Polymers and their photosensitive resin compositions

Abstract

The purpose of the present invention is to provide: a polymer which has a high development rate, can form a fine pattern, and can provide a cured product having excellent fine wire adhesion; and a photosensitive resin composition containing said polymer. The present invention relates to: a polymer having an acid group, wherein the polymer has a structural unit having a ring structure in the main chain and a structural unit derived from a monomer with which a homopolymer represented by a specific structural formula has a Tg of -5°C or less, and has substantially no ethylenically unsaturated double bond in the side chain, and the acid group has an interval with the main chain of at most 6 atoms; and a photosensitive resin composition containing said polymer and a polyfunctional monomer. In addition, the composition preferably further contains a photopolymerization initiator and a color material, and in particular, the composition is preferably in the form of a resist for color filters.

Description

[Technical Field]

[0001] This invention relates to polymers and photosensitive resin compositions thereof. More specifically, it relates to polymers and photosensitive resin compositions comprising polymers and polyfunctional monomers. [Background technology]

[0002] Curable resin compositions that can be cured by heat or active energy rays are being explored for various applications in optical components and electrical / electronic equipment, such as color filters used in liquid crystal display devices and solid-state image sensors, inks, printing plates, printed circuit boards, semiconductor elements, and photoresists. As a result, curable resin compositions with excellent properties required for each application are being developed.

[0003] As a colored resin composition with excellent contact hole formation and pattern formation properties, for example, Patent Document 1 describes a colored resin composition containing (A) a dye, (B) a solvent, and (C) a binder resin, further containing (D) a specific antioxidant and (E) a specific ultraviolet absorber. Particularly preferred binder resins are described, including a resin obtained by adding an unsaturated monobasic acid to at least a portion of the epoxy groups of a copolymer of an epoxy group-containing (meth)acrylate and another radical polymerizable monomer, or an alkali-soluble resin (C-1) obtained by adding a polybasic acid anhydride to at least a portion of the hydroxyl groups produced by the addition reaction. Patent Document 1 requires that the pattern diameter when the color filter resist is cured be brought close to the mask diameter at the time of exposure. Furthermore, as a photosensitive resin composition with excellent dispersibility with organic pigments, for example, Patent Document 2 describes a photosensitive resin composition that includes a polymer obtained by polymerizing monomer components that include (meth)acrylic acid esters having hydrocarbon groups with 8 to 20 carbon atoms and (meth)acrylic acid as essential components, and the polymer is an alkali-soluble resin that has not only alkali-soluble groups but also radically polymerizable unsaturated groups introduced. Patent Document 2 requires high curability of the binder for the resist. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2015-98537 [Patent Document 2] Japanese Patent Publication No. 2011-145553 [Overview of the project] [Problems that the invention aims to solve]

[0005] However, with conventional photosensitive resin compositions, it is difficult to achieve both fast development speed, fine pattern formation, and good adhesion to fine lines. The faster the development time, the more likely the pattern is to peel off along with the fine lines, resulting in insufficient adhesion and difficulty in maintaining the development margin. Furthermore, with the increasing resolution of displays, there is a growing demand for improved fine pattern formation and fine line adhesion.

[0006] In view of the above situation, the present invention aims to provide a polymer that can develop quickly, form fine patterns, and produce a cured product with excellent adhesion to fine lines, and a photosensitive resin composition containing the above polymer. [Means for solving the problem]

[0007] In order to solve the above problems, the present inventors conducted various studies on polymers that can be used in optical components and electrical and electronic equipment applications. They found that by using a polymer having acid groups, wherein the polymer has a ring structure in its main chain and specific structural units, the position of the acid groups is within a specific range, and substantially does not have ethylenically unsaturated double bonds in the side chains, the development speed is fast, there is no line thickening or abrasion in the pattern, good pattern formation is possible even for fine patterns at the level of several micrometers, and the cured product (cured film) that provides excellent adhesion of the formed pattern (especially fine line adhesion). Furthermore, the present inventors have found that a photosensitive resin composition containing such a polymer is particularly suitable as a resin composition for forming optical members such as color filters, and have thus completed the present invention.

[0008] That is, the object of the present invention is achieved by the following <1> to <9>. <1> A polymer having an acid group, wherein the polymer has a structural unit having a ring structure in the main chain and a structural unit derived from a monomer having a Tg of the homopolymer represented by the following general formula (1) of -5°C or lower, and substantially does not have an ethylenically unsaturated double bond in the side chain, and the acid group has an interval of 6 or less atoms from the main chain.

[0009]

Chemical formula

[0010] (In the formula, R 1 represents a hydrogen atom or a methyl group. R 2 represents a linear or branched hydrocarbon group having 6 to 20 carbon atoms.) <2> A polymer having an acid group, wherein the polymer has a structural unit having a ring structure in the main chain and a structural unit derived from a monomer having a Tg of the homopolymer represented by the following general formula (1) of -5°C or lower, the acid group has an interval of 6 or less atoms from the main chain, and the content ratio of the structural unit represented by the following general formula (2) is 5% by mass or less based on 100% by mass of all the structural units of the polymer.

[0011]

Chemical formula

[0012]

Chemical formula

[0013] <3> The acid group is a carboxyl group derived from (meth)acrylic acid. <1> or <2> The polymer described above. <4> The polymer has structural units derived from an N-substituted maleimide monomer. <1> ~ <3> A polymer as described in any of the above. Preferably, the polymer is a polymer for resists. <5> The aforementioned <1> ~ <4> A photosensitive resin composition comprising a polymer and a polyfunctional monomer as described in any of the above. <6> Furthermore, the above includes a photopolymerization initiator and a colorant. <5> The photosensitive resin composition described in [reference]. <7> The aforementioned resist for color filters <5> or <6> The photosensitive resin composition described in [reference]. <8> The aforementioned <5> ~ <7> A cured film obtained by curing a photosensitive resin composition as described in any of the above. <9> The aforementioned <8> A component for a display device having the cured film described above. [Effects of the Invention]

[0014] The polymer and photosensitive resin composition of the present invention can produce cured products with a fast development speed, excellent pattern formation properties, and superior adhesion to fine lines. Such polymers and photosensitive resin compositions of the present invention can be suitably used in various applications such as color filters, inks, printing plates, printed circuit boards, semiconductor elements, photoresists, and other optical components and electrical and electronic equipment used in liquid crystal display devices and solid-state image sensors. [Modes for carrying out the invention]

[0015] The present invention will be described in detail below. Furthermore, combinations of two or more of the individual preferred embodiments of the present invention described below are also preferred embodiments of the present invention. Furthermore, in this specification, "(meth)acrylic acid" means "acrylic acid and / or methacrylic acid," and "(meth)acrylate" means "acrylate and / or methacrylate." In addition, in this specification, the numerical range "Min~Max" means not less than the minimum value Min and not more than the maximum value Max. Further, when preferable numerical values are described stepwise for the upper limit value and the lower limit value, a numerical range obtained by appropriately combining the separately described upper limit value and lower limit value is also a preferable numerical range.

[0016] 1. Polymer The polymer of the present invention has an acid group (preferably has an acid group in the side chain), and further has a structural unit having a ring structure in the main chain, and a structural unit derived from a monomer represented by the following general formula (1) and having a Tg (glass transition temperature) of the homopolymer of -5°C or lower, and substantially has no ethylenically unsaturated double bond in the side chain, and the acid group has an atomic number of 6 or less between the main chain, and is a polymer (also referred to as "polymer-1").

[0017] [Chemical formula] <​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​ (In the formula, R 3 and R 4 (These represent a hydrogen atom or a methyl group, either identical or distinct. Z represents a divalent organic group.)

[0021] Because polymer-1 and polymer-2 of the present invention have the above configuration, they can be developed quickly, form fine patterns, and produce cured products (cured films, fine line patterns) with excellent adhesion. The polymer of the present invention is thought to have improved developability, pattern formation, and adhesion due to the inclusion of specific structural units, improved developability and adhesion due to the acid groups being located within a specific range, i.e., having 6 or fewer atoms between them and the main chain, and to prevent curing by diffracted light during UV exposure, thereby enabling finer patterning, by substantially not having ethylenically unsaturated double bonds in the side chains. Details are described below.

[0022] The polymer of the present invention has structural units containing acidic groups. The presence of acidic groups in the polymer makes it alkali-soluble and thus developable.

[0023] The above-mentioned acid group is located at a position with a distance of 6 or fewer atoms from the main chain. The fact that the above-mentioned acid group is located in a specific range close to the main chain improves the developability of the polymer. Furthermore, the development speed is increased by the combination of this with the fact that the hydrocarbon group of the structural unit represented by the above general formula (1) contained in the polymer has 6 to 20 carbon atoms (low Tg).

[0024] Typically, when producing polymers with acid groups located relatively far from the main chain, a monomer with acid groups is synthesized by reacting a vinyl monomer with a compound containing acid groups or an acid anhydride, and this monomer is then used for copolymerization. For example, a monomer with acid groups located far from the vinyl group can be obtained by reacting hydroxyethyl (meth)acrylate with maleic anhydride. However, if a polymer produced by copolymerizing this monomer is used in the manufacture of color filters, water may be added during the post-curing process (heating process), causing the maleic acid portion to detach and become a foreign substance, which can reduce the heat resistance and transparency of the resulting cured product. In contrast, when the distance between the acid group and the main chain is 6 atoms or less, there is no need to use a monomer produced by reacting a vinyl monomer with a compound containing acid groups or an acid anhydride. Therefore, the detachment of the acid group portion does not occur during the color filter manufacturing process, and there is an advantage in that the heat resistance and transparency of the polymer are less likely to decrease.

[0025] In this invention, the statement that the number of atoms between the side chain and the main chain is 6 or less means that the number of atoms between the atom of the main chain to which the side chain is attached and the atom to which the acid group is attached on the side chain is 6 or less. For example, in the structural unit represented by (a1) below, the number of atoms between the acid group X and the main chain is 4, and in the structural unit represented by (a2) below, the number of atoms between the acid group X and the main chain is 6. Furthermore, if the acid group is directly attached to the main chain, the number of atoms between the acid group and the main chain is 0.

[0026] [ka]

[0027] The above acid group preferably has a spacing of 6 or fewer atoms from the main chain, more preferably 5 or fewer, particularly preferably 3 or fewer, and most preferably 0 atoms. The above acid group is preferably directly bonded to the main chain.

[0028] Examples of the above-mentioned acid groups include functional groups that undergo a neutralization reaction with alkaline water, such as carboxyl groups, phenolic hydroxyl groups, carboxylic acid anhydride groups, phosphoric acid groups, and sulfonic acid groups. Among these, carboxyl groups or carboxylic acid anhydride groups are preferred, more preferably carboxyl groups, and even more preferably (meth)acrylic acid groups. That is, the above-mentioned acid group is preferably a carboxyl group derived from (meth)acrylic acid, and the structural unit containing the above-mentioned acid group is preferably a structural unit derived from (meth)acrylic acid. It is particularly preferable that the structural unit is derived from methacrylic acid in that it can raise the overall Tg of the resin and improve the adhesion of fine wires. The reason for this is not clear, but it is thought that the combination of the structure represented by the above general formula (1) and a unit with a high Tg such as methacrylic acid improves the conformability to the substrate, thereby improving the adhesion of fine wires.

[0029] The content of structural units containing the above acid group is preferably 1 to 50% by mass relative to 100% by mass of the total structural units of the polymer, taking into consideration both the developability and adhesion of the polymer. More preferably, it is 5% by mass or more, more preferably 45% by mass or less, even more preferably 40% by mass or less, and particularly preferably 35% by mass or less, relative to 100% by mass of the total structural units. In other words, the content of structural units containing the above acid group is preferably 5 to 45% by mass, more preferably 5 to 40% by mass, and even more preferably 5 to 35% by mass, based on 100% by mass of the total structural units of the polymer.

