Temperature control member and method for manufacturing the temperature control member

Abstract

To provide a temperature control member and a method for manufacturing a temperature control member which can increase the stability of the temperature distribution of a surface to which a target object of temperature control is attached.SOLUTION: The temperature control member includes: a base body; an insulation substrate storing a heat generator inside and having an opening from which a part of the heat generator is exposed; an electric wire connected to the heat generator through the opening; and an attachment layer for attaching the base body and the insulation substrate to each other. The base body has a through-hole connected to the opening, the electric wire going through the through-hole. The attachment layer has a first part between the base body and the insulation substrate and a second part filling the through-hole.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a temperature adjusting member and a method for manufacturing the temperature adjusting member.

Background Art

[0002] In a temperature adjusting member for adjusting the temperature of a substrate such as a wafer, an insulator substrate and a base are bonded together using an adhesive. The insulator substrate incorporates a heating element for heating the substrate, and an opening connected to the heating element is formed in the insulator substrate. An electric wire connected to the heating element is provided within the opening. Further, a through-hole connected to the opening of the heating element is formed in the base, and the electric wire passes through the through-hole.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a conventional temperature adjusting member, there may be a difference in the temperature distribution during use of the surface (hereinafter sometimes referred to as the "mounting surface") to which the object to be temperature - adjusted is attached among a plurality of temperature adjusting members. Further, the temperature distribution during use of the mounting surface may deviate from a predetermined range.

[0005] An object of the present disclosure is to provide a temperature adjusting member and a method for manufacturing the temperature adjusting member capable of improving the stability of the temperature distribution of the surface to which the object to be temperature - adjusted is attached.

Means for Solving the Problems

[0006] According to one embodiment of the present disclosure, the present invention comprises a base body, an insulating substrate having a heating element built into it and an opening formed therein through which a part of the heating element is exposed, an electric wire connected to the heating element through the opening, and an adhesive layer bonding the base body and the insulating substrate, wherein the base body has a through hole formed therethrough that connects to the opening and through which the electric wire passes, and the adhesive layer has a first portion between the base body and the insulating substrate and a second portion that fills the through hole. The electric wire comprises a conductor and an insulating covering that covers the conductor, and the adhesive layer is also present within the opening, with the first portion of the adhesive layer and the portion present within the opening being integrally formed. A temperature control component is provided. [Effects of the Invention]

[0007] According to this disclosure, the stability of the temperature distribution on the surface to which the object to be temperature-controlled is attached can be improved. [Brief explanation of the drawing]

[0008] [Figure 1] This is a cross-sectional view illustrating a temperature control member according to an embodiment. [Figure 2] This is a flowchart illustrating a method for manufacturing a temperature control member according to an embodiment. [Figure 3] This is a cross-sectional view (part 1) illustrating a method for manufacturing a temperature control member according to an embodiment. [Figure 4] This is a cross-sectional view (part 2) illustrating a method for manufacturing a temperature control member according to an embodiment. [Figure 5] This is a cross-sectional view (part 3) illustrating a method for manufacturing a temperature control member according to the embodiment. [Figure 6] This is a cross-sectional view (part 4) illustrating a method for manufacturing a temperature control member according to an embodiment. [Figure 7] This is a cross-sectional view (5) illustrating a method for manufacturing a temperature control member according to an embodiment. [Figure 8] This is a cross-sectional view (6) illustrating a method for manufacturing a temperature control member according to an embodiment. [Figure 9] This figure shows the results of the simulation. [Modes for carrying out the invention]

[0009] The inventors of this invention have diligently investigated the cause of differences in the temperature distribution of the mounting surface during use in conventional temperature control members. As a result, it has become clear that when the insulating substrate and the base body are bonded, adhesive flows into the through-holes of the base body, but the amount of adhesive that flows varies. For example, the amount of adhesive that flows into the through-holes may differ among multiple temperature control members. Also, if a single temperature control member has multiple through-holes, the amount of adhesive that flows into these multiple through-holes may differ. For example, even if the thickness of the base body is approximately 40 mm and the temperature control members are manufactured under the same conditions, the adhesive may flow to a position of about 5 mm from the side (bottom surface) opposite the insulating substrate of the base body, or it may flow to a position of about 30 mm. These differences in the amount of adhesive that flows in lead to differences in thermal conductivity, resulting in differences in the temperature distribution of the mounting surface during use.

