Module, laminate for image display device, image display device, method for manufacturing a module, and wiring board

Abstract

This module comprises: a wiring board including a board, a mesh wiring layer, a feed portion, and a protection layer; and a feed line electrically connected to the feed portion via an anisotropically conductive film including electrically conductive particles. The board has transparency. The protection layer only covers a part of the feed portion. The anisotropically conductive film covers regions of the feed portion that are not covered by the protection layer.

Description

[Technical Field]

[0001] Embodiments of this disclosure relate to a module, a laminate for an image display device, an image display device, a method for manufacturing a module, and a wiring board. [Background technology]

[0002] Currently, mobile devices such as smartphones, tablets, and smart glasses (AR, MR, etc.) are becoming more sophisticated, smaller, thinner, and lighter. Because these mobile devices utilize multiple communication bands, they require multiple antennas corresponding to each band. For example, mobile devices are equipped with multiple antennas, including antennas for telephone, Wi-Fi (Wireless Fidelity), 3G (Generation), 4G (Generation), 5G (Generation), LTE (Long Term Evolution), Bluetooth (registered trademark), and NFC (Near Field Communication). However, with the miniaturization of mobile devices, the space available for antenna installation is limited, restricting the freedom of antenna design. Furthermore, because antennas are built into a limited space, radio wave sensitivity is not always satisfactory.

[0003] For this reason, film antennas that can be mounted on the display area of ​​mobile devices or the transparent area of ​​smart glasses have been developed. In these film antennas, an antenna pattern is formed on a transparent substrate. The antenna pattern is formed by a mesh-like conductive mesh layer consisting of a conductive part as the part that forms the opaque conductive layer and a number of openings as the non-formed part. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2011-66610 [Patent Document 2] Japanese Patent No. 5636735 [Patent Document 3] Japanese Patent No. 5695947

[0005] By the way, in a film antenna, a feeding wire is connected to a feeding portion for electrically connecting a conductor mesh layer to an external device. In this case, it is required to protect the feeding portion from corrosion etc. while suppressing a decrease in electrical connectivity between the feeding portion and the feeding wire.

[0006] Also, in a film antenna, in order to protect the conductor mesh layer and the feeding portion for electrically connecting the conductor mesh layer to an external device, it is preferable to cover the conductor mesh layer and the feeding portion with a protective layer. However, when the conductor mesh layer is covered with a protective layer, there is a possibility that the wiring substrate becomes easily visible due to light being reflected by the protective layer.

[0007] An object of the present embodiment is to provide a module, a laminate for an image display device, and an image display device that can suppress a decrease in electrical connectivity between a feeding wire and a feeding portion and protect the feeding portion.

[0008] The present embodiment provides a wiring substrate, a laminate for an image display device, and an image display device that can protect a metal layer existing in a region that does not overlap with the display region of the image display device and make it difficult to visually recognize a wiring substrate existing in a region that overlaps with the display region.

[0009] The present embodiment provides a wiring substrate, a laminate for an image display device, and an image display device that can protect a metal layer and make it difficult to visually recognize a wiring substrate. [Disclosure of the Invention] *Note: "

発明の開示

[0010] A first aspect of the present disclosure is a module including a substrate including a first surface and a second surface located on the opposite side of the first surface, a mesh wiring layer disposed on the first surface of the substrate, a power supply unit electrically connected to the mesh wiring layer, and a protective layer disposed on the first surface of the substrate and covering the mesh wiring layer and the power supply unit, and a power supply line electrically connected to the power supply unit via an anisotropic conductive film containing conductive particles. The substrate has transparency, the protective layer covers only a part of the power supply unit, and the anisotropic conductive film covers a region of the power supply unit that is not covered by the protective layer.

[0011] A second aspect of the present disclosure is that in the module according to the first aspect described above, a part of the anisotropic conductive film may be disposed on the protective layer.

[0012] A third aspect of the present disclosure is that in the module according to the first aspect or the second aspect described above, a region of the power supply unit that is not covered by either the protective layer or the anisotropic conductive film may be covered with a coating layer containing a material having corrosion resistance.

[0013] A fourth aspect of the present disclosure is that in the module according to each of the first aspect to the third aspect described above, the power supply line may be electrically connected to the power supply unit by the conductive particles entering into the protective layer.

[0014] A fifth aspect of the present disclosure is that in the module according to each of the first aspect to the fourth aspect described above, the thickness of the protective layer may be 4.0 μm or more and 8.0 μm or less.

[0015] A sixth aspect of the present disclosure is that in the module according to each of the first aspect to the fifth aspect described above, a dummy wiring layer electrically independent of the mesh wiring layer may be provided around the mesh wiring layer.

[0016] A seventh aspect of this disclosure is that, in each of the modules described in the first to sixth aspects above, the wiring board may have a radio wave transmission and reception function.

[0017] An eighth aspect of the present disclosure is that, in each of the modules described in the first to seventh aspects above, the mesh wiring layer may have a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

[0018] A ninth aspect of the present disclosure is a laminate for an image display device, comprising a module according to any of the first to eighth aspects described above, a first adhesive layer located on the first surface side of the substrate, and a second adhesive layer located on the second surface side of the substrate, wherein a portion of the substrate is disposed in a portion of the region between the first adhesive layer and the second adhesive layer.

[0019] A tenth aspect of this disclosure is an image display device comprising a laminate for an image display device according to the ninth aspect described above, and a display device laminated on the laminate for an image display device.

[0020] An eleventh aspect of the present disclosure is a method for manufacturing a module, comprising the steps of: preparing a substrate including a first surface and a second surface located opposite to the first surface; forming a mesh wiring layer and a power supply unit electrically connected to the mesh wiring layer on the first surface of the substrate; forming a protective layer on the first surface of the substrate so as to cover the mesh wiring layer and the power supply unit; and electrically connecting a power supply line to the power supply unit via an anisotropic conductive film containing conductive particles, wherein the substrate is transparent, the protective layer covers only a portion of the power supply unit, and the anisotropic conductive film covers the portion of the power supply unit not covered by the protective layer.

[0021] A twelfth aspect of this disclosure is a wiring board for an image display device, comprising a substrate, a metal layer disposed on the substrate, and a protective layer covering a portion of the metal layer, wherein the substrate is transparent, the metal layer includes a mesh wiring layer, and the protective layer is located in a first region that does not overlap with the display area of ​​the image display device and is not located in a second region that overlaps with the display area of ​​the image display device. In this specification, transparency means that the transmittance of light rays with wavelengths of 400 nm to 700 nm is 85% or more.

[0022] A thirteenth aspect of this disclosure is that, in the wiring board according to the twelfth aspect described above, the difference between the thermal shrinkage rate of the protective layer and the thermal shrinkage rate of the substrate after 1 hour at 120°C may be 1% or less.

[0023] A fourteenth aspect of this disclosure is a wiring board according to the twelfth or thirteenth aspect described above, wherein the dielectric loss tangent of the protective layer may be 0.002 or less.

[0024] A fifteenth aspect of this disclosure relates to a wiring board according to each of the twelve to fourteenth aspects described above, wherein the thickness of the protective layer T1 is relative to the thickness T1 of the substrate. 12 The ratio (T 12 / T1) may be between 0.02 and 5.0.

[0025] A sixteenth aspect of this disclosure is a wiring board according to each of the twelve to fifteen aspects described above, wherein the thickness of the board may be 10 μm or more and 50 μm or less.

[0026] A 17th aspect of this disclosure is that, in a wiring board according to each of the 12th to 16th aspects described above, a dummy wiring layer electrically independent from the mesh wiring layer may be provided around the mesh wiring layer.

[0027] An eighteenth aspect of this disclosure is a wiring board according to each of the twelve to seventeen aspects described above, wherein the mesh wiring layer may function as an antenna.

[0028] A 19th aspect of the present disclosure is a wiring board according to each of the 12th to 18th aspects described above, further comprising a power supply unit electrically connected to the mesh wiring layer, wherein the mesh wiring layer may have a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

[0029] A 20th aspect of this disclosure is a wiring board according to each of the 12th to 19th aspects described above, wherein the substrate, the metal layer, and the protective layer may be curved in the first region.

[0030] A 21st aspect of this disclosure is a module comprising a wiring board according to any of the 12th to 19th aspects described above, and a power supply line electrically connected to the wiring board.

[0031] A 22nd aspect of the present disclosure is a laminate for an image display device, comprising a wiring substrate according to any of the 12th to 19th aspects described above, a third adhesive layer having a larger area than the substrate, and a fourth adhesive layer having a larger area than the substrate, wherein the third adhesive layer is transparent, the fourth adhesive layer is transparent, and a portion of the substrate is disposed in a portion of the region between the third adhesive layer and the fourth adhesive layer.

[0032] A 23rd aspect of this disclosure is a laminate for an image display device according to the 22nd aspect described above, wherein at least one of the thicknesses of the third adhesive layer and the fourth adhesive layer may be 1.5 times or more the thickness of the substrate.

[0033] A 24th aspect of the present disclosure is a laminate for an image display device according to the 22nd or 23rd aspect described above, wherein the material of the third adhesive layer is an acrylic resin, and the material of the fourth adhesive layer may also be an acrylic resin.

[0034] A 25th aspect of the present disclosure is an image display device comprising a laminate for an image display device according to any of the 22nd to 24th aspects described above, and a display unit having a display area laminated on the laminate for an image display device.

[0035] A 26th aspect of this disclosure is a wiring substrate for an image display device, comprising a substrate, a metal layer disposed on the substrate, and a protective layer covering the metal layer, wherein the substrate is transparent, the metal layer includes a mesh wiring layer, and the difference between the refractive index of the substrate and the refractive index of the protective layer is 0.1 or less. In this specification, "transparent" means that the transmittance of light rays with wavelengths of 400 nm to 700 nm is 85% or more.

[0036] A 27th aspect of this disclosure is that, in the wiring board according to the 26th aspect described above, the difference between the thermal shrinkage rate of the protective layer and the thermal shrinkage rate of the board after 1 hour at 120°C may be 1% or less.

[0037] A 28th aspect of this disclosure is a wiring board according to the 26th aspect or the 27th aspect described above, wherein the dielectric loss tangent of the protective layer may be 0.002 or less.

[0038] A 29th aspect of this disclosure relates to a wiring board according to each of the 26th to 28th aspects described above, wherein the thickness of the protective layer T1 is relative to the thickness T1 of the substrate. 12 The ratio (T 12 / T1) may be between 0.02 and 5.0.

[0039] A 30th aspect of this disclosure is a wiring board according to each of the 26th to 29th aspects described above, wherein the thickness of the board may be 10 μm or more and 50 μm or less.

[0040] A 31st aspect of this disclosure is a wiring board according to each of the 26th to 30th aspects described above, wherein a dummy wiring layer electrically independent from the mesh wiring layer is provided around the mesh wiring layer.

[0041] A 32nd aspect of this disclosure is a wiring board according to each of the 26th to 31st aspects described above, wherein the mesh wiring layer may function as an antenna.

[0042] A 33rd aspect of the present disclosure is a wiring board according to each of the 26th to 32nd aspects described above, further comprising a power supply unit electrically connected to the mesh wiring layer, wherein the mesh wiring layer may have a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

[0043] A 34th aspect of this disclosure is that, in a wiring board according to each of the 26th to 33rd aspects described above, a portion of the substrate, the metal layer, and the protective layer may be curved.

[0044] A 35th aspect of this disclosure is a module comprising a wiring board according to any of the 26th to 34th aspects described above, and a power supply line electrically connected to the wiring board.

[0045] A 36th aspect of the present disclosure is a laminate for an image display device, comprising a third adhesive layer, a fourth adhesive layer, and a wiring substrate disposed between the third adhesive layer and the fourth adhesive layer, wherein the wiring substrate comprises a substrate, a metal layer disposed on the substrate, and a protective layer covering the metal layer, the substrate being transparent, the third adhesive layer being transparent, the fourth adhesive layer being transparent, the metal layer including a mesh wiring layer, and the difference between the maximum and minimum values ​​of the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the third adhesive layer, and the refractive index of the fourth adhesive layer being 0.1 or less.

[0046] A 37th aspect of this disclosure is a laminate for an image display device according to the 36th aspect described above, wherein at least one of the thicknesses of the third adhesive layer and the fourth adhesive layer may be 1.5 times or more the thickness of the substrate.

[0047] A 38th aspect of the present disclosure is a laminate for an image display device according to the 36th or 37th aspect described above, wherein the material of the third adhesive layer is an acrylic resin, and the material of the fourth adhesive layer may also be an acrylic resin.

[0048] A 39th aspect of the present disclosure is an image display device comprising a laminate for an image display device according to any of the 36th to 38th aspects described above, and a display unit laminated on the laminate for an image display device.

[0049] According to the embodiments of this disclosure, it is possible to suppress a decrease in electrical connectivity between the power supply line and the power supply unit, and to protect the power supply unit.

[0050] According to the embodiments of this disclosure, it is possible to protect the metal layer in an area that does not overlap with the display area of ​​the image display device, and to make the wiring board in an area that overlaps with the display area less visible.

[0051] According to embodiments of this disclosure, the metal layer can be protected, and the wiring board can be made less visible. [Brief explanation of the drawing]

[0052] [Figure 1] Figure 1 is a plan view showing an image display device according to the first embodiment. [Figure 2] Figure 2 is a cross-sectional view (cross-sectional view along line II-II in Figure 1) showing an image display device according to the first embodiment. [Figure 3] Figure 3 is a plan view showing a wiring board according to the first embodiment. [Figure 4] Figure 4 is an enlarged plan view showing the mesh wiring layer and power supply section of the wiring board according to the first embodiment. [Figure 5] Figure 5 is a cross-sectional view (VV line cross-section in Figure 4) showing a wiring board according to the first embodiment. [Figure 6] Figure 6 is a cross-sectional view (cross-sectional view along line VI-VI in Figure 4) showing a wiring board according to the first embodiment. [Figure 7] Figure 7 is a plan view showing a module according to the first embodiment. [Figure 8] Figure 8(a) is an enlarged plan view showing the power supply section of the module according to the first embodiment, and Figure 8(b) is an enlarged plan view showing the power supply line of the module according to the first embodiment. [Figure 9] Figure 9 is a cross-sectional view (cross-sectional view along line IX-IX in Figure 7) showing a module according to the first embodiment. [Figure 10] Figures 10(a)-(f) are cross-sectional views showing a method for manufacturing a wiring board according to the first embodiment. [Figure 11] Figures 11(a)-(c) are cross-sectional views showing a method for manufacturing a module according to the first embodiment. [Figure 12] Figures 12(a)-(c) are cross-sectional views showing a method for manufacturing a laminate for an image display device according to the first embodiment. [Figure 13] Figure 13 is a cross-sectional view showing a module according to the first modified example. [Figure 14] Figure 14 is a cross-sectional view showing a module according to a second modification. [Figure 15] Figures 15(a)-(d) are cross-sectional views showing a method for manufacturing the module according to a second modified example. [Figure 16] Figure 16 is a cross-sectional view showing a module according to a third modified example. [Figure 17] Figures 17(a)-(c) are cross-sectional views showing a method for manufacturing a module according to a third modified example. [Figure 18] Figure 18 is a plan view showing a wiring board according to the first modified example. [Figure 19] Figure 19 is an enlarged plan view showing a wiring board according to the first modified example. [Figure 20]Figure 20 is a plan view showing a wiring board according to the second modified example. [Figure 21] Figure 21 is an enlarged plan view showing a wiring board according to the second modified example. [Figure 22] Figure 22 is an enlarged plan view showing the mesh wiring layer of a wiring board according to the third modified example. [Figure 23] Figure 23 is a plan view showing an image display device according to the second embodiment. [Figure 24] Figure 24 is a cross-sectional view (cross-sectional view along line XXIV-XXIV in Figure 23) showing an image display device according to the second embodiment. [Figure 25] Figure 25 is a plan view showing a wiring board. [Figure 26] Figure 26 is an enlarged plan view showing the mesh wiring layer of the wiring board. [Figure 27] Figure 27 is a cross-sectional view of the wiring board (cross-sectional view along line XXVII-XXVII in Figure 26). [Figure 28] Figure 28 is a cross-sectional view of the wiring board (cross-sectional view along line XXVIII-XXVIII in Figure 26). [Figure 29] Figures 29(a)-(g) are cross-sectional views showing a method for manufacturing a wiring board according to a second embodiment. [Figure 30] Figure 30 is a cross-sectional view showing a bent circuit board. [Figure 31] Figure 31 is a plan view showing a wiring board according to the first modified example. [Figure 32] Figure 32 is a plan view showing a wiring board according to the second modified example. [Figure 33] Figure 33 is a cross-sectional view showing a wiring board according to a third modified example. [Figure 34] Figure 34 is a cross-sectional view showing a wiring board according to a fourth modified example. [Figure 35] Figure 35 is a cross-sectional view (corresponding to Figure 24) showing an image display device according to the third embodiment. [Figure 36] Figure 36 is a plan view showing a wiring board. [Figure 37]Figures 37(a)-(g) are cross-sectional views showing a method for manufacturing a wiring board according to a third embodiment. [Figure 38] Figure 38 is a plan view showing a wiring board according to the first modified example. [Figure 39] Figure 39 is a plan view showing a wiring board according to the second modified example. [Modes for carrying out the invention]

[0053] (First Embodiment) First, the first embodiment will be described with reference to Figures 1 to 12. Figures 1 to 12 are diagrams illustrating this embodiment.

