A sheet containing the composition and its cured product.

Abstract

This composition comprises the compound represented by formula (1), and a hollow particle. [In formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain.]

Description

[Technical Field]

[0001] The present invention relates to a composition and a sheet containing a cured product thereof. [Background technology]

[0002] Thermal insulation materials are used in various applications for purposes such as protecting heat-sensitive components and improving energy efficiency. In some cases, hollow particles with low thermal conductivity are used in thermal insulation materials to enhance their thermal insulation performance. For example, Patent Document 1 describes a thermal insulation layer formed on the surface of a substrate, comprising a large number of hollow particles and a binder that fills the spaces between the hollow particles and holds the hollow particles to the substrate, wherein the binder is a silicone resin containing T units and D units as basic structural units. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2016-065155 [Overview of the project] [Problems that the invention aims to solve]

[0004] According to the inventors' research, there is a need for thermal insulation materials that are low in elasticity and have excellent stretchability, so that they can be applied to components of various shapes.

[0005] Therefore, the present invention aims to provide a composition suitable for thermal insulation materials that are low in elasticity and have excellent elongation, and a sheet containing a cured product thereof. [Means for solving the problem]

[0006] As a result of intensive research, the inventors of the present invention have found that by using a composition containing a specific compound having a polyoxyalkylene chain and two (meth)acryloyl groups and hollow particles, a composition suitable for a heat insulating material having low elasticity and excellent elongation, and a sheet containing a cured product thereof can be obtained. The present invention provides the following [1] to [7] in several aspects.

[0007] [1] A composition containing a compound represented by the following formula (1) and hollow particles. [Chemical formula] [In formula (1), R 11 and R 12 each independently represents a hydrogen atom or a methyl group, and R 13 represents a divalent group having a polyoxyalkylene chain. [2] The composition according to [1], wherein the polyoxyalkylene chain contains an oxyethylene group. [3] The composition according to [1], wherein the polyoxyalkylene chain contains an oxypropylene group. [4] The composition according to [1], wherein the polyoxyalkylene chain is a copolymer chain containing an oxyethylene group and an oxypropylene group. [5] The composition according to [4], wherein the copolymer chain is a random copolymer chain. [6] The composition according to any one of [1] to [5], wherein the hollow particles include first hollow particles which are thermally expandable hollow particles and second hollow particles which are hollow particles other than the first hollow particles. [7] A sheet containing a cured product of the composition according to any one of [1] to [6]. [Advantages of the Invention]

[0008] According to the present invention, it is possible to provide a composition suitable for a heat insulating material having low elasticity and excellent elongation and a sheet containing a cured product thereof. [Modes for Carrying Out the Invention]

[0009] The embodiments of the present invention will be described in detail below. However, the present invention is not limited to the embodiments described below.

[0010] In this specification, "(meth)acryloyl" means "acryloyl" and its corresponding "methacryloyl," and the same applies to similar expressions such as "(meth)acrylate" and "(meth)acrylic."

[0011] In this specification, the weight-average molecular weight (Mw) refers to the value determined by measuring the following conditions using gel permeation chromatography (GPC) with polystyrene as the standard substance. • Measuring instrument: HLC-8320GPC (product name, manufactured by Tosoh Corporation) • Analytical column: TSKgel SuperMultipore HZ-H (3-column linked) (Product name, manufactured by Tosoh Corporation) • Guard column: TSKguardcolumn SuperMP(HZ)-H (product name, manufactured by Tosoh Corporation) ·Eluent:THF ·Measurement temperature: 25℃

[0012] [Composition] A composition according to one embodiment contains a compound represented by the following formula (1) and hollow particles. [ka] In formula (1), R 11 and R 12 Each of these independently represents a hydrogen atom or a methyl group, R 13 This represents a divalent group having a polyoxyalkylene chain.

[0013] (The compound represented by formula (1)) In one embodiment, by including the compound represented by formula (1) above in the composition, the cured product of the composition has low elasticity and excellent elongation, and can improve conformability to the adherend.

[0014] In one embodiment, R 11 and R 12One of them may be a hydrogen atom and the other may be a methyl group. In another embodiment, R 11 and R 12 may both be hydrogen atoms. In another embodiment, R 11 and R 12 may both be methyl groups.

[0015] In one embodiment, the polyoxyalkylene chain contains a structural unit represented by the following formula (2). Thereby, while suppressing an excessive increase in the viscosity of the composition, the strength of the cured product can be increased.

Chemical formula

[0016] In this case, R 13 may be a divalent group having a polyoxyethylene chain, and the compound represented by the formula (1) is preferably a compound represented by the following formula (1-2) (polyethylene glycol di(meth)acrylate).

Chemical formula

[0017] In another embodiment, the polyoxyalkylene chain contains a structural unit represented by the following formula (3). Thereby, the handling of the composition can be facilitated.

Chemical formula

[0018] In this case, R 13 may be a divalent group having a polyoxypropylene chain, and the compound represented by the formula (1) is preferably a compound represented by the following formula (1-3) (polypropylene glycol di(meth)acrylate). [ka] In formula (1-3), R 11 and R 12 R in equation (1) 11 and R 12 These are equivalent to the above, and n is an integer greater than or equal to 2.

[0019] In another embodiment, the polyoxyalkylene chain is preferably a copolymer chain containing the structural units represented by formula (2) and formula (3) described above, from the viewpoint of easily achieving both the strength of the cured product of the compound represented by formula (1) and the handling of the composition. The copolymer chain may be an alternating copolymer chain, a block copolymer chain, or a random copolymer chain. The copolymer chain is preferably a random copolymer chain from the viewpoint of further lowering the crystallinity of the compound represented by formula (1) and further facilitating the handling of the composition.

[0020] In each of the embodiments described above, the polyoxyalkylene chain may have, in addition to the structural units represented by formula (2) and formula (3), oxyalkylene groups having 4 to 5 carbon atoms, such as oxytetramethylene groups, oxybutylene groups, and oxypentylene groups, as structural units.

[0021] R 13 In addition to the polyoxyalkylene chain described above, the group may be a divalent group further having other organic groups. The other organic groups may be chain-like groups other than the polyoxyalkylene chain, such as a methylene chain (a chain with -CH2- as a structural unit), a polyester chain (a chain containing -COO- as a structural unit), a polyurethane chain (a chain containing -OCON- as a structural unit), etc.

