Dicing apparatus and method for controlling the dicing apparatus

Abstract

To provide a dicing device which can discover an insegmentation failure of a die attaching film, and provide a control method of the dicing device.SOLUTION: A dicing device 10 that performs dicing processing of a street of a workpiece W adhered to a dicing tape 9 via a die attaching film (DAF7), and cuts the workpiece W and the die attaching film along the street, provides: a cross sectional profile acquisition part (a white interference microscope 24 and a processing part 64) that acquires a cross sectional profile of a processing groove 19 formed by dicing processing; a cutting amount detection part 72 that detects a cutting amount Δd to the die attaching film by the dicing processing on the basis of the cross sectional profile acquired by the cross sectional profile acquisition part; and a segmentation determination part 74 that determines whether the die attaching film is in the insegmentation state on the basis of the cutting amount detected by the cutting amount detection part 72.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a dicing device for dicing a street of a work piece attached to a dicing tape via a die attach film, and a control method for the dicing device.

Background Art

[0002] In a work piece such as a semiconductor wafer, a plurality of devices are partitioned in a lattice pattern by lattice-shaped streets. By dividing this work piece along the streets, individual devices are manufactured. As a dicing device for dividing a work piece into a plurality of devices (chips), a blade dicing machine is well known (see Patent Document 1). In this blade dicing machine, a work piece attached to a dicing tape via a die attach film is set. Then, the blade dicing machine forms a processing groove along the street with the blade that rotates at high speed relative to the work piece while relatively moving the blade that rotates at high speed with respect to the work piece, that is, performs dicing processing (cutting processing) for dividing the work piece and the die attach film along the street.

[0003] The dicing device of Patent Document 1 measures the shape of the processing groove by the white light interference method using a white light interference microscope. Further, in the dicing devices described in Patent Documents 2 and 3, in addition to the white light interference microscope, the shape of the processing groove is measured using various three-dimensional shape measurement units such as a laser displacement meter or a confocal microscope. Thereby, the quality and position accuracy of the processing groove can be confirmed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

[0005] A workpiece diced using the dicing apparatus described in Patent Document 1 is divided into individual chips by the expansion of the dicing tape in a known expansion process. Then, the individual chips are picked up in a known pickup process. At this time, the dicing apparatus described in each of the above patent documents uses various three-dimensional shape measuring units to control the shape of the processed groove, but there is a risk that the die attach film may not be completely cut (divided) by the dicing process, resulting in an undivided state. In this case, a large number of undivided die attach films will be produced in the pickup process, so it is desirable to detect the undivided die attach film defects in advance.

[0006] This invention has been made in view of these circumstances, and aims to provide a dicing apparatus capable of detecting defects in undivided die-attach films and a method for controlling the dicing apparatus. [Means for solving the problem]

[0007] A dicing apparatus for achieving the objectives of the present invention is a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and die attach film along the street, comprising: a cross-sectional profile acquisition unit that acquires a cross-sectional profile of a processed groove formed by the dicing process; a cut amount detection unit that detects the amount of cut into the die attach film by the dicing process based on the cross-sectional profile acquired by the cross-sectional profile acquisition unit; and a division determination unit that determines whether or not the die attach film is in an undivided state and has not been completely cut based on the cut amount detected by the cut amount detection unit.

[0008] This dicing device can detect undivided sections of the die-attach film.

[0009] In another embodiment of the present invention, the dicing apparatus includes a cross-sectional profile acquisition unit comprising: a white light interference microscope that splits white light into a measuring light and a reference light, irradiates the measuring light toward the processing groove, and captures the interference light between the measuring light reflected by the processing groove and the reference light reflected by the reference surface to output an interference signal; a scanning mechanism that scans the white light interference microscope relative to the surface of the workpiece in a direction perpendicular to the surface; and a cross-sectional profile calculation unit that calculates the cross-sectional profile based on the interference signal output from the white light interference microscope during scanning by the scanning mechanism. This makes it possible to acquire the cross-sectional profile of the processing groove.

[0010] In another embodiment of the present invention, a dicing apparatus determines whether or not the die attach film is in an undivided state based on whether or not the amount of cut detected by the cut amount detection unit is less than a predetermined threshold. This makes it possible to detect the undivided state of the die attach film.

[0011] In another embodiment of the present invention, a dicing apparatus determines whether or not the die attach film is in an undivided state based on the amount of cut detected by the cut amount detection unit and the signal intensity of the interference signal obtained from the bottom of the processed groove among the interference signals output from the white light interference microscope. This improves the accuracy of the determination of whether or not the die attach film is in an undivided state.

[0012] A dicing apparatus for achieving the objectives of the present invention is a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and die attach film along the street, comprising: a white light interference microscope that splits white light into a measuring light and a reference light, irradiates the measuring light toward a processing groove formed by the dicing process, and captures the interference light of the measuring light reflected from the processing groove and the reference light reflected from the reference surface to output an interference signal; a scanning mechanism that scans the white light interference microscope relative to the surface of the workpiece in a direction perpendicular to the surface; and a division determination unit that determines whether the die attach film is in an undivided state and has not been completely cut, based on the signal intensity of the interference signal obtained from the bottom surface of the processing groove among the interference signals output from the white light interference microscope during scanning by the scanning mechanism.

[0013] This dicing device reduces the processing load required to determine whether or not the die-attach film is in an undivided state, allowing the determination to be made in a short amount of time.

[0014] In another embodiment of the present invention, a dicing apparatus is provided that includes a notification unit that notifies a warning when a separation determination unit determines that the die attach film is in an undivided state. This allows the operator to be notified of the occurrence of an undivided state in the die attach film, thereby preventing the workpiece from being transported to a subsequent process after dicing, i.e., preventing the workpiece from becoming defective in the subsequent process.

[0015] In another embodiment of the present invention, a dicing apparatus comprises a processing unit that performs dicing, and a processing control unit that controls the processing unit to perform dicing on the die attach film in the undivided state when the division determination unit determines that the film is in an undivided state. This eliminates the undivided state of the die attach film, thereby preventing the workpiece from becoming defective in subsequent processes.

[0016] A control method for a dicing apparatus to achieve the object of the present invention is a control method for a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and die attach film along the street, comprising: a cross-sectional profile acquisition step of acquiring a cross-sectional profile of a processed groove formed by the dicing process; a cut amount detection step of detecting the amount of cut into the die attach film by the dicing process based on the cross-sectional profile acquired in the cross-sectional profile acquisition step; and a division determination step of determining whether or not the die attach film is in an undivided state and has not been completely cut based on the cut amount detected in the cut amount detection step.

