Packaging method and transportation method for packaging bodies and airtight storage containers
The packaging method for semiconductor wafers uses a container box with cushioning and vibration-absorbing materials to minimize damage and particle contamination by distributing impact and vibration forces, addressing issues in conventional transportation methods.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- SHIN ETSU HANDOTAI CO LTD
- Filing Date
- 2021-12-28
- Publication Date
- 2026-05-19
AI Technical Summary
Conventional transportation methods for semiconductor wafers using sealed storage containers result in damage, groove detachment, and increased particle contamination due to impact and vibration during transit.
A packaging method using a container box with a cushioning material featuring protruding retaining parts to hold the peripheral edge of the sealed storage container lid, combined with vibration-absorbing materials to minimize impact and vibration effects.
Prevents wafer damage, groove detachment, and reduces particle contamination on the wafer surface during transportation by effectively absorbing and distributing impact and vibration forces.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a packaging body used when further storing and packaging a sealed storage container for storing wafers such as semiconductor wafers, a method for packaging the sealed storage container, and a transportation method.
Background Art
[0002] When transporting semiconductor wafers such as silicon, for example, the wafers are stored in a sealed storage container such as a FOSB (Front Opening Shipping Box) or a FOUP (Front Opening Unified Pod), and these sealed storage containers are further stored in an outer packaging material such as a container box for transportation.
[0003] The sealed storage container has a structure that is not affected by outside air, with a lid body, a container body, and a resin packing between them. These sealed storage containers are hermetically stored in a polyethylene bag or a bag with a moisture-proof function obtained by laminating an aluminum layer. The sealed storage container is sandwiched between a structure formed by molding a resin sheet and a cushioning material formed by molding a resin foam material, and these are stored in a container box with an outer frame formed of cardboard or resin (Patent Documents 1 to 3).
[0004] Problems with conventional transportation using a container box include that, as transportation means, combinations of means such as airplanes, ships, and trucks are used, and during this transportation, impact and vibration are applied. When actually arriving at the customer and checking the semiconductor wafers stored in these sealed storage containers, the wafers may be partially damaged or may have come off from a predetermined groove in the sealed storage container, which may indicate that the container box has received a strong impact such as a collision or a fall. Also, when the number of particles or the like on the surface of the semiconductor wafers in the sealed storage container has increased abnormally compared to the time of shipment, or when the resin of the wafer holding part of the sealed storage container has adhered to the edge part of the wafer.
Prior Art Documents
Patent Documents
[0005] [Patent Document 1] Japanese Patent Publication No. 2019-055794 [Patent Document 2] Japanese Patent Publication No. 2011-016549 [Patent Document 3] International Publication No. 2015 / 037136 [Overview of the project] [Problems that the invention aims to solve]
[0006] This invention has been made in view of the above problems, and aims to provide a packaging body, a method for packaging a sealed storage container, and a method for transporting a sealed storage container that minimizes the impact on the wafer from the impact on the container box when storing the wafer in a sealed storage container and further packaging the sealed storage container in a container box for transport. [Means for solving the problem]
[0007] To solve the above problems, the present invention provides a packaging body for packaging a sealed storage container consisting of a container body and a lid in which wafers are stored, A container box having a housing in which the aforementioned sealed storage container is housed, and a cover for the housing, The container box is equipped with a cushioning material that is placed inside the container box and holds the sealed storage container, The cushioning material provides a packaging body having a plurality of protruding retaining parts for holding the peripheral edge of the upper surface of the lid of the sealed storage container.
[0008] With this type of packaging, wafers are stored in a sealed storage container, and then the sealed storage container is packed into a container box for transport. During transport, the impact on the wafers from the container box is minimized. This prevents wafer damage and groove detachment, and reduces the abnormal increase in particles on the wafer surface compared to when it was shipped, as well as the adhesion of resin from the wafer holder to the wafer edge.
[0009] Furthermore, it is preferable that the present invention further includes a first vibration absorbing material made of a foamed urethane sheet disposed between the cushioning material and the cover inside the container box, and a second vibration absorbing material made of a gel-like sheet disposed between the cushioning material and the bottom of the housing.
[0010] With this type of packaging, when wafers are stored in a sealed storage container and then the sealed storage container is packed into a container box for transport, the impact of vibrations on the wafers from the container box during transport can be minimized.
