Retaining member

Abstract

This suppresses variations in the inter-line distance throughout the heater line section, thereby improving the temperature distribution on the adsorption surface. [Solution] The holding member comprises a plate-shaped member 20, a base 90, a bonding layer 70, and a heater. The heater has a heater line portion 41 which is a linear resistance heating element. The plate-shaped member 20, the base 90, or the bonding layer 70 has a special portion SP. The heater line portion 41 has a main line portion ML having a second main line portion ML2 whose distance from the first main line portion ML1 in the second direction D2 is a predetermined length, and a second main line portion ML. In direction D2, the structure has a first concave line portion RL1 formed around the singular portion SP, the first concave line portion RL1 having a first line portion L1 extending in the second direction D2 toward the singular portion SP when viewed in the first direction, a second line portion L2 running parallel to the first line portion L1 and extending in the second direction D2 when viewed in the first direction, and a third line portion L3 connecting one end of the first line portion L1 and one end of the second line portion L2.

Description

Technical Field

[0001] The present disclosure relates to a holding member.

Background Art

[0002] As a holding device for holding a wafer when manufacturing a semiconductor, for example, an electrostatic chuck is used. The electrostatic chuck includes a ceramic member having an adsorption surface and a chuck electrode provided inside the ceramic member. By utilizing the electrostatic attraction generated when a voltage is applied to the chuck electrode, the wafer is adsorbed and held on the adsorption surface of the ceramic member.

[0003] If the temperature of the wafer held on the adsorption surface of the electrostatic chuck does not reach the desired temperature, the accuracy of each process (film formation, etching, etc.) for the wafer may decrease. Therefore, the electrostatic chuck needs to control the temperature of the wafer. For example, a heater electrode having a heater line portion, which is a linear resistance heating element, is provided inside the ceramic member. When a voltage is applied to the heater electrode, the heater electrode generates heat, thereby heating the ceramic member, and thus realizing temperature control of the adsorption surface of the ceramic member (and thus temperature control of the wafer held on the adsorption surface).

[0004] In the ceramic member of the electrostatic chuck, there are singular points where the heater line portion of the heater electrode cannot be arranged, such as through holes for lift pins. Therefore, for example, in a configuration where the heater electrode has a plurality of concentric heater line portions when viewed in a first direction, a technique of arranging some of the heater line portions to be curved so as to avoid the singular points is known.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, if multiple heater lines are arranged to avoid the singularity, the heater lines become narrower around the singularity. If the line width remains constant while the pitch is narrowed, the heat generation density will increase. To maintain a constant heat generation density, the line width of the narrowed heater lines needs to be increased, but this may not result in the desired line width in the narrowed heater lines. [Means for solving the problem]

[0007] The holding member of this disclosure comprises a plate-shaped member having a circular suction surface perpendicular to a first direction, a base provided on the side of the plate-shaped member facing the suction surface, a bonding layer joining the plate-shaped member and the base, and a heater provided inside the plate-shaped member, wherein the heater has a heater line portion which is a linear resistance heating element, the plate-shaped member, the base, or the bonding layer has a singular portion which is a temperature singularity of the suction surface, and the heater line portion has a first main line portion and, when the radial direction of the suction surface is taken as the second direction in the first viewing direction, A retaining member having a main line portion having a second main line portion having a predetermined distance between it and the first main line portion in the second direction, and a first concave line portion formed around the singular portion in the second direction, wherein the first concave line portion has a first line portion extending in the second direction toward the singular portion when viewed in the first direction, a second line portion running parallel to the first line portion and extending in the second direction when viewed in the first direction, and a third line portion connecting one end of the first line portion and one end of the second line portion. [Effects of the Invention]

[0008] According to this disclosure, variations in the inter-line distance can be suppressed throughout the heater line section, and the temperature distribution of the adsorption surface can be improved. [Brief explanation of the drawing]

[0009] [Figure 1]Figure 1 is a perspective view schematically showing the general configuration of an electrostatic chuck according to an embodiment, with a portion of it cut away. [Figure 2] Figure 2 is a schematic cross-sectional view showing an example of the internal structure of an electrostatic chuck. [Figure 3] Figure 3 is a schematic plan view of the heater electrode. [Figure 4] Figure 4 is a plan view showing the heater electrode of Example 1. [Figure 5] Figure 5 is a plan view showing the heater electrode of Example 2. [Figure 6] Figure 6 is a plan view showing the heater electrode of Example 3. [Figure 7] Figure 7 is a diagram illustrating the schematic configuration of a conventional heater electrode. [Modes for carrying out the invention]

[0010] [Description of Embodiments in this Disclosure] First, embodiments of this disclosure will be listed and described. (1) The holding member of the present disclosure comprises a plate-shaped member having a circular suction surface perpendicular to a first direction, a base provided on the side of the plate-shaped member facing the suction surface, a bonding layer joining the plate-shaped member and the base, and a heater provided inside the plate-shaped member, wherein the heater has a heater line portion which is a linear resistance heating element, the plate-shaped member, the base, or the bonding layer has a singular portion which is a temperature singularity of the suction surface, and the heater line portion has a first main line portion and a second direction which is the radial direction of the suction surface when viewed in the first direction. In this configuration, the main line portion has a second main line portion whose distance from the first main line portion in the second direction is a predetermined length, and a first concave line portion formed around the singular portion in the second direction, wherein the first concave line portion has a first line portion extending in the second direction toward the singular portion when viewed in the first direction, a second line portion running parallel to the first line portion and extending in the second direction when viewed in the first direction, and a third line portion connecting one end of the first line portion and one end of the second line portion.

