Method for manufacturing electroformed molds and electroformed molds

Abstract

To provide a manufacturing method of an electroforming mold which can highly accurately manufacture an electroforming mold having the shape of a photomask correctly reproduced.SOLUTION: A manufacturing method of an electroforming mold comprises the steps of: forming a first resist 20; exposing the first resist 20 using a first photomask 30 to form a first exposed region 21 and a first unexposed region 22; forming a second resist 120 on the first resist 20; exposing the second resist 120 using a second photomask 130 to form a second exposed region 121 and a second unexposed region 122; removing the first unexposed region 22 and the second unexposed region 122 formed in the second exposure step; and arranging eaves 40, which are a transmission prevention layer having a function of preventing transmission of light, in the range overlapping with a region to be exposed next in an upper surface of at least one of the first unexposed region 22 and the second unexposed region 122. The step of forming the second resist 120 and the step of exposing the second resist 120 are repeated.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an electroforming mold and an electroforming mold.

Background Art

[0002] For example, structures with minute shapes such as parts of a watch are manufactured by electroforming (a method for manufacturing, repairing, or replicating metal products by electroplating; hereinafter referred to as electroforming). In such a background, in recent years, an application of the LIGA (Lithographie, Galvanoformung, Abformung) method has been spreading, in which a resist is formed on a substrate, and a pattern of a soluble part and an insoluble part is formed in the resist to manufacture an electroforming mold and manufacture a fine and highly accurate electroformed product.

[0003] Further, by exposing the lower resist and the upper resist with a photomask having mutually different patterns, an electroforming mold having cured parts with different shapes in the upper and lower parts is formed. By using such an electroforming mold, an electroformed product with a complicated shape can be manufactured (see, for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, if the upper resist is exposed using a different pattern than the lower resist after the lower resist has been exposed, ultraviolet light may be irradiated through the upper resist to the unexposed areas of the lower resist, potentially causing parts that should remain uncured to harden. Therefore, after the exposure of the lower photoresist is complete, it is necessary to prevent the uncured areas of the lower resist from hardening due to light passing through the upper resist.

[0006] For example, according to the technology described in Patent Document 1, a portion of the lower photosensitive resin of the two resin layers is dissolved first to form an open hole (recess). Furthermore, a film-like photosensitive resin is placed to cover this open hole, thereby protecting it. However, if the opening area of ​​the open hole is large, the photosensitive resin covering the open hole may bend under its own weight, potentially causing shape defects in the mold of the upper photosensitive resin.

[0007] Alternatively, one could consider filling the lower layer where the first hole is formed with metal to form the first electroformed portion, then forming a second hole in the upper resin, and filling this second hole with metal to form the second electroformed portion. However, with this method, the first and second electroformed portions are not formed as a continuous, integrated unit, resulting in insufficient strength at the boundary between the first and second electroformed portions. Furthermore, while removing the filled metal before electroforming would compensate for the strength deficiency, it would require a significant amount of time and would not be productive.

[0008] The present invention has been made in view of the above circumstances, and aims to provide a method for manufacturing an electroformed mold and an electroformed mold that can manufacture an electroformed mold with high precision in which the shape of the photomask is accurately reproduced. [Means for solving the problem]

[0009] The first aspect of the present invention is a method for manufacturing an electroformed mold used to manufacture an electroformed product in which a first electroformed portion close to a conductive substrate and a second electroformed portion having one or more electroformed layers far from the conductive substrate are integrally formed in a laminated state, comprising: a first resist forming step of forming a first resist corresponding to the first electroformed portion on the conductive substrate; a first exposure step of exposing the first resist using a first photomask to form a first exposed region and a first unexposed region; a second resist forming step of forming a second resist corresponding to the second electroformed portion on the first resist; and the second The method for manufacturing an electroformed mold comprises a second exposure step of exposing a resist using a second photomask to form a second exposed region and a second unexposed region, and a removal step of removing the first unexposed region and the second unexposed region, wherein between the first exposure step and the removal step, an overhang placement step is further provided in which an overhang, which is a light transmission prevention layer having the function of preventing light transmission, is placed on the upper surface of at least one of the first unexposed region or the second unexposed region in a range that overlaps with the region to be exposed next, and the second resist formation step and the second exposure step are repeated at least once.

