Metallized film manufacturing equipment, metallized film, and film capacitor

Abstract

This metallized film manufacturing device comprises: a supply unit that supplies a dielectric film in a lengthwise direction; a printing roll that has a rotational axis in the width direction of the dielectric film, and that prints an insulation pattern on a surface of the dielectric film; and a deposition unit that forms a metal deposition electrode at positions, except where the insulation pattern is, on the surface of the dielectric film. The printing roll has protrusions that are formed axially extending on the outer circumferential surface of the printing roll, and that correspond to the insulation pattern. A reinforcing part is formed at one end of each protrusion in the axial direction of the protrusion.

Description

Technical Field

[0001] The present invention relates to a metallized film manufacturing apparatus, a metallized film, and a film capacitor.

Background Art

[0002] A film capacitor formed by laminating or winding a dielectric film having a vapor-deposited electrode formed on its surface is known. For example, Patent Document 1 describes a metallized film capacitor in which a first vapor-deposited electrode is disposed on one side of a dielectric film and a second vapor-deposited electrode is disposed on the other side of the dielectric film.

[0003] In the film capacitor of Patent Document 1, the first vapor-deposited electrode and the second vapor-deposited electrode are divided by a partition margin extending in the width direction to have first divided electrodes and second divided electrodes.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the metallized film capacitor described in Patent Document 1, there is still room for improvement in suppressing variations in capacitance.

[0006] The present invention provides a metallized film manufacturing apparatus, a metallized film, and a film capacitor capable of suppressing variations in capacitance.

Means for Solving the Problems

[0007] A metallized film manufacturing apparatus according to an aspect of the present invention includes: a supply unit that supplies a dielectric film in the longitudinal direction; A printing roll having a rotation axis in the width direction of the dielectric film and printing an insulating pattern on the surface of the dielectric film, A deposition portion in which a metal deposition electrode is formed on the surface of the dielectric film at a position other than the insulating pattern, Equipped with, The printing roll has a protrusion formed on its outer circumferential surface that extends axially and corresponds to the insulating pattern, A reinforcing portion is formed at one end of the protrusion in the axial direction of the printing roll.

[0008] A metallized film according to one aspect of the present invention is Dielectric film and A metal vapor-deposited electrode is formed on the surface of the dielectric film such that an insulating margin is provided at one end of the dielectric film in the width direction, Equipped with, The metal deposition electrode includes a plurality of divided electrodes separated by slits provided along the width direction of the dielectric film. Each of the aforementioned plurality of divided electrodes is provided with a notch at the corner facing the insulating margin.

[0009] A film capacitor according to one aspect of the present invention is The aforementioned metallized film, A pair of end electrodes are arranged at both ends of the metallized film, It is equipped with. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can suppress variations in capacitance. [Brief explanation of the drawing]

[0011] [Figure 1A] Schematic diagram showing a metallized film according to Embodiment 1 of the present invention. [Figure 1B] Enlarged view of region E1 in Figure 1A [Figure 2] Schematic diagram showing a film capacitor according to Embodiment 1 of the present invention [Figure 3] Schematic diagram showing a pair of metallized films included in a wound body [Figure 4] Schematic diagram showing a metallized film manufacturing apparatus according to Embodiment 1 of the present invention [Figure 5] Perspective view showing the printing roll of the metallized film manufacturing apparatus of FIG. 4 [Figure 6A] Diagram showing the convex portion of the printing roll of FIG. 5 developed on a plane [Figure 6B] Diagram showing an insulating pattern printed by the convex portion of the printing roll [Figure 7] Schematic diagram showing the process of forming an insulating pattern in the metallized film manufacturing apparatus of FIG. 4 [Figure 8] Table showing the relationship between the slit width and the distance of the end portion on the insulating margin side of adjacent divided electrodes and the generation of strain in the divided electrodes [Figure 9] Schematic diagram showing a metallized film according to Modification 1 of Embodiment 1 [Figure 10] Schematic diagram showing a metallized film according to Modification 2 of Embodiment 1 [Figure 11] Schematic diagram showing a metallized film according to Modification 3 of Embodiment 1

Embodiments for Carrying Out the Invention

[0012] (Background Leading to the Present Invention) A film capacitor formed by winding or laminating a dielectric film having a vapor-deposited electrode formed on its surface is known. In a film capacitor, in order to improve safety, a pattern margin may be formed in the vapor-deposited electrode. For example, in the film capacitor described in Patent Document 1, the vapor-deposited electrode is divided by a partition margin extending in the width direction.