[0010] Even if adhesive that has flowed into a through-hole is removed, it is difficult to completely remove the adhesive from the through-hole while leaving some adhesive between the substrate and the insulating substrate, and some adhesive inevitably remains in the through-hole. Furthermore, it is difficult to stabilize the amount of adhesive that inevitably remains, resulting in differences in thermal conductivity.

[0011] This disclosure is based on such findings and improves the stability of the temperature distribution on the mounting surface, even with differences in the amount of adhesive flowing in.

[0012] Embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. In this specification and the drawings, components having substantially the same functional configuration will be denoted by the same reference numerals to avoid redundant descriptions.

[0013] This embodiment relates to a temperature control member. Figure 1 is a cross-sectional view illustrating a temperature control member according to this embodiment.

[0014] As shown in FIG. 1, the temperature adjustment member 1 according to the embodiment includes, as main components, a base body 10, a second adhesion auxiliary layer 52, an adhesion layer 20, a first adhesion auxiliary layer 51, an insulator substrate 30, and an electric wire 40.

[0015] In this embodiment, for convenience, the side where the insulator substrate 30 is located as viewed from the base body 10 is defined as the upper side or one side, and the side where the base body 10 is located as viewed from the insulator substrate 30 is defined as the lower side or the other side. Also, the surface on the insulator substrate 30 side of each part is defined as the upper surface or one surface, and the surface on the base body 10 side is defined as the lower surface or the other surface.

[0016] The insulator substrate 30 has, for example, a disc shape. An object to be temperature-adjusted is attached to the upper surface 30A of the insulator substrate 30. The insulator substrate 30 includes an insulator such as a ceramic sintered body or glass. Examples of the material of the ceramic sintered body include aluminum oxide (Al2O3) and aluminum nitride (AlN). For example, the thickness of the insulator substrate 30 is about 1 mm to 10 mm, and the relative permittivity of the insulator substrate 30 is about 9 to 10 at a frequency of 1 kHz. The insulator substrate 30 incorporates a conductive pattern 31 that functions as a heating element. The conductive pattern 31 includes a sintered body of metal particles or a metal foil. When an electric current flows through the conductive pattern 31, the conductive pattern 31 generates heat. By the conductive pattern 31 generating heat, an object such as a substrate attached to the upper surface 30A of the insulator substrate 30 can be heated. The position of the conductive pattern 31 within the insulator substrate 30 is not particularly limited. The insulator substrate 30 can incorporate one or more conductive patterns 31. The insulator substrate 30 may include an electrostatic adsorption pattern that functions as an electrostatic electrode for electrostatically adsorbing an object, or may include a pattern for attracting plasma by applying a high-frequency voltage. The insulator substrate 30 may include various other patterns. When the insulator substrate 30 includes an electrostatic adsorption pattern, the temperature adjustment member 1 can be used as an electrostatic chuck.

[0017] The insulating substrate 30 has an opening 32 through which a part of the conductive pattern 31 is exposed. The electric wire 40 has a conductor 41 and an insulating coating 42. The conductor 41 is made of a material with a low electrical resistivity such as metal. The conductor 41 has, for example, a single wire or a stranded wire. The outer peripheral surface of the conductor 41 is covered by the coating 42. One end of the conductor 41 is connected to the conductive pattern 31 by a conductive bonding material 43. The conductive bonding material 43 is, for example, a metal solder, a solder, or a conductive adhesive. An electrode member may be included between the conductor 41 and the conductive pattern 31 in addition to the conductive bonding material 43.

[0018] The base body 10 has, for example, a disc shape. The base body 10 includes a metal such as aluminum or a ceramic sintered body. The thickness of the base body 10 is, for example, about 20 mm to 50 mm. A flow path 11 through which a cooling medium flows is formed in the base body 10. The position of the flow path 11 for the cooling medium in the base body 10 is not particularly limited. One or more flow paths 11 may be formed in the base body 10. By circulating the cooling medium through the flow path 11 to cool the base body 10, an object such as a substrate attached to the upper surface 30A of the insulating substrate 30 can be cooled. A through hole 12 that connects to the opening 32 and through which the electric wire 40 passes is formed in the base body 10.

