Vehicle pedals including redundant dual-output inductive position sensors with reduced coupling coil circuits

Abstract

A vehicle pedal assembly including a pedal housing, a rotatable pedal, and an inductive position sensor, the inductive position sensor including an inductive sensor target rotatable in response to rotation of the pedal, and a substrate disposed opposite the inductive sensor target, wherein first and second redundant inductive transmit and receive coil circuits are defined and disposed on different sections of the substrate in a relationship where a receive coil circuit of each of the first and second transmit and receive coil circuits is at least partially surrounded by a transmit coil circuit of each of the first and second transmit and receive coil circuits to reduce a coupling coefficient between the first and second transmit and receive coil circuits.

Description

Technical Field

[0001] This patent application claims the priority and benefit of the filing date of U.S. Provisional Patent Application No. 62 / 976,787, filed on February 14, 2020, the disclosure and content of which are hereby expressly incorporated by reference in their entirety.

[0002] The present invention generally relates to vehicle pedals, and more particularly to vehicle accelerator pedals including redundant dual output inductive (or inductive / inductive) position sensors with reduced coupling between the transmit coil circuit and the receive coil circuit.

Background Art

[0003] Vehicle accelerator pedals having redundant dual output inductive sensors for sensing the position of the pedal are known in the art and incorporate transmit coil circuits and receive coil circuits of the type shown in FIGS. 3 and 4 herein.

[0004] The present invention is directed to a vehicle accelerator pedal including a redundant dual output inductive position sensor having reduced coupling transmit and receive coil circuits.

Disclosure of the Invention

Problems to be Solved by the Invention

[0005] The present invention generally relates to a vehicle pedal assembly including a pedal housing, a rotatable pedal, and an inductive position sensor including an inductive sensor target rotatable in response to rotation of the pedal, a substrate disposed on the opposite side of the inductive sensor target, a first inductive transmit and receive coil circuit defined on the substrate, and a second inductive transmit and receive coil circuit defined and positioned relative to the first inductive transmit and receive coil circuit on the substrate to reduce the coupling coefficient between the first and second inductive transmit and receive coil circuits.

[0006] In one embodiment, the first and second inductive transmit and receive coil circuits are defined and positioned on different sections of the substrate in relation to the respective receive coil circuits of the first and second transmit and receive coil circuits, which are at least partially surrounded by the respective transmit coil circuits of the first and second transmit and receive coil circuits, in order to reduce the coupling coefficient between the first and second transmit and receive coil circuits.

[0007] In one embodiment, the substrate defines a longitudinal axis that separates the substrate into first and second sections on either side of the longitudinal axis, the first inductive transmit and receive coil circuit is located on the first section of the substrate, and the second inductive transmit and receive coil circuit is located on the second section of the substrate.

[0008] In one embodiment, the substrate includes first, second, third, and fourth sections, and the first and second inductive transmitting coil circuits and the second inductive receiving coil circuit are arranged on separate sections of the substrate.

[0009] The present invention also relates to an inductive position sensor comprising a pedal housing, a rotatable pedal, an inductive target rotatable in response to the rotation of the pedal, a substrate positioned opposite the inductive target, a plurality of inductive transmitting coil circuits defined on the substrate, and a plurality of inductive receiving coil circuits defined on the substrate and each at least partially surrounded by the plurality of inductive transmitting coil circuits to reduce the coupling coefficient between the plurality of inductive transmitting coil circuits.

[0010] In one embodiment, the substrate defines multiple substrate sections, and multiple inductive transmitting coil circuits and multiple inductive receiving coil circuits are arranged on different of the multiple substrate sections.

[0011] In one embodiment, the substrate defines a longitudinal axis and first and second sections located on both sides of the longitudinal axis, with a first of a plurality of inductive transmitting coil circuits and a first of a plurality of inductive receiving coil circuits at least partially enclosed by the first of a plurality of inductive transmitting coil circuits located on the first section of the substrate, and a second of a plurality of inductive transmitting coil circuits and a second of a plurality of inductive receiving coil circuits at least partially enclosed by the first of a plurality of inductive transmitting coil circuits located on the second section of the substrate.

[0012] In one embodiment, the substrate is at least partially surrounded by first, second, third, and fourth sections of a plurality of inductive transmitting coil circuits, and by first, second, third, and fourth inductive receiving coil circuits, defining the first, second, third, and fourth inductive receiving coil circuits arranged in the first, second, third, and fourth sections of the substrate, respectively.

[0013] The present invention further comprises a substrate, a plurality of inductive transmitting coil circuits defined on the substrate, and a mechanism defined on the substrate to reduce the coupling coefficient between the plurality of inductive transmitting coil circuits. The subject is an inductive position sensor comprising multiple inductive receiving circuits, each at least partially surrounded by multiple inductive transmitting circuits.

[0014] In one embodiment, the substrate includes a plurality of substrate sections, and a plurality of inductive transmitting coil circuits and each of the plurality of inductive receiving circuits are at least partially surrounded by a plurality of inductive transmitting circuits located on each of the plurality of substrate sections.

[0015] In one embodiment, the substrate defines a longitudinal axis and first and second substrate sections on both sides of the longitudinal axis, and further comprises first and second inductive transmitting coil circuits and first and second inductive receiving coil circuits located on the respective first and second sections of the substrate on both sides of the longitudinal axis of the substrate, at least partially surrounded by the first and second inductive transmitting coil circuits.

[0016] In one embodiment, the substrate defines at least first, second, third, and fourth substrate sections and further comprises first, second, third, and fourth inductive transmitting coil circuits, and first, second, third, and fourth inductive transmitting coil circuits that are at least partially surrounded by the first, second, third, and fourth transmitting coil circuits and located on the first, second, third, and fourth substrate sections, respectively.

