Resin compositions, resin composition varnishes, and prepregs

The resin composition, combining a vinyl aromatic copolymer and polyphenylene ether with controlled molecular weights and OH groups, addresses brittleness and adhesion issues in PPE, resulting in improved dielectric performance for 5G printed circuit boards.

JP7882688B2Active Publication Date: 2026-06-30ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ASAHI KASEI KOGYO KABUSHIKI KAISHA
Filing Date
2022-05-23
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing polyphenylene ether (PPE) compositions used in printed circuit boards face challenges with brittleness, adhesiveness, and reduced dielectric properties due to molecular weight reduction for 5G applications, necessitating improved resin compositions for better dielectric performance.

Method used

A resin composition comprising a vinyl aromatic copolymer with specific molecular weight and structural unit proportions, combined with polyphenylene ether having controlled OH groups and molecular weight, along with optional additives, to enhance dielectric properties and adhesion.

Benefits of technology

The composition achieves a printed wiring board with excellent dielectric characteristics, improved adhesion, and enhanced heat resistance, suitable for 5G applications.

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Patent Text Reader

Abstract

To provide a resin composition which allows a printed wiring board excellent in dielectric characteristics to be obtained, and a prepreg containing the same.SOLUTION: The resin composition of the present invention contains (A) a vinyl aromatic copolymer and (B) a polyphenylene ether. The vinyl aromatic copolymer (A) has a structural unit derived from a divinyl aromatic compound and a structural unit derived from a monovinyl aromatic compound. The ratio of the structural unit derived from the monovinyl aromatic compound is 55-95 mol%, the ratio of the structural unit derived from the divinyl aromatic compound is 5-45 mol%, and the number average molecular weight of the vinyl aromatic copolymer (A) is 2,000-8,000. The number of OH groups of the polyphenylene ether (B) is 20-900 μmol / g, and the weight average molecular weight thereof is 10,000-50,000.SELECTED DRAWING: None
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