electronic machinery

Abstract

To provide an electronic apparatus capable of detecting a pressed portion of a housing.SOLUTION: The electronic apparatus comprises a housing having a hollow shape, a partition placed in the housing, and a sensor provided at the partition and detecting deformation of the partition. The partition connects a first portion at the inner surface of the housing and a second portion opposite to the first portion.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] Patent Document 1 describes a display device including a pressure sensor, an operation panel, and a housing. The operation panel is fitted into the housing so as to close the opening surface of the housing. The pressure sensor includes a piezoelectric film. The pressure sensor is fixed to the operation panel. The pressure sensor detects deformation of the operation panel. Specifically, a user presses the operation panel. The piezoelectric film of the pressure sensor is deformed as the operation panel is deformed. The piezoelectric film is polarized according to the amount of displacement of the piezoelectric film.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Patent Document 1 does not describe detecting deformation other than the operation panel. For example, Patent Document 1 does not describe a configuration for detecting which part of the housing has been pressed.

[0005] An object of the present invention is to provide an electronic device capable of detecting which part of a housing has been pressed.

Means for Solving the Problems

[0006] An electronic device according to an embodiment of the present invention includes a housing having a hollow shape, a partition disposed in the housing, a sensor disposed on the partition and detecting deformation of the partition, and The aforementioned partition connects a first portion on the inner surface of the housing with a second portion opposite to the first portion. [Effects of the Invention]

[0007] An electronic device according to one embodiment of the present invention can detect which part of the housing is being pressed. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of electronic device 1. [Figure 2] Figure 2 is a top view of electronic device 1. [Figure 3] Figure 3 is a cross-sectional view of AA in Figure 2. [Figure 4] Figures 4(A) and 4(B) show the different configurations of the housing 10, partition 11, and piezoelectric sensor 12. [Figure 5] Figure 5(A) shows an example of signal SL1 when the housing 10 is pressed in the thickness direction. Figure 5(B) shows an example of signal SL2 when the housing 10 is pressed in the direction in which the sides SF1 and SF2 are aligned. [Figure 6] Figure 6 shows electronic device 1a according to modified example 1 of electronic device 1. [Figure 7] Figure 7(A) is a top view showing electronic device 1b, which is a modified example 2 of electronic device 1. Figure 7(B) is a cross-sectional view of AA in Figure 7(A). [Figure 8] Figures 8(A) and 8(B) respectively show electronic devices 1c and 1d related to modified example 2 of electronic device 1. [Figure 9] Figures 9(A), 9(B), and 9(C) respectively show electronic devices 1e, 1f, and 1g related to modification 3 of electronic device 1. [Figure 10] Figures 10(A), 10(B), and 10(C) respectively show electronic devices 1h, 1i, and 1j related to modification 4 of electronic device 1. [Figure 11]Each of FIGS. 11(A), 11(B), 11(C), and 11(D) is a diagram showing electronic devices 1k, 1m, 1n, and 1o according to Modification 5 of the electronic device 1. [Figure 12] FIG. 12 is a diagram showing the results of an experiment using the electronic devices 1, 1a, and 1o. [Figure 13] Each of FIGS. 13(A), 13(B), and 13(C) is a diagram showing electronic devices 1p, 1q, and 1r according to Modification 6 of the electronic device 1. [Figure 14] Each of FIGS. 14(A), 14(B), and 14(C) is a diagram showing electronic devices 1s, 1t, and 1u according to Modification 7 of the electronic device 1. [Figure 15] FIG. 15 is a diagram showing an electronic device 1v according to Modification 8 of the electronic device 1.

Mode for Carrying Out the Invention

[0009] [First Embodiment] Hereinafter, the electronic device 1 according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of the electronic device 1. In FIG. 1, the switch 11 and the piezoelectric sensor 12 are shown in broken lines in a perspective view. FIG. 2 is a top view of the electronic device 1. In FIG. 2, the piezoelectric sensor 12 is shown in broken lines in a perspective view. FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2.

[0010] As shown in FIGS. 1 to 3, the electronic device 1 includes a housing 10, a switch 11, and a piezoelectric sensor 12.

[0011] In the present embodiment, as shown in FIG. 1, the housing 10 has a rectangular parallelepiped shape. As an example, the housing 10 has dimensions of approximately 7 mm in length, 25 mm in width, and 5 mm in thickness. The housing 10 has a hollow shape. The housing 10 is pressed by a user. Due to the pressing by the user, the housing 10 elastically deform.

[0012] Note that the housing 10 does not necessarily have to have a rectangular parallelepiped shape. The housing 10 may have a shape such as a cubic shape, a true spherical shape, or an ellipsoidal shape.