[0017] Other advantages and features of the present invention will become more readily apparent from the following description of embodiments of the present invention, the drawings, and the appended claims. [Brief explanation of the drawing]

[0018] In the accompanying drawings that form part of this specification, the same reference numeral is used to indicate the same part throughout. Figure 1 is a perspective view of a vehicle accelerator pedal incorporating the inductive position sensor assembly according to the present invention. Figure 2 is an exploded perspective view of the vehicle accelerator pedal shown in Figure 1. Figure 3A is a plan view of the inductive transmit / receive coil circuit on the front outer surface of the substrate of a conventional inductive position sensor. Figure 3B is a plan view of the inductive transmit / receive coil circuits on the opposing back outer surfaces of the substrate of the conventional inductive position sensor shown in Figure 3A. Figure 4A is a plan view of an inductive transmit / receive coil circuit on the front outer surface of a substrate of another conventional inductive position sensor. Figure 4B is a plan view of the inductive transmit / receive coil circuits on the opposing back outer surfaces of the substrate of the conventional inductive position sensor shown in Figure 4A. Figure 5A is a plan view of the inductive transmit / receive coil circuit on the front outer surface of the substrate of the inductive position sensor according to the present invention. Figure 5B is a plan view of the inductive transceiver coil circuit on the opposing rear outer surfaces of the substrate of the inductive position sensor shown in Figure 5A. Figure 6A is a plan view of an inductive transceiver coil circuit on the front outer surface of a substrate of another inductive position sensor according to the present invention. Figure 6B is a plan view of the inductive transceiver coil circuit on the opposing rear outer surfaces of the substrate of the inductive position sensor shown in Figure 6A. [Modes for carrying out the invention]

[0019] Figures 1 and 2 show a vehicle accelerator pedal 10 having an inductive position sensor assembly according to the present invention, which incorporates a reduced coupling transmit and receive coil circuit structure, as will be described in more detail below.

[0020] The vehicle accelerator pedal 10 comprises a plastic pedal housing 20 which includes a base 20b that defines a plurality of outer walls 20a, an interior 20c, a front opening 20d, and a side opening 20e.

[0021] The vehicle accelerator pedal 10 also includes an elongated plastic pedal arm 30 which includes a distal end or drum 32 having a metal inductive sensor target 34 adapted to be overmolded within the outer surface 32a of the drum 32. The pedal arm 30, more specifically the distal end having the target 34 on it or the drum 32, extends into the interior 20c of the pedal housing 20 so as to be rotatable with respect to the housing 20, and more specifically, it surrounds a shaft 20b which is integral with one of the side walls 20a of the housing 20, and extends into the interior 20c of the housing 20 so as to be rotatable with respect to it.

[0022] The accelerator pedal 10 is in a relationship of covering and closing the housing-side opening 20e, more specifically in a relationship of covering the drum 32 of the pedal arm 30 located inside the housing 20, and even more specifically in a relationship of facing the outer side surface 32a of the drum 32 of the pedal arm 30 and having an inductive sensor target 34 overmolded thereon, and further includes a combination of a plastic housing cover fixed to the pedal housing 20 and an electrical connector assembly 40. A plurality of screws 45 fix the cover 40 to the housing 20.

[0023] The housing cover 40 includes an integral electrical connector 42 and defines both a central circular opening 43 and an internal recess 44 surrounding the opening 42. The housing cover 40 and the pedal arm 30 are positioned relative to each other such that when the housing cover 40 is fixed to the housing 20, the target 34 on the drum 32 of the pedal arm 30 extends into and is positioned within the circular opening 43 defined within the housing cover 40.

[0024] The accelerator pedal 10 further includes opposing outer surfaces 52 and 54, is disposed and seated insertably within the recess 44 defined within the housing cover 40, is disposed in an opposing and adjacent relationship to the target 34 on the drum 32 of the pedal arm 30, and even more specifically, in an embodiment, includes an inductive position sensor substrate or printed circuit board 50 where the outer surface 54 of the substrate faces the target 34.

[0025] The substrate 50 includes respective inductive sensor transmitter coil circuits and receiver coil circuits defined and formed on respective external front surfaces 52 and rear surfaces 54, as will be described in more detail below.

[0026] The accelerator pedal 10 further includes a plastic electrical cover or plate 70 that covers the inductive substrate 50 and is fixed to the outer surface of the housing cover 40.

[0027] The accelerator pedal 10 further comprises a pedal friction assembly 80 located inside 20c of the housing 20. The pedal friction assembly 80 includes a friction device 81 adapted to pivot relative to the base 22 of the pedal housing 20. A pair of telescopic springs 82 and 84 extend between the friction device 80 and the underside of the elongated pedal arm 30. A spring damper 86 is configured to be compressed between the two springs 82 and 84.

[0028] The inductive position sensor assembly of pedal 10 includes an inductive position sensor target 34 on the drum 32 of pedal arm 30, a circuit board 50, and associated transmit and receive coil circuits, as will be described in more detail below.

[0029] Applying or removing foot force to the pedal arm 30 while the vehicle (not shown in the diagram) is in operation results in movement / rotation of the pedal arm 30, further causing movement / rotation of the pedal arm drum 32 inside the pedal housing 20c, and further resulting in movement / rotation of the inductive sensor target 34 on the pedal arm drum 32.

[0030] The movement / rotation of the target 34 relative to the inductive position sensor transmitting coil circuit and receiving coil circuit defined and formed on the outer side surfaces 52 and 54 of the substrate 50 results in a change in the magnetic field generated by each transmitting coil circuit of the inductive position sensor, which in turn results in a change in the voltage in each receiving coil circuit of the inductive position sensor.

