Camera module

Abstract

This embodiment relates to a camera module including a first body including a lens, a second body coupled to the first body, and a substrate assembly disposed within the second body, the substrate assembly including a first substrate and a second substrate, a third substrate disposed between the first substrate and the second substrate, a fourth substrate electrically connecting the first substrate and the second substrate, a fifth substrate electrically connecting the second substrate and the third substrate, and a processor disposed on the second substrate, wherein the length of the fourth substrate is longer than the length of the fifth substrate.

Description

Technical Field

[0001] This embodiment relates to a camera module.

Background Art

[0002] In recent years, ultra-small camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, and game machines.

[0003] As automobiles become more popular, ultra-small cameras are not only used in small electronic products but also in vehicles. For example, a black box camera for vehicle protection or objective materials for traffic accidents, a rear monitoring camera that allows a driver to monitor a blind spot area at the rear of the vehicle through a screen to ensure safety when the vehicle is reversing, and a peripheral sensing camera that can monitor the periphery of the vehicle.

[0004] In recent years, since camera modules have come to output high-resolution images, the number of substrates has increased, and the size and number of elements mounted on the substrates have increased. At this time, the amount of heat generated from the substrates or the elements mounted on the substrates increases, and there is a problem with the heat dissipation structure for releasing heat to the outside as the internal temperature of the camera module rises.

[0005] In particular, a conventional camera module is designed such that the ISP processor, which generates the most heat, is located on the substrate stacked in the second layer. In this case, it is difficult to design a structure that can contact the body made of a metal material with high thermal conductivity, and there is a problem that it is impossible to do anything other than natural heat dissipation by the internal air (Air).

[0006] In addition, there is a problem of malfunction such as the camera module suddenly disappearing due to only natural heat dissipation and the rise in the internal temperature.

Summary of the Invention

Problems to be Solved by the Invention

[0007] This embodiment aims to provide a camera module with improved heat dissipation performance by changing the assembly and stacking structure of the substrate and placing the processor closer to the metal body.

[0008] Furthermore, by changing the assembly and stacking structure of the substrate, we aim to provide a camera module with a substrate structure that is advantageous for heat dissipation by bringing the processor into contact with components that have high thermal conductivity. [Means for solving the problem]

[0009] The camera module according to this embodiment includes a first body including a lens, a second body coupled to the first body, and a substrate assembly disposed within the second body, wherein the substrate assembly includes a first substrate and a second substrate, a third substrate disposed between the first substrate and the second substrate, a fourth substrate electrically connecting the first substrate and the second substrate, a fifth substrate electrically connecting the second substrate and the third substrate, and a processor disposed on the second substrate, the length of the fourth substrate may be longer than the length of the fifth substrate.

[0010] The camera module according to this embodiment includes a first body including a lens, a second body coupled to the first body, and a substrate assembly disposed within the second body, wherein the substrate assembly includes a first substrate and a second substrate, a third substrate disposed between the first substrate and the second substrate, a fourth substrate electrically connecting the first substrate and the second substrate, a fifth substrate electrically connecting the second substrate and the third substrate, and a processor disposed on the second substrate, the length of the fourth substrate in the optical axis direction may be longer than the length of the fifth substrate in the optical axis direction.

[0011] The processor can be positioned closer to the bottom plate of the second body than the first to fifth substrates.

[0012] At least a portion of the fourth substrate can overlap the second substrate in a direction perpendicular to the optical axis.

[0013] The fourth substrate can be overlapped with the fifth substrate in a direction perpendicular to the optical axis.

[0014] The third substrate may include a connector, and the second substrate may include a groove through which the connector passes.

[0015] At least a portion of the connector can overlap the second substrate in a direction perpendicular to the optical axis direction.

[0016] At least a portion of the connector may be positioned higher than the second substrate, while the other portion of the connector may be positioned lower than the second substrate.

[0017] The distance in the optical axis direction between the first substrate and the second substrate may be longer than the distance in the optical axis direction between the first substrate and the third substrate.

[0018] The second body includes a bottom plate and a side plate extending upward from the bottom plate, and includes a heat dissipation pad disposed between the processor and the bottom plate of the second body, wherein one surface of the heat dissipation pad can contact the processor and the other surface of the heat dissipation pad can contact the bottom plate of the second body.

[0019] The heat dissipation pad can be made of a thermally conductive material.

[0020] The thickness of the heat dissipation pad in the optical axis direction may be greater than the thickness of the processor in the optical axis direction.

[0021] The heat generated by the processor is transferred to the heat dissipation pad, and the heat transferred to the heat dissipation pad can be released to the outside through the bottom plate of the second body.

[0022] The width of the fourth substrate in a direction perpendicular to the optical axis direction may be smaller than the width of the fifth substrate in the direction perpendicular to the optical axis direction.

[0023] The first to third substrates may include a rigid printed circuit board, and the fourth to fifth substrates may include a flexible printed circuit board.

[0024] The camera module according to this embodiment includes a first body including a lens, a second body coupled to the first body, and a substrate assembly disposed within the second body. The substrate assembly includes a first substrate on which an image sensor is disposed, a second substrate spaced apart from the first substrate on which a processor is disposed, and a third substrate spaced apart from the first and second substrates on which a connector is disposed. The second substrate can be disposed further away from the lens than the first substrate and the third substrate.

[0025] The second substrate can be disposed at a position lower than the first and third substrates.

[0026] The third substrate is disposed between the first substrate and the third substrate, and the second substrate can include a groove through which the connector passes.

