Power supply unit for aerosol generator

Abstract

To provide a high-performance aerosol generation device.SOLUTION: A suction device 100 includes: a heater connector Cn to which a heater HTR for consuming power supplied from a power source BAT and heating a rod 500 is connected; a first positive side circuit including a switch S4 connected to the heater connector Cn on a positive electrode side and a resistor Rs; a second positive side circuit including a switch S3 connected to the heater connector Cn on the positive electrode side, and connected to the first positive side circuit in parallel; a switch S6 connected to a heater connector Cn on a negative electrode side; and an MCU 1 configured so as to execute predetermined control on the basis of a voltage applied to the heater connector Cn when the switch S4 and the switch S6 are turned ON. The switch S3, the switch S4, and the switch S6 are different from each other.SELECTED DRAWING: Figure 20

Description

[Technical Field]

[0001] This invention relates to a power supply unit for an aerosol generating device. [Background technology]

[0002] Patent Document 1 describes a control device for an aerosol aspirator, which includes an operational amplifier that heats an aerosol source and outputs a voltage corresponding to the voltage applied to a load whose temperature and electrical resistance are correlated; a control unit configured to perform processing based on the voltage corresponding to the output; and a first circuit and a second circuit electrically connected in parallel between a power supply and the load, the first circuit and the second circuit each including a first switch and a second switch. This control device is configured to acquire a voltage corresponding to the output of the operational amplifier while the second switch is in the ON state.

[0003] Patent Document 2 describes a non-combustion type suction device comprising a heating element having a predetermined resistance value, a power supply for supplying power to the heating element, a plurality of resistors connected in parallel with the heating element, a control unit, a first switch for controlling the on / off state of the heating element, a second switch connected between the power supply and the plurality of resistors, and a third switch connected between the wiring between the plurality of resistors and the control unit, wherein when measuring the resistance value of the heating element, the control unit is configured to perform switch control by turning on the second and third switches and turning off the first switch. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent No. 6613008 [Patent Document 2] International Publication No. 2020 / 217949 [Overview of the project] [Problems that the invention aims to solve]

[0005] There was room for consideration from the perspective of providing a high-performance aerosol generation device.

[0006] The objective of the present invention is to provide a high-performance aerosol generating device. [Means for solving the problem]

[0007] A power supply unit for an aerosol generating apparatus according to one aspect of the present invention includes a power supply, a heater connector including a + terminal and a - terminal to which a heater that consumes power supplied from the power supply to heat an aerosol source is connected, a first fixed resistor with one end connected to the + terminal of the heater connector, an operational amplifier including a positive power supply terminal connected to the + terminal side of the heater connector, a negative power supply terminal, a non-inverting input terminal connected between one end of the first fixed resistor and the + terminal of the heater connector, an inverting input terminal connected to the - terminal of the heater connector, and an output terminal, an input terminal connected to the output terminal of the operational amplifier, a power supply terminal, and a ground connected to ground. The device comprises a controller including terminals, and a clamp circuit connected to the output terminal of the operational amplifier, which prevents the voltage output from the output terminal of the operational amplifier and input to the input terminal of the controller from exceeding a predetermined value. In a discharge state in which current is supplied from the power supply to the first fixed resistor and the heater in that order, the voltage applied between the positive power supply terminal and the negative power supply terminal of the operational amplifier is higher than the voltage applied between the power supply terminal and the ground terminal of the controller, and the controller is configured to control the supply of power from the power supply to the heater based on the input to the input terminal. [Effects of the Invention]

[0008] According to the present invention, a high-performance aerosol generating device can be provided. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of a non-combustion type suction device. [Figure 2]This is a perspective view of a non-combustion type suction device with the rod attached. [Figure 3] Another perspective on non-combustion type suction devices. [Figure 4] This is a disassembled perspective view of a non-combustion type suction device. [Figure 5] This is a perspective view of the internal unit of a non-combustion type suction device. [Figure 6] Figure 5 is an exploded perspective view of the internal unit. [Figure 7] This is a perspective view of the internal unit with the power supply and chassis removed. [Figure 8] This is another perspective view of the internal unit with the power supply and chassis removed. [Figure 9] This is a schematic diagram illustrating the operating modes of a suction device. [Figure 10] This diagram shows the schematic configuration of the electrical circuit of the internal unit. [Figure 11] This diagram shows the schematic configuration of the electrical circuit of the internal unit. [Figure 12] This diagram shows the schematic configuration of the electrical circuit of the internal unit. [Figure 13] This diagram illustrates the operation of the electrical circuit in sleep mode. [Figure 14] This diagram illustrates the operation of an electrical circuit in active mode. [Figure 15] This diagram illustrates the operation of the electrical circuit in the initial heating setting mode. [Figure 16] This diagram illustrates the operation of the electrical circuit during heating in heating mode. [Figure 17] This diagram illustrates the operation of the electrical circuit when detecting the heater temperature in heating mode. [Figure 18] This diagram illustrates the operation of the electrical circuit in charging mode. [Figure 19] This diagram illustrates the operation of the electrical circuitry during an MCU reset (reboot). [Figure 20]Figure 10 is a schematic diagram showing the main electronic components used for heating and temperature detection of the heater, extracted from the electrical circuit shown in Figure 10. [Figure 21] This figure shows an example of the voltage change input to the gate terminals of switches S3 and S4 in heating mode. [Figure 22] This diagram shows the current flow during heating control in heating mode. [Figure 23] This diagram shows the current flow during temperature detection and control in heating mode. [Figure 24] This figure shows the current flow when both switches S3 and S4 are ON in the drive example EX2 shown in Figure 21. [Figure 25] This is a plan view of the receptacle-mounted substrate as seen from the main surface. [Figure 26] This is a plan view of the receptacle-mounted substrate as seen from the side. [Figure 27] Figure 25 is an enlarged view of the range H shown. [Modes for carrying out the invention]

[0010] Hereinafter, a suction system, which is one embodiment of the aerosol generating apparatus of the present invention, will be described with reference to the drawings. This suction system comprises a non-combustion type suction device 100 (hereinafter also simply referred to as "suction device 100"), which is one embodiment of the power supply unit of the present invention, and a rod 500 that is heated by the suction device 100. In the following description, the suction device 100 will be described as having a configuration in which the heating unit is not detachably housed. However, the heating unit may be configured to be detachably attached to the suction device 100. For example, the rod 500 and the heating unit may be integrated and configured to be detachably attached to the suction device 100. In other words, the power supply unit of the aerosol generating apparatus may not include a heating unit as a component. Hereinafter, "not detachable" refers to a configuration in which it cannot be removed to the extent of the intended use. Alternatively, an induction heating coil provided in the suction device 100 and a susceptor built into the rod 500 may cooperate to constitute the heating unit.

[0011] Figure 1 is a perspective view showing the overall configuration of the suction device 100. Figure 2 is a perspective view of the suction device 100 with the rod 500 attached. Figure 3 is another perspective view of the suction device 100. Figure 4 is an exploded perspective view of the suction device 100. Furthermore, in the following explanation, for convenience, the three mutually orthogonal directions are referred to as the front-back direction, the left-right direction, and the up-down direction, and the explanation will be based on a three-dimensional orthogonal coordinate system. In the figures, the front is indicated as Fr, the back as Rr, the right side as R, the left side as L, the top as U, and the bottom as D.

[0012] The aspirator 100 is configured to generate an aerosol containing flavor by heating an elongated, roughly cylindrical rod 500 (see Figure 2), which is an example of a flavor component generating substrate having a filling material containing an aerosol source and a flavor source.

[0013] <Flavor component generating base material (rod)> Rod 500 includes a filler containing an aerosol source that is heated to a predetermined temperature to generate an aerosol.

[0014] The type of aerosol source is not particularly limited, and various natural extracts and / or their constituent components can be selected depending on the application. The aerosol source may be a solid, or it may be a liquid such as a polyhydric alcohol such as glycerin or propylene glycol, or water. The aerosol source may contain flavor sources such as tobacco raw materials or extracts derived from tobacco raw materials that release flavor components when heated. The gas to which the flavor components are added is not limited to aerosols; for example, invisible vapor may be generated.

[0015] The filling of Rod 500 may contain shredded tobacco as a flavor source. The material of the shredded tobacco is not particularly limited, and known materials such as lamina or backbone can be used. The filling may contain one or more flavorings. The type of flavoring is not particularly limited, but menthol is preferred from the viewpoint of providing a good smoking taste. The flavor source may contain plants other than tobacco (e.g., mint, herbs, or other herbs). Depending on the application, Rod 500 may not contain a flavoring.

[0016] <Overall configuration of a non-combustion type suction device> Next, the overall configuration of the suction device 100 will be explained with reference to Figures 1 to 4. The suction device 100 includes a case 110 that is roughly rectangular in shape, having a front, rear, left, right, top, and bottom surface. The case 110 includes a bottomed cylindrical case body 112 in which the front, rear, top, bottom, and right surfaces are integrally formed, an outer panel 115 and an inner panel 118 that seal the opening 114 (see Figure 4) of the case body 112 and form the left side, and a slider 119.

[0017] The inner panel 118 is fixed to the case body 112 with bolts 120. The outer panel 115 is fixed to the case body 112 by magnets 124 held in a chassis 150 (see Figure 5), which will be described later and housed in the case body 112, so as to cover the outer surface of the inner panel 118. Because the outer panel 115 is fixed by magnets 124, the user can replace the outer panel 115 to suit their preference.

[0018] The inner panel 118 is provided with two through-holes 126 formed to allow the magnet 124 to pass through. Between the two vertically positioned through-holes 126, the inner panel 118 is further provided with a vertically elongated slot 127 and a circular slot 128. The elongated slot 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built into the case body 112. The button-type operation switch OPS built into the case body 112 passes through the circular slot 128. This allows the user to detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. The user can also press down the operation switch OPS via the pressing portion 117 of the outer panel 115.

[0019] As shown in Figure 2, the top surface of the case body 112 is provided with an opening 132 into which the rod 500 can be inserted. The slider 119 is connected to the case body 112 so as to be movable in the front-rear direction between a position that closes the opening 132 (see Figure 1) and a position that opens the opening 132 (see Figure 2).

[0020] The operating switch OPS is used to perform various operations on the suction device 100. For example, the user operates the operating switch OPS via the pressing part 117 with the rod 500 inserted into the opening 132 as shown in Figure 2. This causes the heating part 170 (see Figure 5) to heat the rod 500 without combustion. When the rod 500 is heated, an aerosol is generated from the aerosol source contained in the rod 500, and the flavor from the flavor source contained in the rod 500 is added to the aerosol. The user can inhale the flavor-containing aerosol by putting the mouthpiece 502 of the rod 500, which protrudes from the opening 132, in their mouth and inhaling.

[0021] As shown in Figure 3, a charging terminal 134 is provided on the underside of the case body 112 for receiving power by electrically connecting to an external power source such as an electrical outlet or mobile battery. In this embodiment, the charging terminal 134 is a USB (Universal Serial Bus) Type-C shaped receptacle, but is not limited to this. The charging terminal 134 will also be referred to as the receptacle RCP below.

[0022] The charging terminal 134 may, for example, be equipped with a power receiving coil and configured to receive power from an external power source in a contactless manner. In this case, the power transmission method (wireless power transfer) may be electromagnetic induction type, magnetic resonance type, or a combination of electromagnetic induction type and magnetic resonance type. As another example, the charging terminal 134 may be connectable to various USB terminals, etc., and may also have the power receiving coil described above.

[0023] The configuration of the suction device 100 shown in Figures 1 to 4 is merely an example. The suction device 100 can be configured in various ways, such as by holding the rod 500 and applying an action such as heating, which generates a gas to which flavor components are imparted, and the user can then inhale the generated gas.

[0024] <Internal components of a non-combustion type suction device> The internal unit 140 of the suction device 100 will be explained with reference to Figures 5 to 8. Figure 5 is a perspective view of the internal unit 140 of the suction device 100. Figure 6 is an exploded perspective view of the internal unit 140 of Figure 5. Figure 7 is a perspective view of the internal unit 140 with the power supply battery and chassis 150 removed. Figure 8 is another perspective view of the internal unit 140 with the power supply battery and chassis 150 removed.

[0025] The internal unit 140 housed in the internal space of the case 110 comprises a chassis 150, a power supply battery (BAT), a circuit section 160, a heating section 170, a notification section 180, and various sensors.

[0026] The chassis 150 comprises a plate-shaped chassis body 151 positioned approximately in the center of the internal space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions; a plate-shaped front-rear dividing wall 152 positioned approximately in the center of the internal space of the case 110 in the front-rear direction and extending in the vertical and left-right directions; a plate-shaped upper-lower dividing wall 153 extending forward from approximately the center of the front-rear dividing wall 152 in the vertical direction; a plate-shaped upper chassis wall 154 extending rearward from the upper edges of the front-rear dividing wall 152 and the chassis body 151; and a plate-shaped lower chassis wall 155 extending rearward from the lower edges of the front-rear dividing wall 152 and the chassis body 151. The left side of the chassis body 151 is covered by the inner panel 118 and outer panel 115 of the case 110 described above.

[0027] The internal space of the case 110 is partitioned by the chassis 150, with a heating unit housing area 142 at the front upper part, a substrate housing area 144 at the front lower part, and a power supply housing space 146 extending vertically at the rear.

[0028] The heating section 170 housed in the heating section housing region 142 is composed of a plurality of cylindrical members, which are arranged concentrically to form a cylindrical body as a whole. The heating section 170 has a rod housing section 172 capable of housing a portion of the rod 500 inside, and a heater HTR (see Figures 10 to 19) that heats the rod 500 from its outer circumference or center. It is preferable that the rod housing section 172 is made of an insulating material, or that an insulating material is provided inside the rod housing section 172, so that the surface of the rod housing section 172 and the heater HTR are insulated. The heater HTR can be any element capable of heating the rod 500. The heater HTR is, for example, a heat-generating element. Examples of heat-generating elements include heat-generating resistors, ceramic heaters, and induction heaters. As the heater HTR, for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases with increasing temperature is preferably used. Alternatively, a heater HTR having NTC (Negative Temperature Coefficient) characteristics, in which the resistance decreases with increasing temperature, may be used. The heating unit 170 has the function of defining the airflow path supplied to the rod 500 and the function of heating the rod 500. The case 110 is formed with a vent (not shown) for introducing air, and is configured so that air can flow into the heating unit 170.

[0029] The power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, an electric double-layer capacitor, etc., and is preferably a lithium-ion secondary battery. The electrolyte of the power supply BAT may consist of one of a gel electrolyte, an electrolyte solution, a solid electrolyte, an ionic liquid, or a combination thereof.