[0054] The following figures are schematic representations. Therefore, the size and shape of each part are exaggerated as appropriate for ease of understanding. Furthermore, they can be modified as appropriate without departing from the technical concept. In the following figures, the same parts are denoted by the same reference numerals, and some detailed explanations may be omitted. Also, the numerical values ​​such as dimensions and material names of each component described in this specification are examples of embodiments and are not limiting; they can be selected and used as appropriate. In this specification, terms that specify shapes and geometric conditions, such as parallel, orthogonal, and perpendicular, are interpreted to include not only their strict meaning but also substantially equivalent states.

[0055] Furthermore, in the following embodiments, "X direction" refers to the direction parallel to one side of the image display device. "Y direction" refers to the direction perpendicular to the X direction and parallel to the other side of the image display device. "Z direction" refers to the direction perpendicular to both the X and Y directions and parallel to the thickness direction of the image display device. Also, "front surface" refers to the surface on the positive Z direction side, which is the light-emitting surface side of the image display device and faces the observer. "Back surface" refers to the surface on the negative Z direction side, which is the surface opposite to the light-emitting surface and the surface facing the observer of the image display device. In this embodiment, the explanation will be given as an example of a mesh wiring layer 20 having a radio wave transmission and reception function (function as an antenna), but the mesh wiring layer 20 does not have to have a radio wave transmission and reception function (function as an antenna).

[0056] [Image display device configuration] The configuration of the image display device according to this embodiment will be described with reference to Figures 1 and 2.

[0057] As shown in Figures 1 and 2, the image display device 60 according to this embodiment comprises an image display device laminate 70 and a display device (display) 61 laminated on the image display device laminate 70. The image display device laminate 70 comprises a first transparent adhesive layer (first adhesive layer) 95, a second transparent adhesive layer (second adhesive layer) 96, and a module 80A. The module 80A of the image display device laminate 70 comprises a wiring board 10 and a power supply line 85 electrically connected to the wiring board 10.

[0058] The wiring board 10 of module 80A includes a substrate 11, a mesh wiring layer 20, a power supply unit 40, and a protective layer 17 covering the mesh wiring layer 20 and the power supply unit 40. The substrate 11 includes a first surface 11a and a second surface 11b located opposite the first surface 11a. The mesh wiring layer 20 is arranged on the first surface 11a of the substrate 11. The power supply unit 40 is electrically connected to the mesh wiring layer 20. Furthermore, a communication module 63 is arranged on the negative Z-direction side relative to the display device 61. The laminate for image display device 70, the display device 61, and the communication module 63 are housed in a housing 62.

[0059] In the image display device 60 shown in Figures 1 and 2, radio waves of a predetermined frequency can be transmitted and received via a communication module 63, enabling communication. The communication module 63 may include any of the following: a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, a 5G antenna, an LTE antenna, a Bluetooth® antenna, an NFC antenna, etc. Examples of such an image display device 60 include mobile terminal devices such as smartphones and tablets, or smart glasses.

[0060] As shown in Figure 2, the image display device 60 has a light-emitting surface 64. The image display device 60 includes a wiring board 10 located on the side of the light-emitting surface 64 (positive Z-direction) relative to the display device 61, and a communication module 63 located on the opposite side of the light-emitting surface 64 (negative Z-direction) relative to the display device 61.

[0061] The display device 61 is, for example, an organic EL (Electro-Luminescence) display device. The display device 61 may include, for example, a metal layer (not shown), a support substrate, a resin substrate, a thin-film transistor (TFT), and an organic EL layer. A touch sensor (not shown) may be placed on the display device 61. A wiring board 10 is also placed on the display device 61 via a second transparent adhesive layer 96. Note that the display device 61 is not limited to an organic EL display device. For example, the display device 61 may be another display device that has the function of emitting light itself, or it may be a micro-LED display device that includes a micro-LED element (light-emitting element). Also, the display device 61 may be a liquid crystal display device that includes a liquid crystal. A cover glass (surface protective plate) 75 is also placed on the wiring board 10 via a first transparent adhesive layer 95. Note that a decorative film and a polarizing plate (not shown) may be placed between the first transparent adhesive layer 95 and the cover glass 75.

[0062] The first transparent adhesive layer 95 is an adhesive layer that directly or indirectly adheres the wiring board 10 to the cover glass 75. This first transparent adhesive layer 95 is located on the first surface 11a side of the substrate 11. The first transparent adhesive layer 95 has optical transparency and may be an OCA (Optical Clear Adhesive) layer. An OCA layer is a layer made, for example, as follows: First, a liquid curable adhesive layer composition containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET), and this is cured using, for example, ultraviolet light (UV) to obtain an OCA sheet. After laminating this OCA sheet to the object, the release film is peeled off to obtain the OCA layer. The material of the first transparent adhesive layer 95 may be an acrylic resin, a silicone resin, or a urethane resin. In particular, the first transparent adhesive layer 95 may contain an acrylic resin. In this case, it is preferable that the second transparent adhesive layer 96 contains an acrylic resin. This effectively eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, thereby more reliably suppressing the reflection of visible light at the interface B5 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0063] Furthermore, the first transparent adhesive layer 95 may have a transmittance of 85% or more of visible light (light with a wavelength of 400 nm to 700 nm), and preferably 90% or more. There is no particular upper limit to the transmittance of visible light of the first transparent adhesive layer 95, but it may be, for example, 100% or less. By setting the transmittance of visible light of the first transparent adhesive layer 95 within the above range, the transparency of the laminate 70 for the image display device is increased, making the display device 61 of the image display device 60 easier to see.

[0064] As described above, the wiring board 10 is positioned on the light-emitting surface 64 side relative to the display device 61. In this case, the wiring board 10 is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. More specifically, a portion of the substrate 11 of the wiring board 10 is positioned in a portion of the area between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. In this case, the first transparent adhesive layer 95, the second transparent adhesive layer 96, the display device 61, and the cover glass 75 each have a larger area than the substrate 11 of the wiring board 10. By positioning the substrate 11 of the wiring board 10 in a portion of the image display device 60 rather than across its entire surface in a plan view, the overall thickness of the image display device 60 can be reduced.

[0065] The wiring board 10 comprises a transparent substrate 11, a mesh wiring layer 20 disposed on the first surface 11a of the substrate 11, a power supply unit 40 electrically connected to the mesh wiring layer 20, and a protective layer 17 disposed on the first surface 11a of the substrate 11 and covering the mesh wiring layer 20 and the power supply unit 40. The power supply unit 40 is electrically connected to the mesh wiring layer 20. The power supply unit 40 is electrically connected to the communication module 63 via a power supply line 85. Furthermore, a portion of the wiring board 10 is not positioned between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, but protrudes outward (towards the negative side in the Y direction) from between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Specifically, the region of the wiring board 10 where the power supply unit 40 is provided protrudes outward. This facilitates the electrical connection between the power supply unit 40 and the communication module 63. On the other hand, the area of ​​the wiring board 10 in which the mesh wiring layer 20 is provided is located between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Details of the wiring board 10 and the power supply line 85 will be described later.

[0066] The second transparent adhesive layer 96 is an adhesive layer that directly or indirectly adheres the display device 61 to the wiring board 10. This second transparent adhesive layer 96 is located on the second surface 11b side of the substrate 11. The second transparent adhesive layer 96, like the first transparent adhesive layer 95, has optical transparency and may be an OCA (Optical Clear Adhesive) layer. The material of the second transparent adhesive layer 96 may be an acrylic resin, a silicone resin, or a urethane resin, etc. In particular, the second transparent adhesive layer 96 may contain an acrylic resin. This substantially eliminates the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and more reliably suppresses the reflection of visible light at the interface B5 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0067] Furthermore, the second transparent adhesive layer 96 may have a transmittance of 85% or more for visible light (light with a wavelength of 400 nm to 700 nm), and preferably 90% or more. There is no particular upper limit to the transmittance of visible light of the second transparent adhesive layer 96, but it may be, for example, 100% or less. By setting the transmittance of visible light of the second transparent adhesive layer 96 within the above range, the transparency of the laminate 70 for the image display device is increased, making the display device 61 of the image display device 60 easier to see.

[0068] In such a laminated image display device 70, the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the protective layer 17 of the wiring board 10 is 0.1 or less, preferably 0.05 or less. Furthermore, the difference between the refractive index of the protective layer 17 and the refractive index of the substrate 11 is 0.1 or less, preferably 0.05 or less. Here, refractive index refers to absolute refractive index, which can be determined based on Method A of JIS K-7142. For example, if the material of the first transparent adhesive layer 95 is an acrylic resin (refractive index 1.49), the refractive index of the protective layer 17 should be 1.39 or more and 1.59 or less.

[0069] In this way, by keeping the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the protective layer 17 to 0.1 or less, the reflection of visible light at the interface B1 between the first transparent adhesive layer 95 and the protective layer 17 is suppressed, making it difficult for an observer to see the substrate 11 on which the protective layer 17 is provided. Furthermore, by keeping the difference between the refractive index of the protective layer 17 and the refractive index of the substrate 11 to 0.1 or less, the reflection of visible light at the interface B2 between the protective layer 17 and the substrate 11 is suppressed, making it difficult for an observer to see the substrate 11.

[0070] Furthermore, in the laminate 70 for image display devices, the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 is 0.1 or less, and preferably 0.05 or less. Also, the difference between the refractive index of the second transparent adhesive layer 96 and the refractive index of the substrate 11 is 0.1 or less, and preferably 0.05 or less. Moreover, the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 is preferably 0.1 or less, and more preferably 0.05 or less. For example, if the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are acrylic resins (refractive index 1.49), the refractive index of the substrate 11 is set to 1.39 or more and 1.59 or less. Examples of such materials include fluororesins, silicone resins, polyolefin resins, polyester resins, acrylic resins, polycarbonate resins, polyimide resins, cellulose resins, and the like.

[0071] In this way, by keeping the difference between the refractive index of the substrate 11 and the refractive index of the first transparent adhesive layer 95 to 0.1 or less, the reflection of visible light at the interface B3 between the substrate 11 and the first transparent adhesive layer 95 is suppressed, making it difficult for the observer to see the substrate 11 with the naked eye. Furthermore, by keeping the difference between the refractive index of the second transparent adhesive layer 96 and the refractive index of the substrate 11 to 0.1 or less, the reflection of visible light at the interface B4 between the second transparent adhesive layer 96 and the substrate 11 is suppressed, making it difficult for the observer to see the substrate 11 with the naked eye. Moreover, by keeping the difference between the refractive index of the first transparent adhesive layer 95 and the refractive index of the second transparent adhesive layer 96 to 0.1 or less, the reflection of visible light at the interface B5 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 is suppressed, making it difficult for the observer to see the first transparent adhesive layer 95 and the second transparent adhesive layer 96 with the naked eye.

[0072] In particular, it is preferable that the material of the first transparent adhesive layer 95 and the material of the second transparent adhesive layer 96 are the same material. This makes it possible to further reduce the difference in refractive index between the first transparent adhesive layer 95 and the second transparent adhesive layer 96, and to suppress the reflection of visible light at the interface B5 between the first transparent adhesive layer 95 and the second transparent adhesive layer 96.

[0073] Furthermore, in Figure 2, the thickness of at least one of the thicknesses T3 of the first transparent adhesive layer 95 and T4 of the second transparent adhesive layer 96 may be 1.5 times or more the thickness T1 of the substrate 11, preferably 2 times or more, and more preferably 2.5 times or more. By making the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 sufficiently thicker than the thickness T1 of the substrate 11, the first transparent adhesive layer 95 or the second transparent adhesive layer 96 deforms in the thickness direction in the region overlapping with the substrate 11, absorbing the thickness of the substrate 11. This suppresses the occurrence of steps in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for observers to recognize the presence of the substrate 11.

[0074] Furthermore, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 are preferably 10 times or less the thickness T1 of the substrate 11, and more preferably 5 times or less. This prevents the thickness T3 of the first transparent adhesive layer 95 or the thickness T4 of the second transparent adhesive layer 96 from becoming too thick, thereby reducing the overall thickness of the image display device 60.

[0075] Furthermore, in Figure 2, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may be the same. In this case, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may each be 1.5 times or more the thickness T1 of the substrate 11, and preferably 2.0 times or more. That is, the sum of the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 (T3 + T4) is 3 times or more the thickness T1 of the substrate 11. In this way, by making the sum of the thicknesses T3 and T4 of the first transparent adhesive layer 95 and the second transparent adhesive layer 96 sufficiently thick compared to the thickness T1 of the substrate 11, the first transparent adhesive layer 95 and the second transparent adhesive layer 96 deform (shrink) in the thickness direction in the region overlapping with the substrate 11, and absorb the thickness of the substrate 11. This prevents the formation of a step in the first transparent adhesive layer 95 or the second transparent adhesive layer 96 at the periphery of the substrate 11, making it difficult for observers to recognize the presence of the substrate 11.

[0076] Furthermore, when the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 are the same, the thickness T3 of the first transparent adhesive layer 95 and the thickness T4 of the second transparent adhesive layer 96 may each be 5 times or less the thickness T1 of the substrate 11, and preferably 3 times or less. This prevents the thicknesses T3 and T4 of both the first transparent adhesive layer 95 and the second transparent adhesive layer 96 from becoming too thick, and allows the overall thickness of the image display device 60 to be reduced.

[0077] Specifically, the thickness T1 of the substrate 11 may be, for example, 2 μm or more and 200 μm or less, 2 μm or more and 50 μm or less, 10 μm or more and 50 μm or less, and preferably 15 μm or more and 25 μm or less. By setting the thickness T1 of the substrate 11 to 2 μm or more, the strength of the wiring substrate 10 can be maintained and the first directional wiring 21 and second directional wiring 22 of the mesh wiring layer 20, described later, can be made less prone to deformation. Furthermore, by setting the thickness T1 of the substrate 11 to 200 μm or less, the occurrence of steps between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be suppressed, making it difficult for observers to recognize the presence of the substrate 11. Furthermore, by setting the thickness T1 of the substrate 11 to 50 μm or less, the occurrence of steps between the first transparent adhesive layer 95 and the second transparent adhesive layer 96 at the periphery of the substrate 11 can be further suppressed, making it even more difficult for observers to recognize the presence of the substrate 11.

[0078] The thickness T3 of the first transparent adhesive layer 95 may be, for example, 15 μm or more and 500 μm or less, preferably 15 μm or more and 300 μm or less, and more preferably 20 μm or more and 250 μm or less. The thickness T4 of the second transparent adhesive layer 96 may be, for example, 15 μm or more and 500 μm or less, preferably 15 μm or more and 300 μm or less, and more preferably 20 μm or more and 250 μm or less.

[0079] As described above, the laminate for image display device 70 is composed of a module 80A equipped with a wiring board 10, a first transparent adhesive layer 95 having a larger area than the substrate 11 of the wiring board 10, and a second transparent adhesive layer 96 having a larger area than the substrate 11. In this embodiment, such a laminate for image display device 70 is also provided. Furthermore, as described above, the laminate for image display device 70, together with the display device 61, constitutes the image display device 60. The laminate for image display device 70 may also be incorporated into a head-mounted display (smart glasses) by being attached to a frame (not shown).

[0080] Referring again to Figure 2, the cover glass (surface protective plate) 75 is placed directly or indirectly on the first transparent adhesive layer 95. This cover glass 75 is a light-transmitting glass component. The cover glass 75 is plate-shaped and may be rectangular in plan view. The thickness of the cover glass 75 may be, for example, 200 μm or more and 1000 μm or less, and preferably 300 μm or more and 700 μm or less. The length of the cover glass 75 in the longitudinal direction (Y direction) may be, for example, 20 mm or more and 500 mm or less, preferably 100 mm or more and 200 mm or less, and the length of the cover glass 75 in the short direction (X direction) may be 20 mm or more and 500 mm or less, preferably 50 mm or more and 100 mm or less.

[0081] As shown in Figure 1, the image display device 60 is approximately rectangular in shape when viewed from above, with its longitudinal direction parallel to the Y direction and its transverse direction parallel to the X direction. The length L4 of the longitudinal direction (Y direction) of the image display device 60 can be selected within the range of, for example, 20 mm to 500 mm, preferably 100 mm to 200 mm, and the length L5 of the transverse direction (X direction) of the image display device 60 can be selected within the range of, for example, 20 mm to 500 mm, preferably 50 mm to 100 mm. The corners of the image display device 60 may also be rounded.

[0082] [Wiring board configuration] Next, the configuration of the wiring board will be described with reference to Figures 3 to 6. Figures 3 to 6 are diagrams showing the wiring board according to this embodiment.

[0083] As shown in Figure 3, the wiring board 10 according to this embodiment is used in the image display device 60 (see Figures 1 and 2) described above, and is located on the light-emitting surface 64 side of the display device 61, and is positioned between the first transparent adhesive layer 95 and the second transparent adhesive layer 96. Such a wiring board 10 has a transparent substrate 11, a mesh wiring layer 20 disposed on the substrate 11, a power supply unit 40 electrically connected to the mesh wiring layer 20, and a protective layer 17 disposed on the substrate 11 and covering the mesh wiring layer 20 and the power supply unit 40. The power supply unit 40 is also electrically connected to the mesh wiring layer 20.

