Heat pump device

Abstract

This disclosure provides a heat pump device capable of cooling a control board by selectively utilizing a heat source fluid or a utilization fluid. [Solution] The heat pump device 1 comprises a refrigerant circuit 11, a heat source line 12, a utilization line 13, a first cooling line 121, a second cooling line 131, and a control unit 15. The heat source line 12 allows the heat source fluid Fh to pass through the first heat exchanger 112 of the refrigerant circuit 11. The utilization line 13 allows the utilization fluid Fu to pass through the second heat exchanger 114 of the refrigerant circuit 11. The first cooling line 121 branches off from the heat source line 12. The second cooling line 131 branches off from the utilization line 13. The control unit 15 includes a control board 151 that controls the refrigerant circuit 11. The first cooling line 121 or the second cooling line 131 has a cooling section CP that cools the control board 151.

Description

Technical Field

[0001] The present disclosure relates to a heat pump device.

Background Art

[0002] Conventionally, a heat pump type air conditioner that cools a switching power element using cooling water has been known (for example, see Patent Document 1). The air conditioner described in Patent Document 1 includes a heat pump type cycle, an auxiliary heat source and a cooling tower, a heat exchange unit, and an element heat exchange unit.

[0003] The heat pump type cycle has a configuration in which an inverter-equipped compressor, a four-way valve, a non-use-side water heat exchanger, an electric expansion valve, and a use-side indoor heat exchanger are connected respectively. The auxiliary heat source and the cooling tower are connected to the water heat exchanger as a heat source via a connection pipe. The heat exchange unit is provided in a part of the connection pipe. The element heat exchange unit is in close contact with the heat exchange unit of the connection pipe, and a switching power element for an inverter is mounted thereon.

[0004] The air conditioner described in Patent Document 1 exchanges heat between the heat source water after heat exchange in the water heat exchanger or the heat source water before heat exchange and the heat generated by the switching power element with the above-described configuration.

Prior Art Documents

Patent Documents

[0005] ​​​​​​​​​​​​​The air conditioner described in Patent Document 1 above cools the switching power elements for the compressor inverter using heat source water that exchanges heat with the refrigerant in the non-utilized water heat exchanger. On the other hand, this conventional air conditioner cannot use the utilized water that exchanges heat with the refrigerant in the utilized indoor heat exchanger to cool the switching power elements.

[0007] This disclosure provides a heat pump device capable of cooling a control board by selectively utilizing a heat source fluid or a utilization fluid. [Means for solving the problem]

[0008] The first aspect of this disclosure includes a refrigerant circuit (11) that performs a refrigeration cycle, comprising a compressor (111) for compressing a refrigerant (Fr), a first heat exchanger (112) for exchanging heat between the refrigerant (Fr) and a heat source fluid (Fh), a pressure reducing mechanism (113) for reducing the pressure of the refrigerant (Fr), and a second heat exchanger (114) for exchanging heat between the refrigerant (Fr) and a work fluid (Fu); a heat source pipeline (12) for passing the heat source fluid (Fh) through the first heat exchanger (112); and the second heat exchanger (1 The present invention provides a heat pump device (1) comprising: a utilization line (13) through which the utilization fluid (Fu) passes; a first cooling line (121) branched from the heat source line (12); a second cooling line (131) branched from the utilization line (13); and a control unit (15) including a control board (151) for controlling the refrigerant circuit (11), wherein the first cooling line (121) or the second cooling line (131) has a cooling section (CP) for cooling the control board (151).

[0009] According to the first aspect described above, a heat pump device (1) capable of cooling a control board (151) by selectively utilizing a heat source fluid (Fh) or a utilization fluid (Fu) can be provided.

[0010] A second aspect of this disclosure is the heat pump device (1) according to the first aspect, wherein the cooling section (CP) includes a heat transfer member (HT) in contact with the first cooling line (121) or the second cooling line (131).

[0011] From the second point of view described above, by bringing the heat transfer member (HT) of the first cooling pipe (121) or the second cooling pipe (131) into contact with the control board (151), the control board (151) can be cooled via the heat transfer member (HT). Furthermore, by cooling the heat transfer member (HT) with the heat source fluid (Fh) or utilization fluid (Fu) passing through the first cooling pipe (121) or the second cooling pipe (131), the control board (151) can be efficiently cooled by selectively utilizing the heat source fluid (Fh) or utilization fluid (Fu).

[0012] A third aspect of this disclosure is the heat pump device (1) according to the second aspect, wherein the first cooling pipe (121) branches off from the heat source pipe (12) upstream of the first heat exchanger (112) in the flow direction of the heat source fluid (Fh) and allows the heat source fluid (Fh) to pass through the heat transfer member (HT).

[0013] From the third point of view described above, the heat source fluid (Fh) in the first heat exchanger (112) of the refrigerant circuit (11) can be passed through the heat transfer member (HT) before it exchanges heat with the refrigerant (Fr). This allows the heat transfer member (HT) to be cooled to a temperature suitable for cooling the control board (151) by the heat source fluid (Fh). Therefore, the heat source fluid (Fh) can be selectively used to cool the control board (151) to an appropriate temperature via the heat transfer member (HT).

[0014] A fourth aspect of this disclosure is the heat pump device (1) according to the second or third aspect described above, wherein the first cooling pipe (121) branches off from the heat source pipe (12) downstream of the first heat exchanger (112) in the flow direction of the heat source fluid (Fh) and allows the heat source fluid (Fh) to pass through the heat transfer member (HT).

[0015] From the fourth point of view described above, the heat source fluid (Fh) that has exchanged heat with the refrigerant (Fr) in the first heat exchanger (112) of the refrigerant circuit (11) can be passed through the heat transfer member (HT). This allows the heat transfer member (HT) to be cooled to a temperature suitable for cooling the control board (151) by the heat source fluid (Fh). Therefore, the heat source fluid (Fh) can be selectively used to cool the control board (151) to an appropriate temperature via the heat transfer member (HT).

[0016] A fifth aspect of this disclosure is the heat pump device (1) according to any one of the second to fourth aspects described above, wherein the second cooling line (131) branches off from the utilization line (13) upstream of the second heat exchanger (114) in the flow direction of the utilization fluid (Fu) and allows the utilization fluid (Fu) to pass through the heat transfer member (HT).

[0017] From the fifth point of view described above, the utilization fluid (Fu) in the second heat exchanger (114) of the refrigerant circuit (11) can be passed through the heat transfer member (HT) before it exchanges heat with the refrigerant (Fr). This allows the heat transfer member (HT) to be cooled to a temperature suitable for cooling the control board (151) by the utilization fluid (Fu). Therefore, the utilization fluid (Fu) can be selectively used to cool the control board (151) to an appropriate temperature via the heat transfer member (HT).

[0018] A sixth aspect of this disclosure is a heat pump device (1) according to any one of the second to fifth aspects described above, comprising a third heat exchanger (HEX) for heat exchange between the heat source fluid (Fh) and the utilization fluid (Fu), wherein the first cooling pipe (121) branches off from the heat source pipe (12) downstream of the first heat exchanger (112) in the flow direction of the heat source fluid (Fh) and passes the heat source fluid (Fh) sequentially through the third heat exchanger (HEX) and the heat transfer member (HT), and the second cooling pipe (131) branches off from the utilization pipe (13) upstream of the second heat exchanger (114) in the flow direction of the utilization fluid (Fu) and passes the utilization fluid (Fu) through the third heat exchanger (HEX).

[0019] From the sixth point of view described above, the control board (151) can be cooled to an appropriate temperature by utilizing both the heat source fluid (Fh) and the utilization fluid (Fu). Specifically, the heat source fluid (Fh) after heat exchange with the refrigerant (Fr) in the first heat exchanger (112) and the utilization fluid (Fu) before heat exchange with the refrigerant (Fr) in the second heat exchanger (114) exchange heat in the third heat exchanger (HEX). As a result, the utilization fluid (Fu) before passing through the second heat exchanger (114) can be used to adjust the heat source fluid (Fh) that has passed through the first heat exchanger (112) to a temperature suitable for cooling the heat transfer member (HT) before it passes through the heat transfer member (HT). Therefore, the control board (151) can be cooled to an appropriate temperature via the heat transfer member (HT) by utilizing both the heat source fluid (Fh) and the utilization fluid (Fu).

[0020] A seventh aspect of this disclosure is a heat pump device (1) according to any one of the second to sixth aspects described above, wherein the refrigerant circuit (11) includes a switching mechanism (116) that can switch between a cooling operation in which the flow direction of the refrigerant (Fr) is switched to cause the second heat exchanger (114) to function as an evaporator and a heating operation in which the second heat exchanger (114) to function as a heat radiator, and the control unit (15) controls the switching mechanism (116) to switch between the cooling operation and the heating operation.

[0021] From the perspective of the seventh point described above, the control board (151) can be efficiently cooled by selectively using a heat source fluid (Fh) or a utilization fluid (Fu) with different temperatures during cooling operation and heating operation of the refrigerant circuit (11).

[0022] The eighth aspect of this disclosure is that, in the heat pump device (1) of the seventh aspect described above, the control unit (15) is configured to communicate with a control device (6) that controls the temperature of the heat source fluid (Fh) in a heat source circuit (2) that circulates the heat source fluid (Fh) to the first heat exchanger (112) via the heat source pipeline (12), and transmits the required temperature of the heat source fluid (Fh) to the control device (6) of the heat source circuit (2) according to the temperature of the control board (151) and the load of the second heat exchanger (114) that exchanges heat between the refrigerant (Fr) and the utilization fluid (Fu) in the refrigerant circuit (11).