[0030] The notification unit 180 notifies various information such as the State of Charge (SOC) indicating the charge status of the power supply BAT, the preheating time during suction, and the period during which suction is possible. The notification unit 180 in this embodiment includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 may be composed of light-emitting elements such as LEDs L1 to L8, vibration elements such as the vibration motor M, or sound output elements. The notification unit 180 may also be a combination of two or more elements from among the light-emitting elements, vibration elements, and sound output elements.

[0031] The various sensors include an intake sensor that detects the user's puffing action (suction action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, a case temperature sensor that detects the temperature of the case 110, a cover position sensor that detects the position of the slider 119, and a panel detection sensor that detects the attachment or detachment of the outer panel 115.

[0032] The intake sensor is mainly composed of a thermistor T2 located near the opening 132, for example. The power supply temperature sensor is mainly composed of a thermistor T1 located near the power supply BAT, for example. The heater temperature sensor is mainly composed of a thermistor T3 located near the heater HTR, for example. As described above, it is preferable that the rod housing 172 be insulated from the heater HTR. In this case, it is preferable that thermistor T3 is in contact with or close to the heater HTR inside the rod housing 172. If the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor. The case temperature sensor is mainly composed of a thermistor T4 located near the left side of the case 110, for example. The cover position sensor is mainly composed of a Hall IC 14 including a Hall element located near the slider 119. The panel detection sensor is mainly composed of a Hall IC 13 including a Hall element located near the inner surface of the inner panel 118.

[0033] The circuit section 160 comprises four circuit boards, multiple ICs (Integrate Circuits), and multiple elements. The four circuit boards include an MCU-mounted board 161 on which the MCU (Micro Controller Unit) 1 and charging IC 2 described later are mainly arranged; a receptacle-mounted board 162 on which the charging terminals 134 are mainly arranged; an LED-mounted board 163 on which the operation switch OPS, LEDs L1 to L8, and the communication IC 15 described later are arranged; and a Hall IC-mounted board 164 on which the Hall IC 14 described later, including a Hall element that constitutes a cover position sensor, is arranged.

[0034] The MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are arranged parallel to each other in the substrate housing area 144. Specifically, the element placement surfaces of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are arranged along the left-right and up-down directions, with the MCU-mounted substrate 161 positioned in front of the receptacle-mounted substrate 162. The MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are each provided with an opening. The MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are fastened to the substrate fixing portion 156 of the front and rear dividing wall 152 with bolts 136, with cylindrical spacers 173 interposed between the peripheral edges of these openings. That is, the spacers 173 fix the positions of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 inside the case 110 and mechanically connect the MCU-mounted substrate 161 and the receptacle-mounted substrate 162. This prevents the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 from coming into contact and thus prevents the generation of a short-circuit current between them.

[0035] For convenience, if we define the forward-facing surfaces of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 as the main surfaces 161a and 162a, respectively, and the opposite surfaces of the main surfaces 161a and 162a as the secondary surfaces 161b and 162b, respectively, then the secondary surface 161b of the MCU-mounted substrate 161 and the main surface 162a of the receptacle-mounted substrate 162 face each other with a predetermined gap between them. The main surface 161a of the MCU-mounted substrate 161 faces the front of the case 110, and the secondary surface 162b of the receptacle-mounted substrate 162 faces the front-to-rear dividing wall 152 of the chassis 150. The elements and ICs mounted on the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 will be described later.

[0036] The LED mounting board 163 is positioned on the left side of the chassis body 151, between two magnets 124 positioned vertically. The element placement surface of the LED mounting board 163 is aligned along the vertical and front-to-back directions. In other words, the element placement surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are orthogonal to the element placement surface of the LED mounting board 163. However, it is preferable that the element placement surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are not only orthogonal to the element placement surface of the LED mounting board 163, but also intersect (are not parallel). The vibration motor M, which constitutes the notification unit 180 together with LEDs L1 to L8, is fixed to the lower surface of the chassis lower wall 155 and electrically connected to the MCU mounting board 161.

[0037] The Hall IC mounting board 164 is positioned on the upper surface of the chassis upper wall 154.

[0038] <Suction device operating modes> Figure 9 is a schematic diagram illustrating the operating modes of the suction device 100. As shown in Figure 9, the operating modes of the suction device 100 include charging mode, sleep mode, active mode, heating initial setting mode, heating mode, and heating end mode.

[0039] Sleep mode is a power-saving mode that primarily stops the power supply to electronic components necessary for heating control of the heater (HTR).

[0040] Active mode is a mode in which most functions are enabled except for heating control of the heater HTR. When the suction device 100 is operating in sleep mode, the operating mode is switched to active mode when the slider 119 is opened. When the suction device 100 is operating in active mode, the operating mode is switched to sleep mode when the slider 119 is closed or when the idle time of the operation switch OPS reaches a predetermined time.

[0041] The heating initial setup mode is a mode in which initial settings such as control parameters are performed to start heating control of the heater HTR. When the suction device 100 is operating in active mode and detects operation of the operation switch OPS, it switches the operating mode to the heating initial setup mode, and when the initial setup is completed, it switches the operating mode back to heating mode.

[0042] The heating mode is a mode in which the heater HTR performs heating control (heating control for aerosol generation and heating control for temperature detection). When the operating mode of the aspirator 100 switches to heating mode, it starts heating control of the heater HTR.

[0043] The heating termination mode is a mode in which the heating control termination process of the heater HTR (such as the storage of the heating history) is executed. When the suction device 100 is operating in heating mode, if the power supply time to the heater HTR or the number of suctions by the user reaches the upper limit, or if the slider 119 is closed, the operating mode is switched to the heating termination mode, and when the termination process is completed, the operating mode is switched to the active mode. When the suction device 100 is operating in heating mode and a USB connection is made, the operating mode is switched to the heating termination mode, and when the termination process is completed, the operating mode is switched to the charging mode. As shown in Figure 9, in this case, the operating mode may be switched to the active mode before switching to the charging mode. In other words, when the suction device 100 is operating in heating mode and a USB connection is made, the operating mode may be switched in the order of heating termination mode, active mode, and charging mode.

[0044] The charging mode is a mode in which the power battery (BAT) is charged by power supplied from an external power source connected to the receptacle RCP. When the suction device 100 is operating in sleep mode or active mode, it switches to charging mode when an external power source (USB connection) is connected to the receptacle RCP. When the suction device 100 is operating in charging mode, it switches to sleep mode when the power battery (BAT) has finished charging or when the connection between the receptacle RCP and the external power source is disconnected.

[0045] <Overview of the internal unit's circuitry> Figures 10, 11, and 12 show the schematic configuration of the electrical circuit of the internal unit 140. Figure 11 is the same as Figure 10 except that the area 161A (area enclosed by a thick dashed line) mounted on the MCU mounting board 161 and the area 163A (area enclosed by a thick solid line) mounted on the LED mounting board 163 are added to the electrical circuit shown in Figure 10. Figure 12 is the same as Figure 10 except that the area 162A mounted on the receptacle mounting board 162 and the area 164A mounted on the Hall IC mounting board 164 are added to the electrical circuit shown in Figure 10.

[0046] In Figure 10, the wiring shown by a thick solid line is wiring that is at the same potential as the reference potential (ground potential) of the internal unit 140 (wiring connected to the ground provided in the internal unit 140), and this wiring will be referred to as the ground line below. In Figure 10, an electronic component with multiple circuit elements integrated into a chip is shown as a rectangle, and the symbols of the various terminals are written inside this rectangle. The power supply terminals VCC and VDD mounted on the chip indicate the high-potential side power supply terminals, respectively. The power supply terminals VSS and GND mounted on the chip indicate the low-potential side (reference potential side) power supply terminals, respectively. For an integrated electronic component, the difference between the potential of the high-potential side power supply terminal and the potential of the low-potential side power supply terminal becomes the power supply voltage. The integrated electronic component uses this power supply voltage to perform various functions.

[0047] As shown in Figure 11, the MCU-mounted board 161 (range 161A) contains, as its main electronic components, an MCU 1 that provides overall control of the aspirator 100, a charging IC 2 that controls the charging of the power supply BAT, load switches (hereinafter referred to as LSWs) 3, 4, and 5 which are composed of a combination of capacitors, resistors, and transistors, and a ROM (Read Only The circuit includes Memory 6, a switch driver 7, a buck-boost DC / DC converter 8 (labeled as buck-boost DC / DC8 in the diagram), operational amplifier OP2, operational amplifier OP3, flip-flops (FF) 16 and 17, a connector Cn(t2) electrically connected to thermistor T2 which constitutes the intake sensor (in the diagram, thermistor T2 connected to this connector is shown), a connector Cn(t3) electrically connected to thermistor T3 which constitutes the heater temperature sensor (in the diagram, thermistor T3 connected to this connector is shown), a connector Cn(t4) electrically connected to thermistor T4 which constitutes the case temperature sensor (in the diagram, thermistor T4 connected to this connector is shown), and a voltage divider circuit Pc for USB connection detection.

[0048] The ground terminals GND of the charging IC2, LSW3, LSW4, LSW5, switch driver 7, step-up / step-down DC / DC converter 8, FF16, and FF17 are connected to the ground line. The power supply terminal VSS of ROM6 is connected to the ground line. The negative power supply terminals of op-amps OP2 and OP3 are connected to the ground line.

[0049] As shown in Figure 11, the LED mounting board 163 (range 163A) is equipped with the following main electronic components: a Hall IC 13 containing a Hall element that constitutes a panel detection sensor, LEDs L1 to L8, an operation switch OPS, and a communication IC 15. The communication IC 15 is a communication module for communicating with electronic devices such as smartphones. The power terminal VSS of the Hall IC 13 and the ground terminal GND of the communication IC 15 are both connected to the ground line. The communication IC 15 and the MCU 1 are configured to communicate via a communication line LN. One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to terminal P4 of the MCU 1.

[0050] As shown in Figure 12, the receptacle-mounted substrate 162 (range 162A) is provided with the following main electronic components: a power connector electrically connected to the power supply BAT (in the figure, the power supply BAT connected to this power connector is shown); a connector electrically connected to the thermistor T1 that constitutes the power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is shown); a boost DC / DC converter 9 (in the figure, boost DC / DC 9); a protection IC 10; an overvoltage protection IC 11; a battery level indicator IC 12; a receptacle RCP; switches S3 to S6 composed of MOSFETs; an operational amplifier OP1; and a pair of heater connectors Cn (positive and negative sides) electrically connected to the heater HTR.

[0051] The two ground terminals GND of the receptacle RCP, the ground terminal GND of the boost DC / DC converter 9, the power supply terminal VSS of the protection IC 10, the power supply terminal VSS of the remaining charge indicator IC 12, the ground terminal GND of the overvoltage protection IC 11, and the negative power supply terminal of the operational amplifier OP1 are all connected to the ground line.

[0052] As shown in Figure 12, the Hall IC mounting board 164 (range 164A) is provided with a Hall IC 14, which includes a Hall element that constitutes a cover position sensor. The power terminal VSS of the Hall IC 14 is connected to the ground line. The output terminal OUT of the Hall IC 14 is connected to terminal P8 of the MCU 1. The MCU 1 detects the opening and closing of the slider 119 based on the signal input to terminal P8.

[0053] As shown in Figure 11, the connector electrically connected to the vibration motor M is provided on the MCU-mounted board 161.

[0054] <Details of the internal unit's circuitry> The following explanation will describe the connections between each electronic component, referring to Figure 10.

[0055] The two power input terminals V of the receptacle RCP BUS Each of these is connected to the input terminal IN of the overvoltage protection IC11 via fuse Fs. When a USB plug is connected to the receptacle RCP and the USB cable containing this USB plug is connected to an external power supply, the two power input terminals V of the receptacle RCP BUS USB voltage V USB It will be supplied.

[0056] One end of a voltage divider circuit Pa, consisting of two resistors in series, is connected to the input terminal IN of the overvoltage protection IC11. The other end of the voltage divider circuit Pa is connected to the ground line. The connection point of the two resistors constituting the voltage divider circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11. When the voltage input to the voltage detection terminal OVLo is below the threshold, the overvoltage protection IC11 outputs the voltage input to the input terminal IN from the output terminal OUT. When the voltage input to the voltage detection terminal OVLo exceeds the threshold (overvoltage), the overvoltage protection IC11 stops the voltage output from the output terminal OUT (disconnecting the electrical connection between LSW3 and receptacle RCP), thereby protecting electronic components downstream of the overvoltage protection IC11. The output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of LSW3 and one end of the voltage divider circuit Pc (a series circuit of two resistors) connected to MCU1. The other end of the voltage divider circuit Pc is connected to the ground line. The connection point of the two resistors that make up the voltage divider circuit Pc is connected to terminal P17 of MCU1.

[0057] One end of a voltage divider circuit Pf, consisting of two resistors in series, is connected to the input terminal VIN of the LSW3. The other end of the voltage divider circuit Pf is connected to the ground line. The connection point of the two resistors constituting the voltage divider circuit Pf is connected to the control terminal ON of the LSW3. The collector terminal of bipolar transistor S2 is connected to the control terminal ON of the LSW3. The emitter terminal of bipolar transistor S2 is connected to the ground line. The base terminal of bipolar transistor S2 is connected to terminal P19 of the MCU1. When the signal input to the control terminal ON of the LSW3 becomes high level, the voltage input to the input terminal VIN is output from the output terminal VOUT of the LSW3. The output terminal VOUT of the LSW3 is connected to the input terminal VBUS of the charging IC2. The MCU1 turns on bipolar transistor S2 when the USB connection is not made. As a result, the control terminal ON of the LSW3 is connected to the ground line via bipolar transistor S2, and a low level signal is input to the control terminal ON of the LSW3. The bipolar transistor S2 connected to LSW3 is turned off by MCU1 when a USB connection is established. When bipolar transistor S2 is turned off, the USB voltage V divided by the voltage divider circuit Pf is turned off. USB This is input to the ON control terminal of LSW3. Therefore, when a USB connection is made and the bipolar transistor S2 is turned off, a high-level signal is input to the ON control terminal of LSW3. As a result, LSW3 receives the USB voltage V supplied from the USB cable. USB This signal is output from the VOUT output terminal. Note that even if a USB connection is made while the bipolar transistor S2 is not turned off, the LSW3 control terminal ON is connected to the ground line via the bipolar transistor S2. Therefore, please note that a low-level signal will continue to be input to the LSW3 control terminal ON unless the MCU1 turns off the bipolar transistor S2.