[0030] Furthermore, it is preferable to introduce structural units containing acid groups by polymerizing acid group-containing monomers (also referred to as "acid group-containing monomers (s)"). Examples of the above acid group-containing monomers (s) include unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, cinnamic acid, and vinylbenzoic acid; unsaturated polycarboxylic acids such as maleic acid, fumaric acid, itaconic acid, citraconic acid, and mesaconic acid; unsaturated acid anhydrides such as maleic anhydride and itaconic anhydride; and phosphoric acid-containing unsaturated compounds such as Light Ester P-1M (manufactured by Kyoeisha Chemical Co., Ltd.). Among these, from the viewpoint of versatility and availability, it is preferable to use carboxylic acid monomers (unsaturated monocarboxylic acids, unsaturated polycarboxylic acids, and unsaturated acid anhydrides). From the viewpoint of reactivity and heat resistance to coloring, unsaturated monocarboxylic acids are more preferable, and (meth)acrylic acid is even more preferable.

[0031] Polymer-1 of the present invention substantially lacks ethylenically unsaturated double bonds in its side chains. This reduces sensitivity to light, making it less likely for line thickening (formation of patterns wider than the exposure mask diameter) to occur during exposure, thus enabling finer pattern reproduction.

[0032] In the present invention, the above-mentioned ethylenically unsaturated double bond means a polymerizable double bond, i.e., a carbon-carbon double bond. "Substantially lacking ethylenically unsaturated double bonds in the side chain" means a range in which the effects of the present invention are not achieved. For example, the content of structural units having ethylenically unsaturated double bonds in the side chain is in the range of 5% by mass or less relative to 100% by mass of the total structural units of the polymer, preferably in the range of 0 to 3% by mass, more preferably 0 to 1% by mass, and even more preferably 0 to 0.5% by mass.

[0033] The double bond equivalent of the above polymer is preferably 3000 (g / mol) or more, and most preferably 30000 (g / mol) or more. In actual measurements of the above double bond equivalent, it is within the range below the detection limit using various analyses such as NMR and IR, and the iodine value test method described in JIS K 0070:1992.

[0034] Examples of the ethylenically unsaturated double bonds mentioned above include (meth)acryloyl groups, vinyl groups, allyl groups, and methallyl groups.

[0035] The ethylenically unsaturated double bond described above is introduced into the polymer, for example, by reacting an epoxy group-containing monomer with the acidic group of the polymer to increase its reactivity. However, in the present invention, it is not introduced, or is substantially not introduced. Examples of the epoxy group-containing monomers mentioned above include compounds containing an epoxy group and a polymerizable double bond. Examples of polymerizable double bonds are similar to the ethylenically unsaturated double bonds described above, such as (meth)acryloyl groups, vinyl groups, allyl groups, and methallyl groups. In this specification, the term epoxy group includes not only epoxy groups in the narrow sense, but also groups in which an oxirane ring is bonded to a carbon atom, such as glycidyl groups, groups containing an ether bond or an ester bond, such as glycidyl ether groups and glycidyl ester groups, and epoxycyclohexane rings, etc.

[0036] Examples of the epoxy group-containing monomers mentioned above include glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, β-ethylglycidyl (meth)acrylate, vinylbenzylglycidyl ether, allylglycidyl ether, (3,4-epoxycyclohexyl)methyl (meth)acrylate, vinylcyclohexene oxide, and the like.

[0037] Examples of structural units containing an ethylenically unsaturated double bond in the side chain include the structural unit represented by the following general formula (2).

[0038] [ka]

[0039] In the formula, R 3 and R 4 The same or different atoms represent a hydrogen atom or a methyl group. Z represents a divalent organic group. Various organic groups can be cited depending on the structure of the epoxy group-containing monomer described above. Examples of Z include the organic group represented by the following general formulas (61) or (62). Here, * in the following general formulas (61) and (62) 1 * This is the position where the polymer is bonded to the oxygen atom on the main chain side. 2 This is the position where the oxygen atom on the ethylenically unsaturated double bond side of the side chain is bonded.

[0040] [ka]

[0041] [ka]

[0042] Polymer-2 of the present invention has a content of structural units represented by the above general formula (2) of 5% by mass or less relative to 100% by mass of the total structural units of the polymer. It is particularly preferable that Polymer-2 substantially does not contain said structural units. Specifically, the content of the structural unit represented by the above general formula (2) is preferably 3% by mass or less, more preferably 1% by mass or less, particularly preferably 0.5% by mass or less, and most preferably 0% by mass, based on 100% by mass of the total structural units of the polymer, in terms of pattern refinement.

[0043] In polymer-2 of the present invention, the content of structural units containing an ethylenically unsaturated double bond in the side chain, including the structural unit represented by the general formula (2) above, is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 1% by mass or less, particularly preferably 0.5% by mass or less, and most preferably 0% by mass, based on 100% by mass of the total structural units of the polymer. Examples of structural units containing an ethylenically unsaturated double bond in the side chain in polymer-2 above are the same as those in polymer-1 described above.

[0044] The polymer of the present invention has structural units having a ring structure in the main chain, and structural units represented by the above general formula (1). Each structural unit will be described below. Structural units having a ring structure in the main chain will also be referred to as "structural unit (A)" below.

[0045] By having a structural unit with a ring structure in the main chain skeleton of the polymer, the heat resistance of the polymer of the present invention can be improved, and the adhesion of the cured product can also be improved. Since the presence of a ring structure in the main chain improves the heat decomposition resistance of the polymer, it is thought that the adhesion of the cured film to fine wires can also be ensured. Furthermore, it is thought that combining it with methacrylic acid as an acid compound will further improve the adhesion to fine wires.

[0046] As monomers that give the above structural unit (A), one or more types are preferred, such as monomers having a double bond-containing ring structure in the molecule, or monomers that undergo cyclization polymerization to form polymers having a ring structure in the main chain. As such monomers, it is preferable to use at least one selected from the group consisting of N-substituted maleimide monomers, dialkyl-2,2'-(oxydimethylene)diacrylate monomers, and α-(unsaturated alkoxyalkyl)acrylate monomers. Thus, as structural units having a ring structure in the main chain, at least one selected from the group consisting of N-substituted maleimide monomer units (structural units derived from N-substituted maleimide monomers), dialkyl-2,2'-(oxydimethylene)diacrylate monomer units, and α-(unsaturated alkoxyalkyl)acrylate monomer units is preferred. In particular, polymers containing N-substituted maleimide monomer units can yield cured products with improved heat resistance, dispersibility (e.g., dispersibility of colorants), and hardness.

[0047] The polymers containing the monomer units mentioned above refer to polymers that contain structural units derived from the monomers, for example, through polymerization or crosslinking reactions of the monomers.

[0048] Examples of the above N-substituted maleimide monomers include N-cyclohexylmaleimide, N-phenylmaleimide, N-methylmaleimide, N-ethylmaleimide, N-isopropylmaleimide, Nt-butylmaleimide, N-dodecylmaleimide, N-benzylmaleimide, and N-naphthylmaleimide, and one or more of these can be used. Among these, N-cyclohexylmaleimide, N-phenylmaleimide, and N-benzylmaleimide are preferred due to their low coloration and excellent dispersibility, and N-benzylmaleimide is particularly preferred.

[0049] Examples of the above-mentioned N-benzylmaleimides include benzylmaleimide; alkyl-substituted benzylmaleimides such as p-methylbenzylmaleimide and p-butylbenzylmaleimide; phenolic hydroxyl-substituted benzylmaleimides such as p-hydroxybenzylmaleimide; and halogen-substituted benzylmaleimides such as o-chlorobenzylmaleimide, o-dichlorobenzylmaleimide, and p-dichlorobenzylmaleimide.

[0050] Examples of the above-mentioned N-phenylmaleimides include phenylmaleimide; alkyl-substituted phenylmaleimides such as p-methylphenylmaleimide and p-butylphenylmaleimide; phenolic hydroxyl-substituted phenylmaleimides such as p-hydroxyphenylmaleimide; and halogen-substituted phenylmaleimides such as o-chlorophenylmaleimide, o-dichlorophenylmaleimide, and p-dichlorophenylmaleimide.

[0051] As the above-mentioned dialkyl-2,2'-(oxydimethylene) diacrylate monomer, it is preferable to use, for example, dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, from the viewpoint of low coloration, dispersibility, and ease of industrial availability.

[0052] Examples of the above α-(unsaturated alkoxyalkyl) acrylate monomers include α-allyloxymethylacrylic acid, α-allyloxymethylacrylate methyl, α-allyloxymethylacrylate ethyl, α-allyloxymethylacrylate n-propyl, α-allyloxymethylacrylate i-propyl, α-allyloxymethylacrylate n-butyl, α-allyloxymethylacrylate s-butyl, α-allyloxymethylacrylate t-butyl, α-allyloxymethylacrylate n-amyl, α-allyloxymethylacrylate s-amyl, α-allyloxymethylacrylate t-amyl, α-allyloxymethylacrylate neopentyl, α-allyloxymethylacrylate n-hexyl, α-allyloxymethylacrylate s-hexyl, α-allyloxymethylacrylate n-heptyl, α-allyloxymethylacrylate n-octyl, α-allyloxymethylacrylate s-octyl α-(allyloxymethyl)acrylates containing chain-like saturated hydrocarbon groups are preferred, such as t-octyl α-allyloxymethylacrylate, 2-ethylhexyl α-allyloxymethylacrylate, capryl α-allyloxymethylacrylate, nonyl α-allyloxymethylacrylate, decyl α-allyloxymethylacrylate, undecyl α-allyloxymethylacrylate, lauryl α-allyloxymethylacrylate, tridecyl α-allyloxymethylacrylate, myristyl α-allyloxymethylacrylate, pentadecyl α-allyloxymethylacrylate, cetyl α-allyloxymethylacrylate, heptadecyl α-allyloxymethylacrylate, stearyl α-allyloxymethylacrylate, nonadecyl α-allyloxymethylacrylate, eicosyl α-allyloxymethylacrylate, ceryl α-allyloxymethylacrylate, and melicyl α-allyloxymethylacrylate. Other alkyl-(α-methallyloxymethyl)acrylate monomers are also preferred. Among these, α-allyloxymethylacrylate (also called α-(allyloxymethyl)methyl acrylate) is particularly preferred.

[0053] The above-mentioned α-(unsaturated alkoxyalkyl)acrylate monomers can be produced, for example, by the manufacturing method disclosed in International Publication No. 2010 / 114077. The above polymer may have only one type of structural unit (A), or it may have two or more types.

[0054] The content of the above structural unit (A) is preferably 0.5 to 50% by mass relative to 100% by mass of the total structural units of the polymer, taking into consideration both the developability and adhesion of the polymer. More preferably, the content of the above structural unit (A) is 1% by mass or more, even more preferably 2% by mass or more, and even more preferably 45% by mass or less, and even more preferably 40% by mass or less, relative to 100% by mass of the total structural units of the polymer. In other words, the content of the above structural unit (A) is more preferably 1 to 45% by mass, and even more preferably 2 to 40% by mass, relative to 100% by mass of the total structural units of the polymer.

[0055] Furthermore, the structural unit represented by the following general formula (1) will also be referred to as "structural unit (B)" below. The above structural unit (B) is preferably a monomer-derived structural unit of the homopolymer whose Tg (Tg when considered as a homopolymer) is -5°C or lower. The polymer of the present invention has monomer-derived structural unit (B) of the homopolymer whose Tg is -5°C or lower, which allows the developer solution to penetrate more easily during development, thus enabling a faster development speed. Furthermore, it is possible to achieve finer patterns. The Tg of the above homopolymer is preferably -10°C or lower, more preferably -20°C or lower, and particularly preferably -40°C or lower. The lower limit of the Tg of the above homopolymer is -60°C. If the Tg is below -60°C, the developability improves too much, and a pattern smaller than the mask diameter is formed, which is unsuitable. In other words, by setting the Tg range as described above, a pattern diameter close to the mask diameter can be obtained.