[0027] At least a part of the connector can be disposed at a position higher than the second substrate, and another part of the connector can be disposed at a position lower than the second substrate.

[0028] The distance in the optical axis direction between the first substrate and the second substrate may be longer than the distance in the optical axis direction between the first substrate and the third substrate.

[0029] It includes a fourth substrate that electrically connects the first substrate and the second substrate, and a fifth substrate that electrically connects the second substrate and the third substrate. The length of the fourth substrate in the optical axis direction may be longer than the length of the fifth substrate in the optical axis direction.

[0030] At least a part of the fourth substrate can be overlapped with the second substrate in a direction perpendicular to the optical axis direction.

Advantages of the Invention

[0031] According to this embodiment, by changing the assembled laminated structure of the substrate and arranging the processor near the body made of a metal material, the heat dissipation performance can be improved.

[0032] Also, by changing the assembled laminated structure of the substrate, the processor can be in contact with a component having a high thermal conductivity, and a substrate structure advantageous for heat dissipation can be obtained.

Brief Description of the Drawings

[0033] [Figure 1] It is a perspective view of the camera module according to this embodiment as viewed from the upper side. [Figure 2] It is a perspective view of the camera module according to this embodiment as viewed from the lower side. [Figure 3] It is an exploded perspective view of FIG. 1. [Figure 4] It is an exploded perspective view of FIG. 2. [Figure 5] It is a perspective view of the camera module according to this embodiment with the second body removed. [Figure 6] It is a front view of the camera module according to this embodiment. [Figure 7] It is a cross-sectional view taken along the line A-A of FIG. 6. [Figure 8] It is a cross-sectional view taken along the line B-B of FIG. 6. [Figure 9] It is a perspective view of the substrate assembly of the camera module according to this embodiment. [Figure 10] It is a perspective view showing the substrate assembly and the support member of the camera module according to this embodiment. [Figure 11] It is an exploded perspective view of FIG. 10. [Figure 12] It is a view showing the expanded state of the first to fifth substrates of the camera module according to this embodiment. [Figure 13] This is a diagram illustrating the spread-out state of the first to fifth substrates of the camera module according to this embodiment. [Figure 14] This is a side view of the circuit board assembly of the camera module according to this embodiment. [Figure 15] This diagram illustrates the heat dissipation path of the camera module according to this embodiment. [Modes for carrying out the invention]

[0034] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0035] However, the technical concept of the present invention is not limited to the embodiments described and can be embodied in various forms that are different from each other, and within the scope of the technical concept of the present invention, one or more components of the embodiments can be selectively combined or substituted for each other.

[0036] Furthermore, unless explicitly defined and described, terms used in the embodiments of the present invention (including technical and scientific terms) should be interpreted in a way that is generally understood by a person with ordinary skill in the art to which the present invention belongs, and terms that are commonly used, such as predefined terms, should be interpreted in consideration of their meaning in the context of the relevant art.

[0037] Furthermore, the terminology used in the embodiments of the present invention is for illustrative purposes only and is not intended to limit the invention.

[0038] In this specification, the singular form may also include the plural form unless otherwise specified in the text, and where it is written as "A and / or at least one of B, C," it may include one or more of all possible combinations of A, B, and C.

[0039] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. Such terms are solely for the purpose of distinguishing one component from another, and do not limit the essence, order, or sequence of the component in question.

[0040] Furthermore, when it is stated that one component is 'linked', 'joined', or 'connected' to another component, this includes not only cases where the component is 'linked', 'joined', or 'connected' to that other component directly, but also cases where it is 'linked', 'joined', or 'connected' by yet another component between that component and the other component.

[0041] Furthermore, when it is stated that a component is formed or positioned "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more additional components are formed or positioned between the two components. Also, when expressed as "above" or "below," the meaning can include not only an upward direction but also a downward direction relative to one component.

[0042] The term 'optical axis direction' used below can be defined as the optical axis direction of the lens. On the other hand, 'optical axis direction' can correspond to any of the following: 'up and down direction', 'vertical direction', or 'z-axis direction'.

[0043] The camera module 10 according to an embodiment of the present invention will be described in more detail below with reference to the attached drawings.

[0044] Figure 1 is a perspective view of the camera module according to this embodiment, viewed from above. Figure 2 is a perspective view of the camera module according to this embodiment, viewed from below. Figure 3 is an exploded perspective view of Figure 1. Figure 4 is an exploded perspective view of Figure 2. Figure 5 is a perspective view of the camera module according to this embodiment with the second body removed. Figure 6 is a front view of the camera module according to this embodiment. Figure 7 is a cross-sectional view of AA in Figure 6. Figure 8 is a cross-sectional view of BB in Figure 6. Figure 9 is a perspective view of the substrate assembly of the camera module according to this embodiment. Figure 10 is a perspective view illustrating the substrate assembly and support member of the camera module according to this embodiment. Figure 11 is an exploded perspective view of Figure 10. Figures 12 and 13 are diagrams illustrating the first to fifth substrates of the camera module according to this embodiment in an unfolded state. Figure 14 is a side view of the substrate assembly of the camera module according to this embodiment.

[0045] A camera module 10 according to one embodiment of the present invention may be a vehicle camera module. The camera module 10 can be coupled to a vehicle. The camera module 10 can be used as one or more of a vehicle's front camera, side camera, rear camera, and black box. The camera module 10 can be positioned at the front of the vehicle. The camera module 10 can be positioned at the rear of the vehicle. The camera module 10 can be coupled to the vehicle's windshield. The camera module 10 can be coupled to the front or rear windshield of the vehicle. The camera module 10 can be positioned on the side of the vehicle. The camera module 10 can capture a subject and output the image to a display (not shown).

