A method for producing an epoxy resin composition, a liquid dispensing head using the epoxy resin composition, and a method for producing the liquid dispensing head.

Abstract

To provide an adhesive which achieves both a sufficient pot life with one liquid, and heat curability in a short time.SOLUTION: There is provided a production method for an epoxy resin composition containing an epoxy resin, a solid basic compound and polythiol. The method comprises the steps of: kneading the epoxy resin and the solid basic compound to prepare a mixture 1; and then kneading the polythiol therewith, thereby rate-limiting dissolution of the solid basic compound in the polythiol to secure a pot life, as well as realizing heat curability in a short time due to a catalyst action by dissolution of the solid basic compound during heating.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a method for producing an epoxy resin composition, a liquid discharge head using the epoxy resin composition, and a method for producing the liquid discharge head.

Background Art

[0002] Epoxy adhesives are widely used because of their high adhesiveness and high chemical resistance. In particular, , for bonding precision parts, quick curing (also called temporary fixing property) in a short time is required so that misalignment does not occur. As a representative of epoxy adhesives having such characteristics, a photo cationic polymerization type epoxy resin adhesive can be mentioned. This adhesive has a long pot life in one component and cures by heating for several seconds, so it is industrially preferably used. For example, since physical property changes such as viscosity at room temperature are small, the adhesive can be stably applied to the adherend. Further, after application, UV irradiation is performed and the adherends are laminated, and then cured by heating at 1 00 °C for several seconds, so misalignment hardly occurs and there is no need to hold the adherends for a long time. Therefore, the next process can be quickly moved to. By performing additional heating as necessary, the crosslink density can be further increased, and the mechanical properties and chemical resistance are also improved. Thus, by performing two-stage curing, productivity and reliability are improved.

[0003] Photo cationic polymerization type epoxy resins are excellent in chemical resistance because ether bonds are formed by ring opening of epoxy rings. However, since ether bonds are formed, functional groups contributing to adhesion such as hydroxyl groups are reduced, and the adhesiveness may not be sufficient. Among the polymerization reactions of epoxy resins, thiol curing using a polythiol as a curing agent is mentioned as having a fast reaction rate. Polythiols exist in the presence of a basic catalyst or a curing accelerator.​ This is anionic polymerization that reacts rapidly with epoxy resin under normal conditions. As an adhesive, the adhesive described in Patent Document 1 is known. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] International Publication No. 2016 / 171072 [Overview of the project] [Problems that the invention aims to solve]

[0005] Although thiol curing is highly reactive, while applying to multiple substrates, the syringe Because it hardens inside the container, its usable time is short, and some kind of ingenuity is needed for practical use. In such thiol curing, a means of extending the pot life is to use a basic reaction of the solid. One method is to select a medium or curing accelerator. For example, a solid basic compound for thiol curing. Using this method allows for more time to be gained before the catalyst dissolves and becomes a basic catalyst. However, the main component is Along with the epoxy resin, the hardening agent, polythiol, is usually a liquid. Especially with relatively low viscosity epoxy resins. Lithiol readily dissolves solid basic compounds, which can slightly delay the onset of the reaction. However, the pot life may still be insufficient. Also, the amount of basic compounds Even if the pot life is extended by reducing the amount of heat used, the curing properties during short-time heating are inferior. In some cases, the temporary fixing effect may not be sufficient. To solve the pot life problem, the adhesive is not a single-component adhesive. If a two-component solution is used, it is necessary to mix the two components each time, fill the syringe, and set it in the device. Productivity is extremely low. Furthermore, since the reaction progresses after mixing, the working time is also short, further reducing productivity. It is inferior to [another name].

[0006] The object of the present invention is to provide an epoxy resin composition that has a sufficient pot life with a single component and has curability by short-time heating. Further, the present invention provides a liquid ejection head using the epoxy resin composition and a method for manufacturing the liquid ejection head.

Means for Solving the Problems

[0007] The aforementioned mixture 6 to manufacture a mixture 8. The inorganic thixotropic agent is characterized by containing silica.

Effects of the Invention

[0008] An epoxy resin composition useful as an adhesive having a sufficient pot life with a single component, excellent heat curability in a short time, and high adhesion reliability can be obtained.

[0009]

Brief Description of the Drawings

[0010]

Embodiments for Carrying Out the Invention

[0011] The solid basic compound coated with the epoxy resin dissolves in the polythiol to become a basic catalyst, and it takes time until the reaction between the epoxy resin and the polythiol starts. Therefore, even in a one-component system at room temperature, the viscosity increase is slow and sufficient pot life can be obtained. Furthermore, by coating the surface of the solid basic compound with an epoxy resin, sufficient pot life can be ensured, so that the solid basic compound can be blended in an amount that was impossible before, and the reaction start points increase, so that curing can be achieved with even shorter heating. Thus, while being a one-component system, both sufficient pot life and short-time curing are compatible. In particular, in a system to which a thixotropic agent is added, due to the expression of thixotropy, it does not spread and can be applied and adhered, so it has excellent applicability to fine parts. Also, by increasing the viscosity of the epoxy resin and / or the polythiol with a thixotropic agent, dissolution of the solid basic compound in the polythiol can be further suppressed, and the pot life becomes longer. [[ID=…]] Since the adhesive obtained by the method of the present invention is a basic thiol cure, the decrease in functional groups contributing to adhesion such as hydroxyl groups due to the curing reaction hardly occurs, and it has excellent adhesiveness. ​​​​​​​​​​​​​​​​​​​​​ Therefore, the method for manufacturing an adhesive according to one embodiment of the present invention is an epoxy resin and a solid basic The process involves preparing a mixture 1 by kneading the compounds, and then kneading polythiol into the mixture 1. This process is characterized by the fact that the solid basic compound is covered with epoxy resin. Therefore, the dissolution contact of solid basic compounds by polythiols can be suppressed, and in one solution... Even at room temperature, the viscosity increases slowly, and the adhesive of this invention provides a sufficient pot life.

[0013] Another embodiment of the adhesive manufacturing method of the present invention uses epoxy resin and / or poly The process of pre-mixing thixotropic agents with thiols allows for the formation of solid basic compounds in polythiols. This can further suppress the dissolution and contact of materials. As a result, the pot life of a single liquid can be more secure. This thixotropic agent allows for the incorporation of a larger amount of solid basic compounds, and the originally highly reactive E This can further improve the thiol curing properties of oxy. Despite being a single-component compound, it can withstand temperatures up to 100°C. It can harden at a moderate temperature in just a few seconds and exhibits excellent temporary fixing properties. On the other hand, it is sufficient An adhesive with a long working time can be obtained.