[0011] Furthermore, the present invention provides a method for packaging a sealed storage container consisting of a container body and a lid in which wafers are stored, A container box having a housing in which the aforementioned sealed storage container is housed, and a cover for the housing, A cushioning material is provided to be placed inside the container box and to hold the sealed storage container, The present invention provides a method for packaging a sealed storage container, wherein the peripheral edge of the upper surface of the lid of the sealed storage container is held by a plurality of protruding retaining parts of the cushioning material within the container box.
[0012] With this method of packaging sealed storage containers, the impact on the wafers from the container box during transport, when the sealed storage containers are placed inside the container boxes, can be minimized. This prevents wafer damage and groove detachment, and reduces the abnormal increase in particles on the wafer surface compared to when the wafers were shipped, as well as the adhesion of resin from the wafer holding parts to the wafer edges.
[0013] Furthermore, in the present invention, a first vibration absorbing material made of foamed urethane sheet is placed between the cushioning material and the cover inside the container box. It is preferable to place a second vibration-absorbing material, which is a gel-like sheet, between the cushioning material and the bottom of the housing.
[0014] With such a method of packing a sealed storage container, when a wafer is stored in the sealed storage container and the sealed storage container is further packed in a container box for transportation, the influence of vibration applied to the container box on the wafer can be minimized.
[0015] In addition, the present invention provides a method of transporting a sealed storage container comprising a container body and a lid body in which a wafer is stored, providing a method of transporting a sealed storage container, in which the sealed storage container is packed by the packing method described above and the packed sealed storage container is transported.
[0016] With such a method of transporting a sealed storage container, when transporting the sealed storage container, it becomes a method of transporting a sealed storage container that can minimize the influence of impact and vibration applied to the container box on the wafer.
Effect of the Invention
[0017] In the package of the present invention, since the protruding holding portion of the cushioning material is arranged at a position holding the peripheral portion of the sealed storage container, when a wafer is stored in the sealed storage container and the sealed storage container is further packed in a container box for transportation, the influence of impact applied to the container box on the wafer can be minimized, and breakage, groove deviation, abnormal increase of particles, and resin sticking to the wafer edge portion of the wafer can be prevented.
Brief Description of the Drawings
[0018] [Figure 1] It is a longitudinal sectional view of the package of the present invention. [Figure 2] It is an explanatory view of the cushioning material of the package of the present invention as seen from below. [Figure 3] It is a cross-sectional view near the side holding portion of the cushioning material of the package of the present invention. [Figure 4] It is an explanatory view showing the positional relationship between the protruding holding portion and the side holding portion as seen from the viewpoint P of FIGS. 1 and 2. [Figure 5] It is a view showing an example of a sealed storage container. [Figure 6]It is a flowchart showing an example of a packaging method and a transportation method of a package in an embodiment. [Figure 7] It is a graph showing the evaluation of surface defects of a wafer. [Figure 8] It is a graph showing the evaluation of edge defects of a wafer. [Figure 9] It is a longitudinal sectional view of a conventional package. [Mode for Carrying Out the Invention]
[0019] As described above, when a wafer is stored in a sealed storage container and the sealed storage container is further packed and transported in a container box, there has been a demand for the development of a package, a method for packing a sealed storage container, and a method for transporting a sealed storage container that minimize the impact on the wafer caused by the impact on the container box.
[0020] As a result of intensive studies on the above problems, the present inventors have found that the impact on the wafer can be suppressed if the package has a plurality of protruding holding portions for holding the peripheral portion of the upper surface of the lid of the sealed storage container by the cushioning material in the container box, and have completed the present invention.
[0021] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0022] FIG. 5 shows a general sealed storage container (FOSB or FOUP) to be packed in the package of the present invention. The sealed storage container 5 includes a container body 5a in which a wafer is stored and a lid 5b.
[0023] [Package] Figure 1 shows a packaging body 10 according to the present invention. It is a longitudinal cross-sectional view of the packaging body 10, and the sealed storage container 5 to be packaged is also shown. The packaging body 10 shown in Figure 1 is a packaging body 10 for packaging a sealed storage container 5, and comprises a container box 2 having a housing 3b in which the sealed storage container 5 is housed, and a cover 3a for the housing 3b, and a cushioning material 1 disposed inside the container box 2 to hold the sealed storage container 5. The cushioning material 1 has a plurality of protruding holding parts 6a for holding the peripheral edge of the upper surface of the lid of the sealed storage container 5. Here, it is preferable that the container box 2 further comprises a first vibration absorbing material 4b made of a foamed urethane sheet disposed between the cushioning material 1 and the cover 3a, and a second vibration absorbing material 4a made of a gel-like sheet disposed between the cushioning material 1 and the bottom of the housing 3b.
