Dynamic release tape for assembling individual components

Abstract

To provide a dynamic release tape for assembling a discrete component.SOLUTION: A method includes the steps of placing a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape having a flexible support layer, a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes a step of applying radiation to the dynamic release structure to release the discrete component from the dynamic release tape.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] Priority Claim This application claims the priority of U.S. Patent Application No. 62 / 843,904, filed on May 6, 2019, and U.S. Patent Application No. 62 / 806,154, filed on February 15, 2019, both of which are hereby incorporated by reference in their entirety.

Background Art

[0002] This specification generally relates to assembling individual components onto a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Means for Solving the Problems

[0004] In one aspect, the method includes placing an individual component assembly on a support fixture of a component transfer system, the individual component assembly including a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component adhered to the dynamic release tape; and irradiating the dynamic release structure to peel the individual component from the dynamic release tape, at least a portion of the flexible support layer being in a non-supported state when the individual component assembly is placed on the support fixture.

[0005] Embodiments can have one or more of the following features.

[0006] The step of placing the individual component assembly onto the support fixture includes the step of mounting the wafer ring of the individual component assembly onto the frame of the support fixture.

[0007] This method includes the step of adhering individual components to a dynamic release tape. The step of adhering individual components to a dynamic release tape includes the step of adhering individual components to the component adhesive layer of the dynamic release structure. The step of adhering individual components to a dynamic release tape includes the step of transferring individual components from a dicing tape to a dynamic release tape.

[0008] This method includes the step of bonding a wafer to a dynamic release tape. The step of bonding a wafer to a dynamic release tape includes the step of bonding the wafer to the component adhesive layer of the dynamic release structure. This method includes the step of dicing the bonded wafer to form individual components. The step of placing the individual component assembly on a transparent support plate includes the step of attaching the dynamic release tape containing the individual components to the support plate of a support fixture. The step of placing the individual component assembly on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[0009] The step of irradiating the dynamic exfoliation structure includes irradiating the dynamic exfoliation structure with light from the light source of the component transfer system.

[0010] In one embodiment, the method includes the steps of arranging an individual component assembly on a support fixture of a component transfer system, wherein the individual component assembly includes a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, and individual components adhered to the dynamic release tape, and the step of arranging the individual component assembly on the support fixture includes the step of directly arranging the flexible support layer of the dynamic release tape on a support plate of the support fixture, and the step of irradiating the dynamic release structure to peel the individual components from the dynamic release tape.

[0011] The embodiment may have one or more of the following features:

[0012] The step of placing the individual component assembly onto the support fixture includes the step of mounting the wafer ring of the individual component assembly onto the frame of the support fixture.

[0013] This method includes the step of irradiating a dynamic release structure through a support plate to peel individual components from the dynamic release tape. This method includes the step of orienting the component transfer system so that the individual components are positioned between the support plate and the target substrate.

[0014] The step of placing the individual component assembly on a support plate includes the step of placing the individual component assembly on a high-rigidity support plate.

[0015] The step of placing the individual component assembly onto the support fixture includes the step of directly attaching the flexible support layer to the support plate.

[0016] The step of placing the individual component assembly onto the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[0017] The step of placing the individual component assembly onto the support plate includes the step of stretching the dynamic release tape over the entire support plate.

[0018] This method includes the step of adhering individual components to a dynamic release tape. The step of adhering individual components to a dynamic release tape includes the step of adhering individual components to the component adhesive layer of the dynamic release structure. The step of adhering individual components to a dynamic release tape includes the step of transferring individual components from a dicing tape to a dynamic release tape.

[0019] This method includes the step of adhering a wafer to a dynamic release tape. The step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to a component adhesive layer of the dynamic release structure. This method includes the step of dicing the adhered wafer to form individual components. The step of placing an individual component assembly on a transparent support plate includes the step of attaching a dynamic release tape including the individual components to a support plate of a support fixture. The step of placing an individual component assembly on a transparent support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[0020] The step of irradiating the dynamic release structure includes the step of irradiating the dynamic release structure with light from a light source of a component transfer system.

[0021] In one aspect, the individual component transfer system includes a light source, an individual component support fixture including a support frame and a support plate disposed on the support frame, the support plate being configured to transmit light emitted by the light source, and an optical element disposed between the light source and the support frame.

[0022] Embodiments can have one or more of the following features.

[0023] The system includes a suction source configured to apply suction to an air flow path of the individual component support fixture to hold a flexible support layer of the individual component assembly against the support plate.

[0024] The system includes an individual component assembly including a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and individual components adhered to the dynamic release tape. The flexible support layer of the dynamic release tape is disposed directly on the support plate and is held in a predetermined position by suction through an air flow path of the individual component support fixture. The air flow path is formed through the thickness of the support frame. The air flow path is formed through the thickness of the support plate.

[0025] The upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into the dynamic release tape held on the individual component support fixture.

[0026] The support plate includes a glass plate.

[0027] The support plate includes a quartz plate.

[0028] The support plate is highly rigid.

[0029] The optical element includes a lens.

[0030] In one aspect, the individual component transfer system includes a light source, an individual component support fixture, an individual component assembly disposed on the individual component support fixture, a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component adhered to the dynamic release tape. The individual component assembly includes an individual component assembly that causes the dynamic release tape to be in a non-supported state when disposed on the individual component support fixture, and an optical element disposed between the light source and the individual component assembly.

[0031] Embodiments can include one or more of the following features.

[0032] The individual component assembly includes a wafer ring disposed on the individual component support fixture.

[0033] In one aspect, the method includes dicing a wafer adhered to a dicing tape to form individual components, transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and directly disposing the flexible support layer of the individual component assembly on the support plate of the component transfer system.

[0034] Embodiments can include one or more of the following features.

[0035] The step of transferring individual components to a dynamic release tape includes the step of adhering the individual components to the component adhesive layer of the dynamic release structure.

[0036] The dynamic release structure of the dynamic release tape includes multiple layers. The dynamic release structure includes an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[0037] The step of directly placing the flexible support layer on the support plate includes the step of directly attaching the flexible support layer to the support plate.

[0038] The step of directly placing the flexible support layer onto the support plate includes the step of holding the individual component assemblies on the support plate by applying suction.

[0039] The step of directly placing the flexible support layer onto the support plate includes the step of stretching the dynamic release tape over the entire support plate.

[0040] This method includes the step of irradiating the dynamic peel structure of an assembly of individual components through a support plate so as to peel the individual components from the dynamic peel tape.

[0041] In one embodiment, the method includes the steps of: dicing a wafer adhered to a dicing tape to form individual components; transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly including a flexible support layer and a dynamic release structure disposed on the flexible support layer; and arranging the individual component assembly in a component transfer system such that at least a portion of the dynamic release tape is unsupported.

[0042] The embodiments may include one or more of the following features:

[0043] This method includes the step of irradiating an unsupported dynamic release tape to peel individual components from the dynamic release tape.

[0044] The dynamic release structure of the dynamic release tape includes multiple layers. The dynamic release structure includes an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[0045] In one embodiment, the process includes the steps of adhering a wafer to a dynamic release tape which includes a flexible support layer in an unsupported state and a dynamic release structure disposed on the flexible support layer, and dicing the adhered wafer to form individual components adhered to the dynamic release tape.

[0046] The embodiments may include one or more of the following features:

[0047] The step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the adhesive layer of the component of the dynamic release structure.

[0048] The dynamic release structure of the dynamic release tape includes multiple layers. The dynamic release structure includes an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[0049] In one embodiment, the method includes the steps of: adhering a wafer to a dynamic release tape which includes a flexible support layer and a dynamic release structure disposed on the flexible support layer; dicing the adhering wafer to form individual components which are adhering to the dynamic release tape, wherein the individual components which are adhering to the dynamic release tape include an individual component assembly; and directly placing the flexible support layer of the individual component assembly onto a support plate of a component transfer system.

[0050] The embodiments may include one or more of the following features:

[0051] The step of directly placing the flexible support layer on the support plate includes the step of directly attaching the flexible support layer of the dynamic release tape to the support plate.

[0052] The step of directly placing the flexible support layer onto the support plate includes the step of holding the individual component assemblies on the support plate by applying suction.

[0053] The step of placing the flexible support layer on the support plate includes the step of stretching the dynamic release tape over the entire support plate.

[0054] This method includes the step of irradiating the dynamic peel structure of an assembly of individual components through a support plate so as to peel the individual components from the dynamic peel tape.

[0055] The dynamic release structure of the dynamic release tape includes multiple layers. The dynamic release structure includes an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[0056] In one embodiment, the method includes the steps of: adhering a wafer to a dynamic release tape which includes a flexible support layer and a dynamic release structure disposed on the flexible support layer; dicing the adhering wafer to form individual components which are adhering to the dynamic release tape, wherein the individual components which are adhering to the dynamic release tape include an individual component assembly; and arranging the individual component assembly in a component transfer system such that at least a portion of the dynamic release tape is in an unsupported state.

[0057] The embodiments may include one or more of the following features:

[0058] This method includes the step of irradiating an unsupported dynamic release tape to peel individual components from the dynamic release tape.