[0023] According to the eighth aspect described above, by transmitting a temperature request from the control unit (15) to the control device (6) of the heat source circuit (2) according to the temperature of the control board (151) and the load of the second heat exchanger (114), the heat source fluid (Fh) can be maintained at a temperature suitable for cooling the control board (151). Therefore, the control board (151) can be cooled to an appropriate temperature using the heat source fluid (Fh). In addition, it is possible to suppress the heat source fluid (Fh) from becoming too low in temperature and suppress dew condensation in the heat transfer member (HT).

[0024] A ninth aspect of the present disclosure is that the heat pump device (1) of the seventh aspect further includes a heat source control valve (Vh) provided in the first cooling pipeline (121) and capable of adjusting the flow rate of the heat source fluid (Fh) passing through the heat transfer member (HT), and the control unit (15) controls the heat source control valve (Vh) according to the temperature of the control board (151) and the temperature of the heat source fluid (Fh) supplied to the heat source pipeline (12).

[0025] According to the ninth aspect described above, the control unit (15) controls the heat source control valve (Vh) to allow a heat source fluid (Fh) with an appropriate flow rate according to the temperature of the control board (151) and the temperature of the heat source fluid (Fh) to pass through the heat transfer member (HT). As a result, it becomes possible to cool the control board (151) to a more appropriate temperature.

[0026] A tenth aspect of the present disclosure is that the heat pump device (1) of the seventh aspect further includes a utilization control valve (Vu) provided in the second cooling pipeline (131) and capable of adjusting the flow rate of the utilization fluid (Fu) passing through the heat transfer member (HT), and the control unit (15) controls the utilization control valve (Vu) according to the temperature of the control board (151), the temperature of the heat source fluid (Fh) supplied to the heat source pipeline (12), and the temperature of the utilization fluid (Fu) upstream of the second heat exchanger (114) in the flow direction of the utilization fluid (Fu).

[0027] According to the tenth aspect described above, the control unit (15) controls the utilization control valve (Vu) to allow the utilization fluid (Fu) with an appropriate flow rate corresponding to the temperature of the control board (151), the temperature of the heat source fluid (Fh), and the temperature of the utilization fluid (Fu) to pass through the heat transfer member (HT). Thereby, it becomes possible to cool the control board (151) to a more appropriate temperature.

[0028] The eleventh aspect of the present disclosure is that in the heat pump device (1) according to any one of the first to tenth aspects described above, the refrigerant (Fr) is a flammable refrigerant.

[0029] According to the eleventh aspect described above, in the event of a refrigerant (Fr) leakage from the refrigerant circuit (11), the safety of the heat pump device (1) can be improved. Specifically, the heat pump device (1) cools the control board (151) by the cooling part (CP) of the first cooling pipe (121) through which the heat source fluid (Fh) passes or the second cooling pipe (131) through which the utilization fluid (Fu) passes. Therefore, it is not necessary to use the refrigerant (Fr) circulating in the refrigerant circuit (11) for cooling the control board (151), and each part of the refrigerant circuit (11) and the control board (151) can be arranged separately. Therefore, even if the refrigerant (Fr), which is a flammable refrigerant, leaks from the refrigerant circuit (11), the contact between the electrical connection part of the control board (151) and the refrigerant (Fr) can be avoided, and the safety of the heat pump device (1) can be improved.

Brief Description of the Drawings

[0030] [Figure 1] Circuit diagram showing Embodiment 1 of the heat pump device (1) according to the present disclosure. [Figure 2] Circuit diagram for explaining the characteristic part of the heat pump device (1) in FIG. 1. [Figure 3] Block diagram for explaining the control unit (15) of the heat pump device (1) in FIG. 1. [Figure 4] Circuit diagram showing Embodiment 2 of the heat pump device (1) according to the present disclosure. [Figure 5] Circuit diagram showing Embodiment 3 of the heat pump device (1) according to the present disclosure. [Figure 6] A circuit diagram showing Embodiment 4 of the heat pump device (1) according to this disclosure. [Modes for carrying out the invention]

[0031] Hereinafter, an embodiment of the heat pump device (1) according to this disclosure will be described with reference to the drawings.

[0032] (Embodiment 1) Figure 1 is a circuit diagram showing Embodiment 1 of the heat pump device (1) according to the present disclosure. Figure 2 is a circuit diagram illustrating the characteristic parts of the heat pump device 1 according to this embodiment. Figure 3 is a block diagram illustrating the control unit 15 of the heat pump device 1 in Figure 1. Note that in Figure 2, some of the components of the heat pump device 1 shown in Figure 1 are omitted from the illustration in order to clarify the configuration of the characteristic parts of the heat pump device 1.

[0033] The heat pump device 1 of this embodiment constitutes, for example, a part of a heat pump system that includes a heat source circuit 2 and a utilization circuit 3. The heat pump device 1 uses the cold energy of the heat source fluid Fh circulating in the heat source circuit 2 to heat or cool the utilization fluid Fu circulating in the utilization circuit 3.

[0034] As described above, the heat source circuit 2 constitutes part of the heat pump system, which includes the heat pump device 1 and the utilization circuit 3. The heat source circuit 2 circulates the heat source fluid Fh to the first heat exchanger 112 of the heat pump device 1, which will be described later, via the heat source pipeline 12 of the heat pump device 1, which will be described later. The heat source circuit 2 includes, for example, a heat source unit 21, a control device 6, and heat source pipelines 24 and 25, as shown in Figure 2.

[0035] The heat source unit 21 uses, for example, air heat, geothermal heat, waste heat, river water, or factory wastewater as a heat source, and heats or cools the heat source fluid Fh, which is recovered via the return heat source pipeline 25 of the heat source circuit 2, to a predetermined temperature range and supplies it to the outgoing heat source pipeline 24 of the heat source circuit 2. As the heat source fluid Fh, for example, a liquid such as water or brine can be used. The heat source unit 21 includes, for example, one or more air heat source heat pump chillers. The heat source unit 21 is installed, for example, in a heat source fluid Fh supply facility located away from a house or office building where the heat pump device 1 is installed.

[0036] The control device 6 includes, for example, an electronic circuit such as a CPU (Central Processing Unit), FPGA (Field Programmable Gate Array), or ASIC (Application Specific Integrated Circuit), a memory such as ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output unit. The control device 6 performs various control operations by executing a program stored in memory using the CPU, or by designing the circuit for a special application.

[0037] The control device 6 controls the temperature of the heat source fluid Fh in the heat source circuit 2. The control device 6 controls the temperature of the heat source fluid Fh circulating in the heat source circuit 2 by, for example, controlling the heat source unit 21. Specifically, the control device 6 controls, for example, the refrigerant circuit that performs the refrigeration cycle within the heat source unit 21, and the heat source pump that pressurizes and circulates the heat source fluid Fh in the heat source circuit 2. In this way, the control device 6 controls the temperature of the heat source fluid Fh that is circulated to the first heat exchanger 112 of the heat pump device 1 via the heat source pipeline 12 of the heat pump device 1, which will be described later.

[0038] The heat source pipeline 24 is a pipe that, for example, has one end connected to the fluid outlet of the heat source unit 21 and the other end connected to the heat source pipeline 12 of the heat pump device 1, forming a forward pipeline through which the heat source fluid Fh supplied from the heat source unit 21 to the heat pump device 1 passes. The heat source pipeline 25 is a pipe that, for example, has one end connected to the heat source pipeline 12 of the heat pump device 1 and the other end connected to the fluid inlet of the heat source unit 21, forming a return pipeline through which the heat source fluid Fh returning from the heat pump device 1 to the heat source unit 21 passes. The heat source pipelines 24 and 25 are equipped with on-off valves at the ends connected to the heat source pipeline 12 of the heat pump device 1, as shown in Figure 1.

[0039] As described above, utilization circuit 3 constitutes part of the heat pump system, which includes the heat pump device 1 and the heat source circuit 2. Utilization circuit 3 circulates the utilization fluid Fu to the heat pump device 1. Utilization circuit 3 includes, for example, a utilization section 31 that utilizes the cold energy of the utilization fluid Fu, and a utilization pipeline 32 connected to the utilization pipeline 13 of the heat pump device 1 (described later) to circulate the utilization fluid Fu to the utilization section 31. For example, liquids such as water or brine can be used as the utilization fluid Fu circulated in utilization circuit 3.

[0040] Furthermore, the utilization circuit 3 includes, for example, a water supply pipe 33, a hot water supply pipe 34, and hot water utilization equipment such as a shower Sh. The utilization pipes 32, water supply pipe 33, and hot water supply pipe 34 of the utilization circuit 3 are equipped with on / off valves at the ends that connect to, for example, the utilization pipe 13, water supply pipe 18, and hot water supply pipe 19 of the heat pump device 1, which will be described later.

[0041] The utilization unit 31 is installed in the middle of the utilization conduit 32 of the utilization circuit 3, and the utilization fluid Fu is supplied from the second heat exchanger 114 of the heat pump device 1 via the utilization conduit 13 of the heat pump device 1 and the utilization conduit 32 of the utilization circuit 3. The utilization unit 31 includes, for example, a radiator 311 or underfloor heating and cooling 312 installed in the room of a house or office.

[0042] The utilization pipeline 32 includes a supply pipe through which the utilization fluid Fu supplied from the second heat exchanger 114 of the heat pump device 1 to each utilization section 31 passes, and a return pipe through which the utilization fluid Fu that flows back from each utilization section 31 to the second heat exchanger 114 of the heat pump device 1 passes.

