Methods, apparatus, devices, and media for constructing a measurement database based on design layout.

Abstract

The present application provides a method, an apparatus, an electronic device, and a computer-readable storage medium for constructing a measurement database based on a design layout. The method for constructing a measurement database based on the design layout includes the steps of: selecting an actual pattern to be measured in the design layout; obtaining an SEM image of the actual pattern at the actual position of the silicon wafer; obtaining all measurement data of the SEM image; and storing the measurement data to obtain a measurement database. According to an embodiment of the present application, the constructed measurement database can store a large amount of measurement data obtained from the actual pattern of the chip and the pattern environment around the measurement data.

Description

Technical Field

[0001] This application belongs to the field of chip production and manufacturing, and particularly relates to a method, apparatus, electronic device, and computer-readable storage medium for constructing a measurement database based on a design layout.

Background Art

[0002] Currently, in the chip production and manufacturing process, for the line width measurement data generated during the production process, a database is usually constructed based on the design line width, design interval, and design pitch (pitch) to store and monitor the data. Here, the pitch is the distance between the centers of two "cells" on the board surface.

[0003] Measurements based on general design line widths, design intervals, and design pitches (pitch) are all to measure various dedicated design test patterns. Hereinafter, the measurement of several general test patterns will be described.

[0004] (1) Measurement of the design line width, design interval, and design pitch of Hole / Islan (hole / island)

[0005] Normal Hole / Island measurement is generally measured based on the design line width of the Hole or Island (a1, b1 shown in FIG. 1), design pitch (p1, p2 shown in FIG. 1), and design interval (s1 shown in FIG. 1). The obtained data is also stored, used, and monitored based on these design values.

[0006] (2) Measurement of the design line width, design interval, and design pitch of Line / Space (line / space)

[0007] Normal Line / Space measurement is generally measured based on the design width of the Line or Space (w1, w2 shown in FIG. 2), design pitch (p1 shown in FIG. 2), and design interval (s1 shown in FIG. 2). The obtained data is also stored, used, and monitored based on these design values.

[0008] Currently, after the measurement of the design line width or design interval is completed, the measured values ​​are generally stored in a database, and then the design pitch is added and stored based on the design line width or design interval. The measurement data is then used and monitored, as shown in Figure 3.

[0009] Conventional technology performs measurements on a test pattern, and since the design line width, design interval, and design pitch of the test pattern are fixed values, data can be stored based on the design line width, design interval, and design pitch.

[0010] However, conventional technology cannot store measurement data of the actual pattern on a silicon wafer. Since the actual pattern on a silicon wafer usually has multiple types of design line widths, design spacings, and design pitches simultaneously, if measurement data is stored only based on the design line width, design spacing, and design pitch, it is not possible to cover the influence of the surrounding environment on the measured line width and spacing values.

[0011] In actual silicon wafer patterns, the design layout patterns of small blocks include various line width design values, spacing design values, and pitch design values, and the actual line width and spacing values ​​are influenced by the surrounding patterns.

[0012] As shown in Figure 4, the line width w1 in the central part of Figure 4 is influenced not only by the adjacent line width w2 and spacing s1, but also by the non-adjacent line width w3 and spacing s2. Furthermore, the line widths w4 and spacings s3 and s4 in other directions also influence w1.

[0013] Therefore, storing data based solely on the design line width, design spacing, and design pitch is insufficient for storing data of the actual chip pattern, and it is not possible to store all pattern information that affects the line width.

[0014] Furthermore, while it is possible to store data based on design line width, design spacing, and design pitch, it is difficult to simultaneously store line width and spacing values ​​for each chip manufacturing layer of the actual pattern on the same silicon wafer. The continuous upgrade of chip production technology necessitates greater attention to the mutual influence between each chip manufacturing layer. It is becoming increasingly important to centrally store and manage measurement data for each manufacturing layer of the actual chip pattern at the same silicon wafer location.

[0015] In light of this, we propose this application. [Overview of the project]

[0016] Embodiments of the present invention provide a method, apparatus, electronic device, and computer-readable storage medium for constructing a measurement database based on a design layout, the constructed measurement database being capable of storing a large amount of measurement data obtained from the actual pattern of the chip and the pattern environment surrounding the measurement data.

[0017] According to the first aspect, an embodiment of the present application provides a method for constructing a measurement database based on a design layout, and the method for constructing a measurement database based on a design layout is The steps include selecting the actual patterns to be measured in the design layout, The steps include: acquiring scanning electron microscope (SEM) images of the actual pattern at the actual location on the silicon wafer; Steps include acquiring all measurement data from the SEM image, This includes the step of storing measurement data and obtaining a measurement database.