[0011] When routing the heater line section to avoid singular areas in the first viewing direction, it is possible to make the distance between the first and second line sections equal to the pitch of the main line section in the second direction (the distance between the first and second main line sections in the second direction) by adjusting the length of the third line section that constitutes the first concave line section. Furthermore, it is possible to make the length of the first line section and the length of the second line section equal to the pitch of the main line section in the second direction. This suppresses variations in the distance between lines in the heater line section as a whole, and improves the temperature distribution of the adsorption surface.

[0012] (2) In the retaining member described in (1), it is preferable that the heater line portion further comprises a second concave line portion having a fourth line portion extending in a third direction perpendicular to the second direction toward the singular portion side in the first view, a fifth line portion aligned with the fourth line portion and extending in the third direction in the first view, and a sixth line portion connecting the end of the fourth line portion and the end of the fifth line portion.

[0013] When routing the heater lines to avoid singular areas in the first viewing direction, it is possible to make the distance between the fourth and fifth lines equal to the pitch of the main line in the second direction by adjusting the length of the sixth line that constitutes the second concave line. Furthermore, it is possible to make the lengths of the fourth and fifth lines equal to the pitch of the main line in the second direction.

[0014] (3) In the retaining member described in (1) or (2), the first concave line portion further includes a seventh line portion that is aligned with the second line portion in a view in the first direction and extends in the second direction, and an eighth line portion that connects the other end of the second line portion to one end of the seventh line portion, and it is preferable that the distance between the first main line portion and the second main line portion and the distance between the eighth line portion and the third line portion are equal in the second direction.

[0015] It is possible to make the line-to-line distance between the first main line portion and the second main line portion in the second direction equal to the line-to-line distance between the eighth line portion and the third line portion in the second direction.

[0016] (4) In the holding member according to any one of (1) to (3), it is preferable that the specific portion is a first through hole penetrating in the first direction in the plate-like member. When wiring the heater line portion so as to avoid the first through hole in the first direction view, it is possible to suppress the occurrence of variations in the line-to-line distance of the entire heater line portion and improve the temperature distribution of the adsorption surface.

[0017] (5) In the holding member according to any one of (1) to (3), it is preferable that the base includes a cooling flow path, and the specific portion is a second through hole penetrating in the first direction in the base. In the plate-like member, the portion where the second through hole of the base is provided in the first direction view is not provided with a cooling flow path, and the adsorption surface is likely to become high temperature. Therefore, the heater line portion is wired so as to avoid the second through hole of the base in the first direction view. At that time, it is possible to suppress the occurrence of variations in the line-to-line distance of the entire heater line portion and improve the temperature distribution of the adsorption surface.

[0018] (6) In the holding member according to any one of (1) to (3), the bonding layer has a bonding portion that bonds the plate-like member and the base, and a void where the bonding portion does not exist, and it is preferable that the specific portion is the void. In the plate-like member, the void where the bonding portion does not exist in the first direction view has a poor thermal conductivity compared to the portion where the bonding portion exists, and the adsorption surface is likely to become high temperature. Therefore, the heater line portion is wired so as to avoid the void in the first direction view. At that time, it is possible to suppress the occurrence of variations in the line-to-line distance of the entire heater line portion and improve the temperature distribution of the adsorption surface.

[0019] (7) In the holding member described in any of (1) to (3), the heater has a pad provided at the end of the heater line portion, and the special portion is preferably the pad. When routing the heater line section to avoid the pads in the first viewing direction, variations in the distance between lines can be suppressed throughout the heater line section, thereby improving the temperature distribution of the adsorption surface.

[0020] [Details of the embodiments of this disclosure] Specific examples of embodiments of this disclosure will be described in detail with reference to Figures 1 to 7. This disclosure is not limited to illustrative examples, but is indicated by the claims, and all modifications within the meaning and scope of equivalence to the claims are intended. Some parts of each drawing show the X, Y, and Z axes of the Cartesian coordinate system XYZ, and each axis is drawn in the same direction in each figure. Hereafter, the Z axis direction is defined as the up and down direction, with the upper side of Figure 2 being referred to as "up" and the lower side of Figure 2 being referred to as "down". In addition, for multiple identical members, one member may be given a reference numeral and the reference numerals of the other members may be omitted. In this specification, "orthogonal" also includes arrangements that are perceived as substantially orthogonal.

