Manufacturing method for mounting equipment and semiconductor device

Abstract

To provide a technique that can improve the accuracy of abnormality inspection on the side of a device.SOLUTION: A mounting device includes at least one pair of mirrors installed to face each other, an imaging device provided such that a die and a reflective surface of the mirror are located within a field of view, an illumination device that emits illumination light along an optical axis of the imaging device, and wraparound light prevention means that prevents light passing around the die from reaching the imaging device among the light reflected by one of the reflective surfaces of the pair of mirrors.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a mounting device and is applicable to, for example, a die bonder for inspecting the side surface of a die.

Background Art

[0002] A mounting device such as a die bonder is a device that attaches (mounts) an element, for example, onto a substrate or an element, using a bonding material. The bonding material is, for example, a liquid or film-shaped resin, solder, or the like. The element is, for example, a die such as a semiconductor chip, MEMS (Micro Electro Mechanical System), glass chip, or an electronic component. The substrate is, for example, a wiring substrate, a lead frame formed of a metal thin plate, a glass substrate, or the like.

[0003] In a die bonder, for example, based on an image acquired using a camera, positioning of an element or inspection of the side surface of the element is performed (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the present disclosure is to provide a technique capable of improving the accuracy of abnormality inspection on the side surface of an element. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

Means for Solving the Problems

[0006] The outline of typical aspects of the present disclosure will be briefly described as follows. In other words, the mounting apparatus comprises at least one pair of mirrors positioned facing each other, an imaging device provided such that the die and the reflective surfaces of the mirrors are within the field of view, an illumination device that irradiates illumination light along the optical axis of the imaging device, and a light-reflecting means that prevents light reflected from one of the reflective surfaces of the pair of mirrors from passing around the die and reaching the imaging device. [Effects of the Invention]

[0007] According to this disclosure, the accuracy of anomaly inspection on the side surface of the element can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic top view of a die bonder in an embodiment. [Figure 2] Figure 2 is a schematic side view of the die bonder shown in Figure 1. [Figure 3] Figure 3 is a flowchart showing the manufacturing method of a semiconductor device using the die bonder shown in Figure 1. [Figure 4] Figure 4 is a schematic diagram showing the stage recognition camera, coaxial lighting, and intermediate stage in an embodiment. [Figure 5] Figure 5 is a schematic diagram showing the illumination light of coaxial lighting at the intermediate stage of the comparative example. [Figure 6] Figure 6 shows a side view of the die using the coaxial illumination light shown in Figure 5. [Figure 7] Figure 7 shows a side view of the die under ideal lighting conditions. [Figure 8] Figure 8 shows an intermediate stage in one embodiment of the design. [Figure 9] Figure 9 shows an intermediate stage in another embodiment of the model. [Figure 10] Figure 10 shows images of the die at different angles of the reflective surfaces of three different mirrors. [Figure 11] Figure 11 shows the configuration of the intermediate stage and the optical path of the transmitted light in the first modified example. [Figure 12] Figure 12 is a top view of the intermediate stage shown in Figure 11. [Figure 13] Figure 13 is a diagram showing the optical path of the reflected light in the intermediate stage shown in Figure 11. [Figure 14] Figure 14 is a diagram showing the stage recognition camera, the lighting device, and the intermediate stage in the second modification example. [Figure 15] Figure 15 is a diagram for explaining the irradiation region of the surface-emitting illumination shown in Figure 14. [Figure 16] Figure 16 is a diagram showing the region irradiated with the illumination light of the surface-emitting illumination shown in Figure 15. [Figure 17] Figure 17 is a diagram for explaining the irradiation region of the surface-emitting illumination in the third modification example. [Figure 18] Figure 18 is a diagram showing the region irradiated with the illumination light of the surface-emitting illumination shown in Figure 17.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments and modification examples will be described with reference to the drawings. However, in the following description, the same reference numerals may be assigned to the same components, and repeated descriptions may be omitted. Note that, for the sake of clarity of explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual aspect. Also, the dimensional relationships and ratios of each element are not necessarily consistent even among multiple drawings.

[0010] First, the configuration of the die bonder according to the embodiment will be described using FIGS. 1 and 2. FIG. 1 is a schematic top view of the die bonder according to the embodiment. FIG. 2 is a schematic side view of the die bonder shown in FIG. 1.

