Internal recirculation cooling module

Abstract

Improved cooling modules and methods are configured to recirculate liquid cooling fluid within the cooling module such that the same liquid cooling fluid impinges on the surface of a heat-generating electronic component (or a cooling plate in thermal communication with the heat-generating electronic component) multiple times before exiting the cooling module, thereby allowing a given flow of cooling fluid to be reused multiple times, each time reducing flow demands and reducing the infrastructure required to achieve higher performance in direct and indirect micro-convection impingement cooling applications.

Description

Technical Field

[0001] Field of the Invention The present invention generally relates to the field of liquid cooling modules for data centers, servers, power converters, and other liquid-cooled modular computing assemblies, and more particularly to micro-convective jet impingement liquid cooling devices and methods.

Background Art

[0002] Related Art The cooling performance of single-phase direct chip liquid cooling (DLC) devices is typically measured by the heat transfer rate. Impingement cooling modules provide extremely high local heat transfer rates. The performance of cooling modules that utilize impingement cooling is determined by both the flow rate and the pressure loss. Compared to other more established cooling technologies (e.g., microchannels), impingement cooling performs optimally when the flow rate of the cooling module is two to four times higher than that of established cooling technologies. Employing an impingement cooling module has inherent advantages such as a more uniform temperature distribution of the processor and no thermal resistance, even when the relatively high flow rate consumption is large.

[0003] However, existing cooling infrastructures in certain application fields may not be able to accommodate a two- to four-fold increase in flow rate. Therefore, in such environments, the highest performance of the jet impingement cooling module cannot be achieved. Thus, it would be beneficial for the jet impingement module to have the ability to reduce the required flow rate and ensure more optimal impingement performance even at low flow rates.

Summary of the Invention

Means for Solving the Problems

[0004] Summary of the Invention Embodiments of the present invention improve cooling modules and methods for cooling heat-generating electronic components mounted on printed circuit boards found in servers and other data processing devices. The improved cooling module and method are configured to recirculate a liquid cooling fluid within the cooling module such that the same liquid cooling fluid collides multiple times with the surface of the heat-generating electronic component (or a cooling plate thermally communicating with the heat-generating electronic component) before leaving the cooling module, thereby enabling the reuse of a given flow of cooling fluid multiple times. Each time the cooling fluid is reused, the flow rate demand decreases. For example, a single recirculation of the cooling fluid in a cooling module constructed and operating according to the devices and techniques described herein typically reduces the required flow rate of the cooling module by about 50% without significantly reducing cooling performance. Recirculating the cooling fluid three times within the cooling module typically reduces the required flow rate by 67%, and so on. Beneficially, the internal recirculation implemented according to the present invention does not increase the number of external seals required, suppresses pressure loss during internal flow diversion, and allows for prioritization of priority cooling areas on the chipset through proper staging of collision areas within the cooling module.

[0005] Generally, embodiments of the present invention reduce the flow rate demand of a cooling module by performing internal recirculation of the liquid cooling fluid within the cooling module so that the liquid cooling fluid collides with the surface being cooled multiple times before leaving the cooling module. Internal recirculation allows the discharged fluid from a given section within the cooling module to be sent to the inlet of a second section without having to leave the housing of the cooling module. This technique of efficiently recovering and resending the cooling fluid that has already collided with the cooling surface allows the majority of the liquid cooling fluid to remain within the main external seal boundary of the cooling module for a longer period of time while still being able to effectively utilize its cooling capacity. Thus, the advantages of using embodiments of the present invention include, but are not limited to, the following: 1) The cooling fluid can be reused multiple times, significantly reducing flow rate requirements. 2) To minimize pressure loss in the flow division, efficiently deliver the cooling fluid. 3) Avoid the addition of external seal failure points and pressure loss that occurs when the cooling fluid is recirculated externally.

[0006] The cooling fluid passing through a cooling module constructed and operating according to embodiments of the present invention is re-delivered internally multiple times after impact so that it can be "reused" multiple times to cool multiple sections of the cooling surface. The cooling fluid is also accelerated multiple times against the surface being cooled using a micro-convection nozzle array. However, instead of being discharged from the cooling module after a single impact, the cooling fluid is re-captured and re-accelerated through further micro-convection nozzle arrays in one or more further stages. The flow rate is reduced by connecting multiple different section micro-convection nozzle arrays in series. In some embodiments, multiple different section nozzle arrays may be connected in series and in parallel with one another.

[0007] The devices and techniques disclosed herein can be implemented in both direct and indirect cooling modules. Direct cooling modules involve applying a coolant directly to the surface of a heat source to induce heat conduction. Indirect cooling modules involve applying a coolant to a plate that is part of the cooling module, causing the plate to come into thermal contact with the heat source to induce heat conduction.

[0008] In one embodiment, the present invention provides a cooling module comprising a jet plate, a housing, a ceiling between the jet plate and the housing, a base plate, a fastening system, and a fastening system for attaching the cooling module to a circuit board (or server) containing heat-generating electronic components. The jet plate has an upper surface, a lower surface, a first segment including a first microjet nozzle array extending through the jet plate from the upper surface to the lower surface, and a second segment including a second microjet nozzle array extending through the jet plate from the upper surface to the lower surface. The ceiling positioned between the jet plate and the housing comprises a first ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate, and a second ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate. The base plate comprises a cooling surface, a first cooling surface mounting boundary extending from the cooling surface to the lower surface of the jet plate, and a second cooling surface mounting boundary extending from the cooling surface to the lower surface of the jet plate.

[0009] The jet plate, ceiling, base plate cooling surface, first ceiling mounting boundary, second ceiling mounting boundary, first cooling surface mounting boundary, and second cooling surface mounting boundary are all arranged to define a first inlet plenum located between the ceiling and the first microjet nozzle array, a second inlet plenum located between the ceiling and the second microjet nozzle array, a first impact space located between the first microjet nozzle array and the cooling surface, a second impact space located between the second microjet nozzle array and the cooling surface, and a first cooch passage that fluidly connects the first impact space to the second inlet plenum.