[0021] <Electrostatic Chuck> In this embodiment, an electrostatic chuck 10 is given as an example of a holding member. The electrostatic chuck 10 is a holding device that attracts and holds an object (workpiece), such as a semiconductor wafer or glass substrate (hereinafter referred to as "wafer 100"), by electrostatic attraction. The electrostatic chuck 10 is used, for example, as a table on which the wafer 100 is placed in an etching process using plasma in a reduced-pressure chamber.

[0022] Figure 1 is a schematic diagram showing the configuration of the electrostatic chuck 10. The electrostatic chuck 10 comprises a disc-shaped plate member 20, a disc-shaped base 90, and a bonding layer 70 that joins the plate member 20 and the base 90. The base 90 is larger than the plate member 20; for example, if the plate member 20 is a disc with a diameter of 300 mm and a thickness of 3 mm, the base 90 can be a disc with a diameter of 340 mm and a thickness of 20 mm. Both the plate member 20 and the base 90 only need to be roughly disc-shaped, and may have protrusions or indentations for alignment.

[0023] The base 90 and the plate-shaped member 20 are arranged in the Z-axis direction and joined together by a bonding layer 70 or the like. The upper surface of the disc-shaped insulating plate 30 constituting the plate-shaped member 20 is an adsorption surface 30S1 that adsorbs and holds the wafer 100, and the lower surface of the insulating plate 30 is a bonding surface 30S2 that is joined to the base 90.

[0024] Figure 2 is a cross-sectional view of the electrostatic chuck 10 when it is cut by a plane perpendicular to the suction surface 30S1, including radii RA and RB, and schematically shows an example of the internal structure of the electrostatic chuck 10. In this embodiment, the Z-axis direction (vertical direction) is considered the first direction. Also in this embodiment, when viewing the insulating plate 30 from the Z-axis direction, the multiple pads 42 are not located on the same radius, and the radius passing through the pad 42 on the right side of the figure is denoted as RA, and the radius passing through the pad 42 on the left side of the figure is denoted as RB.

[0025] The suction surface 30S1 is the plate surface facing upward of the disc-shaped insulating plate 30, and is a plane normalized to the Z-axis, forming a circle when viewed from the Z-axis direction. The suction surface 30S1 only needs to be generally circular, and may have notches or other features. The center line CL is defined as a line passing through the center C of the suction surface 30S1 and parallel to the Z-axis, and the direction from the center C toward the outer circumference is defined as the radial direction.

[0026] The suction surface 30S1 is circular in shape with center C when viewed from the Z-axis direction and is a surface substantially perpendicular to the Z-axis direction. The suction surface 30S1 may have irregularities. The bonding surface 30S2 is a plate surface of the disc-shaped insulating plate 30 that faces downward and is located on the opposite side of the insulating plate 30 from the suction surface 30S1 in the Z-axis direction (the surface facing the suction surface 30S1).

[0027] As shown in Figure 2, the insulating plate 30 is divided into a ring-shaped outer peripheral region OR located radially outward, including the outer edge, when viewed from the Z-axis direction, and a circular inner peripheral region IR located inward from the outer peripheral region OR. The boundary between the outer peripheral region OR and the inner peripheral region IR can be set, for example, at a position where the distance from the center in the radial direction is 0.6 to 0.9 times the radius. Although the example shows the outer peripheral region OR and the inner peripheral region IR being divided by a ring connecting the edges of the holes of the nozzles 32, which will be described later and are arranged on the adsorption surface 30S1, the example is not limited to this, and the boundary between the outer peripheral region OR and the inner peripheral region IR can be set arbitrarily. Furthermore, the inner peripheral region IR may be further divided into multiple regions, for example, a ring-shaped intermediate region and an inner region inside the intermediate region.

[0028] A bonding layer 70 is placed between the joining surface 30S2 of the plate-shaped member 20 and the upper surface of the base 90. The bonding layer 70 has a joint portion 71 that joins the plate-shaped member 20 and the base 90, and a void 72 where the joint portion 71 is not present. The joint portion 71 is made of an adhesive mainly composed of silicone resin, acrylic resin, epoxy resin, etc. The joint portion 71 bonds the insulating plate 30 and the base 90, contributes to heat conduction between the two members, and has the function of relieving stress caused by the difference in thermal expansion coefficients of the two members.

[0029] The electrostatic chuck 10 has a pin insertion hole 11 that penetrates both the insulating plate 30 and the base 90 that constitute the plate-shaped member 20 in the vertical direction. A lift pin is inserted through this pin insertion hole 11, and when the lift pin is moved upward, the wafer 100 can be lifted from the suction surface 30S1. The pin insertion hole 11 is an example of the first through hole and the second through hole of this disclosure.