[0018] As an option, the step of acquiring all measurement data from the SEM image is: Determining target measurement points based on the coordinate position information of the design layout, Based on the design layout and pre-set measurement conditions, all measurement boxes within the pre-set measurement range are generated, Based on the target measurement points and all measurement boxes, generate a measurement recipe file. Aligning SEM images with the design layout and obtaining the alignment results, and This includes measuring SEM images and acquiring measurement data based on the alignment results and measurement recipe file.

[0019] As an option, the step of storing measurement data and obtaining a measurement database is: The process involves grouping patterns based on the design layout and obtaining the grouping results. This includes storing the corresponding measurement data based on the grouping results and obtaining a measurement database.

[0020] As an option, it is possible to store the corresponding measurement data based on the grouping results and obtain a measurement database. This includes storing corresponding measurement data based on grouping results, design line width, design interval, and design pitch, and obtaining a measurement database. Here, the measurement data includes design line width, design interval, design pitch, and design layout information.

[0021] As an option, it is possible to store corresponding measurement data based on grouping results, design line width, design interval, and design pitch, and acquire a measurement database. This includes storing corresponding measurement data based on the grouping results, design line width, design interval, and design pitch order, and obtaining a measurement database.

[0022] As an option, it is possible to store corresponding measurement data based on the grouping results, design line width, design interval, and design pitch order, and acquire a measurement database. Based on the grouping results, determine each layer in the pattern of each group, For each layer, storing corresponding measurement data based on the order of the designed line width, designed interval, and designed pitch, and obtaining a measurement database.

[0023] Optionally, grouping patterns based on the design layout and obtaining a grouping result includes grouping patterns based on the design layout and determining a database number corresponding to the patterns of each group.

[0024] Optionally, after storing the measurement data and obtaining the measurement database, the method further includes obtaining measurement data of a new additional pattern, determining whether the new additional pattern is the same as the pattern corresponding to each database number, and if the pattern corresponding to one database number is the same as the new additional pattern, storing the measurement data of the new additional pattern in the measurement data record corresponding to the database number.

[0025] Optionally, after determining whether the new additional pattern is the same as the pattern corresponding to each database number, the method further includes if the patterns corresponding to all database numbers are all different from the new additional pattern, generating a new database number for the new additional pattern, and storing the measurement data of the new additional pattern in the measurement data record corresponding to the new database number.

[0026] Optionally, after obtaining the measurement data of the new additional pattern, the method further includes searching, comparing, and updating the existing patterns in the measurement database based on the measurement data of the new additional pattern.

[0027] As an option, you can group patterns based on the design layout and obtain the grouping results. This includes grouping measurement points that are located at different positions within a single chip product but have the same pattern into the same group.

[0028] As an option, you can group patterns based on the design layout and obtain the grouping results. This includes grouping measurement points with the same pattern across different chip products into the same group.

[0029] In a second aspect, the embodiment of the present application provides a device for constructing a measurement database based on a design layout. A pattern selection module for selecting the actual patterns to be measured in the design layout, An SEM image acquisition module that acquires an SEM image of the actual pattern at the actual location on the silicon wafer, A measurement data acquisition module that acquires all measurement data from SEM images, It includes a module for building a measurement database that stores measurement data and retrieves a measurement database.

[0030] As an option, the measurement data acquisition module is configured to determine target measurement points based on the coordinate position information of the design layout, generate all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions, generate a measurement recipe file based on the target measurement points and all measurement boxes, align the SEM image to the design layout, acquire the alignment result, and then measure the SEM image and acquire measurement data based on the alignment result and the measurement recipe file.

[0031] As an option, the measurement database construction module is available. A pattern grouping unit that groups patterns based on the design layout and obtains the grouping result, Includes a measurement database construction unit that stores corresponding measurement data based on the grouping results and obtains a measurement database.

[0032] Optionally, the measurement database construction unit is configured to store corresponding measurement data and acquire a measurement database based on grouping results, design line width, design interval, and design pitch. Here, the measurement data includes design line width, design interval, design pitch, and design layout information.

[0033] Optionally, the measurement database building unit is configured to store corresponding measurement data and acquire a measurement database based on the grouping results, design line width, design interval, and design pitch order.

[0034] Optionally, the measurement database construction unit is configured to determine each layer in the pattern of each group based on the grouping results, and to store the corresponding measurement data for each layer based on the order of the design line width, design interval, and design pitch, thereby acquiring a measurement database.

