connector

Abstract

To provide a connector that can improve mountability to a circuit board.SOLUTION: Connectors 10, 10A have outer conductors 12, 13, an inner conductor 11 located inside the outer conductors 12, 13, and a dielectric body 14 interposed between the inner conductor 11 and the outer conductors 12, 13. The outer conductors 12, 13 have a bottom surface 46 opposite the board surface of a circuit board 100, a drawer 42 opening in the bottom surface 46 to draw out the inner conductor 11 toward the circuit board 100, mounting parts 47, 48 protruding from the bottom surface 46, and board installation parts 51, 52 protruding at least one on each side across a mounting area 49 where the mounting parts 47, 48 and the drawer 42 are formed on the bottom surface 46, the leading edge of which is positioned ahead of the leading edge of the mounting parts 47, 48.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a connector.

Background Art

[0002] The connector disclosed in Patent Document 1 includes a plug body (hereinafter referred to as an outer conductor) and an internal conductor portion (hereinafter referred to as an inner conductor) disposed inside the plug body. The outer conductor has a bottom surface facing the plate surface of the circuit board. On the bottom surface of the outer conductor, a mounting portion electrically connected to the ground conductive path of the circuit board is provided. The inner conductor penetrates the bottom surface of the plug body, and the lower end portion is electrically connected to the signal conductive path of the circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The mounting portion of the outer conductor is soldered and connected to the copper foil (conductive layer) of the circuit board. For example, during reflow, if the tip surface of the mounting portion is displaced with respect to the circuit board, there is a concern that the mounting portion may contact the resist (insulating layer, resin layer) of the circuit board, and an appropriate solder connection state cannot be obtained.

[0005] Therefore, an object of the present disclosure is to provide a connector capable of improving the mountability to a circuit board.

Means for Solving the Problems

[0006] The connector of this disclosure comprises a conductive outer conductor, a conductive inner conductor disposed inside the outer conductor, and an insulating dielectric interposed between the inner conductor and the outer conductor, wherein the outer conductor has a bottom surface facing the board surface of a circuit board, an outlet opening in the bottom surface for drawing the inner conductor toward the circuit board, a mounting portion protruding from the bottom surface, and at least one board mounting portion protruding from each side of the mounting area on the bottom surface where the mounting portion and the outlet are formed, the tip of which is located further forward than the tip of the mounting portion. [Effects of the Invention]

[0007] According to this disclosure, it is possible to provide a connector that can improve the mountability on a circuit board. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a side cross-sectional view of the connector in Embodiment 1 of this disclosure. [Figure 2] Figure 2 is a perspective view of the second outer conductor shown in Figure 1. [Figure 3] Figure 3 is a perspective view of the first outer conductor shown in Figure 1. [Figure 4] Figure 4 is a bottom view of the first outer conductor shown in Figure 1. [Figure 5] Figure 5 is a bottom view of the connector shown in Figure 1. [Figure 6] Figure 6 is a magnified side cross-sectional view showing the portion of the circuit board where the connector shown in Figure 1 is mounted. [Figure 7] Figure 7 is a bottom view of the connector in Embodiment 2 of this disclosure. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and described. The connector disclosed herein is (1) The outer conductor comprises a conductive outer conductor, a conductive inner conductor disposed inside the outer conductor, and an insulating dielectric interposed between the inner conductor and the outer conductor, wherein the outer conductor has a bottom surface facing the board surface of the circuit board, an outlet opening in the bottom surface for drawing the inner conductor toward the circuit board, a mounting portion protruding from the bottom surface, and at least one board mounting portion protruding from each side of the mounting area on the bottom surface where the mounting portion and the outlet are formed, with its tip surface located further forward than the tip surface of the mounting portion.

[0010] With the above configuration, the leading edge of the substrate mounting portion is supported by the board surface of the circuit board, and a gap can be formed between the leading edge of the mounting portion and the board surface of the circuit board. Therefore, even if the mounting portion is misaligned relative to the circuit board during reflow soldering, the solder can follow the mounting portion, and a solder fillet can be formed between the board surface of the circuit board and the mounting portion. In particular, since at least one substrate mounting portion is provided on each side of the mounting area on the bottom surface of the outer conductor, the gap formed between the leading edge of the mounting portion and the board surface of the circuit board can be maintained at an appropriate size.

