Photosensitive composition, cured film using the same, optical filter, image display device, solid-state image sensor, and infrared sensor

Abstract

To provide a photosensitive composition having excellent developability and capable of forming a cured film having excellent adhesion, heat cycle resistance, and solvent resistance.SOLUTION: Provided is a photosensitive composition comprising a near-infrared absorption dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photoinitiator (D), where the alkali-soluble resin (B) comprises an alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C.SELECTED DRAWING: None

Description

[Technical Field]

[0001] This invention relates to a photosensitive composition and its uses. [Background technology]

[0002] Video cameras, digital cameras, and portable devices with camera functions use solid-state image sensors (CCDs) and CMOSs ​​(complementary metal-oxide-semiconductors) to produce color images. Since the light-receiving section of these solid-state image sensors uses silicon photodiodes, which are sensitive to infrared light, it is necessary to correct the luminous sensitivity, and infrared cut filters are placed accordingly. Infrared cut filters are manufactured, for example, using compositions containing near-infrared absorbing dyes.

[0003] Traditionally, infrared cut filters have been used as flat films, but in recent years, there has been interest in forming patterns for infrared cut filters using photolithography. Infrared cut filters have traditionally been made from highly heat-resistant resins. However, highly heat-resistant resins have problems such as poor adhesion to the substrate, leading to peeling or chipping during the development process when forming patterns (adhesion), and low solubility in the developer solution, resulting in residue (developability). In addition, there have been other problems such as peeling and cracking due to temperature differences in the environment in which they are used (heat cycle resistance) and poor resistance to solvents (solvent resistance).

[0004] To solve the above problems, for example, Patent Document 1 discloses a photosensitive resin composition for near-infrared absorbers comprising a phthalocyanine compound having an absorption maximum wavelength in the near-infrared region, a binder resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent. Furthermore, Patent Document 2 discloses a pattern-forming composition comprising an infrared-absorbing dye and a resin having a glass transition temperature of 150 to 300°C. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2010-160380 [Patent Document 2] International Publication No. 2019 / 058882 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] However, the compositions described in Patent Documents 1 and 2 failed to satisfy all requirements regarding developability, adhesion, heat cycle resistance, and solvent resistance.

[0007] The present invention aims to provide a photosensitive composition that can form a cured film with excellent developability, adhesion, heat cycle resistance, and solvent resistance. [Means for solving the problem]

[0008] The present invention relates to a photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), The alkali-soluble resin (B) is a photosensitive composition comprising an alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C, and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C. [Effects of the Invention]

[0009] According to the present invention described above, a photosensitive composition can be provided that can form a cured film with excellent developability, adhesion, heat cycle resistance, and solvent resistance. Furthermore, the present invention can provide a cured film, an optical filter, an image display device, a solid-state image sensor, and an infrared sensor. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 shows a schematic cross-sectional view of an image display device equipped with the cured film of the present invention. [Figure 2] Figure 2 shows a schematic cross-sectional view of a solid-state image sensor equipped with the cured film of the present invention. [Figure 3]Figure 3 shows a schematic cross-sectional view of an infrared sensor equipped with the cured film of the present invention. [Modes for carrying out the invention]

[0011] The following describes in detail embodiments for carrying out the photosensitive composition of the present invention. However, the present invention is not limited to the following embodiments and can be modified and implemented within the scope of solving the problem.

[0012] In this invention, unless otherwise specified, "(meth)acryloyl," "(meth)acrylic," "(meth)acrylic acid," "(meth)acrylate," or "(meth)acrylamide" means "acryloyl and / or methacryloyl," "acrylic and / or methacrylic," "acrylic acid and / or methacrylic acid," "acrylate and / or methacrylate," or "acrylamide and / or methacrylamide," respectively. Also, "CI" means Color Index (CI; issued by The Society of Dyers and Colourists). A polymerizable unsaturated group is an ethylenically unsaturated double bond. Regarding the molecular weight of the compounds in this invention, for low molecular weight compounds whose molecular weight can be determined, the value is calculated or measured by ESI-MS (electrospray ionization mass spectrometry). For compounds with a molecular weight distribution, the weight-average molecular weight in polystyrene terms is measured by gel permeation chromatography using tetrahydrofuran as the solvent. A monomer is a compound that forms a resin through polymerization. A monomer is in an unreacted state, while a monomer unit is the state in which the monomer has polymerized and formed a resin.

[0013] <Photosensitive composition> One embodiment of the present invention relates to a photosensitive composition. The photosensitive composition of the present invention comprises a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), The alkali-soluble resin (B) is characterized by comprising an alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C, and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C.

[0014] The mechanism by which the above-described photosensitive composition can solve the problems of the present invention is not clear, but we speculate as follows. By using resins with low and high glass transition temperatures in combination, the coating film contains areas with low glass transition temperatures (flexible areas) and areas with high glass transition temperatures (rigid areas). Therefore, compared to a uniform coating film using a single type of resin, it is presumed that external or internal stresses can be effectively relieved, resulting in a coating film with excellent developability, adhesion, heat cycle resistance, and solvent resistance.

[0015] The components included in or potentially included in one embodiment of the photosensitive composition will be described in detail below.

[0016] [Near-infrared absorbing dye (A)] The photosensitive composition of the present invention contains a near-infrared absorbing dye (A).

[0017] Near-infrared absorbing dye (A) is a compound having maximum absorption at wavelengths of 700 to 2,000 nm, and is a pigment (also called a near-infrared absorbing pigment) or a dye (also called a near-infrared absorbing dye). A near-infrared absorbing pigment and a near-infrared absorbing dye may also be used in combination. From the viewpoint of heat resistance, a near-infrared absorbing pigment is preferred. In the present invention, the near-infrared absorbing pigment preferably has a solubility of less than 2 g, more preferably less than 1 g, and particularly preferably 0.5 g or less in 100 g of propylene glycol monomethyl ether acetate at 25°C.

[0018] Examples of near-infrared absorbing dyes (A) include cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, indigo compounds, immonium compounds, anthraquinone compounds, pyrrolopyrrole compounds, squarylium compounds, and crokonium compounds. Among these, naphthalocyanine compounds, pyrrolopyrrole compounds, squarylium compounds, and indigo compounds are preferred from the viewpoint of heat resistance, with naphthalocyanine compounds and indigo compounds being more preferred.

[0019] Cyanine compounds are described in International Publication No. 2006 / 006573, International Publication No. 2010 / 073857, Japanese Patent Publication No. 2013-241598, Japanese Patent Publication No. 2016-113501, Japanese Patent Publication No. 2016-113504, etc.; Phthalocyanine compounds are described in Japanese Patent Publication No. Hei 4-23868, Japanese Patent Publication No. Hei 06-192584, Japanese Patent Publication No. 2000-63691 Japanese Patent Publication No. 2014 / 208514, etc.; Naphthalocyanine compounds: Japanese Patent Publication No. 11-152414, Japanese Patent Publication No. 2000-86919, Japanese Patent Publication No. 2009-29955, Japanese Patent Publication No. 2018 / 186490, etc.; Indigo compounds: Japanese Patent Publication No. 2013-230412, etc.; Immonium compounds: Japanese Patent Publication No. 2005-3361 Japanese Patent Publication No. 50, Japanese Patent Publication No. 2007-197492, Japanese Patent Publication No. 2008-88426, etc.; for anthraquinone compounds, Japanese Patent Publication No. 62-903, Japanese Patent Publication No. 1-172458, etc.; for pyrrolopyrrole compounds, Japanese Patent Publication No. 2009-263614, Japanese Patent Publication No. 2010-90313, Japanese Patent Publication No. 2011-068731; squarylium compounds Examples of materials include those described in Japanese Patent Publication No. 2011-132361, Japanese Patent Publication No. 2016-142891, International Publication No. 2017 / 135359, International Publication No. 2018 / 225837, Japanese Patent Publication No. 2019-001987, International Publication No. 2020 / 054718, etc.; examples of croconium compounds include those described in International Publication No. 2019 / 021767, etc.

[0020] (Squallium compound) The preferred squarylium compound is one represented by the following general formula (1).

[0021] General formula (1) [Chemical formula]

[0022] In general formula (1), R 24 , 12 , 10 , 3 , , 1 , 24 , 12 ,

[0023] , 30 , 30 , 4 , 2 ~R 4 each independently represents a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, -OR 10 , -COR 11 , -COOR 12 , -OCOR 13 , -NR 14 R 15 , -NHCOR 16 , -CONR 17 R 18 , -NHCONR 19 R 20 , -NHCOOR 21 , -SR 22 , -SO2R 23 , -SO2OR 24 , -NHSO2R 25 , -SO2NR 26 R 27 , -B(OR 28 )2, and -NHBR 29 R 30 represents. R 10 ~R 30 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, and an aralkyl group which may have a substituent. In addition, when R 12 of -COOR 12 is hydrogen (that is, a carboxyl group), the hydrogen atom may dissociate (that is, a carbonate group) or may be in a salt state. Also, when R 24 of -SO2OR 24 is a hydrogen atom (that is, a sulfo group), the hydrogen atom may dissociate (that is, a sulfonate group) or may be in a salt state. Further, R 1 and R 2 , R 3 and R 4 may bond to each other to form a ring.

[0023] "Substituents" include halogen atoms, cyano groups, nitro groups, alkyl groups, alkenyl groups, alkynyl groups, aryl groups, heteroaryl groups, and aralkyl groups. -OR 100 , -COR 101 ,-COOR 102 , -OCOR 103 , -NR 104 R 105 , -NHCOR 106 ,-CONR 107 R 108 ,-NHCONR 109 R 110 , -NHCOOR 111 , -SR 112 , -SO2R 113 , -SO2OR 114 , -NHSO2R 115 or -SO2NR 116 R 117 These are some examples. R 100 ~R 117 Each of these independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. Note that -COOR 102 R 102 If it is hydrogen (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group), and it may be in the form of a salt. Also, -SO2OR 114 R 114 If the atom is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may dissociate (i.e., a sulfonate group), and the group may be in the form of a salt.

[0024] Examples of halogen atoms include fluorine, chlorine, bromine, and iodine. The alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 12, and particularly preferably 1 to 8 carbon atoms. The alkyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkenyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkenyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkynyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkynyl group may be linear, branched, or cyclic. The number of carbon atoms in the aryl group is preferably 6 to 25, more preferably 6 to 15, and particularly preferably 6 to 10. The alkyl portion of the aralkyl group is the same as that of the alkyl group described above. The aryl portion of the aralkyl group is the same as that of the aryl group described above. The number of carbon atoms in the aralkyl group is preferably 7 to 40, more preferably 7 to 30, and particularly preferably 7 to 25. The heteroaryl group is preferably a monocyclic or fused ring, more preferably a monocyclic or fused ring with 2 to 8 fused atoms, and particularly preferably a monocyclic or fused ring with 2 to 4 fused atoms. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3. The heteroatoms constituting the ring of the heteroaryl group are preferably nitrogen atoms, oxygen atoms, or sulfur atoms. The heteroaryl group is preferably a 5-membered or 6-membered ring. The number of carbon atoms constituting the ring of the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and particularly preferably 3 to 12. Alkyl groups, alkenyl groups, alkynyl groups, aryl groups, heteroaryl groups, and aralkyl groups may have substituents or may be unsubstituted. Examples of substituents include the "substituents" mentioned above.

[0025] From the viewpoint of light resistance and heat resistance, compounds represented by the following general formula (2) are more preferred among squarylium compounds. General formula (2) [ka]

[0026] In general formula (2), R 5 ~R 8 Each of these independently consists of a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, and an -OR group. 50 , -COR 51 ,-COOR 52 , -OCOR 53 , -NR54 R 55 、 -NHCOR 56 、 -CONR 57 R 58 、 -NHCONR 59 R 60 、 -NHCOOR 61 、 -SR 62 、 -SO2R 63 、 -SO2OR 64 、 -NHSO2R 65 or -SO2NR 66 R 67 、 -B(OR 68 )2, and -NHBR 69 R 70 represents. R 50 ~R 70 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group which may have a substituent. Note that when R 52 of -COOR 52 is hydrogen (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in a salt state. Also, when R 64 of -SO2OR 64 is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may dissociate (i.e., a sulfonate group) or may be in a salt state. Further, R ... 5 and R 6 , R 7 and R 8 may be bonded to each other to form a ring.

[0027] "Substituent" has the same meaning as the above-mentioned "substituent".

[0028] Hereinafter, specific examples of the compound represented by the general formula (2) are shown. Note that the present invention is not limited thereto.

[0029] [Chemical formula]

[0030] [Chemical formula]

[0031] (Pyrrolopyrrole compound) The pyrrolopyrrole compound is preferably a compound represented by the following general formula (3).

[0032] General formula (3) [Chemical formula]

[0033] In general formula (3), R 1x and R 1y each independently represent an alkyl group, an aryl group or a heteroaryl group, and R 2 and R 3 each independently represent a hydrogen atom or a substituent, and R 2 and R 3 may be bonded to each other to form a ring, and R 4 represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BR 4x R 4y or a metal atom, and R 4 is R 1x 、R 1y and R 3 and may be covalently or coordinately bonded to at least one selected from the group consisting of, and R 4x R 4y each independently represent a substituent. The details of general formula (3) can be referred to the descriptions in JP-A-2009-263614, JP-A-2011-68731, and WO 2015 / 166873, and the contents thereof are incorporated herein.

[0034] R 1x and R 1y each independently are preferably an aryl group or a heteroaryl group, and more preferably an aryl group. Further, the alkyl group, aryl group and heteroaryl group represented by R 1x and R 1y may have a substituent or may be unsubstituted. Examples of the substituent include an alkoxy group, a hydroxy group, a halogen atom, a cyano group, a nitro group, -OCOR11 -SOR 12 , -SO2R 13 Examples include R. 11 ~R 13 Each of these independently represents a hydrocarbon group or a heteroaryl group. Furthermore, examples of substituents include those described in paragraphs 0020-0022 of Japanese Patent Publication No. 2009-263614. Among these, examples of substituents include alkoxy groups, hydroxyl groups, halogen atoms, cyano groups, nitro groups, and -OCOR groups. 11 -SOR 12 , -SO2R 13 R is preferable. 1x and R 1y The group represented by this can be an alkoxy group having a branched alkyl group, or -OCOR 11 It is preferable that the aryl group has a group represented by as a substituent. The branched alkyl group has 3 to 30 carbon atoms, and more preferably 3 to 20 carbon atoms.

[0035] R 2 and R 3 At least one of them is preferably an electron-withdrawing group, R 2 represents an electron-withdrawing group, R 3 It is more preferable that R represents a heteroaryl group. The heteroaryl group is preferably a 5-membered ring or a 6-membered ring. Furthermore, the heteroaryl group is preferably a monoring or a fused ring, preferably a monoring or a fused ring with 2 to 8 condensation units, and more preferably a monoring or a fused ring with 2 to 4 condensation units. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3, and more preferably 1 to 2. Examples of heteroatoms include nitrogen atoms, oxygen atoms, and sulfur atoms. It is preferable that the heteroaryl group has one or more nitrogen atoms. The two R in general formula (3) 2 The two Rs may be the same or different. Also, the two Rs in general formula (3) 3 The same or different items may be identical or different.

[0036] R 4 is a hydrogen atom, alkyl group, aryl group, heteroaryl group, or -BR 4x R 4yIt is preferably a group represented by -BR, which is a hydrogen atom, an alkyl group, an aryl group, or a hydrogen atom, an alkyl group, or an alkyl group. 4x R 4y It is more preferable that the group be represented by -BR 4x R 4y It is particularly preferable that the group be represented by R. 4x R 4y The substituents represented by are preferably halogen atoms, alkyl groups, alkoxy groups, aryl groups, or heteroaryl groups, more preferably alkyl groups, aryl groups, or heteroaryl groups, and particularly preferably aryl groups. These groups may have further substituents. The two R in general formula (3) 4 The same or different items may be identical or different.

[0037] The following are specific examples of compounds represented by general formula (3). In the following structural formulas, Me represents a methyl group and Ph represents a phenyl group. Examples of pyrrolopyrrole compounds include those described in paragraphs 0016-0058 of Japanese Patent Publication No. 2009-263614, paragraphs 0037-0052 of Japanese Patent Publication No. 2011-68731, paragraphs 0014-0027 of Japanese Patent Publication No. 2014-130343, and paragraphs 0010-0033 of International Publication No. 2015 / 166873. However, the present invention is not limited to these.

[0038] [ka]

[0039] (Naphthalocyanine compounds) The naphthalocyanine compound is preferably a compound represented by the following general formula (4).

[0040] General formula (4) [ka]

[0041] In general formula (4), X1~X8, Y lEach of ~Y8 independently represents a hydrogen atom, a halogen atom, a nitro group, a sulfone group, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted cycloalkyl group, an optionally substituted heterocyclic group, an optionally substituted alkoxy group, an optionally substituted aryloxy group, an optionally substituted alkylthio group, an optionally substituted arylthio group, an optionally substituted phthalimidomethyl group, or an optionally substituted sulfamoyl group. Furthermore, each of X1~X8 may independently bond to each other to form an optionally substituted aromatic ring. However, one or more of X1 and X2, X3 and X4, X5 and X6, and X7 and X8 may bond to each other to form an optionally substituted aromatic ring. Z is a polymer moiety containing monomer units shown in the general formula (5) below, or a phosphorus compound moiety represented by the general formula (6) below, and * is a bond with Al.