[0035] Optionally, the pattern grouping unit is configured to group patterns based on the design layout and determine the database number corresponding to the patterns in each group.

[0036] As an option, the device, Furthermore, a measurement data acquisition module is included to acquire measurement data for new additional patterns. A pattern determination module that determines whether a newly added pattern is the same as the pattern corresponding to each database number, Furthermore, the system includes a measurement database construction unit that, if the pattern corresponding to one database number is the same as a new additional pattern, stores the measurement data of the new additional pattern in the measurement data record corresponding to the database number.

[0037] As an option, the device, If all the patterns corresponding to all database numbers are different from the new additional pattern, a database number generation module generates one new database number for the new additional pattern, Furthermore, it includes a measurement database construction unit that stores measurement data for new additional patterns in measurement data records corresponding to a new database number.

[0038] As an option, the device, Furthermore, it includes a measurement database construction unit that searches, compares, and updates existing patterns in the measurement database based on measurement data of newly added patterns.

[0039] Optionally, the pattern grouping unit is configured to group together measurement points that are located at different positions within a single chip product but have the same pattern.

[0040] Optionally, the pattern grouping unit is configured to group together measurement points with the same pattern across different chip products.

[0041] In a third aspect, an embodiment of the present application provides an electronic device including a processor and a memory in which computer program instructions are stored. When the processor executes a computer program instruction, it realizes a method for constructing a measurement database based on the design layout shown in the first embodiment.

[0042] In a fourth embodiment, the embodiment of the present application provides a computer-readable storage medium in which computer program instructions are stored, and when the computer program instructions are executed by a processor, a method for constructing a measurement database based on the design layout shown in the first embodiment is realized.

[0043] The method, apparatus, electronic device, and computer-readable storage medium for constructing a measurement database based on the design layout according to the embodiment of the present application can store a large amount of measurement data obtained from the actual pattern of the chip and the pattern environment surrounding the measurement data in the constructed measurement database.

[0044] The method for constructing a measurement database based on the design layout includes the steps of: selecting the actual pattern to be measured in the design layout; acquiring an SEM image of the actual pattern at the actual location on the silicon wafer; acquiring all the measurement data from the SEM image; and storing the measurement data to obtain a measurement database.

[0045] As will be seen, this method allows for the selection of actual patterns to be measured in the design layout, acquisition of SEM images of the actual patterns at their actual locations on the silicon wafer, and further acquisition of a large amount of measurement data and the pattern environment surrounding the measurement data from the actual patterns on the chip. [Brief explanation of the drawing]

[0046] To more clearly describe specific embodiments of the present invention or technical concepts in the prior art, the drawings that may be used in the description of specific embodiments or the prior art are briefly described below. Clearly, the drawings in the following description are some embodiments of the present application, and those skilled in the art can obtain other drawings based on these without requiring any creative work.

[0047] [Figure 1] This is a schematic diagram illustrating the measurement of the design line width, design interval, and design pitch of Hole / Island in conventional technology. [Figure 2] This is a schematic diagram illustrating the measurement of the design line width, design spacing, and design pitch of Line / Space in conventional technology. [Figure 3] This is a schematic diagram of usage and monitoring data in conventional technology. [Figure 4]This figure shows that the line width w1 is affected by the surrounding patterns. [Figure 5] This is a schematic flowchart of a method for constructing a measurement database based on a design layout according to one embodiment of the present invention. [Figure 6] This is a schematic diagram of the measurement data content based on the design layout according to one embodiment of the present invention. [Figure 7] This is a schematic diagram of a database for storing measurement data for each chip manufacturing layer according to one embodiment of the present invention. [Figure 8] This is a schematic diagram of a measurement database construction device based on a design layout according to one embodiment of the present invention. [Figure 9] This is a schematic diagram of the structure of an electronic device according to one embodiment of the present invention. [Modes for carrying out the invention]

[0048] The features and exemplary embodiments of each aspect of the present application will be described in detail below, and the present application will be described in further detail below with reference to the drawings and specific examples in order to provide a clearer understanding of its purpose, technical proposal and advantages. For the sake of clarity, the specific examples described herein are intended solely for interpretation of the present application and not to limit it. To those skilled in the art, the present application can be implemented without requiring some of these specific details. The following description of the embodiments is provided only to illustrate the present application and to provide a better understanding of it.