[0011] (2) In the connector described in (1) above, the outer conductor has a base and a cylindrical portion that protrudes forward from the base, the bottom surface is disposed between the base and the plate surface, and preferably at least one substrate mounting portion is provided on each of the front and rear sides of the mounting area.

[0012] The outer conductor has its center of gravity positioned forward by a cylindrical portion that protrudes forward from its base. This raises concerns that the mounting portion may tilt relative to the circuit board surface. However, with the above configuration, the board mounting portion located in front of the mounting area is supported by the circuit board surface, thus preventing the mounting portion from tilting relative to the circuit board.

[0013] (3) In the connector according to (2) above, further comprising an insulating housing that holds the outer conductor and is disposed on the front side of the outer conductor, the cylindrical portion protrudes inside the housing, and the substrate installation portion located on the front side of the mounting area may be disposed within the range in the front-back direction of the housing.

[0014] According to the above configuration, since the substrate installation portion located on the front side of the mounting area is supported on the board surface of the circuit board within the range in the front-back direction of the housing, it is possible to effectively suppress the inclination of the outer conductor to the front side.

[0015] (4) In the connector according to any one of (1) to (3) above, it is preferable that the substrate installation portions protrude in pairs at intervals in the left-right direction on both the front and rear sides sandwiching the mounting area.

[0016] According to the above configuration, the outer conductor is stably supported on the circuit board by each substrate installation portion, and the gap formed between the front end surface of the mounting portion and the board surface of the circuit board can be adjusted to be constant. Thereby, a better solder fillet can be formed between the board surface of the circuit board and the mounting portion.

[0017] [Details of Embodiments of the Present Disclosure] Specific examples of the present disclosure will be described below with reference to the drawings. Note that the present invention is not limited to these examples, and is indicated by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0018] <Embodiment 1> As shown in FIG. 1, the connector 10 according to Embodiment 1 exemplifies a shield connector mounted on a circuit board 100. The connector 10 includes a conductive inner conductor 11, conductive outer conductors 12 and 13 surrounding the outer periphery of the inner conductor 11, an insulating dielectric 14 interposed between the inner conductor 11 and the outer conductors 12 and 13, and an insulating housing 15 holding the outer conductors 12 and 13. The housing 15 is adapted to be fitted to a mating connector (not shown). In the following description, with respect to the front-back direction, the side where the housing 15 is fitted to the mating connector is defined as the front side. The arrow X in FIG. 1 indicates the front side. The left-right direction is based on the thickness direction of the paper surface of FIG. 1. The left-right direction is synonymous with the width direction. The reference symbol Y in FIG. 1 indicates the right side. The up-down direction is based on the up-down direction of FIG. 1. The up-down direction is synonymous with the height direction. The arrow Z in FIG. 1 indicates the upper side. These direction references are for convenience. For example, the lower side does not necessarily coincide with the lower side in the gravitational direction when the connector 10 is mounted on a vehicle or the like (not shown).

[0019] (Housing 15) The housing 15 is made of synthetic resin and has an end wall portion 16 and a hood portion 17 protruding forward from the end wall portion 16 as shown in FIG. 1. A mating connector (not shown) is fitted inside the hood portion 17. The hood portion 17 has a locking portion 18 for locking the mating connector in a fitted state. The locking portion 18 is claw-shaped and protrudes inward from the upper wall of the hood portion 17. The end wall portion 16 has an insertion hole 19 penetrating in the front-back direction. A cylindrical portion 32 described later is inserted into the insertion hole 19.

[0020] The housing 15 has an assembly recess 21 inside the wall thickness of the end wall portion 16. As shown in FIG. 5, the assembly recess 21 opens to the rear surface and the lower surface of the end wall portion 16. On the lower end side of the end wall portion 16, there are a pair of locking portions 22 that partially block the left and right ends of the rear surface of the assembly recess 21. A connecting portion 39 of the outer conductors 12 and 13 described later is inserted into the assembly recess 21 from below. Each locking portion 22 contacts the left and right ends of the connecting portion 39 in a pressing state from the rear and holds the connecting portion 39 in the assembly recess 21.