[0030] <Plate-shaped member> As shown in Figures 1 and 2, the plate-shaped member 20 includes a disc-shaped insulating plate 30 and has the function of heating the wafer 100 held on the suction surface 30S1 to a predetermined temperature. In this embodiment, a heater electrode 40 is arranged inside the insulating plate 30. The heater electrode 40 may also be provided on the bonding surface 30S2 of the insulating plate 30. A chuck electrode 50 is also arranged inside the insulating plate 30 between the heater electrode 40 and the suction surface 30S1.

[0031] In this embodiment, the insulating plate 30 is made of an insulator that includes ceramics, such as alumina, aluminum nitride, yttria, or a composite material of alumina and silicon carbide as its main components. In addition to ceramics, the insulating plate 30 may also be made of an insulator that includes polyimide or pyrolysis boron nitride (PBN).

[0032] As previously described, the insulating plate 30 is disc-shaped and has an adsorption surface 30S1 that is substantially perpendicular to the Z-axis direction. Furthermore, as shown in Figures 1 and 2, a gas channel 31 for flowing a gas such as helium is formed inside the insulating plate 30 in this embodiment. The gas channel 31 includes vertical holes and horizontal holes, and nozzles 32 communicating with the gas channel 31 are formed in an annular arrangement on the adsorption surface 30S1. The vertical holes in the gas channel 31 are an example of the first through-holes of this disclosure.

[0033] When gas is supplied to the gas channel 31 from a gas supply source (not shown), the gas discharged from the nozzle 32 via the vertical and horizontal holes is introduced into the space between the wafer 100 and the insulating plate 30. This improves the heat conduction between the wafer 100 and the insulating plate 30, and improves the temperature control of the wafer 100 by the plate-shaped member 20. The insulating plate 30 does not necessarily have a gas channel, or it may have a gas channel consisting only of vertical holes.

[0034] The heater electrode 40 generates heat when a voltage is applied. The heater electrode 40 can be mainly composed of tungsten, molybdenum, or alloys thereof, or carbides thereof. In this embodiment, a metallized heater electrode 40 is used, which is made by printing a conductive paste and sintering a conductive layer. However, the heater electrode 40 is not limited to this, and metal foil, metal mesh, etc. may be used as the heater electrode 40. The heater electrode 40 is an example of the heater of this disclosure.

[0035] The chuck electrode 50 exhibits electrostatic attraction force when a voltage is applied. The type of electrostatic attraction force that can be used includes Coulomb force, Johnsen-Rabec force, or gradient force. The chuck electrode 50 can be composed mainly of tungsten, molybdenum, or alloys thereof. In this embodiment, an example is given where a metallized conductive layer, formed by sintering a conductive paste, is used as the chuck electrode 50. However, metal foil, metal mesh, etc., may also be used as the chuck electrode 50.

[0036] As shown in Figures 1 and 2, in the plate-shaped member 20, the chuck electrode 50 is arranged vertically alongside the heater electrode 40 inside the insulating plate 30. The chuck electrode 50 is positioned on the upper side, closer to the suction surface 30S1, and the heater electrode 40 is positioned below the chuck electrode 50. Inside the insulating plate 30, a connecting member 60 is positioned below the heater electrode 40, and a connecting member 61 is positioned below the chuck electrode 50. The heater electrode 40 is connected to the heater power supply terminal 80, which will be described later, via the connecting member 60, and the chuck electrode 50 is connected to the chuck power supply terminal 81, which will be described later, via the connecting member 61. The connecting member 60 will be described later.

[0037] In this embodiment, the plate-shaped member 20 is made by integrating multiple ceramic sheets. In order to form the gas flow path 31, heater electrode 40, chuck electrode 50, etc., each of the multiple ceramic sheets is first processed, such as by perforating or applying conductive material, according to a predetermined pattern specific to each ceramic sheet. After that, the processed multiple ceramic sheets are stacked in the Z-axis direction and integrated through processes such as thermocompression bonding, cutting, and firing.

[0038] <Base> The base 90 can be made primarily of aluminum, aluminum alloy, a composite of metal and ceramics (Al-SiC), or ceramics (SiC). As previously described, the base 90 is disc-shaped and has a larger diameter than the plate-shaped member 20 so that the entire plate-shaped member 20 can be placed on it.

[0039] As shown in Figures 1 and 2, a gas introduction passage 91 communicating with the gas flow path 31 of the insulating plate 30 described above, and a refrigerant flow path 92 are formed inside the base 90. A refrigerant such as water or a fluorine-based inert liquid flows through the refrigerant flow path 92. When the refrigerant flows through the refrigerant flow path 92, the base 90 is cooled, the insulating plate 30 is cooled by heat conduction through the joint 71, and the wafer 100 held on the adsorption surface 30S1 of the insulating plate 30 is further cooled. The temperature of the wafer 100 is controlled by adjusting the flow of the refrigerant. The gas introduction passage 91 is an example of the second through-hole of this disclosure.