[0059] The dynamic release structure of the dynamic release tape includes multiple layers. The dynamic release structure includes an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[0060] In one embodiment, the apparatus includes a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0061] The embodiments may include one or more of the following features:

[0062] The dynamic release tape has sufficient rigidity to allow individual components to be laser-transferred from the dynamic release tape.

[0063] The dynamic release tape has sufficient rigidity to maintain a substantially planar configuration during laser transfer of individual components from the dynamic release tape. The flexible support layer contains a polymer. The dynamic release structure includes a plurality of layers. The dynamic release structure includes an absorbing adhesive layer disposed on the flexible support layer, which is configured to adhere to the flexible support layer and generate gas in response to light irradiation, and an active layer disposed on the absorbing adhesive layer. The active layer includes a foamed layer configured to mechanically react to the gas generated by the absorbing adhesive layer. The dynamic release structure includes an adhesive layer disposed on the flexible support layer, which is configured to adhere to the flexible support layer, and an active layer structure disposed on the adhesive layer. The active layer structure includes an absorbing foamed layer, which is configured to generate gas in response to light irradiation and to mechanically react to the gas generated. The active layer structure includes an absorbing layer disposed on the adhesive layer, which is configured to generate gas in response to light irradiation, and a foamed layer configured to mechanically react to the gas generated by the absorbing layer. One of the layers in the dynamic delamination structure includes a constituent adhesive layer. The adhesion of the constituent adhesive layer responds to the application of a stimulus.

[0064] The tape is stretchable.

[0065] The flexible support layer transmits ultraviolet light.

[0066] The device includes individual components bonded to a dynamic peel structure. These individual components include light-emitting diodes (LEDs).

[0067] In one embodiment, the method includes the step of forming a dynamic release structure on a flexible support layer to form a dynamic release tape.

[0068] The embodiments may include one or more of the following features:

[0069] The step of forming a dynamic release structure includes the step of forming a plurality of layers on a flexible support layer. The step of forming a dynamic release structure includes the step of forming an absorbent adhesive layer on a flexible support layer, wherein the absorbent adhesive layer is configured to adhere to the flexible support layer and generate gas in response to light irradiation, and the step of forming an active layer on the absorbent adhesive layer. The active layer includes a foamed layer configured to mechanically react to the gas generated by the absorbent adhesive layer. The step of forming a dynamic release structure includes the step of forming an adhesive layer on a flexible support layer, wherein the adhesive layer is configured to adhere to the flexible support layer, and the step of forming an active layer structure on the adhesive layer. The active layer structure includes an absorbent foamed layer, which generates gas in response to light irradiation and is configured to mechanically react to the gas generation. The step of forming an active layer structure includes the step of forming an absorption layer on an adhesive layer, wherein the absorption layer is configured to generate gas in response to irradiation with light, and the step of forming a foam layer on the absorption layer, wherein the foam layer is configured to mechanically react to the gas generated by the absorption layer.

[0070] In one embodiment, the dynamic peeling device comprises a flexible support layer and a dynamic peeling structure disposed on the flexible support layer, the dynamic peeling structure including an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer, and an active layer structure disposed on the adhesive layer.

[0071] The embodiments may include one or more of the following features:

[0072] The active layer structure includes an absorbing foam layer, which generates gas in response to light irradiation and is configured to react mechanically to the gas generation.

[0073] The active layer structure is an absorbent layer disposed on an adhesive layer, and includes an absorbent layer configured to generate gas in response to light irradiation, and a foamed layer configured to mechanically react to the gas generated by the absorbent layer.

[0074] The dynamic delamination structure includes a constituent adhesive layer.

[0075] In one embodiment, the method includes the step of arranging an individual component assembly on a support fixture of a component transfer system, wherein the individual component assembly includes a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, and individual components adhered to the dynamic release tape. The method includes the step of irradiating the dynamic release structure to peel the individual components from the dynamic release tape.

[0076] In one embodiment, the individual component transfer system includes a light source and an individual component support mounting fixture which includes a support frame, a support plate disposed on the support frame that transmits light emitted by the light source, and an optical element disposed between the light source and the support frame.

[0077] In one embodiment, the individual component transfer system includes a light source, an individual component support mounting fixture, and an individual component assembly disposed on the individual component support mounting fixture. The individual component assembly includes a dynamic release tape having a flexible support layer and a dynamic release structure disposed on the flexible support layer, and individual components adhered to the dynamic release tape. The individual component transfer system includes an optical element disposed between the light source and the individual component assembly.

[0078] In one embodiment, the method includes the steps of dicing a wafer adhered to a dicing tape to form individual components, and transferring the individual components from the dicing tape to a dynamic release tape to form an assembly of individual components including a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0079] In one embodiment, the method includes the steps of bonding a wafer to a dynamic release tape which includes a flexible support layer and a dynamic release structure disposed on the flexible support layer, and dicing the bonded wafer to form individual components bonded to the dynamic release tape.

[0080] In one embodiment, the apparatus includes a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0081] In one embodiment, the method includes the step of forming a dynamic release structure on a flexible support layer to form a dynamic release tape. In one embodiment, the dynamic peeling device includes a support layer and a dynamic peeling structure disposed on the support layer, the dynamic peeling structure includes an adhesive layer disposed on the support layer and configured to adhere to the support layer, and an active layer structure disposed on the adhesive layer. [Brief explanation of the drawing]

[0082] [Figure 1A] This is a diagram of the laser-assisted transfer process. [Figure 1B] This is a diagram of the laser-assisted transfer process. [Figure 2A] This is a diagram of a dynamic release tape with a support mounting device. [Figure 2B] This is a diagram of a dynamic release tape with a support mounting device. [Figure 3] This is a diagram of a dynamic release tape with a support mounting device. [Figure 4] This is a diagram of a system for laser-assisted transfer of individual components. [Figure 5] This is a diagram of a system for laser-assisted transfer of individual components. [Figure 6] This is a process diagram. [Figure 7] This is a process diagram. [Figure 8A] This is a diagram of a multilayer dynamic release tape mounted on a support plate. [Figure 8B] This is a diagram of a multilayer dynamic release tape mounted on a support plate. [Figure 8C] This is a diagram of a multilayer dynamic release tape mounted on a support plate. [Figure 9A] This is a diagram of a multilayer dynamic delamination structure. [Figure 9B] This is a diagram of a multilayer dynamic delamination structure. [Figure 9C] This is a diagram of a multilayer dynamic delamination structure. [Figure 10] This is a diagram of a dynamic release tape with a support mounting device. [Modes for carrying out the invention]

[0083] This specification describes a method for laser-assisted transfer of individual components from a thin, flexible dynamic release tape disposed on a support plate of a component transfer system. The dynamic release tape includes a multilayer dynamic release structure disposed on a support layer such as a backing. Each layer of the dynamic release structure can be specifically designed to target one or more functions of the dynamic release structure, such as adhesion, optical properties, or mechanical properties. Laser-assisted transfer of individual components from a dynamic release tape disposed on a carrier substrate is also described.

[0084] Figures 1A and 1B illustrate a laser-assisted transfer process for high-throughput, low-cost, non-contact assembly of discrete components 102 onto rigid or flexible substrates. The term discrete component generally refers to any unit that becomes part of a product or electronic device, e.g., an electronic, electromechanical, photovoltaic, photonic, or optoelectronic component, module, or system, e.g., any semiconductor material having a circuit formed on part of a semiconductor material. In some examples, the discrete component may be a light-emitting diode (LED). The discrete component can be ultrathin, i.e., with a maximum thickness of 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The discrete component can be ultraminiature, i.e., with a maximum length or width dimension of 300 μm or less per side, 100 μm or less per side, 50 μm or less per side, 20 μm or less per side, or 5 μm or less per side. Individual components can be made ultra-thin and ultra-compact.

[0085] Figures 1A and 1B show a portion of the support mount 100 of the component transfer system for laser-assisted transfer of individual components 102. The support mount 100 holds the flexible individual component assembly 108 in place for the laser-assisted transfer process. The support mount (described in more detail below) may include a rigid support plate 106 mounted on a frame (not shown, described in more detail below). The frame provides stability to the rigid support plate 106. In some examples, the frame may be manipulated, for example, for alignment purposes. The individual component assembly 108 can be attached to the support plate 106 by attractive force, tensile stress, or other means, as described in more detail below. The placement of the individual component assembly 108 on the support plate 106 is non-permanent, for example, so that the individual component assembly 108 can be removed from the support plate 106 after the laser-assisted transfer process is completed without damaging the support plate 106. The non-permanent mounting of the individual component assemblies 108 onto the support plate 106 makes the support plate 106 available for multiple transfer processes involving multiple individual component assemblies 108.

[0086] The individual component assembly 108 includes a dynamic release tape 110 mounted on a wafer ring (not shown), to which individual components 102 are bonded. Although only a single individual component 102 is shown here, multiple individual components 102 can also be bonded to the dynamic release tape 110 and transferred by a component transfer system. The dynamic release tape (e.g., tape 110) is a tape comprising a flexible support layer 112 and a dynamic release structure 114 disposed on the flexible support layer 112. The tape is a thin, flexible material composed of one or more layers. The flexible support layer 112 is in contact with the support plate 106 of the support fixture 100, and the individual components 102 are bonded to the dynamic release structure 114. The dynamic release structure 114 can be a multilayer structure, such as a structure having two, three, four, or more layers, as will be described in more detail below.