[0010] A fastening system (which may include, for example, screws, pins, or tensioner plates) attaches a cooling module to a circuit board, on which one or more heat-generating electronic components are mounted. In one embodiment, the fastening system attaches the cooling module to the circuit board such that the cooling surface of the base plate is in direct thermal communication with one or more heat-generating electronic components on the circuit board. In this configuration, the cooling surface of the base plate can absorb the heat generated by the heat-generating electronic components during the operation of the circuit board.

[0011] The cooling module also includes an inlet fitting mounted on the housing, which is configured to introduce pressurized cooling fluid supplied from an external source such as an external pump or a central distribution unit (CDU) into the cooling module. An inlet flow channel inside the cooling module carries the pressurized cooling fluid from the inlet fitting to a first inlet plenum. Once the pressurized cooling fluid enters the first inlet plenum, a first microjet nozzle array in a first segment of the jet plate receives the pressurized cooling fluid from the first inlet plenum, accelerates the pressurized cooling fluid, and in doing so, directs the accelerated pressurized cooling fluid into a first impact space below the jet plate at high speed, causing it to impact a first portion of the cooling surface of the base plate, thereby removing the heat absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components.

[0012] At this time, the coot passage is configured to transport a portion of the pressurized cooling fluid that has impacted the first portion of the cooling surface from the first impact space into the second inlet plenum. Next, a second microjet nozzle array in the jet plate draws the pressurized cooling fluid from the second inlet plenum, accelerates the pressurized cooling fluid, and guides the accelerated pressurized cooling fluid into the second impact space at high speed, causing it to impact the second portion of the cooling surface of the base plate, thereby removing the heat absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

[0013] In a preferred embodiment, the cooling module of the present invention also includes one or more waste recovery passages that capture a portion of the pressurized cooling fluid in the first and second impact spaces and send the captured pressurized cooling fluid to an outlet fitting attached to the housing for discharge from the cooling module.

[0014] In particular, the ceiling may or may not be manufactured as an integral part of the housing. In some embodiments, the cooling module of the present invention may include an intervening plate positioned between the housing and the jet plate, and the ceiling is integrated with the intervening plate instead of the housing.

[0015] In another embodiment, the base plate of the cooling module has an opening on its underside instead of a cooling surface, so that the cooling fluid accelerated by the microjet array in the jet plate can directly impact the surface of the heat-generating electronic component multiple times, instead of impacting a cooling surface that is in thermal contact with the heat-generating electronic component. After the first impact, the cooling fluid is then carried by a cooch passage to a downstream inlet plenum, where it is accelerated and guided by a second (third or fourth) microjet nozzle array in the jet plate to make a second (third or fourth) direct impact on other parts of the heat-generating object.

[0016] In yet another embodiment, a method is provided for cooling one or more heat-generating electronic components mounted on a circuit board. Step 1 of the method is to provide a cooling module comprising a jet plate, a housing, a ceiling positioned between the jet plate and the housing, a base plate having a cooling surface, and a fastening system for fastening the cooling module to a circuit board. In this step, the jet plate comprises a first segment including a first array of microjet nozzles extending through the jet plate, and a second segment including a second array of microjet nozzles extending through the jet plate. The jet plate, ceiling, base plate cooling surface, first ceiling mounting boundary, second ceiling mounting boundary, first cooling surface mounting boundary, and second cooling surface mounting boundary are all arranged to define a first inlet plenum located between the ceiling and the first microjet nozzle array, a second inlet plenum located between the ceiling and the second microjet nozzle array, a first impact space located between the first microjet nozzle array and the cooling surface, a second impact space located between the second microjet nozzle array and the cooling surface, and a first cooch passage that fluidly connects the first impact space to the second inlet plenum.

[0017] Step 2 is to attach the cooling module to the circuit board using a fastening system such that the cooling surface of the base plate is in thermal communication with the one or more heat-generating electronic components on the circuit board and absorbs the heat generated by the one or more heat-generating electronic components during the operation of the circuit board. Step 3 of the method is to connect an external source of pressurized cooling fluid to the inlet port of the housing of the cooling module. Step 4 is to send the pressurized cooling fluid received at the inlet port to the first inlet plenum of the jet plate.

[0018] In step 5, a first microjet nozzle array in the first segment of the jet plate receives pressurized cooling fluid from the first inlet plenum, accelerates the pressurized cooling fluid, and directs the accelerated pressurized cooling fluid into the first impact space at high speed, causing it to impact the first portion of the cooling surface of the base plate, thereby removing the heat absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components. Typically, but not always, the coolant exits through the boundary of the impact space. In step 6, a cooch passage in the cooling module directs at least a portion of the pressurized cooling fluid that has impacted the first portion of the cooling surface from the first impact space to the second inlet plenum. Finally, in step 6, a second array of microjet nozzles in the jet plate receives pressurized cooling fluid from the second inlet plenum, accelerates the pressurized cooling fluid, and then guides the accelerated pressurized cooling fluid into the second impact space at high speed, causing it to impact the second portion of the cooling surface of the base plate without allowing it to escape the cooling module before entering the second inlet plenum, thereby removing the heat absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

[0019] Brief explanation of the drawing The accompanying drawings incorporated herein and constituting part thereof illustrate several preferred embodiments of the present invention and, together with the following description, serve to illustrate the principles of the present invention. In the drawings, identical or functionally similar elements are indicated by the same reference numeral. In addition, the leftmost digit of the reference numeral identifies the drawing in which the reference numeral first appears. [Brief explanation of the drawing]