[0040] As shown in Figures 1 and 2, a heater power supply terminal 80 and a chuck power supply terminal 81 are arranged inside the base 90, penetrating it vertically. Each power supply terminal 80 and 81 can be made of a metal such as nickel (Ni). The lower ends of each power supply terminal 80 and 81 are exposed on the lower surface of the base 90 and connected to a power supply (not shown). The upper ends of each power supply terminal 80 and 81 are exposed on the upper surface of the bonding layer 70, and the heater power supply terminal 80 is connected to the heater electrode 40 via a connecting member 60, and the chuck power supply terminal 81 is connected to the chuck electrode 50 via a connecting member 61. This allows power from each power supply to be supplied to the heater electrode 40 and the chuck electrode 50 through the heater power supply terminal 80 and the chuck power supply terminal 81.

[0041] When using the electrostatic chuck 10, power from the chuck's power supply is supplied to the chuck electrode 50 via the chuck power supply terminal 81. This applies a voltage to the chuck electrode 50, generating an electrostatic attraction force that attracts the wafer 100, and the wafer 100 is held on the attraction surface 30S1 by this electrostatic attraction force. Furthermore, when performing processing such as etching, power from the heater's power supply is supplied to the heater electrode 40 via the heater power supply terminal 80. This applies a voltage to the heater electrode 40, generating heat, which raises the temperature of the insulating plate 30, and heats the wafer 100 held on the attraction surface 30S1.

[0042] <Heater electrode configuration> Let me explain the heater electrode 40 again. In this embodiment, the heater electrode 40 is a metallized product obtained by printing a conductive paste onto a specific ceramic sheet from among the multiple ceramic sheets that form the insulating plate 30 described above, and then sintering the conductive layer. Therefore, the heater electrode 40 is arranged inside the insulating plate 30 in a heater electrode layer that is substantially parallel to the adsorption surface 30S1.

[0043] As shown in Figure 6, the heater electrode 40 includes a heater line portion 41 which is a linear resistance heating element, and a pad 42 provided at the end of the heater line portion 41. The pad 42 is, for example, approximately circular when viewed from the Z-axis direction and is directly connected to the end of the heater line portion 41 without any other members. The pad 42 has a thickness approximately the same as the heater line portion 41, and its diameter when viewed from the Z-axis direction is larger than the line width of the heater line portion 41. Power is supplied from the heater power supply terminal 80 through this pad 42 and a voltage is applied to the heater line portion 41.

[0044] <Outline configuration of the heater line section> Figure 3 shows the schematic configuration of the heater line section 41. The circular area in Figure 3 is the special section SP. The special section SP is the part of the heater line section 41 that is not wired because it tends to become hotter than the surrounding area. This ensures a good temperature distribution. Specifically, the special section SP is the area where the vertical holes of the gas flow path 31 of the insulating plate 30, the pin insertion holes 11 for the lift pins, the connecting members 60 and 61, the heater power supply terminal 80, the chuck power supply terminal 81, etc., overlap when viewed from the Z-axis direction. In addition to these, the special section SP may also be the area where recesses (for arranging terminals and temperature sensors (thermistors, thermocouples)) provided on the side of the plate-shaped member 20 facing the adsorption surface 30S1 overlap.

[0045] Conventionally, in order to achieve a good temperature distribution, the heater line section was arranged in an arc shape to bypass the singular section SP. For example, as shown in Figure 7(A), when the heater line section HL is wired at equal pitches, if it is wired in an arc shape to bypass the singular section SP, the pitch can be narrowed or widened, as shown in Figure 7(B). Here, if it is desired to narrow the pitch, the first heater line section HL1 is formed so that its line width is wider than that of the heater line section HL. This is because a wider line width reduces the amount of heat generated, thus maintaining a constant heat density. On the other hand, if it is desired to widen the pitch, the second heater line section HL2 is formed so that its line width is narrower than that of the heater line section HL. This is because a narrower line width increases the amount of heat generated, thus maintaining a constant heat density.

[0046] However, changing the line width of the heater line section HL may result in the desired line width not being achieved during manufacturing. For example, if the pitch is narrowed, the line width needs to be widened, which increases the amount of ink required per unit area. This could lead to insufficient ink supply and a line width narrower than desired. Conversely, if the pitch is widened, the line width needs to be narrowed, which decreases the amount of ink required per unit area. This could lead to excessive ink supply and a line width wider than desired. Thus, changing the line width in conjunction with changing the pitch of the heater line section HL is technically difficult, and it is desirable to avoid changing the pitch of the heater line section HL as much as possible.

[0047] From this perspective, as a method of bypassing the singular portion SP without changing the pitch, in this embodiment, as shown in Figure 3, the heater line portion 41 is wired to bypass the singular portion SP in an orthogonal arrangement rather than parallel to it. Since the line width of the heater line portion 41 can be kept constant without changing the pitch of the heater line portion 41, variations in line width can be avoided, and the heat generation density can be kept constant.