[0046] The camera module 10 may include bodies 100 and 200. The bodies 100 and 200 may form the exterior of the camera module 10. The bodies 100 and 200 may be made of a metal material. The bodies 100 and 200 may be metal bodies. The bodies 100 and 200 may include a first body 100 and a second body 200.

[0047] The first body 100 can be placed on top of the second body 200. The first body 100 can be coupled to the second body 200. The first body 100 can be screw-coupled to the second body 200 by a coupling member 700.

[0048] The first body 100 may include a body portion 110. The body portion 110 may have a rectangular plate shape. The cross-sectional area of ​​the body portion 110 in the direction perpendicular to the optical axis may be larger than the cross-sectional area of ​​the second body 200 in the corresponding direction. The body portion 110 may be positioned on top of the second body 200. The body portion 110 may be coupled to the second body 200. The body portion 110 may be screw-coupled to the second body 200.

[0049] The first body 100 may include a coupling portion 120. The coupling portion 120 may protrude upward from the upper surface 110 of the body portion 110. A lens module 140, described later, may be placed on the coupling portion 120. The coupling portion 120 can be coupled to the lens module 140. The coupling portion 120 may include a hole 121. The hole 121 may be formed through the coupling portion 120, the upper surface of the body portion 110, and the lower surface 120 of the body portion 110. A threaded groove 122 may be formed on the inner circumferential surface of the hole 121. At least a portion of the inner circumferential surface of the hole 121 may include the shape of the threaded groove 122. The inner circumferential surface of the hole 121 may have a shape corresponding to the outer circumferential surface of the lens module 140. The threaded groove 122 on the inner circumferential surface of the hole 121 may have a shape corresponding to the threaded groove 141 on the outer circumferential surface of the lens module 140.

[0050] The first body 100 may include columns 130 protruding from the lower surface of the body portion 110. The columns 130 may include four columns 130. The columns 130 may be formed at positions corresponding to the four corners 230 of the second body 200. The columns 130 may be positioned in grooves 240 of the second body 200. The columns 130 may include grooves 131. The grooves 131 may be recessed from the lower end of the columns 130. A connecting member 700 may be positioned in the grooves 131. At least a portion of the connecting member 700 may be positioned in the grooves 131. The inner circumferential surface of the grooves 131 may have a shape corresponding to the outer circumferential surface shape of the connecting member 700. The inner circumferential surface of the grooves 131 may include a spiral shape. The grooves 131 can be screw-connected to the connecting member 700. This allows the first body 100 and the second body 200 to be joined.

[0051] The first body 100 may include a groove 132 formed on the lower surface of the body portion 110. A second sealing member 160, described later, can be placed in the groove 132. At least a portion of the second sealing member 160 can be placed in the groove 132. A protruding portion 161 of the second sealing member 160 can be placed in the groove 132. The groove 132 may be used to fix the second sealing member 160, which is placed in the first body 100, when assembling the first body 100 and the second body 200. The groove 132 may be formed in a rounded shape in the portion corresponding to the column 130. The groove 132 may be bent concavely in the portion corresponding to the column 130. The portion of the groove 132 facing the column 130 may have a rounded shape. The portion of the groove 132 facing the column 130 may be bent in a manner corresponding to the column 130. The rounded shape of the groove 132 may be for avoiding the column 130.

[0052] The camera module 10 may include a lens module 140. The lens module 140 may be positioned on the first body 100. The lens module 140 may be positioned on the coupling portion 120 of the first body 100. The lens module 140 may be coupled to the coupling portion 120 of the first body 100. At least a portion of the lens module 140 may be positioned within the hole 121 of the coupling portion 120. A threaded groove 141 may be formed on the outer circumferential surface of the lens module 140. The threaded groove 141 of the lens module 140 may be formed in a shape corresponding to the threaded groove 122 of the coupling portion 120. The threaded groove 141 of the lens module 140 may be formed to mutually connect with the threaded groove 122 of the coupling portion 120. The lens module 140 may include a groove 142. The groove 142 may be formed on the outer circumferential surface of the lens module 140. The groove 142 may be recessed from the outer circumferential surface of the lens module 140. The groove 142 can be formed on the outer surface of the lens module 140 at a position higher than the thread crest 141. The first sealing member 150 can be placed in the groove 142.

[0053] The lens module 140 may include lenses. The lens module 140 may include multiple lenses. The lens module 140 may include spacers placed between multiple lenses. The lens module 140 can be aligned with the image sensor 317, which will be described later. The lens module 140 can be optically aligned with the image sensor 317. The optical axis of the lens module 140 can coincide with the central axis of the image sensor 317. The first body 100 may include an infrared filter (IR filter) placed between the lens module 140 and the image sensor 317.

[0054] The camera module 10 may include a first sealing member 150. The first sealing member 150 may be an O-ring. The first sealing member 150 may be made of an elastic material. The first sealing member 150 may be placed in the groove 142 of the lens module 140. At least a portion of the first sealing member 150 may be placed in the groove 142 of the lens module 140. The first sealing member 150 may be placed between the lens module 140 and the joint 120 of the first body 100. The first sealing member 150 can fill any separation space that may occur between the lens module 140 and the joint 120 of the first body 100. This allows the lens module 140 to be firmly fixed to the joint 120 and prevents moisture from penetrating between the lens module 140 and the joint 120. The first sealing member 150 can be placed between the lens module 140 and the joint 120 to perform a waterproofing function.

