Component mounting device and component mounting method

Abstract

To provide a component mounting system capable of improving the accuracy of a component mounting position.SOLUTION: The component mounting system includes: a mounting head that performs a mounting operation to mount a component picked up from a component supply unit for supplying the component to a circuit board; a moving mechanism that moves the mounting head between the component supply unit and a circuit board placement unit that places the circuit board; an imaging unit that picks up an image of the features of the mounting head; and an arithmetic circuit that controls the moving mechanism and the imaging unit and detects the position of the mounting head based on the imaging results of the features by the imaging unit. The arithmetic circuit is configured so as to, in a preliminary operation of moving the mounting head by the moving mechanism before the mounting operation, detect multiple positions of the mounting head corresponding to each imaging result of the multiple features by the imaging unit and determine whether or not to continue the preliminary operation based on the variations in the position of the detected mounting head.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a component mounting device and a component mounting method.

Background Art

[0002] In a component mounting device including a bonding head that holds components and mounts them on a substrate, it is known that thermal expansion occurs in the components of the component mounting device due to heat generation from motors, heaters, etc., resulting in a problem of reduced positional accuracy of component mounting. In order to suppress such a decrease in mounting accuracy, for example, Patent Document 1 discloses a mounting device that can perform the main operation of mounting while stabilizing the temperature by performing a pre-processing operation (preliminary operation) before the main operation of mounting.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the mounting device described in Patent Document 1, the pre-processing operation is performed for a time or number of times that is preliminarily derived empirically or experimentally. Patent Document 1 discloses, as a method of empirically or experimentally deriving the number of repetitions of this pre-processing operation, counting the number of repetitions until the temperature detected by a thermometer mounted on the mounting device stabilizes. However, in the mounting device described in Patent Document 1, since the temperature of the mounting device portion away from the portion where the thermometer is mounted cannot be detected, it is impossible to accurately detect that the thermal expansion of the entire device has stabilized. Therefore, further thermal expansion may occur in the main operation, and the generated thermal expansion may adversely affect the positional accuracy of component mounting.

[0005] An object of the present disclosure is to provide a component mounting device and a component mounting method capable of improving the positional accuracy of component mounting. [Means for solving the problem]

[0006] A component mounting device relating to one aspect of this disclosure is: A mounting head that performs a mounting operation to mount the components picked up from a component supply unit onto a circuit board, A moving mechanism for moving the mounting head between the component supply unit and the substrate mounting unit on which the substrate is placed, An imaging unit for capturing a characteristic part of the mounted head, The system includes a calculation circuit that controls the moving mechanism and the imaging unit, and detects the position of the mounted head based on the imaging result of the feature unit, The aforementioned arithmetic circuit is In a preliminary operation in which the mounting head is moved by the moving mechanism before the aforementioned mounting operation, the multiple positions of the mounting head corresponding to each of the multiple imaging results of the feature portion by the imaging unit are detected. Based on the detected variation in the position of the mounted head, it is determined whether or not the preparatory operation should be continued.

[0007] A component mounting method relating to one aspect of this disclosure is: A mounting head that performs a mounting operation to mount the components picked up from a component supply unit onto a circuit board, A moving mechanism for moving the mounting head between the component supply unit and the substrate mounting unit on which the substrate is placed, An imaging unit for capturing a characteristic part of the mounted head, A calculation circuit that controls the moving mechanism and the imaging unit and detects the position of the mounted head based on the imaging results of the feature unit, A component mounting method performed by a component mounting device comprising: The calculation circuit includes the step of acquiring multiple imaging results of characteristic parts of the mounting head, which are imaged by the imaging unit, in a preliminary operation in which the mounting head is moved by the moving mechanism before the mounting operation, The calculation circuit includes the step of detecting multiple positions of the mounted head corresponding to each of the multiple imaging results of the feature section, The calculation circuit includes the step of determining whether or not to continue the preliminary operation based on the detected variation in the position of the mounted head. [Effects of the Invention]

[0008] The component mounting device and component mounting method described herein can improve the positional accuracy of component mounting. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram showing an example of the configuration of a component mounting device according to Embodiment 1. [Figure 2] Block diagram showing an example of the control device configuration in Figure 1. [Figure 3] A flowchart illustrating the procedure for preliminary operations performed by the component mounting device according to Embodiment 1. [Figure 4] A schematic diagram illustrating a component mounting device when the bonding head is in the imaging position. [Figure 5] A graph showing an example of location detection results. [Figure 6] A graph showing an example of location detection results. [Figure 7] Block diagram showing an example configuration of the control device for a component mounting device according to Embodiment 2. [Figure 8] A graph showing an example of change data in Figure 7. [Figure 9] A flowchart illustrating the procedure for preliminary operations performed by the component mounting device according to Embodiment 2. [Figure 10] A flowchart illustrating the procedure for preliminary operations performed by the component mounting device according to Embodiment 2. [Figure 11] A flowchart illustrating the procedure for the preliminary imaging operation performed by the component mounting device according to Embodiment 3. [Figure 12] A graph showing an example of position detection results in the X direction. [Figure 13] A graph showing an example of position detection results in the Y direction. [Figure 14]Graph showing an example of the position detection result in the θ direction [Figure 15] Flowchart exemplifying the procedure of the preliminary imaging operation performed by the component mounting apparatus according to Embodiment 4 [Figure 16] Flowchart exemplifying the procedure of the preliminary imaging operation performed by the component mounting apparatus according to Embodiment 4

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings as appropriate. In each figure, for the sake of easy explanation, each element may be exaggerated as appropriate. Note that the present disclosure is not limited to the following embodiments. Also, the present disclosure can be appropriately changed without departing from the scope in which the effects of the present disclosure are achieved.

[0011] 1. Embodiment 1 1-1. Configuration FIG. 1 is a schematic diagram showing a configuration example of a component mounting apparatus 100 according to Embodiment 1 of the present disclosure. The component mounting apparatus 100 picks up a component 120 such as a semiconductor chip from a component supply unit 9 and mounts it on a substrate 110. In FIG. 1, for convenience of explanation, an X-axis, a Y-axis, and a Z-axis orthogonal to each other are shown. In the example shown in FIG. 1, the Z-axis is parallel to the vertical direction.

[0012] The component mounting apparatus 100 includes a frame 6 and a bonding stage (substrate mounting unit) 11 on which the substrate 110 is placed. The frame 6 supports each component of the component mounting apparatus 100. One or a plurality of frames 6 constitute, for example, the housing, base, wall, support column, etc. of the component mounting apparatus 100. Alternatively, the frame 6 is attached to the housing of the component mounting apparatus 100, and each component of the component mounting apparatus 100 is attached to and / or fixed to the frame 6.