[0010] The second aspect of the present invention is an electroforming mold used for manufacturing an electroformed product in which a first electroformed portion near a conductive substrate and a second electroformed portion having one or more electroformed layers far from the conductive substrate are laminated together, comprising: a conductive substrate; a first cured portion of a first resist corresponding to the first electroformed portion that has been cured by ultraviolet light; a second cured portion of a second resist corresponding to the second electroformed portion that has been cured by ultraviolet light and has at least one protruding portion that protrudes from the first cured portion in a width direction perpendicular to the lamination direction; and a canopy portion which is a light transmission prevention layer disposed between the first cured portion and the second cured portion, or between the second cured portions themselves, and which has the function of preventing light transmission, wherein the canopy portion is disposed in at least one of the following locations: below the portion where the first cured portion and the second cured portion overlap in the lamination direction and below the protruding portion, or below the portion where the second cured portions themselves overlap and below the protruding portion, and the second cured portion has one or more layers in the lamination direction. [Effects of the Invention]

[0011] According to the present invention, electroformed molds that accurately reproduce the shape of a photomask can be manufactured with high precision. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic cross-sectional view (part 1) illustrating the flow of the manufacturing method for the electroformed mold of the embodiment. [Figure 2] This is a schematic cross-sectional view (part 2) illustrating the flow of the manufacturing method for the electroformed mold of the embodiment. [Figure 3] This is a schematic cross-sectional view (part 3) illustrating the flow of the manufacturing method for the electroformed mold of the embodiment. [Figure 4] This is a schematic cross-sectional view (part 4) illustrating the flow of the manufacturing method for the electroformed mold of the embodiment. [Figure 5] This is a schematic cross-sectional view (part 5) illustrating the flow of the manufacturing method for the electroformed mold of the embodiment. [Figure 6] This is a partially enlarged cross-sectional view of the area around the eaves. [Figure 7] This is a schematic cross-sectional view (part 6) illustrating the flow of the manufacturing method for the electroformed mold of the embodiment. [Figure 8] This is a schematic cross-sectional view (No. 7) illustrating the flow of the manufacturing method for the electroformed mold of the embodiment. [Figure 9] This is a side view of an electroformed product formed using the electroforming mold of the embodiment. [Modes for carrying out the invention]

[0013] The method for manufacturing an electroformed mold and embodiments of the electroformed mold according to the present invention will be described below with reference to the drawings.

[0014] Figs. 1 to 8 are cross-sectional views schematically showing the process flow of a method for manufacturing an electroforming mold 200 according to an embodiment of the present invention, and Fig. 9 is a side view of an electroformed product E formed using the electroforming mold 200. The method for manufacturing the electroforming mold 200 is a method for manufacturing an electroformed product E integrally formed in a state where a first electroforming portion E1 close to a conductive substrate 10 (hereinafter simply referred to as the substrate 10) and a second electroforming portion E2 far from the substrate 10 are laminated.

[0015] <First Coating Step (First Resist Formation Step)> First, as shown in Fig. 1, a first resist 20 of the first layer serving as a first mold layer is applied onto the conductive substrate 10. Then, it is heated to remove the solvent in the first resist 20. The first mold layer is a portion corresponding to the first electroforming portion E1.

[0016] The substrate 10 may be formed of a conductive metal, or may be a substrate body such as silicon which is a semiconductor or a substrate body such as a non-conductive resin and exhibits conductivity by forming a conductive film thereon respectively. The conductive substrate 10 may be formed by laminating multiple types of metals. The first resist 20 is formed of, for example, a chemically amplified epoxy-based negative photoresist, but is not limited to the negative type, and may be, for example, a polymethyl methacrylate-based positive photoresist or the like.

