Electroless plating inhibitory composition and method for manufacturing plated parts

Abstract

To provide an electroless plating inhibiting composition capable of improving the deposition and selectivity of electroless plating when forming a high-definition pattern.SOLUTION: An electroless plating inhibiting composition includes a catalytic activity inhibitor to inhibit the activity of an electroless plating catalyst, a water repellent, and a solvent comprising glycol ether. A catalytic activity inhibiting layer formed by the electroless plating inhibiting composition has a surface water contact angle of 50° or more.SELECTED DRAWING: None

Description

[Technical Field]

[0001] This invention relates to an electroless plating inhibitory composition and a method for manufacturing plated parts. [Background technology]

[0002] In recent years, molded interconnected devices (MIDs) have been put into practical use in smartphones and other devices, and their application in the automotive sector is expected to expand in the future. MIDs are devices in which circuits are formed with a metal film on the surface of a resin molded body, and they can contribute to reducing the weight, thickness, and number of parts of products.

[0003] As a technology related to MID, Patent Document 1 describes an electroless plating inhibiting composition and a method for manufacturing plated parts. This method for manufacturing plated parts includes applying an electroless plating inhibiting composition to the surface of a substrate, heating or irradiating a part of the substrate surface with light, applying an electroless plating catalyst to the heated or irradiated surface of the substrate, and contacting the surface of the substrate to which the electroless plating catalyst has been applied with an electroless plating solution to form an electroless plating film on the heated or irradiated portion of the surface. The electroless plating inhibiting composition contains a catalyst activity inhibitor. By applying this electroless plating inhibiting composition, a catalyst activity inhibiting layer is formed on the surface of the substrate. By heating or irradiating a part of the substrate surface with light, the catalyst activity inhibiting layer in that portion is removed. As a result, an electroless plating layer can be selectively formed on the portion from which the catalyst activity inhibiting layer has been removed. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] International Publication No. 2020 / 179821 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] According to the electroless plating suppression composition and the method for manufacturing a plated component described in Patent Document 1, generation of an electroless plating film in a portion where formation of the electroless plating film is not planned can be suppressed regardless of the type, shape, and state of the base material. According to this electroless plating suppression composition and the method for manufacturing a plated component, for example, by combining with patterning by laser drawing, a fine wiring pattern (electric circuit) can be formed on the base material.

[0006] Generally, as the pattern to be formed becomes finer, it becomes more difficult to achieve both plating deposition property and selectivity. The plating deposition property means that the plating is uniformly formed on the portion where the plating should be formed, and the plating selectivity means that the plating is not formed on the portion where the plating should not be formed. Also, in the electroless plating suppression composition described in Patent Document 1, when the fineness of the pattern exceeds a predetermined threshold value, the deposition property decreases.

[0007] An object of the present invention is to provide an electroless plating suppression composition capable of improving the deposition property and selectivity of electroless plating when forming a high-definition pattern.

Means for Solving the Problems

[0008] According to a first aspect of the present invention, there is provided an electroless plating suppression composition including a catalyst activity inhibitor that interferes with the activity of an electroless plating catalyst, a water repellent, and a solvent containing a glycol ether, wherein the water contact angle of the surface of the catalyst activity inhibiting layer formed by the electroless plating suppression composition is 50° or more.

[0009] The water repellent may be at least one selected from the group consisting of a silicone compound and a fluorine compound. The ratio of the water repellent in the solid content of the electroless plating suppression composition may be 2.5% by weight or more.

[0010] The electroless plating suppression composition may further contain alcohol.

[0011] The catalyst activity inhibitor may be a compound having at least one of an amide group and an amino group. The catalyst activity inhibitor may be a polymer, and its weight-average molecular weight may be 1,000 to 1,000,000. The catalyst activity inhibitor may also be a hyperbranched polymer. The hyperbranched polymer may have a dithiocarbamate group. In the electroless plating inhibitory composition, the amount of the catalyst activity inhibitor may be 0.1% to 5.0% by weight.

[0012] A second aspect of the present invention provides a method for manufacturing a plated part, comprising: applying the electroless plating inhibitory composition of the first aspect to the surface of a substrate; heating or irradiating a part of the surface of the substrate with light; applying an electroless plating catalyst to the heated or irradiated surface of the substrate; and contacting the surface of the substrate to which the electroless plating catalyst has been applied with an electroless plating solution to form an electroless plating film on the heated or irradiated portion of the surface. [Effects of the Invention]

[0013] The electroless plating suppression composition of the present invention can improve the deposition properties and selectivity of electroless plating when forming high-definition patterns. [Brief explanation of the drawing]

[0014] [Figure 1] Figure 1 schematically shows the behavior of the plating solution when the water repellency of the surface of the catalytic activity interfering layer is relatively low. [Figure 2] Figure 2 schematically shows the behavior of the plating solution when the surface of the catalytic activity interfering layer has relatively high water repellency. [Figure 3] Figure 3 is a flowchart illustrating the manufacturing method of the plated parts according to the embodiment. [Modes for carrying out the invention]

[0015] [Electroless Plating Inhibiting Composition] The electroless plating inhibiting composition comprises a catalyst activity inhibitor, a water repellent, and a solvent. The catalyst activity inhibitor is a catalyst activity inhibitor that interferes with the activity of the electroless plating catalyst. The solvent contains glycol ether. The catalyst activity inhibitor is dispersed in the solvent. That is, the solvent containing glycol ether is the dispersion medium. The electroless plating inhibiting composition is used in a method for manufacturing plated parts. For example, in a method for manufacturing plated parts, the electroless plating inhibiting composition is present in parts of the substrate where electroless plating film formation is not intended, thereby suppressing the formation of the electroless plating film.

[0016] <Catalyst activity interferant> The catalyst activity inhibitor is preferably a compound having at least one of an amide group and an amino group. The catalyst activity inhibitor is also preferably a polymer. When the catalyst activity inhibitor is a polymer having at least one of an amide group and an amino group (hereinafter referred to as "amide / amino group-containing polymer" as appropriate), its weight-average molecular weight may be, for example, 1,000 to 1,000,000. In the manufacturing method of plated parts, the amide / amino group-containing polymer can uniformly cover the surface of various types of substrates as a polymer layer (hereinafter referred to as "catalyst activity-inhibiting layer" or "inhibiting layer" as appropriate) and remain there. This makes it possible to suppress the formation of electroless plating films regardless of the type, shape, and state of the substrate. As a result, the range of substrate selection is broadened. The weight-average molecular weight of the catalyst activity inhibitor can be measured, for example, in polystyrene equivalent by gel permeation chromatography (GPC).