[0056] [ka]

[0057] In the above general formula (1), R 1 This represents a hydrogen atom or a methyl group. From the viewpoint of development speed, R 1 A hydrogen atom is preferred.

[0058] In the above general formula (1), R 2 This represents a linear or branched hydrocarbon group having 6 to 20 carbon atoms. The above-mentioned linear or branched hydrocarbon groups having 6 to 20 carbon atoms include 1-methylpentyl group, 2-methylpentyl group, 3-methylpentyl group, 4-methylpentyl group, 1,1-dimethylbutyl group, 1,2-dimethylbutyl group, 1,3-dimethylbutyl group, 2,2-dimethylbutyl group, 2,3-dimethylbutyl group, 3,3-dimethylbutyl group, 1-ethylbutyl group, 2-ethylbutyl group, and 1,2,2-trimethylpropyl group. Examples of these groups include n-ethylhexyl group, 1-ethyl-1-methylpropyl group, 1-ethyl-2-methylpropyl group, n-heptyl group, n-octyl group, 2-ethylhexyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, or n-eicosyl group.

[0059] The linear or branched hydrocarbon groups having 6 to 20 carbon atoms are preferably linear or branched hydrocarbon groups having 6 to 18 carbon atoms, more preferably linear or branched hydrocarbon groups having 6 to 14 carbon atoms, and particularly preferably branched hydrocarbon groups having 7 to 12 carbon atoms. Selecting the number of carbon atoms within the above range improves adhesion to the substrate. This is due to the hydrophobic interactions of the carbon chains. When the number of carbon atoms is less than 6, the hydrophobic interactions are weak, and adhesion is reduced. On the other hand, when the number of carbon atoms is 21 or more, the hydrophobic interactions improve, and adhesion is improved, but if the adhesion is too strong, problems such as longer development times and thickening of the pattern lines may occur.

[0060] The above R 2Specifically, preferred groups include n-octyl, n-dodecyl, 2-ethylhexyl, 2-ethylbutyl, and n-stearyl groups, with 2-ethylhexyl being more preferred. 2 Branched chains exhibit more effective hydrophobic interactions and superior adhesion to nanowires than straight chains.

[0061] As monomers that give the above structural unit (B), for example, compounds represented by the following general formula (1-1) are preferred. CH2=CR 1 -C(O)-OR 2 (1-1) (In the formula, R 1 R represents a hydrogen atom or a methyl group. 2 (This represents a linear or branched hydrocarbon group with 6 to 20 carbon atoms.) By polymerizing monomer components containing such monomer compounds, a polymer having the above-mentioned structural unit (B) can be obtained. In the above general formula (1-1), R 1 and R 2 These are R in the general formula (1) above. 1 and R 2 Similar examples include the above.

[0062] Examples of monomers that give the above structural unit (B) include, more specifically, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-ethylbutyl (meth)acrylate, n-dodecyl (meth)acrylate, n-octadecyl (meth)acrylate, and more preferably 2-ethylhexyl (meth)acrylate.

[0063] The above polymer may have only one type of structural unit (B), or it may have two or more types.

[0064] The content of the above structural unit (B) is preferably 10% by mass or more, relative to 100% by mass of the total structural units of the polymer, considering the developmentability, pattern formation properties, and adhesion of the polymer. More preferably, the content of the above structural unit (B) is 15% by mass or more, even more preferably 20% by mass or more, relative to 100% by mass of the total structural units, and also preferably 80% by mass or less, and more preferably 70% by mass or less. In other words, the content of the above structural unit (B) is preferably 10 to 80% by mass, more preferably 15 to 70% by mass, and even more preferably 20 to 70% by mass, based on 100% by mass of the total structural units of the polymer.

[0065] The polymer of the present invention may also have a ring structure in its side chains. That is, the polymer may have a structural unit having a ring structure in its side chains (hereinafter also referred to as "structural unit (C)"). By having a ring structure in its side chains, the hydrophobicity of the polymer can be improved, for example, its solvent resistance can be improved.

[0066] Examples of the above-mentioned ring structures include aromatic ring structures such as benzene, or alicyclic structures such as cyclohexane skeletons, adamantane skeletons, and norbornene skeletons. For the above polymer to have a ring structure in its side chain, it is preferable to polymerize a monomer component that includes an aromatic hydrocarbon group or an alicyclic hydrocarbon group and a monomer having a polymerizable double bond.

[0067] Examples of the above-mentioned aromatic hydrocarbon groups include aryl groups such as benzyl, tolyl, naphthyl, and biphenyl.

[0068] The above-mentioned alicyclic hydrocarbon groups preferably have 3 to 20 carbon atoms, more preferably 3 to 15 carbon atoms. Specifically, the above-mentioned alicyclic hydrocarbon groups include monocyclic hydrocarbon groups such as cyclopropyl, cyclopentyl, cyclohexyl, cyclooctyl, cyclododecyl, cycloheptyl, cyclobutenyl, cyclopentenyl, and cyclohexenyl; and polycyclic hydrocarbon groups such as dicyclopentanyl, dicyclopentenyl, tricyclodecanyl, adamantyl, and isobornyl. These may have substituents.

[0069] Examples of polymerizable double bonds include those similar to the ethylenically unsaturated double bonds described above, such as (meth)acryloyl groups, vinyl groups, allyl groups, and methallyl groups. Among these, the (meth)acryloyl group is preferred in terms of reactivity.

[0070] Examples of monomers that give the above structural unit (C) include alicyclic hydrocarbon group-containing monomers such as cyclohexyl (meth)acrylate, cyclohexylmethyl (meth)acrylate, isobornyl (meth)acrylate, 1-adamantyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, tricyclodecanyl (meth)acrylate, dimethylol-tricyclodecane di(meth)acrylate, pentacyclopentadecanedimethanol di(meth)acrylate, cyclohexanedimethanol di(meth)acrylate, norbornane dimethanol di(meth)acrylate; and aromatic hydrocarbon group-containing monomers such as benzyl (meth)acrylate and 1-molethoxylated phenylphenol acrylate. Among these, monomers containing alicyclic hydrocarbon groups are preferred because they can improve hydrophobicity, and cyclohexyl (meth)acrylate is more preferred.

[0071] The content of the above structural unit (C) is preferably 1 to 60% by mass, more preferably 5 to 50% by mass, and even more preferably 5 to 40% by mass, based on 100% by mass of the total structural units of the polymer.

[0072] The above polymer may have only one type of structural unit (C), or it may have two or more types.

[0073] The above polymer may further have other structural units (D) as needed. Examples of the other structural units (D) mentioned above include (meth)acrylic acid ester monomers other than the monomer that gives structural unit (B), hydroxyl group-containing monomers, or structural units derived from other copolymerizable monomers.

[0074] Examples of (meth)acrylic acid ester monomers other than the monomer that gives the above structural unit (B) include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, t-butyl (meth)acrylate, 1-methylpropyl (meth)acrylate, 2-methylpropyl (meth)acrylate, 1,1-dimethylethyl (meth)acrylate, n-pentyl (meth)acrylate, 1-methylbutyl (meth)acrylate, 2-methylbutyl (meth)acrylate, 3-methylbutyl (meth)acrylate, 2,2-dimethylpropyl (meth)acrylate, 1-ethylpropyl (meth)acrylate, n-hexyl (meth)acrylate, and 1,1-dimethylpropyl (meth)acrylate. Examples include propyl, 1,2-dimethylpropyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, 1,4-dioxaspiro[4,5]deca-2-ylmethacrylic acid, (meth)acryloylmorpholine, 4-(meth)acryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-(meth)acryloyloxymethyl-2-methyl-2-isobutyl-1,3-dioxolane, 4-(meth)acryloyloxymethyl-2-methyl-2-cyclohexyl-1,3-dioxolane, and 4-(meth)acryloyloxymethyl-2,2-dimethyl-1,3-dioxolane.

[0075] Examples of the hydroxyl group-containing monomers mentioned above include hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 2,3-hydroxypropyl (meth)acrylate.

[0076] Examples of other copolymerizable monomers include one or more of the following compounds. (Meth)acrylamides such as N,N-dimethyl(meth)acrylamide and N-methylol(meth)acrylamide; macromonomers having a (meth)acryloyl group at one end of the polymer chain, such as polystyrene, polymethyl(meth)acrylate, polyethylene oxide, polypropylene oxide, polysiloxane, polycaprolactone, and polycaprolactam; conjugated dienes such as 1,3-butadiene, isoprene, and chloroprene; vinyl esters such as vinyl acetate, vinyl propionate, vinyl butyrate, and vinyl benzoate; methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, and 2-ethylhexyl Examples include vinyl ethers such as N-vinyl ether, n-nonyl vinyl ether, lauryl vinyl ether, cyclohexyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, methoxyethoxyethyl vinyl ether, methoxypolyethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, and 4-hydroxybutyl vinyl ether; N-vinyl compounds such as N-vinylpyrrolidone, N-vinylcaprolactam, N-vinylimidazole, N-vinylmorpholin, and N-vinylacetamide; and unsaturated isocyanates such as (meth)acrylate isocyanatoethyl and allyl isocyanate. The above polymer may have only one type of structural unit (D), or it may have two or more types.

[0077] The content of the above structural unit (D) is preferably 0 to 60% by mass, more preferably 0.5 to 50% by mass, and even more preferably 1 to 40% by mass, based on 100% by mass of the total structural units of the polymer.

[0078] The weight-average molecular weight of the above polymer is preferably 3,000 to 50,000. When the weight-average molecular weight is within the above range, the viscosity can be adjusted to an appropriate range, resulting in good handling properties, and further improvements in adhesion and developability. The weight-average molecular weight is more preferably 4,000 to 30,000, even more preferably 5,000 to 20,000, and particularly preferably 5,000 to 15,000. In this specification, the weight-average molecular weight can be determined by the method described in the examples below.

[0079] The acid value of the above polymer is preferably 50 to 200 mg KOH / g. When the acid value is within the above range, not only is alkali solubility more pronounced, but the adhesion of the cured product is further improved, and the development speed is even higher. Furthermore, the dispersibility of the above polymer is also good. The above acid value is more preferably 60 to 150 mg KOH / g, and even more preferably 70 to 150 mg KOH / g. In this specification, the acid value can be determined by the method described in the examples below.

[0080] The glass transition temperature (Tg) of the above polymer is preferably 100°C or lower. When the glass transition temperature is within the above range, the polymer exhibits excellent developability and adhesion. The glass transition temperature is preferably 90°C or lower, more preferably 80°C or lower, and even more preferably 70°C or lower. Furthermore, from the viewpoint of heat resistance, the glass transition temperature is preferably -20°C or higher, more preferably 0°C or higher, and particularly preferably 20°C or higher. In other words, the glass transition temperature (Tg) of the above polymer is preferably -20 to 100°C, more preferably 0 to 90°C, even more preferably 20 to 80°C, and particularly preferably 20 to 70°C. In this specification, the glass transition temperature can be determined by the method described in the examples below.

[0081] (Method of producing polymers) The method for producing the polymer of the present invention will be described below. The method for obtaining the above polymer is not particularly limited, but it is preferable that the polymer be obtained by polymerizing monomer components that include at least a monomer (a) that gives the above-mentioned structural unit (A), a monomer (b) that gives the above-mentioned structural unit (B), and the above-mentioned acid group-containing monomer (s). The synthesis method will be described below.

[0082] The monomer component used in polymerization is a monomer component that includes at least the above monomer (a), the above monomer (b), and the above acid group-containing monomer (s). The proportions of each monomer shown above are not particularly limited as long as a polymer with excellent developability and adhesion of the cured product can be obtained. For example, the content of monomers (a), (b), and (s) is preferably 0.5 to 50% by mass of monomer (a), 15 to 80% by mass of monomer (b), and 1 to 50% by mass of monomer (s) based on 100% by mass of the total amount of monomer components that give the polymer, and more preferably 1 to 40% by mass of monomer (a), 20 to 70% by mass of monomer (b), and 5 to 35% by mass of monomer (s).