[0042] Examples of alkyl groups that may have substituents include linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, neopentyl, n-hexyl, n-octyl, stearyl, and 2-ethylhexyl groups. Examples of alkyl groups with substituents include trichloromethyl, trifluoromethyl, 2,2,2-trifluoroethyl, 2,2-dibromoethyl, 2,2,3,3-tetrafluoropropyl, 2-ethoxyethyl, 2-butoxyethyl, 2-nitropropyl, benzyl, 4-methylbenzyl, 4-tert-butylbenzyl, 4-methoxybenzyl, 4-nitrobenzyl, and 2,4-dichlorobenzyl groups.

[0043] Examples of the "aryl group" which may have substituents include a phenyl group, a naphthyl group, anthuryl group, and the like. Examples of "substituted aryl groups" include p-methylphenyl group, p-bromophenyl group, p-nitrophenyl group, p-methoxyphenyl group, 2,4-dichlorophenyl group, pentafluorophenyl group, 2-aminophenyl group, 2-methyl-4-chlorophenyl group, 4-hydroxy-1-naphthyl group, 6-methyl-2-naphthyl group, 4,5,8-trichloro-2-naphthyl group, anthraquinonyl group, and 2-aminoanthraquinonyl group.

[0044] Examples of "cycloalkyl groups" that may have substituents include cyclopentyl groups, cyclohexyl groups, adamantyl groups, and the like. Examples of "substituted cycloalkyl groups" include the 2,5-dimethylcyclopentyl group and the 4-tert-butylcyclohexyl group.

[0045] Examples of heterocyclic groups that may have substituents include pyridyl, pyrazyl, piperidino, pyranyl, morpholino, and acridinyl groups. Examples of heterocyclic groups with substituents include 3-methylpyridyl, N-methylpiperidyl, and N-methylpyrrolyl groups.

[0046] Examples of alkoxyl groups that may have substituents include linear or branched alkoxyl groups such as methoxy, ethoxy, propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, neopentyloxy, 2,3-dimethyl-3-pentyloxy, n-hexyloxy, n-octyloxy, stearyloxy, and 2-ethylhexyloxy. Examples of "substituted alkoxyl groups" include trichloromethoxy, trifluoromethoxy, 2,2,2-trifluoroethoxy, 2,2,3,3-tetrafluoropropoxy, 2,2-ditrifluoromethylpropoxy, 2-ethoxyethoxy, 2-butoxyethoxy, 2-nitropropoxy, and benzyloxy groups.

[0047] Examples of aryloxy groups that may have substituents include phenoxy groups, naphthoxy groups, anthuryloxy groups, and so on. Examples of "substituted aryloxy groups" include p-methylphenoxy group, p-nitrophenoxy group, p-methoxyphenoxy group, 2,4-dichlorophenoxy group, pentafluorophenoxy group, and 2-methyl-4-chlorophenoxy group.

[0048] Examples of alkylthio groups that may have substituents include methylthio, ethylthio, propylthio, butylthio, pentylthio, hexylthio, octylthio, decylthio, dodecylthio, and octadecylthio groups. Examples of "alkylthio groups having substituents" include methoxyethylthio groups, aminoethylthio groups, benzylaminoethylthio groups, methylcarbonylaminoethylthio groups, and phenylcarbonylaminoethylthio groups.

[0049] Examples of the arylthio group which may have substituents include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, a 9-anthrylthio group, and the like. Examples of "substituted arylthio groups" include chlorophenylthio group, trifluoromethylphenylthio group, cyanophenylthio group, nitrophenylthio group, 2-aminophenylthio group, and 2-hydroxyphenylthio group.

[0050] Examples of substituents on the aromatic ring that may have substituents include halogen atoms, nitro groups, nitrile groups, carboxyl groups, sulfone groups, alkyl groups that may have substituents, aryl groups that may have substituents, cycloalkyl groups that may have substituents, alkoxyl groups that may have substituents, aryloxy groups that may have substituents, alkylthio groups that may have substituents, and arylthio groups that may have substituents.

[0051] General formula (5) [ka]

[0052] In general formula (5), X is -CONH-R 25 -,-COO-R 26 -, -CONH-R 27 -O-, -COO-R 28 -O- is R 25 ~R 28 R represents an alkylene or arylene group in which carbon atoms may be linked together by -O-, -CO-, -COO-, -OCO-, -CONH-, or -NHCO-. 31 * represents a hydrogen atom or a methyl group. * represents a bond with Al.

[0053] Examples of alkylene groups include methylene, ethylene, propylene, and butylene. Examples of arylene groups include phenylene, naphthylene, biphenylene, terphenylene, and anthrylene.

[0054] The monomer units represented by general formula (5) can be obtained by polymerizing monomers such as (2-(meth)acryloyloxyethyl) acid phosphate, (2-(meth)acryloyloxypropyl) acid phosphate, and (2-(meth)acryloyloxyisopropyl) acid phosphate. Furthermore, copolymerization can also be carried out using monomers other than these (hereinafter also referred to as other monomers).

[0055] Other monomers include, for example, (meth)acrylic acid esters, crotonic acid esters, vinyl esters, maleic acid diesters, fumaric acid diesters, itaconic acid diesters, (meth)acrylamides, vinyl ethers, vinyl alcohol esters, styrenes, (meth)acrylonitrile, acid group-containing monomers, thermocrosslinkable group-containing monomers, and the like.

[0056] The weight-average molecular weight of the polymerized portion is preferably 5,000 to 20,000, and more preferably 8,000 to 15,000. Having an appropriate molecular weight improves optical properties and heat resistance.

[0057] The glass transition temperature (Tg) of the polymerized portion is preferably -50 to 150°C, and more preferably 20 to 80°C. An appropriate Tg improves the optical properties.

[0058] General formula (6) [ka]

[0059] In general formula (6), R 29 and R 30 Each of these independently represents a hydroxyl group, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted alkoxy group, or an optionally substituted aryloxy group, R 29 and R 30 These elements may bond to each other to form a ring. * represents a bond with Al.

[0060] The "alkyl group" of an optionally substituted alkyl group, the "aryl group" of an optionally substituted aryl group, the "alkoxyl group" of an optionally substituted alkoxyl group, and the "aryloxy group" of an optionally substituted aryloxy group are the same groups as those exemplified in the description of general formula (4) above.

[0061] General formula (6) is R from the viewpoint of dispersibility and color characteristics. 29 and R 30 At least one of them is preferably an aryl group which may have a substituent or an aryloxy group which may have a substituent, R 29 and R 30 Both are more preferably aryl groups or aryloxy groups, R 29 and R 30 In both cases, a phenyl group or a phenoxy group is more preferable.

[0062] The following are specific examples of compounds represented by general formula (4). However, the present invention is not limited to these examples.

[0063] [ka] JPEG0007855919000011.jpg74130

[0064] [ka] JPEG0007855919000013.jpg77138 JPEG0007855919000014.jpg70136

[0065] The compound represented by general formula (4) preferably contains compounds in which two or more of X1 and X2, X3 and X4, X5 and X6, and X7 and X8 are bonded to each other to form an aromatic ring which may have substituents, and more preferably contains compounds in which three or more are bonded to each other to form an aromatic ring which may have substituents.

[0066] (Indigo compound) The indigo compound is preferably a compound represented by the following general formula (7) or general formula (8).

[0067] [ka]

[0068] In general formulas (7) and (8), X1 to X 40Each of these independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted alkoxyl group, an optionally substituted aryloxy group, an optionally substituted arylalkyl group, an optionally substituted cycloalkyl group, an optionally substituted alkylthio group, an optionally substituted arylthio group, an amino group, an optionally substituted alkylamino group, an optionally substituted arylamino group, a cyano group, a halogen atom, a nitro group, a hydroxyl group, -SO3H; -COOH; and monovalent to trivalent metal salts of these acidic groups; or alkylammonium salts. M represents a metal atom.

[0069] Examples of alkyl groups that may have substituents include linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, neopentyl, n-hexyl, n-octyl, stearyl, and 2-ethylhexyl groups. Examples of alkyl groups with substituents include trichloromethyl, trifluoromethyl, 2,2,2-trifluoroethyl, 2,2-dibromoethyl, 2,2,3,3-tetrafluoropropyl, 2-ethoxyethyl, 2-butoxyethyl, 2-nitropropyl, benzyl, 4-methylbenzyl, 4-tert-butylbenzyl, 4-methoxybenzyl, 4-nitrobenzyl, and 2,4-dichlorobenzyl groups.

[0070] Examples of the "aryl group" which may have substituents include a phenyl group, a naphthyl group, anthuryl group, and the like. Examples of "substituted aryl groups" include p-methylphenyl group, p-bromophenyl group, p-nitrophenyl group, p-methoxyphenyl group, 2,4-dichlorophenyl group, pentafluorophenyl group, 2-aminophenyl group, 2-methyl-4-chlorophenyl group, 4-hydroxy-1-naphthyl group, 6-methyl-2-naphthyl group, 4,5,8-trichloro-2-naphthyl group, anthraquinonyl group, and 2-aminoanthraquinonyl group.

[0071] Examples of alkoxyl groups that may have substituents include linear or branched alkoxyl groups such as methoxy, ethoxy, propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, neopentyloxy, 2,3-dimethyl-3-pentyloxy, n-hexyloxy, n-octyloxy, stearyloxy, and 2-ethylhexyloxy. Examples of "substituted alkoxyl groups" include trichloromethoxy, trifluoromethoxy, 2,2,2-trifluoroethoxy, 2,2,3,3-tetrafluoropropoxy, 2,2-ditrifluoromethylpropoxy, 2-ethoxyethoxy, 2-butoxyethoxy, 2-nitropropoxy, and benzyloxy groups.

[0072] Examples of "aryloxy groups" that may have substituents include phenoxy, naphthoxy, and anthuryloxy groups, while examples of "substituted aryloxy groups" include p-methylphenoxy, p-nitrophenoxy, p-methoxyphenoxy, 2,4-dichlorophenoxy, pentafluorophenoxy, and 2-methyl-4-chlorophenoxy groups.

[0073] Examples of "arylalkyl groups that may have substituents" include benzyl group, 2-phenylpropanyl group, styryl group, diphenylmethyl group, triphenylmethyl group, and the like.

[0074] Examples of "cyclic alkyl groups" that may have substituents include cyclopentyl groups, cyclohexyl groups, and adamantyl groups. Examples of "substituted cycloalkyl groups" include 2,5-dimethylcyclopentyl groups and 4-tert-butylcyclohexyl groups.

[0075] Examples of alkylthio groups that may have substituents include methylthio, ethylthio, propylthio, butylthio, pentylthio, hexylthio, octylthio, decylthio, dodecylthio, and octadecylthio groups. Examples of "alkylthio groups having substituents" include methoxyethylthio groups, aminoethylthio groups, benzylaminoethylthio groups, methylcarbonylaminoethylthio groups, and phenylcarbonylaminoethylthio groups.

[0076] Examples of the arylthio group which may have substituents include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, a 9-anthrylthio group, and the like. Examples of "substituted arylthio groups" include chlorophenylthio group, trifluoromethylphenylthio group, cyanophenylthio group, nitrophenylthio group, 2-aminophenylthio group, and 2-hydroxyphenylthio group.

[0077] Examples of alkylamino groups that may have substituents include methylamino group, ethylamino group, propylamino group, butylamino group, pentylamino group, hexylamino group, heptylamino group, octylamino group, nonylamino group, decylamino group, dodecylamino group, octadecylamino group, isopropylamino group, isobutylamino group, isopentylamino group, sec-butylamino group, tert-butylamino group, sec-pentylamino group, tert-pentylamino group, tert-octylamino group, neopentylamino group, cyclopropylamino group, cyclobutylamino group, cyclopentylamino group, cyclohexylamino group, cycloheptylamino group, cyclooctylamino group, cyclododecylamino group, 1-adamantamino group, 2-adamantamino group, and the like.

[0078] Examples of "arylamino groups" that may have substituents include anilino group, 1-naphthylamino group, 2-naphthylamino group, o-toluidino group, m-toluidino group, p-toluidino group, 2-biphenylamino group, 3-biphenylamino group, 4-biphenylamino group, 1-fluoreneamino group, 2-fluoreneamino group, 2-thiazoleamino group, and p-terphenylamino group.

[0079] Examples of halogen atoms include fluorine, chlorine, bromine, and iodine.

[0080] Examples of acidic groups include -SO3H and -COOH. Examples of monovalent to trivalent metal salts of these acidic groups include sodium salts, potassium salts, magnesium salts, calcium salts, iron salts, and aluminum salts. Examples of alkylammonium salts of acidic groups include ammonium salts of long-chain monoalkylamines such as octylamine, laurylamine, and stearylamine, and quaternary alkylammonium salts such as palmityltrimethylammonium, lauryltrimethylammonium, dilauryldimethylammonium, and distearyldimethylammonium salts.

[0081] Of the substituents listed above, X1 to X 40 Preferred substituents include hydrogen atoms, methyl groups, methoxy groups, fluorine atoms, chlorine atoms, bromine atoms, and -SO3H.

[0082] M represents a metal atom. Examples of metal atoms include Zn, Co, Ni, Ru, Pt, Mn, Sn, Ti, and Ba. Among these, divalent metal atoms are preferred, and Zn, Co, and Ni are more preferred.

[0083] The following are specific examples of compounds represented by general formula (7) or general formula (8). However, the present invention is not limited to these examples.

[0084] [ka] [ka] [ka] [ka]

[0085] Near-infrared absorbing dyes (A) can be used alone or in combination of two or more. When using two or more in combination, it is preferable to use at least two compounds with different maximum absorption wavelengths. This broadens the waveform of the absorption spectrum compared to using a single near-infrared absorbing dye (A), allowing for absorption of near-infrared light across a wider wavelength range.

[0086] From the viewpoint of near-infrared absorption, the content of the near-infrared absorbing dye (A) is preferably 0.5 to 70% by mass, and more preferably 1 to 50% by mass, of 100% by mass of the non-volatile content of the photosensitive composition.

[0087] [Alkali-soluble resin (B)] The photosensitive composition of the present invention comprises, as the alkali-soluble resin (B), an alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C, and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C. This results in a cured film with excellent developability, adhesion, heat cycle resistance, and solvent resistance.

[0088] The glass transition temperature (hereinafter also referred to as Tg) can be determined by using a measured Tg obtained through actual measurement. Specifically, the measured Tg can be the value obtained by differential scanning calorimetry (DSC). However, if measurement is difficult due to resin decomposition or other reasons, the calculated Tg obtained by the following formula shall be applied. 1 / Tg=W1 / Tg1+W2 / Tg2+······+W n / Tg n Here, the resins to be calculated are W1 to W nAssuming that n monomer components up to W are copolymerized, n Tg is the weight fraction of the nth monomer. n is the glass transition temperature (absolute temperature) of the homopolymer of the nth monomer. The glass transition temperatures of the homopolymers of each monomer (hereinafter also called homopolymers) are taken from the values ​​given in "Polymer Handbook, Third edition, John Wiley & Sons, 1989," edited by Brandrup, J. Immergut, E.H.

[0089] (Alkali-soluble resin (B1) with a glass transition temperature of -10 to 40°C) Alkali-soluble resin (B1) (hereinafter also simply referred to as alkali-soluble resin (B1)) having a glass transition temperature of -10 to 40°C is sufficient, and any known resin can be used.

[0090] The glass transition temperature of the alkali-soluble resin (B1) is preferably 0 to 30°C from the viewpoint of developability, adhesion, and heat cycle resistance.

[0091] Examples of alkali-soluble resins (B1) include (meth)acrylic resins, styrene resins, epoxy resins, urethane resins, polycarbonate resins, polyester resins, polyether resins, polyimide resins, polyamide-imide resins, and cyclic olefin resins.

[0092] The weight-average molecular weight (Mw) of the alkali-soluble resin (B1) is preferably 5,000 to 40,000, and more preferably 5,000 to 30,000, from the viewpoint of developability, adhesion, and heat cycle resistance.

[0093] From the viewpoint of developability, the alkali-soluble resin (B1) is preferably a resin having an acidic group in its side chain. Examples of acidic groups include carboxyl groups, phosphate groups, sulfo groups, and phenolic hydroxyl groups. Among these, carboxyl groups are preferred. Examples of alkali-soluble resins (B1) include alkali-soluble phenolic resins such as acrylic acid copolymers, methacrylic acid copolymers, maleic acid copolymers, partially esterified maleic acid copolymers, and novolac resins, as well as resins obtained by adding acid anhydrides to resins having hydroxyl groups. Among these, copolymers of (meth)acrylic acid and other monomers copolymerizable with it are preferred. Other monomers copolymerizable with (meth)acrylic acid include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, isobornyl (meth)acrylate, phenyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, adamantyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentanyl (meth)acrylate. (Meth)acrylates such as phenoxydiethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolyethylene glycol (meth)acrylate, ethylene oxide (EO) modified cresol acrylate, n-nonylphenoxypolyethylene glycol acrylate, phenoxyethyl acrylate, ethoxylated phenyl acrylate, EO-modified (meth)acrylate of phenol, EO-modified (meth)acrylate of paracumylphenol or propylene oxide (PO) modified (meth)acrylate, EO-modified (meth)acrylate of nonylphenol, PO-modified (meth)acrylate of nonylphenol, glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 2-glycidoxyethyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and 3,4-epoxycyclohexyl (meth)acrylate; (meth)acrylamides such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, diacetone(meth)acrylamide, or acryloylmorpholine; Styrene, or styrene compounds such as α-methylstyrene; Vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; Vinyl acetate or vinyl propionate, and other fatty acid vinyl compounds; Cyclohexylmaleimide, phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimideethane, 1,6-bismaleimidehexane, 3-maleimidepropionic acid, 6,7-methylenedioxy-4-methyl-3-maleimidocoumarin, 4,4'-bismaleimidediphenylmethane, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichloro N-substituted maleimides such as N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimide benzoate, N-succinimidyl-3-maleimide propionate, N-succinimidyl-4-maleimide butyrate, N-succinimidyl-6-maleimide hexanoate, N-[4-(2-benzoimidazolyl)phenyl]maleimide, and 9-maleimidacridine; Examples include dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, and di(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-propenoate. These monomers can be used individually or in combination of two or more.