[0055] The camera module 10 may include a second sealing member 160. The second sealing member 160 may be named either a gasket or a waterproof member. The second sealing member 160 may be made of an elastic material. The second sealing member 160 may be positioned between the first body 100 and the second body 200. The second sealing member 160 may be positioned in the groove 132 of the body portion 110. At least a portion of the second sealing member 160 may be positioned in the groove 132 of the body portion 110. The second sealing member 160 may be formed in a shape corresponding to the groove 132 of the body portion 110. The second sealing member 160 may be formed in a shape corresponding to the side surface of the first substrate 310. The first sealing member 160 may be positioned outside the first substrate 310. The second sealing member 160 may be positioned in any separation space that may occur between the first body 100 and the second body 200. The second sealing member 160 can be placed in the space between the first body 100 and the second body 200.

[0056] The height of the second sealing member 160 in the optical axis direction can be reduced after assembly compared to before assembly. That is, the second sealing member 160 can be positioned between the first body 100 and the second body 200 in a compressed state in the optical axis direction, thereby performing a waterproofing function. This prevents moisture from penetrating through the separation space between the first body 100 and the second body 200.

[0057] The second sealing member 160 may include a projection 161. The projection 161 may protrude upward from the upper surface of the second sealing member 160 corresponding to the first body 100. The projection 161 may protrude from at least a portion of the upper surface of the second sealing member 160. The projection 161 may be positioned in the groove 121 of the first body 100. The projection 161 may be positioned in the groove 132 of the body portion 110 and fixed to the first body 100. This prevents the second sealing member 160 from detaching from its correct position when assembling the first body 100 and the second body 200. That is, the second body 200 is assembled with the second sealing member 160 positioned in the first body 100, but the projection 161 of the second sealing member 160 is inserted into the groove 132 of the body portion 110 and does not detach from its designated position, allowing the second body 200 to be assembled. Furthermore, the groove 132 can serve to guide the position of the second sealing member 160.

[0058] The camera module 10 may include a second body 200. The second body 200 may be named a rear body, a lower housing, or a second housing. The second body 200 may be made of a metal material. The second body 200 may be a metal body. The second body 200 may be formed in a rectangular shape with an open top. The second body 200 may be positioned below the first body 100. The second body 200 may be coupled to the first body 100. The second body 200 may be screw-coupled to the first body 100. The second body 200 may be positioned below the body portion 110 of the first body 100. The second body 200 may be coupled to the body portion 110 of the first body 100. The second body 200 may form an internal space by coupling with the first body 100. A second sealing member 160 may be positioned on top of the second body 200.

[0059] The second body 200 may include a base plate 210 and side plates 220 extending from the base plate 210. The side plates 220 may extend upward from the edge of the base plate 210. The second body 200 may include a plurality of side plates 220 and corners 230 formed between the plurality of side plates 220. The second body 200 may include four side plates 220 and four corners 230 positioned between the four side plates 220.

[0060] The base plate 210 may include a hole. A connector lead-out portion 250, described later, may be placed in the hole. The connector lead-out portion 250 may pass through the hole. The diameter of the hole in the direction perpendicular to the optical axis may be the same as the diameter of the outer circumferential surface of the connector lead-out portion 250 in the corresponding direction. The diameter of the hole in the direction perpendicular to the optical axis may be larger than the diameter of the inner circumferential surface of the connector lead-out portion 250 in the corresponding direction.

[0061] The second body 200 may include a groove 240 formed on its upper surface, which connects to the first body 100. The groove 240 may be formed at positions corresponding to the four corners 230 of the second body 200. The groove 240 may overlap with the column 130 of the first body 100 in the optical axis direction. The column 130 of the first body 100 can be positioned in the groove 240. The groove 240 may include a bottom surface 241 positioned lower than the upper surface of the second body 200. The bottom surface 241 may be in contact with the lower end of the column 130. A hole 242 may be formed in the bottom surface 241. The hole 242 may overlap with the groove 131 of the column 130 of the first body 100 in the optical axis direction. A connecting member can pass through the hole 242. The inner circumferential surface of the hole 242 may be formed in a shape corresponding to the outer circumferential surface of the connecting member 700. The inner surface of the hole 242 may include a spiral shape. The connecting member 700 that passes through the hole 242 can be placed in the groove 131 of the column 130 of the first body 100.

[0062] The second body 200 may include a connector lead-out section 250. The connector lead-out section 250 may be formed in a cylindrical shape. The connector lead-out section 250 may be coupled to the second body 200. The connector lead-out section 250 may pass through a hole in the bottom plate 210 of the second body 200. The connector lead-out section 250 may be positioned within the hole in the bottom plate 210 of the second body 200. At least a portion of the connector lead-out section 250 may be positioned within the second body 200, while the remainder of the connector lead-out section 250 may be exposed to the outside of the second body 200.

[0063] The connector pull-out section 250 can be coupled to the bottom plate 210 of the second body 200. Connectors 510 and 520 can be placed inside the connector pull-out section 250. The second connector 520 can be placed inside the connector pull-out section 250. The connector pull-out section 250 may include a hole. Connectors 510 and 520 can be placed in the hole. The hole in the connector pull-out section 250 can accommodate at least a portion of the connectors 510 and 520. This allows the connector pull-out section 250 to secure the connectors 510 and 520.

