Indication device

Abstract

To provide a display device preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area.SOLUTION: A display device according to an embodiment of the present disclosure comprises: a substrate including a display area, an open area positioned in the display area, and an intermediate area positioned between the display area and the open area; and a capping layer disposed in the intermediate area and extending in a closed loop surrounding the open area. The capping layer contains a metal material and is connected to the ground or to a power source having a given voltage.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] This specification relates to a display device including an aperture region within a display area.

Background Art

[0002] Display devices are configured in a very wide variety of forms, such as televisions, monitors, smartphones, tablet PCs, notebook computers, wearable devices, and the like.

[0003] A display device can realize an image by a large number of pixels included in a display area.

[0004] With the development of technology, in addition to the function of realizing an image, a display device can also provide a function of photographing or a sensing function using various optical sensors.

[0005] In order to configure such functions, a display device may include various optical devices such as a camera or a detection sensor.

[0006] A display device includes a bezel region outside the display area, and a camera, a detection sensor, and the like may be arranged in the bezel region.

Summary of the Invention

Problems to be Solved by the Invention

[0007] On the other hand, as the demand from users for a bezel-less or bezel-free display device that can reduce the bezel region to the maximum and increase the display area to the maximum increases, it may become difficult to arrange a camera, a detection sensor, and the like in the bezel region.

[0008] As a result, various technologies for arranging a camera, a detection sensor, and the like inside the display area of a display device have been devised.

[0009] A technology has been devised in which a hole-like opening area is located within the display area, allowing for the placement of a camera and detection sensors. This technology may be referred to as Hole-in Display (HID) or Hole-in Active Area (HiAA).

[0010] In the case of an aperture region formed within the display area, various insulating layers, light-emitting layers, and even the substrate of the display panel can be removed to prevent interference between the camera and detection sensors located in the aperture region.

[0011] To form an aperture region, one method for removing the substrate of the display panel is typically to perform a fine cutting process using a laser.

[0012] Thus, when a fine cutting process is performed using a laser, a large amount of energy accumulates locally in the substrate due to the localized thermal energy received from the laser, which can cause cracks to form in the substrate.

[0013] Cracks that occur at the cut edges of the substrate can spread to surrounding areas due to stress generated by subsequent processes.

[0014] For example, a crack that occurs at the cut end of the substrate may spread inward into the display area, and the crack may propagate more effectively through the light-emitting layer and insulating layer located near the opening area.

[0015] Thus, cracks that occur at the cut portion of the substrate in the open area can serve as a kind of water penetration pathway.

[0016] Light-emitting elements located in the display area and containing organic materials are particularly susceptible to moisture. If moisture penetrates the light-emitting element, it can lead to malfunction.

[0017] To prevent moisture penetration due to cracks that occur in this way, a crack propagation prevention structure can be placed between the display area and the opening area to prevent cracks that occur at the cut portion of the opening area from propagating.

[0018] For example, a light-emitting layer placed on a crack propagation prevention structure is formed discontinuously by the stepped structure created by the crack propagation prevention structure, thereby blocking the path through which cracks propagate.

[0019] However, the stepped structure formed by the crack transmission prevention structure can cause seam-like defects in the thin inorganic insulating layer at the boundary between the crack transmission prevention structures.

[0020] If a defect such as a seam occurs in the inorganic insulating layer, the inorganic insulating layer in the area where the seam occurs may not adequately cover the underlying structure, potentially resulting in discontinuity.

[0021] The resulting defects in the inorganic insulating layer can act as upper moisture permeability pathways.

[0022] On the other hand, static electricity can be generated when a laser is used for a fine cutting process.

[0023] The static electricity generated in this way can damage the circuitry within the display panel by either opening up electrodes within the panel or short-circuiting adjacent electrodes.

[0024] The inventors of this specification have, through various experiments, invented a display device that, when forming an opening within a display area, can prevent moisture permeation near the opening and form an electrostatic discharge path.

[0025] The problem to be solved by the embodiments of this specification is to provide a display device that can prevent moisture permeation through the upper part of the insulating layer near the opening area within the display area.

[0026] Another problem to be solved by the embodiments of the present specification is to provide a display device that provides a structure resistant to cracks occurring near the aperture region within the display region.

[0027] Another problem to be solved by the embodiments of the present specification is to provide a display device capable of blocking the propagation of cracks through an insulating layer near the aperture region within the display region.

[0028] Another problem to be solved by the embodiments of the present specification is to provide a display device that provides a path for discharging static electricity to the outside near the aperture region within the display region.

[0029] Another problem to be solved by the embodiments of the present specification is to provide a touch display device capable of reducing the occurrence of touch noise.

[0030] The problems to be solved by the embodiments of the present specification are not limited to the problems mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0031] A display device according to an embodiment of the present specification includes a substrate including a display region, an aperture region located within the display region, and an intermediate region located between the display region and the aperture region, and a capping layer disposed in the intermediate region and arranged to surround the aperture region in a closed loop shape and including a metallic substance, wherein the capping layer is connected to a ground or a power supply having a predetermined voltage.

[0032] Furthermore, the display device according to the embodiment of this specification includes a substrate including a display area, an opening area located within the display area, and an intermediate area located between the display area and the opening area; one or more shielding portions disposed in the intermediate area; one or more insulating layers disposed to cover the one or more shielding portions; and a capping layer containing a metallic material, which covers at least one or more shielding portions and is disposed in the intermediate area so as to surround the opening area, wherein the capping layer is connected to ground or to a power supply having a predetermined voltage. [Effects of the Invention]

[0033] According to the embodiments of this specification, moisture can be prevented from passing through the upper part of the insulating layer near the opening region by placing a capping layer containing a metallic material in an intermediate region between the display region and the opening region, surrounding the opening region.

[0034] According to embodiments of this specification, by placing a capping layer containing a metallic material in an intermediate region between the display area and the opening area, the capping layer can reduce the propagation of cracks through the insulating layer, thus providing a crack-resistant structure.

[0035] Furthermore, according to the embodiments of this specification, the insulating layer can be blocked by using a structure in which an intermediate region between the display area and the opening area surrounds the opening area, and a capping layer containing a metallic material is connected to power connection wiring located below via power connection electrodes, thereby preventing cracks from propagating through the insulating layer.

[0036] Furthermore, according to the embodiments of this specification, by surrounding the aperture region in an intermediate region between the display region and the aperture region, and connecting the capping layer containing a metallic material to ground, or by supplying a power supply with a constant voltage, static electricity generated during the cutting process to form the aperture region can be discharged to the outside, thereby reducing the occurrence of pixel defects.

[0037] In this way, the occurrence of pixel defects can be reduced, thereby improving the lifespan of the display device, and by configuring a low-power display device, power consumption can be reduced.

[0038] Furthermore, according to the embodiments of this specification, by enclosing the aperture region in an intermediate region between the display region and the aperture region, and connecting the capping layer containing a metallic material to ground or supplying a power supply with a constant voltage, the voltage of the capping layer can be kept constant and not fluctuate, thereby reducing the occurrence of touch noise in the touch display device.

