Piezoelectric vibration device

Abstract

To provide a piezoelectric vibration device which allows a user to check the characteristics of a piezoelectric vibrator without removing mold resin.SOLUTION: A piezoelectric vibration device 1 has: at least a vibrator 2; a mold part 12 protecting at least the piezoelectric vibrator 2; and a substrate 11 which has, on one principal surface, a first mounting surface 11a that has a wiring pattern including a plurality of connection terminals 11d and a second mounting surface 11b having a plurality of external connection terminals 11g. The piezoelectric vibration device 1 is structured such that at least the piezoelectric vibrator 2 is connected to the plurality of connection terminals 11d, and it is covered with the mold part 12 in a manner at least including the piezoelectric vibrator 2. On the second mounting surface side, the substrate 11 has an inspection terminal 11k which is electrically connected, not via the external connection terminals 11g, to the connection terminals 11d provided with the piezoelectric vibrator 2.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] This invention relates to a piezoelectric vibration device.

Background Art

[0002] Piezoelectric vibration devices include, for example, crystal oscillators using a crystal vibrating piece. The crystal oscillator has a crystal vibrating piece which is a piezoelectric element, a holding member for holding the crystal vibrating piece, and a lid member for sealing the holding member. The crystal vibrating piece is held in a box-shaped holding member made of an insulator such as ceramic in the crystal oscillator. The crystal oscillator is sealed by the lid member with the electrodes of the crystal vibrating piece and the electrodes of the holding member joined together, and the crystal vibrating piece in the holding member is sealed.

[0003] With the miniaturization of various electronic devices, there is a demand for miniaturization of packages for piezoelectric vibration devices in which the piezoelectric element and integrated circuit element are mounted on a substrate. Therefore, a piezoelectric vibration device in which a piezoelectric oscillator having a laminated structure and the integrated circuit element are mounted on the substrate is known. For example, the piezoelectric vibration device (electronic component) incorporating the piezoelectric oscillator (piezoelectric component) described in Patent Document 1 includes a substrate in which a first insulator having external connection terminals (mounting terminals) formed on the lower surface and a second insulator having wiring electrodes formed on the upper surface and electrically connected to the external connection terminals are laminated, a piezoelectric oscillator disposed on the surface of the second insulator where the wiring electrodes are formed and electrically connected to the wiring electrodes, and a mold resin covering the second insulator and including the piezoelectric oscillator.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The piezoelectric vibration device described in Patent Document 1 has a castellation on the side surface of the first insulator that is recessed inward from the first insulator. A castellation metal film is formed on the castellation that is electrically connected to the external connection terminal. In the piezoelectric vibration device, the external connection terminal is extended to the side surface of the first insulator by the castellation metal film. In other words, the castellation metal film functions as part of the external connection terminal. Therefore, when the piezoelectric vibration device is connected to the terminal of an external substrate by solder, the bonding strength can be improved by the solder adhering to the external connection terminal and the castellation metal film.

[0006] Furthermore, the castellated metal film located on the side surface of the first insulator is electrically connected to the piezoelectric vibrator molded with molding resin via the external connection terminal. Therefore, the piezoelectric vibration device can measure the characteristics of the molded piezoelectric vibrator using the castellated metal film. The characteristics of the piezoelectric vibrator can be measured by bringing a probe of the inspection device into contact with the castellated metal film located on the side surface of the first insulator. On the other hand, in piezoelectric vibration devices manufactured by a method in which a large number of sheets are molded together and then cut individually, it is difficult to provide a castellated metal film on the side surface of the substrate, which is the cut surface. Therefore, in piezoelectric element devices manufactured by the above method and without a castellated metal film, it becomes necessary to remove the molding resin in order to confirm the characteristics of the molded piezoelectric vibrator. However, there was a possibility that the characteristics of the piezoelectric vibrator would change due to the removal of the molding resin.

[0007] The present invention aims to provide a piezoelectric vibration device that allows the characteristics of a piezoelectric vibrator to be confirmed without removing the molded resin. [Means for solving the problem]

[0008] The inventors investigated a piezoelectric vibration device that can confirm the characteristics of a piezoelectric vibrator without removing the molded resin. As a result of diligent investigation, the inventors came up with the following configuration.

[0009] The piezoelectric vibration device comprises at least a piezoelectric vibrator, at least a resin molded portion protecting the piezoelectric vibrator, a component mounting surface having a wiring pattern including a plurality of pads on one main surface, and a mounting surface having a plurality of external connection terminals connected to the wiring pattern and for connection to an external substrate on the other main surface parallel to the one main surface, wherein at least the piezoelectric vibrator is mounted on the component mounting surface with the plurality of pads connected, and at least a portion of the component mounting surface is covered by the resin molded portion so as to include at least the piezoelectric vibrator. The resin substrate has an inspection terminal on the mounting surface side that connects to the pad on which the piezoelectric vibrator is mounted without going through the external connection terminals.

[0010] In the above configuration, the piezoelectric vibration device has an inspection terminal electrically connected to a pad on the mounting surface side of the resin substrate on which a piezoelectric vibrator is mounted. The inspection terminal is located on the mounting surface side of the resin substrate that is not molded by the resin mold portion. Therefore, the piezoelectric vibration device allows the characteristics of the piezoelectric vibrator to be checked by the inspection terminal without removing the resin mold portion of the piezoelectric vibrator. Furthermore, the circuit for checking the characteristics of the piezoelectric vibrator consists of the pad, the inspection terminal, and the circuit wiring that electrically connects the pad and the inspection terminal. Therefore, the measurement result of the characteristics of the piezoelectric vibrator is only affected by the parasitic capacitance contained in the pad, the inspection terminal, and the circuit wiring that electrically connects the pad and the inspection terminal. In other words, the circuit for checking the piezoelectric vibrator is configured so that the path from the inspection terminal to the piezoelectric vibrator is as simple as possible. This makes it possible to check the characteristics of the piezoelectric vibrator while suppressing the influence of parasitic capacitance.

[0011] Furthermore, the inspection terminal is located on the mounting surface side of the resin substrate. Therefore, the inspection terminal of the piezoelectric vibration device of the present invention can be provided on a mold-sealed type piezoelectric vibration device in which multiple devices are manufactured together using a composite substrate and then separated into individual units.

[0012] From another perspective, the piezoelectric vibration device of the present invention preferably includes the following configuration: The inspection terminals are positioned so as not to overlap with the pad on which the piezoelectric vibrator is mounted and the plurality of external connection terminals when viewed in a direction perpendicular to the mounting surface.

