Work handling sheet, method for manufacturing semiconductor device, and use of work handling sheet
The work handling sheet with a laser-induced ablation layer and curable adhesive addresses the challenges of adhesive separation in semiconductor chips, ensuring controlled and efficient separation of thin chips without damage.
JP7875818B2Active Publication Date: 2026-06-18LINTEC CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- LINTEC CORP
- Filing Date
- 2021-12-28
- Publication Date
- 2026-06-18
AI Technical Summary
⚠Technical Problem
The separation of semiconductor chips with a film-like adhesive becomes challenging due to issues of excessive or insufficient adhesion, leading to potential damage or unintended separation during the pickup process, especially with thin wafers.
⚗Method used
A work handling sheet equipped with a base material, an interface ablation layer that undergoes laser-induced ablation, and a curable film-like adhesive layer, allowing controlled separation of small workpieces by laser-induced interface ablation.
🎯Benefits of technology
Facilitates the easy and controlled separation of thin semiconductor chips with a film-like adhesive, preventing breakage and unintended separation, while enabling selective pickup of intended fragments.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 1 Figure 2 
Figure 3
Abstract
A workpiece handling sheet 1 comprises: a substrate 13; an interface abrasion layer 12 laminated on one side of the substrate 13, and capable of interface abrasion through irradiation with laser light; and an adhesive layer 11 laminated on the surface side of the interface abrasion layer 12 opposite to the substrate 13, and composed of a curable film-like adhesive. According to the workpiece handling sheet 1, a small workpiece with a film-like adhesive can be obtained satisfactorily.
Need to check novelty before this filing date? Find Prior Art