[0084] The substrate 11 is approximately rectangular in shape when viewed from above, with its longitudinal direction parallel to the Y direction and its transverse direction parallel to the X direction. The substrate 11 is transparent and approximately flat, and its thickness is approximately uniform throughout. The length L1 in the longitudinal direction (Y direction) of the substrate 11 can be selected from, for example, a range of 2 mm to 300 mm, a range of 10 mm to 200 mm, or a range of 100 mm to 200 mm. The length L2 in the transverse direction (X direction) of the substrate 11 can be selected from, for example, a range of 2 mm to 300 mm, a range of 3 mm to 100 mm, or a range of 50 mm to 100 mm. The corners of the substrate 11 may also be rounded.

[0085] The material of the substrate 11 may be any material having transparency in the visible light region and electrical insulation properties. In this embodiment, the material of the substrate 11 is polyethylene terephthalate, but it is not limited to this. Preferably, the material of the substrate 11 is an organic insulating material such as a polyester resin such as polyethylene terephthalate, an acrylic resin such as polymethyl methacrylate, a polycarbonate resin, a polyimide resin, or a polyolefin resin such as cycloolefin polymer, a cellulose resin such as triacetylcellulose, or a fluororesin material such as PTFE or PFA. Alternatively, the material of the substrate 11 may be an organic insulating material such as a cycloolefin polymer (e.g., ZF-16 manufactured by Nippon Zeon Co., Ltd.) or a polynorbornene polymer (manufactured by Sumitomo Bakelite Co., Ltd.). Furthermore, depending on the application, glass, ceramics, etc. can be appropriately selected as the material of the substrate 11. Although the illustration shows an example in which the substrate 11 is composed of a single layer, it is not limited to this, and may have a structure in which multiple substrates or layers are laminated. Also, the substrate 11 may be in the form of a film or a plate.

[0086] Furthermore, it is preferable that the dielectric loss tangent of the substrate 11 is 0.002 or less. By having the dielectric loss tangent of the substrate 11 within the above range, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced, especially when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are of high frequency.

[0087] The relative permittivity of the substrate 11 is preferably between 2 and 10. Having a relative permittivity of 2 or higher allows for a wider range of material choices for the substrate 11. Furthermore, having a relative permittivity of 10 or lower reduces the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves. That is, when the relative permittivity of the substrate 11 is high, the influence of the substrate 11's thickness on electromagnetic wave propagation increases. Also, if there is an adverse effect on electromagnetic wave propagation, the dielectric loss tangent of the substrate 11 increases, potentially leading to a greater loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves. In contrast, having a relative permittivity of 10 or lower reduces the influence of the substrate 11's thickness on electromagnetic wave propagation. Therefore, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced. In particular, when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high-frequency, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced.

[0088] The dielectric loss tangent and relative permittivity of the substrate 11 can be measured in accordance with IEC 62562. Specifically, first, a test specimen is prepared by cutting out a portion of the substrate 11 where the mesh wiring layer 20 is not formed. The dimensions of the test specimen are 10 mm to 20 mm in width and 50 mm to 100 mm in length. Next, the dielectric loss tangent or relative permittivity is measured in accordance with IEC 62562.

[0089] Furthermore, the substrate 11 is transparent. In this specification, "transparent" means that the transmittance of visible light (light rays with wavelengths of 400 nm to 700 nm) is 85% or more. The substrate 11 may have a transmittance of visible light (light rays with wavelengths of 400 nm to 700 nm) of 85% or more, but it is preferable that it is 90% or more. There is no particular upper limit to the transmittance of visible light of the substrate 11, but it may be, for example, 100% or less. By setting the transmittance of visible light of the substrate 11 within the above range, the transparency of the wiring board 10 is increased, and the display device 61 of the image display device 60 can be made easier to see. Visible light refers to light rays with wavelengths of 400 nm to 700 nm. Furthermore, a visible light transmittance of 85% or higher means that when the absorbance of the substrate 11 is measured using a known spectrophotometer (for example, a spectrometer manufactured by JASCO Corporation: V-670), the transmittance is 85% or higher in the entire wavelength range from 400 nm to 700 nm.

[0090] In this embodiment, the mesh wiring layer 20 consists of an antenna pattern that functions as an antenna. In Figure 3, one mesh wiring layer 20 is formed on the substrate 11. Also, as shown in Figure 3, the mesh wiring layer 20 does not have to be present over the entire surface of the substrate 11, but may be present only in a part of the substrate 11. This mesh wiring layer 20 corresponds to a predetermined frequency band. That is, the mesh wiring layer 20 has a length (length in the Y direction) L a The length corresponds to a specific frequency band. Note that the lower the frequency band, the longer the mesh wiring layer L 20. abecomes longer. The mesh wiring layer 20 may correspond to any one of an antenna for telephone, an antenna for WiFi, an antenna for 3G, an antenna for 4G, an antenna for 5G, an antenna for LTE, an antenna for Bluetooth (registered trademark), an antenna for NFC, an antenna for millimeter wave, etc. Note that a plurality of mesh wiring layers 20 may be formed on the substrate 11. In this case, the lengths of the plurality of mesh wiring layers 20 may be different from each other and may correspond to different frequency bands. Alternatively, when the wiring board 10 does not have a radio wave transmission / reception function, each mesh wiring layer 20 may perform functions such as hovering (a function that allows the user to operate without directly touching the display), fingerprint authentication, a heater, noise cut (shield), etc.

[0091] The mesh wiring layer 20 has a proximal end portion (transmission portion) 20a on the power supply unit 40 side and a distal end portion (transmission / reception portion) 20b connected to the proximal end portion 20a. The proximal end portion 20a and the distal end portion 20b each have a substantially rectangular shape in plan view. In this case, the length (Y-direction distance) of the distal end portion 20b is longer than the length (Y-direction distance) of the proximal end portion 20a, and the width (X-direction distance) of the distal end portion 20b is wider than the width (X-direction distance) of the proximal end portion 20a.

[0092] The longitudinal direction of the mesh wiring layer 20 is parallel to the Y direction, and the short-side direction thereof is parallel to the X direction. The length L of the mesh wiring layer 20 in the longitudinal direction (Y direction) a can be selected, for example, in the range of 2 mm or more and 100 mm or less, or in the range of 3 mm or more and 100 mm or less. The width W of the mesh wiring layer 20 (distal end portion 20b) in the short-side direction (X direction) a can be selected, for example, in the range of 1 mm or more and 10 mm or less. In particular, when the mesh wiring layer 20 is an antenna for millimeter wave, the length L of the mesh wiring layer 20 aThe mesh wiring layer can be selected within a range of 1 mm to 10 mm, more preferably 1.5 mm to 5 mm. Note that while Figure 5 shows the shape when the mesh wiring layer 20 functions as a monopole antenna, it is not limited to this and can also be shaped like a dipole antenna, loop antenna, slot antenna, microstrip antenna, patch antenna, etc.

[0093] Each mesh wiring layer 20 has metal wires formed in a grid or mesh shape, and has a repeating pattern in the X and Y directions. That is, the mesh wiring layer 20 has a pattern shape composed of a portion extending in the X direction (second direction wiring 22) and a portion extending in the Y direction (first direction wiring 21).

[0094] As shown in Figure 4, the mesh wiring layer 20 includes a plurality of first directional wirings (antenna wirings) 21 that function as antennas, and a plurality of second directional wirings (antenna connecting wirings) 22 that connect the plurality of first directional wirings 21. Specifically, the plurality of first directional wirings 21 and the plurality of second directional wirings 22 together form a grid or mesh shape. Each first directional wiring 21 extends in the direction corresponding to the antenna frequency band (longitudinal direction, Y direction), and each second directional wiring 22 extends in the direction perpendicular to the first directional wiring 21 (width direction, X direction). The first directional wiring 21 has a length L corresponding to a predetermined frequency band. a (See Figure 3 for the length of the mesh wiring layer 20 described above) it primarily functions as an antenna. On the other hand, the second directional wiring 22 connects these first directional wirings 21 to each other, thereby preventing problems such as the first directional wiring 21 being disconnected or the first directional wiring 21 losing electrical connection with the power supply unit 40.

[0095] In the mesh wiring layer 20, multiple openings 23 are formed by being surrounded by adjacent first-directional wirings 21 and adjacent second-directional wirings 22. Furthermore, the first-directional wirings 21 and second-directional wirings 22 are arranged at equal intervals from each other. That is, the multiple first-directional wirings 21 are arranged at equal intervals from each other, and their pitch P1 may be in the range of, for example, 0.01 mm to 1 mm. Similarly, the multiple second-directional wirings 22 are arranged at equal intervals from each other, and their pitch P2 may be in the range of, for example, 0.01 mm to 1 mm. In this way, because the multiple first-directional wirings 21 and multiple second-directional wirings 22 are arranged at equal intervals, there is no variation in the size of the openings 23 within the mesh wiring layer 20, making the mesh wiring layer 20 difficult to see with the naked eye. In addition, the pitch P1 of the first-directional wirings 21 is equal to the pitch P2 of the second-directional wirings 22. Therefore, each opening 23 is approximately square in plan view, and the transparent substrate 11 is exposed through each opening 23. By increasing the area of ​​each opening 23, the overall transparency of the wiring board 10 can be increased. The length L3 of one side of each opening 23 may be, for example, in the range of 0.01 mm to 1 mm. Although each first directional wiring 21 and each second directional wiring 22 are orthogonal to each other, they are not limited to this and may intersect each other at acute or obtuse angles. Furthermore, it is preferable that the shape and size of the openings 23 be the same across the entire surface, but they do not have to be uniform across the entire surface, for example, by varying them in different locations.

[0096] As shown in Figure 5, each first-directional wiring 21 has a roughly rectangular or roughly square cross-section perpendicular to its longitudinal direction (cross-section in the X direction). In this case, the cross-sectional shape of the first-directional wiring 21 is roughly uniform along its longitudinal direction (Y direction). Also, as shown in Figure 6, the shape of the cross-section perpendicular to the longitudinal direction (cross-section in the Y direction) of each second-directional wiring 22 is roughly rectangular or roughly square, and is roughly the same as the cross-sectional shape (cross-section in the X direction) of the first-directional wiring 21 described above. In this case, the cross-sectional shape of the second-directional wiring 22 is roughly uniform along its longitudinal direction (X direction). The cross-sectional shapes of the first-directional wiring 21 and the second-directional wiring 22 do not necessarily have to be roughly rectangular or roughly square; for example, they may be roughly trapezoidal in shape, where the front side (positive Z direction side) is narrower than the back side (negative Z direction side), or they may have curved sides on both sides in the longitudinal direction.

[0097] In this embodiment, the line width W1 (length in the X direction, see Figure 5) of the first direction wiring 21 and the line width W2 (length in the Y direction, see Figure 6) of the second direction wiring 22 are not particularly limited and can be appropriately selected depending on the application. For example, the line width W1 of the first direction wiring 21 can be selected in the range of 0.1 μm to 5.0 μm, and is preferably 0.2 μm to 2.0 μm. Similarly, the line width W2 of the second direction wiring 22 can be selected in the range of 0.1 μm to 5.0 μm, and is preferably 0.2 μm to 2.0 μm. Furthermore, the height H1 (length in the Z direction, see Figure 5) of the first direction wiring 21 and the height H2 (length in the Z direction, see Figure 6) of the second direction wiring 22 are not particularly limited and can be appropriately selected depending on the application. The height H1 of the first directional wiring 21 and the height H2 of the second directional wiring 22 can each be selected within a range of, for example, 0.1 μm to 5.0 μm, and preferably between 0.2 μm and 2.0 μm.

[0098] The material of the first directional wiring 21 and the second directional wiring 22 may be any conductive metallic material. In this embodiment, the material of the first directional wiring 21 and the second directional wiring 22 is copper, but it is not limited to this. For example, the material of the first directional wiring 21 and the second directional wiring 22 may be a metallic material (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel. Furthermore, the first directional wiring 21 and the second directional wiring 22 may be a plated layer formed by electroplating.

[0099] The overall aperture ratio At of the mesh wiring layer 20 may be, for example, in the range of 87% or more and less than 100%. By setting the overall aperture ratio At of the mesh wiring layer 20 within this range, the conductivity and transparency of the wiring substrate 10 can be ensured. The aperture ratio refers to the ratio (%) of the area of ​​the opening region (the area where there are no metal parts such as the first direction wiring 21 and the second direction wiring 22, and the substrate 11 is exposed) to a unit area of ​​a predetermined region (for example, the entire area of ​​the mesh wiring layer 20).

[0100] Referring again to Figures 3 and 4, the power supply unit 40 is electrically connected to the mesh wiring layer 20. This power supply unit 40 consists of a substantially rectangular conductive thin plate-like member. The longitudinal direction of the power supply unit 40 is parallel to the X direction, and the short direction of the power supply unit 40 is parallel to the Y direction. The power supply unit 40 is also located at the longitudinal end (negative Y-direction end) of the substrate 11. The material of the power supply unit 40 can be a metallic material (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel. Unlike the mesh wiring layer 20, the power supply unit 40 may be a plate-like member without openings. When the module 80A, which includes the wiring board 10, is incorporated into the image display device 60 (see Figures 1 and 2), this power supply unit 40 is electrically connected to the communication module 63 of the image display device 60 via a power supply line 85. The power supply unit 40 is provided on the first surface 11a of the substrate 11, but is not limited to this, and part or all of the power supply unit 40 may be located outside the periphery of the substrate 11. Furthermore, by forming the power supply unit 40 flexibly, the power supply unit 40 may wrap around to the side or back of the image display device 60 and be electrically connected on the side or back.

[0101] As shown in Figure 4, multiple first-direction wirings 21 are electrically connected to the power supply unit 40 on the positive side in the Y direction. In this case, the power supply unit 40 is formed integrally with the mesh wiring layer 20. The thickness T5 of the power supply unit 40 (length in the Z direction, see Figure 6) can be the same as the height H1 of the first-direction wiring 21 (see Figure 5) and the height H2 of the second-direction wiring 22 (see Figure 6), and can be selected in a range of, for example, 0.1 μm to 5.0 μm.

[0102] Furthermore, as shown in Figures 5 and 6, a protective layer 17 is formed on the first surface 11a of the substrate 11 so as to cover the mesh wiring layer 20 and the power supply unit 40. The protective layer 17 is a layer that protects the mesh wiring layer 20 and the power supply unit 40. As shown in Figures 3, 4 and 6, the protective layer 17 covers only a part of the power supply unit 40. That is, there is an area of ​​the power supply unit 40 that is not covered by the protective layer 17. Specifically, the protective layer 17 covers the entire mesh wiring layer 20 and a part of the power supply unit 40 on the positive side in the Y direction. A part of the power supply unit 40 on the negative side in the Y direction is not covered by the protective layer 17. In other words, the wiring substrate 10 has a protected area 10a where the first surface 11a is covered by the protective layer 17, and an unprotected area 10b where the first surface 11a is not covered by the protective layer 17.

[0103] The thickness T6 of the protective layer 17 (length in the Z direction, see Figure 6) may be between 4.0 μm and 8.0 μm. A thickness T6 of 4.0 μm or more enhances the scratch resistance and weather resistance of the protective layer 17. A thickness T6 of 8.0 μm or less prevents the protective layer 17 from becoming too thick, thus reducing the overall thickness of the image display device 60. In this embodiment, the thickness T6 of the protective layer 17 refers to the distance in the Z direction from the surface of the power supply unit 40 to the surface of the protective layer 17.

[0104] Furthermore, the dielectric loss tangent of the protective layer 17 is preferably 0.005 or less. This effectively suppresses the protective layer 17 from affecting the transmission and reception of radio waves in the mesh wiring layer 20. As a result, a decrease in antenna performance can be suppressed. The dielectric loss tangent of the protective layer 17 can be measured in accordance with IEC 62562 by the same method as the method for measuring the relative permittivity of the substrate 11. In this case, the dielectric loss tangent of the protective layer 17 is measured with the protective layer 17 peeled off from the substrate 11.

[0105] As the material for the protective layer 17, colorless and transparent insulating resins such as polymethyl (meth)acrylate, polyethyl (meth)acrylate, acrylic resins and their modified resins and copolymers, polyester resins, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral and their copolymers, polyurethane resins, epoxy resins, polyamide resins, and chlorinated polyolefins can be used.

[0106] The protective layer 17 preferably contains an acrylic resin or a polyester resin. This improves the adhesion between the first directional wiring 21 and the second directional wiring 22, as well as the adhesion between the protective layer and the substrate 11. As a result, the abrasion resistance and weather resistance of the first directional wiring 21 and the second directional wiring 22 can be increased. Furthermore, invisibility can be maintained, and antenna performance can be preserved.

[0107] Furthermore, it is preferable that the protective layer 17 contains silicon dioxide. The silicon dioxide may be added to the resin as a powder. Alternatively, it may be formed as a film that is substantially free of resin by methods such as vapor deposition, sputtering, or CVD. This improves the slipperiness of the surface of the protective layer 17 and the anti-reflective properties of the protective layer 17.

[0108] [Module configuration] Next, the module configuration will be described with reference to Figures 7 to 9. Figures 7 to 9 show the module according to this embodiment.

[0109] As shown in Figure 7, module 80A comprises the wiring board 10 described above and a power supply line 85 electrically connected to the power supply unit 40 via an anisotropic conductive film 85c. As described above, when module 80A is incorporated into the image display device 60 having a display device 61, the power supply unit 40 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply line 85.

[0110] The power supply line 85 has a roughly rectangular shape in plan view. In this case, the width (distance in the X direction) of the power supply line 85 may be approximately the same as the width (distance in the X direction) of the power supply unit 40. Also, the area of ​​the power supply line 85 may be approximately the same as the area of ​​the power supply unit 40. This makes it possible to bring the electrical resistance of the power supply line 85 and the electrical resistance of the power supply unit 40 closer to each other. As a result, impedance matching can be easily achieved between the power supply line 85 and the power supply unit 40, and a decrease in electrical connectivity between the power supply line 85 and the power supply unit 40 can be suppressed.