[0013] In the above configuration, the inspection terminal does not overlap with either the pad on which the piezoelectric vibrator is mounted or any of the multiple external connection terminals when viewed perpendicular to the mounting surface. In other words, the inspection terminal is not directly connected to the pad or the external connection terminals. Therefore, the circuit for inspecting the piezoelectric vibrator is configured such that the path from the inspection terminal to the piezoelectric vibrator is simple. Furthermore, the inspection terminal is electrically connected to the pad via circuit wiring. Therefore, the pad does not experience surface irregularities caused by the direct connection of the inspection terminal, thus preventing the formation of voids when the piezoelectric vibrator is mounted on the pad. This maintains the reliability of the connection between the piezoelectric vibrator and the pad. In addition, the characteristics of the piezoelectric vibrator can be confirmed without removing the molding resin and while suppressing the influence of parasitic capacitance.

[0014] From another perspective, the piezoelectric vibration device of the present invention preferably includes the following configuration: The resin substrate is composed of one of glass epoxy resin, polyimide resin, and fluororesin.

[0015] In the above configuration, the resin substrate is made of an insulating material that is easy to process. Therefore, the inspection terminal can be formed in a position that makes the circuit for inspecting the piezoelectric vibrator as simple as possible. Furthermore, the resin substrate can reduce the difference in thermal expansion coefficient between it and the molding resin compared to a substrate made of ceramic material, thereby reducing the influence of stress due to the difference in thermal expansion coefficients. This makes it possible to check the characteristics of the piezoelectric vibrator while suppressing the influence of the molding.

[0016] From another perspective, the piezoelectric vibration device of the present invention preferably includes the following configuration: The inspection terminal is electrically connected to a conductor filled inside a through hole that penetrates the resin substrate in the thickness direction, and the conductor is electrically connected to the piezoelectric vibrator.

[0017] In the above configuration, the inspection terminal is electrically connected to a conductor filled inside a through-hole in the resin substrate. Therefore, the piezoelectric vibration device can ensure conductivity from the mounting surface to the component mounting surface without mold resin entering the through-hole. Furthermore, the inspection terminal is connected to the pad via the shortest path from the component mounting surface to the mounting surface, penetrating the resin substrate in the thickness direction. Thus, the path from the inspection terminal to the piezoelectric vibrator is simplified. This makes it possible to check the characteristics of the piezoelectric vibrator without removing the mold resin and while suppressing the effects of parasitic capacitance.

[0018] From another perspective, the piezoelectric vibration device of the present invention preferably includes the following configuration: At least the inspection terminal is covered with an insulating resin.

[0019] In the above configuration, the inspection terminal covered with the insulating resin is not electrically connected to the external substrate or the like even if the resin substrate contacts the external substrate or the like. Therefore, the piezoelectric vibration device can prevent the characteristics of the piezoelectric vibrator from fluctuating due to the contact between the inspection terminal and the external substrate or the like. On the other hand, the insulating resin covering the inspection terminal can be removed more easily than the mold resin. Thereby, when it is necessary to confirm the characteristics of the piezoelectric vibrator, the characteristics of the piezoelectric vibrator can be confirmed without removing the mold resin.

[0020] From another perspective, it is preferable that the piezoelectric vibration device of the present invention includes the following configuration. At least a part of the mounting surface of the resin substrate is covered with an insulating resin.

[0021] In the above configuration, in addition to the inspection terminal, at least a part of the mounting surface of the resin substrate is covered with an insulating resin. Therefore, even if the resin substrate contacts the external substrate or the like, the inspection terminal is not electrically connected to the external substrate or the like. Also, terminals, wiring circuits, external connection terminals, etc. other than the inspection terminal on the mounting surface are protected by the insulating resin. Therefore, the piezoelectric vibration device can prevent contact between the inspection terminal and terminals other than the inspection terminal and the external substrate or the like. On the other hand, the insulating resin covering the inspection terminal can be removed more easily than the mold resin. Thereby, when it is necessary to measure the characteristics of the piezoelectric vibrator, the insulating resin can be removed to expose the inspection terminal. Thereby, the characteristics of the piezoelectric vibrator can be confirmed without removing the mold resin.

Effect of the Invention

[0022] According to an embodiment of the present invention, the characteristics of the piezoelectric vibrator can be confirmed without removing the mold resin.

Brief Description of the Drawings

[0023] [Figure 1] FIG. 1 is a plan view of a piezoelectric vibration device according to Embodiment 1 of the present invention. [Figure 2]FIG. 2 is a side view of the vibrator in the piezoelectric vibration device according to Embodiment 1 of the present invention. [Figure 3] FIG. 3 is a cross-sectional view taken along the arrow B in FIG. 2. [Figure 4] FIG. 4 is a bottom view of the vibrator in the piezoelectric vibration device according to Embodiment 1 of the present invention. [Figure 5] FIG. 5 is a cross-sectional view taken along the arrow A in FIG. 1 in the state where the piezoelectric vibration device according to Embodiment 1 of the present invention is resin-molded. [Figure 6] FIG. 6 is a plan view showing the first mounting surface which is the component mounting surface of the resin substrate in the piezoelectric vibration device according to Embodiment 1 of the present invention. [Figure 7] FIG. 7 is a plan view of a modified example of the piezoelectric vibration device according to Embodiment 1 of the present invention. [Figure 8] FIG. 8 is a transparent plan view of the second mounting surface which is the mounting surface of the resin substrate in the piezoelectric vibration device according to Embodiment 1 of the present invention as viewed from the first mounting surface side. [Figure 9] FIG. 9 is a cross-sectional view taken along the arrow C in FIG. 6. [Figure 10] FIG. 10 is a plan view showing a state where a part of the insulating resin on the second mounting surface of the resin substrate in the piezoelectric vibration device according to Embodiment 1 of the present invention is removed. [Figure 11] FIG. 11 is a plan view of the piezoelectric vibration device according to Embodiment 2 of the present invention. [Figure 12] FIG. 12 is a longitudinal cross-sectional view of the vibrator in the piezoelectric vibration device according to Embodiment 2 of the present invention. [Figure 13] FIG. 13 is a plan view showing the first mounting surface of the resin substrate in the piezoelectric vibration device according to Embodiment 2 of the present invention. [Figure 14] FIG. 14 is a transparent plan view of the second mounting surface of the resin substrate in the piezoelectric vibration device according to Embodiment 2 of the present invention as viewed from the first mounting surface side. [Figure 15] FIG. 15 is a cross-sectional view taken along the arrow D in FIG. 14.

MODE FOR CARRYING OUT THE INVENTION

[0024] The embodiments will be described below with reference to the drawings. In each drawing, the same parts are denoted by the same reference numerals, and the description of those parts will not be repeated. Note that the dimensions of the components in each drawing do not faithfully represent the dimensions of the actual components or the dimensional ratios of each component. In the embodiments described below, "main surface" means the surface with the largest area in the target member, or in the case of a plate-like member, the surface with the largest area visible when viewed in the thickness direction.