[0013] The partition 11 has a rectangular shape in plan view. The partition 11 is disposed within the housing 10. The partition 11 connects two opposing side surfaces SF1 and SF2 among the side surfaces of the housing 10. The side surfaces SF1 and SF2 are arranged in the lateral direction of the housing 10 (the vertical direction in the drawing in FIG. 2). The side surfaces SF1 and SF2 respectively correspond to the first part and the second part in the present application. Note that the partition 11 may also connect two side surfaces SF3 and SF4 arranged in the longitudinal direction of the housing 10. The partition 11 is slightly closer to the bottom surface side than the center in the thickness direction of the housing 10. However, in the present invention, it is not necessary for the partition 11 to be slightly closer to the bottom surface side than the thickness direction of the housing 10. For example, the partition 11 may be disposed at the center in the thickness direction. Also, the shape of the partition 11 in plan view is not particularly limited.

[0014] The piezoelectric sensor 12 has long sides and short sides and has a sheet shape in plan view. The piezoelectric sensor 12 is disposed on the partition 11. The piezoelectric sensor 12 is fixed at the center of the partition 11 by an adhesive (not shown) such as double-sided tape in plan view. The piezoelectric sensor 12 is not in contact with the housing 10. There is a gap between the piezoelectric sensor 12 and the housing 10. Therefore, for example, even if an impact occurs on the housing 10 due to the electronic device 1 falling, it is difficult for the vibration generated in the housing 10 by the impact to be transmitted to the piezoelectric sensor 12. Accordingly, it is difficult for the piezoelectric sensor 12 to malfunction due to an impact such as the fall.

[0015] As shown in FIG. 3, the piezoelectric sensor 12 includes a piezoelectric film 120, a first electrode  121, and a second electrode 122.

[0016] The piezoelectric film 120 has a sheet shape with a long side and a short side. The piezoelectric film 120 is, for example, a film formed from a chiral polymer. A chiral polymer is, for example, polylactic acid (PLA), particularly L-type polylactic acid (PLLA) or D-type polylactic acid (PDLA). PLA made of a chiral polymer has a helical structure in its main chain. The piezoelectric film 120 has a piezoelectric constant of d14. The piezoelectric film 120 becomes piezoelectric when uniaxially stretched and its molecules are oriented. As shown in Figure 2, the stretching direction OD of the piezoelectric film 120 forms a 45-degree angle with respect to the direction in which the long side of the piezoelectric film 120 extends. However, the angle between the stretching direction OD and the direction in which the long side of the piezoelectric film 120 extends should be approximately 45 degrees ± 10 degrees. The piezoelectric film 120 is polarized according to the amount of deformation of the piezoelectric film 120. The direction of polarization when the piezoelectric film 120 is stretched in the direction in which its long side extends is opposite to the direction of polarization when the piezoelectric film 120 is stretched in the direction in which its short side extends. The direction of polarization when the piezoelectric film 120 is bent convexly toward the upper surface is opposite to the direction of polarization when the piezoelectric film 120 is bent convexly toward the bottom surface. Note that the above angles are examples, and for example, the angle between the stretching direction OD and the direction in which the long side of the piezoelectric film 120 extends may be 0 degrees.

[0017] The first electrode 121 is, for example, a signal electrode. As shown in Figure 3, the first electrode 121 is positioned on one main surface of the piezoelectric film 120. The first electrode 121 is fixed to the main surface with an adhesive (not shown).

[0018] The second electrode 122 is, for example, a reference electrode. As shown in Figure 3, the second electrode 122 is positioned on the main surface of the piezoelectric film 120 where the first electrode 121 is not located. The second electrode 122 is fixed to the main surface by an adhesive (not shown).

[0019] Note that the first electrode 121 does not necessarily have to be the signal electrode and the second electrode 122 does not necessarily have to be the reference electrode. The first electrode 121 may be the reference electrode and the second electrode 122 may be the signal electrode.

[0020] The piezoelectric sensor 12 detects the deformation of the partition 11. When a user presses on the housing 10, the housing 10 deforms. As the housing 10 deforms, the partition 11 connected to the housing 10 deforms. As the partition 11 deforms, the piezoelectric sensor 12 positioned on the partition 11 deforms. The piezoelectric sensor 12 outputs a signal corresponding to the deformation of the piezoelectric sensor 12.

[0021] Figures 4(A) and 4(B) show the different configurations of the housing 10, partition 11, and piezoelectric sensor 12.

[0022] The piezoelectric sensor 12 outputs signals of different polarities depending on whether it is pressed along the short side direction of the housing 10 (the direction in which side SF1 and side SF2 face each other) or along the thickness direction of the housing 10. The short side direction of the housing 10 corresponds to the first direction in this application. The thickness direction of the housing 10 corresponds to directions other than the first direction in this application.

[0023] For example, as shown in Figure 4(A), when the housing 10 is pressed in the thickness direction of the housing 10 (the vertical direction of the paper in Figure 4(A)), the top and bottom surfaces of the housing 10 are indented, and the vicinity of the center of the sides SF1 and SF2 deforms to protrude in the short direction of the housing 10 (the left-right direction of the paper in Figure 4(A)). At this time, the partition 11 deforms so that its top and bottom surfaces stretch, as shown in Figure 4(A). In particular, since the partition 11 is positioned closer to the bottom surface than the center in the thickness direction of the housing 10, the amount of stretching on the top surface is greater than the amount of stretching on the bottom surface. Since the piezoelectric sensor 12 is positioned on the top surface of the partition 11, it deforms so that it stretches significantly along the short direction of the housing 10.