[0094] From the viewpoint of developability, the acid value of the alkali-soluble resin (B1) is preferably 30 to 200 mg KOH / g, and more preferably 60 to 150 mg KOH / g.

[0095] From the viewpoint of solvent resistance, the alkali-soluble resin (B1) preferably contains polymerizable unsaturated groups. Examples of polymerizable unsaturated groups include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups. Methods for introducing polymerizable unsaturated groups include, for example, the methods shown in (i) or (ii) below.

[0096] [Method (i)] Method (i) involves, for example, first synthesizing polymers (precursors) of carboxyl group-containing monomers and other monomers. Then, an epoxy group-containing monomer (modified compound) is added to the carboxyl group of the precursor.

[0097] Examples of carboxyl group-containing monomers include (meth)acrylic acid, crotonic acid, o-, m-, p-vinylbenzoic acid, and monocarboxylic acids such as α-haloalkyl, alkoxyl, halogen, nitro, and cyano-substituted derivatives of (meth)acrylic acid, which can be used alone or in combination of two or more.

[0098] Examples of epoxy group-containing monomers include glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, 2-glycidoxyethyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and 3,4-epoxycyclohexyl (meth)acrylate. Among these, glycidyl (meth)acrylate is preferred from the viewpoint of reactivity.

[0099] Other monomers include those mentioned above, and can be used individually or in combination of two or more.

[0100] Alternatively, a method similar to method (i) may involve first synthesizing polymers (precursors) of epoxy group-containing monomers and other monomers. Then, a carboxyl group-containing monomer (modified compound) is added to the epoxy group of the precursor, and the resulting hydroxyl group is reacted with a polybasic acid anhydride (modified compound).

[0101] Examples of polybasic acid anhydrides include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, and maleic anhydride. If necessary, the remaining anhydride group can also be hydrolyzed using tricarboxylic acid dianhydrides such as trimellitic anhydride or tetracarboxylic acid dianhydrides such as pyromellitic anhydride.

[0102] [Method (ii)] Method (ii) involves, for example, first synthesizing polymers (precursors) of hydroxyl group-containing monomers, carboxyl group-containing monomers, and other monomers. Then, reacting the hydroxyl group of the precursor with the isocyanate group of an isocyanate group-containing monomer (modified compound).

[0103] Examples of hydroxyl group-containing monomers include hydroxyalkyl methacrylates such as 2-hydroxyethyl (meth)acrylate, 2- or 3-hydroxypropyl (meth)acrylate, 2- or 3- or 4-hydroxybutyl (meth)acrylate, glycerol mono(meth)acrylate, or cyclohexanedimethanol mono(meth)acrylate. Other examples include polyether mono(meth)acrylates obtained by addition polymerization of ethylene oxide, propylene oxide, and / or butylene oxide to hydroxyalkyl (meth)acrylate, and polyester mono(meth)acrylates obtained by addition of polyγ-valerolactone, polyε-caprolactone, and / or poly12-hydroxystearic acid.

[0104] Examples of isocyanate group-containing monomers include 2-(meth)acryloylethyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, or 1,1-bis[methacryloyloxy]ethyl isocyanate.

[0105] The double bond equivalent of the alkali-soluble resin (B1) is preferably 100 to 2,000 g / mol, and more preferably 200 to 1,000 g / mol, from the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance. Double bond equivalent is the mass per mole of ethylenically unsaturated double bonds in a resin, and can be calculated using the following formula. Double bond equivalent = Mass of resin (g) / Amount of ethylenically unsaturated double bonds in resin (mol)

[0106] From the viewpoint of adhesion, the alkali-soluble resin (B1) preferably contains hydroxyl groups. The method for introducing hydroxyl groups is not particularly limited, but examples include copolymerizing the hydroxyl group-containing monomer, carboxyl group-containing monomer, and other monomers as described above, or methods (i) and (ii) described above.

[0107] From the viewpoint of adhesion, the hydroxyl value of the alkali-soluble resin (B1) is preferably 10 to 200 mg KOH / g, and more preferably 30 to 150 mg KOH / g.

[0108] Furthermore, the alkali-soluble resin (B1) may contain thermosetting groups such as epoxy groups, oxetanyl groups, and isocyanate groups. The isocyanate groups are preferably protected with a heat-removing compound (blocking agent).

[0109] Alkali-soluble resin (B1) can be used alone or in combination of two or more types.

[0110] From the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance, the content of alkali-soluble resin (B1) is preferably 30 to 70% by mass, and more preferably 40 to 60% by mass, of 100% by mass of alkali-soluble resin (B).

[0111] (Alkali-soluble resin (B2) with a glass transition temperature of 60-150°C) Alkali-soluble resin (B2) (hereinafter also simply referred to as alkali-soluble resin (B2)) having a glass transition temperature of 60 to 150°C only needs to have a glass transition temperature of 60 to 150°C, and the same type of resin as the alkali-soluble resin (B1) described above can be used.

[0112] The glass transition temperature of the alkali-soluble resin (B2) is preferably 70 to 120°C, and more preferably 70 to 100°C, from the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance.

[0113] From the viewpoint of developability, adhesion, and heat cycle resistance, it is preferable that the alkali-soluble resin (B2) does not contain polymerizable unsaturated groups.

[0114] From the viewpoint of developability, the acid value of the alkali-soluble resin (B2) is preferably 30 to 200 mg KOH / g, and more preferably 60 to 150 mg KOH / g.

[0115] The weight-average molecular weight (Mw) of the alkali-soluble resin (B2) is preferably 5,000 to 40,000, and more preferably 5,000 to 30,000, from the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance.

[0116] Alkali-soluble resin (B2) can be used alone or in combination of two or more types.

[0117] From the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance, the content of alkali-soluble resin (B2) is preferably 30 to 70% by mass, and more preferably 40 to 60% by mass, of 100% by mass of alkali-soluble resin (B).

[0118] From the viewpoint of developability, adhesion, heat resistance, and heat cycle resistance, the total content of alkali-soluble resin (B1) and alkali-soluble resin (B2) is preferably 90% by mass or more out of 100% by mass of alkali-soluble resin (B).

[0119] (Alkali-soluble resin (B3)) The photosensitive composition of the present invention may contain an alkali-soluble resin (B3) other than alkali-soluble resin (B1) and alkali-soluble resin (B2), as long as the effects of the present invention are not impaired.

[0120] The content of alkali-soluble resin (B) is preferably 1 to 80% by mass, more preferably 5 to 60% by mass, and even more preferably 10 to 50% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0121] [Polymerizable compound (C)] The photosensitive composition of the present invention contains a polymerizable compound (C).

[0122] Polymerizable compounds (C) include monomers and oligomers. Polymerizable unsaturated groups include, for example, vinyl groups, (meth)allyl groups, (meth)acryloyl groups, and (meth)acryloyloxy groups. Polymerizable compounds (C) include, for example, lactone-modified polymerizable compounds, polymerizable compounds having acid groups, polymerizable compounds having urethane bonds, and other polymerizable compounds.

[0123] (Lactone-modified polymerizable compound) From the viewpoint of solvent resistance, the photosensitive composition of the present invention preferably contains a lactone-modified polymerizable compound.

[0124] Lactone-modified polymerizable compounds are compounds that have a structure modified with lactone within their molecule. Lactone-modified polymerizable compounds are obtained by esterifying polyhydric alcohols such as trimethylolethane, ditrimethylolethane, trimethylolpropane, ditrimethylolpropane, pentaethythritol, tripentaerythritol, glycerin, diglycerol, and trimetrolmelamine with (meth)acrylic acid and ε-caprolactone or other lactone compounds. The lactone-modified polymerizable compounds are preferably those represented by the following general formula (9).

[0125] General formula (9) [ka]

[0126] In general formula (9), all six Rs are groups represented by general formula (10), or one to five of the six Rs are groups represented by general formula (10) and the remaining ones are groups represented by general formula (11).

[0127] General formula (10) [ka]

[0128] In general formula (10), R 1represents a hydrogen atom or a methyl group, m is an integer between 1 and 2, and * is a bond that connects to the oxygen atom in general formula (9).

[0129] General formula (11) [ka]

[0130] In general formula (11), R 1 represents a hydrogen atom or a methyl group, and * represents a bond that connects to the oxygen atom in general formula (9).

[0131] Lactone-modified polymerizable compounds are commercially available, for example, as the KAYARAD DPCA series manufactured by Nippon Kayaku Co., Ltd., such as DPCA-20 (where m=1 in the above general formulas (9) to (11), the number of groups represented in general formula (10) = 2, R 1 Compounds in which all atoms are hydrogen atoms), DPCA-30 (in the above general formulas (9) to (11), m=1, number of groups represented in general formula (10)=3, R 1 Compounds in which all atoms are hydrogen atoms), DPCA-60 (in the above general formulas (9) to (11), m=1, number of groups represented in general formula (10)=6, R 1 Compounds in which all atoms are hydrogen atoms), DPCA-120 (in the above general formulas (9) to (11), m=2, number of groups represented in general formula (10)=6, R 1 Examples include compounds in which all atoms are hydrogen atoms.

[0132] From the viewpoint of coating film resistance, lactone-modified polymerizable compounds have the following characteristics: in the above general formulas (9) to (11), m=1, the number of groups represented in general formula (10) = 2 to 6, and R 1 Compounds in which all atoms are hydrogen atoms are preferred, and in the above general formulas (9) to (11), m=1, the number of groups represented in general formula (10) = 2 or 3, R 1 Compounds in which all atoms are hydrogen atoms are more preferable.

[0133] From the viewpoint of solvent resistance, the content of the lactone-modified polymerizable compound is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, and even more preferably 20 to 60% by mass, based on 100% by mass of polymerizable compound (C).

[0134] (Polymerizable compounds containing acidic groups) From the viewpoint of developability, the photosensitive composition of the present invention preferably contains a polymerizable compound having an acidic group. Examples of acidic groups in polymerizable compounds include sulfonic acid groups, carboxyl groups, and phosphate groups. Among these, carboxyl groups are preferred.

[0135] Examples of polymerizable compounds having acidic groups include esters of polyhydric alcohols and (meth)acrylic acid poly(meth)acrylates containing free hydroxyl groups with dicarboxylic acids; and esters of polyhydric acids with monohydroxyalkyl (meth)acrylates. Examples of polyhydric alcohols include ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol, and dipentaerythritol. Examples of dicarboxylic acids include malonic acid, succinic acid, maleic acid, glutaric acid, phthalic acid, and itaconic acid. Examples of polycarboxylic acids include trimellitic acid and pyromellitic acid. Examples of monohydroxyalkyl (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, pentaerythritol triacrylate, and 2-hydroxy-3-acryloyloxypropyl methacrylate.

[0136] Examples of commercially available polymerizable compounds containing acid groups include Viscoat #2500P from Osaka Organic Chemical Industry Co., Ltd., and Aronics M-5300, M-5400, M-5700, M-510, M-520, and M-521 from Toagosei Co., Ltd.

[0137] From the viewpoint of developability, the content of polymerizable compounds having acid groups is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, and even more preferably 20 to 60% by mass, based on 100% by mass of polymerizable compound (C).

[0138] (Polymerizable compound containing urethane bonds) From the viewpoint of heat cycle resistance, the photosensitive composition of the present invention preferably contains a polymerizable compound having a urethane bond as the polymerizable compound (C).

[0139] Polymerizable compounds having a urethane bond include, for example, urethane (meth)acrylates obtained by reacting a hydroxyl-containing (meth)acrylate with a polyfunctional isocyanate, and urethane (meth)acrylates obtained by reacting a polyhydric alcohol with a polyfunctional isocyanate and then reacting that with a hydroxyl-containing (meth)acrylate.

[0140] Examples of the above-mentioned (meth)acrylates having hydroxyl groups include 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, ditrimethylolpropane tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol ethylene oxide-modified penta(meth)acrylate, dipentaerythritol propylene oxide-modified penta(meth)acrylate, dipentaerythritol caprolactone-modified penta(meth)acrylate, glycerol tri(meth)acrylate, glycerol di(meth)acrylate, glycerol mono(meth)acrylate, 2-hydroxy-3-acryloylpropyl methacrylate, reaction products of epoxy group-containing compounds and carboxy(meth)acrylate, hydroxyl group-containing polyol polyacrylate, and the like.

[0141] Examples of the polyfunctional isocyanates mentioned above include aromatic diisocyanates such as tolylene diisocyanate, diphenylmethylene diisocyanate, and xylene diisocyanate; aliphatic diisocyanates such as trimethylene diisocyanate, tetramethylene diisocyanate, and hexamethylene diisocyanate; and alicyclic diisocyanates such as isophorone diisocyanate, as well as their bilets, isocyanate nulates, and trimethylolpropane adducts.

[0142] Polymerizable compounds having urethane bonds are also preferably having acidic groups from the viewpoint of developability. Examples of acidic groups include sulfonic acid groups, carboxyl groups, and phosphate groups. Among these, carboxyl groups are preferred.

[0143] One method for introducing an acid group into a polymerizable compound having a urethane bond is to first react the (meth)acrylate having the hydroxyl group with the polyfunctional isocyanate, and then add a mercapto compound having a carboxyl group to the product.

[0144] Examples of mercapto compounds having the carboxyl group mentioned above include mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, and mercaptosuccinic acid.

[0145] The number of polymerizable unsaturated groups in a polymerizable compound having a urethane bond is preferably 3 to 15, and more preferably 5 to 12.

[0146] From the viewpoint of heat cycle resistance, the content of the polymerizable compound having a urethane bond is preferably 5 to 80% by mass, more preferably 10 to 70% by mass, and particularly preferably 20 to 60% by mass, based on 100% by mass of polymerizable compound (C).

[0147] (Other polymerizable compounds) Other polymerizable compounds include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, polyethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, phenoxytetraethylene glycol (meth)acrylate, phenoxyhexaethylene glycol (meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, trimethylolpropane EO-modified tri(meth)acrylate, isocyanurate EO-modified di(meth)acrylate, isocyanurate EO-modified tri(meth)acrylate, and ditrimethylolpropane tetra(meth)acrylate. Examples include pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate, neopentyl glycol diglycidyl ether di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tricyclodecanyl(meth)acrylate, various acrylic acid esters and methacrylic acid esters such as (meth)acrylic acid esters and epoxy(meth)acrylate of methylolated melamine, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-vinylformamide, and acrylonitrile.

[0148] Other commercially available polymerizable compounds include, for example, KAYARAD R-128H, R526, PEG400DA, MAND, NPGDA, R-167, HX-220, R-551, R712, R-604, R-684, GPO-303, TMPTA, DPHA, DPEA-12, DPHA-2C, D-310, D-330 from Nippon Kayaku Co., Ltd., and Aronix M-303, M-305, M-306, M-309, M-310, M-321, M-325, M-350, M-360, M-313, M-315, M-400, M-402, M-403, M-404, M-405 from Toagosei Co., Ltd. Examples include M-406, M-450, M-452, M-408, M-211B, M-101A, Viscoat #310HP, #335HP, #700, #295, #330, #360, #GPT, #400, #405 from Osaka Organic Chemical Industry Co., Ltd., NK Ester A-9300, ABE-300, A-DOG, A-DCP, A-BPE-4 from Shin Nakamura Chemical Co., Ltd., EBECRY40, 130, 140, 145 from Daicel Ornex Co., Ltd., AH-600, AT-600 from Kyoeisha Chemical Co., Ltd., and OGSOL EA-0200, 0300 from Osaka Gas Chemical Co., Ltd.

[0149] Polymerizable compound (C) can be used alone or in combination of two or more types.

[0150] From the viewpoint of developability, adhesion, heat cycle resistance, and solvent resistance, polymerizable compound (C) preferably contains one or more selected from the group consisting of lactone-modified polymerizable compounds, polymerizable compounds having acid groups, and polymerizable compounds having urethane bonds. In particular, from the viewpoint of developability, adhesion, and heat cycle resistance, it is more preferable to contain a polymerizable compound having an acid group represented by the following general formula (12).

[0151] General formula (12) [ka]

[0152] In general formula (12), R1 independently represents either a hydrogen atom or a methyl group, and L represents a divalent linking group.

[0153] The following are specific examples of polymerizable compounds having an acid group represented by general formula (12). However, the present invention is not limited to these.

[0154] [ka]

[0155] The content of polymerizable compound (C) is preferably 1 to 60% by mass, and more preferably 2 to 50% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0156] [Photopolymerization initiator (D)] The photosensitive composition of the present invention contains a photopolymerization initiator (D). This allows the photosensitive composition to be cured by irradiation with active energy rays, thereby forming a cured film.

