, this heat exchanger 7 is, For example, a first structure 110 located in the center, in which a conduit 110a is designed for heat transfer fluid, For example, a second structure 120 exists concentrically with respect to the first structure 110 and is provided around the first structure 110 (i.e., around the conduit 110a), It is equipped with.

[0073] The first structure 110 and the second structure 120 are configured such that there is a gap between the first structure 110 and the second structure 120 that defines a housing in which the phase change material 5 is placed (or stored).

[0074] Furthermore, it should be noted that the heat exchanger 7, the first structure 110, and the second structure 120 are preferably made of a metallic thermal conductive material such as aluminum, as a plurality of independent columns. The number and size of the columns depend on the energy required to cope with the intermittence of one or more power sources.

[0075] The heat exchanger 7 is manufactured, for example, by extrusion molding. Furthermore, the heat exchanger 7 is preferably elongated in shape so that the conduits for the heat transfer fluid are as long as possible, allowing heat to be released to the phase change material 5 and heat to be recovered from the phase change material 5.

[0076] Therefore, according to a possible embodiment, the heat exchanger 7 comprises two aluminum extruded profiles arranged concentrically with respect to each other. For example, each profile has a cross-section such as a circle, square, or rectangle. The first extruded profile, i.e., the first structure 110, comprises a conduit 110a for heat transfer fluid at its center.

[0077] Therefore, the airflow F is cooled and / or heated by the second structure 120 of the heat exchanger 7, particularly through its outer surface. Furthermore, the first structure 110 and the second structure 120 are advantageously provided with fins 111, fin 121, and fin 122, which increase the contact area and maximize heat exchange.

[0078] In particular, the fins 111 of the first structure 110 extend toward the second structure 120 of the heat exchanger 7, and therefore the fins 111 extend into the volume or space in which the phase change material 5 is stored, thereby increasing the contact area between the phase change material 5 and the first structure 110, and facilitating heat exchange between the heat transfer fluid passing through the conduit 110a and the phase change material 5.

[0079] On the other hand, the fins 121 and 122 in the second structure 120 may extend away from the second structure 120 (towards the outer surface of the second structure 120), and these may be called the external fins 121, and / or may extend from the inner surface of the second structure 120 toward the first structure 110, and these may be called the internal fins 122.

[0080] Multiple external fins 121 increase the contact area between the thermal control flow (in this case, the airflow F) and the second structure 120, thereby promoting heat exchange. Meanwhile, multiple internal fins 122 increase the contact area with the phase change material 5, thereby promoting heat transfer between the phase change material 5 and the heat transfer fluid and / or airflow F.

[0081] It should be noted that the multiple fins 111 and the multiple internal fins 122 in the first structure 110 are configured to cooperate with each other to ensure a certain gap between the first structure 110 and the second structure 120, and to ensure good mechanical resistance of the set.

[0082] Furthermore, it should be noted that since the sheath 21 specifically surrounds at least one heat exchanger 7, there is a gap between the inner surface of the sheath 21 and the second structure 120 in the heat exchanger 7. This gap thus creates a conduit for a thermal control fluid such as air, which induces an airflow F and maximizes the heat exchange between the airflow F and the heat exchanger 7.

[0083] Advantageously, the outer circumference, defined by the multiple external fins 121, has a geometric shape such as a square or rectangle, which facilitates the manufacturing of the sheath 21 for attachment to the heat exchanger 7.

[0084] Regardless of any modifications or embodiments of the present invention, the apparatus 1 advantageously comprises at least one renewable electrical energy source, such as a solar panel or a wind turbine, configured to supply power to a plurality of components in the apparatus 1, such as the heat transfer fluid circuit 3 and its subcomponents.

[0085] This device includes an electronic monitoring unit configured to monitor the release of heat stored in a phase-change material, for example, the release being a function of the available power supply and / or energy price from a renewable electrical energy source.

[0086] In another embodiment not shown (referred to as the second mode), the phase change material 5 is configured to directly exchange heat with at least one component of the computer server S, meaning that heat transfer from at least one component of the computer server S to the phase change material 5 occurs primarily by conduction.