[0043] The supply pipe of the utilization pipeline 32 has one end connected to the utilization pipeline 13 of the heat pump device 1, and the other end connected to the fluid inlet of each utilization section 31. The supply pipe of the utilization pipeline 32 flows out from the fluid outlet of the second heat exchanger 114 of the heat pump device 1, passes through the utilization pipeline 13, and allows the utilization fluid Fu supplied to each utilization section 31 to pass through.

[0044] The return pipe of the utilization pipeline 32 has one end connected to the fluid outlet of each utilization section 31, and the other end connected to the utilization pipeline 13 of the heat pump device 1. The return pipe of the utilization pipeline 32 allows the utilization fluid Fu that flows from each utilization section 31 to the second heat exchanger 114 via the utilization pipeline 13 of the heat pump device 1 to pass through.

[0045] The water supply pipe 33 is connected to the heat pump device 1 and supplies tap water TW to the hot water storage tank HWT, which will be described later. The hot water supply pipe 34 is connected to the heat pump device 1 and supplies hot water HW from the hot water storage tank HWT, which will be described later, to hot water utilization equipment such as showers Sh.

[0046] The heat pump device 1 is an indoor unit installed in a room such as a detached house, apartment building, or office building. The heat pump device 1 mainly comprises a refrigerant circuit 11, a heat source line 12, a utilization line 13, a first cooling line 121, a second cooling line 131, and a control unit 15. The heat pump device 1 may also include, for example, a control valve 14, a utilization pump 16, a switching valve Vt, a branch line 17, a hot water storage tank HWT, a heat exchange coil HC, a water supply line 18, and a hot water supply line 19.

[0047] The refrigerant circuit 11 includes a compressor 111, a first heat exchanger 112, a pressure reducing mechanism 113, and a second heat exchanger 114, and performs a refrigeration cycle. The refrigerant circuit 11 also includes, for example, a refrigerant line 115, a switching mechanism 116, and a check valve 117.

[0048] The compressor 111 is a compressor that compresses the refrigerant Fr. Specifically, the compressor 111 is installed in the refrigerant pipeline 115 and compresses the refrigerant Fr filled in the refrigerant pipeline 115. The compressor 111 can be appropriately selected according to the application and capacity, for example, from a swing compressor, scroll compressor, screw compressor, turbo compressor, etc. The compressor 111 includes, for example, a motor housed in a casing that drives the compression mechanism and an inverter that controls the power supplied to the motor.

[0049] The refrigerant Fr used in the refrigerant circuit 11 is, for example, a flammable refrigerant. A flammable refrigerant is, for example, R290 (propane).

[0050] The first heat exchanger 112 is a heat exchanger that exchanges heat between a refrigerant Fr and a heat source fluid Fh. Specifically, the first heat exchanger 112 is connected, for example, to a refrigerant line 115 of a refrigerant circuit 11 and a heat source line 12 of a heat pump device 1 that constitutes part of a heat source circuit 2, and exchanges heat between the refrigerant Fr flowing through the refrigerant line 115 and the heat source fluid Fh flowing through the heat source line 12. The method of heat exchange in the first heat exchanger 112 is not particularly limited.

[0051] The pressure reducing mechanism 113 is a mechanism for reducing the pressure of the refrigerant Fr. Specifically, the pressure reducing mechanism 113 is, for example, an expansion valve provided in the refrigerant pipeline 115 connecting the first heat exchanger 112 and the second heat exchanger 114, and reduces the pressure of the refrigerant Fr flowing through the refrigerant pipeline 115. The pressure reducing mechanism 113 is, for example, a control valve whose opening degree can be changed under the control of the control unit 15.

[0052] The second heat exchanger 114 is a heat exchanger that exchanges heat between the refrigerant Fr and the utilization fluid Fu. Specifically, the second heat exchanger 114 is connected, for example, to the refrigerant line 115 of the refrigerant circuit 11 and the utilization line 13 of the heat pump device 1 which constitutes part of the utilization circuit 3, and exchanges heat between the refrigerant Fr flowing through the refrigerant line 115 and the utilization fluid Fu flowing through the utilization line 13. The method of heat exchange in the second heat exchanger 114 is not particularly limited.

[0053] The refrigerant pipeline 115 is composed of piping that circulates the refrigerant Fr in the refrigerant circuit 11. The refrigerant pipeline 115 may include, for example, piping that passes through the inside of the first heat exchanger 112, or piping that passes through the inside of the second heat exchanger 114. The refrigerant pipeline 115 is provided with pressure detection devices PI on the discharge side and suction side of the compressor 111, respectively. The pressure detection devices PI detect the pressure of the refrigerant Fr on the discharge side and suction side of the compressor 111 and output the detection result to the control unit 15.

[0054] Furthermore, the refrigerant pipeline 115 is equipped with, for example, third temperature detection devices TI3 on ​​both the inlet and outlet sides of the refrigerant Fr in the first heat exchanger 112. The third temperature detection devices TI3 detect the inlet and outlet temperatures of the refrigerant Fr in the first heat exchanger 112, respectively, and output the detection results to the control unit 15.

[0055] Furthermore, the refrigerant pipeline 115 is equipped with, for example, a fourth temperature detection device TI4 on both the inlet and outlet sides of the refrigerant Fr in the second heat exchanger 114. The fourth temperature detection device TI4 detects the inlet and outlet temperatures of the refrigerant Fr in the second heat exchanger 114, respectively, and outputs the detection results to the control unit 15.

[0056] The switching mechanism 116 is configured to switch between cooling operation, in which the second heat exchanger 114 functions as an evaporator, and heating operation, in which the second heat exchanger 114 functions as a heat radiator, by switching the flow direction of the refrigerant Fr. Specifically, the switching mechanism 116 is, for example, a four-way switching valve connected to the first heat exchanger 112 and the second heat exchanger 114 via refrigerant lines 115, and also connected to the discharge port and suction port of the compressor 111 via refrigerant lines 115. The switching mechanism 116 switches between cooling operation and heating operation of the refrigerant circuit 11 by switching the flow path, for example, controlled by the control unit 15.

[0057] During cooling operation, the refrigerant circuit 11 uses the second heat exchanger 114 as an evaporator for the refrigerant Fr to cool the working fluid Fu. At this time, the switching mechanism 116 switches the flow path so that the refrigerant Fr flowing out of the second heat exchanger 114 is introduced into the suction port of the compressor 111, and the refrigerant Fr discharged from the compressor 111 is introduced into the first heat exchanger 112, as shown by the dashed line.

[0058] During heating operation, the refrigerant circuit 11 uses the second heat exchanger 114 as a heat radiator for the refrigerant Fr to heat the working fluid Fu. At this time, the switching mechanism 116 switches the flow path so that the refrigerant Fr flowing out of the first heat exchanger 112 is introduced into the suction port of the compressor 111, and the refrigerant Fr discharged from the compressor 111 is introduced into the second heat exchanger 114, as shown by the solid line.

[0059] The check valve 117 is installed in the refrigerant pipeline 115 that connects the discharge port of the compressor 111 and the switching mechanism 116. The check valve 117 allows the refrigerant Fr flowing from the compressor 111 to the switching mechanism 116 to pass through, and blocks the reverse flow of refrigerant Fr from the switching mechanism 116 to the compressor 111.

[0060] The heat source pipeline 12 of the heat pump device 1 allows the heat source fluid Fh to pass through the first heat exchanger 112. Specifically, the heat source pipeline 12 allows the heat source fluid Fh circulating in the heat source circuit 2 to pass through the first heat exchanger 112. The heat source pipeline 12 includes a supply pipe connecting the supply heat source pipeline 24 of the heat source circuit 2 to the inlet of the heat source fluid Fh in the first heat exchanger 112. The heat source pipeline 12 also includes a return pipe connecting the outlet of the heat source fluid Fh in the first heat exchanger 112 to the return heat source pipeline 25 of the heat source circuit 2. The heat source pipeline 12 may also include a pipe passing through the inside of the first heat exchanger 112. The heat source pipeline 12 constitutes a part of the heat source circuit 2 that circulates the heat source fluid Fh.

[0061] Furthermore, the heat source pipeline 12 is equipped with first temperature detection devices TI1 on both the inlet and outlet sides of the heat source fluid Fh of the first heat exchanger 112. The first temperature detection devices TI1 measure the inlet and outlet temperatures of the heat source fluid Fh at the inlet and outlet sides of the first heat exchanger 112 and output the measurement results to the control unit 15. The first temperature detection devices TI1 are provided in the supply and return piping of the heat source pipeline 12. In addition, the heat source pipeline 12 is equipped with a control valve 14.

[0062] The control valve 14 is installed, for example, in the supply piping of the heat source pipeline 12. The control valve 14 includes a differential pressure adjustment mechanism that uses the differential pressure of the heat source fluid Fh to maintain the flow rate of the heat source fluid Fh within a certain range relative to a predetermined pressure range. The control valve 14 is also referred to as a pressure independent control valve (PICV), a pressure regulating valve, or a constant flow valve. The control valve 14 is connected to the control unit 15 via a wired or wireless communication line and is controlled by the control unit 15.

[0063] The utilization line 13 of the heat pump device 1 passes the utilization fluid Fu to the second heat exchanger 114. Specifically, the utilization line 13 is connected to the utilization line 32 of the utilization circuit 3 and constitutes part of the utilization circuit 3. The utilization line 13 passes the utilization fluid Fu circulating in the utilization circuit 3 to the second heat exchanger 114 of the refrigerant circuit 11. That is, the utilization circuit 3 may include the utilization line 13 and the second heat exchanger 114 of the heat pump device 1.