[0157] The photopolymerization initiator (D) is, for example, an acetophenone compound such as 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, or 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; Triazine compounds such as 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; Oxime ester compounds such as 1,2-octanedione, 1-[4-(phenylthio)phenyl-,2-(O-benzoyl oxime)], or etanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole3-yl]-,1-(O-acetyl oxime); Acylphosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide or diphenyl-2,4,6-trimethylbenzoylphosphine oxide; Examples include quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone; borate compounds; carbazole compounds; imidazole compounds; or titanocene compounds.

[0158] Commercially available products include acetophenone compounds such as Omnirad907, 369E, and 379EG from IGM Resins; acylphosphine compounds such as Omnirad819 and TPO from IGM Resins; oxime compounds such as IRGACURE OXE-01, 02, 03, and 04 from BASF Japan; N-1919, NCI-730, 831, and 930 from ADEKA; and TRONLY TR-PBG-301, 304, 305, 309, 314, 345, 358, 380, 365, 610, 3054, and 3057 from Changzhou Strong New Materials Co., Ltd. Examples include Omnirad 1312, 1314, and 1316 from Resins, SPI-02, 03, 04, 05, 06, and 07 from Samyang Corporation, and DFI-020, 306, and EOX-01 from Daito Chemix. Furthermore, compounds described in Japanese Patent Publication No. 2007-210991, Japanese Patent Publication No. 2009-179619, Japanese Patent Publication No. 2010-037223, Japanese Patent Publication No. 2010-215575, Japanese Patent Publication No. 2011-020998, International Publication No. 2015 / 036910, Japanese Patent Publication No. 2017-523465, Japanese Patent Publication No. 2019-507108, Japanese Patent Publication No. 2019-528331, International Publication No. 2021 / 175855, etc., are also examples. Among these, oxime compounds are preferred from the viewpoint of reactivity.

[0159] From the viewpoint of adhesion, heat cycle resistance, and solvent resistance, the oxime compound preferably contains one or more compounds selected from the group consisting of compounds represented by the following chemical formulas (16) to (18), and more preferably contains two or more.

[0160] [ka]

[0161] The compounds represented by chemical formulas (16) to (18) can be synthesized, for example, by the methods described in International Publication No. 2015 / 036910, Japanese Patent Publication No. 2012-526185, and International Publication No. 2015 / 152153.

[0162] The photopolymerization initiator (D) can be used alone or in combination of two or more types.

[0163] The content of the photopolymerization initiator (D) is preferably 2 to 50 parts by mass, and more preferably 2 to 30 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A), from the viewpoint of photocurability and developability.

[0164] [Sensitizer (E)] The photosensitive composition of the present invention preferably contains a sensitizer (E) from the viewpoint of developability.

[0165] The sensitizer (E) is, for example, polymethine dyes such as chalcone compounds, unsaturated ketones represented by dibenzalacetone, 1,2-diketone compounds represented by benzyl and camphorquinone, benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, oxonol compounds, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, and azulenium compounds. Examples include compounds such as squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyradinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxaliloporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyririum compounds, thiopyrillium compounds, tetraphylline compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospilopyran compounds, metal arene complexes, organoruthenium complexes, or benzophenone compounds. Among these, from the viewpoint of developability, thioxanthone compounds (E1) or benzophenone compounds (E2) are preferred, and benzophenone compounds (E2) are more preferred.

[0166] (Thioxanthone compound (E1)) Examples of the thioxanthone compound (E1) include 2,4 - diethylthioxanthone, 2 - chlorothioxanthone, 2,4 - dichlorothioxanthone, 2 - isopropylthioxanthone, 4 - isopropylthioxanthone, 1 - chloro - 4 - propoxythioxanthone, etc. Among these, 2,4 - diethylthioxanthone is preferable.

[0167] (Benzophenone compound (E2)) Examples of the benzophenone compound (E2) include 4,4’ - bis(dimethylamino)benzophenone, 4,4’ - bis(diethylamino)benzophenone, 2 - aminobenzophenone, etc. Among these, 4,4’ - bis(diethylamino)benzophenone is preferable.

[0168] The sensitizer (E) can be used alone or in combination of two or more kinds.

[0169] From the viewpoint of developability, the content of the sensitizer (E) is preferably 150 to 400 parts by mass, more preferably 150 to 300 parts by mass with respect to 100 parts by mass of the photoinitiator (D).

[0170] [Colorant (F)] The photosensitive composition of the present invention can contain a colorant (F). Thereby, the transmittance of each wavelength region can be controlled, and the color separation property of the color filter is improved.

[0171] The colorant (F) may be either a pigment or a dye, and they can be used in combination.

[0172] (Pigment) A pigment is a compound classified as a pigment in the Color Index. Red pigments include, for example, CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1,63:2,64,64:1,68,69,81,81:1,81:2,81:3,81:4,83,88,90:1,101,101:1,104,108,108:1,109,112,113,114,122,123,144,146,147,149,151,166,168,169,170,172,173,174,175,176,177,178,179 ,181,184,185,187,188,190,193,194,200,202,206,207,208,209,210,214,216,220,221,224,230,231,232,233,235,236,237,238,239,242,243,245,247,249,250,251,253,254,255,256,257,258,259, Examples include pigments 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, pigments described in Japanese Patent Publication No. 2014-134712, pigments described in Japanese Patent Publication No. 6368844, and the like. Among these, from the viewpoint of heat resistance, light resistance, and transmittance, CI Pigment Red 48:1,122,177,224,242,269,254,291,295,296, the pigment described in Japanese Patent Publication No. 2014-134712, and the pigment described in Japanese Patent Publication No. 6368844 are preferred, and CI Pigment Red 177,254,291,295,296, the pigment described in Japanese Patent Publication No. 2014-134712, and the pigment described in Japanese Patent Publication No. 6368844 are even more preferred.

[0173] Examples of orange pigments include CI Pigment Orange 36, 38, 43, 64, 71, and 73.

[0174] Yellow pigments include, for example, C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 192, 193, 194, 196, 198, 199, 213, 214, 231, 233, and pigments described in JP-A-2012-226110. Among these, C.I. Pigment Yellow 138, 139, 150, 185, 231, 233, and the pigments described in JP-A-2012-226110 are preferred.

[0175] Green pigments include, for example, C.I. Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, 63, etc. Among these, C.I. Pigment Green 36, 58, 59, 62, 63 are preferred.

[0176] Blue pigments include, for example, C.I. Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, 79, etc. Among these, C.I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6 are preferred.

[0177] Examples of purple pigments include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. Among these, CI Pigment Violet 19 and 23 are preferred.

[0178] Examples of black pigments include CI Pigment Black 1, 6, 7, 12, 20, and 31. Alternatively, at least two pigments selected from red, yellow, blue, green, and purple pigments may be used as the black coloring agent.

[0179] Examples of inorganic pigments include titanium dioxide, barium sulfate, zinc oxide, lead sulfate, lead yellow, zinc yellow, red iron(III) oxide, cadmium red, ultramarine, Prussian blue, chromium oxide green, cobalt green, amber, and synthetic iron black.

[0180] (dye) Examples of dyes include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, and sulfur dyes. Derivatives of these dyes, as well as lake pigments (dyes obtained by lake formation), are also examples.

[0181] Acid dyes preferably have acidic groups such as sulfonic acid or carboxylic acid. Salt compounds are also preferred, which are salts of acid dyes with nitrogen-containing compounds such as quaternary ammonium salts, tertiary amines, secondary amines, or primary amines. Salt compounds are also preferred, which are salts of resin components having these functional groups with acid dyes. Furthermore, by sulfonamidating the salt compounds to sulfonamide compounds, it is easy to obtain photosensitive compositions with excellent resistance (lightfastness, solvent resistance). Furthermore, salt-forming compounds of acid dyes and compounds containing an onium base are also preferred due to their excellent resistance (light resistance and solvent resistance). The compound containing the onium base is preferably a resin having a cationic group.

[0182] Basic dyes can be used as is, but salt-forming compounds that form salts with organic acids, perchloric acid, or their metal salts are preferred. Salt-forming compounds of basic dyes are preferred because they have excellent resistance (lightfastness, solvent resistance) and affinity with pigments. Furthermore, in salt-forming compounds of basic dyes, preferred anionic components that act as counterions are salt-forming compounds obtained by salting with organic sulfonic acids, organic sulfuric acids, fluorine-containing phosphorus anionic compounds, fluorine-containing boron anionic compounds, cyano-containing nitrogen anionic compounds, anionic compounds having a conjugate base of an organic acid having a halogenated hydrocarbon group, and acid dyes. Note that the resistance of the salt-forming compound is further improved if it contains polymerizable unsaturated groups in its molecule.

[0183] The chemical structures of dyes include, for example, azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyromethene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (oxazine dyes, thiazine dyes, etc.), and azite dyes. Examples of dye structures derived from dyes selected from chloromethic acid dyes, polymethine dyes (oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and metal complex dyes thereof.

[0184] Among these, from the viewpoint of color characteristics such as hue, color separation, and color unevenness, a pigment structure derived from a pigment selected from azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyromethene dyes, squarylium dyes, quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes is preferred, and a pigment structure derived from a pigment selected from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyromethene dyes, and phthalocyanine dyes is more preferred.

[0185] The coloring agent (F) can be used alone or in combination of two or more types.

[0186] The content of the coloring agent (F) is preferably 5 to 70% by mass, and more preferably 10 to 60% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0187] (Pigment refinement) It is preferable to use the pigment in a finely milled form. The milling method is not particularly limited, and for example, wet milling, dry milling, or dissolution milling can all be used. Among these, salt milling by the kneader method, which is a type of wet milling, is preferred. The average primary particle size of the milled pigment, as determined by TEM (transmission electron microscope), is preferably 5 to 90 nm. However, from the viewpoint of dispersibility and contrast ratio, an average primary particle size of 10 to 70 nm is more preferable.

[0188] Salt milling is a process in which a mixture of pigment, water-soluble inorganic salt, and water-soluble organic solvent is mechanically kneaded while heated using a kneader, two-roll mill, three-roll mill, ball mill, attritor, sand mill, etc., and then washed with water to remove the water-soluble inorganic salt and water-soluble organic solvent. The water-soluble inorganic salt acts as a crushing aid, and the pigment is crushed by utilizing the high hardness of the inorganic salt during salt milling. By optimizing the conditions for salt milling the pigment, it is possible to obtain pigments with a very fine primary particle size, a narrow distribution width, and a sharp particle size distribution.

[0189] For the salt milling treatment, a resin may be added as necessary. The type of the resin is not particularly limited, and examples thereof include natural resins, modified natural resins, synthetic resins, synthetic resins modified with natural resins, and the like. Among these, it is preferable that the resin is solid at room temperature, water-insoluble, and partially soluble in the above organic solvent. The addition amount of the resin is preferably 2 to 200 parts by mass with respect to 100 parts by mass of the pigment.

[0190] [Dispersion resin (G)] The photosensitive composition of the present invention can contain a dispersion resin (G).

[0191] The dispersion resin (G) is preferably a resin having an adsorption group with high affinity for the near-infrared absorbing dye (A). The adsorption group preferably has at least one of a basic group and an acidic group.

[0192] Examples of the basic group include groups containing a nitrogen atom such as a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium base, and a nitrogen-containing heterocyclic ring.

[0193] Examples of the acidic group include a carboxyl group, a phosphoric acid group, a sulfonic acid group, and the like.

[0194] Examples of the resin types of the dispersed resin (G) include urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial)amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphates, hydroxyl group-containing polycarboxylic acid esters, and modified products thereof, amides and salts thereof formed by the reaction of poly(lower alkyleneimines) with polyesters having free carboxyl groups, water-soluble resins and water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylic acid ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone, polyester systems, modified polyacrylate systems, ethylene oxide / propylene oxide adduct compounds, and phosphate ester systems.

[0195] Examples of the structure of the dispersed resin (G) include random structures, block structures, graft structures, comb structures, and star structures. Among these, block structures or comb structures are preferred from the viewpoint of dispersion stability.

[0196] Commercially available dispersion resins (G) include, for example, Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, 2164, or Anti-Terra-U203, 204, or BYK-P from BYK-Chemie Japan. SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 56000, manufactured by Lubrizol Japan, including models such as 104, P104S, 220S, Lactimon, Lactimon-WS, or Bykumen. ,76500 etc., BASF Japan's EFKA-46,47,48,452,4008,4009,4010,4015,4020,4047,4050,4055,4060,4080,4400,4401,4402,4403,4406,4408,4300,4310,4320,4330,4340,450,451,453,4540,4550,4560,4800,5010,5065,5066,5070,7500,7554,1101,120,150,1501,1502,1503 etc., Ajinomoto Fine Techno's Azis Examples of resins include those described in JP 2008-029901, JP 2009-155406, JP 2010-185934, JP 2011-157416, International Publication No. 2008 / 007776, JP 2008-029901, JP 2009-155406, JP 2010-185934, JP 2011-157416, JP 2009-251481, JP 2007-23195, and JP 1996-143651.

[0197] The dispersion resin (G) can be used alone or in combination of two or more types.

[0198] From the viewpoint of dispersion stability, the content of the dispersion resin (G) is preferably 3 to 200 parts by mass, and more preferably 5 to 100 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[0199] [Dye derivative (H)] The photosensitive composition of the present invention may contain a dye derivative (H).

[0200] The dye derivative (H) is not particularly limited and includes dye derivatives having acidic groups, basic groups, neutral groups, etc., in the organic dye residue. Examples of dye derivatives (H) include compounds having acidic substituents such as sulfo groups, carboxyl groups, and phosphate groups, as well as amine salts thereof, compounds having basic substituents such as sulfonamide groups or tertiary amino groups at the terminal, and compounds having neutral substituents such as phenyl groups or phthalimidoalkyl groups. Examples of organic pigments include diketopyrrolopyrrole pigments, anthraquinone pigments, quinacridone pigments, dioxazine pigments, perinone pigments, perylene pigments, thiaidine indigo pigments, triazine pigments, benzimidazolone pigments, indole pigments such as benzoisoindole, isoindoline pigments, isoindolinone pigments, quinophthalone pigments, naphthol pigments, surene pigments, metal complex pigments, and azo pigments such as azo, disazo, and polyazo.

[0201] Specifically, diketopyrrolopyrrole dye derivatives include JP 2001-220520, International Publication No. 2009 / 081930, International Publication No. 2011 / 052617, International Publication No. 2012 / 102399, and JP 2017-156397; phthalocyanine dye derivatives include JP 2007-226161, International Publication No. 2016 / 163351, JP 2017-165820, and Patent No. 5753266; and anthraquinone dye derivatives include JP Sho 63-264 Japanese Patent Publication No. 674, Japanese Patent Publication No. 09-272812, Japanese Patent Publication No. 10-245501, Japanese Patent Publication No. 10-265697, Japanese Patent Publication No. 2007-079094, International Publication No. 2009 / 025325, as quinacridone-based dye derivatives, Japanese Patent Publication No. 48-54128, Japanese Patent Publication No. 03-9961, Japanese Patent Publication No. 2000-273383, as dioxazine-based dye derivatives, Japanese Patent Publication No. 2011-162662, as thiaidine-indigo-based dye derivatives, Japanese Patent Publication No. 2007-314785, triazine Examples of benzoindole-based dye derivatives include Japanese Patent Publication No. 61-246261, Japanese Patent Publication No. 11-199796, Japanese Patent Publication No. 2003-165922, Japanese Patent Publication No. 2003-168208, Japanese Patent Publication No. 2004-217842, and Japanese Patent Publication No. 2007-314681. Examples of benzoisoindole-based dye derivatives include Japanese Patent Publication No. 2009-57478. Examples of quinophthalone-based dye derivatives include Japanese Patent Publication No. 2003-167112, Japanese Patent Publication No. 2006-291194, Japanese Patent Publication No. 2008-31281, and Japanese Patent Publication No. 2012-226 Examples of known dye derivatives include those described in Japanese Patent Publication No. 110, Japanese Patent Publication No. 2012-208329 and Japanese Patent Publication No. 2014-5439 as naphthol-based dye derivatives, Japanese Patent Publication No. 2001-172520 and Japanese Patent Publication No. 2012-172092 as azo-based dye derivatives, Japanese Patent Publication No. 2004-307854 as an acidic substituent, and Japanese Patent Publication No. 2002-201377, Japanese Patent Publication No. 2003-171594, Japanese Patent Publication No. 2005-181383 and Japanese Patent Publication No. 2005-213404 as basic substituents.In addition, these documents may refer to dye derivatives as derivatives, pigment derivatives, dispersants, pigment dispersants, or simply compounds, but compounds having substituents such as acidic groups, basic groups, or neutral groups on the aforementioned organic dye residues are synonymous with dye derivatives.

[0202] The dye derivative (H) can be used alone or in combination of two or more types.

[0203] The content of the dye derivative (H) is preferably 1 to 20 parts by mass, and more preferably 2 to 10 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[0204] [Thermosetting compound (I)] The photosensitive composition of the present invention may contain a thermosetting compound (I). This allows the thermosetting compound (I) to react during the heating process, increasing the crosslinking density and thus improving heat resistance.

[0205] Thermosetting compound (I) may be a low molecular weight compound or a high molecular weight compound such as a resin. Examples of thermosetting compound (I) include epoxy compounds, oxetane compounds, benzoguanamine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenolic compounds. Among these, epoxy compounds and oxetane compounds are preferred.