[0024] The cushioning material 1 used in the packaging 10 of the present invention only needs to have the above-mentioned protruding holding portion at the location where it holds the lid of the sealed storage container 5. For example, as shown in Figure 1, for a packaging arrangement of two sealed storage containers 5 arranged in upper and lower tiers, the packaging can include a first cushioning material 1a having multiple protruding holding portions for the upper sealed storage container 5, a second cushioning material 1b having multiple protruding holding portions for the lower sealed storage container and holding the opposing wall of the lid of the upper sealed storage container (the bottom wall of the container body which becomes the lower side when packaged), and a third cushioning material 1c holding the opposing wall of the lid of the lower sealed storage container, and the containers are held in place by being sandwiched from above and below.
[0025] Here, the effectiveness of the protruding retaining portion of the cushioning material 1 in the present invention will be described in detail, while explaining conventional packaging and its problems. The inventors of the present invention have diligently studied ways to prevent damage such as cracking, chipping, or delamination of the wafers, as well as an increase in particles on the wafer surface, and resin sticking due to contact friction with the holding part of the resin wafer holder in the sealed storage container, when wafers manufactured by the wafer manufacturer are transported to the destination due to impacts such as dropping or collision.
[0026] During wafer transport, impacts that can cause damage such as cracking, chipping, or groove dislodgement of wafers within the sealed storage container can be applied from all six sides (top, bottom, left, right, front, and back) of the container. Therefore, by holding the sealed storage container with cushioning material (especially by sandwiching it from above and below and holding all six sides), the cushioning material can absorb the impact even when subjected to impacts from all six sides.
[0027] Figure 9 shows a conventional packaging body 110. The conventional packaging body 110 is a container box having a sealed storage container 15, a housing 13 in which the sealed storage container 15 is housed, and a cover 12 for the housing 13, and includes a cushioning material 11, a first vibration absorbing material 14b placed between the cushioning material 11 and the cover 12, and a second vibration absorbing material 14a placed between the cushioning material 11 and the bottom of the housing 13. In the conventional packaging body 110 shown in Figure 9, if the holding portion of the cushioning material 11 is placed on the entire surface of the lid of the sealed storage container 15 or on the central side of the lid, the resin lid deforms and flexes due to the aforementioned impact pressing on the area near the center of the lid. Although a sealing structure is formed by a packing between the lid of the sealed storage container 15 and the container body, it was found that when the lid is pressed and flexes, the pressure inside the sealed storage container 15 fluctuates, causing air to enter and exit, and resulting in an increase in particles on the wafer surface. Furthermore, the inside of the lid of the sealed storage container 15 is equipped with a resin retainer to prevent the stored wafers from moving, and the wafers are held in place by this resin retainer. It was found that the aforementioned impact causes the resin lid of the sealed storage container 15 to deform and bend, and as a result the resin retainer presses against the wafer, resin buildup occurs on the wafer edge retainer.
[0028] In contrast, in the present invention, as shown in Figure 2, the multiple protruding retaining parts 6a that support the door (upper surface of the lid) of the airtight storage container are arranged on the periphery of the lid of the airtight storage container 5 (see the explanation using Figure 4 later for details). Figure 2 is an explanatory diagram of the cushioning material 1a (cushioning material 1b) viewed from below. With respect to the cushioning material, only the bottom surface, the protruding retaining parts 6a that hold the periphery of the lid of the airtight storage container, and the side retaining parts 6b that hold the sides of the container body and lid, which will be described later, are shaded. The part where the lid of the airtight storage container is inserted is a recess (white in Figure 2), and the black part in the center of the recess is a hollowed-out space to reduce the material and weight of the cushioning material. Lines representing the position of the side of the container body during packaging are also shown to make the positional relationship with the airtight storage container easier to understand.
[0029] In this manner, the multiple protruding retaining parts 6a that hold the upper surface of the door (lid) of the sealed storage container hold the peripheral edge of the lid, preventing the resin door of the sealed storage container from deforming and bending, preventing the resin retainer of the door of the sealed storage container from excessively pressing on the wafer, and reducing the adhesion of the retaining resin to the wafer edge.