[0031] The voltage change is detected and measured by the associated inductive position sensor integrated circuit, which then detects and converts it into an electrical signal output for controlling the acceleration and deceleration of the vehicle.

[0032] Figures 3A and 3B show a substrate 50 of an existing prior art dual output axis inductive position sensor assembly, including inductive sensor transmit coil circuits 56, 58, 60, and 62 defined and formed on the opposing outer surfaces 52 and 54 of the substrate 50.

[0033] According to the conventional transmit / receive coil circuit structure shown in Figures 3A and 3B, the transmit and receive coil circuits 56 and 60 on the outer surface 52 of the substrate 50 define and form a first inductive position sensor output or circuit, and the transmit and receive coil circuits 58 and 62 on the opposing outer surface 54 of the substrate 50 define and form a second redundant inductive position sensor output circuit.

[0034] In Figures 3A and 3B, the first transmitting coil circuit 56 is composed of a plurality of transmitting coil traces 56a defined and formed on the outer surface 52 of the substrate 50, while the second transmitting coil circuit 58 is composed of a plurality of receiving coil traces 58a defined on the opposing outer surfaces 54 of the substrate 50.

[0035] The first receiving coil circuit 60 consists of a plurality of receiving coil traces 60a defined on the outer surface 52 of the substrate 50, and the second receiving coil circuit 62 consists of a plurality of receiving coil traces 62a defined on the opposing outer surface 54 of the substrate 50.

[0036] Specifically, as shown in Figure 3A, the first transmitting coil circuit 56, and more specifically its first plurality of transmitting coil circuit traces 56a, at least partially surround the first receiving coil circuit 60, and more specifically, at least partially surround the first receiving coil circuit traces 60a that extend outward from the center of the substrate 50 in a spoke-like pattern with respect to the transmitting coil circuit 56 and each of its traces 56a, extending in a circular wheel-like pattern adjacent to and spaced apart from the outer surface 52 of the substrate 50.

[0037] As shown in Figure 3B, the second transmitting coil circuit 58 on the opposing outer surface 54 of the substrate 50, more specifically, the second plurality of transmitting coil circuit traces 58a, at least partially surround the second receiving coil circuit traces 62a that extend outward from the center of the substrate 50 in a spoke-like pattern relative to the transmitting coil circuit 58 and each of the traces 58a, and the circular wheel-shaped pattern extends around the periphery or outer edge of the opposing outer surface 54 of the substrate 50.

[0038] The substrate 50 of a conventional inductive position sensor is shown in the figure. Therefore, Figures 3A and 3B are characterized in that the outer surface 52 includes only one transmitting coil circuit 56 and only one receiving coil circuit 60 is defined and formed on it, and the opposing outer surface 54 includes only one transmitting coil circuit 58 and only one receiving coil circuit 62 is defined and formed on it.

[0039] The substrate 50 of a conventional inductive position sensor is shown in the figure. 3A and 3B are further characterized in that the respective transmitting coil circuits 56 and 58, more specifically the respective transmitting coil circuit traces 56a and 58a on the respective opposing outer surfaces 52 and 54 of the substrate 50, are positioned in a relationship of overlapping, back-to-back, or facing each other on the opposing substrate surfaces 52 and 54 of the substrate 50, with the respective transmitting coil circuits 56 and 58 occupying the respective overlapping or opposing regions or areas of the opposing substrate surfaces 52 and 54. More specifically, the respective receiving coil circuit traces 60a and 62a on the respective opposing outer surfaces 52 and 54 of the substrate are also positioned in a relationship of overlapping, facing each other, or back-to-back on the opposing substrate surfaces 52 and 54 of the substrate 50, with the respective receiving coil circuits 60 and 62 occupying the same respective overlapping or opposing regions or areas of the opposing substrate surfaces 52 and 54.

[0040] The overlapping relationship between the respective transmitters 56 and 58 and the receivers 60 and 62 coil circuits results in coupling or an increase in the coupling coefficient between the respective transmitter coil circuits 56 and 58 and the receivers 60 and 62 coil circuits. The coupling coefficient between the respective transmitter coil circuits 56 and 58 is proportional to the mutual inductance between the respective transmitter coil circuits 56 and 58, and the mutual inductance is proportional to the magnetic flux generated by the respective transmitter coil circuits 56 and 58. The positioning and arrangement of the respective transmitter coil circuits 56 and 58 and the respective receiver coil circuits 60 and 62 in their overlapping relationship on the opposing surfaces 52 and 54 of the substrate 50 results in interaction and mixing between the respective magnetic fields generated by the respective transmitter coil circuits 56 and 58, resulting in an increase in coupling between the respective transmitter coil circuits 56 and 58 and the respective receiver coil circuits 60 and 62.

[0041] Therefore, in the case of a short circuit or open circuit condition in one of the two redundant transmitting circuits 56 or 58, the increased coupling between the transmitting circuits 56 and 58 in the configurations of Figures 3A and 3B, where each transmitting circuit 56 and 58 and each receiving circuit 60 and 62 occupy the same opposing region or region on the opposing surfaces 52 and 54 of the printed circuit board 50, results in interaction between the magnetic fields generated by each transmitting coil circuit, increasing the coupling between the transmitting circuits 56 and 58, which, unfortunately, increases the likelihood of malfunction of the non-short-circuited transmitting circuit 56 and 58.