[0017] <First Exposure Step> Next, as shown in Fig. 2, the first resist 20 is irradiated (exposed) with UV light (ultraviolet light) L as shown by the arrow in the figure through a first photomask 30 in which an opening 31 and a shielding portion 32 are formed. In the first resist 20, a region (first exposure region) 21 irradiated with UV light L through the opening 31 and a region (first unexposed region) 22 not irradiated with UV light L due to the shielding portion 32 are formed.

[0018] Furthermore, if multiple openings 31 are formed in the first photomask 30, multiple first exposure regions 21 are formed below the openings 31. The first unexposed regions 22 become voids through a subsequent development process, forming a mold (first mold) that forms the first electroformed portion E1 close to the substrate 10.

[0019] <Eaves arrangement process> Next, as shown in Figure 3, the eaves portion 40 is placed on the upper surface 22a of the first unexposed region 22. Specifically, the eaves portion 40 only needs to be placed in the area of ​​the upper surface 22a of the first unexposed region 22 that overlaps with the second exposed region 121, which will be described later. However, in order to prevent ultraviolet rays that have passed through the second exposed region 121 from passing near the eaves portion 40 and proceeding to the first unexposed region 22, it is preferable to extend the eaves portion 40 to the first exposed region 21 adjacent to the first unexposed region 22. Therefore, the eaves portion 40 is placed across the first exposed region 21 and the first unexposed region 22 such that one end 40a of the eaves portion 40 is located on the upper surface 21a of the first exposed region 21 and the other end 40b of the eaves portion 40 is located on the upper surface 22a of the first unexposed region 22 adjacent to the first exposed region 21.

[0020] The eaves portion 40 is positioned for the following reasons. For example, when a first unexposed region 22 is formed on the substrate 10, if the upper resist is irradiated with ultraviolet light to form a region (the second exposed region 121, described later) on the first exposed region 21 located between the first unexposed regions 22, which has a portion that protrudes from the first exposed region 21 in the width direction, i.e., the horizontal direction (the direction perpendicular to the direction of ultraviolet irradiation), there is a possibility that the ultraviolet light that passes through the second exposed region 121 will reach the lower layer (the first resist layer). As a result, a part of the lower first unexposed region 22 may be unintentionally photosensitive (hardened), and an electroformed mold 200 that does not accurately reflect the shape of the first photomask 30 will be formed. Therefore, in order to avoid such problems, the eaves portion 40, which has the function of preventing the transmission of ultraviolet light, is positioned at a location where the lower first unexposed region 22 and the upper region where the second electroformed portion E2 is to be formed overlap in the vertical direction (layering direction).

[0021] The eaves portion 40, which prevents the transmission of ultraviolet rays, is preferably formed of a metal such as copper (Cu) by sputtering, for example. Furthermore, since the eaves portion 40 is the part that is melted when the electroformed product is later separated from the electroforming mold, it is preferable that it be formed of a metal material different from the metal material that constitutes the electroformed product. The eaves portion 40 may be formed of any material as long as these conditions are met.

[0022] The eaves portion 40 is arranged in a planar manner, extending over the upper surface 22a of the first unexposed region 22 and the upper surface 21a of the adjacent first exposed region 21. The eaves portion 40 may be a flat plate-shaped member or a film-shaped member. The eaves portion 40 needs to be kept from peeling off the upper surfaces 21a and 22a until the next resist 120 is exposed. Adhesion may be reinforced with a primer or the like as needed. The thickness of the eaves portion 40 is preferably about 500 to 1000 Å (angstroms), but is not particularly limited to this range. By arranging such an eaves portion 40 above the first unexposed region 22, the first unexposed region 22 located on the eaves portion 40 can be maintained in an unexposed (uncured) state even when ultraviolet light is irradiated from above the eaves portion 40.