[0013] In this specification, an object being "fixed" to an object means that the object is positioned so that it does not move relative to the object, regardless of whether the object and the object are in contact. However, even if an object is fixed to an object, it may still move relative to the object due to thermal expansion, vibration, or other causes of the object and / or the object.

[0014] The parts supply unit 9 is mounted on a supply unit movement unit 8 fixed to the frame 6. Based on control by the control device 7, the supply unit movement unit 8 can move the parts supply unit 9 horizontally (in the X and Y directions).

[0015] The bonding stage 11 is mounted on a stage movement unit 10 fixed to the frame 6. The component supply unit 9 and the bonding stage 11 are aligned in the Y direction on the frame 6. The stage movement unit 10 can move the bonding stage 11 horizontally based on control by the control device 7.

[0016] The bonding stage 11 is equipped with a stage heating unit 12 for heating the substrate 110 and a stage thermometer 12a for measuring the temperature of the bonding stage 11 heated by the stage heating unit 12 (stage temperature). Based on control by the control device 7, the stage heating unit 12 heats the bonding stage 11 so that the stage temperature reaches a specified temperature. Information indicating the stage temperature measured by the stage thermometer 12a is transmitted to the control device 7.

[0017] Multiple parts 120 are placed on the parts supply unit 9. The multiple parts 120 may be placed, for example, on a tray or an adhesive sheet. A pickup head 13 capable of picking up and moving the parts 120 is installed above the parts supply unit 9. After picking up the parts 120, the pickup head 13 moves to a predetermined transfer position, which is where the parts 120 are transferred to the bonding head 15 (described later), based on control by the control device 7 (arrow f). As shown in Figure 1, the pickup head 13 may rotate around the X-axis as its axis of rotation before reaching the transfer position.

[0018] The component mounting device 100 further includes a bonding head 15 and a head drive unit 16 that moves the bonding head 15 in the Y direction based on control by the control device 7, above the pickup head 13 and the bonding stage 11. The bonding head 15 is an example of a "mounting head" that performs the mounting operation of mounting components 120 onto the substrate. The head drive unit 16 is an example of a "movement mechanism" that moves the bonding head 15 between the component supply unit 9 and the bonding stage 11 in the Y direction. The head drive unit 16 is, for example, a linear motor.

[0019] A tool 17 for adsorbing and holding the component 120 is provided at the lower end of the bonding head 15. The bonding head 15 also includes a tool lifting mechanism 20 that raises and lowers the tool 17 based on control from the control device 7. Furthermore, the bonding head 15 includes a pressure sensor 21 that measures the load applied upward to the tool lifting mechanism 20. By measuring the load applied upward to the tool lifting mechanism 20, the pressure sensor 21 can detect the load that the tool lifting mechanism 20 applies to press the component 120 against the substrate 110 via the tool 17. The tool lifting mechanism 20 lowers the tool 17 so that the tool 17 presses and mounts the component 120 onto the substrate 110 with the specified load. The load measured by the pressure sensor 21 is transmitted to the control device 7.

[0020] The bonding head 15 further includes an ultrasonic oscillator 22 that ultrasonically vibrates the tool 17. The ultrasonic oscillator 22 ultrasonically vibrates the tool 17 with ultrasonic power, amplitude, and frequency specified by the control device 7, so that the component 120 can be mounted on the substrate 110 using ultrasonic crimping technology.

[0021] The bonding head 15 includes a component heating unit 18 that heats the component 120 held by the tool 17, and a tool thermometer 19 that measures the temperature of the tool 17 (tool temperature). Based on control by the control device 7, the component heating unit 18 heats the tool 17 so that the tool temperature reaches a specified temperature. The tool temperature measured by the tool thermometer 19 is transmitted to the control device 7.

[0022] With the above configuration, the tool 17 picks up the component 120 from the pickup head 13 at the transfer position, moves the component 120 to the mounting position on the substrate 110 as the bonding head 15 moves, and mounts the component 120 on the substrate 110 (arrows g and h).

[0023] The component mounting device 100 further comprises a camera 2, a camera 3, a recognition mark 4, and a recognition mark 5. Recognition marks 4 and 5 are marks having a predetermined shape or pattern, such as a T-shape, L-shape, H-shape, or cross shape, and are, for example, known alignment marks or positioning marks. Recognition mark 4 is attached to or engraved on the bonding head 15 and moves with the bonding head 15 when the bonding head 15 moves. Recognition mark 5 is fixed to the frame 6 by being attached, for example, to the bonding stage 11, the stage moving part 10, and / or the frame 6.

[0024] Cameras 2 and 3 are imaging devices that capture images of the surrounding environment and generate captured image data. Cameras 2 and 3 generate captured images using solid-state image sensors such as CMOS and CCD. Camera 2 captures recognition marks 4 and / or recognition marks 5 to generate captured image data. Camera 2 may be fixed in a predetermined position on frame 6. Alternatively, camera 2 may be movable by a drive device such as a motor and configured to be stopped at any position by motor control.

[0025] Camera 3 captures images of the part 120 held by the tool 17 and generates image data. Camera 3 may be fixed to the frame 6. The image data generated by camera 3 is used, for example, to confirm the position and / or orientation of the part 120. Camera 3 may also capture images of the recognition mark 4.

[0026] Figure 2 is a block diagram showing an example configuration of the control device 7 in Figure 1. The control device 7 comprises an arithmetic circuit 71 and a memory device 72.

[0027] The arithmetic circuit 71 performs information processing to realize the functions of the component mounting device 100. Such information processing is realized, for example, by the arithmetic circuit 71 executing a program stored in the storage device 72. The arithmetic circuit 71 includes, for example, a head position detection unit 711, a camera position detection unit 712, a statistical processing unit 713, a determination unit 714, and a mounting control unit 715 as functional components. The arithmetic circuit 71 includes, for example, a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), etc. The arithmetic circuit 71 may be realized by one or more dedicated processors. Furthermore, with respect to the components of the arithmetic circuit 71, functions may be omitted, replaced, and added as appropriate, depending on the embodiment.

[0028] The storage device 72 is a recording medium that stores various data, including the setting values ​​721 described later and programs necessary to realize the functions of the component mounting device 100. The storage device 72 can be implemented, for example, as a semiconductor storage device such as flash memory or a solid-state drive (SSD), a magnetic storage device such as a hard disk drive (HDD), or other recording media, either alone or in combination thereof. The storage device 72 may also include volatile memory such as SRAM or DRAM.