[0042] The associated electrical circuits, components, and output integrated circuits 53 on the respective opposing surfaces 52 and 54 of the substrate 50 are electrically coupled to the respective transmit and receive coil circuit traces 56a, 58a, 60a, and 62a on the respective opposing surfaces 52 and 54 of the substrate 50.

[0043] Figures 4A and 4B show a second embodiment of a prior art inductive position sensor, comprising axial dual-output inductive sensor transmit and receive coil circuits 156, 158, 160, and 162 defined and formed on opposing outer surfaces 52 and 54 of a substrate 50.

[0044] According to the conventional circuit structure shown in Figures 4A and 4B, the transmitting and receiving coil circuits 156, 158, and 160 on the outer surface 52 of the substrate 50 are combined with the transmitting and receiving coil circuits 156, 158, and 162 on the opposing outer surface 54 of the substrate 50 to define and form first and second redundant inductive position sensors, respectively.

[0045] In the prior art embodiments shown in Figures 4A and 4B, the first and second transmitting coil circuits 156 and 158 are defined and formed on the opposing outer surfaces 52 and 54 of the substrate 50, respectively, and each comprises a plurality of transmitting coil circuit traces 156a and 158a that extend in an alternating circular or wheel-shaped pattern adjacent to and spaced apart from the periphery of the outer surfaces 52 and 54 of the substrate 50, at least partially surrounding the respective first and second plurality of traces 160a and 160b of each plurality of traces 160a and 162 that extend outward from the center of the printed circuit 50 in a spoke-like pattern with respect to the respective traces 156a and 158a of the respective transmitting coil circuits 156 and 158a.

[0046] The substrate 50 of the conventional inductive position sensor depicted in Figures 4A and 4B is characterized in that the outer surface 52 of the substrate 50 includes only one receiver coil circuit 160, at least partially surrounded by the traces 156a and 158a of the respective transmitting coil circuits 156 and 158, and the opposing outer surface 54 of the substrate 50 includes only one receiver coil circuit 162, at least partially surrounded by the traces 156a and 158a of the respective transmitting coil circuits 156 and 150 on the outer surface 54 of the substrate 50.

[0047] The substrate 50 of the conventional inductive position sensor shown in Figures 4A and 4B is such that the respective transmitting coil circuits 156 and 158, more specifically the respective transmitting coil circuit traces 156a and 158a on the respective opposing outer surfaces 52 and 54 of the substrate 50, are arranged in a region that overlaps, is back-to-back, or is in a region that is opposite to each other on the opposing surfaces 52 and 54 of the substrate 50, with the respective transmitting coil circuits 156 occupying the same region or range on the respective opposing surfaces 52 and 54 of the substrate 50, and the respective transmitting coil circuit traces 156a and 158 a is arranged on the opposing outer surfaces 52 and 54 of the substrate 50 in a region that overlaps with each other, or is back-to-back or facing each other. More specifically, the receiving coil circuit traces 160a and 162a on the opposing outer surfaces 52 and 54 of the substrate 50 are also arranged relative to the transmitting coil circuits 156 and 158 in a back-to-back or overlapping relationship, where the receiving coil circuits 60 and 62 occupy the same back-to-back and overlapping regions on the opposing substrate surfaces 52 and 54.

[0048] The overlapping relationship between the respective transmitting coil circuits 156 and 158 and the receiving coil circuits 160 and 162 results in coupling or an increase in the coupling coefficient between the respective transmitting coil circuits 156 and 158 and the receiving coil circuits 160 and 162. The coupling coefficient between the respective transmitting coil circuits 156 and 158 is proportional to the mutual inductance between the respective transmitting coil circuits 156 and 158, and the mutual inductance is proportional to the magnetic flux generated by the respective transmitting coil circuits 156 and 158. The positioning and arrangement of the respective transmitting coil circuits 156 and 158 and the respective receiving coil circuits 160 and 162 in the overlapping planar region relationship on the opposing surfaces 152 and 154 of the substrate 50 results in interaction and mixing between the respective magnetic fields generated by the respective transmitting coil circuits 156 and 158, resulting in an increase in coupling between the respective transmitting coil circuits 156 and 158 and the respective receiving coil circuits 160 and 162.

[0049] Therefore, in the event of a short circuit or open circuit in one of the two redundant transmitting circuits 156 or 158, the increased coupling between transmitting circuits 156 and 158 in the configurations of Figures 4A and 4B, where each transmitting circuit 156 and 158 and each receiving circuit 160 and 162 are arranged on the same or opposing surfaces 52 and 54 of the printed circuit board 50 in an overlapping relationship, each occupying the same or opposing area of ​​the board 50, results in interaction between the magnetic fields generated by each transmitting coil circuit, increasing the coupling between each transmitting circuit 156 and 158, and, unfavorably, increasing the possibility of malfunction of one of the non-short-circuited transmitting circuits 156 and 158.

[0050] The associated electrical circuits, components, and output integrated circuits 53 on the respective opposing surfaces 52 and 54 of the substrate 50 are electrically coupled to the respective transmitting coil and receiving coil circuit traces 156a, 158a, 160a, and 162a on the respective opposing surfaces 52 and 54 of the substrate 50.

[0051] Figures 5A and 5B show a simplified first embodiment of an inductive position sensor assembly according to the present invention, comprising on-axial dual-output inductive sensor transmit and receive coil circuits 256, 258, 260, and 262 defined and formed on the front and rear outer surfaces 52 and 54 of a substrate 50, as will be described in more detail below.

[0052] Although not shown in Figures 5A and 5B for the purpose of simplification, it is understood that the outer surfaces 52 and 54 of the substrate 50 include related electrical circuits, components, and output integrated circuits 53, as shown, for example, in Figures 3A and 3B.