[0020] [Figure 1] A cross-sectional view of a conventional cooling module is shown. The low-temperature inlet coolant can access the entire jet plate and is accelerated through the jet plate toward the surface to be cooled (direct module) or the base plate (indirect module). The coolant, whose temperature has risen through heat transfer, is recovered and flows to the outlet. [Figure 2A]An example of an internal recirculation cooling module according to an embodiment of the present invention is shown in a cross - sectional view. In this example, the cooling module has four stages. [Figure 2B] An example of an internal recirculation cooling module according to an embodiment of the present invention is shown in a cross - sectional view. In this example, the cooling module has four stages. [Figure 2C] An example of an internal recirculation cooling module according to an embodiment of the present invention is shown in a cross - sectional view. In this example, the cooling module has four stages. [Figure 3] Shows how the flow path (A) of a conventional prior - art cooling module differs from the flow path (B) of a cooling module with internal recirculation according to an embodiment of the present invention. [Figure 4] Shows that the division of the section of the jet plate within a given cooling module can be arbitrary. [Figure 5] A schematic diagram of surface division is shown. The initial central collision area is connected to two separate subsequent jet - plate sections, and both sections send their discharges to a common annular recovery passage and flow out at the outlet. [Figure 6A] An isometric cross - sectional view of an indirect cooling module 600 (Example A) with internal recirculation constructed according to an embodiment of the present invention is shown. [Figure 6B] An isometric cross - sectional view of an indirect cooling module 600 (Example A) with internal recirculation constructed according to an embodiment of the present invention is shown. [Figure 7] The same cooling module (Example A) is shown with the housing removed to better distinguish the coot passages between the collision space of each jet - plate section and the inlet side of the downstream section. In this example, the coot passages at the two ends (A and B) of the cooling module are the same. [Figure 8] An exploded view of another example (Example B) of a cooling module constructed according to another embodiment of the present invention is shown with the housing removed to better illustrate some of the internal components. [Figure 9] A partial cross - sectional view of the cooling module 900 (Example B) shown in the exploded view of FIG. 8 is shown. [Figure 10] A cooling module assembly (e.g., C) constructed according to the present invention as described herein is shown. [Figure 11] An exploded view of Example C of the present invention is shown. The base plate includes several channel mechanisms that help to form a cooch passage together with the jet plate and housing. [Figure 12] Figure 10 shows a partial top view of an exemplary cooling module assembly (Example C). [Figure 13] The flow paths in the exemplary cooling module shown in Figures 10 to 12 are further clarified. [Figure 14] An exploded view of another cooling module (Example D) constructed according to one embodiment of the present invention is shown. The illustrated cooling module is considered a direct (contact) cooling module because it is directly attached to the heat source. [Figure 15] Figure 14 shows the flow configuration of the direct contact cooling module (Example D). [Figure 16A] Figure 14 shows a partial cross-sectional view of the direct contact cooling module (Example D). [Figure 16B] Figure 14 shows a partial cross-sectional view of the direct contact cooling module (Example D). [Modes for carrying out the invention]

[0021] Detailed description of exemplary embodiments Preferred embodiments of the present invention are described in detail here, with examples shown in the accompanying drawings. In particular, the following drawings and examples are not intended to limit the scope of the present invention or its embodiments or equivalents. For the purposes of this detailed description, unless otherwise specified, the terms “section” and “segment” are used synonymously and may be considered to have the same meaning.

[0022] Summary of the present invention The present invention uses the geometric structure of a jet plate, ceiling, and base plate to divide the internal chamber of a cooling module into multiple sections, so that the flow passes through at least two sections in series and the discharge from one or more sections is sent to the inlet of a subsequent section within the cooling module. By bringing the same cooling fluid into contact with the cooling surface (base plate cooling surface or heat source) multiple times, the flow rate consumption of the cooling module is significantly reduced. By recooling and recirculating the cooling fluid without separating it from the external seal boundary of the cooling module, the number of external seals required is reduced, the flow path becomes more compact, and the total pressure loss of the recirculating cooling module is reduced.

[0023] Many internal diversion possibilities exist for carrying out the present invention in both direct and indirect cooling module frameworks. A channel that collects waste from one section of a cold plate and sends it to the inlet side of the next section is called a coochie channel. The coochie channel serves to isolate the waste area of ​​the original jet plate section from the waste section of any downstream jet plate section. The coochie channel can also be sealed to prevent the cooling fluid from passing through the next jet plate section. The coochie channel is formed using a combination of surfaces related to other internal elements of the cooling module. Thus, the coochie channel can be formed from, for example, the walls and structures of the following: A) Jet plate (with cutouts, if applicable), ceiling, and base plate. B) Jet plate (with notches, if applicable), intervening plate, and base plate. C) Jet plate (with notches, if applicable), housing, and intervening plate. D) Jet plate (with notches, if applicable), and intervening plate. E) Jet plates (with notches, if applicable), boundaries extending from the ceiling, intervening plates, and base plates.

[0024] Each segment of the jet plate is equipped with a microjet nozzle array configured to draw in cooling fluid from an adjacent inlet plenum, then accelerate the cooling fluid so that it flows at high speed through an associated impact space beneath the jet plate so that it impacts a portion of the cooling surface, the portion of which may include a cooling surface on the base plate of the cooling module or a cooling surface on a heat source, thereby facilitating heat transfer from the heat source to the cooling fluid.

[0025] If an intervening plate is present, it guides the flow from the exit of one segment to the inlet plenum of the next segment. Modern manufacturing techniques may allow the jet plate, ceiling, or both to be constructed as a single integrated component of the intervening plate. Cooling performance can be improved by sealing the joints between the jet plate and the housing, intervening plate, ceiling, and / or base plate using gaskets, adhesives, or welding procedures.

[0026] The fastening system can be directly integrated into the housing, meaning the housing has mounting holes for connecting the cooling module to the heat source. The fastening system can also use a separate structure, sometimes called a tensioner plate, which transmits the fastening force from the substrate to which the heat-generating component is mounted to the housing.

[0027] Additional geometric structures (e.g., walls or boundaries) can be added to direct cooling modules, indirect cooling modules, or both to help form cooch passages beneath the jet plate, which helps ensure that the flow never short-circuits between different exhaust sections. Additional geometric structures tend to simplify the geometric shape required for the base plate, thus reducing manufacturing and assembly costs. The optional assembly of the cooling module and implementation of the present invention in the cooling module can be facilitated by configuring the housing in two parts and fastening, bonding, or welding the two parts together.

[0028] In addition, it may be beneficial to manufacture multiple segments of the jet plate as separate pieces and to keep these separate pieces within the assembly rather than using a single continuous jet plate.

[0029] Referring to the drawings, Figure 1 shows a cross-sectional view of a prior art cooling module 100. As shown in Figure 1, the prior art cooling module 100 typically comprises a housing 102, an inlet 104, an outlet 106, and a jet plate 108. The housing 102 is mounted on the surface 110 to be cooled. A low-temperature coolant enters the inlet 104 and can access the entire jet plate 108, through which it is accelerated toward the surface 110 to be cooled (direct module) or a base plate (indirect module). The temperature of the cooling fluid rises due to heat transfer resulting from contact with the cooling surface 110. The cooling fluid is collected and flows to the outlet 106, where it is discharged from the cooling module 100.

