Inspection equipment and inspection method

Abstract

This inspection device comprises: a captured image acquisition unit that acquires image data by causing an image capture device, which is provided so as to be movable in a machine, to move and capture an image of at least one of a substrate and a component mounted on the substrate as an object to be inspected; and a route setting unit that, when the object to be inspected is large relative to an image capture range of the image capture device, divides a feature region including a feature portion of the object to be inspected into a plurality of sections and sets a movement path that is for the image capture device and that is for capturing an image for each of the plurality of sections.

Description

【Technical Field】 , 【0006】 , , , , 【0001】 This specification relates to an inspection apparatus and an inspection method. 【Background Art】 【0002】 Conventionally, for example, an inspection apparatus disclosed in Patent Document 1 is known. A conventional inspection apparatus acquires a plurality of images with an imaging unit that moves relative to an inspection object beyond the field of view, and creates a composite image by stitching together the acquired plurality of images. Then, the conventional inspection apparatus performs inspection of an inspection object beyond the field of view of the imaging unit using the created composite image. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2010-237225 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 By the way, in the above conventional inspection apparatus, when the inspection object is larger than the field of view of the imaging unit, that is, the imaging range, a plurality of images of the inspection object imaged by moving the imaging unit are acquired. In this case, if there is a limit to the number of images acquired, there is a possibility that the characteristic part of the inspection object to be inspected cannot be imaged. 【0005】 This specification aims to provide an inspection apparatus and an inspection method capable of preferentially imaging the characteristic part of an inspection object. 【Means for Solving the Problems】 【0006】 This specification discloses an inspection apparatus comprising: an imaging acquisition unit that acquires image data by moving an imaging device, which is movably installed inside the machine, to an object to be inspected, with at least one of a substrate and components mounted on the substrate as the object to be inspected; and a path setting unit that, when the object to be inspected is large relative to the imaging range of the imaging device, divides the feature region containing the feature part of the object to be inspected into a plurality of sections and sets a movement path for the imaging device for performing imaging for each of the plurality of sections. 【0007】 Furthermore, this specification discloses an inspection method comprising: an imaging acquisition step of acquiring image data by moving an imaging device, which is movably installed inside the machine, to an inspection target, a substrate and components mounted on the substrate; a path setting step of dividing the feature region containing the feature part of the inspection target into a plurality of sections and setting a movement path of the imaging device for imaging each of the plurality of sections if the inspection target is large relative to the imaging range of the imaging device; an image generation step of generating a composite image by combining the plurality of image data acquired for each section in the imaging acquisition step; and a determination step of determining whether the substrate and components are good or bad based on the composite image generated in the image generation step. 【0008】 This specification also discloses the technical idea behind changing "the inspection device described in claim 1 or 2" to "the inspection device described in any one of claims 1-4" in claim 5 of the original application. Furthermore, this specification also discloses the technical idea behind changing "the inspection device described in claim 1 or 2" to "the inspection device described in any one of claims 1-5" in claim 6 of the original application. Furthermore, this specification also discloses the technical idea behind changing "the inspection device described in claim 1 or 2" to "the inspection device described in any one of claims 1-8" in claim 10 of the original application. Furthermore, this specification also discloses the technical idea behind changing "the inspection device described in claim 1 or 2" to "the inspection device described in any one of claims 1-9" in claim 11 of the original application. In addition, this specification also discloses the technical idea behind changing "the inspection device described in claim 1 or 2" to "the inspection device described in any one of claims 1-11" in claim 12 of the original application. 【0009】 According to these methods, a movement path for the imaging device can be set for each of the multiple sections into which the characteristic region containing the characteristic parts of the object to be inspected is divided. Therefore, by having the imaging device move along the movement path and take images, the characteristic parts of the object to be inspected can be preferentially imaged. [Brief explanation of the drawing] 【0010】 [Figure 1] This is a plan view showing an example configuration of a parts mounting machine. [Figure 2] This is a perspective view showing an example of a tubular member. [Figure 3] This is a schematic diagram illustrating the characteristic features of the circuit board. [Figure 4] This is a schematic diagram illustrating the characteristic features of a component. [Figure 5] This is a schematic diagram illustrating the case in which it becomes impossible to image characteristic regions. [Figure 6] This is a block diagram showing an example of a control block for an inspection device. [Figure 7] This is a schematic diagram illustrating the characteristic regions and sections. [Figure 8] This is a table for explaining the preliminary information. [Figure 9] This is a schematic diagram illustrating the movement path. [Figure 10] This is a schematic diagram illustrating positional and angular errors. [Figure 11] This is a schematic diagram showing the simulation results using the first composite image produced by the discrimination unit. [Figure 12] This is a schematic diagram showing a second composite image that the discrimination unit compares with the simulation results in Figure 11. [Figure 13] This is a schematic diagram illustrating the movement path of the first modified example. [Figure 14] This is a schematic diagram illustrating the movement path of the second modified example. [Modes for carrying out the invention] 【0011】 Hereinafter, the inspection apparatus and inspection method will be described with reference to the drawings. In the present embodiment, a case where the inspection apparatus uses a substrate camera provided in a component mounter that performs a mounting operation of mounting components (for example, electronic components, etc.) on a substrate will be exemplified. And in the inspection apparatus of the present embodiment, at least one of the substrate or the components mounted on the substrate is imaged along a set movement path by the substrate camera, and the quality of the substrate (for example, the state of printed solder, etc.) or the quality of the mounting state of the components mounted on the substrate (for example, the bending of the leads of the components, etc.) is inspected using the image data including the imaged feature portions. 