[0014] The adhesive of the present invention undergoes thiol curing (anionic polymerization reaction), and even after curing, it maintains adhesion of hydroxyl groups, etc. Functional groups that contribute to this remain, and the thiol-derived -S- group is flexible, under harsh conditions However, strong adhesion to the substrate can be expected. For example, liquids such as those found in inkjet heads. It can be applied to the adhesive used to bond the components of the inkjet head. The ink consists of a polar solvent, water, and a colorant, and the parts that come into contact with the ink bond together. Adhesives are required to maintain strong adhesive strength. Furthermore, different color variations between separated liquid channels are required. To prevent mixing, it is desirable to maintain strong adhesion at the interface between the adherend and the adhesive. When a gap forms at the interface between the body and the adhesive, ink penetrates through that gap via capillary action from the liquid channels of each color. The reason is that it increases the likelihood of different colors mixing together.

[0015] In addition, during the inkjet head manufacturing process, small parts are fixed with adhesive to the extent that they do not move. Then, the process of moving on to the next part bonding process is repeated, and finally, a relatively long time is spent The adhesive is then allowed to harden. The process of fixing the parts with adhesive to the extent that they do not move is called temporary fixing. The process of curing the adhesive over a relatively long period of time is called the main curing process. For example, 100 The adhesive of this invention is cured at 100°C for a few seconds, and then fully cured at 150°C for 2 hours. Because it hardens at a moderate temperature and in just a few seconds, it is suitable for the temporary fixing process of inkjet heads. .

[0016] Let's explain each of the constituent components. (Epoxy resin) The main component, epoxy resin, may be of one type or may contain two or more types. Since it is necessary to cover the solid basic compound as a catalyst, the process of kneading the solid basic compound is required. In this case, the epoxy resin composition needs to be liquid. Using an epoxy resin that is solid at room temperature is not recommended. In this case, heat the solid basic compound to a temperature where it does not melt to make it liquid, or use another liquid epoxy. It is best to dissolve it in resin.

[0017] Examples of epoxy resins include bisphenol A type, bisphenol F type, and bisphenol A D-type epoxy resins, and compounds obtained by further adding alkylene oxides to these, are glycerides. Cidyl ether, epoxy novolac resin, bisphenol A novolac diglycidyl ether Glycidyl ether types such as bisphenol F novolac diglycidyl ether and Examples include glycidylamine-type epoxy resins and alicyclic epoxy resins. They are solid at room temperature. Epoxy resins include biphenyl skeletons, naphthalene skeletons, and cresol novolac skeletons. Trisphenolmethane skeleton, dicyclopentadiene skeleton, phenol biphenylene skeleton Examples include epoxy resins having the following properties.

[0018] (Polythiol) There are no particular restrictions on the polythiol used as the curing agent, but it is usually highly reactive and relatively Select a low molecular weight polythiol. Such polythiols should be liquid at room temperature. There are many. For example, pentaerythritol trispropanthol (PEPT), trimethylol Lupropane tris(3-mercaptopropionate) (TMMP), pentaerythritol Examples include tetrakis(3-mercaptopropionate), p-xylene dithiol, etc. It can be listed. Commercially available products include PEPT (manufactured by SC Organic Chemicals Co., Ltd.), TMMP (manufactured by SC Organic Chemicals Co., Ltd.), and Topcure 3-800 (product name, manufactured by Mitsubishi Chemical Corporation), QX11 (product name, Mitsubishi Chemical Corporation) Examples include (manufactured by the company). When using the adhesive of the present invention in areas requiring greater chemical resistance, a more chemically resistant ether A polythiol having an ether skeleton is preferred. A polythiol having an ether skeleton is a side chain It has two or more thiol groups, and its main chain does not contain hydrolyzable ester bonds, and the bonding force This refers to compounds with ether bonds that have excellent properties such as chemical resistance due to their high ether content.

[0019] The polythiol content is calculated as follows: 1 equivalent of epoxy in epoxy resin, with a polythiol content of 1 equivalent of epoxy. It is preferable that the total equivalent is 0.5 to 1 equivalent. When the amount of thiol decreases, the reaction rate between epoxy resin and polythiol decreases. As a whole, the reaction may be slow, and curing in a short time may not be possible. Also, the poly... If the equivalent amount of ol is small, the polymerization reaction between epoxy resin and polythiol is not the main reaction. The polymerization reaction between epoxy resin and a base derived from a solid basic compound is sometimes the main reaction. Therefore, the flexibility of the thioether structure (-S-) derived from polythiol is reduced. From an adhesive standpoint, this is undesirable. The equivalent amount of polythiol becomes too high compared to the epoxy resin. If too much is added, the amount of polythiol that cannot react with epoxy resin will increase. Since thiols remain as plasticizers, mechanical properties may deteriorate, such as a decrease in adhesive strength. Furthermore, if adhesive is used in areas that come into contact with the ink, unreacted polythiol may leach into the ink. Then, ink enters the space where the polythiol has dissolved, and the adhesive swells with the ink. This is undesirable because it can lead to problems.

[0020] (Solid basic compounds) As for the solid basic compound used as a curing catalyst, there are no particular restrictions as long as it is solid at room temperature, however A phenyl resin that is difficult to dissolve is preferably used. For example, dicyandiamide and dihydrazide are commonly used as latent curing agents. Compounds such as diaminodiphenylmethane (DDM) and diaminodiphenylsulfone (DDS) Solid aromatic amines such as ), various imidazoles, and various amine adduct-based latent curing agents It can be listed.

[0021] The content of the solid basic compound is 3 to 10 parts by mass per 100 parts by mass of epoxy resin. Preferred. If the amount of solid basic compound relative to the epoxy resin is too small, in a short time If the amount of solid basic compound becomes too large relative to the epoxy resin, curing will not be possible. , solid basic compounds protected by epoxy resin dissolve in polythiol The amount of basic compounds increases, and the pot life is shortened. In particular, the manufacturing method of the present invention While maintaining sufficient pot life, the solid basic compound is added to 100 parts by mass of epoxy resin. This allows for the addition of large quantities, such as 3 to 10 parts by mass.

[0022] (Stimulant) This reduces the fluidity of the liquid component and further suppresses the dissolution of solid basic compounds into polythiols. For this purpose, the epoxy resin, solid basic compound, and components other than polythiol are used as described above. The thixotropic agent may be added to the epoxy resin composition (adhesive).

[0023] For thixotropic agents, inorganic fine materials such as common fumed silica are used. This is possible. Also, there are liquid types that can impart thixotropy without significantly increasing viscosity, but in this case... The mixture consists of glass, titanium dioxide, alumina, aluminum hydroxide, magnesium hydroxide, and talc. Other fillers such as crystalline silica, mica, and silica will be needed. As a liquid type, polyamide is used. By using systems such as ester systems, hydrogenated castor oil systems, oxidized polyethylene systems, and surfactant systems. These can be used individually or in combination of two or more types.