[0206] (Epoxy compound (I1)) Epoxy compounds (I1) include, for example, polycondensates of bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.), and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnolbornene, tetrahydroindene, divinylbenzene) and phenols. Examples include polymers of phenols (such as divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc.), polycondensates of phenols and ketones (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), polycondensates of phenols and aromatic dimethanols (such as benzenedimethanol, α,α,α',α'-benzenedimethanol, biphenyldimethanol, α,α,α',α'-biphenyldimethanol, etc.), polycondensates of phenols and aromatic dichloromethyls (such as α,α'-dichloroxylene, bischloromethylbiphenyl, etc.), polycondensates of bisphenols and various aldehydes, glycidyl ether epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidylamine epoxy resins, and glycidyl ester epoxy resins obtained by glycidylating alcohols, etc.

[0207] Commercially available products include, for example, Epicote 807, 815, 825, 827, 828, 190P, and 191P from Shell Epoxy Oil & Epoxy Corporation, and TECHMORE from Mitsui Chemicals. Examples include VG3101L, EPPN-201, 501H, 502H from Nippon Kayaku Co., Ltd., EOCN-102S, 103S, 104S, 1020 from Japan Epoxy Resin Co., Ltd., Epicote 1004, 1256, JER1032H60, 157S65, 157S70, 152, 154 from Daicel Chemical Industries, Ltd., Celoxide 2021, EHPE-3150 from Daicel Chemical Industries, Ltd., Denacol EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721 from Nagase ChemteX Corporation, and TEPIC-L, H, S from Nissan Chemical Industries, Ltd.

[0208] From the viewpoint of the heat resistance of the cured film, the content of epoxy compound (I1) is preferably 0.5 to 300 parts by mass, and more preferably 1.0 to 50 parts by mass, per 100 parts by mass of near-infrared absorbing dye (A).

[0209] (Oxetane compound (I2)) Oxetane compounds (I2) are known compounds having an oxetane group. Examples of oxetane compounds include monofunctional oxetane compounds, difunctional oxetane compounds, and trifunctional or multifunctional oxetane compounds.

[0210] Examples of monofunctional oxetane compounds include (3-ethyloxetane-3-yl)methyl acrylate, (3-ethyloxetane-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyl oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, and 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane.

[0211] Examples of commercially available products include OXE-10 and 30 manufactured by Osaka Organic Chemical Industry Co., Ltd., and OXT-101 and 212 manufactured by Toagosei Co., Ltd.

[0212] Examples of bifunctional oxetane compounds include 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, di[1-ethyl(3-oxetanyl)]methyl ether 3-ethyl-3-hydroxymethyloxetane, 3- Ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycos(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenyl(3-ethyl- Examples include 3-oxetanylmethyl) ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, propylene oxide (PO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, and EO-modified bisphenol F (3-ethyl-3-oxetanylmethyl) ether.

[0213] Examples of commercially available products include OXBP and OXTP manufactured by Ube Industries, and OXT-121 and 221 manufactured by Toagosei Co., Ltd.

[0214] Examples of oxetane compounds with three or more functionalities include pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, and caprolactone-modified dipenta Examples include erythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropanetetrakis(3-ethyl-3-oxetanylmethyl) ether, resins containing oxetane groups (for example, the oxetane-modified phenol novolac resin described in Japanese Patent No. 3783462), and polymers obtained by radical polymerization of (meth)acrylic monomers such as the aforementioned OXE-30.

[0215] The content of oxetane compound (I2) is preferably 0.5 to 50% by mass, and more preferably 1 to 40% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0216] Melamine compounds are compounds having a melamine ring structure. Methylol-type and ether-type melamine compounds are preferred, and melamine compounds with an average of 5.0 or more methylol groups and / or ether groups per melamine ring are more preferred. Having a moderate number of methylol groups and / or ether groups makes it easier to obtain adequate heat resistance.

[0217] Examples of commercially available products include Nikarac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MS-001, MX-002, MX-730, MX-750, MX-708, MX-706, MX-042, MX-45, MX-500, MX-520, MX-43, MX-417, and MX-410 from Sanwa Chemical Co., Ltd., and Cymel 232, 235, 236, 238, 285, 300, 301, 303, 350, and 370 from Nippon Cytec Industries Co., Ltd.

[0218] Among these, Nikarac MW-30HM, MW-390, MW-100LM, MX-750LM, MW-30M, MW-30, MW-22, MS-21, MS-11, MW-24X, MX-45 from Sanwa Chemical Co., Ltd., and Cymel 232, 235, 236, 238, 300, 301, 303, 350 from Nippon Cytec Industries Co., Ltd., which have an average of 5.0 or more methylol groups and / or ether groups per melamine ring, are preferred in terms of being able to increase the crosslinking density.

[0219] Thermosetting compound (I) can be used alone or in combination of two or more types.

[0220] [Hardening agent (hardening accelerator)] The photosensitive composition of the present invention may be used in combination with a curing agent (curing accelerator) to assist in the curing of the thermosetting compound (I). Examples of curing agents include amine compounds, acid anhydrides, active esters, carboxylic acid compounds, sulfonic acid compounds, etc. Examples of curing agents include amine compounds (e.g., dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), blocked isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivatives, bicyclic amidine compounds and their salts (e.g., imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, Examples include 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, etc., phosphorus compounds (e.g., triphenylphosphine), S-triazine derivatives (e.g., 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine isocyanuric acid adduct, etc.).

[0221] The hardening agent can be used alone or in combination of two or more types.

[0222] The curing agent content is preferably 0.01 to 15 parts by mass per 100 parts by mass of thermosetting compound (I).

[0223] [Thiol-based chain transfer agent (J)] The photosensitive composition of the present invention may contain a thiol-based chain transfer agent (J). When used in combination with a photopolymerization initiator (D), the thiol-based chain transfer agent (J) generates thiyl radicals that are less susceptible to polymerization inhibition by oxygen during radical polymerization after light irradiation, thereby improving the photosensitivity of the photosensitive composition.

[0224] The thiol-based chain transfer agent (J) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), and more preferably a polyfunctional thiol having four or more thiol groups. As the number of functional groups increases, photocuring becomes easier from the surface to the deepest part of the film.

[0225] Polyfunctional thiols include, for example, hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, pentaerythritol Examples include lithritol tetrakisthiopropionate, tris(2-hydroxyethyl) isocyanurate trimercaptopropionate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, and 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine. Preferably, examples include ethylene glycol bisthiopropionate, trimethylolpropane tristhiopropionate, and pentaerythritol tetrakisthiopropionate.

[0226] Thiol-based chain transfer agents (J) can be used alone or in combination of two or more types.

[0227] The content of the thiol-based chain transfer agent (J) is preferably 1 to 10 parts by mass, and more preferably 2 to 8 parts by mass, per 100 parts by mass of the nonvolatile content of the photosensitive composition. Including an appropriate amount improves photosensitivity and makes it less likely for wrinkles to form on the surface of the cured film.

[0228] [Polymerization inhibitor (K)] The photosensitive composition of the present invention may contain a polymerization inhibitor (K).

[0229] Polymerization inhibitor (K) is, for example, alkylcatechol compounds such as catechol, resorcinol, 1,4-hydroquinone, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-t-butylcatechol, 3-t-butylcatechol, 4-t-butylcatechol, 3,5-di-t-butylcatechol, 2-methylresorcinol, 4-methylresorcinol, 2-ethylresorcinol, 4-ethylresorcinol, 2-propylresorcinol, 4-propylresorcinol, 2-n- Examples include alkylresorcinol compounds such as butylresorcinol, 4-n-butylresorcinol, 2-t-butylresorcinol, and 4-t-butylresorcinol; alkylhydroquinone compounds such as methylhydroquinone, ethylhydroquinone, propylhydroquinone, t-butylhydroquinone, and 2,5-di-t-butylhydroquinone; phosphine compounds such as tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, and tripenzylphosphine; phosphine oxide compounds such as trioctylphosphine oxide and triphenylphosphine oxide; phosphite compounds such as triphenylphosphine and trisnonylphenylphosphine; pyrogallol and phloroglucin.

[0230] The polymerization inhibitor (K) content is preferably 0.01 to 0.4% by mass of 100% by mass of the nonvolatile content of the photosensitive composition.

[0231] [UV absorber (L)] The photosensitive composition of the present invention may contain an ultraviolet absorber (L).

[0232] The ultraviolet absorber (L) is an organic compound that has ultraviolet absorption function, and examples include benzotriazole organic compounds, triazine organic compounds, benzophenone organic compounds, salicylate organic compounds, cyanoacrylate organic compounds, and salicylate organic compounds.

[0233] Benzotriazole compounds include, for example, 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, and 2-[2-hydroxy-3,5-bis(α, α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, 5% 2-methoxy-1-methylethyl acetate and 95% benzenepropanoic acid, a mixture of 3-(2H-benzotriazole2-yl)-(1,1-dimethylethyl)-4-hydroxy,C7-9 side chain and linear alkyl ester, 2-(2H-benzotriazole2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazole2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl Reaction product of 3-(3-(2H-benzotriazole2-yl)-5-t-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300, 2-(2H-benzotriazole2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazole2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazole2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazole2-yl)-6-t-butyl Examples include 4-methylphenol, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole2-yl)phenyl]propionate, and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole2-yl)phenyl]propionate.

[0234] Examples of commercially available products include TINUVIN P, PS, 234, 326, 329, 384-2, 900, 928, 99-2, and 1130 from BASF Japan; ADEKA LA-29, LA-31RG, LA-32, and LA-36 from ADEKA Corporation; KEMISORB 71, 73, 74, 79, and 279 from Chemipro Chemical Co., Ltd.; and RUVA-93 from Otsuka Chemical Co., Ltd.

[0235] Triazine compounds include, for example, 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, and the reaction of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine with (2-ethylhexyl)-glycidic acid ester. Examples of the resulting compounds include 2,4-bis"2-hydroxy-4-butoxyphenyl"-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine.

[0236] Examples of commercially available products include KEMISORB 102 from Chemipro Chemical Co., Ltd., TINUVIN 400, 405, 460, 477, 479, and 1577ED from BASF Japan, ADEKA LA-46 and LA-F70 from ADEKA Corporation, and CYASORB UV-1164 from Sun Chemical Co., Ltd.

[0237] Examples of benzophenone compounds include 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone 5-sulfonic acid 3-hydrobenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 2,2'-di-hydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, and 2-hydroxy-4-methoxy-2'-carboxybenzophenone.

[0238] Examples of commercially available products include KEMISORB 10, 11, 11S, 12, and 111 from Chemipro Chemical Co., Ltd., SEESORB 101 and 107 from Cipro Chemical Co., Ltd., ADEKA Stab 1413 from ADEKA Corporation, and UV-12 from Sun Chemical Co., Ltd.

[0239] Examples of salicylate ester compounds include phenyl salicylate, p-octylphenyl salicylate, and p-tert-butylphenyl salicylate.

[0240] The amount of ultraviolet absorber (L) is preferably 5 to 70% by mass of the total of the photopolymerization initiator (D) and the ultraviolet absorber (L) in 100% by mass.

[0241] [Antioxidant (M)] The photosensitive composition of the present invention may contain an antioxidant (M). The antioxidant (M) prevents the photopolymerization initiator (D) and thermosetting compound (I) in the photosensitive composition from oxidizing and yellowing due to the heat process during thermal curing or ITO annealing. In particular, when the concentration of the near-infrared absorbing dye (A) in the photosensitive composition is high, the content of the polymerizable compound (C) decreases relatively, so if the amount of photopolymerization initiator (D) is increased or a thermosetting compound is added, the cured film is prone to yellowing. Therefore, by including an antioxidant, yellowing of the cured film due to oxidation during the heating process is prevented. The antioxidant (M) is preferably a compound that does not contain halogen atoms.

[0242] Antioxidants (M) include, for example, hindered phenol, hindered amine, phosphorus, sulfur, and hydroxylamine compounds. Among these, hindered phenol antioxidants, hindered amine antioxidants, phosphorus antioxidants, and sulfur antioxidants are preferred.

[0243] Hindered phenol antioxidants, for example, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-t-butylphenyl)-butane, 4,4'-butylidene-bis-(2-t-butyl-5-methylphenol), stearyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5] Undecane, 1,3,5-Tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-Tris(3-hydroxy-4-t-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-Methylenebis(6-t-butyl-4-ethylphenol), 2,2'-Thiodiethylbis-(3,5-di -t-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamamide), i-octyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium salt of 3,5-di-t-butyl-4-hydroxybenzylphosphonic acid monoethyl ester, 4 ,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-methyl-4-hydroxy-5-t-butylphenyl)propionic acid]ethylenebisoxybisethylene, 1,6-hexanediol bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, Examples include 2,2'-thio-bis-(6-t-butyl-4-methylphenol), 2,5-di-t-amyl-hydroquinone, 2,6-di-t-butyl-4-nonylphenol, 2,2'-isobutylidene-bis-(4,6-dimethylphenol), 2,2'-methylene-bis-(6-(1-methylcyclohexyl)-p-cresol), and 2,4-dimethyl-6-(1-methylcyclohexyl)-phenol.

[0244] Examples of commercially available products include ADEKA's ADEKA stub AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, AO-330; Chemipro's KEMINOX 101, 179, 76, 9425; BASF Japan's IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, 565; and Sun Chemical's Cyanox CY-1790, CY-2777.

[0245] Hindered amine antioxidants include, for example, tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidine-4-yl)carbonate, and 1,2,2,6,6-pentamethyl-4-piperidyl. Tamethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, polycondensate of dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 4-hydroxy-2,2,6,6-tetramethyl-1- Ester of piperidineethanol and 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetrakis[4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino}-1,3,5-triazine-2-yl]-4,7-diazadecane-1,10-diamine, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester of decandioate, reaction product of 1,1-dimethylethyl hydroperoxide and octane, bis(1,2,2,6,6-pentamethyl-4-pyriperidyl)[[3,5-bi (1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonatemethyl 1,2,2,6,6-pentamethyl-4-pyriperidyl sebacate, poly[[6-morpholino-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 2,2,6,6-tetramethyl-4-piperidyl-C12-21 and C18 unsaturated fatty acid ester, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,Examples include 6-hexamethylenediamine and 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidyl)amino-N-(2,2,6,6-tetramethyl-4-piperidyl)propionamide.

[0246] Examples of commercially available products include ADEKA's ADEKA Stab LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87, LA-402F, LA-502XP; KAMISTAB29, 62, 77, 94 from Chemipro Chemical; Tinuvin111FDL, 123, 144, 249, 292, 5100 from BASF Japan; and Siasorb UV-3346, UV-3529, UV-3853 from Sun Chemical.

[0247] Phosphorus-based antioxidants include, for example, di(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-t-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-t-butylphenyl) phosphite, tris(nonylphenyl) phosphite, tetra(C12~C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, and diphenyl mono (2-ethylhexyl) phosphite, diphenylisodecyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4-biphenyldiphosphonate, tris(tridecyl) phosphite, phenylisooctyl phosphite, phenylisodecyl phosphite, phenyldi(tridecyl) phosphite, diphenylisooctyl phosphite, diphenyltridecyl phosphite, 4,4'-isopropylide Diphenolalkyl phosphite, trisnonylphenyl phosphite, trisdinonylphenyl phosphite, tris(biphenyl) phosphite, di(2,4-di-t-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-t-butylphenol) diphosphite, hexatridecyl Examples include 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, 3,5-di-t-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis(4-t-butylphenyl) phosphite, sodium-2,2-methylene-bis(4,6-di-t-butylphenyl)-phosphite, 1,3-bis(diphenoxyphosphonyloxy)benzene, and ethylbis(2,4-di-t-butyl-6-methylphenyl) phosphite.

[0248] Examples of commercially available products include ADEKA's ADEKA Stub PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, TPP; BASF Japan's IRGAFOS168; and Clariant Chemicals' Hostanox P-EPQ.

[0249] Examples of sulfur-based antioxidants include 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], ditridecyl 3,3'-thiobispropionate, 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, and 2,4-bis[(laurylthio)methyl]-o-cresol.

[0250] Examples of commercially available products include ADEKA's ADEKA stub AO-412S and AO-503, and KEMINOXPLS from Chemipro Chemical Co., Ltd.

[0251] Antioxidants (M) can be used alone or in combination of two or more types.

[0252] The antioxidant (M) content is preferably 0.5 to 5.0% by mass of 100% by mass of the non-volatile content of the photosensitive composition. An appropriate amount improves transmittance, spectral characteristics, and sensitivity.

[0253] [Leveling agent (N)] The photosensitive composition of the present invention may contain a leveling agent (N). This further improves the wettability and drying properties to the substrate during coating. Examples of leveling agents (N) include silicone-based surfactants, fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants.

[0254] Examples of silicone-based surfactants include linear polymers composed of siloxane bonds, and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0255] Commercially available products include, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, 3570 from Bic Chemie, and FZ-7002, 211 from Toray Dow Corning. Examples include 0, 2122, 2123, 2191, 5609, and Shin-Etsu Chemical Co., Ltd.'s X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, KP-341, etc.

[0256] Examples of fluorinated surfactants include surfactants or leveling agents having fluorocarbon chains.

[0257] Examples of commercially available products include Surflon S-242, 243, 420, 611, 651, and 386 from AGC Seimi Chemical; Megafac F-253, 477, 551, 552, 555, 558, 560, 570, 575, and 576, as well as R-40-LM, R-41, RS-72-K, and DS-21 from DIC; FC-4430 and 4432 from Sumitomo 3M; EF-PP31N09, EF-PP33G1, and EF-PP32C1 from Mitsubishi Materials Electronic Chemicals; and Futergent 602A from Neos.