[0058] The positive terminal of power supply BAT is connected to the power supply terminal VDD of protection IC 10, the input terminal VIN of boost DC / DC converter 9, and the charging terminal bat of charging IC 2. Therefore, the power supply voltage V of power supply BAT is BAT The current is supplied to the protection IC 10, the charging IC 2, and the boost DC / DC converter 9. The negative terminal of the power supply BAT is connected in series in the following order: resistor Ra, switch Sa (composed of MOSFETs), switch Sb (composed of MOSFETs), and resistor Rb. The connection point between resistor Ra and switch Sa is connected to the current sensing terminal CS of the protection IC 10. The control terminals of switches Sa and Sb are connected to the protection IC 10. Both ends of resistor Rb are connected to the battery level indicator IC 12.

[0059] The protection IC 10 obtains the current value flowing through resistor Ra during charging and discharging of the power supply battery from the voltage input to the current sensing terminal CS. If this current value becomes excessive (overcurrent), it controls the opening and closing of switches Sa and Sb to stop charging or discharging the power supply battery, thereby protecting the power supply battery. More specifically, if the protection IC 10 obtains an excessive current value during charging of the power supply battery, it stops charging the power supply battery by turning off switch Sb. If the protection IC 10 obtains an excessive current value during discharging of the power supply battery, it stops discharging the power supply battery by turning off switch Sa. Furthermore, if the voltage value of the power supply battery becomes abnormal (overcharge or overvoltage) from the voltage input to the power supply terminal VDD, the protection IC 10 controls the opening and closing of switches Sa and Sb to stop charging or discharging the power supply battery, thereby protecting the power supply battery. More specifically, if the protection IC10 detects overcharging of the power battery, it stops charging the power battery by turning off switch Sb. If the protection IC10 detects over-discharging of the power battery, it stops discharging the power battery by turning off switch Sa.

[0060] A resistor Rt1 is connected to a connector that is connected to thermistor T1, which is located near the power supply BAT. The series circuit of resistor Rt1 and thermistor T1 is connected to the ground line and to the regulator terminal TREG of the fuel gauge IC12. The connection point of thermistor T1 and resistor Rt1 is connected to the thermistor terminal THM of the fuel gauge IC12. Thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance increases with increasing temperature, or an NTC (Negative Temperature Coefficient) thermistor whose resistance decreases with increasing temperature.

[0061] The battery level indicator IC12 detects the current flowing through resistor Rb and, based on the detected current value, derives battery information such as the remaining capacity of the power supply BAT, the State of Charge (SOC) indicating the charge status, and the State of Health (SOH) indicating the healthy state. The battery level indicator IC12 supplies voltage from the built-in regulator connected to the regulator terminal TREG to the voltage divider circuit of thermistor T1 and resistor Rt1. The battery level indicator IC12 obtains the voltage divided by this voltage divider circuit from the thermistor terminal THM and, based on this voltage, obtains temperature information related to the temperature of the power supply BAT. The battery level indicator IC12 is connected to MCU1 by a communication line LN for serial communication and is configured to communicate with MCU1. The battery level indicator IC12 transmits the derived battery information and the acquired power supply BAT temperature information to MCU1 upon request from MCU1. Note that multiple signal lines, such as a data line for data transmission and a clock line for synchronization, are required for serial communication. Please note that in Figures 10-19, only one signal line is shown for simplification.

[0062] The battery level indicator IC12 is equipped with a notification terminal 12a. The notification terminal 12a is connected to terminal P6 of the MCU1 and the cathode of diode D2, which will be described later. When the battery level indicator IC12 detects an abnormality, such as an excessive temperature of the power supply battery, it notifies the MCU1 of the abnormality by outputting a low-level signal from the notification terminal 12a. This low-level signal is also input to the CLR(￣) terminal of FF17 via diode D2.

[0063] One end of reactor Lc is connected to the switching terminal SW of the boost DC / DC converter 9. The other end of reactor Lc is connected to the input terminal VIN of the boost DC / DC converter 9. The boost DC / DC converter 9 boosts the input voltage by controlling the on / off state of the built-in transistor connected to the switching terminal SW, and outputs it from the output terminal VOUT. The input terminal VIN of the boost DC / DC converter 9 constitutes the high-potential power supply terminal of the boost DC / DC converter 9. The boost DC / DC converter 9 performs boost operation when the signal input to the enable terminal EN is at a high level. When connected via USB, the signal input to the enable terminal EN of the boost DC / DC converter 9 may be controlled to a low level by the MCU1. Alternatively, when connected via USB, the MCU1 may not control the signal input to the enable terminal EN of the boost DC / DC converter 9, thereby making the potential of the enable terminal EN undefined.

[0064] The source terminal of switch S4, which is composed of a P-channel MOSFET, is connected to the output terminal VOUT of the boost DC / DC converter 9. The gate terminal of switch S4 is connected to terminal P15 of MCU1. One end of resistor Rs is connected to the drain terminal of switch S4. The other end of resistor Rs is connected to the positive side heater connector Cn, which is connected to one end of heater HTR. A voltage divider circuit Pb, consisting of two resistors, is connected to the connection point between switch S4 and resistor Rs. The connection point of the two resistors constituting the voltage divider circuit Pb is connected to terminal P18 of MCU1. The connection point between switch S4 and resistor Rs is further connected to the positive power supply terminal of operational amplifier OP1.

[0065] The source terminal of switch S3, which is composed of a P-channel MOSFET, is connected to the connection line between the output terminal VOUT of the boost DC / DC converter 9 and the source terminal of switch S4. The gate terminal of switch S3 is connected to terminal P16 of MCU1. The drain terminal of switch S3 is connected to the connection line between resistor Rs and the positive side heater connector Cn. In this way, a circuit including switch S3 and a circuit including switch S4 and resistor Rs are connected in parallel between the output terminal VOUT of the boost DC / DC converter 9 and the positive side of heater connector Cn. The circuit including switch S3 has no resistors and therefore has lower resistance than the circuit including switch S4 and resistor Rs.

[0066] The non-inverting input terminal of op-amp OP1 is connected to the connection line between resistor Rs and the positive side heater connector Cn. The inverting input terminal of op-amp OP1 is connected to the negative side heater connector Cn, which is connected to the other end of heater HTR, and to the drain terminal of switch S6, which is composed of an N-channel MOSFET. The source terminal of switch S6 is connected to the ground line. The gate terminal of switch S6 is connected to terminal P14 of MCU1, the anode of diode D4, and the enable terminal EN of boost DC / DC converter 9. The cathode of diode D4 is connected to terminal Q of FF17. One end of resistor R4 is connected to the output terminal of op-amp OP1. The other end of resistor R4 is connected to terminal P9 of MCU1 and to the drain terminal of switch S5, which is composed of an N-channel MOSFET. The source terminal of switch S5 is connected to the ground line. The gate terminal of switch S5 is connected to the connection line between resistor Rs and the positive side heater connector Cn.

[0067] The input terminal VBUS of the charging IC2 is connected to the anode of each of the LEDs L1 to L8. The cathode of each of the LEDs L1 to L8 is connected to the control terminals PD1 to PD8 of the MCU1 via resistors for current limiting. That is, the LEDs L1 to L8 are connected in parallel to the input terminal VBUS. The LEDs L1 to L8 are operated by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC2, respectively. The MCU1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND. The MCU1 energizes and lights the LED L1 by turning on the transistor connected to the control terminal PD1, and turns off the LED L1 by turning off the transistor connected to the control terminal PD1. By rapidly switching between on and off of the transistor connected to the control terminal PD1, the brightness and light emission pattern of the LED L1 can be dynamically controlled. The LEDs L2 to L8 are similarly controlled for lighting by the MCU1.

[0068] The charging IC2 has a charging function for charging the power supply BAT based on the USB voltage V USB input to the input terminal VBUS. The charging IC2 acquires the charging current and charging voltage of the power supply BAT from terminals and wirings not shown, and performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT) based on these. Also, the charging IC may acquire the temperature information of the power supply BAT transmitted from the remaining amount meter IC12 to the MCU1 by serial communication using the communication line LN, and use it for charging control.

[0069] The charging IC2 further has a BAT power pass function and an OTG function. The BAT power pass function is a function of outputting a system power supply voltage Vcc0 that substantially matches the power supply voltage V BAT input to the charging terminal bat from the output terminal SYS. The OTG function is a function of outputting a power supply voltage V BATThis function outputs the system power supply voltage Vcc4, obtained by boosting the voltage, from the input terminal VBUS. The on / off switching of the charging IC2's OTG function is controlled by the MCU1 via serial communication using the communication line LN. In the OTG function, the power supply voltage V is input to the charging terminal bat. BAT This can also be output directly from the input terminal VBUS. In this case, the power supply voltage V BAT The system power supply voltage Vcc4 is approximately equal to this.

[0070] The output terminal SYS of the charging IC2 is connected to the input terminal VIN of the buck-boost DC / DC converter 8. One end of the reactor La is connected to the switching terminal SW of the charging IC2. The other end of the reactor La is connected to the output terminal SYS of the charging IC2. The charge enable terminal CE(￣) of the charging IC2 is connected to terminal P22 of the MCU1 via a resistor. Furthermore, the collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE(￣) of the charging IC2. The emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4, which will be described later. The base terminal of the bipolar transistor S1 is connected to the Q terminal of the FF17. Furthermore, one end of the resistor Rc is connected to the charge enable terminal CE(￣) of the charging IC2. The other end of the resistor Rc is connected to the output terminal VOUT of the LSW4.

[0071] Resistors are connected to the input terminal VIN and enable terminal EN of the buck-boost DC / DC converter 8. When the system power supply voltage Vcc0 is input from the output terminal SYS of the charging IC2 to the input terminal VIN of the buck-boost DC / DC converter 8, the signal input to the enable terminal EN of the buck-boost DC / DC converter 8 becomes high level, and the buck-boost DC / DC converter 8 starts boosting or bucking operation. The buck-boost DC / DC converter 8 generates the system power supply voltage Vcc1 by boosting or bucking the system power supply voltage Vcc0 input to the input terminal VIN through switching control of the built-in transistor connected to the reactor Lb, and outputs it from the output terminal VOUT. The output terminal VOUT of the buck-boost DC / DC converter 8 is connected to the feedback terminal FB of the buck-boost DC / DC converter 8, the input terminal VIN of the LSW4, the input terminal VIN of the switch driver 7, and the power supply terminals VCC and D of the FF16. The wiring that supplies the system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is referred to as the power line PL1.

[0072] When the signal input to the control terminal ON of LSW4 becomes high level, it outputs the system power supply voltage Vcc1, which is input to the input terminal VIN, from the output terminal VOUT. The control terminal ON of LSW4 and the power line PL1 are connected via a resistor. Therefore, when the system power supply voltage Vcc1 is supplied to the power line PL1, a high-level signal is input to the control terminal ON of LSW4. The voltage output by LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance etc. is ignored, but in order to distinguish it from the system power supply voltage Vcc1, the voltage output from the output terminal VOUT of LSW4 will be referred to as the system power supply voltage Vcc2 below.

[0073] The output terminal VOUT of LSW4 is connected to the power terminal VDD of MCU1, the input terminal VIN of LSW5, the power terminal VDD of the remaining charge indicator IC12, the power terminal VCC of ROM6, the emitter terminal of bipolar transistor S1, resistor Rc, and the power terminal VCC of FF17. The wiring that supplies the system power supply voltage Vcc2 output from the output terminal VOUT of LSW4 is referred to as power line PL2.

[0074] When the signal input to the control terminal ON of LSW5 becomes high level, it outputs the system power supply voltage Vcc2, which is input to the input terminal VIN, from the output terminal VOUT. The control terminal ON of LSW5 is connected to terminal P23 of MCU1. The voltage output by LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance etc. is ignored, but in order to distinguish it from the system power supply voltage Vcc2, the voltage output from the output terminal VOUT of LSW5 will be referred to as the system power supply voltage Vcc3 below. The wiring to which the system power supply voltage Vcc3 output from the output terminal VOUT of LSW5 is supplied will be referred to as the power line PL3.

[0075] A series circuit of thermistor T2 and resistor Rt2 is connected to power line PL3, with resistor Rt2 connected to the ground line. Thermistor T2 and resistor Rt2 form a voltage divider circuit, and their connection point is connected to terminal P21 of MCU1. Based on the voltage input to terminal P21, MCU1 detects the temperature fluctuation (resistance fluctuation) of thermistor T2 and determines whether or not puffing has occurred based on the amount of the temperature fluctuation.

[0076] A series circuit of thermistor T3 and resistor Rt3 is connected to power line PL3, with resistor Rt3 connected to the ground line. Thermistor T3 and resistor Rt3 form a voltage divider circuit, and their connection point is connected to terminal P13 of MCU1 and the inverting input terminal of operational amplifier OP2. MCU1 detects the temperature of thermistor T3 (corresponding to the temperature of heater HTR) based on the voltage input to terminal P13.

[0077] A series circuit of thermistor T4 and resistor Rt4 is connected to the power line PL3, with resistor Rt4 connected to the ground line. Thermistor T4 and resistor Rt4 form a voltage divider circuit, and their connection points are connected to terminal P12 of MCU1 and the inverting input terminal of op-amp OP3. MCU1 detects the temperature of thermistor T4 (corresponding to the temperature of case 110) based on the voltage input to terminal P12.

[0078] The source terminal of switch S7, which is composed of a MOSFET, is connected to power line PL2. The gate terminal of switch S7 is connected to terminal P20 of MCU1. The drain terminal of switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of these connectors is connected to the ground line. By manipulating the potential of terminal P20, MCU1 can control the opening and closing of switch S7, thereby causing the vibration motor M to vibrate in a specific pattern. A dedicated driver IC may be used instead of switch S7.

[0079] The power supply line PL2 is connected to the positive power supply terminal of the operational amplifier OP2 and to a voltage divider circuit Pd (a series circuit of two resistors) which is connected to the non-inverting input terminal of the operational amplifier OP2. The connection point of the two resistors constituting the voltage divider circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2. The operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (a signal corresponding to the resistance value of thermistor T3). In this embodiment, since thermistor T3 has NTC characteristics, the higher the temperature of the heater HTR (temperature of thermistor T3), the lower the output voltage of the operational amplifier OP2. This is because the negative power supply terminal of the operational amplifier OP2 is connected to the ground line, and when the voltage value input to the inverting input terminal of the operational amplifier OP2 (the voltage divided by thermistor T3 and resistor Rt3) is higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP2 (the voltage divided by the voltage divider circuit Pd), the output voltage value of the operational amplifier OP2 becomes approximately equal to the ground potential. In other words, when the heater HTR (thermistor T3) gets hot, the output voltage of the operational amplifier OP2 becomes low. If a thermistor T3 with PTC characteristics is used, connect the output of the voltage divider circuit of thermistor T3 and resistor Rt3 to the non-inverting input terminal of op-amp OP2, and connect the output of the voltage divider circuit Pd to the inverting input terminal of op-amp OP2.