[0048] As shown in Figure 3, the radial direction of the suction surface 30S1 is defined as the second direction D2, and the circumferential direction of the suction surface 30S1 is defined as the third direction D3 when viewed in the Z-axis direction. The heater line portion 41 has a main line portion ML extending in the third direction D3, and a first concave line portion RL1 formed around the singular portion SP in the second direction D2. The main line portion ML has a first main line portion ML1 and a second main line portion ML2 whose distance from the first main line portion ML1 in the second direction D2 is a predetermined length.

[0049] The first concave line portion RL1 has a first line portion L1 extending in the second direction D2 toward the singular portion SP when viewed in the Z-axis direction, a second line portion L2 running parallel to the first line portion L1 and extending in the second direction D2 when viewed in the Z-axis direction, and a third line portion L3 connecting the outer end of the first line portion L1 in the second direction D2 and the outer end of the second line portion L2 in the second direction D2.

[0050] When routing the heater line section 41 so as to avoid the singular portion SP in a view along the Z-axis, it is possible to make the distance between the first line section L1 and the second line section L2 equal to the pitch of the main line section ML in the second direction D2 (the distance between the first main line section ML1 and the second main line section ML2 in the second direction D2) by adjusting the length of the third line section L3 that constitutes the first concave line section RL1. Furthermore, it is possible to make the length of the first line section L1 and the length of the second line section L2 equal to the pitch of the main line section ML in the second direction D2. As a result, variations in the distance between lines can be suppressed for the heater line section 41 as a whole, and the temperature distribution of the adsorption surface 30S1 can be improved.

[0051] The first line section L1, the second line section L2, and the third line section L3 that constitute the first concave line section RL1, and the first main line section ML1 and the second main line section ML2 that constitute the main line section ML, all have the same line width.

[0052] The heater line portion 41 further includes a second concave line portion RL2. The second concave line portion RL2 has a fourth line portion L4 extending in a third direction D3 perpendicular to the second direction D2 toward the singular portion SP when viewed in the Z-axis direction, a fifth line portion L5 running parallel to the fourth line portion L4 and extending in the third direction D3 when viewed in the Z-axis direction, and a sixth line portion L6 connecting the end of the fourth line portion L4 and the end of the fifth line portion L5.

[0053] When routing the heater line section 41 so as to avoid the singular section SP in a view along the Z axis, it is possible to make the distance between the fourth line section L4 and the fifth line section L5 equal to the pitch of the main line section ML in the second direction D2 by adjusting the length of the sixth line section L6 that constitutes the second concave line section RL2. Furthermore, it is possible to make the length of the fourth line section L4 and the length of the fifth line section L5 equal to the pitch of the main line section ML in the second direction D2.

[0054] The first concave line portion RL1 further includes, in view in the Z-axis direction, a seventh line portion L7 that is aligned with the second line portion L2 and extends in the second direction D2, and an eighth line portion L8 that connects the inner end of the second line portion L2 in the second direction D2 with the inner end of the seventh line portion L7 in the second direction D2.

[0055] It is possible to make the distance between the first main line section ML1 and the second main line section ML2 in the second direction D2 equal to the distance between the eighth line section L8 and the third line section L3 in the second direction D2.

[0056] The distance between the second main line section ML2 and the third line section L3 in the second direction D2 is the same as the distance between the first main line section ML1 and the second main line section ML2 in the second direction D2. Furthermore, the distance between the second main line section ML2 and the third line section L3 in the second direction D2 is the same as the distance between the third line section L3 and the eighth line L8 in the second direction D2. In this application, "same" and "equal" do not necessarily mean perfect matching, but also include a range of manufacturing variations.

[0057] When the singular portion SP is a first through-hole that penetrates the plate-shaped member 20 in the Z-axis direction, when the heater line portion 41 is wired so as to avoid the first through-hole when viewed in the Z-axis direction, variations in the distance between lines in the heater line portion 41 as a whole can be suppressed, and the temperature distribution of the adsorption surface 30S1 can be improved.

[0058] If the special part SP is a second through-hole that penetrates the base 90 in the Z-axis direction, then in the plate-shaped member 20, the portion where the second through-hole of the base 90 is located, when viewed in the Z-axis direction, does not have a refrigerant flow path 92, and the adsorption surface 30S1 tends to become hot. Therefore, the heater line portion 41 is routed to avoid the second through-hole of the base 90 when viewed in the Z-axis direction. In this case, variations in the distance between lines in the heater line portion 41 as a whole can be suppressed, and the temperature distribution of the adsorption surface 30S1 can be improved.