[0019] The adhesive layer 20 adheres the base body 10 and the insulating substrate 30. The adhesive layer 20 includes, for example, a polymer compound. The adhesive layer 20 may be composed of a polymer compound. Examples of the material of the adhesive layer 20 include silicone resin, epoxy resin, acrylic resin, and polyimide resin. These composite materials may be used for the adhesive layer 20. Further, the adhesive layer 20 may contain a filler. Examples of the material of the filler include silica, alumina, and aluminum nitride.

[0020] The adhesive layer 20 has a first portion 21 between the base body 10 and the insulating substrate 30, and a second portion 22 that fills the through hole 12. For example, the lower surface 10A of the base body 10 and the lower surface 22A of the second portion 22 are flush. In this disclosure, the state in which the second portion 22 fills the through hole 12 does not mean only the state in which the second portion 22 fills the entire through hole 12 without any excess or deficiency. The state in which the second portion 22 fills the through hole 12 is also included in the state in which the second portion 22 fills the through hole 12, where the volume of the second portion 22 in the through hole 12 is 90% or more but less than 100% of the volume of the through hole 12 excluding the volume of the electric wire 40 in the through hole 12 (hereinafter sometimes referred to as the "effective volume of the through hole 12"). Furthermore, a state in which a portion of the second portion 22 protrudes from the through hole 12, to the extent that the volume of the second portion 22 is more than 100% but not more than 110% of the effective volume of the through hole 12, is also included in the state in which the second portion 22 fills the through hole 12. Preferably, the volume of the second portion 22 is 95% or more and 105% or less of the effective volume of the through hole 12.

[0021] The first adhesive auxiliary layer 51 is located between the first portion 21 of the adhesive layer 20 and the insulating substrate 30. The first adhesive auxiliary layer 51 includes, for example, a surface modifier or a coupling agent. The surface modifier makes the surface of the insulating substrate 30 more receptive to interaction with the adhesive constituting the adhesive layer 20. The first adhesive auxiliary layer 51 may also contain a resin. The first adhesive auxiliary layer 51 strengthens the adhesive strength between the insulating substrate 30 and the base 10.

[0022] The second adhesive auxiliary layer 52 is located between the first portion 21 of the adhesive layer 20 and the substrate 10. The second adhesive auxiliary layer 52 includes, for example, a surface modifier or a coupling agent. The surface modifier makes the surface of the substrate 10 more receptive to interaction with the adhesive constituting the adhesive layer 20. The second adhesive auxiliary layer 52 may also contain a resin. The second adhesive auxiliary layer 52 strengthens the adhesive strength between the insulating substrate 30 and the substrate 10.

[0023] The temperature control component 1 has the following configuration.

[0024] Next, a method for manufacturing the temperature control member 1 according to the embodiment will be described. Figure 2 is a flowchart illustrating the method for manufacturing the temperature control member 1 according to the embodiment. Figures 3 to 8 are cross-sectional views illustrating the method for manufacturing the temperature control member 1 according to the embodiment.

[0025] First, as shown in Figure 3, an insulating substrate 30 is prepared which incorporates a conductive pattern 31 that functions as a heating element and has an opening 32 formed therein through which a part of the conductive pattern 31 is exposed (Step S1). Next, a first adhesive auxiliary layer 51 is formed on the surface of the insulating substrate 30 where the opening 32 is formed (Step S2). Then, an electric wire 40 is connected to the conductive pattern 31 through the opening 32 (Step S3). The electric wire 40 is connected to the conductive pattern 31 using, for example, a conductive bonding material 43. Alternatively, the first adhesive auxiliary layer 51 may be formed after the electric wire 40 is connected to the conductive pattern 31.

