A film-like underfill material, a resin composition for the film-like underfill material, a method for manufacturing a semiconductor chip with a resin composition layer using the film-like underfill material, a method for manufacturing a substrate for mounting a semiconductor chip with a resin composition layer, and a method for manufacturing a semiconductor device.

Abstract

This film underfill material includes a resin composition layer including a thermosetting resin (A) and a visible light-absorbing agent (B), and a base film. The light transmittance of the film underfill material at a wavelength of 600 nm is 20-90%, and the difference between the light transmittance of the base film at a wavelength of 600 nm and the light transmittance of the film underfill material at a wavelength of 600 nm is 2-80%.

Description

Technical Field

[0001] The present invention relates to an underfill material and a resin composition, and more particularly, to a film-like underfill material, a resin composition for a film-like underfill material, and a semiconductor chip with a resin composition layer, a substrate for mounting a semiconductor chip with a resin composition layer, and a semiconductor device.

Background Art

[0002] Conventionally, with the miniaturization and high performance of semiconductor devices, flip chip mounting has attracted attention as a method of mounting a semiconductor chip (hereinafter sometimes abbreviated as "chip") on a substrate for mounting a semiconductor chip (hereinafter sometimes abbreviated as "substrate"). In flip chip mounting, after joining the chip and the substrate, it is common practice to fill the gap between the chip and the substrate with an underfill material and cure it. There is also a method in which an underfill material (also referred to as a pre-applied underfill material) is filled in the chip or the substrate, and then the chip, the underfill material, and the substrate are joined together. [[ID=id13]]

[0003] In recent years, as an underfill material, the demand for film-like underfill materials has been increasing for applications such as pre-applied underfill materials. Examples of such film-like underfill materials include, for example, underfill materials using radical polymerizable monomers in the main resin, semiconductor films containing resins having transparency, crosslinking reactions, compounds having flux activity, inorganic fillers, etc. (see, for example, Patent Documents 1 and 2 below).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0005] On the surface of a semiconductor chip or the like, an alignment mark, also called a positioning mark, is provided. The mark is recognized by a camera or the like for positioning and is mounted on a substrate or the like. Since the recognition of such an alignment mark affects the yield rate during the production of a semiconductor chip with a resin composition layer or the like, technologies for increasing the recognition rate of alignment marks have been studied in recent years as in the invention described in Patent Document 2.

[0006] On the other hand, in order to improve the recognition of alignment marks, it is conceivable to increase the light transmittance of the resin composition layer. However, as a result of increasing the light transmittance of the resin composition layer, if the light transmittance of the resin composition becomes too high or the difference between the light transmittance of the resin composition layer and the light transmittance of the base film used for the underfill material becomes small, it becomes difficult to visually determine whether the resin composition layer is present on either the front or back of the base film, and the handling property of the NCF and the working efficiency during NCF placement are significantly reduced. From the above, there is a demand for the development of a film-like underfill material that is excellent in handling property and can easily and accurately mount a semiconductor chip with a resin composition layer.

[0007] An object of the present invention is to provide a film-like underfill material that can easily and accurately mount an object laminated with a resin composition layer, a resin composition for a film-like underfill material used for producing the film-like underfill material, a method for manufacturing a semiconductor chip with a resin composition layer using the film-like underfill material, a method for manufacturing a substrate for mounting a semiconductor chip with a resin composition layer, and a method for manufacturing a semiconductor device, in order to solve the above problems.

MEANS FOR SOLVING THE PROBLEMS

[0008] The inventors of the present invention conducted diligent research to solve the aforementioned problems of the prior art and, as a result, discovered that a specific resin composition can solve the aforementioned problems, thus completing the present invention.

[0009] In other words, the present invention includes the following: <1> A resin composition layer comprising a thermosetting resin (A) and a visible light absorber (B), A film-like underfill material comprising a base film, The light transmittance of the aforementioned film-like underfill material at a wavelength of 600 nm is 20-90%, and A film-like underfill material in which the difference between the light transmittance of the base film at a wavelength of 600 nm and the light transmittance of the film-like underfill material at a wavelength of 600 nm is 2 to 80%. <2> The thickness of the resin composition layer is in the range of 5 to 500 μm. <1> The film-like underfill material described above. <3> The visible light absorber (B) is at least one selected from the group consisting of organic dyes, organic pigments, and combinations thereof. <1> or the above <2> The film-like underfill material described above. <4> The visible light absorber (B) is a quinone-based, aminoketone-based, cationic-based, cyanine-based, phthalocyanine-based, or quinac Lido At least one selected from the group consisting of diaryl / triarylmethane, flugide, azo, squarylium, oxonol, benzylidene, nitro, nitroso, thiazole, indigoid, and combinations thereof. seeds The compound, <1> ~the aforementioned <3> A film-like underfill material as described in any of the following. <5> The visible light absorber (B) comprises at least one compound selected from the group consisting of quinone-based, aminoketone-based, and combinations thereof. <1> ~the aforementioned <4> A film-like underfill material as described in any of the following. <6> The thermosetting resin (A) comprises at least one selected from the group consisting of maleimide compounds, citraconimide compounds, and combinations thereof. <1> ~the aforementioned <5> A film-like underfill material as described in any of the following. <7> The maleimide compound includes at least one selected from the group consisting of 2,2'-bis{4-(4-maleimidophenoxy)phenyl}propane, 1,2-bis(maleimide)ethane, 1,4-bis(maleimide)butane, 1,6-bis(maleimide)hexane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-phenylmaleimide, a maleimide compound represented by the following formula (3), a bismaleimide compound containing a structural unit represented by the following formula (4) and maleimide groups at both ends, a maleimide compound represented by the following formula (5), a maleimide compound represented by the following formula (6), a maleimide compound represented by the following formula (7), and combinations thereof. <6> The film-like underfill material described above. [ka] (In formula (3), n 3 (This represents an integer between 1 and 30.) [ka] (In formula (4), R 11 R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 12 R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 13 Each of these independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. 5 (This represents an integer between 1 and 10.) [ka] (In formula (5), each R8 independently represents a hydrogen atom, a methyl group, or an ethyl group. Each R9 independently represents a hydrogen atom or a methyl group.)

Chemical formula

Chemical formula

[0010] According to the present invention, it is possible to provide a film-like underfill material that is easy to handle and allows for easy and accurate mounting of objects on which a resin composition layer has been laminated, a resin composition for film-like underfill material used in the production of the film-like underfill material, a method for manufacturing a semiconductor chip with a resin composition layer using the film-like underfill material, a method for manufacturing a substrate for mounting a semiconductor chip with a resin composition layer, and a method for manufacturing a semiconductor device. [Modes for carrying out the invention]

[0011] The following describes embodiments for carrying out the present invention (hereinafter simply referred to as "this embodiment"). Note that the following embodiments are illustrative examples for explaining the present invention, and the present invention is not limited to these embodiments.

[0012] In this embodiment, "(meth)acryloxy" means both "acryloxy" and its corresponding "methacryloxy," "(meth)acrylonitrile" means both "acrylonitrile" and its corresponding "methacrylonitrile," "(meth)acrylic" means both "acrylic" and its corresponding "methacrylic," "(meth)acrylate" means both "acrylate" and its corresponding "methacrylate," and "(meth)allyl" means both "allyl" and its corresponding "methallyl." Furthermore, unless otherwise specified, "~" in this specification means that the values ​​at both ends are included as the upper and lower limits, and the units for these upper and lower limits are the same.

[0013] Film-type underfill material The film-like underfill material of this embodiment (hereinafter sometimes simply referred to as "underfill material") comprises a resin composition layer containing a thermosetting resin (A) and a visible light absorber (B), and a base film, wherein the light transmittance of the film-like underfill material at a wavelength of 600 nm is 20 to 90%, and the difference between the light transmittance of the base film at a wavelength of 600 nm and the light transmittance of the film-like underfill material at a wavelength of 600 nm is 2 to 80%.

[0014] In this embodiment, the "film-like underfill material" is a laminate comprising a base film and a resin composition layer, and refers to a material that functions as an underfill material by laminating it onto an object such as a semiconductor wafer (hereinafter sometimes abbreviated as "wafer") and then peeling the base film from the resin composition layer, thereby filling the space between the chip and the substrate. The resin composition layer is a non-conductive film and is also called Non-Conductive Film (NCF). Furthermore, the resin composition layer in this embodiment can be made using the resin composition for film-like underfill material of this embodiment (hereinafter sometimes simply referred to as "resin composition"), which will be described later.

[0015] The underfill material of this embodiment comprises a base film and a resin composition layer provided on the base film. The resin composition layer can be, for example, a resin composition that has been applied to the base film in an uncured state (Stage A) and then brought to a semi-cured state (Stage B). In this embodiment, the uncured state (Stage A) refers to a state in which the resin composition has not hardened and has not gelled. The resin composition before application to the base film is, for example, a mixture of the components of the resin composition (which may or may not contain a solvent), or a varnish obtained by dissolving or dispersing the mixture in a solvent, and is in an uncured state (Stage A). The semi-cured state (Stage B) refers to a state in which each component contained in the resin composition layer has not actively started to react (harden), but the resin composition layer has been heated to the point where it is dry, i.e., non-sticky, and the solvent has evaporated. This also includes a state in which the solvent has evaporated without hardening, even without heating.

[0016] (Light transmittance) In this embodiment, the underfill material has a light transmittance of 20-90% at a wavelength of 600 nm for the film-like underfill material (hereinafter sometimes simply referred to as "light transmittance of the underfill material"). Therefore, the light transmittance of the resin composition layer of the film-like underfill material at a wavelength of 600 nm can also be in the range of 20-90%. Therefore, when a semiconductor chip is placed on it using a camera or the like, alignment marks provided on the surface of the chip via the resin composition layer can be accurately and quickly recognized. This makes it possible to easily and accurately place the semiconductor chip with the resin composition layer onto a substrate or the like when mounting it on the substrate or the like. Furthermore, during the manufacturing process of underfill material, foreign matter may be mixed in between the base film and the resin composition layer, or within the resin composition itself. The presence of such foreign matter can affect the performance of the underfill material, such as the film-forming properties and insulation reliability of the resin composition layer. For this reason, in order to ensure the performance of the underfill material, foreign matter inspection using defect inspection machines is often performed after the underfill material has been manufactured. On the other hand, it is preferable to perform this foreign matter inspection on the underfill material itself, that is, in the laminated state of the base film and the resin composition layer. In addition, a certain degree of transmittance is usually required for foreign matter inspection using an inspection machine. Since the light transmittance of the underfill material in this embodiment is in the range of 20 to 90%, the above-mentioned foreign matter inspection can be performed.

[0017] In this embodiment, the light transmittance of the underfill material is preferably 40-90%, and more preferably 50-90%, from the viewpoint of accommodating cameras with low light intensity and further improving the accuracy of the foreign object inspection described above.

[0018] In the underfill material of this embodiment, the light transmittance of the base film at a wavelength of 600 nm (hereinafter sometimes simply referred to as "light transmittance of the base film") is not particularly limited, but from the viewpoint of further improving the accuracy of the foreign matter inspection described above, it is preferably 20 to 90%, and more preferably 40 to 90%. Similarly, although not particularly limited, the light transmittance of the resin composition layer (NCF) at a wavelength of 600 nm (hereinafter sometimes simply referred to as "light transmittance of the resin composition layer") is preferably 20-90%, and more preferably 40-90%, from the viewpoint of compatibility with cameras with low light intensity and further improving the accuracy of the foreign object inspection described above.

[0019] The light transmittance of the underfill material, base film, and resin composition layer can be measured, for example, by the method described in the examples below. Specifically, the values ​​measured using a spectrophotometer at room temperature (25°C) can be adopted. Alternatively, the light transmittance of each underfill material, base film, and NCF can be obtained by, for example, preparing a sample of 5 cm wide x 5 cm long for each and taking the average value measured at any point on the sample (for example, the average value of 5 points). Furthermore, since the underfill material of this embodiment is based on the light transmittance at each wavelength of 600 nm, it can be widely applied to various alignment mark recognition devices such as cameras, as they are readily available and highly versatile.