[0083] Furthermore, when the monomer component that gives the polymer includes monomer (a), monomer (b), monomer (s), and monomer (c) that gives the structural unit (C) described above, the content of each monomer is preferably 0.5 to 50% by mass for monomer (a), 15 to 80% by mass for monomer (b), 1 to 50% by mass for monomer (s), and 1 to 60% by mass for monomer (c), relative to 100% by mass of the total amount of monomer component that gives the polymer, and more preferably 1 to 40% by mass for monomer (a), 20 to 70% by mass for monomer (b), 5 to 35% by mass for monomer (s), and 5 to 40% by mass for monomer (c).

[0084] Furthermore, when the monomer component that gives the polymer includes monomer (a), monomer (b), monomer (s), monomer (c), and monomer (d) that gives the structural unit (D) described above, the content of each monomer is preferably 0.5 to 50% by mass for monomer (a), 15 to 80% by mass for monomer (b), 1 to 50% by mass for monomer (s), 1 to 60% by mass for monomer (c), and 1 to 60% by mass for monomer (d), relative to 100% by mass of the total amount of monomer component that gives the polymer, and more preferably 1 to 40% by mass for monomer (a), 20 to 70% by mass for monomer (b), 5 to 35% by mass for monomer (s), 5 to 40% by mass for monomer (c), and 1 to 40% by mass for monomer (d).

[0085] The method for polymerizing the above monomer components is not particularly limited, and commonly used methods such as bulk polymerization, solution polymerization, and emulsion polymerization can be used, and can be appropriately selected according to the purpose and application. Among these, solution polymerization is preferred because it is industrially advantageous and allows for easy adjustment of the molecular weight and other structural parameters. Furthermore, the polymerization mechanism of the above monomer components can be based on polymerization methods such as radical polymerization, anionic polymerization, cationic polymerization, and coordination polymerization, but polymerization methods based on the radical polymerization mechanism are preferred because they are industrially advantageous. Preferred forms of polymerization reactions are described in Japanese Patent Application Publication No. 2016-29151

[0062] to

[0072] .

[0086] The polymerization initiation method in the above polymerization reaction is sufficient to supply the necessary energy to the monomer component from an active energy source such as heat, electromagnetic waves (e.g., infrared rays, ultraviolet rays, X-rays, etc.), or electron beams. Furthermore, the use of a polymerization initiator in combination is preferable because it can significantly reduce the energy required to initiate polymerization and facilitate reaction control. The molecular weight of the polymer obtained by polymerizing the above monomer component can be controlled by adjusting the amount and type of polymerization initiator, the polymerization temperature, and the type and amount of chain transfer agent.

[0087] Examples of polymerization initiators include peroxides and azo compounds commonly used as polymerization initiators. Examples of chain transfer agents include compounds having a mercapto group, such as alkyl mercaptans, mercaptocarboxylic acids, and mercaptocarboxylic acid esters, commonly used as chain transfer agents. These may be used individually or in combination of two or more. The amounts added can be appropriately determined by known methods.

[0088] Examples of solvents used in the above polymerization include alcohols such as methanol, ethanol, isopropanol, n-butanol, ethylene glycol monomethyl ether, and propylene glycol monomethyl ether; ethers such as tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether; ketones such as acetone and methyl ethyl ketone; esters such as ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, and 3-methoxybutyl acetate; aromatic hydrocarbons such as toluene, xylene, and ethylbenzene; chloroform; dimethyl sulfoxide; and dimethyl carbonate. These solvents may be used individually or in combination of two or more.

[0089] Furthermore, within the limits that do not impair the effects of the present invention, epoxy group-containing monomers may be added to some of the acid groups contained in the polymer. The reaction method is not particularly limited, and any known method may be used as appropriate, but for example, the reaction temperature is preferably 60 to 140°C. It is also preferable to use known catalysts such as amine compounds such as triethylamine and dimethylbenzylamine; ammonium salts such as tetraethylammonium chloride; phosphonium salts such as tetraphenylphosphonium bromide; and amide compounds such as dimethylformamide.

[0090] The amount of epoxy group-containing monomer used is preferably such that the content of the structural unit represented by the general formula (2) is 5% by mass or less, more preferably 3% by mass or less, particularly preferably 0.5% by mass or less, and most preferably 0% by mass, relative to 100% by mass of the total structural units of the polymer. For example, it is preferably 0 to 5 parts by mass, more preferably 0 to 3 parts by mass, particularly preferably 0 to 1 part by mass, and most preferably 0 to 0.5 parts by mass (a range where it is substantially absent) relative to 100 parts by mass of the total amount of monomer components that give the polymer. This further improves the adhesion of fine wires and enables pattern refinement.

[0091] During synthesis, it is preferable to set the amounts of solvent and each monomer component so that the final solid content concentration of the polymer solution is 10 to 70% by mass. In terms of productivity and polymerizability, a more preferable final solid content concentration (non-volatile content concentration) is 20 to 65% by mass, and even more preferably 25 to 60% by mass.

[0092] The polymer of the present invention can provide cured products (cured films, fine patterns) with excellent developability, pattern formation properties, and fine line adhesion. Therefore, it is useful as a polymer for resists used to produce colored pixels, black matrices, black column spacers, overcoats, photospacers, and optical waveguides for color filters, as well as for alkali-developable negative resist materials. Furthermore, because it has good colorant dispersibility, it is also useful for colored photosensitive resin compositions for color filters. The polymer is particularly preferably used as an alkali-soluble resin for binder resins for color resists, and is extremely useful as a component of photosensitive resin compositions.

[0093] 2. Photosensitive resin composition The polymer described above can be further used to form a photosensitive resin composition containing a polyfunctional monomer. Furthermore, the photosensitive resin composition can optionally contain a photopolymerization initiator and a colorant. Because the above photosensitive resin composition contains the polymer, it can provide a cured product with a fast development speed, excellent pattern formation properties, and superior adhesion to fine lines. Furthermore, by including a polyfunctional monomer, the cured product can be provided with excellent curability, adhesion to the substrate, mechanical strength, heat resistance, and other physical properties. Such a photosensitive resin composition containing the polymer and polyfunctional monomer is also part of the present invention. While not limited to its applications, it is suitably used as a material for forming protective films on colored pixels of color filters, color filters, liquid crystal display elements, integrated circuit elements, solid-state image sensors, etc.

[0094] In the above photosensitive resin composition, the polymer content is preferably 5% by mass or more, and preferably 70% by mass or less, based on 100% by mass of the total solid content of the photosensitive resin composition. Within this range, the effects of the present invention can be more significantly realized. More preferably, it is 10-65% by mass, even more preferably 10-50% by mass, particularly preferably 10-40% by mass, even more preferably 10-35% by mass, and most preferably 15-35% by mass. Note that "total solid content" refers to the total amount of components that form the cured product (excluding solvents that volatilize during cured product formation).

[0095] In the above photosensitive resin composition, the polyfunctional monomer is a low-molecular-weight compound having polymerizable unsaturated bonds (also referred to as polymerizable unsaturated groups) that can be polymerized by irradiation with free radicals, electromagnetic waves (e.g., infrared rays, ultraviolet rays, X-rays, etc.), electron beams, or other active energy rays. For example, a polyfunctional compound having two or more polymerizable unsaturated groups in its molecule can be mentioned. The molecular weight of the above polyfunctional monomer is not particularly limited, but from the viewpoint of handling, for example, 3000 or less is preferred, and 2000 or less is more preferred.

[0096] Among the above polyfunctional monomers, polyfunctional (meth)acrylate compounds with two or more functions (hereinafter also simply referred to as "polyfunctional (meth)acrylate compounds") are particularly preferred. These are compounds having two or more (meth)acryloyl groups in one molecule. By including such compounds, the photosensitive resin composition becomes excellent in photosensitivity and curability, making it possible to obtain a cured film (fine pattern) with high hardness and high adhesion. The number of functions of the above polyfunctional (meth)acrylate compound is preferably 3 or more, more preferably 4 or more, and even more preferably 5 or more. Furthermore, from the viewpoint of further suppressing curing shrinkage, the number of functions is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less. That is, the number of functions of the above polyfunctional (meth)acrylate compound is preferably 3 to 10, more preferably 4 to 8, and even more preferably 5 to 6.

[0097] Examples of the above-mentioned polyfunctional monomers include polyfunctional (meth)acrylates such as (di)ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and tri(meth)acrylate of tris(hydroxyethyl) isocyanurate. Among these, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethylene oxide-added dipentaerythritol hexa(meth)acrylate, propylene oxide-added trimethylolpropane tri(meth)acrylate, propylene oxide-added ditrimethylolpropane tetra(meth)acrylate, propylene oxide-added pentaerythritol tetra(meth)acrylate, propylene oxide-added dipentaerythritol hexa(meth)acrylate, ε-caprolactone-added trimethylolpropane tri(meth)acrylate, ε-caprolactone-added ditrimethylolpropane tetra(meth)acrylate, ε-caprolactone-added pentaerythritol tetra(meth)acrylate, and ε-caprolactone-added dipentaerythritol hexa(meth)acrylate are preferred.

[0098] The content ratio of the above-mentioned polyfunctional monomer can be set appropriately depending on the type of polyfunctional monomer and polymer used, as well as the purpose and application. However, from the viewpoint of superior developability, curability, and adhesion, it is preferable that the content ratio be 2% by mass or more, and preferably 85% by mass or less, based on 100% by mass of the total solid content of the photosensitive resin composition. The lower limit is more preferably 5% by mass or more, even more preferably 10% by mass or more, and particularly preferably 15% by mass or more. The upper limit is more preferably 75% by mass or less, even more preferably 60% by mass or less, particularly preferably 50% by mass or less, and most preferably 40% by mass or less. In other words, the content of the above polyfunctional monomer is more preferably 5 to 75% by mass, even more preferably 10 to 60% by mass, particularly preferably 15 to 50% by mass, and most preferably 15 to 40% by mass, based on 100% by mass of the total solid content of the photosensitive resin composition.

[0099] Furthermore, the content of the polyfunctional monomer is preferably 50 parts by mass or more and 500 parts by mass or less per 100 parts by mass of polymer. When the polyfunctional monomer content is within this range, a cured film with higher surface hardness can be obtained, and in combination with the preferred weight-average molecular weight of the polymer being 3000 or more, the developability is further improved. More preferably, it is 80 parts by mass or more, even more preferably 100 parts by mass or more, and particularly preferably 120 parts by mass or more. Also, from the viewpoint of further improving developability, it is more preferable to be 400 parts by mass or less. Even more preferably, it is 300 parts by mass or less, particularly preferably 200 parts by mass or less, and most preferably 150 parts by mass or less. In other words, the content of the polyfunctional monomer is more preferably 80 to 400 parts by mass, even more preferably 100 to 300 parts by mass, particularly preferably 120 to 200 parts by mass, and most preferably 120 to 150 parts by mass, per 100 parts by mass of polymer.

[0100] In the above-mentioned photosensitive resin composition, it is preferable to use a light or thermal polymerization initiator when curing the photosensitive resin composition. As a photopolymerization initiator, known photopolymerization initiators such as alkylphenone compounds, aminoketone compounds, benzophenone compounds, benzoin compounds, thioxanthone compounds, halomethylated triazine compounds, halomethylated oxadiazole compounds, biimidazole compounds, oxime ester compounds, oxime ether compounds, titanocene compounds, benzoic acid ester compounds, and acridine compounds can be used.