[0049] In this specification, relational terms such as "First" and "Second," etc., are merely used to distinguish one entity or operation from another and do not necessarily require or imply that such an actual relationship or order exists between these entities or operations. Furthermore, the terms "includes," "equips," or any other variation thereof are intended to cover non-exclusive inclusion, and a process, method, article, or device that includes a set of elements includes not only those elements but also other elements not explicitly listed, or elements specific to such a process, method, article, or device. Unless further restrictions are found, an element limited by the phrase "...includes" does not preclude the presence of other identical elements in a process, method, article, or device that includes such elements.

[0050] To solve the problems of the prior art, the present invention provides a method, apparatus, electronic device, and computer-readable storage medium for constructing a measurement database based on a design layout. First, the method for constructing a measurement database based on a design layout according to the present invention will be described.

[0051] Figure 5 is a schematic flowchart of a method for constructing a measurement database based on a design layout according to one embodiment of the present invention. As shown in Figure 5, the method for constructing a measurement database based on the design layout includes the following steps.

[0052] S501 selects the actual patterns to be measured in the design layout.

[0053] However, this actual pattern is not a test pattern.

[0054] S502 acquires scanning electron microscope (SEM) images of the actual pattern at the actual location on the silicon wafer.

[0055] S503 acquires all measurement data from the SEM image.

[0056] In some embodiments, all measurement data from SEM images can be automatically acquired.

[0057] In some embodiments, obtaining all measurement data from SEM images is possible. Determining target measurement points based on the coordinate position information of the design layout, Based on the design layout and pre-set measurement conditions, all measurement boxes within the pre-set measurement range are generated, Based on the target measurement points and all measurement boxes, generate a measurement recipe file. The process involves aligning SEM images with the design layout and obtaining the alignment result, This includes measuring SEM images and acquiring measurement data based on the alignment results and measurement recipe file.

[0058] S504 stores measurement data and acquires a measurement database.

[0059] In some embodiments, storing measurement data and obtaining a measurement database is, The process involves grouping patterns based on the design layout and obtaining the grouping results. This includes storing the corresponding measurement data based on the grouping results and obtaining a measurement database.

[0060] In some embodiments, storing corresponding measurement data based on grouping results and obtaining a measurement database is possible. This includes storing corresponding measurement data based on grouping results, design line width, design interval, and design pitch, and obtaining a measurement database. Here, the measurement data includes design line width, design interval, design pitch, and design layout information.

[0061] In some embodiments, based on grouping results, design line width, design interval, and design pitch, corresponding measurement data is stored to obtain a measurement database. This includes storing corresponding measurement data based on the grouping results, design line width, design interval, and design pitch order, and obtaining a measurement database.

[0062] Specifically, as shown in Figure 6, the stored measurement values ​​can be stored in the order of "pattern grouping - design line width and design interval - design pitch," and the database data can be queried and used according to the pattern grouping, design line width and design interval, and design pitch.

[0063] In some embodiments, a measurement database is obtained by storing corresponding measurement data based on the grouping results, design line width, design interval, and design pitch order. Based on the grouping results, determine each layer in the pattern of each group, This includes storing corresponding measurement data for each layer based on the order of design line width, design interval, and design pitch, and acquiring a measurement database.

[0064] Since a layout-based measurement database can include multilayer layout information, measurement data from different chip manufacturing layers can be stored in the same set of design patterns, allowing for better monitoring of the relationship between interlayer linewidth data and yield rates.

[0065] In the manufacturing process of advanced chips, the chip manufacturing layer of the same layer is divided into two or more exposures to transfer the design layout to the silicon wafer. In a multi-exposure process, later exposed layers are affected by the layers that have been exposed and formed on the silicon wafer. In this case, storing together the linewidth measurements of the same design pattern after two or more exposure processes can improve the immediacy and effectiveness of monitoring, which is meaningful for monitoring and adjusting the exposure process.

[0066] Furthermore, in chip manufacturing, the line width of the metal layer and the aperture diameter of the contact / via can also affect the performance of the metal-via connection. If both the line width of the metal layer and the aperture diameter of the contact / via become narrower simultaneously, the risk of the metal-via connection failing is high. If the aperture diameter of the contact / via becomes narrower, and the line width of the preceding metal layer is sufficient, the risk of failure is low, and it is possible to avoid rework in the photolithography process of the contact / via, thereby avoiding cost losses due to excessive rework. Therefore, as shown in Figure 7, by storing the measurement data of multiple layers of the same pattern together, it is possible to improve the accuracy and effectiveness of process monitoring, improve the yield rate, and reduce costs.