[0024] The preferred content of the thixotropic agent is 1 to 20 parts by mass per 100 parts by mass of epoxy resin. The more thixotropic agent added, the longer the pot life tends to be. Therefore, to match the desired pot life... Therefore, it is advisable to adjust the amount of thixotropic agent. The method of mixing the thixotropic agent will be described later.

[0025] (Method for manufacturing epoxy resin composition) In the method for producing the epoxy resin composition (adhesive) according to the present invention, a solid salt of polythiol To suppress the dissolution of the base compound, the raw materials of the adhesive are mixed in the following order.

[0026] (Adhesive that does not contain thixotropic agents) In the adhesive manufacturing method according to this embodiment, epoxy resin and a solid basic compound are kneaded together. A process for producing mixture 1, and a process for producing mixture 2 by kneading polythiol into mixture 1. It has a degree. Without taking the above order, epoxy resin, solid basic compound, and PO Compared to when lithiol is mixed all at once, the adhesive mixed in the order described above is at room temperature Even when stored, the viscosity did not increase significantly, and it had a sufficient pot life. Mix in the order described above. While adhesives that have been mixed together have a sufficient working time, the amount of adhesive mixed all at once is unthinkable. Solid basic compounds can be added, and further rapid curing can be expected.

[0027] (Adhesive containing thixotropic agent) Furthermore, the manufacture of adhesives containing thixotropes can be carried out in the following order of processes. First, the epoxy resin and thixotropic agent are kneaded together to produce mixture 3. A step of kneading a solid basic compound into the mixture 3 to produce a mixture 4, A step of kneading polythiol into the mixture 4 to produce mixture 5. Adhesives mixed in this order had a longer pot life. Another method involves preparing a mixture 1 by kneading epoxy resin and a solid basic compound. The process involves kneading polythiol and thixotropic agent to produce mixture 6, and the above mixture 1 and The manufacturing method may also include the step of kneading mixture 6 to produce mixture 7. In this case, poly The thiol's viscosity increases due to the thixotropic agent, and it interacts with the solid basic compound coated with epoxy resin. Contact with polythiol is further suppressed. Alternatively, prepare the above mixture 4, and mix 4 Alternatively, the mixture 6 may be kneaded together to produce the mixture 8. In this case, more The thixotropic agent can be mixed in, further extending its pot life.

[0028] (Silane coupling agent) The adhesive according to the present invention may further contain a silane coupling agent. Examples of silane coupling agents include epoxy groups, mercapto groups, isocyanate groups, and flu A silane coupling agent having an ore skeleton can be used. However, silane coupling agents Because the coupling agent is a low-viscosity liquid, it is suitable for basic silane coupling, such as with amine compounds. The agent acts as a catalyst, initiating the reaction immediately and shortening the pot life, therefore it should be used. That is inappropriate.

[0029] When using the adhesive of the present invention in situations where stronger adhesion is desired at the interface between the adherend and the adhesive. As for silane coupling agents, those having epoxy groups or mercapto groups are preferred. It is difficult. Since the main component is epoxy resin and the hardener is polythiol, these silar It has good compatibility with coupling agents, and peeling at the interface between the adherend and the adhesive is less likely to occur. It is thought that... The mixing order of the silane coupling agents is not particularly limited, but epoxy group-containing silane coupling agents The ring agent consists of an epoxy resin as the main component and a mercapto group-containing silane coupling agent, polythio It is preferable to mix them at the same time as the other ingredients.

[0030] (Other ingredients) The resin composition containing the above components includes diluents and other substances commonly used in epoxy adhesives. The following additives may be added as needed. For example, the addition of fillers as necessary and as appropriate. It can be implemented.

[0031] (Inkjet head) The epoxy resin composition of the present invention is an adhesive for bonding components of an inkjet head. It can be used suitably. Figure 1 is a perspective view showing one form of an inkjet head, and Figure 2 is a perspective view showing one form of an inkjet head. This is a schematic cross-sectional view showing the configuration. The inkjet head 1 is a recording element that ejects ink. The substrate 2 supports the recording element substrate 2 and has a supply channel 3 that supplies ink to the recording element substrate. It includes a support member 4 and a flow path member 5 that supplies ink to the supply flow path 3. The flow channel member 5 may be composed of multiple parts. For example, as shown in Figure 2, The flow channel member 5 may consist of a first flow channel member 6, a second flow channel member 7, and a third flow channel member 8.

[0032] In the manufacturing process of inkjet heads, two components, such as each flow channel component, are bonded together with precision. Because it is necessary to do so, it may be assembled in the following procedure: Adhere to support member 4. The agent is applied to temporarily fix the recording element substrate in place for a short time, and then fully cured. Third channel member 8 The first channel member 6 is then bonded to the second channel member 7, and the first channel member 6 is then bonded to the second channel member 7. Next, create the flow channel member 5. Then, temporarily fasten the support member 4 and the first flow channel member 6 of the flow channel member 5 together. Finally, let it harden completely.

[0033] The epoxy resin composition of the present invention has a sufficient pot life after being prepared as a single-component solution, and further Because it also has excellent temporary fixing properties, it is particularly suitable as an adhesive for the joint surface between the support member 4 and the first flow channel member 6. Suitable for use. The joint surface between the first flow channel member 6 and the second flow channel member 7, and the third flow channel member 7 and the third It can be suitably used on at least one joint surface between two members, such as the joint surface with the flow channel member 8. Of course, it can also be suitably used on the bonding surface between the support member 4 and the recording element substrate 2. The support member 4 and the flow channel member 5 are made of ceramics such as alumina and modified polyphenylene Resins with excellent dimensional accuracy, such as fluoropolymer resins ("Zylon" (registered trademark), manufactured by Asahi Kasei Corporation, etc.) Engineering plastics are used. The adhesive of the present invention is cured by basic thiols. Therefore, functional groups that contribute to adhesion, such as hydroxyl groups, are not lost relatively well during the curing reaction, and inkjet It can be suitably used as an adhesive for bonding parts of a head unit. [Examples]

[0034] Next, the method for manufacturing the adhesive of the present invention will be explained with reference to examples. (Examples 1-13, Comparative Examples 1-9) Table 1 shows the composition ratios of the examples, and Table 2 shows the composition ratios of the comparative examples. Furthermore, the mixing method is indicated by arrows showing the mixing order of each mixture. Mixture 1 (main agent + curing catalyst), Mixture 2 (mixture 1 + curing agent), Mixture 3 (main agent + chrysalis (Solution agent), Mixture 4 (Mixture 3 + curing catalyst), Mixture 5 (Mixture 4 + curing agent), Mixture 6 ( (Hardening agent + thixotropic agent), Mixture 7 (Mixture 1 + Mixture 6), Mixture 8 (Mixture 4 + Mixture 6) ).