[0101] Specifically, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, oligo{2-hydroxy- Acetophenones such as 2-methyl-1-[4-(1-methylvinyl)phenyl]propanone, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpionyl)benzyl]phenyl}-2-methylpropan-1-one; benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether; benzophenone, o-methyl benzoylbenzoate, 4-phenylbenzophenone, 4- Benzoyl-4'-methyl-diphenyl sulfide, 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4-benzoyl-N,N-dimethyl-N-[2-(1-oxo-2-propenyloxy)ethyl]benzenemethanaminonium bromide, (4-benzoylbenzyl)trimethylammonium chloride, and other benzophenones; 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2, Examples of thioxanthones include 4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, 2-(3-dimethylamino-2-hydroxy)-3,4-dimethyl-9H-thioxanthone-9-one mesochloride, and others such as phenylglyoxylic methyl ester, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. Among these, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone are preferred.

[0102] Other examples include organic peroxides such as cumene hydroperoxide, diisopropylbenzene hydroperoxide, di-t-butyl peroxide, lauroyl peroxide, benzoyl peroxide, t-butyl peroxyisopropyl carbonate, t-amyl peroxy-2-ethylhexanoate, and t-butyl peroxy-2-ethylhexanoate; azo compounds such as 2,2'-azobis(isobutyronitrile), 1,1'-azobis(cyclohexanecarbonile), 2,2'-azobis(2,4-dimethylvaleronitrile), and dimethyl-2,2'-azobis(2-methylpropionate); and titanocene compounds such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrole-1-yl)-phenyl)titanium ("IRGACURE784", manufactured by BASF).

[0103] In particular, alkylphenone compounds, aminoketone compounds, oxime ester compounds, and oxime ether compounds are preferred as the above-mentioned photopolymerization initiators. These include alkylphenone compounds such as 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one ("IRGACURE907", manufactured by BASF) and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 ("IRGACURE369", manufactured by BASF), as well as 1,2-octanedione, 1-[4-(phenylthio)phenyl]-,2-(O-benzoylo It is more preferable to use oxime ester compounds such as xime ("OXE01", manufactured by BASF), ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-,1-(O-acetyloxime) ("OXE02", manufactured by BASF), 1,2-octanedione, 1-[4-(phenylthio)-,2-,(O-benzoyloxime)], ethanone ("OXE03", manufactured by BASF), and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-,1-(O-acetyloxime) ("OXE04", manufactured by BASF). The above photopolymerization initiators may be used individually or in combination of two or more.

[0104] Among the above photopolymerization initiators, it is particularly preferable to use at least alkylphenone compounds and aminoketone compounds (also referred to as aminoketone polymerization initiators). In other words, it is preferable that the above photosensitive resin composition further contains an aminoketone polymerization initiator. This results in better hardness and adhesion.

[0105] The content of the above-mentioned photopolymerization initiator can be set appropriately according to the purpose, application, etc., and is not particularly limited, but it is preferable to have 0.5 parts by mass or more per 100 parts by mass of the total solid content of the photosensitive resin composition. This makes it possible to obtain a cured film with superior adhesion. More preferably it is 1 part by mass or more, and even more preferably 1.5 parts by mass or more. Furthermore, considering the balance with the effects of the decomposition products of the photopolymerization initiator and economic efficiency, it is preferable to have 30 parts by mass or less. More preferably it is 20 parts by mass or less, and even more preferably 10 parts by mass or less. In other words, the content of the above-mentioned photopolymerization initiator is preferably 0.5 to 30 parts by mass, more preferably 1 to 20 parts by mass, and even more preferably 1.5 to 10 parts by mass, per 100 parts by mass of the total solid content of the photosensitive resin composition.

[0106] Examples of photosensitizers and photoradical polymerization accelerators that may be used in combination with the above-mentioned photopolymerization initiators include: dye compounds such as xanthene dyes, coumarin dyes, 3-ketocoumarin compounds, and pyromethene dyes; dialkylaminobenzene compounds such as ethyl 4-dimethylaminobenzoate and 2-ethylhexyl 4-dimethylaminobenzoate; and mercaptan-based hydrogen donors such as 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, and 2-mercaptobenzimidazole.

[0107] The photosensitive resin composition of the present invention (preferably a negative-type photosensitive resin composition) preferably contains a colorant. Examples of the colorant include pigments and dyes. Either a pigment or a dye may be used as the colorant, or a combination of pigments and dyes may be used. For example, when forming red, blue, and green pixels of a color filter, it is preferable to use known methods that appropriately combine colorants, such as blue and purple, or green and yellow, to achieve the desired color characteristics. Also, when forming a black matrix or black column spacer, it is preferable to use a black colorant. Among the colorants, pigments are preferred in terms of durability, and dyes are preferred in terms of improving the brightness of panels, etc. These can be appropriately selected according to the desired characteristics.

[0108] In the photosensitive resin composition of the present invention, pigments are preferred in that the heat resistance to coloring in the cured product can be further improved. As the pigment, the same as that described in Japanese Patent Application Publication No. 2015-157909 can be used. The above pigment is not particularly limited, but examples include organic pigments such as azo pigments, phthalocyanine pigments, polycyclic pigments (quinacridone, perylene, perinone, isoindolinone, isoindoline, dioxazine, thioindigo, anthraquinone, quinophthalone, metal complex, diketopyrrolopyrrole, etc.), dye lake pigments; white / extender pigments (titanium dioxide, zinc oxide, zinc sulfide, clay, talc, barium sulfate, calcium carbonate, etc.), and chromatic pigments (lead yellow, cadmium). Examples include inorganic pigments such as aluminum-based pigments, chrome vermilion, nickel titanium, chromium titanium, yellow iron oxide, red iron oxide, zinc chromate, red lead, ultramarine, Prussian blue, cobalt blue, chrome green, chromium oxide, bismuth vanadate, etc., black pigments (carbon black, bone black, graphite, iron black, titanium black, etc.), luminescent pigments (pearl pigments, aluminum pigments, bronze pigments, etc.), and fluorescent pigments (zinc sulfide, strontium sulfide, strontium aluminate, etc.).

[0109] As the dyes mentioned above, for example, organic dyes described in Japanese Patent Publication No. 2010-9033, Japanese Patent Publication No. 2010-211198, Japanese Patent Publication No. 2009-51896, and Japanese Patent Publication No. 2008-50599 can be used. Among these, azo dyes, anthraquinone dyes, phthalocyanine dyes, quinoneimine dyes, quinoline dyes, nitro dyes, carbonyl dyes, methine dyes, etc. are preferred. These colorants may be used individually or in combination of two or more.

[0110] The content ratio of the above-mentioned colorant is not particularly limited and can be set appropriately depending on the purpose and application, but preferably it is 2 to 80% by mass, more preferably 5 to 70% by mass, and even more preferably 10 to 60% by mass, based on 100% by mass of the total solid content of the above-mentioned photosensitive resin composition. By controlling it within these ranges, it is possible to fully meet the recent demands for higher color purity and higher brightness.

[0111] Furthermore, if the photosensitive resin composition of the present invention contains the above-mentioned colorant, it is preferable to further contain a dispersant. The above-mentioned dispersant has interaction sites with the colorant and interaction sites with the dispersion medium (e.g., solvent or binder resin), and functions to stabilize the dispersion of the colorant in the dispersion medium. Generally, these are classified into resin-type dispersants (e.g., polymer dispersants), surfactants (e.g., low molecular weight dispersants), and dye derivatives. These may be used individually or in combination of two or more.

[0112] Examples of the above-mentioned resin-type dispersants include polyurethane, polycarboxylic acid esters such as polyacrylate, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydrogen group-containing polycarboxylic acid esters, amides and their salts formed by the reaction of poly(lower alkyleneimines) with polyesters having free carboxyl groups, (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylic acid ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, polyvinylpyrrolidone, polyester-based materials, modified polyacrylates, ethylene oxide / polypropylene oxide adducts, and the like. Commercially available resin-type dispersants include those similar to those described in Japanese Patent Publication No. 2015-157909.

[0113] Examples of the surfactants mentioned above include anionic surfactants such as polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyl ether disulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, sodium stearate, and sodium lauryl sulfate; nonionic surfactants such as polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene sorbitan monostearate, and polyethylene glycol monolaurate; cationic surfactants such as alkyl quaternary ammonium salts and their ethylene oxide adducts; and amphoteric surfactants such as alkyl betaines such as alkyldimethylaminoacetic acid betaine and alkylimidazolines.

[0114] The above-mentioned pigment derivatives are compounds in which a functional group is introduced into the pigment. Examples of functional groups include sulfonic acid groups, sulfonamide groups and their quaternary salts, dialkylamino groups, hydroxyl groups, carboxyl groups, amide groups, and phthalimide groups. Examples of the structures of the parent pigments include azo, anthraquinone, quinophthalone, phthalocyanine, quinacridone, benzimidazolon, isoindoline, dioxazine, indanthrene, perylene, and diketopyrrolopyrrole.

[0115] The proportion of the above-mentioned dispersant can be set appropriately depending on the purpose and application, but from the viewpoint of balancing dispersion stability, durability (heat resistance, light resistance, weather resistance, etc.), and transparency, it is preferable, for example, to be 0.01 to 60% by mass, based on 100% by mass of the total solid content of the photosensitive resin composition. More preferably, it is 0.1 to 50% by mass, and even more preferably 0.3 to 40% by mass.

[0116] The method for preparing the above-mentioned photosensitive resin composition is not particularly limited and any known method may be used. For example, one method is to mix and disperse each of the above-mentioned components using various mixers and dispersers. The mixing and dispersion steps are not particularly limited and may be carried out by known methods. In addition, other commonly performed steps may be included. If the above-mentioned photosensitive resin composition contains a colorant, it is preferable to prepare it through a colorant dispersion treatment step.

[0117] One example of the dispersion process for the above-mentioned colorant is to first weigh the colorant (preferably an organic pigment), dispersant, and solvent in predetermined quantities, and then use a disperser to disperse the colorant into fine particles to obtain a liquid colorant dispersion (also referred to as "mill base"). Examples of dispersers include paint conditioners, bead mills, roll mills, ball mills, jet mills, homogenizers, kneaders, and blenders. Preferably, the dispersion process involves kneading and dispersing the mixture using a roll mill, kneader, or blender, followed by fine dispersion using a media mill such as a bead mill filled with 0.01 to 1 mm beads. To the obtained mill base, a composition containing the above-mentioned polymer, polyfunctional monomer, etc. (preferably a transparent liquid), which has been separately stirred and mixed, is added and mixed to obtain a uniform dispersion solution, thereby obtaining a photosensitive resin composition. It is preferable to filter the obtained photosensitive resin composition using a filter or the like to remove fine debris.

[0118] The photosensitive resin composition of the present invention (preferably a negative-type photosensitive resin composition) preferably contains a solvent as a diluent, if necessary. The solvent is not particularly limited as long as it uniformly dissolves the components such as the polymer, polyfunctional monomer, photopolymerization initiator, and colorant. Specifically, examples include ethers such as tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; esters such as ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, and 3-methoxybutyl acetate; alcohols such as methanol, ethanol, isopropanol, n-butanol, ethylene glycol monomethyl ether, and propylene glycol monomethyl ether; aromatic hydrocarbons such as toluene, xylene, and ethylbenzene; chloroform, dimethyl sulfoxide, etc. The solvent content can be appropriately set according to the optimal viscosity when using the photosensitive resin composition. For example, it is 1000 parts by mass or less, more preferably 700 parts by mass or less, per 100 parts by mass of polymer. A preferred lower limit is 30 parts by mass or more, more preferably 60 parts by mass or more, per 100 parts by mass of polymer. By controlling the numerical range to the above, the handling properties and storage stability of the composition, as well as the efficiency during coating operations, are improved. Specifically, the solvent content is preferably 30 to 1000 parts by mass, more preferably 60 to 700 parts by mass, per 100 parts by mass of polymer.