[0017] A control method for a dicing apparatus to achieve the object of the present invention is a control device for a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and die attach film along the street, comprising: a scanning step of scanning a white light interference microscope in a direction perpendicular to the surface of the workpiece, which splits white light into a measuring light and a reference light, irradiates the measuring light toward a processing groove formed by the dicing process, and images the interference light of the measuring light reflected from the processing groove and the reference light reflected from the reference surface to output an interference signal; and a division determination step of determining whether the die attach film is in an undivided state and has not been completely cut, based on the signal intensity of the interference signal obtained from the bottom surface of the processing groove among the interference signals output from the white light interference microscope during scanning of the white light interference microscope. [Effects of the Invention]

[0018] This invention can detect defects in die attachment films that have not been properly separated. [Brief explanation of the drawing]

[0019] [Figure 1] This is a perspective view of the dicing apparatus according to the first embodiment. [Figure 2] These are cross-sectional views of the workpiece before and after dicing. [Figure 3] It is an external perspective view of the processing section. [Figure 4] It is a cross-sectional view showing an example of a white interference microscope. [Figure 5] It is a block diagram of the dicing device of the first embodiment. [Figure 6] It is an explanatory diagram for explaining the detection of the cutting amount of the DAF (die attach film) by the cutting amount detection unit and the determination of the presence or absence of the uncut state by the segmentation determination unit. [Figure 7] It is a table showing an example of the detection result of the cutting amount detected by the cutting amount detection unit. [Figure 8] It is an explanatory diagram for explaining the notification of warning information by the notification control unit. [Figure 9] It is a flowchart showing the flow of the dicing process of the workpiece by the dicing device of the first embodiment, particularly the confirmation process of the uncut state of the DAF. [Figure 10] It is a block diagram of the dicing device of the second embodiment. [Figure 11] It is an explanatory diagram for explaining the generation of two-dimensional projection data by the projection data generation unit. [Figure 12] It is an explanatory diagram for explaining the calculation of the cross-sectional profile 86 of the processing groove by the cross-sectional profile calculation unit of the second embodiment. [Figure 13] It is a block diagram of the dicing device of the third embodiment. [Figure 14] It is an explanatory diagram for explaining the relationship between the signal intensity of the interference signal and the material at the bottom of the processing groove. [Figure 15] It is a block diagram of the dicing device of the fourth embodiment. <00001-10> [Figure 16] It is an explanatory diagram for explaining the problems when the thickness of the workpiece is thick. [Figure 17] It is an explanatory diagram for explaining the detection location of the cutting amount when the thickness of the workpiece is thick. [Figure 18] It is a diagram showing an example of the cross-section of the processing groove at the detection location Q shown in FIG. 17. [Modes for carrying out the invention]

[0020] [First Embodiment] Figure 1 is a perspective view of the dicing apparatus 10 of the first embodiment. Figure 2 is a cross-sectional view of the workpiece W before dicing (see reference numeral 2A) and after dicing (see reference numeral 2B). Note that the XYZ directions in the figures are mutually orthogonal directions, with the XY direction being parallel to the horizontal direction and the Z direction being perpendicular to the horizontal direction (the vertical direction in this invention).

[0021] As shown in Figure 1, the dicing apparatus 10 performs dicing on a flat workpiece W such as a silicon wafer (semiconductor wafer). This dicing apparatus 10 includes a load port 12, a transport mechanism 14, a processing section 16, and a cleaning section 18.

[0022] A cassette containing numerous workpieces W mounted on a frame F is placed on the load port 12. The transport mechanism 14 transports the workpieces W. The processing unit 16 performs dicing of the workpieces W. The cleaning unit 18 spin-cleans the diced workpieces W. Inside the housing 10A of the dicing device 10, there is a control device 60 (see Figure 5) and the like that controls the operation of each part of the dicing device 10. The control device 60 may also be located outside the housing 10A.

[0023] The unprocessed workpiece W, stored in a cassette placed on the load port 12, is transported to the processing section 16 by the transport mechanism 14, where it is cut or diced (grooved) to separate into individual chips. The processed workpiece W from the processing section 16 is then transported to the cleaning section 18 by the transport mechanism 14, where it is cleaned, and then transported back to the load port 12 by the transport mechanism 14 and stored in the cassette.

[0024] As shown by reference numerals 2A and 2B in Figure 2, the dicing apparatus 10 performs dicing along streets (not shown) formed in a grid pattern on the workpiece W, thereby forming processing grooves 19 along each street. In addition, a dicing tape 9 (also called a base material) is attached to the back surface of the workpiece W opposite to the surface (device formation surface) via a die attach film (DAF7) and an adhesive layer 8. The materials and types of DAF7, adhesive layer 8, and dicing tape 9 are not particularly limited as long as they are those used in known semiconductor manufacturing processes.

[0025] Figure 3 is an external perspective view of the processing unit 16. As shown in Figure 3 and Figure 2 described above, the processing unit 16 is a twin-spindle dicer and comprises a pair of blades 21A, 21B, a blade cover (not shown), a pair of spindles 22A, 22B, a microscope 23, a white light interference microscope 24, and a table 31.

[0026] Blades 21A and 21B are formed in a disc shape. The tip shape of blades 21A and 21B, that is, the cross-sectional shape of the outer circumference (cutting edge) of blades 21A and 21B along the radial direction, is rectangular (other shapes such as V-shape are also acceptable). Blades 21A and 21B are arranged opposite each other in the Y direction and are held on spindles 22A and 22B so as to be rotatable around blade rotation axes parallel to the Y direction.

[0027] The spindles 22A and 22B have built-in high-frequency motors that rotate the blades 21A and 21B at high speed around the blade rotation axis. As a result, each street of the workpiece W is diced (cut) by the blades 21A and 21B from the surface (device formation surface) side of the workpiece W. Consequently, the workpiece W and DAF7 are cut along each street, forming the processed groove 19 (see reference numeral 2B in Figure 2).

[0028] The microscope 23 is mounted on the Z carriage 44, for example, integrally with the spindle 22A (or spindle 22B), and is held by the Y carriage 43 and Z carriage 44 so as to be movable in the YZ direction integrally with the spindle 22A. The microscope 23 photographs the surface pattern and machining grooves 19 of the workpiece W from the surface side of the workpiece W. The images of the workpiece W surface captured by this microscope 23 are used for kerf checking to confirm the alignment of the blades 21A and 21B with respect to the street of the workpiece W, and the position of the machining grooves 19.

[0029] The white light interference microscope 24 is mounted on the Z carriage 44 integrally with the spindle 22B (or spindle 22A), and is held to move freely in the YZ direction by the Y carriage 43 and the Z carriage 44. The white light interference microscope 24 is used to acquire a group of three-dimensional coordinate data (also called point cloud data) representing the shape (three-dimensional shape) of the machined groove 19. The group of three-dimensional coordinate data is used to calculate the cross-sectional profile of the machined groove 19 and to confirm the undivided state of the DAF7.