[0024] On the other hand, as shown in Figure 4(B), when the housing 10 is pressed in the direction of its shorter side (the left-right direction in Figure 4(B)), the sides SF1 and SF2 deform, and the top and bottom surfaces of the housing 10 deform, causing them to protrude. At this time, the partition 11 deforms, as shown in Figure 4(B), causing its top and bottom surfaces to shrink. In particular, the partition 11 is positioned closer to the bottom surface than to the center in the thickness direction of the housing 10.

[0025] Figure 5(A) shows an example of signal SL1 when the housing 10 is pressed in the thickness direction. Figure 5(B) shows an example of signal SL2 when the housing 10 is pressed in the direction in which the sides SF1 and SF2 are aligned. When the housing 10 is pressed in the thickness direction, the piezoelectric sensor 12 deforms so as to extend along the shorter side of the housing 10. On the other hand, when the housing 10 is pressed in the direction in which the sides SF1 and SF2 are aligned, the piezoelectric sensor 12 deforms so as to contract along the shorter side of the housing 10. In other words, the piezoelectric sensor 12 expands and contracts in opposite directions when the housing 10 is pressed in the thickness direction and when it is pressed in the direction in which the sides SF1 and SF2 are aligned. For this reason, as shown in Figures 5(A) and 5(B), the polarity of signal SL1 when the housing 10 is pressed in the thickness direction is inverse to the polarity of signal SL2 when the housing 10 is pressed in the direction in which the sides SF1 and SF2 are aligned. Electronic device 1 can distinguish and detect pressure applied to the top and bottom surfaces of the housing 10 from pressure applied to surfaces other than the top and bottom surfaces (for example, the sides SF1, SF2 or SF3, SF4 of the housing 10) by utilizing the reversal of signal polarity. In other words, electronic device 1 can detect when different surfaces of the housing 10 are being pressed.

[0026] The deformation of the housing 10 is not limited to the forms shown in Figures 4(A) and 4(B). For example, only one of the surfaces of the housing 10 may be pressed. Even in such a case, it is still possible to distinguish and detect the pressure on the top and bottom surfaces of the housing 10 from the pressure on surfaces other than the top and bottom surfaces (for example, the sides SF1, SF2 or SF3, SF4 of the housing 10).

[0027] Furthermore, the partition 11 provides the same effect even when the sides SF3 and SF4 are connected but the sides SF1 and SF2 are not connected. In this case, sides SF3 and SF4 correspond to the first and second parts, respectively, in this application. The piezoelectric sensor 12 outputs signals with different polarities depending on whether the housing 10 is pressed in the thickness direction or in the direction in which sides SF3 and SF4 are aligned. Therefore, the electronic device 1 can distinguish and detect whether the housing 10 is pressed in the thickness direction or in the direction in which sides SF3 and SF4 are aligned.

[0028] [Example 1] The following describes the electronic device 1a according to Modification 1 of the electronic device 1 with reference to the drawings. Figure 6 is a diagram showing the electronic device 1a according to Modification 1 of the electronic device 1.

[0029] As shown in Figure 6, in the electronic device 1a, the partition 11 is positioned very close to the bottom or top surface of the housing 10. In this modified example, the partition 11 is positioned within the housing 10, close to the top surface of the housing 10. In this modified example, the distance between the partition 11 and the top surface of the housing 10 is shorter than the distance between the partition 11 and the bottom surface of the housing 10 in the first embodiment.

[0030] When the sides SF1 and SF2 of the housing 10 are pressed, the partition 11 bends upward convexly when positioned close to the top surface of the housing 10. When the sides SF1 and SF2 of the housing 10 are pressed, the partition 11 bends downward convexly when positioned close to the bottom surface of the housing 10. On the other hand, when the partition 11 is positioned in the center in the thickness direction, it is difficult for it to bend upward or downward even when the sides SF1 and SF2 of the housing 10 are pressed. The amount of deformation of the partition 11 for the same pressing force increases as the partition 11 is positioned closer to the top or bottom surface of the housing 10. In other words, the closer the partition 11 is positioned to the top or bottom surface of the housing 10, the better the sensitivity of the piezoelectric sensor 12. In this modified example, the distance between the partition 11 and the top surface of the housing 10 is shorter than the distance between the partition 11 and the bottom surface of the housing 10 in the first embodiment. Therefore, the sensitivity of the piezoelectric sensor 12 in this modified example is higher than the sensitivity of the piezoelectric sensor 12 in the first embodiment.

[0031] [Differentiation 2] The electronic devices 1b, 1c, and 1d relating to Modification 2 of Electronic Device 1 will be described below with reference to the drawings. Figure 7(A) is a top view showing electronic device 1b relating to Modification 2 of Electronic Device 1. Figure 7(B) is a cross-sectional view of AA in Figure 7(A). Figures 8(A) and 8(B) show electronic devices 1c and 1d relating to Modification 2 of Electronic Device 1, respectively.