[0087] As can be seen by referring to Figure 1B, in the laser-assisted transfer process, light, such as a laser beam or other radiation 116, is irradiated onto the back surface of the support plate 106. Both the support plate 106 and the flexible support layer 112 of the dynamic release tape 110 transmit the wavelength (e.g., laser energy) of the radiation 116. An element that transmits a given wavelength is an element through which at least some radiation of a given wavelength passes. The radiation 116 passes through the support plate 106 and the flexible support layer 112 of the dynamic release tape 110 and enters a region of the dynamic release structure 114, cauterizing a portion of the dynamic release structure 114 in the region where the radiation 116 enters (called the irradiation region). Cauterization generates confined gas, which expands and creates stress in the dynamic release structure 114. This stress deforms at least a portion of the material of the dynamic release structure 114, forming a blister 118. The blister 118 applies mechanical force to the individual components 102. When the mechanical force applied by the blister 118 is sufficient to overcome the adhesion between the individual component 102 and the dynamic release structure 114, the mechanical force applied by the blister 118 (combined with gravity) pulls the individual component away from the support plate 106 (for example, downward) and transfers it to the target substrate 130.

[0088] The target substrate 130 can be positioned close to the individual components 102, for example, at a distance between approximately 5 μm and approximately 300 μm. Supporting the tape-based individual component assembly 108 with a high-rigidity support plate 106 helps maintain a constant separation distance between the individual components 102 of the individual component assembly 108 and the target substrate 130, for example, by preventing sagging or other structural variations in the tape 110. In some examples, the support plate 106 can be given a high degree of surface flatness. For example, the support plate 106 can be machined with high precision.

[0089] In some laser-assisted transfer processes, individual components are bonded to a highly rigid transparent carrier substrate by a dynamic release structure. The carrier substrate with the bonded individual components is then supplied to a component transfer system for laser-assisted transfer of the individual components. The component transfer system described herein incorporates a highly rigid transparent support plate into the component transfer system itself, enabling the transfer of individual components from tape rather than from the highly rigid carrier substrate, thereby reducing the cost of the end-to-end individual component transfer process (e.g., in terms of materials, manufacturing, and transportation). For example, highly rigid carrier substrates can be significantly more expensive than dynamic release tapes. Furthermore, dynamic release tapes are disposable, eliminating the associated costs of refurbishing the highly rigid carrier substrate.

[0090] In some cases, the dynamic release tape used in the individual component transfer process is an unsupported tape. An unsupported tape is a tape that is not attached to a high-rigidity substrate. In some cases, an unsupported tape can be placed on a high-rigidity substrate for one or more steps of the individual component transfer process, but it cannot be attached. For example, an unsupported tape can be placed on a high-rigidity substrate when individual components are attached to the tape, when they are introduced into the component transfer system, or when individual components are laser-assisted in the transfer.

[0091] In some cases, the dynamic release tape used in the individual component transfer process is not an unsupported tape, but rather is attached to a high-rigidity substrate when the individual components are attached to the tape, when they are introduced into the component transfer system, and when the individual components are laser-assisted in the transfer.

[0092] A further description of the laser-assisted transfer process is provided in U.S. Patent Application Publication No. 2014 / 0238592, which is incorporated herein by reference in its entirety.

[0093] Figures 2A and 2B show cutaway views of an exemplary support fixture 200, including a support plate 206 for positioning an individual component assembly 208 for a laser-assisted transfer process. The support plate 206 is a highly rigid plate that transmits wavelengths of radiation used in the laser transfer process, such as ultraviolet (UV) light. For example, the support plate 206 can be a glass plate, a quartz plate, or a plate of another material. The support plate 206 is mounted on a frame 220 of the support fixture. In some examples, as shown in Figures 2A and 2B, the frame 220 has an opening 221 to allow radiation to reach the support plate 206. In some examples, the frame 220 does not have to have an opening and can transmit wavelengths of radiation so that radiation passes through the frame 220.

[0094] The individual component assembly 208 includes an unsupported dynamic release tape 210 mounted on a wafer ring 222, to which the individual components 102 are adhered. For example, the dynamic release tape 210 can be stretched on the wafer ring 222. In the example of Figures 2A-2B, the dynamic release tape 210 includes a flexible support layer 212 having a multilayer dynamic release structure 214 disposed on the flexible support layer 212. The exemplary multilayer dynamic release structure 214 includes a plurality of sublayers 224a, 224b having adhesive, radiation absorption, and foaming functions, and a component adhesive layer 226 that adheres to the individual components 102. The multilayer dynamic release structure 214 is described in more detail below.

[0095] As can be seen particularly in Figure 2B, the wafer ring 222 is brought into contact with the frame 220 and the back side of the flexible support layer 212 of the dynamic release tape 210 is brought into contact with the support plate 206 in order to position the individual component assembly 208 on the support plate 206 of the component transfer system. The upper surface 223 of the wafer ring 222, once positioned, becomes substantially horizontal (e.g., aligned) with the upper surface 207 of the support plate 206, thereby ensuring that the dynamic release tape 210 is substantially flat over its entire lateral range.

[0096] For example, suction is applied through the air channel 228 by the suction source of the component transfer system to hold the dynamic release tape 210 against the support plate 206. For example, the air channel 228 can be defined to penetrate the thickness of the frame 220 of the component transfer system (as shown in the figure), to penetrate the thickness of the support plate 206, or to penetrate the thickness of both the frame 220 and the support plate 206. When suction is applied, the dynamic release tape 210 is firmly attracted to the support plate 206, for example, thereby making the dynamic release structure 214 substantially flat.

[0097] As can be seen with reference to Figure 10, in some examples the support mounting fixture 150 includes a frame 170 but does not include a support plate (for example, it does not include a support plate 206 as shown in Figures 2A and 2B). The wafer ring 222 of the individual component assembly 208 is mounted on the frame 170 of the support mounting fixture 150, and the dynamic release tape 210 may remain unsupported for the laser-assisted transfer process. Laser-assisted transfer can be performed directly from the unsupported dynamic release tape 210 when the dynamic release tape 210 has sufficient rigidity, such as enough rigidity to maintain a substantially planar configuration over the duration of the laser-assisted transfer process. For example, the dynamic release tape 210 may have sufficient rigidity to reduce the maximum displacement of the dynamic release tape 210 in the direction z perpendicular to the plane of the tape 210 to less than a threshold amount, for example, less than 20 μm, less than 10 μm, or less than 5 μm, when the individual component assembly 208 is mounted on the frame 170.

[0098] Figure 3 shows a cutaway view of an exemplary support fixture 300, which includes a support plate 306 for positioning an individual component assembly 208 for a laser-assisted transfer process. The support plate 306 is a highly rigid plate that transmits the wavelength of radiation used in the laser transfer process, such as UV light. The support plate 306 is mounted on a frame 320 of the support fixture 300. The frame 320 has an opening 321 to allow radiation to reach the support plate 306. In some examples, the frame 320 can be made to transmit the wavelength of radiation so that the radiation passes through the frame 320.

[0099] In the example in Figure 3, when the individual component assembly 208 is placed on the support fixture 300, the upper surface 223 of the wafer ring 222 is at a lower level than the upper surface 307 of the support plate 306 (for example, offset from the upper surface 307). For example, the frame 320 of the support fixture 300 can be offset from the upper surface of the support plate 306 by an amount such that the support plate 306 and the wafer ring 222 are still offset when the individual component assembly 208 is placed on the support plate. This offset introduces tensile stress to the dynamic release tape 210 that holds the dynamic release tape 210 to the support plate 306, for example, thereby making the dynamic release structure 214 substantially flat. The amount of tensile stress, and therefore the force holding the dynamic release tape 210 to the support plate 306, can be controlled by changing the height difference between the upper surface 223 of the wafer ring 222 and the upper surface 307 of the support plate 306.

[0100] In some examples, the dynamic release tape 210 can be positioned on the support plate of the component transfer system by other means, such as by using magnetic, electrostatic, or mechanical fastening methods, or by other means.

[0101] Figure 4 shows an example of a component transfer system 450. The component transfer system 450 includes a support fixture 400 having a support plate 406 mounted on a frame 420. The support fixture 400 is positioned so that an individual component assembly 408 is held on the support plate 406. The individual component assembly 408 includes a dynamic release tape 410 having bonded individual components 102, which is mounted on a wafer ring 422 and stretched, for example, on the wafer ring 422. For example, the wafer ring 422 is positioned on the frame 420, and the stretched dynamic release tape 410 is held against the support plate 406. The individual component assembly 408 can be illuminated with radiation (e.g., UV light) from a light source 452, for example, a laser. The light from the light source 452 can be manipulated by an optical element 454, such as a lens, positioned between the light source 452 and the support plate 406, to, for example, focus. The frame 420 has an opening 421 to allow radiation from the light source 452 to reach the support plate 406. The substrate holder 432 holds the target substrate 430 on which individual components are transferred by the laser-assisted transfer process.

[0102] In some examples, such as when the support mounting fixture 400 is configured to hold individual component assemblies against the support plate 406 by applying suction, the component transfer system 450 may include a suction source 434 (not shown) fluidly connected (e.g., by piping) to one or more air passages (not shown) in the support plate 406 or frame 420.