[0025] In the following description of the piezoelectric vibration device 1, which is an embodiment of the present invention, the longitudinal direction of the vibrators 2, 22 and substrates 11, h is referred to as the "X direction," the transverse direction is referred to as the "Y direction," and the opening direction of the frame portion 24 in vibrator 22, which is perpendicular to the X and Y directions, and the direction perpendicular to the main surface in substrates 11, 31, are referred to as the "Z direction." In this embodiment, the X and Y directions are directions on the horizontal plane. The Z direction is the vertical direction. However, this definition of directions is not intended to limit the orientation of the piezoelectric vibration device 1 when it is used.

[0026] Furthermore, in the following explanation, the terms “fixed,” “connected,” “joined,” and “attached” (hereinafter referred to as “fixed, etc.”) include not only cases where components are directly fixed, etc. to each other, but also cases where they are fixed, etc. through other components. In other words, in the following explanation, the terms “fixed, etc.” include both direct and indirect fixing, etc. to each other.

[0027] [Embodiment 1] <Configuration of piezoelectric vibration device 1> Next, a piezoelectric vibration device 1, which is Embodiment 1 of the piezoelectric vibration device of the present invention, will be described using Figures 1 to 5. Figure 1 is a plan view of the piezoelectric vibration device 1 according to Embodiment 1 of the present invention. Figure 2 is a side view of the vibrator 2 in the piezoelectric vibration device 1. Figure 3 is a cross-sectional view taken along the line B in Figure 2. Figure 4 is a bottom view of the vibrator 2 in the piezoelectric vibration device 1. Figure 5 is a cross-sectional view taken along the line A in Figure 1, showing the piezoelectric vibration device 1 in a resin-molded state.

[0028] As shown in Figure 1, the piezoelectric vibration device 1 includes an oscillator 2, an integrated circuit element 10, a substrate 11, and a molded portion 12 (see Figure 5).

[0029] As shown in Figures 2 to 4, the oscillator 2 is a piezoelectric vibrator having a piezoelectric element that converts applied force into voltage or applied voltage into force. The oscillator 2 is a piezoelectric vibrator having a piezoelectric diaphragm 3, a first sealing member 6, and a second sealing member 7. The oscillator 2 has a sandwich structure in which the piezoelectric diaphragm 3 is sandwiched between the first sealing member 6 and the second sealing member 7.

[0030] As shown in Figure 3, the piezoelectric diaphragm 3 is a rectangular plate-shaped member made of quartz, which is a piezoelectric material. One main surface and the other main surface of the piezoelectric diaphragm 3 have a pair of excitation electrodes 4a. The piezoelectric diaphragm 3 also has a notch 4b that penetrates from one main surface to the other main surface, enclosing the pair of excitation electrodes 4a, with a portion remaining. As a result, the portion where the pair of excitation electrodes 4a are located is configured as a cantilevered vibrating section 4 that can vibrate in the Z direction. The piezoelectric diaphragm 3 has bonding materials 5 on both main surfaces that are joined to the first sealing member 6 and the second sealing member 7, enclosing the vibrating section 4.

[0031] As shown in Figure 2, the first sealing member 6 and the second sealing member 7 are members that seal the vibrating portion 4 of the piezoelectric diaphragm 3. The first sealing member 6 and the second sealing member 7 are rectangular plate-shaped members made of the same quartz as the piezoelectric diaphragm 3. The first sealing member 6 and the second sealing member 7 are shaped to cover the entire main surface of the piezoelectric diaphragm 3 when their main surfaces are facing the main surface of the piezoelectric diaphragm 3. The first sealing member 6 and the second sealing member 7 have a bonding material 5 on one of their main surfaces that bonds with the bonding material 5 of the piezoelectric diaphragm 3.

[0032] One main surface of the piezoelectric diaphragm 3 is covered by the first sealing member 6. The other main surface of the piezoelectric diaphragm 3 is covered by the second sealing member 7. In this case, the bonding material 5 of the piezoelectric diaphragm 3 and the bonding material 5 of the first sealing member 6 and the second sealing member 7 are diffusely bonded. As a result, the vibrating portion 4 of the piezoelectric diaphragm 3 is hermetically sealed by the first sealing member 6 and the second sealing member 7.

[0033] As shown in Figure 4, the second sealing member 7 has four resonator mounting terminals 7a on its other main surface that are electrically connected to the electrodes of the substrate 11. The four resonator mounting terminals 7a are plate-shaped terminals made of conductive metal. The four resonator mounting terminals 7a are located at the four corners of the rectangle.

[0034] The vibrator 2, configured in this way, is a three-layer package in which both main surfaces of the piezoelectric diaphragm 3 are sealed by a first sealing member 6 and a second sealing member 7, respectively. Furthermore, by covering both main surfaces of the piezoelectric diaphragm 3 with the first sealing member 6 and the second sealing member 7, an internal space is formed that contains the vibrating portion 4 of the piezoelectric diaphragm 3. In other words, the vibrating portion 4, including a pair of excitation electrodes 4a, is hermetically sealed within this internal space of the package of the vibrator 2. An inert gas such as nitrogen gas is sealed inside the internal space. The vibrator 2 oscillates at a predetermined frequency in response to the applied voltage.

[0035] As shown in Figure 1, the integrated circuit element 10 is an IC that controls the oscillator 2. The integrated circuit element 10 has electronic circuits such as an oscillation circuit that is connected to a temperature sensing element (thermistor) that detects the ambient temperature state and generates a predetermined oscillation output. The integrated circuit element 10 outputs the oscillation output generated by the oscillation circuit to the outside as a reference signal such as a clock signal through the integrated circuit element mounting terminal 10a. The parts of the integrated circuit element 10 other than the integrated circuit element mounting terminal 10a are covered with resin.

[0036] The substrate 11 is a resin substrate that electrically connects and integrally forms the oscillator 2 and the integrated circuit element 10 by a wiring pattern. The substrate 11 is made of one of the following materials: glass epoxy resin, polyimide resin, and fluororesin. The substrate 11 is a single-layer substrate. One of the pair of main surfaces of the substrate 11 is configured as a first mounting surface 11a having the wiring pattern including four connection terminals 11d formed of a conductor such as copper, pads, lands, etc. The four connection terminals 11d are electrically connected to the wiring pattern including a plurality of pads on the first mounting surface 11a via internal wiring 11c. At least a portion of the internal wiring 11c is covered with insulating resin. In this way, since the single-layer substrate 11 has only a first mounting surface 11a and a second mounting surface 11b, the internal wiring 11c can be configured simply.