[0030] In this embodiment, the microscope 23 and the white light interference microscope 24 are provided separately, but they may be integrated into a single unit.

[0031] The table 31 has a porous workpiece holding surface 31a, which holds the workpiece W from the back side via a dicing tape 9 or the like. The table 31 is held to move freely in the X direction by the X carriage 36 described later, and is also held to rotate freely around the rotation axis CA by the rotation unit 37 described later.

[0032] The machining section 16 is provided with an X-base 32, an X-guide 34, an X-drive unit 35, an X-carriage 36, and a rotary unit 37. The X-base 32 has a flat plate shape extending in the X direction, and the X-guide 34 is provided on its upper surface in the Z direction. The X-guide 34 has a shape extending in the X direction and guides the X-carriage 36 along the X direction. The X-drive unit 35 uses an actuator such as a linear motor to move the X-carriage 36 in the X direction along the X-guide 34.

[0033] The rotating unit 37 is provided on the upper surface of the X carriage 36. A table 31 is also provided on the upper surface of the rotating unit 37. The rotating unit 37 is rotationally driven by a rotational drive unit (not shown) consisting of a motor and gears, etc. As a result, the rotating unit 37 rotates the table 31 in the θ direction about its rotation axis CA.

[0034] Furthermore, the machining section 16 is provided with a Y base 41, a Y guide 42, a pair of Y carriages 43, and a pair of Z carriages 44. The Y base 41 has a gate-like shape that straddles the X base 32 in the Y direction. A Y guide 42 is provided on the X-side of the Y base 41. The Y guide 42 has a shape that extends in the Y direction and guides the pair of Y carriages 43 along the Y direction. The pair of Y carriages 43 are moved independently along the Y guide 42 by a Y drive unit 45 (see Figure 5), which is composed of, for example, a stepping motor and a ball screw.

[0035] Each of the pair of Y carriages 43 is provided with a Z carriage 44 that is movable in the Z direction via a Z drive unit 46 (corresponding to the scanning mechanism of the present invention, see Figure 5), which is composed of an actuator such as a stepping motor. One of the Z carriages 44 is provided with a spindle 22A and a microscope 23, and the other of the Z carriages 44 is provided with a spindle 22B and a white light interference microscope 24.

[0036] During the dicing process of the workpiece W, the machining unit 16 is driven to perform cutting feed of the workpiece W in the X direction (machining feed direction), indexing feed of the blades 21A and 21B in the Y direction, and cutting feed in the Z direction, thereby forming machining grooves 19 along each street of the workpiece W.

[0037] Figure 4 is a cross-sectional view showing an example of a white light interference microscope 24 that functions as part of the cross-sectional profile acquisition unit of the present invention. As shown in Figure 4, the white light interference microscope 24 is a Mirau-type white light interferometer and is used for measuring the cross-sectional profile of the machined groove 19 by white light interferometry and for confirming the undivided state of the DAF 7 based on the measurement results. This white light interference microscope 24 comprises a housing 50, a white light source 51, a first beam splitter 52, an objective lens 53, a glass plate 54, a second beam splitter 55, and an imaging unit 56.

[0038] The housing 50 houses the first beam splitter 52, the objective lens 53, the glass plate 54, and the second beam splitter 55. Inside the housing 50, the second beam splitter 55, the glass plate 54, the objective lens 53, and the first beam splitter 52 are arranged from the lower side to the upper side in the Z direction. A white light source 51 is mounted on the side of the housing 50, to the side of the first beam splitter 52. Furthermore, an imaging unit 56 is mounted on the top surface of the housing 50, to the upper side of the first beam splitter 52.

[0039] The white light source 51 emits white light L1 toward the first beam splitter 52 while the white interference microscope 24 is scanned perpendicularly in the Z direction relative to the table 31 (workpiece W). The first beam splitter 52 reflects a portion of the white light L1 incident from the white light source 51 toward the objective lens 53. The first beam splitter 52 also transmits a portion of the interference light L4, described later, incident from the objective lens 53 toward the imaging unit 56.

[0040] The objective lens 53 focuses the white light L1 incident from the first beam splitter 52 onto the workpiece W.

[0041] The glass plate 54 is equipped with a mirror 54a in its center that functions as a reference surface. The glass plate 54 (excluding the mirror 54a) transmits the white light L1 incident from the objective lens 53 directly and emits it towards the second beam splitter 55.

[0042] The second beam splitter 55 splits the white light L1 focused by the objective lens 53 into measurement light L2 and reference light L3. It transmits the measurement light L2 towards the surface of the workpiece W and reflects the reference light L3 towards the mirror 54a. The measurement light L2 that has passed through the second beam splitter 55 is reflected by the surface of the workpiece W and the surface of the processed groove 19 (groove wall and groove bottom) and enters the second beam splitter 55. The reference light L3 reflected by the mirror 54a also enters the second beam splitter 55, where a portion of it is reflected. This generates interference light L4 between the measurement light L2 and the reference light L3. This interference light L4 enters the imaging unit 56 via the glass plate 54, the objective lens 53, and the first beam splitter 52.

[0043] Here, the optical path length of the reference light L3 is constant, but the optical path length of the measurement light L2 changes according to the vertical scanning of the white light interference microscope 24. As is well known, when the focus of the objective lens 53 is aligned with various objects to be measured [here, the workpiece W and the surface of the machined groove 19], the difference in optical path lengths between the measurement light L2 and the reference light L3 becomes zero (including nearly zero), and the interference between the measurement light L2 and the reference light L3 reinforces. As a result, the signal intensity of the interference light L4 increases.

[0044] The imaging unit 56 is equipped with a two-dimensional image sensor of the CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) type, in which multiple pixels (photodetectors) are arranged in a two-dimensional array in the XY direction. While the white light interference microscope 24 is scanned vertically in the Z direction once or multiple times by the Z drive unit 46 (see Figure 5), the imaging unit 56 captures the interference light L4 incident from the first beam splitter 52 for each pixel of the two-dimensional image sensor, thereby detecting (acquiring) the interference light L4 for each pixel and outputting the interference light L4 for each pixel to the control device 60.

[0045] In this embodiment, a Miller-type interferometer was used as an example of the white light interference microscope 24, but various interferometers (interferometers) used for measuring the shape of various objects to be measured, such as a Michelson-type interferometer, may also be used.

[0046] Figure 5 is a block diagram of the dicing apparatus 10 according to the first embodiment. Note that in Figure 5, components of the dicing apparatus 10 that are not related to the confirmation of the undivided state of the DAF7 described later have been omitted from the illustration (see Figures 10, 13, and 15 described later).