【0012】 1. Configuration of Component Mounter 10 The configuration of the component mounter 10 will be described with reference to FIG. 1. The component mounter 10 mounts a plurality of components P on a substrate K. For this purpose, the component mounter 10 includes a substrate transfer device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15 as an imaging device, and a control device 16. 【0013】 The substrate transfer device 11 transfers the substrate K in the transfer direction (X-axis direction) along a transfer path formed by, for example, a belt conveyor or the like. Here, the substrate K is a circuit board, and for example, an electronic circuit, an electrical circuit, a magnetic circuit, etc. are formed. The substrate transfer device 11 carries the substrate K into the component mounter 10 and positions the substrate K at a predetermined position inside the machine. After the mounting process of the plurality of components P by the component mounter 10 is completed, the substrate transfer device 11 carries the substrate K out of the component mounter 10. 【0014】 The component supply device 12 supplies a plurality of types of components P to be mounted on the substrate K. The component supply device 12 includes a plurality of feeders 121 provided along the conveyance direction (X-axis direction) of the substrate K. Each of the plurality of feeders 121 is equipped with a reel. A carrier tape in which a plurality of components P are stored is wound around the reel. The feeder 121 pitch-feeds the carrier tape and supplies the component P so that it can be picked up at a supply position located on the tip side of the feeder 121. Incidentally, the component supply device 12 can also supply lead components P1, which are relatively large electronic components compared to chip components, etc., in a state where they are arranged on a tray. Here, the lead component P1 has a plurality of leads P1s arranged along the outer edge of the main body P1b as "feature portions arranged on the outer edge of the main body" (see FIG. 4). 【0015】 The component transfer device 13 includes a head drive device 131 and a moving stage 132. The head drive device 131 is configured to be able to move the moving stage 132 in the X-axis direction and the Y-axis direction (a direction orthogonal to the X-axis direction in the horizontal plane) by a linear motion mechanism. The moving stage 132 is provided with a mounting head 20 that can be detachably (replaceably) attached by a clamping member. The mounting head 20 picks up and holds the component P supplied by the component supply device 12 using at least one holding member 21, and mounts the component P on the substrate K positioned by the substrate conveyance device 11. The holding member 21 can use, for example, a suction nozzle 30, a chuck, etc., which will be described later. 【0016】 The component camera 14 is fixed to the base of the component mounting machine 10 so that the optical axis faces upward in the vertical direction (Z-axis direction orthogonal to the X-axis direction and the Y-axis direction). Therefore, the component camera 14 can image the component P, etc., held by the holding member 21 from below in the vertical direction. 【0017】 The substrate camera 15, which serves as an imaging device, is mounted on the movable table 132 of the component transfer device 13 so that its optical axis is directed downward in the vertical direction (Z-axis direction). As a result, the substrate camera 15 moves together with the movable table 132 in the X-axis and Y-axis directions, and can image the substrate K and the components P mounted on the substrate K from above in the vertical direction along the movement path M (see Figure 9), which will be set up in more detail as described later. 【0018】 The component camera 14 and the circuit board camera 15 perform imaging based on control signals sent from the control device 16. The image data G, including the image captured by the component camera 14 and the image captured by the circuit board camera 15 (described later), is transmitted to the control device 16. Since the component camera 14 and the circuit board camera 15 can use known digital imaging devices having image sensors such as CCD or CMOS, a detailed explanation of their structure is omitted. 【0019】 The control device 16 is equipped with a computer device having a CPU, ROM, RAM, various interfaces, etc., and a storage device for storing various information. The control device 16 receives detected values ​​and information output from various sensors provided on the component mounting machine 10, or image data G from the component camera 14 and the circuit board camera 15. The control device 16 executes a control program and sends control signals to each device according to, for example, a specified mounting position and specified mounting angle of a component P that are set in advance as predetermined mounting conditions, or based on the image data G. 【0020】 For example, the control device 16 causes the substrate K, positioned by the substrate transport device 11, to be imaged by the substrate camera 15. The control device 16 then processes the image data G captured by the substrate camera 15 to recognize the positioning state of the substrate K. The control device 16 also causes the component P supplied by the component supply device 12 to be picked up and held by the holding member 21, and then causes the held component P to be imaged by the component camera 14. The control device 16 then processes the image captured by the component camera 14 to recognize the orientation of the component P. 【0021】 The control device 16 executes a control program and moves the holding member 21 upwards to a designated mounting position that is pre-set as the position for mounting component P (leaded component P1) on the substrate K. The control device 16 also corrects the designated mounting position and mounting angle based on the positioning state of the substrate K and the orientation of component P (leaded component P1), and sets the actual mounting position and mounting angle for mounting component P (leaded component P1). 