[0029] The arithmetic circuit 71 and the memory device 72 are connected wirelessly or via wire to components of the component mounting device 100, such as cameras 2 and 3, a head drive unit 16, a tool lifting mechanism 20, and a stage moving unit 10, via input / output interfaces, communication interfaces, etc.

[0030] 1-2.Operation Figure 3 is a flowchart illustrating the procedure for the preliminary operation performed by the component mounting device 100 according to Embodiment 1. The preliminary operation is an operation performed before the mounting operation (main mounting operation), and can also be called a warm-up operation. In the preliminary operation, the arithmetic circuit 71 moves the bonding head 15 using the head drive unit 16. For example, the preliminary operation includes repeatedly performing predetermined operations, such as operations similar to the main mounting operation, or idle operations that differ from the main mounting operation and do not move the component 120. The process in Figure 3 is executed, for example, by the arithmetic circuit 71 of the control device 7.

[0031] First, the mounting control unit 715 of the arithmetic circuit 71 moves the bonding head 15 to the transfer position via the head drive unit 16 (S11). In step S11, the bonding head 15 only needs to move to a preset first position, and this first position is not limited to the transfer position. In the preliminary operation, unlike the mounting operation, the tool 17 does not need to pick up and receive the component 120 from the pickup head 13 at the transfer position, or it may receive it in the same way as in the main mounting operation.

[0032] Next, the mounting control unit 715 of the arithmetic circuit 71 moves the bonding head 15 to the imaging position via the head drive unit 16 (S12). The imaging position is an example of a preset second position. The second position is a different position from the first position.

[0033] Figure 4 is a schematic diagram illustrating the component mounting device 100 when the bonding head 15 is in the imaging position. In step S12, as the bonding head 15 moves to the imaging position, the recognition mark 4 attached to the bonding head 15 enters the field of view of the camera 2. Therefore, the camera 2 can capture the recognition mark 4.

[0034] The imaging position is set to a position a predetermined distance away from the handover position in the Y direction. The mounting control unit 715 of the calculation circuit 71 determines that the bonding head 15 has moved to the imaging position when the head drive unit 16 moves the bonding head 15 by a predetermined distance from the handover position. Therefore, even if it is determined that the bonding head 15 has moved to the imaging position, the position of the bonding head 15 may be shifted from the imaging position due to fluctuations in the Y-direction length of the head drive unit 16 caused by heat or other factors.

[0035] Returning to Figure 3, the head position detection unit 711 of the calculation circuit 71 acquires the captured image data of the recognition mark 4 generated by the camera 2 (S13).

[0036] Next, the head position detection unit 711 of the calculation circuit 71 detects the position of the bonding head 15 based on the image data acquired in step S13 (S14). The position detection in step S14 includes detecting or deriving the position of the recognition mark 4, the position of the tool 17, and / or the position of the part 120. For example, the head position detection unit 711 detects the position of the recognition mark 4 by analyzing the image data and derives the position of the tool 17 based on the detected position of the recognition mark 4. The detected position of the recognition mark 4 is expressed, for example, as a deviation from a preset reference position.

[0037] In steps S13 and S14, other feature parts of the bonding head 15 may be used, such as the edge portion of the bonding head 15, or recesses or protrusions on the surface of the bonding head 15. The camera position detection unit 712 of the calculation circuit 71 can also detect the position of the camera 2 based on the captured image data that captures these feature parts.

[0038] The head position detection unit 711 of the arithmetic circuit 71 stores the position detection result from step S14 in the storage device 72 (S15).

[0039] Next, the statistical processing unit 713 of the arithmetic circuit 71 determines whether the position detection results from step S14 have been accumulated to a predetermined number or more (S16). For example, the statistical processing unit 713 determines whether the number of position detection results stored in the storage device 72 is greater than or equal to a predetermined number. The position detection results counted in a certain preliminary operation are the results detected in step S14 of that preliminary operation and do not include results detected in past preliminary operations different from that preliminary operation. To enable this process, the count result of position detection results accumulated in a certain preliminary operation may be reset to 0 when that preliminary operation is completed.

[0040] If the statistical processing unit 713 determines in step S16 that the number of location detection results has not exceeded a predetermined number (No in S16), it returns to step S11 and continues accumulating the location detection results. If it determines that the number of location detection results has exceeded a predetermined number (n) (Yes in S16), it proceeds to step S17.

[0041] In step S17, the statistical processing unit 713 determines whether the variation in the position detection results satisfies predetermined conditions (S17). The arithmetic circuit 71 calculates the standard deviation σ of the most recent m (m ≤ n), for example, 1000 position detection results, and determines that the predetermined conditions are met if 3σ is less than or equal to the set value 721.

[0042] However, the specified condition is not limited to (A)3σ being less than or equal to the set value of 721. For example, the specified condition may be any of the following conditions. (B) The maximum value, mode, mean, or median of the position detection results is less than or equal to a predetermined value. (C) All position detection results are within the specified numerical range. (D) The maximum value, minimum value, mode, mean, or median of the position detection results are within a predetermined numerical range. (E) The moving average of the position detection results is within a predetermined numerical range. (F) The moving average of the maximum value, minimum value, mode, mean, or median of the position detection results is within a predetermined numerical range.

[0043] The above setting value of 721, the predetermined value, and the predetermined numerical range are all examples of the "judgment criteria value" in this disclosure.

[0044] When the predetermined conditions are met, the amount of heat generated and the amount of heat dissipated by the components of the component mounting device 100 are balanced, the heat generation and thermal expansion saturate and stabilize, and the component mounting device 100 is in a state suitable for performing the actual mounting operation with high accuracy.

[0045] In step S17, the determination unit 714 of the arithmetic circuit 71 determines that the variation in the position detection results satisfies a predetermined condition (Yes in S17), then completes the process shown in Figure 3 and makes a determination to start, for example, the implementation operation. If it determines that the variation in the position detection results does not satisfy the predetermined condition (No in S17), it returns to step S11, and the arithmetic circuit 71 executes the process shown in Figure 3 again.

[0046] An example of the operation of the component mounting device 100 described above will be explained using Figures 5 and 6. Figures 5 and 6 are graphs showing an example of accumulated position detection results. The graph in Figure 5 shows an example of each position detection result for the 1st to 1000th preliminary operation of the component mounting device 100. The graph in Figure 6 shows an example of each position detection result for the 9001st to 10000th preliminary operation of the component mounting device 100. In Figures 5 and 6, each position detection result in the Y direction is represented as the amount of deviation from a preset reference position in the Y direction.