[0111] Here, as shown in Figure 8(a), through holes 41 may be formed in the power supply section 40. In the illustrated example, the power supply section 40 has multiple (six) through holes 41. That is, in Figure 8(a), three through holes 41 are provided along the X direction, and two rows of these three through holes 41 are provided along the Y direction. Note that the number of through holes 41 is not limited to this. By forming through holes 41 in the power supply section 40 in this way, the area of ​​the power supply section 40 (the area of ​​the region where the metal part exists) can be easily adjusted.

[0112] Furthermore, as shown in Figure 8(b), the end of the power supply line 85 on the power supply unit 40 side may be formed in a comb-like shape. That is, the power supply line 85 may have a main body 88 that is substantially rectangular in plan view, and a plurality (four) of protruding parts 89 that protrude from the main body 88 toward the power supply unit 40 side (positive Y direction). This allows the area of ​​the power supply line 85 to be easily adjusted. As a result, the area of ​​the power supply line 85 and the area of ​​the power supply unit 40 can be made substantially the same. The number of protruding parts 89 may be one to three or more, or five or more.

[0113] Referring again to Figure 7, the power supply line 85 is crimped to the wiring board 10 via an anisotropic conductive film (ACF) 85c. The anisotropic conductive film 85c contains a resin material such as acrylic resin or epoxy resin, and conductive particles 85d (see Figure 9). The anisotropic conductive film 85c covers the area of ​​the power supply section 40 that is not covered by the protective layer 17. This suppresses corrosion of the power supply section 40. In this embodiment, the anisotropic conductive film 85c covers the entire area of ​​the power supply section 40 that is not covered by the protective layer 17.

[0114] Furthermore, as shown in Figure 9, a portion of the anisotropic conductive film 85c is placed on the protective layer 17. This ensures that the anisotropic conductive film 85c reliably covers the area of ​​the power supply unit 40 that is not covered by the protective layer 17, thereby more effectively suppressing corrosion of the power supply unit 40.

[0115] The anisotropic conductive film 85c is positioned opposite the power supply unit 40. A portion of the conductive particles 85d are in contact with the power supply unit 40. This electrically connects the power supply line 85 to the power supply unit 40. Note that a portion of the anisotropic conductive film 85c may dissolve around the power supply line 85 when the power supply line 85 is crimped to the wiring board 10. The particle size of the conductive particles 85d may be, for example, about 7 μm.

[0116] The power supply line 85 may be, for example, a flexible printed circuit board. As shown in Figure 9, the power supply line 85 has a base material 85a and a metal wiring section 85b laminated on the base material 85a. The base material 85a may contain, for example, a resin material such as polyimide or a liquid crystal polymer. The metal wiring section 85b may contain, for example, copper. This metal wiring section 85b is electrically connected to the power supply section 40 via conductive particles 85d.

[0117] [Manufacturing method for wiring boards, manufacturing method for modules, and manufacturing method for laminates for image display devices] Next, with reference to Figures 10(a)-(f), 11(a)-(c), and 12(a)-(c), the manufacturing method of the wiring board 10, the manufacturing method of the module 80A, and the manufacturing method of the laminated body 70 for the image display device according to this embodiment will be described. Figures 10(a)-(f) are cross-sectional views showing the manufacturing method of the wiring board 10 according to this embodiment. Figures 11(a)-(c) are cross-sectional views showing the manufacturing method of the module 80A according to this embodiment. Figures 12(a)-(c) are cross-sectional views showing the manufacturing method of the laminated body 70 for the image display device according to this embodiment.

[0118] First, the method for manufacturing a wiring board according to this embodiment will be described with reference to Figures 10(a)-(f).

[0119] First, a substrate 11 is prepared, which includes a first surface 11a and a second surface 11b located opposite the first surface 11a. The substrate 11 is transparent.

[0120] Next, a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20 are formed on the first surface 11a of the substrate 11.

[0121] In this case, first, as shown in Figure 10(a), a metal foil 51 is laminated over substantially the entire surface 11a of the substrate 11. In this embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In this embodiment, the metal foil 51 may contain copper.

[0122] Next, as shown in Figure 10(b), a photocurable insulating resist 52 is supplied to substantially the entire surface of the metal foil 51. Examples of this photocurable insulating resist 52 include organic resins such as acrylic resin and epoxy resin.

[0123] Next, as shown in Figure 10(c), the insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form the insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the first directional wiring 21 and the second directional wiring 22 is exposed.

[0124] Next, as shown in Figure 10(d), the metal foil 51 located on the first surface 11a of the substrate 11, in the portion not covered by the insulating layer 54, is removed. In this process, the metal foil 51 is etched so that the first surface 11a of the substrate 11 is exposed by performing a wet treatment using ferric chloride, cupric chloride, strong acids such as sulfuric acid and hydrochloric acid, persulfates, hydrogen peroxide, aqueous solutions thereof, or combinations thereof.

[0125] Next, as shown in Figure 10(e), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or by dry treatment using oxygen plasma.

[0126] In this way, a substrate 11 and a mesh wiring layer 20 provided on the first surface 11a of the substrate 11 are obtained. In this case, the mesh wiring layer 20 includes first-directional wiring 21 and second-directional wiring 22. At this time, a power supply section 40 may be formed by a part of the metal foil. Alternatively, a flat plate-shaped power supply section 40 may be prepared separately and electrically connected to the mesh wiring layer 20.

[0127] Subsequently, as shown in Figure 10(f), a protective layer 17 is formed on the first surface 11a of the substrate 11 so as to cover the mesh wiring layer 20 and the power supply unit 40. The protective layer 17 is formed so as to cover only a part of the power supply unit 40 (see Figure 9). Methods for forming the protective layer 17 may include roll coating, gravure coating, gravure reverse coating, microgravure coating, slot die coating, die coating, knife coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, and flexographic printing.

[0128] In this way, a wiring board 10 is obtained having a substrate 11, a mesh wiring layer 20 disposed on the first surface 11a of the substrate 11, a power supply unit 40 electrically connected to the mesh wiring layer 20, and a protective layer 17 disposed on the first surface 11a of the substrate 11 and covering the mesh wiring layer 20 and the power supply unit 40.

[0129] Next, the method for manufacturing a module according to this embodiment will be described with reference to Figures 11(a)-(c).

[0130] First, prepare the wiring board 10 as shown in Figure 11(a). In this case, the wiring board 10 is manufactured, for example, by the method shown in Figures 10(a)-(f).

[0131] Next, the power supply line 85 is electrically connected to the power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d. First, as shown in Figure 11(b), the anisotropic conductive film 85c is placed on the wiring board 10. At this time, the anisotropic conductive film 85c is positioned to face the power supply unit 40.

[0132] Next, as shown in Figure 11(c), the power supply line 85 is crimped to the wiring board 10. At this time, pressure and heat are applied to the power supply line 85 to the wiring board 10, causing it to be crimped. Then, a portion of the conductive particles 85d come into contact with the power supply unit 40. In this way, the power supply line 85 is electrically connected to the power supply unit 40. When crimping the power supply line 85 to the wiring board 10, the anisotropic conductive film 85c is applied so as to cover the area of ​​the power supply unit 40 that is not covered by the protective layer 17. In addition, a portion of the anisotropic conductive film 85c dissolves around the power supply line 85, so that a portion of the anisotropic conductive film 85c is placed on the protective layer 17.

[0133] In this way, a module 80A is obtained that includes a wiring board 10 and a power supply line 85 electrically connected to a power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d.

[0134] Next, with reference to Figures 12(a)-(c), a method for manufacturing the laminated image display device 70 according to this embodiment will be described.

[0135] Next, the first transparent adhesive layer 95, the wiring board 10 of module 80A, and the second transparent adhesive layer 96 are laminated together. First, as shown in Figure 12(a), an OCA sheet 90a is prepared, which includes, for example, a release film 91 made of polyethylene terephthalate (PET) and an OCA layer 92 (first transparent adhesive layer 95 or second transparent adhesive layer 96) laminated on the release film 91. At this time, the OCA layer 92 may be a layer obtained by coating the release film 91 with a liquid curable adhesive layer composition containing a polymerizable compound and curing it using, for example, ultraviolet light (UV). This curable adhesive layer composition contains a polar group-containing monomer.

[0136] Next, as shown in Figure 12(b), the OCA layer 92 of the OCA sheet 90a is bonded to the wiring board 10. This sandwiches the wiring board 10 between the OCA layer 92.

[0137] Subsequently, as shown in Figure 12(c), the release film 91 is peeled off from the OCA layer 92 of the OCA sheet 90a bonded to the wiring board 10, thereby obtaining the first transparent adhesive layer 95 (OCA layer 92), the wiring board 10, and the second transparent adhesive layer 96 (OCA layer 92) which are laminated together.

[0138] In this way, a laminate 70 for an image display device is obtained, comprising a first transparent adhesive layer 95, a second transparent adhesive layer 96, and a module 80A having a wiring board 10.

[0139] Subsequently, by stacking the display device 61 on the image display device laminate 70, an image display device 60 is obtained, comprising the image display device laminate 70 and the display device 61 stacked on the image display device laminate 70.

[0140] [Operation of this embodiment] Next, we will describe the operation of this embodiment, which has the above configuration.

[0141] As shown in Figures 1 and 2, the wiring board 10 is incorporated into an image display device 60 having a display device 61. At this time, the wiring board 10 is placed on the display device 61. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via a power supply unit 40 and a power supply line 85. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0142] In this embodiment, the protective layer 17 covers only a portion of the power supply unit 40, and the anisotropic conductive film 85c covers the area of ​​the power supply unit 40 that is not covered by the protective layer 17. This suppresses a decrease in electrical connectivity between the power supply line 85 and the power supply unit 40, and also suppresses corrosion of the power supply unit 40.

[0143] Furthermore, according to this embodiment, the wiring board 10 comprises a substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. The substrate 11 is transparent. In addition, the mesh wiring layer 20 has a conductive portion that forms an opaque conductive layer and a mesh-like pattern with numerous openings. Therefore, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is placed on the display device 61, the display device 61 can be viewed through the openings 23 of the mesh wiring layer 20, and the visibility of the display device 61 is not obstructed.

[0144] Furthermore, according to this embodiment, a portion of the anisotropic conductive film 85c is placed on the protective layer 17. This ensures that the anisotropic conductive film 85c reliably covers the area of ​​the power supply unit 40 that is not covered by the protective layer 17, thereby more effectively suppressing corrosion of the power supply unit 40.

[0145] [Differentiation] Next, we will explain how to modify the module.

[0146] (First variation) Figure 13 shows a first modified example of the module. The modified example shown in Figure 13 differs in that the wiring board 10 further has a dark-colored layer 18 provided on the mesh wiring layer 20, while the other configurations are substantially the same as those shown in Figures 1 to 12 described above. In Figure 13, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 12, and detailed explanations are omitted.

[0147] In module 80A shown in Figure 13, a dark-colored layer (blackened layer) 18 is formed on the mesh wiring layer 20 of the wiring board 10. This dark-colored layer 18 is a layer that makes the mesh wiring layer 20 difficult to see with the naked eye by suppressing the reflection of visible light by the mesh wiring layer 20. As shown in Figure 13, the dark-colored layer 18 covers the entire area of ​​the mesh wiring layer 20 and the entire area of ​​the power supply section 40. The dark-colored layer 18 is also covered by a protective layer 17.

[0148] The dark layer 18 may be any layer with a lower visible light reflectivity than the protective layer 17, for example, a dark-colored layer such as black. The dark layer 18 may also be a layer with a roughened surface.

[0149] The dark layer 18 may be formed, for example, from a portion of the metal material constituting the mesh wiring layer 20 or the power supply unit 40 by applying a darkening treatment (blackening treatment) to that portion. In this case, the dark layer 18 may be formed as a layer made of metal oxide or metal sulfide. Alternatively, the dark layer 18 may be formed on the surface of the mesh wiring layer 20 or the power supply unit 40 as a coating of dark material or as a plating layer of nickel or chromium. Furthermore, the dark layer 18 may be formed by roughening the surface of the mesh wiring layer 20 or the power supply unit 40.

[0150] According to this modified example, the wiring board 10 further has a dark-colored layer 18 provided on the mesh wiring layer 20. This suppresses the reflection of visible light by the mesh wiring layer 20, making the mesh wiring layer 20 even less visible to the naked eye.

[0151] Furthermore, in this modified example, the protective layer 17 covers only a portion of the power supply section 40, and the anisotropic conductive film 85c (see Figure 9) covers the area of ​​the power supply section 40 that is not covered by the protective layer 17. This suppresses a decrease in electrical connectivity between the power supply line 85 and the power supply section 40, and also suppresses corrosion of the power supply section 40. However, if a dark-colored layer 18 is formed on the power supply section 40 to suppress the reflection of visible light by the mesh wiring layer 20, the corrosion resistance of the power supply section 40 may decrease. In contrast, in this modified example, as described above, corrosion of the power supply section 40 can be suppressed. Therefore, according to this modified example, corrosion of the power supply section 40 can be suppressed while suppressing the reflection of visible light by the mesh wiring layer 20.

[0152] (Second variation) Figures 14 and 15 show a second modified example of the module. The modified example shown in Figures 14 and 15 differs in that the anisotropic conductive film 85c covers only a portion of the power supply section 40 that is not covered by the protective layer 17; the other configurations are substantially the same as those shown in Figures 1 to 13 described above. In Figures 14 and 15, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 13, and detailed explanations are omitted.

[0153] In module 80A shown in Figure 14, the anisotropic conductive film 85c covers only a portion of the power supply section 40 that is not covered by the protective layer 17. The portion of the power supply section 40 that is not covered by either the protective layer 17 or the anisotropic conductive film 85c is covered by a coating layer 86 containing a corrosion-resistant material. In this case, the material of the coating layer 86 can be a metal such as gold, or a resin such as epoxy resin, imide resin, or acrylic resin.

[0154] Next, with reference to Figures 15(a)-(d), the manufacturing method of the module according to this modified example will be described.

[0155] First, prepare the wiring board 10 as shown in Figure 15(a). In this case, the wiring board 10 is manufactured, for example, by the method shown in Figures 10(a)-(f).

[0156] Next, the power supply line 85 is crimped to the wiring board 10 via an anisotropic conductive film 85c containing conductive particles 85d. First, as shown in Figure 15(b), the anisotropic conductive film 85c is placed on the wiring board 10. At this time, the anisotropic conductive film 85c is positioned to face the power supply section 40.

[0157] Next, as shown in Figure 15(c), the power supply line 85 is crimped to the wiring board 10. At this time, the power supply line 85 is crimped to the wiring board 10 such that the anisotropic conductive film 85c covers only a portion of the area of ​​the power supply section 40 that is not covered by the protective layer 17.

[0158] Next, as shown in Figure 15(d), a coating layer 86 is formed to cover the area of ​​the power supply unit 40 that is not covered by either the protective layer 17 or the anisotropic conductive film 85c. In this case, the coating layer 86 may be formed by plating, and gold may be used as the metal constituting the coating layer 86.

[0159] In this way, a module 80A is obtained that includes a wiring board 10 and a power supply line 85 electrically connected to a power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d.

[0160] In this modified example, the area of ​​the power supply section 40 that is not covered by either the protective layer 17 or the anisotropic conductive film 85c is covered by a coating layer 86 containing a corrosion-resistant material. In this case as well, a decrease in electrical connectivity between the power supply line 85 and the power supply section 40 can be suppressed, and corrosion of the power supply section 40 can be suppressed.

[0161] (Third variation) Figures 16 and 17 show a third modified example of the module. The modified examples shown in Figures 16 and 17 differ in that the conductive particles 85d are embedded within the protective layer 17; the other configurations are substantially the same as those shown in Figures 1 to 15 described above. In Figures 16 and 17, the same reference numerals are used for parts identical to those shown in Figures 1 to 15, and detailed explanations are omitted.

[0162] In module 80A shown in Figure 16, the conductive particles 85d penetrate into the protective layer 17. The power supply line 85 is electrically connected to the power supply unit 40 because the conductive particles 85d penetrate into the protective layer 17. In other words, when the power supply line 85 is crimped to the wiring board 10, the conductive particles 85d of the anisotropic conductive film 85c penetrate the surface of the protective layer 17 and enter into the protective layer 17. A portion of the conductive particles 85d then comes into contact with the power supply unit 40. Thus, the power supply line 85 is electrically connected to the power supply unit 40 because the conductive particles 85d penetrate into the protective layer 17.

[0163] In this modified example, the pencil hardness of the surface of the protective layer 17 is preferably between B and 2H. A pencil hardness of B or higher on the surface of the protective layer 17 enhances its abrasion resistance and weather resistance. Furthermore, a pencil hardness of 2H or lower on the surface of the protective layer 17 allows the conductive particles 85d of the anisotropic conductive film (ACF) 85c to penetrate more easily into the protective layer 17, improving the electrical connectivity between the power supply unit 40 and the power supply line 85. The pencil hardness can be measured in accordance with the pencil hardness test specified in JIS K5600-5-4:1999.