[0032] Electronic devices 1b, 1c, and 1d differ from electronic device 1 in that they have partitions 11b, 11c, and 11d that are different from partition 11. Partitions 11b, 11c, and 11d do not connect the two sides SF3 and SF4.

[0033] As shown in Figure 7(A), the electronic device 1b is equipped with partition 11b instead of partition 11. As shown in Figures 7(A) and 7(B), partition 11b extends from side SF3 to side SF4. Partition 11b does not contact side SF4. The other configurations of partition 11b are the same as those of partition 11, so they are not described.

[0034] As shown in Figure 8(A), the electronic device 1c is equipped with partition 11c instead of partition 11. The direction in which partition 11c extends is inclined with respect to the longitudinal direction of the housing 10 (the left-right direction of the paper in Figure 8(A)). In Figure 8(A), partition 11c extends from the edge formed by the bottom surface and side surface SF3 of the housing 10 toward the upper right of the paper. The other components of the electronic device 1c are the same as those of the electronic device 1, so their description is omitted.

[0035] As shown in Figure 8(B), the electronic device 1d includes a partition 11d instead of partition 11. Partition 11d includes a first member 110d and a second member 111d. The first member 110d extends from side SF3 toward side SF4. The second member 111d extends from side SF4 toward side SF3. The second member 111d does not come into contact with the first member 110d. In Figure 8(B), the piezoelectric sensor 12 is located on the first member 110d, but it may also be located on the second member 111d. In Figure 8(B), the second member 111d is larger than the first member 110d, but the sizes of the first member 110d and the second member 111d may be the same or different. The other components of the electronic device 1d are the same as those of the electronic device 1, so their description is omitted.

[0036] Partitions 11b, 11c, and 11d do not connect side SF3 and side SF4, but they do connect side SF1 and side SF2. Therefore, in electronic devices 1b, 1c, and 1d, the piezoelectric sensor 12 outputs signals of different polarities for pressure along the short side of the housing 10 and pressure along the thickness direction, similar to electronic device 1. Consequently, electronic devices 1b, 1c, and 1d can distinguish and detect pressure on the top and bottom surfaces of the housing 10 and pressure on side SF1 and SF2.

[0037] In the electronic device 1d, the first member 110d and the second member 111d may be in contact. Also, the side SF3 and side SF4 may be connected by the contacting first member 110d and the second member 111d. When the housing 10 is pressed in the direction in which the sides SF3 and SF4 are aligned, the piezoelectric sensor 12 deforms in the same way as when it is pressed in the direction in which the sides SF1 and SF2 are aligned. Therefore, the electronic device 1d can distinguish and detect the pressure on the sides SF3 and SF4 of the housing 10 from the pressure on the top and bottom surfaces.

[0038] [Difference 3] The following describes the electronic devices 1e, 1f, and 1g related to Modification 3 of Electronic Device 1, with reference to the drawings. Figures 9(A), 9(B), and 9(C) are diagrams showing the electronic devices 1e, 1f, and 1g related to Modification 3 of Electronic Device 1.

[0039] As shown in Figure 9(A), electronic device 1e differs from electronic device 1d in that the piezoelectric sensor 12 is positioned across both the first member 110d and the second member 111d of the partition 11d. The other components of electronic device 1e are the same as those of electronic device 1d, so their description is omitted.

[0040] As shown in Figure 9(B), electronic device 1f differs from electronic device 1e in that it has a partition 11f that is different from partition 11d. Partition 11f includes a first member 110f and a second member 111f. In Figure 9(B), the first member 110f extends from the edge formed by the bottom surface and side SF3 of the housing 10 toward the upper right of the paper, and the second member 111f extends from the edge formed by the top surface and side SF4 of the housing 10 toward the lower left of the paper. The second member 111f does not come into contact with the first member 110f. The piezoelectric sensor 12 is arranged across the first member 110f and the second member 111f. The other configurations of electronic device 1f are the same as those of electronic device 1, so their description is omitted.

[0041] As shown in Figure 9(C), electronic device 1g differs from electronic device 1e in that it has a partition 11g that is different from partition 11d. Partition 11g includes a third member 112g in addition to the first member 110d and the second member 111d. The third member 112g is positioned between the first member 110d and the second member 111d. The third member 112g does not come into contact with the first member 110d and the second member 111d. The piezoelectric sensor 12 is positioned across the first member 110d, the second member 111d and the third member 112g. The other components of electronic device 1g are the same as those of electronic device 1e and are therefore not described.

[0042] Electronic devices 1e, 1f, and 1g produce the same effects as electronic devices 1b, 1c, and 1d.

[0043] For example, as shown in Figures 9(A) to 9(C), the electronic device in this application may be configured such that the piezoelectric sensor 12 is in contact with multiple members that are in contact with opposing sides of the housing 10. In other words, the multiple first members and the piezoelectric sensor 12 may be in a configuration in which they are in continuous contact with opposing sides of the housing 10. Even with such a configuration, the piezoelectric sensor 12 can obtain sufficient output because each of the multiple partitions is in contact with an opposing side.