[0064] The utilization pipeline 13 includes a supply pipe connecting the outlet of the utilization fluid Fu of the second heat exchanger 114 to the supply pipe of the utilization pipeline 32 that constitutes the utilization circuit 3. The utilization pipeline 13 also includes a return pipe connecting the return pipe of the utilization pipeline 32 that constitutes the utilization circuit 3 to the inlet of the second heat exchanger 114. Furthermore, the utilization pipeline 13 may include a pipe that passes through the inside of the second heat exchanger 114.

[0065] The supply piping of utilization pipeline 13 supplies the utilization fluid Fu from the second heat exchanger 114 to each utilization section 31 via the supply piping of utilization pipeline 32. The return piping of utilization pipeline 13 recirculates the utilization fluid Fu from each utilization section 31 to the second heat exchanger 114 via the return piping of utilization pipeline 32. The piping of utilization pipeline 13 that passes inside the second heat exchanger 114 allows the utilization fluid Fu to pass through the inside of the second heat exchanger 114, and heat exchange occurs between the utilization fluid Fu and the refrigerant Fr of the refrigerant circuit 11.

[0066] The utilization pipeline 13 includes a second temperature detection device TI2 that detects the inlet and outlet temperatures of the utilization fluid Fu at the inlet and outlet sides of the utilization fluid Fu of the second heat exchanger 114. The second temperature detection device TI2 is provided in the supply and return piping of the utilization pipeline 13, respectively. In addition, the supply piping of the utilization pipeline 13 is provided with an on-off valve and a switching valve Vt running from the upstream side to the downstream side of the utilization fluid Fu flow, and the return piping of the utilization pipeline 13 is provided with an on-off valve and a utilization pump 16 running from the upstream side to the downstream side of the utilization fluid Fu flow.

[0067] The utilization pump 16 pumps the utilization fluid Fu and circulates it through the utilization circuit 3, which includes the utilization pipeline 13 and the second heat exchanger 114 of the heat pump device 1. The utilization pump 16 is connected to the control unit 15, for example, via a wired or wireless communication line, and the discharge rate is controlled by the control unit 15.

[0068] The switching valve Vt is installed in the supply piping of the utilization pipeline 13 and connected to the branch pipeline 17. The switching valve Vt is a three-way valve having, for example, a first opening connected to the second heat exchanger 114 via the utilization pipeline 13, a second opening connected to the utilization pipeline 32 of the utilization circuit 3 via the utilization pipeline 13, and a third opening connected to the branch pipeline 17. The switching valve Vt may also be composed of a plurality of control valves.

[0069] Furthermore, the switching valve Vt has a valve body that can switch between a first state and a second state, and a drive unit that drives the valve body to switch between the first state and the second state. The drive unit is connected to the control unit 15, for example, via a wired or wireless communication line, and is controlled by the control unit 15 to switch between the first state and the second state of the switching valve Vt.

[0070] The first state of the switching valve Vt is one in which the valve body connects the first and second openings, connecting the upstream and downstream sides of the utilization pipeline 13 in the flow direction of the utilization fluid Fu, and blocks the connection between the upstream side of the utilization pipeline 13 and the branch pipeline 17 by blocking the connection between the first and third openings. In this first state, the utilization fluid Fu that flows from the second heat exchanger 114 to the first opening of the switching valve Vt via the utilization pipeline 13 passes through the switching valve Vt and flows into the utilization pipeline 32 of the utilization circuit 3 via the utilization pipeline 13 connected to the second opening of the switching valve Vt.

[0071] The second state of the switching valve Vt is a state in which the valve body blocks the connection between the first and second openings, thereby blocking the connection between the upstream and downstream sides of the utilization pipeline 13 in the flow direction of the utilization fluid Fu, and connects the first and third openings, thereby connecting the upstream side of the utilization pipeline 13 to the branch pipeline 17. In this second state, the utilization fluid Fu that flows from the second heat exchanger 114 through the utilization pipeline 13 to the first opening of the switching valve Vt passes through the switching valve Vt and flows into the branch pipeline 17 connected to the third opening of the switching valve Vt.

[0072] The branch pipeline 17 has an upstream pipe connecting the third opening of the switching valve Vt to the inlet of the heat exchange coil HC housed in the hot water storage tank HWT, and a downstream pipe connecting the outlet of the heat exchange coil HC to the utilization pipeline 13. When the switching valve Vt is switched to the second state, the branch pipeline 17 allows the utilization fluid Fu to pass through the heat exchange coil HC. The utilization section 31 of the utilization circuit 3 may include, for example, the heat exchange coil HC.

[0073] The hot water storage tank HWT houses a heat exchange coil HC inside. The hot water storage tank HWT is connected to a water supply pipe 18 and a hot water supply pipe 19. The utilization circuit 3 also includes, for example, a water supply pipe 33 and a hot water supply pipe 34. The water supply pipe 33 and the hot water supply pipe 34 of the utilization circuit 3 are connected to the water supply pipe 18 and the hot water supply pipe 19 of the heat pump device 1 at ends where on-off valves are provided. The hot water storage tank HWT may be located outside the heat pump device 1.

[0074] The water supply pipeline 33 of the utilization circuit 3 supplies tap water TW to the hot water storage tank HWT via the water supply pipeline 18 of the heat pump device 1. The hot water storage tank HWT stores the tap water TW supplied via the water supply pipeline 18. The tap water TW stored in the hot water storage tank HWT is heated by heat exchange with the utilization fluid Fu flowing through the heat exchange coil HC to become hot water HW. The hot water HW in the hot water storage tank HWT is supplied to equipment that uses hot water HW, such as showers Sh, via the hot water supply pipeline 19 of the heat pump device 1 and the hot water supply pipeline 34 of the utilization circuit 3.

[0075] The control unit 15 includes, for example, an electronic circuit such as a CPU, FPGA, or ASIC, a memory such as ROM or RAM, and an input / output unit. The control unit 15 performs various control operations by executing a program stored in memory using the CPU, or by designing the circuit for special applications. Specifically, as shown in Figure 2, the control unit 15 includes a control board 151 that controls the refrigerant circuit 11. The control board 151 is equipped with, for example, the above-mentioned electronic circuit, memory, input / output unit, etc.

[0076] The control unit 15 is connected to each part of the heat pump device 1 shown in Figure 3 and the control device 6 of the heat source circuit 2 via an input / output unit and a wired or wireless communication line. Specifically, the control unit 15 is connected to, for example, a pressure detection device PI, a first temperature detection device TI1, a second temperature detection device TI2, a third temperature detection device TI3, a fourth temperature detection device TI4, a compressor 111, a pressure reducing mechanism 113, a switching mechanism 116, a control valve 14, a switching valve Vt, and a utilization pump 16, etc.

[0077] The control unit 15 controls the rotational speed and capacity of the compressor 111, for example, by controlling the inverter that supplies power to the motor of the compressor 111. The control unit 15 also controls the pressure reducing mechanism 113, for example, to change the opening degree of the pressure reducing mechanism 113. The control unit 15 also controls the switching mechanism 116, for example, to switch between cooling operation and heating operation of the refrigerant circuit 11. The control unit 15 also controls the discharge amount of the utilization pump 16, for example, according to an indicator related to the load of the utilization circuit 3. The control unit 15 also controls the switching valve Vt, for example, to switch between the first state and the second state of the switching valve Vt.

[0078] Furthermore, the control unit 15 includes, for example, a substrate temperature sensor TI5 for detecting the temperature of the control board 151, as shown in Figure 2. The control unit 15 is also configured to communicate with a control device 6 that controls the temperature of the heat source fluid Fh in the heat source circuit 2, which circulates the heat source fluid Fh to the first heat exchanger 112 via the heat source pipeline 12, as described above. In this case, the control unit 15 may transmit the required temperature of the heat source fluid Fh to the control device 6 of the heat source circuit 2 according to the temperature of the control board 151 and the load of the second heat exchanger 114, which exchanges heat between the refrigerant Fr and the utilization fluid Fu in the refrigerant circuit 11.

[0079] The control unit 15 determines the load of the second heat exchanger 114 based, for example, on an indicator related to the load of the utilization circuit 3. Here, the load of the utilization circuit 3 can be rephrased as, for example, the air conditioning load of the utilization unit 31, the refrigeration cycle load of the refrigerant circuit 11, or the load of the second heat exchanger 114 in the refrigerant circuit 11. The indicator for the load of the utilization circuit 3 includes, for example, one or more of the following: the rotational speed of the compressor 111, the temperature difference between the inlet and outlet temperatures of the utilization fluid Fu at the inlet and outlet sides of the second heat exchanger 114, or the temperature difference between the inlet and outlet temperatures of the heat source fluid Fh at the inlet and outlet sides of the first heat exchanger 112.

[0080] The control unit 15 obtains the rotational speed of the compressor 111 based on the detection result of an encoder provided on the motor of the compressor 111, for example. The control unit 15 calculates the temperature difference between the inlet temperature and the outlet temperature of the heat source fluid Fh based on the detection result of the first temperature detection device TI1, for example. The control unit 15 calculates the temperature difference between the inlet temperature and the outlet temperature of the heat source fluid Fh based on the detection result of the second temperature detection device TI2, for example.

[0081] As shown in Figure 2, the first cooling pipeline 121 branches off from the heat source pipeline 12 of the heat pump device 1. Specifically, the first cooling pipeline 121 has a starting end that branches off from the heat source pipeline 12 and a terminal end that merges with the heat source pipeline 12. In the flow direction of the heat source fluid Fh passing through the heat source pipeline 12, the starting end of the first cooling pipeline 121 is located upstream of the terminal end of the first cooling pipeline 121.