[0022] For example, the compound represented by formula (1) may also be a compound represented by the following formulas (1-4). [ka] In formula (1-4), R 11 and R 12 R in equation (1)11 and R 12 These are synonymous, and R 14 and R 15 Each of these is an alkylene group having 2 to 5 carbon atoms, and k1, k2, and k3 are each independent integers of 2 or more. k2 may be an integer less than or equal to 16, for example.

[0023] Multiple Rs exist 14 and R 15 Each of them may be identical to the others, or they may be different to each other. There are multiple R's. 14 and R 15 Each preferably contains an ethylene group and a propylene group. That is, (R 14 O) k1 Polyoxyalkylene chains represented by (R 15 O) k3 The polyoxyalkylene chains represented by are preferably copolymer chains containing an oxyethylene group (structural unit represented by formula (2) above) and an oxypropylene group (structural unit represented by formula (3) above).

[0024] In each of the embodiments described above, the number of oxyalkylene groups in the polyoxyalkylene chain is preferably 100 or more. When the number of oxyalkylene groups in the polyoxyalkylene chain is 100 or more, the main chain of the compound represented by formula (1) becomes longer, which further improves the elongation of the cured product and increases the strength of the cured product. The number of oxyalkylene groups corresponds to m in formula (1-2), n in formula (1-3), and k1 and k3 in formula (1-4), respectively.

[0025] The number of oxyalkylene groups in the polyoxyalkylene chain is more preferably 130 or more, 180 or more, 200 or more, 220 or more, 250 or more, 270 or more, 300 or more, or 320 or more. The number of oxyalkylene groups in the polyoxyalkylene chain may be 600 or less, 570 or less, or 530 or less.

[0026] The weight-average molecular weight of the compound represented by formula (1) is preferably 5000 or more, 6000 or more, 7000 or more, 8000 or more, 9000 or more, 10000 or more, 11000 or more, 12000 or more, 13000 or more, 14000 or more, or 15000 or more, from the viewpoint of the cured product having lower elasticity and superior elongation. The weight-average molecular weight of the compound represented by formula (1) is preferably 100000 or less, 80000 or less, 60000 or less, 34000 or less, 31000 or less, or 28000 or less, from the viewpoint of making it easier to adjust the viscosity of the composition.

[0027] The compound represented by formula (1) may be liquid at 25°C. In this case, the viscosity of the compound represented by formula (1) at 25°C is preferably 1000 Pa·s or less, 800 Pa·s or less, 600 Pa·s or less, 500 Pa·s or less, 350 Pa·s or less, 300 Pa·s or less, or 200 Pa·s or less, from the viewpoint of facilitating application to the coating surface and improving the adhesion of the cured product to the coating surface. The viscosity of the compound represented by formula (1) at 25°C may be 0.1 Pa·s or more, 0.2 Pa·s or more, 0.3 Pa·s or more, 1 Pa·s or more, 2 Pa·s or more, or 3 Pa·s or more.

[0028] The compound represented by formula (1) may be solid at 25°C. In this case, from the viewpoint of further improving the handling of the composition, the compound represented by formula (1) is preferably liquid at 50°C. Also in this case, from the viewpoint of further improving the handling of the composition, the viscosity of the compound represented by formula (1) at 50°C is preferably 100 Pa·s or less, more preferably 50 Pa·s or less, even more preferably 30 Pa·s or less, and particularly preferably 20 Pa·s or less. The viscosity of the compound represented by formula (1) at 50°C may be 0.1 Pa·s or more, 0.2 Pa·s or more, or 0.3 Pa·s or more.

[0029] Viscosity refers to the value measured according to JIS Z 8803, specifically the value measured using an E-type viscometer (for example, PE-80L manufactured by Toki Sangyo Co., Ltd.). The viscometer can be calibrated according to JIS Z 8809-JS14000. The viscosity of the compound represented by formula (1) can be adjusted by adjusting the weight-average molecular weight of the compound.

[0030] From the viewpoint of the cured product having lower elasticity and superior elongation, the content of the compound represented by formula (1) is preferably 10% by mass or more, 20% by mass or more, 30% by mass or more, or 40% by mass or more, based on the total amount of the composition. The content of the compound represented by formula (1) may be 90% by mass or less, 80% by mass or less, 70% by mass or less, 60% by mass or less, or 50% by mass or less, based on the total amount of the composition.

[0031] The composition may further contain other polymerizable compounds (details of which will be described later) other than the compound represented by formula (1). In this case, the content of the compound represented by formula (1) is preferably 20 parts by mass or more, 30 parts by mass or more, or 40 parts by mass or more, based on 100 parts by mass of the total of the compound represented by formula (1) and other polymerizable compounds (hereinafter referred to as "total content of polymerizable components"). The content of the compound represented by formula (1) may be 80 parts by mass or less, 70 parts by mass or less, or 60 parts by mass or less, based on 100 parts by mass of the total content of polymerizable components.

[0032] (hollow particles) Hollow particles have an outer shell and a hollow portion. The inclusion of hollow particles in the composition improves its thermal insulation properties, making it suitable for use as a thermal insulation material. Examples of hollow particles include first hollow particles, which are thermally expandable hollow particles, and second hollow particles, which are hollow particles other than the first hollow particles. The hollow particles may include either or both of the first and second hollow particles, and preferably both the first and second hollow particles are included.

[0033] (First hollow particle) The first hollow particle is a hollow particle that expands with heat (thermally expandable). In this specification, a thermally expandable hollow particle is a hollow particle whose maximum volume expansion ratio relative to its volume at 25°C is 10 times or more. When the first hollow particle is used, in the reflow process, the first hollow particle expands with heat, reducing the adhesion area at the interface between the insulating material and the apparatus, and the composition can be easily removed after the reflow process.

[0034] The maximum volume expansion ratio of the first hollow particle is measured by thermomechanical analysis (TMA) as the ratio of the maximum volume of the first hollow particle to its volume at 25°C (maximum volume / volume at 25°C) when heated at a heating rate of 10°C / min. The maximum volume expansion ratio of the first hollow particle may be, for example, 10 times or more, 20 times or more, 30 times or more, or 40 times or more, and may be 120 times or less.