[0119] The viscosity of the above photosensitive resin composition can be appropriately set according to the desired cured film thickness. The viscosity of the photosensitive resin composition can be adjusted by adding a solvent. The upper limit of the viscosity of the photosensitive resin composition, after adjusting the solid content (non-volatile content) to 40% by adding a solvent, is preferably 30 mPa·s or less, more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. The lower limit of the viscosity is preferably 1 mPa·s or more, and more preferably 5 mPa·s or more, depending on the desired cured film thickness. By setting the viscosity within the above range, handling and application workability are improved.

[0120] In addition to the components described above, the photosensitive resin composition of the present invention may also contain known additives such as fillers (e.g., aluminum hydroxide, talc, clay, barium sulfate), quantum dot particles, defoaming agents, coupling agents, leveling agents, sensitizers, release agents, lubricants, plasticizers, antioxidants, ultraviolet absorbers, light stabilizers, flame retardants, polymerization inhibitors, polymerization retardants, polymerization accelerators, thickeners, dispersants, and surfactants, to the extent that they do not impair the effects of the present invention.

[0121] The present invention also relates to a cured film obtained by curing the above polymer and / or the above photosensitive resin composition. For example, a cured film can be obtained by coating the above photosensitive resin composition onto a substrate and curing it. Examples of materials that can be used as the substrate to which the film is coated include transparent materials such as glass, acrylic resin, polycarbonate resin, polyester resin such as PET, and polystyrene resin, as well as metallic materials such as aluminum, copper, iron, and stainless steel. The cured film preferably has a film thickness (thickness) of 0.1 to 20 μm. This allows for sufficient reduction of the height of components and display devices using the cured film. More preferably, the thickness is 0.5 to 10 μm, and even more preferably 0.5 to 8 μm.

[0122] The above-mentioned cured film can be suitably used in various optical components and components of electrical and electronic equipment, such as color filters, black matrices, photospacers, black column spacers, inks, printing plates, printed wiring boards, semiconductor elements, photoresists, insulating films, films, and organic protective films used in liquid crystal, organic EL, quantum dot, and micro-LED liquid crystal display devices, solid-state image sensors, and touch panel display devices. In particular, it is preferably used in color filter applications. Thus, a color filter using the above-mentioned photosensitive resin composition, that is, specifically a color filter having a cured product (cured film) formed by the above-mentioned photosensitive resin composition on a substrate, and a method for manufacturing a color filter are one of the preferred embodiments of the present invention.

[0123] 3. Color Filters An example of a configuration having the above-mentioned cured product (cured film) is a color filter having the above-mentioned cured film on a substrate. The method for manufacturing this will be described in detail below.

[0124] The components constituting the color filter include, specifically, three primary color (RGB) pixels, a resin black matrix, a protective film, and columnar spacers. It is preferable that at least one of these components constituting the color filter has a cured film formed from the photosensitive resin composition of the present invention. Here, when forming RGB pixels, the resin composition of the present invention contains colorants for each of the three primary colors: red, green, and blue. When forming the resin black matrix, it contains a black colorant.

[0125] The above color filter can be manufactured, for example, as follows: 1) A photosensitive resin composition is coated onto a substrate using a known coating method, dried, and a coating film is prepared. A transparent substrate is preferred as the substrate, and specific examples include glass (preferably alkali-free glass) and transparent plastic. The substrate may be subjected to corona discharge treatment, ozone treatment, chemical treatment with silane coupling agents, etc., as needed. Known coating methods include spin coating and spray coating, with spin coating being preferred. Regarding drying conditions, the drying temperature is preferably room temperature to 120°C, more preferably 60 to 100°C. The drying time is preferably 10 seconds to 60 minutes, more preferably 30 seconds to 10 minutes. Heat drying under atmospheric pressure or vacuum is also preferred.

[0126] 2) Subsequently, a photomask (patterning film) having openings corresponding to the desired pattern shape is placed on the coating obtained in 1) above, either in contact or in a non-contact manner, and cured by irradiation with light. Light refers not only to visible light but also to radiation such as ultraviolet rays, X-rays, and electron beams, but ultraviolet rays are most preferred. A high-pressure mercury lamp is generally preferred as the ultraviolet light source.

[0127] 3) After light irradiation as described in 2) above, development is carried out with a solvent, water, or an alkaline aqueous solution. Among these, an alkaline aqueous solution is preferred because it has a low environmental impact and allows for high-sensitivity development. The alkaline component in the alkaline aqueous solution is not particularly limited, but potassium hydroxide, sodium hydroxide and / or sodium carbonate are preferred. The concentration of the alkaline component is preferably 0.01 to 5% by mass in 100% by mass of the alkaline aqueous solution. When the concentration of the alkaline component is within this range, the solubility of the alkali-soluble polymer is further improved, and the developability (development speed) can be further increased. More preferably it is 0.05 to 3% by mass, and even more preferably 0.1 to 1% by mass. A surfactant may be added to the alkaline aqueous solution.

[0128] 4) The above steps 1) to 3) are carried out using a photosensitive resin composition containing a black colorant to form a resin black matrix on the substrate.

[0129] 5) Next, the colorants of the photosensitive resin composition are sequentially changed to red (R), green (G), and blue (B), and steps 1) to 3) above are repeated to form R, G, and B pixels, thereby creating RGB pixels.

[0130] 6) Next, a protective film is formed on the substrate as needed, for the purpose of protecting the RGB pixels formed on the substrate and improving surface smoothness.

[0131] 7) If the above color filter is a color filter for a liquid crystal display device, it is preferable to further form a columnar spacer. A columnar spacer can be made by coating the surface on which the spacer is to be formed with a photosensitive resin composition to a thickness that results in the desired height of the spacer, and then proceeding through steps 1) to 3) above.

[0132] Here, when manufacturing the color filter, it is preferable to further harden each component by heating after development (post-bake) and completely removing any remaining solvent. The temperature for post-bake is preferably 120 to 300°C. Setting the temperature to this level allows for more sufficient suppression of pixel coloration and the reduction of coating film smoothness due to thermal decomposition, as well as further hardening and increased coating film strength. This makes it possible to further strengthen the hardness and adhesion of the patterned hardened film. More preferably, the temperature is 150 to 250°C, and even more preferably 180 to 230°C. Post-bake may be performed after development in the formation of each component (after step 3 above in the creation of each component), or after all components have been formed.

[0133] As described above, the polymer of the present invention can provide cured products with excellent developability and adhesion. Furthermore, the photosensitive resin composition containing the polymer and polyfunctional monomer of the present invention can provide cured products with a fast development rate and excellent adhesion to the substrate, heat resistance, etc. Such polymers and photosensitive resin compositions of the present invention can be used in applications such as resist materials (preferably resists for color filters), various coating agents, and paints. Moreover, since the polymer has acidic groups such as carboxyl groups, it can be suitably used as an alkali-developable negative-type resist material for producing colored pixels, black matrices, overcoats, photospacers, and optical waveguides for color filters.

[0134] 4. Display device components and display device The display device component and display device of the present invention have the above-mentioned cured film, but may further have one or more other components. In recent years, with the advancement of display device technology, there has been a strong demand for even higher performance from each component used, but by using the photosensitive resin composition of the present invention, the reliability of the display quality and imaging quality of various display devices can be sufficiently improved to adequately meet these needs. The display device is not particularly limited, but for example, liquid crystal display devices, solid-state image sensors, touch panel display devices, etc. are preferred. Among touch panel display devices, capacitive type is particularly preferred.

[0135] The above-mentioned display device component may be a single-layer or multi-layer film-like component made of the cured film, a component in which other layers are further combined with the single-layer or multi-layer component, or a component that includes the cured film in its composition (for example, a color filter). [Examples]

[0136] The present invention will be described in more detail below with reference to examples, but these examples are not intended to limit the present invention, and any modifications or implementations that do not depart from the spirit of the invention are all included within the technical scope of the present invention. The present invention will be specifically illustrated by examples, comparative examples, and characterization evaluations. In the examples and comparative examples, unless otherwise specified, % and wt% refer to mass%, and parts refer to parts by mass. In the following manufacturing examples, various physical properties were evaluated as follows.

[0137] [Evaluation Method] (1) Weight average molecular weight (Mw) Measurements were performed using GPC (HLC-8320GPC, manufactured by Tosoh Corporation) with THF as the eluent and TSKgel SuperHZM-M (manufactured by Tosoh Corporation) as the column, and the results were calculated in terms of standard polystyrene equivalents.

[0138] (2) Solids Approximately 0.3 g of the polymer solution prepared in the examples and comparative examples was weighed into an aluminum cup, dissolved in approximately 1 g of acetone, and then air-dried at room temperature. Afterward, it was dried at 140°C for 3 hours using a hot-air dryer (product name: PHH-101, manufactured by ESPEC Corporation), then allowed to cool in a desiccator, and its weight was measured. The weight (%) of the solid content (polymer) of the polymer solution was calculated from the weight loss.

[0139] (3) Acid value 1.5 g of the polymer solutions prepared in the examples and comparative examples were accurately weighed, dissolved in a mixed solvent of 90 g of acetone and 10 g of water, and titrated with a 0.1 N aqueous KOH solution. The titration was performed using an automatic titrator (product name: COM-1700A, manufactured by Hiranuma Sangyo Co., Ltd.), and the acid value per gram of polymer was determined from the solid content concentration (mgKOH / g).

[0140] (4) Glass transition temperature (Tg) In this example, the glass transition temperature (Tg) of each polymer was calculated. The calculation method conforms to the FOX formula described below. 1 / (Tg+273)=Σ〔wi / (Tgi+273)〕 (In the formula, wi is the mass percentage of monomer i, and Tgi is the glass transition temperature (°C) of the homopolymer of monomer i.) The Tg of the monomer homopolymer used in the above FOX formula can be the value listed in, for example, "POLYMER HANDBOOK THIRD EDITION" (by J. BRANDRUP and EHIMMERGUT, 1989, published by John Wiley & Sons, Inc., pages VI / 209~VI / 277) (if multiple glass transition temperatures are listed, the lowest value should be used). For monomers not listed in "POLYMER HANDBOOK THIRD EDITION," values ​​obtained by computer using commercially available glass transition temperature calculation software (for example, "MATERIALS STUDIO" by Accelrys Software Inc., version: 4.0.0.0, module: Synthia, condition: calculation with an average polymerization molecular weight of 100,000) can be used. Specifically, the polymer Tg of the present invention is calculated using the following formula. 1 / (Tg+273)=w1 / (Tg1+273)+w2 / (Tg2+273)+... Tg: Polymer Tg (w1, w2, ...: weight fractions of monomers 1, 2, ... in the polymer) Tg1, Tg2, ...: Monomers 1, 2, ... constituting the polymer (Tg) For actual measurements, the polymer solution is applied to a 5 cm square glass substrate, spin-coated onto the glass substrate, and dried at room temperature under reduced pressure for 4 hours to form a thin film with a film mass of 30 mg or less, thereby removing volatile components and obtaining the solid content. The amount of residual solvent in the solid content is confirmed to be 0.1 wt% or less by quantitative analysis using gas chromatography. The obtained solid content is measured using a DSC (differential scanning calorimetry, measuring instrument: Netsch DSC3500) under a nitrogen stream at a heating rate of 10°C / min in accordance with JIS-K7121.

[0141] (5) Double bond equivalent (g / mol) The amount of polymer solids was determined by dividing the mass (g) by the amount of double bonds in the polymer (mol).