[0021] As shown in Figure 1, a conductive connecting member 23 is attached to the housing 15. The portion of the connecting member 23 that protrudes upward when attached to the housing 15 contacts the wall surface of the conductive housing 90 located on the outside. The portion of the connecting member 23 that is located inside the housing 15 when attached to the housing 15 contacts the cylindrical portion 32.

[0022] (Internal conductor 11, dielectric 14) The inner conductor 11 is positioned inside the outer conductors 12 and 13. The inner conductor 11 is made of metal and is tab-shaped or pin-shaped, and as shown in Figure 1, it has a mating connector portion 24 that extends long in the front-rear direction and a board connector portion 25 that extends downward from the rear end of the mating connector portion 24. When the housing 15 is mated with the mating connector, the front end of the mating connector portion 24 is electrically connected to a mating inner conductor (not shown). When mounted on the circuit board 100, the lower end of the board connector portion 25 is inserted into the through-hole 102 of the circuit board 100 and electrically connected to the signal conductive path of the circuit board 100.

[0023] The dielectric 14 is made of synthetic resin and, as shown in Figure 1, has a terminal housing portion 26 that extends long in the front-rear direction and a terminal lead-out portion 27 that extends downward from the rear end of the terminal housing portion 26. The dielectric 14 has a housing chamber 28 that extends in the front-rear direction from the terminal housing portion 26 and a lead-out groove 29 that extends in the vertical direction from the terminal lead-out portion 27. The housing chamber 28 penetrates the dielectric 14 in the front-rear direction. The upper end of the lead-out groove 29 communicates with the rear end of the housing chamber 28. The lower end of the lead-out groove 29 opens to the lower surface of the terminal lead-out portion 27. The lead-out groove 29 is open to the rear of the terminal lead-out portion 27. The mating connection portion 24 of the inner conductor 11 is inserted into the housing chamber 28 of the terminal housing portion 26 from the rear. The mating connector 24 is housed in the housing chamber 28, and the substrate connection portion 25 of the inner conductor 11 contacts the back surface of the outlet groove 29, thereby restricting further insertion of the inner conductor 11. At this time, the front end of the mating connector 24 is positioned to protrude forward from the terminal housing portion 26. The lower end of the substrate connection portion 25 is positioned to protrude downward from the terminal outlet portion 27. The space behind the substrate connection portion 25 is closed off by a back wall 43, which will be described later.

[0024] (Outer conductors 12, 13) The outer conductors 12 and 13 electrically shield the inner conductor 11 and are constructed, for example, as conductive rigid bodies made of die-cast material. In this embodiment 1, the outer conductor is composed of a first outer conductor 12 and a second outer conductor 13, which are separate from each other. As shown in Figure 1, the first outer conductor 12 is positioned below the second outer conductor 13.

[0025] As shown in Figure 2, the second outer conductor 13 has a base portion 31 and a cylindrical portion 32 that protrudes forward from the base portion 31. The base portion 31 is rectangular in shape and has a mounting recess 33 inside. The mounting recess 33 opens to the rear and bottom surfaces of the base portion 31. The first outer conductor 12 is inserted into the mounting recess 33 from below and mounted. The base portion 31 has a pair of side wall portions 34 that close the left and right ends of the mounting recess 33. As shown in Figure 5, the lower end of each side wall portion 34 has a support end 35 at the front-rear end that is wider than the middle part in the front-rear direction. Each support end 35 constitutes one of the four corners on the bottom surface of the base portion 31. The base portion 31 has four legs 36 that protrude from the flat bottom surface of each support end 35. Each leg portion 36 is cylindrical and, as shown in Figure 1, is inserted into each fixing hole 101 formed in the circuit board 100 and fixed to the circuit board 100 by soldering.

[0026] The cylindrical portion 32 is cylindrical in shape and protrudes from the front surface of the base portion 31. The front-to-back dimension (protrusion dimension) of the cylindrical portion 32 is greater than the front-to-back length of the base portion 31. As shown in Figure 1, the inside of the cylindrical portion 32 is an insertion hole 37 into which the dielectric 14 can be inserted. The insertion hole 37 is formed from the cylindrical portion 32 to the base portion 31 and is open to the rear of the second outer conductor 13 via a mounting recess 33. In short, the insertion hole 37 penetrates the inside of the second outer conductor 13 in the front-to-back direction.