[0035] The outer shell of the first hollow particle is preferably made of a thermoplastic polymer. In this case, since the outer shell softens when heated, even if the liquid contained in the hollow part vaporizes and the internal pressure increases, the hollow particle is less likely to crack and expands easily. The thermoplastic polymer may be, for example, a polymer containing acrylonitrile, vinylidene chloride, etc. as monomer units. The thickness of the outer shell may be 2 μm or more and 15 μm or less.

[0036] The hollow portion of the first hollow particle contains, for example, a liquid. The first hollow particle is in this state under normal temperature and pressure (for example, at least atmospheric pressure and 30°C). The liquid is appropriately selected, for example, according to the heating temperature in the reflow process. The liquid is, for example, a liquid that vaporizes at a temperature below the maximum heating temperature in the reflow process. The liquid may be, for example, a hydrocarbon with a boiling point (at atmospheric pressure) of 50°C or higher, 100°C or higher, 150°C or higher, or 200°C or higher. In addition to the above liquid, the hollow portion of the first hollow particle may further contain a gas.

[0037] Examples of components contained within the hollow portion of the first hollow particle include hydrocarbons such as propane, propylene, butene, n-butane, isobutane, n-pentane, isopentane, neopentane, n-hexane, isohexane, heptane, isooctane, n-octane, isoalkanes (10-13 carbon atoms), and petroleum ether; low-boiling point compounds such as methane halides and tetraalkylsilanes; and compounds that gasify by thermal decomposition, such as azodicarbonamides.

[0038] The average particle diameter of the first hollow particle may be 5 μm or more, 10 μm or more, or 20 μm or more, and may be 50 μm or less, 40 μm or less, or 30 μm or less. The average particle diameter of the first hollow particle is measured by laser diffraction / scattering (for example, using Shimadzu Corporation's "SALD-7500nano").

[0039] From the viewpoint of making the composition more suitable for use as an insulating material in a reflow process (generally heated to 260°C), the expansion initiation temperature of the first hollow particles is preferably 70°C or higher, 100°C or higher, 130°C or higher, or 160°C or higher, and preferably 260°C or lower. The expansion initiation temperature of the first hollow particles is determined by thermomechanical analysis (TMA) at the temperature (horizontal axis)-volume change (vertical axis) profile when the temperature is raised at a heating rate of 10°C / min. The temperature at which the tangent line at the point where a volume change of 3 times or more / 5°C occurs intersects with the straight line (horizontal axis) where the volume change is zero (initial volume).

[0040] From the viewpoint of making the composition more suitable for use as an insulating material in the reflow process, the maximum expansion temperature of the first hollow particle is preferably 100°C or higher, 150°C or higher, 200°C or higher, or 220°C or higher, and preferably 290°C or lower, 280°C or lower, or 270°C or lower. The maximum expansion temperature of the first hollow particle refers to the temperature at which the volume expansion ratio is maximum when measured by thermomechanical analysis (TMA) at a heating rate of 10°C / min.

[0041] The content of the first hollow particles may be preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 8% by mass or more, 20% by mass or less, or 15% by mass or less, based on the total mass of the composition, from the viewpoint of further facilitating removal after the reflow process of the composition.

[0042] The content of the first hollow particles is preferably 1 volume% or more, more preferably 2 volume% or more, even more preferably 3 volume% or more, and particularly preferably 4 volume% or more, based on the total volume of the composition, from the viewpoint of further facilitating removal after the reflow process of the composition. For example, it may be 10 volume% or less, 7 volume% or less, or 5 volume% or less.

[0043] (Second hollow particle) The second hollow particle is any hollow particle other than the first hollow particle. Specifically, the second hollow particle is a hollow particle whose maximum volume expansion ratio at 25°C is less than 10 times its original volume. Using the second hollow particle improves the thermal insulation properties of the composition, making it suitable for use as a thermal insulation material. The maximum volume expansion ratio of the second hollow particle is measured using the same method as the maximum volume expansion ratio of the first hollow particle.

[0044] The outer shell of the second hollow particle may be composed of a polymer or an inorganic material. The outer shell is preferably composed of a polymer, and more preferably a thermoplastic polymer. In this case, the hollow particle is less likely to crack even when pressurized, can maintain its hollow structure, and can maintain its heat insulation properties. The thermoplastic polymer may be, for example, a polymer containing acrylonitrile, vinylidene chloride, etc. as monomer units. The inorganic material may be, for example, an inorganic glass such as borosilicate glass (sodium borosilicate glass, etc.), aluminosilicate glass, or glass made by compounding these. The thickness of the outer shell may be 0.005 μm or more, and may be 15 μm or less.

[0045] The hollow portion of the second hollow particle contains, for example, a gas. The second hollow particle is in this state under normal temperature and pressure conditions (for example, at least atmospheric pressure and 30°C). In addition to the gas, the hollow portion of the second hollow particle may also contain a liquid.

[0046] Examples of components enclosed within the hollow space of the second hollow particle include hydrocarbons such as propane, propylene, butene, n-butane, isobutane, n-pentane, isopentane, neopentane, n-hexane, isohexane, heptane, isooctane, n-octane, isoalkanes (10-13 carbon atoms), and petroleum ether; low-boiling point compounds such as methane halides and tetraalkylsilanes; and decomposition products of compounds that gasify by thermal decomposition, such as azodicarbonamides. Alternatively, the component enclosed within the hollow space of the second hollow particle may be air.

[0047] The average particle diameter of the second hollow particle is preferably 150 μm or less, more preferably 120 μm or less, and even more preferably 100 μm or less, and may be, for example, 5 μm or more, 10 μm or more, 20 μm or more, or 30 μm or more. The average particle diameter of the second hollow particle is measured by laser diffraction / scattering (for example, using "SALD-7500nano" manufactured by Shimadzu Corporation).

[0048] The density of the second hollow particle is 500 kg / m³. 3 Below 300kg / m 3 Below 100kg / m 3 Below 50kg / m 3 The following, or 40 kg / m 3 The following is acceptable: 10 kg / m 3 or more, or 20 kg / m 3 The above may suffice. In this specification, the density of the second hollow particle refers to the density measured by the tapping density method. That is, the second hollow particle (approximately 5 g) is placed in a 10 mL graduated cylinder, tapped 50 times, and the volume when the top surface is stable is taken as the stable volume, and the density is calculated by the following formula. Density = Initial input amount (kg) / Stabilized volume (m³) 3 )

[0049] From the viewpoint of improving the thermal insulation properties of the composition, the content of the second hollow particle is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, and may be, for example, 20% by mass or less, based on the total mass of the composition.