[0103] Figure 5 shows an example of a component transfer system 550 having a light source 552 and an optical element 554. The component transfer system 550 includes a support mounting fixture 500 including a frame 520. No support plate is mounted on the frame 520. An individual component assembly 508 is held on the frame 520, and the individual component assembly 508 includes a dynamic release tape 510 mounted on a wafer ring 522. In this configuration, the wafer ring 522 of the individual component assembly 508 is positioned on the frame 520, and the dynamic release tape 510 is an unsupported tape during the laser-assisted transfer process (i.e., a tape not supported by a high-rigidity substrate or support plate). The individual component 102 is transferred onto a target substrate 530 held by a substrate holder 532.

[0104] In some examples, the component transfer systems 450, 550 can be configured to transfer a plurality of individual components in parallel, or they can be configured to have a single-component transfer mode and a multiple-component transfer mode, as described in more detail in WO2018 / 231344, filed on April 25, 2018, the contents of which are incorporated herein by reference in their entirety.

[0105] As can be seen with reference to Figure 6, in some examples, the individual components 602 can be transferred to the dynamic release tape 610 after the dicing process. For example, a standard wafer processing technique is used for wafer dicing, in which a wafer 630 containing one or more electronic components (e.g., integrated circuits) is bonded (650) to a dicing tape 632 and diced (652) to form the individual components 602. For example, the dicing tape 632 can be mounted on a wafer ring. In some examples, the dicing process may include, for example, unfolding the dicing tape 632 on a wafer ring to stretch the dicing tape laterally and separate the individual components 602.

[0106] The individual components 602 are transferred onto the dynamic release tape 610 (654), the dicing tape 632 is removed (656), and the individual components 602 adhered to the dynamic release tape 610 remain. For example, the individual components 602 can be adhered to the component adhesive layer (described later) of the dynamic release tape 610. The dynamic release tape 610 with the adhered individual components 602 is attached to the transparent, high-rigidity support plate 606 of the component transfer system for laser-assisted transfer of the individual components 602 onto a target substrate (658). For example, the flexible support layer of the dynamic release tape 610 is attached to the support plate, for example, by suction, tensile stress, or by another method.

[0107] As can be seen with reference to Figure 7, in some examples, individual components 702 can be diced directly on the dynamic release tape 710. A wafer 730 containing one or more semiconductor dies (e.g., integrated circuits) is bonded to the dynamic release tape 710 (750), for example, to the component bonding layer of the dynamic release tape 710. The bonded wafer 730 is then diced (752) to form individual components 702, for example, by using standard wafer processing techniques for wafer dicing. For example, the dynamic release tape 710 can be mounted on a wafer ring. In some examples, the dynamic release tape 710 is stretchable, and the dicing process may include, for example, unfolding the dynamic release tape on a wafer ring to stretch the dynamic release tape 710 laterally and separate the individual components 702.

[0108] A dynamic release tape 710 having bonded individual components 702 is mounted on a transparent, rigid support plate 706 of a component transfer system for laser-assisted transfer of the individual components 702 onto a target substrate (754). For example, the flexible support layer of the dynamic release tape 710 is attached to the support plate by, for example, suction, tensile stress, or by another method.

[0109] In the process shown in Figure 7, the step of transferring the diced individual components 702 from the dicing tape to the dynamic release layer tape is omitted, thus streamlining and improving the efficiency of the process shown in Figure 7.

[0110] As can be seen by referring to Figures 8A to 8C, the dynamic release layer tapes 800, 820, and 840 can be multilayer tapes having a flexible support layer 812 and multilayer dynamic release structures 814, 834, and 854 disposed on the flexible support layer 812, respectively. Individual components 802 can be bonded to the dynamic release structures 814, 834, and 854 by component adhesive layers 808 that form part of each multilayer dynamic release structure 814, 834, and 854. The multilayer dynamic release structures 814, 834, and 854 can be formed by changing the number of layers having various compositions and functions. As shown in Figures 8A to 8C, the dynamic release layer tapes 800, 820, and 840 can be placed on a highly rigid support such as a support plate 806 of a radiation-transmitting component transfer system used in a laser-assisted transfer process. In some examples, the dynamic release layer tapes 800, 820, and 840 can be used in other environments, such as by being mounted on a wafer ring or used in other ways.

[0111] The flexible support layer 812 is a thin, flexible film that transmits radiation used in the laser-assisted transfer process, such as UV light. For example, the flexible support layer 812 can be a polymer film such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or poly(methyl methacrylate) (PMMA). The flexible support layer 812 is thin and flexible enough to allow the dynamic release layer tapes 800, 820, and 840 to be manipulated, for example, by rolling, bending, or stretching, without cutting the tape. The presence of the flexible support layer 812 allows the dynamic release layer tapes 800, 820, and 840 to be unsupported tapes with sufficient mechanical integrity to be handled, for example, without being attached to a high-rigidity substrate.

[0112] As can be seen particularly in Figure 8A, in some examples, the dynamic release structure 814 of the dynamic release layer tape 800 can be a three-layer structure having an absorbent adhesive layer 804 disposed on a flexible support layer 812 and an active layer 805, such as a foamed layer (shown in Figure 8A), disposed on the absorbent adhesive layer 804. The constituent adhesive layer 808 is disposed on the active layer 805.

[0113] The absorbing adhesive layer 804 has two functions: bonding the active layer 805 to the flexible support layer 812 and absorbing energy from irradiation during the laser-assisted transfer process. For example, the absorbing adhesive layer 804 absorbs at least 90%, at least 95%, at least 98%, or at least 99% of the energy incident on it, thereby preventing, for example, radiation from reaching individual components bonded to the tape 800 and potentially damaging those components.

[0114] Energy absorption by the absorbent adhesive layer 804 causes the layer to sinter, generating gas. The generated gas induces a mechanical reaction in the adjacent active layer 805. For example, as shown in Figure 8A, the active layer 805 can be a foamed layer in which a blister is formed in response to the gas generation (for example, as shown in Figure 1B).

[0115] As can be seen by referring to Figure 8B, in some examples, the dynamic release structure 834 of the dynamic release layer tape 820 can be a three-layer structure having an adhesive layer 824 disposed on the flexible support layer 812 and an active layer 826, such as an absorbent foam layer (as shown in Figure 8B), disposed on the adhesive layer 824. The component adhesive layer 808 is disposed on the active layer 826.

[0116] The adhesive layer 824 exhibits sufficient adhesion to bond the active layer 826 to the flexible support layer 812. In the example of Figure 8B, the active layer 826 is an absorption foam layer. The active layer 826 absorbs energy from irradiation during the laser-assisted transfer process, generating gases that induce mechanical reactions such as blister formation in the active layer 826. For example, the active layer 826 can absorb at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy.

[0117] As can be seen with reference to Figure 8C, in some examples, the dynamic release structure 854 of the dynamic release layer tape 840 can be a four-layer structure having an adhesive layer 844 disposed on the flexible support layer 812 and an active layer structure 846 disposed on the adhesive layer 844. The constituent adhesive layer 808 is disposed on the active layer structure 846.

[0118] The adhesive layer 844 exhibits sufficient adhesion to bond the active layer structure 846 to the flexible support layer 812. The active layer structure 846 comprises two layers, namely an absorption layer 848 and a foaming layer 850. The absorption layer 848 absorbs energy from irradiation during the laser-assisted transfer process, generating gas. For example, the absorption layer 848 can absorb at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy. The generation of gas induces mechanical reactions in the foaming layer 850, such as blister formation.

[0119] Dynamically delaminate structures (e.g., dynamically delaminate structures 814, 834, 854) have multiple functions, such as adhesion to a flexible support layer, internal adhesion between layers, absorption of incident radiation, and mechanical reactions (e.g., foaming). The multilayer nature of the dynamically delaminate structures 814, 834, 854 allows each layer to be designed to specifically achieve one or more of these functions.

[0120] In the example shown in Figure 8A, the absorbing adhesive layer 804 can be designed to adhere to the support layer 812, absorb incident radiation, and generate enough gas to form a blister on the active layer 805. In some examples, the absorbing adhesive layer 804 can be designed to adhere to the active layer 805 by sufficient adhesion to promote internal adhesion, for example, to at least partially avoid delamination of the blister. Delamination of the blister may result in large-diameter blisters that can affect the transfer of individual components in the vicinity, such as individual components that are not intended for transfer. In the design of the absorbing adhesive layer 804, the optical and adhesive properties of the layer can be of paramount importance, while the mechanical properties of the layer, such as its strength or modulus, can be secondary. In contrast, the thickness and composition of the active layer 805 can be designed with mechanical properties as the primary consideration, for example, to achieve a desired foaming reaction, while the optical and adhesive properties of the layer can be secondary. In some examples, the active layer 805 can be designed to enable the formation of a blister of a target size, to have mechanical properties that do not cause the blister to rupture, and to prevent gas generated by the absorption adhesive layer 804 from escaping from the dynamic release structure 814. For example, the target size of the blister can be a height-to-diameter ratio of about 1 and a base diameter of about 3 times or less the diameter of the irradiation beam (e.g., a laser beam). In certain examples, the active layer 805 can be a polymer film with a thickness between about 2 μm and about 5 μm, for example, a PET or polyimide film.