[0013] The compartment margin is the portion that does not contribute to the capacitance of the film capacitor. Therefore, reducing the width of the compartment margin is effective in increasing the capacitance of the film capacitor, thereby enabling miniaturization and cost reduction of the film capacitor.

[0014] The partition margin is formed by applying oil to the area that will form the partition margin pattern before depositing metal onto the dielectric film. A printing roll is used, for example, to apply the oil, but narrowing the partition margin also reduces the pattern width of the printing roll, which can cause distortion in the printing roll. This distortion in the printing roll causes distortion in the partition margin formed on the dielectric film, reducing the area of ​​the deposited electrode and causing a decrease in the capacitance of the film capacitor.

[0015] The present inventors have investigated a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can reduce distortion of the partition margin and suppress variations in capacitance, and have arrived at the following invention.

[0016] (Embodiment 1) [Overall structure] Figure 1A is a schematic diagram showing a metallized film 11 according to Embodiment 1 of the present invention. Figure 1B is an enlarged view of region E1 in Figure 1A.

[0017] <Metallic film> The metallized film 11 is a film in which metal deposition electrodes 13 are formed on the surface of the dielectric film 12. By laminating or winding the metallized film 11, a film capacitor 1 shown in Figure 2, which will be described later, is formed.

[0018] The dielectric film 12 is formed from a plastic film containing a thermoplastic resin such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate, or from a plastic film containing a thermosetting resin such as a cured product obtained by the reaction of hydroxyl groups (OH groups) of a first organic material and isocyanate groups (NCO groups) of a second organic material. The metal vapor deposition electrode 13 is formed from a metal such as aluminum or zinc.

[0019] The metal-deposited electrode 13 is divided into multiple segmented electrodes 13a by a plurality of slits 14 provided along the width direction W of the dielectric film 12. The metal-deposited electrode 13 includes a connection portion 13b extending along the longitudinal direction L of the dielectric film 12 at one end in the width direction W of the dielectric film 12. Each of the multiple segmented electrodes 13a is connected to the connection portion 13b via a fuse 15.

[0020] At the other end of the dielectric film 12 in the width direction W, an insulating margin 16 is provided along the longitudinal direction L of the dielectric film 12, where no metal deposition electrodes are formed. The insulating margin 16 is connected to each of the slits 14.

[0021] In each of the multiple divided electrodes 13a, a notch 17 is provided at the corner facing the insulating margin 16. As shown in Figure 1B, each notch 17 is formed at the end of the slit 14 in the direction toward the insulating margin 16, such that the width of the slit 14 widens toward the insulating margin 16. In other words, the slit 14 is formed so that at the end on the insulating margin 16 side, it widens from width d1 to width d2 toward the insulating margin 16. In this embodiment, the notch 17 is formed in a C-shape.

[0022] In this embodiment, the slit width d1 of the slit 14 is formed to be 0.2 mm or less. The slit 14 is a portion of the dielectric film 12 where the metal vapor-deposited electrode 13 is not formed, and therefore does not contribute to the capacitance of the film capacitor 1. For this reason, in order to maximize the capacitance of the film capacitor 1, it is desirable for the slit width d1 to be small, and preferably 0.2 mm or less. By making the slit width d1 0.2 mm or less, the film capacitor 1 can be miniaturized.

[0023] Furthermore, as shown in Figure 1B, the ratio of the first slit width d1 of the slit 14 to the second slit width d2, which is wider than the first slit width d1, should be between 2 and 42 times. The second slit width d2 represents the distance to the insulating margin 16 side end of the adjacent divided electrode 13a. In other words, the ratio of the slit width d1 to the distance d2 to the insulating margin 16 side end of the adjacent divided electrode 13a should be between 2 and 42 times. The notch 17 is formed such that the ratio of the first slit width d1 to the second slit width d2 is between 2 and 42 times. By forming the notch 17 in this way, distortion in the slit 14 can be suppressed, and a decrease in the capacitance of the film capacitor 1 can be suppressed.