[0050] The content of the second type of hollow particle is preferably 50% by volume or more, more preferably 60% by volume or more, and may be, for example, 95% by volume or less, based on the total volume of the composition, from the viewpoint of improving the thermal insulation properties of the composition.

[0051] The total content of hollow particles (including the content of the first and second hollow particles) may be, for example, 5% by mass or more, 10% by mass or more, or 15% by mass or more, and may be 40% by mass or less, 30% by mass or less, or 20% by mass or less, based on the total mass of the composition.

[0052] The total content of hollow particles (including the content of the first and second hollow particles) may be, for example, 50% or more by volume, 60% or more by volume, or 70% or more by volume, and 95% or less by volume, based on the total volume of the composition.

[0053] The composition may further contain other polymerizable compounds that can copolymerize with the compound represented by formula (1) described above, for the purpose of adjusting the physical properties of the composition.

[0054] Other polymerizable compounds may be, for example, compounds having one (meth)acryloyl group. Such compounds may be, for example, alkyl (meth)acrylates. Other polymerizable compounds may also be compounds having, in addition to one (meth)acryloyl group, an aromatic hydrocarbon group, a group containing a polyoxyalkylene chain, a group containing a heterocyclic group, an alkoxy group, a phenoxy group, a group containing a silane group, a group containing a siloxane bond, a halogen atom, a hydroxyl group, a carboxyl group, an amino group, or an epoxy group. In particular, the viscosity of the composition can be adjusted by including alkyl (meth)acrylates in the composition. Furthermore, the adhesion of the composition to the insulating material can be further improved by including compounds having a hydroxyl group, a carboxyl group, an amino group, or an epoxy group in addition to the (meth)acryloyl group.

[0055] The alkyl group (the alkyl group portion other than the (meth)acryloyl group) in alkyl (meth)acrylate may be linear, branched, or alicyclic. The number of carbon atoms in the alkyl group may be, for example, 1 to 30. The number of carbon atoms in the alkyl group may be 1 to 11, 1 to 8, 1 to 6, or 1 to 4, and may also be 12 to 30, 12 to 28, 12 to 24, 12 to 22, 12 to 18, or 12 to 14.

[0056] Examples of alkyl(meth)acrylates having a linear alkyl group include methyl(meth)acrylate, ethyl(meth)acrylate, propyl(meth)acrylate, butyl(meth)acrylate, pentyl(meth)acrylate, n-hexyl(meth)acrylate, n-heptyl(meth)acrylate, octyl(meth)acrylate, nonyl(meth)acrylate, decyl(meth)acrylate, or undecyl(meth)acrylate, which are alkyl(meth)acrylates having a linear alkyl group with 1 to 11 carbon atoms. Examples of alkyl(meth)acrylates having a linear alkyl group with 12 to 30 carbon atoms include syl(meth)acrylate (lauryl(meth)acrylate), tetradecyl(meth)acrylate, hexadecyl(meth)acrylate (cetyl(meth)acrylate), octadecyl(meth)acrylate (stearyl(meth)acrylate), docosyl(meth)acrylate (behenyl(meth)acrylate), tetracosyl(meth)acrylate, hexacosyl(meth)acrylate, and octacosyl(meth)acrylate.

[0057] Examples of alkyl(meth)acrylates having branched alkyl groups include s-butyl(meth)acrylate, t-butyl(meth)acrylate, isobutyl(meth)acrylate, isopentyl(meth)acrylate, isoamyl(meth)acrylate, isooctyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, isononyl(meth)acrylate, isodecyl(meth)acrylate, and other alkyl(meth)acrylates having branched alkyl groups with 1 to 11 carbon atoms, as well as isomiristyl Examples of alkyl(meth)acrylates having branched alkyl groups with 12 to 30 carbon atoms include 12-30 carbon atoms, such as 14-(meth)acrylate, 2-propylheptyl(meth)acrylate, isoundecyl(meth)acrylate, isododecyl(meth)acrylate, isotridecyl(meth)acrylate, isopentadecyl(meth)acrylate, isohexadecyl(meth)acrylate, isoheptadecyl(meth)acrylate, isostearyl(meth)acrylate, and decyltetradecanyl(meth)acrylate.

[0058] Examples of alkyl (meth)acrylates having an alicyclic alkyl group (cycloalkyl group) include cyclohexyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, isobornyl (meth)acrylate, terpene (meth)acrylate, and dicyclopentanyl (meth)acrylate.

[0059] Examples of compounds having a (meth)acryloyl group and an aromatic hydrocarbon group include benzyl (meth)acrylate.

[0060] Examples of compounds having a (meth)acryloyl group and a group containing a polyoxyalkylene chain include polyethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, polybutylene glycol (meth)acrylate, and methoxypolybutylene glycol (meth)acrylate.

[0061] Examples of compounds having a (meth)acryloyl group and a heterocyclic group include tetrahydrofurfuryl (meth)acrylate.

[0062] Examples of compounds having a (meth)acryloyl group and an alkoxy group include 2-methoxyethyl acrylate.

[0063] Examples of compounds having a (meth)acryloyl group and a phenoxy group include phenoxyethyl (meth)acrylate.

[0064] Examples of compounds having groups containing a (meth)acryloyl group and a silane group include 3-acryloxypropyltriethoxysilane, 10-methacryloyloxydecyltrimethoxysilane, 10-acryloyloxydecyltrimethoxysilane, 10-methacryloyloxydecyltriethoxysilane, and 10-acryloyloxydecyltriethoxysilane.

[0065] Examples of compounds having a (meth)acryloyl group and a group containing a siloxane bond include silicone (meth)acrylates.