[0035] Examples 1, 2, and 7 involved kneading the epoxy resin, which was the main component, with the solid basic compound, which was the catalyst. After 12 hours, polythiol, which is a hardening agent, was kneaded in (mixture 1 → 2). Examples 3-6 and 8-12 involved kneading the epoxy resin, which was the main component, with the thixotropic agent, followed by the catalyst. A solid basic compound was kneaded, and after 12 hours, polythiol, which is a curing agent, was kneaded in. mixture 3→4→5). Example 13 involves kneading the epoxy resin, which is the main component, with the solid basic compound, which is the catalyst, to form a mixture. 1. Separately, the hardening agent, polythiol, and the thixotropic agent, silica filler, are kneaded and mixed. Let this be substance 6. After 12 hours, mixture 1 and mixture 6 were kneaded together (mixture 1 → 6 → 7). To mix the thixotropic agent into the epoxy resin, which is the main component, the subsequent solid basicization of the catalyst is required. Considering the mixing of the mixture, there are limitations. In Example 14, the main component is epoxy resin. Mixture 3 is prepared by kneading 100 parts by mass of silica filler, which is a thixotropic agent, with 10 parts by mass of silica filler. After preparation, a mixture 4 was prepared by kneading in a solid basic compound, which served as a catalyst. Separately, curing was performed. 66 parts by mass of the thixotropic agent, polythiol, and 6.6 parts by mass of silica filler. Mixture 6 was prepared by kneading. After 12 hours, mixture 4 and mixture 6 were kneaded together to make mixture 8. (Mixture 3→4→6→8). In contrast, in Comparative Examples 1-9, all materials were mixed simultaneously.

[0036] The mixing of the main component, epoxy resin, and the thixotropic agent is done using HIVIS MI from Primix Corporation. In the X model3, epoxy resin and thixotropic agent are used in a vacuum at 60 rpm for 60 minutes. The mixing was carried out under vacuum at 60 rpm for 5 minutes.

[0037] The time it took for the viscosity to double at room temperature (25°C) was measured and defined as the pot life of the adhesive. 100 The gel time when heated to °C was measured to evaluate the short-term curing (temporary fixing) properties of the adhesive. Ta.

[0038] The judgment was as follows: ◎: Pot life of 8 hours or more, and gel time of 3 seconds or less. ○: Pot life is 3 hours or more but less than 8 hours, and gel time is more than 3 seconds but less than 10 seconds. ×: Pot life is less than 3 hours, or gel time is 10 seconds or longer.

[0039] In Comparative Examples 1 and 2, a liquid basic compound was used as the catalyst. In Comparative Example 1, the amount of catalyst was small. Therefore, the gel time is long. When the amount of catalyst added is increased, as in Comparative Example 2, the pot life is short. Despite this, the gel time does not shorten. Epoxy resin, liquid basic compound, and polythio When the mixture is kneaded, the liquid basic compound and the polythiol mix together, thus reducing the pot life. It is considered that temporary fixing properties cannot be achieved simultaneously.

[0040] In Comparative Examples 7-9, solid basic compounds were used. The viscosity was twice as high in Comparative Example 1 compared to Comparative Example 9. The time to reach the desired state is the same at 14 hours, but the gel time is shorter in Comparative Example 9. Liquid basicization Using a solid basic compound instead of a compound brought us somewhat closer to achieving a balance between pot life and temporary fixation. However, the gel time in Comparative Example 9 was 78 seconds, which is long for a temporary fixing process. There is time, but it cannot be called a temporary fixing adhesive. To improve the temporary fixation of Comparative Example 9, the amount of solid basic compound was increased in Comparative Examples 6-8. The greater the amount of solid basic compound, the shorter the gel time and the better the temporary fixation. The pot life was shortened. It is made from epoxy resin, polythiol, and solid basic compounds. When using a resin and mixing all materials simultaneously, to obtain a sufficient pot life, epoxy resin is necessary. For every 100 parts by mass of fat, the amount of solid basic compound should be less than 3 parts by mass, and even less than 0.5 parts by mass. It is preferable that the amount of the solid basic compound is less than 3 parts by mass, which provides a sufficient pot life. Yes, but it cannot be considered a temporary adhesive.

[0041] In Example 1 and Comparative Example 3, and in Example 2 and Comparative Example 6, the same composition was used, but the manufacturing method was changed. As can be seen from the comparison between Example 1 and Comparative Example 3, and between Example 2 and Comparative Example 6, the gel time remains unchanged. However, in the embodiments of the present invention, the pot life is significantly extended in each case. The solid basic compound is epoxy Because it is covered with xylin resin, the dissolution of solid basic compounds into polythiol is suppressed. This allows for a slower viscosity increase even at room temperature with a single liquid, resulting in a longer pot life. On the other hand, since the composition was the same, the gel time did not change. The epoxy resin, which is the main component, reacted with the gel. A solid basic compound, which serves as a medium, is kneaded into a mixture, and this mixture is then mixed with a polythiol, which is a curing agent. Through a mixing process, an adhesive was created that achieves both long working time and temporary fixing properties.

[0042] As for the amount of solid basic compound used as a catalyst added, as shown in Comparative Examples 6-9, the curing agent is Looking at the composition of ester-type curing agents, which are relatively slow-reactive, if the amount is 3 parts by mass or more, the gel time is 1 The gel time is less than 0 seconds. The more solid basic compound added, the shorter the gel time becomes. If the amount exceeds 10 parts by mass, the viscosity of the adhesive itself increases, and the amount of unreacted catalyst also increases. 3 to 10 parts by mass is preferred. However, in Comparative Examples 6 to 9, the solid basic compound was prepared in advance. Because it does not undergo the process of being coated with epoxy resin, its pot life is short.

[0043] In Examples 3-5, the effect of the type of solid basic compound used as a catalyst was investigated. Even with basic compounds, both pot life and temporary fixation properties were achieved. In Examples 5 and 6, the effect of the type of polythiol used as the curing agent was investigated. Even with thiols, a balance of pot life and temporary fixing properties was achieved. Compared to polythiols with an ester skeleton. In all cases, the temporary fixing time was shortened for polythiols with an ether skeleton. When temporary fixing properties are required, highly reactive ether-type polythiols are preferred.