[0024] <Film Capacitor> Figure 2 is a schematic diagram showing a film capacitor 1 according to Embodiment 1 of the present invention.

[0025] As shown in Figure 2, the film capacitor 1 comprises a wound body 10 formed by winding a pair of metallized films 11 together, and a pair of end-face electrodes 20 positioned at both ends of the wound body 10.

[0026] Figure 3 is a schematic diagram showing a pair of metallized films 11 contained in a wound body 10. The wound body 10 is formed by winding a pair of metallized films 11 that are stacked in the thickness direction. The wound body 10 may also be formed by laminating multiple metallized films 11.

[0027] As shown in Figure 3, the pair of metallized films 11 are stacked on top of the dielectric film 12 with a offset width As in the width direction W. Furthermore, the connecting portions 13b of each metallized film 11 are positioned on opposite sides in the width direction W of the dielectric film 12. After winding the pair of metallized films 11, the connecting portion 13b of one metallized film 11 is connected to one of the pair of end-face electrodes 20, and the connecting portion 13b of the other metallized film 11 is connected to the other of the pair of end-face electrodes 20.

[0028] Because an insulating margin 16 is formed at the end of the metallized film 11 opposite to the connection portion 13b, it is possible to prevent a short circuit from occurring between the connection portion 13b of one metallized film 11 and the other end face electrode 20.

[0029] <Metallic Film Manufacturing Equipment> The metallized film manufacturing apparatus 100 will be described with reference to Figures 4 to 6B. Figure 4 is a schematic diagram showing the metallized film manufacturing apparatus 100 according to Embodiment 1 of the present invention. Figure 5 is a perspective view showing the printing roll 40 of the metallized film manufacturing apparatus 100 of Figure 4. Figure 6A is a diagram showing the protrusions 41 of the printing roll 40 of Figure 5 unfolded in a plane. Figure 6B is a diagram showing the insulating pattern printed by the protrusions 41 of the printing roll 40.

[0030] The metallized film manufacturing apparatus 100 comprises a supply unit 30, a printing roll 40, and a deposition unit 50. The supply unit 30 supplies dielectric film 12 to the metallized film manufacturing apparatus 100. The printing roll 40 forms an insulating pattern on the surface of the dielectric film 12 by applying oil, thereby preventing metal from being deposited. The deposition unit 50 deposits metal onto the areas not coated with oil by the printing roll 40.

[0031] In the manufacturing apparatus 100, the dielectric film 12 is supplied from the supply unit 30 in the direction of arrow S1, i.e., in the longitudinal direction L of the dielectric film 12, and an oil for forming an insulating pattern is applied to the surface of the dielectric film 12 by the printing roll 40. Subsequently, metal deposition electrodes 13 are formed by the deposition unit 50 in the position on the surface of the dielectric film 12 excluding the insulating pattern. The metallized film 11 with the metal deposition electrodes 13 formed on it is fed in the direction of arrow S2 and wound up by the winding unit 60. An intermediate roller 61 is positioned between the supply unit 30 and the winding unit 60.

[0032] As shown in Figure 5, the printing roll 40 has a rotation axis Ax along the width direction W of the dielectric film 12 supplied in the longitudinal direction L. That is, the printing roll 40 has a rotation axis Ax in a direction intersecting the direction in which the dielectric film 12 is supplied, and applies oil to the surface of the dielectric film 12 to form an insulating pattern. The insulating pattern indicates areas where oil is applied to provide areas on the surface of the dielectric film 12 where metal is not deposited, such as slits 14 and insulating margins 16.

[0033] As shown in Figure 5, the printing roll 40 is formed in a generally cylindrical shape. The outer surface of the printing roll 40 is provided with slit-forming portions 41 corresponding to the insulating pattern. The slit-forming portions 41 correspond to the "protrusions" of the present invention.