[0027] The first outer conductor 12 is composed of a main body portion 38 and a connecting portion 39 that is connected to the front of the main body portion 38. As shown in Figure 4, the main body portion 38 has an external shape that corresponds to the opening shape of the mounting recess 33 of the first outer conductor 12 when viewed from below. The connecting portion 39 has an external shape that corresponds to the opening shape of the assembly recess 21 of the housing 15 when viewed from below.

[0028] As shown in Figure 3, the first outer conductor 12 has a plate-shaped bottom wall 41 that forms the bottom of the main body 38 and the connecting portion 39. The main body 38 has a rectangular outlet 42 in bottom view that penetrates the rear end portion of the bottom wall 41 in the thickness direction (vertical direction). As shown in Figures 5 and 6, the lower end of the terminal lead portion 27 of the dielectric 14 is fitted into the outlet 42 of the bottom wall 41. The lower end of the substrate connection portion 25 of the inner conductor 11 is pulled out from the outlet 42 of the bottom wall 41 and inserted into the through-hole 102 of the circuit board 100.

[0029] The main body 38 has a back wall 43 that rises upward on the rear end side of the bottom wall 41. As shown in Figure 1, when the first outer conductor 12 is mounted in the mounting recess 33 of the second outer conductor 13, the back wall 43 closes the rear opening of the mounting recess 33 of the second outer conductor 13.

[0030] As shown in Figure 3, multiple retaining ribs 44 extending in the vertical direction are formed on the left and right sides of the back wall 43 and the bottom wall 41, respectively. As shown in Figure 5, the first outer conductor 12 is held by the second outer conductor 13 by each retaining rib 44 making contact with the inner surface of the mounting recess 33 in a pressing state.

[0031] As shown in Figure 3, the connecting portion 39 has a pair of upwardly rising protruding walls 45 at the left and right ends of the front end of the bottom wall 41. As shown in Figure 5, each protruding wall 45 is fitted into the assembly recess 21 of the housing 15.

[0032] The second outer conductor 13 is assembled to the housing 15 from the rear. Then, the first outer conductor 12 is assembled so as to straddle the second outer conductor 13 and the housing 15 from below. The main body portion 38 is press-fitted into the mounting recess 33, and the connecting portion 39 is press-fitted into the assembly recess 21, thereby holding the first outer conductor 12, the second outer conductor 13, and the housing 15 in the assembled state.

[0033] As shown in Figures 3-5, the lower surface of the bottom wall 41 is a flat bottom surface 46 in the front-to-back and left-to-right directions. Multiple mounting parts 47, 48 are provided protruding from the bottom surface 46 of the bottom wall 41 at intervals around the outlet 42. Each mounting part 47, 48 is electrically connected by soldering to the ground conductive path (copper foil) on the board surface of the circuit board 100. The internal area of ​​the bottom surface 46 of the main body 38, excluding the outer edge, is a mounting area 49 where the outlet 42 from which the lower end of the board connection part 25 of the inner conductor 11 is drawn out, and each mounting part 47, 48 is located, and which is soldered to the circuit board 100. As shown in Figure 1, for example, the tip of the cylindrical part 32 is located in front of the mounting area 49 in the front-to-back direction. Also, when the connector 10 is positioned relative to the circuit board 100, the bottom surface 46 is positioned between the base part 31 and the board surface of the circuit board 100.

[0034] As shown in Figures 3-5, for example, a pair of first mounting sections 47 are arranged on both the front and rear sides of the outlet 42. Also, for example, a pair of second mounting sections 48 are arranged on both the left and right sides of the outlet 42. Each first mounting section 47 has a rib shape extending in the left-right direction along the front and rear edges of the outlet 42, and its protruding end surface (bottom surface) is formed flat in the left-right direction. Each second mounting section 48 has a rib shape extending in the front-rear direction along the left and right edges of the outlet 42, and its protruding end surface (bottom surface) is formed flat in the front-rear direction. The front-rear dimension (front-to-back length) of each second mounting section 48 is smaller than the left-to-right dimension (left-to-right length) of each first mounting section 47. The end surfaces of each first mounting section 47 and each second mounting section 48 are positioned at the same height. Each support end 35 (including each leg portion 36) of the second outer conductor 13 is positioned on both the left and right sides of each first mounting portion 47, and on both the front and rear sides of each second mounting portion 48.