[0258] Nonionic surfactants include, for example, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myristelle ether, polyoxyethylene octyldodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylenedistyrenated phenyl ether, polyoxyethylene tribenzylphenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene alkyl ether phosphate ester, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, sorbitan tristearate Examples include sorbitan monooleate, sorbitan trioleate, sorbitan sesquioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxyethylene sorbitan tetraoleate, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene hydrogenated castor oil, polyoxyethylene alkylamine, alkyl alkanolamide, alkylimidazoline, etc.

[0259] Commercially available products include, for example, Kao's Emulgen 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430, 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G-HA, 2025G, LS-106, L S-110, LS-114, MS-110, A-60, A-90, B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Leodor SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V, SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW- L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emanon 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60(K), Amit 102, Examples include 105, 105A, 302, 320, Aminone PK-02S, L-02, Homogenol L-95, ADEKA's Adekapluronic (registered trademark) L-23, 31, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R, and Kyoeisha Chemical's (meth)acrylic acid-based (co)polymer Polyflow-No.75, No.90, No.95.

[0260] Cationic surfactants include, for example, alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, and cetyltrimethylammonium chloride, and their ethylene oxide adducts.

[0261] Examples of commercially available products include Acetamine 24, Cotamin 24P, 60W, and 86P Concentrate, all manufactured by Kao Corporation.

[0262] Examples of anionic surfactants include polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyl ether disulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine styrene-acrylic acid copolymer, and polyoxyethylene alkyl ether phosphate esters.

[0263] Examples of commercially available products include Neos's Futergent 100 and 150, and ADEKA's Adeka Hope YES-25, Adeka Call TS-230E, PS-440E, and EC-8600.

[0264] Examples of amphoteric surfactants include alkyl betaines such as lauric acid amidopropyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, and alkyldimethylaminoacetic acid betaine, and alkylamine oxides such as lauryldimethylamine oxide.

[0265] Examples of commercially available products include Anchitol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, ​​and 20N, manufactured by Kao Corporation.

[0266] Leveling agent (N) can be used alone or in combination of two or more types.

[0267] The leveling agent (N) content is preferably 0.001 to 2.0% by mass, and more preferably 0.005 to 1.0% by mass, based on 100% by mass of the non-volatile content of the photosensitive composition. Including an appropriate amount further improves the balance between the coating properties and adhesion of the photosensitive composition.

[0268] [Storage stabilizer (O)] The photosensitive composition of the present invention may contain a storage stabilizer (O). This stabilizes the viscosity of the photosensitive composition over time. Examples of storage stabilizers (O) include benzyltrimethyl chloride, quaternary ammonium chlorides such as diethylhydroxyamine, organic acids such as lactic acid and oxalic acid and their methyl ethers, organic phosphines such as t-butylpyrocatechol, tetraethylphosphine, and tetraphenyl, and phosphates.

[0269] The storage stabilizer (O) content is preferably 0.1 to 10 parts by mass per 100 parts by mass of near-infrared absorbing dye (A).

[0270] [Adhesion enhancer (P)] The photosensitive composition of the present invention may contain an adhesion enhancer (P). This improves the adhesion between the cured film and the substrate. It also makes it easier to form narrow patterns using photolithography.

[0271] Adhesion enhancer (P) is, for example, a silane coupling agent. Examples of silane coupling agents include vinylsilanes such as vinyltrimethoxysilane and vinyltriethoxysilane, (meth)acryloxysilanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane, epoxysilanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane, and N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane and N-2-(aminoethyl) Silane coupling agents include aminosilanes such as -3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and hydrochloride salts of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; mercaptos such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryls such as p-styryltrimethoxysilane; ureidos such as 3-ureidopropyltriethoxysilane; sulfides such as bis(triethoxysilylpropyl)tetrasulfide; and isocyanates such as 3-isocyanatetopropyltriethoxysilane.

[0272] Adhesion enhancers (P) can be used alone or in combination of two or more types.

[0273] The content of the adhesion enhancer (P) is preferably 0.01 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass, per 100 parts by mass of the near-infrared absorbing dye (A).

[0274] [Organic solvent (Q)] The photosensitive composition of the present invention may contain an organic solvent (Q).

[0275] Organic solvent (Q) is, for example, 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy- 3-Methylbutylacetate, 3-Methoxybutanol, 3-Methoxybutylacetate, 4-Heptanone, m-Xylene, m-Diethylbenzene, m-Dichlorobenzene, N,N-Dimethylacetamide, N,N-Dimethylformamide, n-Butyl alcohol, n-Butylbenzene, n-Propylacetate, N-Methylpyrrolidone, o-Xylene, o-Chloritolene, o-Diethylbenzene, o-Dichlorobenzene, p-Chloritolene, p-Diethylbenzene, sec-Butylbenzene, tert-Butylbenzene, γ-Butyl Lactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether,Examples include dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, dibasic acid esters, and the like. Among these, from the viewpoint of pigment dispersibility and alkali-soluble resin solubility, glycol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate, alcohols such as benzyl alcohol and diacetone alcohol, and ketones such as cyclohexanone are preferred.

[0276] Organic solvent (Q) can be used alone or in combination of two or more types.

[0277] [Method for producing a photosensitive composition] The photosensitive composition of the present invention can be produced by manufacturing a dispersion by adding, for example, a near-infrared absorbing dye (A), a dispersion resin (G), and an organic solvent (Q) and performing a dispersion treatment. Subsequently, an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D) can be added to the dispersion and mixed. The timing of adding each material is arbitrary. Furthermore, the dispersion process can be performed multiple times.

[0278] Examples of distributed processing machines include two-roll mills, three-roll mills, ball mills, horizontal sand mills, vertical sand mills, annular bead mills, or attritors.

[0279] The average dispersed particle size (secondary particle size) of the near-infrared absorbing dye (A) in the dispersion is preferably 30 to 200 nm, and more preferably 40 to 200 nm. Having an appropriate particle size makes it easier to obtain a photosensitive composition with high dispersion stability.

[0280] The method for measuring the average dispersed particle diameter (secondary particle diameter) is, for example, to use Nikkiso's Microtrac UPA-EX150, which employs dynamic light scattering (FFT power-spectrum method), with particle permeability set to absorption mode, particle shape to non-spherical, and D50 particle diameter as the average diameter. The diluent solvent for measurement is the same organic solvent used for dispersion, and it is preferable to measure immediately after sample preparation of ultrasonically treated samples to obtain results with less variation.

[0281] The photosensitive composition is preferably subjected to centrifugation, sintering filter filtration or membrane filter filtration to remove coarse particles of 5 μm or larger, preferably 1 μm or larger, more preferably 0.5 μm or larger, and any mixed dust. The photosensitive composition of the present invention preferably contains substantially no particles of 0.5 μm or larger, and more preferably contains no particles of 0.3 μm or smaller.

[0282] <Cured film> The cured film of the present invention is obtained by curing a film formed using the photosensitive composition of the present invention through a process such as exposure.

[0283] [Method for manufacturing hardened film] The method for manufacturing a cured film is not particularly limited, and for example, it can be manufactured by a step of applying a photosensitive composition to a substrate to form a layer of the composition (1), exposing the layer in a patterned manner through a mask (2), alkaline developing the unexposed areas to form a patterned cured film (3), and heat-treating the pattern (post-bake) (4).

[0284] The method for manufacturing the cured film will be described in detail below. (Process (1)) Step (1) of forming a layer of composition involves applying the photosensitive composition onto a substrate by methods such as rotary coating, roll coating, slit coating, casting coating, or inkjet coating, and then drying (pre-baking) it at a temperature of 50 to 120°C for 10 to 120 seconds using an oven, hot plate, etc., if necessary. Examples of the substrate include glass substrates and silicon substrates. For example, an image sensor such as a CCD or CMOS may be formed on the surface of the silicon substrate. In addition, a primer layer may be provided on the substrate as needed to improve adhesion with the upper layer, prevent diffusion of materials, and flatten the substrate surface. The layer thickness is preferably 0.05 to 10.0 μm after drying, and more preferably 0.3 to 5 μm.

[0285] (Process (2)) In the exposure process, the layer obtained in step (1) is exposed to a specific pattern through a mask using an exposure device such as a stepper. This results in a cured film. Examples of radiation used for exposure include ultraviolet rays such as g-rays, h-rays, and i-rays. Light with a wavelength of 300 nm or less can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm). Furthermore, exposure may be performed by continuously irradiating with light, or by repeatedly irradiating and pausing with light in short cycles (for example, at the millisecond level or less) (pulsed exposure).

[0286] (Step (3)) The cured film obtained in step (2) is subjected to alkaline development, which causes the unexposed portion of the composition to dissolve in the alkaline developer, leaving only the cured portion and resulting in a patterned cured film. Examples of alkaline developers include alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene. The concentration of the alkaline developer is preferably 0.001 to 10% by mass, and more preferably 0.01 to 1% by mass. The pH of the alkaline developer is preferably 11-13, and more preferably 11.5-12.5. Using a moderate pH suppresses pattern roughness and peeling, and improves the residual film rate after development.

[0287] Development methods include, for example, the dip method, spray method, and paddle method. The development temperature is preferably 15 to 40°C. After alkaline development, it is preferable to wash with pure water.

[0288] (Step (4)) The heat treatment (post-bake) is used to thoroughly harden the patterned cured film obtained in step (3) by heating. The heating temperature for post-bake is preferably 80 to 300°C. The heating time is preferably 2 minutes to 1 hour, and more preferably 3 minutes to 30 minutes. When a material with low heat resistance is used for the substrate, or when an organic electroluminescent element is used as the light source, the temperature is preferably 150°C or lower, and more preferably 130°C or lower.

[0289] <Optical filters> The optical filter of the present invention contains a cured film. It can be preferably used as an infrared cut filter. It can also be used as an infrared transmittance filter. The optical filter of the present invention can be manufactured in the same manner as the cured film described above.

[0290] <Image display device> The image display device of the present invention contains a cured film. The form used in the image display device is not particularly limited, but it can be used as a color filter or a black matrix. Examples of black matrices include black borders provided around the periphery of image display devices such as solid-state image sensors and liquid crystal displays, grid-like and / or striped black areas between red, blue, and green pixels, and dot-like and / or linear black patterns for light shielding of TFTs.

[0291] An example of the image display device of the present invention will be described. The image display device comprises the cured film of the present invention and a light source. Examples of light sources include cold cathode fluorescent lamps (CCFLs) and white LEDs, but in the present invention, it is preferable to use a white LED because it expands the red color reproduction range. Figure 1 is a schematic cross-sectional view showing an example of the configuration of an image display device equipped with the cured film of the present invention. The image display device 10 shown in Figure 1 comprises a pair of transparent substrates 11 and 21 arranged spaced apart and facing each other, with liquid crystal LC sealed between them.

[0292] A TFT (thin-film transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13 made of, for example, ITO is formed on top of it. An orientation layer 14 is provided on top of the transparent electrode layer 13. In addition, a polarizing plate 15 is formed on the outer surface of the transparent substrate 11.

[0293] On the other hand, a color filter 22 is formed on the inner surface of the second transparent substrate 21. The red, green, and blue filter segments that make up the color filter 22 are separated by a black matrix (not shown).

[0294] A transparent protective film (not shown) is formed on the color filter 22 as needed, and a transparent electrode layer 23 made of, for example, ITO is formed on top of that, and an alignment layer 24 is provided covering the transparent electrode layer 23.

[0295] Furthermore, a polarizing plate 25 is formed on the outer surface of the transparent substrate 21. A backlight unit 30 is provided below the polarizing plate 15.

[0296] Liquid crystal (LC) elements are oriented according to the driving mode, such as TN (Twisted Nematic), STN (Super Twisted Nematic), IPS (In-Plane Switching), VA (Vertical Alignment), and OCB (Optically Compensated Birefringence). A TFT (Thin Film Transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13 made of, for example, ITO is formed on top of it. An alignment layer 14 is provided on top of the transparent electrode layer 13. A polarizing plate 15 is also formed on the outer surface of the transparent substrate 11.

[0297] White LED light sources include those with a fluorescent filter formed on the surface of a blue LED, and those with a phosphor contained in the resin package of a blue LED. They have a wavelength (λ3) in which the emission intensity is maximum in the range of 430nm to 485nm, a wavelength (λ4) in which the emission intensity is maximum in the range of 530nm to 580nm, and a wavelength (λ5) in which the emission intensity is maximum in the range of 600nm to 650nm, and the ratio of the emission intensity I3 at wavelength λ3 to the emission intensity I4 at wavelength λ4 (I4 / I3) is between 0.2 and 0.4. Preferably, a white LED light source (LED1) has spectral characteristics in which the ratio of the emission intensity I3 at wavelength λ3 to the emission intensity I5 at wavelength λ5 (I5 / I3) is 0.1 or more and 1.3 or less, or a white LED light source (LED2) has spectral characteristics in which the wavelength (λ1) at which the emission intensity is maximum is in the range of 430 nm to 485 nm, the peak wavelength (λ2) of the second emission intensity is in the range of 530 nm to 580 nm, and the ratio of the emission intensity I1 at wavelength λ1 to the emission intensity I2 at wavelength λ2 (I2 / I1) is 0.2 or more and 0.7 or less.

[0298] Examples of LED1 include NSSW306D-HG-V1 (manufactured by Nichia Corporation) and NSSW304D-HG-V1 (manufactured by Nichia Corporation).

[0299] Examples of LED2 include the NSSW440 (manufactured by Nichia Corporation) and the NSSW304D (manufactured by Nichia Corporation).

[0300] <Solid-state image sensor> The solid-state image sensor of the present invention has a cured film. The form used for the solid-state image sensor is not particularly limited, but for example, it has a substrate on which a plurality of photodiodes constituting the light-receiving area of ​​the solid-state image sensor (CCD image sensor, CMOS image sensor, or organic CMOS image sensor, etc.) and a light-receiving element made of polysilicon, and the cured film of the present invention is provided on the side of the light-receiving element formation surface or the opposite side of the formation surface. Figure 2 is a schematic cross-sectional view showing an example of the configuration of a solid-state image sensor equipped with the cured film of the present invention.

[0301] As shown in Figure 2, the solid-state imaging device 200 comprises a rectangular solid-state image sensor 201 and a transparent cover glass 203 held above the solid-state image sensor 201 and sealing the solid-state image sensor 201. Furthermore, a lens layer 211 is superimposed on the cover glass 203 via a spacer 204. The lens layer 211 is composed of a support 213 and a lens material 212. When stray light is incident on the peripheral region of the lens layer 211, the light diffusion weakens the light-gathering effect of the lens material 212, reducing the amount of light reaching the imaging unit 202. In addition, noise due to stray light occurs. For this reason, the peripheral region of the lens layer 211 is provided with the hardened film 214 of the present invention to block light.

[0302] The solid-state image sensor 201 converts the optical image formed on its light-receiving surface, the imaging unit 202, into an image signal. This solid-state image sensor 201 includes a laminated substrate 205 made of two stacked substrates. The laminated substrate 205 consists of a rectangular chip substrate 206 and a circuit board 207 of the same size, with the circuit board 207 stacked on the back surface of the chip substrate 206.

[0303] An imaging unit 202 is provided in the center of the surface of the chip substrate 206. Furthermore, when stray light is incident on the peripheral region of the imaging unit 202, dark current (noise) is generated from the circuit in this peripheral region. Therefore, this peripheral region is shielded from light by being provided with the hardened film (light shielding) 215 of the present invention.

[0304] Multiple electrode pads 208 are provided on the surface edge of the chip substrate 206. The electrode pads 208 are electrically connected to the imaging unit 202 via signal lines (not shown) provided on the surface of the chip substrate 206.

[0305] On the back surface of the circuit board 207, external connection terminals 209 are provided approximately below each electrode pad 208. Each external connection terminal 209 is connected to the electrode pad 208 via a through-electrode 210 that penetrates the laminated substrate 205 vertically. Furthermore, each external connection terminal 209 is connected via wiring (not shown) to a control circuit that controls the driving of the solid-state image sensor 201, and to an image processing circuit that performs image processing on the imaging signal output from the solid-state image sensor 201.

[0306] <Infrared sensor> The infrared sensor of the present invention contains a cured film. Figure 3 is a schematic cross-sectional view showing an example of the configuration of an infrared sensor equipped with the cured film of the present invention. The infrared sensor shown in Figure 3 comprises a 300 and a solid-state image sensor 310.

[0307] The imaging area on the solid-state image sensor 310 is formed by combining an infrared cut filter 311 and a color filter 312. The infrared cut filter 311 transmits light in the visible light region (e.g., light with wavelengths of 400 to 700 nm) and blocks light in the infrared region (e.g., light with wavelengths of 800 to 1,300 nm), allowing the cured film of the present invention to be used. The color filter 312 is a color filter in which pixels that transmit and absorb light of specific wavelengths in the visible light region are formed. For example, a color filter in which red (R), green (G), and blue (B) pixels are formed is used.

[0308] Between the infrared transmission filter 313 and the solid-state image sensor 310, a resin film 314 is placed that can transmit light of wavelengths that have passed through the infrared transmission filter 313. The infrared transmission filter 313 is a filter that has visible light shielding properties and transmits infrared rays of a specific wavelength, and the cured film of the present invention can be used. Preferably, the infrared transmission filter 313 shields light with wavelengths of 400 to 830 nm and transmits light with wavelengths of 900 to 1,300 nm.

[0309] A microlens 315 is positioned on the incident light side of the color filter 312 and the infrared transmission filter 313. A planarization film 316 is formed to cover the microlens 315.

[0310] In the configuration shown in Figure 3, a resin film 314 is arranged, but an infrared transmission filter 313 may be formed instead of the resin film 314.