[0064] The camera module 10 may include a substrate assembly 300. The substrate assembly 300 may be placed inside the second body 200. The substrate assembly 300 may be placed in the internal space formed by the joining of the first body 100 and the second body 200.

[0065] The substrate assembly 300 may include a first substrate 310. The first substrate 310 may include a printed circuit board. The first substrate 310 may include a rigid printed circuit board. An image sensor 311 may be placed on the first substrate 310. In this case, the first substrate 310 may be named a sensor substrate.

[0066] The first substrate 310 may include a first surface 311 facing the first body 100 and a second surface 312 located on the opposite side of the first surface 311. The image sensor 317 may be located on the first surface of the first substrate 310. The first substrate 310 can be coupled to the first body 100. The first surface 311 of the first substrate 310 can be coupled to the first body 100. The first substrate 310 may include a first side surface 313 and a second side surface 314, a third side surface 315 located on the opposite side of the first side surface 313, and a fourth side surface 316 located on the opposite side of the second side surface 314.

[0067] The first substrate 310 can be placed on the third substrate 330. The first substrate 310 can be separated from the third substrate 330 in the optical axis direction. The first substrate 310 can be separated from the third substrate 330 by the first support member 410. The second surface 312 of the first substrate 310 can face the third substrate 330. The second surface 312 of the first substrate 310 can face the first surface 331 of the third substrate 330. The first substrate 310 can be separated from the second substrate 320 in the optical axis direction. The separation distance in the optical axis direction between the first substrate 310 and the third substrate 330 may be smaller than the separation distance in the optical axis direction between the first substrate 310 and the second substrate 320.

[0068] The first substrate 310 can be connected to the second substrate 320. At least a portion of the first substrate 310 can be connected to the second substrate 320. The first substrate 310 can be electrically connected to the second substrate 320. The first substrate 310 can be electrically connected to the second substrate 320 by the fourth substrate 340, which will be described later. The first substrate 310 can be connected to the second substrate 320 and the fourth substrate 340.

[0069] The first substrate 310 can be connected to the fourth substrate 340. At least a portion of the first substrate 310 can be connected to the fourth substrate 340. The first substrate 310 can be electrically connected to the fourth substrate 340. One end of the fourth substrate 340 can be positioned on the first side surface 313 of the first substrate 310. The first side surface 313 of the first substrate 310 can be coupled to one end of the fourth substrate 340.

[0070] The board assembly 300 may include a second board 320. The second board 320 may include a printed circuit board. The second board 320 may include a rigid printed circuit board. The second board 320 may be named an ISP (Image Sensor Processor) board. The second board 320 may be placed below the third board 330, which will be described later. The second board 320 may be placed closer to the bottom plate 210 of the second body 200 than the first board 310 and the third board 330. The second board 320 may be spaced apart from the first board 310. The second board 320 may be spaced apart from the third board 330 in the optical axis direction. The separation distance in the optical axis direction between the second board 320 and the first board 310 may be greater than the separation distance in the optical axis direction between the second board 320 and the third board 330. The second board 320 may be placed parallel to the first board 310. The second substrate 320 can be arranged parallel to the third substrate 330, which will be described later. The second substrate 320 can be spaced apart from the bottom plate 210 of the second body 200 in the optical axis direction. The second substrate 320 may include a first surface 321 facing the third substrate 330 and a second surface 322 positioned on the opposite side of the first surface 321. The first surface 321 of the second substrate 320 may face the second surface 332 of the third substrate 330. The second surface 322 of the second substrate 320 may face the bottom plate 210 of the second body 200. A processor 328 can be arranged on the second surface 322 of the second substrate 320.

[0071] The second substrate 320 includes a first side surface 323, a second side surface 324, a third side surface 325 located on the opposite side of the first side surface 323, and a fourth side surface 326 located on the opposite side of the third side surface 324.

[0072] The second substrate 320 may include a groove 327. The groove 327 may be recessed inward from the side surface of the second substrate 320. The groove 327 may be recessed from at least a portion of the first side surface 321 of the second substrate 320. The groove 327 may be recessed from at least a portion of the fourth side surface 326 of the second substrate 320. The groove 327 may include a rounded shape in at least a portion of it. A connector 500 may be placed in the groove 327. The connector 500 may pass through the groove 327. The groove 327 may overlap the connector 500 in a direction perpendicular to the optical axis direction. The groove 327 does not have to overlap the first connector 510 of the connector 500 in a direction perpendicular to the optical axis direction. The groove 327 may overlap the second connector 520 of the connector 500 in a direction perpendicular to the optical axis direction. The groove 327 may be spaced apart from the connector 500. The groove 327 can be formed to avoid the connector 500. This allows the connector 500 to be positioned on the third substrate 330, which is located between the first substrate 310 and the second substrate 320.

[0073] The second board 320 may include a processor 328. The processor 328 may be an ISP (Image Sensor Processor) element. The processor 328 may be an element that converts the RGB signals (Red, green, blue signals) of the image sensor 317 into signals that can be seen with the naked eye. The processor 328 may be an element that converts the raw Bayer pattern signals of the image sensor 317 into signals that can be seen with the naked eye.