[0066] Compounds having a (meth)acryloyl group and a halogen atom include trifluoromethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 1,1,1,3,3,3-hexafluoro-2-propyl (meth)acrylate, perfluoroethylmethyl (meth)acrylate, perfluoropropylmethyl (meth)acrylate, perfluorobutylmethyl (meth)acrylate, perfluoropentylmethyl (meth)acrylate, perfluorohexylmethyl (meth)acrylate, perfluoroheptylmethyl (meth)acrylate, perfluorooctylmethyl (meth)acrylate, perfluorononylmethyl (meth)acrylate, perfluorodecylmethyl (meth)acrylate, perfluoroundecylmethyl (meth)acrylate, perfluorododecylmethyl (meth)acrylate, perfluoro Examples include (meth)acrylates containing a fluorine atom, such as tridecylmethyl (meth)acrylate, perfluorotetradecylmethyl (meth)acrylate, 2-(trifluoromethyl)ethyl (meth)acrylate, 2-(perfluoroethyl)ethyl (meth)acrylate, 2-(perfluoropropyl)ethyl (meth)acrylate, 2-(perfluorobutyl)ethyl (meth)acrylate, 2-(perfluoropentyl)ethyl (meth)acrylate, 2-(perfluorohexyl)ethyl (meth)acrylate, 2-(perfluoroheptyl)ethyl (meth)acrylate, 2-(perfluorooctyl)ethyl (meth)acrylate, 2-(perfluorononyl)ethyl (meth)acrylate, 2-(perfluorotridecyl)ethyl (meth)acrylate, and 2-(perfluorotetradecyl)ethyl (meth)acrylate.

[0067] Examples of compounds having a (meth)acryloyl group and a hydroxyl group include hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, and 12-hydroxylauryl (meth)acrylate; and hydroxyalkylcycloalkane (meth)acrylates such as (4-hydroxymethylcyclohexyl)methyl (meth)acrylate.

[0068] Examples of compounds having a (meth)acryloyl group and a carboxyl group include (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, monohydroxyethyl phthalate acrylate (e.g., "Aronics M5400" manufactured by Toagosei Co., Ltd.), and 2-acryloyloxyethyl succinate (e.g., "NK Ester A-SA" manufactured by Shin Nakamura Chemical Co., Ltd.).

[0069] Examples of compounds having a (meth)acryloyl group and an amino group include N,N-dimethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, and N,N-diethylaminopropyl (meth)acrylate.

[0070] Examples of compounds having a (meth)acryloyl group and an epoxy group include glycidyl (meth)acrylate, α-ethyl(meth)acrylate, α-n-propyl(meth)acrylate, α-n-butyl(meth)acrylate, glycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 4,5-epoxypentyl (meth)acrylate, 6,7-epoxyheptyl (meth)acrylate, α-ethyl(meth)acrylate, 6,7-epoxyheptyl (meth)acrylate, 3-methyl-3,4-epoxybutyl (meth)acrylate, 4-methyl-4,5-epoxypentyl (meth)acrylate, 5-methyl-5,6-epoxyhexyl (meth)acrylate, β-methylglycidyl (meth)acrylate, and α-ethyl(meth)acrylate-β-methylglycidyl.

[0071] The composition may contain, in addition to the compound represented by formula (1), one of the other polymerizable compounds mentioned above, or two or more of them.

[0072] The content of other polymerizable compounds other than the compound represented by formula (1) may be, for example, 1% by mass or more, 5% by mass or more, 10% by mass or more, 20% by mass or more, or 30% by mass or more, based on the total amount of the composition, and may be 60% by mass or less, 50% by mass or less, or 40% by mass or less.

[0073] The polymerizable compound content (total content of the compound represented by formula (1) and other polymerizable compounds) may be, for example, 40% by mass or more, 50% by mass or more, 60% by mass or more, or 70% by mass or more, based on the total amount of the composition, and may be 95% by mass or less, or 90% by mass or less.

[0074] The composition may further contain a polymerization initiator. The polymerization initiator may be, for example, a thermal polymerization initiator that generates radicals by heat, or a photopolymerization initiator that generates radicals by light. The polymerization initiator is preferably a thermal polymerization initiator.

[0075] If the composition contains a thermal polymerization initiator, a cured product of the composition can be obtained by applying heat to the composition. In this case, the composition may be cured by heating preferably at 105°C or higher, more preferably at 110°C or higher, and even more preferably at 115°C or higher, and may also be a composition cured by heating at, for example, 200°C or lower, 190°C or lower, or 180°C or lower. The heating time when heating the composition may be appropriately selected according to the composition of the composition so that the composition cures suitably.

[0076] Examples of thermal polymerization initiators include azo compounds such as azobisisobutyronitrile, azobis-4-methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1-carbonitride, and azodibenzoyl; and organic peroxides such as benzoyl peroxide, lauroyl peroxide, di-t-butyl peroxide, di-t-hexyl peroxide, di-t-butyl peroxyhexahydroterephthalate, t-butyl peroxy-2-ethylhexanoate, 1,1-t-butyl peroxy-3,3,5-trimethylcyclohexane, and t-butylperoxyisopropyl carbonate. These thermal polymerization initiators may be used individually or in combination of two or more.

[0077] If the composition contains a photopolymerization initiator, a cured product of the composition can be obtained by irradiating the composition with light (for example, light containing at least some wavelengths between 200 and 400 nm (ultraviolet light)). The conditions for light irradiation may be appropriately set depending on the type of photopolymerization initiator.

[0078] The photopolymerization initiator may be, for example, a benzoin ether-based photopolymerization initiator, an acetophenone-based photopolymerization initiator, an α-ketol-based photopolymerization initiator, an aromatic sulfonyl chloride-based photopolymerization initiator, a photoactive oxime-based photopolymerization initiator, a benzoin-based photopolymerization initiator, a benzyl-based photopolymerization initiator, a benzophenone-based photopolymerization initiator, a ketal-based photopolymerization initiator, a thioxanthone-based photopolymerization initiator, an acylphosphine oxide-based photopolymerization initiator, or the like.

[0079] Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethane-1-one (e.g., BASF's "Irgacure 651"), and anisole methyl ether. Examples of acetophenone-based photopolymerization initiators include 1-hydroxycyclohexyl phenyl ketone (e.g., BASF's "Irgacure 184"), 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one (e.g., BASF's "Irgacure 2959"), 2-hydroxy-2-methyl-1-phenyl-propan-1-one (e.g., BASF's "Irgacure 1173"), and methoxyacetophenone.

[0080] Examples of α-ketol-based photopolymerization initiators include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)-phenyl]-2-hydroxy-2-methylpropan-1-one. Examples of aromatic sulfonyl chloride-based photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime.