[0082] Furthermore, the first cooling conduit 121 has a cooling section CP for cooling the control board 151 of the control unit 15. In the example shown in Figure 2, the cooling section CP includes a heat transfer member HT in contact with the first cooling conduit 121. The heat transfer member HT is, for example, a metallic member that contacts the first cooling conduit 121 and the heat-generating components of the control board 151. The heat transfer member HT may also be, for example, a heat dissipation fin or heat sink that contacts the control board 151 and cools the control board 151.

[0083] Furthermore, in the example shown in Figure 2, the first cooling pipeline 121 branches off from the heat source pipeline 12 upstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh passing through the heat source pipeline 12, and allows the heat source fluid Fh to pass through the heat transfer member HT. Specifically, the first cooling pipeline 121 has a supply pipe extending from the starting end where it branches off from the heat source pipeline 12 to the fluid inlet of the heat transfer member HT, and a return pipe extending from the fluid outlet of the heat transfer member HT to the end where it rejoins the heat source pipeline 12. The first cooling pipeline 121 may also include a through hole or pipe that penetrates the heat transfer member HT.

[0084] The first cooling conduit 121 is, for example, inserted through a through hole provided in the heat transfer member HT, with its outer surface in contact with the inner surface of the through hole in the heat transfer member HT, allowing the heat source fluid Fh to pass through the heat transfer member HT. Alternatively, the first cooling conduit 121 may be connected to the inlet and outlet of a through hole provided in the heat transfer member HT, allowing the heat source fluid Fh to pass through the through hole in the heat transfer member HT. In this case, the heat transfer member HT and the heat source fluid Fh can be brought into contact.

[0085] As shown in Figure 2, the second cooling pipeline 131 branches off from the utilization pipeline 13 of the heat pump device 1. Specifically, the second cooling pipeline 131 has a starting end where it branches off from the utilization pipeline 13 and a terminal end where it merges with the utilization pipeline 13. In the flow direction of the utilization fluid Fu passing through the utilization pipeline 13, the starting end of the second cooling pipeline 131 is located upstream of the terminal end of the second cooling pipeline 131.

[0086] Furthermore, the second cooling pipeline 131 has a cooling section CP for cooling the control board 151 of the control unit 15. In the example shown in Figure 2, the cooling section CP includes a heat transfer member HT that is in contact with the second cooling pipeline 131. The heat transfer member HT is, for example, a metallic member similar to the heat transfer member HT that is in contact with the first cooling pipeline 121. In the example shown in Figure 2, the first cooling pipeline 121 and the second cooling pipeline 131 share a cooling section CP that includes the heat transfer member HT.

[0087] Furthermore, in the example shown in Figure 2, the second cooling pipeline 131 branches off from the utilization pipeline 13 upstream of the second heat exchanger 114 in the flow direction of the utilization fluid Fu passing through the utilization pipeline 13, and allows the utilization fluid Fu to pass through the heat transfer member HT. Specifically, the second cooling pipeline 131 has a supply pipe extending from the starting end where it branches off from the utilization pipeline 13 to the fluid inlet of the heat transfer member HT, and a return pipe extending from the fluid outlet of the heat transfer member HT to the end where it rejoins the utilization pipeline 13. The second cooling pipeline 131 may also include a through hole or pipe that penetrates the heat transfer member HT.

[0088] In this embodiment of the heat pump device 1, it is sufficient that the first cooling pipe 121 or the second cooling pipe 131 has a cooling section CP that cools the control board 151. Here, "the first cooling pipe 121 or the second cooling pipe 131 having a cooling section CP" includes cases where both the first cooling pipe 121 and the second cooling pipe 131 have a cooling section CP, and cases where only one of the first cooling pipe 121 or the second cooling pipe 131 has a cooling section CP. Furthermore, the cooling section CP does not have to include a heat transfer member HT. In this case, a part of the first cooling pipe 121 or the second cooling pipe 131 may be brought into contact with the control board 151, and the part in contact with the control board 151 may be considered the cooling section CP.

[0089] Furthermore, in the example shown in Figure 2, the heat pump device 1 is further equipped with a heat source control valve Vh that is provided in the first cooling pipe 121 and can adjust the flow rate of the heat source fluid Fh passing through the heat transfer member HT. The heat source control valve Vh is, for example, a three-way valve, a flow divider valve, or a flow merger valve provided at the starting end of the first cooling pipe 121. The heat source control valve Vh has a first opening connected to the upstream side of the heat source pipe 12 in the flow direction of the heat source fluid Fh, a second opening connected to the downstream side of the heat source pipe 12 in the flow direction of the heat source fluid Fh, and a third opening connected to the starting end of the first cooling pipe 121.

[0090] Furthermore, the heat source control valve Vh includes a valve body capable of adjusting the flow rate of the heat source fluid Fh that flows in from the first opening and flows out from the second opening, and the flow rate of the heat source fluid Fh that flows in from the first opening and flows out from the third opening, and a drive unit that drives the valve body. In addition, as shown in Figure 3, the heat source control valve Vh is connected to the control unit 15 via a wireless or wired communication line.

[0091] The control unit 15 controls the heat source control valve Vh according to the temperature of the control board 151 obtained from the substrate temperature sensor TI5 and the temperature of the heat source fluid Fh supplied to the heat source pipeline 12 obtained from the first temperature detection device TI1. Specifically, the control unit 15 controls the drive unit of the heat source control valve Vh to drive the valve body, thereby adjusting the flow rate of the heat source fluid Fh flowing in from the first opening and out from the second opening, and the flow rate of the heat source fluid Fh flowing in from the first opening and out from the third opening.

[0092] Furthermore, in the example shown in Figure 2, the heat pump device 1 is further provided with a utilization control valve Vu that is installed in the second cooling pipe 131 and can adjust the flow rate of the utilization fluid Fu passing through the heat transfer member HT. The utilization control valve Vu is, for example, a three-way valve, a flow divider valve, or a flow merger valve installed at the starting end of the second cooling pipe 131. The utilization control valve Vu has a first opening connected to the upstream side of the utilization pipe 13 in the flow direction of the utilization fluid Fu, a second opening connected to the downstream side of the utilization pipe 13 in the flow direction of the utilization fluid Fu, and a third opening connected to the starting end of the second cooling pipe 131.

[0093] Furthermore, the utilization control valve Vu has a valve body capable of adjusting the flow rate of the utilization fluid Fu that flows in from the first opening and flows out from the second opening, and the flow rate of the utilization fluid Fu that flows in from the first opening and flows out from the third opening, and a drive unit that drives the valve body. Also, as shown in Figure 3, the utilization control valve Vu is connected to the control unit 15 via a wireless or wired communication line.

[0094] The control unit 15 controls the utilization control valve Vu according to the temperature of the control board 151, the temperature of the heat source fluid Fh supplied to the heat source pipeline 12, and the temperature of the utilization fluid Fu upstream of the second heat exchanger 114 in the flow direction of the utilization fluid Fu. The temperature of the control board 151, the temperature of the heat source fluid Fh, and the temperature of the utilization fluid Fu are detected by the board temperature sensor TI5, the first temperature detection device TI1, and the second temperature detection device TI2, respectively, and input to the control unit 15. The control unit 15 controls the drive unit of the utilization control valve Vu to drive the valve body, thereby adjusting the flow rate of the utilization fluid Fu flowing in from the first opening and out of the second opening, and the flow rate of the utilization fluid Fu flowing in from the first opening and out of the third opening.

[0095] Next, the operation of the heat pump device 1 of this embodiment will be explained.

[0096] The control unit 15 of the heat pump device 1 selects heating operation based on conditions such as user operation, room temperature, or outside temperature. The control unit 15 then controls the switching mechanism 116 shown in Figure 1 to switch the flow path of the switching mechanism 116 so that the first heat exchanger 112 is connected to the suction port of the compressor 111 via the refrigerant line 115, and the discharge port of the compressor 111 is connected to the second heat exchanger 114 via the refrigerant line 115, as shown by the solid line.

[0097] Furthermore, the control unit 15 controls the compressor 111 of the refrigerant circuit 11 via the control board 151 to rotate it. As a result, heat-generating components such as power transistors for the inverter mounted on the control board 151 generate heat. In response, the control unit 15 controls the heat source control valve Vh to connect the first opening and the third opening at a predetermined opening. This causes the heat source fluid Fh to flow from the heat source pipeline 12 to the first cooling pipeline 121, and as it passes through the cooling section CP of the first cooling pipeline 121, the control board 151 is cooled.

[0098] In heating operation, the temperature of the heat source fluid Fh before heat exchange with the refrigerant Fr in the first heat exchanger 112 is, for example, 10°C or higher and 35°C or lower. Also, if the heat source fluid Fh is 10°C, the temperature of the heat source fluid Fh after heat exchange with the refrigerant Fr in the first heat exchanger 112 is, for example, 2°C or higher and 5°C or lower.

[0099] The control board 151 can also, for example, send a temperature request to the control device 6 of the heat source circuit 2 to raise the temperature of the heat source fluid Fh when the temperature of the heat source fluid Fh is lower than a predetermined temperature. The control board 151 is cooled to a temperature of, for example, 70°C or lower by the cooling section CP of the first cooling pipe 121. The heat source fluid Fh that has passed through the first cooling pipe 121 recirculates to the heat source pipe 12 and passes through the first heat exchanger 112, thereby exchanging heat with the refrigerant Fr.