[0034] As shown in Figure 6A, the slit-forming sections 41 are formed extending in the axial direction of the printing roll 40, and in this embodiment, multiple slit-forming sections 41 are arranged at intervals in the circumferential direction of the printing roll 40. Each of the slit-forming sections 41 corresponds to each of the slits 14 in the metallized film 11. In this embodiment, the slit-forming sections 41 are formed in two rows in the axial direction of the printing roll 40. Because the slit-forming sections 41 are formed in two rows, two metallized films can be formed at once. The slit-forming sections 41 may be formed in one row, or in three or more rows.

[0035] The slit-forming portion 41 is formed to be elongated along the axial direction Ax of the printing roll 40 and the width direction W of the dielectric film 12. Furthermore, it is formed to be narrow in order to reduce the slit width d1 of the slit 14. For this reason, a reinforcing portion 42 is provided to prevent distortion at the end of the slit-forming portion 41. The reinforcing portion 42 is formed at one end of the slit-forming portion 41 in the axial direction Ax of the printing roll 40. Because the slit-forming portion 41 is formed in this shape, a notch 17 is formed at the corner of the divided electrode 13a of the metallized film 11, as shown in Figure 1A. In other words, the reinforcing portion 42 corresponds to the notch 17 provided in the divided electrode 13a.

[0036] In this embodiment, the printing roll 40 has an insulating margin forming portion 43 that extends in the circumferential direction. The insulating margin forming portion 43 corresponds to the insulating margin 16 of the metallized film 11.

[0037] As shown in Figure 6B, when oil 70 is applied to the dielectric film 12 by the printing roll 40, insulating patterns 14a, 17a, and 16a are formed. Insulating pattern 14a is an insulating pattern for forming the slit 14 shown in Figure 1A. Insulating pattern 17a is an insulating pattern for forming the notch 17 shown in Figure 1A. Insulating pattern 16a is an insulating pattern for forming the insulating margin 16 shown in Figure 1A. In this way, the slit forming portion 41, the reinforcing portion 42, and the insulating margin forming portion 43 are formed in a shape that corresponds to the insulating patterns.

[0038] Figure 7 is a schematic diagram showing the process of forming an insulating pattern in the metallized film manufacturing apparatus 100 shown in Figure 4. Dielectric film 12 is supplied in the direction of arrow A1. At this time, the printing roll 40 rotates in the direction of arrow A2, supplying oil 70 to the tip of the slit forming section 41. The oil 70 adhering to the tip of the slit forming section 41 is transferred to the dielectric film 12, forming an insulating pattern on the dielectric film 12. At this time, oil 70 is also supplied to the reinforcing section 42 of the slit forming section 41, and the insulating pattern is formed in a shape corresponding to the slit 14. Similarly, oil is applied to the position corresponding to the insulating margin 16.

[0039] The width of the slit-forming portion 41 should be 0.2 mm or less, corresponding to the slit width d1. Furthermore, the width of the slit-forming portion 41 is formed to gradually increase toward one end. Therefore, one end of the slit-forming portion 41 is formed to widen toward the outside. The ratio of the width of the end of the reinforcing portion 42 to the width of the slit-forming portion 41 should be between 2 and 42 times. This corresponds to the ratio of the distance between the ends of adjacent divided electrodes 13a to the slit width d1.

[0040] In this embodiment, the other end of the slit-forming portion 41 is formed with a constant width.

[0041] Once the insulating pattern is formed by the printing roll 40, the metal deposition electrode 13 is formed by the deposition unit 50. At this time, metal is not deposited in the areas where the insulating pattern is formed, resulting in slits 14 and insulating margins 16. Since the slit forming unit 41 is provided with a reinforcing unit 42, a notch 17 is formed at the corner of the divided electrode 13a of the metal deposition electrode 13, as shown in Figure 1A.

[0042] By forming a reinforcing portion 42 at one end of the slit-forming portion 41, the end of the slit-forming portion 41 can be reinforced, thereby reducing distortion at the end of the slit-forming portion 41.

[0043] The metallized film 11, on which the metal deposition electrode 13 is formed by the deposition unit 50, is wound up by the winding unit 60.

[0044] [Examples] In the metallized film described in Embodiment 1, we investigated whether or not strain occurred in the divided electrodes by changing the slit width. Figure 8 is a table showing the relationship between the slit width d1, the distance between the insulating margin ends of adjacent divided electrodes, and the occurrence of strain in the divided electrodes.