【0022】 The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the holding member 21 according to the mounting position and mounting angle. Then, the control device 16 lowers the holding member 21 at the corrected target position and the corrected rotation angle, and mounts the component P (leaded component P1) onto the substrate K. The control device 16 executes a mounting process to mount multiple components P (leaded component P1) onto the substrate K by repeating the pick-and-place cycle as described above. 【0023】 2. Configuration of the suction nozzle 30 As shown in Figure 2, the suction nozzle 30 comprises a body shaft 31, a flange 32, a nozzle shaft 33, and an identification code 34. The body shaft 31 is formed in a cylindrical shape. The body shaft 31 functions as the main body portion held by the holding member 21 of the mounting head 20. The flange 32 is formed in a disc shape at one end (the lower side of the paper in Figure 2) of the body shaft 31 in the axial direction (corresponding to the Z-axis direction when the suction nozzle 30 is held by the mounting head 20). 【0024】 The nozzle shaft 33 is formed in a tubular shape so as to extend axially from the body shaft 31. The body shaft 31 and the nozzle shaft 33 form a negative pressure flow path in the suction nozzle 30. The nozzle shaft 33 holds the component P (lead component P1) that contacts the tip due to the negative pressure supplied via the body shaft 31. 【0025】 Furthermore, the nozzle shaft 33 is configured to extend and retract axially relative to the body shaft 31. Specifically, the nozzle shaft 33 is biased by an elastic member in the direction of extending from the body shaft 31. The extendable portion of the suction nozzle 30, which is composed of the body shaft 31 and the nozzle shaft 33, extends and retracts against the elastic force of the elastic member when a load is applied to the body shaft 31 side at the tip of the nozzle shaft 33, as the nozzle shaft 33 slides relative to the body shaft 31. 【0026】 The identification code 34 is attached to the upper surface of the flange 32. The identification code 34 is, for example, a barcode or a two-dimensional code, and includes identification information to identify the suction nozzle 30 and unique information such as the type of suction nozzle 30. 【0027】 3. Configuration of the inspection device 40 The inspection device 40 uses at least one of the substrate K and the component P (lead component P1) mounted on the substrate K as the object to be inspected. The inspection device 40 then determines whether the object to be inspected is good or bad, i.e., performs an inspection, based on a plurality of image data G acquired by the imaging device, which captures the characteristic parts of the object to be inspected. 【0028】 In this embodiment, the characteristic parts will be described by illustrating the characteristic part Ck of the substrate K and the characteristic part Cp of the component P (leaded component P1). As shown in Figure 3, the characteristic part Ck of the substrate K can be exemplified by the shape of the solder Ks or lands printed in a predetermined area of ​​the substrate K that includes a designated mounting position for mounting a specific component P (leaded component P1), or by other components that are already mounted. As the characteristic part Cp of the component P (leaded component P1) is located on the outer edge, and as shown in Figure 4, it can be exemplified by the leads P1s arranged along the outer edge of the main body P1b of the leaded component P1. The "predetermined area of ​​the substrate K" mentioned above is the inspection target area of ​​the substrate K before mounting the component P (leaded component P1), and corresponds to, for example, the peripheral area including the designated mounting position of the component P (leaded component P1). 【0029】 Here, assuming that a substrate camera 15 provided on a component mounting machine 10 is used as an imaging device to capture images including the feature parts Ck and Cp, the imaging range of the substrate camera 15 may be smaller than a predetermined area of ​​the substrate K or component P (lead component P1) which is the object to be inspected. In this case, in order to capture images of the object to be inspected including the feature parts Ck and Cp using the substrate camera 15, as shown in Figure 5, it is necessary to move the substrate camera 15 sequentially from a predetermined starting position on the object to be inspected over the entire object to be inspected, and to take multiple images so that the feature parts Ck and Cp are included within the imaging range. 【0030】 By the way, when the substrate camera 15 moves sequentially and takes multiple images, in order to perform inspection using multiple image data G, it is necessary to store all of the image data G of the multiple images that have been captured. In this case, as mentioned above, for example, when imaging the entire object to be inspected, the number of images to be captured increases, or in other words, the data capacity of the image data G that needs to be stored increases. 【0031】 For example, if a limit is set on the storage capacity for storing image data G in the inspection device 40, the storage area may run out while imaging the feature parts Ck and Cp of the object to be inspected, which are larger than the imaging range. As a result, in the area blacked out in Figure 5, it becomes impossible to image the feature parts Ck and Cp of the object to be inspected, or to store the image data G. 【0032】 Therefore, in this embodiment, the inspection device 40 includes an image acquisition unit 41 and a path setting unit 42, as shown in Figure 6. In addition, in this embodiment, the inspection device 40 includes an error calculation unit 43. Furthermore, in this embodiment, the inspection device 40 includes an image generation unit 44 and a discrimination unit 45. With these, the inspection device 40 can reliably acquire image data G including feature parts Ck and / or feature parts Cp of the object to be inspected (at least one of the substrate K and the component P (lead component P1) mounted on the substrate K), and perform accurate inspection. Hereinafter, in this embodiment, an example is given in which the image acquisition unit 41 of the inspection device 40 uses a substrate camera 15 provided on the moving table 132 of the component transfer device 13 as the imaging device. 