[0023] Incidentally, the eaves portion 40 positioned on the side of the first unexposed region 22 (the lower first resist) is provided to prevent photosensitivity of the first resist 20 during the second exposure. However, in the second exposure process, the eaves portion 40 itself reflects ultraviolet light that has passed through the second exposed region 121 of the second resist 120, potentially causing unintended photosensitivity in the uncured portion (the uncured region of the second resist 120). Therefore, it is desirable to provide the eaves portion 40 with a function to prevent reflection of ultraviolet light irradiated from the upper layer, in addition to the transmission prevention function. The anti-reflection function can be obtained, for example, by surface processing the eaves portion 40 with fine irregularities or by an anti-reflection coating, but is not limited to this. The anti-reflection function is positioned on the upper layer side than the transmission prevention function.

[0024] The eaves portion 40 may have a two-layer structure consisting of a transmission-preventing layer 41 having a transmission-preventing function and an anti-reflective layer 42 having an anti-reflective function. If the eaves portion 40 is composed of two layers, for example, it may have a structure in which the anti-reflective layer 42 is placed on top of the transmission-preventing layer 41. The anti-reflective layer 42 may be formed from, for example, an organic ARC (Anti-Reflection Coating) material, an inorganic ARC material, or a micro-protrusion arrangement (moth-eye structure) sheet. The anti-reflective layer 42 can be formed by sputtering, CVD, vacuum deposition, spin coating, etc.

[0025] <Second coating process (second resist formation process)> Next, as shown in Figure 4, a second resist layer (second resist) 120, which will serve as the second mold layer, is formed on top of the first resist layer (first resist) 20. This second resist 120 corresponds to the second electroformed portion E2, which is further from the substrate 10 than the first electroformed portion E1, which is closer to the substrate 10. The second resist 120 is applied so as to cover the entire surface of the first resist layer 20, including the overhang portion 40.

[0026] The second resist 120 must be of at least the same type as the first resist 20 (if the first resist 20 is negative type, the first resist 20 must also be negative type; if the first resist 20 is positive type, the first resist 20 must also be positive type), and it is preferable that it be made of the same material.

[0027] <Second exposure process> Next, as shown in Figure 5, the second resist 120 is irradiated (exposed) with UV light (ultraviolet) L through a second photomask 130 having an opening 131 and a shielding portion 132. The second resist 120 is divided into a region 121 where UV light L is irradiated through the opening 131 (second exposed region) and a region 122 where UV light L is not irradiated by the shielding portion 132 (second unexposed region). The second exposed region 121 has a protruding region 121a that protrudes in the width direction more than the first exposed region 21.

[0028] Furthermore, if multiple openings 131 are formed in the second photomask 130, multiple second exposure regions 121 are formed below the openings 131. The second unexposed region 122 becomes a cavity through a subsequent development process, forming a mold (second mold) for forming the second electroformed portion E2 further away from the substrate 10. At this time, the unexposed region 22 of the resist 20 can also be exposed simultaneously. That is, in the second exposure step, the first unexposed region 22 (the lower first resist 20) and the second resist 120 can be exposed using the second photomask 130 to form a third exposure region 123 that is continuous in the stacking direction. In this way, the third exposure region 123 can be formed integrally, and a smooth side wall can be formed without seams caused by minute steps resulting from alignment. Furthermore, the first resist 20 and the second resist 120 at overlapping positions in the stacking direction may be exposed at different timings.

[0029] In the second exposure step, when forming a second exposure region 121 having a protruding region 121a that protrudes in the width direction from the first exposure region 21, it is also necessary to irradiate the second resist 120 located above the first unexposed region 22 adjacent to the first exposure region 21. In this case, exposure is performed using a second photomask 130 having an opening at a different position than the first photomask 30. An overhang portion 40 is provided to prevent partial exposure of the lower first unexposed region 22 by ultraviolet light irradiated from the portion not covered by the shielding portion 132.

[0030] Figure 6 is a partially enlarged cross-sectional view of the area around the eaves portion 40. As shown in Figure 6, the eaves portion 40 is positioned in a location where irradiation of the first unexposed region 22 with ultraviolet light should be prevented. One end 40a of the eaves portion 40 is positioned on the upper surface 21a of the first exposed region 21. The other end 40b of the eaves portion 40 is positioned so as to coincide with the end 132a of the shielding portion 132 in the vertical direction. By positioning the eaves portion 40 in this way, irradiation of the first unexposed region 22 with ultraviolet light is prevented (see arrow in the figure).