[0037] The oscillator 2 and the integrated circuit element 10 are mounted on the first mounting surface 11a of the substrate 11. The oscillator 2 is positioned on the substrate 11 with the second encapsulation member 7 (see Figure 2) facing the first mounting surface 11a. The four oscillator mounting terminals 7a (see Figure 4) of the second encapsulation member 7 are electrically connected to the four connection terminals 11d of the first mounting surface 11a by conductive solder H. Similarly, the integrated circuit element mounting terminal 10a of the integrated circuit element 10 is electrically connected to the wiring pattern of the first mounting surface 11a via wire 10b and wire connection terminal 11p, which is a wire connection pad on the first mounting surface 11a. In this way, the oscillator 2 and the integrated circuit element 10 are positioned side by side on the first mounting surface 11a of the substrate 11.

[0038] As shown in Figure 5, the other main surface of the substrate 11, which is parallel to the first main surface, is configured as a second mounting surface 11b having an external connection terminal 11g for mounting to an external substrate (not shown). The external connection terminal 11g is a plate-shaped terminal made of conductive metal. The external connection terminal 11g is electrically connected to the wiring pattern, which includes a plurality of pads on the first mounting surface 11a, via internal wiring 11c (not shown).

[0039] The substrate 11 is configured to electrically connect the oscillator 2 and integrated circuit elements 10 mounted on the first mounting surface 11a to an external substrate (not shown) via wiring patterns (not shown) on the first mounting surface 11a, internal wiring 11c, and external connection terminals 11g on the second mounting surface 11b. As a result, the oscillator 2 oscillates at a predetermined frequency in response to a voltage applied from the external substrate.

[0040] As shown in Figure 5, the molded portion 12 protects at least the oscillator 2 among the substrate 11 and the oscillator 2 and integrated circuit elements 10 mounted on the substrate 11. The molded portion 12 is a thermosetting resin such as epoxy resin. The molded portion 12 covers the substrate 11 and at least a part of the oscillator 2 among the oscillator 2 and integrated circuit elements 10 mounted on the substrate 11 with thermosetting epoxy resin. In this embodiment, the molded portion 12 covers the first mounting surface 11a of the substrate 11 and the oscillator 2 and integrated circuit elements 10 mounted on the first mounting surface 11a of the substrate 11. On the other hand, the second mounting surface 11b of the substrate 11 is not molded by the molded portion 12.

[0041] Next, the first mounting surface 11a and connection terminals 11d of the substrate 11 will be described in detail using Figure 6. Figure 6 is a plan view showing the first mounting surface 11a, which is the component mounting surface of the substrate 11 in the piezoelectric vibration device 1.

[0042] As shown in Figure 6, the first mounting surface 11a of the substrate 11 is one of the main surfaces electrically connected to the oscillator 2 and the integrated circuit element 10. The first mounting surface 11a has recesses 11f. The recesses 11f are rectangular depressions that extend in the X and Y directions when viewed in the Z direction. The recesses 11f are shaped to accommodate the oscillator mounting terminals 7a (see Figure 2) of the oscillator 2. Approximately L-shaped connection terminals 11d are located inside each recess 11f. In other words, the substrate 11 has four connection terminals 11d. The connection terminals 11d are plate-shaped terminals made of conductive metal.

[0043] The connection terminals 11d protrude in the Z direction from the bottom surface of each recess 11f. The main surfaces of the four connection terminals 11d (hereinafter simply referred to as "connection terminals 11d") are configured as bonding surfaces 11e that bond to the four oscillator mounting terminals 7a of the oscillator 2. The bonding surfaces 11e are located on the second mounting surface 11b side of the first mounting surface 11a. In other words, the bonding surfaces 11e are recessed compared to the first mounting surface 11a. The bonding surfaces 11e are exposed and not covered by the insulating substrate of the substrate 11.

[0044] Furthermore, internal wiring 11c is connected to connection terminal 11d. Internal wiring 11c is made of a conductive metal. Internal wiring 11c electrically connects the wiring pattern on the first mounting surface 11a to the external connection terminal 11g (see Figure 8). Internal wiring 11c is connected to each connection terminal 11d within the recess 11f.

[0045] Figure 7 shows a plan view of a modified example of the piezoelectric vibration device 1. As shown in Figure 7, the piezoelectric vibration device 1 may also be configured in which the oscillator mounting terminal 7a of the oscillator 2 is connected to the wire connection terminal 11p of the first mounting surface 11a by a wire 10b. The oscillator 2 is placed on the first mounting surface 11a of the substrate 11 so that the oscillator mounting terminal 7a is visible when viewing the first mounting surface 11a of the substrate 11 in the Z direction. The oscillator mounting terminal 7a is electrically connected to the wiring pattern of the first mounting surface 11a by the wire 10b and via the wire connection terminal 11p of the first mounting surface 11a. Thus, the oscillator 2 and the integrated circuit element 10 may be electrically connected to the wiring pattern of the substrate 11 using solder, bonding material, adhesive, etc., or they may be electrically connected to the wiring pattern of the substrate 11 using a wire 10b. Metal bumps may also be used as bonding material.

[0046] Next, the second mounting surface 11b and the external connection terminal 11g of the substrate 11 will be described in detail using Figure 8. Figure 8 is a plan view showing the second mounting surface 11b, which is the mounting surface of the substrate 11 in the piezoelectric vibration device 1.

[0047] As shown in Figure 8, the second mounting surface 11b of the substrate 11 is the other main surface that is electrically connected to an external substrate (not shown). The second mounting surface 11b has four external connection terminals 11g at its four corners. The second mounting surface 11b also has four recesses 11j corresponding to the four external connection terminals 11g. The four recesses 11j are stepped portions that are recessed in a direction perpendicular to the second mounting surface 11b, within an arbitrarily defined range. The four recesses 11j are located at the four corners, including the vertices which are the intersections of the long and short sides of the substrate 11 when viewed in the Z direction. Furthermore, the recesses in the four recesses 11j include a portion of the long side and a portion of the short side that are the outer edges of the substrate 11 extending from the vertices. The recesses 11j are shaped to accommodate the mounting terminals of the external substrate inside.

[0048] The external connection terminals 11g are configured such that one of their main surfaces connects to the connection terminals of an external substrate (not shown). The four external connection terminals 11g (hereinafter simply referred to as "external connection terminals 11g") are roughly rectangular, plate-shaped terminals made of conductive metal. Each external connection terminal 11g is located within one of the four recesses 11j. Each external connection terminal 11g is formed in a roughly rectangular shape. The external connection terminals 11g have a bonding surface 11h on their main surface that connects to the connection terminals of the external substrate. The bonding surface 11h is exposed and not covered by the insulating substrate of the substrate 11. The bonding surface 11h is located on the first mounting surface 11a side of the second mounting surface 11b. In other words, the bonding surface 11h is Second implementation surface 11b It's more recessed than that.