[0035] Multiple substrate mounting sections 51 and 52 are provided protruding from the bottom surface 46 of the bottom wall 41, on both the front and rear sides of the mounting area 49. Each substrate mounting section 51 and 52 is placed on the resist on the surface of the circuit board 100. Each substrate mounting section 51 and 52 is prismatic in shape, with a flat front end (bottom surface) in the direction of protrusion. The protrusion dimension of each substrate mounting section 51 and 52 from the bottom surface 46 is greater than the protrusion dimension of each mounting section 47 and 48 from the bottom surface 46. The front end of each substrate mounting section 51 and 52 is positioned lower than the front end of each mounting section 47 and 48. Therefore, in the direction of protrusion of each substrate mounting section 51 and 52, the front end of each substrate mounting section 51 and 52 is located further forward than the front end of each mounting section 47 and 48. The area of ​​the front end of each substrate mounting section 51 and 52 is smaller than the area of ​​the front end of each mounting section 47 and 48.

[0036] Each board mounting section consists of a pair of first board mounting sections 51, which are spaced apart in the left-right direction at a position forward of the front first mounting section 47, and a pair of second board mounting sections 52, which are spaced apart in the left-right direction at a position behind the rear first mounting section 47. Each first board mounting section 51 is provided on the front end side of the bottom surface 46 of the connecting section 39. Each first board mounting section 51 is positioned within the front-rear range of the housing 15 by press-fitting the connecting section 39 into the assembly recess 21. In this embodiment 1, the connector 10 has a cylindrical section 32 that protrudes forward of the base section 31, and the housing 15 is connected in front of the outer conductors 12 and 13, so the center of gravity is located on the housing 15 side. Each first board mounting section 51 is positioned near the center of gravity of the connector 10 and is stably supported by the circuit board 100.

[0037] Each second substrate mounting section 52 is provided on the rear end side of the bottom surface 46 of the main body section 38. The rear surface of each second substrate mounting section 52 is continuous with the rear surface of the bottom wall 41 without any steps. The distance between the front first mounting section 47 and each first substrate mounting section 51 in the front-rear direction is greater than the distance between the rear first mounting section 47 and each second substrate mounting section 52 in the front-rear direction.

[0038] (Function of connector 10) The connector 10 is mounted to the circuit board 100 by reflow soldering. Prior to reflow soldering, the connector 10 is placed on the circuit board 100. At this time, each leg portion 36 is inserted into each fixing hole 101, and each board mounting portion 51, 52 is placed on the surface of the circuit board 100. As each board mounting portion 51, 52 is supported by the circuit board 100, a constant gap is maintained between the bottom surface 46 of the bottom wall 41 and the circuit board 100. At this time, as the connector 10 is positioned relative to the circuit board 100 with the respective tip surfaces of the board mounting portions 51, 52 in contact with the surface of the circuit board 100, the tip surfaces of each mounting portion 47, 48 are positioned facing the surface of the circuit board 100 with a gap between them.

[0039] Next, the connector 10 is heated in a reflow oven (not shown), and the solder on the board surface of the circuit board 100 is melted. As a result, as shown in Figure 6, solder fillets 70 are formed between the leading edges of each mounting portion 47, 48 and the board surface of the circuit board 100. Solder fillets 80 are also formed between the lower end of the board connection portion 25 of the inner conductor 11 and the board surface of the circuit board 100. Subsequently, as the solder cools and solidifies, the mounting portions 47, 48 of the outer conductors 12, 13 are soldered to the ground conductive path of the circuit board 100, and the board connection portion 25 of the inner conductor 11 is soldered to the signal conductive path of the circuit board 100. The lower end of the board connection portion 25 of the inner conductor 11 is surrounded on all four sides (front-to-back and left-to-right directions) by the mounting portions 47, 48 in the portion exposed between the bottom surface 46 of the bottom wall 41 and the board surface of the circuit board 100. This enhances the shielding performance for the inner conductor 11. Furthermore, each leg portion 36 is soldered to and fixed to each fixing hole 101 of the circuit board 100.

[0040] Solder is not applied to each substrate mounting section 51, 52, and during the reflow process, each substrate mounting section 51, 52 functions to maintain a constant distance between the bottom surface 46 of the bottom wall 41 and the board surface of the circuit board 100. Therefore, even if the connector 10 is misaligned relative to the circuit board 100, contact between each mounting section 47, 48 and the resist can be avoided.