[0044] [Differentiation Example 4] The following describes the electronic devices 1h, 1i, and 1j related to Modification 4 of Electronic Device 1, with reference to the drawings. Figures 10(A), 10(B), and 10(C) are diagrams showing the electronic devices 1h, 1i, and 1j related to Modification 4 of Electronic Device 1.

[0045] Electronic devices 1h, 1i, and 1j differ from electronic device 1 in that the volume of the partition is larger than the volume of the portion within the housing 10 where the partition is not placed.

[0046] As shown in Figure 10(A), the electronic device 1h is equipped with partition 11h, which is different from partition 11. Partition 11h is located in all parts of the housing 10 except near the top surface of the housing 10. The other components of the electronic device 1h are the same as those of the electronic device 1, so their description is omitted.

[0047] As shown in Figure 10(B), electronic device 1i differs from electronic device 1h in that it has a partition 11i that is different from partition 11h. Partition 11i is located in all parts of the housing 10 except near the top and bottom surfaces of the housing 10. The distance between partition 11h and the top surface of the housing 10 is approximately the same as the distance between partition 11h and the bottom surface of the housing 10. The other configurations of electronic device 1i are the same as those of electronic device 1h, so their description is omitted.

[0048] As shown in Figure 10(C), the electronic device 1j differs from the electronic device 1i in that it has a partition 11j that is different from partition 11i. The distance between partition 11j and the top surface of housing 10 is different from the distance between partition 11j and the bottom surface of housing 10. The other components of electronic device 1j are the same as those of electronic device 1i, so their description is omitted.

[0049] When the top and bottom surfaces of the housing 10 are pressed, the pressing force from the top and bottom surfaces of the housing 10 is transmitted to the partition, causing it to bend convexly upward or downward, similar to the top or bottom surface of the housing 10. The larger the volume of the partition, the easier it is for the pressing force to be transmitted to the partition. Therefore, for the same pressing force, the larger the volume of the partition, the greater the deformation of the partition. In other words, the larger the volume of the partition, the higher the sensitivity of the piezoelectric sensor 12. In Modification 4, the volumes of the partitions 11h, 11i, and 11j are larger than the volume of the portion of the housing 10 where the partitions 11h, 11i, and 11j are not located. Therefore, the sensitivity of the piezoelectric sensor 12 in Modification 4 is higher than the sensitivity of the piezoelectric sensor 12 in the first embodiment.

[0050] [Difference 5] The following describes the electronic devices 1k, 1m, 1n, and 1o related to Modification 5 of Electronic Device 1, with reference to the drawings. Figures 11(A), 11(B), 11(C), and 11(D) are diagrams showing the electronic devices 1k, 1m, 1n, and 1o related to Modification 5 of Electronic Device 1.

[0051] Electronic devices 1k, 1m, 1n, and 1o differ from electronic device 1 in that the multiple components contained within the partition are arranged in the thickness direction of the housing 10.

[0052] As shown in Figure 11(A), the electronic device 1k includes a partition 11k comprising a first member 110k and a second member 111k. The first member 110k and the second member 111k are aligned in the thickness direction of the housing 10. A gap exists between the first member 110k and the second member 111k. The volume of the second member 111k is greater than the volume of the gap. The piezoelectric sensor 12 is located in the first member 110k. The other components of the electronic device 1k are the same as those of the electronic device 1 and are therefore omitted from the description.

[0053] As shown in Figure 11(B), electronic device 1m differs from electronic device 1k in that it includes a partition 11m that is different from partition 11k. Partition 11m includes a second member 111m that is different from the second member 111k. The volume of the second member 111m is smaller than the volume of the gap between the first member 110k and the second member 111m. The other components of electronic device 1m are the same as those of electronic device 1k, so their description is omitted.

[0054] As shown in Figure 11(C), electronic device 1n differs from electronic device 1m in that the second member 111m of the partition 11m does not come into contact with the bottom surface of the housing 10. The other components of electronic device 1n are the same as those of electronic device 1m, so their description is omitted.

[0055] As shown in Figure 11(D), the electronic device 1o differs from the electronic device 1k in that it has a partition 11o that is different from partition 11k. Unlike partition 11k, partition 11o includes three members. Partition 11o includes a first member 110o, a second member 111o, and a third member 112o. The first member 110o, the second member 111o, and the third member 112o are aligned in the thickness direction of the housing 10. The first member 110o, the second member 111o, and the third member 112o do not come into contact with each other. The other components of electronic device 1o are the same as those of electronic device 1k, so their description is omitted.

[0056] In Modified Example 5, the volumes of the partitions 11k, 11m, and 11o in the electronic devices 1k, 1m, 1n, and 1o, respectively, are larger than the volume of the portion within the housing 10 where the partitions 11k, 11m, and 11o are not located. Therefore, the sensitivity of the piezoelectric sensors 12 in the electronic devices 1k, 1m, 1n, and 1o in Modified Example 5 is also higher than the sensitivity of the piezoelectric sensors 12 in the first embodiment.