[0049] The internal wiring 11c is connected to the external connection terminal 11g. The internal wiring 11c passes through the inside of the circuit board 11 and is located in the recess 11j. The external connection terminal 11g is joined to the connection terminal of an external circuit board (not shown) by solder or the like.

[0050] Next, the inspection terminals 11k on the substrate 11 will be described using Figures 6, 8 to 10. Figure 9 is a cross-sectional view taken along the line C in Figure 6. Figure 10 is a plan view showing the state in which a portion of the insulating resin on the second mounting surface 11b of the substrate 11 of the piezoelectric vibration device 1 has been removed.

[0051] As shown in Figures 6, 8 to 10, the inspection terminals 11k are terminals used to check the characteristics of the oscillator 2 mounted on the first mounting surface 11a of the substrate 11. The piezoelectric vibration device 1 is provided with a pair of inspection terminals 11k corresponding to both electrodes of the oscillator 2. In the following embodiments, unless otherwise specified, inspection terminals 11k refers to a pair of inspection terminals 11k.

[0052] A pair of test terminals 11k (hereinafter simply referred to as "test terminals 11k") are terminals electrically connected via a wiring circuit or the like to the connection terminal 11d on the first mounting surface 11a side to which the vibrator 2 is electrically connected. The test terminals 11k are located on the second mounting surface 11b side. In this embodiment, the test terminals 11k are located on substantially the same plane as the second mounting surface 11b. The test terminals 11k are electrically connected to the end on the second mounting surface 11b side of a conductor 11n (see Figure 9) located in a through-hole that covers at least the inner circumferential surface of the through-hole extending from the first mounting surface 11a side to the second mounting surface 11b side of the substrate 11. In this embodiment, the test terminals 11k are integrally configured with the conductor 11n filled in the through-hole. The conductor 11n is preferably of the same type as the connection terminal 11d.

[0053] Furthermore, at both ends of the through-hole, there are land-shaped conductors with an outer diameter larger than the inner diameter of the through-hole. The inspection terminal 11k is electrically connected to the land. With this configuration, the inspection terminal 11k has a smaller area than the connection terminal 11d, etc., when viewed perpendicular to the first mounting surface 11a of the substrate 11, thus improving the freedom of placement and enabling space saving for the substrate 11.

[0054] As shown in Figure 6, the test terminal 11k is located within the area surrounded by the four connection terminals 11d, which are pads on which the vibrator 2 is mounted. In this case, the test terminal 11k is positioned so as not to overlap with the connection terminals 11d when viewed in a direction perpendicular to the first mounting surface 11a. In other words, the end of the conductor 11n electrically connected to the test terminal 11k on the first mounting surface 11a side is not directly connected to the connection terminals 11d.

[0055] As shown in Figure 8, the test terminal 11k is located within the region surrounded by the external connection terminals 11g. In this case, the test terminal 11k is positioned so as not to overlap with the external connection terminals 11g when viewed in a direction perpendicular to the first mounting surface 11a. In other words, the test terminal 11k is not directly connected to the external connection terminals 11g. Naturally, the conductor 11n that is electrically connected to the test terminal 11k is not directly connected to the connection terminal 11d and the external connection terminals 11g.

[0056] As shown in Figures 6 and 9, the ends of the conductors 11n to which each pair of test terminals 11k is connected, on the first mounting surface 11a side, are located substantially coplanar with the first mounting surface 11a. The ends of the conductors 11n on the first mounting surface 11a side are electrically connected to one end of each different internal wiring 11m. The other end of each internal wiring 11m is electrically connected to the corresponding connection terminal 11d. In other words, the ends of the conductors 11n on the first mounting surface 11a side are electrically connected to the corresponding connection terminals 11d via the internal wiring 11m. The test terminals 11k and internal wiring 11m are covered with insulating resin.

[0057] The test terminal 11k is located on substantially the same plane as the second mounting surface 11b. The end of the conductor 11n to which the test terminal 11k is connected, on the first mounting surface 11a side, is electrically connected to the connection terminal 11d and internal wiring, etc. In other words, the pair of test terminals 11k are electrically connected to the connection terminal 11d on the first mounting surface 11a side without going through the external connection terminal 11g on the second mounting surface 11b side.

[0058] As shown in Figure 8, at least the inspection terminal 11k on the second mounting surface 11b is covered with insulating resin. Furthermore, at least a portion of the second mounting surface 11b of the substrate 11 is covered with insulating resin. In other words, the inspection terminal 11k and at least a portion of the second mounting surface 11b are covered with insulating resin. The insulating resin is a resin that can be removed from the inspection terminal 11k by physical or chemical means. The insulating resin covering the inspection terminal 11k has a thickness sufficient to allow the inspection terminal 11k to be seen from the outside by passing through the insulating resin. Therefore, the piezoelectric vibration device 1 is configured to be able to determine the position of the inspection terminal 11k covered by the insulating resin from above the insulating resin. This allows the piezoelectric vibration device 1 to easily identify the position to be removed in order to expose the end of the inspection terminal 11k.

[0059] The test terminal 11k is electrically connected to the transducer 2 via the conductor 11n, internal wiring 11m, and connection terminal 11d. Furthermore, the test terminal 11k is located on the second mounting surface 11b side, which is not molded by the molded portion 12 (see Figure 5). Therefore, the test terminal 11k can establish an electrical connection with the transducer 2, which is molded by the molded portion 12, from its end on the second mounting surface 11b side.

[0060] The piezoelectric vibration device 1 having the inspection terminal 11k is configured to be electrically connectable to an external substrate when the vibrator 2 and integrated circuit element 10 are molded by the molding part 12. In this case, even if the second mounting surface 11b of the substrate 11 comes into contact with the external substrate, the inspection terminal 11k located on the second mounting surface 11b side is covered with insulating resin and therefore does not come into contact with the external substrate. Furthermore, the substrate 11 is protected by insulating resin from terminals other than the inspection terminal 11k on the second mounting surface 11b, wiring circuits, and external connection terminals. Therefore, the piezoelectric vibration device 1 can prevent contact between the inspection terminal 11k and other terminals and the external substrate. On the other hand, the piezoelectric vibration device 1 is configured so that the inspection terminal 11k can be seen by passing through the insulating resin. Therefore, the piezoelectric vibration device 1 can easily remove the insulating resin covering the inspection terminal 11k in order to expose the inspection terminal 11k.