[0047] The variation in position detection results during the 1st to 1000th preliminary operation, derived from the graph in Figure 5, does not satisfy the predetermined conditions, so the implementation operation is not started (No in S17). Therefore, the process in Figure 3 is executed again, and the accumulation of position detection results continues. The variation in position detection results during the 9001st to 10000th preliminary operation, derived from the graph in Figure 6, now satisfies the predetermined conditions, so the implementation operation is started (YES in S17).

[0048] In this way, by starting the actual mounting operation after the variation in the position detection results satisfies predetermined conditions and the component mounting device 100 is in a state suitable for performing the actual mounting operation, the positional accuracy of component mounting can be improved.

[0049] 1-3. Effects, etc. As described above, in the component mounting device 100 according to this embodiment, the calculation circuit 71 detects multiple positions of the bonding head 15 corresponding to each of the multiple imaging results of the feature area (recognition mark 4) by the camera 2 during a preliminary operation in which the bonding head 15 is moved by the head drive unit 16 before the mounting operation (mounting operation) (S14). Based on the variation in the detected positions of the bonding head 15, the calculation circuit 71 determines whether or not to continue the preliminary operation (S17). This configuration makes it possible to improve the positional accuracy of component mounting during the mounting operation.

[0050] In the preliminary operation, the bonding head 15 may move multiple times between a first position (e.g., a transfer position) and a second position different from the first position (e.g., an imaging position). In this case, the multiple imaging results of the recognition mark 4 are each imaging results captured by the camera 2 each time the bonding head 15 passes through the second position. This configuration improves the positional accuracy of component mounting during the mounting operation.

[0051] In the preliminary operation, the bonding head 15 may move between a first position and a second position different from the first position a predetermined number of times, and then move between the first position and the second position a predetermined number of times. In this case, the multiple imaging results of the recognition mark 4 are each imaging results captured by the camera 2 each time the bonding head 15 passes through the second position. The calculation circuit 71 may detect the position of the bonding head 15 in the preliminary operation based on the imaging results captured by the camera 2 during the second predetermined number of movements. This configuration can improve the positional accuracy of component mounting during the mounting operation.

[0052] In the process of detecting the position of the bonding head 15 during the preliminary operation (S14), the calculation circuit 71 may calculate the deviation of the recognition mark 4 captured by the camera 2 from a predetermined reference position, derive the position of the recognition mark 4 based on the calculation result, and detect the position of the bonding head 15 during the preliminary operation based on the derived position of the recognition mark 4. This configuration can improve the positional accuracy of component mounting during the mounting operation.

[0053] The component mounting device 100 may further include a storage device 72 that stores a judgment criterion value for the variation in the position of the bonding head 15 for determining whether or not to continue the preliminary operation. The calculation circuit 71 may determine whether or not to continue the preliminary operation based on the result of comparing the detected variation in the position of the bonding head 15 during the preliminary operation with the judgment criterion value. This configuration can improve the positional accuracy of component mounting during the mounting operation.

[0054] The calculation circuit 71 may determine that it is unnecessary to continue the preliminary operation if the statistical amount regarding the variation in the position of the detected bonding head 15 is below a certain threshold value. This configuration can improve the positional accuracy of component mounting during the mounting operation.

[0055] If the calculation circuit 71 determines that it is not necessary to continue the preliminary operation, it may cause the bonding head 15 to perform the mounting operation. This configuration allows the mounting operation to start with improved positional accuracy for component mounting.

[0056] 2. Embodiment 2 Figure 7 is a block diagram showing an example configuration of the control device 7 of the component mounting device 100 according to Embodiment 2 of this disclosure. Compared with the configuration according to Embodiment 1 shown in Figure 2, in Embodiment 2, the storage device 72 further stores change data 722. The change data 722 is data indicating the position detection result in the preliminary operation (the result of S14 in Figure 3), and is acquired in the preliminary operation that is performed in advance.

[0057] Figure 8 is a graph showing an example of the change data 722 in Figure 7. The change data 722 in Figure 8 shows the position detection results during the preparatory operation in time series. The horizontal axis of the graph in Figure 8 represents time. The graph in Figure 8 shows an example in which the component mounting device 100 repeatedly performs preparatory operations at predetermined intervals from time 0, and after performing the 10,000th preparatory operation at time t2, it stops operating. In Figure 8, the data is graphed by taking the average of the position detection results every 100 points, but the change data 722 is not limited to this and may also be the raw data of each position detection result during the preparatory operation.

[0058] When analyzing position detection results from a relatively large number of measurements, as shown in Figure 8, a certain trend may emerge. This trend changes depending on the ratio of the time when the components of the component mounting device 100 are operating and generating heat to the time when they are not operating (time spent only cooling). In the first section of Figure 8, it can be seen that there is a downward trend in which the position detection results decrease as the number of measurements increases. In the initial stages of preparatory operation, as in the first section, the thermal expansion increases with each measurement due to the heat generated by the components of the component mounting device 100, and the position detection results (amount of deviation from a preset reference position) increase in the negative direction.

[0059] In the second section of Figure 8, no downward or upward trend is observed. In the second section, the heat generation and heat dissipation of the components of the component mounting device 100 are balanced, indicating that heat generation and thermal expansion have saturated.

[0060] The third interval in Figure 8 corresponds to the interval in which the component mounting device 100 has stopped all operations, including preparatory operations. In the third interval, it can be seen that there is an upward trend in the position detection results as the number of measurements increases. When the component mounting device 100 is stopped, as in the third interval, the temperature of the components of the component mounting device 100 decreases, thermal expansion decreases, and the position detection results increase in the positive direction. When the preparatory operations start again at time t3, a downward trend appears.

[0061] Therefore, by acquiring change data 722 that shows the trend of fluctuations in advance, it is possible to estimate the state of thermal expansion, such as the time until thermal expansion saturates and the number of preparatory operations, and the estimation results can be used to determine whether or not to continue the preparatory operations. For example, the recognition mark 4 is imaged many times (for example, 10,000 times) during the preparatory operation in advance, and after confirming that the thermal expansion has saturated, the preparatory operation is stopped and the recognition mark 4 is imaged at regular intervals while the device is left to cool (for example, 100 times every 10 minutes). With the change data 722 obtained in this way, the relationship between the operating time of the component mounting device 100 and the time it is left to cool can be determined in advance.

[0062] Figures 9 and 10 are flowcharts illustrating the procedure of preliminary operations performed by the component mounting device 100 according to Embodiment 2. Steps S11 to S17 in Figure 9 are the same as steps S11 to S17 in Figure 3, respectively, except that in Figure 9, if the answer in step S17 is No, the process proceeds to step S20 in Figure 10 via connector A.