【0033】 Furthermore, the image acquisition unit 41, route setting unit 42, error calculation unit 43, image generation unit 44, and discrimination unit 45 can be provided in various control devices, management devices, computing devices, image processing devices, etc. For example, at least one of the image acquisition unit 41, route setting unit 42, error calculation unit 43, image generation unit 44, and discrimination unit 45 can be provided in the control device 16 of the component mounting machine 10. Also, at least one of the image acquisition unit 41, route setting unit 42, error calculation unit 43, image generation unit 44, and discrimination unit 45 can be provided in a management device that is communicatively connected to the control device 16. Moreover, at least one of the image acquisition unit 41, route setting unit 42, error calculation unit 43, image generation unit 44, and discrimination unit 45 can be formed on the cloud. 【0034】 In this embodiment, as shown in Figures 1 and 6, the image acquisition unit 41, the path setting unit 42, the error calculation unit 43, the image generation unit 44, and the discrimination unit 45 are provided in the control device 16 of the component mounting machine 10. That is, the inspection device 40 is provided in the component mounting machine 10. 【0035】 3-1. Image acquisition unit 41 The imaging unit 41 moves a substrate camera 15, which is movably mounted inside the component mounting machine 10, to select at least one of the substrate K and the component P (lead component P1) mounted on the substrate K as the object to be inspected, and acquires image data G by imaging using the substrate camera 15. Specifically, the imaging unit 41 (control device 16) moves the substrate camera 15 in the X-axis and Y-axis directions by moving the movable table 132 of the component transfer device 13 in the X-axis and Y-axis directions. The imaging unit 41 then causes the moved substrate camera 15 to image at least one of the substrate K and the component P (lead component P1) mounted on the substrate K, and acquires image data G representing the captured image. 【0036】 In the following explanation, when necessary to distinguish between them, the image data G obtained by imaging the substrate K as the object to be inspected will be referred to as "image data Gk". Also, in the following explanation, when necessary to distinguish between them, the image data G obtained by imaging the component P (lead component P1) as the object to be inspected will be referred to as "image data Gp". As will be explained later, image data Gk corresponds to the "first image data", and image data Gp corresponds to the "second image data". 【0037】 3-2. Route setting unit 42 The path setting unit 42 sets a movement path M for the substrate camera 15 when imaging the object to be inspected if at least one of a predetermined area of ​​the substrate K, which is the object to be inspected, and a component P (lead component P1) mounted on the substrate K is larger than the imaging range of the substrate camera 15 (for example, about a few millimeters square). For this reason, as shown in Figure 7, the path setting unit 42 sets a feature area R that includes the feature area Ck of the substrate K and / or the feature area Cp of the component P. 【0038】 The path setting unit 42 then divides the feature region R into multiple sections H, indicated by thick rectangular frames in Figure 7, and sets a movement path M for the substrate camera 15 to perform imaging for each of the multiple sections H. In Figure 7, the feature region R is included in the region formed by the multiple sections H, excluding those indicated by the dot pattern. The size of the sections H may be the same as or different from the imaging range of the substrate camera 15, but it is more preferable that they be the same as the imaging range of the substrate camera 15. 【0039】 Specifically, the path setting unit 42 can set a movement path M based on, for example, the imaging accuracy when the substrate camera 15 images the object to be inspected, i.e., the substrate K and at least one of the components P (lead component P1) mounted on the substrate K. Furthermore, the path setting unit 42 can set a movement path M based on, for example, the time required for the substrate camera 15 to move in the X-axis and Y-axis directions to a position where it images the object to be inspected, i.e., the substrate K and at least one of the components P (lead component P1) mounted on the substrate K. In addition, the path setting unit 42 can set a movement path M based on, for example, the load required for the image generation unit 44 to process the image data G (image data Gk and / or image data Gp) acquired by the image acquisition unit 41. 【0040】 Furthermore, as shown in Figure 8, the route setting unit 42 can set the movement path M based on prior information J regarding the setting of the movement path M. Here, the prior information J may include at least one of the following: a designated mounting position for mounting a component P (lead component P1) on the substrate K, shape information of solder Ks and / or leads P1s printed on the substrate K including a feature area Ck and / or feature area Cp, and mounting errors that may occur when mounting the component P (lead component P1) on the substrate K. The prior information J can be obtained, for example, from a management device HC (host computer, buffer, etc.) installed outside the component mounting machine 10. 【0041】 By the way, in the inspection device 40, the image data G (image data Gk and / or image data Gp) required for inspection is image data G (image data Gk and / or image data Gp) that includes feature parts Ck and / or feature parts Cp. In other words, the inspection device 40 only needs image data G (image data Gk and / or image data Gp) that includes feature parts Ck and / or feature parts Cp for inspection. 【0042】 Therefore, especially when the object to be inspected is a component P (lead component P1), the path setting unit 42 can set a spiral-shaped movement path M that always includes the lead P1s, which is a feature part Cp located on the outer edge P1o of the main body P1b of the lead component P1, as shown in Figure 9. This path M is set from the starting position S, passing through the outer edge P1o of the lead component P1 (i.e., the lead P1s), and then from the outer edge P1o towards the center P1c of the lead component P1. As a result, for example, even if there is a limit on the memory capacity and, as shown by the blacked-out area in Figure 9, the image data Gp of the main body P1b cannot be acquired along the movement path M that ultimately goes from the outer edge P1o to the center P1c, it is still possible to acquire image data Gp that includes the outer edge P1o of the lead component P1, i.e., the feature part Cp, which is the lead P1s. 【0043】 As described above, in the inspection device 40, the image data G (image data Gk and / or image data Gp) required for inspection only needs to include the feature portion Ck and / or the feature portion Cp. Therefore, for example, as described above, even if a spiral movement path M is set and image data Gp near the center P1c of the main body P1b of the lead component P1 is obtained, the image data Gp does not include the feature portion Cp (lead P1s), and is therefore unnecessary for inspection. Accordingly, if the path setting unit 42 can, for example, determine the position of the feature portion Cp of component P in advance based on prior information J, it can omit setting the movement path M in areas other than the feature region R. 