[0311] The cured film of the present invention can be used as a light-shielding film on the edges and / or sides of the surface of the infrared cut filter 311, and when used on the inner wall of an infrared sensor, it can prevent internal reflection and / or the incidence of unintended light on the light-receiving part, thereby improving sensitivity.

[0312] This infrared sensor can simultaneously capture image information, enabling motion sensing and other applications that recognize moving objects. Furthermore, because it can acquire distance information, it can capture images containing 3D data. In addition, this infrared sensor can also be used as a biometric authentication sensor.

[0313] Furthermore, the cured film of the present invention can also be used as a colored spacer. For example, when a spacer is used in a TFT-type LCD, the light incident on the TFT may cause the TFT to malfunction as a switching element, and a colored spacer is used to prevent this. A colored spacer can be formed in the same manner as the black matrix described above, except that a mask for colored spacers is used.

[0314] Furthermore, the cured film of the present invention can also be used in applications such as micro-LEDs (Light Emitting Diodes) and micro-OLEDs (Organic Light Emitting Diodes). While not particularly limited, it can be used for optical filters and optical films used in micro-LEDs and micro-OLEDs, as well as for components that provide light-shielding and anti-reflective properties. Micro-LEDs and micro-OLEDs are described, for example, in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890.

[0315] Furthermore, the cured film of the present invention can also be used in applications such as quantum dot displays. While not particularly limited, it can be used for optical filters and optical films used in quantum dot displays, as well as for components that provide light-shielding and anti-reflective properties. [Examples]

[0316] The present invention will be described in more detail below with reference to examples. However, the present invention is not limited to these examples. Note that "parts" refers to "parts by mass" and "%" refers to "percentage by mass". Furthermore, in this invention, non-volatile content or non-volatile content concentration refers to the mass residue after standing in an oven at 280°C for 30 minutes.

[0317] Prior to the examples, each measurement method will be described.

[0318] The weight-average molecular weight (Mw), number-average molecular weight (Mn), acid value (mgKOH / g), hydroxyl value (mgKOH / g), amine value (mgKOH / g), and glass transition temperature (Tg) of the resin are measured as follows.

[0319] (Average molecular weight of resin) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the resin were measured by gel permeation chromatography (GPC) equipped with a radioisotope detector. An HLC-8220GPC (Tosoh Corporation) was used, with two separation columns connected in series. Both columns were packed with two TSK-GEL SUPER HZM-N columns. Measurements were performed at an oven temperature of 40°C, using tetrahydrofuran (THF) solution as the eluent, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent consisting of 1 wt% of the above eluent, and 20 microliters were injected. Molecular weights are expressed on a polystyrene basis.

[0320] (Acid value of resin) 0.5 to 1 g of resin solution was mixed with 80 ml of acetone and 10 ml of water and stirred to dissolve uniformly. A 0.1 mol / L aqueous KOH solution was used as the titrant, and the solution was titrated using an automatic titrator ("COM-555," manufactured by Hiranuma Sangyo Co., Ltd.) to measure the acid value (mg KOH / g). The acid value per unit of non-volatile content of the resin was then calculated from the acid value of the resin solution and the concentration of non-volatile content of the resin solution.

[0321] (Hydroxy value of resin) The solution, in which the resin was dissolved in the acetylating reagent, and a blank acetylating reagent were refluxed for 30 minutes. The condenser was rinsed with water, and the rinse solution was added to the reaction solution. The resulting solution was titrated at 25°C with a 0.1 mol / L sodium hydroxide solution using a potentiometric titrator (product name: AT-510, manufactured by Kyoto Electronics Manufacturing Co., Ltd.). The inflection point of the titration pH curve was taken as the titration endpoint, and the hydroxyl value per non-volatile content of the resin was calculated using the following formula. Hydroxyl value (mgKOH / g) = 56.11 × (V1 - V2) × 0.1 × f / w V1: Volume (mL) of 0.1 mol / L sodium hydroxide solution required for titration in the blank test. V2: Volume of 0.1 mol / L sodium hydroxide solution required for titration (mL) f: Titer of 0.1 mol / L sodium hydroxide aqueous solution w: Mass of resin (g) (calculated as non-volatile content)

[0322] (Amine value of resin) The amine value of the resin is calculated by converting the total amine value (mgKOH / g), which was measured according to the ASTM D 2074 method, into a non-volatile content value.

[0323] (Glass transition temperature) The glass transition temperature (°C) of the resin was measured using a differential scanning thermal analyzer. 5 mg of the sample was weighed into a sample pan and heated from -20 to 200°C at a heating rate of 10°C / min under a nitrogen atmosphere.

[0324] <Manufacturing of near-infrared absorbing dye (A)> (Near-infrared absorbing dye (A-1)) 400 parts toluene, 40.0 parts 1,8-diaminonaphthalene, 32.2 parts 3,5-dimethylcyclohexanone, and 0.087 parts p-toluenesulfonic acid monohydrate were mixed and heated and stirred under a nitrogen atmosphere under reflux for 3 hours. Water produced during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was complete, the toluene was distilled to obtain a dark brown solid, which was extracted with acetone and purified by recrystallization in a mixed solvent of acetone and ethanol. The obtained brown solid was dissolved in a mixed solvent of 240 parts toluene and 160 parts n-butanol, and 13.8 parts 3,4-dihydroxy-3-cyclobutene-1,2-dione were added. The mixture was heated and stirred under a nitrogen atmosphere under reflux for 8 hours. Water produced during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was complete, the solvent was distilled, and 200 parts of hexane were added to the resulting reaction mixture while stirring. The resulting dark brown precipitate was filtered off, and then washed sequentially with hexane, ethanol, and acetone. The mixture was dried under reduced pressure to obtain a near-infrared absorbing dye (A-1) represented by the following chemical formula (19). Fifty parts of the obtained near-infrared absorbing dye (A-1), 500 parts of sodium chloride, and 60 parts of diethylene glycol were placed in a stainless steel gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 60°C for 12 hours. Next, the kneaded mixture was added to warm water and stirred for 1 hour while heating to approximately 80°C to form a slurry. After filtering and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried overnight at 80°C and then pulverized to obtain finely ground near-infrared absorbing dye (A-1).

[0325] Chemical formula (19) [ka]

[0326] (Near-infrared absorbing dye (A-2)) 400 parts toluene, 40.0 parts 1,8-diaminonaphthalene, 50.1 parts 2-hydroxy-9-fluorenone, and 0.087 parts p-toluenesulfonic acid monohydrate were mixed and heated and stirred under a nitrogen atmosphere under reflux for 3 hours. Water produced during the reaction was removed from the system by azeotropic distillation. After the reaction was complete, the toluene was distilled to obtain a dark brown solid, which was extracted with acetone and purified by recrystallization in a mixed solvent of acetone and ethanol. The obtained brown solid was dissolved in a mixed solvent of 240 parts toluene and 160 parts n-butanol, and 13.8 parts 3,4-dihydroxy-3-cyclobutene-1,2-dione were added. The mixture was heated and stirred under a nitrogen atmosphere under reflux for 8 hours. Water produced during the reaction was removed from the system by azeotropic distillation. After the reaction was complete, the solvent was distilled, and 200 parts hexane was added to the resulting reaction mixture while stirring. After filtering off the obtained dark brown precipitate, the material was sequentially washed with hexane, ethanol, and acetone, and dried under reduced pressure to obtain a near-infrared absorbing dye (A-2) represented by the following chemical formula (20). A miniaturized near-infrared absorbing dye (A-2) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0327] Chemical formula (20) [ka]

[0328] (Near-infrared absorbing dye (A-3)) In a reaction vessel, 178 parts of 2,3-dicyanonaphthalene, 890 parts of n-amyl alcohol, 137 parts of DBU (1,8-Diazabicyclo[5.4.0]undec-7-ene), and 40 parts of anhydrous aluminum chloride were mixed and stirred, and the mixture was heated and refluxed at 136°C for 5 hours. The reaction solution was cooled to 30°C while stirring, and then injected with stirring into a mixed solvent consisting of 5,000 parts methanol and 10,000 parts water to obtain a blue slurry. This slurry was filtered, washed with a mixed solvent consisting of 2,000 parts methanol and 4,000 parts water, and dried to obtain compound a. Next, 10 parts of compound a were added to 100 parts of concentrated sulfuric acid in a reaction vessel under ice bath conditions, and the mixture was stirred for 1 hour. Subsequently, 1,000 parts of this sulfuric acid solution were poured into 3°C cold water, and the resulting precipitate was filtered, washed with water, washed with a 2.5% sodium hydroxide aqueous solution, washed with water, and dried to obtain compound b. 5 parts diphenyl phosphate was added to 200 parts N-methylpyrrolidone and thoroughly mixed, then heated to 50°C. 10 parts compound b was added little by little to this solution, and the mixture was stirred at 90°C for 120 minutes. The endpoint of the reaction was confirmed, for example, by dropping the reaction solution onto filter paper until the bleeding stopped. Subsequently, 2,000 parts of deionized water were added to this reaction solution, and the resulting precipitate was filtered, washed with water, and dried to obtain the near-infrared absorbing dye (A-3) represented by the following chemical formula (21). A miniaturized near-infrared absorbing dye (A-3) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0329] Chemical formula (21) [ka]

[0330] (Near-infrared absorbing dye (A-4)) In accordance with International Publication No. 2019 / 058882, a near-infrared absorbing dye (A-4) represented by the following chemical formula (22) was obtained. A miniaturized near-infrared absorbing dye (A-4) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0331] Chemical formula (22) [ka]

[0332] (Near-infrared absorbing dye (A-5)) In a reaction vessel, 26 parts phthalonitrile, 143 parts 2,3-dicyanonaphthalene, 890 parts n-amyl alcohol, 137 parts DBU (1,8-Diazabicyclo[5.4.0]undec-7-ene), and 34 parts aluminum trichloride were mixed and stirred, and the mixture was heated and refluxed at 136°C for 5 hours. The reaction solution, which was cooled to 30°C while stirring, was poured into a mixed solvent consisting of 5,000 parts methanol and 10,000 parts deionized water while stirring to obtain a blue slurry. This slurry was filtered, washed with a mixed solvent consisting of 2,000 parts methanol and 4,000 parts deionized water, and dried to obtain compound c. Next, 140 parts of compound c were added to 1,500 parts of concentrated sulfuric acid in a reaction vessel under ice bath conditions, and the mixture was stirred for 1 hour. Subsequently, 1,000 parts of 3°C cold water were poured into this sulfuric acid solution, and the resulting precipitate was filtered, washed with water, washed with a 2.5% sodium hydroxide aqueous solution, washed with water, dried, and compound d was obtained. 5 parts diphenyl phosphate was added to 200 parts N-methylpyrrolidone and thoroughly mixed, then heated to 50°C. 10 parts compound d was added little by little to this solution, and the mixture was stirred at 90°C for 120 minutes. The endpoint of the reaction was identified, for example, by dropping the reaction solution onto filter paper until the bleeding stopped. Subsequently, 2,000 parts of deionized water were added to this reaction solution, and the resulting precipitate was filtered, washed with water, and dried to obtain a near-infrared absorbing dye (A-5), which is a mixture of compounds represented by the following chemical formula (23) (mass ratio: n1:n2:n3:n4 = 7:19:59:15). A miniaturized near-infrared absorbing dye (A-5) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0333] Chemical formula (23) [ka]

[0334] (Near-infrared absorbing dye (A-6)) In a reaction vessel, 10.7 parts of aniline, 120 parts of bromobenzene, and 25.7 parts of diazabicyclooctane were added and stirred. Then, 95.2 parts of a 1 mol / 1 toluene solution of titanium tetrachloride were added dropwise. After the dropwise addition, 10.0 parts of indigo were added and the mixture was refluxed for 10 hours. After the reaction was complete, methanol was added, the mixture was filtered, and a green powder was obtained. This was separated from the green powder with dichloromethane and water, and the organic layer was concentrated to obtain 14.6 parts of compound e. In a reaction vessel, 13.5 parts of compound e, 9.0 parts of bis(2,4-pentanedionato)zinc(II), and 120 parts of tetrahydrofuran were mixed and stirred, and after raising the temperature, the mixture was stirred at 40°C for 5 hours. The reaction solution, which was cooled to 30°C while stirring, was poured into 500 parts of methanol while stirring to obtain a blue slurry. This slurry was filtered, washed with 500 parts of methanol, washed with 500 parts of water, and dried to obtain a near-infrared absorbing dye (A-6), which is a mixture of compounds represented by the following chemical formula (24) (mass ratio: dimer:trimer:tetramer = 81:17:2). A miniaturized near-infrared absorbing dye (A-6) was obtained using the same method as for the near-infrared absorbing dye (A-1).

[0335] Chemical formula (24) [ka]

[0336] <Manufacturing of alkali-soluble resin (B)> (Alkali-soluble resin (B1-1) solution) 262.0 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as PGMAc) were placed in a reaction vessel, which was a separable four-neck flask fitted with a thermometer, condenser, nitrogen gas inlet tube, and stirrer. The vessel was heated to 120°C while nitrogen gas was injected into it. At the same temperature, 49.7 parts (0.27 mol) of 2-ethylhexyl acrylate, 99.4 parts (0.7 mol) of glycidyl methacrylate, 6.6 parts (0.03 mol) of dicyclopentanyl methacrylate, 19.0 parts of the polymerization initiator t-butyl peroxy-2-ethylhexanoate, and a mixture of PGMAc were added dropwise over 2.5 hours using a dropping tube. After the dropwise addition was complete, the mixture was stirred at 120°C for a further 2 hours to obtain the precursor. Then, the flask was purged with air, and 50.4 parts (0.7 moles) of acrylic acid as the modified compound, along with 0.6 parts of triphenylphosphine and 0.2 parts of methylhydroquinone as catalysts, were added and the mixture was reacted at 110°C for 10 hours. This reacted the epoxy group of glycidyl methacrylate with the carboxyl group of acrylic acid, causing the epoxy group of glycidyl methacrylate to cleave and generate a hydroxyl group, while simultaneously introducing a polymerizable unsaturated group. Next, 21.3 parts (0.14 moles) of tetrahydrophthalic anhydride were added as a modifying compound, and the mixture was reacted at 110°C for 4 hours. This caused some of the hydroxyl groups generated by the cleavage of the epoxy group of glycidyl methacrylate to react with tetrahydrophthalic anhydride, introducing carboxyl groups. Subsequently, PGMAc was added to achieve a non-volatile content of 20% by mass to prepare the alkali-soluble resin (B1-1) solution. The alkali-soluble resin (B1-1) had a Tg of -10°C, an acid value of 32 mgKOH / g, a hydroxyl value of 127 mgKOH / g, and a weight-average molecular weight of 6,400.

[0337] (Alkali-soluble resin (B1-2)~(B1-6) solution) Alkali-soluble resins (B1-2) to (B1-6) were synthesized using the same method as alkali-soluble resin (B1-1), by changing the type and amount of the raw materials and composition ratios as shown in Table 1, and PGMAc was added to bring the non-volatile content to 20% by mass.

[0338] [Table 1]

[0339] (Alkali-soluble resin (B2-1) solution) 160 parts of PGMAc were placed in a reaction vessel, which was a separable four-neck flask fitted with a thermometer, condenser, nitrogen gas inlet tube, and stirrer. The vessel was heated to 120°C while nitrogen gas was injected into it. At the same temperature, 109.25 parts (0.62 mol) of benzyl methacrylate, 24.1 parts (0.28 mol) of methacrylic acid, 22.03 parts (0.10 mol) of dicyclopentanyl methacrylate, 1.0 part of the polymerization initiator zobisisobutyronitrile, and a mixture of PGMAc were added dropwise over 2.5 hours using a dropping tube. After the dropwise addition was complete, the mixture was stirred for a further 2 hours at 120°C. Then, PGMAc was added to achieve a non-volatile content of 20% by mass to prepare the alkali-soluble resin (B2-1) solution. The alkali-soluble resin (B2-1) had a Tg of 75°C, an acid value of 98 mgKOH / g, and a weight-average molecular weight of 17,500.

[0340] (Alkali-soluble resin (B2-2)~(B2-6) solution) Alkali-soluble resins (B2-2) to (B2-6) were synthesized using the same method as for alkali-soluble resin (B2-1), by changing the type and amount of the raw materials and composition ratios shown in Table 2, and PGMAc was added to bring the non-volatile content to 20% by mass.

[0341] [Table 2]

[0342] (Alkali-soluble resin (B3-1)~(B3-3) solution) Alkali-soluble resins (B3-1) to (B3-3) listed in Table 3 were synthesized using the same method as for alkali-soluble resins (B1-1) or (B2-1), and PGMAc was added to bring the non-volatile content to 20% by mass.

[0343] [Table 3]

[0344] <Production of polymerizable compound (C)> (Polymerizable compound (C-1) containing urethane bonds) A five-necked flask equipped with a stirrer, reflux condenser, nitrogen inlet tube, thermometer, and dropping tube was charged with 400 parts dipentaerythritol pentaacrylate, 100 parts PGMAc, and 0.5 parts N,N-dimethylbenzylamine. The temperature was raised to 70°C, and a mixture of 66 parts toluene diisocyanate and 66 parts PGMAc was added dropwise from the dropping tube over 2 hours. After addition, the mixture was reacted at a temperature of 50-70°C for 8 hours, and the reaction was measured at 2180 cm⁻¹ by infrared (IR). -1 The disappearance of the absorption of the isocyanate was confirmed. Next, 35 parts of mercaptoacetic acid and 0.6 parts of 4-methoxyphenol were charged and reacted at a temperature of 50-60°C for 6 hours. The non-volatile content was adjusted to 50% by mass to obtain a polymerizable compound (C-1) solution having urethane bonds with an average of 9 polymerizable unsaturated groups.