[0074] The processor 328 can be placed on the second substrate 320. The processor 328 can be placed on the second surface 322 of the second substrate 320. The processor 328 can be placed between the second surface 322 of the second substrate 320 and the bottom plate 210 of the second body 200. The processor 328 can face the bottom plate 210 of the second body 200. The processor 328 can be spaced apart from the bottom plate 210 of the second body 200 in the optical axis direction. A heat dissipation pad 329, described later, can be placed on the processor 328. The processor 328 can dissipate as much heat as the camera module 10 outputs a high-resolution image.

[0075] The second substrate 320 can be connected to the first substrate 310. The second substrate 320 can be electrically connected to the first substrate 310. The second substrate 320 can be electrically connected to the first substrate 310 by the fourth substrate 340. The second substrate 320 can be connected to the third substrate 330. The second substrate 320 can be electrically connected to the third substrate 330 by the fifth substrate 350, which will be described later.

[0076] The board assembly 300 may include a third board 330. The third board 330 may include a printed circuit board. The third board 330 may include a rigid printed circuit board. The third board 330 may be a serializer PCB. The third board 330 can convert the current supplied via the connector 500 into a stable current. The third board 330 can convert the current supplied via the connector 500 into a stable current value and supply it to the second board 320. The third board 330 can convert the current supplied via the connector 500 into a stable current value and supply it to the processor 328. The third board 330 can convert the current supplied via the connector 500 into a stable current value and supply it to the first board 310. The third board 330 can convert the current supplied via the connector 500 into a stable current value and supply it to the image sensor 317. Although the current value supplied by the vehicle via the connector 500 differs from the current value required by components such as the second circuit board 320 and the processor 328, the third circuit board 330 can convert the current supplied via the connector 500 into the current value required by the components such as the second circuit board 320 and the processor 328 and supply it to those components.

[0077] The third substrate 300 may include a first surface 331 and a second surface 332 located opposite the second surface 331. The third substrate 300 may also include a first side surface 333 and a second side surface 334, a third side surface 335 located opposite the first side surface 333, and a fourth side surface 336 located opposite the second side surface 334.

[0078] The third substrate 330 can be placed below the first substrate 310. The third substrate 330 can be placed on top of the second substrate. The third substrate 330 can be placed between the first substrate 310 and the third substrate 330. The third substrate 330 can be placed parallel to the first substrate 310. The third substrate 330 can be placed parallel to the second substrate 320. The first surface 331 of the third substrate 330 can face the first substrate 310. The first surface 331 of the third substrate 330 can face the second surface 312 of the first substrate 310. The second surface 332 of the third substrate 330 can face the second substrate 320. The second surface 332 of the third substrate 330 can face the second surface 321 of the second substrate 320.

[0079] The third board 330 can be electrically connected to the connector 500. The connector 500 can be placed on the second board 330. The connector 500 can be placed on the second surface 332 of the third board 330. The first connector 510 can be placed on the second surface 332 of the third board 330. The third board 330 can be electrically connected to the first connector 510. As a result, the third board 330 can receive current from the connector 500. As a result, the third board 330 can supply current to the second board 320.

[0080] The third substrate 330 can be connected to the fifth substrate 350, which will be described later. The third substrate 330 can be electrically connected to the fifth substrate 350. One end of the fifth substrate 350 can be positioned on the third side surface 335 of the third substrate 330. The third side surface 335 of the third substrate 330 can be coupled to one end of the fourth substrate 340.

[0081] The substrate assembly 300 may include a fourth substrate 340. The fourth substrate 340 may be a flexible printed circuit board (FPCB). The fourth substrate 340 may be formed of an elastic material. The fourth substrate 340 may be electrically connected to the first substrate 310. The fourth substrate 340 may be electrically connected to the second substrate 320. The fourth substrate 340 may electrically couple the first substrate 310 and the second substrate 320. One end of the fourth substrate 340 may be coupled to the first substrate 310. One end of the fourth substrate 340 may be coupled to the first side surface 313 of the first substrate 310. The other end of the fourth substrate 340 may be coupled to the second substrate 320.

[0082] The other end of the fourth substrate 340 can be coupled to the first side surface 323 of the second substrate 320. The length of the fourth substrate 340 in the optical axis direction may be longer than the length of the fifth substrate 350 in the corresponding direction, as described later. At least a portion of the fourth substrate 340 can overlap with the third substrate 330 in a direction perpendicular to the optical axis direction. The width of the fourth substrate 340 in the direction perpendicular to the optical axis direction may be smaller than the width of the fifth substrate 350 in the corresponding direction. At least a portion of the fourth substrate 340 can overlap with the fifth substrate 350 in a direction perpendicular to the optical axis direction.

[0083] The board assembly 300 may include a fifth board 350. The fifth board 350 may include a flexible printed circuit board (FPCB).

[0084] The fifth substrate 350 can be formed from an elastic material. The fifth substrate 350 can be electrically connected to the second substrate 320. The fifth substrate 350 can be electrically connected to the third substrate 330. The fifth substrate 350 can electrically connect the second substrate 320 and the third substrate 330. One end of the fifth substrate 350 can be connected to the third substrate 330. One end of the fifth substrate 350 can be connected to the third side surface 335 of the third substrate 330. The other end of the fifth substrate 345 can be connected to the second substrate 320. The other end of the fifth substrate 350 can be connected to the third side surface 325 of the second substrate 320.

[0085] The length of the fifth substrate 350 in the optical axis direction may be longer than the length of the fourth substrate 340 in the corresponding direction. The fifth substrate 350 does not have to overlap the first substrate 310 in the direction perpendicular to the optical axis direction. The width of the fifth substrate 350 in the direction perpendicular to the optical axis direction may be smaller than the width of the fourth substrate 340 in the corresponding direction.