[0053] As shown in Figure 5A, the first transmitting coil circuit 256, more specifically its first plurality of transmitting coil circuit traces 256a, surrounds the first receiving coil circuit 260, and more specifically, surrounds the first plurality of receiving coil circuit traces 260a of the first receiving coil circuit 260, extending in a semicircular pattern on the first substrate section 50a.

[0054] Furthermore, the second power transmission coil circuit 258, more specifically the second power transmission coil line 258a, surrounds the second power transmission coil line 262, and more specifically, in relation to the second power transmission coil trace 262a of the second power transmission coil line 262, it is extended in a semicircular pattern on the second power transmission coil section 50b, which is opposite to the first power transmission coil section 50a.

[0055] As shown in Figure 5B, the opposing outer surface 54 of the substrate 50 includes a plurality of transmit / receive coil circuits having patterns, structures, elements, and positions similar to those of the transmit / receive coil circuits 256, 258, 260, and 262 on the outer surface 52 of the substrate 50. Therefore, the above description relating to the patterns, structures, elements, and positions of the transmit / receive coil circuits 256, 258, 260, and 262 on the substrate surface 52, as shown in Figure 5A, is incorporated herein by reference as if it were fully described herein with respect to the patterns, structures, elements, and positions of the transmit / receive coil circuits 256, 258, 260, and 262 on the outer surface 54 of the substrate, as shown in Figure 5B.

[0056] Accordingly, the inductive position sensor of the present invention, as shown in Figures 5A and 5B, is characterized in that the respective transmitting coil circuits 256 and 258 and the associated first and second receiving coil circuits 260 and 262 enclosed by the first and second semicircular transmitting coil circuits 256 and 258 are arranged in opposite and distinct (or spaced apart) relationships on opposite and distinct sections or regions or regions or sections 50a and 50b of the substrate 50, defined and arranged on opposite sides of the central longitudinal axis L of the substrate 50.

[0057] More specifically, the inductive position sensor of the present invention, as shown in Figures 5A and 5B, is characterized in that each of the outer sides 52 and 54 of the substrate 50 includes first and second receiving coil circuits 260 and 262 defined and formed on a plurality of, more specifically, distinct first and second sections or regions 50a and 50b of the substrate 50 located on opposite sides of the longitudinal axis L of the substrate 50.

[0058] The transmitting coil circuit 256, combined with the respective receiver circuits 260 on opposing substrate surfaces 52 and 54, is electrically coupled to define and form a first of two redundant output inductive sensor circuits, while the transmitting coil circuit 258 and the respective receiving coil circuits 262 on opposing substrate surfaces 52 and 54 are electrically coupled to define and form a second of two redundant output inductive sensor circuits in on-axis dual-output sensor applications, in which the present invention is particularly suited, including dual-output pedal position applications.

[0059] Figures 6A and 6B show another embodiment of the inductive position sensor according to the present invention, in which an inductive position sensor substrate 50 according to the present invention is defined and formed on opposing outer surfaces 52 and 54 of the substrate 50, and includes inductive axis dual output sensor transmit coil circuits 356, 357, 358, 359, 360, 361, 362, and 363, more specifically an embodiment in which each of the outer surfaces 50 and 52 of the substrate 50 is defined and formed on a plurality, more specifically on a plurality of substrates 50, more specifically on four different sections or regions or quadrants 50a, 50b, 50c, and 50d, as will be described in more detail below, and includes four transmit and receive coil circuits 356, 357, 358, 359, 360, 361, 362, and 363.

[0060] The associated electrical circuits, components, and output integrated circuits 53 on the respective opposing surfaces 52 and 54 of the substrate 50 are electrically coupled to the respective transmitting coil and receiving coil circuit traces 356a, 357a, 358a, 359a, 360a, 361a, 362a, and 363a on the respective opposing surfaces 52 and 54 of the substrate 50.

[0061] In an embodiment as shown in Figure 6A, the outer surface 52 of the substrate 50 includes a first pair of substantially quarter-circular or pi-shaped transmitting coil circuits 356 and 357, each containing a plurality of transmitting coil circuit traces 356a and 357a, and a plurality of transmitting coil circuit traces 358a and 359a extending around the outer surface 52 of the housing 50, which are in an alternating relationship with each of the transmitting coil circuits 356, 357, 358 and 359, each at least partially surrounding those of the respective receiving coil circuits 360, 361, 362 and 364.

[0062] Specifically, in the embodiment shown in Figure 6A, the first pair of transmitting coil circuits 356 and 357 are positioned in an opposite relationship to each other, the second pair of transmitting coil circuits 358 and 359 are positioned in an opposite relationship to each other, transmitting coil circuit 358 is positioned between the first pair of transmitting coil circuits 356 and 357, and transmitting coil circuit 359 is positioned between the first pair of transmitting coil circuits 356 and 357.

[0063] Therefore, in the embodiment of Figure 6A, the respective substantially pi-shaped transmitting coil circuits 356, 357, 358, and 359 extend around the outer surface 52 of the substrate 50, in a relationship where they are positioned and seated on each of the distinct, different, non-overlapping planar sections or regions or quadrants 50a, 50b, 50c, and 50d of the substrate 50, more specifically, the transmitting coil circuit 356 is positioned and formed on substrate section 50a, the transmitting coil circuit 359 is positioned and formed on substrate section 50b, the transmitting coil circuit 357 is positioned and formed on substrate section 50c, and the transmitting coil circuit 358 is positioned and formed on substrate section 50d.