[0011] The die bonder 1 generally includes a die supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transfer unit 50, and a control unit (control device) 80 that monitors and controls the operations of each unit. The Y-axis direction is the front-rear direction of the die bonder 1, and the X-axis direction is the left-right direction. The die supply unit 10 is arranged on the front side of the die bonder 1, and the bonding unit 40 is arranged on the rear side.

[0012] The die supply unit 10 has a wafer holding table (not shown) for holding the wafer W and a peeling unit 13 for peeling the die D from the wafer W. The wafer holding table is moved in the XY directions by a driving means (not shown), and the die D to be picked up is moved to the position of the peeling unit 13. The peeling unit 13 is moved in the vertical direction by a driving means (not shown). The wafer W is adhered onto a dicing tape DT and is divided into a plurality of dies D. The dicing tape DT with the wafer W adhered thereon is held by a wafer ring (not shown). A film-like adhesive material called a die attach film (DAF) is pasted between the wafer W and the dicing tape DT. The die attach film cures by heating.

[0013] The pickup unit 20 has a pickup head 21, a wafer recognition camera 24, and a lighting device 25. The pickup head 21 has a collet 22 for sucking and holding the peeled die D at its tip, picks up the die D from the die supply unit 10, and places it on the intermediate stage 31. The wafer recognition camera 24 grasps the pickup position of the die D picked up from the wafer W. The pickup unit 20 has driving units (not shown) for moving the pickup head 21 up and down, rotating it, and moving it in the X and Y directions.

[0014] The intermediate stage section 30 includes an intermediate stage 31, a stage recognition camera 34, and a lighting device 35. The intermediate stage 31 includes mirrors 311a to 311d, a pedestal 312 on which the die D is temporarily placed, and a base 313. Mirrors 311a to 311d are sometimes collectively referred to as mirror 311. The stage recognition camera 34 is installed above the intermediate stage 31 and photographs the die D on the intermediate stage 31. The lighting device 35 is, for example, a coaxial light installed between the stage recognition camera 34 and the intermediate stage 31.

[0015] Furthermore, each mirror 311 has a reflective surface tilted at a predetermined angle with respect to the optical axis of the stage recognition camera 34, and four mirrors are installed on the base 313. Note that the number of mirrors 311 is not limited to four; two may be used if only two specific sides of the die D are to be recognized. One mirror 311 facing one side of the die D may be composed of multiple mirrors.

[0016] The mirror 311 is, for example, a triangular prism in which opposing sides are right-angled isosceles triangles, and the other sides, base, and the inclined surface having the reflective surface are rectangular. That is, the reflective surface is planar. The mirror 311 may be made of a prism in addition to a mirror.

[0017] The predetermined angle is such that the illumination light from the illumination device 35 is shone onto the side of the die D at an angle nearly perpendicular to it, and the side of the die D can be imaged at an angle nearly perpendicular to it. By reflecting the side image of the die D onto the reflective surface of the mirror 311, the top surface and all four sides of the die D can be simultaneously imaged (in a single exposure) and inspected by the stage recognition camera 34 installed above the intermediate stage 31.

[0018] The die D is temporarily placed on the base 312. The mounting surface of the base 312 on which the die D is placed is higher than the surface on which the mirror 311 is installed (the upper surface of the base 313). Also, the base 312 is, for example, columnar, and its upper mounting surface is smaller than the die D. In this case, the size is such that the outer edge of the die D does not bend and deform when it is in contact with the mounting surface. This makes it possible to position the mirror 311 closer to the die D. It also makes it easier to photograph the lower end of the die D. Furthermore, it makes it possible to accommodate changes in the size of the die being mounted. For these reasons, it is preferable to provide the base 312, but it is not necessary.

[0019] The stage recognition camera 34 is installed, for example, directly above the intermediate stage 31, and its field of view is directed vertically downwards so that the optical axis of the stage recognition camera 34 coincides with the central axis of the intermediate stage 31. The stage recognition camera 34 is installed so that the die D and the reflective surfaces of the four mirrors 311 are within its field of view. The illumination device 35 illuminates the die D, which is placed on the intermediate stage 31, with light to make it bright enough for the stage recognition camera 34 to photograph. The reflected light from the illuminated die is incident on the four mirrors 311. With this configuration, the stage recognition camera 34 can photograph the die D from its sides to its top surface.