[0017] The amide / amino group-containing polymer may be a polymer having only amide groups, a polymer having only amino groups, or a polymer having both amide and amino groups. Any amide / amino group-containing polymer can be used, but from the viewpoint of hindering the catalytic activity of the electroless plating catalyst, a polymer having amide groups is preferred, and a branched polymer having side chains is preferred. In the case of a branched polymer, it is preferable that the side chains contain at least one of amide groups and amino groups, and more preferable that the side chains contain amide groups.

[0018] The mechanism by which amide / amino group-containing polymers hinder the catalytic activity of electroless plating catalysts is not entirely clear, but it is hypothesized as follows: The amide and / or amino groups adsorb, coordinate, and react with the electroless plating catalyst to form a complex, thereby trapping the electroless plating catalyst in the amide / amino group-containing polymer. In particular, the amide and / or amino groups contained in the side chains of branched polymers have a high degree of freedom, and a single molecule of branched polymer can contain a large number of amide and / or amino groups. Therefore, branched polymers can efficiently and powerfully trap electroless plating catalysts with multiple amide and / or amino groups. For example, branched polymers can act as polydentate ligands, and multiple amide and / or amino groups can coordinate with the electroless plating catalyst to form a chelate structure. Electroless plating catalysts trapped in this manner cannot exhibit catalytic activity. For example, when a metal such as palladium is applied to the interfering layer as an electroless plating catalyst, the amide and / or amino groups of the branched polymer trap the palladium in the form of palladium ions. Palladium ions are reduced to metallic palladium by the reducing agent contained in the electroless plating solution, and exhibit catalytic activity in electroless plating. However, palladium ions trapped in the branched polymer are not reduced by the reducing agent contained in the electroless plating solution and cannot exhibit catalytic activity. As a result, the formation of the electroless plating film is suppressed on the surface of the substrate on which a catalytic activity-interfering layer has been formed. However, this mechanism is merely a hypothesis, and the present invention is not limited thereto.

[0019] The amide group contained in the amide / amino group-containing polymer is not particularly limited and may be a primary, secondary, or tertiary amide group. Similarly, the amino group contained in the amide / amino group-containing polymer is not particularly limited and may be a primary, secondary, or tertiary amino group. The polymer may contain only one type of amide group or two or more types of amino groups.

[0020] When using a branched polymer as an amide / amino group-containing polymer, from the viewpoint of efficiently interfering with the catalytic activity of the electroless plating catalyst, the amide group contained in the branched polymer is preferably a secondary amide group, and it is also preferable that an isopropyl group is bonded to the nitrogen of the amide group. Furthermore, the amino group contained in the branched polymer is preferably a primary amino group (-NH2) or a secondary amino group (-NH-).

[0021] The side chains of the branched polymer may have at least one of an amide group and an amino group, and may also have a sulfur-containing group. The sulfur-containing group, like the amide and amino groups mentioned above, tends to adsorb the electroless plating catalyst. This promotes the effect of the branched polymer in inhibiting the catalytic activity of the electroless plating catalyst. The sulfur-containing group is not particularly limited and may be, for example, a sulfide group, a dithiocarbamate group, or a thiocyanate group, preferably a dithiocarbamate group. The side chains of the branched polymer may contain only one type of sulfur-containing group, or two or more types.

[0022] The branched polymer is preferably a dendritic polymer. A dendritic polymer is a polymer composed of a molecular structure that frequently repeats regular branching, and is classified into dendrimers and hyperbranched polymers. A dendrimer is a spherical polymer with a diameter of several nanometers that has a structure that is regularly and completely dendritically branched around a core molecule, while a hyperbranched polymer, unlike a dendrimer which has a complete dendritic structure, is a polymer that has incomplete dendritic branching. Among dendritic polymers, hyperbranched polymers are preferred as the branched polymer in this embodiment because they are relatively easy and inexpensive to synthesize.

[0023] Because dendritic polymers have many highly flexible side chains, they readily adsorb to electroless plating catalysts and can efficiently interfere with the catalytic activity of the electroless plating catalyst. Therefore, even when formed into thin films, dendritic polymers act efficiently as catalyst activity inhibitors. Furthermore, since dendritic polymer dispersions have low viscosity even at high concentrations, they can form a uniformly thick interfering layer even on substrates with complex shapes. In addition, dendritic polymers have high heat resistance. For this reason, they are suitable for plated parts requiring solder reflow resistance.

[0024] The dendritic polymer may contain functional groups that have a high affinity for the substrate, in addition to amide and / or amino groups. This enhances the adhesion between the substrate and the catalytic activity interfering layer. The functional groups with high affinity for the substrate can be appropriately selected depending on the type of substrate. For example, if the substrate is a material having aromatic rings, such as polyphenylene sulfide or liquid crystal polymer, it is preferable that the dendritic polymer contains aromatic rings. If the substrate is glass, it is preferable that the dendritic polymer contains silanol groups that have a high affinity for glass.

[0025] The dendritic polymer in this embodiment is preferably a polymer represented by the following formula (1) as described in International Publication No. 2018 / 131492. The polymer represented by the following formula (1) acts efficiently as a catalyst activity inhibitor. Furthermore, the polymer represented by formula (1) is easily dispersed in glycol ether (good initial dispersibility) and its dispersibility can be easily maintained over a long period of time (good dispersion stability).

[0026] [ka] In equation (1), A 1 It is a group containing an aromatic ring, A 2 A is a group containing an amide group, 3 R is a sulfur-containing group, 0is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, m1 is from 0.4 to 11, and n1 is from 5 to 100. m1 is preferably from 0.5 to 11.

[0027] A 1 Any group containing an aromatic ring can be used, and for example, a group represented by the following formula (2) is preferred.

Chemical formula

[0028] A 1 When A is a group represented by the formula (2), the hyperbranched structure of the hyperbranched polymer of this embodiment has a styrene skeleton. When the hyperbranched structure has a styrene skeleton, the weather resistance and heat resistance of the hyperbranched polymer are improved.