[0039] The effects described above, as well as the specific effects of the present invention, will be explained and described below in conjunction with the descriptions of embodiments for carrying out the invention. [Brief explanation of the drawing]

[0040] [Figure 1] This is a schematic plan view of a display device according to an embodiment of this specification. [Figure 2] This is a schematic plan view of a display device including anti-static wiring and crack detection wiring according to embodiments of this specification. [Figure 3] This is a cross-sectional view relating to one subpixel of a display device according to an embodiment of this specification. [Figure 4] This is an enlarged plan view of the opening area within the display area. [Figure 5] This is a cross-sectional view of the A-A' region in Figure 4. [Figure 6] This is a cross-sectional view of the B-B' region in Figure 4. [Figure 7] This is a cross-sectional view of the B-B' region in Figure 4. [Figure 8] This is a circuit diagram of the vicinity of the aperture region of a display device according to one embodiment of this specification. [Figure 9] This is a plan view of the vicinity of the aperture region of a display device according to one embodiment of this specification. [Figure 10] This is a cross-sectional view of the vicinity of the aperture region of a display device according to one embodiment of this specification. [Figure 11] This is a circuit diagram of the vicinity of the aperture region of a display device according to another embodiment of this specification. [Figure 12] This is a plan view of the vicinity of the aperture region of a display device according to another embodiment of this specification. [Figure 13] This is a cross-sectional view near the aperture region of a display device according to another embodiment of this specification. [Figure 14] This is a circuit diagram of the vicinity of the aperture region of a display device according to one embodiment of this specification. [Figure 15] This is a plan view of the vicinity of the aperture region of a display device according to one embodiment of this specification. [Figure 16] This is a cross-sectional view of the vicinity of the aperture region of a display device according to one embodiment of this specification. [Modes for carrying out the invention]

[0041] The advantages and features of this specification, and the methods for achieving them, will become clear with reference to the embodiments described below in detail, along with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below, but can be configured in a variety of different forms. These embodiments are provided to complete the disclosure of this specification and to fully inform those who are ordinary skill in the art to which this specification belongs of the scope of the invention, and this specification is defined only by the scope of the claims.

[0042] The shapes, sizes, proportions, angles, and quantities disclosed in the drawings for the purpose of illustrating embodiments of this specification are illustrative, and this specification is not limited to those depicted. The same reference numerals throughout the specification refer to the same components. In addition, if a specific description of related known technology is deemed to obscure the gist of this specification, such description will be omitted. Where "includes," "has," "becomes," etc., as used in this specification, other parts may be added unless "only" is used. When a component is expressed singularly, it includes cases where it includes multiple components unless otherwise explicitly stated.

[0043] When interpreting the constituent elements, even if not explicitly stated elsewhere, they shall be interpreted as including a margin of error.

[0044] When describing the positional relationship between two parts, for example, using phrases like "on top of," "above," "below," or "to the side," it is acceptable for one or more other parts to be located between the two parts, unless "immediately" or "directly" is used.

[0045] When describing temporal relationships, for example, when describing the sequence of events using phrases like "after," "following," "next," or "before," it may include cases that are not consecutive, unless "immediately" or "directly" is used.

[0046] The terms "first," "second," etc., are used to describe various components, but these components are not limited by these terms. These terms are simply used to distinguish one component from another. Therefore, the first component referred to below may also be the second component within the technical concept of this specification.

[0047] The features of the various embodiments described herein can be combined or linked together, either partially or entirely, and are technically capable of various interlocking and driving mechanisms. Each embodiment can be implemented independently of the others or in conjunction with them.

[0048] In the following, a display device according to one embodiment of this specification will be described in detail with reference to Figures 1 to 3.

[0049] Figure 1 is a schematic plan view of a display device according to an embodiment of this specification.

[0050] The display device 1 described below is an Organic Light Emitting Diodes Display Device, but is not limited to this.

[0051] The display device 1 may include a substrate 10 that includes a display area (AA) and a non-display area (NA) surrounding the display area (AA).

[0052] The display area (AA) on the substrate 10 may include a plurality of data lines (DL) extending in a first direction and a plurality of gate lines (GL) extending in a second direction intersecting the first direction.

[0053] The regions separated by the intersection of data lines (DL) and gate lines (GL) can each be defined as one sub-pixel (SP1, SP2, SP3).

[0054] Each subpixel (SP1, SP2, SP3) can be configured to emit light of the same color, such as white (W) light, or it can be configured to emit light of different colors, such as red (R), green (G), or blue (B) light.

[0055] A single pixel (P) may be composed of a combination of multiple subpixels (SP1, SP2, SP3) as described above.

[0056] Multiple subpixels (SP1, SP2, SP3) may be arranged in a matrix with multiple rows and columns.

[0057] In this specification, the first direction may be defined as the direction of a column, specifically the Y-axis direction, and the second direction may be defined as the direction of a row, specifically the X-axis direction.

[0058] The non-display area (NA) on the substrate 10 may contain numerous wires and pads that supply various signals and power to the inside of the pixels.

[0059] A data drive circuit (D-IC) 20 may be located on one side of the non-display area (NA).

[0060] The data driving circuit 20 can apply a data signal to the data wiring (DL) and apply a driving voltage such as a high potential voltage (VDD) or a low potential voltage (VSS) to the pixels (P).

[0061] Power supply wiring 30 may be arranged along the edge of the display area (AA), excluding one side of the non-display area (NA) where the data drive circuit 20 is located.

[0062] For example, a gate drive unit 40 that applies a gate signal to the gate wiring (GL) may be arranged in the non-display areas (NA) located on both sides of the display area (AA), and a power supply wiring 30 that can apply a voltage to the anode electrode or cathode electrode in the pixel (P) may be arranged along the outer casing of the gate drive unit 40.

[0063] A gate drive unit 40 formed on the substrate 10 using a gate-in-panel (GIP) method can be referred to as a GIP drive unit.

[0064] The power supply wiring 30 may be low-voltage wiring that can apply a low potential voltage (VSS) to the cathode electrode of the pixel (P), but is not limited to this, and high-voltage wiring that can apply a high potential voltage (VDD) to the thin-film transistor of the pixel (P) may also be provided.

[0065] The display area (AA) may include multiple power connection wires 31 that electrically connect power supply wiring 30 to multiple sub-pixels (SP1, SP2, SP3) so as to apply a low potential voltage (VSS) to multiple sub-pixels (SP1, SP2, SP3).

[0066] For example, multiple power connection wires 31 may extend identically in the first direction over which multiple data wires (DLs) extend.

[0067] Referring to Figure 2, one or more optical regions (OA1, OA2) may be formed within the display region (AA).

[0068] For example, the display area (AA) may include a first area (A1) containing a first optical area (OA1) and a second area (A2) containing a second optical area (OA2).

[0069] The first optical region (OA1) and the second optical region (OA2) may be located in the upper region of the display region (AA).

[0070] The first optical region (OA1) and the second optical region (OA2) may be formed to have various patterns, such as circles, ellipses, squares, hexagons, or octagons.

[0071] A first optical electronic device may be placed in the first optical region (OA1), and a second optical electronic device may be placed in the second optical region (OA2).

[0072] For example, the first optical electronic device may be a camera, and the second optical electronic device may be a detection sensor such as a proximity sensor, illuminance sensor, or infrared sensor.

[0073] The first optical region (OA1) may also be called the camera opening, and the second optical region (OA2) may also be called the sensor opening.

[0074] A flexible circuit board 50 and a printed circuit board 51 may be arranged in the lower region of the substrate 10.

[0075] One side of the flexible circuit board 50 may be connected to the board 10, and the other side of the flexible circuit board 50 may be connected to the printed circuit board 51.

[0076] The flexible circuit board 50 may be a chip-on-film (COF) or a flexible printed circuit board (FPC).

[0077] A data drive unit 20 that supplies data signals to cause pixels to emit light may be arranged on the flexible circuit board 50.

[0078] The printed circuit board 51 may include various components that can supply various signals to the data drive unit 20 and the gate drive unit 40, such as high potential voltage, low potential voltage, scan signals, data signals, or touch detection signals.

[0079] Crack detection wiring 60 may be arranged on the substrate 10.

[0080] The crack detection wiring 60 may be formed in a manner that surrounds the outer edge of the display area (AA) of the substrate 10, and extends through the non-display area (NA).

[0081] The crack detection wiring 60 passing through the upper region of the substrate 10 may be formed in a manner that passes through the periphery of the first optical region (OA1) and the second optical region (OA2), and substantially surrounds the first optical region (OA1) and the second optical region (OA2).

[0082] The first region (A1) is a region including the first optical region (OA1), the peripheral area of ​​the first optical region (OA1), and the crack detection wiring 60 surrounding them, and the second region (A2) may be a region including the second optical region (OA2), the peripheral area of ​​the second optical region (OA2), and the crack detection wiring 60 surrounding them.