[0100] Furthermore, during heating operation, if the temperature of the heat source fluid Fh is lower than a threshold and there is a high possibility of condensation occurring in the cooling section CP, the control unit 15 may control the utilization control valve Vu to connect the first opening and the third opening at a predetermined opening. As a result, the utilization fluid Fu flows from the utilization pipeline 13 to the second cooling pipeline 131 and cools the control board 151 as it passes through the cooling section CP of the second cooling pipeline 131.

[0101] In heating operation, the temperature of the utilization fluid Fu before heat exchange with the refrigerant Fr in the second heat exchanger 114 is, for example, 60°C or higher and 70°C or lower. In this case, the temperature of the utilization fluid Fu after heat exchange with the refrigerant Fr in the second heat exchanger 114 is, for example, 70°C or higher and 80°C or lower. If the utilization section 31 of the utilization circuit 3 includes a fan coil, the temperature of the utilization fluid Fu after heat exchange with the refrigerant Fr in the second heat exchanger 114 is, for example, 35°C or higher and 75°C or lower.

[0102] The control board 151 is cooled to a temperature of, for example, 70°C or lower by the cooling section CP of the second cooling pipeline 131. The heat source fluid Fh that has passed through the second cooling pipeline 131 is returned to the utilization pipeline 13 and passes through the second heat exchanger 114, thereby exchanging heat with the refrigerant Fr.

[0103] Furthermore, the control unit 15 of the heat pump device 1 selects cooling operation based on conditions such as user operation, room temperature, or outside temperature. The control unit 15 then controls the switching mechanism 116 shown in Figure 1 to switch the flow path of the switching mechanism 116 so that the second heat exchanger 114 is connected to the suction port of the compressor 111 via the refrigerant line 115, and the discharge port of the compressor 111 is connected to the first heat exchanger 112 via the refrigerant line 115, as shown by the dashed line.

[0104] In cooling operation, the temperature of the heat source fluid Fh before heat exchange with the refrigerant Fr in the first heat exchanger 112 is, for example, 10°C or higher and 35°C or lower. Also, if the temperature of the heat source fluid Fh before heat exchange with the refrigerant Fr in the first heat exchanger 112 is 35°C, the temperature of the heat source fluid Fh after heat exchange with the refrigerant Fr in the first heat exchanger 112 is, for example, 40°C or higher.

[0105] The control board 151 is cooled to a temperature of, for example, 70°C or lower by the cooling section CP of the first cooling pipeline 121. The heat source fluid Fh that has passed through the first cooling pipeline 121 recirculates to the heat source pipeline 12 and passes through the first heat exchanger 112, thereby exchanging heat with the refrigerant Fr.

[0106] Furthermore, even during cooling operation, the control unit 15 can control the utilization control valve Vu to connect the first opening and the third opening at a predetermined opening. As a result, the utilization fluid Fu flows from the utilization pipeline 13 to the second cooling pipeline 131 and passes through the cooling section CP of the second cooling pipeline 131, thereby cooling the control board 151.

[0107] In cooling operation, the temperature of the working fluid Fu before heat exchange with the refrigerant Fr in the second heat exchanger 114 is, for example, 15°C or higher and 18°C ​​or lower. In this case, the temperature of the working fluid Fu after heat exchange with the refrigerant Fr in the second heat exchanger 114 is, for example, approximately 10°C.

[0108] The control board 151 is cooled to a temperature of, for example, 70°C or lower by the cooling section CP of the second cooling pipeline 131. The heat source fluid Fh that has passed through the second cooling pipeline 131 is returned to the utilization pipeline 13 and passes through the second heat exchanger 114, thereby exchanging heat with the refrigerant Fr.

[0109] As described above, the heat pump device 1 of this embodiment includes a refrigerant circuit 11, a heat source pipeline 12, a utilization pipeline 13, a first cooling pipeline 121, a second cooling pipeline 131, and a control unit 15. The refrigerant circuit 11 includes a compressor 111 for compressing the refrigerant Fr, a first heat exchanger 112 for exchanging heat between the refrigerant Fr and the heat source fluid Fh, a pressure reducing mechanism 113 for reducing the pressure of the refrigerant Fr, and a second heat exchanger 114 for exchanging heat between the refrigerant Fr and the utilization fluid Fu, and performs a refrigeration cycle. The heat source pipeline 12 allows the heat source fluid Fh to pass through the first heat exchanger 112. The utilization pipeline 13 allows the utilization fluid Fu to pass through the second heat exchanger 114. The first cooling pipeline 121 branches off from the heat source pipeline 12. The second cooling pipeline 131 branches off from the utilization pipeline 13. The control unit 15 includes a control board 151 that controls the refrigerant circuit 11. The first cooling line 121 or the second cooling line 131 has a cooling section CP that cools the control board 151.

[0110] With this configuration, the control board 151 can be cooled by selectively using either the heat source fluid Fh that exchanges heat with the refrigerant Fr in the first heat exchanger 112, or the utilization fluid Fu that exchanges heat with the refrigerant Fr in the second heat exchanger 114. Therefore, depending on the respective temperatures of the heat source fluid Fh and the utilization fluid Fu, the control board 151 can be cooled by selectively using the heat source fluid Fh or the utilization fluid Fu that is appropriate for cooling the control board 151.

[0111] Furthermore, in the heat pump device 1 of this embodiment, the cooling section CP includes a heat transfer member HT that is in contact with the first cooling pipe 121 or the second cooling pipe 131.

[0112] With this configuration, the control board 151 can be cooled by bringing the heat transfer member HT, which is in contact with the first cooling pipe 121 or the second cooling pipe 131, into contact with the control board 151. Furthermore, by cooling the heat transfer member HT with the heat source fluid Fh or utilization fluid Fu passing through the first cooling pipe 121 or the second cooling pipe 131, the control board 151 can be efficiently cooled by selectively utilizing the heat source fluid Fh or utilization fluid Fu. In addition, compared to the case where the first cooling pipe 121 or the second cooling pipe 131 is in contact with the control board 151, the heat transfer area between the control board 151 and the heat transfer member HT can be increased, thereby improving cooling efficiency.

[0113] Furthermore, in the heat pump device 1 of this embodiment, the first cooling pipe 121 branches off from the heat source pipe 12 upstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh, and allows the heat source fluid Fh to pass through the heat transfer member HT.

[0114] This configuration allows the heat source fluid Fh to pass through the heat transfer member HT before it exchanges heat with the refrigerant Fr in the first heat exchanger 112 of the refrigerant circuit 11. This allows the heat transfer member HT to be cooled to a temperature suitable for cooling the control board 151 by the heat source fluid Fh. Therefore, the heat source fluid Fh can be selectively used to cool the control board 151 to an appropriate temperature via the heat transfer member HT.

[0115] Furthermore, in the heat pump device 1 of this embodiment, the second cooling pipe 131 branches off from the utilization pipe 13 upstream of the second heat exchanger 114 in the flow direction of the utilization fluid Fu, and allows the utilization fluid Fu to pass through the heat transfer member HT.

[0116] This configuration allows the utilization fluid Fu to pass through the heat transfer member HT before it exchanges heat with the refrigerant Fr in the second heat exchanger 114 of the refrigerant circuit 11. This allows the heat transfer member HT to be cooled to a temperature suitable for cooling the control board 151 by the utilization fluid Fu. Therefore, the utilization fluid Fu can be selectively used to cool the control board 151 to an appropriate temperature via the heat transfer member HT.

[0117] Furthermore, in the heat pump device 1 of this embodiment, the refrigerant circuit 11 includes a switching mechanism 116 that can switch between cooling operation, in which the flow direction of the refrigerant Fr is switched to make the second heat exchanger 114 function as an evaporator, and heating operation, in which the second heat exchanger 114 function as a heat radiator. The control unit 15 controls the switching mechanism 116 to switch between cooling operation and heating operation of the refrigerant circuit 11.

[0118] With this configuration, the control board 151 can be efficiently cooled by selectively using the heat source fluid Fh or the utilization fluid Fu, which have different temperatures during cooling and heating operations of the refrigerant circuit 11.

[0119] Specifically, the first cooling pipe 121 branches off from the heat source pipe 12 upstream of the first heat exchanger 112, allowing the heat source fluid Fh to pass through the heat transfer member HT. This enables efficient cooling of the control board 151 using the heat source fluid Fh, which is at a lower temperature than the used fluid Fu, during heating operation of the refrigerant circuit 11. Furthermore, by passing the heat source fluid Fh through the heat transfer member HT before it flows into the first heat exchanger 112, the control board 151 is cooled, causing the temperature of the heat source fluid Fh to rise. This reduces the temperature of the heat source fluid Fh circulated to the heat source circuit 2 during heating operation of the refrigerant circuit 11, thereby reducing power consumption in the heat source circuit 2. Additionally, by branching the first cooling pipe 121 off from the heat source pipe 12 upstream of the first heat exchanger 112, the heat source fluid Fh, before its temperature drops due to heat exchange with the refrigerant Fr in the first heat exchanger 112, can be used to cool the control board 151 during heating operation of the refrigerant circuit 11. Therefore, condensation caused by excessive cooling of the heat transfer element HT can be suppressed.

[0120] Furthermore, the second cooling pipe 131 branches off from the utilization pipe 13 upstream of the second heat exchanger 114, allowing the utilization fluid Fu to pass through the heat transfer member HT. This enables the control board 151 to be cooled while suppressing condensation by utilizing the utilization fluid Fu, which is at a higher temperature than the heat source fluid Fh, during heating operation of the refrigerant circuit 11. Additionally, by passing the utilization fluid Fu through the heat transfer member HT before flowing into the second heat exchanger 114 and cooling the control board 151, the temperature of the utilization fluid Fu rises. This reduces the power consumption of the refrigerant circuit 11 required to raise the utilization fluid Fu to a predetermined temperature through heat exchange with the refrigerant Fr in the second heat exchanger 114 during heating operation of the refrigerant circuit 11.