[0029] The hyperbranched polymer has a plurality of end groups. In the end group of the hyperbranched polymer represented by the above formula (1), A 2 is a group containing an amide group, and A 3 is a group containing sulfur. Also, m1 is the average value of the number (repetition number) m of the group containing an amide group (A 2 ) in each end group. Therefore, m1 does not have to be an integer. The hyperbranched polymer of this embodiment only needs the average value m1 to be from 0.4 to 11, and may have an end group that does not have a group containing an amide group (A 2 ). m1 is preferably from 0.5 to 11. The number (repetition number) m of the group containing an amide group (A 2 ) in each end group is, for example, from 0 to 11. m1 in the formula (1) is the quotient obtained by dividing the total number of groups containing an amide group (A 2 ) in the molecule (the total of m in the molecule) by the number of end groups. The value of m1 can be quantified by NMR method or elemental analysis method.

[0030] In the above formula (1), A 2 is not particularly limited as long as it is a group containing an amide group, and A 2The amide group contained in may be a primary amide group, a secondary amide group, or a tertiary amide group. Also, A 2 This may be a group containing one amide group, or a group containing two or more amide groups. 2 It is preferable that the group is represented by the following formula (3). A 2 If the group is represented by the following formula (3), the hyperbranch polymer of this embodiment has improved metal-capturing ability. This further enhances the electroless plating suppression effect.

[0031] [ka] In equation (3), R 1 R is a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms, or a single bond. 2 and R 3 Each of these is a substituted or unsubstituted alkyl group or hydrogen having 1 to 10 carbon atoms. Also, in formula (3), R 1 It is preferable that R be a single bond. 2 It is preferably hydrogen, R 3 It is preferable that it be an isopropyl group.

[0032] In the above equation (1), A 3 The group is not particularly limited as long as it contains sulfur, and examples include dithiocarbamate groups, trithiocarbonate groups, sulfide groups, thiocyanate groups, etc., with dithiocarbamate groups being preferred. 3 If the group is a dithiocarbamate group, the hyperbranched polymer of this embodiment becomes easier to synthesize and its metal-capturing ability is improved. Furthermore, A 3 Preferably, the group is represented by the following formula (4).

[0033] [ka] In equation (4), R 4 and R 5Each of these is a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or hydrogen. Also, in formula (4), R 4 and R 5 It is preferable that it be an ethyl group.

[0034] In the above equation (1), R 0 Any hydrocarbon group can be used, as long as it is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms. The hydrocarbon group may be a linear or cyclic saturated aliphatic hydrocarbon group, a linear or cyclic unsaturated aliphatic hydrocarbon group, or an aromatic hydrocarbon group. 0 However, in the case of a substituted hydrocarbon group, the substituent may be, for example, an alkyl group, a cycloalkyl group, a vinyl group, an allyl group, an aryl group, an alkoxy group, a halogen group, a hydroxyl group, an amino group, an imino group, a nitro group, a silyl group, or an ester group. Also, R 0 This group may be an unsubstituted hydrocarbon group, such as a vinyl group or an ethyl group.

[0035] The hyperbranch polymer of this embodiment is, in formula (1), R 0 It may be a mixture of different hyperbranched polymers. For example, R 0 If the polymer has unsaturated bonds, during the synthesis process of hyperbranched polymers, some of the unsaturated bonds may undergo an addition reaction to become saturated bonds. In this case, in formula (1) above, R 0 is a hyperbranched polymer of unsaturated hydrocarbon groups, and R 0 A mixture with a saturated hydrocarbon group hyperbranch polymer is obtained. The hyperbranch polymer of this embodiment is, in formula (1) above, R 0 is a vinyl group hyperbranched polymer and R 0 This may be a mixture with an ethyl group hyperbranched polymer.

[0036] The hyperbranched polymer of this embodiment preferably has a number-average molecular weight of 3,000 to 30,000 and a weight-average molecular weight of 10,000 to 300,000, and more preferably a number-average molecular weight of 5,000 to 30,000 and a weight-average molecular weight of 14,000 to 200,000. If the number-average molecular weight or weight-average molecular weight is within the above range, the dispersibility and dispersion stability in the electroless plating inhibitory composition, as well as the plating inhibitory effect, are further improved. The weight-average molecular weight and number-average molecular weight of the hyperbranched polymer can be measured, for example, in polystyrene equivalent by gel permeation chromatography (GPC).

[0037] The method for synthesizing the hyperbranched polymer of this embodiment is not particularly limited and can be synthesized by any method. For example, the hyperbranched polymer of this embodiment may be synthesized using a commercially available hyperbranched polymer as a starting material. Alternatively, the hyperbranched polymer of this embodiment may be synthesized by sequentially performing monomer synthesis, monomer polymerization, end group modification, etc. The weight-average molecular weight and number-average molecular weight of the hyperbranched polymer of this embodiment, as well as m1 and n1 in formula (1), can be adjusted within a predetermined range by adjusting the ratio of reagents used in synthesis, synthesis conditions, etc., by any method.

[0038] The amount of catalyst activity inhibitor in the electroless plating inhibitory composition is not particularly limited, but from the viewpoint of balancing the dispersibility, dispersion stability, and plating inhibitory effect of the catalyst activity inhibitor, the amount is preferably 0.1% to 5.0% by weight, and more preferably 0.3% to 2.0% by weight. Furthermore, from the viewpoint of improving the dispersion stability of the catalyst activity inhibitor, the amount is more preferably 0.1% to 2.0% by weight, and from the viewpoint of improving the plating inhibitory effect, it is more preferably 0.3% to 5.0% by weight.

[0039] <Water repellent> The water-repellent agent is an additive used to impart water repellency to the catalytic activity interfering layer formed by the electroless plating inhibitory composition. The water-repellent agent is not particularly limited as long as it is an additive that can impart water repellency to the catalytic activity interfering layer. For example, the water-repellent agent may be one or more selected from the group consisting of silicone compounds and fluorine compounds.

[0040] Examples of silicone compounds include silicone oil, modified silicone oil, silicone rubber, and silicone resin. Among these, silicone resin is preferred, and acrylic silicone resin is particularly preferred. The acrylic silicone resin may be, for example, an acrylic graft polymer structure in which the main chain has an acrylic structure and the graft (comb) portion has a siloxane structure, or an acrylic block polymer structure which is a block copolymer of an acrylic structure and a siloxane structure.

[0041] Examples of fluorine compounds include fluorine oil, fluororubber, and fluororesin. Among these, fluororesin is preferred, and acrylic fluororesin is particularly preferred. Acrylic fluororesin may be, for example, an acrylic graft polymer structure in which the main chain has an acrylic structure and the graft (comb) portion has a CF bond, or an acrylic block polymer structure which is a block copolymer of an acrylic structure and a structure having a CF bond.