[0121] Furthermore, in the dynamic peel structure 814 of Figure 8A, the active layer 805 itself does not absorb energy and is therefore not partially cauterized. Instead, cauterization occurs in the adjacent absorbing adhesive layer 804. Since cauterization does not occur in the active layer 805, the thickness of the active layer 805 is not affected by the amount of laser energy delivered to the blister location; in other words, the active layer 805 is not thinned by irradiation. Separating cauterization and blister formation into two different layers in this way allows for the formation of larger blisters using higher pulse energies.

[0122] In some cases, such as when transferring individual components 802 from a dicing tape or other source substrate (as shown in Figure 6) to a dynamic release layer tape, or when forming individual components 802 by directly dicing a wafer on the dynamic release layer tape, the component adhesive layer 808 can be designed to have an adhesive strength greater than the force holding the individual component 802 to its source substrate. In some cases, relatively low adhesion between the component adhesive layer 808 and the individual component 802 can contribute to increased accuracy during the laser-assisted transfer process. The component adhesive layer 808 can be designed to have the lowest possible adhesive strength, while still being strong enough to keep the individual component adhered to the dynamic release layer tape before the laser-assisted transfer process. In some cases, to satisfy these conflicting criteria of having both high and low adhesive strength, the component adhesive layer 808 can be designed to have an adhesive strength that can be modified by applying stimuli such as UV light or heat. Strong initial adhesion of the component adhesive layer 808 can facilitate the reliable transfer of the individual component 802 from its source substrate to the dynamic release layer tape. The initial adhesion of the component adhesive layer 808 can also support the wafer during the dicing process and form individual components. Before the laser-assisted transfer process, stimulation can be applied to reduce the adhesion between the component adhesive layer 808 and the individual components 802 to a level that can contribute to the accuracy of component placement during transfer.

[0123] As can be seen by referring to Figures 9A to 9C, in some examples, the multilayer dynamic peel structures 914, 934, and 954 can be attached to a high-rigidity carrier substrate 910, such as a glass carrier substrate. Individual components 902 can be bonded to the high-rigidity carrier substrate 910 by the dynamic peel structures 914, 934, and 954 to form individual component assemblies 900, 920, and 940. Individual components 902 can be directly transferred from the high-rigidity carrier substrate 910 to a target substrate by a laser-assisted transfer process.

[0124] The dynamic release structure can be provided as an unsupported tape, and can be attached to the carrier substrate 910 as a tape, for example, by roll coating or other tape application methods. In some examples, the dynamic release structure can be spin-coated onto the carrier substrate. Attaching the tape-form dynamic release structure to the carrier substrate may offer advantages over spin coating, such as reduced cost, reduced processing effort, and more efficient attachment.

[0125] The dynamic peel structures 914, 934, and 954, which are provided in tape form for attachment to the high-rigidity carrier substrate 910, can have a multilayer structure as described above with reference to Figures 8A to 8C.

[0126] As can be seen particularly in Figure 9A, in some examples the dynamic peel structure 914 can be a three-layer structure having an absorbent adhesive layer 904 that adheres to a high-rigidity carrier substrate 910. An active layer 906, such as a foamed layer (as shown in Figure 9A), is disposed on the absorbent adhesive layer 904. A constituent adhesive layer 908 is disposed on the active layer 906.

[0127] The absorbing adhesive layer 904 has two functions: bonding the active layer 906 to the high-rigidity carrier substrate 910 and absorbing energy from irradiation during the laser-assisted transfer process. When energy is absorbed by the absorbing adhesive layer 904, the layer is cauterized and gas is generated. The generated gas induces a mechanical reaction in the adjacent active layer 906. For example, as shown in Figure 9A, the active layer 906 can be a foamed layer in which blisters are formed in response to gas generation, transferring individual components 902.

[0128] As can be seen with reference to Figure 9B, in some examples, the dynamic peel structure 934 can be a three-layer structure having an adhesive layer 924 that adheres to a high-rigidity carrier substrate 910, and an active layer 926, such as an absorbing foam layer (as shown in Figure 9B), disposed on the adhesive layer 924. The constituent adhesive layer 908 is disposed on the active layer 926. The adhesive layer 924 exhibits sufficient adhesion to the carrier substrate 910. In the example of Figure 9B, the active layer 926 is an absorbing foam layer that absorbs energy from irradiation during the laser-assisted transfer process and generates a gas that induces mechanical reactions such as blister formation in the active layer 926.

[0129] As can be seen with reference to Figure 9C, in some examples, the dynamic peel structure 954 can be a four-layer structure having an adhesive layer 944 that adheres to the high-rigidity carrier substrate 910 and an active layer structure 946 disposed on the adhesive layer 944. The constituent adhesive layer 908 is disposed on the active layer structure 946. The active layer structure 946 has two layers, namely an absorption layer 948 and a foaming layer 950. The absorption layer 948 absorbs energy from irradiation during the laser-assisted transfer process and generates gas. The generation of gas induces mechanical reactions in the foaming layer 950, such as the formation of blisters.

[0130] Each layer of the multilayer dynamic delamination structure can be designed to achieve the desired functions described above with respect to Figures 8A to 8C. For example, the adhesive layers 904, 924, and 954 that adhere to the carrier substrate 910 can have adhesion to the carrier substrate that is low enough to allow for easy removal, and can be designed to facilitate the modification of the carrier substrate after the completion of the laser transfer process.

[0131] Several embodiments have been described. However, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, some of the steps described above are independent of order and can therefore be carried out in an order different from that described above.

[0132] Other implementation forms are also within the scope of the following claims.

[0133] [1] A step of placing an individual component assembly on a support mounting fixture of a component transfer system, wherein the individual component assembly is Dynamic release tape, Flexible support layer, A dynamic release tape comprising a dynamic release structure disposed on the flexible support layer, The process includes a step and an individual component adhered to the dynamic release tape, The step includes irradiating the dynamic peel structure so as to peel off the individual components from the dynamic peel tape, A method wherein at least a portion of the flexible support layer is unsupported when the individual component assembly is placed on the support mounting fixture. [2] The method according to [1], wherein the step of arranging the individual component assembly on the support mounting fixture includes the step of mounting the wafer ring of the individual component assembly onto the frame of the support mounting fixture. [3] The method according to [1] or [2], comprising the step of adhering the individual components to the dynamic release tape. [4] The method according to [3], wherein the step of adhering the individual components to the dynamic release tape includes the step of adhering the individual components to the component adhesive layer of the dynamic release structure. [5] The method according to [3] or [4], wherein the step of adhering the individual components to the dynamic release tape includes the step of transferring the individual components from the dicing tape to the dynamic release tape. [6] The method according to [1] or [2], comprising the step of adhering a wafer to the dynamic release tape. [7] The method according to [6], wherein the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the adhesive layer of the component of the dynamic release structure. [8] The method according to [6] or [7], comprising the step of dicing the bonded wafer to form individual components. [9] The method according to [8], wherein the step of arranging the individual component assembly on a transparent support plate includes the step of attaching the dynamic release tape comprising the individual component to the support plate of the support fixture.

[10] The method according to [8] or [9], wherein the step of placing the individual component assembly on a support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[11] The method according to any one of [1] to

[10] , wherein the step of irradiating the dynamic peel structure includes irradiating the dynamic peel structure with light from a light source of the component transfer system.

[12] A step of placing an individual component assembly on a support mounting fixture of a component transfer system, wherein the individual component assembly is Dynamic release tape, Flexible support layer, A dynamic release tape comprising a dynamic release structure disposed on the flexible support layer, The individual components are attached to the dynamic release tape, The step of placing the individual component assembly onto the support mounting fixture includes the step of directly placing the flexible support layer of the dynamic release tape onto the support plate of the support mounting fixture, A method comprising the step of irradiating the dynamic peel structure so as to peel off the individual components from the dynamic peel tape.

[13] The method according to

[12] , wherein the step of arranging the individual component assembly on the support mounting fixture includes the step of mounting the wafer ring of the individual component assembly onto the frame of the support mounting fixture.

[14] The method according to

[12] or

[13] , comprising the step of irradiating the dynamic peel structure through the support plate so that the individual components are peeled off from the dynamic peel tape.

[15] The method of

[14] , comprising the step of determining the orientation of the component transfer system such that the individual components are positioned between the support plate and the target substrate.

[16] The method according to any one of

[12] to

[15] , wherein the step of placing the individual component assembly on a support plate is further the step of placing the individual component assembly on a high-rigidity support plate.

[17] The method according to any one of

[12] to

[16] , wherein the step of arranging the individual component assembly on the support fixture includes the step of attaching the flexible support layer directly to the support plate.

[18] The method according to any one of

[12] to

[17] , wherein the step of placing the individual component assembly on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[19] The method according to any one of

[12] to

[18] , wherein the step of arranging the individual component assembly on the support plate includes the step of stretching the dynamic release tape over the entire support plate.

[20] The method according to any one of

[12] to

[19] , comprising the step of adhering the individual components to the dynamic release tape.

[21] The method according to

[20] , wherein the step of adhering the individual components to the dynamic release tape includes the step of adhering the individual components to the component adhesive layer of the dynamic release structure.

[22] The method according to

[20] or

[21] , wherein the step of adhering the individual components to the dynamic release tape includes the step of transferring the individual components from the dicing tape to the dynamic release tape.