[0057] [Experiments using electronic devices 1, 1a, and 1o] The following describes the experiments using electronic devices 1, 1a, and 1o, with reference to the drawings. Figure 12 shows the results of the experiments using electronic devices 1, 1a, and 1o. Figure 12 shows the output of the piezoelectric sensor 12 when the housing 10 of electronic devices 1, 1a, and 1o is pressed in the thickness direction of the housing 10, and the output of the piezoelectric sensor 12 when it is pressed in the direction in which the sides SF1 and SF2 are aligned. In the table in Figure 12, the output of the piezoelectric sensor 12 when the housing 10 of electronic device 1o is pressed in the thickness direction is used as the reference.

[0058] As shown in Figure 12, in electronic device 1, when the housing 10 is pressed in the thickness direction, the output of the piezoelectric sensor 12 is 8%, meaning the polarity of the signal from the piezoelectric sensor 12 is positive. Similarly, in electronic devices 1a and 1o, when the housing 10 is pressed in the thickness direction, the polarity of the signal from the piezoelectric sensor 12 is positive.

[0059] On the other hand, as shown in Figure 12, in electronic device 1, when the housing 10 is pressed in the direction in which the sides SF1 and SF2 are aligned, the output of the piezoelectric sensor 12 is -4%, meaning the polarity of the signal from the piezoelectric sensor 12 is negative. Similarly, in electronic devices 1a and 1o, when the housing 10 is pressed in the thickness direction, the polarity of the signal from the piezoelectric sensor 12 is negative.

[0060] As described above, in electronic devices 1, 1a, and 1o, the polarity of the signal output by the piezoelectric sensor 12 differs depending on whether the housing 10 is pressed in the thickness direction or in the direction in which the sides SF1 and SF2 are aligned. Therefore, by detecting whether the polarity of the signal output by the piezoelectric sensor 12 is positive or negative, electronic devices 1, 1a, and 1o can distinguish and detect the pressure on the sides SF1 and SF2 of the housing 10 from the pressure on the top and bottom surfaces of the housing 10.

[0061] Furthermore, as explained in Modification Example 1, when the sides SF1 and SF2 of the housing 10 are pressed, the amount of deformation of the partition 11 increases as the partition 11 is positioned closer to the top or bottom surface of the housing 10. The partition 11 in electronic device 1a is positioned closer to the top or bottom surface of the housing 10 compared to the partition 11 in electronic device 1. Therefore, as shown in Figure 12, when the housing 10 is pressed in the direction in which the sides SF1 and SF2 are aligned, the output of the piezoelectric sensor 12 in electronic device 1a is greater than the output of the piezoelectric sensor 12 in electronic device 1.

[0062] Furthermore, as explained in Modification 4 and Modification 5, when the top and bottom surfaces of the housing 10 are pressed, the pressing force is more easily transmitted to the partition 11 the larger the volume of the partition 11. The volume of the partition 11o in electronic device 1o is larger than the volume of the partition 11 in electronic device 1 and electronic device 1a. Therefore, as shown in Figure 12, when the housing 10 is pressed in the thickness direction, the output of the piezoelectric sensor 12 in electronic device 1o is greater than the output of the piezoelectric sensor 12 in electronic devices 1 and 1a.

[0063] [Modification 6] The electronic devices 1p, 1q, and 1r related to Modification 6 of Electronic Device 1 will be described below with reference to the drawings. Figures 13(A), 13(B), and 13(C) are diagrams showing the electronic devices 1p, 1q, and 1r related to Modification 6 of Electronic Device 1.

[0064] Electronic devices 1p, 1q, and 1r differ from electronic device 1 in that the piezoelectric sensor 12 is frequently sandwiched between them.

[0065] As shown in Figure 13(A), the electronic device 1p includes a partition 11p. The partition 11p includes a first member 110p and a second member 111p. The first member 110p and the second member 111p are aligned in the thickness direction of the housing 10. The first member 110p and the second member 111p do not contact each other, and there is an air gap GP1 between the first member 110p and the second member 111p. The piezoelectric sensor 12 is located on the first member 110p. The piezoelectric sensor 12 is located between the first member 110p and the second member 111p, that is, in the air gap GP1. The other configurations of the electronic device 1p are the same as those of the electronic device 1, so their description is omitted.

[0066] As shown in Figure 13(B), electronic device 1q differs from electronic device 1p in that the second member 111p is in contact with the upper surface of the housing 10. The other components of electronic device 1q are the same as those of electronic device 1p, so their description is omitted.

[0067] As shown in Figure 13(C), electronic device 1r differs from electronic device 1q in that the first component 110p is in contact with the bottom surface of the housing 10. The other components of electronic device 1r are the same as those of electronic device 1q, so their description is omitted.