[0081] Examples of benzoin-based photopolymerization initiators include benzoin. Examples of benzyl-based photopolymerization initiators include benzyl. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, α-hydroxycyclohexylphenyl ketone. Examples of ketal-based photopolymerization initiators include benzyldimethylketal. Examples of thioxanthone-based photopolymerization initiators include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, dodecylthioxanthone, etc.

[0082] Examples of acylphosphine-based photopolymerization initiators include bis(2,6-dimethoxybenzoyl)phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)(2,4,4-trimethylpentyl)phosphine oxide, bis(2,6-dimethoxybenzoyl)-n-butylphosphine oxide, bis(2,6-dimethoxybenzoyl)-(2-methylpropan-1-yl)phosphine oxide, bis(2,6-dimethoxybenzoyl)-(1-methylpropan-1-yl)phosphine oxide, and bis(2,6-dimethoxybenzoyl)-t-butylphosphine oxide. Tylphosphine oxide, bis(2,6-dimethoxybenzoyl)cyclohexylphosphine oxide, bis(2,6-dimethoxybenzoyl)octylphosphine oxide, bis(2-methoxybenzoyl)(2-methylpropan-1-yl)phosphine oxide, bis(2-methoxybenzoyl)(1-methylpropan-1-yl)phosphine oxide, bis(2,6-diethoxybenzoyl)(2-methylpropan-1-yl)phosphine oxide, bis(2,6-diethoxybenzoyl)(1-methylpropan-1-yl)phosphine Oxide, bis(2,6-dibutoxybenzoyl)(2-methylpropan-1-yl)phosphine oxide, bis(2,4-dimethoxybenzoyl)(2-methylpropan-1-yl)phosphine oxide, bis(2,4,6-trimethylbenzoyl)(2,4-dipentoxyphenyl)phosphine oxide, bis(2,6-dimethoxybenzoyl)benzylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2-phenylpropylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2-phenylethylphosphine oxide Catalyst, 2,6-dimethoxybenzoylbenzylbutylphosphine oxide, 2,6-dimethoxybenzoylbenzyloctylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-2,5-diisopropylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-2-methylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-4-methylphenylphosphine oxide, bis(2,4,Examples include 6-trimethylbenzoyl)-2,3,5,6-tetramethylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-2,4-di-n-butoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, bis(2,4,6-trimethylbenzoyl)isobutylphosphine oxide, 2,6-dimethitoxybenzoyl-2,4,6-trimethylbenzoyl-n-butylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-2,4-dibutoxyphenylphosphine oxide, 1,10-bis[bis(2,4,6-trimethylbenzoyl)phosphine oxide]decane, tri(2-methylbenzoyl)phosphine oxide, etc.

[0083] The photopolymerization initiators described above may be used individually or in combination of two or more.

[0084] From the viewpoint of ensuring favorable polymerization, the content of the polymerization initiator is preferably 0.01 parts by mass or more, more preferably 0.02 parts by mass or more, and even more preferably 0.05 parts by mass or more, based on 100 parts by mass of the total content of polymerizable components. From the viewpoint of ensuring that the molecular weight of the polymer in the cured product of the composition is within a suitable range and suppressing decomposition products, the content of the polymerization initiator is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, even more preferably 3 parts by mass or less, and particularly preferably 1 part by mass or less, based on 100 parts by mass of the total content of polymerizable components.

[0085] The composition may contain a plasticizer as an additive. The inclusion of a plasticizer in the composition can further enhance the adhesion of the composition and the elongation of the cured product. Examples of plasticizers include tackifiers such as butadiene rubber, isoprene rubber, silicone rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, ethylene propylene rubber, urethane rubber, acrylic resin, rosin-based resin, terpene-based resin, or polyalkylene glycol. The content of the plasticizer may be 0.1 parts by mass or more, 1 part by mass or more, or 3 parts by mass or more, and may be 20 parts by mass or less, 15 parts by mass or less, 12 parts by mass or less, or 10 parts by mass or less, based on 100 parts by mass of the total content of polymerizable components.

[0086] The composition may further contain other additives as needed. Examples of other additives include antioxidants, surface treatment agents (e.g., silane coupling agents), dispersants, curing accelerators, colorants, nucleating agents, heat stabilizers, foaming agents, flame retardants, vibration dampers, dehydrating agents, and flame retardant aids (e.g., metal oxides). The content of other additives may be 0.1% by mass or more and 30% by mass or less based on the total amount of the composition.

[0087] The composition is preferably liquid at 25°C. This allows it to be suitably applied to the surface of objects such as non-volatile semiconductor memory devices, and also improves adhesion to the applied surface. The composition may also be solid at 25°C, in which case it is preferable to become liquid by heating (for example, at 50°C or higher). The composition can be applied in a liquid state and then cured, which can suppress dripping and pump-out phenomena.

[0088] [Composition Set] The compositions described above may also be in the form of a multi-liquid composition (composition set). One embodiment of the composition set comprises a first liquid containing an oxidizing agent and a second liquid containing a reducing agent. At least one of the first and second liquids contains the compound represented by formula (1) described above. At least one of the first and second liquids also contains the hollow particles described above. By mixing the first and second liquids, the oxidizing agent and the reducing agent react to generate free radicals, and polymerization of the polymerizable component proceeds. According to the composition set of this embodiment, by mixing the first and second liquids, a cured product of the mixture of the first and second liquids is immediately obtained. That is, with the composition set, a cured product of the composition can be obtained at a rapid rate.

[0089] Preferably, the composition set contains an oxidizing agent, a polymerizable compound represented by formula (1), and hollow particles, and the second liquid contains a reducing agent, a polymerizable compound represented by formula (1), and hollow particles.

[0090] The content of the compound represented by formula (1), based on the total amount of liquids constituting the composition set (for example, the total amount of the first and second liquids in the case of a two-component composition set), may be the same as the range of the content of the compound represented by formula (1), based on the total amount of the composition described above. The same applies to the content of hollow particles contained in the composition set.