[23] The method according to any one of

[12] to

[19] , comprising the step of adhering a wafer to the dynamic release tape.

[24] The method according to

[23] , wherein the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the adhesive layer of the component of the dynamic release structure.

[25] The method according to

[23] or

[24] , comprising the step of dicing the bonded wafer to form individual components.

[26] The method of

[25] , wherein the step of arranging the individual component assembly on a transparent support plate includes the step of attaching the dynamic release tape comprising the individual component to the support plate of the support mounting fixture.

[27] The method according to

[25] or

[26] , wherein the step of placing the individual component assembly on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[28] The method according to any one of

[12] to

[27] , wherein the step of irradiating the dynamic peel structure includes irradiating the dynamic peel structure with light from a light source of the component transfer system.

[29] Individual component transcription system, Light source and A mounting fixture for supporting individual components, Support frame and A support mounting fixture for individual components comprising a support plate disposed on the support frame, which transmits light emitted by the light source, A system comprising an optical element disposed between the light source and the support frame.

[30] A suction source is provided which is configured to apply suction to the air passage of the individual component support mounting fixture to hold the flexible support layer of the individual component assembly relative to the support plate, wherein the individual component assembly A dynamic release tape comprising the flexible support layer and a dynamic release structure disposed on the flexible support layer, The system according to

[29] , further comprising individual components adhered to the dynamic release tape.

[31] comprising an individual component assembly, the individual component assembly is A dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, The system comprises individual components adhered to the aforementioned dynamic release tape, The system according to

[29] or

[30] , wherein the flexible support layer of the dynamic release tape is placed directly on the support plate and held in place by suction through the air passage of the individual component support mounting fixture.

[32] The system according to

[30] or

[31] , wherein the air passage is formed to penetrate the thickness of the support frame.

[33] The system according to any one of

[30] to

[32] , wherein the air passage is formed to penetrate the thickness of the support plate.

[34] The system according to any one of

[29] to

[33] , wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into the dynamic release tape held on the individual component support mounting fixture.

[35] The system according to any one of

[29] to

[34] , wherein the support plate comprises a glass plate.

[36] The system according to any one of

[29] to

[34] , wherein the support plate comprises a quartz plate.

[37] The system according to any one of

[29] to

[36] , wherein the support plate has high rigidity.

[38] The system according to any one of

[29] to

[37] , wherein the optical element comprises a lens.

[39] Individual component transcription system, Light source and Individual component support and mounting fixture, An individual component assembly disposed on the individual component support mounting fixture, A dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, The system comprises individual components adhered to the aforementioned dynamic release tape, The individual component assembly, wherein the dynamic release tape is in an unsupported state when the individual component assembly is placed on the individual component support mounting fixture, A system comprising an optical element disposed between the light source and the individual component assembly.

[40] The system according to

[39] , wherein the individual component assembly comprises a wafer ring disposed on the individual component support mounting fixture.

[41] The step of dicing a wafer attached to a dicing tape to form individual components, Flexible support layer, A dynamic peeling structure disposed on the flexible support layer and The steps include transferring the individual components from the dicing tape to the dynamic release tape so as to form an assembly of individual components comprising, A method comprising the step of directly placing the flexible support layer of the individual component assembly onto a support plate of a component transfer system.

[42] The method according to

[41] , wherein the step of transferring the individual components to the dynamic release tape includes the step of adhering the individual components to the component adhesive layer of the dynamic release structure.

[43] The method according to

[41] or

[42] , wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.

[44] The method according to

[43] , wherein the dynamic release structure comprises an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[45] The method according to any one of

[41] to

[44] , wherein the step of directly placing the flexible support layer on the support plate includes the step of directly attaching the flexible support layer to the support plate.

[46] The method according to any one of

[41] to

[45] , wherein the step of directly placing the flexible support layer on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[47] The method according to any one of

[41] to

[46] , wherein the step of directly placing the flexible support layer on the support plate includes the step of stretching the dynamic release tape over the entire support plate.

[48] ​​The method according to any one of

[41] to

[47] , comprising the step of irradiating the dynamic peel structure of the individual component assembly through the support plate so as to peel the individual component from the dynamic peel tape.

[49] The step of dicing a wafer attached to a dicing tape to form individual components, Flexible support layer, A dynamic peeling structure disposed on the flexible support layer and The steps include transferring the individual components from the dicing tape to the dynamic release tape so as to form an assembly of individual components comprising, A method comprising the steps of: positioning the individual component assembly within a component transfer system such that at least a portion of the dynamic release tape is in an unsupported state.

[50] The method according to

[49] , comprising the step of irradiating the unsupported dynamic release tape to peel off the individual components from the dynamic release tape.

[51] The method according to

[49] or

[50] , wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.

[52] The method according to

[51] , wherein the dynamic release structure comprises an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[53] wafers, A flexible support layer in an unsupported state, The steps include adhering to a dynamic release tape comprising a dynamic release structure disposed on the flexible support layer, A method comprising the steps of dicing the bonded wafer to form individual components bonded to the dynamic release tape.

[54] The method according to

[53] , wherein the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the adhesive layer of the component of the dynamic release structure.

[55] The method according to

[53] or

[54] , wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.

[56] The method according to

[55] , wherein the dynamic release structure comprises an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[57] wafers, Flexible support layer, The steps include adhering to a dynamic release tape comprising a dynamic release structure disposed on the flexible support layer, A step of dicing the bonded wafer to form individual components bonded to the dynamic release tape, wherein the individual components bonded to the dynamic release tape comprise an individual component assembly. A method comprising the step of directly placing the flexible support layer of the individual component assembly onto a support plate of a component transfer system.

[58] The method according to

[57] , wherein the step of directly arranging the flexible support layer on the support plate includes the step of directly attaching the flexible support layer of the dynamic release tape to the support plate.

[59] The method according to

[57] or

[58] , wherein the step of directly placing the flexible support layer on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[60] The method according to any one of

[57] to

[59] , wherein the step of placing the flexible support layer on the support plate includes the step of stretching the dynamic release tape over the entire support plate.

[61] The method of any one of

[57] to

[60] , comprising the step of irradiating the dynamic peel structure of the individual component assembly through the support plate so as to peel the individual component from the dynamic peel tape.

[62] The method according to any one of

[57] to

[61] , wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.

[63] The method according to

[62] , wherein the dynamic release structure comprises an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the constituent adhesive layer.

[64] wafers, Flexible support layer, The steps include adhering to a dynamic release tape comprising a dynamic release structure disposed on the flexible support layer, A step of dicing the bonded wafer to form individual components bonded to the dynamic release tape, wherein the individual components bonded to the dynamic release tape comprise an individual component assembly. A method comprising the steps of arranging the individual component assembly within a component transfer system such that at least a portion of the dynamic release tape is in an unsupported state.

[65] The method according to

[64] , comprising the step of irradiating the unsupported dynamic release tape to peel off the individual components from the dynamic release tape.

[66] The method according to

[64] or

[65] , wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.

[67] The method according to

[66] , wherein the dynamic release structure comprises an active layer structure and a constituent adhesive layer, and the step of bonding the wafer to the dynamic release tape comprises the step of bonding the wafer to the constituent adhesive layer.

[68] A dynamic release tape is provided, and the dynamic release tape is Flexible support layer, An apparatus comprising a dynamic peeling structure disposed on the flexible support layer.

[69] The apparatus according to

[68] , wherein the dynamic release tape has sufficient rigidity to allow individual components to be laser transferred from the dynamic release tape.

[70] The apparatus according to

[68] or

[69] , wherein the dynamic release tape has sufficient rigidity to maintain a substantially planar configuration when laser transfer of individual components from the dynamic release tape.

[71] The apparatus according to

[68] , wherein the flexible support layer comprises a polymer.

[72] The apparatus according to any one of

[68] to

[71] , wherein the dynamic peel structure comprises a plurality of layers.

[73] The dynamic peel structure is An absorbent adhesive layer disposed on the flexible support layer, wherein the absorbent adhesive layer is configured to adhere to the flexible support layer and generate gas in response to light irradiation, The apparatus according to

[72] , comprising an active layer disposed on the absorbent adhesive layer.

[74] The apparatus according to

[73] , wherein the active layer comprises a foamed layer configured to react mechanically to the gas generated by the absorbent adhesive layer.

[75] The dynamic peel structure is An adhesive layer disposed on the flexible support layer, configured to adhere to the flexible support layer, The apparatus according to any one of

[72] to

[74] , comprising an active layer structure disposed on the adhesive layer.

[76] The apparatus according to

[75] , wherein the active layer structure comprises an absorbing foam layer, the absorbing foam layer is configured to generate a gas in response to irradiation with light and to react mechanically to the gas generation.

[77] The active layer structure is An absorption layer disposed on the adhesive layer, configured to generate gas in response to light irradiation, The apparatus according to

[75] , further comprising a foamed layer configured to mechanically react to the generation of the gas by the absorption layer.

[78] The apparatus according to any one of the claims

[72] to

[77] , wherein one of the layers of the dynamic peel structure comprises a constituent adhesive layer.

[79] The apparatus according to any one of

[72] to

[77] , wherein the adhesion of the constituent adhesive layers is responsive to the application of a stimulus.