[0044] Examples 7 through 14 examine the amount of thixotropin used. Compared to the additive-free (0 parts by mass) in Example 7, up to 1 and 2.5 parts by mass in Examples 8 and 9 are used. The pot life was extended. By adding a thixotropic agent to the epoxy resin, the solid basic compound was coated. The viscosity of the polyoxy resin can be increased, thereby improving its thixotropy. As a result, polythio The dissolution of solid basic compounds is suppressed, and the solid basic compounds act as basic catalysts. This is likely because it took time for the polymerization reaction between the oxy resin and the polythiol to begin. In Examples 10-12, even when exceeding 2.5 parts by mass (up to 5, 10, and 15 parts by mass), the pot life remained the same. There is almost no change. It has the effect of suppressing the dissolution of solid basic compounds into polythiols. This is thought to be because the system is saturated. In Example 13, a polyol hexixol agent was added. Compared to Example 7 (without additive), the potability was... The interval was slightly extended. Adding a thixotropic agent to the polythiol resulted in the solid basicization of the polyol. The dissolution of the compound appears to have been suppressed. In Example 14, 10 parts by mass of thixotropic agent were added to the epoxy resin, and 6.6 parts by mass of thixotropic agent were added to the polythiol. Each was added in parts by mass. The total amount of thixotropic agent per 100 parts by mass of epoxy resin was 1 The pot life is further extended by using 6.6 parts by mass. Epoxy resin and polythio By adding thixotropin to both sides, the solubility of solid basic compounds in polythiol is improved. It is thought that this further suppressed the growth. It is possible to achieve both pot life and temporary fixation without adding thixotropic agents. It is possible, but if you want a longer pot life, depending on the type of main agent and hardener, thixotropic agents may be needed. It is preferable to add [a certain substance], and it is confirmed that the content is preferably 1 to 20 parts by mass. It was acknowledged.

[0045] [Table 1]

[0046] [Table 2]

[0047] The abbreviations used in the table are as follows. The same applies to the following tables. jER828: Product name, Bisphenol A type epoxy resin (Epoxy equivalent: 184~1 94) Manufactured by Mitsubishi Chemical Corporation Product name: jER152, manufactured by Mitsubishi Chemical Corporation. Aerosil 200: Product name "AEROSIL200", manufactured by Aerosil Japan Co., Ltd. PEPT: Pentaerythritol tripropanthol (thiol equivalent: approx. 115) , manufactured by SC Organic Chemical Co., Ltd. TMMP: Trimethylolpropane Tris(3-mercaptopropionate)(thio Equivalent weight: approximately 133), manufactured by SC Organic Chemicals Co., Ltd. PN23J: Product name "Amicure PN-23J", manufactured by Ajinomoto Fine Techno Co., Ltd. MY-24: Product name "Amicure MY-24", manufactured by Ajinomoto Fine Techno Co., Ltd. MY-25: Product name "Amicure MY-25", manufactured by Ajinomoto Fine Techno Co., Ltd. PN40J: Product name "Amicure PN-40J", manufactured by Ajinomoto Fine Techno Co., Ltd. 1B2PZ: Product name "Curezol 1B2PZ", manufactured by Shikoku Chemicals Co., Ltd.

[0048] (Examples 15-27) Tables 3 and 4 show the composition ratios for Examples 15-27. The composition ratios for Examples 5 and 6 are also shown. vinegar. Examples 15, 17-19 were conducted in the same manner as in Example 14, after which mixture 3 was prepared, and then silang was added to mixture 3. A coupling agent is added and kneaded, then a solid basic compound, which is a catalyst, is added and kneaded. Mixture 4 was then prepared. The remaining thixotropic agent was kneaded with the polythiol, which is the curing agent. Mixture 6 was prepared. After 12 hours, mixture 6 was kneaded into mixture 4 to make mixture 8. Example 16 uses a silane coupling agent containing a mercapto group, so silane coupling Mixture 8 was prepared in the same manner as in Example 14, except that the additive was added to mixture 6. Furthermore, in Examples 20, 21, and 23-27, after preparing mixture 3, the same process as in Example 11 was followed by mixing. A silane coupling agent is added to substance 3 and kneaded, and then a solid basic compound, which is a catalyst, is added. Mixture 4 was prepared by adding and kneading. After 12 hours, polythiol, which is a curing agent, was added to mixture 4. Mixture 5 was obtained by kneading the following. In Example 22, at the stage of preparing mixture 5, the curing agent was polythio The mercapto-silane coupling agent was kneaded together with the ru.

[0049] The mixing of the main component, epoxy resin, and the thixotropic agent is done using HIVIS MI from Primix Corporation. In the X model3, epoxy resin and thixotropic agent are used in a vacuum at 60 rpm for 60 minutes. The mixing was carried out under vacuum at 60 rpm for 5 minutes.

[0050] The adhesive was evaluated using the following method. The evaluation of whether the adhesive has both a suitable pot life and gel time was carried out in the same manner as described above. Ta. Additionally, 2g of cured material heated at 160℃ for 2 hours is used as ink (service head ink). The material (non-made) was immersed in 20g of water and heated at 121°C for 10 hours. The mass of the hardened material after immersion was measured. The rate of mass change was calculated by comparing it with the mass before immersion. Furthermore, the components that make up the inkjet head (alumina and alumina) are bonded together with adhesive. Then, it was heated at 160°C for 2 hours. Here, as shown in Figure 3, adhesive 2 The alumina plates 21 and 22, which were bonded together in step 3, were placed on the plate, and measurements were taken through the holes drilled in the alumina plate 21. The adhesive strength was measured using a butt joint method with a jig. The state of delamination was also observed during this process. In the case of component failure, accurate delamination strength cannot be measured, so the delamination strength is indicated as ND. Furthermore, the parts are glued together, heated at 160°C for 2 hours, and then immersed in the ink mentioned above. The samples were heated at 121°C for 60 hours. After washing with water and drying, the adhesive strength was measured using the butt joint method. At the same time, the state of the peeling was observed.

[0051] Determining the appropriate adhesive for an inkjet head is: ◎: Adhesive strength 1.0kgf / mm 2 (9.8N / mm 2 ) did not peel off, and further pressure was applied The part was destroyed and it ended. ○: Adhesive strength of 1.0 kgf / mm 2 (9.8N / mm 2 ) and interfacial delamination. .

[0052] As mentioned above, in Example 5, a polythiol (TMMP) having an ester skeleton was used in Example In step 6, a polythiol (PETE) with an ether skeleton was used. PETE and TMMP are Since the molecular weights relative to the thiol group differ, each polythiol was kneaded in different parts by mass. When using PETE with an ether skeleton compared to TMMP with an ester skeleton, the mass change rate was The size was small, and the adhesive strength after ink contact was strong. Compared to the ester skeleton, the ether skeleton was This is thought to be due to its high chemical resistance, high reactivity, and high crosslinking density. It has an ester skeleton. Compared to other polythiols, polythiols with an ether skeleton are more suitable for inkjet printing. It is preferable as an adhesive for bonding the components of a rod.