[0030] Figures 2A, 2B, and 2C show a cross-sectional view of an example of an internal recirculation cooling module 200 according to one embodiment of the present invention. In this example, the cooling module 200 has four stages, meaning that the same cooling fluid is accelerated four separately through four distinct segments 210a to 210d of a jet plate, each addressing a different area on the surface 212 to be cooled. The surface 212 to be cooled may include a base plate that is in thermal contact with the surface of one or more heat-generating electronic devices, and the base plate is a component of the cooling module 200. In this configuration, the cooling module 200 is called an “indirect” cooling module. Alternatively, the surface 212 to be cooled may include the heat-generating electronic device itself, in which case the cooling module 200 may be called a “direct” cooling module.

[0031] As best illustrated in Figure 2A, the cooling module 200 comprises an inlet port 202 connected to the housing 206, an outlet port 208 connected to the housing 206, and divided jet plates 210a–210d. The cooling module 200 also comprises a ceiling 216 located inside the upper wall of the housing 206. As best illustrated in Figure 2B, the housing 206 has a set of ceiling mounting boundaries 218a–218d (i.e., walls) extending downward from the ceiling 216 to the upper surfaces of each of the different segments 210a–210d of the jet plates. If the cooling surface is a base plate (as in the indirect cooling version of the cooling module), the cooling surface 212 has a set of cooling surface mounting boundaries 220a–220d extending upward from the base plate to the lower surfaces 222 of the jet plates 210a–210d.

[0032] The shapes, arrangement, and relative positions of the jet plate segments 210a-210d, ceiling 216, ceiling mounting boundaries 218a-218c, cooling surface 212, and cooling surface mounting boundaries 220a-220c collectively serve to define four inlet plenums 222a-222d located above the jet plate segments 210a-210d, four collision spaces 224a-224d located below the jet plate segments 210a-210d, and three cooch passages 214a-214c. See Figure 2C. The coot passages 214a-214c are configured in the cooling module 200 to fluidly connect the outlets of the impact spaces 224a-224c to the inlets of the inlet plenums 222b-222d, so that the cooling fluid that has already entered the impact spaces 224a-224c to impact different parts of the cooling surface 212 is then sent to the inlet plenums 222b-222d, where the cooling fluid is drawn into the subsequent microjet arrays of the jet plate segments 210b-210d and accelerated by the microjet arrays.

[0033] Figure 3 illustrates how the flow path (A) of a conventional cooling module differs from the flow path (B) of a cooling module with internal recirculation according to an embodiment of the present invention. The coochy passage connects the impact space beneath each segment of the jet plate to the inlet plenum of the subsequent section of the jet plate. While it may be more efficient to form the coochy passage by controlling the shape, arrangement, and relative position of the boundaries extending from the ceiling and cooling surface in the cooling module, it should be understood that in alternative embodiments of the present invention, the coochy passage may comprise a physical tube or conduit (independent of the boundaries extending from the ceiling and cooling surface).

[0034] Figure 4 shows that the distribution of jet plate segments within a given cooling module can be arbitrary. Here, the central inlet connects from the central jet plate section to the subsequent ring-shaped segments, the annular outlet recovery passage, and finally to the outlet.

[0035] Figure 5 shows a schematic diagram of the surface distribution. Here, the initial central impact area is connected to two separate subsequent jet plate sections, and both sections send their own emissions to a common annular collection passage, directing the flow to the outlet. The diagram shows that not all jet plate sections must be connected in series.

[0036] Figures 6A and 6B show isometric cross-sectional views of an indirect cooling module 600 (Example A) with internal recirculation, constructed according to one embodiment of the present invention. The cooling module 600 comprises a housing 602, a jet plate 605, a base plate 610, an inlet 615, and an outlet 620. The jet plate 605 is divided into three separate segments 605a to 605c. These three segments 605a to 605c are isolated from each other by two ceiling mounting boundaries 625a and 625b extending from a ceiling 630 on the inner upper wall of the housing 602. Seals 635a and 635b are positioned where the ceiling mounting boundaries 625a and 625b join to the jet plate 605 to prevent cooling fluid from flowing directly into another segment without flowing through the jet plate or cooch passage (best shown in Figures 7 and 12, which will be further detailed later) formed by the shape, arrangement, and relative position of the jet plate 605, base plate 610, ceiling 630, and ceiling mounting boundaries 625a and 625b. The waste recovery passage 640 ensures that the cooling fluid that has already passed through the microjet nozzle array in the jet plate segments 605a, 605b, and 605c is reliably directed to the cooch passage and / or the outlet of the cooling module 600.

[0037] Figure 7 shows the same cooling module 600 as shown in Figure 6 (Example A), but with the housing 602 removed for identification purposes, showing the coochy passages 705a and 705b which are fluidly connected to the impact space below one of each of the microjet nozzle arrays 715a, 715b, and 715c in each of the three jet plate segments, as well as the inlet plenum associated with the microjet nozzle array in the downstream jet plate segment. In this example, there are two coochy passages on both sides (A side and B side) of each of the microjet arrays in the jet plate segment of the cooling module. As shown in Figure 7, the two coochy passages 705a (A side and B side) are configured to capture and guide the cooling fluid (not shown in Figure 7) that has gone through a first impact due to the operation of the first microjet nozzle array 715a in the first segment of the jet plate. The two coot passages 705b (side A and side B) are configured to capture and guide the cooling fluid after a second impact by the operation of the second microjet nozzle array 715b in the second segment of the jet plate. Then, the two discharge channels 740 (side A and side B) capture and guide the cooling fluid after a third impact by the operation of the third microjet nozzle array 715c in the third segment of the jet plate.

[0038] The coot passage 705a guides the cooling fluid from the impact space located below the microjet nozzle array 715a (not shown in Figure 7, but shown in Figure 2) into the inlet plenum located above the microjet nozzle array 715b (also not shown in Figure 7, but shown in Figure 2). The coot passage 705b delivers the cooling fluid from the impact space located below the microjet nozzle array 715b to the inlet plenum located above the microjet nozzle array 715c. The waste recovery channel 740 is configured to deliver the cooling fluid from the impact space located below the microjet nozzle array 715c towards the outlet of the cooling module 700.