[0041] As each substrate mounting section 51, 52 performs the above-described spacing maintenance function, a gap is formed between the leading edge of each mounting section 47, 48 and the board surface of the circuit board 100. Therefore, the molten solder can follow the direction of the misalignment of each mounting section 47, 48, and properly form the solder fillet 70.

[0042] As described above, according to this embodiment 1, with the respective tip surfaces of the substrate mounting portions 51 and 52 supported by the board surface of the circuit board 100, a gap can be formed between the respective tip surfaces of the mounting portions 47 and 48 and the board surface of the circuit board 100. Therefore, even if the mounting portions 47 and 48 are misaligned relative to the circuit board 100 during reflow soldering, the solder can follow the position of the mounting portions 47 and 48, and a solder fillet 70 can be properly formed between the board surface of the circuit board 100 and the mounting portions 47 and 48. In particular, since each substrate mounting portion 51 and 52 is provided in pairs on both sides of the mounting area 49 on the bottom surface 46 of the first outer conductor 12, the gap formed between the tip surfaces of the mounting portions 47 and 48 and the board surface of the circuit board 100 can be adjusted to a suitable and constant size. As a result, the connector 10 can be made more mountable.

[0043] Furthermore, in this embodiment 1, since each first substrate mounting portion 51 located in front of the mounting area 49 is supported on the surface of the circuit board 100 near the center of gravity of the connector 10, it is possible to suppress tilting of each mounting portion 47, 48 relative to the circuit board 100 during reflow.

[0044] <Embodiment 2> The connector 10A according to Embodiment 2 differs from Embodiment 1 in that it comprises two internal conductors 11 and two dielectrics 14, has two outlets 42 openings in the bottom surface 46 of the bottom wall 41, and has multiple mounting sections 47A, 48A corresponding to each outlet 42. Otherwise, it is the same as Embodiment 1, and in Embodiment 2, the same or similar structures as in Embodiment 1 are denoted by the same reference numerals, and redundant explanations are omitted.

[0045] As shown in Figure 7, the two outlets 42 are provided side by side in the front-to-back direction on the bottom wall 41 of the first outer conductor 12. Each outlet 42 opens in a rectangular shape when viewed from below on the bottom surface 46 of the bottom wall 41. The rear edge of the front outlet 42 and the front edge of the rear outlet 42 are arranged parallel to each other. The two dielectrics 14 each have the lower ends of their terminal lead-out portions 27 fitted into their corresponding outlets 42. The two inner conductors 11 each have the lower ends of their substrate connection portions 25 protruding downward from their corresponding outlets 42.

[0046] The multiple mounting sections include a main mounting section 47A located in the mounting area 49 excluding the front-to-rear ends, and a pair of sub-mounting sections 48A located at the front-to-rear ends of the mounting area 49. The main mounting section 47A is composed of a rib-shaped intermediate mounting section 47B extending left-to-right between each outlet 42, and a pair of rib-shaped lateral mounting sections 47C extending long across each outlet 42 along the left and right edges of each outlet 42. The left and right ends of the intermediate mounting section 47B are connected to the front-to-rear intermediate sections of each lateral mounting section 47C. The front-to-rear dimension (front-to-rear width) of the intermediate mounting section 47B is larger than the left-to-right dimension (left-to-right width) of the lateral mounting section 47C. The main mounting section 47A has an H-shape when viewed from below, formed by the intermediate mounting section 47B and each lateral mounting section 47C. The tip surface of the main mounting section 47A is formed flat along the H shape of the main mounting section 47A.

[0047] Each sub-mounting section 48A is composed of a rib-shaped portion extending laterally along the front edge of the front outlet 42 and a rib-shaped portion extending laterally along the rear edge of the rear outlet 42. The front end surface of each sub-mounting section 48A is formed flat at the same height as the front end surface of the main mounting section 47A. The front-to-back dimension of each sub-mounting section 48A is smaller than the front-to-back dimension of the intermediate mounting section 47B.