[0080] The power supply line PL2 is connected to the positive power supply terminal of the operational amplifier OP3 and to a voltage divider circuit Pe (a series circuit of two resistors) which is connected to the non-inverting input terminal of the operational amplifier OP3. The connection point of the two resistors constituting the voltage divider circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3. The operational amplifier OP3 outputs a signal corresponding to the temperature of case 110 (a signal corresponding to the resistance value of thermistor T4). In this embodiment, since a thermistor T4 with NTC characteristics is used, the higher the temperature of case 110, the lower the output voltage of the operational amplifier OP3 becomes. This is because the negative power supply terminal of the operational amplifier OP3 is connected to the ground line, and when the voltage value input to the inverting input terminal of the operational amplifier OP3 (the voltage divided by thermistor T4 and resistor Rt4) is higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP3 (the voltage divided by the voltage divider circuit Pe), the output voltage value of the operational amplifier OP3 becomes approximately equal to the ground potential. In other words, when the temperature of thermistor T4 becomes high, the output voltage of operational amplifier OP3 becomes low. If a thermistor T4 with PTC characteristics is used, connect the output of the voltage divider circuit of thermistor T4 and resistor Rt4 to the non-inverting input terminal of op-amp OP3, and connect the output of the voltage divider circuit Pe to the inverting input terminal of op-amp OP3.

[0081] Resistor R1 is connected to the output terminal of op-amp OP2. The cathode of diode D1 is connected to resistor R1. The anode of diode D1 is connected to the output terminal of op-amp OP3, terminal D of FF17, and terminal CLR(￣) of FF17. Resistor R2, which is connected to power line PL1, is connected to the connection line between resistor R1 and diode D1. Also, terminal CLR(￣) of FF16 is connected to this connection line.

[0082] One end of resistor R3 is connected to the connection line between the anode of diode D1 and the output terminal of op-amp OP3, and the D terminal of FF17. The other end of resistor R3 is connected to the power line PL2. Furthermore, the anode of diode D2, which is connected to the notification terminal 12a of fuel gauge IC12, the anode of diode D3, and the CLR(￣) terminal of FF17 are also connected to this connection line. The cathode of diode D3 is connected to terminal P5 of MCU1.

[0083] When the heater HTR temperature of the FF16 becomes excessive, causing the signal output from the op-amp OP2 to decrease and the signal input to the CLR(￣) terminal to become low level, the FF16 inputs a high-level signal from the Q(￣) terminal to terminal P11 of the MCU1. The D terminal of the FF16 is supplied with a high-level system power supply voltage Vcc1 from the power supply line PL1. Therefore, as long as the signal input to the CLR(￣) terminal, which operates in negative logic, does not become low level, the Q(￣) terminal will continue to output a low-level signal.

[0084] The signal input to the CLR(￣) terminal of FF17 becomes low level in any of the following cases: when the heater HTR temperature becomes excessive, when the case 110 temperature becomes excessive, or when a low-level signal indicating abnormality detection is output from the notification terminal 12a of the remaining charge meter IC 12. When the signal input to the CLR(￣) terminal of FF17 becomes low level, it outputs a low-level signal from the Q terminal. This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of the boost DC / DC converter 9, and the base terminal of the bipolar transistor S1 connected to the charging IC 2, respectively. When a low-level signal is input to the gate terminal of switch S6, the gate-source voltage of the N-channel MOSFET constituting switch S6 falls below the threshold voltage, causing switch S6 to turn off. When a low-level signal is input to the enable terminal EN of the boost DC / DC converter 9, the boost operation stops because the enable terminal EN of the boost DC / DC converter 9 is in positive logic. When a low-level signal is input to the base terminal of bipolar transistor S1, bipolar transistor S1 turns on (an amplified current is output from the collector terminal). When bipolar transistor S1 turns on, a high-level system power supply voltage Vcc2 is input to the CE(￣) terminal of charging IC2 via bipolar transistor S1. Since the CE(￣) terminal of charging IC2 is negative logic, charging of power supply BAT is stopped. As a result, heating of heater HTR and charging of power supply BAT are stopped. Note that even if MCU1 attempts to output a low-level enable signal from terminal P22 to the charge enable terminal CE(￣) of charging IC2, when bipolar transistor S1 turns on, an amplified current is input from the collector terminal to terminal P22 of MCU1 and the charge enable terminal CE(￣) of charging IC2. Therefore, a high-level signal is input to the charge enable terminal CE(￣) of charging IC2.

[0085] The D terminal of the FF17 is supplied with a high-level system power supply voltage Vcc2 from the power supply line PL2. Therefore, in the FF17, a high-level signal will continue to be output from the Q terminal as long as the signal input to the CLR(￣) terminal, which operates in negative logic, is not low level. When a low-level signal is output from the output terminal of op-amp OP3, a low-level signal is input to the CLR(￣) terminal of the FF17, regardless of the level of the signal output from the output terminal of op-amp OP2. Note that when a high-level signal is output from the output terminal of op-amp OP2, the low-level signal output from the output terminal of op-amp OP3 is not affected by this high-level signal due to diode D1. Also, when a low-level signal is output from the output terminal of op-amp OP2, even if a high-level signal is output from the output terminal of op-amp OP3, this high-level signal is replaced by a low-level signal via diode D1.

[0086] The power line PL2 further branches off from the MCU-mounted board 161 towards the LED-mounted board 163 and the Hall IC-mounted board 164. The power terminal VDD of the Hall IC 13, the power terminal VCC of the communication IC 15, and the power terminal VDD of the Hall IC 14 are connected to this branched power line PL2.

[0087] The output terminal OUT of the Hall IC 13 is connected to terminal P3 of the MCU 1 and terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low-level signal is output from the output terminal OUT of the Hall IC 13. The MCU 1 determines whether the outer panel 115 is installed or not based on the signal input to terminal P3.

[0088] The LED-mounted circuit board 163 is provided with a series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS. This series circuit is connected to the power line PL2. The connection point of the resistor and capacitor in this series circuit is connected to terminal P4 of the MCU1, the operation switch OPS, and terminal SW1 of the switch driver 7. When the operation switch OPS is not pressed, the operation switch OPS does not conduct, and the signals input to terminal P4 of the MCU1 and terminal SW1 of the switch driver 7 are high level due to the system power supply voltage Vcc2. When the operation switch OPS is pressed and conducts, the signals input to terminal P4 of the MCU1 and terminal SW1 of the switch driver 7 are connected to the ground line and become low level. The MCU1 detects the operation of the operation switch OPS by the signal input to terminal P4.

[0089] The switch driver 7 is provided with a reset input terminal RSTB. The reset input terminal RSTB is connected to the control terminal ON of LSW4. When the signal levels input to terminals SW1 and SW2 of the switch driver 7 become low (when the outer panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 outputs a low-level signal from the reset input terminal RSTB to stop the output operation of LSW4. In other words, if the operation switch OPS, which is normally pressed down via the press portion 117 of the outer panel 115, is pressed down directly by the user when the outer panel 115 is removed, the signal levels input to terminals SW1 and SW2 of the switch driver 7 will both become low.

[0090] <Operation of the suction device in each operating mode> The operation of the electrical circuit shown in Figure 10 will be explained below with reference to Figures 13 to 19. Figure 13 is a diagram illustrating the operation of the electrical circuit in sleep mode. Figure 14 is a diagram illustrating the operation of the electrical circuit in active mode. Figure 15 is a diagram illustrating the operation of the electrical circuit in heating initial setting mode. Figure 16 is a diagram illustrating the operation of the electrical circuit when the heater HTR is heating in heating mode. Figure 17 is a diagram illustrating the operation of the electrical circuit when the temperature of the heater HTR is detected in heating mode. Figure 18 is a diagram illustrating the operation of the electrical circuit in charging mode. Figure 19 is a diagram illustrating the operation of the electrical circuit when the MCU1 is reset (rebooted). In each of Figures 13 to 19, among the terminals of the chipped electronic components, the terminals enclosed by the dashed ellipse are connected to the power supply voltage V BAT USB voltage V USB This indicates terminals to which input or output such as system power supply voltage is provided.

[0091] In any operating mode, the power supply voltage V BAT This power is input to the power terminal VDD of the protection IC 10, the input terminal VIN of the boost DC / DC converter 9, and the charging terminal bat of the charging IC 2.

[0092] <Sleep mode: Figure 13> MCU1 controls the voltage of charging IC2. BAT Enable the Power Pass function and disable the OTG function and charging function. Connect the USB voltage V to the VBUS input terminal of charging IC2. USB Because no input is received, the voltage of charging IC2 BAT The power path function is enabled. However, the OTG function is disabled because the signal to enable the OTG function is not output from MCU1 to charging IC2 via the communication line LN. Therefore, charging IC2 receives the power supply voltage V input to the charging terminal bat. BATThe system power supply voltage Vcc0 is generated from the switch and output from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. The buck-boost DC / DC converter 8 is enabled when a high level of system power supply voltage Vcc0 is input to the enable terminal EN, which is positive logic, and generates system power supply voltage Vcc1 from system power supply voltage Vcc0 and outputs it from the output terminal VOUT. The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is supplied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, and the power terminals VCC and D of the FF16, respectively.

[0093] When the system power supply voltage Vcc1 is input to the control terminal ON of LSW4, it outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT. The system power supply voltage Vcc2 output from LSW4 is input to the power supply terminal VDD of MCU1, the input terminal VIN of LSW5, the power supply terminal VDD of Hall IC13, the power supply terminal VCC of communication IC15, and the power supply terminal VDD of Hall IC14. Furthermore, the system power supply voltage Vcc2 is supplied to the power supply terminal VDD of battery level indicator IC12, the power supply terminal VCC of ROM6, the resistor Rc and bipolar transistor S1 connected to the charge enable terminal CE(￣) of charging IC2, the power supply terminal VCC of FF17, the positive power supply terminal of op-amp OP3, the voltage divider circuit Pe, the positive power supply terminal of op-amp OP2, and the voltage divider circuit Pd. The bipolar transistor S1 connected to charging IC2 is off unless a low-level signal is output from the Q terminal of FF17. Therefore, the system power supply voltage Vcc2 generated by LSW4 is also input to the charge enable terminal CE(￣) of the charge IC2. Since the charge enable terminal CE(￣) of the charge IC2 is negative logic, the charging function by the charge IC2 is turned off in this state.

[0094] Thus, in sleep mode, LSW5 stops outputting the system power supply voltage Vcc3, and therefore power is not supplied to the electronic components connected to power line PL3. Also, in sleep mode, the OTG function of charging IC2 is disabled, and therefore power is not supplied to LEDs L1 to L8.

[0095] <Active Mode: Figure 14> When the MCU1 detects that the signal input to terminal P8 has become high level and that slider 119 has opened, from the sleep mode state shown in Figure 13, it inputs a high-level signal from terminal P23 to the control terminal ON of the LSW5. As a result, the LSW5 outputs the system power supply voltage Vcc2, which is input to input terminal VIN, as the system power supply voltage Vcc3 from output terminal VOUT. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to thermistors T2, T3, and T4.

[0096] Furthermore, when MCU1 detects that slider 119 is open, it enables the OTG function of charging IC2 via communication line LN. This allows charging IC2 to receive the power supply voltage V input from charging terminal bat. BAT The system power supply voltage Vcc4, obtained by boosting the voltage, is output from the input terminal VBUS. The system power supply voltage Vcc4 output from the input terminal VBUS is supplied to LEDs L1 to L8.

[0097] <Initial heating mode: Figure 15> From the state shown in Figure 14, when the signal input to terminal P4 becomes low level (operation switch OPS is pressed), the MCU1 performs various settings necessary for heating, and then inputs a high-level enable signal from terminal P14 to the enable terminal EN of the boost DC / DC converter 9. As a result, the boost DC / DC converter 9 operates on the power supply voltage V BAT The drive voltage V obtained by boosting the voltage bst The output voltage is VOUT. bstThis power is supplied to switches S3 and S4. In this state, switches S3 and S4 are off. Switch S6 is turned on by a high-level enable signal output from terminal P14. As a result, the negative terminal of heater HTR is connected to the ground line, and when switch S3 is turned ON, heater HTR can be heated. After a high-level enable signal is output from terminal P14 of MCU1, it transitions to heating mode.

[0098] <Heater heating in heating mode: Figure 16> In the state shown in Figure 15, the MCU1 starts switching control of switch S3 connected to terminal P16 and switch S4 connected to terminal P15. These switching controls may start automatically once the heating initial setting mode described above is completed, or they may be started by pressing the operation switch OPS. Specifically, as shown in Figure 16, the MCU1 turns on switch S3 and off switch S4, and the drive voltage V bst Heating control is performed to supply the aerosol to the heater HTR and heat the heater HTR for aerosol generation, and temperature detection control is performed to turn off switch S3 and turn on switch S4 as shown in Figure 17 to detect the temperature of the heater HTR.

[0099] As shown in Figure 16, during heating control, the drive voltage V bst This is also supplied to the gate of switch S5, turning switch S5 on. Furthermore, during heating control, the drive voltage V that passes through switch S3 is also supplied. bst However, this voltage is also input to the positive power supply terminal of the operational amplifier OP1 via resistor Rs. The resistance value of resistor Rs is negligibly small compared to the internal resistance value of the operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is the drive voltage V bst It becomes almost equivalent to that.

[0100] Note that the resistance value of resistor R4 is greater than the on-resistance value of switch S5. Op-amp OP1 operates even during heating control, but switch S5 is turned on during heating control. When switch S5 is on, the output voltage of op-amp OP1 is divided by the voltage divider circuit of resistor R4 and switch S5 and input to terminal P9 of MCU1. Because the resistance value of resistor R4 is greater than the on-resistance value of switch S5, the voltage input to terminal P9 of MCU1 is sufficiently small. This prevents a large voltage from being input from op-amp OP1 to MCU1.

[0101] <Heater temperature detection during heating mode: Figure 17> As shown in Figure 17, during temperature detection control, the drive voltage V bst This voltage is input to the positive power supply terminal of the operational amplifier OP1 and also to the voltage divider circuit Pb. The voltage divided by the voltage divider circuit Pb is input to terminal P18 of the MCU1. Based on the voltage input to terminal P18, the MCU1 applies a reference voltage V to the series circuit of resistor Rs and heater HTR during temperature detection control. temp Obtain it.