[0121] Furthermore, in the heat pump device 1 of this embodiment, the control unit 15 is configured to communicate with a control device 6 that controls the temperature of the heat source fluid Fh in the heat source circuit 2, which circulates the heat source fluid Fh to the first heat exchanger 112 via the heat source pipeline 12. The control unit 15 also transmits the required temperature of the heat source fluid Fh to the control device 6 of the heat source circuit 2 according to the temperature of the control board 151 and the load of the second heat exchanger 114, which exchanges heat between the refrigerant Fr and the utilization fluid Fu in the refrigerant circuit 11.

[0122] With this configuration, the control unit 15 sends a temperature request to the control device 6 of the heat source circuit 2 in accordance with the temperature of the control board 151 and the load of the second heat exchanger 114, thereby maintaining the heat source fluid Fh at a temperature suitable for cooling the control board 151. Therefore, the control board 151 can be cooled to an appropriate temperature using the heat source fluid Fh. In addition, condensation on the heat transfer member HT can be suppressed by preventing the heat source fluid Fh from becoming excessively cold.

[0123] Furthermore, the heat pump device 1 of this embodiment is further equipped with a heat source control valve Vh provided in the first cooling pipe 121, which can adjust the flow rate of the heat source fluid Fh passing through the heat transfer member HT. The control unit 15 controls the heat source control valve Vh according to the temperature of the control board 151 and the temperature of the heat source fluid Fh supplied to the heat source pipe 12.

[0124] With this configuration, the control unit 15 controls the heat source control valve Vh to allow the heat source fluid Fh at an appropriate flow rate, corresponding to the temperature of the control board 151 and the temperature of the heat source fluid Fh, to pass through the heat transfer member HT. This makes it possible to cool the control board 151 to a more appropriate temperature. Specifically, during heating operation, the control unit 15 controls the heat source control valve Vh to allow the heat source fluid Fh at an appropriate flow rate, corresponding to the temperature of the control board 151 and the temperature of the heat source fluid Fh, to pass through the heat transfer member HT. Therefore, as described above, the power consumption of the heat source circuit 2 can be reduced while efficiently cooling the control board 151, and condensation on the heat transfer member HT can be suppressed.

[0125] Furthermore, the heat pump device 1 of this embodiment is further equipped with a utilization control valve Vu provided in the second cooling pipe 131, which can adjust the flow rate of the utilization fluid Fu passing through the heat transfer member HT. The control unit 15 controls the utilization control valve Vu according to the temperature of the control board 151, the temperature of the heat source fluid Fh supplied to the heat source pipe 12, and the temperature of the utilization fluid Fu upstream of the second heat exchanger 114 in the flow direction of the utilization fluid Fu.

[0126] With this configuration, the control unit 15 controls the utilization control valve Vu so that an appropriate flow rate of utilization fluid Fu, corresponding to the temperature of the control board 151, the temperature of the heat source fluid Fh, and the temperature of the utilization fluid Fu, can be passed through the heat transfer member HT. This makes it possible to cool the control board 151 to a more appropriate temperature. Specifically, during heating operation, the control unit 15 controls the utilization control valve Vu so that the temperature of the control board 151, the temperature of the heat source fluid Fh, and Fluid used Fu An appropriate flow rate of the utilization fluid Fu, depending on the temperature, can be passed through the heat transfer member HT. Therefore, as described above, the power consumption of the refrigerant circuit 11 can be reduced while suppressing condensation in the heat transfer member HT.

[0127] Furthermore, in the heat pump device 1 of this embodiment, the refrigerant Fr used in the refrigerant circuit 11 is a flammable refrigerant.

[0128] This configuration improves the safety of the heat pump device 1 in the event of a leak of refrigerant Fr from the refrigerant circuit 11. Specifically, the heat pump device 1 cools the control board 151 by the cooling section CP of the first cooling pipe 121 through which the heat source fluid Fh passes, or the second cooling pipe 131 through which the utilization fluid Fu passes. Therefore, it is not necessary to use the refrigerant Fr circulating in the refrigerant circuit 11 to cool the control board 151, and the various parts of the refrigerant circuit 11 and the control board 151 can be arranged at a distance from each other. Consequently, even if flammable refrigerant Fr leaks from the refrigerant circuit 11, contact between the electrical connections of the control board 151 and the refrigerant Fr can be avoided, thereby improving the safety of the heat pump device 1.

[0129] As described above, according to this embodiment, a heat pump device 1 is provided that can selectively use the heat source fluid Fh or the utilization fluid Fu to cool the control board 151.

[0130] (Embodiment 2) Next, with reference to Figure 4, Embodiment 2 of the heat pump device (1) according to the present disclosure will be described. Figure 4 is a circuit diagram showing Embodiment 2 of the heat pump device (1) according to the present disclosure. Note that, as with Figure 2 above, some of the components of the heat pump device 1 shown in Figure 1 are omitted from the illustration in Figure 4.

[0131] The heat pump device 1 of this embodiment differs from the heat pump device 1 of Embodiment 1 described above in that the first cooling pipe 121 branches off from the heat source pipe 12 downstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh, and passes the heat source fluid Fh through the heat transfer member HT. The other components of the heat pump device 1 of this embodiment are the same as those of the heat pump device 1 of Embodiment 1 described above, so the same reference numerals are used for the same parts and their description is omitted.

[0132] According to the heat pump device 1 of this embodiment, the heat source fluid Fh, which has exchanged heat with the refrigerant Fr in the first heat exchanger 112 of the refrigerant circuit 11, can be passed through the heat transfer member HT. This allows, for example, during heating operation of the refrigerant circuit 11, to pass a heat source fluid Fh at a lower temperature than the heat source fluid Fh before heat exchange with the refrigerant Fr through the heat transfer member HT, thereby improving the cooling capacity of the control board 151 by the heat transfer member HT. Also, for example, during cooling operation of the refrigerant circuit 11, to pass a heat source fluid Fh at a higher temperature than the heat source fluid Fh before heat exchange with the refrigerant Fr through the heat transfer member HT, thereby suppressing condensation on the heat transfer member HT. Therefore, the heat source fluid Fh can be selectively utilized, and the control board 151 can be cooled to an appropriate temperature via the heat transfer member HT.

[0133] (Embodiment 3) Next, with reference to Figure 5, Embodiment 3 of the heat pump device (1) according to the present disclosure will be described. Figure 5 is a circuit diagram showing Embodiment 3 of the heat pump device (1) according to the present disclosure. Note that, as with Figure 2 above, some of the components of the heat pump device 1 shown in Figure 1 are omitted from the illustration in Figure 5.

[0134] In this embodiment, the heat pump device 1 is similar to the heat pump device 1 of Embodiment 1 described above, in which the first cooling pipe 121 branches off from the heat source pipe 12 upstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh, and allows the heat source fluid Fh to pass through the heat transfer member HT. Also, in this embodiment, the heat pump device 1 is similar to the heat pump device 1 of Embodiment 2 described above, in which the first cooling pipe 121 branches off from the heat source pipe 12 downstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh, and allows the heat source fluid Fh to pass through the heat transfer member HT.

[0135] Furthermore, the heat pump device 1 of this embodiment is equipped with a plurality of heat source control valves Vh1 and Vh2 that are provided in the first cooling pipe 121 and can adjust the flow rate of the heat source fluid Fh that passes through the heat transfer member HT. The other components of the heat pump device 1 of this embodiment are the same as those of the heat pump device 1 of Embodiment 1 described above, so the same reference numerals are used for the same parts and their description is omitted.

[0136] In the heat pump device 1 of this embodiment, the first cooling pipeline 121 includes, for example, a first pipeline 121a, a second pipeline 121b, a third pipeline 121c, a fourth pipeline 121d, and a fifth pipeline 121e.

[0137] The first pipeline 121a has a starting end that branches off from the heat source pipeline 12 upstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh passing through the heat source pipeline 12, and a terminal end that is connected to the first opening of the first heat source control valve Vh1. The second pipeline 121b has a starting end that is connected to the second opening of the first heat source control valve Vh1 and a terminal end that is connected to the third opening of the second heat source control valve Vh2, and has a cooling section CP including a heat transfer member HT in the middle. The third pipeline 121c has a starting end that is connected to the second opening of the second heat source control valve Vh2 and a terminal end that is connected to the heat source pipeline 12 downstream of the starting end of the first pipeline 121a and upstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh passing through the heat source pipeline 12.

[0138] The fourth pipeline 121d has a starting end that branches off from the heat source pipeline 12 downstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh passing through the heat source pipeline 12, and a terminal end that is connected to the third opening of the first heat source control valve Vh1. The fifth pipeline 121e has a starting end that is connected to the first opening of the second heat source control valve Vh2, and a terminal end that is connected to the heat source pipeline 12 downstream of the starting end of the fourth pipeline 121d in the flow direction of the heat source fluid Fh passing through the heat source pipeline 12.

[0139] The control unit 15 controls, for example, the first heat source control valve Vh1 to connect the first and second openings, and the second heat source control valve Vh2 to connect the second and third openings. As a result, as shown by the solid arrows, the heat source fluid Fh flows from the heat source pipeline 12 to the first pipeline 121a upstream of the first heat exchanger 112, passes through the second pipeline 121b, the heat transfer member HT, and the third pipeline 121c, and returns to the heat source pipeline 12. As a result, the heat pump device 1 of this embodiment can achieve the same effects as the heat pump device 1 of Embodiment 1.