[0053] Examples 15-22 investigated the effect of the type of silane coupling agent. Even with coupling agents, it was possible to achieve both a long working time and temporary fixing properties, while also possessing sufficient adhesive strength. In particular, those containing epoxy groups or mercapto groups as silane coupling agents. When using this method, the adhesive strength was measured after ink contact, and instead of interfacial delamination, component failure occurred. It worked. When bonding together the components of an inkjet head, different colors do not mix. Therefore, adhesives that destroy the component are preferable to adhesives that cause interfacial delamination. As an adhesive for bonding the components of the head, epoxy group or mercapto group-containing silane cutter Adhesives with added pulling agents are more preferable. The adhesive contains epoxy resin as the main component. Because it contains polythiol as a curing agent, epoxy group or mercapto group-containing silane The plucking agent likely had good affinity with the main component and the hardening agent, which is thought to have prevented interfacial delamination.

[0054] In Examples 20 and 23-25, the amount of polythiol added was investigated. Even with a small amount, it achieved both long pot life and temporary fixing properties. When the amount of polythiol decreases, the gel The time has become longer. In order to maintain temporary fixing properties, the epoxy resin is used in proportion to 1 equivalent of epoxy. Furthermore, the thiol equivalent of the polythiol is preferably 0.5 or more. As the quantity increased, the rate of mass change increased. Polythio that could not react with epoxy resin As the amount of polythiol increases, the polythiol that could not react dissolves into the ink, and the empty space where the polythiol has been removed It is thought that ink penetrated the space between the molecules, causing a large change in mass. Unreactable polythiols To avoid increasing the amount of epoxy, the thiol of the polythiol is used for 1 equivalent of epoxy in the epoxy resin. The equivalent amount is preferably 1 or less.

[0055] In Examples 20, 26, and 27, the mixing ratio of the two epoxy resins was varied. Even in that ratio, it achieved both usable time and temporary fixing ability. Also, the inkjet head components were attached. It was also suitable as an adhesive for bonding.

[0056] [Table 3]

[0057] [Table 4]

[0058] The silane coupling agents listed in the table are as follows: A-186: Product name "Silquest A-186", Momentive Performance Material Made by Pan Co. A-187: Product name "Silquest A-187", Momentive Performance Material Made by Pan Co. KBM-803: Product name, 3-mercaptopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd. Company-made KBE-9007: Product name, 3-isocyanate propyl triethoxysilane, Shin-Etsu Chemical Co., Ltd. Manufactured by Gaku Kogyo Co., Ltd. X-12-1156: Product name, polyfunctional mercapto-based silane coupling agent, Shin-Etsu Chemical Co., Ltd. Industrial Co., Ltd. X-12-1159L: Product name, polyfunctional isocyanate-based silane coupling agent, trust Manufactured by Etsu Chemical Industry Co., Ltd. OCG-157-3: Fluorene-based silane coupling agent, manufactured by Osaka Gas Chemical Co., Ltd.

[0059] (Example 28) Generally, if the adhesive is a mixture of liquid and solid components, the space between the adherends When used in narrow areas of several tens of micrometers, the movement of solid components is restricted within the narrow gap, resulting in separation of the mixture. This occurs, causing bleeding during the curing reaction and resulting in poor curing. In this invention, the curing catalyst is solid. Yes, there was a concern about breeding, so the presence or absence of breeding was confirmed using the following procedure. In the example, bonding was performed using a spacer of a predetermined size. Without spacer, 5 The thickness was varied to 10, 20, and 30 μm to check for bleeding and whether or not hardening occurred. No bleeding was observed in any of the samples, and no uncured components were found. This is because the solid components came into contact with each other. This is because it is a medium and the reaction proceeds even in small amounts, and in the method of the present invention, a large amount of catalyst is included, I suspect this is due to the high reactivity of the polythiol hardening agent.

[0060] The adhesive of the present invention, due to its reactivity, undergoes a first thermal curing process that provides temporary fixation, and then proceeds from this first thermal curing process. By performing a second thermal curing process, which involves a longer curing time, in two stages, particularly precise bonding can be achieved. It is suitable for joining things together. For example, a Si substrate on which an ink ejection pressure generating element and wiring for applying electrical pulses are formed. Ink is supplied to the recording element, which has an ink channel and ejection port located above, using alumina. Systems and other components may be joined together. In such cases, the flow channels are joined together with precision. To achieve this, the adhesive needs to be aligned, then held in place and allowed to harden. The hardening process, which allows the material to harden, takes at least one hour. The material is then heat-cured using a jig or similar tool for positioning. Holding it in a furnace is extremely difficult. Therefore, using the adhesive of the present invention, a heat tool The material is applied directly to the Si substrate of the recording element and heated; at 100°C, it hardens in a few seconds, providing temporary fixation. It is possible. After temporary fixing, the adhesive has hardened, so it will not shift even when the jig is removed. The final curing can be performed in a heating furnace. The second stage of heat curing, which is the final curing, is performed to ensure the adhesive is sufficiently hardened. Therefore, it naturally takes longer than the first heat curing, which is a temporary fixation. The second heat curing is the It is preferable that the curing temperature is higher than that of the first heat curing. The curing time and curing temperature are combined. The main component, hardener, type and composition ratio of solid basic compounds, and other additives are appropriately optimized. You can select the appropriate conditions. Also, especially if a thixotropic agent has been added, inkjet The flow of adhesive into the fine channels of the diaphragm can also be controlled, and ether-type polythiols can be used. High ink resistance can be expected, and adhesive reliability is also ensured.

[0061] As shown in Table 5, in Example 21, the solid basic compound PN40J was changed from 5 parts by mass to 3 The adhesive was prepared in the same manner except that the mass portion was changed. Using this adhesive, the inkjet Two modified polyphenylene ether resin plates (product name "Zylon") are used as components for the head unit. It was laminated with "L564Z" (registered trademark), manufactured by Asahi Kasei Corporation (abbreviation: m-PPE). It was allowed to harden for 2 hours. When the parts were peeled off using a butt joint method, cohesive failure of the adhesive occurred. The adhesive of the present invention is It exhibited sufficient adhesion to the m-PPE resin sheet.