[0059] The bonding layer 70 has a bonding portion 71 that joins the plate-shaped member 20 and the base 90, and a void 72 where the bonding portion 71 is not present. When the singular portion SP is a void 72, the void 72 in the plate-shaped member 20, when viewed in the Z-axis direction, has poorer thermal conductivity compared to the portion where the bonding portion 71 is present, and the adsorption surface 30S1 tends to become hotter. Therefore, the heater line portion 41 is routed so as to avoid the void 72 when viewed in the Z-axis direction. In this case, variations in the distance between lines in the heater line portion 41 as a whole can be suppressed, and the temperature distribution of the adsorption surface 30S1 can be improved.

[0060] The heater electrode 40 has a pad 42 provided at the end of the heater line portion 41. When the singular portion SP is the pad 42, when the heater line portion 41 is routed to avoid the pad 42 in a view along the Z axis, variations in the inter-line distance of the heater line portion 41 as a whole can be suppressed, and the temperature distribution of the adsorption surface 30S1 can be improved.

[0061] <Example 1> Embodiment 1 of this model will be explained with reference to Figure 4. In Embodiment 1, a plurality of singular parts SP are arranged in a line in a third direction D3, a second concave line portion RL2 is formed between a pair of singular parts SP adjacent to each other in the third direction D3, and a first concave line portion RL1 is formed on the outside of the singular parts SP in the second direction D2.

[0062] When the distance between a pair of adjacent singular parts SP is short, the conventional method of escaping in an arc shape parallel to each other tends to result in a narrower pitch. However, in Embodiment 1, a method of escaping in a direction intersecting the singular parts SP is adopted, so that the second concave line section RL2 can be wired while maintaining an equal pitch without narrowing the pitch.

[0063] On the outer side of the first concave line portion RL1 in the second direction D2, a main line portion ML is formed, comprising a first main line portion ML1 and a second main line portion ML2. When the distance between the main line portion ML and the singular portion SP is short, the conventional method of escaping in an arc shape parallel to each other tends to result in a narrower pitch. However, in Embodiment 1, a method of escaping in a direction intersecting the singular portion SP is adopted, so that the first concave line portion RL1 can be wired while maintaining an equal pitch without narrowing the pitch.

[0064] <Example 2> Embodiment 2 of this model will be explained with reference to Figure 5. In Embodiment 2, the singular parts SP are not as close together as in Embodiment 1, and a wide area is secured around the singular parts SP for wiring the heater line 41. In such a case, the first concave line RL1 and the second concave line RL2 may be used in combination with the conventional arc-shaped line AL.

[0065] The arc-shaped line portion AL includes a first arc-shaped line portion AL1 that extends in an arc along the singular portion SP, a second arc-shaped line portion AL2 that is located on the outer circumference of the first arc-shaped line portion AL1 and extends in an arc along the first arc-shaped line portion AL1, and a third arc-shaped line portion AL3 that is located on the outer circumference of the second arc-shaped line portion AL2 and extends in an arc along the second arc-shaped line portion AL2.

[0066] In the third arc-shaped line section AL3, an opening ALO is formed at the inner end in the second direction D2, and the first line section L1 and the second line section L2 are connected to this opening ALO, respectively. In this case, the third line section connecting the outer end in the second direction D2 of the first line section L1 and the outer end in the second direction D2 of the second line section L2 is composed of a second arc-shaped line section AL2, a third arc-shaped line section AL3, and a pair of left and right fourth line sections L4 that connect their ends.

[0067] <Example 3> Embodiment 3 of this model will be explained with reference to Figure 6. In Embodiment 3, a plurality of pads 42 are formed around the singular portion SP, and the first concave line portion RL1 and the second concave line portion RL2 are formed so as to avoid the pads 42 and the singular portion SP. In Embodiment 3, as in Embodiment 2, the first concave line portion RL1 and the second concave line portion RL2 are used in combination with the conventional arc-shaped line portion AL.

[0068] An arc-shaped line portion AL is formed between the singular portion SP and the multiple pads 42, and a second opening ALO2 is formed at the inner end of the arc-shaped line portion AL in the second direction D2. A first line portion L1 and a second line portion L2 are connected to this second opening ALO2, respectively. The second line portion L2 is located to the right of the first line portion L1 in the illustration, and the end of the second line portion L2 and the end of the first line portion L1 are connected by a third line portion L3.

[0069] Multiple third openings ALO3 are formed at both ends of the arc-shaped line section AL in the third direction D3. A pair of third openings ALO3 are arranged on the left side of the singular section SP in the figure, and a pair of third openings ALO3 are arranged on the right side in the figure. The fourth line section L4 and the fifth line section L5 are connected to these third openings ALO3, respectively. The ends of the fourth line section L4 and the ends of the fifth line section L5 are connected by a sixth line section (not shown).

[0070] <Other Embodiments> (1) In the above embodiment, a third line section L3 is provided which connects the outer end of the first line section L1 in the second direction D2 with the outer end of the second line section L2 in the second direction D2. However, the third line section may also be provided which connects the inner end of the first line section L1 in the second direction D2 with the inner end of the second line section L2 in the second direction D2.