[0083] The crack detection wiring 60 may consist of a single wire, but is not limited to that, and may consist of multiple wires.

[0084] The crack detection wiring 60 passing through the lower region of the substrate 10 may be connected to the crack detection pad portion 61.

[0085] The crack detection pad portion 61 may be placed on the substrate 10, but is not limited to that, and may also be placed on the flexible circuit board 50.

[0086] The crack detection wiring 60 connected to the crack detection pad section 61 may be formed to form a closed loop overall.

[0087] As mentioned above, the crack detection wiring 60 can be positioned to extend to the periphery of the first optical region (OA1) and the second optical region (OA2), thereby allowing confirmation of whether or not cracks occur in the first optical region (OA1) and the second optical region (OA2).

[0088] The method for checking whether or not a crack occurs via the crack detection wiring 60 is as follows:

[0089] When performing an auto-probe (AP) test for the final inspection of the display panel of the display device 1, a certain level of power can be applied to the crack detection pad section 61, and the input value and output value can be compared.

[0090] In this process, the degree of resistance of the crack detection wiring 60 can be determined from the difference between the measured input value and the output value, and based on this, it is possible to confirm whether or not the crack detection wiring 60 is broken.

[0091] For example, if a crack occurs near the first optical region (OA1), part or all of the crack detection wiring 60 may break.

[0092] If a portion of the crack detection wiring 60 breaks, the resistance will gradually increase, potentially weakening the output power. If the wire breaks completely, the output power can converge to zero. These characteristics related to electrical resistance allow for confirmation of whether or not a crack has occurred in the display panel.

[0093] The crack detection pad section 61 can be connected to ground (GND), thereby allowing the crack detection wiring 60 connected to the crack detection pad section 61, as well as other wiring connected to the crack detection wiring 60, to be connected to ground (GND) and grounded.

[0094] Furthermore, anti-static wiring 70 may be placed on the substrate 10.

[0095] The anti-static wiring 70 can be referred to as ESD (Electrostatic Discharge) wiring.

[0096] The anti-static wiring 70 may be formed to surround the outer edge of the display area (AA) of the substrate 10 and extend through the non-display area (NA).

[0097] For example, the anti-static wiring 70 may be located inside the crack detection wiring 60, but is not limited to this.

[0098] The anti-static wiring 70 passing through the upper region of the substrate 10 may be formed to pass through the peripheral areas of the first optical region (OA1) and the second optical region (OA2).

[0099] For example, the anti-static wiring 70 may be formed extending adjacent to the upper regions of the first optical region (OA1) and the second optical region (OA2), but is not limited thereto.

[0100] The anti-static wiring 70 passing through the lower region of the substrate 10 may be connected to the anti-static pad portion 71.

[0101] The anti-static pad portion 71 may be placed on the substrate 10, but is not limited to that, and may also be placed on the flexible circuit board 50.

[0102] The anti-static wiring 70 connected to the anti-static pad portion 71 may be formed to form a closed loop overall.

[0103] The anti-static pad portion 71 can be connected to ground (GND), thereby allowing the anti-static wiring 70 connected to the anti-static pad portion 71, and other wiring connected to the anti-static wiring 70, to also be connected to ground (GND) and grounded.

[0104] Therefore, the anti-static wiring 70 may have the function of discharging static electricity generated in the display panel to the outside.

[0105] Referring to Figure 3, the subpixels within the display area (AA) according to the embodiments of this specification will be described in detail.

[0106] The substrate 10 can be made of glass or a plastic such as polyimide.

[0107] A first thin-film transistor, a storage capacitor, and a second thin-film transistor may be arranged on the substrate 10.

[0108] A first light-blocking layer (BSM1) may be placed on the substrate 10.

[0109] The first light-blocking layer (BSM1) can block light incident from the outside and protect the first active layer (ACT1) of the first thin-film transistor.

[0110] Therefore, the first light-blocking layer (BSM1) may be arranged to overlap the first active layer (ACT1) of the first thin-film transistor in the vertical direction.

[0111] The vertical direction in Figure 3 can be interpreted as the Z-axis direction.

[0112] A buffer layer (BUF) may be placed on the first light-blocking layer (BSM1).

[0113] The buffer layer (BUF) may consist of one or more layers of inorganic insulating layers, but is not limited to this.

[0114] For example, the inorganic insulating layer described herein may contain silicon oxide (SiOx) or silicon nitride (SiNx).

[0115] The buffer layer (BUF) can also be called the lower buffer layer.

[0116] The first active layer (ACT1) may be placed on top of the buffer layer (BUF).

[0117] The first active layer (ACT1) may, but is not limited to, an oxide semiconductor material.

[0118] A first gate insulating layer (GI1) may be placed on the first active layer (ACT1).

[0119] The first gate insulating layer (GI1) may consist of one or more layers of inorganic insulating layers, but is not limited thereto.

[0120] A first gate electrode (GAT1) may be placed on the first gate insulating layer (GI1).

[0121] The first gate electrode (GAT1) may be arranged so as to overlap the first active layer (ACT1) in the vertical direction.

[0122] Furthermore, a first capacitor electrode (Cst1) may be placed on the first gate insulating layer (GI1).

[0123] The first gate electrode (GAT1) and the first capacitor electrode (Cst1) may be formed in the same layer and of the same material.

[0124] A first interlayer insulating layer (ILD1) may be placed on the first gate electrode (GAT1) and the first capacitor electrode (Cst1).

[0125] The first interlayer insulating layer (ILD1) may consist of one or more layers of inorganic insulating layers, but is not limited thereto.

[0126] A second capacitor electrode (Cst2) may be placed on the first interlayer insulating layer (ILD1).

[0127] The second capacitor electrode (Cst2) may be arranged so as to overlap the first capacitor electrode (Cst1) in the vertical direction, and a storage capacitor may be formed by the second capacitor electrode (Cst2) and the first capacitor electrode (Cst1).

[0128] Furthermore, a second light-blocking layer (BSM2) may be placed on the first interlayer insulating layer (ILD1).

[0129] The second light-blocking layer (BSM2) can block incoming light from the outside and protect the second active layer (ACT2) of the second thin-film transistor.

[0130] Therefore, the second light-blocking layer (BSM2) may be arranged to overlap the second active layer (ACT2) of the second thin-film transistor in the vertical direction.

[0131] A second interlayer insulating layer (ILD2) may be placed on the second capacitor electrode (Cst2) and the second light-blocking layer (BSM2).

[0132] A second active layer (ACT2) may be placed on the second interlayer insulating layer (ILD2).

[0133] The second active layer (ACT2) may, but is not limited to, an oxide semiconductor material.

[0134] A second gate insulating layer (GI2) may be placed on the second active layer (ACT2).

[0135] The second gate insulating layer (GI2) may consist of one or more layers of inorganic insulating layers, but is not limited thereto.

[0136] A second gate electrode (GAT2) may be placed on the second gate insulating layer (GI2).

[0137] The second gate electrode (GAT2) may be arranged so as to overlap the second active layer (ACT2) in the vertical direction.

[0138] A third interlayer insulating layer (ILD3) may be placed on the second gate electrode (GAT2).

[0139] The third interlayer insulating layer (ILD3) may consist of one or more layers of inorganic insulating layers, but is not limited to this.

[0140] The third interlayer insulating layer (ILD3) can also be called the upper buffer layer.

[0141] A pair of first source-drain electrodes (SD1) and a pair of second source-drain electrodes (SD2) may be arranged on the third interlayer insulating layer (ILD3).

[0142] A pair of first source-drain electrodes (SD1) may be connected to one side and the other side of the first active layer (ACT1) via contact holes penetrating the third interlayer insulating layer (ILD3), the second gate insulating layer (GI2), the second interlayer insulating layer (ILD2), the first interlayer insulating layer (ILD1), and the first gate insulating layer (GI1).