[0048] On the bottom surface 46 of the bottom wall 41, a pair of substrate mounting sections 51 and 52 are provided on both the front and rear sides of the mounting area 49, spaced apart in the left-right direction. The leading edges of each substrate mounting section 51 and 52 are positioned lower than the leading edges of each mounting section 47A and 48A. Each substrate mounting section 51 and 52 is placed on the surface of the circuit board 100. Each mounting section 47A and 48A forms a gap between itself and the surface of the circuit board 100 by the substrate mounting sections 51 and 52. The structure and arrangement of the substrate mounting sections 51 and 52 are the same as in Embodiment 1.

[0049] According to Embodiment 2, since the main mounting section 47A and each sub-mounting section 48A surround each outlet 42 on all four sides, the shielding performance for each inner conductor 11 drawn out from each outlet 42 can be improved. In particular, since the intermediate mounting section 47B of the main mounting section 47A is provided between the board connection sections 25 of each inner conductor 11, crosstalk between each inner conductor 11 can be prevented.

[0050] [Other embodiments of this disclosure] The embodiments 1 and 2 disclosed herein should be considered in all respects to be illustrative and not restrictive. In the case of embodiments 1 and 2 described above, Circuit board mounting section They were arranged in pairs on both sides of the implementation area. In contrast, according to other embodiments, Circuit board mounting section These may be placed one on each side of the implementation area, or three or more on each side of the implementation area. In the case of Embodiments 1 and 2, Circuit board mounting section These were positioned on both the front and back sides of the implementation area. In contrast, according to other embodiments, Circuit board mounting section These may be placed on both the left and right sides of the implementation area. Circuit board mounting section These may be placed on both the front and rear sides, and on both the left and right sides, flanking the implementation area. In embodiments 1 and 2, the mounting units were arranged in multiple locations around the outlet on the bottom surface of the bottom wall. In contrast, according to other embodiments, the mounting units may be arranged only once per outlet on the bottom surface of the bottom wall, surrounding the outlet all the way around. In embodiments 1 and 2, the mounting portion had a shape that extended linearly along the edge of the outlet on the bottom surface of the bottom wall. In contrast, for example, if the outlet has a circular opening, the mounting portion may have a shape that curves along the edge of the outlet. In embodiments 1 and 2, the outer conductor was separable and combinable into a first outer conductor and a second outer conductor. In contrast, according to other embodiments, the outer conductor may be an inseparable, integrated outer conductor. In the above embodiments 1 and 2, the outer conductor was made of die-cast material. In contrast, according to other embodiments, the outer conductor may be formed by machining a metal block member. [Explanation of symbols]

[0051] 10, 10A… Connector 11...Inner conductor 12…First outer conductor (outer conductor) 13…Second outer conductor (outer conductor) 14…Dielectric 15… Housing 16…End wall section 17…Food Department 18... Rock Club 19…Through hole 21…Assembly recess 22... Locking part 23…Connecting member 24...Partner connection part 25... Circuit board connection section 26... Terminal housing section 27...Terminal lead-out part 28... Confinement Room 29…Outlet groove 31...Base 32...Cylinder part 33… Mounting recess 34... Side wall section 35...Support end 36...legs 37…Insertion hole 38...Main body 39...Connection part 41...Bottom wall 42...Drawer opening 43...back wall 44…Retaining ribs 45... Projection wall 46...Bottom 47…First Implementation Department (Implementation Department) 47A...Main implementation section (implementation section) 47B...Intermediate implementation section (implementation section) 47C... Side mounting section (mounting section) 48…Second Implementation Department (Implementation Department) 48A... Sub-implementation section (implementation section) 49…Implementation Area 51…First circuit board installation section (circuit board installation section) 52...Second circuit board installation section (circuit board installation section) 70…(Solder fillet on the mounting side) 80…(Solder fillet on the inner conductor side) 90... Cabinet 100... Circuit board 101…Fixing hole 102... Through hole

Claims

[Claim 1] A conductive outer conductor, A conductive inner conductor is disposed inside the outer conductor, The system comprises an insulating dielectric interposed between the inner conductor and the outer conductor, The outer conductor faces the board surface of the circuit board and has a flat bottom surface in the front-to-back and left-to-right directions, The mounting portion protruding from the bottom surface, A connector having at least two substrate mounting portions protruding from both the front and rear sides of the mounting portion on the bottom surface, spaced apart in the left-right direction, with their tip surfaces positioned further forward than the tip surface of the mounting portion.

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