[0062] [Table 5]

[0063] (Examples 29-37) Examples 29-37 investigated the ability to apply thick coatings. If the adhesive is too thin, it may not spread sufficiently and could peel off during use. Therefore, a thick layer of adhesive is required. We considered whether it was possible to apply the adhesive thickly. Table 6 shows the composition ratios of Examples 29-37. The composition ratio of Example 16 is also shown. Example 29 was prepared in the same manner as Example 16, except for the addition of fused silica as a filler. Example 30 ~35 is similar to Example 14, with thixotropin added to 100 parts by mass of epoxy resin, which is the main component. After preparing a mixture 3 by kneading 10 parts by mass of silica filler, which is the agent, and an organic thixotropic agent, the catalyst A mixture 4 was prepared by kneading a solid basic compound. Separately, a curing agent was used. A mixture prepared by kneading 66 parts by mass of thiol with 6.6 parts by mass of silica filler, which is a thixotropic agent. Product 6 was prepared. After 12 hours, mixture 4 and mixture 6 were kneaded together to make mixture 8 (organic The thixotropic compound is a mixture 3).

[0064] Example 36 uses silica as the thixotropic agent in a mixture of 100 parts by mass of epoxy resin as the main component. After preparing mixture 3 by kneading 10 parts by mass of filler, a solid basic compound, which is the catalyst, is kneaded in. A mixture 4 was prepared. Separately, 66 parts by mass of polythiol, which is a curing agent, was mixed with thiol. A mixture 6 was prepared by kneading 6.6 parts by mass of silica filler, which is a thixotropic agent, with an organic thixotropic agent. After 12 hours, mixture 4 and mixture 6 were kneaded together to make mixture 8. (Organic thixotropic agent mixture) The combination is a mixture of 6).

[0065] Example 37 uses silica as the thixotropic agent in a mixture of 100 parts by mass of epoxy resin as the main component. After preparing a mixture 3 by kneading 10 parts by mass of filler and 1.5 parts by mass of organic thixotropic agent, the mixture was treated with a catalyst. A mixture 4 was prepared by kneading a certain solid basic compound. Separately, a curing agent, Poly, was used. For every 66 parts by mass of all, 6.6 parts by mass of silica filler, which is a thixotropic agent, and organic thixotropic agent are used. Mixture 6 was prepared by kneading 1.5 parts by mass of the agent. After 12 hours, mixture 4 and mixture 6 were mixed. It was kneaded to make mixture 8. (Mixtures 3 and 6 contain organic thixotropes).

[0066] The mixing of the main component, epoxy resin, and the thixotropic agent is done using HIVIS MI from Primix Corporation. In the X model3, epoxy resin and thixotropic agent are used in a vacuum at 60 rpm for 60 minutes. The mixing was carried out under vacuum at 60 rpm for 5 minutes. The thickness of the adhesive application was evaluated using the following method. The thixotropy was measured using a viscometer. Specifically, it was measured at rotation speeds of 10 rpm and 50 rpm. The viscosity at 10 rpm was determined, and the thixotropic value was defined as (viscosity at 10 rpm) / (viscosity at 50 rpm). A higher value indicates better shape retention, allowing for a thicker application of adhesive. Furthermore, at room temperature... Chixoprofen levels were measured every two hours, and a level of 3 or higher after eight hours was marked as ◎. Levels less than 3 were considered excellent. Those with a rating of ○ were marked as such. Those with a rating of less than 3 were deemed difficult to apply thickly, and were therefore limited to use as thin coats. Yes. Furthermore, to confirm that thick application is possible, we checked whether a 0.7mm thick coating was feasible. Apply with a 18G (inner diameter 0.84mm) drill bit. A coating height of 0.7mm or more is considered excellent. Items less than m were marked with a circle (〇).

[0067] In Example 16, the thixotropy was approximately 1, and it was not possible to apply a coating thicker than 0.7 mm. Similarly, Example 29 is a mixture of the composition of Example 16 with a high concentration of silica as a filler, resulting in a high viscosity. However, the thixotropy was about 1, and the thick coating properties were the same as in Example 16. On the other hand, Example 3 For samples 0-37, in addition to inorganic thixotropes, organic thixotropes were also used. By using both, The thixotropy was 3 or higher, allowing for a thickness of 0.7 mm or more. This is due to the inorganic thixotropy. The silica surface of the agent has countless hydroxyl groups, which interact with the functional groups of organic thixotropic agents. Therefore, it is assumed that it became high-tick-spot.

[0068] [Table 6]

[0069] The thixotropic agents and fillers listed in the table are as follows: RHEOCIN, RHEOBYK-430, RHEOBYK-431, RHEOBYK-R606: BYK brand names Disparon 3600N, 3900EF: Product names manufactured by Kusumoto Kasei Co., Ltd. FB-5D: Denka product name [Explanation of symbols]

[0070] 1. Inkjet head 2. Recording element substrate 3. Supply channel 4. Support members 5 Flow channel members 6. First flow channel member 7. Second flow channel member 8 Third flow channel member

Claims

1. A method for producing an epoxy resin composition comprising an epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of producing a mixture 3 obtained by kneading the epoxy resin, the inorganic thixotropic agent, and the organic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, A step of kneading the polythiol and the inorganic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 4 and the aforementioned mixture 6 to produce a mixture 8, Includes, A method for producing an epoxy resin composition, characterized in that the inorganic thixotropic agent is silica.

2. A method for producing an epoxy resin composition comprising an epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of producing a mixture 3 obtained by kneading the epoxy resin and the inorganic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, A step of kneading the aforementioned polythiol, the aforementioned inorganic thixotropic agent, and the aforementioned organic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 4 and the aforementioned mixture 6 to produce a mixture 8, Includes, A method for producing an epoxy resin composition, characterized in that the inorganic thixotropic agent is silica.

3. A method for producing an epoxy resin composition comprising an epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of producing a mixture 3 obtained by kneading the epoxy resin, the inorganic thixotropic agent, and the organic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, A step of kneading the aforementioned polythiol, the aforementioned inorganic thixotropic agent, and the aforementioned organic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 4 and the aforementioned mixture 6 to produce a mixture 8, Includes, A method for producing an epoxy resin composition, characterized in that the inorganic thixotropic agent is silica.

4. A method for producing an epoxy resin composition comprising an epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of producing a mixture 3 obtained by kneading the epoxy resin, the inorganic thixotropic agent, and the organic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, The process involves kneading the polythiol into the mixture 4 to produce the mixture 5. Includes, A method for producing an epoxy resin composition, characterized in that the inorganic thixotropic agent is silica.

5. A method for producing an epoxy resin composition comprising an epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of kneading the epoxy resin and the solid basic compound to produce a mixture 1, A step of kneading the aforementioned polythiol, the aforementioned inorganic thixotropic agent, and the aforementioned organic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 1 and the aforementioned mixture 6 to produce a mixture 7, Includes, A method for producing an epoxy resin composition, characterized in that the inorganic thixotropic agent is silica.