[0142] [Polymer production] The following polymers were used. [Example 1] In a reaction vessel equipped with a thermometer, stirrer, gas inlet pipe, condenser pipe, and dropper inlet, 630g of propylene glycol monomethyl ether acetate (PGMEA) and 308g of propylene glycol monomethyl ether (PGME) were charged. After purging with nitrogen, the mixture was heated to 90°C. On the other hand, for the dropping tank (A), a beaker was prepared containing 210 g of N-benzylmaleimide (BzMI), 134 g of methacrylic acid (MAA), 8 g of cyclohexyl methacrylate (CHMA), 8 g of methyl methacrylate (MMA), 479 g of 2-ethylhexyl acrylate (2EHA), 147 g of propylene glycol monomethyl ether acetate (PGMEA), 63 g of propylene glycol monomethyl ether (PGME), and 17 g of t-butyl peroxy-2-ethylhexanoate ("Perbutyl® O" manufactured by Nippon Oil & Fats Co., Ltd.), which was stirred and mixed. For the dropping tank (B), a mixture of 38 g of n-dodecyl mercaptan (nDM) and 88 g of propylene glycol monomethyl ether acetate (PGMEA) was prepared, which was stirred and mixed. After the temperature of the reaction vessel reached 90°C, the mixture was started dropwise from the dropping tank over 3 hours while maintaining the same temperature, and polymerization was carried out. After the dropwise addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4g of perbutyl O was added. After maintaining the temperature at 90°C for another 30 minutes, the temperature was raised to 115°C and aged for 90 minutes. After that, it was cooled to room temperature to obtain polymer solution A-1.

[0143] [Example 2] 978g of propylene glycol monomethyl ether acetate (PGMEA) was charged into a reaction vessel equipped with a thermometer, stirrer, gas inlet pipe, condenser pipe, and dropper inlet. After purging with nitrogen, the vessel was heated to 90°C. On the other hand, for the dropping tank (A), a beaker was prepared containing 120g of N-benzylmaleimide (BzMI), 72g of methacrylic acid (MAA), 80g of cyclohexyl methacrylate (CHMA), 248g of methyl methacrylate (MMA), 280g of 2-ethylhexyl acrylate (2EHA), 120g of propylene glycol monomethyl ether acetate (PGMEA), and 16g of t-butyl peroxy-2-ethylhexanoate ("Perbutyl® O" manufactured by Nippon Oil & Fats Co., Ltd.), which was stirred and mixed. For the dropping tank (B), a mixture of 30g of n-dodecyl mercaptan (nDM) and 71g of propylene glycol monomethyl ether acetate (PGMEA) was prepared, which was stirred and mixed. After the temperature of the reaction vessel reached 90°C, the mixture was started dropwise from the dropping tank over 3 hours while maintaining the same temperature, and polymerization was carried out. After the dropwise addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4g of perbutyl O was added. After maintaining the temperature at 90°C for another 30 minutes, the temperature was raised to 115°C and aged for 90 minutes. After that, it was cooled to room temperature to obtain polymer solution A-2.

[0144] [Example 3] In a reaction vessel equipped with a thermometer, stirrer, gas inlet, condenser, and dropper inlet, 572g of propylene glycol monomethyl ether acetate (PGMEA) and 276g of propylene glycol monomethyl ether (PGME) were charged. After purging with nitrogen, the mixture was heated to 90°C. On the other hand, for the dropping tank (A), a beaker was prepared by stirring and mixing 240g of N-benzylmaleimide (BzMI), 172g of methacrylic acid (MAA), 160g of cyclohexyl methacrylate (CHMA), 68g of methyl methacrylate (MMA), 160g of 2-ethylhexyl acrylate (2EHA), 168g of propylene glycol monomethyl ether acetate (PGMEA), 72g of propylene glycol monomethyl ether (PGME), and 16g of t-butyl peroxy-2-ethylhexanoate (manufactured by Nippon Oil & Fats Co., Ltd. as "Perbutyl® O"), and for the dropping tank (B), a mixture of 24g of n-dodecyl mercaptan (nDM) and 72g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring and mixing. After the reaction vessel reached 90°C, polymerization was carried out by starting the addition of the solution from the dropping vessel over a period of 3 hours while maintaining the same temperature. After the addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4g of perbutyl O was added. After maintaining the temperature at 90°C for another 30 minutes, the temperature was raised to 115°C and aged for 90 minutes. After that, it was cooled to room temperature to obtain polymer solution A-3.

[0145] [Example 4] In a reaction vessel equipped with a thermometer, stirrer, gas inlet, condenser, and dropper inlet, 586g of propylene glycol monomethyl ether acetate (PGMEA) and 283g of propylene glycol monomethyl ether (PGME) were charged. After purging with nitrogen, the mixture was heated to 90°C. On the other hand, for the dropping tank (A), a beaker was prepared containing 40g of N-benzylmaleimide (BzMI), 128g of acrylic acid (AA), 64g of cyclohexyl methacrylate (CHMA), 8g of methyl methacrylate (MMA), 560g of 2-ethylhexyl acrylate (2EHA), 159g of propylene glycol monomethyl ether acetate (PGMEA), 68g of propylene glycol monomethyl ether (PGME), and 16g of t-butyl peroxy-2-ethylhexanoate (manufactured by Nippon Oil & Fats Co., Ltd. as "Perbutyl® O"), which was stirred and mixed. For the dropping tank (B), a mixture of 32g of n-dodecyl mercaptan (nDM) and 75g of propylene glycol monomethyl ether acetate (PGMEA) was prepared, which was stirred and mixed. After the temperature of the reaction vessel reached 90°C, the mixture was started dropwise from the dropping tank over 3 hours while maintaining the same temperature, and polymerization was carried out. After the dropwise addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4g of perbutyl O was added. After maintaining the temperature at 90°C for another 30 minutes, the temperature was raised to 115°C and aged for 90 minutes. After that, it was cooled to room temperature to obtain polymer solution A-4.

[0146] [Example 5] In a reaction vessel equipped with a thermometer, stirrer, gas inlet pipe, condenser pipe, and dropper inlet, 620g of propylene glycol monomethyl ether acetate (PGMEA) and 294g of propylene glycol monomethyl ether (PGME) were charged. After purging with nitrogen, the mixture was heated to 90°C. On the other hand, for the dropping tank (A), a mixture of 80g of N-benzylmaleimide (BzMI), 112g of methacrylic acid (MAA), 208g of cyclohexyl methacrylate (CHMA), 400g of 2-ethylbutyl acrylate (2EBA), 131g of propylene glycol monomethyl ether acetate (PGMEA), 56g of propylene glycol monomethyl ether (PGME), and 16g of t-butyl peroxy-2-ethylhexanoate ("Perbutyl® O" manufactured by Nippon Oil & Fats Co., Ltd.) was prepared by stirring and mixing. For the dropping tank (B), a mixture of 28g of n-dodecyl mercaptan (nDM) and 65g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring and mixing. After the temperature of the reaction vessel reached 90°C, the mixture was started dropwise from the dropping tank over 3 hours while maintaining the same temperature, and polymerization was carried out. After the dropwise addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4g of perbutyl O was added. After maintaining the temperature at 90°C for another 30 minutes, the temperature was raised to 115°C and aged for 90 minutes. After that, it was cooled to room temperature to obtain polymer solution A-5.

[0147] [Example 6] Polymer solution A-1 was obtained in the same manner as in [Example 1], and then bubbling of an oxygen / nitrogen = 7 / 93 (v / v) mixed gas was started. Next, 14 g of glycidyl methacrylate (GMA), 3 g of triethylamine (TEA) as a catalyst, and 1 g of Antige W-400 (manufactured by Kawaguchi Chemical Industry Co., Ltd.) as a polymerization inhibitor were charged into the reaction vessel, and the reaction was carried out at 115°C for 11 hours. After that, it was cooled to room temperature to obtain polymer solution A-6.

[0148] [Example 7] Polymer solution A-7 was obtained in the same manner as in Example 1, except that N-phenylmaleimide (PMI) was used instead of N-benzylmaleimide.

[0149] [Example 8] Polymer solution A-8 was obtained in the same manner as in Example 1, except that 252 g of dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate (MD) was used instead of 210 g of N-benzylmaleimide (BzMI), and 437 g of 2-ethylhexyl acrylate (2EHA) was used instead of 479 g.

[0150] [Example 9] Polymer solution A-9 was obtained in the same manner as in Example 5, except that octyl acrylate (OA) was used instead of 2-ethylbutyl acrylate.

[0151] [Example 10] Polymer solution A-10 was obtained in the same manner as in Example 5, except that stearyl methacrylate (STMA) was used instead of 2-ethylbutyl acrylate.

[0152] [Comparative Example 1] Polymer solution A-11 was obtained in the same manner as in Example 5, except that lauryl acrylate (LA) was used instead of 2-ethylbutyl acrylate.

[0153] [Comparative Example 2] Polymer solution A-12 was obtained in the same manner as in Example 5, except that ethyl methacrylate (EMA) was used instead of 2-ethylbutyl acrylate.

[0154] [Comparative Example 3] In a reaction vessel equipped with a thermometer, stirrer, gas inlet pipe, condenser pipe, and dropper inlet, 610 g of propylene glycol monomethyl ether acetate (PGMEA) and 297 g of propylene glycol monomethyl ether (PGME) were charged. After purging with nitrogen, the mixture was heated to 90°C. On the other hand, for the dropping tank (A), a mixture of 70g of N-benzylmaleimide (BzMI), 98g of methacrylic acid (MAA), 182g of cyclohexyl methacrylate (CHMA), 350g of 2-ethylbutyl acrylate (2EBA), 147g of propylene glycol monomethyl ether acetate (PGMEA), 63g of propylene glycol monomethyl ether (PGME), and 14g of t-butyl peroxy-2-ethylhexanoate ("Perbutyl® O" manufactured by Nippon Oil & Fats Co., Ltd.) was prepared by stirring and mixing. For the dropping tank (B), a mixture of 25g of n-dodecyl mercaptan (nDM) and 84g of propylene glycol monomethyl ether acetate (PGMEA) was prepared by stirring and mixing. After the temperature of the reaction vessel reached 90°C, the mixture was started dropwise from the dropping tank over 3 hours while maintaining the same temperature, and polymerization was carried out. After the dropwise addition was complete, the reaction vessel was kept at 90°C for 30 minutes, then 4g of perbutyl O was added. After maintaining 90°C for another 30 minutes, the temperature was raised to 115°C and aged for 90 minutes. After cooling to room temperature, bubbling of an oxygen / nitrogen = 7 / 93 (v / v) mixed gas was started. 81g of glycidyl methacrylate, 2g of triethylamine (TEA) as a catalyst, and 1g of Antige W-400 (manufactured by Kawaguchi Chemical Industry Co., Ltd.) as a polymerization inhibitor were charged, and the reaction was carried out at 115°C for 11 hours. After cooling to room temperature, polymer solution A-13 was obtained.

[0155] [Comparative Example 4] In a reaction vessel equipped with a thermometer, stirrer, gas inlet pipe, condenser pipe, and dropper inlet, 604 g of propylene glycol monomethyl ether acetate (PGMEA) and 290 g of propylene glycol monomethyl ether (PGME) were charged. After purging with nitrogen, the mixture was heated to 90°C. On the other hand, for the dropping tank (A), a beaker was prepared containing 88g of methacrylic acid (MAA), 183g of cyclohexyl methacrylate (CHMA), 132g of methyl methacrylate (MMA), 330g of 2-ethylhexyl acrylate (2EHA), 92g of propylene glycol monomethyl ether acetate (PGMEA), 40g of propylene glycol monomethyl ether (PGME), and 15g of t-butyl peroxy-2-ethylhexanoate (manufactured by Nippon Oil & Fats Co., Ltd. as "Perbutyl® O"), which was stirred and mixed. For the dropping tank (B), a mixture of 18g of n-dodecyl mercaptan (nDM) and 73g of propylene glycol monomethyl ether acetate (PGMEA) was prepared, which was stirred and mixed. After the temperature of the reaction vessel reached 90°C, the mixture was started dropwise from the dropping tank over 3 hours while maintaining the same temperature, and polymerization was carried out. After the dropwise addition was complete, the reaction vessel was kept at 90°C for 30 minutes, and then 4g of perbutyl O was added. After maintaining the temperature at 90°C for another 30 minutes, the temperature was raised to 115°C and aged for 90 minutes. After that, it was cooled to room temperature to obtain polymer solution A-14.