[0143] A first thin-film transistor may be formed by the first active layer (ACT1), the first gate electrode (GAT1), and the pair of first source-drain electrodes (SD1) thus formed.

[0144] A pair of second source-drain electrodes (SD2) may be connected to one side and the other side of the second active layer (ACT2) via contact holes that penetrate the third interlayer insulating layer (ILD3) and the second gate insulating layer (GI2), respectively.

[0145] A second thin-film transistor may be formed by the second active layer (ACT2), the second gate electrode (GAT2), and a pair of second source-drain electrodes (SD2) thus formed.

[0146] One of the second source-drain electrodes (SD2) can be electrically connected to the second capacitor electrode (Cst2).

[0147] For example, one of the second source-drain electrodes (SD2) can be electrically connected to the second capacitor electrode (Cst2) via a contact hole that penetrates the third interlayer insulating layer (ILD3), the second gate insulating layer (GI2), and the second interlayer insulating layer (ILD2).

[0148] A first planarization layer (PLN1) may be placed on a pair of first source-drain electrodes (SD1) and a pair of second source-drain electrodes (SD2).

[0149] The first planarization layer (PLN1) can flatten the step created by the lower circuit elements, including thin-film transistors.

[0150] The first planarization layer (PLN1) may contain, but is not limited to, an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0151] A third source-drain electrode (SD3) may be placed on the first planarization layer (PLN1).

[0152] The third source-drain electrode (SD3) can function as a connecting electrode that connects the second source-drain electrode (SD2) and the anode electrode (AND).

[0153] The third source-drain electrode (SD3) may be connected to the second source-drain electrode (SD2) via a contact hole that penetrates the first planarization layer (PLN1).

[0154] A second planarization layer (PLN2) may be placed on the third source-drain electrode (SD3).

[0155] The second planarization layer (PLN2) may contain, but is not limited to, an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0156] An anode electrode (AND) may be placed on the second planarization layer (PLN2).

[0157] The anode electrode (AND) may be connected to the third source-drain electrode (SD3) via a contact hole that penetrates the second planarization layer (PLN2).

[0158] A bank (BNK) may be placed on the anode electrode (AND).

[0159] The bank (BNK) may be formed to cover the edge of the anode electrode (AND).

[0160] The bank (BNK) functions to separate each subpixel (SP1, SP2, SP3) and prevents the mixing of light of other colors between adjacent subpixels (SP1, SP2, SP3).

[0161] The bank (BNK) may contain, but is not limited to, organic insulating materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0162] A light-emitting layer (EL) may be placed on the anode electrode (AND).

[0163] The light-emitting layer (EL) may contain organic materials that emit different colors in each of its subpixels (SP1, SP2, SP3).

[0164] For example, the light-emitting layer (EL) can emit light in one of the following colors: red, green, blue, and white.

[0165] Furthermore, the light-emitting layer (EL) is made of an organic material that emits white light, and by further placing color filters of different hues on top of the light-emitting layer (EL), it is also possible to represent red, green, or blue.

[0166] The light-emitting layer (EL) may be an organic light-emitting layer consisting of a stack structure including a hole transport layer, a light-emitting material layer, an electron transport layer, a hole blocking layer, a hole injection layer, an electron blocking layer, and an electron injection layer.

[0167] The light-emitting layer (EL) may be formed to cover the anode electrode (AND) while also covering a portion of the side and top surfaces of the bank (BNK).

[0168] Furthermore, the light-emitting layer (EL) can be formed over the entire surface of the display area (AA) so as to cover the exposed surfaces of the anode electrode (AND) and the bank (BNK).

[0169] The light-emitting layer (EL) may include a display area (AA) and extend to the interface of the aperture area (OA).

[0170] A spacer (SPC) may be placed between the bank (BNK) and the light-emitting layer (EL).

[0171] The spacer (SPC) may be formed to contain the same material as the bank (BNK).

[0172] The spacer (SPC) can also serve to prevent the light-emitting layer (EL) from being subjected to external impacts and to provide a separation space so that the substrate 10 does not come into direct contact with the deposition screen mask during the process of depositing the light-emitting layer (EL).

[0173] A cathode electrode (CAT) may be placed on the light-emitting layer (EL).

[0174] The cathode electrode (CAT) can be formed to cover the light-emitting layer (EL).

[0175] The cathode electrode (CAT) may be formed to extend over multiple pixels (P).

[0176] The region where the anode electrode (AND), light-emitting layer (EL), and cathode electrode (CAT) are superimposed in this manner can function as an organic electroluminescent (OLED) light-emitting element.

[0177] Figure 3 shows the anode electrode (AND) located at the bottom and the cathode electrode (CAT) at the top, but it is not limited to this arrangement; the cathode electrode (CAT) may be located at the bottom and the anode electrode (AND) at the top.

[0178] A first passivation layer (PAS1) may be placed on the cathode electrode (CAT).

[0179] The first passivation layer (PAS1) may consist of one or more layers of inorganic insulating layers, but is not limited thereto.

[0180] The first passivation layer (PAS1) can protect the light-emitting element from external oxygen or moisture.

[0181] A sealing layer (PCL) may be formed on the first passivation layer (PAS1).

[0182] The sealing layer (PCL) may cover the first passivation layer (PAS1) and have sufficient thickness to have a flat surface.

[0183] The sealing layer (PCL) can prevent foreign matter from penetrating the light-emitting element.

[0184] The sealing layer (PCL) may contain an organic insulating material.

[0185] For example, the sealing layer (PCL) may contain, but is not limited to, an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0186] A second passivation layer (PAS2) may be placed on the sealing layer (PCL).

[0187] The second passivation layer (PAS2) may consist of one or more layers of inorganic insulating layers, but is not limited to this.

[0188] The second passivation layer (PAS2) can protect the light-emitting element from external oxygen or moisture.

[0189] The first passivation layer (PAS1), the encapsulation layer (PCL), and the second passivation layer (PAS2) can, in a broad sense, be considered encapsulation layers.

[0190] A touch panel may also be placed on the display panel as described above.

[0191] For example, a touch buffer layer (T-BUF) may be placed on the second passivation layer (PAS2).

[0192] For example, the touch buffer layer (T-BUF) may consist of one or more layers of inorganic insulating layers, but is not limited to this.

[0193] A touch sensor (TS) may be placed on the touch buffer layer (T-BUF).

[0194] The touch sensor (TS) may include a touch sensor metal (TSM) and a bridge metal (BRG) located in different layers from each other.

[0195] The touch sensor (TS) can be referred to as the touch electrode layer (TS), and the touch sensor metal (TSM) and bridge metal (BRG) can be referred to as the second touch electrode (TSM) and the first touch electrode (BRG), respectively.

[0196] A touch interlayer insulating layer (T-ILD) may be placed between the touch sensor metal (TSM) and the bridge metal (BRG).

[0197] For example, the touch sensor metal (TSM) may include a pair of first touch sensor metals (TSM1) and a second touch sensor metal (TSM2) arranged adjacent to each other.

[0198] When a second touch sensor metal (TSM2) is located between a pair of first touch sensor metals (TSM1), and the pair of first touch sensor metals (TSM1) must be electrically connected to each other, the pair of first touch sensor metals (TSM1) can be electrically connected to each other via a bridge metal (BRG) located in another layer.

[0199] The bridge metal (BRG) can be insulated from the second touch sensor metal (TSM2) by a touch interlayer insulating layer (T-ILD).

[0200] A protective layer (PAC) may be placed on the touch sensor (TS).

[0201] The protective layer (PAC) may, but is not limited to, an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0202] Below, we will provide a more detailed explanation of the first region (A1) with reference to Figures 4 to 7.

[0203] In the case of the second region (A2), it can have substantially the same structure as the first region (A1), and a detailed explanation will be omitted.

[0204] The first region (A1) may include an opening region (OA) within the display region (AA) in which a hole is formed by cutting through it.

[0205] An intermediate region (MA) may be formed along the peripheral edge of the opening region (OA).