[0020] (The difference between the light transmittance of the base film and the light transmittance of the underfill material) The underfill material of this embodiment contains a visible light absorber (B) in the resin composition layer, and the difference between the light transmittance of the base film at a wavelength of 600 nm and the light transmittance of the underfill material at a wavelength of 600 nm is 2 to 80%. When there is such a difference between the light transmittance of the base film at a wavelength of 600 nm and the light transmittance of the underfill material at a wavelength of 600 nm, there is a difference in the light transmittance of the base film and the resin composition layer, making it possible to easily distinguish the base film surface and the resin composition layer surface of the film by visual inspection, i.e., it has excellent visibility. As a result, it does not take time to recognize the base film surface and the resin composition layer surface, the handling of the underfill material can be improved, and it can be easily placed on the target object such as a wafer. In this embodiment, the difference between the light transmittance of the base film and the light transmittance of the underfill material is more preferably 5 to 80%, and particularly preferably 10 to 80%, from the viewpoint of better visibility.

[0021] Light transmittance of the substrate film at a wavelength of 600 nm [T 1 ] and the light transmittance of the underfill material at a wavelength of 600 nm [T 0 The difference with ] is |T 1 -T 0The absolute value of the difference between these two is used as the basis for judgment.

[0022] In this embodiment, the laminated structure of the underfill material is not particularly limited as long as the light transmittance of the underfill material and the difference between said light transmittance and the light transmittance of the base film satisfy the above-mentioned relationship. For example, it may have an intermediate layer between the base film and the resin composition layer. An example of an intermediate layer is a release layer provided on the base film. For example, if the base film is a film with a release layer, the release layer is peeled off together with the base film after the base film is peeled off, so the transmittance of the entire "base film with a release layer" can be considered as the "light transmittance of the base film" mentioned above.

[0023] <Base film> The base film is not particularly limited, but for example, a polymer film can be used. Examples of polymer films include polyester resins such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate; vinyl resins such as polyvinyl chloride, polyvinylidene chloride, polyethylene, polypropylene, polybutene, polybutadiene, ethylene-propylene copolymer, polymethylpentene, ethylene-vinyl acetate copolymer, and ethylene-vinyl alcohol copolymer; polyurethane resins; polyimide resins; and polyamide resins. As the base film, films containing these resins, and release films in which a release agent is applied to the surface of these films can be used. Among these, films containing one or more resins selected from polyester resins, polyimide resins, and polyamide resins, or release films in which a release agent is applied to the surface of these films are preferred, and films containing polyethylene terephthalate, a type of polyester resin, or release films in which a release agent is applied to the surface of a film containing polyethylene terephthalate are more preferred.

[0024] The thickness of the base film is not particularly limited and can be adjusted as appropriate from the viewpoint of achieving the above-mentioned light transmittance, but it is preferably 10 to 100 μm from the viewpoint of ease of manufacturing the underfill material, for example, good stability of the coating thickness when coating the resin composition onto the base film, and good transportability of the underfill material. Furthermore, the lower limit of the substrate film thickness is more preferably 10 μm or more, even more preferably 20 μm or more, and even more preferably 25 μm or more, from the standpoint of ensuring sufficient yield when manufacturing the underfill material. The upper limit of the substrate film thickness is preferably 100 μm or less, even more preferably 80 μm or less, and even more preferably 50 μm or less, from the standpoint of the substrate film not ultimately existing as a component of the semiconductor device but being peeled off during the process, and from the standpoint of the manufacturing cost of the underfill material.

[0025] <Resin composition layer> The resin composition layer comprises a thermosetting resin (A) and a visible light absorber (B). The resin composition layer may optionally contain one or more selected from the group consisting of an inorganic filler (C), a flux activator (D), a curing catalyst (E), a curing agent (F), and combinations thereof. In this embodiment, the resin composition layer can be formed using a resin composition for film-like underfill material comprising at least a thermosetting resin (A) and a visible light absorber (B). Similarly, the resin composition for film-like underfill material may optionally contain one or more selected from the group consisting of an inorganic filler (C), a flux activator (D), a curing catalyst (E), a curing agent (F), and combinations thereof.

[0026] Since the underfill material of this embodiment is suitable for use as a pre-applied underfill material, as described above, the resin composition layer is preferably in a semi-cured state (Stage B). In this embodiment, the minimum melt viscosity in the semi-cured state (Stage B) can usually be 50,000 Pa·s or less. The lower limit of the minimum melt viscosity can be, for example, 10 Pa·s or more.

[0027] In this embodiment, the minimum melt viscosity of the resin composition layer can be measured by the following method. Specifically, a resin composition layer can be laminated using a laminator to obtain a resin piece with a thickness of approximately 0.4 to 0.6 mm. This resin piece can then be used as a sample, and the minimum melt viscosity can be measured using a rheometer (HAAKEMARS60 (product name) manufactured by Thermo Fisher Scientific). For this measurement, a disposable parallel plate with a plate diameter of 8 mm is used, and the minimum melt viscosity of the resin piece is measured in the range of 40°C to 300°C under conditions of a heating rate of 10°C / min, a frequency of 10.0 rad / sec, and a strain of 0.1%. This value can then be considered as the minimum melt viscosity of the resin composition layer.

[0028] The method for producing the underfill material of this embodiment by forming a resin composition layer on a base film is not particularly limited. For example, such a production method involves applying a varnish, obtained by dissolving or dispersing a resin composition containing a thermosetting resin (A) and a visible light absorber (B) in an organic solvent, to the surface of a base film, drying it under heat and / or reduced pressure, removing the solvent, and solidifying the resin composition to form a resin composition layer. The drying conditions are not particularly limited, but it is preferable to dry the resin composition layer such that the content ratio of the organic solvent to the total mass (100 parts by mass) of the resin composition layer is usually 10 parts by mass or less, preferably 5 parts by mass or less. The conditions for achieving such drying also vary depending on the type and amount of organic solvent in the varnish. For example, in the case of a varnish containing 10 to 200 parts by mass of methyl ethyl ketone per 100 parts by mass of total thermosetting resin (A), drying at 1 atmosphere and a heating condition of 90 to 160°C for 2 to 15 minutes is a guideline.

[0029] The thickness of the resin composition layer in the underfill material of this embodiment is such that it can exhibit a transmittance sufficient to achieve the light transmittance of the underfill material described above. This can vary depending on the content of the visible light absorber (B) described later, but from the viewpoint of better removing relatively low molecular weight volatile components when the resin composition layer dries, and from the viewpoint of more effectively and reliably performing its function as an underfill material, a range of 5 to 500 μm is preferred, a range of 5 to 100 μm is more preferred, and a range of 5 to 50 μm is particularly preferred.

[0030] [Thermosetting resin (A)] The resin composition layer includes a thermosetting resin (A). Any known thermosetting resin that can exhibit a transmittance sufficient to achieve the light transmittance of the underfill material described above can be used as appropriate. The type of thermosetting resin (A) is not particularly limited, but examples include maleimide compounds, citraconimide compounds, epoxy resins, oxetane resins, phenolic resins, (meth)acrylate resins, unsaturated polyester resins, diallyl phthalate resins, etc. Among these, it is preferable to include at least one selected from the group consisting of maleimide compounds, citraconimide compounds, and combinations thereof. It is preferable that the thermosetting resin (A) does not react with the flux activator (D) described later. Furthermore, the thermosetting resin (A) can be used alone or in a mixture of two or more types.

[0031] The thermosetting resin (A) can be a combination of a compound with a relatively high molecular weight (A1) and a compound with a relatively low molecular weight (A2). For example, using a compound with a relatively high molecular weight (A1) can alleviate the stress generated during curing shrinkage when semiconductor chip mounting or during thermosetting (post-curing). Alternatively, using a compound with a relatively low molecular weight (A2) can improve the crosslinking density when semiconductor chip mounting or during post-curing.

[0032] Furthermore, the thermosetting resin (A) can be used in combination with at least one selected from the group consisting of a maleimide compound (AA-1) with a weight-average molecular weight of 3,000 to 9,500, a citraconiamide compound (AB-1) with a weight-average molecular weight of 3,000 to 9,500, and combinations thereof, and at least one selected from the group consisting of a maleimide compound (AA-2) with a weight-average molecular weight of 300 to less than 3,000, a citraconiamide compound (AB-2) with a weight-average molecular weight of 300 to less than 3,000, and combinations thereof. Compound (A1) preferably contains maleimide compound (AA-1) because it provides even better low void properties and chip adhesion. Furthermore, compound (A2) preferably contains maleimide compound (AA-2) because it provides even better low void properties and chip adhesion.

[0033] As for the maleimide compound (AA-1), in order to obtain even better low void properties and tip adhesion, its weight-average molecular weight is preferably 3,200 to 8,000, and more preferably 3,300 to 6,000. As for the citraconimide compound (AB-1), in order to obtain even better low void properties and tip adhesion, its weight-average molecular weight is preferably 3,200 to 8,000, and more preferably 3,300 to 6,000. As for the maleimide compound (AA-2), since even better low void properties and tip adhesion can be obtained, its weight-average molecular weight is preferably 350 to 2,800, and more preferably 400 to 2,500. As for the citraconimide compound (AB-2), in order to obtain even better low void properties and tip adhesion, its weight-average molecular weight is preferably 350 to 2,800, and more preferably 400 to 2,500.

[0034] (Maleimide compounds) Compared to epoxy resins and the like, maleimide compounds are significantly less prone to reactions with flux activators during storage and heat treatment, resulting in less deactivation of the flux activator. The maleimide compound is not particularly limited as long as it is a resin or compound having one or more maleimide groups in its molecule. One or more maleimide compounds can be used. Examples of such maleimide compounds include N-phenylmaleimide, N-hydroxyphenylmaleimide, bis(4-maleimidophenyl)methane, 4,4-diphenylmethanebismaleimide, bis(3,5-dimethyl-4-maleimidophenyl)methane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, bis(3,5-diethyl-4-maleimidophenyl)methane, phenylmethanemaleimide, and o-phenyl Nilenbismaleimide, m-phenylenebismaleimide, p-phenylenebismaleimide, 2,2-bis(4-(4-maleimidophenoxy)-phenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanebismaleimide, 4-methyl-1,3-phenylenebismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, 4,4-diphenyletherbismaleimide, 4,4-diphenyl Examples include nilsulfone bismaleimide, 1,3-bis(3-maleimidophenoxy)benzene, 1,3-bis(4-maleimidophenoxy)benzene, polyphenylmethanemaleimide, novolac-type maleimide compounds, biphenyl aralkyl-type maleimide compounds, 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane, 1,2-bis(maleimide)ethane, 1,4-bis(maleimide)butane, 1,6-bis(maleimide)hexane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-phenylmaleimide, maleimide compounds represented by the following formula (3), bismaleimide compounds containing a constituent unit represented by the following formula (4) and maleimide groups at both ends of the molecular chain, maleimide compounds represented by the following formula (5), maleimide compounds represented by the following formula (6), and maleimide compounds represented by the following formula (7). The thermosetting resin (A) can also be included in the resin composition according to this embodiment in the form of a prepolymer obtained by polymerizing a maleimide compound, or a prepolymer obtained by polymerizing a maleimide compound with other compounds such as an amine compound.

[0035] Maleimide compounds are not particularly limited, but in order to obtain better solubility in organic solvents, 2,2'-bis{4-(4-maleimidophenoxy)phenyl}propane, 1,2-bis(maleimide)ethane, 1,4-bis(maleimide)butane, 1,6-bis(maleimide)hexane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-phenylmaleimide, maleimide compounds represented by the following formula (3), bismaleimide compounds containing a structural unit represented by the following formula (4) and maleimide groups at both ends, maleimide compounds represented by the following formula (5), and below It is preferable to include at least one selected from the group consisting of a maleimide compound represented by formula (6), a maleimide compound represented by formula (7) below, and combinations thereof. Furthermore, it is more preferable to include at least one selected from the group consisting of 2,2'-bis{4-(4-maleimidophenoxy)phenyl}propane, a maleimide compound represented by formula (3) below, a bismaleimide compound containing a structural unit represented by formula (4) below and maleimide groups at both ends, a maleimide compound represented by formula (5) below, a maleimide compound represented by formula (6) below, a maleimide compound represented by formula (7) below, and combinations thereof.

[0036] [ka]

[0037] In formula (3), n 3 This represents an integer between 1 and 30.