[0031] While the eaves portion 40 may be widened so that it overlaps with the shielding portion 132 in the vertical direction, a larger area of ​​the eaves portion 40 increases the likelihood of unwanted ultraviolet reflection. Therefore, it is desirable to narrow the area that does not overlap with the shielding portion 132 in the vertical direction, and it is desirable that the other end 40b of the eaves portion 40 and the end 132a of the shielding portion 132 overlap by about 10 μm in the vertical direction. For the same reason, it is also desirable that the area of ​​the eaves portion 40 positioned on the upper surface 21a of the first exposure area 21 be narrow.

[0032] Thus, even when the area where the opening 131 of the second photomask 130 and the first unexposed area 22 partially overlap in the vertical direction is irradiated with ultraviolet light, the eaves portion 40, which has a transmission prevention function, covers this overlapping area. This prevents unwanted ultraviolet light from entering the first unexposed area 22 and suppresses the occurrence of unintended photosensitivity.

[0033] Furthermore, in order to form three or more electroformed layers, the second coating step and the second exposure step may be repeated two or more times after the eaves placement step and before the development step. For example, Figure 5 shows an exposed region (first exposed region 21, second exposed region 121) and an unexposed region (first unexposed region 22, second unexposed region 122) with an upper and lower two-layer structure. However, by repeating the second coating step and the second exposure step multiple times as steps after the first coating step and exposure step, three or more exposed and unexposed regions may be formed vertically.

[0034] Furthermore, if three or more layers of exposed and unexposed regions are formed vertically, that is, if multiple second exposed regions 121 are stacked on top of the first exposed region 21, the eaves portion 40 may also be placed on the upper surface of the second unexposed region 122 by repeating the eaves portion placement process at least once between the second exposure process and the development process. In this way, by stacking three or more unexposed regions, the electroformed mold 200 can be made into a structure of three or more layers.

[0035] <Developing process> Next, as shown in Figure 7, the first unexposed region 22 of the first layer of the first resist 20 and the second unexposed region 122 of the second layer of the second resist 120 are removed by the development process. Alternatively, as shown in Figure 8, the portion of the transmission prevention layer 41 on the lower side of the eaves portion 40 that overlaps with the protruding region 121a in the vertical direction (the range corresponding to the first unexposed region 22) may be removed separately. Only the portion of the transmission prevention layer 41 that overlaps with the first exposed region 21 remains. This development process yields an electroformed mold 200 in which regions with different shapes (the first exposed region 21 and the second exposed region 121) are stacked vertically on the substrate 10.

[0036] Through the above series of steps, an electroforming mold 200 is formed, as shown in Figure 7, having a substrate 10, a first exposure region 21 placed on the substrate 10, and a second exposure region 121 placed on the first exposure region 21. The first exposure region 21 is the first hardened portion of the first resist 20 corresponding to the first electroformed portion E1, which has been hardened by ultraviolet light, and the second exposure region 121 is the second hardened portion of the second resist 120 corresponding to the second electroformed portion E2, which has been hardened by ultraviolet light. The second exposure region 121 is larger (wider) than the first exposure region 21 and has a protruding region 121a that protrudes in the width direction from the first exposure region 21. An overhang portion 40 is placed between the first hardened portion and the second hardened portion. The overhang portion 40 is placed below the portion where the first hardened portion and the second hardened portion overlap in the vertical direction, and below the protruding portion located in the protruding region 121a of the second hardened portion. A cavity corresponding to the first unexposed region 22 is formed on the lower side of the eaves portion 40.