[0047] As shown in Figure 5, the control device 60 of the dicing device 10 controls all parts of the dicing device 10. In addition to the load port 12, transport mechanism 14, processing unit 16, and cleaning unit 18 (all parts except the processing unit 16 are not shown in Figure 5), the control device 60 is connected to a storage unit 48 and a monitor 49.

[0048] The storage unit 48 uses various known storage media such as memory. In addition to the operation program (not shown) for operating the control device 60, the storage unit 48 stores a threshold value 75 that is used to determine the undivided state of the DAF7, which will be described later.

[0049] The monitor 49 uses a known display device such as a liquid crystal display and displays various operation screens and setting screens of the dicing device 10, as well as warning information 78 (see Figure 8), which will be described later.

[0050] The control device 60 may be a PC (Personal Computer), for example, and may include an arithmetic circuit composed of various processors and memory. These various processors include CPUs (Central Processing Units), GPUs (Graphics Processing Units), ASICs (Application Specific Integrated Circuits), and programmable logic devices [e.g., SPLDs (Simple Programmable Logic Devices), CPLDs (Complex Programmable Logic Devices), and FPGAs (Field Programmable Gate Arrays)]. The various functions of the control device 60 may be implemented by a single processor, or by multiple processors of the same or different types.

[0051] The control device 60 functions as a device control unit 62 and a processing unit 64 by executing a control program (not shown). The control device 60 functions as a cross-sectional profile acquisition unit of the present invention together with the white light interference microscope 24 and Z drive unit 46 described above.

[0052] When dicing the workpiece W, the device control unit 62 controls each part of the machining unit 16 (each drive unit 35, 45, 46, microscope 23, and spindles 22A, 22B, etc.) to perform a known alignment, and then performs cutting along each street to form the machining grooves 19 (cutting of the workpiece W and DAF7). Since the specific method of dicing is publicly known, a detailed explanation is omitted here (see, for example, Japanese Patent Application Publication No. 2020-37171).

[0053] Furthermore, after dicing one or more streets or all streets of the workpiece W, the device control unit 62 controls each part of the machining unit 16 (each drive unit 35, 45, 46 and the white light interference microscope 24, etc.) to perform shape measurement of the machined groove 19 using a known white light interference method.

[0054] For example, the device control unit 62 controls the drive units 35, 45, and 46 to adjust the position of the white interference microscope 24 relative to the workpiece W so that the white interference microscope 24 is positioned above the machining groove 19 in the Z direction. Next, the device control unit 62 controls the Z drive unit 46 to vertically scan the white interference microscope 24 in the Z direction, while continuously emitting white light L1 from the white light source 51, and capturing interference light L4 and outputting interference signals by the imaging unit 56. While the vertical scanning of the white interference microscope 24 is being performed, interference signals are continuously output from the two-dimensional image sensor of the imaging unit 56 to the control device 60 for each pixel. Then, the device control unit 62 repeatedly changes the position of the white interference microscope 24 in the XY direction relative to the workpiece W, performs vertical scanning of the white interference microscope 24, and captures interference light L4 and outputs interference signals by the imaging unit 56 so that the shape of the machining groove 19 is measured for any street of the workpiece W.

[0055] Furthermore, if the DAF7 is determined to be undivided by the division determination unit 74 (described later), the device control unit 62 controls each part of the processing unit 16 (each drive unit 35, 45, 46, microscope 23, and spindles 22A, 22B, etc.) to perform dicing (reprocessing) of the undivided DAF7. In this case, the device control unit 62 functions as the processing control unit of the present invention.

[0056] The processing unit 64 calculates the cross-sectional profile of the machining groove 19 based on the interference signal output for each pixel from the two-dimensional image sensor of the imaging unit 56 during the vertical scanning of the white interference microscope 24, and further determines whether or not the DAF 7 is in an undivided state based on this cross-sectional profile. This processing unit 64 functions as a coordinate data acquisition unit 66, a three-dimensional data generation unit 68, a cross-sectional profile calculation unit 70, a cut depth detection unit 72, a division determination unit 74, and a notification control unit 76.

[0057] The coordinate data acquisition unit 66 acquires a group of three-dimensional coordinate data consisting of multiple three-dimensional coordinate data (XYZ coordinate data) representing the three-dimensional shape of the processed groove 19, based on interference signals output for each pixel (XY coordinate) from the two-dimensional image sensor of the imaging unit 56 during vertical scanning of the white light interference microscope 24, using a known method (see Patent Document 1 above).

[0058] The 3D data generation unit 68 generates 3D data (3D model) of the machining groove 19 using a known method based on the 3D coordinate data group of the machining groove 19 acquired by the coordinate data acquisition unit 66 (see Patent Document 1 above).

[0059] The cross-sectional profile calculation unit 70 calculates the cross-sectional profile of the machined groove 19 (see Figure 12) by cutting out an arbitrary cross-section or a cross-section specified by the user from the 3D data of the machined groove 19 generated by the 3D data generation unit 68.

[0060] Figure 6 is an explanatory diagram illustrating the detection of the cutting depth Δd of the DAF7 by the cutting depth detection unit 72 and the determination of whether or not the DAF7 is in an undivided state by the division determination unit 74. In Figure 6, reference numeral 6A indicates a state in which the DAF7 is completely cut (divided) by the dicing process, and reference numeral 6B indicates a state in which the DAF7 is undivided by the dicing process.

[0061] As shown by reference numerals 6A and 6B in Figure 6 and in Figure 5 described above, the depth of cut detection unit 72 detects the amount of cut Δd in the Z direction into the DAF7 by dicing, based on the cross-sectional profile of the machined groove 19 calculated by the cross-sectional profile calculation unit 70. This amount of cut Δd is the depth of cut in the Z direction from the surface of the DAF7 (the side facing the workpiece W) to the DAF7 (including the adhesive layer 8).

[0062] For example, if the depth of cut detection unit 72 can determine the interface between the workpiece W and the DAF7 from the cross-sectional profile of the machining groove 19, it detects the depth of the machining groove 19 below this interface in the Z direction as the depth of cut Δd. Conversely, if the depth of cut detection unit 72 cannot determine the interface between the workpiece W and the DAF7 from the cross-sectional profile of the machining groove 19, it first detects the depth of the machining groove 19 (the length in the Z direction from the surface of the workpiece W to the bottom surface of the machining groove 19) from the cross-sectional profile. Then, the depth of cut detection unit 72 detects the depth of cut Δd as the value obtained by subtracting the known thickness of the workpiece W from the depth of the machining groove 19.

[0063] Figure 7 is a table showing an example of the detection results of the depth of cut Δd detected by the depth of cut detection unit 72. As shown in Figure 7, the dicing device 10 performed dicing on multiple workpieces W with different DAF7 film thicknesses (10 μm, 20 μm, 40 μm) so that the DAF7 would be either completely cut or not completely cut.