[0156] [Comparative Example 5] Polymer solution A-15 was obtained in the same manner as in Example 1, except that butyl acrylate (BA) was used instead of 2-ethylhexyl acrylate (2EHA).

[0157] [Comparative Example 6] Polymer solution A-16 was obtained in the same manner as in Example 1, except that 2-acryloyloxyethyl succinic acid (HOA-MS) was used instead of methacrylic acid.

[0158] The composition and properties of the polymers in the above polymer solutions A-1 to A-10 (Examples 1 to 10) and A-11 to A-16 (Comparative Examples 1 to 6) are shown in Table 1.

[0159] [Table 1]

[0160] The information in Table 1 is as follows: BzMI:N-Benzylmaleimide PMI: N-phenylmaleimide MD: Dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate MAA: Methacrylic acid AA: Acrylic acid HOA-MS: 2-Acryloyloxyethyl succinate CHMA: Cyclohexyl methacrylate MMA: Methyl methacrylate 2EHA: 2-ethylhexyl acrylate (homopolymer Tg: approx. -50°C) 2EBA: 2-ethylbutyl acrylate (homopolymer Tg: approx. -50°C) STMA: Stearyl methacrylate (Tg of homopolymer: -100℃) OA: Octyl acrylate (Tg of homopolymer: approx. -65°C) LA: Lauryl acrylate (Tg of homopolymer: approx. -3°C) BA: Butyl acrylate (homopolymer Tg: approx. -54°C) EMA: Ethyl methacrylate (Tg of homopolymer: approximately 65°C) GMA: Glycidyl methacrylate

[0161] (Examples 11-20, Comparative Examples 7-12) Using the obtained alkali-soluble resin solutions (polymer solutions A-1 to A-16), photosensitive resin compositions were prepared by the following method and evaluated using the evaluation method (6) below. The results are shown in Table 2.

[0162] [Preparation of Pigment Dispersion 1] Pigment dispersion 1 (solids content 22% by mass) was obtained by mixing 12.9 parts of propylene glycol monomethyl ether acetate (PGMEA), 0.4 parts of Disparon DA-7301 as a dispersant, 2.25 parts of CI Pigment Green 58 as a colorant, and 1.5 parts of CI Pigment Yellow 138 as colorants, and dispersing the mixture in a paint shaker for 3 hours.

[0163] [Preparation of photosensitive resin composition] 8.4 g (total solids content 3.5 g) of the above polymer solution A-1 as a binder resin, 3.5 g of dipentaerythritol hexaacrylate (DPHA) as a polyfunctional monomer, 39.8 g (total solids content 8.75 g) of pigment dispersion 1, and 1.75 g of 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one (trade name "IRGACURE® 907", manufactured by BASF Japan, hereinafter referred to as Irg907) as a photopolymerization initiator were added, and the mixture was diluted with PGMEA to a non-volatile content concentration of 20% by weight to prepare photosensitive resin composition B1. Similarly, photosensitive resin compositions B2 to B16 were prepared using the above polymer solutions (A-2 to A-16) as binder resins. Their compositions are shown in Table 2.

[0164] (6) Evaluation of photosensitive resin composition [Development speed] A photosensitive resin composition was applied to a 10 cm square glass substrate using a spin coater and dried in an oven at 90°C for 3 minutes. After drying, a photomask with 1-100 μm line and space was placed 100 μm from the coating film, and a UV aligner (product name "TME-150RNS", manufactured by TOPCON) equipped with a 2.0 kW ultra-high pressure mercury lamp was used to apply 100 mJ / cm² of UV radiation. 2 Ultraviolet light was irradiated at an intensity equivalent to 365 nm illuminance. After UV irradiation, a 0.05 mass% potassium hydroxide aqueous solution was sprayed onto the coating film using a spin developer to dissolve and remove the unexposed areas. The remaining exposed areas were then developed by washing with pure water for 10 seconds to form a line and space pattern. The time required to dissolve and remove the unexposed areas was measured and defined as the development time (seconds), which was evaluated according to the following criteria. The results are shown in Table 2.

[0165] [Pattern diameter] The diameter of the pattern formed by a 20 μm mask diameter on the glass substrate obtained in the development speed test was measured using a surface roughness meter (Ryoka Systems Co., Ltd., product name VertScan2.0). The results are shown in Table 2. The closer the obtained pattern system was to 20 μm, the better the pattern system was judged to have been obtained.

[0166] [Minimum contact pattern] Line and space patterns were formed using the same procedure as in the development speed test, except that the time for spraying potassium hydroxide solution was changed to twice the development time determined in the development speed test. The smallest possible pattern size was observed with an optical microscope and defined as the minimum contact pattern. The results are shown in Table 2. A minimum contact pattern closer to 1 was considered better.

[0167] [Table 2]

[0168] The abbreviations are as follows: Irg907: IRGACURE(registered trademark) 907, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one DPHA: Dipentaerythritol hexaacrylate

[0169] Based on the evaluation of photosensitive resin compositions under the differences of each polymer in Table 1, as shown in Table 2, the following points were confirmed. [Examples 11-13, 16-18] In all cases, the development time was fast, under 12 seconds, and the pattern diameter was sufficiently small relative to the mask diameter with minimal line thickening. Even when the development time was twice the break time, the minimum contact pattern was still sufficiently small, demonstrating a balance between development speed, pattern diameter, and development margin. In addition, 2EHA in the polymers of Examples 1-4 and 6-8 is a monomer with a polymer Tg of approximately -50°C. Similarly, 2EBA in the polymer of Example 5 is a monomer with a polymer Tg of approximately -50°C.

[0170] [Example 14] The development time was fast at 9 seconds, and although the minimum contact pattern was inferior to Examples 11-13 and 15-18, it was still good.

[0171] [Example 15] The development time was fast at 12 seconds, and the minimum contact pattern was good, although inferior to Examples 11-13 and 16-18. The pattern diameter was also good at 21 μm.

[0172] [Examples 19, 20] The development time was fast, less than 10 seconds. The pattern system also showed little difference from the mask system compared to Comparative Examples 7-9. The minimum contact pattern tended to worsen compared to Examples 11-18, but was better than Comparative Examples 8-12.

[0173] [Comparative Example 7] The minimum contact pattern was sufficiently small at 3 μm. On the other hand, the development time was slow at 20 seconds, and the pattern diameter was large at 25 μm, which was worse than in Examples 11-20. Note that the LA in the polymer of Comparative Example 7 is the monomer with a polymer Tg of approximately -3°C.

[0174] [Comparative Example 8] The development time was slow at 25 seconds, the pattern diameter was large at 26 μm, and the minimum contact pattern was large at 8 μm, which was worse than in Examples 11-20. Note that the EMA of the polymer in Comparative Example 8 is that of the monomer with a polymer Tg of approximately 65°C.

[0175] [Comparative Example 9] The development time was a sufficiently fast 9 seconds. On the other hand, the pattern diameter was large at 28 μm and the minimum contact pattern was large at 8 μm, which was worse compared to Examples 11-20. The polymer in Comparative Example 9 is a polymer that has ethylenically unsaturated double bonds in its side chains.

[0176] [Comparative Example 10-12] The pattern diameter was a good 22 μm. On the other hand, the development time was slow at 13 seconds, and the minimum contact pattern was large at 8-10 μm, which was worse than in Examples 11-20. Note that the polymer in Comparative Example 10 is a polymer without structural unit (A), and BA in the polymer of Comparative Example 11 has a butyl group and is a monomer with a polymer Tg of approximately -54°C. HOA-MS in Comparative Example 12 is an acid group-containing monomer compound, and the acid group has 8 atoms spaced from the main chain.

[0177] (Example 21, Comparative Examples 13, 14) Using the obtained alkali-soluble resin solution, photosensitive resin compositions C1 to C3 were prepared by diluting them with PGMEA to the composition shown in Table 3, with a non-volatile content concentration of 20% by weight. The heat resistance was evaluated by the following method. The results are shown in Table 3.

[0178] (7) Heat resistance A photosensitive resin composition was applied to a 10 cm square glass substrate using a spin coater and dried in an oven at 250°C for 1 hour. After drying, one substrate was heated at 250°C for 1 hour to obtain a cured film that had not undergone the 250°C heating test and a cured film that had undergone the heating test. The color difference (ΔEab) of the two cured films obtained in this way was measured using a colorimeter. The results are shown in Table 3 below. A smaller ΔEab value indicated a smaller color difference before and after the heating test, and was judged to have better heat resistance.

[0179] [Table 3]

[0180] Table 3 shows that the ΔEab values ​​were 0.5 for Example 21, 1.0 for Comparative Example 13, and 0.9 for Comparative Example 14, indicating that Example 21 had a superior value compared to Comparative Examples 13 and 14. The polymer in Comparative Example 13 is a polymer without structural unit (A), and HOA-MS in Comparative Example 14 is an acid group-containing monomer compound, with an acid group having 8 atoms spaced from the main chain.

[0181] Based on the above, the superiority of the polymer and photosensitive resin composition of the present invention has been recognized. [Industrial applicability]

[0182] The radical polymerizable polymer and photosensitive resin composition of the present invention can be applied, for example, to resist materials and can be suitably used in the optical and electrical / electronic fields.

Claims

1. A polymer having an acid group, The polymer has structural units having a ring structure in the main chain, structural units derived from monomers of a homopolymer represented by the following general formula (1) with a Tg of -20°C or lower, and structural units having an alicyclic structure in the side chain, and substantially does not have ethylenically unsaturated double bonds in the side chain. The structural unit having a ring structure in the main chain is at least one selected from the group consisting of N-benzylmaleimide monomer units and dialkyl-2,2'-(oxydimethylene)diacrylate monomer units. The acid group is a polymer in which the number of atoms between it and the main chain is 6 or less. 【Chemistry 1】 (In the formula, R １ R represents a hydrogen atom or a methyl group. ２ (This represents a linear or branched hydrocarbon group having 6 to 20 carbon atoms.)

2. A polymer having an acid group, The polymer has structural units having a ring structure in the main chain, structural units derived from monomers of a homopolymer represented by the following general formula (1) with a Tg of -20°C or lower, and structural units having an alicyclic structure in the side chain. The structural unit having a ring structure in the main chain is at least one selected from the group consisting of N-benzylmaleimide monomer units and dialkyl-2,2'-(oxydimethylene)diacrylate monomer units. The acid group has a spacing of 6 or fewer atoms from the main chain. A polymer in which the content of structural units represented by the following general formula (2) is 5% by mass or less relative to 100% by mass of the total structural units of the polymer. 【Chemistry 2】 (In the formula, R １ R represents a hydrogen atom or a methyl group. ２ (This represents a linear or branched hydrocarbon group having 6 to 20 carbon atoms.) 【Transformation 3】 (In the formula, R ３ and R ４ (These represent a hydrogen atom or a methyl group, either identical or distinct. Z represents a divalent organic group.)

3. The polymer according to claim 1 or 2, wherein the acid group is a carboxyl group derived from (meth)acrylic acid.

4. The polymer according to claim 1 or 2, wherein the Tg of the homopolymer represented by the general formula (1) is -60°C to -20°C.

5. The polymer according to claim 1 or 2, wherein the content of monomer-derived structural units of the homopolymer represented by the general formula (1) having a Tg of -20°C or lower is 35% to 80% by mass with respect to 100% by mass of the total structural units of the polymer.

6. A photosensitive resin composition comprising the polymer according to claim 1 or 2 and a polyfunctional monomer.

7. The photosensitive resin composition according to claim 6, further comprising a photopolymerization initiator and a colorant.

8. The photosensitive resin composition according to claim 6, which is a resist for color filters.

9. A cured film obtained by curing the photosensitive resin composition according to claim 6.

10. A component for a display device having the cured film described in claim 9.

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