[0102] Furthermore, during temperature detection control, the drive voltage V bst (Reference voltage V temp The drive voltage V is supplied to the series circuit of the resistor Rs and the heater HTR. bst (Reference voltage V temp The voltage V obtained by dividing the voltage between resistor Rs and heater HTR. heat However, this is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of resistor Rs is sufficiently larger than the resistance value of heater HTR, the voltage V heat The drive voltage V bst This value is significantly lower than [the specified value]. During temperature detection control, this low voltage V heat When this voltage is also supplied to the gate terminal of switch S5, switch S5 is turned off. The operational amplifier OP1 receives the voltage input to the inverting input terminal and the voltage V input to the non-inverting input terminal. heat The difference is amplified and output.

[0103] The output signal of operational amplifier OP1 is input to terminal P9 of MCU1. MCU1 obtains a reference voltage V based on the signal input to terminal P9 and the input voltage of terminal P18. temp Based on the electrical resistance value of the known resistor Rs, the temperature of the heater HTR is obtained. Based on the obtained temperature of the heater HTR, the MCU1 performs heating control of the heater HTR (for example, control so that the temperature of the heater HTR reaches the target temperature).

[0104] Furthermore, MCU1 can acquire the temperature of the heater HTR even when switches S3 and S4 are turned off (when no power is supplied to the heater HTR). Specifically, MCU1 acquires the temperature of the heater HTR based on the voltage input to terminal P13 (the output voltage of the voltage divider circuit consisting of thermistor T3 and resistor Rt3).

[0105] Furthermore, the MCU1 can acquire the temperature of case 110 at any time. Specifically, the MCU1 acquires the temperature of case 110 based on the voltage input to terminal P12 (the output voltage of the voltage divider circuit consisting of thermistor T4 and resistor Rt4).

[0106] <Charging mode: Figure 18> Figure 18 illustrates the case when a USB connection is made while the device is in sleep mode. When a USB connection is made, the USB voltage V USB The USB voltage V is input to the LSW3 input terminal VIN via the overvoltage protection IC11. USB This voltage is also supplied to the voltage divider circuit Pf connected to the input terminal VIN of the LSW3. Immediately after the USB connection is made, the bipolar transistor S2 is on, so the signal input to the control terminal ON of the LSW3 remains at a low level. USB voltage V USB This voltage is also supplied to the voltage divider circuit Pc connected to terminal P17 of the MCU1, and the voltage divided by this voltage divider circuit Pc is input to terminal P17. Based on the voltage input to terminal P17, the MCU1 detects that a USB connection has been made.

[0107] When MCU1 detects that a USB connection has been made, it turns off the bipolar transistor S2 connected to terminal P19. When a low-level signal is input to the gate terminal of bipolar transistor S2, the USB voltage V divided by the voltage divider circuit Pf is turned on. USB This is input to the control terminal ON of LSW3. As a result, a high-level signal is input to the control terminal ON of LSW3, and LSW3 receives the USB voltage V USB The output voltage VOUT is output from the output terminal. USB This is input to the VBUS input terminal of the charging IC2. Also, the USB voltage V output from LSW3 is input. USB This voltage, Vcc4, is then supplied directly to LEDs L1-L8 as the system power supply voltage.

[0108] When MCU1 detects that a USB connection has been made, it further outputs a low-level enable signal from terminal P22 to the charge enable terminal CE(￣) of the charge IC2. This causes the charge IC2 to activate the charging function of power supply BAT, and the USB voltage V input to input terminal VBUS is connected. USB The power battery will begin charging.

[0109] Furthermore, when a USB connection is made while in active mode, MCU1 detects the USB connection, turns off the bipolar transistor S2 connected to terminal P19, outputs a low-level enable signal from terminal P22 to the charge enable terminal CE(￣) of the charge IC2, and then turns off the OTG function of the charge IC2 via serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to LEDs L1~L8 is the voltage (power supply voltage V) that was generated by the OTG function of the charge IC2. BAT (Based on the voltage) USB voltage V output from LSW3 USB The switch is made. LEDs L1~L8 will not operate unless the built-in transistors are turned on by MCU1. This prevents unstable voltages from being supplied to LEDs L1~L8 during the transient period when the OTG function is turned on to off.

[0110] <Reset of MCU: Figure 19> When the outer panel 115 is removed and the output of the Hall IC 13 becomes low level, and when the on-operation of the operation switch OPS is performed and the signal input to the terminal P4 of the MCU 1 becomes low level, both the terminals SW1 and SW2 of the switch driver 7 become low level. As a result, the switch driver 7 outputs a low-level signal from the reset input terminal RSTB. The low-level signal output from the reset input terminal RSTB is input to the control terminal ON of the LSW4. As a result, the LSW4 stops the output of the system power supply voltage Vcc2 from the output terminal VOUT. Since the system power supply voltage Vcc2 is no longer input to the power supply terminal VDD of the MCU 1, the MCU 1 stops.

[0111] When the time for which the switch driver 7 outputs a low-level signal from the reset input terminal RSTB reaches the preset time, or when the signal input to either of the terminals SW1 and SW2 becomes high level, the switch driver 7 returns the signal output from the reset input terminal RSTB to high level. As a result, the control terminal ON of the LSW4 becomes high level, and the state in which the system power supply voltage Vcc2 is supplied to each part returns.

[0112] <Details of Heating Control and Temperature Detection Control> FIG. 20 is a main part circuit diagram showing the main electronic components used for heating and temperature detection of the heater HTR among the electric circuits shown in FIG. 10. In FIG. 20, as the electronic components and nodes whose illustration or symbols were omitted in FIG. 10, there are a reactor Ld, a resistor R S4 and an npn-type bipolar transistor T S4 and resistors R Pb1 and resistor R Pb2 that constitute a voltage dividing circuit Pb, the parasitic diode D5 of the switch S5, nodes N1 to N8, and the operational amplifiers OP4, OP5, ADC (analog-to-digital converter) 1a, and ADC1b built in the MCU 1 are shown. Various resistors (resistor R S4 resistor Rs, resistor RPb1 , resistor R Pb2 , and resistor R4) are fixed resistors with a predetermined resistance value.

[0113] resistor R S4 One end is connected to the gate terminal of switch S4. Resistor R S4 The other end is a bipolar transistor T S4 It is connected to the collector terminal of the bipolar transistor T. S4 The emitter terminal of the bipolar transistor T is connected to ground. S4 The base terminal is connected to terminal P15 of MCU1.

[0114] The reactor Ld is driven by the drive voltage V output from the boost DC / DC converter 9. bst It is provided for the purpose of noise reduction. Reactor Ld is connected between the source terminal of switch S4 and the output terminal VOUT of boost DC / DC converter 9. In addition to reactor Ld, a first reactor for noise reduction may be provided between switch S4 and resistor Rs, and a second reactor for noise reduction may be provided between resistor Rs and the positive side heater connector Cn(+). Any one or two of these reactors, reactor Ld, the first reactor, and the second reactor, may be omitted. Furthermore, these noise reduction reactors are not mandatory and can be omitted.

[0115] Node N1 connects the source terminal of switch S3 to one end of reactor Ld. Node N1 is connected to the output terminal VOUT of boost DC / DC converter 9.

[0116] Node N7 connects the positive (+) side heater connector Cn (+) to the non-inverting input terminal of the operational amplifier OP1.

[0117] Node N2 connects the drain terminal of switch S3 to node N7.

[0118] Node N4 connects node N2 to resistor Rs. Node N4 is connected to the gate terminal of switch S5.

[0119] Node N5 connects the opposite end of resistor R4 (the side facing op-amp OP1) to the drain terminal of switch S5. Node N5 is connected to terminal P9 of MCU1.

[0120] Node N3 connects the drain terminal of switch S4 to the opposite end of resistor Rs on the node N4 side. Node N3 connects the positive power supply terminal of op-amp OP1 to resistor R Pb1 It is connected to one end of it.

[0121] Node N6 is resistor R Pb1 The other end and resistor R Pb2 It is connected to one end of the node. Node N6 is connected to terminal P18 of MCU1. Resistor R Pb2 The other end is connected to ground.

[0122] Node N8 connects the negative (-) side heater connector Cn (-) to the drain terminal of switch S6. Node N8 is connected to the inverting input terminal of operational amplifier OP1.

[0123] Parasitic diode D5 is configured such that its anode is connected to the source terminal of switch S5 and its cathode is connected to the drain terminal of switch S5.

[0124] In the circuit shown in Figure 20, the process for turning on switch S4 is as follows: First, the drive voltage VOUT is supplied from the output terminal VOUT of the boost DC / DC converter 9. bst With the output displayed, MCU1 uses the bipolar transistor T S4 Turn on (bipolar transistor T S4 (The amplified current is output from the emitter terminal of the switch S4). As a result, the gate terminal of the switch S4 is connected to the resistor R S4 , bipolar transistor T S4 The collector terminal of the bipolar transistor TS4 It is connected to ground via the emitter terminal. As a result, the gate voltage of switch S4 becomes close to the ground potential (0V in this embodiment), and the absolute value of the gate-source voltage of switch S4 becomes greater than the absolute value of the threshold voltage of switch S4, so switch S4 turns on. Bipolar transistor T S4 When the switch is turned off, the absolute value of the gate-source voltage of switch S4 becomes less than or equal to the absolute value of the threshold voltage of switch S4, and therefore switch S4 is turned off. The gate-source voltage refers to the voltage applied between the gate terminal and the source terminal. In this embodiment, since switch S4 is a P-channel MOSFET, a negative gate-source voltage is required to turn on switch S4. In other words, when the potential of the source terminal becomes lower than the threshold voltage from the potential of the gate terminal, switch S4 is turned on. For example, if the threshold voltage of switch S4 is -4.5V, and the source potential is 4.9V and the gate potential is 0V, the gate-source voltage will be -4.9V. Since -4.9V is lower than the threshold voltage of -4.5V, switch S4 is turned on. On the other hand, if the source potential is 4.9V and the gate potential is 3.3V, the gate-source voltage will be -1.6V. Since -1.6V is higher than the threshold voltage of -4.5V, switch S4 is turned off. For the sake of clarity, in this specification, the gate-source voltage and threshold voltage of a P-channel MOSFET are described as absolute values ​​with their signs ignored.

[0125] Furthermore, the system power supply voltage Vcc2 (the power supply voltage of the MCU1 input to the power terminal VDD of the MCU1) and the drive voltage V have been mentioned above. bst Preferably, the value is one of the values ​​shown below. System power supply voltage Vcc2 = 3.3V Drive voltage V bst =4.9V

[0126] Next, referring to Figures 21 to 24, the operation of the heating control and temperature detection control of the heater HTR will be explained.

[0127] Figure 21 shows an example of the voltage change input to the gate terminals of switches S3 and S4 in heating mode. Note that in this embodiment, since switches S3 and S4 are P-channel type MOSFETs, switches S3 and S4 are turned on when the voltage input to their gate terminals is low. Figure 21 shows driving example EX1 and driving example EX2. In driving example EX1 in Figure 21, MCU1 alternately turns switches S3 and S4 on and off. In other words, in driving example EX1, MCU1 turns off switch S4 while switch S3 is on, and turns on switch S4 while switch S3 is off. To put it another way, in driving example EX1, the period when the voltage input to the gate terminal of switch S3 is low and the period when the voltage input to the gate terminal of switch S4 is low do not overlap. Driving example EX2 differs from driving example EX1 in that the period when switch S3 is on and the period when switch S4 is on partially overlap. In other words, in the drive example EX2, the period during which the voltage input to the gate terminal of switch S3 is low overlaps with the period during which the voltage input to the gate terminal of switch S4 is low.

[0128] Figure 21 shows the control period Tc of the MCU1. During this control period Tc, the MCU1 controls the time for which switch S4 is ON and the time for which switch S3 is ON. In other words, during heating control, the MCU1 supplies power to the heater HTR by PWM (pulse width modulation) control. The maximum time for which switch S3 is ON is the time remaining after deducting the constant time for which switch S4 is ON from this control period Tc. The constant time for which switch S4 is ON is sufficiently small compared to the maximum time for which switch S3 is ON, for example, less than or equal to one-tenth of this maximum value. Note that switch S3 may be turned ON multiple times during the control period Tc. In this case, if the duty cycle calculated by PWM control is less than 100%, switch S3 will be turned ON intermittently during the time remaining after deducting the constant time for which switch S4 is ON from the control period Tc.

[0129] In the example EX1, the MCU1 controls the switch so that when switch S3 switches from on to off, switch S4 switches from off to on. In other words, the MCU1 fixes the timing of when switch S3 is turned off and controls the timing of when switch S3 is turned on, thereby changing the on time of switch S3. The MCU1 may also supply power to the heater HTR using PFM (pulse frequency modulation) control.

[0130] Figure 22 shows the current flow during heating control in heating mode. During heating control, switch S3 is ON and switch S4 is OFF. In this state, a first heating discharge path HR1 is formed through which current flows in the order of node N1, switch S3, node N2, node N7, heater HTR, node N8, switch S6, and ground; a second heating discharge path HR2 is formed through which current flows in the order of node N1, switch S3, node N2, node N4, and the gate terminal of switch S5; and a third heating discharge path HR3 is formed through which current flows in the order of node N1, switch S3, node N2, node N4, resistor Rs, node N3, and the positive power supply terminal of operational amplifier OP1.

[0131] Due to the presence of the third heating discharge path HR3, the positive power supply terminal of the operational amplifier OP1 receives the drive voltage V bst Lower voltage than (drive voltage V bst The voltage (after being stepped down by the resistor Rs) is supplied, and the operational amplifier OP1 becomes operational. In other words, during heating control, due to the presence of the third heating discharge path HR3, the voltage applied between the positive and negative power supply terminals of the operational amplifier OP1 is the drive voltage V bst The value will be lower than (but higher than the system power supply voltage Vcc2, which is the power supply voltage of the MCU1). In this state, the differential input value of the operational amplifier OP1 will be the drive voltage V bstIf the voltage exceeds a certain level, the output voltage of op-amp OP1 will become fixed to the voltage applied to the positive power supply terminal of op-amp OP1. Since this voltage is higher than the power supply voltage of MCU1, if this voltage is input to MCU1, there is a risk that MCU1 will not operate properly. Therefore, the presence of the second heating discharge path HR2 causes switch S5 to be turned on. As a result, the output voltage of op-amp OP1 is divided by the on-resistance of resistor R4 and switch S5 and input to terminal P9 of MCU1. The on-resistance of switch S5 is sufficiently smaller than the resistance of resistor R4. Therefore, the voltage divided by resistor R4 and switch S5 is minute. Thus, when switch S5 is turned on, it can be considered that the output voltage of op-amp OP1 is clamped to ground level.