[0064] Specifically, for workpiece W with a DAF7 film thickness of 10 μm, dicing was performed so that the target depth of cut Δd was 25 μm (divided state) and 5 μm (undivided state). For workpiece W with a DAF7 film thickness of 20 μm, dicing was performed so that the target depth of cut Δd was 35 μm (divided state) and 15 μm (undivided state). Furthermore, for workpiece W with a DAF7 film thickness of 40 μm, dicing was performed so that the target depth of cut Δd was 60 μm (divided state) and 35 μm (undivided state).

[0065] Then, as described above, the cross-sectional profiles of the machined grooves 19 formed by these dicing processes were measured, and the depth of cut Δd was detected by the depth of cut detection unit 72. The average value (Avg), maximum value (Max), minimum value (Min), and 3σ of the depth of cut Δd were calculated. As a result, a difference in the depth of cut Δd was confirmed between the divided state and the undivided state of the DAF7. Therefore, it was confirmed that by appropriately setting the threshold value 75 for the depth of cut Δd (see Figure 5), it is possible to determine whether the DAF7 is in a divided state or an undivided state based on the result of comparing the depth of cut Δd detected by the depth of cut detection unit 72 with the threshold value 75. This threshold value 75 is determined in advance for each type of workpiece W and DAF7 by performing experiments or simulations and is stored in the storage unit 48.

[0066] Returning to Figures 5 and 6, the division determination unit 74 determines whether the DAF7 is in an undivided state based on whether the depth of cut Δd detected by the depth of cut detection unit 72 is less than the threshold 75 in the storage unit 48. If the division determination unit 74 determines that the DAF7 is in an undivided state, it outputs the determination result to the notification control unit 76. If the division determination unit 74 determines that the DAF7 is in an undivided state, it also outputs street position information indicating the location of the street where this undivided state occurred to the device control unit 62. Based on the street position information input from the division determination unit 74, the device control unit 62 controls each part of the processing unit 16 (each drive unit 35, 45, 46, microscope 23, and spindles 22A, 22B, etc.) to perform dicing (reprocessing) of the undivided DAF7.

[0067] Figure 8 is an explanatory diagram illustrating the display (notification) of warning information 78 by the notification control unit 76. As shown in Figure 8 and Figure 5 described above, the notification control unit 76 functions as a notification unit of the present invention together with the monitor 49. When the notification control unit 76 receives a determination result from the separation determination unit 74 that the DAF7 is in an unseparated state, it notifies the operator of the warning information 78 by displaying warning information 78 to that effect on the monitor 49. Alternatively, instead of displaying the warning information 78 on the monitor 49, or in conjunction with displaying it, the warning information 78 may be output as audio from a speaker (not shown).

[0068] [Operation of the First Embodiment] Figure 9 is a flowchart showing the flow of the dicing process of a workpiece W by the dicing apparatus 10 of the first embodiment, particularly the process of confirming the undivided state of the DAF7, according to the control method of the dicing apparatus 10 of the present invention.

[0069] As shown in Figure 9, when the workpiece W is set on the workpiece holding surface 31a of the table 31, the device control unit 62 controls each part of the machining unit 16 to repeatedly perform the alignment of the blades 21A and 21B with respect to the machining start position of the street of the workpiece W, and the formation of machining grooves 19 by dicing along the street, for each arbitrary street (step S1).

[0070] Next, the device control unit 62 controls the X drive unit 35 and the Y drive unit 45 to adjust the position of the white light interference microscope 24, thereby aligning the optical axis of the white light interference microscope 24 with one end of the machining groove 19 formed along the street (step S2).

[0071] Then, the device control unit 62 controls the Z drive unit 46 to start vertical scanning of the white light interference microscope 24 (step S3). At the same time, the device control unit 62 also causes the imaging unit 56 to capture interference light L4 and output interference signal IS. As a result, the coordinate data acquisition unit 66 of the control device 60 continuously acquires interference signals from the imaging unit 56 for each pixel during vertical scanning of the white light interference microscope 24 (steps S4 and S5).

[0072] Once the vertical scanning of the white light interference microscope 24 is complete (YES in step S5), the coordinate data acquisition unit 66 acquires a group of three-dimensional coordinate data of the machined groove 19 based on the interference signals output from the imaging unit 56 for each pixel during the vertical scanning of the white light interference microscope 24 (step S6). Next, the three-dimensional data generation unit 68 generates three-dimensional data of the machined groove 19 based on the group of three-dimensional coordinate data of the machined groove 19 (step S7), and further, the cross-sectional profile calculation unit 70 calculates the cross-sectional profile of the machined groove 19 based on the three-dimensional data of the machined groove 19 (step S8). Steps S2 to S8 correspond to the cross-sectional profile acquisition step of the present invention.

[0073] Once the calculation of the cross-sectional profile of the machined groove 19 is complete, the depth of cut detection unit 72 detects the amount of cut Δd into the DAF7 by dicing based on the cross-sectional profile of the machined groove 19, as shown in Figure 6 above (step S9, corresponding to the depth of cut detection step of the present invention).

[0074] Next, the division determination unit 74 compares the cut amount Δd detected by the cut amount detection unit 72 with the threshold 75 in the storage unit 48, and determines whether the DAF7 is in an undivided state based on whether the cut amount Δd is less than the threshold 75 (step S10, corresponding to the division determination step of the present invention). If the division determination unit 74 determines that the DAF7 is not in an undivided state (i.e., it is in a divided state), the process proceeds to step S14 described below (NO in step S11).

[0075] On the other hand, if the division determination unit 74 determines that the DAF7 is in an undivided state (YES in step S11), the determination result is output from the division determination unit 74 to the notification control unit 76, and the street location information of the street where the undivided state of the DAF7 occurred is output from the division determination unit 74 to the device control unit 62.

[0076] Then, the notification control unit 76 notifies the operator of the warning information 78 by displaying the warning information 78 on the monitor 49 based on the judgment result input from the separation judgment unit 74 (step S12). This allows the operator to be notified of the occurrence of an unseparated state of the DAF7, thereby preventing the transport of this workpiece W to the next process, i.e., preventing the workpiece W from becoming defective in the next process.

[0077] Furthermore, the device control unit 62 controls each part of the processing unit 16 based on the street position information input from the division determination unit 74 to perform dicing (reprocessing) of the undivided DAF7 (step S13). This eliminates the undivided state of the DAF7, thus preventing the workpiece W from becoming defective.