[0038] [ka]

[0039] In formula (4), R 11 R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 12R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 13 Each of these independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. 5 This represents an integer between 1 and 10. Details of the constituent units represented by equation (4) will be described later.

[0040] [ka]

[0041] In formula (5), R8 independently represents a hydrogen atom, a methyl group, or an ethyl group. R9 independently represents a hydrogen atom or a methyl group.

[0042] [ka]

[0043] In formula (6), R 10 Each of these independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group. 4 This represents an integer from 1 to 10. 10 It is preferable that it be a hydrogen atom.

[0044] [ka]

[0045] In formula (7), R 10 Each of these independently represents either a hydrogen atom or a methyl group, and n 2 This represents an integer greater than or equal to 1, preferably an integer between 1 and 10.

[0046] Next, we will describe the structure of a bismaleimide compound containing a constituent unit represented by formula (4) and maleimide groups at both ends of the molecular chain.

[0047] The bismaleimide compound may have multiple structural units represented by formula (4), in which case R in the multiple structural units represented by formula (4) 11 , R 12 , and R 13 These may be the same or different. Also, the bismaleimide compound has R in the constituent unit represented by formula (4). 11 , R 12 , and R 13 The mixture may also consist of compounds in which at least one of the number of constituent units of formula (4) in the bismaleimide compound is different.

[0048] In the structural unit represented by formula (4) of a bismaleimide compound, R 11 R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 11 In this regard, linear or branched alkylene groups are preferable, and linear alkylene groups are more preferable, as they allow the resin composition to have a suitable viscosity during chip mounting and to allow for favorable control of the increase in melt viscosity during mounting.

[0049] The number of carbon atoms in the alkylene group is preferably 2 to 14, and more preferably 4 to 12, in order to have a more suitable viscosity for the resin composition during chip mounting and to better control the increase in melt viscosity during mounting. Examples of linear or branched alkylene groups include methylene, ethylene, propylene, 2,2-dimethylpropylene, butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, dodecylene, undecylene, tridecylene, tetradecylene, pentadecylene, hexadecylene, neopentylene, dimethylbutylene, methylhexylene, ethylhexylene, dimethylhexylene, trimethylhexylene, methylheptylene, dimethylheptylene, trimethylheptylene, tetramethylheptylene, ethylheptylene, methyloctylene, methylnonylene, methyldecylene, methyldodecylene, methylundecylene, methyltridecylene, methyltetradecylene, and methylpentadecylene.

[0050] The number of carbon atoms in the alkenylene group is preferably 2 to 14, and more preferably 4 to 12, in order to have a more suitable viscosity for the resin composition during chip mounting and to better control the increase in melt viscosity during mounting. Examples of linear or branched alkenylene groups include vinylene, 1-methylvinylene, allylene, propenylene, isopropenylene, 1-butenylene, 2-butenylene, 1-pentenylene, 2-pentenylene, isopentylene, cyclopentenylene, cyclohexenylene, and dicyclopentadienylene.

[0051] In the constituent unit represented by equation (4), R 12 R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 12 In this regard, linear or branched alkylene groups are preferable, and linear alkylene groups are more preferable, as they allow the resin composition to have a suitable viscosity during chip mounting and to allow for favorable control of the increase in melt viscosity during mounting.

[0052] The number of carbon atoms in the alkylene group is preferably 2 to 14, and more preferably 4 to 12, in order to have a more suitable viscosity for the resin composition during chip mounting and to better control the increase in melt viscosity during mounting. As a linear or branched alkylene group, the above-mentioned R 11 This can be referenced.

[0053] The number of carbon atoms in the alkenylene group is preferably 2 to 14, and more preferably 4 to 12, in order to have a more suitable viscosity for the resin composition during chip mounting and to better control the increase in melt viscosity during mounting. As a linear or branched alkenylene group, the above-mentioned R 11 This can be referenced.

[0054] In the constituent unit represented by equation (4), R 11 And, R 12 These may be the same or different, but it is preferable that they be the same in that the bismaleimide compound can be synthesized more easily.

[0055] In the constituent unit represented by equation (4), R 13 Each of these independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. 13 In order to ensure that the resin composition has a suitable viscosity during chip mounting and that the increase in melt viscosity during mounting can be suitably controlled, it is preferable that each component independently be a hydrogen atom or a linear or branched alkyl group having 1 to 16 carbon atoms, R 13 Of these, groups 1 to 5 (R 13 ) is a linear or branched alkyl group having 1 to 16 carbon atoms, and the remaining group (R 13 It is more preferable that ) is a hydrogen atom, R 13 Of these, 1 to 3 groups (R 13 ) is a linear or branched alkyl group having 1 to 16 carbon atoms, and the remaining group (R 13 It is even more preferable that ) is a hydrogen atom.

[0056] The number of carbon atoms in the alkyl group is preferably 2 to 14, and more preferably 4 to 12, in order to have a more suitable viscosity for the resin composition during chip mounting and to better control the increase in melt viscosity during mounting. Examples of linear or branched alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, 1-ethylpropyl group, n-butyl group, 2-butyl group, isobutyl group, tert-butyl group, n-pentyl group, 2-pentyl group, tert-pentyl group, 2-methylbutyl group, 3-methylbutyl group, 2,2-dimethylpropyl group, n-hexyl group, 2-hexyl group, 3-hexyl group, n-heptyl group, n-octyl group, 2-methylpentyl group, 3-methylpentyl group, 4-methylpentyl group, 2-methylpentan-3-yl group, and n-nonyl group.

[0057] The number of carbon atoms in the alkenyl group is preferably 2 to 14, and more preferably 4 to 12, in order to have a more suitable viscosity for the resin composition during chip mounting and to better control the increase in melt viscosity during mounting. Examples of linear or branched alkenyl groups include vinyl, allyl, 4-pentenyl, isopropenyl, isopentenyl, 2-heptenyl, 2-octenyl, and 2-nonenyl groups.

[0058] In the constituent unit represented by equation (4), n 5 This represents an integer between 1 and 10.

[0059] Bismaleimide compounds have maleimide groups at both ends of their molecular chain. "Both ends" refers to both ends of the molecular chain of a bismaleimide compound. For example, if the structural unit represented by formula (4) is at the end of the molecular chain of a bismaleimide compound, the maleimide group is R 11 This means having a maleimide group at the end of the molecular chain, at the end of the molecular chain at the N atom of the maleimide ring, or at both ends. Bismaleimide compounds may also have maleimide groups in addition to the two ends of the molecular chain. The maleimide group is represented by the following formula (8), with the N atom bonded to the molecular chain of the bismaleimide compound. The maleimide groups bonded to the bismaleimide compound may all be the same or different, but it is preferable that the maleimide groups at both ends of the molecular chain are the same.

[0060] [ka]

[0061] In formula (8), R 11 Each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms. 11 It is preferable that both are hydrogen atoms, as they react more favorably with resin (A). The number of carbon atoms in the alkyl group is preferably 1 to 3, and more preferably 1 to 2, from the viewpoint of reacting more favorably with resin (A). As a linear or branched alkyl group, the above R 13 This can be referenced.

[0062] Examples of such bismaleimide compounds include maleimide compounds represented by the following formula (9). These can be used individually or by mixing two or more compounds with different numbers of 'a' repeating in formula (9) as appropriate.

[0063] [ka]

[0064] In formula (9), a represents an integer from 1 to 10. Preferably, a is an integer from 1 to 6, as this allows the resin composition to have a more suitable viscosity during chip mounting and to more effectively control the increase in melt viscosity during mounting. The maleimide compound represented by formula (9) may be a mixture of compounds in which a is different.

[0065] As for the maleimide compound (AA-1), it is preferable that it be a maleimide compound represented by formula (3) and a bismaleimide compound represented by formula (4) that contains maleimide groups at both ends of the constituent unit and molecular chain, in order to obtain even better low void properties and chip adhesion.

[0066] As for the maleimide compound (AA-2), it is preferable that it be the maleimide compound represented by formula (5) or the maleimide compound represented by formula (6) above, as these provide even better low void properties and tip adhesion.

[0067] As the maleimide compound, commercially available products may be used, and as 2,2'-bis(4-(4-maleimidophenoxy)phenyl)propane, for example, BMI-80 (trade name) manufactured by K.I. Chemicals Co., Ltd. is an example. As the maleimide compound represented by formula (3), for example, BMI-1000P (trade name, in formula (3) n) manufactured by K.I. Chemicals Co., Ltd. is an example. 3 =14 (average value), weight-average molecular weight: 3,700), BMI-650P manufactured by K.I. Chemicals Co., Ltd. (product name, n in formula (3)) 3 =9 (mean value), BMI-250P manufactured by K.I. Chemicals Co., Ltd. (product name, n in formula (3)) 3 =3~8 (average value)), CUA-4 manufactured by K.I. Kasei Co., Ltd. (product name, n in formula (3)) 3 Examples include =1). An example of a bismaleimide compound containing a constituent unit represented by formula (4) and maleimide groups at both ends of the molecular chain is MIZ-001 (trade name, contains a maleimide compound represented by formula (9), weight-average molecular weight: 3,900) manufactured by Nippon Kayaku Co., Ltd. An example of a maleimide compound represented by formula (5) is BMI-70 (trade name; bis-(3-ethyl-5-methyl-4-maleimidophenyl)methane, molecular weight: 550) manufactured by K.I. Chemicals, Inc. An example of a maleimide compound represented by formula (6) is MIR-3000-70MT (trade name; R in formula (6)) manufactured by Nippon Kayaku Co., Ltd. 10 all of them are hydrogen atoms, n 4Examples include a mixture of 1 to 10 (weight-average molecular weight: 1,050). An example of a maleimide compound represented by formula (7) is BMI-2300 (trade name) manufactured by Yamato Chemical Industries, Ltd.

[0068] (Citraconimide compound) The citracomide compounds are not particularly limited, but examples include o-phenylenebiscitraconimide, m-phenylenebiscitraconimide, p-phenylenebiscitraconimide, 4,4-diphenylmethanebiscitraconimide, 2,2-bis[4-(4-citraconimidophenoxy)phenyl]propane, bis(3,5-dimethyl-4-citraconimidophenyl)methane, bis(3-ethyl-5-methyl-4-citraconimidophenyl)methane, bis(3,5-diethyl-4-citraconimidophenyl)methane, 1,3-xylylenebis(citraconimide), N-[3-bis(trimethylsilyl)amino-1-p Examples include [Pyropropyl]citraconimide, N-[3-bis(triethylsilyl)amino-1-propyl]citraconimide, N-[3-bis(triphenylsilyl)amino-1-propyl]citraconimide, N,N'-(m-phenylenedimethylene)disitracomimide, and N-[3-(methylidenesuccinimodomethyl)benzyl]citraconimide, citracomimide compounds represented by the following formula (10), biscitraconimide compounds containing the constituent unit represented by the above formula (4) and citracomimide groups at both ends of the molecular chain, citracomimide compounds represented by the following formula (11), and citracomimide compounds represented by the following formula (12). Note that biscitraconimide compounds can refer to the bismaleimide compounds mentioned above. The details of the structure of formula (4) are as described above, and for the citracomimide group, in formula (8), R 11 The structure of formula (8) can be referenced, except that at least one of the groups is a methyl group. Citraconimide compounds can be used individually or in combination of two or more.

[0069] Among the citraconimide compounds mentioned above, it is preferable to include the citraconimide compound represented by formula (10) below, the biscitraconimide compound containing the structural unit represented by formula (4) and citraconimide groups at both ends of the molecular chain, the citraconimide compound represented by formula (11) below, and the citraconimide compound represented by formula (12) below, as these provide superior solubility in organic solvents and even better low voiding and tip adhesion.

[0070] As for the citraconimide compound (AB-1), it is preferable that it be a citraconimide compound represented by the following formula (10), or a biscitraconimide compound containing a structural unit represented by the above formula (4) and citraconimide groups at both ends of the molecular chain, in order to obtain even better low void properties and chip adhesion.

[0071] [ka]

[0072] In formula (10), n 6 This represents an integer between 1 and 30.

[0073] As for the citraconimide compound (AB-2), it is preferable to use a citraconimide compound represented by the following formula (11) or a citraconimide compound represented by the following formula (12) in order to obtain even better low void properties and tip adhesion.