[0164] Furthermore, as mentioned above, the thickness T6 of the protective layer 17 (see Figure 6) may be between 4.0 μm and 8.0 μm. By making the thickness T6 of the protective layer 17 8.0 μm or less, the conductive particles 85d of the anisotropic conductive film (ACF) 85c can easily come into contact with the power supply unit 40 when they penetrate into the protective layer 17. This ensures an electrical connection between the power supply unit 40 and the power supply line 85.

[0165] Next, with reference to Figures 17(a)-(c), the manufacturing method of the module according to this modified example will be described.

[0166] First, prepare the wiring board 10 as shown in Figure 17(a). In this case, the wiring board 10 is manufactured, for example, by the method shown in Figures 10(a)-(f). Here, in this modified example, the protective layer 17 may be formed to cover the entire area of ​​the power supply section 40 (see Figure 17(a)).

[0167] Next, the power supply line 85 is crimped to the wiring board 10 via an anisotropic conductive film 85c containing conductive particles 85d. First, as shown in Figure 17(b), the anisotropic conductive film 85c is placed on the wiring board 10. At this time, the anisotropic conductive film 85c is positioned to face the power supply section 40.

[0168] Next, as shown in Figure 17(c), the power supply line 85 is crimped to the wiring board 10. At this time, the conductive particles 85d of the anisotropic conductive film 85c penetrate the surface of the protective layer 17 and enter the protective layer 17. Then, some of the conductive particles 85d come into contact with the power supply unit 40. In this way, the power supply line 85 is electrically connected to the power supply unit 40 by the conductive particles 85d entering the protective layer 17.

[0169] In this way, a module 80A is obtained that includes a wiring board 10 and a power supply line 85 electrically connected to a power supply unit 40 via an anisotropic conductive film 85c containing conductive particles 85d.

[0170] In this modified example, the power supply line 85 is electrically connected to the power supply unit 40 by conductive particles 85d entering the protective layer 17. In this case as well, a decrease in electrical connectivity between the power supply line 85 and the power supply unit 40 can be suppressed, and corrosion of the power supply unit 40 can be suppressed.

[0171] Next, we will describe a modified example of a wiring board.

[0172] (First variation) Figures 18 and 19 show a first modified example of the wiring board. The modified example shown in Figures 18 and 19 differs in that a dummy wiring layer 30 is provided around the mesh wiring layer 20, while the other configurations are substantially the same as those shown in Figures 1 to 17 described above. In Figures 18 and 19, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 17, and detailed explanations are omitted.

[0173] In the wiring board 10 shown in Figure 18, a dummy wiring layer 30 is provided around the mesh wiring layer 20. Unlike the mesh wiring layer 20, this dummy wiring layer 30 does not substantially function as an antenna.

[0174] As shown in Figure 19, the dummy wiring layer 30 is composed of repeating dummy wiring 30a having a predetermined unit pattern shape. That is, the dummy wiring layer 30 contains multiple dummy wiring 30a of the same shape, and each dummy wiring 30a is electrically independent from the mesh wiring layer 20 (first direction wiring 21 and second direction wiring 22). In other words, in the horizontal direction, each dummy wiring 30a is spaced apart from the mesh wiring layer 20. Furthermore, the multiple dummy wiring 30a are regularly arranged throughout the entire area of ​​the dummy wiring layer 30. The multiple dummy wiring 30a are spaced apart from each other in the planar direction and are positioned protruding from the substrate 11. That is, each dummy wiring 30a is electrically independent from the mesh wiring layer 20, the power supply unit 40, and other dummy wiring 30a. Each dummy wiring 30a is approximately L-shaped in plan view.

[0175] In this case, the dummy wiring 30a has a shape in which a part of the unit pattern shape of the mesh wiring layer 20 described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring layer 20 and the dummy wiring layer 30, and makes the mesh wiring layer 20 placed on the substrate 11 less visible. The aperture ratio of the dummy wiring layer 30 may be the same as or different from that of the mesh wiring layer 20, but it is preferable that it is close to the aperture ratio of the mesh wiring layer 20.

[0176] In this way, by arranging a dummy wiring layer 30 electrically independent of the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be obscured. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0177] (Second variation) Figures 20 and 21 show a second modified example of the wiring board. The modified examples shown in Figures 20 and 21 differ in that multiple dummy wiring layers 30A and 30B with different aperture ratios are provided around the mesh wiring layer 20, while the other configurations are substantially the same as those shown in Figures 1 to 19 described above. In Figures 20 and 21, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 19, and detailed explanations are omitted.

[0178] In the wiring board 10 shown in Figure 20, multiple (in this case, two) dummy wiring layers 30A and 30B (first dummy wiring layer 30A and second dummy wiring layer 30B) with different aperture ratios are provided around the mesh wiring layer 20. Specifically, the first dummy wiring layer 30A is arranged around the mesh wiring layer 20, and the second dummy wiring layer 30B is arranged around the first dummy wiring layer 30A. Unlike the mesh wiring layer 20, these dummy wiring layers 30A and 30B do not substantially function as antennas.

[0179] As shown in Figure 21, the first dummy wiring layer 30A is composed of repeating dummy wiring 30a1 having a predetermined unit pattern shape. The second dummy wiring layer 30B is composed of repeating dummy wiring 30a2 having a predetermined unit pattern shape. That is, dummy wiring layers 30A and 30B each contain multiple dummy wirings 30a1 and 30a2 of the same shape, and each dummy wiring 30a1 and 30a2 is electrically independent from the mesh wiring layer 20. Furthermore, the dummy wirings 30a1 and 30a2 are regularly arranged throughout the entire area of ​​dummy wiring layers 30A and 30B, respectively. Each dummy wiring 30a1 and 30a2 is spaced apart from each other in the planar direction and is positioned protruding from the substrate 11. Each dummy wiring 30a1 and 30a2 is electrically independent from the mesh wiring layer 20, the power supply unit 40, and other dummy wirings 30a1 and 30a2. Furthermore, each dummy wiring 30a1 and 30a2 is roughly L-shaped in plan view.

[0180] In this case, the dummy wiring 30a1 and 30a2 have a shape in which a part of the unit pattern shape of the mesh wiring layer 20 described above is missing. This makes it difficult to visually recognize the difference between the mesh wiring layer 20 and the first dummy wiring layer 30A, and the difference between the first dummy wiring layer 30A and the second dummy wiring layer 30B, thereby making the mesh wiring layer 20 placed on the substrate 11 less visible. The aperture ratio of the first dummy wiring layer 30A is greater than that of the mesh wiring layer 20, and the aperture ratio of the first dummy wiring layer 30A is greater than that of the second dummy wiring layer 30B.

[0181] Furthermore, the area of ​​each dummy wire 30a1 in the first dummy wiring layer 30A is larger than the area of ​​each dummy wire 30a2 in the second dummy wiring layer 30B. In this case, the line width of each dummy wire 30a1 is the same as the line width of each dummy wire 30a2, but this is not limited to this, and the line width of each dummy wire 30a1 may be thicker than the line width of each dummy wire 30a2. In addition, three or more dummy wiring layers with different aperture ratios may be provided. In this case, it is preferable that the aperture ratio of each dummy wiring layer gradually increases from those closer to the mesh wiring layer 20 to those further away.

[0182] In this way, by arranging dummy wiring layers 30A and 30B that are electrically independent from the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made more indistinct. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0183] (Third variation) Figure 22 shows a third modified example of the wiring board. The modified example shown in Figure 22 differs in the planar shape of the mesh wiring layer 20, but the other components are substantially the same as those shown in Figures 1 to 21 described above. In Figure 22, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 21, and detailed explanations are omitted.

[0184] Figure 22 is an enlarged plan view showing a modified mesh wiring layer 20. In Figure 22, the first directional wiring 21 and the second directional wiring 22 intersect at an angle (not perpendicular), and each opening 23 is formed in a rhombus shape in plan view. Neither the first directional wiring 21 nor the second directional wiring 22 are parallel to either the X or Y direction, but either one of the first directional wiring 21 or the second directional wiring 22 may be parallel to either the X or Y direction.

[0185] (Second Embodiment) Next, a second embodiment will be described with reference to Figures 23 to 30. Figures 23 to 30 show this embodiment. In Figures 23 to 30, the same reference numerals are used for parts that are the same as those in the first embodiment shown in Figures 1 to 22, and detailed descriptions may be omitted.

[0186] [Image display device configuration] The configuration of the image display device according to this embodiment will be described with reference to Figures 23 and 24.

[0187] As shown in Figures 23 and 24, the image display device 60 according to this embodiment comprises an image display device laminate 70 and a display unit (display) 610 having a display area 61a, which is laminated on the image display device laminate 70. The image display device laminate 70 includes a third adhesive layer 950, a fourth adhesive layer 960, and a wiring board 10 located between the third adhesive layer 950 and the fourth adhesive layer 960. A communication module 63 is also arranged on the negative Z-direction side relative to the display unit 610. The image display device laminate 70, the display unit 610, and the communication module 63 are housed in a housing 62.

[0188] The wiring board 10 comprises a transparent substrate 11, a metal layer 90, and a protective layer 17. The metal layer 90 is placed on the substrate 11. The metal layer 90 has a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20. The protective layer 17 covers a portion of the metal layer 90. That is, a portion of the metal layer 90 is not covered by the protective layer 17. In other words, the metal layer 90 includes a portion that is not covered by the protective layer 17. The protective layer 17 is present in at least a portion of the first region A1 and not in the second region A2. The first region A1 is a region that does not overlap with the display region 61a of the image display device 60. The second region A2 is a region that overlaps with the display region 61a of the image display device 60.

[0189] As shown in Figure 24, the image display device 60 has a light-emitting surface 64. The wiring board 10 is located on the side of the light-emitting surface 64 (positive Z-direction) relative to the display unit 610. The communication module 63 is located on the opposite side of the light-emitting surface 64 (negative Z-direction) relative to the display unit 610.

[0190] The display unit 610 is, for example, an organic EL (Electro-Luminescence) display device. The display unit 610 has a display area 61a on the wiring board 10 side. The display area 61a refers to the area on the surface of the display unit 610 that corresponds to the screen for displaying images, etc. The display unit 610 may include, for example, a metal layer (not shown), a support substrate, a resin substrate, a thin-film transistor (TFT), and an organic EL layer. A touch sensor (not shown) may be placed on the display unit 610. The wiring board 10 is also placed on the display unit 610 via a third adhesive layer 950. Note that the display unit 610 is not limited to an organic EL display device. For example, the display unit 610 may be another display device that has the function of emitting light itself, or it may be a micro-LED display device that includes a micro-LED element (light-emitting element). Also, the display unit 610 may be a liquid crystal display device that includes a liquid crystal. A cover glass (surface protective plate) 75 is placed on the wiring board 10 via a fourth adhesive layer 960. A decorative film 74 is placed between the fourth adhesive layer 960 and the cover glass 75. The decorative film 74 may define the boundary between the second region A2 and the first region A1. That is, the inner circumference of the decorative film 74 may be located on the aforementioned boundary. A polarizing plate (not shown) may also be placed between the fourth adhesive layer 960 and the cover glass 75.

[0191] The third adhesive layer 950 is an adhesive layer that directly or indirectly adheres the display unit 610 to the wiring board 10. The third adhesive layer 950 has optical transparency. The third adhesive layer 950 has a larger area than the substrate 11 of the wiring board 10. The visible light transmittance of the third adhesive layer 950 may be 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the third adhesive layer 950, but it may be, for example, 100% or less. Visible light refers to light rays with a wavelength of 400 nm or more and 700 nm or less. Furthermore, a visible light transmittance of 85% or more means that when the absorbance of the third adhesive layer 950 is measured using a known spectrophotometer (for example, a spectrometer manufactured by JASCO Corporation: V-670), the transmittance is 85% or more in the entire wavelength range of 400 nm to 700 nm.

[0192] The third adhesive layer 950 may be an OCA (Optical Clear Adhesive) layer. The OCA layer is a layer prepared, for example, as follows: First, a liquid curable adhesive layer composition containing a polymerizable compound is applied to a release film such as polyethylene terephthalate (PET). Next, the curable adhesive layer composition is cured using, for example, ultraviolet light (UV) to obtain an OCA sheet. After laminating this OCA sheet to the object, the release film is peeled off to obtain the OCA layer. The material of the third adhesive layer 950 may be an acrylic resin, a silicone resin, or a urethane resin, etc.

[0193] As described above, the wiring board 10 is positioned on the light-emitting surface 64 side relative to the display unit 610. In this case, the wiring board 10 is located between the third adhesive layer 950 and the fourth adhesive layer 960. More specifically, a portion of the substrate 11 of the wiring board 10 is positioned in a portion of the area between the third adhesive layer 950 and the fourth adhesive layer 960. In this case, the third adhesive layer 950, the fourth adhesive layer 960, the display unit 610, and the cover glass 75 each have a larger area than the substrate 11 of the wiring board 10. By positioning the substrate 11 of the wiring board 10 in a portion of the image display device 60 rather than the entire surface in a plan view, the overall thickness of the image display device 60 can be reduced.

[0194] The wiring board 10 comprises a transparent substrate 11, a metal layer 90 disposed on the substrate 11, and a protective layer 17 covering a portion of the metal layer 90. The metal layer 90 includes a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20. The power supply unit 40 is electrically connected to the communication module 63. In the first region A1, a portion of the wiring board 10 is not positioned between the third adhesive layer 950 and the fourth adhesive layer 960, but protrudes outward (towards the negative side in the Y direction) from between the third adhesive layer 950 and the fourth adhesive layer 960. Specifically, the region of the wiring board 10 where the power supply unit 40 is provided protrudes outward. This facilitates the electrical connection between the power supply unit 40 and the communication module 63. On the other hand, the region of the wiring board 10 where the mesh wiring layer 20 is provided is located between the third adhesive layer 950 and the fourth adhesive layer 960. A portion of the mesh wiring layer 20 may protrude outward. Furthermore, in the first region A1, a portion of the wiring board 10 is curved. Details of the wiring board 10 will be described later.

[0195] The fourth adhesive layer 960 is an adhesive layer that directly or indirectly adheres the wiring board 10 to the cover glass 75. The fourth adhesive layer 960 has a larger area than the substrate 11 of the wiring board 10. The fourth adhesive layer 960 is optically transparent, similar to the third adhesive layer 950. The visible light transmittance of the fourth adhesive layer 960 may be 85% or more, and preferably 90% or more. There is no particular upper limit to the visible light transmittance of the fourth adhesive layer 960, but it may be, for example, 100% or less. The fourth adhesive layer 960 may be an OCA (Optical Clear Adhesive) layer. The material of the fourth adhesive layer 960 may be an acrylic resin, a silicone resin, or a urethane resin, etc. The fourth adhesive layer 960 may be composed of the same material as the third adhesive layer 950.

[0196] Also, in Figure 24, the thickness T of the third adhesive layer 950. 13 and the thickness T of the fourth adhesive layer 960 14The thickness of at least one of the two may be 1.5 times or more the thickness T1 of the substrate 11, preferably 2.0 times or more, and more preferably 2.5 times or more. Thus, the thickness T of the third adhesive layer 950 relative to the thickness T1 of the substrate 11 13 Or the thickness T of the fourth adhesive layer 960 14 By making the third adhesive layer 950 or the fourth adhesive layer 960 sufficiently thick, the region overlapping with the substrate 11 deforms in the thickness direction, absorbing the thickness of the substrate 11. This suppresses the formation of steps in the third adhesive layer 950 or the fourth adhesive layer 960 at the periphery of the substrate 11, making it difficult for observers to recognize the presence of the substrate 11.

[0197] Furthermore, the thickness T of the third adhesive layer 950 13 and the thickness T of the fourth adhesive layer 960 14 The thickness of at least one of the layers may be 10 times or less the thickness T1 of the substrate 11, and preferably 5 times or less. This results in the thickness T of the third adhesive layer 950. 13 Or the thickness T of the fourth adhesive layer 960 14 This prevents the component from becoming too thick, allowing the overall thickness of the image display device 60 to be reduced.

[0198] Thickness T of the third adhesive layer 950 13 and the thickness T of the fourth adhesive layer 960 14 The two may be identical to each other. In this case, the thickness T of the third adhesive layer 950 13 and the thickness T of the fourth adhesive layer 960 14 Each of these may be 1.2 times or more the thickness T1 of the substrate 11, preferably 1.5 times or more, and more preferably 2.0 times or more. That is, the thickness T of the third adhesive layer 950 13 and the thickness T of the fourth adhesive layer 960 14 Sum of (T 13 +T 14 ) is more than three times the thickness T1 of the substrate 11. Thus, the thickness T of the third adhesive layer 950 and the fourth adhesive layer 960 is greater than the thickness T1 of the substrate 11. 13 , T 14By making the total thickness sufficiently large, the third adhesive layer 950 and the fourth adhesive layer 960 deform in the thickness direction in the region overlapping with the substrate 11, absorbing the thickness of the substrate 11. This suppresses the formation of steps in the third adhesive layer 950 or the fourth adhesive layer 960 at the periphery of the substrate 11, making it difficult for an observer to recognize the presence of the substrate 11.

[0199] Furthermore, the thickness T of the third adhesive layer 950 13 and the thickness T of the fourth adhesive layer 960 14 If and are identical to each other, the thickness T of the third adhesive layer 950 13 and the thickness T of the fourth adhesive layer 960 14 Each of these layers may be 5 times or less the thickness T1 of the substrate 11, and preferably 3 times or less. This ensures that the thickness T of both the third adhesive layer 950 and the fourth adhesive layer 960 is 13 , T 14 This prevents the component from becoming too thick, allowing the overall thickness of the image display device 60 to be reduced.