[0086] The camera module 10 may include a heat dissipation pad 329. The heat dissipation pad 329 may be placed on the processor 328. The heat dissipation pad 329 may face the bottom plate 210 of the second body 200. The heat dissipation pad 329 may be in contact with the bottom plate 210 of the second body 200. The heat dissipation pad 329 may be made of a thermally conductive material. The heat dissipation pad 329 may transfer heat emitted from the processor 328 to the second body 200. The heat dissipation pad 329 may transfer heat emitted from the processor 328 to the bottom plate 210 of the second body 200. As a result, the heat generated in the processor 328 is transferred to the second body 200, which is made of metal, via the heat dissipation pad 329, and the heat transferred to the second body 200 can be released to the outside. The heat dissipation pad 329 may be made of a material with a higher thermal conductivity than the internal temperature of the bodies 100 and 200. In other words, the camera module 10 according to this embodiment can dissipate heat even if the processor 328 generates a large amount of heat by changing or replacing the heat dissipation pad 329. The thickness of the heat dissipation pad 329 in the optical axis direction may be thicker than the thickness of the processor 329 in the optical axis direction.

[0087] The camera module 10 may include a support member 400. The support member 400 may be referred to as a shielding can, a shielding member, or a spacer. The support member 400 may be made of a metal material. The support member 400 may be placed inside the bodies 100 and 200. The support member 400 may be placed inside the second body 200. The support member 400 may include a plurality of support members 410 and 420. In this embodiment, an example is given where there are two plurality of support members 410 and 420, but this is not limited to this and can be varied in various ways depending on the number of substrates. The support member 400 can be placed between a plurality of substrates to separate the plurality of substrates in the optical axis direction. The support member 400 can be placed between a plurality of substrates to support the plurality of substrates. The support member 400 can perform an electromagnetic wave shielding function.

[0088] The support member 400 may include a first support member 410. The first support member 410 may be positioned below the first substrate 310. The first support member 410 may be positioned above the third substrate 330. The first support member 410 may be positioned between the first substrate 310 and the third substrate 330. The upper end of the first support member 410 may be in contact with the first substrate 310. The upper end of the first support member 410 may be in contact with the second surface 312 of the first substrate 310. The lower end of the first support member 410 may be in contact with the third substrate 330. The lower end of the first support member 410 may be in contact with the first surface 331 of the third substrate 330. At least a portion of the first support member 410 may overlap with the second support member 420, which will be described later, in a direction perpendicular to the optical axis.

[0089] The support member 400 may include a second support member 420. The second support member 420 may be positioned on the second substrate 320. The second support member 420 may be positioned below the third substrate 330. The second support member 420 may be positioned between the third substrate 330 and the second substrate 320. The upper end of the second support member 420 may be in contact with the third substrate 330. The upper end of the second support member 420 may be in contact with the second surface 332 of the third substrate 330. The lower end of the second support member 420 may be in contact with the second substrate 320. The lower end of the second support member 420 may be in contact with the second surface 332 of the second substrate 320. At least a portion of the second support member 420 may overlap with the first support member 410, which will be described later, in a direction perpendicular to the optical axis.

[0090] The camera module 10 may include a connector 500. The connector 500 may be located within the bodies 100 and 200. The connector 500 may be located within the second body 200. The connector 500 can electrically connect a cable (not shown) to the third board 330. The connector 500 may include a first connector 510 electrically connected to the third board 330, and a second connector 520 electrically connecting the first connector 510 to the cable. The first connector 510 may be located on the third board 330. The first connector 510 may be located on the second surface 332 of the third board 330. The first connector 510 can be electrically connected to the third board 330. At least a portion of the connector 500 may be located higher than the second board 320. The other portion of the connector 500 may be located lower than the second board 320.

[0091] The first connector 510 can be positioned between the second substrate 320 and the third substrate 330. The first connector 510 can be spaced apart from the second substrate 320 in the optical axis direction. The first connector 510 can be positioned closer to the third substrate 330 than to the second substrate 320. At least a portion of the first connector 510 can overlap with the fourth substrate 340 in a direction perpendicular to the optical axis direction. The first connector 510 can overlap with the fifth substrate 350 in a direction perpendicular to the optical axis direction. A grounding member 530, described later, can be positioned on the first connector 510. The first connector 510 can be formed integrally with the grounding member 530.

[0092] The second connector 520 can be electrically connected to the first connector 510. The second connector 520 can be electrically connected to a cable. The second connector 520 can be located within the connector lead-out portion 250 of the second body 200. At least a portion of the second connector 520 can be located within the connector lead-out portion 250 of the second body 200, and the remainder of the second connector 520 can be located within the second body 200. The second connector 520 can pass through the groove 327 of the second substrate 320. A portion of the second connector 520 can be located between the second substrate 320 and the third substrate 330, and the remainder of the second connector 520 can be located lower than the second substrate 320. The second connector 520 can be formed integrally with the grounding member 530.

[0093] The connector 500 may include a grounding member 530. The grounding member 530 may include a washer. The grounding member 530 may be formed integrally with the connector 500. The grounding member 530 may be coupled to the first connector 510. At least a portion of the second connector 520 may be disposed inside the grounding member 530. One end of the grounding member 530 may be coupled to the first connector 510. The grounding member 530 may be grounded to the third substrate 330.