[0061] As shown in Figure 10, when measuring the characteristics of the oscillator 2 molded by the molded part 12 of the piezoelectric vibration device 1, the insulating resin of the insulating region 11o covering the test terminals 11k is removed. The piezoelectric vibration device 1 brings a probe or the like of an inspection device (not shown) into contact with a pair of test terminals 11k exposed on the second mounting surface 11b side of the substrate 11. The oscillator 2 is electrically connected to the inspection device via the pair of test terminals 11k, the conductor 11n, and the internal wiring 11m. The characteristics of the oscillator 2 are measured according to a predetermined procedure.

[0062] The piezoelectric vibration device 1 configured in this way has an inspection terminal 11k that can be electrically connected to the vibrator 2 on the first mounting surface 11a side of the substrate 11. The inspection terminal 11k is located on the second mounting surface 11b side of the substrate 11, which is not molded by the resin mold portion 12. Therefore, the piezoelectric vibration device 1 allows the characteristics of the vibrator 2 to be checked by the inspection terminal 11k without removing the resin mold of the vibrator 2.

[0063] Furthermore, the circuit for testing the oscillator 2 is designed to be as short and simple as possible, consisting of a connection terminal 11d, a test terminal 11k, a conductor 11n that electrically connects the connection terminal 11d and the test terminal 11k, and internal wiring 11m. As a result, the measurement results of the oscillator 2 are only affected by the parasitic capacitance contained in the connection terminal 11d, the test terminal 11k, and the conductor 11n and internal wiring 11m that electrically connect the connection terminal 11d and the test terminal 11k.

[0064] Furthermore, the inspection terminal 11k is electrically connected to the connection terminal 11d via internal wiring 11m. Therefore, the connection terminal 11d does not experience any irregularities caused by the direct connection of the inspection terminal 11k, which is a conductor filled in the through-hole of the substrate 11. This prevents the occurrence of voids when the vibrator 2 is mounted on the connection terminal 11d. As a result, even with the presence of the inspection terminal 11k, the reliability of the connection between the vibrator 2 and the connection terminal 11d is not compromised.

[0065] Furthermore, the inspection terminal 11k is electrically connected to the conductor 11n filled inside the through-hole formed in the substrate 11. Therefore, the piezoelectric vibration device 1 can ensure conductivity from the first mounting surface 11a to the second mounting surface 11b without mold resin entering the through-hole. In addition, the inspection terminal 11k is connected to the connection terminal 11d via the shortest path that penetrates the substrate 11 in the thickness direction. Therefore, the path from the inspection terminal 11k to the vibrator 2 is configured to be simple.

[0066] Therefore, this makes it possible to confirm the characteristics of oscillator 2 without removing the mold resin and while suppressing the influence of parasitic capacitance.

[0067] Furthermore, the substrate 11 is made of an easily processable insulating material such as glass epoxy resin, polyimide resin, and fluororesin. Therefore, the inspection terminal 11k can be formed in a position that makes the circuit for inspecting the oscillator 2 as simple as possible. In addition, the substrate 11 can reduce the difference in thermal expansion coefficient between it and the molding resin compared to a substrate made of ceramic material, thus reducing the effect of stress due to the difference in expansion coefficient.

[0068] [Embodiment 2] <Configuration of piezoelectric vibration device 21> Next, a piezoelectric vibration device 21, which is Embodiment 2 of the piezoelectric vibration device of the present invention, will be described using Figures 11 to 14. Figure 11 is a plan view of the piezoelectric vibration device 21 according to Embodiment 2 of the present invention. Figure 12 is a longitudinal cross-sectional view of the vibrator 22 in the piezoelectric vibration device 21. Figure 13 is a plan view showing the first mounting surface of the substrate 31 in the piezoelectric vibration device 21. Figure 14 is a plan view showing the second mounting surface of the substrate 31 in the piezoelectric vibration device 21. Figure 15 is a cross-sectional view taken along arrow D in Figure 14. In the following embodiments, specific explanations of points similar to those of the embodiments already described will be omitted, and the differences will be the focus of the explanation.

[0069] As shown in Figure 11, the piezoelectric vibration device 21 includes an oscillator 22, an integrated circuit element 30, a substrate 31, and a molded portion 12 (see Figure 5).

[0070] As shown in Figure 12, the oscillator 22 is a piezoelectric oscillator having a piezoelectric element that converts an applied force into a voltage, or converts an applied voltage into force. The oscillator 22 includes a piezoelectric diaphragm 23, a first sealing member 27, and a second sealing member 28.

[0071] The piezoelectric diaphragm 23 is a rectangular quartz crystal vibrating piece cut from a quartz crystal in a specific direction. The piezoelectric diaphragm 23 has a frame portion 24, a vibrating portion 25, and a connecting portion 26. The piezoelectric diaphragm 23 is integrally molded with the frame portion 24, the vibrating portion 25, and the connecting portion 26. In other words, the frame portion 24, the vibrating portion 25, and the connecting portion 26 are configured as a single component.

[0072] The frame portion 24 is a member that surrounds the vibrating portion 25. The frame portion 24 is made of a rectangular plate when viewed in the Z direction in a plan view. The frame portion 24 is a frame-shaped member in which the pair of main surfaces each have a rectangular opening when viewed in the Z direction. In other words, the frame portion 24 has a rectangular through hole 24c that penetrates from one of the main surfaces to the other.

[0073] The vibrating section 25 is a piezoelectric material. The vibrating section 25 is a plate material that is approximately rectangular in plan view, perpendicular to the pair of main surfaces with the largest area. The vibrating section 25 is located within the frame of the frame section 24. A portion of the vibrating section 25 is connected to the frame section 24 via a plate-shaped connecting section 26. The vibrating section 25 is held in a cantilevered position on the frame section 24 via the connecting section 26. The vibrating section 25 has a pair of excitation electrodes 25a. The pair of excitation electrodes 25a are connected to the vibrator mounting terminals 24d.

[0074] The sealing members, the first sealing member 27 and the second sealing member 28, are members that seal the inside of the frame portion 24. The first sealing member 27 and the second sealing member 28 are rectangular members when viewed in the Z direction. The first sealing member 27 and the second sealing member 28 are made of, for example, metal. The first sealing member 27 and the second sealing member 28 are smaller than the frame portion 24 and larger than the opening of the frame portion 24. The first sealing member 27 and the second sealing member 28 are joined to the joining surface 24a of the main surface of the frame portion 24 by a bonding material 33, which is a thermoplastic adhesive. The first sealing member 27 and the second sealing member 28 close the opening portion of the frame portion 24.