[0026] In addition, as shown in Figure 4, a base body 10 is prepared, which has a through hole 12 connected to the opening 32 through which the electric wire 40 passes (step S4). Next, a second adhesive auxiliary layer 52 is formed on the surface of the base body 10 that will be bonded to the insulating substrate 30 (step S5). Next, a liquid first adhesive 61 is applied on the second adhesive auxiliary layer 52 (step S6). The amount of the first adhesive 61 is greater than the volume of the space between the base body 10 and the insulating substrate 30 when the distance between the base body 10 and the insulating substrate 30 is a predetermined distance.

[0027] Subsequently, as shown in Figure 5, the first adhesive 61 is placed between the base body 10 and the insulating substrate 30 so that the electric wire 40 passes through the through hole 12 (step S7).

[0028] Next, as shown in Figure 6, the base body 10 is pressed against the insulating substrate 30 to set the distance between the base body 10 and the insulating substrate 30 to a predetermined distance. In other words, the distance between the base body 10 and the insulating substrate 30 is adjusted (step S8). At this time, a portion of the first adhesive 61 remains between the base body 10 and the insulating substrate 30, while the other portion flows out into the through hole 12. When pressing the base body 10 against the insulating substrate 30, for example, the laminate including the base body 10 and the insulating substrate 30 is placed on a support member 2 such as a surface plate so that the surface that will become the upper surface of the insulating substrate 30 faces vertically downward, and pressure is applied to the base body 10 from vertically above toward the insulating substrate 30.

[0029] Next, as shown in Figure 7, the through hole 12 is filled with the second adhesive 62 (step S9). For example, the second adhesive 62 is the same type of adhesive as the first adhesive 61. When filling with the second adhesive 62, for example, the second adhesive 62 is placed in a syringe and injected into the through hole 12 through a needle. Note that if the through hole 12 is filled with the first adhesive 61, the filling of the second adhesive 62 may be omitted.

[0030] Next, as shown in Figure 8, the first adhesive 61 and the second adhesive 62 are cured (step S10). The first adhesive 61 and the second adhesive 62 are cured using, for example, a heating furnace. As a result, an adhesive layer 20 comprising the first part 21 and the second part 22 is formed. If the second part 22 protrudes excessively from the through hole 12, the protruding portion is removed so that the lower surface 22A of the second part 22 is flush with the lower surface 10A of the base 10. However, it is not necessary for the lower surface 22A to be perfectly flush with the lower surface 10A; it is sufficient if the volume of the second part 22 is between 90% and 110% of the effective volume of the through hole 12.

[0031] In this way, the temperature control member 1 according to the embodiment can be manufactured.

[0032] In the temperature control member 1, the second portion 22 of the adhesive layer 20 fills the through hole 12 of the base body 10. As a result, the amount of adhesive layer 20 in the through hole 12 is stabilized, and the thermal conductivity in the through hole 12 is stabilized. Therefore, the stability of the temperature distribution on the upper surface 30A of the insulating substrate 30, which is the surface to which the object is attached, can be improved.

[0033] Furthermore, because the thermal conductivity within the through-hole 12 is stable, it is easier to simulate the temperature distribution after design changes when modifying the design of the conductive pattern 31 or the flow path 11.

[0034] Furthermore, the temperature control member 1 does not necessarily have to include one or both of the first adhesive auxiliary layer 51 and the second adhesive auxiliary layer 52.

[0035] The base body 10, the second adhesive auxiliary layer 52, the adhesive layer 20, the first adhesive auxiliary layer 51, and the insulating substrate 30 may have channels formed through which a gas, such as an inert gas, to be blown onto the object flows.

[0036] Here, we will explain the simulation performed by the present inventors. In this simulation, we calculated the change in the temperature distribution on the upper surface 30A of the insulating substrate 30 when the amount of adhesive layer 20 in the through hole 12 of the temperature control member 1 according to the embodiment was changed. Specifically, the thickness of the base body 10 was assumed to be approximately 40 mm, the thickness of the insulating substrate 30 was assumed to be approximately 7.0 mm, and the thickness of the first portion 21 of the adhesive layer 20 was assumed to be approximately 0.2 mm. The amount of adhesive layer 20 in the through hole 12 was changed under five conditions and expressed as the distance between the lower surface 22A of the second portion 22 and the lower surface 10A of the base body 10. In addition, the temperature of the refrigerant flowing through the flow path 11 was assumed to be 20°C.