[0094] The camera module 10 may include a third sealing member 600. The third sealing member 600 may be a waterproof member. The third sealing member 600 may be made of an elastic material. The third sealing member 600 may be spaced apart from the grounding member 530 in the optical axis direction. The third sealing member 600 may be positioned lower than the second substrate 320. The third sealing member 600 may be positioned on the second connector 520. The third sealing member 600 may be positioned inside the second body 200. The third sealing member 600 may be positioned inside the connector outlet portion 250 of the second body 200. This prevents moisture from penetrating between the second body 200 and the connector 500.

[0095] The camera module 10 may include a coupling member 700. The coupling member 700 can connect the first body 100 and the second body 200. The coupling member 700 can screw-connect the first body 100 and the second body 200. The coupling member 700 may include screws. The coupling member 700 may have a screw thread formed on its outer surface. The coupling member 700 can be coupled to the hole 242 of the second body 200. The coupling member 700 can pass through the hole 242 of the second body 200. The coupling member 700 that has passed through the hole 242 of the second body 200 can be positioned in the groove 131 of the column 130 of the first body 100. In this way, the coupling member 700 can connect the first body 100 and the second body 200.

[0096] In the following section, the heat dissipation path of the camera module 10 according to this embodiment will be described in detail with reference to the drawings.

[0097] Figure 15 is a diagram illustrating the heat dissipation path of the camera module according to this embodiment.

[0098] In recent years, as camera modules have started outputting high-resolution video, the number of circuit boards has increased, and consequently, the size and number of components mounted on those boards have also increased. At this time, the amount of heat generated from the circuit boards or the components mounted on them has increased, causing the internal temperature of the camera module to rise, and there are issues regarding the heat dissipation structure that releases this heat to the outside.

[0099] Referring to Figure 15, the heat generated from the processor 328 is transferred to the heat dissipation pad 329, and the heat transferred to the heat dissipation pad 329 is transferred to the second body 200 made of metal material and can be released to the outside. This allows the heat inside the bodies 100 and 200 to be released to the outside and the temperature to be lowered. In a modified example, the camera module 10 does not need to include the heat dissipation pad 329. In this case, the heat generated from the processor 328 can be transferred to the second body 200 and released to the outside.

[0100] In this embodiment, the camera module 10 can be designed so that the heat-generating processor 328 is positioned adjacent to the bottom plate 210 of the second body 200 by changing the assembly structure of the circuit boards 310, 320, and 330. Furthermore, by changing the assembly structure of the circuit boards 310, 320, and 330, a component such as a heat dissipation pad 329 with high thermal conductivity can be brought into contact with the circuit boards to create a structure advantageous for heat dissipation. Additionally, the heat dissipation performance can be improved by changing the area, thickness, and material of the heat dissipation pad 329.

[0101] While embodiments of the present invention have been described above with reference to the attached drawings, those with ordinary skill in the art to which the present invention pertains should understand that the present invention can be implemented in other specific forms without altering its technical idea or essential features. Therefore, the embodiments described above should be understood to be illustrative and not limiting in all respects.

Claims

1. The first body, including the lens, A second body which connects to the first body, The second body includes a substrate assembly disposed within the second body, The aforementioned substrate assembly is A first substrate and a second substrate stacked in the optical axis direction, A third substrate is disposed between the first substrate and the second substrate, A fourth substrate connecting the first substrate and the second substrate, A fifth substrate connecting the second substrate and the third substrate, The second substrate includes a processor, The aforementioned second substrate is It includes a first side surface, a second side surface adjacent to the first side surface, a third side surface located on the opposite side of the first side surface, a fourth side surface located on the opposite side of the second side surface, and grooves formed inward from the first side surface and the second side surface. The first side surface of the second substrate is coupled to the fourth substrate. The third side of the second substrate is coupled to the fifth substrate. Of the region of the first side surface of the second substrate, at least a portion of the region in contact with the fourth substrate overlaps the groove of the second substrate in a first direction perpendicular to the optical axis. The length of the fourth substrate in the optical axis direction is longer than the length of the fifth substrate in the optical axis direction. The width of the fourth substrate in a second direction perpendicular to the optical axis and perpendicular to the first direction is smaller than the width of the fifth substrate in the second direction. The third substrate further includes a connector, The connector is a camera module that penetrates the groove of the second substrate.

2. The camera module according to claim 1, wherein the processor is positioned closer to the bottom plate of the second body than the first to fifth substrates.

3. The camera module according to claim 1 or 2, wherein at least a portion of the fourth substrate overlaps with the second substrate in a direction perpendicular to the optical axis direction.

4. The camera module according to any one of claims 1 to 3, wherein the fourth substrate overlaps the fifth substrate in a direction perpendicular to the optical axis direction.

5. The camera module according to claim 1, wherein at least a portion of the connector overlaps with the second substrate in a direction perpendicular to the optical axis direction.

6. At least a portion of the connector is positioned higher than the second substrate, The camera module according to claim 1, wherein the other part of the connector is positioned lower than the second substrate.

7. The camera module according to any one of claims 1 to 6, wherein the distance in the optical axis direction between the first substrate and the second substrate is longer than the distance in the optical axis direction between the first substrate and the third substrate.

8. The second body includes a bottom plate and side plates extending upward from the bottom plate. Includes a heat dissipation pad disposed between the processor and the bottom plate of the second body, One surface of the heat dissipation pad is in contact with the processor, The other side of the heat dissipation pad is in contact with the bottom plate of the second body, as described in any one of claims 1 to 7, for the camera module.

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