[0132] Figure 23 shows the current flow during temperature detection control in heating mode. During temperature detection control, switch S3 is off and switch S4 is on. In this state, a first detection discharge path MR1 is formed through which current flows in the order of node N1, reactor Ld, switch S4, resistor Rs, node N2, node N7, heater HTR, node N8, switch S6, and ground; a second detection discharge path MR2 is formed through which current flows in the order of node N1, reactor Ld, switch S4, resistor Rs, node N4, and the gate terminal of switch S5; and a third detection discharge path MR3 is formed through which current flows in the order of node N1, reactor Ld, switch S4, node N3, and the positive power supply terminal of operational amplifier OP1.

[0133] The resistance of the reactor Ld and the on-resistance of switch S4 are sufficiently small. Therefore, due to the presence of the third detection discharge path MR3, the drive voltage V is applied to the positive power supply terminal of the operational amplifier OP1. bst This is almost the same voltage (reference voltage V temp With the power supplied, the operational amplifier OP1 becomes operational. Thus, during temperature detection control, the power supply voltage of the operational amplifier OP1 is higher than during heating control, which allows the upper limit of the differential input value of the operational amplifier OP1 to be increased.

[0134] During temperature detection and control, the voltage of node N3 (reference voltage V temp ) is input to the non-inverting input terminal of operational amplifier OP1 as the voltage V heat divided by resistor Rs and heater HTR. Note that node N7 coincides with the potential of node N4 if the wiring resistance is ignored. Therefore, the voltage input to the gate terminal of switch S5 is also the same as voltage V heat . Since voltage V heat is below the threshold voltage of switch S5, switch S5 is off in the state of FIG. 23. Thus, it is preferable to determine the resistance value of resistor Rs so that voltage V heat is below the threshold voltage of switch S5. When switch S5 turns off, the output voltage V OUT of operational amplifier OP1 is input to terminal P9 of MCU1 without being divided. Note that in the state where switch S5 is off, parasitic diode D5 behaves like a Zener diode. Therefore, even if the output voltage V OUT of operational amplifier OP1 becomes excessive due to some factor, it is possible to prevent the voltage input to terminal P9 of MCU1 from becoming high. In this embodiment, in the state of FIG. 23, the resistance values of resistor R4 and resistor Rs are determined so that the voltage input to terminal P9 of MCU1 is below the operating voltage of MCU1 (system power supply voltage Vcc2).

[0135] Assuming the amplification factor of operational amplifier OP1 is A, the resistance value of heater HTR is R HTR , the resistance value of resistor Rs is R RS , and the voltage input to the inverting input terminal of operational amplifier OP1 is 0V, the output voltage V OUT of operational amplifier OP1 is expressed by the following formula (1). The term excluding the amplification factor A on the right side of formula (1) corresponds to voltage V heat .

[0136]

Equation

[0138]

Number

[0139] During temperature detection control, the MCU1 amplifies the difference between the output voltage V input to terminal P9 OUT and the ground potential (= 0V) by the built-in operational amplifier OP5, and converts the amplified voltage into a digital value (denoted as ADC_V OUT ) by the built-in ADC1b. Also, the MCU1 amplifies the difference between the divided voltage value of the reference voltage V input to terminal P18 temp (the value divided by the voltage dividing circuit Pb) and the ground potential (= 0V) by the built-in operational amplifier OP4, and converts the amplified voltage into a digital value (denoted as ADC_V temp ) by the built-in ADC1a. The inverting input terminal of operational amplifier OP4 and / or operational amplifier OP5 does not necessarily have to be connected to the ground potential, and it may be connected to another reference potential. When this reference potential is sufficiently high, the reference potential is connected to the non-inverting input terminal, and the output voltage V OUT or the divided voltage value of the reference voltage V temp may be connected to the inverting input terminal. Note that the outputs of ADC1a and operational amplifier OP4 generate a temperature drift error ε1 due to the influence of the temperature inside the MCU1, and the outputs of ADC1b and operational amplifier OP5 generate a temperature drift error ε2 due to the influence of the temperature inside the MCU1. That is, the digital value output from ADC1a is strictly ADC_V temp (1 + ε1), and the digital value output from ADC1b is strictly ADC_V OUT (1 + ε2).

[0140] Substitute the digital value ADC_V temp (1 + ε1) into V in equation (2) temp , and substitute the digital value ADC_V OUT (1 + ε2) into V in equation (2) OUTSubstituting these values ​​gives equation (3). ADC1a and op-amp OP4, and ADC1b and op-amp OP5 are each located inside the MCU1. Therefore, the temperature drift errors ε1 and ε2 can be considered to be approximately the same. In other words, (1+ε1) and (1+ε2) in equation (3) are the same value. For this reason, the temperature drift errors cancel each other out in equation (3). The MCU1 calculates the resistance value R of the heater HTR using this calculation in equation (3). HTR The following is derived. The heater HTR has the characteristic that its resistance value changes depending on the temperature, therefore the resistance value R HTR By deriving this, the temperature of the heater HTR can be obtained.

[0141]

number

[0142] Thus, by performing the calculation in equation (3), the output voltage V OUT The temperature drift error that may occur (more precisely, the output voltage V OUT The temperature drift error that may occur in the output of the electronic components (op-amp OP5 and ADC1b) necessary to obtain the corresponding information, and the reference voltage V temp The temperature drift error that may occur (more precisely, the reference voltage V temp This can be used to cancel out the temperature drift error that may occur in the output of the electronic components (op-amp OP4 and ADC1a) necessary to obtain the corresponding information, and the resistance value R of the heater HTR. HTR This allows for more accurate derivation of the resistance value R of the heater HTR, without being affected by the temperature of the MCU1. HTR This makes it easier to derive.

[0143] In the example shown in Figure 20, the MCU1 contains separate operational amplifiers OP5 and ADC1b, and operational amplifiers OP4 and ADC1a. However, these may be shared. That is, the output voltage V OUT An operational amplifier and ADC for obtaining information, and a reference voltage V temp The operational amplifier and ADC are shared to obtain the information, and the digital value ADC_Vtemp (1+ε1) and the digital value ADC_V OUT A configuration in which (1+ε2) is obtained in time division may also be used. With this configuration, the temperature drift error occurring in these two digital values ​​can be matched more closely, and the resistance value R of the heater HTR can be adjusted. HTR This allows for more accurate derivation.

[0144] Furthermore, when switch S4 is ON, the potential of node N3 is approximately the same as the potential of node N1. Therefore, when switch S3 is OFF and switch S4 is ON, MCU1 sets the potential of node N1 to the reference voltage V temp This can be obtained and used to derive the resistance value of the heater HTR. Alternatively, if it is acceptable to allow increased power consumption by constantly supplying voltage to the positive power supply terminal of the operational amplifier OP1, the positive power supply terminal of the operational amplifier OP1 may be connected to node N1 instead of node N3, and node N1 may be connected to the voltage divider circuit Pb.

[0145] Figure 24 shows the current flow when both switches S3 and S4 are ON in the driving example EX2 of Figure 21. In the state shown in Figure 24, a first heating discharge path HR1 is formed through which current flows in the order of node N1, switch S3, node N2, node N7, heater HTR, node N8, switch S6, and ground; a second heating discharge path HR2 is formed through which current flows in the order of node N1, switch S3, node N2, node N4, and the gate terminal of switch S5; and a third detection discharge path MR3 is formed through which current flows in the order of node N1, reactor Ld, switch S4, node N3, and the positive power supply terminal of operational amplifier OP1.

[0146] In the state shown in Figure 24, nodes N3 and N4 are at almost the same potential, so almost no current flows through resistor Rs. Therefore, the power supply voltage of op-amp OP1 is the drive voltage V bst This means that in this state, the upper limit of the differential input value of the operational amplifier OP1 is the drive voltage V. bstThis becomes equal to the above. As a result, the output voltage of the operational amplifier OP1 becomes larger compared to the state shown in Figure 22. However, in this embodiment, the resistance ratio of the resistor R4 and the on-resistance of the switch S5 is determined so that in the state shown in Figure 24, the voltage input to terminal P9 of the MCU1 is less than or equal to the operating voltage of the MCU1 (system power supply voltage Vcc2). As a result, a voltage larger than the operating voltage is never input to terminal P9 of the MCU1. In other words, the operation of the MCU1 is stable.

[0147] Thus, in the suction device 100, as shown in Figure 22, during the period when switch S3 is on and switch S4 is off, the third heating discharge path HR3 drives the drive voltage V bst A voltage smaller than this can be supplied as the power supply voltage for the operational amplifier OP1. Also, as shown in Figure 23, during the period when switch S4 is on and switch S3 is off, the third detection discharge path MR3 provides the drive voltage V bst A voltage equivalent to this can be supplied as the power supply voltage for the operational amplifier OP1. Therefore, as shown in Figure 21, the power supply voltage can be continuously supplied to the operational amplifier OP1 during the period from when the heater HTR is started, when the heating is finished, and when the temperature detection of the heater HTR is finished (from the falling edge of the gate voltage of switch 3 to the rising edge of switch S4 immediately afterward). Therefore, compared to a reference example in which no power supply voltage is supplied to the operational amplifier OP1 during the ON period of switch S3 (heating period of the heater HTR), it is no longer necessary to wait for the power supply voltage of the operational amplifier OP1 to rise sufficiently during temperature detection control, and heating control and temperature detection control can be performed efficiently.

[0148] In particular, according to the driving example EX2, it becomes possible to supply the power supply voltage for the operational amplifier OP1, which is necessary for temperature detection control, while simultaneously performing heating control. As a result, the power supply voltage for the operational amplifier OP1 can be sufficiently raised when the heating control is completed, and compared to the driving example EX1, the resistance value of the heater HTR can be detected with high accuracy at an earlier timing after the heating of the heater HTR is completed.

[0149] In both the drive example EX1 and drive example EX2 shown in Figure 21, there may be a period between when switch S4 is turned off and when switch S3 is turned on during which the power supply voltage is not supplied to the operational amplifier OP1. However, the operation that takes place immediately after this period is heating control, and the operation of the operational amplifier OP1 is not essential. Therefore, it is not a problem if the power supply voltage is not supplied to the operational amplifier OP1 during this period. Moreover, since power consumption by the operational amplifier OP1 can be eliminated during this period, it can contribute to saving power for the entire suction device 100.

[0150] In the suction device 100 configured as described above, switches S3, S4, and S6 shown in Figure 20 each have preferred configurations. Preferred examples of each switch will be described below.

[0151] <Preferred configuration for switch S3> Switch S3 is preferably configured with a low on-resistance (in other words, a large chip size) in order to allow more current to flow to the heater HTR when heating it. In the following, when comparing the on-resistance values ​​of switches S3, S4, and S6, the comparison will be made under the condition that the temperature and the current flowing through them are the same.

[0152] Switch S3 is rapidly switched on and off by PWM control or PFM control when heating the heater HTR. For this reason, it is preferable that the maximum current value that can be output instantaneously (the maximum current value that can be output in a pulsed manner) is large. Also, from the viewpoint of supplying a large amount of current to the heater HTR and from the viewpoint of having a longer on time than switch S4, it is preferable that the maximum current value that can be continuously output by switch S3 is larger than that of switch S4. In the following, when comparing the maximum current values ​​that each of switches S3, S4, and S6 can output, the comparison will be made under the condition that the temperature is the same.

[0153] Switch S3 is preferably a P-channel MOSFET, as illustrated in Figure 20. Switch S3 can also be an N-channel MOSFET. However, if switch S3 is an N-channel MOSFET, the voltage supplied from terminal P16 of MCU1 to the gate terminal of switch S3 to turn on switch S3 is the drive voltage V bst The value needs to be larger than this, and the power supply voltage of MCU1 needs to be increased. In contrast, if switch S3 is configured with a P-channel MOSFET, the power supply voltage of MCU1 can be increased to the drive voltage V bst Because it can be reduced further, the power consumption of MCU1 can be lowered.

[0154] <Preferred configuration of switch S4> It is preferable that the on-resistance of switch S4 be small enough to apply a sufficiently large voltage to the series circuit of resistor Rs and heater HTR. However, if the on-resistance is too small, the size will increase, so in order to reduce the circuit area, it is preferable that the on-resistance of switch S4 be larger than that of switch S3. It is also preferable that the on-resistance of switch S4 not be too small so that the current used to detect the resistance of heater HTR does not change the temperature of heater HTR. Specifically, it is preferable that the on-resistance of switch S4 be smaller than the resistance of resistor Rs and larger than the on-resistance of switch 3.

[0155] As illustrated in Figure 21, the detection of the heater HTR's resistance value must be performed in a shorter time than the heating of the heater HTR. Furthermore, since switch S6 is always on in heating mode, its responsiveness does not need to be high. Therefore, it is preferable that the responsiveness of switch S4 is higher than that of switches S3 and S6. An indicator of transistor responsiveness is the turn-on time t. on , turn-on delay time t d(on) , rise time t r , turn-off time t off , turn-off delay time t d(off) , and descent time t f There is.

[0156] Turn-on delay time t d(on) This is the time required for the gate-source voltage to reach 10% of the set value and for the drain-source voltage to reach 90% of the set value during turn-on. Rise time t r This is the time required for the drain-source voltage to rise from 90% of the set value to 10% during turn-on. Turn-on time t on is the turn-on delay time t d(on) and rising time t r This is the sum of the values. Turn-off delay time t d(off) This is the time required for the gate-source voltage to reach 90% of the set value and for the drain-source voltage to reach 10% of the set value during turn-off. descent time t f This is the time required for the drain-source voltage to rise from 10% to 90% of the set value during turn-off. Turn-off time t off The turn-off delay time t d(off) and descent time t f This is the sum of the values.

[0157] The detection of the heater HTR's resistance value must be performed in a shorter time than the heating of the heater HTR. For this reason, it is preferable that the turn-on delay time or rise time of switch S4 is shorter than the turn-on delay time or rise time of switches S3 and S6, respectively. Similarly, it is preferable that the turn-off delay time or fall time of switch S4 is shorter than the turn-off delay time or fall time of switches S3 and S6, respectively.

[0158] Switch S4 is preferably a P-channel MOSFET, as illustrated in Figure 20. Switch S4 can also be an N-channel MOSFET. However, if switch S4 is an N-channel MOSFET, the voltage supplied from terminal P15 of MCU1 to the gate terminal of switch S4 to turn on the switch S4 is the drive voltage V bstThe value needs to be greater than this, which increases the power supply voltage of the MCU1. In contrast, if the switch S4 is configured with a P-channel MOSFET, the power supply voltage of the MCU1 can be increased to the drive voltage V bst Because it can be reduced further, the power consumption of MCU1 can be lowered.