[0068] In electronic devices 1p, 1q, and 1r, the piezoelectric sensor 12 is positioned in the air gap GP1. Therefore, even if the housing 10 is struck by an impact, for example, due to the electronic devices 1p, 1q, or 1r being dropped, the vibrations generated in the housing 10 by the impact are not transmitted to the piezoelectric sensor 12. Consequently, the piezoelectric sensor 12 is less likely to malfunction due to such impacts. Furthermore, the volume of the partition 11p in each of the electronic devices 1p, 1q, and 1r is larger than the volume of the portion of the housing 10 where the partition 11p is not positioned. Consequently, the sensitivity of the piezoelectric sensor 12 in each of the electronic devices 1p, 1q, and 1r is higher than that of the piezoelectric sensor 12 in the first embodiment.

[0069] [Difference 7] The following describes the electronic devices 1s, 1t, and 1u related to Modification 7 of Electronic Device 1 with reference to the drawings. Figures 14(A), 14(B), and 14(C) are diagrams showing the electronic devices 1s, 1t, and 1u related to Modification 7 of Electronic Device 1.

[0070] Electronic devices 1s, 1t, and 1u differ from electronic device 1r in that one partition surrounds the piezoelectric sensor 12.

[0071] As shown in Figure 14(A), the electronic device 1s is equipped with a partition 11s. Within the partition 11s, there is an air gap GP2 that is larger than the piezoelectric sensor 12. The piezoelectric sensor 12 is placed within the air gap GP2. The air gap GP2 is located on the side SF1 side of the housing 10. The air gap GP2 is in contact with the side SF1 of the housing 10. The other components of the electronic device 1s are the same as those of the electronic device 1r, so their description is omitted.

[0072] As shown in Figure 14(B), the electronic device 1t is equipped with a partition 11t that is different from partition 11s. Partition 11t does not come into contact with the bottom and top surfaces of the housing 10. The other components of the electronic device 1t are the same as those of the electronic device 1s, so their description is omitted.

[0073] As shown in Figure 14(C), the electronic device 1u has a partition 11u that is different from partition 11t. In partition 11u, the air gap GP2 is located in the center of the shorter side of partition 11u compared to the air gap GP2 in partition 11t. The air gap GP2 does not come into contact with the side surface SF2. Therefore, in electronic device 1u, the entire surface of the piezoelectric sensor 12 is surrounded by partition 11u. The other configurations of electronic device 1u are the same as those of electronic device 1t, so their description is omitted.

[0074] The volume of each partition 11p in the electronic devices 1p, 1q, and 1r is greater than the volume of the portion within the housing 10 where partitions 11p are not located. Therefore, the sensitivity of each piezoelectric sensor 12 in the electronic devices 1p, 1q, and 1r is also higher than the sensitivity of the piezoelectric sensor 12 in the first embodiment.

[0075] Furthermore, the partitions 11s, 11t, and 11u may be connected to ground. In this case, the piezoelectric sensor 12, surrounded by partitions 11s, 11t, and 11u, becomes less susceptible to external noise, and the sensitivity of the piezoelectric sensor 12 increases.

[0076] [Differentiation 8] The following describes Modification 8 of Electronic Device 1 with reference to the drawings. Figure 15 shows Electronic Device 1v relating to Modification 8 of Electronic Device 1.

[0077] As shown in Figure 15, the electronic device 1v comprises components 20, 21, and 22. In this modified example, the housing 10 encloses components 20, 21, and 22. The electronic device 1v is, for example, a small electronic device such as a smartphone or TWS (True Wireless Stereo) earphones. The housing 10 is, for example, a smartphone case or an earphone housing. Components 20, 21, and 22 are components that realize the functions of the electronic device 1v, such as a battery, a circuit board, and a Bluetooth® module.

[0078] In such an electronic device 1v, for example, when component 21 connects side surfaces SF1 and SF2 of the housing 10, component 21 functions as a partition 11 in the first embodiment. A piezoelectric sensor 12 is placed on component 21. When the housing 10 is pressed in the thickness direction, the piezoelectric sensor 12 placed on the upper surface of component 21 deforms to stretch significantly along the short side direction of the housing 10. On the other hand, when the housing 10 is pressed in the short side direction, the piezoelectric sensor 12 placed on the upper surface of component 21 deforms to contract significantly along the short side direction of the housing 10. As a result, in the electronic device 1v, the polarity of the signals differs between the pressure on the top and bottom surfaces of the housing 10 and the pressure on side surfaces SF1 and SF2, so that the pressure on the top and bottom surfaces of the housing 10 and the pressure on side surfaces SF1 and SF2 can be distinguished and detected.

[0079] Furthermore, as shown in Figure 15, even if there is no space on the housing 10 of the electronic device 1v to attach the piezoelectric sensor 12, simply placing the piezoelectric sensor 12 on the component 21 connecting the two sides of the housing 10 allows detection of which part of the housing 10 is being pressed. In other words, there is no need to provide space on the housing 10 to attach the piezoelectric sensor 12, which allows for space saving and miniaturization of the electronic device 1v.