[0030] Furthermore, in the cushioning material, the protruding retaining portion is positioned on the outer side of the periphery of the sealed storage container (container body side) rather than on the inner side of the door (upper side) of the sealed storage container. As a result, the impact is not transmitted to the central part of the door of the sealed storage container, preventing the door from being pushed or released. This eliminates the inflow and outflow of air due to pressure fluctuations inside the sealed storage container caused by the door being pushed, thereby reducing the adhesion of particles to the wafers stored in the sealed storage container.
[0031] As is clear from the above description, the packaging of the present invention is characterized in that the protruding retaining portion of the cushioning material is positioned on the upper surface of the lid of the sealed storage container to hold the peripheral edge of the upper surface of the lid of the sealed storage container. Therefore, other configurations are not particularly limited, and conventionally known configurations can be used.
[0032] The number of protruding retaining parts 6a is not limited to any one number, but in the example shown in Figure 2, one is provided near each of the four sides of the top surface of the lid (a total of four). The number can be determined according to the size of the airtight storage container, and there is no upper limit. Furthermore, the size and shape of the protruding retaining parts 6a are not limited and can be determined as appropriate. Further details, including other components, will be provided below.
[0033] As shown in Figures 2 and 3, the cushioning material 1 used in the packaging of the present invention may have multiple side-holding portions 6b (protrusions) for holding the sides of the sealed storage container 5. Figure 3 is a cross-sectional view of the area near the side-holding portions of the cushioning material 1a. The container body of the sealed storage container is also shown for reference. Here, there are two side-holding portions 6b on each side (eight in total), but their number, size, and shape are not particularly limited. Holding the container with these side-holding portions can prevent it from moving horizontally.
[0034] Figure 4 shows the positional relationship between the protruding retaining portion 6a and the side retaining portion 6b. Figure 4 is an explanatory diagram viewed from viewpoint P in Figures 1 and 2. More specifically, it is an enlarged view of the area around an example of the protruding retaining portion 6a (6a1) and an example of the side retaining portion 6b (6b1) (the area enclosed by the ellipse in Figure 2) as viewed from viewpoint P. As shown in Figure 4, the sealed storage container 5 is equipped with a protruding retaining portion 6a that holds the peripheral edge of the upper surface of the lid and a side retaining portion 6b that holds the peripheral edges of the sides of the container body 5a and lid 5b of the sealed storage container 5.
[0035] Note that in Figure 1, the protruding retaining part appears to be positioned to hold the central part of the lid. However, it actually holds the peripheral edge on the front side of the lid. In other words, Figure 1 corresponds to a vertical cross-sectional view of the location of the protruding retaining part 6a1 in Figure 2, and in reality, as shown in Figure 2, it is positioned to hold the peripheral edge of the upper surface of the lid.
[0036] The casing and cover of a shipping container box can be formed into a box shape from corrugated plastic, which is made by bonding a flat sheet (liner) and a corrugated sheet (medium) together using a resin such as polypropylene. The container box cover may have a groove that allows it to fit into the casing, or it may be made slightly larger than the casing and fitted over it, with hook-and-loop fasteners attached to the outside of the casing and the inside of the cover. In addition, to prevent the container box cover from coming off in the event of impact, the cover and casing may be secured with string or a resin belt.
[0037] Cushioning material is a sealed storage container and a component that mitigates impact to wafers. Cushioning material can be made from foamed materials using resins such as polyethylene or polystyrene.
[0038] The first and second vibration absorbers are components that absorb vibrations transmitted to the sealed storage container and the wafer. The first and second vibration absorbers can be components formed from foamed materials made from resins such as polyurethane, or components formed from gel-like vibration absorbers in sheet form. The gel-like vibration absorbers can be rubber-based gels such as viscoelastic rubber or silicone rubber, silicone gels obtained by mixing and dispersing quartz particles, glass particles, or alumina particles in silicone oil, or cellulose gels obtained by mixing and dispersing cellulose fibers in water, oil, or silicone oil. The second vibration absorber is formed from gel-like vibration absorbers in sheet form, and its high vibration absorption allows for a thin profile. However, because its specific gravity is higher than that of polyurethane, it is preferable to place it between the bottom of the housing and the cushioning material. The first vibration absorber is preferably made from a polyurethane component, particularly a foamed urethane sheet. Its lightness allows it to be placed between the cover and the cushioning material, which reduces the effort required when storing and removing the sealed storage container. These vibration-absorbing materials absorb vibrations, suppressing abnormal increases in particles and preventing resin from sticking to the wafer holding parts at the edges.