[0042] As described later, the water repellent is formulated so that the water contact angle on the surface of the catalyst activity inhibiting layer is 50° or more. The amount of water repellent required varies depending on the type of water repellent, but it is preferable to formulate it so that the proportion of water repellent in the solid content of the electroless plating inhibiting composition is 2.5% by weight or more. Here, "solid content of the electroless plating inhibiting composition" refers to the components of the electroless plating inhibiting composition other than the solvent. The "solid content of the electroless plating inhibiting composition" may include catalyst activity inhibiting agents and water repellents, as well as optionally added components. Examples of optionally added components include binders (such as resins that do not interfere with catalyst activity) and leveling agents.

[0043] If the proportion of water repellent in the solid content of the electroless plating inhibitory composition is too low, the effect of imparting water repellency to the surface of the catalyst activity interfering layer may decrease, and the effect of improving the deposition and selectivity of electroless plating may decrease. The lower limit of the proportion of water repellent in the solid content of the electroless plating inhibitory composition is more preferably 3.0% by weight, even more preferably 5.0% by weight, even more preferably 6.0% by weight, and even more preferably 8.0% by weight. On the other hand, if the proportion of water repellent in the solid content of the electroless plating inhibitory composition is too high, the water repellent may bleed out (deposit), and when the substrate is stacked with another substrate, the water repellent may migrate to the back surface of the other substrate, causing problems. The upper limit of the proportion of water repellent in the solid content of the electroless plating inhibitory composition is preferably 40.0% by weight, and more preferably 35.0% by weight.

[0044] <Solvent> The glycol ether contained in the solvent is not particularly limited as long as it is a monoether of a dihydric alcohol or a diether of a dihydric alcohol. For example, from the viewpoint of improving the dispersibility of catalyst activity inhibitors, a compound represented by the following formula (G) is preferred.

[0045] [ka] In equation (G), R 11 This is a linear or branched alkyl group having 1 to 4 carbon atoms. R 12 is an ethylene group or a propylene group, R 13 This is a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms. R 11 and R 13 These may be the same group or different groups. n is either 1 or 2.

[0046] In equation (G), R 13 R may be a hydrogen atom. In this case, the glycol ether represented by formula (G) is a monoether. Also, in formula (G), R13 R may be an alkyl group instead of a hydrogen atom. In this case, the glycol ether represented by formula (G) is a diether. When the glycol ether represented by formula (G) is a diether, it is preferable to have fewer carbon atoms in formula (G) from the viewpoint of improving the dispersibility of catalyst activity inhibitors. For example, when the glycol ether represented by formula (G) is a diether, 11 and R 13 Each of these is either a methyl group or an ethyl group, and it is preferable that n is 1.

[0047] Furthermore, in the method for manufacturing plated parts, the electroless plating inhibiting composition is applied to the substrate and then dried to form a catalyst activity inhibiting layer. From the viewpoint of improving the drying properties of the electroless plating inhibiting composition, it is preferable that n is 1 in formula (G).

[0048] Examples of glycol ethers include ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol dimethyl ether, with ethylene glycol monobutyl ether and propylene glycol monomethyl ether being preferred. Using these glycol ethers further improves the dispersibility of catalyst activity inhibitors. These glycol ethers may be used individually or in combination of two or more types.

[0049] The solvent may further contain an alcohol. The alcohol contained in the solvent is a different compound from the glycol ether described above. The inclusion of an alcohol in the solvent along with the glycol ether improves the dispersion stability of the catalyst activity inhibitor. Furthermore, from the viewpoint of improving the drying properties of the electroless plating inhibitor composition in the manufacturing method of plated parts, the number of carbon atoms in the alcohol is preferably 2 to 6. From a similar viewpoint, the alcohol is preferably a monohydric or dihydric alcohol, and more preferably a monohydric alcohol.

[0050] Alcohols may be composed of a hydrocarbon group and a hydroxyl group. In this case, the alcohol does not contain oxygen atoms other than those contained in the hydroxyl group, and therefore does not contain, for example, an ether bond. The hydrocarbon group contained in the alcohol may be a straight chain or a branched chain. The hydrocarbon group may be a saturated hydrocarbon group or an unsaturated hydrocarbon group.

[0051] Examples of alcohols include ethanol, 1-propanol (n-propanol), 2-propanol (isopropyl alcohol), 1-butanol (n-butanol), 2-butanol, 1-pentanol (n-pentanol), 1-hexanol (n-hexanol), ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, and 1,2-hexanediol, with ethanol, 2-propanol, and n-butanol being preferred. Using these alcohols further improves the dispersion stability of the catalyst activity inhibitor. These alcohols may be used individually or in mixtures of two or more types.

[0052] In the electroless plating inhibitory composition, the weight ratio (X / Y) of the amount of glycol ether (X) to the amount of alcohol (Y) is not particularly limited. However, from the viewpoint of balancing the dispersibility, dispersion stability, and plating inhibitory effect of the catalyst activity inhibitor, a weight ratio (X / Y) of 2 / 98 to 100 / 0, 2 / 98 to 80 / 20, 5 / 95 to 80 / 20, or 5 / 95 to 49 / 51 is preferred. Furthermore, from the viewpoint of improving the dispersibility of the catalyst activity inhibitor, a weight ratio (X / Y) of 5 / 95 to 100 / 0 is more preferred, and from the viewpoint of improving the dispersion stability of the catalyst activity inhibitor, a weight ratio (X / Y) of 2 / 98 to 49 / 51 is more preferred. In addition, in the manufacturing method of plated parts, from the viewpoint of suppressing deformation of the substrate due to the solvent and broadening the range of substrate selection, for example, a weight ratio (X / Y) of 40 / 60 to 60 / 40 is preferred.

[0053] Furthermore, from the viewpoint of improving the dispersibility of the catalyst activity inhibitor, the weight ratio of the amount of catalyst activity inhibitor (Z) to the amount of glycol ether (X) is preferably, for example, (Z / X) × 100 = 0.4% to 25.0% by weight, and more preferably 1.02% to 10.0% by weight.

[0054] The solvent may consist solely of glycol ether, or solely of glycol ether and alcohol, or may contain other organic solvents in addition to glycol ether and alcohol, to the extent that it does not impair the effects of this embodiment. Furthermore, the amount of glycol ether (X) or the total amount of glycol ether and alcohol (X+Y) in the electroless plating inhibiting composition is, for example, 90% to 99% by weight, or 95% to 99% by weight.