[0037] The first exposure region 21 and the second exposure region 121 have portions that do not overlap with each other in the vertical direction (stacking direction). That is, the first exposure region 21 has a portion that does not overlap with the second exposure region 121 in the vertical direction, and the second exposure region 121 has a portion that does not overlap with the first exposure region 21 in the vertical direction. By using such an electroforming mold 200, electroformed products E with different shapes in the upper and lower sections can be molded integrally. Therefore, electroformed products E consisting of multiple layers can be manufactured with high precision, and are not limited to two layers. In particular, the effect is demonstrated in electroforming molds 200 having a second exposure region 121 that is larger in size than the first exposure region 21 above the first exposure region 21.

[0038] Furthermore, if the second coating step and the second exposure step are repeated two or more times, two or more layers of the second exposure area 121 are laminated on top of the first exposure area 21. In this case, the overhang portion 40 may be placed not only between the first cured portion (first exposure area 21) and the second cured portion (second exposure area 121), but also between the second cured portions themselves. The overhang portion 40 is placed at least one of the following: below the portion of the second cured portion that protrudes in the width direction more than the first cured portion, or below the portion of the upper second cured portion that protrudes in the width direction more than the lower second cured portion.

[0039] <Conductive film formation process> Furthermore, the process may include a conductive film formation step at any point between the first exposure step and the second resist formation step in which the upper surface of the first exposure region 21 that overlaps with the second unexposed region 122 is covered with a conductive film 50. If a second exposure region 121 that is narrower than the first exposure region 21 is formed on the substrate 10, it is desirable that the conductive film 50 be placed on the upper surface of a portion of the first exposure region 21, as shown in Figure 4.

[0040] The conductive film 50 is composed of, for example, an ITO film, or a metallic material such as gold, silver, or copper. The conductive film 50 can be formed by methods such as sputtering, vapor deposition, or electroless plating. By placing the conductive film 50 on the upper surface 21a of the first exposure region 21, Ni can be easily deposited on the upper side of the first exposure region 21, and an electroformed product conforming to the electroforming mold can be formed.

[0041] <Plating Process> Next, as shown in Figure 8, a first electroformed portion E1 is formed between the substrate 10 and the resist 10 by electroplating with nickel (Ni), using a cavity corresponding to the first unexposed region 22 of the first layer of the first resist 20 as a mold. Subsequently, a second electroformed portion E2 is formed using a cavity corresponding to the second unexposed region 122 of the second layer of the resist 120 as a mold. Note that the electroforming material is not limited to nickel, but all electroformable materials such as gold (Au), copper (Cu), tin (Sn), and cobalt (Co) can be used. By making the first and second plating layers continuous, a decrease in strength at the boundary is prevented.

[0042] <Electroformed product extraction process> After the second electroformed portion E2 has grown to the desired thickness, the upper surfaces of the second resist 120 and the second electroformed portion E2 are ground and polished to be flat, and then the resists 20 and 120 are removed, and the substrate 10 is also removed, thereby extracting an electroformed product E in which the first electroformed portion E1 and the second electroformed portion E2 are integrally formed, as shown in Figure 9. The first electroformed portion E1 is the base portion located on the lower layer side of the electroformed product E. The second electroformed portion E2 is the portion located on the upper layer side of the electroformed product E, and may have multiple electroformed layers. That is, the electroformed product E may have three or more electroformed portions (electroformed layers) in the stacking direction.

[0043] The manufacturing method of the electroformed mold according to the above embodiment comprises: a first resist formation step of forming a first resist 20 corresponding to the first electroformed portion E1 on a conductive substrate 10; a first exposure step of exposing the first resist 20 using a first photomask 30 to form a first exposed region 21 and a first unexposed region 22; an awning placement step of placing an awning 40, which is a light transmission prevention layer having the function of preventing light transmission, on the upper surface of the first unexposed region 22 formed in the first exposure step; and a second electroformed mold corresponding to the second electroformed portion E2 on the first resist 20. The process includes a second resist formation step for forming a resist 120, a second exposure step for exposing the second resist 120 using a second photomask 130 to form a second exposed region 121 and a second unexposed region 122, and a removal step for removing the first unexposed region 22 and the second unexposed region 122. In the overhang placement step, the overhang 40 is placed on the upper surface 22a of the first unexposed region 22 in a portion that overlaps with the second exposed region 121, and the second resist formation step and the second exposure step are repeated one or more times between the overhang placement step and the removal step.