[0200] Specifically, the thickness T1 of the substrate 11 may be, for example, 10 μm or more and 50 μm or less, and is preferably 15 μm or more and 25 μm or less. By setting the thickness T1 of the substrate 11 to 10 μm or more, the strength of the wiring substrate 10 is maintained, and the first directional wiring 21 and second directional wiring 22 of the mesh wiring layer 20, which will be described later, can be made less prone to deformation. Furthermore, by setting the thickness T1 of the substrate 11 to 50 μm or less, the occurrence of steps in the third adhesive layer 950 and the fourth adhesive layer 960 at the periphery of the substrate 11 can be suppressed, making it difficult for an observer to recognize the presence of the substrate 11.

[0201] Thickness T of the third adhesive layer 950 13 The thickness of the fourth adhesive layer 960 may be, for example, 15 μm or more and 500 μm or less, and is preferably 20 μm or more and 250 μm or less. 14 For example, it may be 15 μm or more and 500 μm or less, and preferably 20 μm or more and 250 μm or less.

[0202] As described above, the laminate 70 for the image display device is composed of the wiring board 10, the third adhesive layer 950, and the fourth adhesive layer 960. In this embodiment, such a laminate 70 for the image display device is also provided.

[0203] The decorative film 74 is placed on the fourth adhesive layer 960. The decorative film 74 may have an opening in the portion corresponding to the second region A2 (display region 61a) when viewed from the observer's side. The decorative film 74 shields the first region A1 other than the second region A2 (display region 61a). That is, the decorative film 74 may be placed so as to cover the entire circumference of the edge of the display portion 610 when viewed from the observer's side.

[0204] As shown in Figure 23, the image display device 60 is approximately rectangular in shape when viewed from above, with its longitudinal direction parallel to the Y direction and its transverse direction parallel to the X direction. The length L4 of the longitudinal direction (Y direction) of the image display device 60 can be selected within the range of, for example, 20 mm to 500 mm, preferably 100 mm to 200 mm. The length L5 of the transverse direction (X direction) of the substrate 11 can be selected within the range of, for example, 20 mm to 500 mm, preferably 50 mm to 100 mm. The corners of the image display device 60 may also be rounded.

[0205] [Wiring board configuration] Next, the configuration of the wiring board will be described with reference to Figures 25 to 28. Figures 25 to 28 are diagrams showing the wiring board according to this embodiment.

[0206] As shown in Figure 25, the wiring board 10 according to this embodiment is used in the image display device 60 described above (see Figures 23 and 24). The wiring board 10 is located on the light-emitting surface 64 side of the display unit 610 and is positioned between the third adhesive layer 950 and the fourth adhesive layer 960. Such a wiring board 10 comprises a transparent substrate 11, a metal layer 90, and a protective layer 17. The metal layer 90 is placed on the substrate 11. The protective layer 17 covers a portion of the metal layer 90. The metal layer 90 also includes a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20.

[0207] As shown in Figure 26, in this embodiment as well, a plurality of openings 23 are formed by being surrounded by adjacent first directional wirings 21 and adjacent second directional wirings 22. In this embodiment as well, the pitch P1 of the plurality of first directional wirings 21 may be in the range of 0.01 mm to 1 mm. The pitch P2 of the plurality of second directional wirings 22 may also be in the range of 0.01 mm to 1 mm. Furthermore, the length L3 of one side of each opening 23 may also be in the range of 0.01 mm to 1 mm.

[0208] As shown in Figure 27, in this embodiment as well, each first directional wiring 21 has a roughly rectangular or roughly square cross-section perpendicular to its longitudinal direction (X-direction cross-section). Also, as shown in Figure 28, in this embodiment as well, the shape of the cross-section perpendicular to the longitudinal direction (Y-direction cross-section) of each second directional wiring 22 is roughly rectangular or roughly square, and is substantially the same as the cross-sectional shape (X-direction cross-section) of the first directional wiring 21 described above.

[0209] The protective layer 17 is formed on the surface of the substrate 11 and covers the metal layer 90. That is, in the wiring board 10, the protective layer 17 is formed to overlap the metal layer 90 in a plan view. The protective layer 17 protects the metal layer 90. Specifically, the protective layer 17 covers the entire area of ​​the power supply section 40 except for the electrically connected portion. The protective layer 17 also further covers a portion of the mesh wiring layer 20 (the area on the power supply section 40 side). However, the protective layer 17 may cover only a portion of the power supply section 40. The protective layer 17 does not have to cover the mesh wiring layer 20. In areas where the metal layer 90 is not present, the protective layer 17 covers the substrate 11. The protective layer 17 is formed over substantially the entire width direction (X direction) of the substrate 11, but it may be formed over only a portion of the width direction of the substrate 11.

[0210] As described above, the protective layer 17 is located in the first region A1, which does not overlap with the display region 61a. The protective layer 17 is present only in the first region A1 of the wiring board 10. On the other hand, the protective layer 17 is not present in the second region A2, which overlaps with the display region 61a. That is, the protective layer 17 is not present throughout the entire second region A2. Here, the first region A1 is the region that does not overlap with the display region 61a (non-display region) when viewed from the light-emitting surface 64 side (positive Z direction). The second region A2 is the region that overlaps with the display region 61a (display region) when viewed from the light-emitting surface 64 side (positive Z direction). The edge 17a of the protective layer 17 located on the second region A2 side (positive Y direction) (see Figure 24) may overlap with the decorative film 74. The edge 17a of the protective layer 17 is located between the third adhesive layer 950 and the fourth adhesive layer 960. However, the protective layer 17 is not limited to this, and its edges 17a may be exposed outward from the third adhesive layer 950 and the fourth adhesive layer 960. In this way, by not providing the protective layer 17 in the second region A2, the protective layer 17 is not substantially visible to the naked eye of the observer, making it difficult for the observer to recognize the presence of the wiring board 10.

[0211] As shown in Figure 24, a portion of the wiring board 10 is curved beyond the third adhesive layer 950 and the fourth adhesive layer 960. Specifically, the substrate 11, metal layer 90, and protective layer 17 of the wiring board 10 are curved in a roughly C-shape toward the display unit 610. The substrate 11, metal layer 90, and protective layer 17 are curved toward the display unit 610 (negative Z direction). However, the invention is not limited to this, and the substrate 11, metal layer 90, and protective layer 17 may also be curved toward the opposite side of the display unit 610 (positive Z direction). In this specification, "curve" is not limited to cases where the surface is bent in a curved shape. It also includes cases where the surface is bent to form an acute angle, right angle, or obtuse angle. For example, the substrate 11, metal layer 90, and protective layer 17 may be bent in an L-shape.

[0212] In this curved portion, the outermost protective layer 17 covers the substrate 11 and the metal layer 90. As a result, when the circuit board 10 is bent for mounting, for example, the metal layer 90 is protected by the protective layer 17. This prevents the metal layer 90 from cracking or peeling due to tensile forces.

[0213] As the material for the protective layer 17, colorless and transparent insulating resins such as polymethyl (meth)acrylate, polyethyl (meth)acrylate, acrylic resins and their modified resins and copolymers, polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl butyral and their copolymers, polyurethane, epoxy resin, polyamide, and chlorinated polyolefin can be used.

[0214] The difference between the thermal shrinkage rate of the protective layer 17 and the thermal shrinkage rate of the substrate 11 after 120°C for 1 hour may be 0% or more and 1% or less, and is preferably 0% or more and 0.5% or less. By keeping the difference between the thermal shrinkage rate of the protective layer 17 and the thermal shrinkage rate of the substrate 11 within the above range, it is possible to suppress cracking or peeling of the metal layer 90 when the wiring board 10 is exposed to a high-temperature environment for a long time. Specifically, the thermal shrinkage rate of the protective layer 17 after 120°C for 1 hour may be 0.01% or more and 2.0% or less, is preferably 0.01% or more and 1.0% or less, and is more preferably 0.05% or more and 0.3% or less. Also, the thermal shrinkage rate of the substrate 11 after 120°C for 1 hour may be 0.01% or more and 2.0% or less, is preferably 0.01% or more and 1.0% or less, and is more preferably 0.05% or more and 0.3% or less.

[0215] Here, the thermal shrinkage rate of the protective layer 17 or substrate 11 after 1 hour at 120°C is a numerical value that represents how much the protective layer 17 or substrate 11 changes dimensionally when heat is applied, and can be measured by the following method. First, the protective layer 17 or substrate 11 is cut to a size of 50 mm (MD) in length and 4 mm (TD) in width to make a test piece. Next, the length M (mm) of the test piece is measured using a precision automatic two-dimensional coordinate measuring machine (Shinto S Precision Co., Ltd.: AMIC 700). Note that the length and width can be adjusted as appropriate depending on the size of the protective layer 17 or substrate 11, and may be smaller than 50 mm in length and 4 mm in width. Next, the end (approximately 1 mm) in the longitudinal direction of the test piece is fixed to a wire mesh with tape, and the test piece is suspended from the wire mesh. In this state, the test piece is placed in an oven heated to 120°C for 1 hour, and then the test piece is removed together with the wire mesh and allowed to cool naturally at room temperature (25°C). Next, the length N (mm) of the test specimen, which has been naturally cooled to room temperature, is measured using a precision automatic two-dimensional coordinate measuring machine (AMIC 700, manufactured by Shinto S Precision Co., Ltd.). At this time, the thermal shrinkage rate is calculated using the following formula. Thermal shrinkage rate (%) = (1 - (length N / length M)) × 100

[0216] The dielectric loss tangent of the protective layer 17 may be 0.002 or less, and preferably 0.001 or less. There is no particular lower limit for the dielectric loss tangent of the protective layer 17, but it may be greater than 0. By having the dielectric loss tangent of the protective layer 17 within the above range, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 can be reduced, especially when the electromagnetic waves transmitted and received by the mesh wiring layer 20 are of high frequency. There are no particular restrictions on the dielectric constant of the protective layer 17, but it may be 2.0 or more and 10.0 or less.

[0217] The dielectric loss tangent of the protective layer 17 can be measured in accordance with IEC 62562. Specifically, first, the substrate 11 and the protective layer 17 are cut out, and the protective layer 17 is peeled off the substrate 11 to prepare a test specimen. The dimensions of the test specimen are 10 mm to 20 mm in width and 50 mm to 100 mm in length. Next, the dielectric loss tangent is measured in accordance with IEC 62562.

[0218] Thickness T of protective layer 17 12 The thickness of the protective layer 17 may be 1 μm or more and 100 μm or less, 1 μm or more and 50 μm or less, 5 μm or more and 50 μm or less, and preferably 5 μm or more and 25 μm or less. 12 Having a thickness of 1 μm or more enhances the abrasion resistance and weather resistance of the protective layer 17. 12 Since the thickness is 100 μm or less, the thickness of the wiring board 10 can be reduced, and the flexibility of the curved portion of the wiring board 10 can be ensured. Also, the thickness T of the protective layer 17 12 Since the thickness is 50 μm or less, the thickness of the wiring board 10 can be made even thinner, and the flexibility of the curved portion of the wiring board 10 can be further ensured. In this embodiment, the thickness T of the protective layer 17 12 This refers to the distance measured from the surface of the metal layer 90 to the surface of the protective layer 17 while the wiring board 10 is not bent.

[0219] Thickness T of the protective layer 17 relative to the thickness T1 of the substrate 11 12 The ratio (T 12 The ratio (T1) may be between 0.02 and 5.0, but is preferably between 0.2 and 1.5. 12If the ratio (T1) is 0.02 or higher, the abrasion resistance and weather resistance of the protective layer 17 can be increased. 12 By keeping / T1) below 5.0, the thickness of the wiring board 10 can be reduced, and the flexibility of the curved portion of the wiring board 10 can be ensured.

[0220] In this embodiment as well, the power supply line 85 may be electrically connected to the power supply section 40 of the wiring board 10 via an anisotropic conductive film 85c. The module 80A may be composed of the wiring board 10 and the power supply line 85 electrically connected to the power supply section 40 via the anisotropic conductive film 85c (see Figures 1, 2, and 7, etc.).

[0221] [Manufacturing method for wiring boards] Next, the method for manufacturing a wiring board according to this embodiment will be described with reference to Figures 29(a)-(g). Figures 29(a)-(g) are cross-sectional views showing the method for manufacturing a wiring board according to this embodiment.

[0222] As shown in Figure 29(a), a transparent substrate 11 is prepared.

[0223] Next, a metal layer 90 is formed on the substrate 11. The metal layer 90 includes a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20.

[0224] In this process, first, as shown in Figure 29(b), a metal foil 51 is laminated over substantially the entire surface of the substrate 11. In this embodiment, the thickness of the metal foil 51 may be between 0.1 μm and 5.0 μm. In this embodiment, the metal foil 51 may contain copper.

[0225] Next, as shown in Figure 29(c), a photocurable insulating resist 52 is supplied to substantially the entire surface of the metal foil 51. Examples of photocurable insulating resists 52 include organic resins such as acrylic resins and epoxy resins.

[0226] Next, as shown in Figure 29(d), the insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form the insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the metal layer 90 is exposed.

[0227] Next, as shown in Figure 29(e), the metal foil 51 located on the surface of the substrate 11 in a portion not covered by the insulating layer 54 is removed. In this process, the metal foil 51 is etched so that the surface of the substrate 11 is exposed by performing a wet treatment using ferric chloride, cupric chloride, strong acids such as sulfuric acid and hydrochloric acid, persulfates, hydrogen peroxide, aqueous solutions thereof, or a combination thereof.

[0228] Next, as shown in Figure 29(f), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or by dry treatment using oxygen plasma.

[0229] In this way, a wiring board 10 is obtained having a substrate 11 and a metal layer 90 provided on the substrate 11. The metal layer 90 includes a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20.

[0230] Subsequently, as shown in Figure 29(g), a protective layer 17 is formed to cover the metal layer 90 located in the first region A1 on the substrate 11. At this time, the protective layer 17 is not formed in the second region A2. Methods for forming the protective layer 17 may include roll coating, gravure coating, gravure reverse coating, microgravure coating, slot die coating, die coating, knife coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, and flexographic printing.

[0231] [Operation of this embodiment] Next, we will describe the operation of this embodiment, which has the above configuration.

[0232] As shown in Figures 23 and 24, the wiring board 10 is incorporated into an image display device 60 having a display unit 610. At this time, the wiring board 10 is placed on the display unit 610. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0233] According to this embodiment, the protective layer 17 is located in a first region A1 that does not overlap with the display area 61a of the image display device 60. The protective layer 17 is not located in a second region A2 that overlaps with the display area 61a of the image display device 60. As a result, when an observer observes the image display device 60 from the light-emitting surface 64 side, reflected light at the interface between the protective layer 17 and the substrate 11, or at the interface between the protective layer 17 and the fourth adhesive layer 960, is not visible. Therefore, it is difficult for the observer to see the wiring board 10 with the naked eye. In particular, when the third adhesive layer 950 and the fourth adhesive layer 960 each have a larger area than the substrate 11, the outer edge of the substrate 11 can be made difficult to see with the observer's naked eye, and the observer can be prevented from recognizing the presence of the substrate 11.

[0234] Furthermore, according to this embodiment, the protective layer 17 does not overlap with the fourth adhesive layer 960 in the second region A2. As a result, a step is less likely to occur in the fourth adhesive layer 960 at a position corresponding to the outer edge of the substrate 11. Therefore, the outer edge of the substrate 11 can be made difficult to see with the naked eye of an observer, and the observer may not be aware of the presence of the substrate 11.

[0235] Furthermore, according to this embodiment, the protective layer 17 is located on the metal layer 90 in the first region A1. This makes it possible to prevent scratches or ruptures in the metal layer 90 when mounting the wiring board 10.

[0236] In particular, when a portion of the wiring board 10 is curved in the first region A1, the tensile force when the wiring board 10 is bent prevents the metal layer 90 from cracking or peeling. That is, as shown in Figure 30, when the wiring board 10 is bent, the relatively flexible substrate 11 and protective layer 17 are stretched outwards. On the other hand, a force acts in the opposite direction (inwards) on the metal layer 90 located between the substrate 11 and the protective layer 17. As a result, the metal layer 90 is not stretched significantly. In this way, the protective layer 17 protects the metal layer 90, and cracking or peeling of the metal layer 90 is prevented.

[0237] Furthermore, according to this embodiment, the wiring board 10 comprises a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. Since the mesh wiring layer 20 has a mesh-like pattern consisting of a conductive portion that forms an opaque conductive layer and a large number of openings, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is placed on the display unit 610, the display area 61a can be seen through the openings 23 of the mesh wiring layer 20, and the visibility of the display area 61a is not hindered.

[0238] [Examples] Next, a specific example of the above embodiment will be described.

[0239] (Example A1) A wiring board (Example A1) comprising a substrate, a metal layer, and a protective layer was fabricated. The substrate was made of polyethylene terephthalate with a thickness of 10 μm. The metal layer was made of copper with a thickness of 2 μm. The line width of the mesh wiring layer was all 2 μm, and all openings were square with sides of 100 μm. A protective layer was formed only in the first region of the metal layer that did not overlap with the display area. The protective layer was made of acrylic resin with a thickness of 10 μm.

[0240] (Example A2) A wiring board (Example A2) was fabricated in the same manner as Example A1, except that the substrate thickness was 25 μm and the protective layer thickness was 25 μm.

[0241] (Comparative Example A1) A wiring board (Comparative Example A1) was fabricated in the same manner as in Example A1, except that no protective layer was provided.