[0020] The light images incident on the four mirrors 311 are incident along the optical axis of the stage recognition camera 34, which is installed above the four mirrors 311. The stage recognition camera 34 captures the subject images reflected from the top surface of the die D and from the four mirrors 311, respectively. The images captured by the stage recognition camera 34 are output to the control unit 80, processed, and can also be displayed on a display screen (not shown).

[0021] The bonding unit 40 includes a bond head 41, a substrate recognition camera 44, and a bond stage 46. The bond head 41 has a collet 42 that holds the die D at its tip by suction, similar to the pickup head 21. The substrate recognition camera 44 captures a position recognition mark (not shown) on the substrate S and recognizes the bond position. Here, the substrate S has multiple product areas (hereinafter referred to as package areas P) that will ultimately form a single package. A position recognition mark is provided for each package area P. The bond stage 46 is moved upward when the die D is placed on the substrate S, supporting the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place. The bond stage 46 has a heating unit (not shown) for heating the substrate S. The bonding unit 40 also includes drive units (not shown) that move the bond head 41 up and down, rotate, and in the X and Y directions.

[0022] With this configuration, the bond head 41 corrects its pickup position and orientation based on the image data from the stage recognition camera 34 and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the image data from the substrate recognition camera 44, or bonds it by stacking it on top of a die that has already been bonded to the package area P of the substrate S.

[0023] The transport unit 50 has a transport lane 52 on which the substrate S moves. The transport lane 52 transports the substrate S in the X-axis direction. With this configuration, the substrate S moves from a substrate supply unit (not shown) along the transport lane 52 to the bonding position (mounting position), and after bonding, it moves to a substrate discharge unit (not shown) or returns to the substrate supply unit.

[0024] The control unit 80 includes a memory for storing a program (software) that monitors and controls the operation of each of the parts of the die bonder 1 described above, and a central processing unit (CPU) that executes the program stored in the memory.

[0025] The bonding process (manufacturing method), which is one step in the manufacturing process of a semiconductor device using die bonder 1, will be explained with reference to Figure 3. Figure 3 is a flowchart showing the manufacturing method of a semiconductor device using die bonder as shown in Figure 1. In the following explanation, the operation of each part constituting die bonder 1 is controlled by control unit 80.

[0026] (Wafer loading process: Process S1) A wafer ring (not shown) is supplied to the wafer cassette (not shown) of the die bonder 1. The supplied wafer ring is then supplied to the die supply unit 10 and loaded into the die bonder 1. Here, the wafer ring holds a dicing tape DT to which dies D, separated from wafer W, are attached.

[0027] (Substrate loading process: Process S2) The substrate transport jig containing the substrate S is supplied to the substrate supply unit and loaded into the die bonder 1. In the substrate supply unit, the substrate S is removed from the substrate transport jig and fixed to transport claws (not shown).

[0028] (Pickup process: Process S3) After step S1, the wafer holder is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 24, and the die D is positioned and its surface inspected based on the image data acquired by the photograph.

[0029] The positioned die D is peeled from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D, peeled from the dicing tape DT, is attracted and held by the collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0030] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired by the camera. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder is calculated, and positioning is performed. The die position reference point is a predetermined position on the intermediate stage 31, which is held as the initial setting of the device. The surface inspection of the die D is performed by processing the image data.

[0031] The pickup head 21, which has transported die D to the intermediate stage 31, is returned to the die supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, die D is peeled off one by one from the dicing tape DT following the same procedure.

[0032] (Bond process: Process S4) The transport unit 50 transports the substrate S to the bond stage 46. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired by the image capture. By processing the image data, the amount of displacement of the substrate S from the substrate position reference point of the die bonder 1 (in the X, Y, and θ directions) is calculated. The substrate position reference point is a predetermined position of the bonding unit 40, which is held as the initial setting of the device.

[0033] In step S3, the suction position of the bond head 41 is corrected based on the amount of displacement of the die D on the intermediate stage 31 calculated, and the die D is picked up by the collet 42. The bond head 41, which has picked up the die D from the intermediate stage 31, bonds the die D to a predetermined location on the substrate S supported by the bond stage 46. Here, the predetermined location on the substrate S is the package area P of the substrate S, or an area where elements are already placed and elements are to be bonded in addition to them, or the bond area of ​​elements to be laminated and bonded. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by the photograph to determine whether the die D is bonded to the desired location. If the inspected die D is found to be defective, the bond head 41 transports the die D to the discard area.