[0159] <Preferred configuration of switch S6> Switch S6 is preferably configured with a low on-resistance (in other words, a large chip size) in order to allow more current to flow to the heater HTR when heating it. Specifically, it is preferable that the on-resistance of switch S6 be the same as that of switch S3.

[0160] Switch S6 needs to continuously supply current in heating mode. Therefore, it is preferable that the maximum current value that switch S6 can continuously output is greater than that of switches S4 and S3. On the other hand, since switch S6 is always on in heating mode, it is preferable that the maximum current value that switch S6 can instantaneously output (output in pulse form) be smaller than that of switch S3, which is repeatedly switched on and off. If the maximum current value that switch S6 can instantaneously output (output in pulse form) is made excessively large for the application of switch S6, the chip size and cost of switch S6 may increase.

[0161] Furthermore, since switch S3 is connected to a high-potential point in the circuit, it is more difficult to improve its responsiveness compared to switch S6 from a safety standpoint. Therefore, improving the responsiveness of switch S6 compared to switch S3 is effective in improving the overall responsiveness of the circuit. Specifically, it is preferable that the turn-off delay time or descent time of switch S6 is shorter than the turn-off delay time or descent time of switch S3. Similarly, it is preferable that the turn-on delay time or rise time of switch S6 is shorter than the turn-on delay time or rise time of switch S3.

[0162] Switch S6 is preferably an N-channel MOSFET, as illustrated in Figure 20. Switch S6 can also be configured as a P-channel MOSFET. However, if switch S6 is configured as a P-channel MOSFET, the voltage supplied from terminal P14 of MCU1 to the gate terminal of switch S6 must be less than ground level to turn on switch S6. Generating a voltage less than ground level requires dedicated circuits such as a negative power supply or rail splitter circuit. In contrast, if switch S6 is configured as an N-channel MOSFET, MCU1 can turn on switch S6 by inputting a voltage equivalent to its own power supply voltage to the gate terminal, thus reducing circuit complexity. Furthermore, if switch S6 is configured as an N-channel MOSFET, a high-level signal is input to the enable terminal EN of the boost DC / DC converter 9 simultaneously with the turn-on of switch S6, and the boost DC / DC converter 9 provides a drive voltage V bst This allows the output to be made. If switch S6 is configured with a P-channel MOSFET, it is necessary to connect a logic inverter between the enable terminal EN of the boost DC / DC converter 9 and the gate terminal of switch S6. However, by configuring switch S6 with an N-channel MOSFET, such an inverter can be eliminated, resulting in a reduction in circuit size and manufacturing costs.

[0163] Thus, it is preferable that switches S3, S4, and S6 each have different configurations. In this specification, different configurations of switches that include transistors mean that at least one of the following conditions is met: the type of transistor is different, or the specifications of the transistor (on-resistance, response, etc.) are different. By adopting such a configuration, the type and specifications of each switch can be tailored to the location to which they are connected, compared to the case where all three switches are of the same type and specifications. This improves the performance of the suction device 100.

[0164] In addition, in the circuit shown in Figure 20, it is also possible to omit switch S6 and connect node N8 directly to ground. Even in this case, by using different configurations for switches S3 and S4, the type and specifications of each switch can be tailored to the location to which they are connected, compared to the case where all two switches are of the same type and specifications. This improves the performance of the suction device 100.

[0165] <Preferred arrangement of electronic components> Next, preferred examples of the placement locations of the main electronic components on the receptacle mounting substrate 162 in the circuit shown in Figure 20 will be described.

[0166] Figure 25 is a plan view of the receptacle mounting substrate 162 as seen from the main surface 162a side. Figure 26 is a plan view of the receptacle mounting substrate 162 as seen from the sub-surface 162b side. As shown in Figure 25, the main surface 162a of the receptacle mounting substrate 162 is provided with the following electronic components shown in Figure 20: reactor Lc, resistor Rs, switch S4, switch S6, and heater connector Cn. As shown in Figure 26, the sub-surface 162b of the receptacle mounting substrate 162 is provided with the following electronic components shown in Figure 20: boost DC / DC converter 9, switch S3, resistor R Pb1 , and resistor R Pb2 A system will be established.

[0167] On the side surface 162b, resistor R Pb1 and resistor R Pb2 They are located in close proximity. Resistor R Pb1 and resistor R Pb2 This constitutes a voltage divider circuit Pb that divides the potential at node N3. Resistor R Pb1 and resistor R Pb2 When a temperature difference occurs, the voltage division ratio of the voltage divider circuit Pb fluctuates, and the accuracy of obtaining the potential of node N3, which is necessary to derive the resistance value of the heater HTR, decreases. As shown in Figure 26, resistor R Pb1 and resistor R Pb2 However, because it is mounted on the same side of the receptacle-mounted substrate 162 and is further positioned in close proximity, the resistor R Pb1and resistor R Pb2 This prevents temperature differences from occurring. To enhance this effect, among the electronic components mounted on the receptacle-mounted substrate 162, resistor R Pb1 The electronic component closest to it is the resistor R. Pb2 It is preferable to do so.

[0168] Among the electronic components shown in Figures 25 and 26, those that could be sources of heat or noise include switch S3, boost DC / DC converter 9, reactor Lc, and heater connector Cn. Of these, switch S3 generates the most heat, followed by boost DC / DC converter 9. In the example shown in Figures 25 and 26, the high-heat-generating switch S3 and boost DC / DC converter 9 are mounted on different sides of the same board, as are switch S4, switch S6, and resistor Rs. In other words, switch S3 and boost DC / DC converter 9 are mounted on the sub-side 162b, while switch S4, switch S6, and resistor Rs are mounted on the main side 162a. This prevents switch S4, switch S6, and resistor Rs from being affected by heat or noise from switch S3 and boost DC / DC converter 9.

[0169] Furthermore, in the example shown in Figure 25, when viewed in a direction perpendicular to the element mounting surface (main surface 162a and sub-surface 162b) of the receptacle mounting substrate 162, the switch S3 and boost DC / DC converter 9 are arranged so as not to overlap with the switches S4, S6, and resistor Rs. This arrangement makes it difficult for heat or noise generated by the switch S3 and boost DC / DC converter 9 to be transmitted to the switches S4, S6, and resistor Rs through the substrate. In other words, the influence of heat or noise from the switch S3 and boost DC / DC converter 9 on the switches S4, S6, and resistor Rs can be more strongly suppressed.

[0170] In the examples shown in Figures 25 and 26, for example, switch S4 or switch S6 may be mounted on the sub-surface 162b. This configuration also prevents either switch S4 or switch S6 from being affected by heat or noise from switch S3 and the boost DC / DC converter 9.

[0171] Furthermore, among the electronic components of the circuit shown in Figure 20, at least one of switches S4 and S6 may be mounted on a separate board from the receptacle mounting board 162 (for example, an MCU mounting board 161). This also prevents at least one of switches S4 and S6 from being affected by heat or noise from switch S3 and the boost DC / DC converter 9.

[0172] Figure 25 shows the distance DS4 (the length of the straight line connecting the two mounting areas by the shortest distance) between the mounting area on the main surface 162a where the resistor Rs is mounted and the mounting area on the main surface 162a where the reactor Lc is mounted. Also in Figure 25, the distance DS5 (the length of the straight line connecting the two mounting areas by the shortest distance) between the mounting area on the main surface 162a where the switch S4 is mounted and the mounting area on the main surface 162a where the reactor Lc is mounted is shown. Distance DS4 is shorter than distance DS5.

[0173] The resistance value of resistor Rs is less affected by temperature fluctuations compared to the on-resistance value of switch S4. Therefore, by placing resistor Rs, which is less affected by temperature changes, closer to reactor Lc than switch S4, the board area can be used more effectively.

[0174] Furthermore, in the example shown in Figure 25, a resistor Rs is mounted between the switch S4 and the reactor Lc. In other words, the mounting area of ​​the resistor Rs lies on the straight line connecting the mounting area of ​​the switch S4 and the mounting area of ​​the reactor Lc. In this way, the resistor Rs acts as a physical barrier protecting the switch S4 from the heat generated by the reactor Lc. As a result, the temperature change of the switch S4 can be strongly suppressed. If the on-resistance value of the switch S4 fluctuates, it will affect the measurement accuracy of the heater HTR's resistance value. Therefore, suppressing the temperature change of the switch S4 is particularly important.

[0175] Figure 27 is an enlarged view of the area H shown in Figure 25. As shown in Figure 27, on the main surface 162a of the receptacle mounting substrate 162, the mounting area of ​​the switch S4 and the mounting area of ​​the heater connector Cn are separated, but between them is the resistor R in the circuit shown in Figure 20. S4 and bipolar transistor T S4 This is implemented. In other words, resistors R are placed on the straight lines DL1 and DL2 that connect the mounting area of ​​switch S4 and the mounting area of ​​heater connector Cn. S4 and bipolar transistor T S4 This is implemented. According to this configuration, resistor R S4 and bipolar transistor T S4 However, this acts as a physical barrier protecting the switch S4 from the heat generated in the heater connector Cn. As a result, changes in the temperature of the switch S4 can be strongly suppressed.

[0176] Furthermore, as shown in Figures 25 and 27, the switch S4 is positioned near the outer edge of the main surface 162a of the receptacle mounting substrate 162. Specifically, on the main surface 162a of the receptacle mounting substrate 162, the distance DS1 between the mounting area of ​​the switch S4 and the nearest edge 162em, which is the edge 162e on the right side of the main surface 162a that is closest to the mounting area of ​​the switch S4, is shorter than the distance DS2 between the center in the left-right direction of the main surface 162a of the receptacle mounting substrate 162 and the mounting area of ​​the switch S4. In this way, by positioning the switch S4 near the edge of the receptacle mounting substrate 162, it is less susceptible to the effects of heat generated by other electronic components. In particular, as shown in Figure 27, by ensuring that there are no other electronic components between the nearest nearest edge 162em and the switch S4, in other words, by making the switch S4 the electronic component closest to the nearest nearest edge 162em on the receptacle mounting substrate 162, the temperature change of the switch S4 can be further suppressed.

[0177] Furthermore, in the example shown in Figure 27, the distance DS3 between the mounting area of ​​the resistor Rs on the main surface 162a of the receptacle-mounted substrate 162 and the edge 162en that is closest to the mounting area of ​​the resistor Rs among the edges 162e is greater than the distance DS1. As mentioned above, the resistor Rs is less affected by temperature changes than the switch S4. Therefore, by positioning the resistor Rs closer to the center of the receptacle-mounted substrate 162, the substrate area can be used effectively.

[0178] <Preferred form of switch S4> Switch S4 is ON when the voltage V applied between the gate and source is GS It is preferable to make the (absolute value) as high as possible. In other words, if the switch S4 is a P-channel type MOSFET, the voltage V applied between the gate and source when it is ON. GSIt is preferable to set this to the largest possible negative value. This is because it is possible to lower the on-resistance of switch S4, reduce Joule heating during on-state operation, and suppress temperature fluctuations of switch S4. Specifically, the maximum rated value (absolute value) of the voltage that can be applied between the gate and source of switch S4 is set to voltage V GSS The threshold voltage (absolute value) between the gate and source of switch S4 is set to voltage V th Therefore, MCU1 has a voltage V GS (Absolute value) is the voltage V GSS and voltage V th Of these, voltage V GSS It is preferable to control the voltage applied to the gate terminal of switch S4 so that it is close to the value V. GSS and voltage V GS The absolute value of the difference (absolute value) is the voltage V th and voltage V GS It is preferable to control the voltage applied to the gate terminal of switch S4 so that it is smaller than the absolute value of the difference with (absolute value).

[0179] Thus, voltage V GS To achieve a high absolute value, it is preferable to provide an overvoltage protection diode, such as a varistor, between the gate terminal and source terminal of switch S4. This overvoltage protection diode ensures that even if a surge voltage, potentially generated by switching in the boost DC / DC converter 9, is applied to switch S4, its value remains below the maximum rated value. As a result, switch S4 becomes less prone to failure, improving the durability of the suction device 100.

[0180] This specification contains at least the following information. Note that the components etc. in parentheses indicate those corresponding to the embodiments described above, but are not limited thereto.

[0181] (1) Power supply (power battery), A heater (heater HTR) that includes a positive and a negative terminal and consumes power supplied from the above power source to heat the aerosol source is connected to a heater connector (heater connector Cn) which includes a positive and a negative terminal, A first positive side circuit (a circuit including a series circuit of reactor Ld, switch S4, and resistor Rs, and wiring connecting this series circuit to nodes N1 and N2) is provided, with one end connected to the above-mentioned positive terminal, and includes a first positive side switch (switch S4) and a fixed resistor (resistor Rs). A second positive side circuit (including wiring connecting switch S3 to node N1 and node N2) is connected in parallel to the first positive side circuit, and includes a second positive side switch (switch S3) with one end connected to the above-mentioned positive terminal, The negative side switch (switch S6) connected to the above-mentioned negative terminal, The system includes a controller (MCU1) configured to perform predetermined control based on the voltage applied to the fixed resistor or heater connector when the first positive switch and the negative switch are ON, The first positive switch satisfies one or both of the following conditions: the first positive switch is different from at least one of the second positive switch and the negative switch; and the second positive switch is different from the negative switch. Power supply unit for an aerosol generator.

[0182] According to (1), compared to the case where all three switches are of the same type and specifications, the type and specifications of each switch can be made to suit the location to which they are connected. This makes it possible to improve the performance of the aerosol generator.

[0183] (2) (1) The power supply unit of the aerosol generating apparatus described above, The above-mentioned first positive switch includes a P-channel type MOSFET, The above second positive switch includes a P-channel MOSFET, The negative switch mentioned above includes an N-channel MOSFET. Power supply unit for an aerosol generator.

[0184] According to (2), a P-channel MOSFET suitable for high potential (positive control) is placed on the positive side, and an N-channel MOSFET suitable for low potential (negative control) is placed on the negative side. This improves the performance of the aerosol generator.

[0185] (3) (2) The power supply unit for the aerosol generating apparatus described above, A boost converter (boost DC / DC converter 9) whose output terminals are connected to the source terminal of a P-channel MOSFET included in the first positive switch and the source terminal of a P-channel MOSFET included in the second positive switch, The system includes a controller (MCU1) connected to the gate terminal of a P-channel MOSFET included in the first positive switch and the gate terminal of a P-channel MOSFET included in the second positive switch, The voltage input to the power terminal (power terminal VDD) of the above controller (system power supply voltage Vcc2) is the voltage output from the output terminal (VOUT) of the above boost converter (drive voltage V bst ) lower than Power supply unit for an aerosol generator.