[0045] In the metallized film 11 of Embodiment 1, the electrode width d3 of the divided electrode 13a (see Figure 1A) was kept constant at 2 mm, and the slit width d1 was varied to 0.1 mm, 0.2 mm, and 0.05 mm. Furthermore, the distance d2 (indicated as "end distance d2" in Figure 8) between adjacent divided electrodes 13a on the insulating margin 16 side was varied. The end distance d2 was changed by changing the chamfer dimension d4 shown in Figure 1A. The chamfer dimension d4 indicates the size of the notch 17 in the width direction (longitudinal direction L of the dielectric film 12) of the divided electrode 13a at the insulating margin 16 side end of the divided electrode 13a.

[0046] As shown in Figure 8, when the slit width d1 is 0.1 mm and the end distance d2 is 1.1 mm, the ratio of end distance d2 / slit width d1 is 11 times. That is, the ratio of the distance d2 of the end of the adjacent divided electrode 13a on the insulating margin 16 side to the slit width d1 is 11 times. Similarly, when the slit width d1 is 0.2 mm and the end distance d2 is 0.4 mm, the ratio of end distance d2 / slit width d1 is 2 times, when the slit width d1 is 0.05 mm and the end distance d2 is 2.1 mm, the ratio of end distance d2 / slit width d1 is 42 times, and when the slit width d1 is 0.1 mm and the end distance d2 is 0.15 mm, the ratio of end distance d2 / slit width d1 is 1.5 times. Note that No. 4 in the table in Figure 8 is a comparative example without reinforcement, and Nos. 1 to 3 and No. 5 are examples with reinforcement. In the embodiment shown in No. 5, although distortion occurred due to the small size of the reinforcement, the degree of distortion was less than in the case without reinforcement.

[0047] In the four patterns described above, we checked whether or not distortion occurred in the divided electrode 13a after forming the metal vapor-deposited electrode 13. As a result, as shown in Figure 8, no distortion occurred in the divided electrode when the end distance d2 / slit width d1 was between 2 and 42 times. This indicates that no distortion occurred at the end of the slit forming section 41 of the printing roll 40.

[0048] Therefore, it can be seen that if the value of the end distance d2 / slit width d1 is between 2 and 42 times, the metal vapor-deposited electrode 13 can be formed as designed using the printing roll 40. The metal vapor-deposited electrode 13 can be formed as designed. As a result, the shape of the divided electrode 13a can be stabilized, and when the film capacitor 1 is formed using the metallized film 11, the decrease in capacitance can be suppressed.

[0049] [effect] According to the above-described embodiment, the following effects can be achieved.

[0050] The metallized film 11 comprises a dielectric film 12 and a metal deposition electrode 13. The metal deposition electrode 13 is formed on the surface of the dielectric film 12 such that an insulating margin 16 is provided at one end of the dielectric film 12 in the width direction, and includes a plurality of divided electrodes 13a divided by a slit 14 provided along the width direction of the dielectric film 12. Each of the plurality of divided electrodes 13a is provided with a notch 17 at the corner facing the insulating margin 16.

[0051] This configuration allows the metal-deposited electrode 13 to be divided into multiple divided electrodes 13a, providing a safety function for the film capacitor while suppressing a decrease in capacitance due to distortion of the divided electrodes 13a.

[0052] The width d1 of the slit 14 is 0.2 mm or less.

[0053] This configuration allows for a smaller slit width and a larger capacitance of the film capacitor.

[0054] The ratio of the distance of the end of the adjacent divided electrode 13a on the insulating margin 16 side to the width d1 of the slit 14 is between 2 and 42 times.

[0055] This configuration suppresses distortion of the divided electrode 13a and thus prevents a decrease in capacitance.

[0056] The notch 17 is formed in a chamfered shape.

[0057] This configuration suppresses distortion of the divided electrode 13a, thereby preventing a decrease in the capacitance of the film capacitor.

[0058] The film capacitor 1 comprises the aforementioned metallized film 11 and end electrodes 20. The end electrodes 20 are positioned at both ends of the metallized film 11.