[0206] The intermediate region (MA) can be an internal bezel area where no subpixels (SP1, SP2, SP3) are located.

[0207] Therefore, the opening area (OA) and the intermediate area (MA) may be non-display areas located within the display area (AA).

[0208] The area outside the intermediate region (MA) may be the display region (AA) where subpixels (SP1, SP2, SP3) are arranged.

[0209] The intermediate region (MA) prevents moisture permeation that may occur along the trimming line of the opening region (OA), and prevents fine cracks that may occur during the formation of the opening region (OA) from penetrating to the display region (AA).

[0210] The intermediate region (MA) may include a cutting margin section (TA), a second blocking section (SPR2), a dam section (DM), a first blocking section (SPR1), and a touch routing region (TRA) that are sequentially arranged in the direction from the opening region (OA) toward the display region (AA).

[0211] Figure 5 is a cross-sectional view of the display area (AA) along the line A-A' in Figure 4. Explanations that overlap with the explanation of the display area (AA) described with reference to Figure 3 above will be omitted.

[0212] Figure 6 is a cross-sectional view of the first region (A1) along the line B-B' in Figure 4.

[0213] The touch routing region (TRA) may contain touch sensors, including touch sensor metal (TSM) and bridge metal (BRG) located in different layers from each other.

[0214] The first interruption section (SPR1) may have one or more first interruption structures 210.

[0215] The adjacent first blocking structures 210 may be arranged so as to be separated from each other.

[0216] Each of the first blocking structures 210 may be formed in an uneven pattern.

[0217] For example, the first barrier structure 210 may be formed by removing at least a portion of the organic insulating layer, such as a first planarization layer (PLN1) and a second planarization layer (PLN2).

[0218] The first blocking structure 210 may be formed in a two-layer structure.

[0219] In one example, the first substructure 211 located at the bottom has a positive tapered shape with its width decreasing towards the top, and the second upper structure 222 located above the first substructure 211 may also have a positive tapered shape with its width decreasing towards the top.

[0220] The first substructure 211 may be formed of the same material as the third interlayer insulating layer (ILD3), and the first superstructure 212 may be formed of the same material as the second planarization layer (PLN2), but is not limited to this.

[0221] This allows the first blocking structure 210 to form an undercut structure at its lower part.

[0222] Depending on the shape of the first barrier structure 210 formed in this manner, the light-emitting layers (EL) placed on the first barrier structure 210 may be arranged discontinuously. For example, the light-emitting layers (EL) may be, but are not limited to, a stack structure including a hole transport layer, an electron transport layer, a hole barrier layer, a hole injection layer, an electron barrier layer, and an electron injection layer.

[0223] In other words, the light-emitting layers (EL) extending between adjacent first shielding structures 210 may be formed discontinuously without being connected to each other due to the undercut structure of the first shielding structures 210.

[0224] The light-emitting layer (EL) located in the intermediate region (MA) is not continuously connected, but rather arranged discontinuously, which effectively blocks moisture from entering along the light-emitting layer (EL) in the intermediate region (MA) through the opening region (OA).

[0225] The first blocking structure 210 functions to cut the light-emitting layer (EL), and therefore can also be called a separator.

[0226] The dam section (DM) may contain one or more dams 250.

[0227] Dam 250 can prevent the sealing layer (PCL) from overflowing and flowing outside of Dam 250.

[0228] For example, the dam 250 may be formed by patterning a third interlayer insulating layer (ILD3), a second flattening layer (PLN2), and a spacer (SPC).

[0229] An aligned metal layer (AM) may be formed at the bottom of the dam 250, which is made of the same layer as the first gate electrode (GAT1). The aligned metal layer (AM) can serve as a mark to ensure that the laser can accurately illuminate the aperture region (OA) when it is cut by irradiating it with a laser to form the aperture region (OA). One or more second blocking structures 220 may be arranged in the second blocking section (SPR2).

[0230] The adjacent second blocking structures 220 may be arranged so as to be separated from each other.

[0231] The second blocking structure 220 may be formed as a two-layer structure consisting of a second lower structure 221 located at the bottom and a second upper structure 222 located at the top.

[0232] The second blocking structure 220 is formed to have the same shape as the first blocking structure 210, and an undercut structure can be formed at the bottom.

[0233] Depending on the shape of the second shielding structure 220 formed in this manner, the light-emitting layers (EL) placed on the second shielding structure 220 may be arranged discontinuously.

[0234] Furthermore, one or more third blocking structures 230 may be provided in the cutting margin (TA).

[0235] The adjacent third blocking structures 230 may be arranged so as to be separated from each other.

[0236] The third blocking structure 230 may be formed as a two-layer structure consisting of a third lower structure 231 located at the bottom and a third upper structure 232 located at the top.

[0237] The third blocking structure 230 is formed to have the same shape as the second blocking structure 220, and an undercut structure can be formed at the bottom.

[0238] Depending on the shape of the third shielding structure 230 formed in this manner, the light-emitting layers (EL) placed on the third shielding structure 230 may be arranged discontinuously.

[0239] Thus, the light-emitting layer (EL) located in the intermediate region (MA) is not continuously connected but is arranged discontinuously, which effectively blocks moisture from entering along the light-emitting layer (EL) in the intermediate region (MA) through the opening region (OA).

[0240] The area outside the cutting margin (TA) can become an opening region (OA).

[0241] The cutting margin (TA) may be formed to have a predetermined width, taking into account the process errors that may occur when cutting by irradiating with a laser to form the aperture region (OA).

[0242] The cutting margin (TA) may be formed to have substantially the same layer structure as the second blocking portion (SPR2).

[0243] Therefore, in a broader sense, the cutting margin (TA) can also be said to be included in the second cutting section (SPR2).

[0244] A first passivation layer (PAS1) may be placed on the first blockage structure 210, second blockage structure 220, third blockage structure 230 and dam 250 formed in this manner.

[0245] The first passivation layer (PAS1) may be formed to fill the separation space between each of the barrier structures 210, 220, and 230.

[0246] However, due to the undercut structure of the barrier structures 210, 220, and 230, in the case of the first passivation layer (PAS1), which is an inorganic insulating layer formed to be relatively thin compared to the organic insulating layer, discontinuous disconnections may occur in the separation space between the barrier structures 210, 220, and 230, potentially resulting in defects such as seams.

[0247] Thus, if the first passivation layer (PAS1) cannot continuously cover the underlying structure and is formed discontinuously, the areas where seams occur can act as moisture permeability pathways in the upward direction.

[0248] Based on the dam 250, a sealing layer (PCL), which is an organic insulating layer, may be placed on the first passivation layer (PAS1) of the first barrier section (SPR1) located inside the dam 250.

[0249] Based on Dam 250, an organic insulating layer is not required in the second interruption section (SPR2) and the cutting margin section (TA) located outside Dam 250.

[0250] On the first passivation layer (PAS1), inorganic insulating layers such as a second passivation layer (PAS2), a touch buffer layer (T-BUF), and a touch interlayer insulating layer (T-ILD) may be further arranged.

[0251] Since a sealing layer (PCL) may be further arranged in the first passivation layer (PAS1) of the first barrier (SPR1), it is possible to partially block the upper moisture permeability path through the seam formed in the first passivation layer (PAS1). However, in the case of the second barrier (SPR2) and cut margin (TA) formed by a laminated structure of thin inorganic insulating layers, a method may be needed to block the upper moisture permeability path through the seam formed in the first passivation layer (PAS1).

[0252] As a result, the display device 1 according to the embodiment of this specification can form a capping layer (CL) in the intermediate region (MA).

[0253] The capping layer (CL) may include a first capping layer (CL1) placed on the touch buffer layer (T-BUF) and a second capping layer (CL2) placed on the intertouch insulating layer (T-ILD).

[0254] Therefore, the capping layer (CL) may be formed as a double structure consisting of a first capping layer (CL1) located at the bottom and a second capping layer (CL2) located at the top.