[0055] The electroless plating inhibitory composition of this embodiment may consist only of a catalyst activity inhibitor, a water repellent, and a solvent. Alternatively, the electroless plating inhibitory composition of this embodiment may also include general-purpose additives such as binders and leveling agents in addition to the catalyst activity inhibitor, water repellent, and solvent.

[0056] <Water contact angle on the surface of the catalyst activity-obstructing layer> The electroless plating inhibiting composition according to this embodiment has a water contact angle of 50° or more on the surface of the catalyst activity inhibiting layer formed by the electroless plating inhibiting composition. In a method for manufacturing plated parts, the electroless plating inhibiting composition is applied to a substrate and then dried to form a catalyst activity inhibiting layer. The size of the water contact angle on the surface of the formed catalyst activity inhibiting layer can be adjusted by the type of catalyst activity inhibiting agent, the type of water repellent, and the amount of water repellent blended, and in particular, by the type of water repellent and the amount of water repellent blended. In other words, the electroless plating inhibiting composition is formulated such that the water contact angle on the surface of the formed catalyst activity inhibiting layer is 50° or more, with the type of water repellent and the amount of water repellent blended being adjusted accordingly. If the water contact angle on the surface of the catalyst activity inhibiting layer is less than 50°, the effect of imparting water repellency to the surface of the catalyst activity inhibiting layer decreases, and the effect of improving the deposition and selectivity of electroless plating decreases.

[0057] The water contact angle of the catalytic activity inhibiting layer surface is measured as follows: An electroless plating inhibiting composition is applied to a substrate (plate-shaped) using a dip coater and dried for 5 minutes at 85°C. The water contact angle is measured using the droplet method. The measurement temperature (ambient temperature) is, for example, 20-25°C. A water droplet is brought into contact with the surface of the catalytic activity inhibiting layer and the angle between the droplet and the surface of the catalytic activity inhibiting layer is measured. This measurement can be performed, for example, using a contact angle meter / wettability evaluation device LSE-B100TW (manufactured by Nic Corporation).

[0058] The lower limit of the water contact angle on the surface of the catalytic activity interfering layer is preferably 60°, more preferably 65°, and even more preferably 75°. The upper limit of the water contact angle on the surface of the catalytic activity interfering layer is not particularly limited, but is, for example, 130°, preferably 120°, and more preferably 110°.

[0059] The water contact angle of the surface of the catalyst activity inhibiting layer is preferably ((water contact angle of the substrate surface) - 30°) or higher. For example, if the water contact angle of the substrate surface is 85°, the water contact angle of the surface of the catalyst activity inhibiting layer is preferably 55° or higher. The water contact angle of the surface of the catalyst activity inhibiting layer is more preferably ((water contact angle of the substrate surface) - 20°) or higher, even more preferably ((water contact angle of the substrate surface) - 10°) or higher, and still more preferably at or above the water contact angle of the substrate surface.

[0060] <Method for producing electroless plating inhibitory composition> The electroless plating inhibitory composition of this embodiment can be prepared by a general method. For example, the electroless plating inhibitory composition can be prepared by mixing a catalyst activity inhibitor, a water repellent, a solvent containing glycol ether, and other additives as needed, using general-purpose equipment such as a stirrer, ultrasonic disperser, or mixer.

[0061] <Effects of electroless plating inhibitory composition> The electroless plating suppression composition of this embodiment provides, for example, the following effects. The electroless plating suppression composition contains a catalyst activity inhibitor. In a method for manufacturing plated parts, by applying the electroless plating suppression composition of this embodiment to parts of the substrate where electroless plating film formation is not intended, the formation of an electroless plating film in those parts can be suppressed, regardless of the type, shape, and state of the substrate. As a result, plated parts can be manufactured with a clear contrast between parts with a plated film and parts without a plated film.

[0062] Furthermore, the electroless plating inhibitory composition uses a solvent containing glycol ether as a dispersion medium to disperse the catalyst activity inhibitor. Glycol ether is a good dispersion medium that effectively disperses catalyst activity inhibitors. In addition, while solvents such as methyl ethyl ketone (MEK) and ethyl acetate corrode many types of resin substrates, glycol ether is less likely to corrode resin substrates. Therefore, using glycol ether as a dispersion medium broadens the range of substrates that can be selected.

[0063] The electroless plating inhibitory composition according to this embodiment further includes a water-repellent agent. The water-repellent agent imparts water repellency to the surface of the catalyst activity interfering layer, thereby improving the deposition and selectivity of the electroless plating.

[0064] The mechanism by which imparting water repellency to the surface of the catalytic activity inhibiting layer improves deposition and selectivity is presumed to be as follows. Figure 1 schematically shows the behavior of the plating solution 12 when the water repellency of the surface of the catalytic activity inhibiting layer 11 is relatively low (i.e., when the water contact angle is relatively small), and Figure 2 schematically shows the behavior of the plating solution 12 when the water repellency of the surface of the catalytic activity inhibiting layer 11 is relatively high (i.e., when the water contact angle is relatively large).

[0065] By imparting water repellency to the surface of the catalyst activity inhibiting layer 11, it is possible to suppress the wetting and spreading of the plating solution 12 onto the catalyst activity inhibiting layer 11 (i.e., areas where electroless plating film formation is not intended), and to promote the penetration of the plating solution 12 into areas of the substrate 10 where the catalyst activity inhibiting layer 11 is not formed (i.e., areas where electroless plating film formation is intended) (capillary action). As a result, the deposition of electroless plating in areas where electroless plating film formation is not intended can be further suppressed (improved selectivity), and the deposition of electroless plating in areas where electroless plating film formation is intended can be further promoted (improved deposition performance).

[0066] [Manufacturing method for plated parts] The manufacturing method for plated parts according to this embodiment will be described according to the flowchart shown in Figure 3. The plated parts manufactured in this embodiment are plated parts in which a plating film is selectively formed, with an electroless plating film formed on a part of the surface of the substrate (a predetermined pattern, a predetermined portion), and no electroless plating film formed on the other parts.

[0067] First, the electroless plating inhibitory composition of this embodiment described above is applied to the surface of the substrate (step S1 in Figure 3).

[0068] The material of the base material is not particularly limited, but an insulator is preferred from the viewpoint of forming an electroless plating film on the surface. For example, thermoplastic resins, thermosetting resins, photocurable resins, ceramics, and glass can be used. Among these, a resin base material formed from resin is preferred due to its ease of molding.