【0044】 When a movement path M is set, the imaging unit 41 moves the substrate camera 15 along the movement path M to image at least one of the object to be inspected, i.e., the substrate K and the component P (lead component P1) mounted on the substrate K, in multiple sections H. As a result, if the object to be inspected is the substrate K, the imaging unit 41 acquires image data Gk (Gk1, Gk2, ..., Gkn) for each of the multiple images in each section H that include the characteristic part Ck of the substrate K (for example, the shape of the solder Ks). If the object to be inspected is a component P (lead component P1), the imaging unit 41 acquires image data Gp (Gp1, Gp2, ..., Gpn) for each of the multiple images in each section H that include the characteristic part Cp (for example, the lead P1s) of the component P. 【0045】 Furthermore, the image acquisition unit 41 can temporarily store the acquired image data Gk and / or image data Gp in, for example, a RAM or memory device forming the control device 16. Alternatively, the image acquisition unit 41 can sequentially output the acquired image data Gk and / or image data Gp to, for example, the image generation unit 44, which will be described later. 【0046】 3-3.Error calculation section 43 As shown in Figure 10, the error calculation unit 43 calculates position errors D1 and D2 of the actual mounting position (Ar, Br) relative to the designated mounting position (Ac, Bc) specified for mounting the leaded component P1 (component P) on the substrate K, and the angular error θe of the actual mounting angle θr relative to the designated mounting angle θc specified for mounting the component P (leaded component P1) on the substrate K. Specifically, the error calculation unit 43 acquires image data G (image data Gk and / or image data Gp) acquired by the imaging acquisition unit 41 along a portion of the movement path M set by the path setting unit 42 from the movement start position S to a predetermined distance, from the imaging acquisition unit 41 or a storage device, etc. Note that in Figure 10, the position errors D1, D2 and angular error θe are exaggerated for ease of understanding. 【0047】 The error calculation unit 43 then identifies the mounting position (Ar, Br) and mounting angle θr on the substrate K where the lead component P1 (component P) is attached, based on the image data G (image data Gk and / or image data Gp) acquired for a portion of the movement path M. As a result, the error calculation unit 43 calculates position errors D1 and D2 by comparing the specified mounting position (Ac, Bc) with the mounting position (Ar, Br), as shown in Figure 10. The error calculation unit 43 also calculates the angle error θe by comparing the specified mounting angle θc with the mounting angle θr, as shown in Figure 10. 【0048】 The error calculation unit 43 supplies the calculated position errors D1 and D2 and the angle error θe to the image acquisition unit 41. Based on the position errors D1 and D2 and the angle error θe, the image acquisition unit 41 corrects the direction of movement of the substrate camera 15 as it moves along the movement path M, for example, so that the mounting position (Ar, Br) and mounting angle θr of the mounted lead component P1 (component P) match the specified mounting position (Ac, Bc) and specified mounting angle θc. The image acquisition unit 41 then moves the substrate camera 15 along the rest of the movement path M according to the corrected direction of movement to acquire image data G (image data Gk and / or image data Gp). 【0049】 As a result, the imaging unit 41 can acquire image data G (image data Gk and / or image data Gp) that includes feature portion Ck and / or feature portion Cp within the image captured by the substrate camera 15. In other words, the imaging unit 41 can prevent acquiring image data G (image data Gk and / or image data Gp) that does not include feature portion Ck and / or feature portion Cp within the image, for example, due to positional errors D1, D2 and angular errors θe occurring at the imaging position of the substrate camera 15. 【0050】 3-4. Image generation unit 44 The image generation unit 44 acquires multiple image data Gk from the imaging acquisition unit 41 for each section H of the solder Ks printed in a predetermined area corresponding to the specified mounting position (Ac, Bc) on the substrate K before the component P (lead component P1) is mounted as the object to be inspected. The image generation unit 44 also acquires multiple image data Gp from the imaging acquisition unit 41 for each section H of the component P (lead component P1) mounted on the substrate K as the object to be inspected. In addition to the mounted component P (lead component P1), the image data Gp also includes images of the substrate K (solder Ks) after the component P (lead component P1) has been mounted. 【0051】 The image generation unit 44 generates a composite image Mk of the substrate K before the component P (leaded component P1) is mounted by combining (combining) multiple acquired image data Gk. The image generation unit 44 also generates a composite image Mp of the component P (leaded component P1) mounted on the substrate K by combining (combining) multiple acquired image data Gp. The composite image of component P (leaded component P1) also includes the substrate K (solder Ks) after component P (leaded component P1) has been mounted. 【0052】 Here, each image data Gk and image data Gp is ​​associated with position information representing the head position of the mounting head 20 at the time of imaging. This allows the coordinate positions of feature parts Ck and Cp to be identified in the composite image Mk and composite image Mp as well. Furthermore, if the size of the section H divided by the path setting unit 42 is the same as the size of the imaging range of the substrate camera 15, the image processing content by the image generation unit 44 can be simplified to generate a composite image. The image generation unit 44 then outputs the generated composite image Mk of the substrate K and the composite image Mp of the component P (lead component P1) to the discrimination unit 45. 【0053】 3-5.Discrimination part 45 The discrimination unit 45 determines the quality of the substrate K before the component P (lead component P1) is attached, for example, the shape of the solder Ks and whether or not it is peeling, based on the composite image Mk of the substrate K generated by the image generation unit 44. The discrimination unit 45 also determines the quality of the mounting state of the component P (lead component P1) attached to the substrate K, for example, the bending state of the leads P1s and the misalignment state relative to the solder Ks, based on the composite image Mp of the component P (lead component P1) attached to the substrate K generated by the image generation unit 44. 