[0078] Next, the device control unit 62 controls the X drive unit 35 and the Y drive unit 45 to adjust the position of the white interference microscope 24 for the next measurement area of ​​the machining groove 19 (NO in step S14, step S2). Then, the processes from steps S3 to S13 described above are repeatedly executed. Similarly, the determination of whether or not there is an undivided state of the DAF7 for the machining groove 19 of any street, the notification of warning information 78 if an undivided state of the DAF7 occurs, and re-machining are repeatedly executed until the dicing process of the workpiece W is completed (YES in step S14).

[0079] As described above, in the dicing apparatus 10 of the first embodiment, after dicing each street of the workpiece W, the cross-sectional profile of the processed groove 19 is acquired, the amount of cut Δd into the DAF7 is detected, and the presence or absence of an undivided state of the DAF7 is determined, thereby enabling the detection of undivided DAF7 defects during the dicing process of the workpiece W. As a result, the detection of undivided DAF7 defects in subsequent processes (expanding process, pickup process) is prevented, thus preventing the workpiece W from becoming defective in subsequent processes.

[0080] [Second Embodiment] Figure 10 is a block diagram of the dicing apparatus 10 of the second embodiment. In the dicing apparatus 10 of the first embodiment, the cross-sectional profile calculation unit 70 calculates the cross-sectional profile of the machined groove 19 based on the three-dimensional data of the machined groove 19. However, in the dicing apparatus 10 of the second embodiment, the cross-sectional profile of the machined groove 19 is calculated in a different way than in the first embodiment.

[0081] The dicing apparatus 10 of the second embodiment has basically the same configuration as the dicing apparatus 10 of the first embodiment, except that the processing unit 64 of the control device 60 functions as a projection data generation unit 68A instead of the 3D data generation unit 68 of the first embodiment. For this reason, components that are functionally or structurally identical to those of the first embodiment are denoted by the same reference numerals and their descriptions are omitted.

[0082] Figure 11 is an explanatory diagram illustrating the generation of two-dimensional projection data 84 by the projection data generation unit 68A. In Figure 11, the three-dimensional coordinate data group 80, indicated by the symbol XIA, is represented as three-dimensional data (image) in order to illustrate the projection of the three-dimensional coordinate data group 80 of the machined groove 19 onto a two-dimensional plane by the projection data generation unit 68A. However, in the second embodiment, three-dimensional data of the machined groove 19 is not generated.

[0083] As shown in Figure 11, the projection data generation unit 68A projects each dot of the 3D coordinate data group 80 (point cloud) of the machining groove 19 acquired by the coordinate data acquisition unit 66 onto a 2D plane 82, which is a virtual YZ plane perpendicular to the X direction, which is the machining feed direction (see symbol XIA). As a result, the projection data generation unit 68A generates 2D projection data 84 of the machining groove 19 (see symbol XIB).

[0084] The 2D projection data 84 contains variations in the shape of the machined grooves 19 along the X direction, as well as data variations due to vibrations during shape measurement of the machined grooves 19 using the white light interference microscope 24. Therefore, the 2D projection data 84 reflects the variations in the shape of the machined grooves 19 along the X direction. Since such 2D projection data 84 can be generated simply by projecting each dot of the 3D coordinate data group 80 onto a 2D plane 82, the generation processing load is smaller than that of 3D data (3D model) as in the first embodiment.

[0085] Figure 12 is an explanatory diagram illustrating the calculation of the cross-sectional profile 86 of the machined groove 19 by the cross-sectional profile calculation unit 70 of the second embodiment. As shown by the symbol XIIA in Figure 12, the cross-sectional profile calculation unit 70 of the second embodiment calculates the cross-sectional profile 86 of the machined groove 19, as shown by the symbol XIIB, based on the two-dimensional projection data 84 generated by the projection data generation unit 68A. Specifically, the cross-sectional profile calculation unit 70 calculates the cross-sectional profile 86 by applying noise reduction processing and statistical processing to the two-dimensional projection data 84.

[0086] Here, if vibration occurs during the shape measurement of the machined groove 19 using the white light interference microscope 24, variations will occur in the shape measurement results (dot data of the 3D coordinate data group 80). For example, the dicing device 10 may use air guides / linear motors for the X guide 34 and X drive unit 35 for the purpose of high precision and high durability, but in this case the restraining force in the X direction becomes weaker. Therefore, if the X axis oscillates slightly during the shape measurement of the machined groove 19 due to disturbance vibrations in the installation environment of the dicing device 10, or vibrations from other units mounted on the dicing device 10 (such as spin cleaning), errors (variations) will occur in the shape measurement results of the machined groove 19.

[0087] To address these issues, it is necessary to design a highly rigid stage. However, by calculating the cross-sectional profile 86 as in the second embodiment, vibration suppression at an accuracy level acceptable to the dicing device 10 becomes possible. This allows for statistical analysis through the effect of integrating and projecting the shape measurement data in the X direction, thereby improving robustness. Furthermore, it becomes possible to measure the cross-sectional profile 86 with higher accuracy compared to conventional methods of measuring 3D data.

[0088] Hereafter, similar to the first embodiment described above, based on the cross-sectional profile 86 calculated by the cross-sectional profile calculation unit 70, the cutting depth detection unit 72 detects the cutting depth Δd of the DAF7, and the division determination unit 74 determines whether or not the DAF7 is in an undivided state.

[0089] As described above, in the dicing apparatus 10 of the second embodiment, two-dimensional projection data 84 is generated from the three-dimensional coordinate data group 80 of the processed groove 19, and the cross-sectional profile 86 is calculated from this two-dimensional projection data 84. This eliminates the need to generate three-dimensional data and cut out the cross-section from this three-dimensional data, as in the conventional method. As a result, the processing load of the control device 60 is reduced, and the calculation speed of the cross-sectional profile 86 is improved. Furthermore, even if vibration occurs during the shape measurement of the processed groove 19, it becomes possible to measure the cross-sectional profile 86 with high accuracy. Moreover, the same effects as the dicing apparatus 10 of the first embodiment can be obtained.

[0090] [Third Embodiment] Figure 13 is a block diagram of the dicing apparatus 10 of the third embodiment. In the dicing apparatus 10 of each of the above embodiments, the division determination unit 74 determines whether or not the DAF7 is in an undivided state based on the result of the cut amount Δd detected by the cut amount detection unit 72. In contrast, in the dicing apparatus 10 of the third embodiment, the cut amount Δd detected by the cut amount detection unit 72 and the interference signal acquired by the coordinate data acquisition unit 66 from the white light interference microscope 24 determine whether or not the DAF7 is in an undivided state.

[0091] The dicing apparatus 10 of the third embodiment has basically the same configuration as the dicing apparatus 10 of each of the above embodiments, except that the processing unit 64 of the control device 60 further functions as an interference signal acquisition unit 73, and a threshold value 75A is further stored in the storage unit 48. For this reason, components that are functionally or structurally identical to those of each of the above embodiments are denoted by the same reference numerals and their descriptions are omitted.