[0039] Figure 8 shows an exploded view of another example (Example B) of a cooling module 800 constructed according to another embodiment of the present invention, with the housing removed to better illustrate some of the internal components. In this embodiment, an intervening plate 805 and a sealing gasket 810 are inserted between the jet plate 815 and the housing (not shown). The jet plate 815 is divided into three segments, each segment containing a microjet nozzle array 817. After the cooling fluid passes through the first and second microjet nozzle arrays and collides with the cooling surface 825 of the base plate 820, the cooling fluid is positioned in the collision space located below the plane of the divided jet plate 815. Cooch passages (best shown in Figures 7 and 12) are used to move the cooling fluid from the collision space below the plane of the divided jet plate 815 into an inlet plenum located above the plane of the divided jet plate 815. Therefore, the couch passage needs to be configured to "rise" the cooling fluid from a level below the plane of the divided jet plate 815 to a level located above the plane of the divided jet plate 815 when moving the cooling fluid from the impact space to the downstream inlet plenum. Thus, at least some portions of the couch passage are located below the plane of the divided jet plate 815, and the other portions of the couch passage are located above the plane of the divided jet plate 815.

[0040] The creation of the cooch passage in the cooling module 800 may be facilitated by the insertion and use of an intervening plate 805, which has a ceiling 807 on its underside, and the ceiling 807 has a ceiling mounting boundary (and / or wall or standoff) extending downward. These ceiling mounting boundaries, in combination with the upper surface of the divided jet plate 815 and the structure of the ceiling 807, are conveniently used to form a portion of the cooch passage that lies above the plane of the divided jet plate 815. In some embodiments, the ceiling 807 is an integral part of the intervening plate 805. If the intervening plate is not used, the mechanism of the ceiling 807 may be formed in the inner upper wall of the housing. In yet another embodiment, the ceiling 807 may consist of a separately manufactured piece that can be inserted below the intervening plate 805 or the inner upper wall of the housing. The base plate 820 includes a cooling surface 825 having an upwardly extending cooling surface mounting boundary 830 which is appropriately shaped and positioned to form a portion of the coot passage located below the plane of the divided jet plate 815, in cooperation with the structure of the lower surface of the divided jet plate 815 and the cooling surface 825.

[0041] The sealing gasket 810 prevents the cooling fluid in one segment of the divided jet plate 815 from flowing directly into a different segment of the divided jet plate 815 without passing through the coot passage. The notches 840 in the divided jet plate 815 and the corresponding portions of the sealing gasket 810 are portions of the coot passage that allow the coolant to pass through the plane of the divided jet plate 815, raising the cooling fluid from a level below the plane of the divided jet plate 815 to a level above the plane of the divided jet plate 815.

[0042] Figure 9 shows a partial cross-sectional view of the cooling module 900 (Example B) shown in the exploded view of Figure 8. In this case, the inlet flow channel 905 cut into the upper part of the intervening plate 910 is connected to the inlet port on the housing (not shown). ,coldCooling fluid is delivered to the approximate center 915 of the cooling module 900. A first cooch passage, which returns the cooling fluid towards the inlet side of the divided jet plate 920 before it flows through the nozzle array in the second segment of the jet plate 925, is formed by a combination of structures related to the boundary of the base plate 930, the divided jet plate 925, and the intervening plate 910. A second cooch passage 935, which delivers cooling fluid from the second segment to the third segment of the divided jet plate 925, is also formed by the boundary of the base plate 930, the jet plate 925, and the intervening plate 910, where the cooling fluid collates with the third section before being collected in the waste collection passage 940 within the intervening plate 910, and can then flow to an outlet port (not shown) via several external flow channels 950 located between the lower side of the upper wall of the housing and the upper side of the intervening plate 910.

[0043] Figure 10 shows a cooling module assembly 1000 (Example C) using a cooling module 1005 with internal recirculation constructed according to one embodiment of the present invention. In this example, the base plate 1010 of the cooling module 1005 is attached and secured to the surface 1015 (in this case, the processor) to be cooled using a fastening system, which in this case comprises a processor mounting bracket 1025 (in this case, the bolster plate) and a tensioner plate 1020 that transmits compressive force from the fastener 1030 to the cooling module housing 1040. An inlet port 1050 attached to the housing 1040 is configured to introduce pressurized cooling fluid supplied by an external source into the cooling module 1005, and an outlet port 1055 attached to the housing 1040 is configured to discharge the cooling fluid from the cooling module 1005. The base plate 1010 of the cooling module is in thermal communication with the surface 1015 to be cooled using a thermal interface material (not shown).

[0044] Figure 11 shows an exploded view of the cooling module assembly shown in Figure 10. The cooling surface 1103 of the base plate 1105 includes several cooling surface mounting boundaries 1110 (walls, standoffs, or channel-forming mechanisms) that, together with the structure and cutouts incorporated into the jet plate 1015, sealing gasket 1020, and housing 1025, help to form a well-configured cooch passage for moving cooling fluid from one segment of the jet plate 1015 to the next.

[0045] Figure 12 shows a partial top view of an exemplary cooling module assembly shown in Figure 10. For ease of understanding, the housing, inlet port, and outlet port have been removed from the image of the drawing. As shown in Figure 12, the inlet flow of the cooling fluid is divided into two parallel sections of the jet plate (section 1A and section 1B), each section containing a microjet nozzle array with multiple microjet nozzles. The discharge from these parallel sections is collected together through several coochy passages and carries the coolant to section 2. The coochy passages in section 2 direct the flow into the upper space of the fluid connected to the inlet plenum in section 3. Section 3 then has coochy passages connecting section 3 to a fourth segment and a final segment. Example C demonstrates the ability to combine the parallel sections (1A and 1B) to connect to further series sections (2, 3, and 4). Figure 12 also shows that these sections can be used to customize heat transfer for specific areas of a processor chip.