[80] The apparatus according to any one of

[68] to

[79] , wherein the tape is stretchable.

[81] The apparatus according to any one of

[68] to

[80] , wherein the flexible support layer transmits ultraviolet light.

[82] The apparatus according to any one of

[68] to

[81] , comprising individual components bonded to the dynamic peel structure.

[83] The apparatus according to

[82] , wherein the individual components are light-emitting diodes (LEDs).

[84] A method comprising the step of forming a dynamic release structure on a flexible support layer to form a dynamic release tape.

[85] The method according to

[84] , wherein the step of forming the dynamic peel structure includes the step of forming a plurality of layers on the flexible support layer.

[86] The step of forming the dynamic peel structure is A step of forming an absorbent adhesive layer on the flexible support layer, wherein the absorbent adhesive layer is configured to adhere to the flexible support layer and generate gas in response to irradiation with light, The method according to

[85] , comprising the step of forming an active layer on the absorbent adhesive layer.

[87] The method according to

[86] , wherein the active layer comprises a foamed layer configured to mechanically react to the generation of the gas by the absorbent adhesive layer.

[88] The step of forming the dynamic peel structure is A step of forming an adhesive layer on the flexible support layer, wherein the adhesive layer is configured to adhere to the flexible support layer, The method according to

[85] , comprising the step of forming an active layer structure on the adhesive layer.

[89] The method according to

[88] , wherein the active layer structure comprises an absorbing foam layer, the absorbing foam layer is configured to generate a gas in response to irradiation with light and to react mechanically to the gas generation.

[90] The step of forming the active layer structure is A step of forming an absorbent layer on an adhesive layer, wherein the absorbent layer is configured to generate gas in response to light irradiation, The method according to

[85] , comprising the step of forming a foamed layer on the absorbent layer, wherein the foamed layer is configured to mechanically react to the gas generated by the absorbent layer.

[91] A dynamic peeling device, Flexible support layer, The system comprises a dynamic peel structure disposed on the flexible support layer, and the dynamic peel structure is An adhesive layer disposed on the flexible support layer, configured to adhere to the flexible support layer, A dynamic peeling device comprising an active layer structure disposed on the adhesive layer.

[92] The apparatus according to

[91] , wherein the active layer structure comprises an absorbing foam layer, the absorbing foam layer is configured to generate a gas in response to irradiation with light and to react mechanically to the gas generation.

[93] The active layer structure is An absorption layer disposed on the adhesive layer, configured to generate gas in response to light irradiation, The apparatus according to

[91] , further comprising a foamed layer configured to mechanically react to the generation of the gas by the absorption layer.

[94] The apparatus according to any one of

[91] to

[93] , wherein the dynamic peel structure comprises a constituent adhesive layer.

[95] A step of arranging an individual component assembly on a support mounting fixture of a component transfer system, wherein the individual component assembly is Dynamic release tape, Flexible support layer, A dynamic release tape including a dynamic release structure disposed on the flexible support layer, The steps include: an individual component adhered to the dynamic release tape; A method comprising the step of irradiating the dynamic peel structure so as to peel off the individual components from the dynamic peel tape.

[96] Individual component transcription system, Light source and Individual component support and mounting fixture, An individual component assembly disposed on the individual component support mounting fixture, A dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, A component assembly comprising individual components adhered to the dynamic release tape, A component transfer system comprising an optical element disposed between the light source and the individual component assembly.

[97] The steps of dicing a wafer attached to a dicing tape to form individual components, Flexible support layer, A dynamic peeling structure disposed on the flexible support layer and A method comprising the step of transferring the individual components from the dicing tape to a dynamic release tape so as to form an assembly of individual components including the following.

[98] wafers, Flexible support layer, The steps include adhering to a dynamic release tape comprising a dynamic release structure disposed on the flexible support layer, A method comprising the steps of dicing the bonded wafer to form individual components bonded to the dynamic release tape. [Explanation of Symbols]

[0134] 100 Support mounting hardware 102 Individual Components 106 High rigidity support plate 108 Individual component assemblies 110 Dynamic release tape 112 Flexible support layer 114 Dynamic Delamination Structure 116 Radiation 118 Blister 130 Target substrate 150 Support mounting hardware 170 frames 200 Support and mounting hardware 206 Support plate 207 Top surface 208 Individual component assemblies 210 Dynamic Release Tape 212 Flexible support layer 214 Multilayer Dynamic Delamination Structure 220 frames 221 Opening 222 Wafer Ring 223 Top surface 224a, 224b sublayer 226 Component adhesive layer 228 Airflow channel 300 Support mounting hardware 306 Support plate 307 Top surface 320 frames 321 Opening 400 Support mounting hardware 406 Support plate 408 Individual component assemblies 410 Dynamic Release Tape 420 frames 421 Opening 422 Wafer Ring 430 Target substrate 432 PCB holder 434 Suction source 450 Component Transfer System 452 Light source 454 optical elements 500 Support mounting hardware 508 Individual component assemblies 510 Dynamic Release Tape 520 frames 522 Wafer Ring 530 Target substrate 532 PCB holder 550 Component Transfer System 552 Light source 554 Optical elements 602 Individual Components 606 High rigidity support plate 610 Dynamic Release Tape 630 wafers 632 Dicing Tape 702 Individual Components 706 High rigidity support plate 710 Dynamic Release Tape 730 wafers 800, 820, 840 Dynamic Release Layer Tape 802 Individual Components 804 Absorbent adhesive layer 805 Active layer 808 Component adhesive layer 812 Flexible support layer 814, 834, 854 Multilayer Dynamic Delamination Structure 824 Adhesive layer 826 Active layer 844 Adhesive layer 846 Active layer structure 848 Absorption layer 850 foam layer 900, 920, 940 Individual component assemblies 902 Individual Components 904 Absorbent adhesive layer 906 Active layer 908 Component adhesive layer 910 High-rigidity carrier substrate 914, 934, 954 Multilayer Dynamic Delamination Structure 924 Adhesive layer 926 Active layer 946 Active layer structure 948 Absorption layer 950 foam layer

Claims

1. The invention provides a dynamic release tape, wherein the dynamic release tape comprises (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer. The aforementioned dynamic peeling structure is An absorption layer configured to generate gas in response to light irradiation, A foamed layer, different from the absorbent layer, is disposed on the absorbent layer and is configured to mechanically react to the gas generated by the absorbent layer. A device equipped with the following features.

2. The apparatus according to claim 1, wherein the dynamic release tape has sufficient rigidity to allow individual components to be laser-transferred from the dynamic release tape.

3. The apparatus according to claim 1, wherein the dynamic release tape has sufficient rigidity to maintain a substantially planar configuration when laser-transferring individual components from the dynamic release tape.

4. The apparatus according to claim 1, wherein the flexible support layer comprises a polymer.

5. The apparatus according to claim 1, wherein the dynamic peel structure includes a plurality of layers.

6. The apparatus according to claim 1, wherein the absorbent layer is an absorbent adhesive layer disposed on the flexible support layer, and is further configured to adhere to the flexible support layer.

7. The apparatus according to claim 1, wherein the dynamic peel structure comprises (a) an adhesive layer disposed on the flexible support layer, configured to adhere to the flexible support layer, and (b) an active layer structure disposed on the adhesive layer.

8. The apparatus according to claim 7, wherein the active layer structure comprises (a) the absorbent layer disposed on the adhesive layer and (b) the foamed layer.

9. Steps to form a dynamic release tape by forming a dynamic release structure on a flexible support layer. Includes, The step of forming the dynamic peel structure is, The steps include forming an absorption layer configured to generate gas in response to light irradiation, A step of forming a foamed layer on the absorbent layer, wherein the foamed layer is configured to mechanically react to the gas generated by the absorbent layer. Methods that include...

10. The method according to claim 9, wherein the step of forming the dynamic peel structure includes the step of forming a plurality of layers on the flexible support layer.

11. The method according to claim 9, wherein the step of forming the absorbent layer is the step of forming an absorbent adhesive layer on the flexible support layer, wherein the absorbent adhesive layer is further configured to adhere to the flexible support layer.

12. The step of forming the dynamic peel structure is, A step of forming an adhesive layer on the flexible support layer, wherein the adhesive layer is configured to adhere to the flexible support layer, The steps include forming an active layer structure on the adhesive layer and The method according to claim 9, including the method described in claim 9.

13. The step of forming the aforementioned active layer structure is, The steps include forming the absorbent layer on the adhesive layer, The steps of forming the foamed layer on the absorbent layer and The method according to claim 12, including the method described in claim 12.

14. A dynamic peeling device, Flexible support layer, A dynamic release structure disposed on the flexible support layer, comprising: (a) an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and (b) an active layer structure disposed on the adhesive layer. Equipped with, The aforementioned active layer structure is An absorption layer disposed on the aforementioned adhesive layer, configured to generate gas in response to light irradiation, A foamed layer, different from the absorbent layer, is disposed on the absorbent layer and is configured to mechanically react to the gas generated by the absorbent layer. A dynamic peeling device equipped with the following features.

15. The dynamic peeling apparatus according to claim 14, wherein the dynamic peeling structure comprises a component adhesive layer.

