Metal-ceramic bonded substrate and method for manufacturing the same

The metal-ceramic bonded substrate addresses strength and reliability issues by using an aluminum alloy annular member welded to through holes, ensuring robustness and thermal conductivity in power modules.

JP7870214B2Active Publication Date: 2026-06-04DOWA METALTECH CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DOWA METALTECH CO LTD
Filing Date
2022-07-28
Publication Date
2026-06-04

Smart Images

  • Figure 0007870214000008
    Figure 0007870214000008
  • Figure 0007870214000009
    Figure 0007870214000009
  • Figure 0007870214000010
    Figure 0007870214000010
Patent Text Reader

Abstract

To provide a metal-ceramic bonded substrate which suppresses deformation of a screw fastening part of a metal base plate bonded to a ceramic substrate and can suppress void defects at a joint part due to Fe diffusion from an annular member and the formation of an intermetallic compound with an iron-based material, without using a brazing filler metal for bonding a through hole and the annular member.SOLUTION: There is provided a metal-ceramic bonded substrate 1 in which a metal circuit board 12 is bonded to one surface of a ceramic substrate 10 and a metal base plate 14 is bonded to the other surface of the ceramic substrate 10. In the metal-ceramic bonded substrate, the metal base plate 14 comprises aluminum or an aluminum alloy, and an annular member 16 is welded to a through hole 14b formed to penetrate through from one surface of the metal base plate 14 to the other surface thereof, the annular member having a Vickers hardness greater than that of the metal base plate 14.SELECTED DRAWING: Figure 1B
Need to check novelty before this filing date? Find Prior Art