[0034] The bond head 41, having bonded die D to the substrate S, is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This process is repeated until die D is bonded to all predetermined locations on the substrate S.

[0035] (Substrate unloading process: Process S5) The substrate S to which die D has been bonded is transported to the substrate discharge section. In the substrate discharge section, the substrate S is removed from the substrate transport claws and stored in the substrate transport jig. The substrate S stored in the substrate transport jig is discharged from the die bonder 1.

[0036] After step S5, the substrate S to which the die D is bonded is transported to the wire bonding step, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wire or the like. For example, in the case of laminate bonding, the substrate S to which the die D is bonded is then transported to the die bonder, where the die D is laminated on top of the die D bonded on the substrate S. After being transported out of the die bonder, the electrodes of the substrate S are electrically connected via Au wire in the wire bonding step. Dies D from the second stage upwards are peeled off from the dicing tape DT in the manner described above, then transported to the bonding section 40 and laminated on top of the die D. After the above steps are repeated a predetermined number of times, the substrate S is transported to the molding step, where the multiple die Ds and Au wires are sealed with molding resin (not shown) to complete the laminated package.

[0037] Next, the lighting device 35 will be described. Figure 4 is a schematic diagram showing the stage recognition camera, coaxial lighting, and intermediate stage in an embodiment.

[0038] As shown in Figure 4, the lighting device 35 is positioned between the stage recognition camera 34 and the intermediate stage 31. The lighting device 35 includes a surface-emitting illuminator (light source) 351 and a half-mirror (semi-transparent mirror) 352. The light emitted from the surface-emitting illuminator 351 is reflected by the half-mirror 352 in the same optical axis direction as the stage recognition camera 34 and illuminates the die D of the intermediate stage 31. The illumination light that illuminates the die D in the same optical axis as the stage recognition camera 34 is reflected by the die D, and the reflected light passes through the half-mirror 352 to the stage recognition camera 34, forming an image of the die D. The lighting device 35 is a coaxial incident illumination (coaxial lighting) device.

[0039] When a mirror 311 with a reflective surface tilted at approximately 45 degrees with respect to the optical axis of the stage recognition camera 34 is placed on the intermediate stage 31, the illumination light from coaxial illumination (coaxial illumination light) is reflected by the mirror 311, and the reflected illumination light is shone approximately perpendicularly to the side of the die D. Then, the light reflected from the side of the die D is reflected by the mirror 311, and this reflected light reaches the stage recognition camera 34. In other words, approximately perpendicular illumination and approximately perpendicular imaging become possible for all four sides of the die D.

[0040] Next, in order to further clarify the embodiment, the problems with side imaging will be explained using Figures 5 to 7.

[0041] Figure 5 is a schematic diagram showing the coaxial illumination light at the intermediate stage of the comparative example. Figure 6 is a side view of the die using the coaxial illumination light shown in Figure 5. Figure 7 is a side view of the die under ideal illumination.

[0042] As shown in Figure 5, when the inclination (θ) of the reflective surfaces of mirrors 311a and 311b is 45 degrees with respect to the upper surface of the base 313 of the intermediate stage 31, some of the coaxial illumination light reflected by mirror 311a, indicated by the dotted line, does not hit the side surface DSa of die D, but passes around die D and hits the reflective surface of mirror 311b on the opposite side from a horizontal direction. Some of the light that did not hit the side surface DSa of die D is reflected again at 45 degrees from the reflective surface of mirror 311b and heads towards the stage recognition camera 34. Note that the upper surface of the base 313 is a surface perpendicular to the optical axis of the stage recognition camera 34.

[0043] Some of the light that does not hit side DSa of die D becomes diffuse light (transmitted light or back illumination) that brightens the surroundings when observing side DSb on the opposite side of die Dsa. If sufficient light to clearly photograph the surface (side) of die D acts as diffuse light, the brightness of the diffuse light will be inversely proportional to the brightness of the surface reflected light from the surface (side) of die D, according to the reciprocal of its reflectance. Therefore, this basically results in a state of excessive light.