[0242] (Comparative Example A2) A wiring board (Comparative Example A2) was fabricated in the same manner as in Example A1, except that the thickness of the protective layer was 12 μm and the protective layer was formed not only in the first region but also in the second region.

[0243] Next, the mounting resistance, invisibility, and flex resistance of the wiring boards of Example A1-2 and Comparative Example A1-2 were evaluated when incorporated into the image display device, respectively. The results are shown in Table 1.

[0244] Regarding "mounting resistance", when heat or pressure was applied during the mounting of the wiring board, those without damage such as disconnection, distortion, or collapse were judged as "high", and those with damage such as disconnection, distortion, or collapse were judged as "low".

[0245] Regarding "invisibility", when observed at angles of 30°, 60°, and 90° with respect to the surface of the substrate in a general visual inspection environment, those where the outer edge of the wiring board could not be visually identified were judged as "high", and those where the outer edge of the wiring board could be visually identified were judged as "low".

[0246] Regarding "flex resistance", when the wiring board was bent 180° along the circumference of a cylinder with a diameter of 2 mm using a cylindrical mandrel bending tester, those without peeling or disconnection of the metal layer and with a resistance value variation of less than 0.5 Ω / □ were judged as "high", and those with peeling or disconnection of the metal layer or a resistance value variation of 0.5 Ω / □ or more were judged as "low".

[0247] [Table 1]

[0248] Thus, the wiring board of Example A1-2 was found to have high mounting durability, invisibility, and bending resistance. The wiring board of Comparative Example A1-2 was found to have low mounting durability, invisibility, or bending resistance.

[0249] [Differentiation] Next, we will describe a modified example of a wiring board.

[0250] (First variation) Figure 31 shows a first modified example of the wiring board. The modified example shown in Figure 31 differs in that a dummy wiring layer 30 is provided around the mesh wiring layer 20, while the other configurations are substantially the same as those of the embodiments shown in Figures 1 to 30 described above. In Figure 31, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 30, and detailed descriptions are omitted.

[0251] In the wiring board 10 shown in Figure 31, a dummy wiring layer 30 is provided around the mesh wiring layer 20. Unlike the mesh wiring layer 20, this dummy wiring layer 30 does not substantially function as an antenna. In this case, the metal layer 90 includes the mesh wiring layer 20, the dummy wiring layer 30, and the power supply section 40. The protective layer 17 is present in the first region A1 but not in the second region A2.

[0252] In this way, by arranging a dummy wiring layer 30 electrically independent of the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be obscured. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0253] (Second variation) Figure 32 shows a second modified example of the wiring board. The modified example shown in Figure 32 differs in that multiple dummy wiring layers 30A and 30B with different aperture ratios are provided around the mesh wiring layer 20, while the other configurations are substantially the same as those of the embodiments shown in Figures 1 to 31 described above. In Figure 32, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 31, and detailed descriptions are omitted.

[0254] In the wiring board 10 shown in Figure 32, multiple (in this case, two) dummy wiring layers 30A and 30B (first dummy wiring layer 30A and second dummy wiring layer 30B) with different aperture ratios are provided around the mesh wiring layer 20. Specifically, the first dummy wiring layer 30A is arranged around the mesh wiring layer 20, and the second dummy wiring layer 30B is arranged around the first dummy wiring layer 30A. Unlike the mesh wiring layer 20, these dummy wiring layers 30A and 30B do not substantially function as antennas. The metal layer 90 includes the mesh wiring layer 20, the dummy wiring layers 30A and 30B, and the power supply section 40. The protective layer 17 is present in the first region A1 but not in the second region A2.

[0255] In this way, by arranging dummy wiring layers 30A and 30B that are electrically independent from the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made more indistinct. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0256] (Third variation) Figure 33 shows a third modified example of the wiring board. The modified example shown in Figure 33 differs in that a primer layer 15 is placed between the substrate 11 and the mesh wiring layer 20, while the other configurations are substantially the same as those of the embodiments shown in Figures 1 to 32 described above. In Figure 33, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 32, and detailed descriptions are omitted.

[0257] In the wiring board 10 shown in Figure 33, a primer layer 15 is formed on the substrate 11, and a mesh wiring layer 20 is formed on the primer layer 15. The primer layer 15 plays a role in improving the adhesion between the mesh wiring layer 20 and the substrate 11. In this case, the primer layer 15 is provided over substantially the entire surface of the substrate 11. Alternatively, the primer layer 15 may be provided only in the area of ​​the substrate 11 where the mesh wiring layer 20 is provided.

[0258] The primer layer 15 may contain a polymer material. This effectively improves the adhesion between the mesh wiring layer 20 and the substrate 11. In this case, a colorless, transparent polymer material can be used as the material for the primer layer 15. Furthermore, it is preferable that the primer layer 15 contains an acrylic resin or a polyester resin. This further effectively improves the adhesion with the mesh wiring layer 20.

[0259] The thickness of the primer layer 15 is preferably 0.05 μm or more and 0.5 μm or less. By having the primer layer 15 within the above thickness range, the adhesion between the mesh wiring layer 20 and the substrate 11 is improved, and the transparency of the wiring substrate 10 can be ensured.

[0260] (Fourth variation) Figure 34 shows a fourth modified example of the wiring board. The modified example shown in Figure 34 differs in that the first directional wiring 21 and the second directional wiring 22 have a blackened layer 28, while the other configurations are substantially the same as those of the embodiments shown in Figures 1 to 33 described above. In Figure 34, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 33, and detailed descriptions are omitted.

[0261] In the wiring board 10 shown in Figure 34, the first directional wiring 21 and the second directional wiring 22 each have a main body portion 27 and a blackened layer 28 formed on the outer circumference of the main body portion 27. The main body portion 27 constitutes the main part of the first directional wiring 21 and the second directional wiring 22, respectively, and is located in the center of the first directional wiring 21 and the second directional wiring 22. The blackened layer 28 is located on the outermost surface of the first directional wiring 21 and the second directional wiring 22.

[0262] The material of the main body 27 can be any conductive metallic material. In this modified example, the material of the main body 27 is copper, but it is not limited to this. For example, the material of the main body 27 can be a metallic material (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel.

[0263] The blackening layer 28 is formed to cover the outer surface of the main body 27. The blackening layer 28 is formed on the front surface (the surface on the positive Z-direction side) and the side surface (the surface perpendicular to the Z-direction) of the main body 27. It is preferable that the blackening layer 28 be formed over the entire surface and side surface of the main body 27. On the other hand, the blackening layer 28 does not need to be formed on the back surface (the surface on the negative Z-direction side) of the main body 27. The blackening layer 28 has an overall black appearance and is a layer that reflects less visible light than the main body 27. Note that black includes not only colorless black, but also dark gray, colored black, and dark gray.

[0264] The material of the blackened layer 28 is preferably a black metallic material, and may contain, for example, palladium or tellurium. Palladium or tellurium may be formed by substitution treatment of the main body 27. Specifically, it may be formed by substitution treatment in which metal atoms on the outer surface of the main body 27 are replaced with palladium or tellurium atoms. Alternatively, the blackened layer 28 may be a layer obtained by oxidation treatment of the main body 27. Specifically, the blackened layer 28, which is an oxide film formed on the outer surface of the main body 27, may be formed by oxidation treatment of the outer surface of the main body 27 with a blackening treatment solution. For example, if the material of the main body 27 is copper, the blackened layer 28 may contain copper oxide.

[0265] The thickness of the blackening layer 28 may be 10 nm or more, preferably 20 nm or more. By setting the thickness of the blackening layer 28 to 10 nm or more, the main body portion 27 is sufficiently covered by the blackening layer 28, so that the blackening layer 28 can sufficiently absorb visible light. As a result, the reflection of the blackening layer 28 with respect to visible light can be suppressed, and the mesh wiring layer 20 can be made difficult to visually recognize with the naked eye. The thickness of the blackening layer 28 may be 100 nm or less, preferably 60 nm or less. By setting the thickness of the blackening layer 28 to 100 nm or less, it is possible to suppress a decrease in the conductivity of the mesh wiring layer 20 due to the presence of the blackening layer 28, and prevent the current from flowing hardly through the mesh wiring layer 20 when transmitting and receiving radio waves. The thickness of the blackening layer 28 can be measured using the STEM-EDS (Scanning Transmission Electron Microscopy-Energy Dispersive X-ray Spectroscopy) method.

[0266] According to this modification, the first-direction wiring 21 and the second-direction wiring 22 each have the main body portion 27 and a blackening layer 28 formed on the outer periphery of the main body portion 27. As a result, since the blackening layer 28 absorbs visible light, the reflection of visible light by the main body portion 27 can be suppressed. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, and it can be made difficult for an observer to recognize the mesh wiring layer 20 with the naked eye.

[0267] (Third Embodiment) Next, a third embodiment will be described with reference to FIGS. 35 to 37. FIGS. 35 to 37 are diagrams showing this embodiment. In FIGS. 35 to 37, the same parts as those in the first embodiment shown in FIGS. 1 to 22 or the same parts as those in the second embodiment shown in FIGS. 23 to 34 may be denoted by the same reference numerals and detailed description thereof may be omitted.

[0268] [Configuration of Image Display Device] The configuration of the image display device according to this embodiment will be described with reference to FIG. 35.

[0269] As shown in Figure 35, the image display device 60 according to this embodiment comprises an image display device laminate 70 and a display unit (display) 610 having a display area 61a, which is laminated on the image display device laminate 70. In this embodiment, the protective layer 17 covers the metal layer 90. The difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less.

[0270] In this embodiment, the difference between the maximum and minimum refractive indices of the substrate 11, the protective layer 17, the third adhesive layer 950, and the fourth adhesive layer 960 is preferably 0.1 or less, more preferably 0.07 or less, and more preferably 0.05 or less. There is no particular lower limit to the difference between the maximum and minimum refractive indices, but it may be 0 or greater. Here, refractive index refers to absolute refractive index, which can be determined based on Method A of JIS K-7142. For example, if the material of the third adhesive layer 950 and the material of the fourth adhesive layer 960 are acrylic resin (refractive index 1.49), the refractive indices of the substrate 11 and the protective layer 17 are 1.39 or more and 1.59 or less, respectively, and the difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less.

[0271] In this way, the difference between the maximum and minimum refractive indices of the substrate 11, the protective layer 17, the third adhesive layer 950, and the fourth adhesive layer 960 is set to 0.1 or less. This suppresses the reflection of visible light at the interface B10 between the third adhesive layer 950 and the substrate 11, the interface B20 between the substrate 11 and the protective layer 17, and the interface B30 between the protective layer 17 and the fourth adhesive layer 960, respectively, making it difficult for the observer to see the wiring board 10 with the naked eye.

[0272] Furthermore, it is preferable that the material of the third adhesive layer 950 and the material of the fourth adhesive layer 960 be the same. This makes it possible to further reduce the difference in refractive index between the third adhesive layer 950 and the fourth adhesive layer 960, thereby suppressing the reflection of visible light at the interface B40 between the third adhesive layer 950 and the fourth adhesive layer 960.

[0273] [Wiring board configuration] Next, the configuration of the wiring board will be described with reference to Figure 36. Figure 36 is a diagram showing a wiring board according to this embodiment.

[0274] As shown in Figure 36, the wiring board 10 according to this embodiment is used in the image display device 60 (see Figure 35) described above. The wiring board 10 is located on the light-emitting surface 64 side of the display unit 610 and is positioned between the third adhesive layer 950 and the fourth adhesive layer 960. Such a wiring board 10 comprises a transparent substrate 11, a metal layer 90, and a protective layer 17. The metal layer 90 is placed on the substrate 11. The protective layer 17 covers the metal layer 90. The metal layer 90 also includes a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20.

[0275] The substrate 11 is a material that is transparent in the visible light region and has electrical insulating properties. In this embodiment, as described above, the substrate 11 is a material whose refractive index difference from that of the protective layer 17 is 0.1 or less. Furthermore, it is preferable that the substrate 11 is a material in which the difference between the maximum and minimum refractive indices of the substrate 11, the protective layer 17, the third adhesive layer 950, and the fourth adhesive layer 960 is 0.1 or less.

[0276] The protective layer 17 is formed on the surface of the substrate 11 and covers the metal layer 90. The protective layer 17 protects the metal layer 90. The protective layer 17 may cover the entire mesh wiring layer 20 and the entire power supply section 40. Alternatively, the protective layer 17 may cover only a portion of the power supply section 40. In areas where the metal layer 90 is not present, the protective layer 17 covers the substrate 11. In this case, the protective layer 17 is formed over the entire substrate 11. Specifically, the protective layer 17 is formed over substantially the entire width (X direction) and longitudinal (Y direction) of the substrate 11. However, it is not limited to this, and the protective layer 17 may be provided only in a portion of the substrate 11. For example, the protective layer 17 may be formed only in a portion of the width of the substrate 11.

[0277] The difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less, preferably 0.07 or less, and more preferably 0.05 or less. There is no particular lower limit to the above difference in refractive index, but it may be 0 or greater. By keeping the difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 to 0.1 or less, the reflection of visible light at the interface B20 between the substrate 11 and the protective layer 17 is suppressed, making it difficult for the observer to see the wiring board 10 with the naked eye.

[0278] As shown in Figure 35, a portion of the wiring board 10 is curved beyond the third adhesive layer 950 and the fourth adhesive layer 960. Specifically, the substrate 11, metal layer 90, and protective layer 17 of the wiring board 10 are curved in a roughly C-shape toward the display unit 610 side (negative Z direction). However, the invention is not limited to this, and the substrate 11, metal layer 90, and protective layer 17 may also be curved toward the opposite side of the display unit 610 (positive Z direction). In this specification, "curve" is not limited to cases where the surface is bent in a curved shape. It also includes cases where the surface is bent to form an acute angle, right angle, or obtuse angle. For example, the substrate 11, metal layer 90, and protective layer 17 may be bent in an L-shape.

[0279] In this curved portion, the outermost protective layer 17 covers the substrate 11 and the metal layer 90. As a result, when the circuit board 10 is bent for mounting, for example, the metal layer 90 is protected by the protective layer 17. This prevents the metal layer 90 from cracking or peeling due to tensile forces.

[0280] The protective layer 17 is made of a material whose refractive index difference from that of the substrate 11 is 0.1 or less. Furthermore, it is preferable that the protective layer 17 is made of a material whose refractive index difference between the maximum and minimum values ​​of the refractive index of the substrate 11, the protective layer 17, the third adhesive layer 950, and the fourth adhesive layer 960 is 0.1 or less. Examples of materials that can be used for the protective layer 17 include acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate, and their modified resin copolymers; polyvinyl resins such as polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, and polyvinyl butyral, and their copolymers; and colorless, transparent insulating resins such as polyurethane, epoxy resin, polyamide, and chlorinated polyolefin.

[0281] In this embodiment as well, the power supply line 85 may be electrically connected to the power supply section 40 of the wiring board 10 via an anisotropic conductive film 85c. The module 80A may be composed of the wiring board 10 and the power supply line 85 electrically connected to the power supply section 40 via the anisotropic conductive film 85c (see Figures 1, 2, and 7, etc.).

[0282] [Manufacturing method for wiring boards] Next, the method for manufacturing a wiring board according to this embodiment will be described with reference to Figures 37(a)-(g). Figures 37(a)-(g) are cross-sectional views showing the method for manufacturing a wiring board according to this embodiment.

[0283] As shown in Figure 37(a), a transparent substrate 11 is prepared.

[0284] Next, a metal layer 90 is formed on the substrate 11. The metal layer 90 includes a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20.

[0285] In this process, first, as shown in Figure 37(b), a metal foil 51 is laminated over substantially the entire surface of the substrate 11. In this embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In this embodiment, the metal foil 51 may contain copper.

[0286] Next, as shown in Figure 37(c), a photocurable insulating resist 52 is supplied to substantially the entire surface of the metal foil 51. Examples of photocurable insulating resists 52 include organic resins such as acrylic resins and epoxy resins.

[0287] Next, as shown in Figure 37(d), the insulating layer 54 is formed by photolithography. In this case, the photocurable insulating resist 52 is patterned by photolithography to form the insulating layer 54 (resist pattern). At this time, the insulating layer 54 is formed so that the metal foil 51 corresponding to the metal layer 90 is exposed.

[0288] Next, as shown in Figure 37(e), the metal foil 51 located on the surface of the substrate 11 that is not covered by the insulating layer 54 is removed. In this process, the metal foil 51 is etched so that the surface of the substrate 11 is exposed by performing a wet treatment using ferric chloride, cupric chloride, strong acids such as sulfuric acid and hydrochloric acid, persulfates, hydrogen peroxide, aqueous solutions thereof, or combinations thereof.

[0289] Next, as shown in Figure 37(f), the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, an acid or alkaline solution, or by dry treatment using oxygen plasma.

[0290] In this way, a wiring board 10 is obtained having a substrate 11 and a metal layer 90 provided on the substrate 11. The metal layer 90 includes a mesh wiring layer 20 and a power supply unit 40 electrically connected to the mesh wiring layer 20.

[0291] Subsequently, as shown in Figure 37(g), a protective layer 17 is formed to cover the metal layer 90 located on the substrate 11. At this time, the protective layer 17 may be formed over substantially the entire surface of the substrate 11. Methods for forming the protective layer 17 may include roll coating, gravure coating, gravure reverse coating, microgravure coating, slot die coating, die coating, knife coating, inkjet coating, dispenser coating, kiss coating, spray coating, screen printing, offset printing, and flexographic printing.