[0069] As thermoplastic resins, polyamides such as nylon 6 (PA6), nylon 66 (PA66), nylon 12 (PA12), nylon 11 (PA11), nylon 6T (PA6T), nylon 9T (PA9T), 10T nylon, 11T nylon, nylon MXD6 (PAMXD6), nylon 9T-6T copolymer, and nylon 6-66 copolymer can be used. As resins other than polyamides, polypropylene, polymethyl methacrylate, polycarbonate (PC), amorphous polyolefin, polyetherimide, polyethylene terephthalate, polyetheretherketone, ABS resin, polyphenylene sulfide (PPS), polyamideimide, polylactic acid, polycaprolactone, liquid crystal polymer (LCP), and cycloolefin polymer can be used. Among these, polyphenylene sulfide (PPS), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS resin), liquid crystal polymer (LCP), and nylon 6 (PA6) are highly versatile, and the solvent in the electroless plating inhibitory composition of this embodiment is less likely to deform the substrate containing these thermoplastic resins, making them preferable as substrate materials. These thermoplastic resins may be used individually or in mixtures of two or more types.

[0070] Thermosetting resins such as silicone resins and epoxy resins can be used. By using a transparent thermosetting resin, transparent devices (plated parts) with solder reflow resistance can be manufactured. Photocurable resins such as acrylic resins, silicone resins, epoxy resins, and polyimides can be used. In addition, ceramics such as alumina, aluminum nitride, lead zirconate titanate (PZT), barium titanate, and silicon wafers can be used.

[0071] The base material used in this embodiment may be a commercially available product, or it may be manufactured from commercially available materials by molding or other means. Furthermore, the base material used in this embodiment may be a foamed molded body having foam cells inside.

[0072] The electroless plating inhibiting composition applied to the substrate forms a catalytic activity interfering layer (interfering layer) on the substrate. The interfering layer is preferably thin so as not to affect the physical properties of the substrate, such as heat resistance, or its electrical properties, such as dielectric constant. The thickness of the interfering layer is preferably 5000 nm or less, more preferably 1000 nm or less, and even more preferably 300 nm or less. On the other hand, from the viewpoint of interfering with the catalytic activity of the electroless plating catalyst, the thickness is preferably 10 nm or more, more preferably 30 nm or more, and even more preferably 50 nm or more. Furthermore, from the viewpoint of suppressing the formation of electroless plating films other than predetermined patterns, the interfering layer is preferably formed in at least the region of the substrate surface that comes into contact with the electroless plating solution in the electroless plating process described later, and more preferably formed over the entire surface of the substrate.

[0073] The method for forming an interference layer on the surface of the substrate is not particularly limited. For example, the electroless plating inhibiting composition may be applied to the substrate, or the substrate may be immersed in the electroless plating inhibiting composition. Specific formation methods include dip coating, screen coating, and spray coating. Among these, the method of immersing the substrate in the electroless plating inhibiting composition (dip coating) is preferred from the viewpoint of uniformity of the formed interference layer and ease of operation.

[0074] The temperature of the electroless plating inhibitory composition and the immersion time when immersing a substrate in the electroless plating inhibitory composition are not particularly limited and can be appropriately determined considering the type of catalyst activity interferant, the thickness of the interfering layer formed, etc. The temperature of the electroless plating inhibitory composition is, for example, 0°C to 100°C or 10°C to 50°C, and the immersion time is, for example, 1 second to 10 minutes or 5 seconds to 2 minutes.

[0075] The water contact angle of the surface of the interfering layer is preferably ((water contact angle of the substrate surface) - 30°) or higher. In other words, it is preferable to prepare the electroless plating inhibiting composition so that the water contact angle of the surface of the interfering layer is ((water contact angle of the substrate surface) - 30°) or higher. More preferably, the water contact angle of the surface of the interfering layer is ((water contact angle of the substrate surface) - 20°) or higher, even more preferably ((water contact angle of the substrate surface) - 10°) or higher, and still more preferably greater than or equal to the water contact angle of the substrate surface.

[0076] Next, a portion of the surface of the substrate to which the electroless plating inhibitory composition has been applied is heated or irradiated with light (step S2 in Figure 3). The method of irradiating with light is not particularly limited, and examples include irradiating the surface of the substrate with laser light according to a predetermined pattern (laser drawing), or masking the parts that are not to be irradiated with light and then irradiating the entire surface of the substrate with light. It is presumed that by irradiating a portion of the surface of the substrate with light, the light is converted into heat and the surface of the substrate is heated. Another method of heating the surface of the substrate without irradiating the surface of the substrate with light is to directly heat press the surface of the substrate with a simple mold in which a pattern is formed by protrusions. Heating the substrate by laser drawing is preferred because it is easy to perform and offers excellent selectivity of the heated area, and furthermore, it is easy to change and miniaturize the pattern.

[0077] The laser light can be irradiated using laser devices such as CO2 lasers, YVO4 lasers, and YAG lasers, and these laser devices can be appropriately selected depending on the type of catalytic activity interferant used in the interfering layer.

[0078] The interfering layer is removed from a portion of the surface of the substrate that has been heated or irradiated with light (the heated portion). Here, "removal of the interfering layer" means, for example, that the interfering layer in the heated portion disappears by evaporation. By performing laser drawing of a predetermined pattern on the surface of the substrate to which the interfering layer has been applied, a portion where the interfering layer has been removed and a portion where the interfering layer remains can be formed. In the heated portion where the interfering layer has been removed, the surface layer of the substrate may evaporate and disappear together with the interfering layer. Furthermore, "removal of the interfering layer" includes not only the complete disappearance of the interfering layer, but also cases where the interfering layer remains to an extent that does not affect the progress of the subsequent electroless plating process. Even if the interfering layer remains, if it does not affect the subsequent electroless plating process, it means that the effect of interfering with the catalytic activity of the electroless plating catalyst has disappeared. Moreover, in this embodiment, cases where the heated portion of the interfering layer is modified or altered and ceases to function as an interfering layer are also included in "removal of the interfering layer". For example, if the catalyst activity interferant is an amide / amino group-containing polymer, the amide and / or amino groups may be modified or altered, resulting in the amide / amino group-containing polymer being unable to trap the electroless plating catalyst. In this case, the heated portion of the interfering layer does not completely disappear, but rather modified (altered) material remains. This modified material does not interfere with catalytic activity. Therefore, the modified or altered portion of the interfering layer exhibits the same effect as the portion where the interfering layer has disappeared.