[0044] When photographed in this state, as shown in Figure 6, light wraps around the contour of die D, blurring the contour. Side inspection of die D is performed to check for scratches and foreign matter on the side, but it also serves to check for chipping that occurs during dicing. Due to its formation process, chipping mainly occurs on the contour of the die's side. In this case, if the wrap-around light causes blurring of the contour, it becomes difficult to detect minute chipping. For example, there is chipping within circle C shown in Figure 6, but it is not easy to recognize. When detecting chipping with coaxial illumination, it is desirable to be able to see the contour of the die D's side with uniform brightness, as shown in Figure 7. In that state, the chipping that becomes a recess within circle C can be photographed as a dark area.

[0045] The configuration of the intermediate stage in the embodiment will be explained with reference to Figures 8 and 9. Figure 8 is a diagram showing the intermediate stage in one aspect of the embodiment. Figure 9 is a diagram showing the intermediate stage in another aspect of the embodiment.

[0046] As shown in Figure 8, in the intermediate stage 31 of this embodiment, the inclination (θ) of the reflective surface of the mirror 311 is set to a predetermined angle (θp). That is, the inclination (θ) of the reflective surface is slightly shifted from 45 degrees (°) (for example, θp = 45° - Δ). Here, Δ is called the displacement angle. As a result, the reflected light that is reflected twice by the mirror 311 and heads towards the stage recognition camera 34 will have an inclination of "four times the displacement angle (Δ) of the mirror 311 relative to 45 degrees," and will not be captured by the stage recognition camera 34. The inclination of the reflective surface of the mirror 311 with respect to the optical axis is (90° - θ). Therefore, the predetermined angle with respect to the optical axis is (45° + Δ).

[0047] Furthermore, the inclination of the reflective surface of mirror 311 only needs to deviate from an angle of 45 degrees, so it can be shifted to the opposite side from Figure 8, as shown in Figure 9 (θp = 45° + δ). Also, the angle can be such that the light-emitting surface of the coaxial illumination beyond it is no longer visible, even if the image of the opposing mirror is reflected.

[0048] As shown in Figure 8, the captured images when the inclination (θ) of the reflective surface is reduced from 45 degrees will be explained using Figure 10. Figure 10 shows images of the die at the angles of the reflective surfaces of three different mirrors. In Figure 10, the case where only a pair of opposing mirrors 311a and 311b are provided is shown. The top surface of the die D, the two sides DSa and DSb of the die D, and the two sides of the base 312 are shown.

[0049] When the inclination (θ) of the reflective surfaces of mirrors 311a and 311b is 45 degrees (θ=45°), the opposing mirrors 311a and 311b appear white, except for the parts hidden by die D.

[0050] If the inclination (θ) of the reflective surfaces of mirrors 311a and 311b is tilted from 45 degrees to an angle smaller than the appropriate angle (for example, θ = 45° - Δ / 2), the opposing mirrors 311a and 311b will appear white, except for the area above die D and the area hidden by die D.

[0051] When the inclination (θ) of the reflective surfaces of mirrors 311a and 311b is appropriately tilted from 45 degrees (θ=45°-Δ=θp), the side of die D is reflected, but the opposing mirrors 311a and 311b are not reflected (they appear black).

[0052] As the inclination of the reflective surface of mirror 311 is reduced, the opposing mirror is no longer reflected. In this state, die D is reflected at an angle, and as a result, the bottom surface of die D is slightly visible.

[0053] The distance between mirror 311a and the mirror 311b facing it ("mirror-to-mirror distance") is greater than the distance between mirrors 311a and 311b and the side surface of die D facing them ("mirror-to-side distance"). Therefore, by gradually reducing the inclination of the reflective surface of mirror 311, it is possible to make the side surface of die D visible while obscuring the opposing mirror. In other words, the predetermined angle (θp) is an angle at which the side surface of die D can be photographed, and at which light passing around die D does not reach the stage recognition camera 34. The inclination of the reflective surface of mirror 311 is a means of suppressing stray light.

[0054] According to the embodiment, it has one or more of the following effects.

[0055] (1) It is possible to reduce blurring that occurs on the side contour of the die in the image due to light wrapping around the die.

[0056] (2) It is possible to stabilize and improve the accuracy of detecting chipping on the side of the die.