[0091] The oxidizing agent contained in the first solution acts as a polymerization initiator (radical polymerization initiator). The oxidizing agent may be, for example, an organic peroxide or an azo compound. Examples of organic peroxides include hydroperoxides, peroxydicarbonates, peroxyesters, peroxyketals, dialkylperoxides, diacylperoxides, etc. Examples of azo compounds include AIBN (2,2'-azobisisobutyronitrile) and V-65 (azobisdimethylvaleronitrile). The oxidizing agent can be used alone or in combination of two or more types.

[0092] Examples of hydroperoxides include diisopropylbenzene hydroperoxide and cumene hydroperoxide.

[0093] Examples of peroxydicarbonates include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis(4-t-butylcyclohexyl)peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, di(2-ethylhexylperoxy)dicarbonate, dimethoxybutyl peroxydicarbonate, and di(3-methyl-3-methoxybutylperoxy)dicarbonate.

[0094] Examples of peroxyesters include cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxyneodecanoate, t-hexyl peroxyneodecanoate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane, and 1-cyclohexyl-1-methylethyl peroxy Examples include t-2-ethylhexanate, t-hexylperoxy-2-ethylhexanate, t-butylperoxy-2-ethylhexanate, t-butylperoxyisobutyrate, 1,1-bis(t-butylperoxy)cyclohexane, t-butylperoxy-3,5,5-trimethylhexanate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di(m-toluylperoxy)hexane, t-hexylperoxybenzoate, and t-butylperoxyacetate.

[0095] Examples of peroxyketals include 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(t-hexylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(t-butylperoxy)cyclododecane, and 2,2-bis(t-butylperoxy)decane.

[0096] Examples of dialkyl peroxides include α,α'-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, and t-butylcumyl peroxide.

[0097] Examples of diacyl peroxides include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, benzoyl peroxytoluene, and benzoyl peroxide.

[0098] From the viewpoint of storage stability, the oxidizing agent is preferably a peroxide, more preferably a hydroperoxide, and even more preferably cumene hydroperoxide.

[0099] The oxidizing agent content may be 0.1% by mass or more, 0.5% by mass or more, or 1% by mass or more, and may be 10% by mass or less, 5% by mass or less, or 3% by mass or less, based on the total amount of liquid constituting the composition set.

[0100] The reducing agent contained in the second solution may be, for example, a tertiary amine, a thiourea derivative, or a transition metal salt. Examples of tertiary amines include triethylamine, tripropylamine, tributylamine, and N,N-dimethylparatoluidine. Examples of thiourea derivatives include 2-mercaptobenzimidazole, methylthiourea, dibutylthiourea, tetramethylthiourea, and ethylenethiourea. Examples of transition metal salts include cobalt naphthenate, copper naphthenate, and vanadylacetylacetonate. The reducing agent can be used individually or in combination of two or more types.

[0101] From the viewpoint of excellent curing speed, the reducing agent is preferably a thiourea derivative or a transition metal salt. The thiourea derivative may be, for example, ethylenethiourea. From a similar viewpoint, the transition metal salt is preferably vanadylacetylacetonate.

[0102] The reducing agent content may be 0.05% by mass or more, 0.1% by mass or more, or 0.3% by mass or more, and may be 5% by mass or less, 3% by mass or less, or 1% by mass or less, based on the total amount of liquid constituting the composition set.

[0103] The composition set may further contain other polymerizable compounds and additives that can be used in the composition described above. These components may be contained in one or both of the first and second liquids, or in a third liquid different from the first and second liquids. The content of these components relative to the total volume of the liquids constituting the composition set may be in the same range as the content of these components relative to the total volume of the composition described above.

[0104] [Sheet] A sheet according to one embodiment includes a cured product of the composition described above, or a cured product of a mixture of the composition set.

[0105] The sheet of this embodiment can be obtained, for example, by allowing polymerization of polymerizable components in the above-described composition or composition set to proceed and then curing it.

[0106] The thickness of the sheet is not particularly limited; for example, it may be 200 μm or more and 2000 μm or less. [Examples]

[0107] The present invention will be described in more detail below based on examples, but the present invention is not limited in any way to these examples.

[0108] The following components were used in the examples and comparative examples. (The compound represented by formula (1)) A: A mixture of compounds represented by the following formulas (1-5) synthesized by the procedure shown below (weight-average molecular weight: 15000, where m1+m2 in formula (1-5) is approximately 252±5 and n1+n2 is approximately 63±5 integers (where m1, m2, n1, and n2 are each integers of 2 or greater, and m1+n1≧100, m2+n2≧100), viscosity at 25℃: 50 Pa·s) [ka] [In equations (1-5), -r- represents random copolymerization.]

[0109] (A compound that has two acryloyl groups but no polyoxyalkylene chains) a: Modified epoxy acrylate (EBECRYL 3708, manufactured by Daicel Ornex Co., Ltd.)

[0110] (First hollow particle) B-1: Matsumoto Oil & Fat Pharmaceutical Co., Ltd.'s "Matsumoto Microsphere (registered trademark) F-190SSD" (average particle size: 10-15 μm, maximum volume expansion ratio: 50 times or more, expansion start temperature: 155-165°C, maximum expansion temperature: 210-220°C) B-2: Matsumoto Oil & Fat Pharmaceutical Co., Ltd.'s "Matsumoto Microsphere (registered trademark) F-190D" (average particle size: 30-40 μm, maximum volume expansion ratio: 50 times or more, expansion start temperature: 160-170°C, maximum expansion temperature: 210-220°C) B-3: "D-210D" manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd. (Average particle size: 35-40 μm, Maximum volume expansion ratio: 50 times or more, Expansion start temperature: 200-210°C, Maximum expansion temperature: 220-230°C) B-4: Matsumoto Oil & Fat Pharmaceutical Co., Ltd.'s "Matsumoto Microsphere (registered trademark) F-230D" (average particle size: 20-35 μm, maximum volume expansion ratio: 50 times or more, expansion start temperature: 180-190°C, maximum expansion temperature: 220-240°C) B-5: Matsumoto Oil & Fat Pharmaceutical Co., Ltd.'s "Matsumoto Microsphere (registered trademark) F-260D" (average particle size: 20-35 μm, maximum volume expansion ratio: 50 times or more, expansion start temperature: 190-200°C, maximum expansion temperature: 250-260°C)

[0111] (Second hollow particle) C-1: Nippon Philite Co., Ltd. "Expancel (registered trademark) 920DE80d30" (average particle size 60-90 μm, density 30 ± 3 kg / m³) 3 (Maximum volume expansion ratio: less than 5 times) C-2: Hollow glass beads "Q-CEL(registered trademark) 5020" manufactured by Potters Barotini Co., Ltd. (particle size 5-110 μm, density 200 kg / m³) 3 (Maximum volume expansion ratio: less than 5 times)

[0112] (Other polymerizable compounds) D-1: Dicyclopentanyl acrylate (Funcryl® FA-513A, manufactured by Showa Denko Materials Co., Ltd.) D-2: 4-Hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.)