[0064] Furthermore, in the embodiment of Figure 6A, the outer surface 52 of the substrate 50 includes four respective plurality of receiving coil circuit traces 360a, 361a, 362a, and 363a, defined and formed and positioned on the outer surface 52 of the substrate 50, in a manner at least partially surrounded by each of the respective receiving coil circuits 360, 361, 362, and 363, and more specifically, in a manner at least partially surrounded by each of the respective transmitting coil circuits 356, 357, 358, and 359, and more specifically, in a manner at least partially surrounded by each of the respective transmitting coil circuit traces 356a, 357a, 358, and 359a of each of the respective transmitting coil circuits 356, 357, 358, and 359.

[0065] In the illustrated embodiment, two of the two substrate sections or quadrants 50a and 50d, and the respective transmit / receive coil circuits 356, 358, 360, and 362 defined and positioned thereon, are located on the first side of the longitudinal axis L of the substrate 50, while the other two substrate sections or quadrants 50b and 50c, and the other two of the respective transmit / receive coil circuits 357, 359, 361, and 363 defined and positioned thereon, are located on the second opposing side of the longitudinal axis L of the substrate 50, and are in direct opposition to the substrate sections 50a and 50d and the respective transmit / receive coil circuits 356, 358, 360, and 362.

[0066] As shown in Figure 6B, the opposing outer surfaces 54 of the substrate 50 are located on separate distinct sections or regions or quadrants 50a, 50b, 50c, and 50d of the substrate 50 and include a plurality of transmit / receive coil circuits 356, 357, 358, 359, 360, 361, 362, and 363 whose patterns, structures, elements, and positions are similar to those of the transmit / receive coil circuits 356, 357, 358, 359, 360, 361, 362, and 363 on the outer surface 52 of the substrate 50.

[0067] The above description with respect to Figure 6A relating to the patterns, structures, elements, and locations of the transmit / receive coil circuits 356, 357, 358, 359, 360, 361, 362, and 363 on the outer surface 52 of the substrate 50 is incorporated herein by reference as if it were fully described herein with respect to the patterns, structures, elements, and locations of the transmit / receive coil circuits 356, 357, 358, 359, 360, 361, 362, and 363 on the opposing outer surface 54 of the substrate 50, as shown in Figure 6B.

[0068] The inductive sensor coil circuit is shown in the figure. Figures 5A, 5B, 6A, and 6B, as well as those described above, are suitable for use in on-axis dual / redundant output applications.

[0069] In Figures 5A and 5B, the respective first transmitting coil circuits 256 and first receiving coil circuits 260 on the respective outer surfaces 52 and 54 of the substrate 50 are arranged in the same overlapping or opposing regions or in an overlapping, back-to-back or opposing relationship occupying the same region on the opposing surfaces 52 and 54 of the substrate 50, defining and forming the first inductive output sensor circuit of the inductive sensor of the present invention.

[0070] Furthermore, in Figures 5A and 5B, the respective second transmitting coil circuits 258 and second receiving coil circuits 262 on the respective outer surfaces 52 and 54 of the substrate 50 are arranged in an overlapping, back-to-back, or opposing relationship, occupying the same overlapping, opposing, or back-to-back region, area, section, or region of the opposing surfaces 52 and 54 of the substrate 50, thereby defining and forming a second redundant inductive output sensor circuit of the inductive sensor of the present invention.

[0071] According to the present invention, the transmitting coil circuit 256 and the receiving coil circuit 260 on opposing substrate surfaces 52 and 54 define the first inductive sensor circuit and the transmitting coil circuit 258 and the receiving coil circuit 262, which define the second inductive sensor circuit of the inductive position sensor of the present invention, and occupy different non-overlapping regions or areas on opposing surfaces 52 and 54 of the substrate 50, as shown in 5A and 5B, thereby reducing coupling between the respective first and second inductive sensor circuits of the inductive sensor of the present invention.

[0072] In Figures 6A and 6B, the respective first transmitting coil circuits 356 and 357, in combination with the respective receiving coil circuits 360 and 361 on the respective opposing surfaces 52 and 54 of the substrate 50, are positioned relative to each other in an overlapping or back-to-back relationship, occupying the same overlapping region, region, or quadrant of the opposing surfaces 52 and 54 of the substrate 50, and are electrically coupled to each other to form the first of the two inductive output sensor circuits of the inductive sensor of the present invention.

[0073] Furthermore, in Figures 6A and 6B, the respective second transmitting coil circuits 358 and 359, in combination with the respective receiving coil circuits 362 and 363 on the respective outer surfaces 52 and 54 of the substrate 50, are arranged in an overlapping, back-to-back, or opposing relationship with respect to each other, occupying the same overlapping or opposing region or region or quadrant or section of the opposing surfaces 52 and 54 of the substrate 50, and are defined and electrically coupled to each other to form a second of the redundant inductive output sensor circuits of the inductive position sensor according to the present invention.

[0074] According to the present invention, the respective first transmitting coil circuits 356 and 357, each having the respective receiving coil circuits 360 and 361 of the first redundant inductive output sensor circuit, are arranged on regions or quadrants of the opposing surfaces 52 and 54 of the substrate 50 that do not overlap with the regions or quadrants of the opposing surfaces 52 and 54 of the substrate 50 occupied by the respective second transmitting coil circuits 358 and 359 and the respective receiving coil circuits 362 and 363 of the second redundant inductive output sensor circuit, thereby reducing coupling between the respective transmitting coil circuits and receiving coil circuits of the respective first and second inductive output circuits.