[0071] (2) In the above embodiment, the first line portion L1 is provided in an arrangement that intersects with the singular portion SP, but the first line portion does not necessarily have to be arranged to intersect with the singular portion SP, and may be arranged to extend in the second direction D2 toward the singular portion SP. The same applies to the fourth line portion L4, which does not necessarily have to be arranged to intersect with the singular portion SP, and may be arranged to extend in the third direction D3 toward the singular portion SP.

[0072] (3) In the above embodiment, a sixth line section L6 was provided as an example, connecting the end of the fourth line section L4 that is furthest from the singular section SP and the end of the fifth line section L5 that is furthest from the singular section SP. However, the sixth line section may also be provided as connecting the end of the fourth line section L4 that is closer to the singular section SP and the end of the fifth line section L5 that is closer to the singular section SP.

[0073] (4) In the above embodiment, an electrostatic chuck 10 consisting of a plate-shaped member 20 and a base 90, in which chuck electrodes and gas flow channels are formed in the plate-shaped member 20, was illustrated as an example, but the invention is not limited thereto. For example, gas flow channels may not be provided in the plate-shaped member.

[0074] (5) In the above embodiment, an electrostatic chuck 10 was used as an example of a holding member, but the present disclosure is not limited thereto. For example, this disclosure can also be applied to heater devices such as CVD (Chemical Vapor Deposition) heaters and vacuum chucks. [Explanation of Symbols]

[0075] 10: Electrostatic chuck (holding member) 11: Pin insertion hole (first through hole, second through hole) 20: Plate-shaped member 30: Insulating plate 30S1: Adsorption surface 30S2: Joint surface 31: Gas flow path (first through hole) 32: Outlet 40: Heater electrode (heater) 41: Heater line section 42: Pad 50: Chuck electrode 60: Connecting member 61: Connecting member 70: Bonding layer 71: Bonding part 72: Vacant space 80: Heater power supply terminal 81: Chuck power supply terminal 90: Base 91: Gas introduction passage (second through-hole) 92: Refrigerant flow path (flow path) 100: Wafer C: Center CL: Center line D2: Second direction D3: Third direction IR: Inner area OR: Outer area RA: Radius RB: Radius SP: Singular part ML: Main line section 1st main line section: ML1 2nd main line section: ML2 RL1: First concave line section L1: First line section L2: Second line section L3: Third line section L7: Seventh line section L8: Eighth line section RL2: Second concave line section L4: Fourth line section L5: Fifth line section L6: Sixth line section AL: Arc-shaped line section AL1: First arc-shaped line section AL2: Second arc-shaped line section AL3: Third arc-shaped line section ALO: Opening

Claims

1. A plate-shaped member having a circular suction surface perpendicular to the first direction, A base provided on the side of the plate-shaped member facing the suction surface, A bonding layer that joins the plate-shaped member and the base, The plate-shaped member comprises a heater provided inside the plate-shaped member, The heater has a heater line portion which is a linear resistance heating element. The plate-like member, the base, or the bonding layer has a special portion that becomes a temperature singularity of the adsorption surface, The aforementioned heater line section is, A main line portion having a first main line portion and a second main line portion having a predetermined distance between the first main line portion and the second main line portion in the second direction, when the radial direction of the adsorption surface in the first direction view is the second direction, In the second direction, it has a first concave line portion formed around the distinctive portion, The first concave line portion is, It has a plurality of units arranged in a third direction which is the circumferential direction of the adsorption surface, Each of the aforementioned units is In the first view, the first line portion extends in the second direction toward the singular portion, A second line portion is aligned with the first line portion and extends in the second direction when viewed in the first direction, A third line portion connecting the end of the first line portion opposite to the singular portion in the second direction and the end of the second line portion opposite to the singular portion in the second direction, A retaining member having an eighth line portion extending in the third direction from the end of the second line portion on the side of the singular portion in the second direction.

2. The aforementioned heater line section further, In the first viewing direction, a fourth line portion extending in the third direction toward the singular portion, In the first view, a fifth line portion is aligned with the fourth line portion and extends in the third direction, The retaining member according to claim 1, comprising a second concave line portion having a sixth line portion connecting the end of the fourth line portion and the end of the fifth line portion.

3. The holding member according to claim 1, wherein in the second direction, the distance between the first main line portion and the second main line portion is equal to the distance between the eighth line portion and the third line portion.

4. The holding member according to claim 1 or claim 2, wherein the distinctive portion is a first through-hole penetrating the plate-shaped member in the first direction.

5. The base is equipped with a cooling channel, The holding member according to claim 1 or claim 2, wherein the distinctive portion is a second through-hole that penetrates the base in the first direction.

6. The holding member according to claim 1 or claim 2, wherein the joining layer has a joining portion that joins the plate-like member and the base, and a void where the joining portion does not exist, and the unique portion is the void.

7. The heater has a pad provided at the end of the heater line portion. The retaining member according to claim 1 or claim 2, wherein the distinctive portion is the pad.

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