[0255] The first capping layer (CL1) may be located in the same layer as the first touch electrode (BRG) and may be made of the same material.

[0256] Furthermore, the second capping layer (CL2) may be located in the same layer as the second touch electrode (TSM) and may be made of the same material.

[0257] The first capping layer (CL1) and the second capping layer (CL2) may contain a metallic substance.

[0258] For example, the first capping layer (CL1) and the second capping layer (CL2) may be single or multi-layered layers made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0259] The first capping layer (CL1) and the second capping layer (CL2) may be arranged so as not to be electrically connected to each other via the touch interlayer insulating layer (T-ILD), but are not limited thereto. In other embodiments, the first capping layer (CL1) and the second capping layer (CL2) may be electrically connected to each other via contact holes in the touch interlayer insulating layer (T-ILD).

[0260] The first capping layer (CL1) and the second capping layer (CL2) may be arranged so as to overlap each other in the vertical direction.

[0261] The second capping layer (CL2) may be formed to have an even larger area than the first capping layer (CL1).

[0262] The first capping layer (CL1) and the second capping layer (CL2) may be arranged to surround the opening region (OA), or they may be formed in a closed loop shape.

[0263] The capping layer (CL) may be located in at least a portion of the intermediate region (MA).

[0264] As one embodiment, referring to Figure 6, the capping layer (CL) may be positioned on top of the first blocking section (SPR1), the dam section (DM), and the second blocking section (SPR2).

[0265] In this case, the capping layer (CL) may be positioned to completely cover the dam section (DM) and the second barrier section (SPR2), while the first barrier section (SPR1) may be positioned to cover only a portion of the area adjacent to the dam section (DM).

[0266] Furthermore, the second capping layer (CL2) of the capping layer (CL) placed in the first blocking section (SPR1) may be arranged to have a smaller area than the first capping layer (CL1).

[0267] For example, the first capping layer (CL1) may be formed to extend further toward the display area (AA) than the second capping layer (CL2).

[0268] Crack detection wiring 60 may be arranged on the first capping layer (CL1), which extends further than the second capping layer (CL2), so as to overlap in the vertical direction.

[0269] The crack detection wiring 60 may be located in the same layer as the second capping layer (CL2) and may be made of the same material.

[0270] The crack detection wiring 60 may be arranged so as to overlap the first blocking structure 210 in the vertical direction.

[0271] The crack detection wiring 60 may be arranged to surround the opening area (OA).

[0272] For example, the crack detection wiring 60 may be arranged to surround the opening area (OA) in such a way that a portion of the opening area (OA) is left open.

[0273] As described above, according to the embodiments of this specification, by arranging a capping layer (CL) in the intermediate region (MA) between the display region (AA) and the opening region (OA) so as to surround the opening region (OA), moisture permeation can be prevented through the upper part of the insulating layer near the opening region (OA).

[0274] In this case, the capping layer (CL) can more effectively block the moisture permeability pathway by being formed to surround the opening region (OA) in a closed loop.

[0275] Furthermore, by arranging the capping layer (CL) so as to cover the first barrier section (SPR1) with a double layer consisting of the first capping layer (CL1) and the second capping layer (CL2), the upper moisture permeability path in the first barrier section (SPR1), where the inorganic insulating layer is laminated, can be more effectively blocked.

[0276] Furthermore, by including a metallic substance in the capping layer (CL) placed on top of the insulating layer, the propagation of cracks through the insulating layer can be reduced, thus providing a crack-resistant structure.

[0277] In this case, the capping layer (CL) can more effectively block the path through which the crack propagates by being formed to surround the opening region (OA) in a closed loop.

[0278] Referring to Figure 6, one end of the capping layer (CL) of the display device 1 according to one embodiment of this specification may be located at the boundary between the second blocking portion (SPR2) and the cutting margin portion (TA).

[0279] Therefore, the capping layer (CL) may be arranged so as not to overlap the cutting margin (TA) in the vertical direction, and may be arranged at a predetermined distance from the opening region (OA).

[0280] The second capping layer (CL2) may extend further toward the opening region (OA) than the first capping layer (CL1), so as to surround the side surface of one end portion of the first capping layer (CL1) toward the opening region (OA).

[0281] For example, one end portion of the second capping layer (CL2) may be located at the boundary between the second blocking portion (SPR2) and the cutting margin portion (TA), and one end portion of the first capping layer (CL1) may be located inside the boundary of the cutting margin portion (TA).

[0282] Thus, since the capping layer (CL) is not disposed in the cutting margin portion (TA), when performing a laser cutting process to form the opening region (OA), there is an advantage in terms of process because it is not necessary to further consider or change the process conditions of the laser cutting process to further cut the capping layer (CL).

[0283] Further, the second capping layer (CL2) may be disposed so as to cover a side surface of the touch interlayer insulating layer (T-ILD) located on one end portion of the first capping layer (CL1) by further extending in the direction of the opening region (OA) than the first capping layer (CL1).

[0284] Thereby, the side surface of the touch interlayer insulating layer (T-ILD) may not be exposed to the outside by the second capping layer (CL2), so that the moisture permeation path and crack path that may occur through the touch interlayer insulating layer (T-ILD) can be more effectively blocked.

[0285] Referring to FIG. 7, one end portion of the capping layer (CL) of the display device 1 according to another embodiment of the present specification may be located at the boundary between the cutting margin portion (TA) and the opening region (OA).

[0286] In this case, one end portions of both the first capping layer (CL1) and the second capping layer (CL2) may be located at the boundary between the cutting margin portion (TA) and the opening region (OA).

[0287] In such a structure, when a laser cutting process is performed to form an aperture region (OA), the cutting margin (TA) including the capping layer (CL) may also be cut, so that one end of the capping layer (CL) is located at the boundary between the cutting margin (TA) and the aperture region (OA).

[0288] Thus, because the capping layer (CL) extends further to the cutting margin (TA), and the boundary where the opening region (OA) begins coincides with one end of the capping layer (CL), positioning the capping layer (CL) from the point where the moisture permeability path and crack path begin not only allows for more effective blocking of upper moisture permeability but also provides a structure that is resistant to cracks.

[0289] On the other hand, when a fine cutting process using a laser is performed to form an aperture region (OA), static electricity may be generated, so a structure is needed that can dissipate this static electricity to the outside.

[0290] Furthermore, when a capping layer (CL) containing a metallic material is positioned to float, the voltage of the capping layer (CL) may fluctuate, potentially generating touch noise. Therefore, a structure that can resolve this issue is also necessary.

[0291] According to the embodiments of this specification, the capping layer (CL), which is positioned to surround the opening region (OA), can be connected to ground or supplied with a power supply having a constant voltage, so that the capping layer (CL) has a constant voltage.

[0292] Referring to Figures 8 to 10, one embodiment of this specification can be described, in which the capping layer (CL) can be electrically connected to the crack detection wiring 60.

[0293] Since the crack detection wiring 60 is connected to ground (GND), the capping layer (CL) can be connected to ground (GND) and grounded via the crack detection wiring 60.

[0294] For example, a crack detection wiring 60 located in the first interruption section (SPR1) can be electrically connected to the first capping layer (CL1) via a first contact hole (CH1) that penetrates the touch interlayer insulating layer (T-ILD).

[0295] The first contact hole (CH1) may be formed in a region that overlaps vertically with the sealing layer (PCL) located below, thereby being stably formed in a flattened region via the organic insulating layer.

[0296] Furthermore, the first capping layer (CL1) can be electrically connected to the second capping layer (CL2) via a second contact hole (CH2) that penetrates the touch interlayer insulating layer (T-ILD).

[0297] The second contact hole (CH2) may be formed in a region that overlaps vertically with the lower dam 250, thereby being stably formed in a flattened region via the organic insulating layer.

[0298] The crack detection wiring 60 may be positioned outside the enclosure of the anti-static wiring 70.