[0057] (3) The die bonder can improve the precision and yield of the products it assembles.

[0058] <Variation> The following are some representative examples of modifications of the embodiments. In the following descriptions of modifications, the same reference numerals as in the embodiments described above may be used for parts having the same configuration and function as those described in the embodiments described above. Furthermore, the descriptions of such parts may be appropriately referenced from the embodiments described above, to the extent that they do not contradict the technical standards. In addition, some of the embodiments described above, and all or some of the modifications, may be applied in combination as appropriate, to the extent that they do not contradict the technical standards.

[0059] (First torture) The intermediate stage 31 in the first modified example will be explained using Figures 11 to 13. Figure 11 shows the configuration of the intermediate stage and the optical path of transmitted light in the first modified example. Figure 12 is a top view of the intermediate stage shown in Figure 11. Figure 13 shows the optical path of reflected light in the intermediate stage shown in Figure 11.

[0060] As shown in Figure 11, the intermediate stage 31 in the first modified example further includes polarizing filters 314a to 314d compared to the intermediate stage 31 in the embodiment. The polarizing filters 314a to 314d are each mounted horizontally on mirrors 311a to 311d. The polarizing filters 314a to 314d are sometimes collectively referred to as polarizing filter 314. Opposing polarizing filters 314 have polarization directions that differ by 90°. It is preferable to use a non-polarizing mirror 311.

[0061] As shown in Figure 11, polarizing filters 314a and 314b have polarization directions that differ by 90°, so transmitted light that has passed through polarizing filters 314a, mirrors 311a and 311b cannot pass through polarizing filter 314b. Similarly, transmitted light that has passed through polarizing filters 314b, mirrors 311b and 311a cannot pass through polarizing filter 314a. In other words, illumination light cannot pass through both polarizing filters 314a and 314b. This prevents blurring of the die side contour in the image caused by light diffracting around the die D. Polarizing filter 314 is a means for suppressing diffracting light.

[0062] As shown in Figure 13, the reflected light that passes through the polarizing filter 314a and mirror 311a and is reflected off the right side of die D can pass through the polarizing filter 314a via mirror 311a. Similarly, the reflected light that passes through the polarizing filter 314b and mirror 311b and is reflected off the left side of die D can pass through the polarizing filter 314b via mirror 311b.

[0063] Furthermore, it is preferable that the mirror 311 be constructed from a prism. This makes it easier to install the polarizing filter 314.

[0064] (Second variation) The lighting device 35 in the second modified example will be explained using Figures 14 to 16. Figure 14 is a diagram showing the stage recognition camera, lighting device, and intermediate stage in the second modified example. Figure 15 is a diagram illustrating the illumination area of ​​the surface-emitting illumination shown in Figure 14. Figure 16 is a diagram showing the area illuminated by the illumination light of the surface-emitting illumination shown in Figure 15.

[0065] The intermediate stage 31 in the second modified example has the same configuration as the intermediate stage in the comparative example shown in Figure 5. The stage recognition camera 34 in the second modified example has the same configuration as the stage recognition camera 34 in the embodiment. The lighting device 35 in the second modified example has the same configuration as the lighting device 35 in the embodiment, except that it has a light-shielding plate.

[0066] The illumination area of ​​the surface-emitting illuminator 351 is divided for each side of the die D to be photographed. For example, as shown in Figure 15, the surface-emitting illuminator 351 is divided into four sections in a grid pattern, and illumination light is shone onto the die D from only two adjacent illumination areas out of the four areas 351a to 351d. Then, as shown in Figure 16, the areas from areas 351a to 351d that are illuminated are switched.

[0067] Of the regions 351a to 351d, the region to which illumination light is irradiated is switched by moving a light-shielding plate 353 provided on the half-mirror 352 side of the surface-emitting light illuminator 351. The light-shielding plate 353 is the irradiation suppression means. Alternatively, the surface-emitting light illuminator 351 may be composed of LEDs arranged in an array, and the illumination region may be switched by turning the LEDs on and off, or the surface-emitting light illuminator 351 may be composed of a liquid crystal or organic EL (Electro-Luminescence) display device, and the illumination region may be switched by turning it on and off. The off region of the surface-emitting light illuminator 351 is the irradiation suppression means.

[0068] When photographing the side of die D facing mirror 311a, illumination light is irradiated from regions 351a and 351d, as shown in the UPR of Figure 16.