[0067] In some embodiments, grouping patterns based on the design layout and obtaining the grouping results is possible. This includes grouping patterns based on the design layout and determining the database number corresponding to the pattern in each group.

[0068] In some embodiments, after storing measurement data and obtaining a measurement database, the method further... To acquire measurement data for new additional patterns, Determine whether the newly added pattern is the same as the pattern corresponding to each database number, This includes, if the pattern corresponding to one database number is the same as a new additional pattern, storing the measurement data for the new additional pattern in the measurement data record corresponding to the database number.

[0069] In some embodiments, after determining whether the new additional pattern is the same as the pattern corresponding to each database number, the method further... If all the patterns corresponding to all database numbers are different from the new additional pattern, a new database number will be generated for the new additional pattern. This includes storing measurement data for new additional patterns in measurement data records corresponding to the new database number.

[0070] Specifically, patterns are first grouped based on the design layout, and each group of patterns has a corresponding database number. When new measurement pattern data is added, the new measurement pattern needs to be compared with the numbered pattern in the database. If the new measurement pattern is the same as an existing measurement pattern, the new measurement data is added to the data record of the existing pattern and stored as one of the new measurement data for the existing pattern. If all new measurement patterns are different from existing measurement patterns, the database generates a new measurement pattern number to store this new measurement pattern. The new measurement data is also stored in the measurement data record for the new measurement pattern.

[0071] In some embodiments, after obtaining measurement data for new additional patterns, the method further... This includes searching, comparing, and updating existing patterns in the measurement database based on measurement data of newly added patterns.

[0072] In some embodiments, grouping patterns based on the design layout and obtaining the grouping results is possible. This includes grouping measurement points that are located at different positions within a single chip product but have the same pattern into the same group.

[0073] In some embodiments, grouping patterns based on the design layout and obtaining the grouping results is possible. This includes grouping measurement points with the same pattern across different chip products into the same group.

[0074] Based on the pattern grouping method shown in the above embodiment, the uniformity of line width control within a chip and the uniformity of line width control between products can be better compared and monitored.

[0075] As described above, the measurement database constructed according to this invention can store a large amount of measurement values ​​obtained from the actual pattern of the chip, as well as the pattern environment surrounding the measurement values. Conventional measurement databases, when storing measurement values ​​on the actual pattern, can only store the design line width or spacing and design pitch of the measurement points, and cannot store the pattern environment surrounding the measurement points. However, it is necessary to consider that the measurement values ​​on the actual chip pattern are affected by the surrounding pattern.

[0076] Figure 8 is a schematic diagram of a measurement database construction device based on a design layout according to one embodiment of the present invention. As shown in Figure 8, the measurement database construction device based on the design layout is A pattern selection module 801 for selecting the actual pattern to be measured in the design layout, An SEM image acquisition module 802 acquires an SEM image of the actual pattern at the actual location on the silicon wafer, A measurement data acquisition module 803 that acquires all measurement data from SEM images, It includes a measurement database construction module 804 that stores measurement data and retrieves a measurement database.

[0077] In some embodiments, the measurement data acquisition module 803 is configured to determine a target measurement point based on the coordinate position information of the design layout, generate all measurement boxes within a preset measurement range based on the design layout and preset measurement conditions, generate a measurement recipe file based on the target measurement point and all measurement boxes, align the SEM image to the design layout, acquire the alignment result, and measure the SEM image and acquire measurement data based on the alignment result and the measurement recipe file.

[0078] In some embodiments, the measurement database construction module 804 is A pattern grouping unit that groups patterns based on the design layout and obtains the grouping result, It includes a measurement database construction unit that stores corresponding measurement data based on the grouping results and acquires a measurement database.

[0079] In some embodiments, the measurement database construction unit is configured to store corresponding measurement data and acquire a measurement database based on grouping results, design line width, design interval, and design pitch, and the measurement data includes design line width, design interval, design pitch, and design layout information.

[0080] In some embodiments, the measurement database construction unit stores the corresponding measurement data based on the grouping results, design line width, design interval, and design pitch order, and acquires a measurement database.

[0081] In some embodiments, the measurement database construction unit determines each layer in the pattern of each group based on the grouping results, and for each layer, stores the corresponding measurement data based on the front-to-back order of the design line width, design interval, and design pitch, thereby acquiring a measurement database.

[0082] In some embodiments, the pattern grouping unit groups patterns based on the design layout and determines a database number corresponding to the patterns in each group.