[0186] According to (3), a boost converter can be used to apply a high voltage to the heater that provides excellent aerosol generation efficiency. Furthermore, even with a low-voltage, energy-saving controller, the gate / source voltages of the first and second positive switches can be easily set to the value required to turn the switches ON. As a result, both high performance and energy savings can be achieved simultaneously in the aerosol generation device.

[0187] (4) (2) or (3) A power supply unit for the aerosol generating apparatus described above, The output terminal (output terminal VOUT) is connected to the source terminals of the P-channel MOSFETs included in the first positive-side switch and the source terminals of the P-channel MOSFETs included in the second positive-side switch, and an enabling terminal (enable terminal EN) that outputs a voltage from the output terminal when a signal of a predetermined level is input is provided. A boost converter (boost DC / DC converter 9) is provided. The enabling terminal of the boost converter is connected to the gate terminal of the N-channel MOSFET included in the negative-side switch. A power supply unit for an aerosol generating device.

[0188] (4) According to this, the negative-side switch can be turned on and the boost converter can be started simultaneously. Therefore, the steps required to discharge to the heater are reduced, and the responsiveness of aerosol generation can be enhanced.

[0189] (5) A power supply unit for an aerosol generating device according to (4), The predetermined level is a high level. A power supply unit for an aerosol generating device.

[0190] ((The negative-side switch can be turned on and the boost converter can be started with the same signal, according to (5). In other words, it is not necessary to connect an inverter for logical inversion to the enabling terminal of the boost converter. Therefore, the cost of the aerosol generating device can be reduced while enhancing the responsiveness of aerosol generation.

[0191] (6) A power supply unit for an aerosol generating device according to (1), The second positive-side switch includes a transistor. The negative-side switch includes a transistor. The transistor included in the second positive-side switch has a difference other than the channel type from the transistor included in the negative-side switch. A power supply unit for an aerosol generating device.

[0192] According to (6), compared to the case where the second positive switch and the negative switch are of different types and have the same specifications, the specifications of each switch can be made to suit the location to which they are connected. Therefore, the performance of the aerosol generator can be improved.

[0193] (7) (6) The power supply unit for the aerosol generating apparatus described above, The maximum current that the transistor included in the negative switch can continuously output is greater than the maximum current that the transistor included in the second positive switch can continuously output. Power supply unit for an aerosol generator.

[0194] According to (7), even if two positive switches turn ON simultaneously due to some factor, and current is supplied to the negative switch from both of the two parallel-connected positive circuits, the negative switch is less likely to be damaged. This improves the durability of the aerosol generator.

[0195] (8) (6) or (7) A power supply unit for an aerosol generating apparatus, The above controller is configured to repeatedly switch the transistor included in the second positive switch ON and OFF while the transistor included in the negative switch is ON. The maximum current value that the transistor included in the negative switch can output in a pulsed manner is smaller than the maximum current value that the transistor included in the second positive switch can output in a pulsed manner. Power supply unit for an aerosol generator.

[0196] According to (8), even if a surge current is generated by repeatedly switching the second positive switch, the second positive switch is less likely to be damaged. As a result, the aerosol generator can be operated stably.

[0197] (9) A power supply unit for an aerosol generating apparatus described in any one of (6) to (8), The turn-off delay time of the transistor included in the second positive switch is longer than the turn-off delay time of the transistor included in the negative switch. and / or, The descent time of the transistor included in the second positive switch is longer than the descent time of the transistor included in the negative switch. Power supply unit for an aerosol generator.

[0198] Since the positive transistor is connected to a high-potential point in the circuit, it is difficult to improve its responsiveness from a safety standpoint. According to (9), the responsiveness of the negative transistor is higher than that of the positive transistor, so the responsiveness of the aerosol generation device as a whole can be improved.

[0199] (10) A power supply unit for an aerosol generating apparatus as described in any one of (6) to (9), The turn-on delay time of the transistor included in the second positive switch is longer than the turn-on delay time of the transistor included in the negative switch. and / or, The rise time of the transistor included in the second positive switch is longer than the rise time of the transistor included in the negative switch. Power supply unit for an aerosol generator.

[0200] Since the positive transistor is connected to a high-potential point in the circuit, it is difficult to improve its responsiveness from a safety standpoint. According to (10), the responsiveness of the negative transistor is higher than that of the positive transistor, so the responsiveness of the aerosol generation device as a whole can be improved.

[0201] (11) (1) The power supply unit of the aerosol generating apparatus described above, The first positive-side switch includes a P-channel type MOSFET, The second positive-side switch includes a P-channel type MOSFET, The P-channel type MOSFET included in the first positive-side switch is different from the P-channel type MOSFET included in the second positive-side switch. A power supply unit for an aerosol generating device.

[0202] (11) According to this, compared with the case where two positive-side switches are of the same type and the same specification, the specifications of each switch can be made according to the location where each is connected. Therefore, the performance of the aerosol generating device can be improved.

[0203] (12) A power supply unit for an aerosol generating device according to (11), The maximum current value that the P-channel type MOSFET included in the second positive-side switch can continuously output is larger than the maximum current value that the P-channel type MOSFET included in the first positive-side switch can continuously output. A power supply unit for an aerosol generating device.

[0204] (12) According to this, when generating aerosol, more current can be supplied to the heater through the second positive-side switch. Therefore, the amount of aerosol that can be generated is improved, and the commercial value of the aerosol generating device can be improved.

[0205] (13) A power supply unit for an aerosol generating device according to (11) or (12), The ON resistance value of the P-channel type MOSFET included in the second positive-side switch is lower than the ON resistance value of the P-channel type MOSFET included in the first positive-side switch. A power supply unit for an aerosol generating device.

[0206] According to (13), while reducing losses in the second positive switch, it is possible to supply power for aerosol generation to the heater with low loss, and the size of the first positive switch can be reduced. As a result, the aerosol generation efficiency of the aerosol generator can be improved while also being made smaller.

[0207] (14) (13) Power supply unit for the aerosol generating apparatus described above, The ON resistance of the P-channel MOSFET included in the first positive switch described above is lower than the electrical resistance of the fixed resistor described above. Power supply unit for an aerosol generator.

[0208] According to (14), a fixed resistor with a high resistance value can further reduce the current flowing through the first positive switch. This makes it possible to miniaturize the first positive switch, and thus further miniaturize the aerosol generator.

[0209] (15) A power supply unit for an aerosol generating apparatus described in any one of (11) to (14), The turn-on delay time of the P-channel MOSFET included in the first positive switch is shorter than the turn-on delay time of the P-channel MOSFET included in the second positive switch. and / or, The rise time of the P-channel MOSFET included in the first positive switch is shorter than the rise time of the P-channel MOSFET included in the second positive switch. Power supply unit for an aerosol generator.

[0210] According to (15), the voltage applied to the heater connector or fixed resistor can be obtained more quickly when executing a predetermined control. Therefore, the predetermined control can be executed with good responsiveness.

[0211] (16) (1) The power supply unit of the aerosol generating apparatus described above, The above first positive switch includes a transistor, The negative switch mentioned above includes a transistor, The transistor included in the first positive switch described above has differences from the transistor included in the negative switch described above, other than the channel type. Power supply unit for an aerosol generator.

[0212] According to (16), compared to the case where the first positive switch and the negative switch are of the same type and specifications, the specifications of each switch can be made according to the location to which they are connected. This makes it possible to improve the performance of the aerosol generator.

[0213] (17) (16) A power supply unit for the aerosol generating apparatus described above, The turn-on delay time of the transistor included in the first positive switch is shorter than the turn-on delay time of the transistor included in the negative switch. and / or, The rise time of the transistor included in the first positive switch is shorter than the rise time of the transistor included in the negative switch. Power supply unit for an aerosol generator.

[0214] According to (17), unlike negative switches, the responsiveness of the first positive switch, which does not carry a large current, can be improved. Therefore, the responsiveness of the aerosol generator as a whole can be improved to perform predetermined control.

[0215] (18) Power supply (power battery), A heater (heater HTR) that includes a positive and a negative terminal and consumes power supplied from the above power source to heat the aerosol source is connected to a heater connector (heater connector Cn) which includes a positive and a negative terminal, A first positive side circuit (a circuit including a series circuit of reactor Ld, switch S4, and resistor Rs, and wiring connecting this series circuit to nodes N1 and N2) is provided, with one end connected to the above-mentioned positive terminal, and includes a first positive side switch (switch S4) and a fixed resistor (resistor Rs). A second positive side circuit (including wiring connecting switch S3 to node N1 and node N2) is connected in parallel to the first positive side circuit, and includes a second positive side switch (switch S3) with one end connected to the above-mentioned positive terminal, The system includes a controller (MCU1) configured to perform predetermined control based on the voltage applied to the fixed resistor or heater connector when the first positive switch is ON, The first positive switch described above is different from the second positive switch described above. Power supply unit for an aerosol generator.

[0216] According to (18), compared to the case where the two switches are of the same type and specifications, the type and specifications of each switch can be made to suit the location to which they are connected. This makes it possible to improve the performance of the aerosol generator.

[0217] (19) (18) A power supply unit for the aerosol generating apparatus described above, The above-mentioned first positive switch includes a P-channel type MOSFET, The above second positive switch includes a P-channel MOSFET, The P-channel MOSFET included in the first positive switch described above is different from the P-channel MOSFET included in the second positive switch described above. Power supply unit for an aerosol generator.

[0218] According to (19), compared to the case where the two switches are of different types but have the same specifications, the specifications of each switch can be made to suit the location to which they are connected. This makes it possible to improve the performance of the aerosol generator.

[0219] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to these examples. It is clear to those skilled in the art that various modifications or alterations can be conceived within the scope of the claims, and these will naturally also fall within the technical scope of the present invention. Furthermore, the components of the above embodiments may be combined in any way without departing from the spirit of the invention.

[0220] This application is based on Japanese Patent Application No. 2021-079879 filed on May 10, 2021, and its contents are incorporated herein by reference. [Explanation of Symbols]

[0221] 100 Aspirator 1 MCU 9. Boost DC / DC Converter OP1 Operational Amplifier Lc, Ld reactor HTR Heater BAT power supply Cn Heater Connector S3, S4, S5, S6 Switch Rs, R4, R Pb1 , R Pb2 resistor D5 Parasitic Diode Nodes N1-N8 HR1 First heating discharge path HR2 Second heating discharge path HR3 Third heating discharge path MR1 First detection discharge path MR2 Second detection discharge path MR3 Third detection discharge path

Claims

1. Power supply and A heater connector including a positive and a negative terminal to which a heater that consumes power supplied from the aforementioned power source to heat the aerosol source is connected, A first fixed resistor, one end of which is connected to the positive terminal of the heater connector, An operational amplifier including a positive power supply terminal connected to the positive terminal of the heater connector, a negative power supply terminal, a non-inverting input terminal connected between one end of the first fixed resistor and the positive terminal of the heater connector, an inverting input terminal connected to the negative terminal of the heater connector, and an output terminal. A controller including an input terminal connected to the output terminal of the operational amplifier, a power supply terminal, and a ground terminal connected to ground, The system includes a clamp circuit connected to the output terminal of the operational amplifier, which prevents the voltage output from the output terminal of the operational amplifier and input to the input terminal of the controller from exceeding a predetermined value. In a discharge state in which current is supplied from the power supply to the first fixed resistor and then to the heater in that order, the voltage applied between the positive power supply terminal and the negative power supply terminal of the operational amplifier is higher than the voltage applied between the power supply terminal and the ground terminal of the controller. The controller is configured to control the supply of power from the power supply to the heater based on the input to the input terminal. Power supply unit for an aerosol generator.

2. A power supply unit for an aerosol generating apparatus according to claim 1, The clamp circuit includes a clamp switch with control terminals for controlling opening and closing, The control terminal of the clamp switch is connected between one end of the first fixed resistor and the positive terminal of the heater connector. Power supply unit for an aerosol generator.

3. A power supply unit for an aerosol generating apparatus according to claim 1, A second fixed resistor is provided, with one end connected to the output terminal of the operational amplifier and the other end connected to the input terminal of the controller. The clamp circuit includes an N-channel MOSFET, The gate terminal of the N-channel MOSFET is connected between one end of the first fixed resistor and the positive terminal of the heater connector. The source terminal of the aforementioned N-channel MOSFET is connected to ground. The drain terminal of the N-channel MOSFET is connected between the other end of the second fixed resistor and the input terminal of the controller. Power supply unit for an aerosol generator.

4. A power supply unit for an aerosol generating apparatus according to claim 3, The resistance value of the second fixed resistor is higher than the ON resistance value of the N-channel MOSFET. Power supply unit for an aerosol generator.

5. A power supply unit for an aerosol generating apparatus according to claim 4, The clamp circuit includes a parasitic diode having an anode connected to the source terminal of the N-channel MOSFET and a cathode connected to the drain terminal of the N-channel MOSFET. Power supply unit for an aerosol generator.

6. A power supply unit for an aerosol generating apparatus according to any one of claims 2 to 5, A first positive switch, which includes a control terminal for controlling opening and closing and is connected between the other end of the first fixed resistor and the power supply, A second positive switch is connected between one end of the first fixed resistor and the power supply, It includes a sensor that outputs a user's aerosol generation request, The controller is configured to close the second positive switch based on the aerosol generation request. Power supply unit for an aerosol generator.

7. A power supply unit for an aerosol generating apparatus according to claim 6, When the second positive switch is ON, the voltage applied between the positive and negative power supply terminals of the operational amplifier is lower than the voltage applied between the positive and negative power supply terminals of the operational amplifier when the first positive switch is closed. When the first positive switch is closed, the voltage applied between the positive and negative power supply terminals of the operational amplifier is higher than the voltage applied between the power supply terminal and the ground terminal of the controller. Power supply unit for an aerosol generator.

8. A power supply unit for an aerosol generating apparatus according to claim 7, The clamp circuit functions only when the second positive switch is closed. Power supply unit for an aerosol generator.

9. A power supply unit for an aerosol generating apparatus according to any one of claims 6 to 8, The controller is configured to alternately turn ON the first positive switch and the second positive switch. Power supply unit for an aerosol generator.

10. A power supply unit for an aerosol generating apparatus according to any one of claims 6 to 8, The controller is configured to output a signal to the control terminal of the other positive switch to turn on the other positive switch when one of the first positive switch and the second positive switch is ON. Power supply unit for an aerosol generator.

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