[0345] <Manufacturing of coloring agent (F)> (Finely milled green pigment (F-1)) 100 parts of CI Pigment Green 58, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 70°C for 6 hours. This mixture was added to 3,000 parts of warm water and stirred in a high-speed mixer for 1 hour while heating to 70°C to form a slurry. After repeated filtration and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried at 80°C overnight and then pulverized to obtain finely ground green pigment (F-1).

[0346] (Finely milled red pigment (F-2)) 100 parts of CI Pigment Red 254, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 60°C for 6 hours. Next, the kneaded mixture was added to warm water and stirred in a high-speed mixer for 1 hour while heating to approximately 80°C to form a slurry. After filtering and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried at 80°C overnight and then pulverized to obtain finely ground red pigment (F-2).

[0347] (Finely milled blue pigment (F-3)) 100 parts of CI Pigment Blue 15:6, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 50°C for 12 hours. This mixture was added to 3,000 parts of warm water and stirred in a high-speed mixer for about 1 hour while heating to about 70°C to form a slurry. After repeated filtration and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried at 80°C for 24 hours and then pulverized to obtain finely ground blue pigment (F-3).

[0348] (Finely milled yellow pigment (F-4)) 100 parts of CI Pigment Yellow 138, 800 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 70°C for 12 hours. 3000 parts of this mixture were added to warm water and stirred in a high-speed mixer for about 1 hour while heating to approximately 70°C to form a slurry. After repeated filtration and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried at 80°C overnight and then pulverized to obtain finely milled yellow pigment (F-4).

[0349] (Finely milled purple pigment (F-5)) 100 parts of CI Pigment Violet 23, 800 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 70°C for 12 hours. 3000 parts of this mixture were added to warm water and stirred in a high-speed mixer for about 1 hour while heating to approximately 70°C to form a slurry. After repeated filtration and washing with water to remove sodium chloride and diethylene glycol, the mixture was dried at 80°C overnight and then pulverized to obtain finely ground purple pigment (F-5).

[0350] <Manufacturing of Dispersed Resin (G)> (Dispersion resin (G-1) solution) In a reactor equipped with a gas inlet pipe, condenser, stirring blades, and thermometer, 40 parts methyl methacrylate, 10 parts n-butyl methacrylate, and 13.2 parts tetramethylethylenediamine as catalyst were charged, and the mixture was stirred at 50°C for 1 hour while flowing nitrogen, and the system was purged with nitrogen. Next, 9.3 parts ethyl bromoisobutyrate as initiator, 5.6 parts cuprous chloride as catalyst, and 100 parts PGMAc were charged, and the temperature was raised to 110°C under a nitrogen atmosphere to start polymerization of the first block (block B). After 4 hours of polymerization, the polymerization solution was sampled and the non-volatile content was measured, and it was confirmed that the polymerization conversion rate was 98% or higher based on the non-volatile content. Next, 50 parts PGMAc, 40 parts dimethylaminoethyl methacrylate and 10 parts methacryloyloxyethyl benzyldimethylammonium chloride as monomers for the second block (block A) were added to this reactor, and the reaction was continued by stirring while maintaining 110°C and a nitrogen atmosphere. Two hours after the start of the reaction, the polymerization solution was sampled and its non-volatile content was measured. Based on the non-volatile content, it was confirmed that the polymerization conversion rate of the second block (block A) was 98% or higher, and the reaction solution was cooled to room temperature to stop the polymerization. GPC measurement results showed that the polymer had a mass-average molecular weight of 20,000, a molecular weight distribution Mw / Mn of 1.4, and a reaction conversion rate of 98.5%. In this way, a dispersion resin (G-1) with an amine value of 169.8 mgKOH / g per non-volatile content was obtained. A dispersion resin (G-1) solution was prepared by adding PGMAc so that the non-volatile content was 30% by mass.

[0351] (Dispersion resin (G-2) solution) In a reactor equipped with a gas inlet pipe, condenser, stirring blades, and thermometer, 30 parts methyl methacrylate, 30 parts n-butyl methacrylate, 20 parts hydroxyethyl methacrylate, and 13.2 parts tetramethylethylenediamine were charged. The mixture was stirred at 50°C for 1 hour while flowing nitrogen, and the system was purged with nitrogen. Next, 9.3 parts ethyl bromoisobutyrate, 5.6 parts cuprous chloride, and 133 parts PGMAc were charged, and the temperature was raised to 110°C under a nitrogen stream to start polymerization of the first block (block B). After 4 hours of polymerization, the polymerization solution was sampled and the non-volatile content was measured. Based on the non-volatile content, it was confirmed that the polymerization conversion rate was 98% or higher. Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpiperidyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., Funcryl FA-711MM) as the second block (block A) monomer were added to the reaction apparatus, and the reaction was continued with stirring while maintaining a temperature of 110°C and a nitrogen atmosphere. Two hours after the addition of 1,2,2,6,6-pentamethylpiperidyl methacrylate, the polymerization solution was sampled and the non-volatile content was measured. Based on the non-volatile content, it was confirmed that the polymerization conversion rate of the second block (block A) was 98% or higher, and the reaction solution was cooled to room temperature to stop the polymerization. PGMAc was added to dilute the solution to a non-volatile content of 30%, and a dispersed resin (G-2) solution with an amine value of 57 mgKOH / g per non-volatile content and a number-average molecular weight of 4,500 (Mn) was obtained.

[0352] (Dispersion resin (G-3) solution) In a reaction vessel equipped with a gas inlet tube, temperature control, condenser, and stirrer, 10 parts methacrylic acid, 100 parts methyl methacrylate, 70 parts i-butyl methacrylate, 20 parts benzyl methacrylate, and 50 parts PGMAc were charged and purged with nitrogen gas. The reaction vessel was heated to 50°C and stirred, and 12 parts 3-mercapto-1,2-propanediol were added. The temperature was raised to 90°C, and the reaction was carried out for 7 hours while adding a solution of 0.1 parts 2,2'-azobisisobutyronitrile added to 90 parts PGMAc. Non-volatile content measurement confirmed that 95% had reacted. 19 parts pyromellitic anhydride, 50 parts PGMAc, 50 parts cyclohexanone, and 0.4 parts 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added, and the reaction was carried out at 100°C for 7 hours. After confirming that more than 98% of the acid anhydride had undergone half-esterification by measuring the acid value, the reaction was terminated. The solution was then diluted with PGMAc to a non-volatile content of 30% to obtain a dispersion resin (G-3) solution with an acid value of 70 mgKOH / g and a weight-average molecular weight of 8,500.

[0353] <Dispersion manufacturing> (Dispersion 1) After stirring and mixing the following raw materials until uniform, the mixture was dispersed for 3 hours using an Eiger mill (Eiger Japan's "Mini Model M-250 MKII") with a 0.5 mm diameter zirconia bead, and then filtered through a 1.0 μm pore size filter to prepare dispersion 1. The organic solvent (Q-1) is PGMAc. Near-infrared absorbing dye (A-1): 15.0 parts Dispersion resin (G-1) solution: 20.0 parts Organic solvent (Q-1): 65.0 parts

[0354] (Dispersion 2~11) Dispersions 2-11 were prepared in the same manner as dispersion 1, except that the raw materials and quantities listed in Table 4 were changed.

[0355] [Table 4]

[0356] <Manufacturing of photosensitive compositions> [Example 1] (Photosensitive composition 1) The following raw materials were mixed and stirred, and filtered through a filter with a pore size of 1.0 μm to obtain photosensitive composition 1. Dispersion 1: 15.0 parts Dispersion 3: 20.0 parts Alkali-soluble resin (B1-1) solution: 15.0 parts Alkali-soluble resin (B2-1) solution: 15.0 parts Polymerizable compound (C-1): 3.0 parts Polymerizable compound (C-2): 3.5 parts Polymerizable compound (C-4): 3.5 parts Photopolymerization initiator (D-2): 0.25 parts Photopolymerization initiator (D-3): 0.25 parts Benzophenone compound (E2-1): 0.75 parts Leveling agent (N): 1.0 part Organic solvent (Q): 22.25 parts

[0357] [Examples 2-48, Comparative Examples 1-4] (Photosensitive composition 2-52) Photosensitive compositions 2 to 52 were prepared in the same manner as in Example 1, except that the raw materials and quantities of photosensitive composition 1 in Example 1 were changed to those listed in Tables 5-1 to 5-5.

[0358] [Table 5-1]

[0359] [Table 5-2]

[0360] [Table 5-3]

[0361] [Table 5-4]

[0362] [Table 5-5]

[0363] The ingredients listed in Tables 5-1 to 5-5 are as follows:

[0364] [Polymerizable compound (C)] C-1: Polymerizable compound having the urethane bond described above. C-2: Polymerizable compound having the acid group of the above chemical formula (13) C-3: Aronics M-520 (manufactured by Toagosei Co., Ltd., a polymerizable compound containing an acidic group) C-4: KAYARAD DPCA-30 (manufactured by Nippon Kayaku Co., Ltd., a lactone-modified polymerizable compound)

[0365] [Photopolymerization initiator (D)] D-1: Photopolymerization initiator of the above chemical formula (16) D-2: Photopolymerization initiator of the above chemical formula (17) D-3: Photopolymerization initiator of the above chemical formula (18) D-4: Irgacure OXE-02 (manufactured by BASF Japan, oxime compound)

[0366] [Sensitizer (E)] (Thioxanthone compound (E1)) E1-1: 2,4-Diethylthioxanthone (Benzophenone compounds (E2)) E2-1: 4,4'-Bis(diethylamino)benzophenone

[0367] [Leveling agent (N)] N-1: BYK-330 (manufactured by Big Chemie Co., Ltd.) N-2: Megafuck F-551 (manufactured by DIC Corporation) As described above, (N-1) and (N-2) were mixed in 1 part each and dissolved in 98 parts PGMAc to form a mixed solution which was used as the leveling agent (N).

[0368] [Organic solvent (Q)] Q-1: Propylene glycol monomethyl ether acetate 30 parts Q-2: Cyclohexanone 30 parts Q-3: 3-Ethoxypropionate 10 parts Q-4: Propylene glycol monomethyl ether 10 parts Q-5: Cyclohexanol acetate 10 parts Q-6: Dipropylene glycol methyl ether acetate 10 parts The above (Q-1) to (Q-6) were mixed in the above-mentioned parts by mass to obtain organic solvent (Q).

[0369] <Evaluation of photosensitive compositions> The resulting photosensitive compositions 1 to 52 (Examples 1 to 48, Comparative Examples 1 to 4) were evaluated for developability, adhesion, heat cycle resistance, and solvent resistance using the methods described below. The evaluation results are shown in Table 6.

[0370] [Evaluation of developability] The obtained photosensitive composition was coated onto a 100 mm x 100 mm, 0.7 mm thick glass substrate (Corning Eagle 2000) using a spin coater to a dry film thickness of 2.0 μm, and then dried on a hot plate at 70°C for 1 minute. Next, an illuminance of 30 mW / cm² was applied using an ultra-high pressure mercury lamp. 2 50 mJ / cm² 2 The substrate was then exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling the substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with deionized water, and air-dried. The resulting substrate was post-baked in a clean oven at 200°C for 15 minutes to form a stripe pattern on the substrate. The pattern was observed with an optical microscope, and the amount of residue remaining in the unexposed areas was evaluated by binarization of the image. The evaluation criteria are as follows, with a score of 2 or higher indicating usability. 3: Development residue is less than 1.5% of the unexposed area. 2: Development residue is between 1.5% and less than 3% of the unexposed area. 1: Development residue covers 3% or more of the unexposed area.

[0371] [Adhesion evaluation] The obtained photosensitive composition was coated onto a 100 mm x 100 mm, 0.7 mm thick glass substrate (Corning Eagle 2000) by spin coating to a dry film thickness of 2.0 μm, and dried on a hot plate at 70°C for 1 minute. After the substrate cooled to room temperature, it was illuminated at 30 mW / cm² using a high-pressure mercury lamp through a photomask with a stripe pattern ranging from 5 μm to 25 μm in 5 μm width increments. 2 50 mJ / cm² 2 The substrate was exposed to light. Subsequently, this substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with deionized water, air-dried, and post-baked in a clean oven at 200°C for 15 minutes to obtain a substrate for adhesion evaluation. Spray development was performed for the shortest time possible for pattern formation without any development residue for each photosensitive composition, and this was defined as the appropriate development time. Fine line patterns with a width of 5 to 25 μm on the substrate used for adhesion evaluation were observed with an optical microscope to confirm the minimum line width of the remaining fine line patterns. The evaluation criteria are as follows, with a score of 3 or higher indicating practical usability. 5: Fine lines smaller than 10 μm remain. 4: Fine lines larger than 15 μm remain. 3: Fine lines larger than 20 μm remain. A fine line measuring 2:25 μm remains. 1: No thin lines remain.

[0372] [Solvent resistance evaluation] The obtained photosensitive composition was coated onto a 100 mm x 100 mm, 0.7 mm thick glass substrate (Corning Eagle 2000) using a spin coater to a dry film thickness of 2.0 μm, and then dried on a hot plate at 70°C for 1 minute. Next, an illuminance of 30 mW / cm² was applied using an ultra-high pressure mercury lamp. 2 50 mJ / cm² 2The substrate was then exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling the substrate to room temperature, it was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with deionized water, and air-dried. The resulting substrate was post-baked in a clean oven at 200°C for 15 minutes to obtain a substrate for solvent resistance evaluation. The obtained substrates were immersed in N-methylpyrrolidone at room temperature for 30 minutes, washed with deionized water, air-dried, and observed using an optical microscope on the 100 μm wide stripe pattern area. The evaluation criteria are as follows, with a score of 3 or higher considered practical. 5: There is no change in appearance or color. 4: Slight wrinkles may appear, but there is no change in color. 3: Some wrinkles may appear, but there is no change in color. 2: Wrinkles and other marks may appear throughout, and the color may fade slightly. 1: Peeling and fading may occur.

[0373] [Heat cycle resistance evaluation] The obtained photosensitive composition was coated onto a 100 mm x 100 mm, 0.7 mm thick glass substrate (Corning Eagle 2000) using a spin coater to a dry film thickness of 2.0 μm, and then dried on a hot plate at 70°C for 1 minute. After the substrate cooled to room temperature, it was illuminated at 30 mW / cm² using a high-pressure mercury lamp through a 100 μm stripe pattern photomask. 2 50 mJ / cm² 2 The substrate was exposed to light. Subsequently, this substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with deionized water, air-dried, and post-baked in a clean oven at 200°C for 15 minutes to obtain a substrate for evaluating heat cycle resistance. Subsequently, the heat cycle resistance evaluation substrate was subjected to 500 cycles of temperature changes: 10 minutes at -20°C, followed by 10 minutes at 100°C. The evaluation criteria were as follows, with a score of 3 or higher indicating practical usability. 5:500 cycles, no visible abnormalities. 4:500 cycles: Slight cracking and / or peeling occurs. 3: After 500 cycles, some cracks and / or peeling occurred. 2:200 cycles: Cracks and / or delamination occur. Cracks and / or peeling occur at a rate of 1:100 cycles.

[0374] [Table 6] [Explanation of Symbols]

[0375] 10 Image display device 11 Transparent substrate 12 TFT arrays 13 Transparent electrode layer 14. Orientation layer 15 Polarizing plates 21 Transparent substrate 22 Color Filters 23 Transparent electrode layer 24 orientation layer 25 Polarizing plates 30 backlight units 31 White LED light source LC LCD 200 Solid State Imaging Devices 201 Solid-state image sensor 202 Imaging Department 203 Cover glass 204 Spacer 205 Multilayer substrate 206 Chip board 207 Circuit board 208 Electrode Pads 209 External connection terminals 210 Through electrode 211 Lens layer 212 Lens material 213 Support 214 Cured film 215 Cured film 300 Infrared Sensors 310 Solid-state image sensor 311 Infrared Cut Filter 312 Color Filters 313 Infrared transmission filter 314 Resin film 315 Microlens 316 Flat film

Claims

1. A photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), The alkali-soluble resin (B) comprises an alkali-soluble resin (B1) having a glass transition temperature of -10 to 37°C, and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C. The alkali-soluble resin (B1) is a resin containing polymerizable unsaturated groups and hydroxyl groups. A photosensitive composition in which the content of the alkali-soluble resin (B1) is 30 to 70% by mass of 100% by mass of the alkali-soluble resin (B).

2. Furthermore, the photosensitive composition according to claim 1, further comprising a coloring agent (F).

3. The photosensitive composition according to claim 1 or 2, wherein the alkali-soluble resin (B2) is a resin that does not contain polymerizable unsaturated groups.

4. Furthermore, the photosensitive composition according to claim 1 or 2, further comprising a sensitizer (E).

5. The photosensitive composition according to claim 4, wherein the content of the sensitizer (E) is 150 to 400 parts by mass per 100 parts by mass of the photopolymerization initiator (D).

6. A cured film obtained by curing the photosensitive composition according to claim 1 or 2.

7. An optical filter having the cured film described in claim 6.

8. An image display device having the cured film described in claim 6.

9. A solid-state image sensor having the cured film described in claim 6.

10. An infrared sensor having a cured film as described in claim 6.

Images