[0083] In some embodiments, the apparatus is A measurement data acquisition module 803 acquires measurement data for new additional patterns, A pattern determination module that determines whether a newly added pattern is the same as the pattern corresponding to each database number, Furthermore, the system includes a measurement database construction unit that, if the pattern corresponding to one database number is the same as a newly added pattern, stores the measurement data of the new added pattern in the measurement data record corresponding to the database number.

[0084] In some embodiments, the apparatus is If all the patterns corresponding to all database numbers are different from the new additional pattern, a database number generation module generates a new database number for the new additional pattern, Furthermore, it includes a measurement database construction unit that stores measurement data for new additional patterns in measurement data records corresponding to a new database number.

[0085] In some embodiments, the apparatus is Furthermore, it includes a measurement database construction unit that searches, compares, and updates existing patterns in the measurement database based on measurement data of newly added patterns.

[0086] In some embodiments, a pattern grouping unit groups together measurement points that are located at different positions within a single chip product but have the same pattern.

[0087] In some embodiments, the pattern grouping unit groups measurement points that have the same pattern across different chip products into the same group.

[0088] Each module in the apparatus shown in Figure 8 has the function of realizing each step in Figure 5 and can achieve its corresponding technical effect. For the sake of brevity, the explanation is omitted here.

[0089] Figure 9 is a schematic diagram of an electronic device according to one embodiment of the present invention.

[0090] The electronic device may include a processor 901 and memory 902 that stores computer program instructions.

[0091] Specifically, the processor 901 may include a central processing unit (CPU) or an application-specific integrated circuit (ASIC), or it may be configured as one or more integrated circuits implementing embodiments of the present invention.

[0092] Memory 902 includes, but is not limited to, a large-capacity memory for data or instructions. For example, memory 902 includes, but is not limited to, a hard disk drive (HDD), a flexible disk drive, flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 902 may include a removable (or fixed) medium. Where appropriate, memory 902 may be inside or outside the electronic device. In certain embodiments, memory 902 is non-volatile fixed memory.

[0093] In one embodiment, the memory 902 may be a read-only memory (ROM). In one embodiment, the ROM may be a masked ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or flash memory, or a combination of two or more of these.

[0094] The processor 901 reads and executes computer program instructions stored in the memory 902, thereby realizing a method for constructing a measurement database based on any of the design layouts described in the above embodiment.

[0095] In one example, the electronic device may further include a communication interface 903 and a bus 910. As shown in Figure 9, the processor 901, memory 902, and communication interface 903 are connected and communicate with each other using the bus 910.

[0096] The communication interface 903 is primarily configured to enable communication between modules, apparatus, units, and / or devices in the embodiments of the present application.

[0097] Bus 910 connects components of electronic equipment, including hardware, software, or both. For example, the bus may include, but is not limited to, an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-E) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other appropriate buses or two or more combinations thereof. Where appropriate, Bus 910 may include one or more buses. While the embodiments of this application describe a specific bus, this application considers any suitable bus or interconnection.

[0098] Furthermore, referring to the measurement database construction method based on the design layout in the above embodiment, the embodiment of the present application can be realized by providing a computer-readable storage medium. Computer program instructions are stored in the computer-readable storage medium, and when the computer program instructions are executed by a processor, the measurement database construction method based on any of the design layouts in the above embodiment is realized.

[0099] It should be made clear that this application is not limited to the specific configurations and processes described above. For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps have been described and illustrated as examples. However, the method process of this application is not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications and additions, or change the order of the steps, after understanding the spirit of this application.

[0100] The functional modules shown in the structural block diagram above may be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they may include, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, or functional cards. When implemented in software, the elements of this application are programs or code segments for performing the required tasks. The programs or code segments may be stored in an instrument-readable medium or transmitted over a transmission medium or communication link by data signals contained in a carrier wave. "Instrument-readable medium" may include any medium capable of storing or transmitting information. Examples of instrument-readable mediums include electronic circuits, semiconductor memory devices, ROMs, flash memory, erasable ROMs (EROMs), flexible disks, CD-ROMs, optical disks, hard disks, optical fiber media, and radio frequency (RF) links. Code segments can be downloaded via computer networks such as the Internet or an intranet.

[0101] The exemplary embodiments referred to herein describe several methods or systems based on a series of steps or apparatus. However, this invention is not limited to the order of the steps described above; that is, the steps may be performed in the order described in the embodiments, in a different order, or multiple steps may be performed simultaneously.