[0075] Specifically, according to the present invention, unlike the prior art substrate designs shown in Figures 3A, 3B, 4A, and 4B, the position, arrangement, geometric shape, and / or design of each redundant first and second inductive sensor transmit and receive coil circuits of the inductive sensor of the present invention shown in Figures 5A, 5B, 6A, and 6B on separate, different, non-overlapping sections or regions or quadrants of the substrate 50 described in detail above, each having a receive coil circuit at least partially surrounded by its respective transmit coil circuit, advantageously creates separation between the traces of each transmit coil circuit and receive coil circuit, advantageously resulting in reduced interaction, mixing, or interference between the respective magnetic fields generated by the respective non-overlapping transmit coil circuits of each first and second inductive sensor circuit, and consequently resulting in reduced coupling / coupling coefficients between the respective transmit coil circuits of each first and second inductive sensor circuit.

[0076] Reducing the coupling between the respective transmitting coil circuits of the redundant first and second inductive sensor circuits of the inductive position sensor of the present invention reduces the possibility of interference with the function or effectiveness of the respective transmitting coil circuits of the respective redundant first and second inductive sensor circuits in the event of a short circuit in one of the redundant transmitting and receiving coil circuits. As a result, the risk of interference with the function or effectiveness of the redundant transmitting and receiving coil circuits that are not short-circuited is reduced.

[0077] Without departing from the spirit and scope of the novel features of the present invention, numerous variations and modifications can be made to the positioning, arrangement, geometric shape, and design of the inductive sensor coil circuit as described above. Of course, the appended claims are intended to encompass all such modifications that fall within the scope of the claims.

[0078] For example, no limitations are intended or should be assumed regarding the positioning, arrangement, geometric shape, and design of the inductive sensor coil circuit defined and formed on the substrate of the inductive position sensor, and it is understood that, for example, each transmitting coil circuit may include embodiments other than semicircular or pi-shaped. The following is the invention as originally described in the application. <Claim 1> Pedal housing and Rotatable pedals, An inductive position sensor, An inductive sensor target that can rotate in response to the rotation of the pedal, A substrate positioned on the opposite side of the inductive sensor target, A first inductive transmitting and receiving coil circuit defined on the substrate, A second inductive transmit and receive coil circuit, comprising the second inductive transmit and receive coil circuit defined and positioned on the substrate relative to the first inductive transmit and receive coil circuit to reduce the coupling coefficient between the first and second inductive transmit and receive coil circuits, The inductive position sensor and, Vehicle pedal assembly including. <Claim 2> The vehicle pedal according to claim 1, wherein the first and second inductive transmitting and receiving coil circuits are defined and positioned on different sections of the substrate in such a relationship that each receiving coil circuit of the first and second transmitting and receiving coil circuits is at least partially surrounded by each transmitting coil circuit of the first and second transmitting and receiving coil circuits, thereby reducing the coupling coefficient between the first and second transmitting and receiving coil circuits. <Claim 3> The vehicle pedal according to claim 2, wherein the substrate defines a longitudinal axis that separates the substrate into first and second sections on both sides of the longitudinal axis, the first inductive transmitting and receiving coil circuit is located on the first section of the substrate, and the second inductive transmitting and receiving coil circuit is located on the second section of the substrate. <Claim 4> The vehicle pedal according to claim 2, wherein the circuit board comprises first, second, third, and fourth sections, and the first and second transmitting and receiving coil circuits are arranged on separate parts of the first, second, third, and fourth sections of the circuit board. <Claim 5> The pedal housing and Rotatable pedals, An inductive position sensor, An inductive target that can rotate in response to the rotation of the pedal, A substrate positioned opposite the inductive target, Multiple inductive transmitting coil circuits defined on the substrate, The substrate is defined and includes a plurality of inductive receiving coil circuits, each at least partially surrounded by the plurality of inductive transmitting coil circuits to reduce the coupling coefficient between the plurality of inductive transmitting coil circuits, The inductive position sensor and, Vehicle pedal assembly including. <Claim 6> The vehicle pedal assembly according to claim 5, wherein the substrate defines a plurality of substrate sections, and the plurality of inductive transmitting coil circuits and the plurality of inductive receiving coil circuits are arranged on different of the plurality of substrate sections. <Claim 7> The vehicle pedal assembly according to claim 6, wherein the substrate defines a longitudinal axis and first and second sections located on both sides of the longitudinal axis, and a first of the plurality of inductive transmitting coil circuits and a first of the plurality of inductive receiving coil circuits at least partially enclosed by the first of the plurality of inductive transmitting coil circuits are located in the first section of the substrate, and a second of the plurality of inductive transmitting coil circuits and a second of the plurality of inductive receiving coil circuits at least partially enclosed by the second of the plurality of inductive transmitting coil circuits are located on the second section of the substrate. <Claim 8> The vehicle pedal assembly according to claim 6, wherein the substrate is at least partially surrounded by first, second, third, and fourth sections and the first, second, third, and fourth of the plurality of inductive transmitting coil circuits, and defines the first, second, third, and fourth of the plurality of inductive receiving coil circuits, respectively, which are arranged in the first, second, third, and fourth sections of the substrate. <Claim 9> circuit board and Multiple inductive transmitting coil circuits defined on the substrate, A plurality of inductive receiving circuits defined on the substrate and at least partially surrounded by the plurality of inductive transmitting circuits to reduce the coupling coefficient between the plurality of inductive transmitting coil circuits, An inductive position sensor having [a specific feature / feature]. <Claim 10> The inductive position sensor according to claim 9, wherein the substrate comprises a plurality of substrate sections, and each of the plurality of inductive receiving circuits, at least partially surrounded by the plurality of inductive transmitting coil circuits, is arranged on each of the plurality of substrate sections. <Claim 11> The inductive position sensor according to claim 10, wherein the substrate defines a longitudinal axis and first and second substrate sections on both sides of the longitudinal axis, and further comprises first and second inductive transmitting coil circuits and first and second inductive receiving coil circuits located in the first and second sections of the substrate on both sides of the longitudinal axis of the substrate, at least partially surrounded by the first and second inductive transmitting coil circuits. <Claim 12> The inductive position sensor according to claim 10, wherein the substrate defines at least first, second, third, and fourth substrate sections and further comprises first, second, third, and fourth transmitting coil circuits and first, second, third, and fourth inductive receiving coil circuits, each at least partially surrounded by the first, second, third, and fourth transmitting coil circuits and located on the first, second, third, and fourth substrate sections, respectively.