[0063] In step S20 of Figure 10, the arithmetic circuit 71 compares the position detection results accumulated in the flow of Figure 9 with change data 722 pre-stored in the memory device 72 (S20). Next, based on the comparison result of step S20, the arithmetic circuit 71 estimates the state of thermal expansion by estimating which of the sections corresponding to the first to third sections in Figure 8 the current (latest) position detection result belongs to (S21).

[0064] For example, if a downward trend appears in the position detection results, it can be inferred that the thermal expansion is in the first interval, which is the initial stage of preparatory movement. Furthermore, by using data on the elapsed time from the start time of preparatory movement (t=0) or the number of preparatory movements, it is possible to infer whether the thermal expansion is in the early, middle, or late stages of the first interval. Similarly, if an upward trend appears in the position detection results, it can be inferred that the thermal expansion is in the third interval, and if neither a downward nor upward trend appears, it can be inferred that the thermal expansion is in the second interval, which is a saturated state.

[0065] Next, the arithmetic circuit 71 determines whether the prediction result from step S21 satisfies predetermined conditions (S22). If the arithmetic circuit 71 determines that the prediction result from step S21 satisfies predetermined conditions (Yes in S22), it completes the process shown in Figure 9 and starts, for example, the implementation operation. Thus, the predetermined conditions in step S22 are conditions for determining whether or not to continue the preliminary operation.

[0066] For example, the arithmetic circuit 71 determines that a predetermined condition has been met when it determines that the thermal expansion state is near the end of the first interval. By starting the mounting operation when the thermal expansion state is near the end of the first interval, the start of the mounting operation can be accelerated.

[0067] Furthermore, the calculation circuit 71 may also determine that the predetermined conditions have been met if it determines that the thermal expansion state is in the early stages of the third section. By enabling the implementation operation to be resumed without further preparatory operation (warm-up) when the thermal expansion state is in the early stages of the third section, the implementation operation can be resumed quickly.

[0068] As described above, the component mounting device 100 may further include a storage device 72 that stores change data 722, which is a time-series arrangement of the positions of the bonding head 15 during and before / after the mounting operation and / or preparatory operation. The arithmetic circuit 71 may determine whether or not to continue the preparatory operation based on the result of comparing the detected position of the bonding head 15 during the preparatory operation with the change data 722. This configuration can improve the positional accuracy of component mounting during the mounting operation.

[0069] 3. Embodiment 3 3-1. Overview Embodiments 1 and 2 describe an example in which the thermal expansion of the components of the component mounting device 100 is determined by determining whether the variation in the detection results of the position of the bonding head 15 satisfies predetermined conditions. Embodiment 3 describes an example in which the reduction in position detection accuracy due to the effect of heat on the camera 2 is suppressed.

[0070] The imaging device, such as camera 2, consumes power and generates heat each time it performs an imaging operation and transfers imaging data to the control device 7. Therefore, even when power-consuming components of the component mounting device 100, such as the head drive unit 16 and component heating unit 18, are not in operation, when the camera 2 performs an imaging operation, the heat generated by the camera 2 itself causes thermal expansion in the camera 2 and the surrounding components of the component mounting device 100, and this thermal expansion may adversely affect the positional accuracy of component mounting.

[0071] Furthermore, even if the heat generated by the camera 2 itself has little effect on thermal expansion, thermal expansion caused by heat generated from the head drive unit 16, component heating unit 18, etc., may displace the position of the camera 2.

[0072] Therefore, in Embodiment 3, the component mounting device 100 performs multiple imaging operations by the camera 2 as a preliminary imaging operation before the preliminary operation and / or the main mounting operation. This saturates the effect of thermal expansion of 2 on the camera, improving the accuracy and reliability of the position detection results based on the imaging results of the camera 2 during the preliminary operation and / or the main mounting operation.

[0073] 3-2.Operation Figure 11 is a flowchart illustrating the procedure for the preliminary imaging operation performed by the component mounting device 100 according to Embodiment 3. First, the camera position detection unit 712 of the calculation circuit 71 acquires the image data of the recognition mark 5 generated by the camera 2 (S31).

[0074] Next, the camera position detection unit 712 of the calculation circuit 71 detects the position of the camera 2 relative to the recognition mark 5 based on the captured image data acquired in step S31 (S32). Since the recognition mark 5 is fixed to, for example, the bonding stage 11, the stage moving unit 10, and / or the frame 6, it is stationary relative to the camera 2 when the temperature of these components is constant. Therefore, in step S32, the camera position detection unit 712 can detect the position of the recognition mark 5 in the captured image by analyzing the captured image data, and derive the position of the camera 2 based on the detected position of the recognition mark 5. The detected position of the recognition mark 4 is expressed, for example, as a deviation from a preset reference position.

[0075] In steps S31 and S32, a recognition mark 4 attached to the bonding head 15 stationary at the imaging position may be used instead of the recognition mark 5. Alternatively, in steps S31 and S32, a component of the component mounting device 100, such as the edge portion of the frame 6 or the edge portion of the stage moving unit 10, may be used instead of the recognition mark 5. The camera position detection unit 712 of the calculation circuit 71 can also detect the position of the camera 2 based on the captured image data obtained by capturing these components.

[0076] The camera position detection unit 712 of the arithmetic circuit 71 stores the position detection result from step S32 in the storage device 72 (S33).

[0077] Next, the statistical processing unit 713 of the arithmetic circuit 71 determines whether the position detection results from step S32 have been accumulated to a predetermined number or more (S34). For example, the statistical processing unit 713 determines whether the number of position detection results stored in the storage device 72 is greater than or equal to a predetermined number. The position detection results counted in a certain preliminary imaging operation are the results detected in step S33 of that preliminary imaging operation and do not include results detected in past preliminary imaging operations different from that preliminary imaging operation. To enable this process, the count result of position detection results accumulated in a certain preliminary imaging operation may be reset to 0 when that preliminary imaging operation is completed.

[0078] If the statistical processing unit 713 determines in step S34 that the number of location detection results has not exceeded a predetermined number (No in S34), it returns to step S31 and continues accumulating the location detection results. If it determines that the number of location detection results has exceeded a predetermined number (j items) (Yes in S34), it proceeds to step S35.

[0079] In step S35, the statistical processing unit 713 determines whether the variation in the position detection results satisfies predetermined conditions (S35). The arithmetic circuit 71 calculates the standard deviation σ of the latest k (k ≤ j), for example, 1000 position detection results, and determines that the predetermined conditions are met if 3σ is less than or equal to a set value.