[0102] The embodiments of this application have been described above with reference to flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products relating to embodiments of this application. Each block in the flowchart and / or block diagram, and each combination of blocks in the flowchart and / or block diagram, may be implemented by computer program instructions. These computer program instructions are provided to a processor of a general-purpose computer, a dedicated computer, or another programmable data processing device, so that these instructions executed by the processor of the computer or other programmable data processing device can generate a machine that can implement the functions / operations specified in one or more blocks of the flowchart and / or block diagram. Such a processor may be, but is not limited to, a general-purpose processor, a dedicated processor, a special application processor, or a field-programmable logic circuit. Furthermore, each block in the block diagram and / or flowchart, and each combination of blocks in the block diagram and / or flowchart, may be implemented by dedicated hardware that performs the specified function or operation, or by a combination of dedicated hardware and computer instructions.

[0103] The above are merely specific embodiments of the present application, and those skilled in the art will clearly understand that, for the sake of convenience and simplicity of explanation, the specific operating processes of the systems, modules, and units described above can be found by referring to the corresponding processes in the embodiments of the above methods, and are therefore omitted here. The scope of protection of the present application is not limited thereto, and those skilled in the art will understand that various equivalent modifications or substitutions can be easily conceived within the technical scope disclosed herein, and that any such modifications or substitutions should fall within the scope of protection of the present application.

Claims

1. A method for constructing a measurement database based on a design layout, The steps include selecting the actual patterns to be measured in the design layout, The steps include: acquiring an SEM image of the actual pattern at the actual location on the silicon wafer; The steps include acquiring all measurement data from the aforementioned SEM image, The step includes storing the measurement data and obtaining a measurement database, The step of storing the aforementioned measurement data and obtaining a measurement database is: The process involves grouping patterns based on the aforementioned design layout and obtaining the grouping results. This includes storing the corresponding measurement data based on the grouping results and obtaining a measurement database, Based on the grouping results, storing the corresponding measurement data and obtaining a measurement database is: This includes storing corresponding measurement data based on the grouping results, design line width, design interval, and design pitch, and acquiring a measurement database. The measurement data includes the design line width, the design interval, the design pitch, and the design layout information. A method for constructing a measurement database based on a design layout, characterized by the above.

2. The step of acquiring all measurement data from the aforementioned SEM image is: Determining target measurement points based on the coordinate position information of the design layout, Based on the aforementioned design layout and preset measurement conditions, all measurement boxes within the preset measurement range are generated. Based on the aforementioned target measurement points and all the aforementioned measurement boxes, a measurement recipe file is generated. The SEM image and the design layout are aligned to obtain the alignment result, This includes measuring the SEM image and acquiring the measurement data based on the alignment result and the measurement recipe file, A method for constructing a measurement database based on the design layout described in claim 1, characterized in that

3. Based on the grouping results, design line width, design interval, and design pitch, the corresponding measurement data is stored to obtain a measurement database. This includes storing the corresponding measurement data based on the grouping results, design line width, design interval, and design pitch order, and acquiring a measurement database. A method for constructing a measurement database based on the design layout described in claim 1, characterized in that

4. Based on the grouping results, design line width, design interval, and design pitch, the corresponding measurement data is stored to obtain a measurement database. Based on the grouping results, determine each layer in the pattern of each group, This includes, for each layer, storing the corresponding measurement data based on the order of the design line width, design interval, and design pitch, and acquiring a measurement database. A method for constructing a measurement database based on the design layout described in claim 3, characterized in that

5. Grouping patterns based on the aforementioned design layout and obtaining the grouping results is, This includes grouping patterns based on the aforementioned design layout and determining a database number corresponding to the pattern in each group. A method for constructing a measurement database based on the design layout described in claim 1, characterized in that

6. After storing the aforementioned measurement data and obtaining a measurement database, the method further: To acquire measurement data for new additional patterns, To determine whether the aforementioned new additional pattern is the same as the pattern corresponding to each of the aforementioned database numbers, If the pattern corresponding to one of the database numbers is the same as the new additional pattern, the measurement data of the new additional pattern is stored in the measurement data record corresponding to the database number, A method for constructing a measurement database based on the design layout described in claim 5, characterized in that

7. After determining whether the new additional pattern is the same as the pattern corresponding to each database number, the method further: If all the patterns corresponding to the aforementioned database numbers are different from the new additional patterns, then a new database number is generated for the new additional patterns. This includes storing measurement data for new additional patterns in a measurement data record corresponding to the new database number, A method for constructing a measurement database based on the design layout described in claim 6, characterized in that