【0054】 Here, the discrimination unit 45 uses the image data Gk captured by the imaging acquisition unit 41 of the substrate K before the component P (lead component P1) is mounted along the movement path M as the first image data, and the combined image Mk of the substrate K before the component P (lead component P1) is mounted as the first combined image. Then, as shown in Figure 11, the discrimination unit 45 uses the first combined image (combined image Mk) to obtain a simulation result that simulates the state in which the component P (lead component P1) is mounted (shown by the dashed line in Figure 11). 【0055】 Furthermore, the discrimination unit 45 uses the image data Gp captured by the imaging acquisition unit 41 of the substrate K and the component P (lead component P1) after the component P (lead component P1) has been mounted along the movement path M as the second image data, and the combined image Mp of the component P (lead component P1) mounted on the substrate K as the second combined image. The discrimination unit 45 then compares the simulation results shown in Figure 11 with the second combined image (composite image Mp) shown in Figure 12. As a result, the discrimination unit 45 can determine the quality of the substrate K before the component P (lead component P1) is mounted, and the quality of the mounting state of the component P (lead component P1) mounted on the substrate K, as described above. Here, the discrimination unit 45 can inform, for example, an operator, of the quality of the substrate K and the quality of the mounting state of the component P, for example, through a display device (not shown). 【0056】 4. Inspection method using inspection device 40 The same applies to the inspection method performed by the inspection device 40 as described above. Specifically, the inspection method comprises an image acquisition step, a path setting step, an image generation step, and a discrimination step. The processing performed by the image acquisition unit 41 corresponds to the image acquisition step. The processing performed by the path setting unit 42 corresponds to the path setting step. The processing performed by the image generation unit 44 corresponds to the image generation step. The processing performed by the discrimination unit 45 corresponds to the discrimination step. 【0057】 In the inspection method using the inspection device 40, for example, a correction step can be added between the path setting step and the image generation step. In this case, the process by which the error calculation unit 43 calculates position error D1, position error D2, and angular error θe, and the process by which the image acquisition unit 41 corrects the direction of movement based on position error D1, position error D2, and angular error θe, correspond to the correction step. 【0058】 As can be understood from the above explanation, the inspection device 40 includes an imaging acquisition unit 41 that acquires image data G (image data Gk and / or image data Gp) by moving a substrate camera 15, which is an imaging device that is movable inside the component mounting machine 10, to image at least one of the substrate K and the component P (lead component P1) mounted on the substrate K as the object to be inspected, and a path setting unit 42 that, if at least one of the substrate K and the component P (lead component P1) mounted on the substrate K is larger than the imaging range of the substrate camera 15, divides the feature region R containing the feature portion Ck and / or feature portion Cp into a plurality of sections H, and sets a movement path M for the substrate camera 15 to perform imaging for each of the plurality of sections H. 【0059】 According to this, a movement path M can be set for imaging each of the multiple sections H obtained by dividing the feature region R, which includes at least one feature portion Ck and / or feature portion Cp of the substrate K and the component P (lead component P1) mounted on the substrate K. Therefore, by moving the substrate camera 15 along the movement path M and acquiring image data G (image data Gk and / or image data Gp), feature portions Ck and / or feature portions Cp can be preferentially imaged. 【0060】 Furthermore, the path setting unit 42 can set a spiral movement path M from the outer edge P1o of the lead component P1 (component P) toward the center P1c. As a result, the substrate camera 15 will first image the lead P1s, which are feature parts Cp located on the outer edge P1o of the lead component P1, and then image the main body P1b of the lead component P1. However, if the main body P1b of the lead component P1 does not have feature parts Cp, the image data Gp of the main body P1b is unnecessary for inspection. Therefore, by setting a spiral movement path M from the outer edge P1o toward the center P1c, the lead P1s, which are feature parts Cp, are imaged before the main body P1b, which does not have feature parts Cp, thus allowing for preferential imaging of feature parts Cp. 【0061】 Furthermore, if the path setting unit 42 can, for example, determine the position of the feature area Cp of part P based on prior information J, it can omit setting the movement path M in areas other than the feature area R. This reduces the time required to set the movement path M and also reduces the load required for setting. In addition, the storage area for storing image data Gp and image data Gk can be reduced, making it possible to achieve a reduction in manufacturing costs. 【0062】 5. First variation In the embodiment described above, the path setting unit 42 of the inspection device 40 is configured to set a spiral movement path M from the outer edge P1o to the center P1c. Alternatively, as shown in Figure 13, the path setting unit 42 can also set a circumferential movement path M so as to image only the outer edge P1o where the feature portion Cp, which is the lead P1s, is located, based on prior information J. In this case, the substrate camera 15 does not image in the area shown in black in Figure 13. 【0063】 Therefore, even in the first modified example, the route setting unit 42 can omit setting the travel route M in areas other than the feature area R, thereby reducing the time required to set the travel route M and lowering the load required for setting. Furthermore, the storage area for storing the image data Gp and image data Gk can be reduced, making it possible to achieve a reduction in manufacturing costs. 