[0074] [ka]

[0075] In formula (11), R8 independently represents a hydrogen atom, a methyl group, or an ethyl group. R9 independently represents a hydrogen atom or a methyl group. [ka]

[0076] In formula (12), R 10 Each of these independently represents either a hydrogen atom or a methyl group, and n 4 R represents an integer greater than or equal to 1, preferably an integer between 1 and 10. 10 It is preferable that it be a hydrogen atom.

[0077] The total amount of thermosetting resin (A) in the resin composition layer is not particularly limited, but from the viewpoint of curability, manufacturability, and strength of the underfill material, it is preferably 25 parts by mass or more, more preferably 40 parts by mass or more, and even more preferably 50 parts by mass or more, per 100 parts by mass of the total resin components. The upper limit of the total amount of thermosetting resin (A) is not particularly limited, but it is preferably 100 parts by mass or less, more preferably 95 parts by mass or less, and even more preferably 90 parts by mass or less, per 100 parts by mass of the total resin components. The term "resin components" as used herein includes thermosetting resin (A), as well as curing agents (F) and flux activators (D) if resins are used as such, but does not include visible light absorbers (B), curing catalysts (E), etc.

[0078] When the thermosetting resin (A) contains both compound (A1) and compound (A2), even better low void properties and chip adhesion can be obtained. Therefore, the content of compound (A1) is preferably 40 to 90 parts by mass, more preferably 42 to 85 parts by mass, and even more preferably 45 to 80 parts by mass, based on 100 parts by mass of the total of compound (A1) and compound (A2). Furthermore, the content of compound (A2) is preferably 10 to 60 parts by mass, more preferably 15 to 58 parts by mass, and even more preferably 20 to 55 parts by mass, based on 100 parts by mass of the total of compound (A1) and compound (A2).

[0079] When the thermosetting resin (A) contains maleimide compound (AA-1) and maleimide compound (AA-2), even better low void properties and chip adhesion can be obtained. Therefore, the content of maleimide compound (AA-1) is preferably 40 to 90 parts by mass, more preferably 42 to 85 parts by mass, and even more preferably 45 to 80 parts by mass, based on 100 parts by mass of the total of compound (AA-1) and compound (AA-2). Furthermore, the content of maleimide compound (AA-2) is preferably 10 to 60 parts by mass, more preferably 15 to 58 parts by mass, and even more preferably 20 to 55 parts by mass, based on 100 parts by mass of the total of compound (AA-1) and compound (AA-2).

[0080] When the thermosetting resin (A) contains both citraconimide compound (AB-1) and citraconimide compound (AB-2), even better low void properties and chip adhesion can be obtained. Therefore, the content of citraconimide compound (AB-1) is preferably 40 to 90 parts by mass, more preferably 42 to 85 parts by mass, and even more preferably 45 to 80 parts by mass, based on 100 parts by mass of the total of compound (AB-1) and compound (AB-2). Furthermore, the content of citraconimide compound (AB-2) is preferably 10 to 60 parts by mass, more preferably 15 to 58 parts by mass, and even more preferably 20 to 55 parts by mass, based on 100 parts by mass of the total of compound (AB-1) and compound (AB-2).

[0081] [Visible light absorber (B)] The resin composition layer contains a visible light absorber (B). In this embodiment, the light transmittance of the underfill material and the resin composition layer can be set to a desired range by selecting the type of visible light absorber (B) contained in the resin composition layer and adjusting the visible light absorber (B) content and the film thickness of the resin composition layer. For example, it is conceivable to use relatively large inorganic fine particles, such as silica with an average particle diameter of more than 400 nm, to adjust the light transmittance of the resin composition layer. However, large inorganic fine particles tend to settle during storage, reducing the varnish storage stability. Therefore, especially when using an inorganic filler (C) with an average particle diameter of 400 nm or less, adjusting the light transmittance of the resin composition layer using a visible light absorber (B) is advantageous from the viewpoint of varnish storage stability.

[0082] The visible light absorber (B) is not particularly limited as long as it is a material that can absorb visible light. However, from the viewpoint of light absorption efficiency and suppressing reactions with other components such as the thermosetting resin (A), at least one selected from the group consisting of organic dyes, organic pigments, and combinations thereof can be used.

[0083] Organic dyes and organic pigments are not particularly limited, but examples include quinone-based, aminoketone-based, cationic-based, cyanine-based, phthalocyanine-based, and quinac. Lido At least one selected from the group consisting of diaryl / triarylmethane, flugide, azo, squarylium, oxonol, benzylidene, nitro, nitroso, thiazole, indigoid, and combinations thereof. seeds A compound can be used, and from the viewpoint of suppressing reactions with other components such as thermosetting resin (A), at least one compound selected from the group consisting of quinone-based compounds, aminoketone-based compounds, and combinations thereof is preferred.

[0084] (organic dye) Specific examples of organic dyes are not limited to the following, but examples include azo dyes, mordant dyes, reactive dyes, and acid dyes. In this embodiment, black dyes are preferred among the following, from the viewpoint of having a wide absorption wavelength range. Kayaset Black AN Direct Brilliant Pink B(CIDirect Red9) Kayarus Light Red F5G(CIDirect Red225) Direct Light Rose FR(CIDirect Red227) Sumilight Supra Turquoise Blue G(CIDirect Blue86) Direct Supra Blue FFRL(CIDirect Blue108) Kayarus Cupro Green G(CIDirect Green59) Direct Fast Black B(CIDirect Black22) Sunchromine Yellow MR(CIMordant Yellow3) Chrome Yellow AS(CIMordant Yellow5) Chrome Yellow 3R(CIMordant Yellow8) Chrome Yellow PG(CIMordant Yellow23) Chrome Orange FL(CIMordant Orange29) Chrome Red B conc.(CIMordant Red7) Chrome Red 5G(CIMordant Red19) Sunchromine Brilliant Violet R conc.(CIMordant Violet1:1) Chrome Fine Violet R(C.I.Mordant Violet1) Chrome Cyanine BXS(C.I.Mordant Blue1) Mordant Blue B 120%(C.I.Mordant Blue13) Chrome Cyanine BLA(C.I.Mordant Blue29) Mordant Green L(C.I.Mordant Green17) Chrome Green 3B-N(C.I.Mordant Green28) Mordant Brown KS(C.I.Mordant Brown15) Chrome Brown LE(C.I.Mordant Brown19) Chrome Brown RH(C.I.Mordant Brown33) Chrome Black P2B(C.I.Mordant Black7) Chrome Black PLW(C.I.Mordant Black9) Chrome Black ET-1(C.I.Mordant Black11)

[0085] Chrome Navy CR 158%(C.I.Mordant Black17) Chrome Light Grey G(C.I.Mordant Black38) Chrome Bordeaux FB Alizarine Chrome Brilliant Blue BL Chrome Blue 2G Sumifix Yellow GR 150%(C.I Reactive Yellow15) Lanasol Yellow 4G(C.I Reactive Yellow39) Sumifix Golden Yellow GG(A) 150%(C.I Reactive Yellow76) Kayacion Yellow E-S4R(C.I Reactive Yellow84) Novacron Yellow P-6GS gran(C.I Reactive Yellow95) Kayacion Yellow E-SNA(C.I Reactive Yellow102) Kayacion Yellow E-SN4G(C.I Reactive Yellow105) Drimarene Yellow K-2R CDG(C.I Reactive Yellow125) Sumifix Supra Yellow 3RF 150% gran(C.I Reactive Yellow145) Sumifix Supra Brilliant Yellow 3GF 150% gr(C.I Reactive Yellow167) Novacron Yellow C-R(C.I Reactive Yellow168) Novcron Yellow C-5G(C.I Reactive Yellow175) Kayacion Yellow CF-3RJ 150 Kayacion Yellow E-CM Procion Orange PX-RN(C.I.Reactive Orange5) Remazol Brilliant Orange 3R Special(C.I.Reactive Orange16) Levafix Yellow E-3RL gran(C.I.Reactive Orange30) Levafix Orange E-3GA gran(C.I.Reactive Orange64) Remazol Golden Yellow RNL gran 150%(C.I.Reactive Orange107) Drimaren Rubinol X3LR CDG(C.I.Reactive Red55) Brilliant Red G SPL(C.I.Reactive Red112) Brilliant Red 7BF Liq 25%(C.I.Reactive Red114) Lanasol Red 2G(C.I.Reactive Red116) Levafix Scarlet E-2GA gran(C.I.Reactive Red124) Levafix Brilliant Red E-4BA gran(C.I.Reactive Red158)

[0086] Levafix Brilliant Red E-6BA gran(C.I.Reactive Red159) Remazol Brilliant Red F3B gran(C.I.Reactive Red180) Supra Brilliant Red 3BF 150% gran(C.I.Reactive Red195) Remazol Red RB 133%(C.I.Reactive Red198) Supra Scarlet 2GF 150G(C.I.Reactive Red222) Novacron Red P-6B Gran. 150% Novacron Red C-2G Kayacion Violet A-3R(C.I.Reactive Violet1) Remazol Brill. Violet 5R(C.I.Reactive Violet5) Drimaren Violet K-2RL CDG(C.I.Reactive Violet33) Remazol Brill. Blue RN(C.I.Reactive Blue19) Sumifix Turquoise Blue G(N) conc.(C.I.Reactive Blue21) Novacron Blue P-3R IN(C.I.Reactive Blue49) Lanasol Blue 3R(C.I.Reactive Blue50) Drimarene Blue X-3LR CDG(C.I.Reactive Blue52) Lanasol Blue 3G(C.I.Reactive Blue69) Novacron Turquoise P-GR 150%(C.I.Reactive Blue72) Drimarene Navy X-RBL CDG(C.I.Reactive Blue79) Lanasol Blue 8G-01 150%(C.I.Reactive Blue185) Drimarene Blue K-2RL CDG(C.I.Reactive Blue209) Sumifix Supra Blue BRF 150% gran.(C.I.Reactive Blue221) Sumifix Supra Navy Blue BF gran.(C.I.Reactive Blue222) Sumifix Supra Turquoise Blue BGF(N)(C.I.Reactive Blue231) Novacron Blue C-R(C.I.Reactive Blue235) Kayacion Blue CF-GJ 150 Kayacion Blue CF-BL Kayacin Marine E-CM Kayacion Navy E-CM Sumifix Supra Navy Blue 3GF 150% granLevafix Brown E-2R gran(C.I.Reactive Brown19) Novacron Brown P-6R Gran. 150 Remazol Black B-N 150%(C.I.Reactive Black5)

[0087] Remazol Black RL 133%(C.I.Reactive Black31) Remazol Deep Black N 150%(C.I.Reactive Black31) Acid Quinoline Yellow WS H / C(C.I.Acid Yellow3) Kayacyl Yellow GG 80(C.I.Acid Yellow17) Tartrazine NS conc(C.I.Acid Yellow23) Suminol Fast Yellow R conc.(C.I.Acid Yellow25) Kayanol Milling Yellow O(C.I.Acid Yellow38) Suminol Milling Yellow MR(C.I.Acid Yellow42) Aminyl Yellow E-3GL(C.I.Acid Yellow49) Suminol Fast Yellow G (B)(C.I.Acid Yellow61) Erionyl Yellow B-4G(C.I.Acid Yellow79) Kayanol Yellow N5G(C.I.Acid Yellow110) Lanyl Yellow G ex cc(C.I.Acid Yellow116) Kayakalan Yellow GL 143(C.I.Acid Yellow121) Kayanol Milling Yellow 5GW(C.I.Acid Yellow127) Lanacron Yellow N-2GL KWL(C.I.Acid Yellow129) Erionyl Golden Yellow M-R-02(C.I.Acid Yellow151) Tectilon Yellow 2G 200%(C.I.Acid Yellow169) Lanacron Yellow S-2G-01 KWL(C.I.Acid Yellow220) Telon Yellow RLN micro(C.I.Acid Yellow230) Tectilon Yellow 3R 200%(C.I.Acid Yellow246) Chuganol Fast Yellow 5GL(C.I.Acid Yellow40:1) Solar Orange(C.I.Acid Orange7) Solar Light Orange GX(C.I.Acid Orange10) Chuganol Milling Brown 5R(C.I.Acid Orange51) Chuganol Milling OrangeSG(C.I.Acid Orange56) Kayanol Yellow N3R(C.I.Acid Orange67) Aminyl Yellow E-3RL(C.I.Acid Orange67) Lanyl Orange R 200%(C.I.Acid Orange88) Chuganol Milling Orange GSN 150%(C.I.Acid Orange95) Suminol Milling Orange GN(N)(C.I.Acid Orange95) Isolan Orange K-RLS(C.I.Acid Orange107) Telon Orange AGT 01(C.I.Acid Orange116) Lanyl Orange 2R e / c(C.I.Acid Orange120) Supralan Orange S-RL(C.I.Acid Orange166) Lanasyn Yellow M-2RL 180(C.I.Acid Orange180) Nylosan Orange NRL 250(C.I.Acid Orange250)