[0299] The first capping layer (CL1) may be surrounded by a touch sensor metal (TSM) and other components arranged to enclose the first capping layer (CL1).

[0300] For example, the touch sensor metal (TSM) may include a first touch sensor metal (TSM1) and a second touch sensor metal (TSM2).

[0301] The first touch sensor metal (TSM1) and the second touch sensor metal (TSM2) may be arranged alternately with respect to each other.

[0302] In this case, the first touch sensor metals (TSM1) adjacent to each other can be electrically connected to each other by the bridge metal (BRG) disposed at the lower part.

[0303] Also, the touch sensor metal (TSM) may further include a touch connection part (TCL).

[0304] The touch connection part (TCL) is disposed adjacent to the first capping layer (CL1) rather than the first touch sensor metal (TSM1) and the second touch sensor metal (TSM2), but may be disposed at a predetermined distance apart so as to surround the first capping layer (CL1).

[0305] The first touch sensor metal (TSM1) and the second touch sensor metal (TSM2) can be electrically connected to each other by the touch connection part (TCL).

[0306] The first touch sensor metal (TSM1), the second touch sensor metal (TSM2), and the touch connection part (TCL) may be formed of the same material in the same layer.

[0307] Referring to FIGS. 11 to 13, another embodiment of the present specification will be described. The capping layer (CL) can be electrically connected to the electrostatic prevention wiring 70.

[0308] Since the electrostatic prevention wiring 70 is connected to the ground (GND), the capping layer (CL) can be connected to the ground (GND) and grounded through the electrostatic prevention wiring 70.

[0309] For example, the electrostatic prevention wiring 70 extending to the first blocking part (SPR1) can be electrically connected to the first capping layer (CL1) through the third contact hole (CH3) penetrating the touch interlayer insulation layer (T-ILD).

[0310] The third contact hole (CH3) may be formed in a region that overlaps vertically with the sealing layer (PCL) located below it, thereby being stably formed in a flattened region via the organic insulating layer.

[0311] Furthermore, the first capping layer (CL1) can be electrically connected to the second capping layer (CL2) via a second contact hole (CH2) that penetrates the touch interlayer insulating layer (T-ILD).

[0312] The second contact hole (CH2) may be formed in a region that overlaps vertically with the lower dam 250, thereby being stably formed in a flattened region via the organic insulating layer.

[0313] As a result, according to the embodiments of this specification, by connecting the capping layer (CL), which is arranged to surround the aperture region (OA), to ground (GND), static electricity generated during the cutting process to form the aperture region (OA) can be discharged to the outside, thereby reducing the occurrence of pixel defects.

[0314] Furthermore, according to the embodiments of this specification, by connecting the capping layer (CL), which is arranged to surround the opening region (OA), to ground (GND), the voltage of the capping layer (CL) can be kept constant and not fluctuate, thereby reducing the occurrence of touch noise in the touch display device.

[0315] The crack detection wiring 60 may be positioned outside the enclosure of the anti-static wiring 70.

[0316] Referring to Figures 14 to 16, another embodiment of this specification can be described, in which the capping layer (CL) can be electrically connected to the power connection wiring 31.

[0317] For example, the power supply connection wiring 31 may be high-voltage wiring or low-voltage wiring.

[0318] The power connection wiring 31 may be located below the capping layer (CL).

[0319] For example, the power connection wiring 31 may be formed in the same layer as the first light-blocking layer (BSM1) and made of the same material as the first light-blocking layer (BSM1).

[0320] The power connection wiring 31 may be formed to extend through the first interruption section (SPR1) and the dam section (DM) to the second interruption section (SPR2).

[0321] The power connection wiring 31 located in the second interruption section (SPR2) can be electrically connected to the first capping layer (CL1) via a fourth contact hole (CH4) that penetrates the buffer layer (BUF), the first interlayer insulation layer (ILD1), the second interlayer insulation layer (ILD2), the third interlayer insulation layer (ILD3), the first planarization layer (PLN1), the first passivation layer (PAS1), and the touch buffer layer (T-BUF).

[0322] In this case, a power connection electrode 32 is further formed between the power connection wiring 31 and the first capping layer (CL1), allowing the power connection wiring 31 and the first capping layer (CL1) to be electrically connected via the fourth contact hole (CH4).

[0323] The fourth contact hole (CH4) may be located between adjacent second blocking structures 220.

[0324] As a result, the power connection electrode 32 formed in the fourth contact hole (CH4) may be positioned between adjacent second blocking structures 220.

[0325] Therefore, the separation distance between the second blocking structures 220 via the fourth contact hole (CH4) may be even greater than the separation distance between the other second blocking structures 220 in which the fourth contact hole (CH4) is not formed.

[0326] Furthermore, the first capping layer (CL1) can be electrically connected to the second capping layer (CL2) via a fifth contact hole (CH5) that penetrates the touch interlayer insulating layer (T-ILD).

[0327] In this case, the fifth contact hole (CH5) may be positioned to overlap the fourth contact hole (CH4) in the vertical direction.

[0328] This allows the second capping layer (CL2) to be electrically connected to the power supply connection wiring 31 via the first capping layer (CL1).

[0329] The power connection wiring 31, power connection electrode 32, first capping layer (CL1), and second capping layer (CL2) formed in this manner are sequentially stacked so as to be in contact with each other, thereby blocking the insulating layer located above them.

[0330] The crack detection wiring 60 may be positioned outside the enclosure of the anti-static wiring 70.

[0331] Thus, and according to the embodiments of this specification, the capping layer (CL) can block the insulating layer by using a structure that connects it to the power connection wiring 31 located below it via the power connection electrode 32, and can therefore function as a further crack propagation prevention structure that can block the propagation of cracks through the insulating layer.

[0332] Furthermore, according to the embodiments of this specification, by supplying a power supply with a constant voltage to the capping layer (CL) which is arranged to surround the aperture region (OA), static electricity generated during the cutting process to form the aperture region (OA) can be discharged to the outside, thereby reducing the occurrence of pixel defects.

[0333] Furthermore, according to the embodiments of this specification, by supplying a power supply with a constant voltage to the capping layer (CL) which is arranged to surround the opening region (OA), the voltage of the capping layer (CL) remains constant without fluctuation, thereby reducing the occurrence of touch noise in the touch display device.

[0334] As described above, the display device according to the embodiments of this specification can be described as follows.

[0335] A display device according to an embodiment of this specification includes a substrate including a display area, an aperture area located within the display area, and an intermediate area located between the display area and the aperture area, and a capping layer containing a metallic material, which is disposed in the intermediate area and arranged to surround the aperture area in a closed loop, wherein the capping layer is connected to ground or supplied with a power supply having a constant voltage.

[0336] The display device further includes crack detection wiring or anti-static wiring, at least a portion of which is located in the intermediate region, and the capping layer can be electrically connected to the crack detection wiring or anti-static wiring and connected to ground.

[0337] The capping layer includes a first capping layer and a second capping layer disposed spaced apart on the first capping layer, wherein the second capping layer can be electrically connected to the crack detection wiring or the anti-static wiring via the first capping layer.

[0338] The capping layer further includes power connection wiring positioned below the capping layer, and the capping layer may be electrically connected to the power connection wiring and have the same voltage as the power connection wiring.

[0339] The power supply connection wiring may be high-voltage wiring or low-voltage wiring.

[0340] The capping layer includes a first capping layer and a second capping layer disposed spaced apart on the first capping layer, wherein the second capping layer can be electrically connected to the power supply connection wiring via the first capping layer.

[0341] Furthermore, the display device according to the embodiment of this specification includes a substrate including a display area, an opening area located within the display area, and an intermediate area located between the display area and the opening area; one or more shielding portions disposed in the intermediate area; one or more insulating layers disposed to cover the one or more shielding portions; and a capping layer containing a metallic material, which covers at least one or more shielding portions and is disposed in the intermediate area so as to surround the opening area, wherein the capping layer is connected to ground or supplied with a power supply having a constant voltage.