[0079] Next, an electroless plating catalyst is applied to the surface of the heated or light-irradiated substrate (step S3 in Figure 3). The method of applying the electroless plating catalyst to the surface of the substrate is not particularly limited. For example, the electroless plating catalyst may be applied to the substrate by a general-purpose method such as the sensorizer activator method or the catalyst accelerator method. Alternatively, the electroless plating catalyst may be applied to the surface of the substrate using a plating catalyst solution containing a metal salt such as palladium chloride, as disclosed in Japanese Patent Application Publication No. 2017-036486. As the plating catalyst solution containing the metal salt, a commercially available activator treatment solution may be used.

[0080] Next, the electroless plating solution is brought into contact with the surface of the substrate (step S4 in Figure 3). The substrate surface has areas where the interfering layer remains and areas where the interfering layer has been removed in a predetermined pattern by heating or other means. By applying the electroless plating catalyst to this substrate surface and bringing it into contact with the electroless plating solution, an electroless plating film can be formed only in the areas where the interfering layer has been removed in a predetermined pattern.

[0081] As the electroless plating solution, any general-purpose electroless plating solution can be used depending on the purpose, but electroless nickel-phosphorus plating solution, electroless copper plating solution, electroless nickel plating solution, and electroless copper-nickel plating solution are preferred due to their high catalytic activity and stability.

[0082] On top of the electroless plating film, different types of electroless plating films may be formed, or electrolytic plating films may be formed by electrolytic plating. By increasing the total thickness of the plating film on the substrate, the electrical resistance can be reduced when a predetermined pattern of plating film is used as an electrical circuit. From the viewpoint of reducing the electrical resistance of the plating film, electroless copper plating films, electrolytic copper plating films, electrolytic nickel plating films, etc., are preferred as the plating films laminated on top of the electroless plating film. Also, since electrolytic plating cannot be performed on electrically isolated circuits, in such cases it is preferable to increase the total thickness of the plating film on the substrate by electroless plating. Furthermore, in order to improve the solder wettability of the plating film pattern so that it can be used with solder reflow, a plating film of tin, gold, silver, etc. may be formed on the outermost surface of the plating film pattern.

[0083] The method for manufacturing plated parts according to this embodiment, by using an electroless plating suppression composition, can suppress the formation of an electroless plating film in areas where electroless plating is not intended, regardless of the type, shape, and state of the substrate. The method for manufacturing plated parts according to this embodiment can produce plated parts with a clear contrast between areas with a plated film and areas without a plated film.

[0084] The electroless plating inhibitory composition used in the method for manufacturing plated parts of this embodiment exhibits high dispersion stability of the catalyst activity inhibitor. Therefore, even when used for extended periods, aggregation and precipitation are unlikely to occur within the electroless plating inhibitory composition, making it easy to maintain a uniform concentration of the catalyst activity inhibitor. Consequently, the method for manufacturing plated parts of this embodiment is suitable for mass production of plated parts.

[0085] In the above-described method for manufacturing plated parts, an electroless plating inhibiting composition is applied to the substrate (step S1 in Figure 3), and then a portion of the substrate surface is heated or irradiated with light (step S2 in Figure 3). However, this embodiment is not limited to this, and a portion of the substrate surface may be heated or irradiated with light (step S2 in Figure 3), and then the electroless plating inhibiting composition may be applied to the substrate. For example, since the surface of a substrate that has been laser-drawn (irradiated with light) is roughened, even if an electroless plating inhibiting composition is applied on it, a sufficient interfering layer to inhibit electroless plating will not be formed. For this reason, a plating film can be selectively formed only on the laser-drawn portion. [Examples]

[0086] The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the following examples and comparative examples.

[0087] The electroless plating inhibitory compositions of Examples 1 to 15 were prepared by the method described below.

[0088] As a catalyst activity inhibitor, a hyperbranched polymer represented by the following formula (5) was synthesized by the method disclosed in International Publication No. 2018 / 131492.

[0089] [ka]

[0090] The hyperbranched polymer represented by formula (5) is the polymer represented by formula (1), and in formula (1), A 1 is the base represented by formula (2); A 2The group is represented by formula (3), and R 1 It is a single bond, R 2 is hydrogen, R 3 is an isopropyl group; A 3 is a dithiocarbamate group represented by formula (4), and R 4 and R 5 is an ethyl group, R 0 This is either a vinyl group or an ethyl group.

[0091] The molecular weight of the synthesized hyperbranched polymer was measured by GPC (gel permeation chromatography). The molecular weight was 9,946 for the number average molecular weight (Mn) and 24,792 for the weight average molecular weight (Mw), which is a significant difference between the number average molecular weight (Mn) and the weight average molecular weight (Mw), characteristic of the hyperbranched structure.

[0092] After mixing the synthesized hyperbranch polymer represented by formula (5), a leveling agent, a water repellent, and a glycol ether (ethylene glycol monobutyl ether (SP:9.8)), the mixture was stirred and dispersed for approximately 30 minutes using an AS ONE tornado stirrer to prepare the electroless plating inhibitory compositions of Examples 1 to 15. The leveling agent was blended in an amount equal to half the weight of the hyperbranch polymer (catalyst activity inhibitor). As a comparative example, an electroless plating inhibitory composition without a water repellent was also prepared.

[0093] [Evaluation Method] These electroless plating inhibitory compositions were evaluated as follows. The evaluation results are shown in Tables 1 and 2.

[0094] (1) Water contact angle of the surface of the catalyst activity interfering layer The water contact angle on the surface of the catalyst activity interfering layer formed by each electroless plating inhibitory composition was measured using the method described in the embodiment. The measurement was performed using a contact angle meter / wettability evaluation device LSE-B100TW (manufactured by NIC), and the contact angle was calculated by analyzing the image automatically acquired on a PC after droplet application.

[0095] (2) Precipitation and selectivity The deposition properties and selectivity of the electroless plating inhibitory composition were evaluated as follows.

[0096] First, polyphenylene sulfide (PPS), nylon 6 (PA6), and syndiotactic polystyrene (SPS) were molded into 5cm × 8cm × 0.2cm plate-like bodies using a general-purpose injection molding machine. These plate-like bodies were used as substrates. The water contact angles of the surfaces of these substrates were 80° (PPS, Z230 (DIC Corporation)), 60° (PA6, 1015GC9 (Ube Industries, Ltd.)), and 85° (SPS, Zarec SP130 (Idemitsu Kosan Co., Ltd.)), respectively.