[0080] Furthermore, if the electronic device 1v is equipped with electrodes as a component, these electrodes may be used as the first electrode 121 and the second electrode 122 of the piezoelectric sensor 12. In this case, only the piezoelectric film 120 needs to be attached to the component 21 connecting the two sides of the housing 10.

[0081] [Other embodiments] The description of this embodiment should be considered in all respects to be illustrative and not restrictive. The scope of the invention is indicated by the claims, rather than by the embodiments described above. Furthermore, the scope of the invention includes the scope equivalent to the claims.

[0082] Furthermore, the electronic device according to the present invention is not limited to electronic devices 1, 1a~1k, 1m~1v, but can be modified within the scope of its gist. The configurations of electronic devices 1, 1a~1k, 1m~1v may be combined in any way.

[0083] Furthermore, if the partition 11 connects not only sides SF1 and SF2, but also sides SF3 and SF4, the electronic device 1 can detect pressure in the direction in which sides SF3 and SF4 are aligned. Here, since the area of ​​sides SF3 and SF4 is smaller than the area of ​​sides SF1 and SF2, if the pressing force is the same, the amount of deformation of sides SF3 and SF4 is smaller than the amount of deformation of sides SF1 and SF2. Therefore, the amount of deformation of the partition 11 when sides SF3 and SF4 are pressed is smaller than the amount of deformation of the partition 11 when sides SF1 and SF2 are pressed, so the amount of deformation of the piezoelectric sensor 12 when sides SF3 and SF4 are pressed is small. For this reason, the output of the piezoelectric sensor 12 when sides SF3 and SF4 are pressed is smaller than the output of the piezoelectric sensor 12 when sides SF1 and SF2 are pressed. Therefore, the electronic device 1 may detect whether sides SF1 and SF2 or sides SF3 and SF4 are pressed based on the magnitude of the output of the piezoelectric sensor 12. Specifically, the electronic device 1 may detect that when the piezoelectric sensor 12 outputs a negative signal relative to a reference potential, if the magnitude of the signal is less than a predetermined threshold, the sides SF3 and SF4 are pressed, and if the magnitude of the signal is greater than a predetermined threshold, the sides SF1 and SF2 are pressed. In other words, the electronic device 1 may detect which of the pairs of opposing surfaces in the rectangular prism-shaped housing 10 has been pressed.

[0084] The present invention has the following structure.

[0085] (1) A housing having a hollow shape, A partition placed inside the aforementioned enclosure, A sensor is placed in the partition to detect deformation of the partition, Equipped with, The aforementioned partition connects a first portion on the inner surface of the housing with a second portion opposite to the first portion. electronic equipment.

[0086] (2) The sensor outputs signals of different polarities when compressed along a first direction in which the first and second parts of the housing face each other, and when compressed along a direction other than the first direction. (1) Electronic equipment as described above.

[0087] (3) The volume of the partition is greater than the volume of the portion of the housing where the partition is not located. (1) or (2) the electronic equipment described above.

[0088] (4) The sensor is positioned near either the first or second portion. (1) to (3) any electronic device described in any of the above.

[0089] (5) The sensor is not in contact with the housing. An electronic device as described in any of (1) to (4).

[0090] (6) The aforementioned partition includes a first member and a second member, The sensor is arranged in the first member or the second member. A gap exists between the first member and the second member. The sensor is placed in the gap, (1) to (5) any electronic device.

[0091] (7) The aforementioned partition is connected to the ground. (1) to (6) the electronic devices described above. [Explanation of Symbols]

[0092] 1,1a~1k,1m~1v:Electronic equipment 10: Cabinet 11, 11b~11d, 11f~11u: partition 12: Piezoelectric sensor 120: Piezoelectric film 121: 1st electrode 122:Second electrode 20, 21, 22: Parts 110d, 110f, 110k, 110o, 110p: First member 111d, 111f, 111k, 111m, 111o, 111p: Second member 112g, 112o: Third component GP1,GP2: air gap OD: Stretching direction SF1~SF4: Side view SL1, SL2: Signal

Claims

1. A housing having a hollow shape, A partition is placed inside the aforementioned enclosure and connected to ground, A sensor is placed in the partition to detect deformation of the partition, Equipped with, The aforementioned partition connects the first portion on the inner surface of the housing with the second portion facing the first portion. The sensor is surrounded by the partition, electronic equipment.

2. The sensor outputs signals of different polarities when compressed along a first direction in which the first and second parts of the housing face each other, and when compressed along a direction other than the first direction. The electronic device according to claim 1.

3. The volume of the partition is greater than the volume of the portion of the housing where the partition is not located. The electronic device according to claim 1 or claim 2.

4. The sensor is positioned near either the first portion or the second portion. The electronic device according to claim 1 or claim 2.

5. The sensor is not in contact with the housing. The electronic device according to claim 1 or claim 2.

6. The partition includes a first member and a second member, The sensor is arranged on the first member or the second member. A gap exists between the first member and the second member. The sensor is placed in the gap, The electronic device according to claim 1 or claim 2.

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