Claims

1. Pedal housing and Rotatable pedals, An inductive position sensor, An inductive target that can rotate in response to the rotation of the pedal, A substrate disposed adjacent to the inductive target, comprising a first substrate section and a second substrate section located on opposite sides of the longitudinal axis of the substrate, wherein the first substrate section and the second substrate section are located in non-overlapping sections of the substrate on the same surface of the substrate, First and second inductive transmitting coil circuits defined and located on the first and second substrate sections, respectively, Each includes first and second inductive receiving coil circuits defined and located on the first and second substrate sections, To reduce the coupling coefficient between the first and second inductive transmitting coil circuits, the inductive position sensor is configured such that the first inductive receiving coil circuit is located in the first substrate section and is at least partially surrounded by the first inductive transmitting coil circuit located in the first substrate section, and the second inductive receiving coil circuit is located in the second substrate section and is at least partially surrounded by the second inductive transmitting coil circuit located in the second substrate section. Includes, The first inductive transmitting coil circuit includes a plurality of transmitting coil circuit traces extending within a semicircular or quarter-circular pattern on the first substrate section of the vehicle pedal assembly.

2. The vehicle pedal assembly according to claim 1, wherein the first inductive transmitting coil circuit surrounds the first receiving coil circuit.

3. The vehicle pedal assembly according to claim 1, wherein the first inductive receiving coil circuit includes a plurality of first receiving coil circuit traces, and the first inductive transmitting coil circuit surrounds the plurality of first receiving coil circuit traces.

4. The vehicle pedal assembly according to claim 1, wherein the substrate includes an output integrated circuit.

5. The pedal housing and Rotatable pedals, An inductive position sensor, An inductive target that can rotate in response to the rotation of the pedal, A substrate disposed adjacent to the inductive target, wherein the substrate includes a first substrate section and a second substrate section on opposite sides of the longitudinal axis of the substrate, the first substrate section and the second substrate section located in non-overlapping sections of the substrate on a first surface of the substrate, and the substrate includes a third substrate section and a fourth substrate section on a second opposing surface of the substrate, the third substrate section and the fourth substrate section located in non-overlapping sections of the substrate on opposite sides of the longitudinal axis on the second opposing surface of the substrate, The first, second, third, and fourth inductive transmitting coil circuits are located on the first, second, third, and fourth substrate sections, respectively. Each includes first, second, third, and fourth inductive receiving coil circuits located on the first, second, third, and fourth substrate sections, The inductive position sensor and, Includes, The first, second, third, and fourth inductive receiving coil circuits are at least partially surrounded by the first, second, third, and fourth inductive transmitting coil circuits, each located in the first, second, third, and fourth substrate sections, respectively, in a vehicle pedal assembly.

6. The vehicle pedal assembly according to claim 5, wherein the first, second, third, and fourth inductive transmitting coil circuits are quarter-circular or pi-shaped transmitting coil circuits.

7. The vehicle pedal assembly according to claim 5, wherein each of the first, second, third, and fourth inductive transmitting coil circuits includes a plurality of inductive transmitting coil circuit traces.

8. The vehicle pedal assembly according to claim 5, wherein the first inductive transmitting coil circuit includes a plurality of transmitting coil circuit traces extending within a semicircular or quarter-circular pattern on the first substrate section.

9. The vehicle pedal assembly according to claim 5, wherein the first inductive transmitting coil circuit surrounds the first receiving coil circuit.

10. The vehicle pedal assembly according to claim 5, wherein the first receiving coil circuit includes a plurality of first receiving coil circuit traces, and the first inductive transmitting coil circuit surrounds the plurality of first receiving coil circuit traces.

11. The vehicle pedal assembly according to claim 5, wherein the substrate includes an output integrated circuit.

12. A substrate defining at least first, second, third, and fourth substrate sections, wherein the first and second substrate sections are located on a first surface opposite the longitudinal axis of the substrate, the third and fourth substrate sections are located on a second opposing surface of the substrate, and the third and fourth substrate sections are located on the second opposing surface of the substrate in non-overlapping sections of the substrate opposite the longitudinal axis, The first, second, third, and fourth inductive transmitting coil circuits are located on the first, second, third, and fourth substrate sections, respectively. The first, second, third, and fourth inductive receiving coil circuits are located on the first, second, third, and fourth substrate sections, respectively. It has, An inductive position sensor circuit board, wherein the first, second, third, and fourth inductive receiving coil circuits are located in the first, second, third, and fourth substrate sections, respectively, and are at least partially surrounded by the first, second, third, and fourth inductive transmitting coil circuits, respectively, to reduce the coupling coefficient between the first, second, third, and fourth inductive transmitting coil circuits.

13. The inductive position sensor circuit board according to claim 12, wherein the first, second, third, and fourth inductive transmitting coil circuits are quarter-circular or pi-shaped transmitting coil circuits.

14. The inductive position sensor circuit board according to claim 12, wherein each of the first, second, third, and fourth inductive transmitting coil circuits includes a plurality of inductive transmitting coil circuit traces.

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