[0092] Similar to the coordinate data acquisition unit 66, the interference signal acquisition unit 73 continuously acquires the interference signal IS (see Figure 14) output from the imaging unit 56 for each pixel during the vertical scanning of the white light interference microscope 24.

[0093] Figure 14 is an explanatory diagram illustrating the relationship between the signal intensity of the interference signal IS and the material of the bottom (bottom surface) of the machined groove 19. As shown by the symbol XIVA in Figure 14, when DAF7 is in a fragmented state, the material (composition) of the bottom of the machined groove 19 becomes the adhesive layer 8. On the other hand, as shown by the symbol XIVB in Figure 14, when DAF7 is in a fragmented state, the material (composition) of the bottom of the machined groove 17 becomes DAF7. Therefore, the material of the bottom of the machined groove 19 changes depending on whether DAF7 is in a fragmented or unfragmented state.

[0094] In this process, the signal intensity of the interference signal IS acquired by the white light interference microscope 24 from the bottom of the machined groove 19 varies depending on the material of the bottom of the machined groove 19. Therefore, if the signal intensity of the interference signal IS acquired by the white light interference microscope 24 is close to the signal intensity of the interference signal IS obtained by measuring DAF7, it is possible to determine that DAF7 is in an undivided state. Accordingly, by appropriately setting the threshold value 75A (see Figure 13) for the signal intensity of the interference signal IS, it is possible to determine whether DAF7 is in a divided or undivided state based on the result of comparing the interference signal IS acquired by the interference signal acquisition unit 73 with the threshold value 75A. This threshold value 75A is determined in advance for each type of DAF7 and adhesive layer 8 by performing experiments or simulations and stored in the storage unit 48. This makes it possible to determine whether DAF7 is in an undivided state based on whether the signal intensity of the interference signal IS satisfies the threshold value 75A.

[0095] Returning to Figure 13, the division determination unit 74 of the third embodiment determines whether the DAF7 is in an undivided state based on the cut amount Δd detected by the cut amount detection unit 72 and the interference signal IS acquired by the interference signal acquisition unit 73. Specifically, similar to the embodiments described above, the division determination unit 74 determines whether the cut amount Δd detected by the cut amount detection unit 72 is less than the threshold 75 in the storage unit 48.

[0096] Furthermore, the segmentation determination unit 74 determines the signal strength of the interference signal IS obtained from the bottom of the machining groove 19 from among the pixel-by-pixel interference signals IS acquired by the imaging unit 56 by the interference signal acquisition unit 73. For example, the segmentation determination unit 74 determines the signal strength of the interference signal IS obtained from the bottom of the machining groove 19 based on the pixel address (XY coordinate) of the imaging unit 56 and the signal strength distribution of the interference signal IS. Next, the segmentation determination unit 74 determines whether the signal strength of the interference signal IS obtained from the bottom of the machining groove 19 satisfies the threshold 75A in the storage unit 48.

[0097] The division determination unit 74 determines that the DAF7 is in an undivided state if the incision amount Δd is less than the threshold 75, the signal strength of the interference signal IS satisfies the threshold 75A, or both. Conversely, the division determination unit 74 determines that the DAF7 is in a divided state if the incision amount Δd is greater than or equal to the threshold 75 and the signal strength of the interference signal IS does not satisfy the threshold 75A.

[0098] As described above, in the dicing apparatus 10 of the third embodiment, the division determination unit 74 determines whether the DAF7 is in an undivided state based on two parameters (cutting amount Δd and signal strength of interference signal IS), thus improving the accuracy of the determination compared to the above embodiments. Furthermore, since the interference signal IS acquired by the white light interference microscope 24 is used, there is no need to add a separate device, thus preventing cost increases. Moreover, the same effects as the dicing apparatus 10 of the above embodiments can be obtained.

[0099] [Fourth Embodiment] Figure 15 is a block diagram of the dicing apparatus 10 of the fourth embodiment. Note that the dicing apparatus 10 of the fourth embodiment has basically the same configuration as the dicing apparatus 10 of the third embodiment, except that some functions of the processing unit 64 are omitted. Therefore, components identical in function or configuration to those in the above embodiments are denoted by the same reference numerals, and their descriptions are omitted.

[0100] In the dicing apparatus 10 of the third embodiment described above, the division determination unit 74 determines whether the DAF7 is in an undivided state based on two parameters (cutting amount Δd and signal strength of interference signal IS). In contrast, as shown in Figure 15, in the dicing apparatus 10 of the fourth embodiment, the processing unit 64 functions as an interference signal acquisition unit 73, a division determination unit 74, and a notification control unit 76. As a result, the division determination unit 74 of the fourth embodiment determines whether the DAF7 is in an undivided state based solely on whether the signal strength of the interference signal IS satisfies the threshold 75A. Consequently, in the flowchart of the first embodiment shown in Figure 9 described above, the processing from steps S6 to S9 can be omitted. In the fourth embodiment, the processing in step S3 of Figure 9 corresponds to the scanning step of the present invention.

[0101] As described above, in the dicing apparatus 10 of the fourth embodiment, the calculation of the cross-sectional profile 86 of the processed groove 19 can be omitted, thereby reducing the processing load on the control device 60 and enabling the division determination unit 74 to perform its determination in a short time.

[0102] [others] In the first to third embodiments described above, the cross-sectional profile 86 of the machined groove 19 is obtained using white light interferometry, but the cross-sectional profile 86 may also be obtained using known methods such as a laser microscope (laser displacement meter) or focusing method (focus variation method).

[0103] In each of the above embodiments, the Z drive unit 46 is driven to perform vertical scanning of the white interference microscope 24 in the Z direction. However, the white interference microscope 24 may also be scanned perpendicularly in the Z direction relative to the surface of the workpiece W by, for example, reciprocating the table 31 in the Z direction.

[0104] In the embodiments described above, a blade dicer was used as an example of the dicing apparatus 10, but the present invention can also be applied to, for example, a laser processing apparatus that performs laser processing.

[0105] In each of the above embodiments, the dicing device 10 determines whether or not the DAF7 is in an undivided state. However, the determination of whether or not the DAF7 is in an undivided state may be made by a determination device separate from the dicing device 10. Furthermore, this determination device may be integrated with the devices for the subsequent processes (expanding process, pickup process) described above.

[0106] Figure 16 is an explanatory diagram illustrating the challenges when the workpiece W is thick. Figure 17 is an explanatory diagram illustrating the detection location Q for the depth of cut Δd when the workpiece W is thick. Figure 18 is a diagram showing an example of a cross-section of the machined groove 19 at the detection location Q shown in Figure 17. Components that are functionally or structurally identical to those in the above embodiments are denoted by the same reference numerals and their descriptions are omitted.