[0342] The display device further includes a dam portion disposed in the intermediate region, the blocking portion includes a first blocking portion disposed between the dam portion and the display region and a second blocking portion disposed between the dam portion and the opening region, the capping layer is disposed to cover the second blocking portion and the dam portion, and the first blocking portion may be disposed to cover at least a portion of the region.

[0343] The capping layer includes a first capping layer and a second capping layer disposed separately on the first capping layer, and the first capping layer and the second capping layer may have a closed loop structure.

[0344] The second capping layer may have an even larger area than the first capping layer.

[0345] The first capping layer may further include crack detection wiring or anti-static wiring located in the intermediate region, and the first capping layer may be electrically connected to the crack detection wiring or anti-static wiring and connected to ground.

[0346] The first capping layer and the second capping layer are electrically connected via contact holes, and the second capping layer can be electrically connected to the crack detection wiring or the anti-static wiring via the first capping layer.

[0347] The invention further includes a power connection wiring disposed below the insulating layer and supplied with power, and a power connection electrode that penetrates the insulating layer and has one side connected to the first capping layer and the power connection wiring, respectively, and the first capping layer can be electrically connected to the power connection wiring via the power connection electrode.

[0348] The second interruption section includes a plurality of interruption structures arranged in one direction, and the power supply connection electrodes may be positioned between the plurality of interruption structures that are adjacent to each other.

[0349] The first capping layer can be electrically connected to the second capping layer in a region that overlaps vertically with the contact hole to which the power supply connection electrode and the first capping layer are connected.

[0350] The power supply connection wiring, the power supply connection electrode, the first capping layer, and the second capping layer can be sequentially stacked to block the insulating layer.

[0351] The substrate further includes a touch electrode layer disposed on the substrate, comprising a first touch electrode and a second touch electrode, wherein the first touch electrode is disposed in the same layer as the first capping layer, and the second touch electrode is disposed in the same layer as the second capping layer.

[0352] The second capping layer may extend further toward the opening region than the first capping layer, so as to surround the side surface of the end portion of the first capping layer toward the opening region.

[0353] The embodiments of this specification have been described in more detail above with reference to the attached drawings. However, this specification is not necessarily limited to these embodiments, and various modifications are possible within the scope of the technical concept of this specification. Therefore, the embodiments disclosed herein are for illustrative purposes only, not to limit the technical concept of this specification, and the scope of the technical concept of this specification is not limited by these embodiments. Accordingly, the embodiments described above should be understood as illustrative in all respects and not limiting. [Explanation of Symbols]

[0354] 1 Display device 10 circuit boards 20 Data-driven circuits 30 Power wiring 31 Power Connection Wiring 32 Power connection electrodes 40 Gate drive unit 50 Flexible circuit boards 51 Printed circuit board 60 Crack detection wiring 61 Crack detection pad section 70. Antistatic wiring 71 Anti-static pad section OA1 1st optical area OA2 2nd optical area

Claims

1. A substrate including a display area, an aperture area located within the display area, and an intermediate area located between the display area and the aperture area, The intermediate region is arranged to surround the opening region in a closed loop, and includes a capping layer containing a metallic material, A crack detection wiring or anti-static wiring, at least a portion of which is located in the intermediate region, Includes, The capping layer is connected to ground or to a power supply having a predetermined voltage. The capping layer is connected to the ground by being electrically connected to the crack detection wiring or the anti-static wiring connected to the ground. Display device.

2. The capping layer includes a first capping layer and a second capping layer disposed separately on the first capping layer. The second capping layer is electrically connected to the crack detection wiring or the anti-static wiring via the first capping layer. The display device according to claim 1.

3. A substrate including a display area, an aperture area located within the display area, and an intermediate area located between the display area and the aperture area, The intermediate region is arranged to surround the opening region in a closed loop, and includes a capping layer containing a metallic material, Power connection wiring located below the capping layer, Includes, The capping layer is electrically connected to the power supply connection wiring and has the same voltage as the power supply connection wiring. Display device.

4. The power supply connection wiring is either high-voltage wiring or low-voltage wiring. The display device according to claim 3.

5. The capping layer includes a first capping layer and a second capping layer disposed separately on the first capping layer. The second capping layer is electrically connected to the power supply connection wiring via the first capping layer. The display device according to claim 4.

6. A substrate including a display area, an aperture area located within the display area, and an intermediate area located between the display area and the aperture area, One or more blocking units arranged in the intermediate region, One or more insulating layers arranged to cover one or more of the aforementioned barrier portions, A capping layer containing a metallic material is provided, which covers at least one of the aforementioned blocking portions and is arranged in the intermediate region so as to surround the opening region. A crack detection wiring or anti-static wiring is arranged in the intermediate region, Includes, The capping layer is connected to ground or to a power supply having a predetermined voltage. The capping layer includes a first capping layer and a second capping layer disposed separately on the first capping layer. The first capping layer and the second capping layer have a closed loop structure. The first capping layer is connected to the ground by being electrically connected to the crack detection wiring or the anti-static wiring connected to the ground. Display device.

7. The aforementioned intermediate region further includes a dam section, The blocking section comprises a first blocking section disposed between the dam section and the display area, and a second blocking section disposed between the dam section and the opening area. Includes, The capping layer is arranged to cover the second blocking portion and the dam portion, and the first blocking portion is arranged to cover at least a portion of the area. The display device according to claim 6.

8. The second capping layer has an even larger area than the first capping layer. The display device according to claim 6.

9. The first capping layer and the second capping layer are electrically connected via contact holes, and the second capping layer is electrically connected to the crack detection wiring or the anti-static wiring via the first capping layer. The display device according to claim 6.

10. The present invention further includes a power connection wiring disposed below the insulating layer and supplied with the power, and a power connection electrode that penetrates the insulating layer, with one side and the other side connected to the first capping layer and the power connection wiring, respectively. The first capping layer is electrically connected to the power connection wiring via the power connection electrode. The display device according to claim 6.

11. The invention further includes a power connection wiring disposed below the insulating layer and supplied with power, and a power connection electrode that penetrates the insulating layer and whose one side and the other side are connected to the first capping layer and the power connection wiring, The second blocking section includes a plurality of blocking structures arranged in one direction, The power connection electrodes are arranged between the plurality of adjacent shut-off structures. The display device according to claim 7.

12. The first capping layer is electrically connected to the second capping layer in a region that overlaps vertically with the contact hole to which the power supply connection electrode and the first capping layer are connected. The display device according to claim 10.

13. The power supply connection wiring, the power supply connection electrode, the first capping layer, and the second capping layer are sequentially stacked to block the insulating layer. The display device according to claim 12.

14. The substrate is disposed on and further includes a touch electrode layer comprising a first touch electrode and a second touch electrode, The first touch electrode is placed in the same layer as the first capping layer. The second touch electrode is placed in the same layer as the second capping layer. The display device according to claim 6.

15. The second capping layer extends further toward the opening region than the first capping layer, so as to surround the side surface of the end portion of the first capping layer toward the opening region. The display device according to claim 6.

16. The cutting margin portion is further located in the intermediate region of the substrate between the second blocking portion and the opening region, The capping layer is positioned so as not to overlap with the cutting margin in the vertical direction, and is separated by a predetermined distance from the opening region. The display device according to claim 7.

17. The cutting margin portion is further located in the intermediate region of the substrate between the second blocking portion and the opening region, One end of the first capping layer and one end of the second capping layer are located at the boundary between the cutting margin and the opening region. The display device according to claim 7.

18. Each of the one or more said blocking sections is composed of a plurality of blocking structures formed in a two-layer structure, including a lower structure and an upper structure disposed on the lower structure. The blocking structure is located below the upper structure and defines an undercut structure adjacent to the lower structure, and the undercut structure blocks the light-emitting layer extending between adjacent blocking structures. The display device according to claim 6.

19. The lower structure and the upper structure have a tapered shape, with the width decreasing as they go upwards. The display device according to claim 18.

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