8. After obtaining measurement data for the new additional pattern, the method further: This includes searching, comparing, and updating existing patterns in the measurement database based on the measurement data of the newly added patterns, A method for constructing a measurement database based on the design layout described in claim 6, characterized in that

9. Grouping patterns based on the aforementioned design layout and obtaining the grouping results is, This includes grouping measurement points that are located in different positions within a single chip product but have the same pattern into the same group. A method for constructing a measurement database based on the design layout described in claim 1, characterized in that

10. Grouping patterns based on the aforementioned design layout and obtaining the grouping results is, This includes grouping measurement points with the same pattern across different chip products into the same group. A method for constructing a measurement database based on the design layout described in claim 1, characterized in that

11. A pattern selection module for selecting the actual patterns to be measured in the design layout, An SEM image acquisition module that acquires an SEM image of the actual pattern at the actual location on the silicon wafer, A measurement data acquisition module that acquires all measurement data of the aforementioned SEM image, Includes a measurement database construction module that stores the aforementioned measurement data and obtains a measurement database, The aforementioned measurement database construction module is A pattern grouping unit that groups patterns based on the aforementioned design layout and obtains the grouping result, Includes a measurement database construction unit that stores corresponding measurement data based on the grouping results and acquires a measurement database, The measurement database construction unit stores the corresponding measurement data based on the grouping results, design line width, design interval, and design pitch, and acquires the measurement database. The measurement data includes the design line width, the design interval, the design pitch, and the design layout information. A device for constructing a measurement database based on a design layout, characterized by the following features.

12. The aforementioned measurement data acquisition module is: Based on the coordinate position information of the design layout, the target measurement point is determined. Based on the aforementioned design layout and preset measurement conditions, all measurement boxes within the preset measurement range are generated. A measurement recipe file is generated based on the aforementioned target measurement point and all the aforementioned measurement boxes. The SEM image and the design layout are aligned, and the alignment result is obtained. Based on the alignment results and the measurement recipe file, the SEM image is measured and the measurement data is acquired. A measurement database construction device based on the design layout described in claim 11, characterized in that

13. The measurement database construction unit stores the corresponding measurement data based on the grouping results, design line width, design interval, and design pitch order, and acquires the measurement database. A measurement database construction device based on the design layout described in claim 12, characterized in that

14. The aforementioned measurement database construction unit is Based on the grouping results, determine each layer in the pattern of each group, For each layer, the corresponding measurement data is stored based on the order of the design line width, design interval, and design pitch, and a measurement database is acquired. A measurement database construction device based on the design layout described in claim 13, characterized in that

15. The pattern grouping unit groups patterns based on the design layout and determines a database number corresponding to the pattern in each group. A measurement database construction device based on the design layout described in claim 11, characterized in that

16. The aforementioned measurement data acquisition module further acquires data for new additional patterns, The measurement database construction device based on the design layout further includes a pattern determination module that determines whether the new additional pattern is the same as the pattern corresponding to each of the database numbers. The measurement database construction unit further stores the measurement data of the new additional pattern in the measurement data record corresponding to the database number if the pattern corresponding to one of the database numbers is the same as the new additional pattern. A measurement database construction device based on the design layout described in claim 15, characterized in that

17. Furthermore, if all the patterns corresponding to all database numbers are different from the new additional patterns, it includes a database number generation module that generates one new database number for the new additional pattern. The measurement database construction unit further stores the measurement data of the new additional pattern in a measurement data record corresponding to the new database number. A measurement database construction device based on the design layout described in claim 16, characterized in that

18. The measurement database construction unit further performs a search, comparison, and update of existing patterns in the measurement database based on the measurement data of the newly added patterns. A measurement database construction device based on the design layout described in claim 16, characterized in that

19. The pattern grouping unit divides measurement points located at different positions within a single chip product but having the same pattern into the same group. A measurement database construction device based on the design layout described in claim 11, characterized in that

20. The pattern grouping unit divides measurement points with the same pattern across different chip products into the same group. A measurement database construction device based on the design layout described in claim 11, characterized in that

21. It is an electronic device, Includes the processor and memory in which computer program instructions are stored, When the processor executes the computer program instruction, it realizes a method for constructing a measurement database based on the design layout described in any one of claims 1 to 10. An electronic device characterized by the following features.

22. A computer-readable storage medium, When computer program instructions are stored and executed by a processor, a method for constructing a measurement database based on a design layout as described in any one of claims 1 to 10 is realized. A computer-readable storage medium characterized by the following features.

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