[0059] This configuration makes it possible to provide a film capacitor 1 that suppresses the decrease in capacitance.

[0060] The metallized film manufacturing apparatus 100 comprises a supply unit 30, a printing roll 40, and a vapor deposition unit 50. The supply unit 30 supplies the dielectric film 12 in the longitudinal direction. The printing roll 40 has a rotation axis in the width direction of the dielectric film 12 and prints an insulating pattern on the surface of the dielectric film 12. The vapor deposition unit 50 forms metal vapor deposition electrodes 13 on the surface of the dielectric film 12 in positions other than the insulating pattern. The printing roll 40 has protrusions 41 that extend axially on its outer circumferential surface and correspond to the insulating pattern. A reinforcing portion 42 is formed at one end of the protrusions 41 in the width direction of the dielectric film 12.

[0061] This configuration makes it possible to suppress distortion in the protrusions 41 of the printing roll 40 when applying oil to the insulating pattern.

[0062] The reinforcing portion 42 is formed such that its width gradually increases toward one end of the protrusion 41.

[0063] This configuration further suppresses distortion of the protrusion 41.

[0064] The width of the portion of the protrusion 41 where the reinforcing portion 42 is not formed is 0.2 mm or less.

[0065] This configuration allows for a reduction in the width d1 of the slit 14 in the metallized film 11, thereby increasing the capacitance of the film capacitor 1.

[0066] The ratio of the width of the reinforcing portion 42 on one end of the protrusion 41 to the width of the protrusion 41 is between 2 and 42 times.

[0067] This configuration makes it possible to reduce the width of the protrusion 41 while suppressing distortion of the protrusion 41.

[0068] The other end of the protrusion 41 in the width direction of the dielectric film 12 is formed with a constant width.

[0069] This configuration allows the area of ​​the divided electrode 13a to be made as large as possible, thereby increasing the capacitance of the film capacitor 1.

[0070] (modified version) Figure 9 is a schematic diagram showing a metallized film according to a modification 1 of Embodiment 1. As shown in Figure 9, in the metallized film 111, the notch 117 may be formed to be larger than the notch 17 of the metallized film 11 according to Embodiment 1, and the tip of the divided electrode 113a may be formed to be pointed.

[0071] Figure 10 is a schematic diagram showing a metallized film according to a modified example 2 of Embodiment 1. As shown in Figure 10, the notch 217 in the metallized film 211 may be formed in an R-shape. By forming the notch 217 in an R-shape, the corners of the divided electrode 213a become rounded, which further suppresses distortion of the divided electrode 213a. stomach.

[0072] Figure 11 is a schematic diagram showing a metallized film according to a modified example 3 of Embodiment 1. As shown in Figure 11, in the metallized film 311, the notch 317 may be formed in an R-shape, and the end of the divided electrode 313a may be formed in an arc shape.

[0073] (Summary of the embodiment) (1) The metallized film manufacturing apparatus of the present invention comprises a supply unit for supplying a dielectric film in the longitudinal direction, a printing roll having a rotation axis in the width direction of the dielectric film and printing an insulating pattern on the surface of the dielectric film, and a deposition unit for forming metal deposition electrodes on the surface of the dielectric film at positions other than the insulating pattern, wherein the printing roll has a convex portion that extends axially on the outer circumferential surface of the printing roll and corresponds to the insulating pattern, and a reinforcing portion is formed at one end of the convex portion in the axial direction of the printing roll.

[0074] (2) In the metallized film manufacturing apparatus of (1), the reinforcing portion may be formed such that its width gradually increases toward one end of the protrusion in the axial direction of the printing roll.

[0075] (3) In the metallized film manufacturing apparatus of (1) or (2), the width of the portion where the reinforcing portion of the protrusion is not formed may be 0.2 mm or less.

[0076] (4) In any one of the metallized film manufacturing apparatuses described in (1) to (3), the ratio of the width of one end of the reinforcing portion to the width of the protrusion may be 2 times or more and 42 times or less.

[0077] (5) In any one of the metallized film manufacturing apparatuses described in (1) to (4), the other end of the convex portion in the width direction of the dielectric film may be formed with a constant width.