[0075] The transducer 22, configured as described above, has a three-layer structure comprising a piezoelectric diaphragm 23 and a first sealing member 27 and a second sealing member 28 that close the opening portion of the piezoelectric diaphragm 23. The transducer 22 has an internal space S formed by the frame portion 24 of the piezoelectric diaphragm 23, the first sealing member 27, and the second sealing member 28. The vibrating part 25 of the transducer 22 is located within the internal space S. Furthermore, an inert gas such as nitrogen gas is sealed within the internal space S. The transducer 22 oscillates at a predetermined frequency in response to the voltage applied from each transducer mounting terminal 24d.

[0076] As shown in Figure 11, the integrated circuit element 30 is an IC that controls the oscillator 22. The configuration of the integrated circuit element 30 is the same as that of the integrated circuit element 10 in Embodiment 1, so a description is omitted.

[0077] The substrate 31 is a single-layer resin substrate that electrically connects and integrally forms the oscillator 22 and the integrated circuit element 30 by a wiring pattern (not shown). The substrate 31 is based on one of the following materials, which are insulators that are easy to process, such as cutting: glass epoxy resin, polyimide resin, and fluororesin. The substrate 31 can easily be used to construct a piezoelectric vibration device 21 having any shape. The substrate 31 is a rectangular plate material.

[0078] As shown in Figure 13, one main surface of the substrate 31 is configured as a first mounting surface 31a having the aforementioned wiring pattern including pads, lands, etc., formed of a conductor such as copper. The resonator 22 and the integrated circuit element 30 are mounted on the first mounting surface 31a, respectively (see Figure 11). Both resonator mounting terminals 24d of the resonator 2 (see Figure 12) are electrically connected to two connection terminals 31d on the first mounting surface 31a, respectively, by a conductive bonding material. The resonator 2 is positioned such that the second sealing member 28 faces the first mounting surface 31a. The second sealing member 28 is in contact with the first mounting surface 31a. Similarly, the integrated circuit element mounting terminals 30a of the integrated circuit element 30 are electrically connected to the wiring pattern on the first mounting surface 31a of the substrate 31, respectively, by a conductive bonding material.

[0079] As shown in Figure 14, the other main surface of the substrate 31, which is parallel to one main surface, is configured as a second mounting surface 31b having an external connection terminal 31f for mounting to an external substrate. The external connection terminal 31f is a plate-shaped terminal made of conductive metal. The wiring pattern on the first mounting surface 31a is electrically connected to the external connection terminal 31f via internal wiring 31c.

[0080] As shown in Figures 11 and 12, the vibrator 22 mounted on the substrate 31 is electrically connected to an external substrate via the vibrator mounting terminal 24d, the connection terminal 31d on the first mounting surface 31a, the internal wiring 31c, and the external connection terminal 31f on the second mounting surface 31b (see Figure 11). Furthermore, the vibrating portion 25 of the vibrator 22 is cantilevered to the frame portion 24 of the piezoelectric diaphragm 23 by the connecting portion 26. As a result, the vibrating portion 25 oscillates at a predetermined frequency in response to the voltage applied from the external substrate.

[0081] The molded portion (not shown) protects the substrate 31 and at least the oscillator 22, which is mounted on the substrate 31, and the integrated circuit element 30. The molded portion is the same as the molded portion 12 in Embodiment 1, so its description is omitted.

[0082] Next, the first mounting surface 31a and connection terminals 31d of the substrate 31 will be described in detail using Figure 13.

[0083] As shown in Figure 13, the first mounting surface 31a has two connection terminals 31d. The connection terminals 31d are plate-shaped terminals made of conductive metal. The main surfaces of the two connection terminals 31d (hereinafter simply referred to as "connection terminals 31d") are configured as bonding surfaces 31e that bond to the two oscillator mounting terminals 24d (see Figure 12) of the oscillator 22. The bonding surfaces 31e are exposed and not covered by the insulating substrate of the substrate 31.

[0084] Furthermore, internal wiring 31c is connected to connection terminal 31d. The internal wiring 31c is made of conductive metal. The internal wiring 31c electrically connects the wiring pattern on the first mounting surface 31a to the external connection terminal 31f (see Figure 14). The internal wiring 31c is connected to each of the connection terminals 31d.

[0085] Next, the second mounting surface 31b and external connection terminals 31f of the substrate 31 will be described in detail with reference to Figure 14. Figure 14 is a plan view showing the second mounting surface 31b of the substrate 31 in the piezoelectric vibration device 21. In this embodiment, the second mounting surface 31b is assumed to have four external connection terminals 31f.

[0086] As shown in Figure 14, the second mounting surface 31b of the substrate 31 is the other main surface that is electrically connected to the external substrate. The second mounting surface 31b has four recesses 31g corresponding to the four external connection terminals 31f. The second mounting surface 31b and the external connection terminals 31f are the same as the second mounting surface 11b and the external connection terminals 11g in Embodiment 1, so their description is omitted.

[0087] Next, the inspection terminals 31h on the substrate 31 will be described using Figures 13 to 15.

[0088] As shown in Figure 13, the inspection terminal 31h is a terminal used to measure the characteristics of the vibrator 22 when it is mounted on the first mounting surface 31a of the substrate 31. The piezoelectric vibration device 21 is provided with a pair of inspection terminals 31h corresponding to both electrodes of the vibrator 22. In the following embodiments, inspection terminal 31h refers to a pair of inspection terminals 31h unless otherwise specified. The configuration of the inspection terminal 31h is the same as that of the inspection terminal 11k in Embodiment 1, so a description is omitted.

[0089] The test terminal 31h is positioned so as not to overlap with the connection terminal 31d, which is the pad on which the vibrator 22 is mounted, when viewed perpendicular to the first mounting surface 31a. In other words, the test terminal 31h is not directly connected to the connection terminal 31d. Furthermore, the end of the conductor 31k that is electrically connected to the test terminal 31h on the first mounting surface 31a side is not directly connected to the connection terminal 31d.

[0090] As shown in Figure 14, the test terminal 31h is positioned so as not to overlap with the external connection terminal 31f when viewed perpendicular to the first mounting surface 31a. In other words, the test terminal 31h is not directly connected to the external connection terminal 31f. The test terminal 31h is electrically connected to the end on the second mounting surface 31b side of the conductor 31k located within a through-hole that covers at least the inner circumference of the through-hole extending from the first mounting surface 31a side to the second mounting surface 31b side of the substrate 31. Naturally, the conductor 31k electrically connected to the test terminal 31h is not directly connected to the connection terminal 31d and the external connection terminal 31f.