[0069] When photographing the side of die D facing mirror 311b, illumination light is shone from regions 351b and 351c, as shown in the LWR in Figure 16.

[0070] When photographing the side of die D facing mirror 311c, illumination light is irradiated from regions 351c and 351d, as shown in the LFT in Figure 16.

[0071] When photographing the side of die D facing mirror 311d, illumination light is irradiated from regions 351a and 351b, as shown in the RGT of Figure 16.

[0072] Therefore, the four sides of die D are captured by four separate images. When capturing the top surface of die D, illumination light is irradiated from all regions 351a to 351d.

[0073] (Third variation) In the second modified example, an example was described in which the illumination area of ​​the surface-emitting illuminator 351 is divided equally into four parts. However, the division of areas 351a to 351d does not have to be equal, as long as there is a necessary area.

[0074] The illumination device 35 in the third modified example will be explained using Figure 17. Figure 17 is a diagram illustrating the illumination area of ​​the surface-emitting illumination in the third modified example. Figure 18 is a diagram showing the area to which the illumination light of the surface-emitting illumination shown in Figure 17 is irradiated.

[0075] In the third modified example, the lighting device 35 has the same configuration as the lighting device 35 in the embodiment, except for the surface-emitting light 351.

[0076] The illumination area of ​​the surface-emitting illuminator 351 is divided according to each side of the die D to be photographed. For example, as shown in Figure 17, the surface-emitting illuminator 351 is divided into four areas corresponding to each of the mirrors 311a to 311d, and areas 351e to 351h illuminate the mirrors 311a to 311d with illumination light, respectively. Then, as shown in Figure 18, the area to which the illumination light is emitted is switched among areas 351e to 351h. Note that areas 351e and 351f are not illuminated with illumination light when photographing the side, but are illuminated with illumination light when photographing the top.

[0077] When photographing the side of die D facing mirror 311a, illumination light is shone from region 351e, as shown in the UPR in Figure 18.

[0078] When photographing the side of die D facing mirror 311b, illumination light is shone from region 351f, as shown in LWR in Figure 18.

[0079] When photographing the side of die D facing mirror 311c, illumination light is shone from region 351g, as shown in the LFT in Figure 18.

[0080] When photographing the side of die D facing mirror 311d, illumination light is shone from region 351h, as shown in RGT in Figure 18.

[0081] Therefore, the four sides of die D are captured by four separate images. When capturing the top surface of die D, illumination light is irradiated from all regions 351e to 351h.

[0082] The disclosure made by the Discloser has been described in detail above based on embodiments and modifications, but it goes without saying that the disclosure is not limited to the above embodiments and modifications and can be modified in various ways.

[0083] For example, in the embodiment, an example was described in which a mirror is placed on an intermediate stage and the die is placed between the mirrors, but an intermediate stage or other stage is not necessarily required. The mirror can be placed in a position opposite the side of the die. For example, the mirror may be fixed with a support column or the like, and the die, which is fixed by a collet of a pickup head or bond head, may be transported between the mirrors to perform a side inspection.

[0084] In this embodiment, a die bonder was described in which a die is picked up from a die supply unit by a pickup head and placed on an intermediate stage, and the die placed on the intermediate stage is picked up by a bonding head and bonded to a substrate. However, it is also possible to have a system without a pickup head, in which the die from the die supply unit is picked up by a bonding head and placed on an intermediate stage, and the die placed on the intermediate stage is picked up by a bonding head and bonded to a substrate.

[0085] In this embodiment, a DAF is attached to the back surface of the wafer, but the DAF is not required.

[0086] In this embodiment, bonding is performed with the die surface facing upwards, but after picking up the die, the die may be flipped over and bonded with the die surface facing upwards. This device is called a flip-chip bonder.

[0087] In this embodiment, an example of picking up a die from a wafer in the die supply unit was described, but the die may also be picked up from a tray.