[0080] However, the specified condition is not limited to (a) 3σ being less than or equal to the set value. For example, the specified condition may be any of the following conditions. (b) The maximum value, mode, mean, or median of the position detection results is less than or equal to a predetermined value. (c) All position detection results are within the specified numerical range. (d) The maximum value, minimum value, mode, mean, or median of the position detection results are within a predetermined numerical range. (e) The moving average of the position detection results is within a predetermined numerical range. (f) The moving average of the maximum, minimum, mode, mean, or median of the position detection results is within a predetermined numerical range.

[0081] The above-mentioned set values, predetermined values, and predetermined numerical ranges are all examples of judgment criteria values ​​related to the position of the imaging unit in this disclosure. The judgment criteria values ​​are stored in the storage device 72 in advance, for example.

[0082] When the specified conditions are met, the heat generated and the heat dissipated by camera 2 are balanced, the heat generation and thermal expansion saturate and stabilize, and camera 2 can be said to be in a state suitable for accurate implementation operation.

[0083] In step S35, the determination unit 714 of the arithmetic circuit 71 determines that the variation in the position detection results satisfies a predetermined condition (Yes in S35), then completes the process shown in Figure 11 and makes a determination to start, for example, the implementation operation. If it determines that the variation in the position detection results does not satisfy the predetermined condition (No in S35), it returns to step S31, and the arithmetic circuit 71 executes the process shown in Figure 11 again.

[0084] An example of the operation shown in Figure 11 will be explained using Figure 12. Figure 12 is a graph showing an example of the accumulated position detection results for camera 2 in the X direction. The graph in Figure 12 shows an example of each position detection result for the 10001st to 11000th preliminary imaging operation of the component mounting device 100. In Figure 12, each position detection result in the X direction is represented as the amount of deviation from a preset reference position in the X direction.

[0085] If the variation in the latest predetermined number of position detection results of the preliminary imaging operation (for example, position detection results from the 10001st to the 11000th time) derived from the graph in Figure 12 satisfies the above predetermined conditions, the preliminary operation and / or the main implementation operation shown in Figure 3 is started (Yes in S35).

[0086] In this way, by starting the preliminary operation and / or the main mounting operation after the variation in the position detection results satisfies predetermined conditions, the positional accuracy of component mounting can be improved. When the preliminary operation shown in Figure 3 is started after the process in Figure 11, the thermal expansion of the camera 2 is saturated, so the effect of the camera 2's own positional displacement is reduced, and the position of the bonding head 15 can be accurately detected during the preliminary operation. Similarly, when the main mounting operation is started after the process in Figure 11, the positional accuracy of component mounting can be improved.

[0087] The position of camera 2 can shift not only in the X direction as shown in Figure 12, but also in the Y and θ directions, relative to the recognition mark 5. Here, the θ direction is the direction of rotation around an axis parallel to the Z axis. Figure 13 is a graph showing an example of the accumulated position detection results of camera 2 in the Y direction. Figure 14 is a graph showing an example of the accumulated position detection results of camera 2 in the θ direction.

[0088] In step S35, the statistical processing unit 713 may determine whether the variations in the position detection results in the X, Y, and θ directions satisfy predetermined conditions. For example, in step S35, if the variation in the position detection results in the X direction satisfies a predetermined first condition, the variation in the position detection results in the Y direction satisfies a predetermined second condition, and the variation in the position detection results in the θ direction satisfies a predetermined third condition, the statistical processing unit 713 may start the preliminary operation and / or the main implementation operation shown in Figure 3 (Yes in S35).

[0089] Furthermore, the preliminary imaging operation only needs to be one that balances the heat generated and dissipated by camera 2, as described above, and stabilizes the thermal expansion of camera 2; it is not necessary for camera 2 to capture the recognition mark 5 every time it operates. Therefore, before step S31 in Figure 11, camera 2 may perform the imaging operation even if the recognition mark 5 is not within the field of view. For example, camera 2 can continue to capture still images or videos during times when imaging is not actually necessary, such as during the warm-up of the motor of the head drive unit 16 or during the waiting time for the mounting operation, thereby keeping the thermal expansion of camera 2 saturated. After such imaging, the component mounting device 100 may perform processing to determine whether to start the preliminary operation and / or the main mounting operation as shown in Figure 11. This prevents a decrease in productivity due to the preliminary imaging operation when it comes to component mounting.

[0090] 3-3. Effects, etc. As described above, the component mounting device 100 according to this embodiment includes a bonding head 15, a head drive unit 16, a frame 6, a camera 2 which is an example of an imaging unit, and a calculation circuit 71 that controls the mounting operation (implementation operation) based on the imaging results of the camera 2. The camera 2 images the substrate 110 and / or the component 120. The calculation circuit 71 uses the camera 2 to perform a preliminary imaging operation in which it images a recognition mark 5, which is an example of a component fixed to the frame 6, multiple times before the mounting operation, and detects the change in the relative position between the camera 2 and the recognition mark 5 due to heat based on the multiple imaging results of the recognition mark 5. With this configuration, the accuracy of position detection based on the imaging results of the camera 2 can be improved, and the positional accuracy of component mounting in the mounting operation can be improved.

[0091] Camera 2 may be fixed to frame 6. By fixing both camera 2 and recognition mark 5 to frame 6, changes in the relative position of camera 2 and recognition mark 5 due to heat can be detected with high accuracy.

[0092] The recognition mark 5 is configured to remain stationary relative to the camera 2 when the temperature of the component mounting device 100 is constant. This configuration improves the accuracy of position detection based on the imaging results from the camera 2.

[0093] The calculation circuit 71 may determine whether or not to continue the preliminary imaging operation based on the change in the relative position between the detected camera 2 and the recognition mark 5. This configuration improves the accuracy of position detection based on the imaging results of camera 2 after the preliminary imaging operation.

[0094] In the preliminary imaging operation, the arithmetic circuit 71 may, after the camera 2 has taken a first predetermined number of images, take a second predetermined number of images of the recognition mark 5. In this case, the arithmetic circuit 71 detects the change in the relative position between the camera 2 and the recognition mark 5 due to heat, based on the second predetermined number of images of the recognition mark 5 taken by the camera 2. The arithmetic circuit 71 may determine whether or not to continue the preliminary imaging operation based on the change in position detected based on the second predetermined number of images taken by the camera 2. This configuration improves the accuracy of position detection based on the images taken by the camera 2 after the preliminary imaging operation.

[0095] If the calculation circuit 71 determines that it is unnecessary to continue the preliminary imaging operation, it may cause the bonding head 15 to perform the mounting operation. This configuration improves the accuracy of position detection based on the imaging results of the camera 2 during the mounting operation.