【0064】 6. Second variation In the embodiment described above, the path setting unit 42 of the inspection device 40 is configured to set a spiral-shaped movement path M from the outer edge P1o to the center P1c. Alternatively, as shown in Figure 14, the path setting unit 42 can also set the movement path M to image only the four outer edges P1o where the feature portion Cp, which is the lead P1s, is located, based on prior information J. In this case, the substrate camera 15 does not image in the area shown in black in Figure 14. 【0065】 In the second modified example, the path setting unit 42 sets a movement path M for each of the four outer edges P1o so that the substrate camera 15 moves back and forth from the movement start position S. As a result, in the second modified example, in addition to the effects of the embodiment described above, it is possible to reduce the effect of backlash in the moving platform 132 that moves the substrate camera 15. As a result, in the second modified example, it is possible to improve the imaging accuracy of the substrate camera 15. 【0066】 7. Other variations In the component mounting machine 10 of the above-described embodiment, the substrate transport device 11 transports one substrate K along one transport path formed by one conveyor belt or the like. Alternatively, the component mounting machine may be equipped with a substrate transport device capable of independently transporting two substrates K along two transport paths formed by, for example, two conveyor belts or the like. 【0067】 Furthermore, in the component mounting machine 10 of the above-described embodiment, only one set of head drive unit 131 and mobile table 132 of the component transfer device 13 is provided, and one mounting head 20 is provided on the mobile table 132. Alternatively, the component transfer device may be a so-called opposing (double) type component mounting machine, which is provided with two sets of head drive units and mobile tables arranged facing each other, and each mobile table is provided with a mounting head. 【0068】 Furthermore, in the above-described embodiment, the inspection device 40 is equipped with an error calculation unit 43. However, if, for example, the mounting accuracy of the component P to be mounted on the substrate K is high, the error calculation unit 43 may be omitted from the inspection device 40 as needed. 【0069】 Furthermore, in the embodiments described above, the case in which a substrate camera 15 provided on the component mounting machine 10 is used as the imaging device was explained as an example. However, the imaging device is not limited to the substrate camera 15, and other imaging devices (cameras, etc.) provided separately may be used. [Explanation of symbols] 【0070】 10...Component mounting machine, 15...Circuit board camera (imaging device), 40...Inspection device, 41...Image acquisition unit, 42...Path setting unit, 43...Error calculation unit, 44...Image generation unit, 45...Discrimination unit, G...Image data, Gk...Image data (first image data), Gp...Image data (second image data), K...Circuit board (object to be inspected), Ks...Solder, Ck...Feature area, P...Component (object to be inspected), P1...Leaded component (object to be inspected), P1b...Main body, P1s...Lead, P1o...Outer edge, P1c...Center, Cp...Feature area, R...Feature region, H...Section, M...Movement path, J...Prior information, D1, D2...Position error, θe...Angular error, Mk...Composite image (first composite image), Mp...Composite image (second composite image), S...Movement start position

Claims

[Claim 1] An imaging unit that moves an imaging device, which is movably installed inside the machine, to acquire image data by imaging at least one of a circuit board and components mounted on the circuit board as the object to be inspected, If the object to be inspected is larger than the imaging range of the imaging device, a path setting unit sets a feature region that includes the feature parts of the object to be inspected, divides the feature region into multiple sections, and sets a movement path for the imaging device for imaging each of the multiple sections. Equipped with, An inspection device wherein the route setting unit sets the movement path based on prior information regarding the setting of the movement path, and omits setting the movement path in areas other than the feature area where the object to be inspected is located if the position of the feature area can be known in advance based on the prior information. [Claim 2] An imaging unit that moves an imaging device, which is movably installed inside the machine, to acquire image data by imaging at least one of a circuit board and components mounted on the circuit board as the object to be inspected, If the object to be inspected is larger than the imaging range of the imaging device, a path setting unit sets a feature region that includes the feature parts of the object to be inspected, divides the feature region into multiple sections, and sets a movement path for the imaging device for imaging each of the multiple sections. Equipped with, The object to be inspected is the part in which the characteristic portion is arranged on the outer edge of the main body. An inspection device comprising: a path setting unit that sets a feature region which includes the feature portion located on the outer edge of the main body, and a circumferential movement path which, based on prior information regarding the setting of the movement path, images the outer edge of the main body where the feature portion is located. [Claim 3] The aforementioned route setting unit, The inspection apparatus according to claim 2, wherein a spiral movement path is set that passes through the outer edge of the part and extends from the outer edge toward the center of the part. [Claim 4] The aforementioned component is a lead component having a plurality of leads arranged along the outer edge of the main body, The inspection apparatus according to claim 2, wherein the aforementioned feature is a plurality of leads. [Claim 5] An imaging unit that acquires image data by moving an imaging device, which is movably installed inside the machine, to image a circuit board and components mounted on the circuit board as the objects to be inspected, If the object to be inspected is larger than the imaging range of the imaging device, a path setting unit sets a feature region that includes the feature parts of the object to be inspected, divides the feature region into multiple sections, and sets a movement path for the imaging device for imaging each of the multiple sections. An error calculation unit compares a specified mounting position and specified mounting angle for mounting the component on the substrate with a mounting position and mounting angle for mounting the component on the substrate, which are identified by the image data acquired by the imaging unit along a portion of the movement path set by the path setting unit from the starting position to a predetermined distance, and calculates the position error of the mounting position