[0088] In this embodiment, a die bonder was used as an example, but it can also be applied to chip mounters (surface mount machines) that place electronic components and semiconductor chips onto a wiring board. [Explanation of Symbols]

[0089] 1. Die bonder (assembly device) 311...Mirror 34. Stage recognition camera (imaging device) 35. Lighting equipment D...Dai

Claims

1. At least one pair of mirrors installed facing each other with a die in between, An imaging device is provided such that the reflective surfaces of the die and the pair of mirrors are located within the field of view. An illumination device that irradiates illumination light along the optical axis of the imaging device, A light-reflection suppression means that prevents light that passes around the die from reaching the imaging device, among the light reflected from one of the pair of mirrors. Equipped with, The aforementioned light-reflecting means is a pair of mirrors, the reflective surfaces of which are installed at a predetermined angle greater than 45 degrees with respect to the optical axis of the imaging device. The predetermined angle is an angle at which the side surface of the die can be photographed, and at which light passing around the die does not reach the imaging device.

2. At least one pair of mirrors installed facing each other with a die in between, An imaging device is provided such that the reflective surfaces of the die and the pair of mirrors are located within the field of view. An illumination device that irradiates illumination light along the optical axis of the imaging device, A light-reflection suppression means that prevents light that passes around the die from reaching the imaging device, among the light reflected from one of the pair of mirrors. Equipped with, The aforementioned light-reflecting means is a pair of mirrors, the reflective surfaces of which are installed at a predetermined angle less than 45 degrees with respect to the optical axis of the imaging device. The predetermined angle is an angle at which the side surface of the die can be photographed, and at which light passing around the die does not reach the imaging device.

3. At least one pair of mirrors installed facing each other with a die in between, An imaging device is provided such that the reflective surfaces of the die and the pair of mirrors are located within the field of view. An illumination device that irradiates illumination light along the optical axis of the imaging device, A light-reflection suppression means that prevents light that passes around the die from reaching the imaging device, among the light reflected from one of the pair of mirrors. Equipped with, The aforementioned light-reflecting means includes a first polarizing filter provided on one of the pair of mirrors and a second polarizing filter provided on the other of the pair of mirrors. The mounting device wherein the polarization direction of the first polarizing filter is 90 degrees different from the polarization direction of the second polarizing filter.

4. In the mounting device according to any one of claims 1 to 3, The illumination light consists of light that irradiates the die and light that is reflected by the pair of mirrors and irradiates the side surface of the die. The imaging device is a mounting device capable of simultaneously imaging the top and side surfaces of the die.

5. In the mounting device according to any one of claims 1 to 3, Furthermore, it is equipped with a stage, The pair of mirrors are installed on the upper surface of the stage. The imaging device is an mounting device provided above the stage.

6. At least one pair of mirrors installed opposite each other with a die in between, An imaging device is provided such that the reflective surfaces of the die and the pair of mirrors are located within the field of view. An illumination device that irradiates illumination light along the optical axis of the imaging device, Equipped with, The lighting device has an irradiation suppression means for suppressing the light irradiated onto one of the pair of mirrors. The aforementioned lighting device includes a surface-emitting light source, The irradiation suppression means is configured to divide the irradiation area of ​​the surface-emitting illumination into multiple sections, and to irradiate one side of the die from one of the multiple irradiation areas of the surface-emitting illumination, while preventing other sides of the die from being irradiated from the other irradiation areas.

7. In the mounting apparatus of claim 6, The irradiation suppression means is a light-shielding plate, and the mounting device is configured to switch the irradiation area of ​​the surface-emitting illumination by moving the light-shielding plate.

8. In the mounting apparatus of claim 6, The illumination suppression means is the off-zone region of the surface-emitting illumination, and the mounting device is configured to switch the illumination region by changing the on-zone and off-zone regions of the surface-emitting illumination.

9. In the mounting apparatus of claim 6, The illumination light consists of light that irradiates the die and light that is reflected by the pair of mirrors and irradiates the side surface of the die. The imaging device is a mounting device capable of simultaneously imaging the top and side surfaces of the die.

10. In the mounting apparatus of claim 6, Furthermore, it is equipped with a stage, The pair of mirrors are installed on the upper surface of the stage. The imaging device is an mounting device provided above the stage.

11. A step of loading a wafer into a mounting apparatus according to any one of claims 1 to 3, The process of taking a photograph of the side surface of the die using the imaging device, A method for manufacturing a semiconductor device having [a certain feature].

12. A step of loading a wafer into the mounting apparatus of claim 6, The process of taking a photograph of the side surface of the die using the imaging device, A method for manufacturing a semiconductor device having [a certain feature].

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