[0096] Camera 2 may be configured to capture characteristic parts of the bonding head 15 (e.g., recognition mark 4). If the calculation circuit 71 determines that it is not necessary to continue the preliminary imaging operation, it detects multiple positions of the bonding head 15 corresponding to each of the multiple imaging results of the characteristic parts by Camera 2 during the preliminary operation, which is performed after the preliminary imaging operation but before the mounting operation. Based on the variation in the detected positions of the bonding head 15, the calculation circuit 71 determines whether it is necessary to continue the preliminary operation. This configuration improves the accuracy of position detection based on the imaging results of Camera 2 during the preliminary operation, and improves the positional accuracy of component mounting during the mounting operation.

[0097] The component mounting device 100 may further include a storage device 72 that stores a judgment criterion value for the position of the camera 2 for determining whether or not to continue the preliminary imaging operation. The calculation circuit 71 may determine whether or not to continue the preliminary imaging operation based on the result of comparing the variation in the relative position change between the detected camera 2 and the recognition mark 5 with the judgment criterion value. This configuration improves the accuracy of position detection based on the imaging results of the camera 2 during the mounting operation.

[0098] The calculation circuit 71 may determine that it is unnecessary to continue the preliminary imaging operation if the statistical quantity relating to the variation in the relative position change between the detected camera 2 and the recognition mark 5 is below a judgment criterion value. This configuration improves the accuracy of position detection based on the imaging results of camera 2 during the mounting operation.

[0099] 4. Embodiment 4 In Embodiment 4, similar to Embodiment 2, the storage device 72 further stores change data indicating the position detection result in the preliminary imaging operation (the result of S32 in Figure 11).

[0100] When analyzing the position detection results for camera 2 over a relatively large number of cycles, a certain trend may emerge. Therefore, by acquiring change data that shows the trend of fluctuations in advance, it is possible to estimate the thermal expansion state of camera 2, such as the time until thermal expansion saturates and the number of preliminary imaging operations. The estimation results can then be used to determine whether or not to continue the preliminary imaging operation. For example, the recognition mark 5 can be imaged many times (e.g., 10,000 times) during the preliminary imaging operation, and after confirming that the thermal expansion of camera 2 has saturated, the preliminary imaging operation can be stopped and the recognition mark 5 can be imaged at regular intervals while the camera is left to cool (e.g., 100 times every 10 minutes). The change data obtained in this way allows the relationship between the operation time of camera 2 and the cooling time to be understood in advance.

[0101] Figures 15 and 16 are flowcharts illustrating the procedure for a preliminary imaging operation performed by the component mounting device 100 according to Embodiment 4. Steps S31 to S35 in Figure 15 are the same as steps S31 to S35 in Figure 11, respectively, except that in Figure 15, if the answer in step S35 is No, the process proceeds to step S40 in Figure 16 via connector A.

[0102] In step S40 of Figure 16, the arithmetic circuit 71 compares the position detection results accumulated in the flow shown in Figure 15 with the change data previously stored in the memory device 72 (S40).

[0103] Next, the calculation circuit 71 estimates the state of thermal expansion (S41) based on the comparison result of step S40. The process in step S41 is similar to the process in Embodiment 2 in which the current (latest) position detection result is estimated to belong to one of the sections corresponding to the first to third sections in Figure 8.

[0104] Next, the calculation circuit 71 determines whether the prediction result from step S41 satisfies predetermined conditions (S42). If the calculation circuit 71 determines that the prediction result from step S41 satisfies predetermined conditions (Yes in S42), it completes the process shown in Figure 15 and starts, for example, a preliminary operation or a main implementation operation. Thus, the predetermined conditions in step S42 are conditions for determining whether or not to continue the preliminary imaging operation.

[0105] As described above, the component mounting device 100 according to this embodiment further includes a storage device 72 that stores change data, which is obtained in advance and is arranged in time series, of the position of the camera 2 during and before / after the mounting operation and / or preliminary imaging operation. The calculation circuit 71 determines whether or not to continue the preliminary imaging operation based on the result of comparing the detected position of the camera 2 during the preliminary imaging operation with the change data. With this configuration, the accuracy of position detection based on the imaging results of the camera 2 can be improved, and the positional accuracy of component mounting during the mounting operation can be improved.

[0106] (Note) Examples of aspects of this disclosure are given below.

[0107] <Aspect 1> A mounting head that performs a mounting operation to mount the components picked up from a component supply unit onto a circuit board, A moving mechanism for moving the mounting head between the component supply unit and the substrate mounting unit on which the substrate is placed, An imaging unit for capturing a characteristic part of the mounted head, The system includes a calculation circuit that controls the moving mechanism and the imaging unit, and detects the position of the mounted head based on the imaging result of the feature unit, The aforementioned arithmetic circuit is In a preliminary operation in which the mounting head is moved by the moving mechanism before the aforementioned mounting operation, the multiple positions of the mounting head corresponding to each of the multiple imaging results of the feature portion by the imaging unit are detected. Based on the detected variation in the position of the mounted head, it is determined whether or not the preparatory operation should be continued. Component mounting device.

[0108] <Aspect 2> In the aforementioned preliminary operation, the mounted head moves multiple times between a first position and a second position different from the first position. Each of the multiple imaging results of the feature portion is an imaging result captured by the imaging unit each time the mounted head passes through the second position. A component mounting device according to Embodiment 1.

[0109] <Aspect 3> In the aforementioned preliminary operation, the mounted head repeats movement between a first position and a second position different from the first position a predetermined number of times, and then repeats movement between the first position and the second position a predetermined number of times. Each of the multiple imaging results of the feature portion is an imaging result captured by the imaging unit each time the mounted head passes through the second position. The calculation circuit detects the position of the mounted head during the preliminary operation based on the imaging results captured by the imaging unit during the second predetermined number of movements. A component mounting device according to embodiment 1 or 2.

[0110] <Aspect 4> The calculation circuit, in the process of detecting the position of the mounted head in the preliminary operation, The deviation of the feature portion captured by the imaging unit from a predetermined reference position is calculated. Based on the calculation results, the position of the feature part is derived, Based on the derived position of the feature portion, the position of the mounted head in the preliminary operation is detected. A component mounting device according to any one of embodiments 1 to 3.

[0111] <Aspect 5> The device further includes a memory device that stores a judgment criterion value for the variation used to determine whether or not the preparatory operation needs to be continued, The calculation circuit determines whether or not to continue the preliminary operation based on the result of comparing the variation with the judgment criterion value. A component mounting device according to any one of embodiments 1 to 4.

[0112] <Aspect 6> The component mounting device according to embodiment 5, wherein the calculation circuit determines that it is unnecessary to continue the preliminary operation when the statistical quantity relating to the variation is less than or equal to the judgment criterion value.