[0088] Lanasyn Orange M-RL p Silk Scarlet(C.I.Acid Red9) Brilliant Scarlet 3R conc.(C.I.Acid Red18) Acid Rhodamine G Conc(C.I.Acid Red50) Acid Rhodamine B Conc(C.I.Acid Red52) Chugacid Red FCH(C.I.Acid Red73) Chugacid Rubinol 3B 200%(C.I.Acid Red80) Rocceline NS conc. 120%(C.I.Acid Red88) Chuganol Anthracene Red G(C.I.Acid Red97) Suminol Fast Red G (B)(C.I.Acid Red118) Suminol Milling Brilliant Red 3BN (N) conc.(C.I.Acid Red131) Lanyl Red GG(C.I.Acid Red211) Lanyl Red B(C.I.Acid Red215) Lanasyn Bordeaux M-RLA200(C.I.Acid Red217) Suminol Milling Brilliant Red B conc. N(C.I.Acid Red249) Aminyl Red E-3BL(C.I.Acid Red257) Telon Red M-BL(C.I.Acid Red260) Chugai Aminol Fast Pink R(C.I.Acid Red289) Nylosan Red N-2RBL SGR(C.I.Acid Red336) Telon Red FRL micro(C.I.Acid Red337) Lanasyn Red M-G(C.I.Acid Red399) Kayakalan Red BL Nylosan Red EBL SGR 180 Kayanol Milling Red BW Kayanol Milling Violet FBW(C.I.Acid Violet48) Erionyl Red B-10B-01(C.I.Acid Violet54) Chugai Aminol Fast Violet F6R(C.I.Acid Violet102) Acid Pure Blue VX(C.I.Acid Blue1) Acid Brilliant Blue AF-N(C.I.Acid Blue7) Chugacid Light Blue A(C.I.Acid Blue25) Kayanol Blue N2G(C.I.Acid Blue40) Nylosan Blue E-GL p 250(C.I.Acid Blue72) Chuganol Blue 6B 333%(C.I.Acid Blue83) Chuganol Blue G 333%(C.I.Acid Blue90) Kayanol Navy Blue R(C.I.Acid Blue92)

[0089] Suminol Milling Brilliant Sky Blue SE (N)(C.I.Acid Blue112) Suminol Milling Cyanine 5R (N)(C.I.Acid Blue113) Kayanol Milling Blue GW(C.I.Acid Blue127) Lanyl Brilliant Blue G ex cc(C.I.Acid Blue127:1) Kayanol Blue NR(C.I.Acid Blue129) Kayanol Milling Blue BW(C.I.Acid Blue138) Kayanol Milling Blue 2RW(C.I.Acid Blue140) Lanyl Blue 3G ex conc(C.I.Acid Blue171) Nylosan Blue N-GL 150(C.I.Acid Blue230) Tectilon Blue 6G 200%(C.I.Acid Blue258) Telon Blue AFN(C.I.Acid Blue264) Tectilon Blue 4R-01 200%(C.I.Acid Blue277:1) Nylosan B Blue N-FL SGR180(C.I.Acid Blue278) Nylosan Blue N-5GL SGR 200(C.I.Acid Blue280) Kayalax Navy R(C.I.Acid Blue300) Nylosan Blue N-BLN(C.I.Acid Blue350) Lanacron Blue N-3GL AcidGreen V (CIAcidGreen16) Chuganol Cyanine Green G(CIAcid Green25)

[0090] The content of the visible light absorber (B) in the resin composition layer is adjusted as appropriate according to its type and other factors in order to adjust the transmittance as described above, so the content is not limited. However, from the viewpoint of insulation reliability, film durability, etc., it is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, and even more preferably 0.05 to 2 parts by mass, per 100 parts by mass of the total amount of thermosetting resin (A).

[0091] [Inorganic filler (C)] The resin composition layer preferably further contains an inorganic filler (C) to improve flame resistance, improve thermal conductivity, and reduce the coefficient of thermal expansion. By using an inorganic filler (C), the flame resistance and thermal conductivity of the underfill material can be improved and the coefficient of thermal expansion can be reduced.

[0092] The average particle size of the inorganic filler (C) is not particularly limited, but from the viewpoint of suppressing the decrease in varnish storage stability due to sedimentation when using inorganic fillers with large particle sizes, improving the melt viscosity and transparency of the resin composition layer, and accommodating narrower electrode pitches and narrower gaps between electrodes arranged on the chip, it is preferably 400 nm or less, more preferably 300 nm or less, and particularly preferably 1 to 100 nm. In this embodiment, the "average particle size" of the inorganic filler (C) refers to the median diameter of the inorganic filler (C). Here, the median diameter refers to the particle size at which, when the particle size distribution of the powder is divided into two parts based on a certain particle size, the volume of particles on the larger side and the volume of particles on the smaller side each account for 50% of the total powder volume. The average particle size (median diameter) of the inorganic filler (C) is measured by the wet laser diffraction-scattering method.

[0093] The inorganic filler (C) is not particularly limited, but examples include silica such as natural silica, fused silica, amorphous silica, and hollow silica; aluminum compounds such as boehmite, aluminum hydroxide, alumina, and aluminum nitride; magnesium compounds such as magnesium oxide and magnesium hydroxide; calcium compounds such as calcium carbonate and calcium sulfate; molybdenum compounds such as molybdenum oxide and zinc molybdate; boron nitride; barium sulfate; talc such as natural talc and calcined talc; mica; and glass such as short fibrous glass, spherical glass, and finely powdered glass (e.g., E glass, T glass, D glass). Furthermore, if conductivity or anisotropic conductivity is to be imparted to the resin composition layer, metal particles of gold, silver, nickel, copper, tin alloy, and palladium may be used as the inorganic filler (C).

[0094] Among these, from the viewpoint of improving the flame resistance of the resin composition layer and reducing the coefficient of thermal expansion, the inorganic filler (C) preferably includes at least one selected from the group consisting of silica, aluminum hydroxide, alumina, boehmite, boron nitride, aluminum nitride, magnesium oxide, magnesium hydroxide, and combinations thereof, and more preferably includes at least one selected from the group consisting of silica, alumina, and boron nitride, with silica being even more preferred among them. Examples of silica include SFP-120MC (product name) and SFP-130MC (product name) from Denka Co., Ltd.; and 0.3μmSX-CM1 (product name), 0.3μmSX-EM1 (product name), 0.3μmSV-EM1 (product name), SC1050-MLQ (product name), SC2050-MNU (product name), SC2050-MTX (product name), 2.2μmSC6103-SQ (product name), SE2053-SQ (product name), Y50SZ-AM1 (product name), YA050C-MJE (product name), YA050C-MJM (product name), YA050C-MJF (product name), and YA050C-MJA (product name) from Admatex Co., Ltd.

[0095] These inorganic fillers (C) can be used individually or in appropriate mixtures of two or more types.

[0096] The inorganic filler (C) may be one that has been surface-treated with a silane coupling agent. The silane coupling agent used for surface treatment of the inorganic filler (C) is not particularly limited as long as it is a silane coupling agent that is generally used for surface treatment of inorganic materials. Examples include vinylsilane-based silane coupling agents such as vinyltrimethoxysilane and γ-(meth)acryloxypropyltrimethoxysilane; phenylaminosilane-based silane coupling agents such as N-phenyl-3-aminopropyltrimethoxysilane; phenylsilane-based silane coupling agents such as trimethoxyphenylsilane; and imidazolesilane-based silane coupling agents. These silane coupling agents can be used individually or in appropriate mixtures of two or more.

[0097] In the resin composition layer, the content of inorganic filler (C) is not particularly limited, but from the viewpoint of ensuring insulation reliability and sufficient flux activity during mounting, it is preferably 10 to 500 parts by mass, more preferably 25 to 400 parts by mass, and even more preferably 30 to 300 parts by mass, per 100 parts by mass of the total amount of thermosetting resin (A). The upper limit of the content of inorganic filler (C) may be 250 parts by mass.

[0098] [Flux activator (D)] The resin composition layer preferably further contains a flux activator (D) to exhibit flux activity during flip-chip mounting. The flux activator (D) is not particularly limited as long as it is an organic compound having one or more acidic sites in its molecule. Preferred acidic sites include, for example, phosphate groups, phenolic hydroxyl groups, carboxyl groups, and sulfonic acid groups. In semiconductor devices using the resin composition layer as an underfill material, phenolic hydroxyl groups or carboxyl groups are more preferred from the viewpoint of more effectively preventing migration and corrosion of solder and metals such as copper that constitute the joints. The flux activator (D) can be used alone or by mixing two or more types as appropriate.

[0099] The flux activator (D) is not particularly limited, but from the viewpoint of sufficiently removing the oxide film at the joint, it is preferable that its acid dissociation constant pKa is 3.8 or more and 15.0 or less, and from the viewpoint of balancing the storage stability of the varnish and underfill material with flux activity, it is more preferable that it is 4.0 or more and 14.0 or less.

[0100] In the resin composition layer, the molecular weight of the flux activator (D) is not particularly limited, but from the viewpoint of preventing it from volatilizing before flux activity is expressed during flip-chip mounting, that is, from preventing the flux activator (D) from volatilizing before the oxide film at the joint is removed, the molecular weight is preferably 200 or more, and more preferably 250 or more. From the viewpoint of having mobility as a flux activator and obtaining sufficient flux activity, the molecular weight of the flux activator (D) is preferably 8000 or less, more preferably 1000 or less, and even more preferably 600 or less.

[0101] The flux activator (D) is not particularly limited, but examples include rosin-based resins such as abietic acid, neoabietic acid, dehydroabietic acid, pimaric acid, isopimaric acid, parastric acid, diphenolic acid, dihydroabietic acid, tetrahydroabietic acid, hydrogenated rosin esters, and rosin-modified maleic acid resins; diamine-based resins such as N,N'-bis(salicylidene)-1,2-propanediamine and N,N'-bis(salicylidene)-1,3-propanediamine; and phenolphthalein. These flux activators (D) are preferred because of their excellent solubility in solvents and storage stability of varnishes and underfill materials.

[0102] Among these, from the viewpoint of preventing deactivation by the thermosetting resin (A), the flux activator (D) more preferably contains at least one selected from the group consisting of dehydroabietic acid, diphenolic acid, dihydroabietic acid, tetrahydroabietic acid, hydrogenated rosin ester, rosin-modified maleic acid resin, N,N'-bis(salicylidene)-1,2-propanediamine, and N,N'-bis(salicylidene)-1,3-propanediamine, and is particularly preferably a rosin-based resin. These flux activators are even more preferable from the viewpoint that, because they have relatively low reactivity, they hardly react with the thermosetting resin (A), and sufficient flux activity necessary for removing the oxide film is maintained. Furthermore, from the viewpoint of obtaining even better flux activity, it is even more preferable that the flux activator (D) is a hydrogenated rosin ester.

[0103] The flux activator (D) can be a commercially available product. Examples of rosin resins include the Pine Crystal (registered trademark, same hereinafter) series: KR-85 (product name, same hereinafter), KR-612, KR-614, KE-100, KE-311, PE-590, KE-359, KE-604, KR-120, KR-140, KR-614, D-6011, and KR-50M; Marquis No. 32 (all manufactured by Arakawa Chemical Industries, Ltd.).

[0104] The content of flux activator (D) in the resin composition layer is not particularly limited, but from the viewpoint of ensuring insulation reliability and sufficient flux activity during mounting, it is preferably 3 to 70 parts by mass, more preferably 5 to 50 parts by mass, and even more preferably 8 to 40 parts by mass, per 100 parts by mass of the total amount of thermosetting resin (A).