[0113] (Other ingredients) E: Polymerization initiator ("Perbutyl® O" manufactured by NOF Corporation) F: Phenolic antioxidant (ADEKA Corporation's "ADEKA Stab (registered trademark) AO-80") G: Surface conditioning agent (BYK Co., Ltd.'s "BYK® 350")

[0114] [Synthesis of compounds represented by formulas (1-5)] A 500 mL flask, consisting of a stirrer, thermometer, nitrogen gas inlet tube, outlet tube, and heating jacket, was used as the reactor. 225 g of glycol having polyoxyalkylene chains (Sanyo Chemical Industries, Ltd. "Newpol 75H-90000") and 300 g of toluene were added to the reactor and stirred at 45°C and a stirring speed of 250 revolutions / minute. Nitrogen was supplied at 100 mL / min and stirred for 30 minutes. The temperature was then lowered to 25°C, and after cooling was complete, 2.9 g of acryloyl chloride was added dropwise to the reactor and stirred for 30 minutes. Then, 3.8 g of triethylamine was added dropwise and stirred for 2 hours. The temperature was then raised to 45°C and the reaction was carried out for 2 hours. The reaction mixture was filtered, and the filtrate was desoluble to obtain the compound represented by formula (1-5).

[0115] [Preparation of composition and sheet] The components were mixed according to the mixing ratios shown in Table 1 to obtain the compositions. Next, two substrates were prepared by placing a release-treated PET sheet (Toyobo Co., Ltd. "A31") with the release-treated side facing upwards on a glass plate. A 10cm × 15cm × 1.0mm silicone rubber mold was placed on the PET sheet of one substrate, and the composition was filled inside the mold. Furthermore, the release-treated side of the PET sheet of the other substrate was placed facing the composition, and the other substrate was used as a lid. The mixture was then heated at 135°C for 15 minutes to cure the composition. This obtained cured sheets (1.0mm thick) of the compositions according to Examples 1 to 12 and Comparative Example 1.

[0116] [Measurement of thermal conductivity] The fabricated sheet was sandwiched between two PET sheets, cut to 8cm x 13cm x 1.0mm, and then sandwiched between a reference plate and a measuring probe. The thermal conductivity was measured at 25°C using a rapid thermal conductivity meter (Kyoto Electronics Manufacturing Co., Ltd. "QTM-710", measuring probe PD-11N, thin film measurement mode). For the reference, two sheets of release-treated PET (Toyobo Co., Ltd. "A31") were stacked and sandwiched between the reference plate and measuring probe for measurement.

[0117] [Measurement of elongation at break and tensile modulus] The elongation at break and tensile modulus at 25°C were measured for sheets containing each cured material using a tensile testing machine ("Autograph EZ-TEST EZS" manufactured by Shimadzu Corporation). For the measurements, a cured material with dimensions of 0.2 mm (film thickness) × 5 mm (width) × 30 mm (length) was measured in accordance with JIS K7161 under conditions of a chuck distance of 20 mm and a tensile speed of 5 mm / min.

[0118] [Measuring Adhesion] After attaching the prepared sheet to a glass slide and letting it stand for at least 15 minutes, [1] Unheated at room temperature (20-25°C) [2] After heating at 220°C for 120 seconds and then cooling to room temperature, [3] After heating at 260°C for 30 seconds, the state after cooling to room temperature. Three types of samples were prepared. For each of these samples, the adhesive strength was measured using Shimadzu Corporation's "EZ Test EZ-S" (90° peel, tensile speed: 50 mm / min).

[0119] Table 1 shows the measurement results for each physical property of the sheets from Examples 1 to 12 and Comparative Example 1. In Table 1, the notation "≧200" (N / m) for adhesive strength indicates that the sheet failed to peel off due to cohesive failure when attempted.

[0120] [Table 1]

[0121] As described above, the sheets of Examples 1 to 12 had low elasticity and excellent stretchability. Furthermore, the sheets of Examples 2 to 11 were found to have [2] high adhesive strength when heated at 220°C for 120 seconds and then cooled to room temperature, allowing them to adhere well to the equipment during the reflow process, and [3] low adhesive strength when heated at 260°C for 30 seconds and then cooled to room temperature, allowing them to be easily removed after the reflow process.

Claims

1. Compounds represented by the following formulas (1-4), A composition containing hollow particles. 【Chemistry 1】 [In formula (1-4), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, R 14 and R 15 each independently represent an alkylene group having 2 to 5 carbon atoms, k1, k2 and k3 each independently represent an integer of 2 or more, and any multiple R 14 and R 15 may be identical or different from each other.]

2. The composition according to claim 1, wherein at least one of the polyoxyalkylene chain represented by (R 14 O) k1 and the polyoxyalkylene chain represented by (R 15 O) k3 contains an oxyethylene group.

3. The composition according to claim 1, wherein at least one of the polyoxyalkylene chain represented by (R 14 O) k1 and the polyoxyalkylene chain represented by (R 15 O) k3 contains an oxypropylene group.

4. The composition according to claim 1, wherein at least one of the polyoxyalkylene chain represented by (R 14 O) k1 and the polyoxyalkylene chain represented by (R 15 O) k3 is a copolymer chain containing an oxyethylene group and an oxypropylene group.

5. The composition according to claim 4, wherein the copolymer chain is a random copolymer chain.

6. A compound represented by the following formula (1), It contains hollow particles and The hollow particle is, The first hollow particle is a thermally expandable hollow particle, A second hollow particle, which is a hollow particle other than the first hollow particle, A composition containing the following: 【Chemistry 2】 [In formula (1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 13 represents a divalent group having a methylene chain in addition to a polyoxyalkylene chain.]

7. A sheet comprising a cured product of the composition according to any one of claims 1 to 6.

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