relative to the specified mounting position and the angular error of the mounting angle relative to the specified mounting angle. Equipped with, The route setting unit sets the travel route based on the prior information regarding the setting of the travel route. The imaging acquisition unit corrects the direction of movement of the imaging device as it moves along the movement path based on the position error and angle error calculated by the error calculation unit, and acquires the image data along the other part of the movement path using the corrected direction of movement. [Claim 6] The aforementioned route setting unit, The inspection apparatus according to any one of claims 1, 2, or 5, wherein the movement path is set based on the imaging accuracy when the imaging device images the object to be inspected, the time required for the imaging device to move to a position where it images the object to be inspected, and the magnitude of the load required for processing the image data acquired by the image acquisition unit. [Claim 7] The aforementioned prior information is An inspection apparatus according to any one of claims 1, 2, or 5, comprising at least one of a designated mounting position for mounting the component on the substrate, shape information of the object to be inspected including the characteristic portion, and mounting errors that may occur when mounting the component on the substrate. [Claim 8] The objects to be inspected are the substrate before the component is attached and the component attached to the substrate. An image generation unit generates a composite image by combining a plurality of image data acquired for each section by the image acquisition unit, An inspection apparatus according to any one of claims 1, 2, or 5, comprising: a discrimination unit that determines, based on the composite image generated by the image generation unit, the quality of the substrate before the component is mounted and the quality of the mounting state of the component mounted on the substrate. [Claim 9] The inspection apparatus according to any one of claims 1, 2, or 5, wherein the imaging device is a substrate camera provided on a component mounting machine. [Claim 10] An imaging acquisition step involves moving an imaging device that is movable inside the machine to acquire image data by imaging a substrate and components mounted on the substrate as the objects to be inspected, and If the object to be inspected is larger than the imaging range of the imaging device, a path setting step is performed to set a feature region that includes the feature parts of the object to be inspected, divide the feature region into multiple sections, and set a movement path for the imaging device for imaging each of the multiple sections. An image generation step that generates a composite image by combining a plurality of image data obtained for each section by the imaging acquisition step, A determination step for determining the quality of the substrate and the components based on the composite image generated by the image generation step, Equipped with, The inspection method comprising the path setting step, which sets the movement path based on prior information regarding the setting of the movement path, and, if the position of the feature part can be known in advance based on the prior information, omits setting the movement path in areas other than the feature area where the object to be inspected is located. [Claim 11] An imaging acquisition step involves moving an imaging device that is movable inside the machine to acquire image data by imaging a substrate and components mounted on the substrate as the objects to be inspected, and If the object to be inspected is larger than the imaging range of the imaging device, a path setting step is performed to set a feature region that includes the feature parts of the object to be inspected, divide the feature region into multiple sections, and set a movement path for the imaging device for imaging each of the multiple sections. An image generation step that generates a composite image by combining a plurality of image data obtained for each section in the image acquisition step, A determination step for determining the quality of the substrate and the components based on the composite image generated by the image generation step, Equipped with, The object to be inspected is the part in which the characteristic portion is arranged on the outer edge of the main body. The aforementioned path setting step is an inspection method comprising setting the feature region which includes the feature portion located on the outer edge of the main body, and setting the circumferential movement path to image the outer edge of the main body where the feature portion is located, based on prior information regarding the setting of the movement path. [Claim 12] An imaging acquisition step involves moving an imaging device that is movable inside the machine to acquire image data by imaging a substrate and components mounted on the substrate as the objects to be inspected, and If the object to be inspected is larger than the imaging range of the imaging device, a path setting step is performed to set a feature region that includes the feature parts of the object to be inspected, divide the feature region into multiple sections, and set a movement path for the imaging device for imaging each of the multiple sections. An image generation step that generates a composite image by combining a plurality of image data obtained for each section in the image acquisition step, A determination step for determining the quality of the substrate and the components based on the composite image generated by the image generation step, An error calculation step involves comparing a specified mounting position and specified mounting angle for mounting the component on the substrate with a mounting position and mounting angle for mounting the component on the substrate, which are identified by the image data acquired in the imaging acquisition step along a portion of the movement path set in the path setting step from the starting position to a predetermined distance, and calculating the position error of the mounting position relative to the specified mounting position and the angular error of the mounting angle relative to the specified mounting angle. Equipped with, The aforementioned route setting step sets the travel route based on prior information regarding the setting of the travel route, The imaging acquisition step is an inspection method comprising correcting the direction of movement of the imaging device as it moves along the movement path based on the position error and angle error calculated in the error calculation step, and acquiring the image data along the other part of the movement path using the corrected direction of movement.

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