[0105] [Curing catalyst (E)] The resin composition layer may further contain a curing catalyst (E). The inclusion of the curing catalyst (E) in the resin composition layer allows for more favorable control of the polymerization rate of the thermosetting resin (A), and tends to result in a resin composition with appropriate moldability. The curing catalyst is not particularly limited, as long as it is a compound capable of promoting the polymerization of the thermosetting resin (A). The curing catalyst (E) can be used alone or in a mixture of two or more types.

[0106] The curing catalyst (E) is not particularly limited, but examples include organic peroxides, imidazole compounds, azo compounds, and tertiary amines such as triethylamine and tributylamine. Among these, it is preferable to include at least one selected from the group consisting of organic peroxides, imidazole compounds, and combinations thereof, in order to obtain a good polymerization rate and a good curing rate, and it is more preferable to include both organic peroxides and imidazole compounds.

[0107] The content of the curing catalyst (E) in the resin composition layer is not particularly limited, but from the standpoint of obtaining a good curing rate, it is preferably 0.02 to 10 parts by mass, and more preferably 0.05 to 8 parts by mass, per 100 parts by mass of the total amount of thermosetting resin (A).

[0108] (organic peroxide) The organic peroxide according to this embodiment is not particularly limited as long as it is a compound that releases an active substance (radical) that can polymerize the thermosetting resin (A) upon heat, and known organic peroxides can be used. The organic peroxide can be used alone or in a mixture of two or more types.

[0109] In this embodiment, the 10-hour half-life temperature of the organic peroxide is not particularly limited, but is preferably 100°C or higher, and more preferably 110°C or higher from the viewpoint of manufacturability. It is preferable that the organic peroxide satisfies the above-mentioned range of 10-hour half-life temperature, as this allows for higher temperatures in the solvent removal process during manufacturing.

[0110] Examples of organic peroxides include dicumyl peroxide, di(2-tert-butylperoxyisopropyl)benzene, 1,1,3,3-tetramethylbutylhydroperoxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexine-3, benzoyl peroxide, di-t-butyl peroxide, methyl ethyl ketone peroxide, and ketone peroxides of cyclohexanone peroxide; 1,1-di(t-butylperoxy)cyclohexane, and 2,2-di(4,4-di(t-butylperoxy)cyclohexane Peroxyketal of xyl)propane; hydroperoxides of tert-butyl hydroperoxide, p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; di(2-t-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylcumyl peroxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexine-3, α, Examples include α'-di(t-butylperoxy)diisopropylbenzene and dialkyl peroxides of di-t-butyl peroxide; dibenzoyl peroxide and di(4-methylbenzoyl)peroxide diacyl peroxide; di-n-propyl peroxydicarbonate and peroxydicarbonate of diisopropyl peroxydicarbonate; and peroxyesters of 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-hexylperoxybenzoate, t-butylperoxybenzoate, and t-butylperoxy-2-ethylhexanone. From the standpoint of obtaining better reaction and curing rates, at least one selected from the group consisting of dicumyl peroxide, di(2-tert-butylperoxyisopropyl)benzene, 1,1,3,3-tetramethylbutyl hydroperoxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexyn-3, α,α'-di(t-butylperoxy)diisopropylbenzene, and tert-butyl hydroperoxide is preferred.

[0111] In the resin composition layer, the content of organic peroxide is not particularly limited, but it is preferably 0.02 to 10 parts by mass, and more preferably 0.05 to 8 parts by mass, per 100 parts by mass of the total amount of thermosetting resin (A), in order to obtain an even better polymerization rate and curing rate.

[0112] (Imidazole compounds) The imidazole compound is not particularly limited as long as it can promote the polymerization of the thermosetting resin (A), and any known imidazole compound can be used. The imidazole compound can be used individually or in combination of two or more types.

[0113] Examples of imidazole compounds include 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 2,4,5-triphenylimidazole, tertiary amines such as triethylamine and tributylamine, and their derivatives. Among these, 2-ethyl-4-methylimidazole is preferred because it is easier to adjust the reaction rate and curing rate.

[0114] In the resin composition layer, the content of the imidazole compound is not particularly limited, but it is preferably 0.02 to 10 parts by mass, and more preferably 0.05 to 8 parts by mass, per 100 parts by mass of the total amount of thermosetting resin (A), as this makes it easier to adjust the polymerization rate and curing rate.

[0115] (azo compound) The azo compound is not particularly limited as long as it can promote the polymerization of the thermosetting resin (A), and any known azo compound can be used. The azo compound can be used alone or in a mixture of two or more. Examples of azo compounds include 2,2'-azobisbutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile).

[0116] In the resin composition layer, the content of the azo compound is not particularly limited, but it is preferably 0.02 to 10 parts by mass, and more preferably 0.05 to 8 parts by mass, per 100 parts by mass of the total amount of thermosetting resin (A), as this makes it easier to adjust the polymerization rate and curing rate.

[0117] [Hardening agent (F)] The resin composition layer may further contain a curing agent (F). The curing agent (F) is used for purposes such as improving the curability of the thermosetting resin (A) or adjusting the curing rate of the thermosetting resin (A). As the curing agent (F), any known one can be appropriately selected depending on the type of thermosetting resin (A) used, but examples include phenolic resins, amines, thiols, etc.

[0118] In this embodiment, the content of the curing agent (F) is not particularly limited, but from the standpoint of easily adjusting the curability and curing speed of the thermosetting resin (A), it is preferably 3 to 80 parts by mass, more preferably 5 to 70 parts by mass, and particularly preferably 15 to 50 parts by mass, based on 100 parts by mass of the total of the thermosetting resin (A) and the curing agent (F).

[0119] (Aminotriazine novolac resin) Furthermore, although not particularly limited, an aminotriazine novolac resin can be used as the curing agent (F). For example, when an aminotriazine novolac resin is used as the curing agent (F) for a resin composition mainly composed of a maleimide compound or a citracomimide compound, the aminotriazine novolac resin has a triazine skeleton and can react well with maleimide groups and / or citracomimide groups. Therefore, for example, the rate of the radical polymerization reaction of the thermosetting resin can be suitably controlled and cured using an aminotriazine novolac resin. In addition, since the novolac skeleton is bonded to the triazine skeleton, the aminotriazine novolac resin can contain many hydroxyl groups and amino groups even after curing. Therefore, even after curing, good chemical bonding is formed between these groups and the silanol groups of the chip, which can improve the chip adhesion of the resin composition layer.

[0120] The resin composition layer may include an aminotriazine novolac resin from the viewpoint of improving low void properties and chip adhesion. As the aminotriazine novolac resin, any known resin can be used as long as it is a phenol formaldehyde resin (phenol resin) having a triazine ring in its molecule. Such aminotriazine novolac resins can be prepared by known methods, for example, by modifying a phenol resin with a nitrogen compound such as melamine. The aminotriazine novolac resin can be used alone or by appropriately mixing two or more types.

[0121] In the resin composition layer, the content of aminotriazine novolac resin is preferably 5 to 70 parts by mass, and more preferably 15 to 50 parts by mass, and particularly preferably 20 to 40 parts by mass, based on 100 parts by mass of the total of the aminotriazine novolac resin and the thermosetting resin (A). This is more preferable for obtaining better low void properties and chip adhesion.

[0122] For aminotriazine novolac resins, the weight-average molecular weight is preferably 300 to 9,500, and more preferably 500 to 5,000, in order to obtain even better low void properties and chip adhesion. In this embodiment, the weight-average molecular weight is the value on a standard polystyrene basis determined by the GPC (gel permeation chromatography) method.

[0123] As for the aminotriazine novolac resin, the nitrogen content is preferably 10 to 25% by mass per 100% by mass of the aminotriazine novolac resin, in order to obtain even better low void properties and tip adhesion, and more preferably 15 to 20% by mass, in order to obtain even better low void properties and even better tip adhesion.

[0124] For aminotriazine novolac resins, the hydroxyl group equivalent is preferably 80-200 g / eq., and more preferably 100-180 g / eq., in order to obtain even better low void properties and chip adhesion. In this embodiment, the hydroxyl group equivalent refers to the number of mg of potassium hydroxide required to acetylate the hydroxyl groups contained in 1 g of aminotriazine novolac resin. Specifically, it is measured in accordance with JIS K 0070.

[0125] As an aminotriazine novolac resin, it is preferable to include one or more compounds selected from the group consisting of compounds represented by the following formula (1) and compounds represented by the following formula (2), in order to obtain even better low void properties and tip adhesion.

[0126] [ka]

[0127] In formula (1), R1 independently represents a hydrogen atom, a methyl group, or an ethyl group. It is preferable that R1 independently represents a hydrogen atom or a methyl group in order to obtain even better low void properties and chip adhesion. l, m, and n independently represent integers from 0 to 10. It is preferable that l, m, and n independently represent integers from 1 to 6 in order to obtain even better low void properties and chip adhesion. (l+m+n) represents an integer from 1 to 20. It is preferable that (l+m+n) is an integer from 3 to 18 in order to obtain even better low void properties and chip adhesion. Note that the compound represented by formula (1) may be a mixture containing, for example, compounds with different functional groups or numbers of R1 in formula (1), compounds with different numbers of l, m, and n, and compounds with different numbers of (l+m+n).

[0128] [ka]

[0129] In formula (2), R2 independently represents a hydrogen atom, a methyl group, or an ethyl group. It is preferable that R2 independently represents a hydrogen atom or a methyl group in order to obtain even better low void properties and tip adhesion. o, p, q, r, and s independently represent integers from 0 to 10. It is preferable that o, p, q, r, and s independently represent integers from 1 to 4 in order to obtain even better low void properties and tip adhesion. (o+p+q+r+s) represents an integer from 1 to 20. It is preferable that (o+p+q+r+s) is an integer from 5 to 20 in order to obtain even better low void properties and tip adhesion. Note that the compound represented by formula (2) may be a mixture containing, for example, compounds with different functional groups or numbers of R2 in formula (2), compounds with different numbers of o, p, q, r, and s, and compounds with different numbers of (o+p+q+r+s).

[0130] Furthermore, to obtain even better low void properties and tip adhesion, the aminotriazine novolac resin is more preferably a mixture of the compound represented by formula (1) and the compound represented by formula (2). As such a mixture, to obtain even better low void properties and tip adhesion, the mass ratio of the compound represented by formula (1) to the compound represented by formula (2) (parts by mass of the compound represented by formula (1): parts by mass of the compound represented by formula (2)) is preferably 50:50 to 90:10, and more preferably 60:40 to 85:15.

[0131] As the aminotriazine novolac resin, commercially available products may be used, for example, LA-1356 (product name), LA-3018-50P (product name), LA-7052 (product name), LA-7054 (product name), and LA-7751 (product name) manufactured by DIC Corporation.

[0132] [Other ingredients] The resin composition layer may contain one or more other components in addition to the thermosetting resin (A) and the visible light absorber (B). Other components are not particularly limited, but examples include flexibility-imparting components. The flexibility-imparting component is not particularly limited as long as it is capable of imparting flexibility to the layer containing the resin composition. Examples of such components include thermoplastic polymer compounds other than thermosetting resins (A), visible light absorbers (B), inorganic fillers (C), flux activators (D), curing catalysts (E), and curing agents (F), such as polyimides, polyamide-imides, polystyrene, polyolefins, styrene-butadiene rubber (SBR), isoprene rubber (IR), butadiene rubber (BR), (meth)acrylonitrile butadiene rubber (NBR), polyurethanes, polypropylenes, (meth)acrylic oligomers, (meth)acrylic polymers, and silicone resins. These flexibility-imparting components can be used individually or in appropriate mixtures of two or more.

[0133] Furthermore, the resin composition layer may also contain a silane coupling agent as another component, for the purpose of further improving the adhesion of the interface between the resin component and the inorganic filler (C), and the moisture absorption and heat resistance. Examples of silane coupling agents include vinylsilane-based silane coupling agents such as vinyltrimethoxysilane and γ-(meth)acryloxypropyltrimethoxysilane; phenylaminosilane-based silane coupling agents such as N-phenyl-3-aminopropyltrimethoxysilane; phenylsilane-based silane coupling agents such as trimethoxyphenylsilane; and imidazolesilane-based silane coupling agents. These silane coupling agents can be used individually or in appropriate mixtures of two or more. When using a silane coupling agent, its content is not particularly limited, but from the viewpoint of further improving moisture absorption and heat resistance and further reducing the amount of volatilization during flip-chip mounting, it is preferably 0.02 to 20 parts by mass per 100 parts by mass of the total amount of thermosetting resin (A).