[0037] Then, for each condition of the amount of adhesive layer 20 in the through hole 12, the temperature at the position closest to the through hole 12 on the upper surface 30A was calculated when the current flowing through the conductive pattern 31 was adjusted so that the average temperature of the upper surface 30A of the insulating substrate 30 was 60°C. The results are shown in Figure 9. Figure 9 is a diagram showing the simulation results. The horizontal axis of Figure 9 shows the distance between the lower surface 22A and the lower surface 10A. The vertical axis of Figure 9 shows how much lower the temperature is under other conditions (temperature difference) compared to the temperature under the condition where there is no adhesive layer 20 in the through hole 12.

[0038] As shown in Figure 9, the temperature at the position closest to the through-hole 12 on the upper surface 30A differs depending on the amount of adhesive layer 20 inside the through-hole 12. Furthermore, the smaller the amount of adhesive layer 20 inside the through-hole 12, the greater the change in temperature difference in response to the change in the amount of adhesive layer 20 inside the through-hole 12. For example, when the distance between the lower surface 22A and the lower surface 10A changes within the range of 10 mm to 30 mm, a temperature difference of as much as 0.04°C occurs, while when the distance changes within the range of 0 mm to 10 mm, the temperature difference is only 0.01°C.

[0039] This indicates that the filling of the through-hole 12 by the second part 22 suppresses temperature variations in the upper surface 30A at positions close to the through-hole 12, thereby improving the stability of the temperature distribution on the upper surface 30A. Furthermore, if the volume of the second part 22 is between 90% and 110% of the effective volume of the through-hole 12, a stable temperature distribution can be obtained even if the lower surface 22A and the lower surface 10A are not perfectly flush.

[0040] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims. [Explanation of symbols]

[0041] 1. Temperature control member 10 Base 10A bottom 12 through holes 20 Adhesive layer 21 Part 1 22 Part 2 22A Bottom 30 Insulator substrate 30A top 31 Conductive Patterns 32 openings 40 Electric wire 51 1st adhesion auxiliary layer 52 Second adhesion auxiliary layer 61 First adhesive 62 Second adhesive

Claims

1. Substrate and, An insulating substrate having a built-in heating element and an opening formed therein in which a part of the heating element is exposed, A wire connected to the heating element through the aforementioned opening, An adhesive layer for bonding the substrate and the insulating substrate, It has, The base has a through-hole formed therein, which is connected to the opening and through which the electric wire passes. The aforementioned adhesive layer is The first portion between the substrate and the insulating substrate, A second portion that fills the aforementioned through hole, It has, The aforementioned electric wire is A conductor and An insulating coating covering the conductor, It has, The adhesive layer is also present inside the opening, A temperature control member characterized in that the first portion of the adhesive layer and the portion located within the opening are integrally formed.

2. The temperature control member according to claim 1, characterized in that the insulating substrate includes a ceramic sintered body.

3. The temperature control member according to claim 1 or 2, characterized by having a first adhesive auxiliary layer located between the first portion and the insulating substrate.

4. The temperature control member according to claim 1 or 2, characterized by having a second adhesive auxiliary layer located between the first portion and the substrate.

5. The temperature control member according to claim 1 or 2, characterized in that the substrate has a flow path through which a refrigerant flows.

6. A step of preparing an insulating substrate having a built-in heating element and an opening formed therein in which a part of the heating element is exposed, The steps include connecting an electric wire to the heating element through the opening, A step of preparing a base body having a through hole formed therein, which is connected to the aforementioned opening, through which the electric wire passes; A step of bonding the substrate and the insulating substrate with a first adhesive, A step of filling the through hole with a second adhesive, A step of simultaneously curing the first adhesive and the second adhesive, It has, The aforementioned electric wire is A conductor and An insulating coating covering the conductor, It has, In the step of bonding the substrate and the insulating substrate with the first adhesive, the first adhesive is present at least between the substrate and the insulating substrate and within the opening. A method for manufacturing a temperature control member, characterized in that the portion of the first adhesive located between the substrate and the insulating substrate and the portion located within the opening are integrally formed.

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