[0044] As a result, when ultraviolet light is irradiated onto the second resist 120 positioned above the first resist 20, the first unexposed region 22, which is located in a position overlapping with the opening 131 of the second photomask 130 in the stacking direction, is covered by the eaves portion 40 which has a transmission prevention function, thereby preventing unintended light exposure of the first resist 20. Consequently, it becomes possible to manufacture electroforming molds that accurately reproduce the shape of the photomask with high precision, and to manufacture electroformed products consisting of multiple layers with high precision.

[0045] Furthermore, the eaves portion 40 has a two-layer structure consisting of a transmission-preventing layer 41 positioned closer to the first resist 20, and an anti-reflective layer 42 positioned on top of the transmission-preventing layer 41, which has the function of preventing light reflection. The transmission-preventing layer 41 suppresses irradiation of ultraviolet light to the first resist 20 on the lower side, and the anti-reflective layer 42 suppresses the reflection of ultraviolet light to the second resist 120 on the upper side. Therefore, by suppressing photosensitivity of the photoresist due to unintended irradiation and reflection of ultraviolet light, the shape of the photomask can be accurately reproduced.

[0046] Furthermore, the overhang portion 40 is formed of a different metal material from both the first electroformed portion E1 and the second electroformed portion E2. This allows for the removal of (part of) the overhang portion 40 without dissolving the nickel during the electroformed product extraction process.

[0047] Furthermore, in the second exposure step, the first unexposed region 22 and the second resist 120 are exposed using the second photomask 130 to form a third exposure region 123 that is continuous in the stacking direction. That is, the first resist 20 and the second resist 120 are exposed simultaneously, and a third exposure region 123 is formed in which no boundary line, which would form a seam, is formed between the upper and lower layers. As a result, the third exposure region 123 can be formed integrally, and a smooth side wall can be formed without seams caused by minute steps resulting from alignment. This is particularly effective when the third exposure region 123 is located in the outer peripheral portion of the electroforming mold 200.

[0048] While embodiments of the present invention have been described in detail above with reference to the drawings, the specific configuration is not limited to these embodiments, and any design modifications that do not depart from the spirit of the present invention are included in the present invention. [Explanation of Symbols]

[0049] 10: Conductive substrate 20: First Registration 21: First exposure region 22: First unexposed region 30: First photomask 40: Eaves 41: Transmission prevention layer 42: Anti-reflection layer 120: Second registration 121: Second exposure region 122: Second unexposed region 123: Third exposure region 130: Second photomask 200: Electroformed mold E: Electroformed products E1: 1st electroformed part E2: 2nd electroformed part

Claims

1. A method for manufacturing an electroforming mold used to produce an electroformed product in which a first electroformed portion close to a conductive substrate and a second electroformed portion having one or more electroformed layers far from the conductive substrate are integrally formed in a laminated state, A first resist forming step of forming a first resist corresponding to the first electroformed portion on the conductive substrate, A first exposure step in which the first resist is exposed using a first photomask to form a first exposed region and a first unexposed region, A second resist forming step of forming a second resist corresponding to the second electroformed portion on the first resist, A second exposure step in which the second resist is exposed using a second photomask to form a second exposed region and a second unexposed region, The process includes a removal step to remove the first unexposed region and the second unexposed region, Between the first exposure step and the removal step, there is a eaves placement step in which an eaves portion, which is a light transmission prevention layer having the function of preventing light transmission, is placed on the upper surface of at least one of the first unexposed region or the second unexposed region in a range that overlaps with the region to be exposed next. The eaves portion has a light transmission prevention function and a light reflection prevention function, wherein the light reflection prevention function is positioned further away from the first resist than the light transmission prevention function. A method for manufacturing an electroformed mold, comprising repeating the second resist formation step and the second exposure step at least once.