[0134] Furthermore, the resin composition layer may also contain a wetting and dispersing agent as another component, for purposes such as further improving the manufacturability of the film-like underfill material and further improving the dispersibility of the filler. The wetting and dispersing agent is not particularly limited as long as it is a wetting and dispersing agent that is generally used in paints and the like. Examples include DISPERBYK®-110 (trade name), DISPERBYK-111 (trade name), DISPERBYK-180 (trade name), DISPERBYK-161 (trade name), BYK-W996 (trade name), DISPERBYK-W9010 (trade name), and DISPERBYK-W903 (trade name), all manufactured by BYChemie Japan Co., Ltd. These wetting and dispersing agents can be used individually or by mixing two or more as appropriate. When using a wetting and dispersing agent, its content is not particularly limited, but from the viewpoint of further improving the manufacturability of the film-like underfill material, it is preferable to use 0.1 to 5 parts by mass, and more preferably 0.5 to 3 parts by mass, per 100 parts by mass of inorganic filler (C). When using two or more wetting and dispersing agents in combination, it is preferable that their total amount satisfies the above ratio.

[0135] As for other components, the resin composition layer may contain various additives for various purposes, to the extent that the desired properties are not impaired. Examples of additives include thickeners, lubricants, defoamers, leveling agents, glossing agents, flame retardants, and ion trapping agents. These additives can be used individually or in appropriate mixtures of two or more. In the resin composition layer, the content of other additives is not particularly limited, but is usually 0.01 to 10 parts by mass per 100 parts by mass of the total amount of thermosetting resin (A).

[0136] [Method for preparing a resin composition for film-like underfill material] As described above, the resin composition for the film-like underfill material of this embodiment includes a thermosetting resin (A), a visible light absorber (B), etc., and the preparation method is not particularly limited as long as a composition having the above-described composition can be obtained. The resin composition can be prepared, for example, by appropriately mixing the thermosetting resin (A) and the visible light absorber (B), and optionally an inorganic filler (C), a flux activator (D), a curing catalyst (E), a curing agent (F), and other components. If necessary, these components may be in the form of a varnish in which they are dissolved or dispersed in an organic solvent. The varnish can be suitably used when producing the film-like underfill material. For specific methods of producing the film-like underfill material, refer to the laminate manufacturing method described above and the examples described later. While the resin composition for film-like underfill material of this embodiment can be suitably used to produce the resin composition layer of the film-like underfill material of this embodiment, this embodiment is not limited thereto and can also be applied to film-like underfill materials other than the film-like underfill material of this embodiment.

[0137] The organic solvent is not particularly limited as long as it can suitably dissolve or disperse each of the above-mentioned components and does not impair the effects of the present invention. Examples of organic solvents include alcohols such as methanol, ethanol, and propanol; ketones such as acetone, methyl ethyl ketone (hereinafter sometimes abbreviated as "MEK"), and methyl isobutyl ketone; amides such as dimethylacetamide and dimethylformamide; and aromatic hydrocarbons such as toluene and xylene. These organic solvents can be used individually or in appropriate mixtures of two or more.

[0138] [Semiconductor chip with resin composition layer, and substrate for mounting semiconductor chip with resin composition layer] The film-like underfill material of this embodiment can be suitably used as an underfill material for semiconductor chips and substrates for mounting semiconductor chips.

[0139] For example, a semiconductor chip with a resin composition layer comprises a semiconductor chip and a layer containing a resin composition layer laminated on the semiconductor chip. Furthermore, a substrate for mounting a semiconductor chip with a resin composition layer comprises a substrate for mounting a semiconductor chip and a layer containing a resin composition layer laminated on the substrate for mounting a semiconductor chip.

[0140] In the method for manufacturing a semiconductor chip with a resin composition layer according to this embodiment, a semiconductor chip with a resin composition layer can be manufactured using the film-like underfill material of this embodiment described above. The method for manufacturing a semiconductor chip with a resin composition layer is not particularly limited, but for example, the resin composition layer of the film-like underfill material of this embodiment can be bonded to the electrode-formed surface of a semiconductor wafer, i.e., the surface where bonding with the substrate takes place, then the base film of the film-like underfill material is peeled off, and then individual pieces can be obtained using a dicing saw or the like to obtain a semiconductor chip with a resin composition layer. Furthermore, in the method for manufacturing a substrate for mounting a semiconductor chip with a resin composition layer according to this embodiment, a substrate for mounting a semiconductor chip with a resin composition layer can be manufactured using the film-like underfill material of this embodiment. The method for manufacturing a substrate for mounting a semiconductor chip with a resin composition layer is not particularly limited, but for example, it can be obtained by bonding the resin composition layer of the film-like underfill material of this embodiment to the chip-mounting side surface of a semiconductor chip mounting substrate, and then the base film of the film-like underfill material is peeled off.

[0141] The method for laminating the film-like underfill material of this embodiment to a semiconductor wafer or a substrate for mounting semiconductor chips is not particularly limited, but a vacuum pressure laminator can be suitably used. In this case, a method of laminating by applying pressure to the film-like underfill material of this embodiment via an elastic material such as rubber is preferred. The lamination conditions are not particularly limited as long as they are conditions commonly used in the industry, but for example, a temperature of 50 to 140°C and a pressure of 1 to 11 kgf / cm² are suitable. 2 The process is carried out under a contact pressure within a specified range and under a reduced atmospheric pressure of 20 hPa or less. After the lamination process, the bonded film-like underfill material may be smoothed by heat pressing with a metal plate. The lamination and smoothing processes can be carried out continuously using a commercially available vacuum pressure laminator. In all cases, the film-like underfill material bonded to a semiconductor wafer or substrate for mounting semiconductor chips is removed from the base film before flip-chip mounting of the chip.

[0142] [Semiconductor device] A semiconductor device can be configured using the semiconductor chip with the resin composition layer and / or the substrate for mounting the semiconductor chip with the resin composition layer. In other words, in the method for manufacturing a semiconductor device of the present embodiment, a semiconductor device can be manufactured using the film-like underfill material of the present embodiment. Specifically, the semiconductor device includes a semiconductor chip with a resin composition layer and / or a substrate for mounting a semiconductor chip with a resin composition layer. The method for manufacturing the semiconductor device is not particularly limited, and examples thereof include a method of mounting a semiconductor chip with a resin composition layer on a substrate for mounting a semiconductor chip. Further, a semiconductor chip may be mounted on a substrate for mounting a semiconductor chip with a resin composition layer. In the method of mounting a semiconductor chip with a resin composition layer on a substrate for mounting a semiconductor chip and the method of mounting a semiconductor chip on a substrate for mounting a semiconductor chip with a resin composition layer, a flip chip bonder compatible with a thermocompression bonding method can be preferably used. In the present embodiment, the case of flip chip mounting a semiconductor chip on a substrate for mounting a semiconductor chip is described for convenience, but the object to which the resin composition layer is applied while flip chip mounting the semiconductor chip may be other than the substrate for mounting a semiconductor chip. For example, the resin composition layer can also be used for the joint between the semiconductor wafer and the semiconductor chip when mounting the semiconductor chip on the semiconductor wafer, or for the joint between each semiconductor chip of a chip laminate that performs semiconductor chip interconnection via TSV (Through Silicon Via) or the like. In any case, the effects of the present embodiment can be obtained.

Example

[0143] Hereinafter, the present embodiment will be described more specifically using examples and comparative examples. The present embodiment is not limited by the following examples in any way.

[0144] [Example 1] (Preparation of resin composition (varnish)) As the thermosetting resin (A), 70 parts by mass of a bismaleimide compound (long-chain maleimide; MIZ-001 (trade name), Nippon Kayaku Co., Ltd., including the maleimide compound represented by the formula (9), where a in the formula (9) is a mixture of integers from 1 to 6), 10 parts by mass of bis-(3-ethyl-5-methyl-4-maleimidophenyl)methane (phenylene-type maleimide; BMI-70 (trade name), Kay-I Chemical Co., Ltd.); As the visible light absorber (B), 0.1 part by mass of a black dye (Kayaset Black A-N (trade name, Nippon Kayaku Co., Ltd.)); As the inorganic filler (C), 180 parts by mass (90 parts by mass in terms of non-volatile content) of slurry silica (YA050C-MJM (trade name), Admatechs Co., Ltd., phenylaminosilane-treated silica, solid content: 50% by mass, dispersion medium: MEK, average particle diameter: 50 nm); As the flux activator (D), 25 parts by mass of a hydrogenated rosin ester (Pink Crystal (registered trademark); KR-140 (trade name), Arakawa Chemical Industries, Ltd.); As the curing catalyst (E), 0.05 part by mass of α,α'-di(t-butylperoxy)diisopropylbenzene (Perbutyl (registered trademark) P, NOF Corporation, 10-hour half-life temperature: 119.20°C), which is an organic peroxide, and 1 part by mass of 2-ethyl-4-methylimidazole (2E4MZ, Shikoku Chemicals Corporation), which is an imidazole compound; As the curing agent (F), 33.3 parts by mass (20 parts by mass in terms of non-volatile content) of an aminotriazine novolak resin (Phenolite (registered trademark); LA-1356 (trade name, DIC Corporation)); These were mixed and stirred in a 60°C water bath using a high-speed stirrer for 40 minutes, and MEK was separately added to obtain a varnish (resin composition) with a solid content concentration of 60% by mass. Note that LA-1356 (trade name, DIC Corporation), which is an aminotriazine novolak resin, is a compound represented by the above formula (1) (a mixture of compounds represented by the formula (1), and in this mixture, R 1However, each is independently a hydrogen atom or a methyl group, and l, m, and n are each independently integers from 1 to 6, and (l+m+n) is an integer from 3 to 18.) and a compound represented by formula (2) (a mixture of compounds represented by formula (2), in which R 2 The mixture includes a group of compounds in which each is independently a hydrogen atom or a methyl group, and o, p, q, r, and s are independently integers from 1 to 4, and (o+p+q+r+s) is an integer from 5 to 20. In the mixture, the mass ratio (formula (1):formula (2)) of the compound (mixture) represented by formula (1) to the compound (mixture) represented by formula (2) was 65 (parts by mass):35 (parts by mass).

[0145] (Preparation of film-like underfill material) The obtained varnish (resin composition) was applied to a 38 μm thick polyethylene terephthalate film (base film; release agent thickness 0.1 μm, TR1-38 (product name, Unitika Ltd.)) with a mold release agent coated on its surface. The film was then heated and dried at 100°C for 5 minutes under 1 atmosphere to obtain a film-like underfill material in which a resin composition layer with a thickness of 16.5 μm was formed on the base film. The thickness of the resin composition layer was calculated by measuring the thickness of the film-like underfill material using a micrometer (MDH-25M, manufactured by Mitutoyo Corporation) and subtracting the thickness of the base film from the thickness of the film-like underfill material.

[0146] [Example 2] In the "Preparation of Film-like Underfill Material," a film-like underfill material was obtained in the same manner as in Example 1, except that the thickness of the resin composition layer was set to 43 μm.

[0147] [Example 3] In the "Preparation of Resin Composition (Varnish)," the amount of black dye used was changed to 0.3 parts by mass, and in the "Preparation of Film-like Underfill Material," the thickness of the resin composition layer was set to 16.0 μm. A film-like underfill material was obtained in the same manner as in Example 1, except that the amount of black dye used was changed to 0.3 parts by mass, and the thickness of the resin composition layer was set to 16.0 μm in the "Preparation of Film-like Underfill Material."

[0148] [Example 4] In the "Preparation of Film-like Underfill Material," a film-like underfill material was obtained in the same manner as in Example 3, except that the thickness of the resin composition layer was set to 35 μm.

[0149] [Example 5] In the "Preparation of Resin Composition (Varnish)," the amount of black dye used was changed to 0.5 parts by mass, and in the preparation of the film-like underfill material, the thickness of the resin composition layer was set to 17.0 μm. A film-like underfill material was obtained in the same manner as in Example 1.