[0039] Furthermore, the thickness of the polyurethane or gel-like vibration absorber is preferably 5 mm or more. In addition, the contact area of the vibration absorber with the cushioning material and the container box is preferably half or more of the area of the cushioning material, the bottom of the housing, and the cover (top surface), and it is even more preferable that it be the same area.
[0040] In particular, regarding the first vibration-absorbing material placed between the cushioning material and the cover, the height of the cushioning material sandwiched between the cushioning material may vary relative to the height of the enclosure depending on the type of sealed storage container used. Therefore, by appropriately combining vibration-absorbing materials of different thicknesses and adjusting the overall thickness of the vibration-absorbing material, it is possible to eliminate any gaps or protrusions.
[0041] In the packaging, as shown in Figure 1, it is preferable that there are no spaces (gaps) between the cushioning material and each vibration absorbing material, between each vibration absorbing material and the housing (bottom) and cover, and between the cushioning material and the side of the housing. This makes it possible to further suppress shocks and vibrations to the sealed storage container and, consequently, to the wafers.
[0042] The type and number of sealed storage containers to be packed in the packaging body according to the present invention, and the wafers to be stored in the sealed storage containers are not particularly limited. For example, as shown in Figure 5, the sealed storage container can be an FOSB, the number of containers to be stored can be 12, and the wafers can be silicon wafers with a diameter of 300 mm.
[0043] [How to pack airtight storage containers] Furthermore, a method for packaging the airtight storage container of the present invention will be described. First, prepare a container box having a housing and a cover, as shown in Figure 1-4, and cushioning materials 1a to 1c. At this time, it is also advisable to prepare a first vibration absorber and a second vibration absorber. Then, within the container box, a first vibration absorber is placed between the cushioning material and the cover, and a second vibration absorber, consisting of a gel-like sheet, is placed between the cushioning material and the bottom of the housing. The sealed storage container is then packaged while the peripheral edge of the upper surface of the lid of the sealed storage container is held in place by multiple protruding retaining parts 6a of the cushioning materials 1a and 1b.
[0044] [Transportation methods for airtight storage containers] Furthermore, a method for transporting the sealed storage container of the present invention will be described. The airtight storage container can be packed using the packing method described above, and the packed airtight storage container can be transported.
[0045] The means of transporting the sealed storage container are not particularly limited; for example, trucks or aircraft can be used. [Examples]
[0046] The present invention will be specifically described below using examples and comparative examples, but the present invention is not limited to these.
[0047] [Examples] Based on the flowchart shown in Figure 6, the manufactured wafers were placed in sealed storage containers, and the sealed storage containers were packaged. Specifically, 300 silicon wafers with a diameter of 300 mm were prepared, and 25 wafers were placed in one sealed storage container (FOSB), resulting in a total of 300 wafers being stored in 12 sealed storage containers. A second vibration absorber 4a and a third cushioning material 1c were placed inside the housing of the container box, and six sealed storage containers were placed on top of them as the lower layer. Then, six more sealed storage containers were placed on top of the structure of the second cushioning material 1b, which has a thickness of 25 mm or more, as the upper layer. Furthermore, a first cushioning material 1a and a first vibration absorber 4b were placed on top, and a total of 12 sealed storage containers were stored, and the housing 3b was covered with a cover 3a to package it as shown in Figure 1. A cushioning material was used in which multiple protruding holding parts that support the lid of the sealed storage container are placed around the periphery of the sealed storage container. Specifically, a device having four protruding retaining parts 6a as shown in Figure 2 was used. Furthermore, the second vibration absorbing material 4a between the bottom of the container box housing and the cushioning material was made of a gel-like sheet material, the first vibration absorbing material between the cover and the cushioning material was made of foamed urethane, the cushioning material was made of expanded polystyrene, and the container box housing was made of polypropylene corrugated plastic. The second vibration absorbing material between the bottom of the container box housing and the cushioning material was made of a silicone rubber gel-like sheet with a thickness of 30 mm and an area the same as the bottom of the housing. The first vibration absorbing material between the cover and the cushioning material was made of a foamed urethane sheet (polyurethane) with a thickness of 45 mm and an area the same as the cover.