[0046] Figure 13 further clarifies the flow paths in the exemplary cooling module shown in Figures 10–12 by focusing on the formation of coochie passages from sections 1A and 1B that connect to section 2. In particular, channel-forming mechanisms in the base plate, typically formed from copper, can be used to assist in the formation of coochie passages. These convex mechanisms (protruding from the copper) on the base plate can also be realized using separate pieces. The arrows in Figure 13 indicate the flow paths taken by the cooling fluid traveling through the coochie passages that connect the collision space of section 1 to the inlet plenum of section 2.

[0047] Figure 14 shows an exploded view of another cooling module (Example D) constructed according to one embodiment of the present invention. The illustrated cooling module is considered a direct cooling module because it is mounted directly to the heat source. In this case, the internal passages do not have gaskets. The jet plate in this example comprises three distinct sections manufactured as three distinct physical pieces.

[0048] Figure 15 shows the flow configuration of the direct contact cooling module (Example D) shown in Figure 14, demonstrating how a single jet plate section connected to the inlet can collect the exhaust from these sections together and divide it into two parallel sections (Section 2A and Section 2B) before sending the exhaust to the outlet (not shown).

[0049] Figures 16A and 16B show partial cross-sectional views of the direct-contact cooling module (Example D) shown in Figure 14. These cross-sectional views show the flow path from section 1 to section 2A in more detail. In this case, the cooch passage is formed by the jet plate, the lower half of the housing, and the surface being cooled. Figure 16 has an enlarged inset of the flow path through the cooch passage from section 1 to section 2A.

[0050] The preferred embodiments described above are for illustrative purposes only and not to limit the scope of the present invention. Those skilled in the art will be able to conceive of various other embodiments, modifications, and equivalents of these preferred embodiments by reading this disclosure or by practicing the present invention as described in the claims. Such variations, modifications, and equivalents are intended to be included within the scope of the present invention and the appended claims.

Claims

1. It is a cooling module, (a) A jet plate comprising an upper surface, a lower surface, a first segment including a first microjet nozzle array extending through the jet plate from the upper surface to the lower surface of the jet plate, and a second segment including a second microjet nozzle array extending through the jet plate from the upper surface to the lower surface of the jet plate, (b) Housing and (c) A ceiling disposed between the jet plate and the housing, the ceiling comprising a first ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate, and a second ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate, (d) A sealing gasket inserted between the jet plate and the housing, (e) A base plate comprising a cooling surface, a first cooling surface mounting boundary extending from the cooling surface to the lower surface of the jet plate, and a second cooling surface mounting boundary extending from the cooling surface to the lower surface of the jet plate. Equipped with, (f) The jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the first cooling surface mounting boundary, and the second cooling surface mounting boundary are all arranged to define a first inlet plenum located between the ceiling and the first microjet nozzle array, a second inlet plenum located between the ceiling and the second microjet nozzle array, a first impact space located between the first microjet nozzle array and the cooling surface, a second impact space located between the second microjet nozzle array and the cooling surface, and a first cooch passage that fluidly connects the first impact space to the second inlet plenum. (g) A fastening system for attaching the cooling module to the circuit board on which the one or more heat-generating electronic components are fixed, such that the cooling surface of the base plate is in thermal communication with one or more heat-generating electronic components on the circuit board, and absorbs the heat generated by the one or more heat-generating electronic components during the operation of the circuit board, (h) An inlet fitting attached to the housing and configured to introduce pressurized cooling fluid supplied from an external source into the cooling module, (i) an inlet flow channel that carries the pressurized cooling fluid from the inlet fitting to the first inlet plenum Equipped with, (j) (i) The first microjet nozzle array in the first segment of the jet plate is configured to receive the pressurized cooling fluid from the first inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid into the first impact space at high speed, and impact the first portion of the cooling surface of the base plate, thereby removing the heat absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components, (ii) The coot passage is configured to carry a portion of the pressurized cooling fluid in the first collision space and within the second inlet plenum, (iii) The second microjet nozzle array in the jet plate is configured to receive the pressurized cooling fluid from the second inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid into the second impact space at high speed, and impact the second portion of the cooling surface of the base plate, thereby removing the heat absorbed by the second portion of the cooling surface from one or more heat-generating electronic components, (iv) A cooling module wherein the sealing gasket is configured to form part of the first cooch passage and to prevent the pressurized cooling fluid entering the first segment of the jet plate from flowing directly into the second segment of the jet plate without passing through the first cooch passage.

2. (a) an outlet fitting connected to the housing and configured to discharge pressurized cooling fluid from the cooling module, (b) A first waste recovery passage configured to capture a portion of the pressurized cooling fluid from the first collision space and to send the captured pressurized cooling fluid to the outlet joint for discharge from the cooling module; The cooling module according to claim 1, further comprising the following:

3. The cooling module according to claim 2, further comprising a second waste recovery passage configured to capture a portion of the pressurized cooling fluid from the second collision space and to send the captured pressurized cooling fluid to the outlet joint for discharge from the cooling module.

4. The cooling module according to claim 1, wherein the ceiling is manufactured as an integral part of the housing.

5. The cooling module according to claim 1, wherein the ceiling is not manufactured as an integral part of the housing.

6. (a) Intervening plate positioned between the housing and the jet plate Furthermore, (b) The cooling module according to claim 5, wherein the ceiling is manufactured as an integral part of the intervening plate.

7. (a) The second segment of the jet plate surrounds the first segment of the jet plate, (b) The second ceiling mounting boundary of the ceiling surrounds the first ceiling mounting boundary, (c) The cooling module according to claim 1, wherein the second cooling surface mounting boundary of the base plate surrounds the first cooling surface mounting boundary.

8. (a) The jet plate further comprises a third segment including a third microjet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate, (b) The ceiling further comprises a third ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate, (c) The base plate further comprises a third cooling surface mounting boundary extending from the cooling surface to the lower surface of the jet plate, (d) The jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the third ceiling mounting boundary, the first cooling surface mounting boundary, the second cooling surface mounting boundary, and the third cooling surface mounting boundary are all arranged to define a third inlet plenum located between the ceiling and the third microjet nozzle array, a third impact space located between the cooling surface and the third microjet nozzle array, and a second cooch passage that fluidly connects either or both of the first impact space or the second impact space to the third inlet plenum. (e) The cooling module according to claim 1, wherein the third microjet nozzle array in the jet plate is configured to receive the pressurized cooling fluid from the third inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid into the third impact space at high speed, and impact the third portion of the cooling surface of the base plate, thereby removing the heat absorbed by the third portion of the cooling surface from the one or more heat-generating electronic components.