16. The steps include providing individual components attached to a dicing tape, The steps include: transferring the individual components from the dicing tape to the dynamic release tape so as to form an individual component assembly including (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer; The steps include: directly placing the flexible support layer of the individual component assembly onto the support plate of the component transfer system; Methods that include...

17. The method according to claim 16, wherein the step of transferring the individual components to the dynamic release tape includes the step of adhering the individual components to the component adhesive layer of the dynamic release structure.

18. The method according to claim 16, wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.

19. The method according to claim 18, wherein the step of transferring the individual components from the dicing tape to the dynamic release tape includes the step of bonding the wafer to the component adhesive layer.

20. The method according to claim 16, wherein the step of directly placing the flexible support layer on the support plate includes the step of directly attaching the flexible support layer to the support plate.

21. The method according to claim 16, wherein the step of directly placing the flexible support layer on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

22. The method according to claim 16, wherein the step of directly placing the flexible support layer on the support plate includes the step of stretching the dynamic release tape over the entire support plate.

23. The method according to claim 16, further comprising the step of irradiating the dynamic peel structure of the individual component assembly through the support plate so as to peel the individual component from the dynamic peel tape.

24. The method according to claim 16, wherein the dynamically peelable tape is an unsupported tape.

25. The method according to claim 16, wherein the individual components are bonded to the dynamic peel structure, the dynamic peel structure includes an active layer, the dynamic peel structure is configured to generate a gas in response to irradiation with light, and the gas induces a mechanical reaction in the active layer.

26. A step of adhering a wafer to a dynamic release tape, wherein the dynamic release tape comprises (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer, A step of dicing the bonded wafer to form individual components bonded to the dynamic release tape, wherein the individual components bonded to the dynamic release tape form an individual component assembly. Includes, The aforementioned dynamic peeling structure is An absorption layer configured to generate gas in response to light irradiation, A foamed layer, different from the absorbent layer, is disposed on the absorbent layer and is configured to mechanically react to the gas generated by the absorbent layer. A method that includes [a certain feature].

27. ​​A step of adhering a wafer to a dynamic release tape, wherein the dynamic release tape comprises (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer, A step of dicing the bonded wafer to form individual components bonded to the dynamic release tape, wherein the individual components bonded to the dynamic release tape form an individual component assembly. Includes, A method further comprising the step of directly placing the flexible support layer of the dynamic release tape onto a support plate of a component transfer system.

28. The method according to claim 27, wherein the step of directly arranging the flexible support layer on the support plate includes the step of directly attaching the flexible support layer of the dynamic release tape to the support plate.

29. The method according to claim 27, wherein the step of directly placing the flexible support layer on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

30. The method according to claim 27, wherein the step of placing the flexible support layer on the support plate includes the step of stretching the dynamic release tape over the entire support plate.

31. The method according to claim 27, further comprising the step of irradiating the dynamic peel structure of the individual component assembly through the support plate so as to peel the individual component from the dynamic peel tape.

32. The method according to claim 27, wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.

33. The method according to claim 32, wherein the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to a component adhesive layer of the dynamic release structure, and the dynamic release structure comprises (a) the component adhesive layer and (b) an active layer structure.

34. A step of adhering a wafer to a dynamic release tape, wherein the dynamic release tape comprises (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer, A step of dicing the bonded wafer to form individual components bonded to the dynamic release tape, wherein the individual components bonded to the dynamic release tape form an individual component assembly. Includes, A method further comprising the step of positioning the individual component assembly within a component transfer system such that at least a portion of the dynamic release tape is in an unsupported state.

35. The method according to claim 34, further comprising the step of irradiating the unsupported tape so as to peel off the individual components from the dynamic release tape.

36. A step of adhering a wafer to a dynamic release tape, wherein the dynamic release tape comprises (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer, A step of dicing the bonded wafer to form individual components bonded to the dynamic release tape, wherein the individual components bonded to the dynamic release tape form an individual component assembly. Includes, The method wherein the dynamically peelable tape is a tape in an unsupported state.

37. The steps include providing individual components attached to a dicing tape, A step of forming an assembly of individual components by transferring the individual components from the dicing tape to a dynamic release tape, wherein the dynamic release tape is an unsupported tape, and the dynamic release tape includes (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer, the individual components are adhered to the dynamic release structure, and the dynamic release structure includes an absorption layer configured to generate gas in response to irradiation with light and an active layer different from the absorption layer, the gas inducing a mechanical reaction in the active layer, and Methods that include...

38. A step of adhering a wafer to a dynamic release tape, wherein the dynamic release tape is an unsupported tape, and the dynamic release tape includes (a) a flexible support layer, and (b) a dynamic release structure disposed on the flexible support layer, wherein the dynamic release structure includes an absorption layer configured to generate gas in response to irradiation with light, and an active layer different from the absorption layer, wherein the gas induces a mechanical reaction in the active layer, The steps include: dicing the bonded wafer to form individual components bonded to the dynamic release tape; Methods that include...

39. A step of placing an individual component assembly on an individual component support mounting fixture of an individual component transfer system, wherein the individual component transfer system is Light source and The individual component support mounting device comprises (a) a support frame and (b) a support plate disposed on the support frame, the support plate being transparent to light emitted by the light source, The system comprises an optical element disposed between the light source and the support frame, The individual component assembly comprises (a) a flexible support layer and a dynamic release tape including a dynamic release structure disposed on the flexible support layer, and (b) individual components adhered to the dynamic release tape, step, The steps include: irradiating the dynamic peel structure so as to peel the individual components from the dynamic peel tape; Methods that include...

40. The method according to claim 39, wherein at least a portion of the flexible support layer is unsupported when the individual component assembly is placed on the individual component support mounting fixture.

41. The method according to claim 39, wherein the step of placing the individual component assembly on the individual component support mounting fixture includes the step of directly placing the flexible support layer of the dynamic release tape on the support plate of the individual component support mounting fixture.

42. The method according to claim 39, wherein the step of placing the individual component assembly on the individual component support mounting fixture includes the step of mounting the wafer ring of the individual component assembly onto the support frame of the individual component support mounting fixture.

43. The method according to claim 39, further comprising the step of adhering the individual components to the dynamic release tape before arranging the individual components.

44. The method according to claim 39, further comprising the step of bonding the individual components to the component adhesive layer of the dynamic peel structure.

45. The method according to claim 39, further comprising the step of adhering a wafer containing the individual components to the dynamic release tape.

46. The method according to claim 45, wherein the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the adhesive layer of the component of the dynamic release structure.

47. The method according to claim 39, wherein the step of placing the individual component assembly on the individual component support mounting fixture includes the step of attaching the dynamic release tape containing the individual component to the support plate of the individual component support mounting fixture.

48. The method according to claim 47, wherein the step of placing the individual component assembly on the support plate includes the step of holding the individual component assembly on the support plate by applying suction.

49. The method according to claim 39, wherein the step of irradiating the dynamic peel structure includes irradiating the dynamic peel structure with light from the light source of the individual component transfer system.

50. The method according to claim 39, wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into the dynamic release tape held on the individual component support mounting fixture.

51. A system for transcribing individual components, Light source and A mounting fixture for individual components, comprising (a) a support frame, and (b) a support plate disposed on the support frame, the support plate being transparent to light emitted by the light source, An optical element disposed between the light source and the support frame. A system for transferring individual components, comprising:

52. The device further comprises a suction source configured to apply suction to the air passage of the individual component support mounting fixture to hold the flexible support layer of the individual component assembly relative to the support plate, The individual component transfer system according to claim 51, wherein the individual component assembly comprises (a) a dynamic release tape having a flexible support layer and a dynamic release structure disposed on the flexible support layer, and (b) an individual component adhered to the dynamic release tape.

53. The individual component transfer system according to claim 52, wherein the air passage is formed to penetrate the thickness of the support frame.

54. The individual component transfer system according to claim 52, wherein the air passage is formed to penetrate the thickness of the support plate.

55. An individual component assembly further comprises (a) (i) a flexible support layer and (ii) a dynamic release tape having a dynamic release structure disposed on the flexible support layer and (b) an individual component adhered to the dynamic release tape, The individual component transfer system according to claim 51, wherein the flexible support layer of the dynamic release tape is placed directly on the support plate and is held in a predetermined position by suction through the air passage of the individual component support mounting fixture.

56. The individual component transfer system according to claim 51, wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress to the dynamic release tape held on the individual component support mounting fixture.

57. A system for transcribing individual components, Light source and A mounting fixture for individual components, comprising (a) a support frame, and (b) a support plate disposed on the support frame, the support plate being transparent to light emitted by the light source, An individual component assembly disposed on the individual component support mounting fixture, comprising: (a) a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and (b) an individual component adhered to the dynamic release tape, wherein the dynamic release structure is configured such that the individual component is peeled off from the dynamic release tape in response to irradiation of the dynamic release structure by the light source; An optical element disposed between the light source and the support frame. A system for transferring individual components, comprising:

58. The individual component transfer system according to claim 57, wherein the dynamic release tape becomes unsupported when the individual component assembly is placed on the individual component support mounting fixture.

59. The individual component transfer system according to claim 57, wherein the individual component assembly comprises a wafer ring disposed on the individual component support mounting fixture.

60. The individual component transfer system according to claim 57, wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into the dynamic release tape held on the individual component support mounting fixture.

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