[0140] Furthermore, the control unit 15 controls, for example, the first heat source control valve Vh1 to connect the second and third openings, and the second heat source control valve Vh2 to connect the first and third openings. As a result, as shown by the dashed arrows, the heat source fluid Fh flows from the heat source pipeline 12 to the fourth pipeline 121d downstream of the first heat exchanger 112, passes through the second pipeline 121b, the heat transfer member HT, and the fifth pipeline 121e, and returns to the heat source pipeline 12. As a result, the heat pump device 1 of this embodiment can achieve the same effects as the heat pump device 1 of Embodiment 2.

[0141] (Embodiment 4) Finally, with reference to Figure 6, Embodiment 4 of the heat pump device (1) according to the present disclosure will be described. Figure 6 is a circuit diagram showing Embodiment 4 of the heat pump device (1) according to the present disclosure. Note that, as with Figure 2 above, some of the components of the heat pump device 1 shown in Figure 1 are omitted from the illustration in Figure 6.

[0142] The heat pump device 1 of this embodiment differs from the heat pump device 1 of Embodiment 2 shown in Figure 4 above, mainly in that it includes a third heat exchanger HEX that exchanges heat between the heat source fluid Fh and the utilization fluid Fu. The other components of the heat pump device 1 of this embodiment are the same as those of the heat pump device 1 of Embodiment 2 above, so the same parts are denoted by the same reference numerals and their description is omitted.

[0143] As described above, the heat pump device 1 of this embodiment includes a third heat exchanger HEX that exchanges heat between a heat source fluid Fh passing through a first cooling pipe 121 and a utilization fluid Fu passing through a second cooling pipe 131. The first cooling pipe 121 branches off from the heat source pipe 12 downstream of the first heat exchanger 112 in the flow direction of the heat source fluid Fh, and sequentially passes the heat source fluid Fh through the third heat exchanger HEX and the heat transfer member HT. The second cooling pipe 131 branches off from the utilization pipe 13 upstream of the second heat exchanger 114 in the flow direction of the utilization fluid Fu, and passes the utilization fluid Fu through the third heat exchanger HEX.

[0144] This configuration allows the control board 151 to be cooled to an appropriate temperature using both the heat source fluid Fh and the utilized fluid Fu. Specifically, the heat source fluid Fh, which has exchanged heat with the refrigerant Fr in the first heat exchanger 112, and the utilized fluid Fu, which has not yet exchanged heat with the refrigerant Fr in the second heat exchanger 114, exchange heat in the third heat exchanger HEX. This allows the utilized fluid Fu, before passing through the second heat exchanger 114, to adjust the heat source fluid Fh, which has passed through the first heat exchanger 112, to a temperature suitable for cooling the heat transfer member HT, and then pass it through the heat transfer member HT. Therefore, the control board 151 can be cooled to an appropriate temperature via the heat transfer member HT using both the heat source fluid Fh and the utilized fluid Fu. Temperature adjustment of the heat source fluid Fh in the third heat exchanger HEX is particularly effective during cooling operation of the refrigerant circuit 11, where the heat source fluid Fh tends to become hot.

[0145] Preferred embodiments and variations of the present disclosure have been described in detail above. However, the present disclosure is not limited to the embodiments and variations described above. Various modifications or substitutions may be applied to the embodiments and variations described above without departing from the scope of the present disclosure. Furthermore, features described separately can be combined as long as no technical inconsistencies arise. [Explanation of Symbols]

[0146] 1. Heat pump system 11 Refrigerant Circuit 111 Compressor 112 1st heat exchanger 113 Pressure reduction mechanism 114 Second heat exchanger 116 Switching mechanism 12 Heat source pipe 121 1st cooling pipe line 13 Pipeline used 131 2nd cooling pipe line 15 Control Unit 151 Control board 2 Heat source circuit 6. Control device CP cooling section Fh heat source fluid Fr refrigerant Fu Fluid used HT heat transfer components HEX 3rd heat exchanger Vh Heat source control valve Vu Control Valve

Claims

1. A refrigerant circuit (11) that performs a refrigeration cycle includes a compressor (111) for compressing a refrigerant (Fr), a first heat exchanger (112) for exchanging heat between the refrigerant (Fr) and a heat source fluid (Fh), a pressure reducing mechanism (113) for reducing the pressure of the refrigerant (Fr), and a second heat exchanger (114) for exchanging heat between the refrigerant (Fr) and a utilization fluid (Fu). The first heat exchanger (112) has a heat source pipe (12) through which the heat source fluid (Fh) passes, The second heat exchanger (114) has a utilization pipe (13) through which the utilization fluid (Fu) passes, A first cooling pipeline (121) branched off from the heat source pipeline (12), A second cooling pipeline (131) branched off from the aforementioned utilization pipeline (13), The system includes a control unit (15) which includes a control board (151) for controlling the refrigerant circuit (11), The first cooling pipeline (121) and the second cooling pipeline (131) each have a cooling section (CP) for cooling the control board (151). Heat pump device (1).

2. The cooling section (CP) includes a heat transfer member (HT) in contact with the first cooling pipe (121) or the second cooling pipe (131). The heat pump device (1) according to claim 1.

3. The first cooling pipe (121) branches off from the heat source pipe (12) upstream of the first heat exchanger (112) in the flow direction of the heat source fluid (Fh) and allows the heat source fluid (Fh) to pass through the heat transfer member (HT). The heat pump device (1) according to claim 2.

4. The first cooling pipe (121) branches off from the heat source pipe (12) downstream of the first heat exchanger (112) in the flow direction of the heat source fluid (Fh) and allows the heat source fluid (Fh) to pass through the heat transfer member (HT). The heat pump device (1) according to claim 2.

5. The second cooling conduit (131) branches off from the utilization conduit (13) upstream of the second heat exchanger (114) in the flow direction of the utilization fluid (Fu) and allows the utilization fluid (Fu) to pass through the heat transfer member (HT). The heat pump device (1) according to claim 2.

6. A refrigerant circuit (11) that performs a refrigeration cycle, including a compressor (111) for compressing a refrigerant (Fr), a first heat exchanger (112) for exchanging heat between the refrigerant (Fr) and a heat source fluid (Fh), a pressure reducing mechanism (113) for reducing the pressure of the refrigerant (Fr), and a second heat exchanger (114) for exchanging heat between the refrigerant (Fr) and a utilization fluid (Fu), The first heat exchanger (112) has a heat source pipe (12) through which the heat source fluid (Fh) passes, The second heat exchanger (114) has a utilization pipe (13) through which the utilization fluid (Fu) passes, A first cooling pipeline (121) branched off from the heat source pipeline (12), A second cooling pipeline (131) branched off from the aforementioned utilization pipeline (13), A control unit (15) including a control board (151) for controlling the refrigerant circuit (11), The system includes a third heat exchanger (HEX) that exchanges heat between the heat source fluid (Fh) and the utilization fluid (Fu), The first cooling pipeline (121) has a cooling section (CP) for cooling the control board (151), The cooling section (CP) includes a heat transfer member (HT) in contact with the first cooling pipe (121), The first cooling pipeline (121) branches off from the heat source pipeline (12) downstream of the first heat exchanger (112) in the flow direction of the heat source fluid (Fh), and sequentially passes the heat source fluid (Fh) through the third heat exchanger (HEX) and the heat transfer member (HT). The second cooling conduit (131) branches off from the utilization conduit (13) upstream of the second heat exchanger (114) in the flow direction of the utilization fluid (Fu) and allows the utilization fluid (Fu) to pass through to the third heat exchanger (HEX). Heat pump device (1).

7. The refrigerant circuit (11) includes a switching mechanism (116) that can switch between a cooling operation in which the flow direction of the refrigerant (Fr) is switched to make the second heat exchanger (114) function as an evaporator, and a heating operation in which the second heat exchanger (114) function as a heat radiator. The control unit (15) controls the switching mechanism (116) to switch between the cooling operation and the heating operation. The heat pump device (1) according to claim 2.

8. The control unit (15) is configured to communicate with a control device (6) that controls the temperature of the heat source fluid (Fh) in the heat source circuit (2) that circulates the heat source fluid (Fh) to the first heat exchanger (112) via the heat source pipeline (12), and transmits the required temperature of the heat source fluid (Fh) to the control device (6) of the heat source circuit (2) according to the temperature of the control board (151) and the load of the second heat exchanger (114) that exchanges heat between the refrigerant (Fr) and the utilization fluid (Fu) in the refrigerant circuit (11). The heat pump device (1) according to claim 7.

9. The system further includes a heat source control valve (Vh) provided in the first cooling pipe (121) that can adjust the flow rate of the heat source fluid (Fh) passing through the heat transfer member (HT), The control unit (15) controls the heat source control valve (Vh) according to the temperature of the control board (151) and the temperature of the heat source fluid (Fh) supplied to the heat source pipeline (12). The heat pump device (1) according to claim 7.

10. The system further includes a utilization control valve (Vu) provided in the second cooling pipe (131) that can adjust the flow rate of the utilization fluid (Fu) passing through the heat transfer member (HT), The control unit (15) controls the utilization control valve (Vu) according to the temperature of the control board (151), the temperature of the heat source fluid (Fh) supplied to the heat source pipeline (12), and the temperature of the utilization fluid (Fu) upstream of the second heat exchanger (114) in the flow direction of the utilization fluid (Fu). The heat pump device (1) according to claim 7.

11. The refrigerant (Fr) is a flammable refrigerant. A heat pump device (1) according to any one of claims 1 to 10.

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