[0107] In each of the above embodiments, vertical scanning of the white interference microscope 24 on the surface of the workpiece W is performed, a set of three-dimensional coordinate data of the machining groove 19 is acquired, three-dimensional data of the machining groove 19 is generated, and a cross-sectional profile 86 of the machining groove 19 is generated. However, as shown in Figure 16, if the thickness of the workpiece W is thick, there is a risk that a cross-sectional profile 86 with the aspect ratio necessary for detecting the depth of cut Δd of the DAF7 cannot be obtained.

[0108] Therefore, as shown in Figure 17, for example, a detection point Q for the depth of cut Δd may be set in the cut allowance (DAF7) outside the workpiece W, and vertical scanning of the white light interference microscope 24, acquisition of a set of 3D coordinate data of the machined groove 19, generation of 3D data of the machined groove 19, and generation of a cross-sectional profile of the machined groove 19 may be performed on this detection point Q. As a result, as shown in Figure 18, the machined groove 19 formed in the DAF7 can be measured directly and a cross-sectional profile 86 can be generated, rather than through the workpiece W. As a result, the aspect ratio constraint mentioned above is eliminated, and the scanning amount when vertically scanning the white light interference microscope 24, etc., can be reduced, thereby shortening the measurement time.

[0109] Furthermore, regardless of the thickness of the workpiece W, the detection of the depth of cut Δd may be performed at the detection point Q. [Explanation of Symbols]

[0110] 7…Die Attach Film (DAF) 8…adhesive layer 9…Dicing tape 10…Dicing device 10A... enclosure 12…Load port 14…Conveying mechanism 16...Processing section 17…Processing groove 18…Cleaning section 19…Processing groove 21A…Blade 21B...Blade 22A... Spindle 22B... Spindle 23…Microscope 24…White light interference microscope 31... Table 31a...Workpiece holding surface 32...X base 34...X Guide 35…X drive unit 36…X Carriage 37... Rotating Unit 41…Y-Base 42…Y Guide 43…Y Carriage 44...Z Carriage 45…Y drive unit 46…Z drive unit 48...Storage section 49…Monitor 50… Housing 51...White light source 52...First beam splitter 53…Objective lens 54…Glass plate 54a...Mirror 55... Second beam splitter 56…Imaging Unit 60...Control device 62...Device Control Unit 64… Processing Unit 66... ​​Coordinate data acquisition unit 68...3D Data Generation Unit 68A...Projection data generation unit 70...Cross-sectional profile calculation unit 72... Cutting depth detection unit 73...Interference signal acquisition unit 74... Division Determination Unit 75... Threshold 75A…Threshold 76... Notification Control Unit 78…Warning Information 80...3D coordinate data set 82…2D plane 84...2D projection data 86...Cross-sectional profile CA... Rotation axis F...frame IS...Interference signal L1…white light L2... Measuring light L3...Reference light L4... Interfering light W...work Δd…Depth of cut Q...Detection location

Claims

1. In a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and the die attach film along the street, A cross-sectional profile acquisition unit that acquires the cross-sectional profile of the machined groove formed by the dicing process, Based on the cross-sectional profile acquired by the cross-sectional profile acquisition unit, a cutting amount detection unit detects the amount of cutting into the die attach film by the dicing process, A division determination unit determines whether the die attach film is in an undivided state and has not been completely cut, based on the amount of cut detected by the cut amount detection unit. A dicing device equipped with the following features.

2. The cross-sectional profile acquisition unit, A white light interference microscope that splits white light into a measurement light and a reference light, irradiates the measurement light toward the machining groove, and captures the interference light of the measurement light reflected by the machining groove and the reference light reflected by the reference surface to output an interference signal, A scanning mechanism that scans the white light interference microscope relative to the surface of the workpiece in a direction perpendicular to it, A cross-sectional profile calculation unit calculates the cross-sectional profile based on the interference signal output from the white-white interference microscope during scanning by the scanning mechanism, The dicing apparatus according to claim 1, comprising:

3. The dicing apparatus according to claim 2, wherein the division determination unit determines whether or not the cutting amount detected by the cutting amount detection unit is less than a predetermined threshold, and whether or not the state is undivided.

4. The dicing apparatus according to claim 2, wherein the division determination unit determines whether or not the state is undivided based on the amount of cut detected by the amount of cut detection unit and the signal intensity of the interference signal obtained from the bottom of the processed groove among the interference signals output from the white light interference microscope.

5. In a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and the die attach film along the street, A white light interference microscope that splits white light into a measurement light and a reference light, irradiates the measurement light toward a processing groove formed by the dicing process, and captures the interference light between the measurement light reflected by the processing groove and the reference light reflected by the reference surface to output an interference signal, A scanning mechanism that scans the white light interference microscope relative to the surface of the workpiece in a direction perpendicular to it, A division determination unit determines whether the die attach film is in an undivided state and not completely cut, based on the signal intensity of the interference signal obtained from the bottom surface of the processing groove among the interference signals output from the white interference microscope during scanning by the scanning mechanism, A dicing device equipped with the following features.

6. The dicing apparatus according to any one of claims 1 to 5, further comprising a notification unit that notifies warning information when the division determination unit determines that the state is not divided.

7. A processing unit that performs the aforementioned dicing process, When the separation determination unit determines that the film is in an unseparated state, the processing control unit controls the processing unit to perform the dicing process on the die attach film in the unseparated state, A dicing apparatus according to any one of claims 1 to 5, comprising:

8. A control method for a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and the die attach film along the street, A step of obtaining a cross-sectional profile to obtain the cross-sectional profile of the machined groove formed by the dicing process, A cutting amount detection step is performed to detect the amount of cutting into the die attach film by the dicing process based on the cross-sectional profile obtained in the cross-sectional profile acquisition step, A division determination step is performed to determine whether the die attach film is in an undivided state and has not been completely cut, based on the amount of cut detected in the cut amount detection step. A control method for a dicing apparatus having the following features.

9. In a control device for a dicing apparatus that dices a street of a workpiece attached to a dicing tape via a die attach film, and cuts the workpiece and the die attach film along the street, A scanning step involves scanning a white light interference microscope, which splits white light into a measurement light and a reference light, irradiates the measurement light toward a processing groove formed by the dicing process, and captures the interference light between the measurement light reflected from the processing groove and the reference light reflected from the reference surface to output an interference signal, in a direction perpendicular to the surface of the workpiece. A fragmentation determination step in which, during scanning with the white light interference microscope, a fragmentation determination is made based on the signal intensity of the interference signal obtained from the bottom surface of the processed groove among the interference signals output from the white light interference microscope, to determine whether the die attach film is in an unfragmented state and has not been completely cut. A control method for a dicing apparatus having the following features.

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