[0078] (6) The metallized film of the present invention comprises a dielectric film and a metal vapor deposition electrode formed on the surface of the dielectric film such that an insulating margin is provided at one end of the dielectric film in the width direction, wherein the metal vapor deposition electrode includes a plurality of divided electrodes divided by slits provided along the width direction of the dielectric film, and each of the plurality of divided electrodes is provided with a notch at the corner facing the insulating margin.

[0079] (7) In the metallized film of (6), the width of the slit may be 0.2 mm or less.

[0080] (8) In the metallized film of (6) or (7), the ratio of the distance between the insulating margin side end of adjacent divided electrodes to the width of the slit may be 2 times or more and 42 times or less.

[0081] In any one of the metallized films described in (9)(6) to (8), the notch may be formed in a C-shape.

[0082] In any one of the metallized films (10)(6) to (8), the notch may be formed in the shape of an R surface.

[0083] (11) The film capacitor of the present invention comprises one of the metallized films from (6) to (10) and a pair of end electrodes arranged at both ends of the metallized film. [Industrial applicability]

[0084] This invention can be broadly applied to metallized films for forming film capacitors and to apparatus for manufacturing the same. [Explanation of Symbols]

[0085] 1 Film Capacitor 10 coils 11, 111, 211, 311 Metallized film 12 Dielectric film 13 Metal evaporated electrode 13a, 113a, 213a, 313a split electrode 13b Connection section 14 slits 15 fuses 16. Insulation margin 20 End electrode 30 Supply section 40 Print Rolls 41 Slit-forming portion (protruding portion) 42 Reinforcement section 50 Vapor deposition section 100 Manufacturing equipment d1 Slit width d2 End distance L Longitudinal direction W (width direction)

Claims

1. A supply unit that supplies dielectric film, A printing roll having a rotation axis perpendicular to the direction in which the dielectric film is supplied by the supply unit, prints an insulating pattern on the surface of the dielectric film, A deposition portion in which a metal deposition electrode is formed on the surface of the dielectric film at a position other than the insulating pattern, Equipped with, The printing roll has a slit forming portion formed on its outer circumferential surface extending in the axial direction of the rotation shaft and corresponding to the insulating pattern, and an insulating margin forming portion formed on its outer circumferential surface extending in the supply direction and corresponding to the insulating pattern, The insulating margin forming portion is positioned at one end of the slit forming portion. The slit forming portion and the insulating margin forming portion are connected by a reinforcing portion which is wider in the supply direction than the slit forming portion. Metallized film manufacturing equipment.

2. The reinforcing portion is formed such that its width gradually increases toward one end of the slit forming portion in the axial direction. The apparatus for manufacturing a metallized film according to claim 1.

3. The width of the portion of the slit-forming area where the reinforcing portion is not formed is 0.2 mm or less. The apparatus for manufacturing a metallized film according to claim 1.

4. The ratio of the width of the reinforcing portion at one end of the slit-forming portion to the width of the slit-forming portion is 2 times or more and 42 times or less. The apparatus for manufacturing a metallized film according to claim 1.

5. The other end of the slit forming portion is formed with a certain width. A metallized film manufacturing apparatus according to any one of claims 1 to 4.

6. Dielectric film and A metal vapor-deposited electrode is formed on the surface of the dielectric film such that an insulating margin is provided at one end of the dielectric film in the width direction, Equipped with, The metal deposition electrode includes a plurality of divided electrodes separated by slits provided along the width direction of the dielectric film. Each of the plurality of divided electrodes has a notch at the corner facing the insulating margin and a flat portion along the direction in which the insulating margin extends. The ratio of the width of the slit to the distance of the insulating margin end of the adjacent divided electrode is between 2 and 42 times. Metallized film.

7. The width of the slit is 0.2 mm or less. The metallized film according to claim 6.

8. The aforementioned notch is formed in a C-shape. The metallized film according to claim 6.

9. The aforementioned notch is formed in an R-shape, The metallized film according to claim 6.

10. A metallized film according to any one of claims 6 to 9, A pair of end electrodes are arranged at both ends of the metallized film, Equipped with, Film capacitor.

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