[0150] [Example 6] In the "Preparation of Film-like Underfill Material," a film-like underfill material was obtained in the same manner as in Example 5, except that the thickness of the resin composition layer was set to 30 μm.

[0151] [Example 7] In the "Preparation of Resin Composition (Varnish)," the amount of black dye used was changed to 0.7 parts by mass, and in the "Preparation of Film-like Underfill Material," the thickness of the resin composition layer was set to 17.0 μm. A film-like underfill material was obtained in the same manner as in Example 1, except that the preparation was changed to 0.7 parts by mass of black dye, and the thickness of the resin composition layer was set to 17.0 μm.

[0152] [Example 8] "Fabrication of film-like underfill material" " In the same manner as in Example 7, a film-like underfill material was obtained, except that the thickness of the resin composition layer was set to 33 μm.

[0153] [Example 9] A film-like underfill material was obtained in the same manner as in Example 1, except that the amount of black dye used in "Preparation of Resin Composition (Varnish)" was changed to 1.0 part by mass, and the thickness of the resin composition layer in "Preparation of Film-like Underfill Material" was set to 17.0 μm.

[0154] [Example 10] In the "Preparation of Film-like Underfill Material," a film-like underfill material was obtained in the same manner as in Example 9, except that the thickness of the resin composition layer was set to 33 μm.

[0155] [Example 11] In the "Preparation of Resin Composition (Varnish)", the amount of the black dye used was changed to 2.0 parts by mass, and in the preparation of the film-like underfill material, a film-like underfill material was obtained in the same manner as in Example 1 except that the thickness of the resin composition layer was 18.0 μm.

[0156] [Comparative Example 1] In the "Preparation of Film-Like Underfill Material", a film-like underfill material was obtained in the same manner as in Example 11 except that the thickness of the resin composition layer was 41 μm.

[0157] [Comparative Example 2] In the "Preparation of Resin Composition (Varnish)", no black dye was used, and in the "Preparation of Film-Like Underfill Material", a film-like underfill material was obtained in the same manner as in Example 1 except that the thickness of the resin composition layer was 13.0 μm.

[0158] [Comparative Example 3] In the "Preparation of Resin Composition (Varnish)", no black dye was used, and as the inorganic filler (C), instead of the slurry silica (YA050C-MJM), 128.6 parts by mass (90 parts by mass in terms of non-volatile content) of slurry silica (methacrylic surface-treated silica; 5SM-CM2 (trade name), manufactured by Admatechs Co., Ltd., solid content 70% by mass, dispersion medium: MEK, average particle diameter: 500 nm) was used. In the "Preparation of Film-Like Underfill Material", a film-like underfill material was obtained in the same manner as in Example 1 except that the thickness of the resin composition layer was 38 μm.

[0159] [Comparative Example 4] In the "Preparation of Resin Composition (Varnish)," black dye was not used, the amount of slurry silica (YA050C-MJM) used as inorganic filler (C) was changed to 90 parts by mass (45 parts by mass in terms of non-volatile content), and 64.3 parts by mass (45 parts by mass in terms of non-volatile content) of slurry silica (methacrylic surface-treated silica; 5SM-CM2) was added. In the "Preparation of Film-like Underfill Material," a film-like underfill material was obtained in the same manner as in Example 1, except that the thickness of the resin composition layer was set to 35 μm.

[0160] "evaluation" (1) Transmittance (Measurement of light transmittance at 600 nm) Sample A was prepared by cutting the film-like underfill material obtained in each example and comparative example into a 5cm wide x 5cm long strip. The light transmittance of Sample A at 600nm was measured at room temperature using a spectrophotometer (SD6000 (product name), manufactured by JASCO Corporation), and the "light transmittance of the film-like underfill material at a wavelength of 600nm" T 0 That's what I decided. Similarly, sample B was prepared by cutting the base film used in each example and comparative example into a 5cm wide x 5cm long piece. The light transmittance of sample B at 600nm was measured at room temperature using a spectrophotometer (SD6000 (product name), manufactured by JASCO Corporation), and the "light transmittance of the base film at a wavelength of 600nm" T 1 That's what I decided.

[0161] (Light transmittance of underfill material and light transmittance of base film) to difference) In each example and comparative example, the light transmittance of the substrate film at a wavelength of 600 nm [T 1 ] and the light transmittance of the underfill material at a wavelength of 600 nm [T 0 The difference between ] and |T 1 -T 0 The | value was calculated. Note that in the table, values ​​less than 0 are displayed with a minus sign, but these values ​​were judged based on their absolute value.

[0162] (Alignment mark recognition) The film-like underfill material obtained in each example and comparative example was attached to a semiconductor chip mounting substrate (WALTS-KIT CC80(W)-0105JY (product name)) manufactured by Walts Co., Ltd. The base film was peeled off from the resin composition layer, and the alignment marks on the substrate were observed from the resin composition layer side using a camera mounted on a flip-chip bonder (LFB-2301 (product name), Shinkawa Co., Ltd.). The recognizability of the alignment marks was evaluated according to the following criteria. <standard> A: Alignment marks were recognized. C: The alignment mark could not be recognized.

[0163] (NCF Visibility) The film-like underfill material obtained in each example and comparative example was visually observed to confirm which side of the film-like underfill material was the resin composition layer (NCF), and the visibility of the NCF was evaluated according to the following criteria. <standard> A: The resin composition layer (NCF) surface could be easily identified (in less than 3 seconds). B: Recognition of the resin composition layer (NCF) surface took more than 3 seconds. C: Recognition of the resin composition layer (NCF) surface was difficult.

[0164] (2) Storage stability of varnish The varnishes (resin compositions) obtained in each example and comparative example were left in a sealed container at 25°C for one week, and the presence or absence of sediment at the bottom of the container was visually checked. If sediment was found, only the sediment was separated and its mass was measured, and the sedimentation rate of the inorganic filler after one week was calculated using the following formula, and the storage stability of the varnish was evaluated according to the following criteria. Inorganic filler settling rate = Mass of settled material / Amount of non-volatile inorganic filler × 100 <standard> A: No sediment was observed upon visual inspection. B: Sediment was visually confirmed, but the sedimentation rate of the inorganic filler was less than 5%. C: The settling rate of the inorganic filler was 5% or higher.

[0165] [Table 1] [Industrial applicability]

[0166] The film-like underfill material of this embodiment is easy to handle and can be easily and accurately placed on objects such as wafers, making it suitable for use as a material for semiconductor chips with a resin composition layer, substrates for mounting semiconductor chips with a resin composition layer, semiconductor devices, and methods for manufacturing these.

[0167] The disclosures of Japanese Patent Application No. 2021-169233, filed on 15 October 2021, and Japanese Patent Application No. 2022-26833, filed on 24 February 2022, are incorporated herein by reference in their entirety. Furthermore, all documents, patent applications, and technical standards described in this specification are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted to be incorporated by reference.

Claims

1. A resin composition layer comprising a thermosetting resin (A) and a visible light absorber (B), A film-like underfill material comprising a base film, The light transmittance of the aforementioned film-like underfill material at a wavelength of 600 nm is 20 to 90%, and A film-like underfill material wherein the difference between the light transmittance of the base film at a wavelength of 600 nm and the light transmittance of the film-like underfill material at a wavelength of 600 nm is 2 to 80%.

2. The film-like underfill material according to claim 1, wherein the thickness of the resin composition layer is in the range of 5 to 500 μm.

3. The film-like underfill material according to claim 1, wherein the visible light absorber (B) is at least one selected from the group consisting of organic dyes, organic pigments, and combinations thereof.

4. The film-like underfill material according to claim 1, wherein the visible light absorber (B) comprises at least one compound selected from the group consisting of quinone-based, aminoketone-based, cationic-based, cyanine-based, phthalocyanine-based, quinacridone-based, diaryl / triarylmethane-based, flugide-based, azo-based, squarylium-based, oxonol-based, benzylidene-based, nitro-based, nitroso-based, thiazole-based, indigoid-based, and combinations thereof.

5. The film-like underfill material according to claim 1, wherein the visible light absorber (B) comprises at least one compound selected from the group consisting of quinone-based, aminoketone-based, and combinations thereof.

6. The film-like underfill material according to claim 1, wherein the thermosetting resin (A) comprises at least one selected from the group consisting of maleimide compounds, citraconimide compounds, and combinations thereof.

7. The film-like underfill material according to claim 6, wherein the maleimide compound comprises at least one selected from the group consisting of 2,2'-bis{4-(4-maleimidephenoxy)phenyl}propane, 1,2-bis(maleimide)ethane, 1,4-bis(maleimide)butane, 1,6-bis(maleimide)hexane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-phenylmaleimide, a maleimide compound represented by the following formula (3), a bismaleimide compound containing a structural unit represented by the following formula (4) and maleimide groups at both ends, a maleimide compound represented by the following formula (5), a maleimide compound represented by the following formula (6), a maleimide compound represented by the following formula (7), and combinations thereof. 【Chemistry 1】 (In formula (3), n 3 (This represents an integer between 1 and 30.) 【Chemistry 2】 (In formula (4), R 11 R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 12 R represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. 13 Each of these independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. 5 (This represents an integer between 1 and 10.) 【Transformation 3】 (In formula (5), R 8 Each of these independently represents a hydrogen atom, a methyl group, or an ethyl group. 9 Each of these independently represents either a hydrogen atom or a methyl group. 【Chemistry 4】 (In formula (6), R 10 each independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group. n 4 represents an integer of 1 to 10.) 【Transformation 5】 (In formula (7), R 10 Each of these independently represents either a hydrogen atom or a methyl group, n 2 (This represents an integer greater than or equal to 1.)

8. The film-like underfill material according to claim 7, wherein the maleimide compound comprises at least one selected from the group consisting of 2,2'-bis{4-(4-maleimidephenoxy)phenyl}propane, a maleimide compound represented by formula (3), a bismaleimide compound containing a structural unit represented by formula (4) and maleimide groups at both ends, a maleimide compound represented by formula (5), a maleimide compound represented by formula (6), a maleimide compound represented by formula (7), and combinations thereof.

9. The film-like underfill material according to claim 1, further comprising an inorganic filler (C).

10. The film-like underfill material according to claim 9, wherein the average particle size of the inorganic filler (C) is 400 nm or less.

11. The film-like underfill material according to claim 9, wherein the inorganic filler (C) comprises at least one selected from the group consisting of silica, aluminum hydroxide, alumina, boehmite, boron nitride, aluminum nitride, magnesium oxide, magnesium hydroxide, and combinations thereof.

12. The film-like underfill material according to claim 9, wherein the content of the inorganic filler (C) is 10 to 500 parts by mass per 100 parts by mass of the total amount of the thermosetting resin (A).

13. The average particle size of the inorganic filler (C) is 400 nm or less. The inorganic filler (C) comprises at least one selected from the group consisting of silica, aluminum hydroxide, alumina, boehmite, boron nitride, aluminum nitride, magnesium oxide, magnesium hydroxide, and combinations thereof. The film-like underfill material according to claim 9, wherein the content of the inorganic filler (C) is 10 to 500 parts by mass per 100 parts by mass of the total amount of the thermosetting resin (A).

14. The film-like underfill material according to claim 1, further comprising a flux activator (D).

15. The film-like underfill material according to claim 14, wherein the flux activator (D) includes a rosin-based resin.

16. The film-like underfill material according to claim 1, further comprising a curing catalyst (E).

17. The curing catalyst (E) is an organic peroxide, an imidazole compound, and a combination thereof. The film-like underfill material according to claim 16, comprising at least one selected from the group.

18. The film-like underfill material according to claim 1, further comprising a hardening agent (F).

19. The film-like underfill material according to claim 18, wherein the curing agent (F) comprises an aminotriazine novolac resin.

20. A method for manufacturing a semiconductor chip with a resin composition layer, using a film-like underfill material according to any one of claims 1 to 19.

21. A method for manufacturing a semiconductor chip mounting substrate with a resin composition layer, using a film-like underfill material according to any one of claims 1 to 19.

22. A method for manufacturing a semiconductor device, using a film-like underfill material according to any one of claims 1 to 19.

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