[0113] <Aspect 7> The component mounting apparatus according to any one of embodiments 1 to 6, wherein the calculation circuit determines that it is unnecessary to continue the preliminary operation, and instructs the mounting head to perform the mounting operation.

[0114] <Aspect 8> The system further includes a storage device that stores change data, which is obtained in advance, in which the position of the mounting head during and before / after the mounting operation and / or the preliminary operation is arranged in chronological order. The calculation circuit determines whether or not to continue the preliminary operation based on the result of comparing the position of the mounted head in the detected preliminary operation with the change data. A component mounting device according to any one of embodiments 1 to 7.

[0115] <Pattern 9> The component mounting device according to any one of embodiments 1 to 8, wherein the aforementioned feature is a recognition mark provided on the mounting head.

[0116] <Aspect 10> A mounting head that performs a mounting operation to mount the components picked up from a component supply unit onto a circuit board, A moving mechanism for moving the mounting head between the component supply unit and the substrate mounting unit on which the substrate is placed, An imaging unit for capturing a characteristic part of the mounted head, A calculation circuit that controls the moving mechanism and the imaging unit and detects the position of the mounted head based on the imaging results of the feature unit, A component mounting method performed by a component mounting device comprising: The calculation circuit includes the step of acquiring multiple imaging results of characteristic parts of the mounting head, which are imaged by the imaging unit, in a preliminary operation in which the mounting head is moved by the moving mechanism before the mounting operation, The calculation circuit includes the step of detecting multiple positions of the mounted head corresponding to each of the multiple imaging results of the feature section, The calculation circuit includes a step of determining whether or not to continue the preliminary operation based on the detected variation in the position of the mounted head, Component mounting method. [Industrial applicability]

[0117] This disclosure is applicable to component mounting equipment that mounts components onto a substrate. [Explanation of Symbols]

[0118] 2. Camera (imaging unit) 3 cameras 4. Recognition mark (feature part) 5. Recognition Mark (Component) 6 frames 7 Control device 8. Supply Unit, Mobile Unit 9. Parts Supply Department 10 Stage Movement Section 11 Bonding stage (substrate mounting section) 12 Stage heating section 12a Stage Thermometer 13 Pickup head 15 Bonding head (mounted head) 16. Head drive unit (movement mechanism) 17 Tools 18. Parts heating section 19 Tool Thermometer 20 Tool Lifting Mechanism 21 Pressure Sensor 22 Ultrasonic Oscillator 71 Arithmetic circuit 72 Storage device 100 component mounting device 110 circuit boards 120 parts 711 Head position detection unit 712 Camera position detection unit 713 Statistical Processing Department 714 Judgment section 715 Mounted Control Unit 721 Setting value 722 Change Data

Claims

1. A mounting head that performs a mounting operation to mount the components picked up from a component supply unit onto a circuit board, A moving mechanism for moving the mounting head between the component supply unit and the substrate mounting unit on which the substrate is placed, An imaging unit for capturing a characteristic part of the mounted head, The system includes a calculation circuit that controls the moving mechanism and the imaging unit, and detects the position of the mounted head based on the imaging result of the feature unit, The aforementioned arithmetic circuit is In a preliminary operation in which the mounting head is moved by the moving mechanism before the aforementioned mounting operation, the mounting head is detected in multiple positions corresponding to each of the multiple imaging results of the feature portion by the imaging unit. Based on the detected variation in the position of the mounted head, it is determined whether or not the preparatory operation should be continued. Component mounting device.

2. In the aforementioned preliminary operation, the mounted head moves multiple times between a first position and a second position different from the first position. Each of the multiple imaging results of the feature portion is an imaging result captured by the imaging unit each time the mounted head passes through the second position. The component mounting device according to claim 1.

3. In the aforementioned preliminary operation, the mounted head repeats movement between a first position and a second position different from the first position a predetermined number of times, and then repeats movement between the first position and the second position a predetermined number of times. Each of the multiple imaging results of the feature portion is an imaging result captured by the imaging unit each time the mounted head passes through the second position. The calculation circuit detects the position of the mounted head during the preliminary operation based on the imaging results captured by the imaging unit during the second predetermined number of movements. The component mounting device according to claim 1.

4. The calculation circuit, in the process of detecting the position of the mounted head in the preliminary operation, The deviation of the feature portion captured by the imaging unit from a predetermined reference position is calculated. Based on the calculation results, the position of the feature part is derived, Based on the derived position of the feature portion, the position of the mounted head in the preliminary operation is detected. The component mounting device according to claim 1.

5. The device further includes a memory device that stores a judgment criterion value for the variation used to determine whether or not the preparatory operation needs to be continued, The calculation circuit determines whether or not to continue the preliminary operation based on the result of comparing the variation with the judgment criterion value. A component mounting device according to any one of claims 1 to 4.

6. The component mounting device according to claim 5, wherein the calculation circuit determines that it is unnecessary to continue the preliminary operation when the statistical quantity relating to the variation is less than or equal to the judgment criterion value.

7. The component mounting apparatus according to any one of claims 1 to 4, wherein the calculation circuit determines that it is unnecessary to continue the preliminary operation, and instructs the mounting head to perform the mounting operation.

8. The system further includes a storage device that stores change data, which is obtained in advance, in which the position of the mounting head during and before / after the mounting operation and / or the preliminary operation is arranged in chronological order. The calculation circuit determines whether or not to continue the preliminary operation based on the result of comparing the position of the mounted head in the detected preliminary operation with the change data. A component mounting device according to any one of claims 1 to 4.

9. The component mounting device according to any one of claims 1 to 4, wherein the aforementioned feature is a recognition mark provided on the mounting head.

10. A mounting head that performs a mounting operation to mount the components picked up from a component supply unit onto a circuit board, A moving mechanism for moving the mounting head between the component supply unit and the substrate mounting unit on which the substrate is placed, An imaging unit for capturing a characteristic part of the mounted head, A calculation circuit that controls the moving mechanism and the imaging unit and detects the position of the mounted head based on the imaging results of the feature unit, A component mounting method performed by a component mounting device comprising: The calculation circuit includes the step of acquiring multiple imaging results of characteristic parts of the mounting head, which are imaged by the imaging unit during a preliminary operation in which the mounting head is moved by the moving mechanism before the mounting operation, The calculation circuit includes the step of detecting multiple positions of the mounted head corresponding to each of the multiple imaging results of the feature section, The calculation circuit includes a step of determining whether or not to continue the preliminary operation based on the detected variation in the position of the mounted head, Component mounting method.

Images