[0048] [Comparative Example] The manufactured wafers were packaged in the same manner as in the examples. However, the cushioning material used had a structure that supported the entire lid of the sealed storage container, as shown in Figure 9. All other conditions were the same as in the examples.
[0049] [Transportation Test] As described above, the examples and comparative examples were transported by truck between the factory and Haneda Airport, and by air between Haneda Airport and Naha Airport, using trucks and aircraft.
[0050] [Wafer surface defect evaluation] For the wafers prepared for the examples and comparative examples, the number of surface defects before and after the transport test was measured for 300 wafers each using a KLA SP5 particle counter. The number of defects with a particle size of 22 nm or larger was measured, and the average difference in the number of defects was calculated and compared. Figure 7 shows the results of the wafer surface defect evaluation. The results were compared by indexing the average number of surface particle increases for the examples (300 wafers) against the average number of surface particle increases for the comparative examples (300 wafers) as the baseline.
[0051] [Wafer edge defect (adhesion) evaluation] For the wafers prepared for the example and comparative example, the number of edge defects and their area were measured on 300 wafers each before and after the transport test using the RXM edge defect inspection system manufactured by Nano System Solutions. The difference in the average defect area was calculated and compared. Figure 8 shows the results of the wafer edge defect evaluation. The results were compared by indexing the average value of the defect increase area (difference) of 300 wafers for the example, using the average value of the defect increase area (difference) of 300 wafers for the comparative example as the baseline.
[0052] As is clear from Figure 7, the example showed a smaller increase (difference) in the number of wafer surface particles before and after the transport test compared to the comparative example. Also, as is clear from Figure 8, the example showed a smaller increase (difference) in the area of defects at the wafer edge compared to the comparative example.
[0053] According to the present invention, when transporting manufactured wafers, it is possible to suppress the transmission of shocks during transport to the sealed storage container packed in a container box, as well as to the wafers themselves, making it useful for the wafer manufacturing industry.
[0054] It should be noted that the present invention is not limited to the embodiments described above. The embodiments described above are illustrative, and any configuration that is substantially identical to the technical idea described in the claims of the present invention and achieves similar effects is included within the technical scope of the present invention. [Explanation of symbols]
[0055] 1...Buffer material, 1a...First buffer material, 1b...Second buffer material, 1c... Third cushioning material, 2... Container box, 3a... Cover, 3b...Housing, 4a...Second vibration absorber, 4b...First vibration absorber 5...Airtight storage container, 5a...Container body, 5b...Lid, 6a...Protruding retaining part, 6b...Side retaining part, 10...Packaging body of the present invention, 11... cushioning material, 12... cover, 13... casing, 14a...Second vibration absorber, 14b...First vibration absorber, 15...Sealed storage container, 110... Conventional packaging.
Claims
1. A packaging body for packaging a sealed storage container consisting of a container body and a lid in which wafers are stored, A container box having a housing in which the aforementioned sealed storage container is housed, and a cover for the housing, The container box is equipped with a cushioning material that is placed inside the container box and holds the sealed storage container, The packaging is characterized in that the cushioning material has a plurality of protruding retaining parts for holding only the peripheral edge of the upper surface of the lid of the sealed storage container.
2. Furthermore, the packaging body according to claim 1 is characterized in that it further comprises a first vibration absorbing material made of a foamed urethane sheet disposed between the cushioning material and the cover inside the container box, and a second vibration absorbing material made of a gel-like sheet disposed between the cushioning material and the bottom of the housing.
3. A method for packaging a sealed storage container consisting of a container body and a lid in which wafers are stored, A container box having a housing in which the aforementioned sealed storage container is housed, and a cover for the housing, A cushioning material is provided to be placed inside the container box and to hold the sealed storage container, A method for packaging a sealed storage container, characterized in that, within the container box, only the peripheral edge of the upper surface of the lid of the sealed storage container is held by a plurality of protruding retaining parts of the cushioning material.
4. Furthermore, within the container box, a first vibration-absorbing material made of foamed urethane sheet is placed between the cushioning material and the cover. The method for packaging a sealed storage container according to claim 3, characterized in that a second vibration-absorbing material made of a gel-like sheet is placed between the cushioning material and the bottom of the housing.
5. A method for transporting a sealed storage container consisting of a container body and a lid in which wafers are stored, A method for transporting a sealed storage container, characterized by packaging the sealed storage container using the packaging method described in claim 3 or claim 4, and transporting the packaged sealed storage container.