6. A method for producing an epoxy resin composition according to any one of claims 1 to 5, wherein the thiol equivalent of the polythiol is 0.5 to 1 equivalent per 1 equivalent of epoxy of the epoxy resin.

7. A method for producing an epoxy resin composition according to any one of claims 1 to 6, further comprising the step of adding a silane coupling agent.

8. The method for producing an epoxy resin composition according to claim 7, wherein the silane coupling agent is a silane coupling agent having an epoxy group and / or a mercapto group.

9. A method for producing an epoxy resin composition according to any one of claims 1 to 8, wherein the solid basic compound is mixed with 100 parts by mass of the epoxy resin in a manner that the content of the solid basic compound is 3 to 10 parts by mass.

10. A method for producing an epoxy resin composition according to any one of claims 1 to 9, wherein the polythiol is pentaerythritol tripropanthol.

11. A method for manufacturing a liquid ejection head having a recording element substrate for ejecting ink, a support member having a supply channel for supporting the recording element substrate and supplying ink to the recording element substrate, and a channel member for supplying ink to the supply channel, A step of manufacturing an adhesive by a method for manufacturing an epoxy resin composition according to any one of claims 1 to 10, A step of applying the adhesive to at least one bonding surface between any two of the recording element substrate, the support member, and the flow path member to bond the two members together. A method for manufacturing a liquid dispensing head that includes [a specific component].

12. A method for manufacturing a liquid ejection head having a recording element substrate for ejecting ink, a support member having a supply channel for supporting the recording element substrate and supplying ink to the recording element substrate, and a channel member for supplying ink to the supply channel, A process for manufacturing an adhesive containing epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of applying the adhesive to at least one bonding surface between any two of the recording element substrate, the support member, and the flow path member to bond the two members together, Includes, The process for manufacturing the aforementioned adhesive is as follows: A step of producing a mixture 3 obtained by kneading the epoxy resin, the inorganic thixotropic agent, and the organic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, A step of kneading the polythiol and the inorganic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 4 and the aforementioned mixture 6 to produce a mixture 8, Includes, A method for manufacturing a liquid dispensing head, characterized in that the inorganic thixotropic agent is silica.

13. A method for manufacturing a liquid ejection head having a recording element substrate for ejecting ink, a support member having a supply channel for supporting the recording element substrate and supplying ink to the recording element substrate, and a channel member for supplying ink to the supply channel, A process for manufacturing an adhesive containing epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of applying the adhesive to at least one bonding surface between any two of the recording element substrate, the support member, and the flow path member to bond the two members together, Includes, The process for manufacturing the aforementioned adhesive is as follows: A step of producing a mixture 3 obtained by kneading the epoxy resin and the inorganic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, A step of kneading the aforementioned polythiol, the aforementioned inorganic thixotropic agent, and the aforementioned organic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 4 and the aforementioned mixture 6 to produce a mixture 8, Includes, A method for manufacturing a liquid dispensing head, characterized in that the inorganic thixotropic agent is silica.

14. A method for manufacturing a liquid ejection head having a recording element substrate for ejecting ink, a support member having a supply channel for supporting the recording element substrate and supplying ink to the recording element substrate, and a channel member for supplying ink to the supply channel, A process for manufacturing an adhesive containing epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of applying the adhesive to at least one bonding surface between any two of the recording element substrate, the support member, and the flow path member to bond the two members together, Includes, The process for manufacturing the aforementioned adhesive is as follows: A step of producing a mixture 3 obtained by kneading the epoxy resin, the inorganic thixotropic agent, and the organic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, A step of kneading the aforementioned polythiol, the aforementioned inorganic thixotropic agent, and the aforementioned organic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 4 and the aforementioned mixture 6 to produce a mixture 8, Includes, A method for manufacturing a liquid dispensing head, characterized in that the inorganic thixotropic agent is silica.

15. A method for manufacturing a liquid ejection head having a recording element substrate for ejecting ink, a support member having a supply channel for supporting the recording element substrate and supplying ink to the recording element substrate, and a channel member for supplying ink to the supply channel, A process for manufacturing an adhesive containing epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of applying the adhesive to at least one bonding surface between any two of the recording element substrate, the support member, and the flow path member to bond the two members together, Includes, The process for manufacturing the aforementioned adhesive is as follows: A step of producing a mixture 3 obtained by kneading the epoxy resin, the inorganic thixotropic agent, and the organic thixotropic agent, The process involves kneading the solid basic compound into the mixture 3 to produce a mixture 4, The process involves kneading the polythiol into the mixture 4 to produce a mixture 5, Includes, A method for manufacturing a liquid dispensing head, characterized in that the inorganic thixotropic agent is silica.

16. A method for manufacturing a liquid ejection head having a recording element substrate for ejecting ink, a support member having a supply channel for supporting the recording element substrate and supplying ink to the recording element substrate, and a channel member for supplying ink to the supply channel, A process for manufacturing an adhesive containing epoxy resin, an inorganic thixotropic agent, an organic thixotropic agent, a solid basic compound, and a polythiol, A step of applying the adhesive to at least one bonding surface between any two of the recording element substrate, the support member, and the flow path member to bond the two members together, Includes, The process for manufacturing the aforementioned adhesive is as follows: A step of kneading the epoxy resin and the solid basic compound to produce a mixture 1, A step of kneading the aforementioned polythiol, the aforementioned inorganic thixotropic agent, and the aforementioned organic thixotropic agent to produce a mixture 6, A step of kneading the aforementioned mixture 1 and the aforementioned mixture 6 to produce a mixture 7, Includes, A method for manufacturing a liquid dispensing head, characterized in that the inorganic thixotropic agent is silica.

17. A method for manufacturing a liquid dispensing head according to any one of claims 12 to 16, comprising a first thermal curing step in which the two members are temporarily fixed together using the adhesive, and a second thermal curing step in which the curing is permanent and takes longer than the first thermal curing step.

18. A method for manufacturing a liquid dispensing head according to any one of claims 12 to 17, wherein the thiol equivalent of the polythiol is 0.5 to 1 equivalent per 1 equivalent of epoxy of the epoxy resin.

19. A method for manufacturing a liquid dispensing head according to any one of claims 12 to 18, further comprising the step of adding a silane coupling agent.

20. The method for manufacturing a liquid discharge head according to claim 19, wherein the silane coupling agent is a silane coupling agent having an epoxy group and / or a mercapto group.

21. A method for manufacturing a liquid dispensing head according to any one of claims 12 to 20, wherein the solid basic compound is mixed with 100 parts by mass of epoxy resin so that the content is 3 to 10 parts by mass.

22. The method for manufacturing a liquid dispensing head according to any one of claims 12 to 21, wherein the polythiol is pentaerythritol tripropanthol.

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