[0091] As shown in Figure 15, the ends of the conductor 31k on the first mounting surface 31a side, which are electrically connected to the pair of test terminals 31h, are each electrically connected to one end of a different internal wiring 31j. The other end of each internal wiring 31j is electrically connected to the corresponding connection terminal 31d. In other words, the pair of test terminals 31h are each electrically connected to the corresponding connection terminal 31d via the conductor 31k and the internal wiring 31j.

[0092] The test terminal 31h is not electrically connected to the external connection terminal 31f or internal wiring, etc. In other words, the test terminal 31h does not go through the external connection terminal 31f on the second mounting surface 31b. First mounting surface 31a Each is electrically connected to the connection terminal 31d on the side. The end of the test terminal 31h on the second mounting surface 31b side and the internal wiring 31c are covered with insulating resin. Of the second mounting surface 31b, at least the test terminal 31h is covered with insulating resin.

[0093] The test terminal 31h is electrically connected to the vibrator 2 via the conductor 31k, internal wiring 31j, and connection terminal 31d. Furthermore, the test terminal 31h is located on the second mounting surface 31b side, which is not molded by the molding portion 12. Therefore, the test terminal 31h can establish an electrical connection with the vibrator 2, which is molded by the molding portion 12, from its end on the second mounting surface 31b side.

[0094] [Other embodiments] In the above-described embodiment, the substrates 11 and 31 have recesses 11j and 31g for each external connection terminal 11g and 31f. However, the substrate does not necessarily have to have a recess for each external connection terminal. The substrate may have multiple external connection terminals located in a single recess.

[0095] Furthermore, in the above-described embodiment, the piezoelectric vibration device 1 has a vibrator 2 with a three-layer structure in which a piezoelectric diaphragm 3, a first sealing member 6, and a second sealing member 8 are stacked. However, the piezoelectric vibration device may have a vibrator with three or more layers. The vibrator may also be a four-layer vibrator in which a sensor such as a thermistor is further mounted on the main surface of the first sealing member.

[0096] Furthermore, in the embodiments described above, the piezoelectric vibration devices 1 and 21 are composed of single-layer substrates 11 and 31. However, the piezoelectric vibration devices may be composed of a laminated substrate having multiple layers.

[0097] Furthermore, in the above-described embodiment, the test terminals 11k and 31h have lands. However, the test terminals do not need to have lands.

[0098] Furthermore, in the above-described embodiment, the inspection terminals 11k and 31h are located on substantially the same single surface as the second mounting surfaces 11b and 31b. However, the inspection terminals may be located closer to the first mounting surface than the second mounting surface. That is, the inspection terminals may be recessed compared to the second mounting surface. Also, the inspection terminals may protrude beyond the second mounting surface.

[0099] Furthermore, in the embodiments described above, the piezoelectric vibration devices 1 and 21 have the vibrators 2 and 22 and the integrated circuit elements 10 and 30 molded by the molding portion 12. However, the piezoelectric vibration device does not necessarily have to have the vibrators and integrated circuit elements molded. The piezoelectric vibration device may also have a configuration in which the vibrators and integrated circuit elements are housed within a housing.

[0100] Furthermore, in the above-described embodiment, the test terminals 11k and 31h are covered with insulating resin. However, the test terminals do not necessarily have to be covered with insulating resin.

[0101] Furthermore, in the above-described embodiment, the inspection terminals 11k and 31h covered with insulating resin are configured to be visible from the outside. However, the inspection terminals covered with insulating resin do not necessarily need to be visible from the outside. The piezoelectric vibration device may have a marker or the like that can identify the position of the inspection terminal.

[0102] Although embodiments of the present invention have been described above, the embodiments described above are merely examples for carrying out the present invention. Therefore, the invention is not limited to the embodiments described above, and it is possible to carry out the invention by appropriately modifying the embodiments described above without departing from the spirit of the invention. [Explanation of Symbols]

[0103] 1.21 Piezoelectric Vibration Devices 2.22 oscillator 3.23 Piezoelectric diaphragm 4.25 Vibration section 4a, 25a excitation electrode 4b Notch 5 Bonding material 26 Connecting part 6, 27 First sealing member 7, 28 Second sealing member 24 Frame section 24c through hole 10, 30 Integrated Circuit Elements 10a, 30a Integrated Circuit Element Mounting Terminals 10b Wire 11, 31 circuit boards 11a, 31a First implementation surface 11b, 31b Second implementation surface 11c, 11m, 31c, 31j internal wiring 11d, 31d connection terminals 11g, 31f external connection terminals 11e, 11h, 24a, 31e joint surface 11f, 11j, 31g recess 11k, 31h test terminal 11n, 31k conductor 110 Insulation area 11p wire connector 12. Molded section 33 Bonding material 7a, 24d Transducer mounting terminals S interior space

Claims

1. A piezoelectric vibrator comprising a piezoelectric diaphragm sealed by a sealing member, A resin molded portion that protects the piezoelectric vibrator, A resin substrate comprising at least one main surface having a component mounting surface with a wiring pattern including multiple pads, and the other main surface parallel to the first main surface having a mounting surface that is connected to the wiring pattern and has multiple external connection terminals for connecting to an external substrate, A piezoelectric vibration device in which at least the piezoelectric vibrator is connected to the plurality of pads and mounted on the component mounting surface, and at least a portion of the component mounting surface is covered by the resin molded portion so as to include at least the piezoelectric vibrator, The aforementioned resin substrate is The mounting surface has an inspection terminal that is electrically connected to the pad on which the piezoelectric vibrator is mounted without going through the external connection terminal, The aforementioned test terminal is, When viewed in a direction perpendicular to the aforementioned mounting surface, the following are positioned so as not to overlap with the aforementioned pads: Piezoelectric vibration device.

2. In the piezoelectric vibration device according to claim 1, The aforementioned test terminal is, When viewed in a direction perpendicular to the mounting surface, the piezoelectric vibrator is positioned so as not to overlap with the plurality of external connection terminals on which it is mounted. Piezoelectric vibration device.

3. In the piezoelectric vibration device according to claim 1 or 2, The aforementioned resin substrate is It is composed of one of the following: glass epoxy resin, polyimide resin, and fluororesin. Piezoelectric vibration device.

4. In the piezoelectric vibration device according to claim 1 or claim 2, The aforementioned test terminal is, A conductor is electrically connected to a through hole that penetrates the resin substrate in the thickness direction, and the conductor is electrically connected to the piezoelectric vibrator. Piezoelectric vibration device.

5. In the piezoelectric vibration device according to claim 1 or claim 2, At least the inspection terminals are, It is covered with insulating resin. Piezoelectric vibration device.

6. In the piezoelectric vibration device according to claim 5, The aforementioned resin substrate is At least a portion of the mounting surface is covered with insulating resin. Piezoelectric vibration device.

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