resin composition

Abstract

To provide a new resin composition which gives a cured product showing both a good glass transition temperature and low dielectric loss tangent while showing good flame retardancy.SOLUTION: A resin composition contains (A) a phosphorus-based flame retardant containing an ethylenic unsaturated bond, (B) an epoxy resin, and (C) a curing agent.SELECTED DRAWING: None

Claims

1. A resin composition comprising (A) a phosphorus-based flame retardant containing ethylenically unsaturated bonds, (B) an epoxy resin, and (C) a curing agent, Component (A) is a compound represented by the following formula (A2): (C) Component contains an active ester-based curing agent, A resin composition in which, when the total amount of resin components in the resin composition is 100% by mass, the content of component (A) is 1 to 10% by mass. 【Chemistry 1】 (In formula (A2), X represents a monovalent organic group containing an ethylenically unsaturated bond, as shown in formula (1) below. R １ and R ２ Each of these independently represents a hydroxyl group or a monovalent organic group. 【Chemistry 2】 (In formula (1), X １ This represents an alkenyl group or an alkenylaryl group. Z represents -O- or -C(=O)-O-, R ３ This represents a divalent aliphatic group, n1 and n2 each independently represent either 0 or 1.

2. The resin composition according to claim 1, further comprising (E) an inorganic filler.

3. The resin composition according to claim 2, wherein when the nonvolatile components in the resin composition are taken as 100% by mass, the content of component (E) is 40% by mass or more.

4. The resin composition according to claim 2, wherein component (E) contains silica, and when the nonvolatile components in the resin composition are taken as 100% by mass, the silica content is 40% by mass or more.

5. The resin composition according to claim 1, wherein component (A) contains 1 mole or more of phosphorus atoms per mole of ethylenically unsaturated bond.

6. The resin composition according to claim 1, wherein the mass ratio of component (A) to component (B) (component (A) / component (B)) is 0.01 or greater.

7. The resin composition according to claim 1, for use as an insulating layer for a circuit board.

8. A resin sheet comprising a support and a layer of the resin composition according to any one of claims 1 to 7 provided on the support.

9. The resin sheet according to claim 8, wherein the support is a thermoplastic resin film or a metal foil.

10. A cured product of the resin composition according to any one of claims 1 to 7.

11. A circuit board comprising an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 7.

12. A semiconductor device comprising the circuit board described in claim 11.

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