[0097] The substrate was immersed in an electroless plating inhibitory composition at room temperature for 1 second, and then dried in an 85°C dryer for 5 minutes. This formed a catalyst activity inhibiting layer on the surface of the substrate.

[0098] To form a line / space (L / S) pattern at a predetermined interval, laser light was irradiated, and the catalytic activity interfering layer in the irradiated area was removed. Patterns were created in which both the width of the line portion (plating formation area) and the width of the space portion (gaps between plating formation areas (non-plating areas)) were 0.2 mm, and patterns in which both the width of the line portion and the width of the space portion were 0.5 mm.

[0099] An electroless plating catalyst was applied to the surface of a substrate irradiated with laser light using a commercially available electroless plating catalyst solution (Okuno Pharmaceutical Co., Ltd., Sensitizer and Activator) in a general-purpose manner (Sensitizer-Activator method). Next, the substrate coated with the electroless plating catalyst was immersed for 10 minutes in an electroless nickel-phosphorus plating solution or an electroless nickel-copper plating solution adjusted to 60°C.

[0100] The substrates subjected to the above treatment were observed with an optical microscope, and the deposition properties and selectivity of the plating were evaluated according to the following criteria.

[0101] <Precipitation property> Good: Electroless plating was formed over 95% of the surface area of ​​the line section. Acceptable: An electroless plating film was formed on an area of ​​80% to less than 95% of the line area. Failure: The area of ​​the electroless plating film formed on the line portion was less than 80% of the line portion's area. <Selectivity> Good: The area of ​​the electroless plating film formed in the empty space was less than 2% of the area of ​​the empty space. Acceptable: The area of ​​the electroless plating film formed in the space was 2% or more but less than 5% of the total area of ​​the space. Unacceptable: Electroless plating film was formed on an area of ​​5% or more of the space area. <Rating> Excellent: Both selectivity and precipitation properties are "good". Good: Selectivity is "good" and precipitation is "acceptable," or selectivity is "acceptable" and precipitation is "good." Acceptable: Both precipitation properties and selectivity are "acceptable," or selectivity is "good" and precipitation is "unacceptable." Impossible: Selectivity is "impossible," or selectivity is "possible" but precipitation is "impossible."

[0102] In Tables 1 and 2, the types of water repellents, plating solutions, and substrates are indicated using the following abbreviations. <Water repellent> Water repellent A: Manufactured by NOF Corporation, acrylic-fluorine polymer, Modiper (registered trademark) F606 Water repellent B: Manufactured by NOF Corporation, acrylic-silicone copolymer, Modiper (registered trademark) FS700 Water repellent C: Manufactured by BYK, silicone-based surface modifier (hydroxyl group-containing silicone-modified acrylic polymer), SILCLEAN® 3700 <Plating solution> NiP: Electroless nickel-phosphorus plating solution (Okuno Pharmaceutical Co., Ltd., Top Nicolon LPH-L, pH 6.5) CuNi: Electroless copper-nickel plating solution (JCU Corporation, AISL570) <Base material> PPS: Polyphenylene sulfide (DIC Corporation, glass fiber reinforced PPS Z230, black) PA6: Nylon 6 (manufactured by Ube Industries, Ltd., UBE Nylon® GC1015GC9) SPS: Syndiotactic polystyrene (manufactured by Idemitsu Kosan Co., Ltd., Zarec SP130)

[0103] [Table 1]

[0104] [Table 2]

[0105] As shown in Tables 1 and 2, the electroless plating inhibiting compositions of Examples 1 to 15 had a water contact angle of 50° or more on the surface of the catalyst activity interfering layer. Examples 1 to 15, in which electroless plating was performed using these electroless plating inhibiting compositions, showed superior deposition and selectivity of the electroless plating compared to the comparative example. [Industrial applicability]

[0106] The electroless plating inhibitory composition of the present invention can be used, for example, in the manufacture of mass-produced plated parts such as MIDs used in smartphones, automobiles, and the like.

Claims

1. A composition that inhibits electroless plating, A catalyst activity inhibitor that interferes with the activity of electroless plating catalysts, Water repellent, A solvent containing glycol ether, The catalyst activity interferant is a hyperbranched polymer represented by the following formula (5), The water contact angle on the surface of the catalyst activity interfering layer formed by the electroless plating suppression composition is 50° or more. An electroless plating inhibitory composition wherein the proportion of the water repellent in the solid content of the electroless plating inhibitory composition is 40.0% by weight or less. 【Chemistry 1】 In formula (5), m2 is 0.4 to 11, n2 is 5 to 100, and R0 is a vinyl group or an ethyl group.

2. An electroless plating inhibitory composition, A catalyst activity inhibitor that interferes with the activity of electroless plating catalysts, Water repellent, A solvent containing glycol ether, The catalyst activity interferant is a hyperbranched polymer represented by the following formula (5), An electroless plating inhibiting composition wherein the water contact angle of the surface of the catalyst activity interfering layer formed by the electroless plating inhibiting composition is 50° or more and 101° or less. 【Chemistry 2】 In formula (5), m2 is 0.4 to 11, n2 is 5 to 100, and R0 is a vinyl group or an ethyl group.

3. The electroless plating inhibitory composition according to claim 1 or 2, wherein the water-repellent agent is at least one selected from the group consisting of silicone compounds and fluorine compounds.

4. The electroless plating inhibitory composition according to any one of claims 1 to 3, wherein the proportion of the water repellent in the solid content of the electroless plating inhibitory composition is 2.5% by weight or more.

5. The electroless plating inhibitory composition according to any one of claims 1 to 4, wherein the solvent further comprises an alcohol.

6. The electroless plating inhibitory composition according to any one of claims 1 to 5, wherein the weight-average molecular weight of the catalyst activity inhibitor is 1,000 to 1,000,000.

7. The electroless plating inhibiting composition according to any one of claims 1 to 6, wherein the amount of the catalyst activity inhibitor blended in the electroless plating inhibiting composition is 0.1% by weight to 5.0% by weight.

8. A method for manufacturing plated parts, The electroless plating inhibitory composition according to any one of claims 1 to 7 is applied to the surface of the substrate, Heating or irradiating a portion of the surface of the substrate with light, Applying an electroless plating catalyst to the surface of the substrate that has been heated or irradiated with light, A method for manufacturing a plated part, comprising contacting an electroless plating solution with the surface of the substrate to which the electroless plating catalyst has been applied, and forming an electroless plating film on the heated portion or the light-irradiated portion of the surface.

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