[0292] [Operation of this embodiment] Next, we will describe the operation of this embodiment, which has the above configuration.

[0293] As shown in Figure 35, the wiring board 10 is incorporated into an image display device 60 having a display unit 610. At this time, the wiring board 10 is placed on the display unit 610. The mesh wiring layer 20 of the wiring board 10 is electrically connected to the communication module 63 of the image display device 60 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the mesh wiring layer 20, and communication can be performed using the image display device 60.

[0294] According to this embodiment, the difference between the refractive index of the substrate 11 and the refractive index of the protective layer 17 is 0.1 or less. This makes it possible to suppress the reflection of visible light at the interface B20 between the substrate 11 and the protective layer 17. As a result, when an observer observes the image display device 60 from the light-emitting surface 64 side, the substrate 11 of the wiring board 10 can be made difficult to see with the naked eye.

[0295] Furthermore, according to this embodiment, the difference between the maximum and minimum refractive indices of the substrate 11, the protective layer 17, the third adhesive layer 950, and the fourth adhesive layer 960 is 0.1 or less. This suppresses the reflection of visible light at the interface B10 between the third adhesive layer 950 and the substrate 11, the interface B20 between the substrate 11 and the protective layer 17, and the interface B30 between the protective layer 17 and the fourth adhesive layer 960. As a result, when an observer observes the image display device 60 from the light-emitting surface 64 side, the substrate 11 of the wiring board 10 becomes difficult to see with the naked eye. In particular, when the third adhesive layer 950 and the fourth adhesive layer 960 each have a larger area than the substrate 11, the outer edge of the substrate 11 becomes difficult to see with the naked eye, and the observer does not become aware of the presence of the substrate 11.

[0296] Furthermore, according to this embodiment, a protective layer 17 is formed to cover the metal layer 90. This protects the metal layer 90 from external impacts, etc. Also, it prevents scratches or ruptures of the metal layer 90 when mounting the wiring board 10.

[0297] In particular, when a portion of the wiring board 10 is curved outside the third adhesive layer 950 and the fourth adhesive layer 960, the tensile force when the wiring board 10 is bent can prevent the metal layer 90 from cracking or peeling. That is, as shown in Figure 30, when the wiring board 10 is bent, the relatively flexible substrate 11 and protective layer 17 are stretched outwards. On the other hand, a force acts in the opposite direction (inwards) on the metal layer 90 located between the substrate 11 and the protective layer 17. As a result, the metal layer 90 is not stretched significantly. This protects the metal layer 90 from cracking or peeling, as the protective layer 17 protects it.

[0298] Furthermore, according to this embodiment, the wiring board 10 comprises a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. Since the mesh wiring layer 20 has a mesh-like pattern consisting of a conductive portion that forms an opaque conductive layer and a large number of openings, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is placed on the display area 61a, the display area 61a can be seen through the openings 23 of the mesh wiring layer 20, and the visibility of the display area 61a is not obstructed.

[0299] [Examples] Next, a specific example of the above embodiment will be described.

[0300] (Example B1) A laminate for an image display device (Example B1) was fabricated, comprising a third adhesive layer, a fourth adhesive layer, and a wiring substrate. The wiring substrate included a substrate, a metal layer, and a protective layer. The substrate was made of polyethylene terephthalate with a thickness of 10 μm. The refractive index of the substrate was 1.57. The metal layer was made of copper with a thickness of 2 μm. The line width of the mesh wiring layer was 2 μm for all connections, and all openings were square with sides of 100 μm. The protective layer was formed over the entire surface of the substrate. The protective layer was made of acrylic resin with a thickness of 10 μm. The refractive index of the protective layer was 1.53. An acrylic resin OCA film with a thickness of 25 μm was used as the third adhesive layer. The refractive index of the third adhesive layer was 1.55. An acrylic resin OCA film with a thickness of 25 μm was used as the fourth adhesive layer. The refractive index of the fourth adhesive layer was 1.55. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer was 0.04. Furthermore, the difference between the maximum and minimum values ​​of the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the third adhesive layer, and the refractive index of the fourth adhesive layer was 0.04.

[0301] (Example B2) A laminate for an image display device (Example B2) was fabricated in the same manner as in Example B1, except that a substrate with a thickness of 25 μm and a refractive index of 1.51 was used, a protective layer with a thickness of 25 μm and a refractive index of 1.57 was used, a third adhesive layer with a thickness of 50 μm and a refractive index of 1.54 was used, and a fourth adhesive layer with a thickness of 75 μm and a refractive index of 1.54 was used. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer was 0.06. Furthermore, the difference between the maximum and minimum values ​​of the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the third adhesive layer, and the refractive index of the fourth adhesive layer was 0.06.

[0302] (Example B3) A laminate for an image display device (Example B3) was fabricated in the same manner as in Example B1, except that a substrate with a thickness of 12 μm and a refractive index of 1.53 was used, and a protective layer with a thickness of 0.2 μm and a refractive index of 1.55 was used. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer was 0.02. Furthermore, the difference between the maximum and minimum values ​​of the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the third adhesive layer, and the refractive index of the fourth adhesive layer was 0.02.

[0303] (Comparative Example B1) A laminate for an image display device (Comparative Example B1) was fabricated in the same manner as in Example B1, except that a substrate with a thickness of 25 μm and a refractive index of 1.51 was used, a protective layer with a thickness of 50 μm and a refractive index of 1.65 was used, a third adhesive layer with a thickness of 50 μm and a refractive index of 1.54 was used, and a fourth adhesive layer with a thickness of 75 μm and a refractive index of 1.54 was used. In this case, the difference between the refractive index of the substrate and the refractive index of the protective layer was 0.14. Furthermore, the difference between the maximum and minimum values ​​of the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the third adhesive layer, and the refractive index of the fourth adhesive layer was 0.14.

[0304] (Comparative example B2) A laminate for an image display device (Comparative Example B2) was fabricated in the same manner as in Example B1, except that a protective layer was not provided.

[0305] Next, the mounting durability, invisibility, and bending resistance of the wiring boards of Example B1-3 and Comparative Example B1-2 were evaluated when incorporated into an image display device. The results are shown in Table 2.

[0306] "Mounting durability" was determined by whether the circuit board showed no damage such as breakage, twisting, or bending when subjected to heat and pressure during mounting. A "high" rating indicated that the circuit board was undamaged, and a "low" rating indicated that it suffered damage such as breakage, twisting, or bending.

[0307] "Invisibility" was determined as follows: "High" was defined as the inability to visually identify the outer edge of the wiring board when observed at angles of 30°, 60°, and 90° relative to the surface of the substrate in a typical visual inspection environment; and "Low" was defined as the inability to visually identify the outer edge of the wiring board when observed at angles of 30°, 60°, and 90° relative to the surface of the substrate in a typical visual inspection environment.

[0308] "Flexural resistance" was determined by using a cylindrical mandrel bending tester to bend the circuit board 180° around a 2mm diameter cylinder. If no peeling or breakage of the metal layer occurred and the resistance fluctuation was less than 0.5Ω / □, it was judged as "high." If peeling or breakage of the metal layer occurred or the resistance fluctuation was 0.5Ω / □ or more, it was judged as "low."

[0309] [Table 2]

[0310] Thus, the wiring board of Example B1-3 was found to have high mounting durability, invisibility, and bending resistance. The wiring board of Comparative Example B1-2 was found to have low mounting durability, invisibility, or bending resistance.

[0311] [Differentiation] Next, we will describe a modified example of a wiring board.

[0312] (First variation) Figure 38 shows a first modified example of the wiring board. The modified example shown in Figure 38 differs in that a dummy wiring layer 30 is provided around the mesh wiring layer 20, while the other configurations are substantially the same as those of the embodiments shown in Figures 1 to 37 described above. In Figure 38, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 37, and detailed descriptions are omitted.

[0313] In the wiring board 10 shown in Figure 38, a dummy wiring layer 30 is provided around the mesh wiring layer 20. Unlike the mesh wiring layer 20, this dummy wiring layer 30 does not substantially function as an antenna. In this case, the metal layer 90 includes the mesh wiring layer 20, the dummy wiring layer 30, and the power supply section 40.

[0314] In this way, by arranging a dummy wiring layer 30 electrically independent of the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be obscured. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0315] (Second variation) Figure 39 shows a second modified example of the wiring board. The modified example shown in Figure 39 differs in that multiple dummy wiring layers 30A and 30B with different aperture ratios are provided around the mesh wiring layer 20, while the other configurations are substantially the same as those of the embodiments shown in Figures 1 to 38 described above. In Figure 39, the same reference numerals are used for parts that are the same as those shown in Figures 1 to 38, and detailed descriptions are omitted.

[0316] In the wiring board 10 shown in Figure 39, a plurality of dummy wiring layers 30A and 30B (first dummy wiring layer 30A and second dummy wiring layer 30B) with different aperture ratios are provided around the mesh wiring layer 20 (in this case, two). Specifically, the first dummy wiring layer 30A is arranged around the mesh wiring layer 20, and the second dummy wiring layer 30B is arranged around the first dummy wiring layer 30A. Unlike the mesh wiring layer 20, these dummy wiring layers 30A and 30B do not substantially function as antennas. The metal layer 90 includes the mesh wiring layer 20, the dummy wiring layers 30A and 30B, and the power supply section 40.

[0317] In this way, by arranging dummy wiring layers 30A and 30B that are electrically independent from the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made more indistinct. As a result, the mesh wiring layer 20 can be made less visible on the surface of the image display device 60, making it difficult for users of the image display device 60 to recognize the mesh wiring layer 20 with the naked eye.

[0318] The multiple components disclosed in the above embodiments and variations can be combined as needed. Alternatively, some components may be removed from all the components shown in the above embodiments and variations.

Claims

1. A wiring board comprising a substrate including a first surface and a second surface located opposite the first surface, a mesh wiring layer disposed on the first surface of the substrate, a power supply unit electrically connected to the mesh wiring layer, and a protective layer disposed on the first surface of the substrate and covering the mesh wiring layer and the power supply unit, The system comprises a power supply line electrically connected to the power supply unit via an anisotropic conductive film containing conductive particles, The substrate is transparent, The power supply unit is partially covered by the protective layer. The anisotropic conductive film covers the portion of the power supply unit that is not covered by the protective layer, in the module.

2. The module according to claim 1, wherein a portion of the anisotropic conductive film is disposed on the protective layer.

3. The module according to claim 1, wherein the portion of the power supply section not covered by either the protective layer or the anisotropic conductive film is covered by a coating layer containing a corrosion-resistant material.

4. The module according to claim 1, wherein the power supply line is electrically connected to the power supply section by the conductive particles entering the protective layer.

5. The module according to claim 1, wherein the thickness of the protective layer is 4.0 μm or more and 8.0 μm or less.

6. The module according to claim 1, wherein a dummy wiring layer is provided around the mesh wiring layer, electrically independent from the mesh wiring layer.

7. The module according to claim 1, wherein the wiring board has the function of an antenna.

8. The module according to claim 1, wherein the mesh wiring layer has a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

9. A module according to any one of claims 1 to 8, A first adhesive layer located on the first surface side of the substrate, The substrate comprises a second adhesive layer located on the second surface side, A laminate for an image display device, wherein a portion of the substrate is disposed in a portion of the region between the first adhesive layer and the second adhesive layer.

10. A laminate for an image display device according to claim 9, An image display device comprising a display device formed by stacking the aforementioned image display device laminates.

11. A method for manufacturing a module, A step of preparing a substrate including a first surface and a second surface located opposite the first surface, A step of forming a mesh wiring layer and a power supply unit electrically connected to the mesh wiring layer on the first surface of the substrate, A step of forming a protective layer on the first surface of the substrate so as to cover the mesh wiring layer and the power supply section, The process includes a step of electrically connecting a power supply line to the power supply section via an anisotropic conductive film containing conductive particles, The substrate is transparent, The power supply unit is partially covered by the protective layer. A method for manufacturing a module, wherein the anisotropic conductive film covers the area of ​​the power supply section that is not covered by the protective layer.

12. A wiring board for an image display device, circuit board and A metal layer disposed on the substrate, The metal layer comprises a protective layer that covers a portion of the metal layer, The substrate is transparent, The aforementioned metal layer includes a mesh wiring layer, A wiring board wherein the protective layer exists in a first region that does not overlap with the display area of ​​the image display device, and does not exist in a second region that overlaps with the display area of ​​the image display device.

13. The wiring board according to claim 12, wherein the difference between the thermal shrinkage rate of the protective layer and the thermal shrinkage rate of the substrate after 1 hour at 120°C is 1% or less.

14. The wiring board according to claim 12, wherein the dielectric loss tangent of the protective layer is 0.002 or less.

15. The thickness T of the aforementioned substrate １ The thickness T of the protective layer relative to the thickness T １２ The ratio (T １２ / T １ The wiring board according to claim 12, wherein the coefficient of

16. The wiring board according to claim 12, wherein the thickness of the substrate is 10 μm or more and 50 μm or less.

17. The wiring board according to claim 12, wherein a dummy wiring layer is provided around the mesh wiring layer, electrically independent from the mesh wiring layer.

18. The wiring board according to claim 12, wherein the mesh wiring layer functions as an antenna.

19. The wiring board according to claim 12, further comprising a power supply unit electrically connected to the mesh wiring layer, wherein the mesh wiring layer has a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

20. The wiring board according to claim 12, wherein the substrate, the metal layer, and the protective layer are curved in the first region.

21. A wiring board according to any one of claims 12 to 18 and 20, The wiring board is equipped with a power supply line electrically connected to the aforementioned wiring board, The wiring board further comprises a power supply unit electrically connected to the mesh wiring layer, The power supply line is a module electrically connected to the power supply unit.

22. The wiring board according to claim 19, A module comprising a power supply line electrically connected to the power supply section of the wiring board.

23. The wiring board according to claim 12, A third adhesive layer having a larger area than the aforementioned substrate, A fourth adhesive layer having a larger area than the aforementioned substrate is provided, The third adhesive layer described above is transparent, The fourth adhesive layer is transparent, A laminate for an image display device, wherein a portion of the substrate is disposed in a portion of the region between the third adhesive layer and the fourth adhesive layer.

24. The laminate for an image display device according to claim 23, wherein at least one of the thicknesses of the third adhesive layer and the fourth adhesive layer is 1.5 times or more the thickness of the substrate.

25. The laminate for an image display device according to claim 23, wherein the material of the third adhesive layer is an acrylic resin, and the material of the fourth adhesive layer is an acrylic resin.

26. A laminate for an image display device according to any one of claims 23 to 25, An image display device comprising a display unit having a display area, which is laminated on the aforementioned laminate for image display devices.

27. A wiring board for an image display device, circuit board and A metal layer disposed on the substrate, The metal layer comprises a protective layer covering the metal layer, The substrate is transparent, The aforementioned metal layer includes a mesh wiring layer, The difference between the refractive index of the substrate and the refractive index of the protective layer is 0.1 or less. A wiring board in which the substrate, the metal layer, and a portion of the protective layer are curved.

28. The wiring board according to claim 27, wherein the difference between the thermal shrinkage rate of the protective layer and the thermal shrinkage rate of the substrate after 1 hour at 120°C is 1% or less.

29. The wiring board according to claim 27, wherein the dielectric loss tangent of the protective layer is 0.002 or less.

30. The thickness T of the aforementioned substrate １ The thickness T of the protective layer relative to the thickness T １２ The ratio (T １２ / T １ The wiring board according to claim 27, wherein the coefficient of

31. The wiring board according to claim 27, wherein the thickness of the substrate is 10 μm or more and 50 μm or less.

32. The wiring board according to claim 27, wherein a dummy wiring layer is provided around the mesh wiring layer, electrically independent from the mesh wiring layer.

33. The wiring board according to claim 27, wherein the mesh wiring layer functions as an antenna.

34. The wiring board according to claim 27, further comprising a power supply unit electrically connected to the mesh wiring layer, wherein the mesh wiring layer has a transmission unit connected to the power supply unit and a transmitting / receiving unit connected to the transmission unit.

35. A wiring board according to any one of claims 27 to 33, The wiring board is equipped with a power supply line electrically connected to the aforementioned wiring board, The wiring board further comprises a power supply unit electrically connected to the mesh wiring layer, The power supply line is a module electrically connected to the power supply unit.

36. A wiring board according to claim 34, A module comprising a power supply line electrically connected to the power supply section of the wiring board.

37. The third adhesive layer, The fourth adhesive layer, The device comprises a wiring board disposed between the third adhesive layer and the fourth adhesive layer, The aforementioned wiring board comprises a substrate, a metal layer disposed on the substrate, and a protective layer covering the metal layer. The substrate is transparent, The third adhesive layer described above is transparent, The fourth adhesive layer is transparent, The aforementioned metal layer includes a mesh wiring layer, A laminate for an image display device, wherein the difference between the maximum and minimum values ​​of the refractive index of the substrate, the refractive index of the protective layer, the refractive index of the third adhesive layer, and the refractive index of the fourth adhesive layer is 0.1 or less.

38. The laminate for an image display device according to claim 37, wherein at least one of the thicknesses of the third adhesive layer and the fourth adhesive layer is 1.5 times or more the thickness of the substrate.

39. The laminate for an image display device according to claim 37, wherein the material of the third adhesive layer is an acrylic resin, and the material of the fourth adhesive layer is an acrylic resin.

40. A laminate for an image display device according to any one of claims 37 to 39, An image display device comprising a display unit stacked on the aforementioned laminate for image display device.

Images