2. A method for manufacturing an electroforming mold used to manufacture an electroformed product in which a first electroformed portion close to a conductive substrate and a second electroformed portion having one or more electroformed layers far from the conductive substrate are integrally formed in a laminated state, A first resist forming step of forming a first resist corresponding to the first electroformed portion on the conductive substrate, A first exposure step in which the first resist is exposed using a first photomask to form a first exposed region and a first unexposed region, A second resist forming step of forming a second resist corresponding to the second electroformed portion on the first resist, A second exposure step in which the second resist is exposed using a second photomask to form a second exposed region and a second unexposed region, The process includes a removal step to remove the first unexposed region and the second unexposed region, Between the first exposure step and the removal step, there is a eaves placement step in which an eaves portion, which is a light transmission prevention layer having the function of preventing light transmission, is placed on the upper surface of at least one of the first unexposed region or the second unexposed region in a range that overlaps with the region to be exposed next. The eaves portion has a two-layer structure consisting of the transmission-preventing layer positioned on the side closer to the first resist, and an anti-reflective layer positioned on the transmission-preventing layer, which has the function of preventing light reflection. A method for manufacturing an electroformed mold, comprising repeating the second resist formation step and the second exposure step at least once.

3. The method for manufacturing an electroformed mold according to claim 1 or 2, wherein the eaves portion is formed of a metal material different from both the first electroformed portion and the second electroformed portion.

4. The method for manufacturing an electroformed mold according to claim 1 or 2, wherein in the second exposure step, the first unexposed region and the second resist are exposed using a second photomask to form a third exposure region that is continuous in the stacking direction.

5. An electroforming mold used to manufacture an electroformed product in which a first electroformed portion close to a conductive substrate and a second electroformed portion having one or more electroformed layers far from the conductive substrate are integrally formed in a laminated state, The conductive substrate and, The first hardened portion of the first resist corresponding to the first electroformed portion, which has been hardened by ultraviolet light, The second resist corresponding to the second electroformed portion includes at least one second hardened portion which is hardened by ultraviolet light and has a protrusion that protrudes from the first hardened portion in a width direction perpendicular to the lamination direction, The invention comprises an overhang portion which is a light-blocking layer disposed between the first hardened portion and the second hardened portion, or between the second hardened portions themselves, and which has the function of preventing light transmission, The eaves portion is positioned at least one of the following locations: the portion where the first hardened portion and the second hardened portion overlap in the stacking direction and below the protruding portion, or the portion where the two second hardened portions overlap and below the protruding portion; and has a light transmission prevention function and a light reflection prevention function, wherein the light reflection function is positioned further from the first resist than the light transmission prevention function. The second hardened portion is an electroforming mold having one or more layers in the lamination direction.

6. An electroforming mold for manufacturing an electroformed product in which a first electroformed portion close to a conductive substrate and a second electroformed portion having one or more electroformed layers far from the conductive substrate are integrally formed in a laminated state, The conductive substrate and, The first hardened portion of the first resist corresponding to the first electroformed portion, which has been hardened by ultraviolet light, The second resist corresponding to the second electroformed portion includes at least one second hardened portion which is hardened by ultraviolet light and has a protrusion that protrudes from the first hardened portion in a width direction perpendicular to the lamination direction, The invention comprises an overhang portion which is a light-blocking layer disposed between the first hardened portion and the second hardened portion, or between the second hardened portions themselves, and which has the function of preventing light transmission, The eaves portion is positioned in at least one of the following locations: the portion where the first hardened portion and the second hardened portion overlap in the stacking direction and below the protruding portion, or the portion where the two hardened portions overlap and below the protruding portion, and has a two-layer structure comprising a transparency-preventing layer positioned closer to the first resist, and an anti-reflective layer positioned on the transparency-preventing layer, which has the function of preventing light reflection. The second hardened portion is an electroforming mold having one or more layers in the lamination direction.

7. The electroforming mold according to claim 5 or 6, wherein at least a portion of the second hardened portion at a position overlapping with the first hardened portion in the stacking direction is integrally formed.

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