9. (a) an outlet fitting connected to the housing and configured to discharge pressurized cooling fluid from the cooling module, (b) A first waste collection passage configured to capture a portion of the pressurized cooling fluid from the third collision space and to send the captured pressurized cooling fluid to the outlet joint for discharge from the cooling module; The cooling module according to claim 8, further comprising the following:

10. The cooling module according to claim 8, wherein the sealing gasket forms part of a second cooch passage, preventing the pressurized cooling fluid entering the second segment of the jet plate from flowing directly into the third segment of the jet plate without passing through the second cooch passage.

11. (a) The third segment of the jet plate surrounds the first segment of the jet plate and the second segment of the jet plate, (b) The third ceiling mounting boundary of the ceiling surrounds the first ceiling mounting boundary and the second ceiling mounting boundary, (c) The cooling module according to claim 8, wherein the third cooling surface mounting boundary of the base plate surrounds the first cooling surface mounting boundary and the second cooling surface mounting boundary.

12. The cooling module according to claim 8, wherein the ceiling is manufactured as an integral part of the housing.

13. The cooling module according to claim 8, wherein the ceiling is not manufactured as an integral part of the housing.

14. (a) Intervening plate positioned between the housing and the jet plate Furthermore, (b) The cooling module according to claim 13, wherein the ceiling is manufactured as an integral part of the intervening plate.

15. (a) A second jet plate comprising another upper surface, another lower surface, and a third segment including a third microjet nozzle array extending through the second jet plate from the other upper surface to the other lower surface of the second jet plate. Furthermore, (b) (i) The ceiling further comprises a third ceiling mounting boundary extending from the ceiling to the other upper surface of the second jet plate, (ii) The base plate further comprises a third cooling surface mounting boundary extending from the cooling surface to the other lower surface of the second jet plate, (iii) The second jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the third ceiling mounting boundary, the first cooling surface mounting boundary, the second cooling surface mounting boundary, and the third cooling surface mounting boundary are all arranged to define a third inlet plenum located between the ceiling and the third microjet nozzle array, a third impact space located between the cooling surface and the third microjet nozzle array, and a second cooch passage that fluidly connects either or both of the first impact space or the second impact space to the third inlet plenum. (iv) The cooling module according to claim 1, wherein the third microjet nozzle array in the second jet plate is configured to receive the pressurized cooling fluid from the third inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid to flow at high speed into the third impact space and impact the third portion of the cooling surface of the base plate, thereby removing some of the heat absorbed by the third portion of the cooling surface from the one or more heat-generating electronic components.

16. A method for cooling one or more heat-generating electronic components mounted on a circuit board, wherein the method is (a) Providing a cooling module comprising a jet plate, a housing, a ceiling disposed between the jet plate and the housing, a sealing gasket inserted between the ceiling and the jet plate, a base plate having a cooling surface, and a fastening system for fastening the cooling module to the circuit board. Includes, (b) (i) The jet plate comprises a first segment including a first microjet nozzle array extending through the jet plate and a second segment including a second microjet nozzle array extending through the jet plate, (ii) The jet plate, the ceiling, the cooling surface of the base plate, a first ceiling mounting boundary, a second ceiling mounting boundary, a first cooling surface mounting boundary, and a second cooling surface mounting boundary are all arranged to define a first inlet plenum located between the ceiling and the first microjet nozzle array, a second inlet plenum located between the ceiling and the second microjet nozzle array, a first impact space located between the first microjet nozzle array and the cooling surface, a second impact space located between the second microjet nozzle array and the cooling surface, and a first cooch passage that fluidly connects the first impact space to the second inlet plenum, (c) Using the fastening system, the cooling module is attached to the circuit board such that the cooling surface of the base plate is in thermal communication with the one or more heat-generating electronic components on the circuit board, and that the cooling module absorbs the heat generated by the one or more heat-generating electronic components during the operation of the circuit board; (d) Connecting an external source of pressurized cooling fluid to the inlet port on the housing of the cooling module, (e) Sending the pressurized cooling fluid received at the inlet port to the first inlet plenum of the jet plate, (f) Using the first microjet nozzle array in the first segment of the jet plate, receiving the pressurized cooling fluid from the first inlet plenum, accelerating the pressurized cooling fluid, guiding the accelerated pressurized cooling fluid into the first impact space at high speed, and impacting the first portion of the cooling surface of the base plate, thereby removing the heat absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components; (g) Using the first cooch passage, a portion of the pressurized cooling fluid that has collided with the first portion of the cooling surface is sent from the first collision space to the second inlet plenum, (h) Using the second microjet nozzle array in the jet plate, receive the pressurized cooling fluid from the second inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid to flow at high speed into the second impact space, causing the pressurized cooling fluid to impact the second portion of the cooling surface of the base plate without leaving the cooling module before entering the second inlet plenum, thereby removing the heat absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components. (i) The sealing gasket is configured to form part of the first cooch passage and to prevent the pressurized cooling fluid entering the first segment of the jet plate from flowing directly into the second segment of the jet plate without passing through the first cooch passage. Methods that include...

17. (a) A step of capturing a portion of the pressurized cooling fluid in the first collision space that the coot passage does not send to the second inlet plenum, (b) The step of sending the captured pressurized cooling fluid to an outlet joint connected to the housing, (c) The step of discharging the pressurized cooling fluid from the cooling module The method according to claim 16, further comprising:

18. The method according to claim 16, wherein the ceiling is manufactured as an integral part of the housing.

19. The method according to claim 16, wherein the ceiling is not manufactured as an integral part of the housing.

20. It is a cooling module, (a) A jet plate comprising an upper surface, a lower surface, a first segment including a first microjet nozzle array extending through the jet plate from the upper surface to the lower surface of the jet plate, and a second segment including a second microjet nozzle array extending through the jet plate from the upper surface to the lower surface of the jet plate, (b) A housing comprising a top cover and a base plate, (c) A ceiling positioned between the jet plate and the top cover of the housing, wherein the ceiling comprises a first ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate and a second ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate. Equipped with, (d) A sealing gasket inserted between the jet plate and the housing, (e) The base plate of the housing comprises an opening, a flange surrounding the opening, a first flange mounting boundary, and a second flange mounting boundary, wherein both the first flange mounting boundary and the second flange mounting boundary extend across the opening of the base plate and abut against the lower surface of the jet plate, (f) The jet plate, the ceiling, the flange of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the first flange mounting boundary, and the second flange mounting boundary are all arranged to define a first inlet plenum located between the ceiling and the first microjet nozzle array, a second inlet plenum located between the ceiling and the second microjet nozzle array, a first impact space located directly below the first microjet nozzle array within the opening, a second impact space located directly below the second microjet nozzle array within the opening, and a first cooch passage that fluidly connects the first impact space to the second inlet plenum. (g) A fastening system for attaching the cooling module to the circuit board on which the one or more heat-generating electronic components are fixed, such that the one or more heat-generating electronic components on the circuit board are positioned inside or directly below the first inlet plenum and the second inlet plenum in the opening of the base plate, (h) An inlet fitting attached to the top cover and configured to introduce pressurized cooling fluid supplied from an external source into the cooling module, (i) an inlet flow channel that carries the pressurized cooling fluid from the inlet fitting to the first inlet plenum Equipped with, (j) The first microjet nozzle array in the first segment of the jet plate is configured to receive the pressurized cooling fluid from the first inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid into the first collision space at high speed, and directly collide with the first part of the one or more heat-generating electronic components, thereby removing the heat generated by the first part of the one or more heat-generating electronic components while the first part of the one or more heat-generating electronic components is operating. The first coot passage is configured to transport a portion of the pressurized cooling fluid that has collided with one or more heat-generating electronic components from the first collision space into the second inlet plenum. The second microjet nozzle array in the jet plate is configured to receive the pressurized cooling fluid from the second inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid into the second collision space at high speed, and collide with the second part of the one or more heat-generating electronic components, thereby removing some of the heat generated by the second part of the one or more heat-generating electronic components during their operation. A cooling module in which the sealing gasket is configured to form part of the first cooch passage and to prevent the pressurized cooling fluid entering the first segment of the jet plate from flowing directly into the second segment of the jet plate without passing through the first cooch passage.

21. (a) an outlet fitting connected to the top cover and configured to discharge pressurized cooling fluid from the cooling module, (b) A first waste recovery passage configured to capture a portion of the pressurized cooling fluid in the first collision space and to send the captured pressurized cooling fluid to the outlet joint for discharge from the cooling module; The cooling module according to claim 20, further comprising the following:

22. The cooling module according to claim 20, further comprising a second waste recovery passage configured to capture a portion of the pressurized cooling fluid in the second collision space and to send the captured pressurized cooling fluid to the outlet joint for discharge from the cooling module.

23. The cooling module according to claim 20, wherein the ceiling is manufactured as an integral part of the top cover.

24. The cooling module according to claim 20, wherein the ceiling is not manufactured as an integral part of the top cover.

25. (a) Intervening plate positioned between the top cover and the jet plate Furthermore, (b) The cooling module according to claim 24, wherein the ceiling is manufactured as an integral part of the intervening plate.

26. (a) The second segment of the jet plate surrounds the first segment of the jet plate, (b) The second ceiling mounting boundary of the ceiling surrounds the first ceiling mounting boundary, (c) The cooling module according to claim 20, wherein the second flange mounting boundary of the base plate surrounds the first flange mounting boundary.

27. (a) The jet plate further comprises a third segment including a third microjet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate, (b) The ceiling further comprises a third ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate, (c) The base plate further comprises a third flange mounting boundary that extends across the opening of the base plate and abuts against the lower surface of the jet plate, (d) The jet plate, the ceiling, the flange of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the third ceiling mounting boundary, the first flange mounting boundary, the second flange mounting boundary, and the third flange mounting boundary are all arranged to define a third inlet plenum located between the ceiling and the third microjet nozzle array, a third impact space located within the opening directly below the third microjet nozzle array, and a second cooch passage that fluidly connects either or both of the first impact space and the second impact space to the third inlet plenum. (e) The cooling module according to claim 20, wherein the third microjet nozzle array in the jet plate is configured to draw the pressurized cooling fluid from the third inlet plenum, accelerate the pressurized cooling fluid, guide the accelerated pressurized cooling fluid into the third collision space at high speed, and cause it to directly collide with the third portion of the one or more heat-generating electronic components, thereby removing the heat generated by the third portion of the one or more heat-generating electronic components during operation of the third portion of the one or more heat-generating electronic components.

28. (a) an outlet fitting connected to the top cover and configured to discharge pressurized cooling fluid from the cooling module, (b) A first waste collection passage configured to capture a portion of the pressurized cooling fluid in the third collision space and to send the captured pressurized cooling fluid to the outlet joint for discharge from the cooling module; The cooling module according to claim 27, further comprising the following:

29. The cooling module according to claim 27, wherein the sealing gasket forms part of a second cooch passage, preventing pressurized cooling fluid entering the second segment of the jet plate from flowing directly into the third segment of the jet plate without passing through the second cooch passage.

30. (a) The third segment of the jet plate surrounds the first segment of the jet plate and the second segment of the jet plate, (b) The third ceiling mounting boundary of the ceiling surrounds the first ceiling mounting boundary and the second ceiling mounting boundary, (c) The cooling module according to claim 27, wherein the third flange mounting boundary of the base plate surrounds the first flange mounting boundary and the second flange mounting boundary.

31. The cooling module according to claim 27, wherein the ceiling is manufactured as an integral part of the top cover.

32. The cooling module according to claim 27, wherein the ceiling is not manufactured as an integral part of the top cover.

33. (a) Intervening plate positioned between the top cover and the jet plate Furthermore, (b) The cooling module according to claim 32, wherein the ceiling is manufactured as an integral part of the intervening plate.

34. A method for removing heat from a heat-generating electronic component mounted on a circuit board of a computer processor, wherein the method is (a) To provide the cooling module described in claim 20, (b) The cooling module according to claim 20 is attached to an external source of pressurized cooling fluid, (c) Using the cooling module described in claim 20 to remove heat from the heat-generating electronic component Methods that include...

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