[0087] The phase change material 5 can be in direct contact with at least one component, or it can be in contact via one or more intermediate thermal conductive members (e.g., a heat exchanger, thermal paste, flange, etc.).

[0088] Therefore, in a second embodiment of the present invention, the apparatus 1 includes a heat conductive member that connects at least one component of the server S to the phase change material 5.

[0089] A heat-conducting member is a structure that thermally contacts a component whose temperature needs to be lowered, for example, via a heat-conducting paste. For example, the heat-conducting member is made of a material with excellent thermal conductivity, such as a metal like copper or aluminum.

[0090] The heat conduction component may further include a Peltier thermoelectric module.

[0091] However, it is advantageous that the phase change material 5 is always housed in a heat exchanger connected to the heat transfer fluid circuit 3.

[0092] Therefore, in this second embodiment not shown, A heat exchanger is A first structure in which conduits are designed for the heat transfer fluid in a heat transfer fluid circuit, A second structure is located around the first structure, in contact with at least one component of the server, and configured to cool the at least one component of the server (by heat transfer to a phase change material), It is equipped with.

[0093] The first structure and the second structure are configured such that there is a gap between the structures that define the housing in which the phase change material is placed.

[0094] Furthermore, in a modified version of the second embodiment of the present invention, all heat-generating components of the server S are directly attached to a column or cooling unit containing the phase change material 5, and the cooling unit is located inside the server (or at least its rack) and is an integral part of the server. [Explanation of Symbols]

[0095] 1 device 2 Cooling Units 3 Heat transfer fluid circuit 4. Heat pump type circuit 5-phase change materials 7 Heat exchanger

Claims

1. A device (1) for cooling at least a server of a data center computer, The aforementioned device (1) is A phase change material (5) configured to exchange heat with at least one component of the server, A heat exchanger (7) connected to a heat transfer fluid circuit (3), Equipped with, The aforementioned device (1) is On the one hand, the heat generated by the components is stored in the phase change material (5) to cool at least one component of the server. On the other hand, the heat stored in the phase change material (5) is released via the heat exchanger (7). The apparatus (1) includes a ventilation unit (V) configured to circulate an airflow (F) through the server to the phase change material (5), The airflow (F) from the ventilation unit (V) is directed to at least one cooling unit (2) which includes the heat exchanger (7) and the phase change material (5). The heat exchanger (7) of the cooling unit (2) is A first structure (110) in which the conduit (110a) is designed for the heat transfer fluid of the heat transfer fluid circuit (3), A second structure (120) is located around the first structure (110) and is configured to cool the airflow (F) from the ventilation unit (V) (by heat transfer to the phase change material (5)), Equipped with, The first structure (110) and the second structure (120) have a gap between them that defines a housing in which the phase change material (5) is placed. Apparatus (1) is configured as follows.

2. The apparatus (1) comprises at least one renewable electrical energy source configured to supply power to a plurality of components of the apparatus (1), The apparatus (1) according to claim 1, characterized in that

3. The apparatus (1) includes an electronic monitoring unit (15) configured to monitor the release of heat stored in the phase change material (5). The apparatus (1) according to claim 1, characterized in that

4. The heat transfer fluid circuit (3) is thermally coupled to a heat pump type circuit or cooling system. The apparatus (1) according to claim 1, characterized in that

5. The ventilation unit (V) is installed to draw air from the server. The apparatus (1) according to claim 1, characterized in that

6. The airflow (F) from the ventilation unit (V) is directed downward through the cooling unit (2). The apparatus (1) according to claim 1, characterized in that

7. The heat transfer fluid circuit (3) is configured such that the heat transfer fluid flows upward through the heat exchanger (7). The apparatus (1) according to claim 1, characterized in that

8. The apparatus includes a heat conductive member that connects at least one component of the server to the phase change material (5). The apparatus (1) according to claim 1, characterized in that

9. The heat conductive member further comprises a Peltier thermoelectric module. The apparatus (1) according to claim 8, characterized in that

10. A data center comprising at least one server (S) having the device (1) described in any one of claims 1 to 9.

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